WO2017018297A1 - Resin composition for connector, and connector - Google Patents
Resin composition for connector, and connector Download PDFInfo
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- WO2017018297A1 WO2017018297A1 PCT/JP2016/071294 JP2016071294W WO2017018297A1 WO 2017018297 A1 WO2017018297 A1 WO 2017018297A1 JP 2016071294 W JP2016071294 W JP 2016071294W WO 2017018297 A1 WO2017018297 A1 WO 2017018297A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
Definitions
- the present invention relates to a resin composition for connectors and a connector.
- Automotive connectors used for power supply lines that supply high-voltage power may be placed in unsealed spaces.
- PBT polybutylene terephthalate
- a resin modifier to PBT and improving tracking resistance is examined (for example, patent document 1).
- the present invention has been made in view of such background, and intends to provide a connector resin composition having excellent tracking resistance and a connector using the resin composition.
- One embodiment of the present invention relates to 100 parts by mass of polybutylene terephthalate.
- a resin composition for connectors comprising 3 to 23 parts by mass of an ethylene-alkyl acrylate-glycidyl methacrylate copolymer.
- Another aspect of the present invention lies in a connector having a resin component made of the connector resin composition of the above aspect.
- the connector resin composition is composed by mixing PBT and an ethylene-alkyl acrylate-glycidyl methacrylate copolymer at the specific composition ratio. Thereby, the thermal decomposition temperature of the said resin composition can be improved, and tracking resistance can be improved compared with the former.
- the connector since the connector has a resin part made of the resin composition, the occurrence of the tracking phenomenon can be suppressed more easily than in the past. As a result, the connector can be easily reduced in size and thickness.
- the resin composition it is preferable to use a resin having a high CTI (Comparison Tracking Index) as the PBT.
- the CTI of the resulting resin composition can be further increased due to the effect of improving the tracking resistance by the copolymer.
- the occurrence of the tracking phenomenon in the connector can be more easily suppressed.
- a PBT having a CTI of 500 V or higher it is preferable to use a PBT having a CTI of 500 V or higher.
- the resin composition contains an ethylene-alkyl acrylate-glycidyl methacrylate copolymer.
- the thermal decomposition temperature of the resin composition can be improved. The reason for this is not fully understood at the present time.
- the above-mentioned copolymer acts on the resin composition as follows for improving the thermal decomposition temperature.
- the specific copolymer reacts with the functional group at the end of the polymer when mixed with PBT using an extruder or the like. Therefore, the amount of unstable functional groups in the resin composition is less than that in the case where the copolymer is not included, and the thermal decomposition of PBT can be suppressed. Thereby, it is thought that the said copolymer can improve the thermal decomposition temperature of a resin composition. Moreover, it is thought that by suppressing the thermal decomposition of PBT, carbides are less likely to be generated on the surface of the resin component, and the tracking resistance can be improved.
- the content of the copolymer is 3 to 23 parts by mass with respect to 100 parts by mass of PBT. Thereby, the thermal decomposition temperature of a resin composition can be improved and by extension, tracking resistance can be improved.
- the content of the copolymer is less than 3 parts by mass, the effect of improving tracking resistance cannot be sufficiently obtained.
- the content of the copolymer exceeds 23 parts by mass, the tracking resistance decreases.
- the content of the copolymer is 3 to 23 parts by mass. From the viewpoint of further improving the effect of improving tracking resistance, the content of the copolymer is preferably 5 to 20 parts by mass, and more preferably 10 to 20 parts by mass.
- the copolymer preferably includes a structural unit derived from butyl acrylate as the alkyl acrylate. In this case, the effect of improving tracking resistance can be further enhanced.
- the resin composition may contain 10 to 20 parts by mass of glass fiber in addition to PBT and the specific copolymer. In this case, since the strength of the resin composition can be improved, the resin component can be more easily downsized and thinned while securing sufficient strength.
- the resin composition may contain additives generally used for resin materials, such as antioxidants and colorants, as long as the tracking resistance is not impaired.
- the resin composition preferably has a CTI (Comparison Tracking Index) of 600 V or higher.
- CTI Comparison Tracking Index
- the connector has a resin component composed of the resin composition.
- the resin component include a housing that holds a terminal and a retainer that engages with a mating connector. From the viewpoint of suppressing the tracking phenomenon, it is preferable that the housing disposed at a position close to the terminal is made of the resin composition.
