WO2017039055A1 - Fil composite métal/graphène et son procédé de fabrication - Google Patents

Fil composite métal/graphène et son procédé de fabrication Download PDF

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Publication number
WO2017039055A1
WO2017039055A1 PCT/KR2015/010160 KR2015010160W WO2017039055A1 WO 2017039055 A1 WO2017039055 A1 WO 2017039055A1 KR 2015010160 W KR2015010160 W KR 2015010160W WO 2017039055 A1 WO2017039055 A1 WO 2017039055A1
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WO
WIPO (PCT)
Prior art keywords
metal wire
graphene
wire
layer
graphene composite
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PCT/KR2015/010160
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English (en)
Korean (ko)
Inventor
김형근
양우석
유세현
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전자부품연구원
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Publication of WO2017039055A1 publication Critical patent/WO2017039055A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26—Deposition of carbon only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips

Definitions

  • the present invention relates to a graphene composite metal wire and a method for manufacturing the same, and more particularly, to a graphene composite metal wire and a method for producing the graphene composite metal wire with high strength and light weight and improved reliability of high conductivity characteristics.
  • metal wires to metal cables are wires made of metal, and are used in a wide variety of fields such as power (transmission and distribution), communication, control, equipment, and transportation.
  • metal wires to metal cables are made of metal, which is a representative conductor, so they have excellent electrical conductivity.
  • metal which is a representative conductor
  • they have excellent electrical conductivity.
  • methods for developing alloys used or surface treatment (coating, etc.) of metal wires / metal cables have been studied.
  • forming graphene on the metal wire / metal cable surface may be a good alternative.
  • Graphene not only can deliver about 100 times more current than copper per unit area at room temperature, but also has twice the thermal conductivity of diamond.
  • the mechanical strength is more than 200 times stronger than steel and excellent in flexibility, the conductive strength is not reduced even if it is increased or folded.
  • the method of synthesizing such graphene may be various, usually, a method of directly growing graphene using a peeling method (aka Scotch tape method) or a metal catalyst is used.
  • a peeling method aka Scotch tape method
  • a metal catalyst is used.
  • graphene and graphite fragments are randomly mixed while graphene and multiple layers of graphite are easily broken during deposition on a substrate with Scotch tape, which is basically a process expected by chance. There was this. Therefore, when graphene is to be formed on the surface of the metal wire by using the peeling method, graphene may not be uniformly formed.
  • graphene is grown by supplying a reaction source including a carbon source on the metal catalyst and performing heat treatment at atmospheric pressure. Therefore, there is a problem that a high temperature of 1,000 ° C. or higher is required in the graphene manufacturing process.
  • FIG. 1 is a graph of the manufacturing temperature in the case of the graphene direct-forming manufacturing method
  • Figure 2 is a graph showing the change in tensile strength of copper with temperature.
  • the yes the decomposition temperature will depend on a pin formed when hydrocarbons (gas flow, liquid flow, and residence) precursors, primarily have used the CH 4 gas into the hydrocarbon precursor for the production of high quality graphene.
  • the decomposition temperature is 900 ° C to 1,000 ° C or higher.
  • the substrate on which graphene is synthesized is a metal, for example, copper, as shown in FIG. 2, the tensile strength of copper rapidly decreases with temperature, thereby degrading the mechanical strength of the substrate, thereby intensifying physical property degradation.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a graphene composite metal wire and a method of manufacturing a high-strength and light weight and improved reliability of high conductivity properties as a fine line.
  • the graphene composite metal wire is a metal wire including a copper alloy wire; And a graphene layer formed on the surface of the metal wire.
  • the copper alloy wire may include an alloy metal selected from nickel (Ni), cobalt (Co), iron (Fe), and alloys thereof.
  • alloy metal is iron
  • iron may be included in the 2.5wt% to 60wt% based on the total weight of the copper alloy wire.
  • the copper alloy wire may include carbon fiber therein.
