WO2017002421A1 - Lead conductor and power storage device - Google Patents

Lead conductor and power storage device Download PDF

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Publication number
WO2017002421A1
WO2017002421A1 PCT/JP2016/061054 JP2016061054W WO2017002421A1 WO 2017002421 A1 WO2017002421 A1 WO 2017002421A1 JP 2016061054 W JP2016061054 W JP 2016061054W WO 2017002421 A1 WO2017002421 A1 WO 2017002421A1
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WO
WIPO (PCT)
Prior art keywords
lead conductor
mass
resin layer
less
treatment
Prior art date
Application number
PCT/JP2016/061054
Other languages
French (fr)
Japanese (ja)
Inventor
美里 草刈
鉄也 桑原
西川 太一郎
圭太郎 宮澤
木谷 昌幸
Original Assignee
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 住友電気工業株式会社 filed Critical 住友電気工業株式会社
Priority to KR1020177034326A priority Critical patent/KR20180022651A/en
Priority to CN201680030993.4A priority patent/CN107636863B/en
Publication of WO2017002421A1 publication Critical patent/WO2017002421A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/543Terminals
    • H01M50/552Terminals characterised by their shape
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/02Making non-ferrous alloys by melting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/172Arrangements of electric connectors penetrating the casing
    • H01M50/174Arrangements of electric connectors penetrating the casing adapted for the shape of the cells
    • H01M50/178Arrangements of electric connectors penetrating the casing adapted for the shape of the cells for pouch or flexible bag cells
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/06Making non-ferrous alloys with the use of special agents for refining or deoxidising
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G11/00Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/74Terminals, e.g. extensions of current collectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/172Arrangements of electric connectors penetrating the casing
    • H01M50/174Arrangements of electric connectors penetrating the casing adapted for the shape of the cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/183Sealing members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/531Electrode connections inside a battery casing
    • H01M50/534Electrode connections inside a battery casing characterised by the material of the leads or tabs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/543Terminals
    • H01M50/552Terminals characterised by their shape
    • H01M50/553Terminals adapted for prismatic, pouch or rectangular cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/543Terminals
    • H01M50/562Terminals characterised by the material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00Batteries for particular applications
    • H01M2220/10Batteries in stationary systems, e.g. emergency power source in plant
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Definitions

  • the present invention relates to a lead conductor used in a power storage device such as a nonaqueous electrolyte battery, and a power storage device.
  • the present invention relates to a lead conductor that is thin and thin and hardly breaks.
  • Lithium ion secondary batteries are used as power sources for portable electronic / electrical devices such as mobile phones such as smartphones and notebook personal computers, and small electronic / electrical devices (hereinafter sometimes referred to as portable devices).
  • portable devices small electronic / electrical devices
  • a typical lithium-ion secondary battery for use as a power source for portable devices has a configuration in which a battery element is housed in a bag-like container and lead conductors are arranged from the inside to the outside of the container (Patent Document 1). 1 and 2).
  • the lead conductor is mainly made of a metal strip that transfers power between the battery and an external member.
  • pure aluminum is used for the positive lead conductor
  • pure nickel or pure nickel-plated pure copper is used for the negative lead conductor.
  • the above-mentioned bag-shaped container is typically provided with a metal layer. In order to insulate the metal layer from the metal lead conductor, the two are joined via a resin layer. The container is sealed through this resin layer. A lead conductor with resin in which a resin layer is formed on a metal strip is also used.
  • lead conductors used for power storage devices such as lithium ion secondary batteries are not easily broken even if they are thin and narrow.
  • lithium ion secondary batteries and the like used for power supplies of portable devices are required to increase battery capacity (energy density) while being thin and small, and lead conductors are also thicker than before. It is desired to reduce the thickness and the width.
  • lead conductors made of pure metals such as pure aluminum and pure nickel and having a thin and narrow width, for example, a thickness of 0.1 mm or less and a width of 10 mm or less, are assembled in a manufacturing process or in portable devices. There is a risk of breaking.
  • the lead conductor may be bent into a predetermined shape and connected to a member such as a circuit board provided in portable devices.
  • a member such as a circuit board provided in portable devices.
  • the portable device can be stored even when the casing of the portable device is thin or small. If the bending radius is reduced, such as right-angle bending or double folding, the storage capacity of the lead conductor can be further reduced.
  • thin and narrow pure metal lead conductors have a small breaking load, so if they are bent with a small bending radius so that they can be stored in a thin housing, etc., they may break and fall during transport before assembly. There is a possibility of breaking even if an impact such as doing is applied.
  • the lead conductor provided in the power storage device is used for power transfer, it is also desired that the lead conductor is excellent in conductivity.
  • the lead conductor which concerns on 1 aspect of this invention is used for an electric power storage device provided with a positive electrode, a negative electrode, electrolyte solution, and the container which accommodates these.
