WO2017003246A1 - Contacteur fonctionnel et dispositif électronique portable le comportant - Google Patents
Contacteur fonctionnel et dispositif électronique portable le comportant Download PDFInfo
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- WO2017003246A1 WO2017003246A1 PCT/KR2016/007102 KR2016007102W WO2017003246A1 WO 2017003246 A1 WO2017003246 A1 WO 2017003246A1 KR 2016007102 W KR2016007102 W KR 2016007102W WO 2017003246 A1 WO2017003246 A1 WO 2017003246A1
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- conductive
- functional
- electrode
- elastic portion
- electronic device
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Definitions
- the present invention relates to a functional contactor for an electronic device such as a smart phone, and more particularly, to a functional contactor capable of providing various functions and a portable electronic device having the same.
- a conductive gasket is used between the external housing and the internal circuit board of the portable electronic device to mitigate an impact from the outside and reduce electromagnetic waves penetrating into or leaking from the portable electronic device.
- the portable electronic device has a plurality of antennas for each function according to the multifunction, and at least some of them are internal antennas and may be disposed in an external housing of the portable electronic device. Therefore, conductive contactors for electrical contact between the antenna disposed in the outer housing and the embedded circuit board of the portable electronic device have been used.
- an electrical path can be formed between the outer housing and the embedded circuit board by the conductive gasket or the conductive contactor, and in particular, as the metal housing and the circuit board form the loop, the outer metal housing has a large external exposed area.
- the static electricity having a high voltage instantaneously flows through a conductor such as, the static electricity may flow into the embedded circuit board through the conductive gasket or the conductive contactor to break the circuit of the IC.
- Such a portable electronic device typically uses a charger to charge the battery.
- a charger rectifies external AC power to DC power, and then converts it into a low DC power supply suitable for portable electronic devices through a transformer.
- a Y-CAP composed of a capacitor across the transformer.
- the DC power may not be sufficiently cut off by the Y-CAP, and furthermore, a leakage current may be generated by the AC power. It can propagate along the ground of the circuit.
- This leakage current can also be transmitted to conductors that can be contacted by the human body, such as an external case of a portable electronic device, and as a result, can cause users to feel discomfort and, in severe cases, can cause injury. It causes an electric shock accident.
- a protective element for protecting a user from such a leakage current needs to be provided in the conductive gasket or the conductive contactor connecting the metal housing and the circuit board.
- the conductive gasket or the conductive contactor has a low capacitance, so that attenuation of the signal occurs and the RF signal is not transmitted smoothly. Therefore, it is necessary to implement a high capacitance.
- such a functional contactor has a function of stacking a relatively small contactor on the electrode by soldering or stacking the contactor by soldering when the area of the electrode is large to increase the capacitance of the functional device.
- the device is mounted on the substrate by secondary soldering, defects occur as the contactor is not fixed.
- the functional element in which the contactor is laminated is bonded to the substrate by secondary soldering, wherein the contactor is caused by heat generated in the secondary soldering. And the soldering portion of the functional element is melted may cause defects in the adhesiveness and reliability of the contactor, which may cause electrical contact failure.
- the present invention has been made in view of the above, and an object thereof is to provide a functional contactor having a function for protecting a user or an internal circuit and a portable electronic device having the same.
- another object of the present invention is to provide a functional contactor in which a junction portion in which a functional element and a contactor are in contact with each other is melted and distorted by secondary soldering or reliability is maintained without contact failure.
- the present invention to solve the above problems is a conductive elastic portion having an elastic force in electrical contact with the conductor of the electronic device; And a functional element including a first electrode mounted on a circuit board of the electronic device, a second electrode electrically connected to a lower side of the conductive elastic portion, and a dielectric formed between the first electrode and the second electrode.
- Functional contactors are provided.
- the functional device may have a breakdown voltage greater than a rated voltage of an external power source of the electronic device.
- the conductive elastic portion may be stacked on the second electrode of the functional element through a conductive adhesive layer or solder.
- the functional element may be provided with a groove on the upper side
- the second electrode may be formed on the bottom surface of the groove
- the conductive elastic portion may be fixed in the groove by the conductive adhesive layer or the solder.
- the dielectric is made of a ceramic material
- the ceramic material is Er 2 O 3 , Dy 2 O 3 , Ho 2 O 3 , V 2 O 5 , CoO, MoO 3 , SnO 2 , BaTiO 3 , Nd 2 O 3
- It may be a metal-based oxidizing compound including at least one selected from among, a calcined ceramic or ferrite, ZnO-based varistor material, or any one of Pr and Bi-based material.
- the conductive elastic part may be any one of a conductive gasket, a silicone rubber pad, and a clip-shaped conductor having elastic force.
- the present invention is electrically conductive contact with the conductor of the electronic device, the conductive elastic portion having an elastic force provided with a mounting electrode on the bottom; And a functional unit including a dielectric formed under the mounting electrode and an external electrode formed under the dielectric and mounted on a circuit board of the electronic device.
- the present invention includes a conductive elastic portion having an elastic force in electrical contact with the conductor of the electronic device; Internal electrodes provided on a lower surface of the conductive elastic portion; A dielectric formed under the internal electrode; And an external electrode formed under the dielectric and mounted on a circuit board of the electronic device.
- the present invention includes a conductive elastic portion having an elastic force in electrical contact with the conductor of the electronic device; And a functional unit including an internal electrode electrically connected to a lower side of the conductive elastic part, and a dielectric formed under the internal electrode and mounted on a circuit board of the electronic device.
- the present invention is electrically conductive contact with the conductor of the electronic device, the conductive elastic portion having an elastic force provided with a mounting electrode on the bottom; And a functional unit formed of a dielectric formed under the mounting electrode.
