WO2017041333A1

WO2017041333A1 - Plating process for plating layer on nail abutting seat component

Info

Publication number: WO2017041333A1
Application number: PCT/CN2015/090645
Authority: WO
Inventors: 浦晓冬
Original assignee: 无锡市宝玛精密部件有限公司
Priority date: 2015-07-20
Filing date: 2015-09-25
Publication date: 2017-03-16
Also published as: CN105350032A; CN105350032B

Abstract

Provided is a plating process for a plating layer on a nail abutting seat component, wherein a Ni-PTFE plating layer is formed on the inner surface of the nail abutting seat component by direct plating. The plating process comprises the following steps: oil removal: placing a nail abutting seat component to be plated in an ultrasonic cleaner, adding an oil removing solution, cleaning and water washing; acid pickling: placing the nail abutting seat component to be plated after experiencing the oil removal in an acid pickling solution, then acid pickling, water washing, and drying by blowing; activation: immersing the nail abutting seat component to be plated after experiencing the acid pickling in an activating solution, cleaning, drying by blowing, and performing a thermal treatment; electroplating: placing the nail abutting seat component to be plated after experiencing the activation in a composite plating solution composed of a nickel salt, a PTFE emulsion, dual surfactants, a complexing agent and a stabilizer, and after plating with the composite plating solution, plating one uniform and intact Ni-PTFE plating layer on the nail abutting seat component; passivation: placing the plated nail abutting seat component in a passivation solution for passivation; and water washing and drying.

Description

Plating process for plating the nailed parts

Technical field

The invention relates to the field of metal surface protective coatings, in particular to a plating process for plating a nail-bearing part.

Background technique

The electroless nickel plating layer has excellent physical and chemical properties such as excellent corrosion resistance, wear resistance and weldability, and is widely used in aviation, aerospace, petrochemical, machinery, electronics, computers, automobiles, food packaging, molds, and medical treatment. , textile and other fields. Electroless plating is a metal deposition process in which metal ions are reduced by autocatalysis of a metal surface by a reducing agent in a solution. However, with the development of modern science and technology, the requirements for corrosion resistance and wear resistance of mechanical parts in these fields are becoming higher and higher, and the single chemical nickel plating is increasingly unable to meet the needs of industrial development. Composite electroless plating with good corrosion resistance and wear resistance has gradually developed.

Chemical composite plating is a process for obtaining a composite coating developed on the basis of electroless plating. It refers to the addition of one or more insoluble solid particles to the plating solution under the condition of no electricity. A deposition technique in which a solid coating is uniformly dispersed in a plating solution to co-deposit solid particles with metal ions to form a composite plating layer. Chemical composite plating has low cost, low pollution, and can meet the performance needs of most occasions. However, the composite electroless plating is not ideal for friction and lubricity, and it does not have the effect of silencing.

Summary of the invention

The technical problem to be solved by the present invention is to provide a plating process for plating the nail-bearing member, which has low friction, good lubricity, corrosion resistance, thermal conductivity, and is also effective for silencing and preventing static electricity.

In order to solve the above technical problem, a technical solution adopted by the present invention is to provide a plating process for plating a nail-bearing member, and directly plating an inner surface of the abutment member to form a Ni-PTFE plating layer, comprising the following steps:

(1) Degreasing: the parts to be plated to the nail are placed in an ultrasonic cleaning machine, and the degreasing liquid is added, washed at 45 to 55 ° C for 5 to 10 minutes, and washed with water;

(2) pickling: the parts to be plated to be replaced after degreasing are placed in the pickling solution, pickled at room temperature for 5-10 min, washed with water, and blown dry;

(3) activation: the step of (2) pickling after the nail block to be plated with the activation solution at room temperature for 15 ~ 25min, washed, blow dry, heat treatment at 120 ~ 150 ° C for 5 ~ 12min;

(4) electroplating; placing the abutting member to be plated after the step (3) is activated in a composite plating solution composed of a nickel salt, a PTFE emulsion, a double surfactant, a complexing agent and a stabilizer, In the composite plating solution, the nickel salt is 30-40 g/L, the PTFE emulsion is 20-30.0 mL/L, the rare earth element is 0.5-1.1 g/L, the double surfactant is 0.5-2 g/L, and the complexing agent is 30-50 mL/L. Stabilizer 15～30mg/L, accelerator 0.5～1mg/L, the rest is deionized water; pH value is 4.8～5.2, temperature is 75～85°C, plating time is 30～80min, stirring rate is 160～220r/min The plating rate is 12-18 μm/h, and the composite plating solution is plated with a uniform and complete Ni-PTFE coating layer, and the plating thickness is 3-5 μm;

(5) passivation: the plated nail seat component is placed in the passivation solution, the temperature is 70-85 ° C, passivation 13 ~ 15min;

(6) Rinse with 10 to 15 ° C of deionized water until the pH of the rinse is neutral and finally dry.

