WO2017031799A1 - 有机发光二极管封装件及包括其的显示装置 - Google Patents

有机发光二极管封装件及包括其的显示装置 Download PDF

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Publication number
WO2017031799A1
WO2017031799A1 PCT/CN2015/089840 CN2015089840W WO2017031799A1 WO 2017031799 A1 WO2017031799 A1 WO 2017031799A1 CN 2015089840 W CN2015089840 W CN 2015089840W WO 2017031799 A1 WO2017031799 A1 WO 2017031799A1
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Prior art keywords
substrate
barrier
substrates
barrier member
disposed
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English (en)
French (fr)
Inventor
何超
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/897,506 priority Critical patent/US20180159070A1/en
Publication of WO2017031799A1 publication Critical patent/WO2017031799A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an organic light emitting diode package.
  • the invention further relates to a display device comprising such an organic light emitting diode package.
  • An organic light emitting diode is a light emitting diode device that can emit light after being energized.
  • the backlight can be omitted, so that the display device can be made lighter and thinner.
  • the OLED package in the prior art cannot separate the destructive fluid (such as water vapor and/or oxygen, etc.) from the organic light emitting diode, so that the destructive fluid can easily penetrate into the OLED package and The organic light emitting diodes are in contact with each other. Since the destruction of the fluid can cause great damage to the structure and performance of the organic light emitting diode, which greatly affects the display quality of the organic light emitting diode package, the display quality of the existing organic light emitting diode package is generally poor, and the user is present. Some OLED packages are not satisfactory for use.
  • the present invention provides an organic light emitting diode package having a high display quality.
  • the present invention also proposes a display device comprising such an organic light emitting diode package.
  • an OLED package includes an oppositely disposed substrate, and a receiving region for accommodating the organic light emitting diode is formed between the opposite substrates, wherein A barrier member capable of blocking a fluid damage is disposed around the receiving region between the oppositely disposed substrates, the barrier member is connected to one of the substrates, and the barrier member is disposed at a position corresponding to the barrier member of the other substrate.
  • the groove, the barrier extends into the groove.
  • the barrier member can block the destruction of the fluid, so that the damage fluid cannot pass directly through the barrier member into the receiving area, but needs to bypass the barrier member to enter the receiving area.
  • the OLED package of such a structure thereby reduces or even completely eliminates the damaging fluid entering the accommodating region thereof, thereby preventing the OLED from being damaged, improving the display quality of the OLED package, and extending the organic The lifetime of the LED package.
  • the recess is configured with a bottom wall that is parallel to the surface of the substrate, the barrier extending toward the bottom wall of the mating recess.
  • the passage of the barrier member toward the bottom wall and adjacent to the bottom wall extends the permeation path of the destructive fluid and reduces the size of the gap between the barrier member and the bottom wall, thereby further effectively reducing or even completely eliminating damage entering the receiving region. fluid.
  • the barrier member is in contact with the bottom wall.
  • the barrier is configured to surround the frame of the receiving area.
  • the destructive fluid can be blocked in multiple directions, so that the destructive fluid can be more effectively blocked outside the receiving area.
  • a plurality of barrier members are disposed in a direction parallel to the surface of the substrate and toward the receiving region, the plurality of barrier members being spaced apart from each other, the number of the grooves corresponding to the number of the barrier members.
  • adjacent barriers are parallel to each other in a direction parallel to the surface of the substrate and toward the receiving area. This structure facilitates processing of the organic light emitting diode package.
  • adjacent barriers are connected to different substrates in a direction parallel to the surface of the substrate and toward the receiving area.
  • a plastic frame connecting the oppositely disposed substrates is further disposed between the oppositely disposed substrates, and the plastic frame surrounds the receiving area, wherein the blocking member is disposed in the area where the plastic frame is disposed, the plastic frame Enclose the barrier.
  • the oppositely disposed substrates can be effectively connected together through the plastic frame, and the blocking members are also prevented The destruction of the fluid enters the receiving area.
  • the matching structure of the plastic frame and the barrier member occupies less space, and the occupied substrate area is smaller, thereby making the organic light emitting diode package smaller, or occupying the OLED package. When the volume and area are constant, the space and area occupied by the accommodating area can be increased.