- the present invention includes a conductive elastic portion having an elastic force in electrical contact with the conductor of the electronic device; Internal electrodes provided on the bottom surface of the conductive elastic portion; And a dielectric formed under the internal electrode and mounted on a circuit board of the electronic device.
- the present invention provides a functional contactor fixed and electrically connected to the substrate through a first conductive bonding member.
- the functional contactor may include a functional element including a first electrode and a second electrode, wherein the first electrode contacts the first conductive bonding member; A conductive elastic portion disposed on the functional element; And a second conductive bonding member interposed between the conductive elastic portion and the functional element or between the conductive elastic portion and the second electrode to fix and electrically connect the conductive elastic portion and the functional element.
- a melting point of the second conductive joining member is higher than a melting point of the first conductive joining member.
- the first conductive bonding member and the second conductive bonding member may be made of different materials.
- the functional device may further include an electric shock prevention function for blocking leakage current of external power introduced from the ground of the substrate of the electronic device, a communication signal bypass function for passing the communication signal flowing from the conductive case, and the conductive case. It may have at least one of the ESD protection function that passes the static electricity without breaking the insulation when the static electricity flows.
- the conductive elastic portion may be in line contact or point contact with the conductor to reduce galvanic corrosion.
- the present invention is a conductor capable of contacting the human body; Pads for component mounting of circuit boards; And a functional contactor as described above mounted on the mounting pad and electrically connected in series with the conductor.
- the present invention includes a conductive elastic portion having an elastic force in electrical contact with the conductor of the electronic device;
- a functional part including an internal electrode electrically connected to a lower side of the conductive elastic part, and a dielectric formed under the internal electrode and mounted on a circuit board of the electronic device; And a conductive pad provided on the circuit board to mount the functional unit thereon.
- the breakdown voltage between the internal electrode and the conductive pad of the circuit board may be greater than the rated voltage of the external power source of the electronic device.
- the present invention is a functional element; A conductive elastic portion disposed on the functional element; And a second conductive bonding member interposed between the conductive elastic portion and the functional element, wherein the melting point of the second conductive bonding member is higher than the melting point of the first conductive bonding member. do.
- the present invention is a substrate; A functional contactor disposed on the substrate; And a first conductive bonding member for fixing and electrically connecting a functional contactor on the substrate.
- the functional contactor includes a functional element, a conductive elastic portion disposed on the functional element, and a second conductive bonding member configured to fix and electrically connect the conductive elastic portion to the functional element, wherein the second conductive A functional circuit component is provided that includes a functional contactor whose melting point is higher than the melting point of the first conductive bonding member.
- the contactor connecting the conductor and the circuit board is provided with a functional element or a functional unit, whereby a user's damage or internal circuit such as an electric shock through the conductor is prevented. Breakage can be prevented.
- the present invention may be suitable for miniaturization of a portable electronic device by having a functional element or a functional unit and a contactor as an integrated body, without the need for a separate element for implementing the corresponding function and an additional space therefor.
- the present invention provides a functional unit with only minimal components by eliminating overlapping components when mounted on the circuit board, thereby reducing the manufacturing cost and reducing resources for manufacturing functional devices. You can save.
- the present invention sets the melting point of the junction for joining the functional element and the contactor higher than the melting point of the junction for joining the functional element and the substrate, so that the junction between the functional element and the contactor is not deformed even in the two soldering processes and the reliability is high. Can be maintained.
- FIG. 1 is a cross-sectional view of an example in which a functional contactor is applied to a portable electronic device according to an embodiment of the present invention
- FIG. 2 is a cross-sectional view of another example in which a functional contactor is applied to a portable electronic device according to an embodiment of the present disclosure
- 3 and 4 are cross-sectional views of an example of a functional contactor according to an embodiment of the present invention.
- 5 to 8 are cross-sectional views and perspective views of another example of a functional contactor according to an embodiment of the present invention.
- FIGS. 9 and 10 are cross-sectional views of yet another example of a functional contactor according to an embodiment of the present invention.
- 11 to 13 are cross-sectional views showing various forms of the conductive elastic portion of the functional contactor according to the embodiment of the present invention.
- FIG. 14 is a cross-sectional view of another example in which a functional contactor is applied to a portable electronic device according to an embodiment of the present disclosure
- FIG. 15 is a cross-sectional view of the functional contactor separated from the portable electronic device of FIG. 14; FIG.
- 16 and 17 are cross-sectional views of yet another example of a functional contactor according to an embodiment of the present invention.
- FIGS. 18 and 19 are a perspective view and a cross-sectional view showing a functional circuit component including a functional contactor according to an embodiment of the present invention.
- Functional contactor 100 includes a conductive elastic portion 110 and a functional element (120).
- the functional contactor 100 is for electrically connecting the conductor 12, such as an outer metal case, and the circuit board 14 in a portable electronic device.
- the portable electronic device may be in the form of a portable electronic device that is portable and easy to carry.
- the portable electronic device may be a mobile terminal such as a smart phone or a cellular phone, and may be a smart watch, a digital camera, a DMB, an e-book, a netbook, a tablet PC, a portable computer, or the like.
- Such electronics may have any suitable electronic components including antenna structures for communication with an external device.
- the device may be a device using local area network communication such as Wi-Fi and Bluetooth.
- the functional contactor 100 is pressed according to the pressing force for coupling the conductor 12 to the portable electronic device, and has an elastic force to be restored to its original state when the conductor 12 is detached from the portable electronic device. Can be.
- the conductor 12 may be provided to partially surround or entirely surround the side of the portable electronic device, and may be an antenna for communication between the portable electronic device and an external device.
