WO2017028794A1 - 太赫兹超材料 - Google Patents

太赫兹超材料 Download PDF

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Publication number
WO2017028794A1
WO2017028794A1 PCT/CN2016/095805 CN2016095805W WO2017028794A1 WO 2017028794 A1 WO2017028794 A1 WO 2017028794A1 CN 2016095805 W CN2016095805 W CN 2016095805W WO 2017028794 A1 WO2017028794 A1 WO 2017028794A1
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Prior art keywords
substrate
ring structure
terahertz
electromagnetic
electromagnetic loss
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PCT/CN2016/095805
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English (en)
French (fr)
Inventor
刘若鹏
熊伟
叶金财
何嘉威
王今金
陈江波
张淑媛
Original Assignee
深圳光启高等理工研究院
深圳光启创新技术有限公司
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Priority to EP16836658.1A priority Critical patent/EP3340385B1/en
Priority to US15/894,017 priority patent/US20190137655A1/en
Publication of WO2017028794A1 publication Critical patent/WO2017028794A1/zh
Priority to US17/033,436 priority patent/US20210011195A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/002Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of materials engineered to provide properties not available in nature, e.g. metamaterials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/0086Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B3/00Hydrogen; Gaseous mixtures containing hydrogen; Separation of hydrogen from mixtures containing it; Purification of hydrogen
    • C01B3/02Production of hydrogen or of gaseous mixtures containing a substantial proportion of hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/0427Coating with only one layer of a composition containing a polymer binder
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/007Optical devices or arrangements for the control of light using movable or deformable optical elements the movable or deformable optical element controlling the colour, i.e. a spectral characteristic, of the light
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/364Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor
    • H01Q1/368Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor using carbon or carbon composite
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives

Definitions

  • the present invention relates to the field of electromagnetic communication, and in particular to a terahertz metamaterial.
  • Terahertz which refers to electromagnetic waves with a frequency in the range of 0. ITHz-lOTHz, whose wavelength covers 3mm-30w m, and is also known as THz radiation, submillimeter wave or T-ray.
  • THz radiation submillimeter wave or T-ray.
  • Terahertz is between the millimeter wave and the infrared in the electromagnetic spectrum. Compared to the two bands of millimeter wave and infrared, terahertz is not widely used in the field of electromagnetic communication.
  • terahertz The reason for the limited application of terahertz is that it is mainly restricted by terahertz sources, detectors and functional devices, so it has not been applied on a large scale; in addition, since the terahertz wavelength is very short, this This will result in a device that is much smaller than a microwave device, that is, its size may be on the order of a few percent of that of a microwave device, so processing of terahertz devices can be very difficult and costly.
  • the present invention proposes a terahertz super material which can simplify the processing steps of the terahertz device, reduce the processing cost, and can be widely applied in the field of electromagnetic communication.
  • a terahertz metamaterial is provided.
  • the terahertz metamaterial includes: [0010] a substrate;
  • the substrate comprises a flexible substrate.
  • the terahertz metamaterial further includes:
  • the electromagnetic loss resonant ring structure of different sizes is processed on the electromagnetic loss film.
  • the electromagnetic loss resonant ring structure is a resonant ring structure having an opening.
  • the resonant ring structure having an opening has a U-shape, a V-shape, a C-shape, an inverted h-shape, an L-shape, or a y-shape.
  • the electromagnetic loss resonant ring structure has a closed resonant ring structure.
  • the closed resonant ring structure has an elliptical shape, a closed polygonal shape, a D-shaped shape, or a P-shape.
  • the square resistance of the electromagnetic loss resonant ring structure is 200 ohms per square.
  • the material contained in the electromagnetic loss film is selected from nano carbon powder, or resin, or a combination of the two
  • the electromagnetic loss resonant ring structure disposed on the substrate includes a plurality of, and the plurality of electromagnetic loss resonant ring structures are arranged on the substrate in a periodic array manner.
  • the substrate is divided into a plurality of cells, and each of the cells is provided with an electromagnetic loss resonant ring structure.
  • the cells are square, and the length and width of the cells are in the range of 320 ⁇ ⁇ ⁇ 480 ⁇
  • the flexible substrate comprises a polyimide film ( ⁇ ) film.
  • the flexible substrate is a low dielectric constant substrate.