  • the width of the barrier member occupies 10% to 40% of the width of the region of the bezel disposed between the substrates in a direction parallel to the surface of the substrate and toward the receiving region.
  • a display device comprising the above-described organic light emitting diode package.
  • This display device has higher display quality and a longer life.
  • the invention has the advantages that: (1) the barrier member can block the damage of the fluid, so that the damage fluid cannot directly pass through the barrier member and enter the accommodating region, but needs to bypass the barrier member and enter the accommodating region. Inside. (2) The destructive fluid entering the receiving area is reduced or even completely eliminated, the organic light emitting diode is prevented from being damaged, and the service life of the organic light emitting diode package is prolonged. (3) The display quality of the organic light emitting diode package is improved.
  • FIG. 1 is a schematic structural view showing an embodiment of an organic light emitting diode package of the present invention
  • FIG. 2 is a partial structural schematic view showing an embodiment of the organic light emitting diode package of FIG. 1;
  • Fig. 3 is a schematic structural view showing an embodiment of the barrier member of Fig. 1.
  • FIG. 1 schematically shows the structure of an organic light emitting diode package 100 (hereinafter simply referred to as a package 100) of the present invention.
  • the package 100 includes oppositely disposed substrates 11, 12.
  • the substrates 11, 12 will hereinafter be referred to as a first substrate 11 and a second substrate 12, respectively.
  • a receiving area 20 is formed between the first substrate 11 and the second substrate 12, and an organic light emitting diode (OLED) 21 may be disposed in the receiving area.
  • OLED organic light emitting diode
  • a barrier is provided around the receiving area 20 between the first substrate 11 and the second substrate 12.
  • the barrier is made of a material that has the ability to block the destruction of fluid.
  • the destructive fluid is typically oxygen and/or moisture.
  • the barrier member can be made of silicon nitride, silicon oxide or other dense material.
  • the barrier member is connected to one of the substrates, and at the same time, a groove matching the barrier member is disposed on the other substrate, and the opening of the groove faces the barrier member and the substrate provided with the barrier member, The barrier member can be extended into the recess.
  • the barrier member can be coupled to the first substrate 11, such as the barrier member 14b of FIG. In this case, corresponding grooves 15b are provided on the second substrate 12. The barrier 14b is inserted into the recess 15b.
  • the barrier member can be coupled to the second substrate 12, such as the barrier member 14a of FIG.
  • corresponding grooves 15a are provided on the first substrate 11. The barrier 14a is inserted into the recess 15a.
  • the destructive fluid will be blocked by the barrier member so that it cannot penetrate directly into the accommodating region 20 through the region where the barrier member is located in the direction of the arrow shown (ie, in a direction parallel to the surface of the substrate and toward the accommodating region).
  • this configuration greatly reduces the flow area of the permeate path that disrupts the fluid so that most of the destructive fluid can be blocked outside of the containment region 20, with only a small portion of the destructive fluid being able to wrap around the location from which the barrier is not disposed. It passes through and penetrates into the accommodating area 20.
  • the destructive fluid since the destructive fluid must bypass the barrier member to penetrate into the accommodating region 20, the permeation path of the destructive fluid is also prolonged, and the permeation path of the destructive fluid is made tortuous, thereby effectively reducing the damage entering the accommodating region 20. fluid.
  • the above structure can effectively prevent the destruction gas from coming into contact with the organic light emitting diode 21 disposed in the accommodating region 20, thereby ensuring the normal operation of the OLED 21, thereby effectively improving the display quality of the package 100, and The service life of the package 100 is extended to meet the needs of the user for the organic light emitting diode package.
  • the barrier member may extend into the recess and further extend toward the bottom wall of the recess.
  • the groove 15a has a bottom wall 151a which is parallel or substantially parallel to the surface of the first substrate 11 facing the second substrate 12.
  • the barrier member 14a extends toward the bottom wall 151a to minimize the distance between the barrier member 14a and the bottom wall 151a.
