WO2017008455A1 - 一种散热装置 - Google Patents

一种散热装置 Download PDF

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Publication number
WO2017008455A1
WO2017008455A1 PCT/CN2015/099524 CN2015099524W WO2017008455A1 WO 2017008455 A1 WO2017008455 A1 WO 2017008455A1 CN 2015099524 W CN2015099524 W CN 2015099524W WO 2017008455 A1 WO2017008455 A1 WO 2017008455A1
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heat
foam
graphene film
film
heat sink
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PCT/CN2015/099524
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English (en)
French (fr)
Inventor
张航
郑华伟
郑金桥
陈继良
刘欣
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中兴通讯股份有限公司
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Publication of WO2017008455A1 publication Critical patent/WO2017008455A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present application relates to the field of electronic heat dissipation technology, for example, to a heat sink.
  • thermal interface materials are mostly prepared by thermally conductive particles filled with silicone grease and epoxy polymer silica gel system.
  • the materials have complex preparation processes, large thermal contact resistance between materials, and poor reliability of long-term use of materials. Sex.
  • the traditional radiator products are mainly made of aluminum, copper and other metals. The main disadvantages are: high cost, high density and high weight.
  • the existing heat dissipation system has problems such as large contact thermal resistance between the heat dissipation systems, large weight of the heat dissipation system, and high cost, so how to overcome the problem becomes a technical problem to be solved by the present application.
  • a heat dissipating device provided by an embodiment of the invention includes: a graphene film and a heat-resistant supporting substrate; wherein the graphene film is uniformly coated on the heat-resistant supporting substrate.
  • the heat resistant support substrate is an elastomeric heat resistant support substrate.
  • the elastic heat-resistant support base comprises: foam.
  • one side of the graphene film is coated with a heat-resistant adhesive; the graphene film is uniformly coated on the heat-resisting manner by adhesive bonding. Support matrix on.
  • the other surface of the graphene film is covered with a protective film.
  • the heat dissipating device of the embodiment of the invention is prepared by uniformly coating a heat-resistant supporting substrate with a graphene film with good thermal conductivity, and the heat dissipating device solves the problem of large contact thermal resistance between the heat dissipating devices;
  • the heat-resistant support base body for example, a foam having a low density and good compression performance, makes the heat-dissipating device light in weight and low in cost, and solves the problems of large weight and high price of the existing heat-dissipating device.
  • the heat dissipating device of the embodiment of the invention has a simple preparation process, strong use reliability, and the overall use reliability of the heat dissipating device is greatly improved.
  • FIG. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.
  • FIG. 2 is a schematic view showing a interface of a graphene film according to an embodiment of the present invention
  • FIG. 3 is a schematic cross-sectional view showing a heat dissipating device when the shape of the foam is a rectangular parallelepiped according to an embodiment of the present invention
  • FIG. 4 is a schematic cross-sectional view showing a heat dissipating device when the shape of the foam is zigzag in the embodiment of the present invention
  • Fig. 5 is a schematic cross-sectional view showing a heat dissipating device when the shape of the foam is wavy in the embodiment of the present invention.
  • Embodiments of the present invention provide a heat dissipating device which is a novel heat conducting product prepared from a graphene film and a heat resistant supporting substrate.
  • the device can replace part of the heat conducting interface material and the heat dissipating system such as a heat sink, and the heat dissipating device has the characteristics of simple preparation, light weight and low cost.
  • the heat dissipating device provided by the embodiment of the invention comprises a graphene film and a heat-resistant supporting substrate, wherein the graphene film is evenly coated on the heat-resistant supporting substrate to obtain a heat dissipating device.
  • FIG. 1 it is a schematic diagram of a heat sink after the graphene film is uniformly coated on the heat-resistant support substrate.
  • the thickness, density, and thermal conductivity specifications of the graphene film can be flexibly selected according to actual needs.
  • the graphene film is coated with a backing on one side, so that the graphene film can be uniformly coated on the foam by sticking.
  • the other side of the graphene film may be coated with a protective film.
  • FIG. 2 a schematic diagram of an interface of a top coat and a protective film on a graphene film is shown.
  • the heat sink when the heat sink is applied to some scenes, the heat sink needs to be fixed.
  • the backing glue may be coated on the surface of the heat sink (ie, the surface of the graphene film) to fix the heat sink.