  • the thickness of the substrate is in the range of 2. 8 ⁇ 4.
  • the loss tangent of the substrate is in the range of 0. 0048, . 0072
  • the thickness of the substrate is in the range of 60 ⁇ ⁇ 90 ⁇ m.
  • the dielectric constant of the substrate is in the range of 3.44 ⁇ 5.
  • the loss tangent of the substrate ranges from 0. 0032. 0048
  • the thickness of the substrate ranges from 32 ⁇ ⁇ 48 ⁇ m.
  • the influence factors of the terahertz metamaterial on the electromagnetic modulation function of the terahertz band include at least one of the following: [0030] the size of the electromagnetic loss resonant ring structure;
  • a periodic arrangement of a plurality of electromagnetic loss resonant ring structures on a substrate is a periodic arrangement of a plurality of electromagnetic loss resonant ring structures on a substrate.
  • the electromagnetic loss resonant ring structure includes two sides parallel and symmetrical to each other and a bottom side connecting the two sides.
  • the length of the side has a range of 180 ⁇ ⁇ ⁇ 220 ⁇ ⁇
  • the width of the side has a range of 4 0 ⁇ ⁇ ⁇ 60 ⁇ m
  • the distance between the two sides ranges from 180 ⁇ ⁇ ⁇ 220 ⁇ m
  • the length of the bottom edge is 240 ⁇ ⁇ 360 ⁇ ⁇ .
  • the present invention achieves a terahertz device processing step by providing an electromagnetic loss resonant ring structure on a substrate and adjusting the electromagnetic modulation function of the terahertz band by adjusting different structural sizes and square resistances of the electromagnetic loss resonant ring structure.
  • the effect of reducing the processing cost enables the terahertz technology to be widely used in the field of electromagnetic communication.
  • FIG. 1 is a side elevational view of a terahertz metamaterial in accordance with an embodiment of the present invention
  • FIG. 2 is a top plan view of the terahertz metamaterial shown in FIG. 1.
  • a terahertz metamaterial is provided.
  • a terahertz metamaterial according to an embodiment of the present invention includes:
  • the structure of the electromagnetic loss resonant ring structure 12 is The ring structure, wherein the terahertz band electromagnetic modulation function can be realized by adjusting different structural sizes and square resistances of the electromagnetic loss resonant ring structure 12.
  • the substrate 11 is covered with an electromagnetic loss film, and the electromagnetic loss resonant ring structure 1 2 is based on the electromagnetic loss film processing, and in different embodiments, different sizes of the electromagnetic loss resonant ring structure 12 can be processed on the electromagnetic loss film, so that a plurality of different sizes of electromagnetic losses are disposed on the substrate.
  • Resonant ring structure in the manufacturing process of the terahertz metamaterial, first, the substrate 11 is covered with an electromagnetic loss film, and the electromagnetic loss resonant ring structure 1 2 is based on the electromagnetic loss film processing, and in different embodiments, different sizes of the electromagnetic loss resonant ring structure 12 can be processed on the electromagnetic loss film, so that a plurality of different sizes of electromagnetic losses are disposed on the substrate.
  • Resonant ring structure in the manufacturing process of the terahertz metamaterial, first, the substrate 11 is covered with an electromagnetic loss film, and the electromagnetic loss resonant ring structure 1 2 is based on the electromagnetic loss film processing, and in different embodiments, different sizes
  • the electromagnetic loss resonant ring structure may be a resonant ring structure having an opening (Fig. 1, Fig. 2 is a single The regular resonant ring of the opening), but according to the different requirements of the electromagnetic modulation, the electromagnetic loss resonant ring structure 12 can also be configured as a closed resonant ring or a multi-opening resonant ring, thereby adjusting the electromagnetic frequency of the terahertz band (0.1 to 10 ⁇ ) The frequency and magnitude of the loss.
  • the resonant ring structure having an opening may be U-shaped, V-shaped, C-shaped, inverted h-shaped, L Glyph, or y-shaped, etc.
  • the closed resonant ring structure may have an elliptical shape, a closed polygon shape, a D shape, or a P shape.
  • the resonant ring structure is a U-shaped regular single-opening resonant ring (ie, a single-open square resonant ring), wherein, as can be seen from FIG.