  • the barrier member is allowed to extend into contact with the bottom wall of the recess. That is, it is desirable for the barrier member 14a to extend into contact with the bottom wall 151a of the recess 15a. With this configuration, the destruction gas can be completely blocked outside the accommodating region 20.
  • the barrier member (for example, the barrier member 14a) may be configured as a frame.
  • the barrier member configured as a frame can surround the receiving region 20 and the organic light emitting diode 21 disposed in the receiving region in an empty interior thereof.
  • the frame here may be a rectangular frame, a circular frame or other regular or irregular frames.
  • a plurality of barrier members 14a, 14b, 14c, 14d are disposed in a direction parallel to the surface of the substrate and toward the receiving region, and recesses are provided corresponding to the barrier members 14a, 14b, 14c, 14d. Slots 15a, 15b, 15c, 15d.
  • the barrier members 14a, 14b, 14c, 14d are spaced apart from one another. The destruction gas can be further blocked outside the accommodating region 20 by this structure.
  • barrier members 14a, 14b, 14c, 14d may be disposed on the first substrate 11 and the grooves 15a, 15b, 15c, 15d may be disposed on the second substrate 12.
  • the barrier members 14a, 14b, 14c, 14d may be disposed on the second substrate 12, and the grooves 15a, 15b, 15c, 15d may be disposed on the first substrate 11.
  • one or more of the barrier members 14a, 14b, 14c, 14d may be disposed on the first substrate 11 in a direction parallel to the surface of the substrate and toward the receiving region, and the additional barrier members may be disposed On the second substrate 12, the grooves 15a, 15b, 15c, 15d are disposed on the respective substrates corresponding to the barrier members.
  • the length of the permeation path can be lengthened and the permeation path can be made more tortuous.
  • adjacent barrier members can be attached to different substrates. That is, as shown in FIG. 1, the barrier members 14a, 14c may be disposed on the second substrate 12, the barrier members 14b, 14d are disposed on the first substrate 11, and recessed corresponding to the respective barrier members. Slots 15a, 15b, 15c, 15d. Through this staggered structure, the permeation path of the destructive fluid can be greatly extended, and the permeation path can be made more tortuous.
  • barrier members 14a, 14b, 14c, 14d may extend into the recesses 15a, 15b, 15c, 15d, respectively, and are in contact with the bottom walls 151a, 151b, 151c, 151d, respectively.
  • only one or more of the barrier members 14a, 14b, 14c, 14d may extend into the respective recesses and respectively contact the respective bottom walls.
  • a plastic frame 13 may be disposed between the first substrate 11 and the second substrate 12 which are disposed opposite each other.
  • the plastic frame is a frame structure as shown in FIG. 3, and the receiving area can be enclosed in the hollow portion of the middle portion thereof. Thereby, the first substrate 11 and the second substrate 12 can be stably connected together and formed to be stably accommodated.
  • the barrier member is in the region 10 in which the bezel 13 is disposed.
  • This structure can effectively reduce the space occupied by the frame and the barrier and the area of the substrate.
  • the organic light emitting diode package can be made smaller to accommodate the use of the package 100.
  • the space and area occupied by the accommodating area 20 can be increased without the volume and area of the package 100 being constant.
  • the plastic frame 13 surrounds the barrier.
  • the bezel 13 can extend into the recess and fill the recess.
  • the bezel 13 can extend into the gap.
  • the width of all of the barrier members may be from 10% to 40% of the width of the region 10 of the bezel disposed between the substrates in a direction parallel to the surface of the substrate and toward the receiving region.
  • This structure can effectively ensure that the plastic frame effectively connects the substrates together while blocking the destruction of the fluid.
  • adjacent barrier members may be parallel to each other in a direction parallel to the surface of the substrate and toward the receiving region, thereby facilitating processing of the package 100.
  • the barrier members may be inclined, crossed, and the like.
  • the barrier member can be a node and the plastic frame can be used as a connection medium to form any feasible topology.
  • the above package 100 can be produced by the following manufacturing method.
  • one or more grooves are etched in a region of the substrate (the first substrate 11 and/or the second substrate 12) where the bezel is to be provided.