  • This lead conductor contains 0.1 mass% or more and 1.2 mass% or less of Si, and Mg has a mass ratio of Mg / Si of 0.8 or more and 2.7 or less, and less than 1.5 mass%. It is comprised from the aluminum alloy contained in the range to satisfy
  • the tensile strength of this lead conductor is 100 MPa or more and 220 MPa or less.
  • the conductivity of the lead conductor is 50% IACS or more.
  • a power storage device includes the above lead conductor.
  • the above lead conductors are not easily broken even if they are thin and narrow. In the above power storage device, the lead conductor is not easily broken.
  • FIG. 2 is a cross-sectional view of the nonaqueous electrolyte battery of the embodiment taken along the line (II)-(II) shown in FIG.
  • the inventors of the present invention say that a thin and thin lead conductor is not easily broken by bending or impact if it is made of a metal having a specific composition and the tensile strength and conductivity satisfy a specific range. Obtained knowledge.
  • the present invention is based on the above findings. First, the contents of the embodiment of the present invention will be listed and described.
  • the lead conductor which concerns on 1 aspect of this invention is used for an electric power storage device provided with a positive electrode, a negative electrode, electrolyte solution, and the container which accommodates these.
  • This lead conductor contains 0.1 mass% or more and 1.2 mass% or less of Si, and Mg has a mass ratio of Mg / Si of 0.8 or more and 2.7 or less, and less than 1.5 mass%. It is comprised from the aluminum alloy contained in the range to satisfy.
  • the tensile strength of this lead conductor is 100 MPa or more and 220 MPa or less.
  • the conductivity of the lead conductor is 50% IACS or more.
  • the above lead conductor has a tensile strength that satisfies a specific range, is high in strength but is not too high (not too hard), and is excellent in toughness (for example, elongation at break).
  • Such a lead conductor having high strength and high toughness is thin and thin, for example, with a resistance to bending or impact (for example, 0.1 mm or less) even if the thickness is 0.1 mm or less and the width is 10 mm or less. 2% proof stress), and it is difficult to break even if a predetermined bending is performed or an impact is applied.
  • the lead conductor is not easily broken even when subjected to an impact while being bent into a predetermined shape.
  • the above lead conductor has a specific conductivity and is excellent in conductivity.
  • the strength can be increased by increasing the content of the additive element in the constituent metal of the lead conductor, or by performing sufficient work hardening by plastic working at a high workability.
  • excessive addition of additive elements, excessive strain introduction due to work hardening, and the like cause a decrease in conductivity.
  • Said lead conductor is excellent in electroconductivity, when content of an additive element is adjusted in the range with which the electrical conductivity satisfy
  • non-aqueous electrolyte batteries such as lithium ion secondary batteries used for power sources of portable devices and other power storage devices It can utilize suitably as a structural member.
  • the above lead conductor contains Mg, which is considered to be more easily eluted into the electrolyte than Al, it exists as a compound with Mg (Mg 2 Si) by containing it in a specific range together with Si, thereby storing power. It was found that when assembled in a device, it also has excellent resistance to electrolytes. The presence of a resin layer between the lead conductor and the container of the power storage device is also expected to make it difficult to elute the constituent components of the lead conductor and contribute to improvement in resistance to the electrolytic solution. Also from these points, the lead conductor can be suitably used as a constituent member of a power storage device such as a nonaqueous electrolyte battery.
  • the 0.2% proof stress satisfies a specific range, the proof stress is sufficiently high, and even if it is thin and thin, it is difficult to break.
  • the above-mentioned form is thin and narrow, it is not too thin or too narrow, and is difficult to break. Moreover, since the said form is thin and thin, it can respond to the request
  • the diffusion resistance value is 5 ⁇ 10 5 ⁇ ⁇ cm ⁇ 2 or more.
  • the diffusion resistance value is measured as follows. A sample in which a part of the lead conductor is covered with a predetermined resin is used as a sample, and the formation position of the resin and the counter electrode in the sample are brought into contact with the electrolyte used in the power storage device, and the electrolyte is maintained at 60 ° C. Maintain for 1 week. After one week, the AC impedance spectrum of the sample is measured, and the resistance value of the sample is obtained based on the measured AC impedance spectrum. The obtained resistance value is defined as a diffusion resistance value. In a lead conductor with a resin having a coating resin layer to be described later, the diffusion resistance value may be measured by regarding the coating resin layer as the predetermined resin.
  • the diffusion resistance value is high even if the above-described form is in contact with a high-temperature electrolyte solution for a long time via the predetermined resin, it can be said that the constituent elements of the lead conductor are difficult to elute into the electrolyte solution over time. Therefore, the above-mentioned form is not easily broken even if it is thin and narrow, and is excellent in resistance to the electrolytic solution.
  • the surface treatment part has fine unevenness and excellent adhesion to the resin layer, and the lead conductor and the resin layer are difficult to peel off even if the resin layer formation area in the lead conductor is bent or shocked .