  • the adhesive is a heat-resistant adhesive, and a conductive or insulating adhesive can be selected according to the needs of the application scenario.
  • the thermal conductivity of different types of adhesives varies.
  • the protective film may be an organic protective film having high temperature resistance and good insulating properties, and may be, but not limited to, a PET protective film.
  • the heat-resistant support base may be an elastomeric heat-resistant support base, that is, the heat-resistant support base has good compressibility and resilience, so that the heat dissipation device of the embodiment can be applied to various scenarios.
  • the elastomeric heat-resistant support substrate is not limited to foam.
  • the material of the foam may be, but not limited to, one of polyurethane (PU) ethylene-vinyl acetate copolymer (EVA) and the like.
  • PU polyurethane
  • EVA ethylene-vinyl acetate copolymer
  • the foams with different materials can be selected according to the application scenario.
  • the foam may have different appearance characteristics according to different application scenarios.
  • the shape of the foam in the embodiment of the present invention may be a square, a rectangular parallelepiped, a wavy body, or a tooth-shaped body.
  • the heat conductive foam may also be a combined shape of different shapes.
  • the cut graphene heat conductive film can be a whole sheet, and can not be damaged or broken, and the cut graphene heat conductive film can completely cover the selected foam skeleton; for example, the selected foam is regular.
  • the covering surface may include front, rear, left, right, upper and lower faces; and the foamed portion of the special shape characteristic such as the tooth shape is difficult to cover.
  • FIGS. 3, 4, and 5 a schematic cross-sectional view of the graphene heat-conductive foaming device when the foam shape is a rectangular parallelepiped, a zigzag-shaped body, and a wave-shaped body, respectively.
  • the properties of the graphene film are as follows: a thickness of 50 ⁇ m, a single-sided coated backing, and a non-coated backed PET protective film covering a thermal conductivity of 1000 W/m ⁇ K and an axial thermal conductivity of 15 W/m ⁇ K, the graphene film density was 1.8 g/cm 3 .
  • the selected foam is a polyurethane (PU) foam having a rectangular shape and a size of 30 mm ⁇ 30 mm ⁇ 10 mm (height).
  • the film is cut into appropriate specifications and the film is coated in six foams.
  • the surface was prepared into a graphene heat conductive foam.
  • the thermal conductivity of the graphene thermally conductive foam was determined to be 0.8 W/m ⁇ K.
  • the properties of the graphene film are as follows: the thickness is 75 ⁇ m, the back side is coated with the backing, and the uncoated back side is covered by the PET protective film, which has a thermal conductivity of 900 W/m ⁇ K and an axial thermal conductivity of 15 W/m. K, the graphene film density was 1.6 g/cm 3 .
  • the selected foam is a polyurethane (PU) foam having a rectangular shape and a size of 30 mm ⁇ 30 mm ⁇ 10 mm (height).
  • the film is cut into appropriate specifications and the film is coated in six foams.
  • the surface was prepared into a graphene heat conductive foam.
  • the thermal conductivity of the graphene thermally conductive foam was determined to be 1.2 W/m ⁇ K.
  • the properties of the graphene film are as follows: a thickness of 100 ⁇ m, a single-sided coated backing, and a non-coated backed PET protective film covering a thermal conductivity of 800 W/m ⁇ K and an axial thermal conductivity of 15 W/m ⁇ K, the graphene film density was 1.4 g/cm 3 .
  • the selected foam is a polyurethane (PU) foam having a rectangular shape and a size of 30 mm ⁇ 30 mm ⁇ 10 mm (height).
  • the film is cut into appropriate specifications and the film is coated in six foams.
  • the surface was prepared into a graphene heat conductive foam.
  • the thermal conductivity of the graphene thermally conductive foam was determined to be 1.8 W/m ⁇ K.
  • the properties of the graphene film are as follows: a thickness of 50 ⁇ m, a single-sided coated backing, and a non-coated backed PET protective film covering a thermal conductivity of 1000 W/m ⁇ K and an axial thermal conductivity of 15 W/m ⁇ K, the graphene film density was 1.8 g/cm 3 .
  • the selected foam is a polyurethane (PU) foam, and its outer shape is a wave-shaped body, and the size is about 30 mm ⁇ 30 mm ⁇ 20 mm (height).
  • the film is cut into appropriate specifications and the film is coated on the surface of the foam.