In a preferred embodiment of the present invention, the degreasing liquid described in the step (1) is composed of 30 to 60 g/L of sodium hydrogencarbonate, 20 to 30 g/L of sodium silicate, and the balance of water.

In a preferred embodiment of the invention, the frequency of the ultrasonic waves during cleaning in step (1) is from 20 kHz to 30 kHz.

In a preferred embodiment of the present invention, the volume ratio of hydrofluoric acid, nitric acid and deionized water in the pickling solution used in the step (2) is (0.5 to 1): (2 to 3):1.

In a preferred embodiment of the present invention, the weight ratio of ammonium hydrogen fluoride, phosphoric acid and deionized water in the activation liquid used in the step (3) is 1: (1.5 to 3): (3 to 5), the phosphoric acid The mass percentage concentration is 85%.

In a preferred embodiment of the invention, the nickel salt is nickel sulfate or nickel acetate, and the PTFE emulsion has a solid content of 55 to 65 wt%.

In a preferred embodiment of the present invention, the double surfactant is a compounded double surfactant of OP and CTAB, the complexing agent used is citrate or sodium succinate, and the stabilizer is barium sulfate. .

In a preferred embodiment of the present invention, the passivation solution in the step (5) is 15 to 30 g/L of vanadate, 5 to 30 g/L of molybdate, 5 to 10 g/L of phosphinecarboxylic acid, and 1 to 5 g. / L sulfonated lignin and the balance of water composition.

In a preferred embodiment of the invention, the weight ratio of OP and CTAB in the dual surfactant is 1: (5-7).

In a preferred embodiment of the invention, the accelerator is succinic acid.

The invention has the beneficial effects that the invention has low friction, good lubricity, corrosion resistance, thermal conductivity, and is also effective for silencing and preventing static electricity.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

Example 1

A plating process for plating the abutting member, directly plating the inner surface of the abutment member to form a Ni-PTFE coating, comprising the following steps:

(1) Degreasing: The parts to be plated are placed in an ultrasonic cleaner, degreased, and washed at 45 ° C for 10 min. The frequency of the ultrasonic waves during washing is 25 kHz, washed with water. 30 g / L sodium bicarbonate, 20 g / L sodium silicate and the balance of water;

(2) Pickling: Put the parts to be plated after degreasing in the pickling solution, pickle at room temperature for 10 min, wash with water, blow dry, hydrofluoric acid, nitric acid and deionized in the pickling solution used. The volume ratio of water is 0.5:3:1;

(3) Activation: the plated part to be plated after pickling in step (2) is immersed in the activation solution for 20 minutes at room temperature, washed, blow dried, heat treated at 150 ° C for 5 min, and the ammonium fluoride, phosphoric acid and phosphoric acid in the activation solution used. The weight ratio of deionized water is 1:1.5:5, and the mass percentage concentration of the phosphoric acid is 85%;

(4) electroplating; placing the abutting member to be plated after the step (3) is activated in a composite plating solution composed of a nickel salt, a PTFE emulsion, a double surfactant, a complexing agent and a stabilizer, In the composite plating solution, nickel salt 30g / L, PTFE emulsion 30.0mL / L, lanthanum rare earth element 1.1g / L, double surfactant 0.5g / L, complexing agent 30mL / L, stabilizer 15mg / L, Ding The acid accelerator 0.5mg/L, the rest is deionized water; the pH value is 5.0, the temperature is 75°C, the plating time is 80min, the stirring rate is 160r/min, the plating speed is 15μm/h, and the composite plating solution is plated after plating. a uniform and complete Ni-PTFE coating with a coating thickness of 4 μm; The salt is nickel sulfate, the PTFE emulsion has a solid content of 55 wt%; the double surfactant is a compounded double surfactant of OP and CTAB, and the weight of OP and CTAB in the double surfactant is matched. The ratio is 1:6; the complexing agent used is sodium succinate, and the stabilizer is barium sulfate;

(5) Passivation: Place the plated abutment parts in the passivation solution at a temperature of 78 ° C, passivation for 14 min, passivation solution from 27 g / L vanadate, 18 g / L molybdate, 5 g /L-phosphoric acid, 1g/L sulfonated lignin and the balance of water;

(6) Rinse with 12 ° C of deionized water until the pH of the rinse is neutral and finally dry.