  • the single-open square resonant ring includes two sides parallel and symmetrical to each other and a bottom side connecting the two sides, wherein, for the sizes of the side edges and the bottom sides, the length of the side sides herein ranges from 180 ⁇ ⁇ 220 ⁇ ⁇ , the width of the side is in the range of 40 ⁇ ⁇ 60 ⁇ m, the distance between the two sides is 180 ⁇ ⁇ 220 ⁇ m, and the length of the bottom is in the range of 240 ⁇ ⁇ 360 ⁇ . ⁇ , wherein, in a preferred embodiment, the length of the sides and The width is 200 ⁇ ⁇ , 50 ⁇ ⁇ , and the two sides are 200 ⁇ ⁇ apart, and the base is 300 ⁇ ⁇ long.
  • the square resistance of the electromagnetic loss resonant ring structure shown in FIG. 2 is 200 ohms per square.
  • the material contained is selected from nano carbon powder, or resin, or a combination of the two, That is, the electromagnetic loss film may be composed of nano-sized carbon powder, or may be composed of a resin material, or may be a mixture material of nano-scale carbon powder and a resin material, and of course, the electromagnetic loss film
  • the constituent materials may also be other non-metallic materials with electromagnetic loss function, so that different non-metal materials can be doped according to the modulation requirements of different terahertz bands.
  • an electromagnetic loss resonant ring structure is disposed on a substrate, and substantially, in different embodiments, different sizes of electromagnetic loss resonance can be processed on the electromagnetic loss film.
  • the ring structure 12 is provided with a plurality of electromagnetic loss resonant ring structures of different sizes on the substrate.
  • the electromagnetic loss resonant ring structure 12 is arranged on the flexible substrate 11 in a periodic array, that is, according to an embodiment of the present invention.
  • the terahertz metamaterial may comprise a plurality of metamaterial unit structures as shown in Fig. 2 arranged in a periodic array.
  • the substrate may be divided into a plurality of cells, and an electromagnetic loss resonant ring structure is placed on each cell, and each The shape of the electromagnetic loss resonant ring structure placed on the cells may be the same or different.
  • the substrate 11 in order to enable the terahertz metamaterial of the present invention to implement electricity in the terahertz band
  • the magnetic substrate the substrate 11 according to the embodiment of the present invention may be a flexible substrate, and is a low dielectric constant substrate (dielectric constant is less than 4.5 and greater than 3.8); and for the composition of the flexible substrate 11 It may be a PI film, of course, it may also be composed of other flexible materials, so that the terahertz metamaterial of the present invention can be attached to any curved surface, thereby applying the terahertz metamaterial of the present invention.
  • the components are more extensive, not limited by the shape of the components, and are more universal in application;
  • the terahertz metamaterial according to an embodiment of the present invention further provides two flexible substrates having different toughness, wherein, in one embodiment, the dielectric constant of the flexible substrate has a value
  • the range of the loss tangent of the flexible substrate is 0. 0048, . 0072, and the thickness of the flexible substrate ranges from 60 ⁇ ⁇ ⁇ 90 ⁇ ⁇ , wherein, in a preferred implementation 006,
  • the flexible substrate has a thickness d of 75 ⁇ ; as shown in FIG. 1 and FIG. 2, the dielectric substrate has a dielectric constant of 3.5 ⁇ m ;
  • the flexible substrate has a dielectric constant in the range of 3.44 ⁇ 5. 16 , and the loss tangent of the flexible substrate ranges from 0. 0032, 0048, flexible 004, ⁇ From the figure, the dielectric substrate has a dielectric constant of 4. 3, the loss tangent of the flexible substrate is 0. 004, from the figure, the thickness of the substrate is 0. 004, from the figure 1, 2 can be seen that the thickness of the flexible substrate is d 40 ⁇ .
  • the terahertz metamaterial of the present invention can have different toughness according to the different requirements of the manufactured electromagnetic device, so that the application environment of the terahertz metamaterial of the present invention is more extensive.
  • the factor affecting the electromagnetic modulation function may be the size of the electromagnetic loss resonant ring structure 12 (for example)
  • the opening condition of the resonant ring, the specific shape and the like, etc. may also be the square resistance of the electromagnetic loss resonant ring structure 12, or may be a periodic arrangement of the plurality of electromagnetic loss resonant ring structures 12 on the substrate 11 (ie, different periods)
  • Arrangement method may also be any combination of the above three factors, that is, the terahertz metamaterial according to the present invention can adjust the resonant ring structure and the square resistance of the non-metallic electromagnetic loss film constituting the resonant ring structure.