- test material C1 is a resin made of only the PBT.
- test material C2 is a resin composition obtained by mixing 100 parts by mass of the PBT and 25 parts by mass of the copolymer.
- the thermal decomposition temperature of each test material was measured and the tracking resistance was evaluated by the following method.
- thermogravimetric measurement of each test material was performed to obtain a TG curve. Based on this TG curve, a temperature range in which the slope of the TG curve is constant was determined, and the starting temperature of the range was defined as the thermal decomposition temperature. The rate of temperature increase in thermogravimetry was 20 ° C./min. Table 1 shows the thermal decomposition temperature of each test material.
- the test materials E1 to E4 in which PBT and the above copolymer are mixed with the above specific composition have a thermal decomposition temperature and a CTI as compared with the test material C1 not containing the copolymer. Increased and improved tracking resistance. Since each of the test materials E1 to E4 has a tracking resistance of 600 V or more, the occurrence of the tracking phenomenon can be easily suppressed even when the connector is downsized.
- test materials E2 to E4 in which the content of the copolymer is in the range of 10 to 20 parts by mass exhibited CTI of more than 700 V and excellent tracking resistance. Therefore, the test materials E2 to E4 can more easily suppress the occurrence of the tracking phenomenon.
- test material C2 in which the content of the copolymer exceeded 23 parts by mass had a CTI lower than that of the test material C1 not containing the copolymer, and rather the tracking resistance was lowered.
Abstract
The present invention provides a resin composition for a connector, which exhibits excellent tracking resistance; and a connector obtained using the resin composition. This resin composition for a connector is obtained by blending 3-23 parts by mass of an ethylene-alkyl acrylate-glycidyl methacrylate copolymer relative to 100 parts by mass of poly(butylene terephthalate). The alkyl acrylate contained in the copolymer is preferably butyl acrylate. The resin composition for a connector may contain 10-20 parts by mass of glass fibers.
Description
本発明は、コネクタ用樹脂組成物及びコネクタに関する。
The present invention relates to a resin composition for connectors and a connector.
高電圧の電力を供給する電力供給線等に用いられる自動車用コネクタは、密閉されていない空間に配置されることがある。この場合、コネクタにおけるトラッキング現象の発生を抑制するため、コネクタのハウジング等に耐トラッキング性の高い樹脂を用いる必要がある。
Automotive connectors used for power supply lines that supply high-voltage power may be placed in unsealed spaces. In this case, in order to suppress the occurrence of the tracking phenomenon in the connector, it is necessary to use a resin having high tracking resistance for the housing of the connector.
従来、自動車用コネクタには、耐熱性、機械的強度、電気絶縁性及び成形性に優れたＰＢＴ（ポリブチレンテレフタレート）が多用されている。しかし、ＰＢＴは、高電圧が印加された際に、表面に炭化物質が生成されやすいため、耐トラッキング性が要求される水準に到達しないことがあった。そのため、ＰＢＴに樹脂改質剤を添加して耐トラッキング性を向上させることが検討されている（例えば、特許文献１）。
Conventionally, PBT (polybutylene terephthalate), which is excellent in heat resistance, mechanical strength, electrical insulation, and moldability, has been frequently used for automobile connectors. However, in PBT, when a high voltage is applied, a carbonized material is easily generated on the surface, so that the level at which tracking resistance is required may not be reached. Therefore, adding a resin modifier to PBT and improving tracking resistance is examined (for example, patent document 1).
近年、自動車用部品の一層の小型化、軽量化が求められており、コネクタを従来よりも小型化、薄肉化することが求められている。しかし、コネクタを小型化すると、ハウジング等の表面において十分に長い絶縁距離を確保することが難しくなり、トラッキング現象が従来よりも発生しやすくなる。一方、従来の樹脂改質剤は、ＰＢＴに添加した際の耐トラッキング性向上の効果が不十分であり、従来よりも小型化されたコネクタにおけるトラッキング現象の抑制が困難である。
In recent years, there has been a demand for further miniaturization and weight reduction of automobile parts, and it has been demanded that connectors be smaller and thinner than before. However, when the connector is downsized, it becomes difficult to ensure a sufficiently long insulation distance on the surface of the housing or the like, and the tracking phenomenon is more likely to occur than in the past. On the other hand, conventional resin modifiers are insufficient in the effect of improving tracking resistance when added to PBT, and it is difficult to suppress the tracking phenomenon in a connector that is smaller than the conventional one.