  • the above-described form is not easily broken even if it is thin and thin, and the above-mentioned diffusion resistance value is further enhanced in that the resin layer is in close contact, and the resistance to the electrolytic solution is superior.
  • the aluminum alloy contains 0.005% by mass or more in total of one or more elements selected from Cu, Fe, Cr, Mn, Zn, Ni, Ag, and Zr. The form containing below mass% is mentioned.
  • the elements listed above are contained in a specific range, so that the strength is easily increased and the material is not easily broken.
  • the aluminum alloy contains at least one of Ti of 0.01% by mass to 0.05% by mass and B of 0.001% by mass to 0.008% by mass. A form is mentioned.
  • Both Ti and B have the effect of making the crystal of the aluminum alloy fine during casting.
  • Ti and B are contained in a specific range, so that the constituent metal of the lead conductor can be an aluminum alloy having a fine crystal structure, and the strength becomes higher. Easy to break.
  • the lead conductor includes a coating resin layer bonded to a fixed region of the lead conductor with the container, and the coating resin layer has a multilayer structure made of different resins.
  • the form whose total thickness is 20 micrometers or more and 300 micrometers or less is mentioned.
  • the coating resin layer is interposed between the lead conductor and the container of the power storage device and functions as an insulator. If the coating resin layer has a multilayer structure, it can contain resins of various materials, particularly resins having excellent adhesion. Even if the coating resin layer has a multi-layer structure, a thin lead conductor with a resin can be obtained as long as the thickness thereof is within the specific range described above. Therefore, the said form can ensure insulation with a container and contributes to thickness reduction of an electric power storage device. When this coating resin layer is provided in the surface treatment portion of (5) above, it is preferable because of excellent adhesion to the lead conductor as described above.
  • a power storage device includes the lead conductor according to any one of (1) to (8) above.
  • the lead conductor provided in the above power storage device is thin and thin, the lead conductor is not easily broken when it is bent during the manufacturing process or when it is subjected to an impact by dropping it at any time. Therefore, when the power storage device is used as a power source for portable equipment, it is possible to reduce a decrease in yield due to breakage of the lead conductor or to maintain the lead conductor having excellent conductivity for a long period of time. , Can exchange power with the outside.
  • the lead conductor 1 (FIGS. 1 and 2) of the embodiment is a conductive member used in a power storage device (nonaqueous electrolyte battery 10 in FIG. 1), and includes a positive electrode 14 and a negative electrode 15 (see FIG. 1) housed in a container 11. 2) and an external member (not shown) are electrically connected to be used for power transfer.
  • the lead conductor 1 is typically a rectangular metal strip, and is used in a state where the resin layer is in contact with, preferably in close contact with, at least a fixed region of the surface with the container 11.
  • the resin layer is at least one of a coating resin layer 22 described later, an inner resin layer 112 (FIG. 2) provided in the container 11 itself, and a bonding resin layer (not shown) separately bonded between the lead conductor 1 and the container 11. (Hereinafter, simply referred to as a resin layer).
  • the lead conductor 1 is made of an aluminum alloy having a specific composition containing Mg and Si in a specific range.
  • the composition of this aluminum alloy will be described first, and then the characteristics and structure of the lead conductor 1 will be described.
  • the aluminum alloy constituting the lead conductor 1 of the embodiment contains 0.1% by mass or more and 1.2% by mass or less of Si, and Mg contains Mg / Si in a mass ratio of 0.8 or more and 2.7.
  • An Al—Mg—Si based alloy that is contained in a range satisfying less than 1.5% by mass below, the balance being Al (aluminum) and inevitable impurities.
  • the lower limit of the Mg content is 0.08% by mass or more.
  • the aluminum alloy which comprises the lead conductor 1 of embodiment contains Si and Mg in the above-mentioned specific range, and is selected from Cu, Fe, Cr, Mn, Zn, Ni, Ag, and Zr.
  • Al—Mg—Si based alloy containing a total of 0.005 mass% or more and 1 mass% or less of elements (hereinafter sometimes referred to as specific elements), with the balance being Al and inevitable impurities.
  • specific elements elements
  • the element content indicates mass%.
  • Al—Mg—Si alloy containing 0.1% or more of Si and 0.08% or more of Mg has high tensile strength and 0.2% yield strength, and is excellent in strength and yield strength.
  • Such an Al—Mg—Si-based alloy can be expected to further improve the strength and yield strength by age hardening when it is subjected to an aging treatment in the production process.
  • Such an Al—Mg—Si based alloy may improve in strength over time due to natural aging.
  • Such a high-strength Al—Mg—Si-based alloy can maintain high strength even when, for example, softening is performed after plastic working to increase toughness or conductivity. In this case, it can have high strength, high toughness, and high conductivity. Even if the lead conductor 1 made of such an Al—Mg—Si alloy is thin and thin, it is difficult to break when subjected to predetermined bending or impact.
  • Such an Al—Mg—Si alloy tends to have higher strength as the Mg and Si contents are higher.