  • the arrangement of the resonant ring structure on the flexible substrate to adjust the frequency and amplitude of the electromagnetic loss in the terahertz band to achieve electromagnetic adjustment.
  • a super-material tuned to electromagnetic characteristics is realized by disposing a resonant ring structure of different sizes on an electromagnetic loss material, so that the electromagnetic loss based on the present invention is achieved.
  • the terahertz metamaterial that consumes the resonant ring structure has the advantages of light weight, low cost, and easy processing, and has the advantage of loss adjustment compared with the design of the terahertz metamaterial formed by the electromagnetic loss material without any structural design, and It has the controllability of electromagnetic modulation to the terahertz frequency band, and has more practical application value.

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Abstract

本发明公开了一种太赫兹超材料,该太赫兹超材料包括基底;设置在基底上的电磁损耗谐振环结构,其中,通过调整电磁损耗谐振环结构的不同结构尺寸和方阻实现太赫兹波段电磁调制功能。本发明通过在基底上设置电磁损耗谐振环结构,并通过调整电磁损耗谐振环结构的不同结构尺寸和方阻来实现太赫兹波段电磁调制功能,从而达到简化太赫兹器件的加工步骤,降低加工成本的效果,使得太赫兹技术能够在电磁通信领域得到广泛应用的效果。

Description

发明名称: 太赫兹超材料
技术领域
[0001] 本发明涉及电磁通信领域, 具体来说, 涉及一种太赫兹超材料。
背景技术
[0002] 太赫兹波段 (Terahertz , THz ) , 是指频率位于 0. ITHz-lOTHz范围内的电磁波 , 其波长覆盖 3mm-30 w m, 也被成为 THz辐射、 亚毫米波或者 T射线。 太赫兹在电 磁波谱中处于毫米波和红外之间, 相对于毫米波和红外这两个波段而言, 太赫 兹在电磁通信领域的应用并不广泛。
技术问题
[0003] 对于太赫兹的应用受限的原因来说, 主要在于其受到太赫兹发生源、 探测器以 及功能器件的制约, 因此尚未得到大规模应用; 此外, 由于太赫兹波长非常短 , 这则会导致其器件尺寸相对微波器件而言要小很多, 也就是说, 其尺寸可能 是微波器件的百分之几的量级, 因此, 太赫兹器件的加工会变得非常困难, 而 且成本高昂。
[0004] 所以, 在现有技术中, 大部分太赫兹器件都是采用光刻方法得到的, 但是这样 会造成样件尺寸小, 成品率不高的问题, 而这显然会极大的制约对太赫兹技术 的深入研究和广泛应用。
[0005] 针对相关技术中太赫兹器件所存在的加工困难, 价格昂贵, 不利于太赫兹技术 在电磁通信领域的应用的问题, 目前尚未提出有效的解决方案。
问题的解决方案