- the conductive elastic portion 110 may be in electrical contact with the conductor 12 of the portable electronic device and have an elastic force.
- the conductive elastic portion 110 may be a conductive gasket as shown in FIG. 1, a silicone rubber pad, and a clip-shaped conductor having elastic force as shown in FIG. 2.
- the conductive elastic portion 110 when the conductive elastic portion 110 is in surface contact with the conductor 12, such as a conductive gasket or a silicone rubber pad, the conductive elastic portion 110 may be integrally formed of a conductive material having an elastic force. In this case, the conductive elastic portion 110 may be contracted toward the circuit board 14 by the pressing force of the conductor 12, and when the conductive elastic portion 110 is separated from the portable electronic device, the conductive elastic portion 110 is restored to its original state by the elastic force. Can be.
- the conductive elastic portion 110 may be formed of clip-shaped conductors 211, 212, and 213 having elastic force, and may electrically contact the conductor 12.
- the conductive elastic portion 110 as shown in Figure 2, as the contact portion 211 is pressed by the circuit board 14, the bending portion 212 having an elastic force is pressed toward the circuit board 14,
- the conductor 12 When the conductor 12 is separated from the portable electronic device, it may be restored to its original state, ie, above the mounting portion of the circuit board 14 by the elastic force of the bent portion 212.
- the present invention is not limited thereto, and any one may be applied as long as the conductive elastic portion 110 has an elastic force.
- the conductive elastic portion when the conductive elastic portion is in contact with the conductor, galvanic corrosion occurs due to a potential difference between dissimilar metals. At this time, in order to minimize galvanic corrosion, it is preferable that the conductive elastic portion has a small area in contact with the conductor.
- the conductive elastic portion may be configured not only in surface contact with the conductor, but also preferably in line contact and / or point contact.
- the conductive elastic portion 110 is a conductive gasket or a silicone rubber pad
- the conductive elastic portion 110 may be in surface contact with the conductor, and in the case of a clip-shaped conductor, line contact and / or point contact may be performed.
- the functional device 120 is electrically connected to the conductive elastic portion 110 in series.
- the functional element 120 may be disposed under the conductive elastic portion 110.
- the second electrode 122 (see FIG. 3) may be disposed on an upper surface of the functional device 120.
- the functional element 120 is provided with a groove portion 1202 (see FIG. 4) on the upper side, the second electrode 122 is provided on the bottom surface of the groove portion 1202, the conductive elastic portion 110 is It may be stacked on the second electrode 122 through a conductive adhesive layer or solder 111. This structure will be described later.
- the functional device 120 is provided with a function for protecting a user or an internal circuit, and may include, for example, at least one of an electric shock protection device, a varistor, a suppressor, a diode, and a capacitor.
- the functional contactors 100 and 100 ′ may include a conductive gasket 110 and a functional element 120 as conductive elastic portions.
- the conductive gasket 110 may be integrally formed of a conductive material having elastic force.
- the conductive gasket 110 may include, for example, at least one of a polymer body, a natural rubber, a sponge, a synthetic rubber, a heat resistant silicone rubber, and a tube in which the conductive paste is manufactured by thermocompression bonding.
- the conductive gasket is not limited thereto and may include a conductive material having elastic force.
- the conductive gasket 110 may be in surface contact with a conductor 12 such as a metal housing or an antenna, and the lower portion thereof may be electrically connected to the functional element 120.
- the functional device 120 includes a first electrode 121, a second electrode 122, and a dielectric 123.
- the functional device 120 may be a capacitor.
- Such a capacitor can prevent damage to a user or damage to an internal circuit such as an electric shock through a conductor such as a metal case.
- the capacitor may block leakage current of external power flowing from the ground of the circuit board of the electronic device, and may pass a communication signal flowing from the conductor 12.
- the first electrode 121 is disposed below the functional device 120 and mounted on the circuit board 14 of the electronic device.
- the second electrode 122 is disposed above the functional element 120 and is electrically connected to the lower side of the conductive elastic portion 110.
- the conductive adhesive layer 111 may be coated on the second electrode 122 on the upper surface of the functional element 120, and the conductive gasket 110 may be stacked through the conductive adhesive layer 111.
- the conductive device gasket 110 may be stacked by soldering the functional device 120.
- the groove portion 1202 may be provided on the upper surface.
- the functional element 120 may be provided with a second electrode 122 on the bottom surface of the groove portion 1202.
- the conductive gasket 110 may be inserted and stacked in the groove 1202 through the conductive adhesive layer 111 or the solder.
- the dielectric 123 is formed between the first electrode 121 and the second electrode 122.
- the dielectric 123 may be made of a ceramic material.
- the ceramic material may include at least one selected from Er 2 O 3 , Dy 2 O 3 , Ho 2 O 3 , V 2 O 5 , CoO, MoO 3 , SnO 2 , BaTiO 3 , and Nd 2 O 3 . It may be made of a metal-based oxidizing compound, or made of ferrite, and a calcined ceramic such as low temperature co-fired ceramic (LTCC) or high temperature co-fired ceramic (HTCC) may be used.
- LTCC low temperature co-fired ceramic
- HTCC high temperature co-fired ceramic
- the ceramic material may be a ZnO-based varistor material, or Pr and Bi-based materials, such as Er 2 O 3 , Dy 2 O 3 , Ho 2 O 3 , V 2 O 5 , CoO, MoO 3 , SnO 2 , BaTiO 3 , and Nd 2 O 3 should be understood as examples and it is understood that other kinds of metal-based oxidizing compounds not mentioned may also be used.
- the functional device 120 may be made of a body.