本発明は、かかる背景に鑑みてなされたものであり、優れた耐トラッキング性を有するコネクタ用樹脂組成物及び当該樹脂組成物を用いたコネクタを提供しようとするものである。
The present invention has been made in view of such background, and intends to provide a connector resin composition having excellent tracking resistance and a connector using the resin composition.
本発明の一態様は、ポリブチレンテレフタレート１００質量部に対して、
エチレン－アルキルアクリレート－グリシジルメタクリレート共重合体３～２３質量部を混合してなる、コネクタ用樹脂組成物にある。 One embodiment of the present invention relates to 100 parts by mass of polybutylene terephthalate.
A resin composition for connectors comprising 3 to 23 parts by mass of an ethylene-alkyl acrylate-glycidyl methacrylate copolymer.
エチレン－アルキルアクリレート－グリシジルメタクリレート共重合体３～２３質量部を混合してなる、コネクタ用樹脂組成物にある。 One embodiment of the present invention relates to 100 parts by mass of polybutylene terephthalate.
A resin composition for connectors comprising 3 to 23 parts by mass of an ethylene-alkyl acrylate-glycidyl methacrylate copolymer.
本発明の他の態様は、上記の態様のコネクタ用樹脂組成物からなる樹脂部品を有する、コネクタにある。
Another aspect of the present invention lies in a connector having a resin component made of the connector resin composition of the above aspect.
上記コネクタ用樹脂組成物は、ＰＢＴと、エチレン－アルキルアクリレート－グリシジルメタクリレート共重合体とを上記特定の組成比で混合することにより構成されている。これにより、上記樹脂組成物の熱分解温度を向上させることができ、ひいては耐トラッキング性を従来よりも向上させることができる。
The connector resin composition is composed by mixing PBT and an ethylene-alkyl acrylate-glycidyl methacrylate copolymer at the specific composition ratio. Thereby, the thermal decomposition temperature of the said resin composition can be improved, and tracking resistance can be improved compared with the former.
また、上記コネクタは、上記樹脂組成物からなる樹脂部品を有しているため、従来よりも容易にトラッキング現象の発生を抑制することができる。その結果、上記コネクタは、小型化、薄肉化を容易に行うことができる。
In addition, since the connector has a resin part made of the resin composition, the occurrence of the tracking phenomenon can be suppressed more easily than in the past. As a result, the connector can be easily reduced in size and thickness.
上記樹脂組成物において、ＰＢＴとしては、ＣＴＩ（比較トラッキング指数）が高い樹脂を用いることが好ましい。この場合には、上記共重合体による耐トラッキング性向上の効果により、得られる樹脂組成物のＣＴＩをより高くすることができる。その結果、コネクタにおけるトラッキング現象の発生をより容易に抑制することができる。具体的には、５００Ｖ以上のＣＴＩを有するＰＢＴを用いることが好ましい。
In the resin composition, it is preferable to use a resin having a high CTI (Comparison Tracking Index) as the PBT. In this case, the CTI of the resulting resin composition can be further increased due to the effect of improving the tracking resistance by the copolymer. As a result, the occurrence of the tracking phenomenon in the connector can be more easily suppressed. Specifically, it is preferable to use a PBT having a CTI of 500 V or higher.
上記樹脂組成物は、エチレン－アルキルアクリレート－グリシジルメタクリレート共重合体を含有している。上記特定の共重合体を用いることにより、樹脂組成物の熱分解温度を向上させることができる。この理由は現時点では完全には解明されていないが、例えば、上記共重合体が以下のように樹脂組成物に作用することが熱分解温度向上の理由として考えられる。
The resin composition contains an ethylene-alkyl acrylate-glycidyl methacrylate copolymer. By using the specific copolymer, the thermal decomposition temperature of the resin composition can be improved. The reason for this is not fully understood at the present time. For example, it is considered that the above-mentioned copolymer acts on the resin composition as follows for improving the thermal decomposition temperature.