技术解决方案
[0006] 针对相关技术中的上述问题, 本发明提出一种太赫兹超材料, 能够简化太赫兹 器件的加工步骤, 降低加工成本, 能够电磁通信领域得到广泛应用。
[0007] 本发明的技术方案是这样实现的:
[0008] 根据本发明的一个方面, 提供了一种太赫兹超材料。
[0009] 该太赫兹超材料包括: [0010] 基底;
[0011] 设置在基底上的电磁损耗谐振环结构, 其中, 通过调整电磁损耗谐振环结构的 不同结构尺寸和方阻实现太赫兹波段电磁调制功能。
[0012] 其中, 该基底包括柔性基底。
[0013] 此外, 该太赫兹超材料进一步包括:
[0014] 覆盖在基底上的电磁损耗薄膜。
[0015] 其中, 在电磁损耗薄膜上加工有不同尺寸的上述电磁损耗谐振环结构。
[0016] 可选的, 电磁损耗谐振环结构为具有开口的谐振环结构。
[0017] 其中, 具有开口的谐振环结构呈 U字形、 V字形、 C字形、 倒 h形、 L字形、 或者 y 字形。
[0018] 可选的, 电磁损耗谐振环结构为具有闭合的谐振环结构。
[0019] 其中, 具有闭合的谐振环结构呈椭圆形、 闭合多边形、 D字形、 或者 P字形。
[0020] 优选的, 电磁损耗谐振环结构的方阻为 200欧姆每方。
[0021] 此外, 电磁损耗薄膜所包含的材料选自纳米碳粉、 或者树脂、 或者二者的结合
[0022] 另外, 可选的, 设置在基底上的电磁损耗谐振环结构包括多个, 且多个电磁损 耗谐振环结构在基底上以周期性阵列的方式进行排布。
[0023] 其中, 基底划分有多个单元格, 每个单元格上放置一个电磁损耗谐振环结构。
[0024] 优选的, 单元格呈方形, 且单元格的长度和宽度的尺寸范围均为 320 μ πΓ480 μ
Πΐ ο
[0025] 优选的, 柔性基底包括聚酰亚胺薄膜 (ΡΙ ) 膜。
[0026] 优选的, 柔性基底为低介电常数的基底。
[0027] 可选的, 基底的介电常数的取值范围为 2. 8〜4. 2, 基底的损耗角正切的取值范 围为 0. 0048、. 0072, 基底的厚度的取值范围为 60 μ πΓ90 μ m。
[0028] 可选的, 基底的介电常数的取值范围为 3. 44〜5. 16, 基底的损耗角正切的取值 范围为 0. 0032、. 0048, 基底的厚度的取值范围为 32 μ πΓ48 μ m。
[0029] 其中, 太赫兹超材料的对太赫兹波段的电磁调制功能的影响因素包括以下至少 之一: [0030] 电磁损耗谐振环结构的尺寸;
[0031] 电磁损耗谐振环结构的方阻;
[0032] 多个电磁损耗谐振环结构在基底上的周期排布方式。
[0033] 优选的, 电磁损耗谐振环结构包括相互平行且对称的两条侧边以及连接两条侧 边的底边。
[0034] 优选的, 侧边的长度的取值范围为 180 μ πΓ220 μ πι, 侧边的宽度的取值范围为 4 0 μ πΓ60 μ m, 两条侧边相距的取值范围为 180 μ πΓ220 μ m, 底边的长的取值范围 为 240 μ π 360 μ ΐϋ。
发明的有益效果
有益效果
[0035] 本发明通过在基底上设置电磁损耗谐振环结构, 并通过调整电磁损耗谐振环结 构的不同结构尺寸和方阻来实现太赫兹波段电磁调制功能, 从而达到简化太赫 兹器件的加工步骤, 降低加工成本的效果, 使得太赫兹技术能够在电磁通信领 域得到广泛应用的效果。
对附图的简要说明
附图说明
[0036] 为了更清楚地说明本发明实施例或现有技术中的技术方案, 下面将对实施例中 所需要使用的附图作简单地介绍, 显而易见地, 下面描述中的附图仅仅是本发 明的一些实施例, 对于本领域普通技术人员来讲, 在不付出创造性劳动的前提 下, 还可以根据这些附图获得其他的附图。
[0037] 图 1是根据本发明实施例的太赫兹超材料的侧面图;
[0038] 图 2是根据图 1所示的太赫兹超材料的俯视图。
发明实施例
本发明的实施方式