  • spacers that are opposite and matched to the grooves are provided at corresponding positions on the opposite substrates (the second substrate 12 and/or the first substrate 11).
  • UV adhesive a UV-curable adhesive
  • the ultraviolet curable adhesive is disposed on the substrate disposed opposite to each other at the time of manufacture, and covers the groove formed on the substrate and the barrier member disposed on the substrate.
  • the substrates (the first substrate 11 and the second substrate 12) are disposed opposite each other so that the barrier member can be inserted into the recess at a predetermined depth.
  • the ultraviolet curable adhesive is cured by ultraviolet irradiation of the ultraviolet curable adhesive to form a bead frame 13 which connects the oppositely disposed substrates (the first substrate 11 and the second substrate 12) together.
  • the use of the above-described package 100, or the package 100 manufactured by the above method, can block the destructive fluid outside the accommodating region 20, thereby effectively ensuring the illuminating quality of the OLED and extending the service life of the OLED.
  • the use of the above-described package 100, or the use of the package 100 manufactured by the above method enables the display device including the same to have a high illuminating quality and a long service life.
  • package 100 or display device described above may also include any structure that is known to those skilled in the art to be necessary for the package 100 or display device to function properly.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

有机发光二极管封装件（100）包括相对设置的基板（11,12），在相对设置的基板（11,12）之间形成用于容纳有机发光二极管（21）的容纳区域（20），其中，在相对设置的基板（11,12）之间的容纳区域（11,12）的周围设置有能阻隔破坏流体的阻隔件（14a，14b，14c，14d），阻隔件（14a，14b，14c，14d）与其中一个基板（11,12）相连，在另一个基板（11,12）的与阻隔件（14a，14b，14c，14d）相对应的位置上设置有与阻隔件相匹配的凹槽（15a，15b，15c，15d），阻隔件（14a，14b，14c，14d）延伸至凹槽（15a，15b，15c，15d）内。这种有机发光二极管封装件（100）的显示品质较高。