- the first electrode 121 and the second electrode 122 are disposed on the upper and lower surfaces of the dielectric sheet so as to be integrally formed through a firing or curing process.
- the functional element 120 has a dielectric strength of the dielectric 123 such that its internal voltage is greater than a rated voltage of an external power source of the electronic device, and forms a capacitance capable of passing a communication signal flowing from the conductor 12.
- the thickness between each of the first electrode 121 and the second electrode 122 may be set.
- the functional contactor 100 is described as coupling the conductive elastic portion 110 and the functional element 120 by a conductive adhesive layer or soldering, but is not limited thereto.
- the functional contactor 100 is provided with a mounting pad on the lower surface of the conductive elastic portion, the functional portion is coupled to the lower surface of the mounting pad.
- the functional unit includes the dielectric and the external electrode.
- the mounting pad is provided to directly bond the conductive elastic portion to the pad of the circuit board by soldering, and may be a copper plate or a plate coated with stainless steel (SUS) and chromium.
- SUS stainless steel
- the mounting pad of the conductive elastic portion corresponds to the second electrode 122 of the functional element 120 in FIGS. 3 and 4, and the external electrode is the first electrode 121 of the functional element 120. Corresponds to.
- the conductive elastic portion and the functional portion may be coupled through an insulating adhesive layer. That is, the mounting pad of the conductive elastic portion may be laminated on the dielectric of the functional element through the insulating adhesive layer.
- the functional contactors 200 and 200 ′ are cases in which the conductive elastic portion is a clip-shaped conductor 210, and the clip-shaped conductor 210 has a contact portion 211 and a bent portion 212. ) And a terminal portion 213.
- the contact portion 211 has a curved shape and may be in electrical contact with the conductor 12 as shown in FIG. 2. Such contact may be any one of point contact, line contact, and surface contact.
- the bent portion 212 extends from the contact portion 211 and may have an elastic force.
- the terminal unit 213 may include a terminal electrically connected to the functional device.
- the contact portion 211, the bent portion 212, and the terminal portion 213 may be integrally formed of a conductive material having elastic force.
- the functional device 120 may have a first electrode 121 and a second electrode 122 formed on a bottom surface and a top surface, respectively.
- the conductive adhesive layer 111 may be coated on the second electrode 122 on the upper surface of the functional element 120, and the conductor 210 having a clip shape may be formed through the conductive adhesive layer 111.
- the conductive device gasket 110 may be stacked by soldering the functional device 120.
- the functional element 120 may be provided with a groove portion 1202 on the upper surface, as shown in FIGS.
- the functional element 120 may be provided with a second electrode 122 on the bottom surface of the groove portion 1202.
- the clip-shaped conductor 210 may be inserted and stacked in the groove 1202 through the conductive adhesive layer or the solder 111.
- the groove portion 1202 can serve as a side stopper, thereby replacing the side stopper installed in the clip-shaped conductor 210, it is possible to reduce the manufacturing cost.
- a clip-shaped conductor 210 may be inserted into the groove 1202 to prevent twisting or bending after joining, and in particular, to prevent falling or deviating from the post- SMD reflow process.
- the functional contactors 300 and 300 ′ are cases in which the conductive elastic portions are silicon rubber pads 310, and the silicone rubber pads 310 form the body 311 and the conductive wires 312. Include.
- the body 311 may be made of silicone rubber, the upper portion of which may be in surface contact with a conductor 12 such as an antenna or a metal housing, and the lower portion thereof may be electrically connected to the functional element 120.
- the conductive wire 312 may be vertically formed in the body 311. This conductive wire 312 is intended to enhance the electrical contact with the conductor 12 (see FIG. 1) while at the same time complementing the elastic force of the body 311.
- the conductive wire 312 when the conductive wire 312 is pressed by the conductor 12, the upper end thereof is bent downward, and when the conductor 12 is removed, the conductive wire 312 is restored to its original vertical state, thereby It can supplement the elastic force.
- the functional contactor is a case in which the conductive elastic portion is a silicone rubber pad 320 having a different shape, and the silicone rubber pad 320 includes a body 321 and a conductive wire 322.
- the body 321 may be made of silicone rubber, the upper portion of which may be in surface contact with a conductor 12 (see FIG. 1), such as an antenna or a metal housing, and the lower portion thereof may be electrically connected to the functional element 120.
- the conductive wire 322 may be formed diagonally in the body 321.
- the conductive wire 322 is to improve the electrical contact with the conductor 12 and to compensate for the elastic force of the body 321.
- the conductive wire 312 when the conductive wire 312 is pressed by the conductor 12, the top thereof is inclined left and right, and when the conductor 12 is removed, the conductive wire 312 is restored to its original vertical state, thereby It can supplement the elastic force. At this time, when the conductive wire 312 is inclined by the pressing force of the conductor 12, the contact with the conductor 12 is excellent, and therefore, the conductivity of the communication signal may be improved.
- the conductive wire 322 has superior conductivity of the communication signal, good elastic restoring force, and long-term use, as compared with the vertically formed conductive wire 312 of FIG. 9 bent downward by the pressing force of the conductor 12. Can be.
- the functional contactor is a case where the conductive elastic portion is the silicone rubber pad 330, and the silicone rubber pad 330 includes a body 331, a conductive layer 332, and a contact portion 333. do.
- the body 331 may be made of silicone rubber, and a lower portion thereof may be electrically connected to the functional element 120.
- the conductive layer 332 may be horizontally cross laminated in the interior of the body 331 and may be a plurality of layers made of a curable Ag paste. The conductive layer 332 improves electrical contact with the conductor 12 and at the same time complements the elastic force of the body 331.