  • Graphene conductive foam is a polyurethane (PU) foam, and its outer shape is a wave-shaped body, and the size is about 30 mm ⁇ 30 mm ⁇ 20 mm (height).
  • the properties of the graphene film are as follows: the thickness is 75 ⁇ m, the single-sided coated backing, the uncoated back-coated PET protective film covers, the thermal conductivity is 900 W/m ⁇ K, and the axial thermal conductivity is 15 W/m ⁇ K, the graphene film density was 1.6 g/cm 3 .
  • the selected foam is a polyurethane (PU) foam, and its outer shape is a wave-shaped body, and the size is about 30 mm ⁇ 30 mm ⁇ 20 mm (height). The film is cut into appropriate specifications and the film is coated on the surface of the foam.
  • Graphene conductive foam is a polyurethane (PU) foam, and its outer shape is a wave-shaped body, and the size is about 30 mm ⁇ 30 mm ⁇ 20 mm (height).
  • the properties of the graphene film are as follows: the thickness is 100 ⁇ m, the back side is coated with the backing, and the uncoated back side is covered by the PET protective film, and the thermal conductivity is 800 W/m ⁇ K, and the axial thermal conductivity is 15 W/m. K, the graphene film density was 1.4 g/cm 3 .
  • the selected foam is a polyurethane (PU) foam, and its outer shape is a wave-shaped body, and the size is about 30 mm ⁇ 30 mm ⁇ 20 mm (height). The film is cut into appropriate specifications and the film is coated on the surface of the foam.
  • Graphene conductive foam is a polyurethane (PU) foam, and its outer shape is a wave-shaped body, and the size is about 30 mm ⁇ 30 mm ⁇ 20 mm (height).
  • the properties of the graphene film are as follows: the thickness is 50 ⁇ m, the back side is coated with the backing, and the uncoated back side is covered by the PET protective film, which has a thermal conductivity of 1000 W/m ⁇ K and an axial thermal conductivity of 15 W/m. K, the graphene film density was 1.8 g/cm 3 .
  • the selected foam is a polyurethane (PU) foam, and its outer shape is a tooth-shaped body having a size of about 30 mm ⁇ 30 mm ⁇ 20 mm (height). The film is cut into an appropriate size and the film is coated on the surface of the foam. Prepared into graphene heat conductive foam.
  • the properties of the graphene film are as follows: the thickness is 75 ⁇ m, the back side is coated with the backing, and the uncoated back side is covered by the PET protective film, which has a thermal conductivity of 900 W/m ⁇ K and an axial thermal conductivity of 15 W/m. K, the graphene film density was 1.6 g/cm 3 .
  • the selected foam is a polyurethane (PU) foam, and its outer shape is a tooth-shaped body having a size of about 30 mm ⁇ 30 mm ⁇ 20 mm (height). The film is cut into an appropriate size and the film is coated on the surface of the foam. Prepared into graphene heat conductive foam.
  • the properties of the graphene film are as follows: the thickness is 100 ⁇ m, the back side is coated with the backing, and the uncoated back side is covered by the PET protective film, and the thermal conductivity is 800 W/m ⁇ K, and the axial thermal conductivity is 15 W/m. K, the graphene film density was 1.4 g/cm 3 .
  • the selected foam is a polyurethane (PU) foam, and its outer shape is a tooth-shaped body having a size of about 30 mm ⁇ 30 mm ⁇ 20 mm (height). The film is cut into an appropriate size and the film is coated on the surface of the foam. Prepared into graphene heat conductive foam.
  • a heat dissipating device disclosed in the embodiment of the invention includes: a graphene film and a heat resistant supporting substrate; wherein the graphene film is uniformly coated on the heat resistant supporting substrate.