Description

有机发光二极管封装件及包括其的显示装置
相关申请的交叉引用
本申请要求享有于2015年8月25日提交的名称为“有机发光二极管封装件及包括其的显示装置”的中国专利申请CN 201510524146.0的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本发明涉及显示技术领域，特别是涉及一种有机发光二极管封装件。本发明还涉及包括这种有机发光二极管封装件的显示装置。
背景技术
有机发光二极管(OLED)是能在通电后进行发光的一种发光二极管器件。通过在显示装置中使用有机发光二极管能省去背光源，以便于显示装置能制造得更加轻薄。
但是，在现有技术中的有机发光二极管封装件无法将破坏流体(例如水汽和/或氧气等)与有机发光二极管分隔开，从而破坏流体能轻易地渗透到有机发光二极管封装件内并与其中的有机发光二极管相接触。由于破坏流体能对有机发光二极管的结构和性能造成很大破坏，会极大地影响有机发光二极管封装件的显示品质，所以现有的有机发光二极管封装件的显示品质通常较差，使用者对现有的有机发光二极管封装件的使用体验不满意。
因此，需要一种显示品质较高的有机发光二极管封装件。
发明内容
针对上述问题，本发明提出了一种有机发光二极管封装件，其显示品质较高。本发明还提出了一种显示装置，其包括这种有机发光二极管封装件。
根据本发明的第一方面，提出了一种有机发光二极管封装件，其包括相对设置的基板，在相对的基板之间形成用于容纳有机发光二极管的容纳区域，其中， 在相对设置的基板之间的容纳区域的周围设置有能阻隔破坏流体的阻隔件，阻隔件与其中一个基板相连，在另一个基板的与阻隔件相对应的位置上设置有与阻隔件相匹配的凹槽，阻隔件延伸至凹槽内。
通过使用本发明的有机发光二极管封装件，阻隔件能阻隔破坏流体，从而使得破坏流体无法直接穿过阻隔件而进入到容纳区域内，而是需要绕过阻隔件才能进入到容纳区域内。这种结构的有机发光二极管封装件由此减少甚至完全消除了进入到其容纳区域内的破坏流体，从而防止了有机发光二极管损坏，提高了有机发光二极管封装件的显示品质，并且还延长了有机发光二极管封装件的使用寿命。
在一个实施例中，凹槽构造有与基板的表面平行的底壁，阻隔件朝向相匹配的凹槽的底壁延伸。通过阻隔件朝向底壁延伸并靠近底壁延长了破坏流体的渗透路径，并减小了在阻隔件与底壁之间的间隙尺寸，从而进一步有效地减少甚至完全消除进入到容纳区域内的破坏流体。
在一个实施例中，阻隔件与底壁相接触。通过这种结构完全阻断了破坏流体的渗透路径，以使得破坏流体更是无法进入到容纳区域内。
在一个实施例中，阻隔件构造为包围所述容纳区域的框体。通过这种阻隔件能在多个方向上阻隔破坏流体，从而能更加有效地将破坏流体阻隔在容纳区域之外。
在一个实施例中，在沿与基板的表面平行并朝向容纳区域的方向上设置有多个阻隔件，多个阻隔件相互间隔开，凹槽的数量与阻隔件的数量相对应。通过这种结构能进一步阻碍破坏流体的渗透，并能更加有效地减少甚至消除进入到容纳区域内的破坏流体。
在一个实施例中，在沿与基板的表面平行并朝向容纳区域的方向上，相邻的阻隔件相互平行。这种结构方便了对有机发光二极管封装件进行加工。
在一个实施例中，在沿与基板的表面平行并朝向容纳区域的方向上，相邻的阻隔件与不同的基板相连。通过这种结构能进一步延长破坏流体的渗透路径，从而能进一步减少甚至消除进入到容纳区域内的破坏流体。
在一个实施例中，在相对设置的基板之间还设置有将相对设置的基板连接在一起的胶框，胶框包围容纳区域，其中，阻隔件设置在设置有胶框的区域内，胶框包围阻隔件。通过胶框能将相对设置的基板有效连接在一起，同时阻隔件还防 止了破坏流体进入到容纳区域内。另外，胶框与阻隔件的这种配合结构所占空间较小，所占的基板面积较小，由此可将有机发光二极管封装件制造得更小，或者在有机发光二极管封装件的所占体积和面积不变的情况下，可以增大容纳区域所占的空间和面积。