  • such an Al—Mg—Si-based alloy has a Si content of 0.2% or more, further 0.3% or more, 0.35% or more, a Mg content of 0.1% or more, 0% .2% or more, and further 0.3% or more.
  • the Si content is 0.9% or less, further 0.8% or less, 0.7% or less, and the Mg content is 1.4% or less, 1.2% or less, and further 1.0% or less. can do.
  • Such an Al—Mg—Si based alloy has a mass ratio of Mg to Si of Mg / Si, and since this Mg / Si is 0.8 or more, there are many metal components and the conductivity tends to be high.
  • the lower limit of Mg / Si can be 0.9 or more, further 0.95 or more, and 1 or more. Since Mg / Si is 2.7 or less, precipitates containing Mg and Si can be appropriately present and the strength tends to increase.
  • the upper limit of Mg / Si can be 2.6 or less, further 2.5 or less, or 2.0 or less.
  • Mg alone is easier to elute into the electrolyte than Al.
  • the Al—Mg—Si based alloy contains Mg, it contains Mg in a specific range with respect to Si and less than 1.5%, so that Mg is a compound with Si (Mg 2 Si ). Since Mg 2 Si is difficult to pass electricity, it is considered that short circuiting caused by elution of Mg can be prevented.
  • the inventors of the present invention configured a two-electrode electrochemical cell of a working electrode made of aluminum alloy or pure aluminum having various compositions and a counter electrode made of platinum, and both electrodes were immersed in an electrolyte solution to obtain a predetermined voltage. The amount of current that flows when sapphire was measured was measured.
  • the lead conductor 1 of the embodiment defines the Si content, the Mg content, and Mg / Si.
  • the aluminum alloy constituting the lead conductor 1 of the embodiment is likely to have high strength when it contains the above-mentioned specific element in a specific range in addition to Mg and Si.
  • Cu has little decrease in conductivity and can improve strength.
  • Fe, Cr, Mn, Ni, and Zr have a large decrease in conductivity, the effect of improving the strength is high.
  • Zn and Ag have little decrease in electrical conductivity and have a certain degree of strength improvement effect. Either a form containing only one kind of these elements or a form containing two or more kinds can be used.
  • Such an aluminum alloy has high strength and hardly breaks when the total content of the specific elements is 0.005% or more.
  • the greater the total content, the higher the strength, and the lower limit can be 0.01% or more, further 0.05% or more, 0.1% or more.
  • the total content of the specific element is 1% or less, such an aluminum alloy is excellent in conductivity by reducing the decrease in conductivity.
  • the constituent components of the lead conductor 1 are eluted in the electrolytic solution, there is a possibility that the positive electrode 14 and the negative electrode 15 are short-circuited or the characteristics of the power storage device are deteriorated due to the eluted components.
  • the total content is 1% or less, the elution of the constituent components can be sufficiently reduced.
  • the upper limit of the total content can be 0.9% or less, further 0.8% or less, or 0.7% or less.
  • Examples of the content of each element include the following. Cu 0.01% to 0.9%, further 0.03% to 0.8% Fe 0.005% to 0.9%, further 0.01% to 0.5% Cr 0.005 % To 0.8%, further 0.01% to 0.7% Mn 0.005% to 0.8%, further 0.01% to 0.7% Zn, Ni, Ag, Zr Total 0.005% or more and 0.2% or less, and in total, 0.005% or more and 0.15% or less
  • the aluminum alloy can easily increase the strength when it contains at least one of Ti and B in a specific range. This is because Ti and B have an effect of making the crystal of the aluminum alloy fine at the time of casting, and the strength is enhanced if it has a fine crystal structure.
  • the form containing B may be sufficient as an aluminum alloy, the refinement
  • crystallization is easier to obtain if it is the form containing Ti, and also the form containing both Ti and B.
  • An aluminum alloy is more likely to obtain a crystal refinement effect as the content of Ti or B is larger, but if it is too much, the electrical conductivity is lowered. Moreover, it is thought that the refinement
  • the fine crystal structure described above can be cited.
  • the average crystal grain size may be 1 ⁇ m or more and 50 ⁇ m or less, 2 ⁇ m or more and 40 ⁇ m or less, and further 30 ⁇ m or less.
  • the lead conductor 1 has such a fine crystal structure, the lead conductor 1 is excellent in strength and is not easily broken even if it is thin and thin, and the electrolyte does not easily penetrate into the lead conductor 1. It is expected that the amount of the constituent component eluted into the electrolytic solution is reduced and the resistance to the electrolytic solution is easily increased.
  • the crystal grain size may be controlled to a predetermined size by adjusting the content of the above-described additive elements, the conditions of plastic working in the manufacturing process, the heat treatment conditions, and the like.