[0039] 下面将结合本发明实施例中的附图, 对本发明实施例中的技术方案进行清楚、 完整地描述, 显然, 所描述的实施例仅仅是本发明一部分实施例, 而不是全部 的实施例。 基于本发明中的实施例, 本领域普通技术人员所获得的所有其他实 施例, 都属于本发明保护的范围。
[0040] 根据本发明的实施例, 提供了一种太赫兹超材料。
[0041] 如图 1所示, 根据本发明实施例的太赫兹超材料包括:
[0042] 基底 11, 和设置在基底 11上表面的电磁损耗谐振环结构 12, 其中, 从与图 1对 应的太赫兹超材料的俯视图图 2可以看出, 电磁损耗谐振环结构 12的结构为环状 结构, 其中, 可以通过调整电磁损耗谐振环结构 12的不同结构尺寸和方阻来实 现太赫兹波段电磁调制功能。
[0043] 对于上述实施例中的电磁损耗谐振环结构 12来说, 在该太赫兹超材料的制作过 程中, 首先需要在基底 11上覆盖一层电磁损耗薄膜, 而该电磁损耗谐振环结构 1 2正是基于该电磁损耗薄膜加工制作而成, 而在不同的实施例中, 可以在电磁损 耗薄膜上加工不同尺寸的电磁损耗谐振环结构 12, 使得基底上设置有多个不同 尺寸的电磁损耗谐振环结构。
[0044] 其中, 从图 1、 图 2所示的实施例中可以看出, 根据本发明实施例的电磁损耗谐 振环结构可以为具有开口的谐振环结构 (图 1、 图 2示意的为单开口的规则谐振 环) , 但是根据电磁调制的不同需求, 也可以将电磁损耗谐振环结构 12构造成 闭合谐振环或者多开口的谐振环, 从而调节太赫兹波段 (0. 1ΤΗζ〜10ΤΗζ ) 的电 磁损耗的频率和幅度。
[0045] 例如在不同的实施例中, 在该电磁损耗谐振环结构为具有开口的谐振环结构时 , 该具有开口的谐振环结构可以呈 U字形、 V字形、 C字形、 倒 h形、 L字形、 或者 y字形等。
[0046] 而在该电磁损耗谐振环结构为具有闭口的谐振环结构时, 该具有闭合的谐振环 结构可以呈椭圆形、 闭合多边形、 D字形、 或者 P字形等。
[0047] 优选的, 从图 2可以看出, 在本实施例中, 该谐振环结构为 U形规则单开口谐振 环 (即单开口方形谐振环) , 其中, 从图 1可以看出, 该单开口方形谐振环包括 相互平行且对称的两条侧边以及连接两条侧边的底边, 其中, 对于两侧边和底 边的尺寸来说, 这里的侧边的长度的取值范围为 180 μ πΓ220 μ πι, 侧边的宽度的 取值范围为 40 μ πΓ60 μ m、 两条侧边相距的取值范围为 180 μ πΓ220 μ m, 底边的 长度的取值范围为 240 μ πΓ360 μ πι, 其中, 在一个优选的实施例中, 侧边长度和 宽度分别为 200 μ ΐΉ、 50 μ ΐΉ, 两条侧边相距为 200 μ ΐΉ, 该底边长度为 300 μ ΐΉ。
[0048] 相应的, 从图 2还可以看出, 电磁损耗谐振环结构 12的厚度 h=18 y m。
[0049] 其中, 图 2所示的电磁损耗谐振环结构的方阻则为 200欧姆每方。
[0050] 当然, 这里只是示意性的举例而已, 也就是说, 本发明对于谐振环结构的具体 形状并不作限定, 只要使该电磁损耗谐振环结构满足是环形结构, 从而可以根 据对太赫兹频段的不同调节要求, 设置不同类型的环结构在即可。
[0051] 此外, 在一个实施例中, 对于加工成上述电磁损耗谐振环结构的电磁损耗薄膜 的组成材料而言, 所包含的材料选自纳米碳粉、 或者树脂、 或者二者的结合, 也就是说, 该电磁损耗薄膜可以是由纳米级碳粉构成, 也可以是由树脂材料构 成, 还可以是由纳米级碳粉和树脂材料掺杂在一起的混合物材料, 当然, 该电 磁损耗薄膜的组成材料还可以是其他的一些具备电磁损耗功能的非金属材料, 从而可以根据不同的太赫兹波段的调制需要, 掺杂不同的非金属材料。
[0052] 其中, 在上述实施例中是以一基底上设置一个电磁损耗谐振环结构为例的, 而 实质上, 在不同的实施例中, 可以在电磁损耗薄膜上加工不同尺寸的电磁损耗 谐振环结构 12, 使得基底上设置有多个不同尺寸的电磁损耗谐振环结构。