Example 2

(1) Degreasing: the parts to be plated are placed in an ultrasonic cleaner, degreased, and washed at 55 ° C for 5 min. The frequency of the ultrasonic waves during cleaning is 20 kHz, washed with water, and the degreasing liquid is 45g/L sodium bicarbonate, 25g/L sodium silicate and the balance of water;

(2) Pickling: Put the parts to be plated to the nail base after degreasing, pickle at room temperature for 8 min, wash with water, blow dry, hydrofluoric acid, nitric acid and deionized in the pickling solution used. The volume ratio of water is 1:3:1;

(3) Activation: the plated part to be plated after pickling in step (2) is immersed in the activation solution for 15 to 25 minutes at room temperature, washed, blow dried, heat treated at 120 ° C for 12 minutes, and the ammonium hydrogen fluoride in the activation solution used. The weight ratio of phosphoric acid to deionized water is 1:3:3, and the mass percentage concentration of the phosphoric acid is 85%;

(4) electroplating; placing the abutting member to be plated after the step (3) is activated in a composite plating solution composed of a nickel salt, a PTFE emulsion, a double surfactant, a complexing agent and a stabilizer, In the composite plating solution, nickel salt 40g / L, PTFE emulsion 20mL / L, lanthanum rare earth element 0.8g / L, double surfactant 2g / L, complexing agent 50mL / L, stabilizer 30mg / L, succinic acid accelerated 1mg/L, the rest is deionized water; pH is 5.2, The temperature is 85 ° C, the plating time is 30 min, the stirring rate is 220 r / min, the plating speed is 12 μm / h, and the composite plating solution is plated with a uniform and complete Ni-PTFE coating layer with a thickness of 3 μm; the nickel salt Nickel acetate, the PTFE emulsion has a solid content of 60% by weight; the double surfactant is a compounded double surfactant of OP and CTAB, and the weight ratio of OP and CTAB in the double surfactant Is 1:5; the complexing agent used is citrate, and the stabilizer is barium sulfate;

(5) Passivation: Place the plated abutment parts in the passivation solution at a temperature of 85 ° C, passivation for 13 min, passivation solution from 15 g / L vanadate, 30 g / L molybdate, 8 g /L phosphocarboxylic acid, 3g / L sulfonated lignin and the balance of water;

(6) Rinse with 15 ° C of deionized water until the pH of the rinse is neutral and finally dry.

Example 3

(1) Degreasing: the parts to be plated are placed in an ultrasonic cleaner, degreased, and washed at 50 ° C for 7 min. The frequency of the ultrasonic waves during washing is 30 kHz, washed with water, and the degreasing liquid is 60 g / L sodium bicarbonate, 30 g / L sodium silicate and the balance of water;

(2) Pickling: Put the parts of the nail to be plated after degreasing into the pickling solution, pickle at room temperature for 5 min, wash with water, blow dry, hydrofluoric acid, nitric acid and deionized in the pickling solution used. The volume ratio of water is 0.7:2.5:1;

(3) Activation: the plated part to be plated after pickling in step (2) is immersed in the activation solution for 15 to 25 minutes at room temperature, washed, blow dried, heat treated at 135 ° C for 9 minutes, and the ammonium hydrogen fluoride in the activation solution used. The weight ratio of phosphoric acid to deionized water is 1:2.5:4, and the mass percentage concentration of the phosphoric acid is 85%;

(4) electroplating; placing the abutting member to be plated after the step (3) is activated in a composite plating solution composed of a nickel salt, a PTFE emulsion, a double surfactant, a complexing agent and a stabilizer, In the composite plating solution, Nickel salt 35g / L, PTFE emulsion 25mL / L, lanthanum rare earth element 0.5g / L, double surfactant 1.3g / L, complexing agent 40mL / L, stabilizer 22mg / L, succinic acid accelerator 0.8mg / L, the rest is deionized water; pH value is 4.8, temperature is 80 ° C, plating time is 50 min, stirring rate is 190 r/min, plating speed is 18 μm/h, and the composite plating solution is plated with a uniform and complete Ni a PTFE coating having a plating thickness of 5 μm; the nickel salt being nickel acetate, the PTFE emulsion having a solid content of 65 wt%; and the double surfactant being a compounded double surfactant of OP and CTAB, The weight ratio of OP and CTAB in the dual surfactant is 1:7; the complexing agent used is citrate, and the stabilizer is barium sulfate;

(5) Passivation: Place the plated abutment parts in the passivation solution at a temperature of 70 ° C, passivation for 15 min, passivation solution from 30 g / L vanadate, 5 g / L molybdate, 10 g /L phosphocarboxylic acid, 5g / L sulfonated lignin and the balance of water;

(6) Rinse with 10 ° C of deionized water until the pH of the rinse is neutral and finally dry.