- the conductive layer 332 when the conductive layer 332 is pressed by the conductor 12, it is pressed downward near the center portion thereof, and when the conductor 12 is removed, the conductive layer 332 is restored to its original horizontal state, whereby the body 331 The elastic force of the can be compensated. Therefore, the conductive layer 332 has elastic resilience as compared with the vertically formed conductive wire 312 of FIG. 9 bent downward by the pressing force of the conductor 12 or the diagonally formed conductive wire 322 of FIG. 11 inclined left and right. It can be excellent and prolonged use.
- the contact part 333 may be formed in a curved protrusion shape on the upper side of the body 332. These contacts 333 may increase the contact area with the conductors 12 by contacting the conductors 12, such as an antenna or metal housing, with multiple wires or surfaces. Therefore, the silicon rubber pad 330 may improve the conductivity of the communication signal.
- the conductive elastic part is a silicone rubber pad 410 including conductive particles
- the silicone rubber pad 410 includes a body 412, a conductive part 414, and a contact part 416. ).
- the body 412 may be made of non-conductive silicone rubber, and may be provided with a through hole 413 vertically penetrating through a plurality of positions therein. In this case, the body 412 may be in contact with the conductor 12 through the contact portion 416 formed on one side thereof, and may be electrically connected to the functional device 120 through the contact portion 416 formed on the other side thereof. have.
- the conductive portion 414 may be made of conductive silicone rubber and conductive particles.
- the conductive part 414 may be formed by filling conductive silicon rubber and conductive particles together in the plurality of through holes 413.
- the conductive silicone rubber has a function of fixing the position of the conductive particles in the through hole 413, the conductive particles may be arranged regularly or irregularly distributed in the conductive silicone rubber.
- the conductive particles are not energized apart from each other when no pressure or heat is applied from the outside, and may be in contact with each other by the contraction of the conductive silicone rubber when the pressure or heat is applied from the outside. .
- the conductive part 414 may realize electrical contact with the conductor 12 by conductive particles, and may be contracted and expanded by conductive silicone rubber. Accordingly, the conductive portion 414 may simultaneously provide electrical contact force and elastic restoring force due to pressure.
- the conductive part 414 has superior elastic restoring force as compared to the conductive wires 312 and 322 or the conductive layer 332 of FIGS. 9 to 12, and in particular, is made of the same or similar material as the body 412. Can be reduced and thus prolonged use is possible.
- the contact part 416 may be formed in a curved protrusion shape on both sides of the conductive part 414.
- the contact portion 416 may increase the contact area with the conductor 12 by contacting the conductor 12 with a plurality of lines or surfaces. Accordingly, the silicon rubber pad 410 may improve conductivity of leakage current, static electricity, or a communication signal.
- the conductive pad 15 of the circuit board 14 may function as the other electrode.
- the functional contactors 400 and 400 ' include a conductive elastic portion 110 and a functional portion 120'.
- the functional unit 120 ′ includes only one internal electrode 122, and the functional unit 120 ′ is mounted on the conductive pad 15 of the circuit board 14 to form the conductive pad ( 15 functions as another electrode of the functional portion 120 '.
- a capacitor may be formed between the internal electrode 122 of the functional unit 120 'and the conductive pad 15.
- the functional unit 120 ′ may be coupled to the conductive pad 15 through an insulating adhesive layer.
- This configuration eliminates the need to separately configure the electrodes of the functional elements and the conductive pads on the circuit board, thereby eliminating overlapping components when mounting the circuit board to use the conductive pattern of the circuit board as another electrode, thereby reducing manufacturing costs. It is possible to reduce and save resources for manufacturing functional elements.
- the functional unit 120 ′ includes an internal electrode 122 and a dielectric 124.
- the functional unit 120 ′ is mounted on the conductive pad 15 of the circuit board 14, wherein the internal electrode 122 and the conductive pad 15 are connected to the functional element 120 ′ by the functional unit 120 ′. Electrode Can be achieved. That is, a capacitor may be formed between the internal electrode 122 of the functional unit 120 ′ and the conductive pad 15.
- the capacitor formed by the functional unit 120 ′ and the conductive pad 15 may prevent damage to a user or damage to an internal circuit such as an electric shock through a conductor, such as a metal case.
- the capacitor may block leakage current of external power flowing from the ground of the circuit board of the electronic device, and may pass a communication signal flowing from the conductor 12.
- the internal electrode 122 is disposed above the functional unit 120 ′ and electrically connected to the lower side of the conductive elastic unit 110.
- the conductive adhesive layer 111 may be coated on the internal electrode 122 on the upper surface of the functional unit 120 ′, and the conductive gasket 110 may be laminated through the conductive adhesive layer 111.
- the functional unit 120 ′ may have a conductive gasket 110 laminated through soldering.
- the functional unit 120 ′ may be provided with a groove 1202 on an upper surface thereof.
- the functional unit 120 ′ may be provided with an internal electrode 122 on the bottom surface of the groove 1202.
- the conductive gasket 110 may be inserted and stacked in the groove 1202 through the conductive adhesive layer 111 or the solder.
- the dielectric 124 is formed under the internal electrode 122 and is mounted on the conductive pad 15 of the circuit board 14. In this case, the dielectric 123 may be mounted and coupled on the conductive pad 15 through an insulating adhesive. This dielectric 124 may be made of a ceramic material.
- the internal voltage between the internal electrode 122 of the functional unit 120 'and the conductive pad 15 of the circuit board 14 is greater than the rated voltage of the external power source of the electronic device, and the conductor 12
- the dielectric constant and thickness of the dielectric 124 and the area of the internal electrode 122 and the conductive pad 15 may be set to form a capacitance through which a communication signal flowing from the same may be passed.