ＰＢＴは、ポリマー末端に不安定な官能基を有しているため、高温に曝された際に末端部分等が熱分解して炭化しやすい。そのため、ＰＢＴよりなる樹脂部品は、高電圧を印加された際に、表面にポリマーの炭化物等が生じやすい。それ故、コネクタが長期間に亘って使用されると、ポリマーの炭化物が導電路を形成し、トラッキング現象が発生する。
Since PBT has an unstable functional group at the polymer terminal, the terminal part and the like are easily pyrolyzed and carbonized when exposed to high temperatures. For this reason, resin parts made of PBT are liable to produce polymer carbide or the like on the surface when a high voltage is applied. Therefore, when the connector is used for a long period of time, the polymer carbide forms a conductive path and a tracking phenomenon occurs.
これに対し、上記特定の共重合体は、押出機等を用いてＰＢＴと混合する際に、ポリマー末端の官能基と反応すると考えられる。そのため、上記樹脂組成物は、上記共重合体を含まない場合に比べて不安定な官能基の量が少なくなり、ＰＢＴの熱分解を抑制することができる。これにより、上記共重合体は樹脂組成物の熱分解温度を向上させることができると考えられる。また、ＰＢＴの熱分解が抑制されることにより、樹脂部品の表面に炭化物が生じにくくなり、耐トラッキング性を向上させることができると考えられる。
On the other hand, it is considered that the specific copolymer reacts with the functional group at the end of the polymer when mixed with PBT using an extruder or the like. Therefore, the amount of unstable functional groups in the resin composition is less than that in the case where the copolymer is not included, and the thermal decomposition of PBT can be suppressed. Thereby, it is thought that the said copolymer can improve the thermal decomposition temperature of a resin composition. Moreover, it is thought that by suppressing the thermal decomposition of PBT, carbides are less likely to be generated on the surface of the resin component, and the tracking resistance can be improved.
上記共重合体の含有量は、１００質量部のＰＢＴに対して３～２３質量部である。これにより、樹脂組成物の熱分解温度を向上させ、ひいては耐トラッキング性を向上させることができる。共重合体の含有量が３質量部未満の場合には、耐トラッキング性向上の効果を十分に得ることができない。一方、共重合体の含有量が２３質量部を超えるとかえって耐トラッキング性が低下する。
The content of the copolymer is 3 to 23 parts by mass with respect to 100 parts by mass of PBT. Thereby, the thermal decomposition temperature of a resin composition can be improved and by extension, tracking resistance can be improved. When the content of the copolymer is less than 3 parts by mass, the effect of improving tracking resistance cannot be sufficiently obtained. On the other hand, when the content of the copolymer exceeds 23 parts by mass, the tracking resistance decreases.
従って、上記共重合体の含有量は、３～２３質量部とする。耐トラッキング性向上の効果をより高める観点からは、上記共重合体の含有量を、５～２０質量部とすることが好ましく、１０～２０質量部とすることがより好ましい。
Therefore, the content of the copolymer is 3 to 23 parts by mass. From the viewpoint of further improving the effect of improving tracking resistance, the content of the copolymer is preferably 5 to 20 parts by mass, and more preferably 10 to 20 parts by mass.
上記共重合体は、アルキルアクリレートとして、ブチルアクリレートに由来する構造単位を含んでいることが好ましい。この場合には、耐トラッキング性向上の効果をより高めることができる。
The copolymer preferably includes a structural unit derived from butyl acrylate as the alkyl acrylate. In this case, the effect of improving tracking resistance can be further enhanced.
上記樹脂組成物は、ＰＢＴ及び上記特定の共重合体以外に、１０～２０質量部のガラス繊維を含有していてもよい。この場合には、上記樹脂組成物の強度を向上させることができるため、十分な強度を確保しつつ、樹脂部品の小型化、薄肉化をより容易に行うことができる。
The resin composition may contain 10 to 20 parts by mass of glass fiber in addition to PBT and the specific copolymer. In this case, since the strength of the resin composition can be improved, the resin component can be more easily downsized and thinned while securing sufficient strength.
また、上記樹脂組成物は、耐トラッキング性を損なわない範囲で、酸化防止剤、着色剤等の一般的に樹脂材料に用いられる添加剤を含んでいても良い。
The resin composition may contain additives generally used for resin materials, such as antioxidants and colorants, as long as the tracking resistance is not impaired.