[0053] 优选的, 为了实现对太赫兹波段的电磁调制, 根据本发明实施例的电磁损耗谐 振环结构 12在柔性基底 11上是以周期性阵列的方式排布的, 即根据本发明实施 例的太赫兹超材料可以包括多个以周期性阵列的方式排布的图 2所示的超材料单 元结构。
[0054] 其中, 在一个实施例中, 在电磁损耗谐振环结构为多个的情况下, 基底可划分 有多个单元格, 并每个单元格上放置一个电磁损耗谐振环结构, 并且每个单元 格上放置的电磁损耗谐振环结构的形状可以相同或不同。
[0055] 另外, 从图 1、 2可以看出, 由于在本实施例中的谐振环结构为方谐振环, 相应 的, 柔性基底 11的尺寸则被设计成了正方形结构, 柔性基底 11的长度和宽度的 尺寸范围均为 320 μ πΓ480 μ πι, 在本实施例中, 柔性基底 11的优选长度 Lx=400 y m, 优选宽度 Ly=400 w m, 并且, 其上表面的尺寸可以容纳谐振环结构, 使得谐 振环结构与柔性基底的边缘存在间隔的空间。
[0056] 另外, 在一个实施例中, 为了使本发明的太赫兹超材料实现对太赫兹波段的电 磁调制, 根据本发明是实施例的基底 11可以是柔性基底, 且为低介电常数的基 底 (介电常数小于 4. 5且大于 3. 8 ) ; 而对于该柔性基底 11的组成成分来说, 其 可以是 PI膜, 当然, 其也可以是由其他的柔性材料构成, 这样就可使本发明的 太赫兹超材料能够附着在任何曲面上, 从而使得应用本发明的太赫兹超材料的 元件更加广泛, 不受元件形状的限制, 更具应用的普遍性;
[0057] 此外, 在一个实施例中, 根据本发明实施例的太赫兹超材料还提供了两种韧性 不同的柔性基底, 其中, 在一个实施例中, 该柔性基底的介电常数的取值范围 为2. 8〜4. 2, 柔性基底的损耗角正切的取值范围为 0. 0048、. 0072, 柔性基底的 厚度的取值范围为 60 μ πΓ90 μ πι , 其中, 在一个优选的实施例中, 该柔性基底 的介电常数为 3. 5, 柔性基底的损耗角正切为 0. 006, 从图 1、 2可以看出, 该柔 性基底的厚度 d为 75 μ πι;
[0058] 而在另一个实施例中, 柔性基底的介电常数还可以在 3. 44〜5. 16范围内, 且柔 性基底的损耗角正切的取值范围为 0. 0032、. 0048, 柔性基底的厚度的取值范围 为 32 μ πΓ48 μ πι, 其中, 在一个优选的实施例中, 该柔性基底的介电常数则为 4. 3, 柔性基底的损耗角正切为 0. 004, 从图 1、 2可以看出, 柔性基底的厚度为 d为 40 μ πι。
[0059] 这样就可根据制造的电磁器件的不同需求, 使本发明的太赫兹超材料具备不同 的韧性, 使得本发明的太赫兹超材料的应用环境更加广泛。
[0060] 另外, 对于本发明的太赫兹超材料在太赫兹波段 (0. ΙΤΗζ 〜10- THz ) 进行电磁 调制时, 影响其电磁调制功能的因素可以是电磁损耗谐振环结构 12的尺寸 (例 如谐振环的开口情况、 具体形状尺寸等) , 也可以是电磁损耗谐振环结构 12的 方阻, 还可以是多个电磁损耗谐振环结构 12在基底 11上的周期排布方式 (即不 同的周期排布方式) , 当然还可以是上述三种因素的任意组合, 也就是说, 根 据本发明的太赫兹超材料可以通过调整谐振环结构、 构成该谐振环结构的非金 属电磁损耗薄膜的方阻, 以及谐振环结构在柔性基底上的排布方式来调节太赫 兹波段的电磁损耗的频率和幅度, 从而实现电磁调整。
[0061] 综上所述, 借助于本发明的上述技术方案, 通过在电磁损耗材料上设置不同尺 寸的谐振环结构, 从而实现调谐电磁特性的超材料, 使得本发明的基于电磁损 耗谐振环结构的太赫兹超材料具有重量轻、 价格低廉、 易于加工的优势, 相比 于无任何结构设计的电磁损耗材料所形成的太赫兹超材料的设计, 具备损耗可 调节的优势, 并具备对太赫兹频段的电磁调制的可控性, 更加具有实际应用价 值。
以上所述仅为本发明的较佳实施例而已, 并不用以限制本发明, 凡在本发明的 精神和原则之内, 所作的任何修改、 等同替换、 改进等, 均应包含在本发明的 保护范围之内。