  • the lead conductor 1 of the embodiment is characterized in that the tensile strength is 100 MPa or more and 220 MPa or less. Since the lead conductor 1 has a sufficiently high tensile strength, it is difficult to break even if it is thin and narrow. Since the higher the tensile strength, the better the strength and the more difficult it is to break, the lower limit of the tensile strength can be 110 MPa or more, further 120 MPa or more, 125 MPa or more. Since the lead conductor 1 is not too high in tensile strength, the electrical conductivity is reduced due to strain introduced during plastic working, and the electrical conductivity is excellent, and the toughness such as elongation is also excellent. Therefore, the lead conductor 1 can have a tensile strength of 210 MPa or less, further 200 MPa or less, and 190 MPa or less.
  • the lead conductor 1 of the embodiment has high tensile strength and typically excellent strength, and it is difficult to break even if it is thin and narrow. Specifically, a lead conductor 1 having a 0.2% proof stress satisfying 40 MPa or more can be mentioned. The lead conductor 1 has a tendency that the higher the yield strength, the more difficult it is to break, and the 0.2% yield strength can be set to 45 MPa or more, further 50 MPa or more, 55 MPa or more. When the 0.2% proof stress is too high, the tensile strength tends to be too high, and there is a concern about the above-described decrease in conductivity and toughness. The upper limit of 0.2% proof stress is about 100 MPa or less.
  • the lead conductor 1 of the embodiment is excellent in strength such as tensile strength and proof stress, and is typically excellent in toughness such as elongation, and it is difficult to break even if it is thin and narrow.
  • the lead conductor 1 satisfying a breaking elongation of 5% or more can be mentioned.
  • the lead conductor 1 tends to be more difficult to break as the elongation is higher, and the elongation at break can be 6% or more, further 7% or more, or 8% or more.
  • the upper limit of breaking elongation is about 40% or less.
  • the lead conductor 1 of the embodiment is excellent in strength and toughness, and is also excellent in conductivity, and has a conductivity satisfying 50% IACS or more.
  • the lead conductor 1 preferably has higher electrical conductivity, and the electrical conductivity can be 51% IACS or higher, further 52% IACS or higher, or 53% IACS or higher.
  • the size (thickness, width, length) of the lead conductor 1 of the embodiment can be selected as appropriate.
  • the lead conductor 1 having a small thickness and a narrow width can be suitably used as a constituent member of a power storage device for which a reduction in thickness and size is desired.
  • Examples of the thin and narrow lead conductor 1 include those having a thickness of 0.03 mm to 0.1 mm and a width of 1 mm to 10 mm.
  • the length of the lead conductor 1 may be adjusted by appropriately cutting before assembling to the power storage device.
  • the thickness is 0.03 mm or more, it is difficult to break even if the width is as thin as about 1 mm.
  • the thickness can be 0.035 mm or more, and further 0.04 mm or more. If thickness is 0.1 mm or less, it can contribute to thickness reduction and size reduction of an electric power storage device.
  • the thickness can be 0.08 mm or less, further 0.07 mm or less, and 0.05 mm or less.
  • the lead conductor 1 can have a width of 2 mm or more, and further 3 mm or more. If the width
  • the lead conductor 1 can have a width of 9 mm or less, further 8 mm or less, or 7 mm or less.
  • the lead conductor 1 of the embodiment is also excellent in resistance to the electrolyte solution, and the constituent components of the lead conductor 1 are difficult to elute into the electrolyte solution.
  • the lead conductor 1 has a higher diffusion resistance value, so that the amount of the above constituent components eluted into the electrolyte solution is smaller and the resistance to the electrolyte solution is better, and the diffusion resistance value is 6 ⁇ 10 5 ⁇ ⁇ cm ⁇ 2 or more, Furthermore, it is preferable to satisfy 7 ⁇ 10 5 ⁇ ⁇ cm ⁇ 2 or more and 7.5 ⁇ 10 5 ⁇ ⁇ cm ⁇ 2 or more. In order to increase the diffusion resistance value, it is preferable to provide a specific surface treatment section described later in the contact area with the resin layer.
  • the lead conductor 1 of embodiment is provided with the surface treatment part by which the below-mentioned surface treatment was given to the fixed area
  • region with the container 11 at least on the surface of at least one part of the surface Preferably both surfaces of a front and back, a resin layer Adhesion can be improved.
  • the contact area of the lead conductor 1 with the electrolytic solution in the container 11 in the lead conductor 1 is reduced due to the closely adhered resin layer, and the components of the lead conductor 1 can be reduced from being eluted into the electrolytic solution.
  • a lead conductor 1 has a high diffusion resistance value.
  • the sealed state of the container 11 of the power storage device can be maintained satisfactorily, leakage of the electrolyte solution to the outside of the container 11, and intrusion of moisture from the outside into the container 11 Can be prevented.