在一个实施例中，在沿与基板的表面平行并朝向容纳区域的方向上，阻隔件的宽度占基板之间的设置有胶框的区域的宽度的10％至40％。这种结构能在阻隔破坏流体的同时有效保证胶框将基板有效连接在一起。
根据本发明的第二方面，提出了一种显示装置，其包括上述有机发光二极管封装件。这种显示装置的显示品质更高，并且使用寿命更长。
与现有技术相比，本发明的优点在于：(1)阻隔件能阻隔破坏流体，从而破坏流体无法直接穿过阻隔件而进入到容纳区域内，而是需要绕过阻隔件进入到容纳区域内。(2)减少甚至完全消除了进入到容纳区域内的破坏流体，防止了有机发光二极管损坏，延长了有机发光二极管封装件的使用寿命。(3)提高了有机发光二极管封装件的显示品质。
附图说明
在下文中将基于实施例并参考附图来对本发明进行更详细的描述。其中：
图1是显示了本发明的有机发光二极管封装件的一个实施例的结构示意图；
图2是显示了图1的有机发光二极管封装件的一个实施例的局部结构示意图；以及
图3是显示了图1中的阻隔件的一个实施例的结构示意图。
在附图中，相同的部件使用相同的附图标记。附图并未按照实际的比例绘制。
具体实施方式
下面将结合附图对本发明作进一步说明。
图1示意性显示了本发明的有机发光二极管封装件100(以下简称为封装件100)的结构。
封装件100包括相对设置的基板11，12。为了便于说明，以下将基板11，12分别称为第一基板11和第二基板12。在第一基板11和第二基板12之间形成容纳区域20，有机发光二极管(OLED)21可设置在容纳区域内。
在第一基板11和第二基板12之间的容纳区域20的周围设置有阻隔件。阻隔件由具有阻挡破坏流体的能力的材料制成。破坏流体通常为氧气和/或水汽。在这种情况下，阻隔件可由氮化硅、氧化硅或其他致密材料制得。
如图2所示，阻隔件与其中一个基板相连，同时，在另一基板上设置有与该阻隔件相匹配的凹槽，凹槽的开口朝向阻隔件以及设置有该阻隔件的基板，以使得阻隔件能延伸至凹槽内。
在一个实施例中，阻隔件可与第一基板11相连，如图2中的阻隔件14b。在这种情况下，在第二基板12上设置有相应的凹槽15b。阻隔件14b插入到凹槽15b内。
在另一个实施例中，阻隔件可与第二基板12相连，如图2中的阻隔件14a。在这种情况下，在第一基板11上设置有相应的凹槽15a。阻隔件14a插入到凹槽15a内。
通过上述结构，破坏流体将被阻隔件阻挡，致使其无法直接沿图示的箭头方向(即沿与基板的表面平行并朝向容纳区域的方向)穿过阻隔件所在的区域而渗透至容纳区域20内。由此，这种结构极大地减小了破坏流体的渗透路径的流通面积，使得大部分破坏流体能被阻挡在容纳区域20之外，只有少部分破坏流体能从未设置阻隔件的位置处绕过并渗透到容纳区域20内。另外，由于破坏流体必须绕过阻隔件才能渗透到容纳区域20内，因此还延长了破坏流体的渗透路径，并使得破坏流体的渗透路径较为曲折，从而有效减少了进入到容纳区域20内的破坏流体。
因此，通过上述结构能有效防止破坏气体与设置在容纳区域20内的有机发光二极管21相接触，并由此保证了有机发光二极管21能正常工作，从而有效提高了封装件100的显示品质，并延长了封装件100的使用寿命，能满足使用者对有机发光二极管封装件的需要。
为了更为有效地阻挡破坏气体，可令阻隔件延伸至凹槽内，并进一步朝向凹槽的底壁延伸。如图2所示，凹槽15a具有与第一基板11的朝向第二基板12的表面平行或大体平行的底壁151a。阻隔件14a朝向底壁151a延伸，以尽量减小阻隔件14a与底壁151a之间的距离。通过上述结构，能进一步减小破坏流体的渗透路径的流通面积，从而能进一步防止破坏流体进入到容纳区域20内。
优选地，可令阻隔件延伸至与凹槽的底壁相接触。即是说，对于阻隔件14a来说理想的是，其可延伸至与凹槽15a的底壁151a相接触。通过这种结构可完全将破坏气体阻隔在容纳区域20之外。
另外，如图3所示，阻隔件(例如阻隔件14a)可构造为框体。构造为框体的阻隔件可在其中空的内部包围容纳区域20以及设置在容纳区域内的有机发光二极管21。根据具体的需要，这里的框体可以为矩形框、圆形框或其他规则或不规则的框体。