  • the heat dissipating device of the embodiment of the invention is prepared by uniformly coating a heat-resistant supporting substrate with a graphene film with good thermal conductivity, and the heat dissipating device solves the problem of large contact thermal resistance between the heat dissipating devices;
  • the heat-resistant supporting substrate for example, a foam having a low density and good compression properties, makes the heat sink lightweight The low cost solves the problems of large weight and high price of the existing heat sink.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

公开了一种散热装置，包括：石墨烯薄膜和耐热支撑基体；其中，所述石墨烯薄膜均匀包覆在所述耐热支撑基体上。因此，所述散热装置采用导热性能良好的石墨烯薄膜均匀包覆耐热支撑基体的方式制备得到，该散热装置解决了散热装置之间接触热阻较大的问题；同时，采用弹性体耐热支撑基体，例如采用低密度、压缩性能良好的泡棉，使得散热装置的重量轻、成本低，很好的解决了已有散热装置重量大、价格昂贵等问题。

Description

一种散热装置 技术领域
本申请涉及电子散热技术领域，例如涉及一种散热装置。
背景技术
随着电子设备向着小型化、高功耗发展，其功耗密度逐步增加。电子设备的发热量也成倍增加，这也对系统的散热性能提出了更高的要求。目前散热系统包括：导热界面材料、散热器。现在的导热界面材料多以导热颗粒填充硅脂以及环氧类高分子硅胶体系制备而成，该类材料存在制备工艺复杂，材料之间接触热阻较大，材料长期使用可靠性较差等局限性。而传统的散热器产品主要是由铝、铜等金属制备而成，其主要缺点有：成本较高、并且密度高重量大等。可见，现有的散热系统存在散热系统之间接触热阻较大、散热系统重量大、成本高等问题，所以如何克服该问题，成为本申请所要解决的技术问题。
发明内容
鉴于上述问题，提出了本发明实施例以便提供一种解决上述技术问题的一种散热装置。
本发明实施例提供的一种散热装置，包括：石墨烯薄膜和耐热支撑基体；其中，所述石墨烯薄膜均匀包覆在所述耐热支撑基体上。
可选地，本发明实施例的所述散热装置中，所述耐热支撑基体为弹性体耐热支撑基体。
可选地，本发明实施例的所述散热装置中，所述弹性体耐热支撑基体包括：泡棉。
可选地，本发明实施例的所述散热装置中，所述石墨烯薄膜的一面涂覆有耐热背胶；所述石墨烯薄膜通过背胶粘贴的方式均匀包覆在所述耐热支撑基体 上。
可选地，本发明实施例的所述散热装置中，所述石墨烯薄膜的另一面覆有保护膜。
本发明实施例的有益效果如下：
本发明实施例的所述散热装置采用导热性能良好的石墨烯薄膜均匀包覆耐热支撑基体的方式制备得到，该散热装置解决了散热装置之间接触热阻较大的问题；同时，采用弹性体耐热支撑基体，例如采用低密度、压缩性能良好的泡棉，使得散热装置的重量轻、成本低，很好的解决了已有散热装置重量大、价格昂贵等问题。另外，本发明实施例的所述散热装置制备工艺简单，使用可靠性强，散热装置的整体使用可靠性得到极大提高。
附图概述
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的一种散热装置的结构示意图；
图2为本发明实施例中石墨烯薄膜界面示意图；
图3为本发明实施例中泡棉形状为长方体时散热装置的截面示意图；
图4为本发明实施例中泡棉形状为锯齿形时散热装置的截面示意图；
图5为本发明实施例中泡棉形状为波浪形时散热装置的截面示意图。