  • Form in which the surface treatment part is provided only in the fixed region with the container 11 on the surface of the lead conductor 1 (form in which surface treatment is performed only in the fixed area), and form in which the surface treatment part is provided on the entire front and back surfaces of the lead conductor 1
  • Surface treatment is applied to the end surface / side surface connecting the back surface
  • the surface treatment portion is provided on the entire outer surface of the lead conductor 1 (surface treatment is applied to all of the end surface / side surface connecting the front and back surfaces and the front and back surfaces.
  • Examples of the surface treatment include chemical conversion treatment, boehmite treatment, alumite treatment, etching, blast treatment, and brush polishing.
  • As the conditions for each treatment known conditions that have been applied to conventional lead conductors can be used.
  • the lead conductor 1 when the lead conductor 1 includes a surface treatment portion to which one type selected from chemical conversion treatment, boehmite treatment, alumite treatment, and etching is provided, the lead conductor 1 is more excellent in adhesion to the resin layer, depending on the treatment conditions. It tends to be the lead conductor 1.
  • the lead conductor 1 includes a surface treatment portion subjected to chemical conversion or etching, the lead conductor 1 is further excellent in adhesion to the resin layer. By being superior in the adhesion between the lead conductor 1 and the resin layer, it is possible to reduce the elution amount of the constituent components, increase the diffusion resistance value, maintain a good sealing state, and the like.
  • the surface roughness of this surface treatment part 0.1 micrometer or more and 0.5 micrometer or less are mentioned by arithmetic mean roughness Ra, for example.
  • Covering resin layer As an example of the lead conductor 1 of the embodiment, a coating bonded to a fixed region between the main body of the lead conductor 1 made of an aluminum alloy having the above-described specific composition and the container 11 in the main body of the lead conductor 1 A lead conductor with resin 20 including the resin layer 22 is exemplified.
  • the covering resin layer 22 functions as an insulator between the main body of the lead conductor 1 and the metal layer 110 when the container 11 of the power storage device includes the metal layer 110.
  • known manufacturing conditions for lead conductors with resin can be used for the coating resin layer 22.
  • thermoplastic polyolefin A typical example of the constituent material of the coating resin layer 22 is thermoplastic polyolefin. Specifically, polyethylene, acid-modified polyethylene, polypropylene, ethylene vinyl acetate copolymer, acid-modified polypropylene (for example, maleic anhydride-modified polypropylene), ionic polymers such as ionomer, maleic acid-modified polyolefin (for example, maleic acid-modified polyolefin) Low density polyethylene), or mixtures thereof.
  • ionomer examples include those obtained by crosslinking a copolymer such as ethylene and methacrylic acid with a metal ion such as Na, Mg, K, Ca, or Zr, a metal complex, or a cation such as an ammonium salt.
  • a metal ion such as Na, Mg, K, Ca, or Zr
  • a metal complex such as an ammonium salt.
  • the covering resin layer 22 can be a single layer structure or a multilayer structure made of resins having different components and cross-linked states.
  • the coating resin layer 22 having a multilayer structure include a two-layer structure including an adhesive layer and a surface layer.
  • the adhesive layer includes the above-described thermoplastic polyolefin
  • the surface layer includes the above-described thermoplastic polyolefin cross-linked (for example, the same resin as the constituent resin of the adhesive layer and cross-linked).
  • both the adhesion between the main body of the lead conductor 1 and the coating resin layer 22 and the adhesion between the container 11 and the coating resin layer 22 can be selected by selecting a component, a crosslinked state, and the like. Can be enhanced. As a result, even if the portion having the coating resin layer 22 in the lead conductor 20 with resin is bent or subjected to an impact, the container 11 and the coating resin layer 22 are disposed between the main body of the lead conductor 1 and the coating resin layer 22. The covering resin layer 22 is difficult to peel off.
  • the power storage device including such a lead conductor 20 with resin can reduce the amount of elution into the electrolyte in the constituent components of the main body of the lead conductor 1 by the coating resin layer 22 that is in close contact with the main body of the lead conductor 1.
  • the sealed state of the container 11 can be maintained satisfactorily.
  • the surface treatment portion includes the coating resin layer 22 because the adhesion of the coating resin layer 22 is more excellent.
  • the coating resin layer 22 is thick to some extent, the coating resin layer 22 is not easily damaged when the lead conductor 20 with resin is bent or subjected to an impact, and conversely, the coating resin layer 22 is not too thick. Thus, the lead conductor 20 with resin can be thinned.
  • the thickness of the coating resin layer 22 is, for example, 20 ⁇ m or more and 300 ⁇ m or less, and can be 30 ⁇ m or more and 290 ⁇ m or less, 40 ⁇ m or more and 280 ⁇ m or less, and 50 ⁇ m or more and 200 ⁇ m or less.
  • This thickness is the thickness of the coating resin layer 22 provided on one surface of the main body of the lead conductor 1 when the coating resin layers 22 are provided on the front and back surfaces of the main body of the lead conductor 1, respectively. If the layer 22 has a multilayer structure, the total thickness is taken.