- the functional contactor 400 has been described as coupling the conductive elastic portion 110 and the functional portion 120 'by a conductive adhesive layer or soldering, but is not limited thereto.
- the functional contactor 400 is provided with a mounting pad on the lower surface of the conductive elastic portion, the functional portion is coupled to the lower surface of the mounting pad.
- the functional unit includes only the dielectric.
- the mounting pad is provided to directly bond the conductive elastic portion to the pad of the circuit board by soldering, and may be a copper plate or a plate coated with stainless steel (SUS) and chromium.
- SUS stainless steel
- the mounting pad of the conductive elastic part corresponds to the internal electrode 122 of the functional part 120 ′ in FIGS. 16 and 17.
- the conductive elastic portion and the functional portion may be coupled through an insulating adhesive layer. That is, the mounting pad of the conductive elastic portion may be laminated on the dielectric of the functional portion through the insulating adhesive layer.
- the functional circuit component 10 includes a functional contactor 500, a first conductive bonding member 140, and a substrate 150. .
- the functional contactor 500 may electrically connect an external conductor such as a metal case and an internal conductor such as the conductive bracket or the shield can.
- Can connect In this case, the conductive bracket may be made of a conductive material, for example, may be made of magnesium (Mg).
- the functional contactor 500 includes a conductive elastic portion 110, a functional element 120 ′′ and a second conductive bonding member 130.
- the functional element 120 ′′ is electrically connected in series with the conductive elastic portion 110, and has a large area of the first electrode 121, the second electrode 122, and the body 120a to increase the capacitance of the capacitance. It includes.
- the first electrode 121 is electrically connected to the substrate 150 of the electronic device through the first conductive bonding member 140.
- the first electrode 121 may be mounted on the substrate 150 by an SMT soldering process.
- first electrode 121 may be coupled to an internal conductor such as a bracket or a shield can or an external conductor such as a metal case through the first conductive bonding member 140.
- the second electrode 122 is electrically connected to the conductive elastic portion 110 through the second conductive bonding member 130.
- the second electrode 122 may contact the conductive elastic portion 110 by an SMT soldering process.
- the body 120a may be formed between the first electrode 121 and the second electrode 122.
- the body 120a may be formed of a ceramic material or a varistor material. Additionally, the body 120a may be provided with an internal electrode.
- the functional device 120 ′′ may have the same function, internal structure, and shape as the functional device described with reference to FIGS. 1 to 4 and 15 to 17.
- the functional device 120 ′′ may block a leakage current of external power flowing into the conductor from the ground of the substrate 150.
- the functional device 120 ′′ may break the breakdown voltage Vbr.
- the internal voltage may be configured to be greater than the rated voltage of the external power source of the electronic device.
- the rated voltage may be a standard rated voltage for each country, and for example, may be any one of 240V, 110V, 220V, 120V, and 100V.
- the functional element 120 ′′ when the conductor has an antenna function, the functional element 120 ′′ also functions as a capacitor because the first electrode 121 and the second electrode 122 disposed at regular intervals on the body 120a. It can block leakage current of external power and pass communication signal from conductor.
- the functional device 120 ′′ may pass static electricity (ESD) flowing from the conductor without breaking the insulation.
- ESD static electricity
- the functional device 120 ′′ has a breakdown voltage Vbr of the body 120 a. It may be configured to be smaller than the breakdown voltage (Vcp) of).
- the functional contactor 500 electrically connects and passes the conductor and the substrate 150 with respect to a communication signal, an electrostatic discharge (ESD), etc., but leakage current of an external power source from the substrate 150 is caused by the conductor. You can block it from passing through.
- ESD electrostatic discharge
- the second conductive bonding member 130 is interposed between the conductive elastic portion 110 and the second electrode 122 or between the conductive elastic portion 110 and the functional element 120 ′′ to be electrically connected thereto.
- the second conductive bonding member 130 may be bonded to the conductive elastic portion 110 by a soldering process.
- the soldering process is typically a process of mounting a component on a circuit board or the like to apply a high temperature heat source to electrically connect the circuit board and the component, melting the bonding member to stably bond the component to the substrate, or using a different process.
- Heterogeneous components that perform a function can be integrated into one component.
- components integrated through soldering are mounted through a soldering process on a circuit board or the like, wherein heat and / or pressure applied to the integrated components melt and solidify a joining member interposed between the component and the substrate to form an integrated component. To be bonded to the substrate.
- the heat and / or pressure exerted on an integrated part does not only affect the joint member interposed between the part and the substrate but also affects another joint member interposed to integrate the component, thereby There is a fear that the connection reliability can be significantly reduced.
- the soldering process may include the conductive elastic portion ( After the 110 and the functional element 120 ′′ are bonded by primary soldering, the functional element 120 ′′ in which the conductive elastic portion 110 is stacked is bonded to the substrate 150 by secondary soldering. At this time, the junction of the contactor and the functional element is melted by the heat generated in the secondary soldering, so that the adhesion and reliability of the functional contactor 500 may be degraded, and electrical defects may occur.
- the functional contactor 500 can solve the above problems by including the first conductive bonding member 140 and the second conductive bonding member 130 which will be described later as the bonding member of the soldering process.
- the melting point of the second conductive bonding member 130 is set higher than the melting point of the first conductive bonding member 140.
- the second conductive bonding member 130 is composed of one or two or more laminates of Ti, Cr, Pt, Ni, Au, In, Sn, Ag, Pb, Sn, Bi, Sb, Cd, Cu, or two or more alloys. It may include. More preferably, it may include Sn and Ag without Pb for the management of harmful substances.