Claims

权利要求书
一种太赫兹超材料, 其特征在于, 包括:
基底;
设置在所述基底上的电磁损耗谐振环结构, 其中, 通过调整所述电磁 损耗谐振环结构的不同结构尺寸和方阻实现太赫兹波段电磁调制功能 根据权利要求 1所述的太赫兹超材料, 其特征在于, 所述基底包括柔 性基底。
根据权利要求 1所述的太赫兹超材料, 其特征在于, 所述太赫兹超材 料进一步包括- 覆盖在所述基底上的电磁损耗薄膜。
根据权利要求 3所述的太赫兹超材料, 其特征在于, 在所述电磁损耗 薄膜上加工有不同尺寸的所述电磁损耗谐振环结构。
根据权利要求 1所述的太赫兹超材料, 其特征在于, 所述电磁损耗谐 振环结构为具有开口的谐振环结构。
根据权利要求 5所述的太赫兹超材料, 其特征在于, 所述具有开口的 谐振环结构呈 U字形、 V字形、 C字形、 倒 h形、 L字形、 或者 y字形。 根据权利要求 1所述的太赫兹超材料, 其特征在于, 所述电磁损耗谐 振环结构为具有闭合的谐振环结构。
根据权利要求 7所述的太赫兹超材料, 其特征在于, 所述具有闭合的 谐振环结构呈椭圆形、 闭合多边形、 D字形、 或者 P字形。
根据权利要求 1所述的太赫兹超材料, 其特征在于, 所述电磁损耗谐 振环结构的方阻为 200欧姆每方。
根据权利要求 3所述的太赫兹超材料, 其特征在于, 所述电磁损耗薄 膜所包含的材料选自纳米碳粉、 或者树脂、 或者二者的结合。
根据权利要求 1所述的太赫兹超材料, 其特征在于, 设置在所述基底 上的电磁损耗谐振环结构包括多个, 且多个所述电磁损耗谐振环结构 在所述基底上以周期性阵列的方式进行排布。 [权利要求 12] 根据权利要求 11所述的太赫兹超材料, 其特征在于, 所述基底划分有 多个单元格, 每个单元格上放置一个所述电磁损耗谐振环结构。
[权利要求 13] 根据权利要求 12所述的太赫兹超材料, 其特征在于, 所述单元格呈方 形, 且所述单元格的长度和宽度的尺寸范围均为 320 μ πΓ480 μ πι。
[权利要求 14] 根据权利要求 2所述的太赫兹超材料, 其特征在于, 所述柔性基底包 括聚酰亚胺薄膜 ΡΙ膜。
[权利要求 15] 根据权利要求 2所述的太赫兹超材料, 其特征在于, 所述柔性基底为 低介电常数的基底。
[权利要求 16] 根据权利要求 1所述的太赫兹超材料, 其特征在于, 所述基底的介电 常数的取值范围为 2. 8〜4. 2, 所述基底的损耗角正切的取值范围为 0. 0 048〜0. 0072, 所述基底的厚度的取值范围为 60 μ πΓ90 μ m。
[权利要求 17] 根据权利要求 1所述的太赫兹超材料, 其特征在于, 所述基底的介电 常数的取值范围为 3. 4 5. 16, 所述基底的损耗角正切的取值范围为 0 . 0032、. 0048, 所述基底的厚度的取值范围为 32 μ πΓ48 μ m。
[权利要求 18] 根据权利要求 11所述的太赫兹超材料, 其特征在于, 所述太赫兹超材 料的对太赫兹波段的电磁调制功能的影响因素包括以下至少之一: 所述电磁损耗谐振环结构的尺寸;
所述电磁损耗谐振环结构的方阻;
多个所述电磁损耗谐振环结构在所述基底上的周期排布方式。
[权利要求 19] 根据权利要求 1所述的太赫兹超材料, 其特征在于, 所述电磁损耗谐 振环结构包括相互平行且对称的两条侧边以及连接所述两条侧边的底 边。
[权利要求 20] 根据权利要求 1所述的太赫兹超材料, 其特征在于, 所述侧边的长度 的取值范围为 180 μ πΓ220 μ m, 所述侧边的宽度的取值范围为 40 μ πΓ6 0 μ m, 所述两条侧边相距为 180 μ πΓ220 μ m, 所述底边的长的取值范 围为 240 μ π 360 μ ΐϋ。
PCT/CN2016/095805 2015-08-20 2016-08-18 太赫兹超材料 WO2017028794A1 (zh)

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