本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本发明实施例提供一种散热装置，该散热装置是由石墨烯薄膜与耐热支撑基体制备的新型导热产品。该装置能够替代部分导热界面材料以及散热器等散热系统，该散热装置具有制备简单、重量轻、成本较低等特点。
本发明实施例提供的散热装置，包括石墨烯薄膜以及耐热支撑基体，其中，石墨烯薄膜均匀包覆在耐热支撑基体上，得到散热装置。如图1所示，为石墨烯薄膜均匀包覆在耐热支撑基体上后的散热装置示意图。
本实施例中，石墨烯薄膜的厚度、密度以及导热率规格可以根据实际需求进行灵活选择。
本实施例中，石墨烯薄膜一面涂覆有背胶，使得石墨烯薄膜通过粘贴的方式可以均匀包覆在泡棉上。石墨烯薄膜的另一面可以覆有保护性薄膜。如图2所示，为石墨烯薄膜上涂覆背胶和保护性薄膜的界面示意图。
本发明实施例中，考虑到散热装置应用到一些场景时，需要对散热装置进行固定，此时，可以在散热装置表面(即石墨烯薄膜表面)涂覆背胶，以将散热装置进行固定。
本实施例中，所述背胶为耐热型背胶，根据应用场景的需要，可以选择导电性或绝缘性的背胶。不同类型的背胶导热性能也各不相同。
本实施例中，所述保护性薄膜可以为具有耐高温、绝缘性能良好的有机保护膜，可以但不限于为PET保护薄膜。
本实施例中，耐热支撑基体可以为弹性体耐热支撑基体，即耐热支撑基体具有良好的压缩性和回弹性，使得本实施例所述散热装置可以应用于各种场景。
其中，弹性体耐热支撑基体不限制于泡棉。所述泡棉的材质可以但不限于为聚氨酯类(PU)乙烯-醋酸乙烯共聚物(EVA)等中的一种。本实施例中，可以根据应用场景选择材质不同的泡棉。
本实施例中，所述泡棉可以根据不同的应用场景其外型特征各不相同。本发明实施例中的泡棉外形可以是正方体、长方体、波浪形体、齿状形体，根据实际应用场景可导热泡棉也可以是不同形状的组合形体。
基于上述的结构阐述，下面给出本发明实施例的所述散热装置的制备方法：
(1)选择特定形状的耐热型泡棉作为支撑基体；
(2)根据选择的耐热泡棉外形裁剪出适当外形的石墨烯薄膜，以使得该石墨烯薄膜能够均匀包覆泡棉。其中，所裁剪的石墨烯导热薄膜可以为一整张，不能出现破损、断裂等情况，所裁剪的石墨烯导热薄膜能够完全包覆所选择的泡棉骨架；例如，选择的泡棉为规则的长方体，则其包覆面可包括前、后、左、右、上、下六个面；而对于齿状等特殊外形特征的泡棉部分难以包覆面除外。
(3)利用石墨烯薄膜表面涂覆的背胶将石墨烯薄膜贴在选择的泡棉支撑基体表面，制备成石墨烯导热泡棉装置。如图3、4、5所示，分别是泡棉形状为长方体、锯齿型体和波浪型体时，石墨烯导热泡棉装置的截面示意图。
下面给出几个应用示例，以说明本发明实施例提供的散热装置的性能。
示例1
石墨烯薄膜的性质如下：厚度为50μm，单面涂覆背胶，未涂覆背胶的面PET保护薄膜覆盖，其面向导热率为1000W/m·K，轴向导热率为15W/m·K，石墨烯薄膜密度为1.8g/cm3。所选择的泡棉为聚氨酯(PU)泡棉，其外型形状为长方体，尺寸为：30mm×30mm×10mm(高)将上述薄膜裁剪成适当的规格后将薄膜包覆在泡棉的六个面，制备成石墨烯导热泡棉。经检测，该石墨烯导热泡棉的导热率为0.8W/m·K。
示例2
石墨烯薄膜的性质如下：厚度为75μm，单面涂覆背胶，未涂覆背胶的面由PET保护薄膜覆盖，其面向导热率为900W/m·K，轴向导热率为15W/m·K，石墨烯薄膜密度为1.6g/cm3。所选择的泡棉为聚氨酯(PU)泡棉，其外型形状为长方体，尺寸为：30mm×30mm×10mm(高)将上述薄膜裁剪成适当的规格后将薄膜包覆在泡棉的六个面，制备成石墨烯导热泡棉。经检测，该石墨烯导热泡棉的导热率为1.2W/m·K。
示例3
石墨烯薄膜的性质如下：厚度为100μm，单面涂覆背胶，未涂覆背胶的面PET保护薄膜覆盖，其面向导热率为800W/m·K，轴向导热率为15W/m·K，石墨烯薄膜密度为1.4g/cm3。所选择的泡棉为聚氨酯(PU)泡棉，其外型形状为长方体，尺寸为：30mm×30mm×10mm(高)将上述薄膜裁剪成适当的规格后将薄膜包覆在泡棉的六个面，制备成石墨烯导热泡棉。经检测，该石墨烯导热泡棉的导热率为1.8W/m·K。
示例4
石墨烯薄膜的性质如下：厚度为50μm，单面涂覆背胶，未涂覆背胶的面PET保护薄膜覆盖，其面向导热率为1000W/m·K，轴向导热率为15W/m·K，石墨烯薄膜密度为1.8g/cm3。所选择的泡棉为聚氨酯(PU)泡棉，其外形特征为波浪型体，尺寸约为30mm×30mm×20mm(高)将上述薄膜裁剪成适当的规格后将薄膜包覆在泡棉表面制备成石墨烯导热泡棉。