- the second conductive bonding member 130 may have a melting point of 150 ° C to 300 ° C. If the melting point of the second conductive bonding member 130 is less than 150 ° C., the second conductive bonding member may be formed by heat and / or pressure applied in a second soldering process for the first conductive bonding member 140 to be described later. The melted 130 may degrade the adhesion and reliability of the functional contactor 500 and may cause electrical defects. In addition, when the melting point of the second conductive bonding member 130 exceeds 300 ° C., the preheating time may be relatively long, and damage may occur to circuit components of the functional contactor 500 due to a high temperature heat source.
- the second conductive bonding member 130 does not contain Pb according to an embodiment of the present invention, at least 30 °C due to the long preheating time and high preheating temperature compared to the conventional bonding member including SnPb-based Soldering process should proceed at high temperature.
- the bonding member including a SnPb-based soldering section for maintaining a high temperature at least 30 °C higher for a predetermined time unlike the bonding member including a SnPb-based soldering section for maintaining a high temperature at least 30 °C higher for a predetermined time, the second conductive bonding member in the second soldering process for the first conductive bonding member 140 ( There is a fear of thermal damage due to the melting of 130).
- the melting point of the second conductive bonding member 130 may be set higher than 30 °C higher than the melting point of the first conductive bonding member 140, preferably may have a melting point of 245 °C ⁇ 270 °C. .
- the melting point of the second conductive bonding member 130 has a temperature higher than the melting point of the first conductive bonding member 140 to be described later. Therefore, the bonding portion of the conductive elastic portion 110 and the functional element 120 ′′ bonded by the second conductive bonding member 130 may be formed of the substrate 150 and the functional element 120 ′′ using the one conductive bonding member 140. In the secondary soldering process of), even if a heat source is applied, reliability can be maintained without melting or deforming, thereby improving electrical contact of the functional contactor 500.
- the first conductive bonding member 140 fixes and electrically connects the functional contactor 500 to the substrate 150.
- the first conductive bonding member 140 may be interposed between the functional contactor 500 and the first electrode 121 so that the first electrode is bonded to the substrate 150.
- the first conductive bonding member 140 is made of one or two or more laminates of Ti, Cr, Pt, Ni, Au, In, Sn, Ag, Pb, Sn, Bi, Sb, Cd, Cu, or two or more alloys. It may include. More preferably, it may include Sn and Ag without Pb for the management of harmful substances.
- the first conductive bonding member 140 may have a melting point of 100 °C ⁇ 240 °C. If the melting point of the first conductive joining member 140 is less than 100 ° C., the material constituting the first conductive joining member 140 may not be melted to join the soldering process, and thus adhesiveness may be lowered. When the melting point of the bonding member 140 exceeds 240 °C preheating time is relatively long, the high temperature heat source may cause damage to the circuit components of the functional contactor 500.
- the second conductive bonding member 130 does not contain Pb according to an embodiment of the present invention, due to the long preheating time and high preheating temperature compared to the conventional bonding member including SnPb-based at least 30 Soldering process should be carried out at high temperature above °C.
- the bonding member including a SnPb-based soldering section for maintaining a high temperature at least 30 °C higher for a predetermined time unlike the bonding member including a SnPb-based soldering section for maintaining a high temperature at least 30 °C higher for a predetermined time, the second conductive bonding member in the second soldering process for the first conductive bonding member 140 ( There is a fear of thermal damage due to the melting of 130).
- the melting point of the first conductive bonding member 140 may be set to 30 ° C or more lower than the melting point of the second conductive bonding member 130, preferably may have a melting point of 215 °C ⁇ 240 °C. .
- the melting point of the second conductive bonding member 130 that joins the functional element 120 ′′ and the conductive elastic portion 110 or the second electrode 122 and the conductive elastic portion 110 is a functional contactor.
- the second conductive bonding member 130 may be set higher than the melting point of the first conductive bonding member 140 for bonding the 500 to the substrate 150 or the first electrode 121 and the substrate 150. It is possible to provide a functional circuit component 10 including a functional contactor 500 in which a junction part is melted or denatured and reliability is maintained, and electrical properties are improved.
- a second conductive bonding member containing a melting point of 183 DEG C and Sn63Pb37 an alloy containing Sn by 63% by weight and Pb by weight 37% by weight
- a conductive elastic part cooperative connector
- a functional device electrical shock protection device , Amotech Co., Ltd.
- BK-350S reflow soldering device
- a circuit component was prepared in which the first conductive bonding member having a melting point of 199 ° C. and containing Sn 50 Pb 50 was fixed with a functional contactor on a substrate using a reflow soldering device (BK-350S).
- the degree of contamination of the second conductive bonding member was visually checked for the functional contactor fixed to the substrate, and the degree of contamination due to melting of the second conductive bonding member was evaluated. Evaluation Results
- the contamination area caused by the second conductive joining members in Examples and Comparative Examples was evaluated based on a relative value of 0 to 100 based on the contamination area caused by the second conductive joining members in Comparative Example 1. 1 is shown. At this time, the pollution degree of 0 means no bleeding.
- the twisting degree of the conductive elasticity connected to the upper surface of the functional element with respect to the functional contactor fixed to the substrate was visually checked, and the twisting degree of the conductive elastic portion due to the melting of the second conductive bonding member was evaluated.
- Evaluation result The relative angle between 0 and 100 is the relative angle between 0 and 100 due to the melting of the second conductive bonding member in Examples and Comparative Examples based on the twist angle of the conductive elastic portion of the circuit component manufactured in Comparative Example 1. It is evaluated as shown in Table 1 below. In this case, the difference of 0 means that the error is not wrong.