上記樹脂組成物は、６００Ｖ以上のＣＴＩ（比較トラッキング指数）を有することが好ましい。この場合には、小型のコネクタにおいても十分な耐トラッキング性を有する樹脂部品を得ることができ、トラッキング現象をより容易に抑制することができる。
The resin composition preferably has a CTI (Comparison Tracking Index) of 600 V or higher. In this case, a resin component having sufficient tracking resistance can be obtained even with a small connector, and the tracking phenomenon can be more easily suppressed.
上記コネクタは、上記樹脂組成物から構成された樹脂部品を有している。樹脂部品としては、例えば、端子を保持するハウジングや、相手方のコネクタに係合するリテーナ等がある。トラッキング現象を抑制する観点からは、端子に近い位置に配置されるハウジングが上記樹脂組成物から構成されていることが好ましい。
The connector has a resin component composed of the resin composition. Examples of the resin component include a housing that holds a terminal and a retainer that engages with a mating connector. From the viewpoint of suppressing the tracking phenomenon, it is preferable that the housing disposed at a position close to the terminal is made of the resin composition.
上記コネクタ用樹脂組成物の実施例について、以下に説明する。本例においては、ＰＢＴ（三菱化学株式会社製「ノバデュラン（登録商標）５０１０Ｒ３」）と、エチレン－ブチルアクリレート－グリシジルメタクリレート共重合体（デュポン社製「エルバロイ（登録商標）ＨＰ４０５１」）とを表１に示す割合で混合してなる樹脂組成物（試験材Ｅ１～Ｅ４）を作製した。なお、ＰＢＴと共重合体との混合は、熱可塑性樹脂の混合に通常用いられる押出機やロール混練機などを用いて行うことができる。
Examples of the above resin composition for connectors will be described below. In this example, PBT ("Novaduran (registered trademark) 5010R3" manufactured by Mitsubishi Chemical Corporation) and an ethylene-butyl acrylate-glycidyl methacrylate copolymer ("Elvalloy (registered trademark) HP4051" manufactured by DuPont) are listed in Table 1. Resin compositions (test materials E1 to E4) obtained by mixing at the ratios shown in FIG. In addition, mixing with PBT and a copolymer can be performed using the extruder, roll kneader, etc. which are normally used for mixing of a thermoplastic resin.
また、本例においては、試験材Ｅ１～Ｅ４との比較のため、表１に示す試験材Ｃ１及び試験材Ｃ２を作製した。試験材Ｃ１は、上記ＰＢＴのみからなる樹脂である。また、試験材Ｃ２は、１００質量部の上記ＰＢＴと２５質量部の上記共重合体とを混合してなる樹脂組成物である。
In this example, for comparison with the test materials E1 to E4, the test material C1 and the test material C2 shown in Table 1 were produced. The test material C1 is a resin made of only the PBT. The test material C2 is a resin composition obtained by mixing 100 parts by mass of the PBT and 25 parts by mass of the copolymer.
上記の試験材を準備した後、各試験材の熱分解温度の測定及び耐トラッキング性の評価を以下の方法により行った。
After preparing the above test materials, the thermal decomposition temperature of each test material was measured and the tracking resistance was evaluated by the following method.
＜熱分解温度の測定＞
各試験材の熱重量測定を行い、ＴＧ曲線を得た。このＴＧ曲線に基づいて、ＴＧ曲線の傾きが一定となる温度範囲を決定し、当該範囲の開始温度を熱分解温度とした。なお、熱重量測定における昇温速度は２０℃／ｍｉｎとした。表１に、各試験材の熱分解温度を示した。 <Measurement of thermal decomposition temperature>
A thermogravimetric measurement of each test material was performed to obtain a TG curve. Based on this TG curve, a temperature range in which the slope of the TG curve is constant was determined, and the starting temperature of the range was defined as the thermal decomposition temperature. The rate of temperature increase in thermogravimetry was 20 ° C./min. Table 1 shows the thermal decomposition temperature of each test material.
各試験材の熱重量測定を行い、ＴＧ曲線を得た。このＴＧ曲線に基づいて、ＴＧ曲線の傾きが一定となる温度範囲を決定し、当該範囲の開始温度を熱分解温度とした。なお、熱重量測定における昇温速度は２０℃／ｍｉｎとした。表１に、各試験材の熱分解温度を示した。 <Measurement of thermal decomposition temperature>
A thermogravimetric measurement of each test material was performed to obtain a TG curve. Based on this TG curve, a temperature range in which the slope of the TG curve is constant was determined, and the starting temperature of the range was defined as the thermal decomposition temperature. The rate of temperature increase in thermogravimetry was 20 ° C./min. Table 1 shows the thermal decomposition temperature of each test material.