优选地，如图1所示，沿与基板的表面平行并朝向容纳区域的方向设置有多个阻隔件14a，14b，14c，14d，并且对应于阻隔件14a，14b，14c，14d设置有凹槽15a，15b，15c，15d。阻隔件14a，14b，14c，14d之间相互间隔开。通过这种结构能进一步将破坏气体阻隔在容纳区域20之外。
这里应理解地是，可将阻隔件14a，14b，14c，14d均设置在第一基板11上，并将凹槽15a，15b，15c，15d均设置在第二基板12上。或者，可将阻隔件14a，14b，14c，14d均设置在第二基板12上，并将凹槽15a，15b，15c，15d均设置在第一基板11上。
优选地，可在沿与基板的表面平行并朝向容纳区域的方向上，将阻隔件14a，14b，14c，14d中的一个或多个设置在第一基板11上，并将另外的阻隔件设置在第二基板12上，将凹槽15a，15b，15c，15d对应于阻隔件设置在相应的基板上。由此，能延长渗透路径的长度，并使得渗透路径更加曲折。
更加优选地，可令相邻的阻隔件与不同的基板相连。即是说，可如图1所示的那样，将阻隔件14a，14c设置在第二基板12上，将阻隔件14b，14d设置在第一基板11上，并对应于相应的阻隔件设置凹槽15a，15b，15c，15d。通过这种交错的结构，能极大地延长破坏流体的渗透路径，并使得渗透路径更加曲折。
这里应理解地是，阻隔件14a，14b，14c，14d可分别延伸至凹槽15a，15b，15c，15d内，并分别与底壁151a，151b，151c，151d相接触。或者，也可只有阻隔件14a，14b，14c，14d中的一个或多个分别延伸至相对应的凹槽内，并分别与相应的底壁相接触。
另外，如图2所示，在相对设置的第一基板11和第二基板12之间还可设置胶框13。胶框为如图3所示的框体结构，可将容纳区域包围在其中部的中空区域内。由此能将第一基板11和第二基板12稳定地连接在一起，并形成能稳定容纳 有机发光二极管21的容纳区域20。
如图1和图2所示，阻隔件处于设置有胶框13的区域10内。这种结构能有效减小胶框与阻隔件所占的空间以及基板面积。由此，可将有机发光二极管封装件制造得更小，以适应封装件100的使用需要。或者，可在封装件100的所占体积和面积不变的情况下，增大容纳区域20所占的空间和面积。
并且在这种情况下，胶框13包围阻隔件。而且，在阻隔件没有填满相对应的凹槽的情况下，胶框13可延伸至凹槽内并填满凹槽。例如，在阻隔件与凹槽的底壁之间构造有间隙的情况下，胶框13可延伸至该间隙内。通过这种结构能有效提高相对的基板(即第一基板11和第二基板12)之间的连接的稳定性。
优选地，可在沿与基板的表面平行并朝向容纳区域的方向上，令所有的阻隔件的宽度占基板之间的设置有胶框的区域10的宽度的10％至40％。这种结构能在阻隔破坏流体的同时有效保证胶框将基板有效连接在一起。
此外，还可令相邻的阻隔件在沿与基板的表面平行并朝向容纳区域的方向上相互平行，由此方便了对封装件100进行加工。但是，根据使用需要，也可令阻隔件之间相互倾斜、交叉等。在将阻隔件设置在设置有胶框的区域10的情况下，可以阻隔件为节点而以胶框为连接媒介而形成任意可行的拓扑结构。
上述封装件100可由以下制造方法制得。
首先，在基板(第一基板11和/或第二基板12)上的将要设置胶框的区域内蚀刻出一个或多个凹槽。
然后，在相对的基板(第二基板12和/或第一基板11)上的相应的位置处设置与凹槽相对并相匹配的阻隔件。
上述凹槽和阻隔件的具体位置和结构可根据上文中对封装件100的结构的描述以及使用者的具体需要而确定。
再然后，在设置好凹槽和或阻隔件的基板上，设置紫外线固化胶(UV胶)。优选地，将紫外线固化胶设置在制造时相对设置在下方的基板上，并覆盖在构造于该基板上的凹槽上以及设置在该基板上的阻隔件上。
接下来，将基板(第一基板11和第二基板12)相对设置在一起，令阻隔件能以预定深度插入到凹槽内。
最后，通过紫外线照射紫外线固化胶而使紫外线固化胶固化以形成将相对设置的基板(第一基板11和第二基板12)连接在一起的胶框13。
使用上述封装件100，或使用通过上述方法制造成的封装件100能将破坏流体阻隔在容纳区域20之外，从而能有效保证有机发光二极管的发光品质，并延长有机发光二极管的使用寿命。
同时，使用上述封装件100，或使用通过上述方法制造成的封装件100还能使得包括其的显示装置具有较高的发光品质，以及较长的使用寿命。