示例5
石墨烯薄膜的性质如下：厚度为75μm，单面涂覆背胶，未涂覆背胶的面PET保护薄膜覆盖，其面向导热率为900W/m·K，轴向导热率为15W/m·K，石墨烯薄膜密度为1.6g/cm3。所选择的泡棉为聚氨酯(PU)泡棉，其外形特征为波浪型体，尺寸约为30mm×30mm×20mm(高)将上述薄膜裁剪成适当的规格后将薄膜包覆在泡棉表面制备成石墨烯导热泡棉。
示例6
石墨烯薄膜的性质如下：厚度为100μm，单面涂覆背胶，未涂覆背胶的面由PET保护薄膜覆盖，其面向导热率为800W/m·K，轴向导热率为15W/m·K，石墨烯薄膜密度为1.4g/cm3。所选择的泡棉为聚氨酯(PU)泡棉，其外形特征为波浪型体，尺寸约为30mm×30mm×20mm(高)将上述薄膜裁剪成适当的规格后将薄膜包覆在泡棉表面制备成石墨烯导热泡棉。
示例7
石墨烯薄膜的性质如下：厚度为50μm，单面涂覆背胶，未涂覆背胶的面由PET保护薄膜覆盖，其面向导热率为1000W/m·K，轴向导热率为15W/m·K，石 墨烯薄膜密度为1.8g/cm3。所选择的泡棉为聚氨酯(PU)泡棉，其外形特征为齿状型体，尺寸约为30mm×30mm×20mm(高)将上述薄膜裁剪成适当的规格后将薄膜包覆在泡棉表面制备成石墨烯导热泡棉。
示例8
石墨烯薄膜的性质如下：厚度为75μm，单面涂覆背胶，未涂覆背胶的面由PET保护薄膜覆盖，其面向导热率为900W/m·K，轴向导热率为15W/m·K，石墨烯薄膜密度为1.6g/cm3。所选择的泡棉为聚氨酯(PU)泡棉，其外形特征为齿状型体，尺寸约为30mm×30mm×20mm(高)将上述薄膜裁剪成适当的规格后将薄膜包覆在泡棉表面制备成石墨烯导热泡棉。
示例9
石墨烯薄膜的性质如下：厚度为100μm，单面涂覆背胶，未涂覆背胶的面由PET保护薄膜覆盖，其面向导热率为800W/m·K，轴向导热率为15W/m·K，石墨烯薄膜密度为1.4g/cm3。所选择的泡棉为聚氨酯(PU)泡棉，其外形特征为齿状型体，尺寸约为30mm×30mm×20mm(高)将上述薄膜裁剪成适当的规格后将薄膜包覆在泡棉表面制备成石墨烯导热泡棉。
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。
工业实用性
本发明实施例公开的一种散热装置包括：石墨烯薄膜和耐热支撑基体；其中，所述石墨烯薄膜均匀包覆在所述耐热支撑基体上。本发明实施例所述散热装置采用导热性能良好的石墨烯薄膜均匀包覆耐热支撑基体的方式制备得到，该散热装置解决了散热装置之间接触热阻较大的问题；同时，采用弹性体耐热支撑基体，例如采用低密度、压缩性能良好的泡棉，使得散热装置的重量轻、 成本低，很好的解决了已有散热装置重量大、价格昂贵等问题。

Claims (5)

  1. 一种散热装置，包括：石墨烯薄膜和耐热支撑基体；其中，所述石墨烯薄膜均匀包覆在所述耐热支撑基体上。
  2. 如权利要求1所述的散热装置，其中，所述耐热支撑基体为弹性体耐热支撑基体。
  3. 如权利要求2所述的散热装置，其中，所述弹性体耐热支撑基体包括：泡棉。
  4. 如权利要求1或2或3所述的散热装置，其中，
    所述石墨烯薄膜的一面涂覆有耐热背胶；
    所述石墨烯薄膜通过背胶粘贴的方式均匀包覆在所述耐热支撑基体上。
  5. 如权利要求4所述的散热装置，其中，所述石墨烯薄膜的另一面覆有保护膜。
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CN107033802A (zh) * 2017-05-12 2017-08-11 东华大学 一种易揭取的聚酰亚胺弹性导热胶带
CN113201717A (zh) * 2021-03-19 2021-08-03 深圳市汉嵙新材料技术有限公司 一种屏下散热组件制成工艺

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CN113201717A (zh) * 2021-03-19 2021-08-03 深圳市汉嵙新材料技术有限公司 一种屏下散热组件制成工艺

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