＜耐トラッキング性の評価＞
ＪＩＳ Ｃ２１３４の規定に適応した試験装置を用い、各試験材のＣＴＩ（比較トラッキング指数）を測定した。表１に、各試験材のＣＴＩを示した。なお、本例において用いた試験装置は７００Ｖを超える電圧を電極間に印加することができない。そのため、ＣＴＩが７００Ｖを超える試験材、即ち７００Ｖを印加したときにトラッキング破壊及び持続炎の発生がない試験材については、正確なＣＴＩの値を測定することができない。このような試験材については、表１のＣＴＩの欄に「＞７００」と表記した。 <Evaluation of tracking resistance>
Using a test apparatus adapted to the provisions of JIS C2134, the CTI (Comparative Tracking Index) of each test material was measured. Table 1 shows the CTI of each test material. Note that the test apparatus used in this example cannot apply a voltage exceeding 700 V between the electrodes. Therefore, an accurate CTI value cannot be measured for a test material having a CTI of over 700 V, that is, a test material that does not generate tracking failure or continuous flame when 700 V is applied. Such a test material is indicated as “> 700” in the CTI column of Table 1.
ＪＩＳ Ｃ２１３４の規定に適応した試験装置を用い、各試験材のＣＴＩ（比較トラッキング指数）を測定した。表１に、各試験材のＣＴＩを示した。なお、本例において用いた試験装置は７００Ｖを超える電圧を電極間に印加することができない。そのため、ＣＴＩが７００Ｖを超える試験材、即ち７００Ｖを印加したときにトラッキング破壊及び持続炎の発生がない試験材については、正確なＣＴＩの値を測定することができない。このような試験材については、表１のＣＴＩの欄に「＞７００」と表記した。 <Evaluation of tracking resistance>
Using a test apparatus adapted to the provisions of JIS C2134, the CTI (Comparative Tracking Index) of each test material was measured. Table 1 shows the CTI of each test material. Note that the test apparatus used in this example cannot apply a voltage exceeding 700 V between the electrodes. Therefore, an accurate CTI value cannot be measured for a test material having a CTI of over 700 V, that is, a test material that does not generate tracking failure or continuous flame when 700 V is applied. Such a test material is indicated as “> 700” in the CTI column of Table 1.
表１より知られるように、ＰＢＴと上記共重合体とが上記特定の組成で混合されてなる試験材Ｅ１～Ｅ４は、共重合体を含まない試験材Ｃ１に比べて熱分解温度及びＣＴＩが高くなり、耐トラッキング性が向上した。試験材Ｅ１～Ｅ４は、いずれも６００Ｖ以上の耐トラッキング性を有しているため、コネクタが小型化した場合にもトラッキング現象の発生を容易に抑制することができる。
As is known from Table 1, the test materials E1 to E4 in which PBT and the above copolymer are mixed with the above specific composition have a thermal decomposition temperature and a CTI as compared with the test material C1 not containing the copolymer. Increased and improved tracking resistance. Since each of the test materials E1 to E4 has a tracking resistance of 600 V or more, the occurrence of the tracking phenomenon can be easily suppressed even when the connector is downsized.
また、上記共重合体の含有量が１０～２０質量部の範囲内である試験材Ｅ２～Ｅ４は、ＣＴＩが７００Ｖを超え、優れた耐トラッキング性を示した。それ故、試験材Ｅ２～Ｅ４は、より容易にトラッキング現象の発生を抑制することができる。
Further, the test materials E2 to E4 in which the content of the copolymer is in the range of 10 to 20 parts by mass exhibited CTI of more than 700 V and excellent tracking resistance. Therefore, the test materials E2 to E4 can more easily suppress the occurrence of the tracking phenomenon.
一方、上記共重合体の含有量が２３質量部を超えた試験材Ｃ２は、共重合体を含まない試験材Ｃ１よりもＣＴＩが低下し、かえって耐トラッキング性が低下した。
On the other hand, the test material C2 in which the content of the copolymer exceeded 23 parts by mass had a CTI lower than that of the test material C1 not containing the copolymer, and rather the tracking resistance was lowered.