这里应理解地是，上述封装件100或显示装置还可包括本领域的技术人员所熟知的任一为了使封装件100或显示装置正常工作而必须的结构。
虽然已经参考优选实施例对本发明进行了描述，但在不脱离本发明的范围的情况下，可以对其进行各种改进并且可以用等效物替换其中的部件。尤其是，只要不存在结构冲突，各个实施例中所提到的各项技术特征均可以任意方式组合起来。本发明并不局限于文中公开的特定实施例，而是包括落入权利要求的范围内的所有技术方案。

Claims (18)

  1. 一种有机发光二极管封装件，其包括相对设置的基板，在相对的所述基板之间形成用于容纳有机发光二极管的容纳区域，
    其中，在相对设置的基板之间的所述容纳区域的周围设置有能阻隔破坏流体的阻隔件，所述阻隔件与其中一个基板相连，在另一个基板的与所述阻隔件相对应的位置上设置有与所述阻隔件相匹配的凹槽，所述阻隔件延伸至所述凹槽内。
  2. 根据权利要求1所述的有机发光二极管封装件，其中，所述凹槽构造有与所述基板的表面平行的底壁，所述阻隔件朝向相匹配的所述凹槽的底壁延伸。
  3. 根据权利要求2所述的有机发光二极管封装件，其中，所述阻隔件与所述底壁相接触。
  4. 根据权利要求1所述的有机发光二极管封装件，其中，所述阻隔件构造为包围所述容纳区域的框体。
  5. 根据权利要求1所述的有机发光二极管封装件，其中，在沿与基板的表面平行并朝向所述容纳区域的方向上设置有多个阻隔件，多个所述阻隔件相互间隔开，所述凹槽的数量与所述阻隔件的数量相对应。
  6. 根据权利要求5所述的有机发光二极管封装件，其中，在沿与基板的表面平行并朝向所述容纳区域的方向上，相邻的阻隔件相互平行。
  7. 根据权利要求5所述的有机发光二极管封装件，其中，在沿与基板的表面平行并朝向所述容纳区域的方向上，相邻的阻隔件与不同的基板相连。
  8. 根据权利要求1所述的有机发光二极管封装件，其中，在相对设置的所述基板之间还设置有将相对设置的基板连接在一起的胶框，所述胶框包围所述容纳区域，
    其中，所述阻隔件设置在设置有胶框的区域内，所述胶框包围所述阻隔件。
  9. 根据权利要求8所述的有机发光二极管封装件，其中，在沿与基板的表面平行并朝向所述容纳区域的方向上，所述阻隔件的宽度占所述基板之间的设置有胶框的区域的宽度的10％至40％。
  10. 一种显示装置，其包括有机发光二极管封装件，所述有机发光二极管封装件包括相对设置的基板，在相对的所述基板之间形成用于容纳有机发光二极管的容纳区域，
    其中，在相对设置的基板之间的所述容纳区域的周围设置有能阻隔破坏流体的阻隔件，所述阻隔件与其中一个基板相连，在另一个基板的与所述阻隔件相对应的位置上设置有与所述阻隔件相匹配的凹槽，所述阻隔件延伸至所述凹槽内。
  11. 根据权利要求10所述的显示装置，其中，所述凹槽构造有与所述基板的表面平行的底壁，所述阻隔件朝向相匹配的所述凹槽的底壁延伸。
  12. 根据权利要求11所述的显示装置，其中，所述阻隔件与所述底壁相接触。
  13. 根据权利要求10所述的显示装置，其中，所述阻隔件构造为包围所述容纳区域的框体。
  14. 根据权利要求10所述的显示装置，其中，在沿与基板的表面平行并朝向所述容纳区域的方向上设置有多个阻隔件，多个所述阻隔件相互间隔开，所述凹槽的数量与所述阻隔件的数量相对应。
  15. 根据权利要求14所述的显示装置，其中，在沿与基板的表面平行并朝向所述容纳区域的方向上，相邻的阻隔件相互平行。
  16. 根据权利要求14所述的显示装置，其中，在沿与基板的表面平行并朝向所述容纳区域的方向上，相邻的阻隔件与不同的基板相连。
  17. 根据权利要求10所述的显示装置，其中，在相对设置的所述基板之间还设置有将相对设置的基板连接在一起的胶框，所述胶框包围所述容纳区域，
    其中，所述阻隔件设置在设置有胶框的区域内，所述胶框包围所述阻隔件。
  18. 根据权利要求17所述的显示装置，其中，在沿与基板的表面平行并朝向所述容纳区域的方向上，所述阻隔件的宽度占所述基板之间的设置有胶框的区域的宽度的10％至40％。
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