  • the step of preparing a metal wire comprising a copper alloy wire; Forming a carbon source layer including a carbon source on a surface of the metal wire; And irradiating at least one of microwave (Variable Frequency Microwave, VFM) or white light (Intensed Pulse Light, IPL) to form a graphene layer on the surface of the metal wire.
  • microwave Variable Frequency Microwave, VFM
  • white light Intensed Pulse Light, IPL
  • Carbon sources include polyimide (PI), polymethylmethacrylate (PMMA), polystyrene (PS), acrylonitrile butadiene styrene (ABS), and self-assembled monolayer (SAM). It may include at least one of.
  • the carbon source layer may include at least one of an ionic liquid and a poly ionic liquid (PIL).
  • PIL poly ionic liquid
  • the graphene layer may be formed at a process temperature of 200 ° C. to 300 ° C. from the carbon source layer.
  • additional functions such as heat conductivity, heat capacity, and electromagnetic wave shielding / absorption may be implemented according to the metal alloy combination of the metal wire, thereby obtaining a graphene composite metal wire having improved product performance.
  • Figure 1 is a graph of the manufacturing temperature in the case of the graphene direct-forming manufacturing method
  • Figure 2 is a graph showing the change in tensile strength of copper with temperature.
  • FIG 3 is a perspective view of a graphene composite metal wire according to an embodiment of the present invention.
  • FIG. 4 is a perspective view of a graphene composite metal wire according to another embodiment of the present invention.
  • FIG. 6 is a graph showing the current density improvement efficiency of the graphene layer according to the graphene thickness (number of layers).
  • the graphene composite metal wire 100 includes a metal wire 110 including a copper alloy wire; And a graphene layer 120 formed on the surface of the metal wire 110.
  • the graphene composite metal wire 100 of the present invention includes a metal wire 110 including a copper alloy wire.
  • the metal wire 110 particularly includes a copper alloy wire, which may include an alloy metal selected from nickel (Ni), cobalt (Co), iron (Fe), and alloys thereof.
  • the copper alloy wire may be used in addition to copper having excellent electrical conductivity.
  • other metals may be used in combination with Cu / Ag, Cu / Pd, Cu / Fe, Cu / Co, Cu / W or Cu in consideration of mechanical strength and elastic force. Materials such as / Ni alloys can be used.
  • the graphene layer 120 is synthesized on the metal wire 110, and the number of layers of the graphene layer 120 may vary depending on the use of the graphene composite metal wire 100 used. Therefore, if the number of layers of the graphene layer 120 of the graphene composite metal wire 100 is freely controlled, the graphene composite metal wire 100 suitable for various applications may be obtained. For example, when the copper content in the copper alloy wire is low and the content of the other alloy metal is high, the content of copper having high conductivity is low, thereby forming the graphene layer 120 in multiple layers to improve the conductivity of the graphene composite metal wire 100. You can.
  • the graphene layer 120 is preferably formed as a layer for preventing metal oxidation and is formed with a small number of layers. Therefore, the number of layers of the graphene layer 120 formed on the metal wire 110 is preferably controlled in various ways.
  • the substrate on which the graphene layer 120 is to be formed that is, the metal wire It is preferable that the component with high carbon solubility is contained in (110).
  • the metal wire 110 contains a component having high carbon solubility, carbon from the carbon element is melted on the metal wire 110 to be in close contact with the surface. Therefore, the synthesis of multilayer graphene on the metal wire 110 is easy.
  • the high carbon solubility is a transition metal, especially in the case of transition metals such as nickel (Ni), cobalt (Co) and iron (Fe) has a high carbon solubility, the graphene layer 120 can be formed in multiple layers have. In the case of such a transition metal, since the number of layers of the graphene layer 120 to be formed on the surface can be controlled without reducing the electrical conductivity of copper, the metal wire 110 preferably includes a copper alloy wire.
  • the alloy metal may be iron (Fe), in particular, when the copper alloy wire containing iron is high strength can maintain a high mechanical strength even when a high temperature is applied. Therefore, the mechanical strength of the metal wire 110 is high and can be manufactured into fine lines.
  • the metal wire may have a diameter of 10 ⁇ m to 200 ⁇ m.
  • iron may be included in the copper alloy wire in consideration of the overall strength of the graphene composite metal wire 100. That is, iron may be included in the range of 2.5wt% to 60wt% based on the total weight of the copper alloy wire. Preferably, iron may be included in 30wt% to 60wt% based on the total weight of the metal wire 110.