  • the lead conductor 1 of embodiment and the lead conductor 20 with resin can be utilized for any of the positive electrode of a power storage device, and a negative electrode, it is suitable for the lead conductor for positive electrodes.
  • the lead conductor 1 having the above-mentioned specific composition and having high strength and excellent conductivity, and the lead conductor 1 also excellent in elongation are prepared by preparing an aluminum alloy having a specific composition, and plasticity such as rolling. Manufactured by processing and heat treatment. Examples of the material used for plastic working include a continuous cast material, a billet cast material, and an extruded material obtained by extruding a continuous cast rolled material.
  • the heat treatment includes softening treatment, and plastic processing can be performed before and after the softening treatment.
  • Examples of the lead conductor 1 include soft materials and 1 ⁇ 2 hard materials.
  • the 1 ⁇ 2 hard material can be manufactured by performing plastic processing to some extent after the softening treatment, or by performing a softening treatment to such an extent that the strength does not decrease too much after the plastic working. At least the heat treatment conditions and the degree of plastic working are adjusted so that the tensile strength and the electrical conductivity satisfy the specific ranges described above.
  • the lead conductor 20 with a resin including the coating resin layer 22 is preferably manufactured by, for example, the following manufacturing method (A) or (B) because the adhesiveness of the coating resin layer 22 is excellent.
  • the details of the surface treatment refer to the section of the surface treatment section described above.
  • the details of the coating resin layer 22 may be referred to the section of the coating resin layer 22 described above.
  • Aging treatment can be performed at any time before softening treatment.
  • the solution treatment can be performed at any time before the aging treatment.
  • continuous casting the solution treatment can be omitted.
  • a compound containing Mg and Si is precipitated by aging treatment, and the strength is improved by dispersion strengthening by the precipitates and the electrical conductivity is improved by reducing the solid solution amount of Mg and Si in Al. Can do.
  • the cast plate of (A) is a continuous cast material, it has the advantages that it is easy to refine crystals by rapid cooling, a long material is obtained, and a supersaturated solid solution is easily obtained by rapid cooling.
  • the continuous cast rolled material (B) By subjecting the continuous cast rolled material (B) to conform extrusion, an extruded plate having a desired shape and size can be easily formed, and an extruded plate having a fine crystal structure can be obtained. Since the material used for rolling has a fine structure, it is excellent in plastic workability and can be rolled well.
  • Hot rolling or cold rolling is performed by adjusting the rolling reduction so as to obtain a rolled sheet having a desired thickness (which may be the thickness of the lead conductor 1).
  • a desired thickness which may be the thickness of the lead conductor 1.
  • the crystal can be made finer, and even when heat treatment is performed at an appropriate time, the lead conductor 1 having a fine crystal structure can be easily obtained.
  • Intermediate heat treatment can be performed during rolling. When the intermediate heat treatment is performed, the plastic workability can be improved.
  • Heat treatment such as softening treatment, aging treatment, and solution treatment can be either continuous treatment for long materials or batch treatment in which the materials are sealed in a heating container such as an atmospheric furnace. Can also be used. Examples of the continuous treatment include a direct energization method, an indirect energization method, and a furnace method. Control parameters such as holding temperature, holding time, material supply speed, current value, furnace temperature, and the like are adjusted in accordance with the continuous processing method so that the tensile strength and the electrical conductivity become desired values.
  • Solution treatment Holding temperature 500 ° C. or more and 580 ° C. or less
  • Holding time 0.01 hour or more and 10 hours or less
  • Aging treatment Holding temperature 100 ° C. or more and 250 ° C. or less
  • Holding time 2 hours or more and 20 hours or less
  • Softening treatment Holding temperature 250 to 500 ° C., holding time: 0.5 to 6 hours
  • atmosphere of the heat treatment is an atmosphere having a low oxygen content, generation of an oxide film can be suppressed.
  • Specific atmospheres include an air atmosphere and a non-oxidizing atmosphere.
  • the non-oxidizing atmosphere include a reduced pressure atmosphere (vacuum atmosphere), an inert gas atmosphere such as nitrogen and argon, and a reducing gas atmosphere containing hydrogen and carbon dioxide gas.
  • the produced aluminum alloy plate having a predetermined thickness is cut according to a predetermined width of the lead conductor 1 to form a strip.
  • the cross-sectional area of the wide thin plate is large to some extent, so that it is difficult to break and is easy to handle.
  • this wide thin plate is cut into, for example, a width of 10 mm or less to form a narrow strip, the cross-sectional area is reduced.
  • this thin and narrow strip is made of the aluminum alloy having the specific composition described above, and the tensile strength and the electrical conductivity satisfy a specific range, so that the breaking load is large and it is difficult to break.
  • this thin and narrow strip (an example of the lead conductor 1 of the embodiment) is not easily broken and easy to handle in the manufacturing process of the lead conductor 1 itself, and is bent or shocked in the manufacturing process of the power storage device. It is difficult to break even if it is received. If the strip is long, it may be appropriately cut to a predetermined length.