The performance test data of the plating of the abutment parts of Examples 1 to 3 is shown in Table 1, and the salt spray test was carried out in accordance with GB2423.17-2003.

Table 1

The invention has low friction, good lubricity, corrosion resistance, thermal conductivity, and Sound and static prevention are also very effective.

The above is only the embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification of the present invention, or directly or indirectly applied to other related technical fields, The same is included in the scope of patent protection of the present invention.

Claims

A plating process for plating a nail-bearing member, characterized in that directly plating an inner surface of the abutment member to form a Ni-PTFE coating comprises the following steps:

(1) Degreasing: the parts to be plated to the nail are placed in an ultrasonic cleaning machine, and the degreasing liquid is added, washed at 45 to 55 ° C for 5 to 10 minutes, and washed with water;

(2) pickling: the parts to be plated to be replaced after degreasing are placed in the pickling solution, pickled at room temperature for 5-10 min, washed with water, and blown dry;

(3) activation: the step of (2) pickling after the nail block to be plated with the activation solution at room temperature for 15 ~ 25min, washed, blow dry, heat treatment at 120 ~ 150 ° C for 5 ~ 12min;

(4) electroplating; placing the abutting member to be plated after the step (3) is activated in a composite plating solution composed of a nickel salt, a PTFE emulsion, a double surfactant, a complexing agent and a stabilizer, In the composite plating solution, the nickel salt is 30-40 g/L, the PTFE emulsion is 20-30.0 mL/L, the rare earth element is 0.5-1.1 g/L, the double surfactant is 0.5-2 g/L, and the complexing agent is 30-50 mL/L. Stabilizer 15～30mg/L, accelerator 0.5～1mg/L, the rest is deionized water; pH value is 4.8～5.2, temperature is 75～85°C, plating time is 30～80min, stirring rate is 160～220r/min The plating rate is 12-18 μm/h, and the composite plating solution is plated with a uniform and complete Ni-PTFE coating layer, and the plating thickness is 3-5 μm;

(5) passivation: the plated nail seat component is placed in the passivation solution, the temperature is 70-85 ° C, passivation 13 ~ 15min;

(6) Rinse with 10 to 15 ° C of deionized water until the pH of the rinse is neutral and finally dry.
The plating process of the plating of the anvil member according to claim 1, wherein the degreasing liquid in the step (1) comprises 30-60 g/L sodium hydrogencarbonate and 20-30 g/L sodium silicate. And the balance of water composition.
The plating process of the abutment member plating layer according to claim 1, wherein the frequency of the ultrasonic waves during the cleaning in the step (1) is 20 kHz to 30 kHz.
The plating process for the plating of the anvil member according to claim 1, wherein the volume ratio of hydrofluoric acid, nitric acid and deionized water in the pickling liquid used in the step (2) is (0.5 to 1). :(2~3): 1.
The plating process for the plating of the anvil member according to claim 1, wherein the weight ratio of ammonium hydrogen fluoride, phosphoric acid and deionized water in the activation liquid used in the step (3) is 1: (1.5 to 3) :(3~5), The mass percentage concentration of the phosphoric acid is 85%.
The plating process for the plating of the anvil member according to claim 1, wherein the nickel salt is nickel sulfate or nickel acetate, and the PTFE emulsion has a solid content of 55 to 65 wt%.
The plating process of the plating of the anvil member according to claim 1, wherein the double surfactant is a compounded double surfactant of OP and CTAB, and the complexing agent used is citrate or butyl. Sodium dicarbonate, the stabilizer is barium sulfate.
The plating process for the plating of the anvil member according to claim 1, wherein the passivation liquid in the step (5) is 15 to 30 g/L of vanadate, 5 to 30 g/L of molybdate, and 5 ～10g/L phosphine carboxylic acid, 1-5g/L sulfonated lignin and the balance of water.
The plating process of the plating of the anvil member according to claim 7, wherein the weight ratio of OP and CTAB in the double surfactant is 1: (5-7).
The plating process for the plating of the anvil member according to claim 1, wherein the accelerator is succinic acid.