  • the metal wire 110 having a high iron content exhibits high strength even when the diameter is small, the size of the metal wire 110 to be used is reduced, resulting in a lighter weight than that of the related art. The effect can be obtained.
  • iron may impart electromagnetic and magnetic field shielding functions to the graphene composite metal wire 100 as a magnetic material.
  • iron can also perform a heat dissipation function due to the high thermal conductivity. Therefore, in the case where the iron content is high, the graphene composite metal wire 100 may be formed as a high-strength fine line, and may form a highly reliable product having a heat radiation function together with electromagnetic or magnetic field shielding functions.
  • the graphene composite metal wire 100 according to the present invention may further include a magnetic layer (not shown) between the metal wire 110 and the graphene layer 120.
  • the magnetic layer (not shown) is a magnetic layer and has a function of shielding electromagnetic waves or a magnetic field.
  • the magnetic layer (not shown) may include at least one metal of Ni, Fe, Co, M, Zn, Si, Mo, Nb, and B.
  • the graphene composite metal wire 200 according to the present invention may further include a carbon fiber 230 inside the metal wire 210.
  • the carbon fiber 230 is lighter than the metal, so that the carbon fiber 230 can maintain the strength even when the carbon fiber 230 is implemented in a smaller diameter. You can get it.
  • FIG. 5 is a graph showing the current density improvement efficiency of the graphene layer according to the diameter of the copper wire.
  • the electrical properties such as the resistance, thermal conductivity, and dielectric breakdown current density of the copper wire are improved, and the oxidation of the copper is delayed. Therefore, the current density of the copper wire having the graphene layer is improved. .
  • the current density of the graphene-coated copper wire may be calculated by Equation 1 below.
  • J is the current density of the graphene-coated copper wire
  • J ' is the current density of the copper wire
  • A is the cross-sectional area of the coated graphene
  • A' is the cross-sectional area of the copper wire
  • ⁇ is the conductivity of the graphene ⁇ 'is the conductivity of copper.
  • the current density improvement rate of the single graphene layer coated copper wire calculated according to Equation 1 is shown in FIG. 5. As the diameter of the copper wire becomes smaller, the current density improvement effect by the graphene layer coated with a single layer is expected to be increased.
  • the carbon fiber 230 When the carbon fiber 230 is included in the metal wire 210 as shown in the embodiment of FIG. 4, the carbon fiber 230 has a higher electrical conductivity than the metal in comparison with the case where only the metal wire 210 of the same diameter is included. Since it is low, the overall electrical conductivity is low. However, the carbon fiber 230 exhibits ten times more strength than the metal such as copper or iron by the weight of 1/3 to 1/4. Therefore, in the case of the graphene composite metal wire 200 including the carbon fiber 230 therein, the weight of the carbon fiber 230 is lighter than that of the metal wire 110 as a whole as shown in FIG. 3. Since the metal layer is included in the outside, the electrical conductivity is complemented, and thus the lightweight high strength property is shown.
  • a metal layer is positioned between the carbon fiber 230 and the graphene layer 220. If the metal layer is thin, the carbon fiber (220) is formed when the graphene layer 220 is formed. 230) and the gap between the graphene layer 220 is small. Therefore, when the graphene layer 220 is formed, the carbon meltability is higher due to the carbon fiber 230 layer under the metal layer, and thus, the graphene layer 220 may be formed in multiple layers.
  • 6 is a graph showing the current density improvement efficiency of the graphene layer according to the graphene thickness (number of layers). In FIG. 6, the current density improvement efficiency according to the number of layers of graphene, that is, the thickness of graphene, is shown for copper wires having diameters of 25 ⁇ m, 50 ⁇ m, and 100 ⁇ m, respectively.
  • the graphene composite metal wire 200 including the carbon fiber 230 is a graphene layer 220 because it is easy to form the graphene layer 220 in a multilayer while being lightweight and high strength using the carbon fiber 230 as a core. ),
  • the current density is improved by forming a multilayer, so that the carbon fiber 230 has a lower electrical conductivity than the metal, and the electrical properties are also improved.