Claims (5)
- ポリブチレンテレフタレート１００質量部に対して、
エチレン－アルキルアクリレート－グリシジルメタクリレート共重合体３～２３質量部を混合してなる、コネクタ用樹脂組成物。 For 100 parts by mass of polybutylene terephthalate,
A resin composition for connectors, comprising 3 to 23 parts by mass of an ethylene-alkyl acrylate-glycidyl methacrylate copolymer. - 上記アルキルアクリレートは、ブチルアクリレートである、請求項１に記載のコネクタ用樹脂組成物。 The resin composition for connectors according to claim 1, wherein the alkyl acrylate is butyl acrylate.
- 上記コネクタ用樹脂組成物は、さらにガラス繊維１０～２０質量部を含有している、請求項１または２に記載のコネクタ用樹脂組成物。 The connector resin composition according to claim 1 or 2, wherein the connector resin composition further contains 10 to 20 parts by mass of glass fibers.
- 比較トラッキング指数が６００Ｖ以上である、請求項１～３のいずれか１項に記載のコネクタ用樹脂組成物。 The resin composition for connectors according to any one of claims 1 to 3, wherein the comparative tracking index is 600 V or more.
- 請求項１～４のいずれか１項に記載のコネクタ用樹脂組成物からなる樹脂部品を有する、コネクタ。 A connector having a resin part comprising the resin composition for a connector according to any one of claims 1 to 4.
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| JP2015148413A JP2017027906A (en) | 2015-07-28 | 2015-07-28 | Resin composition for connector and connector |
| JP2015-148413 | 2015-07-28 |
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| JP7259273B2 (en) * | 2018-11-09 | 2023-04-18 | 東レ株式会社 | Polybutylene terephthalate resin composition and high-voltage parts comprising the same |
| US20220098362A1 (en) | 2019-02-12 | 2022-03-31 | Toyobo Co., Ltd. | Polybutylene terephthalate resin composition |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04279657A (en) * | 1991-03-07 | 1992-10-05 | Nippon Petrochem Co Ltd | Polyester resin composition |
| JPH0649337A (en) * | 1992-07-30 | 1994-02-22 | Nippon Petrochem Co Ltd | Polybutylene terephthalate resin composition |
| JP2000156950A (en) * | 1998-11-19 | 2000-06-06 | Toray Ind Inc | Resin-sealing electromagnetic coil for motor |
| JP2001049095A (en) * | 1999-05-28 | 2001-02-20 | Toray Ind Inc | Thermoplastic polyester resin composition |
| JP2001514699A (en) * | 1997-12-29 | 2001-09-11 | エルフ アトケム ソシエテ アノニム | Injection molded product of impact resistant polyester |
| JP2006056997A (en) * | 2004-08-20 | 2006-03-02 | Mitsubishi Engineering Plastics Corp | Polybutylene terephthalate resin composition and molded product |
| JP2009525385A (en) * | 2006-02-01 | 2009-07-09 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Articles comprising polyester and ethylene copolymers |
-
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- 2015-07-28 JP JP2015148413A patent/JP2017027906A/en active Pending
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04279657A (en) * | 1991-03-07 | 1992-10-05 | Nippon Petrochem Co Ltd | Polyester resin composition |
| JPH0649337A (en) * | 1992-07-30 | 1994-02-22 | Nippon Petrochem Co Ltd | Polybutylene terephthalate resin composition |
| JP2001514699A (en) * | 1997-12-29 | 2001-09-11 | エルフ アトケム ソシエテ アノニム | Injection molded product of impact resistant polyester |
| JP2000156950A (en) * | 1998-11-19 | 2000-06-06 | Toray Ind Inc | Resin-sealing electromagnetic coil for motor |
| JP2001049095A (en) * | 1999-05-28 | 2001-02-20 | Toray Ind Inc | Thermoplastic polyester resin composition |
| JP2006056997A (en) * | 2004-08-20 | 2006-03-02 | Mitsubishi Engineering Plastics Corp | Polybutylene terephthalate resin composition and molded product |
| JP2009525385A (en) * | 2006-02-01 | 2009-07-09 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Articles comprising polyester and ethylene copolymers |
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