- Examples 1 to 3 and Comparative Example 1 relates to a bonding member containing Pb as a material
- Examples 4 to 6 and Comparative Example 2 relates to a bonding member not containing Pb.
- Second conductive bonding member 130 for electrically connecting the conductive elastic portion 110 and the functional element 120 "compared to Examples 1 to 6 in which the melting point of the second conductive bonding member 130 is set higher than that of the melting point.
- the degree of contamination of the conductive elastic portion 110 and the degree of twisting of the conductive elastic portion 110 are remarkably large, that is, the conductive elastic portion 110 and the functional element 120 ′′ are bonded by primary soldering, and then the conductive elasticity
- the conductive elastic portion 110 and the functional element may be formed by heat and / or pressure generated during secondary soldering in which the functional element 120 ′′ in which the portion 110 is stacked is bonded to the substrate 150 by secondary soldering.
- the second conductive bonding member 130 which electrically connects the 120 "is partially denatured, or It can be melted and twisted.
- the adhesiveness and reliability of the functional contactor 500 are lowered, and the electrical defect is poor. This can happen.
- the melting point difference between the first conductive joining member 140 and the melting point of the second conductive joining member 130 are set to 16 ° C. and 27 ° C., respectively.
- the numerical range of the present invention, the second conductive bonding member It can be seen that the degree of contamination of the 130 and the degree of distortion of the conductive elastic portion 110 are significantly reduced.
- the second conductive joining member 130 when the melting point of the second conductive joining member 130 is set higher than the melting point of the first conductive joining member 140, the second conductive joining member 130 is relatively formed by heat and / or pressure generated in the secondary soldering. It can be seen that the less deformed to, and in particular, when the difference between the melting point of the first conductive joining member 140 and the melting point of the second conductive joining member 130 is greater than 30 °C through the third conductive joining member ( It can be seen that the denaturation of 130) can be minimized.
- the functional contactor as described above may be disposed on the human body contactable conductor 12 and the circuit board 14 in the portable electronic device.
- the functional contactor may be mounted on a mounting pad of the circuit board 14.
- the portable electronic device can prevent damage to the user or damage to the internal circuit through the conductor.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Signal Processing (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
L'invention concerne un contacteur fonctionnel et un dispositif électronique portable le comportant. Un contacteur fonctionnel selon un exemple de mode de réalisation de la présente invention comprend : une partie élastique conductrice possédant de l'élasticité et connectée électriquement à un conducteur d'un dispositif électronique; et un élément fonctionnel comprenant une première électrode montée sur une carte de circuit imprimé du dispositif électronique, une seconde électrode connectée électriquement à la face inférieure de la partie élastique conductrice, et un diélectrique formé entre la première électrode et la seconde électrode.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN201680038605.7A CN107810540B (zh) | 2015-07-01 | 2016-07-01 | 功能性连接器及具有其的便携式电子装置 |
US15/740,825 US10650945B2 (en) | 2015-07-01 | 2016-07-01 | Functional contactor and portable electronic device having same |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
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KR20150094281 | 2015-07-01 | ||
KR10-2015-0094281 | 2015-07-01 | ||
KR1020160017386A KR101939651B1 (ko) | 2015-07-01 | 2016-02-15 | 기능성 컨택터 및 이를 구비한 휴대용 전자장치 |
KR1020160017383A KR101939650B1 (ko) | 2015-07-01 | 2016-02-15 | 기능성 컨택터 및 이를 구비한 휴대용 전자장치 |
KR10-2016-0017383 | 2016-02-15 | ||
KR10-2016-0017386 | 2016-02-15 |
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WO2017003246A1 true WO2017003246A1 (fr) | 2017-01-05 |
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PCT/KR2016/007102 WO2017003246A1 (fr) | 2015-07-01 | 2016-07-01 | Contacteur fonctionnel et dispositif électronique portable le comportant |
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JPH08330027A (ja) * | 1995-05-26 | 1996-12-13 | Nec Corp | 貫通コンデンサ付きコネクタ |
JP2006164600A (ja) * | 2004-12-03 | 2006-06-22 | Canon Inc | コネクタ |
JP2007141533A (ja) * | 2005-11-15 | 2007-06-07 | Polymatech Co Ltd | 弾性コネクタ |
KR20080001363U (ko) * | 2006-11-22 | 2008-05-27 | 리 듀오 인터내셔널 컴퍼니 리미티드 | 개선된 고무 커넥터 |
JP2014529887A (ja) * | 2011-08-15 | 2014-11-13 | エスエムエーソーラー テクノロジー アーゲー | 回路基板のホルダにコンデンサを含む電子デバイス、及び電子デバイスを製造する方法 |
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- 2016-07-01 WO PCT/KR2016/007102 patent/WO2017003246A1/fr active Application Filing
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JPH08330027A (ja) * | 1995-05-26 | 1996-12-13 | Nec Corp | 貫通コンデンサ付きコネクタ |
JP2006164600A (ja) * | 2004-12-03 | 2006-06-22 | Canon Inc | コネクタ |
JP2007141533A (ja) * | 2005-11-15 | 2007-06-07 | Polymatech Co Ltd | 弾性コネクタ |
KR20080001363U (ko) * | 2006-11-22 | 2008-05-27 | 리 듀오 인터내셔널 컴퍼니 리미티드 | 개선된 고무 커넥터 |
JP2014529887A (ja) * | 2011-08-15 | 2014-11-13 | エスエムエーソーラー テクノロジー アーゲー | 回路基板のホルダにコンデンサを含む電子デバイス、及び電子デバイスを製造する方法 |
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