  • the step of preparing a metal wire comprising a copper alloy wire In order to form a graphene layer in the present invention, forming a carbon source layer including a carbon source on the surface of the metal wire; And irradiating at least one of microwave (Variable Frequency Microwave, VFM) or white light (Intensed Pulse Light, IPL) to form a graphene layer on the surface of the metal wire.
  • microwave Variable Frequency Microwave
  • IPL Intensed Pulse Light
  • the metal wire may include a copper alloy wire, and may further include a magnetic layer on the surface of the copper alloy wire.
  • the copper alloy wire may be formed by vacuum deposition (sputter, thermal, e-beam evaporation, etc.), plating, and IPL-applied ink photocrystallization method, and the magnetic layer may be formed in the same manner as long as the magnetic layer is formed.
  • a carbon source layer including a carbon source is formed on the surface of the metal wire.
  • Carbon sources that can be used in the present invention include polyimide (PI), polymethylmethacrylate (PMMA), polystyrene (PS), acrylonitrile butadiene styrene (ABS), and For example, SAM (Self-assembled monolayer), which is a high molecular material is heated to a certain temperature when a certain temperature of the chemical structure of the polymer is decomposed and the chemical bonds are rearranged, and the CC bond cyclization proceeds, graphene These are polymers that form. Therefore, the carbon source can be used as long as it is a polymer that can undergo cyclization of C-C bonds by heating.
  • the carbon source layer may be formed by coating the surface of the metal wire.
  • the carbon source layer may be formed on the metal wire by spin coating, dip coating, or spray coating the carbon source.
  • Spin coating is a method of coating the carbon source polymer by dropping the metal wire or plate and then rotating the metal wire as a whole
  • dip coating is a method of coating the surface of the metal wire or plate by immersing the metal wire or plate in the carbon source polymer
  • Spray coating is a method of coating the surface of a metal wire or a plate by spraying the carbon source polymer.
  • the thickness of the coating is not limited as long as graphene is formed, but is preferably 100 nm or more and 1 m or less. When the thickness of the coating is less than 100 nm, graphene is not sufficiently formed, and when the thickness is greater than 1 ⁇ m, the carbon source polymer is excessively used, which is not preferable for the graphene layer layer control.
  • the carbon source layer may include at least one of an ionic liquid and a poly ionic liquid (PIL) in addition to the carbon source.
  • Ionic liquid or polymerized ionic liquid refers to a substance in which cations and anions do not crystallize due to their size asymmetry and exist in a liquid state. Unlike general salts, a liquid that exists as a liquid at a temperature below 100 ° C to be.
  • Cations include Morpholinium, Imidazolium, quaternary ammonium, or a quaternary phosphonium and the like phosphonium, the anion is Br -, Cl -, NO 3 -, BF 4 - or PF 6 - there is such an ionic liquid is such Many cations and anions can be prepared in combination. These ionic liquids or polymeric ionic liquids are characterized by volatility, thermal stability, high ionic conductivity, wide electrochemical stability, low vapor pressure and the like. When the carbon source layer is formed by mixing an ionic liquid or a polymerized ionic liquid with a polymer used as a carbon source, the carbon source layer may have high stability, and may be formed at a lower temperature than the graphene layer formed thereafter.
  • the carbon source layer When the carbon source layer is formed, at least one of microwave (Variable Frequency Microwave, VFM) or white light (Intensed Pulse Light, IPL) is irradiated to the metal wire on which the carbon source layer is formed. Irradiating microwaves or IPL means applying heat to the carbon source layer as light irradiation. When irradiated with microwaves or IPL, the carbon source layer is formed of a graphene layer at a temperature of 600 ° C. or lower. In particular, the microwave or IPL can selectively heat only the carbon source layer, and thus does not adversely affect the physical properties of the internal metal wires.
  • microwave Very Frequency Microwave
  • IPL Intensed Pulse Light
  • the graphene layer may have a temperature synthesized from the carbon source layer to 200 ° C to 300 ° C. That is, it is conventionally performed at a process temperature of 900 to 1,000 °C when synthesizing the graphene layer, adversely affects the physical properties such as tensile strength of metals such as copper, but to form a carbon source layer as in the present invention, micro
  • the graphene layer may be formed at about 600 ° C. when the wave or IPL is irradiated.
  • the carbon source layer further includes an ionic liquid or a polymerized ionic liquid
  • the graphene layer may be formed even at 300 to 600 ° C.
  • the graphene layer may be formed without affecting the physical properties of the metal wire.

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

L'invention concerne un fil composite métal/graphène et son procédé de fabrication, le fil composite métal/graphène présentant un haut degré de résistance et étant léger tout en constituant une ligne fine, présentant ainsi une fiabilité améliorée en termes de propriétés de haute conductivité. Le procédé de fabrication d'un fil composite métal/graphène comportant une couche de graphène sur sa surface, selon la présente invention, comprend les étapes consistant : à préparer un fil métallique comprenant un fil en alliage de cuivre; à former une couche de source de carbone comprenant une source de carbone sur la surface du fil métallique; et à l'exposer à une hyperfréquence et/ou à de la lumière blanche de façon à former une couche de graphène sur la surface du fil métallique.
PCT/KR2015/010160 2015-09-03 2015-09-25 Fil composite métal/graphène et son procédé de fabrication WO2017039055A1 (fr)

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KR1020150124811A KR20170028036A (ko) 2015-09-03 2015-09-03 그래핀 복합 금속와이어 및 그의 제조방법
KR10-2015-0124811 2015-09-03

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180269660A1 (en) * 2017-03-15 2018-09-20 Federal-Mogul Llc Advanced ignition coil wires
CN111584118A (zh) * 2020-04-09 2020-08-25 戚世成 铜包烯合金漆包线及其加工方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111899911A (zh) * 2020-07-01 2020-11-06 上海交通大学 一种石墨烯/金属复合导体及其制备方法和传输线
KR102521678B1 (ko) * 2021-08-23 2023-04-14 한국생산기술연구원 Ipl을 이용하여 표면개질된 저품위 탄소섬유 및 이를 포함하는 탄소섬유 복합재

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05114311A (ja) * 1991-04-30 1993-05-07 Honda Motor Co Ltd マグネツトワイヤー
US5578775A (en) * 1991-07-08 1996-11-26 Ito; Keisuke Wire for musical instrument string
JP2002150841A (ja) * 2000-11-09 2002-05-24 Fujikura Ltd 高張力電線
KR20130058389A (ko) * 2011-11-25 2013-06-04 전자부품연구원 그래핀 표면을 갖는 금속선의 제조방법
KR101503283B1 (ko) * 2013-09-23 2015-03-17 전자부품연구원 그래핀 코팅층을 포함하는 동축 케이블 및 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05114311A (ja) * 1991-04-30 1993-05-07 Honda Motor Co Ltd マグネツトワイヤー
US5578775A (en) * 1991-07-08 1996-11-26 Ito; Keisuke Wire for musical instrument string
JP2002150841A (ja) * 2000-11-09 2002-05-24 Fujikura Ltd 高張力電線
KR20130058389A (ko) * 2011-11-25 2013-06-04 전자부품연구원 그래핀 표면을 갖는 금속선의 제조방법
KR101503283B1 (ko) * 2013-09-23 2015-03-17 전자부품연구원 그래핀 코팅층을 포함하는 동축 케이블 및 제조방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180269660A1 (en) * 2017-03-15 2018-09-20 Federal-Mogul Llc Advanced ignition coil wires
US10923887B2 (en) * 2017-03-15 2021-02-16 Tenneco Inc. Wire for an ignition coil assembly, ignition coil assembly, and methods of manufacturing the wire and ignition coil assembly
CN111584118A (zh) * 2020-04-09 2020-08-25 戚世成 铜包烯合金漆包线及其加工方法

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