  • the power storage device electrically connects a positive electrode, a negative electrode, an electrolyte, a container that stores these, a positive electrode and an external member, and a negative electrode and an external member.
  • One lead conductor In the power storage device of the embodiment, one or two of the two lead conductors are the lead conductor 1 of the above-described embodiment (there may be a lead conductor 20 with resin).
  • Each lead conductor is arranged from the inside to the outside of the container, and a positive electrode or a negative electrode is connected to one end side, and an external member such as a circuit board is connected to the other end side by soldering or the like.
  • a fixing area with the container is provided.
  • a resin layer (at least one of the above-described coating resin layer 22, inner resin layer 112, and bonding resin layer) is interposed between the lead conductor fixing region and the container.
  • the power storage device of the embodiment include a non-aqueous electrolyte battery using a non-aqueous electrolyte, an electric double layer capacitor, and an aqueous electrolyte battery using water as a main solvent of the electrolyte.
  • Known techniques can be applied to the basic configuration of the nonaqueous electrolyte battery, the electric double layer capacitor, the aqueous electrolyte battery, the material of each component, and the like.
  • the nonaqueous electrolyte battery 10 includes a positive electrode 14, a negative electrode 15, a separator 13 impregnated with an electrolytic solution (here, a nonaqueous electrolytic solution), a bag-like container 11 that houses these battery elements, and a container 11. And two lead conductors 20 with resin fixed to each other.
  • At least one of the lead conductors 20 with resin includes a main body of the lead conductor 1 made of an aluminum alloy having the specific composition described above, and a coating resin layer 22 bonded to the front and back surfaces of the main body of the lead conductor 1.
  • the negative electrode lead conductor for example, one made of pure nickel, pure copper, pure nickel-plated pure copper, or the like can be used.
  • the covering resin layer 22 shown in FIG. 2 has a double structure including an adhesive layer 220 in contact with the main body of the lead conductor 1 and a surface layer 222 in contact with the inner surface of the container 11.
  • the positive electrode 14 and the negative electrode 15 of the nonaqueous electrolyte battery 10 are typically an active material layer composed of a powder molded body containing an active material, etc., and are a current collector 16 and a current collector composed of metal foil. 17 is formed on each.
  • the current collector 16 (or current collector 17) and the main body of the lead conductor 1 are connected by, for example, a lead wire 19 (FIG. 2).
  • a lead wire 19 As the positive electrode and the negative electrode of the electric double layer capacitor, solid activated carbon is exemplified.
  • the container 11 is typically provided with a metal layer and a resin layer.
  • the container 11 of FIG. 2 shows the example comprised from the double-sided multilayer film provided with the inner side resin layer 112, the metal layer 110, and the outer side resin layer 114 in order from the inner side.
  • the container 11 is sealed by heat-sealing the peripheral portion of the double-sided multilayer film, and is formed into a bag shape as shown in FIG.
  • the inner resin layer 112 of the container 11 and the covering resin layer 22 (here, the surface layer 222) of the lead conductor 20 with resin are heat-sealed, thereby providing the lead conductor with resin. 20 is fixed to the container 11 and the container 11 is sealed.
  • the strip material of each sample was manufactured as follows. A raw material having the composition shown in Table 1 (remainder Al and inevitable impurities) is prepared, and an aluminum alloy plate having a thickness of 0.05 mm is manufactured by the following step (I) or (II). Each obtained aluminum alloy plate is cut into a width of 5 mm or a width of 4 mm to obtain a narrow strip.
  • II Billet casting ⁇ Solution treatment ⁇ Cold rolling ⁇ Softening treatment
  • Some samples are subjected to an aging treatment at an appropriate time during the cold rolling.
  • the conditions for the aging treatment are a holding temperature of 180 ° C., a holding time of 16 hours, and “180 ° C. ⁇ 16 H” in Table 1.
  • a softening treatment (final heat treatment in this test) is performed after rolling.
  • Table 1 shows the conditions of the softening treatment (softening temperature, atmosphere). In this test, the softening treatment was performed by batch treatment, and the softening temperature holding time was adjusted mainly using the tensile strength as an index. Sample No. No softening treatment is performed on 1-103.
  • a tensile test (room temperature) was performed using a strip of 5 mm width among the strips of each sample prepared, and tensile strength (MPa), 0.2% proof stress (MPa), and elongation at break (%) were examined. . The results are shown in Table 2. The tensile test is performed based on JIS Z 2241 (2011).
  • the electrical conductivity (IACS%) was examined by a four-terminal method using a strip having a width of 5 mm among the strips of each prepared sample. The results are shown in Table 2.
  • the bending test is performed as follows. As shown in FIG. 3, the sample S (strip) having a distance L between the scores of 30 mm is folded into two (see black arrows). Bending is performed so that the distance C between the ends of the sample S adjacent by folding is equal to twice the thickness of the sample S (0.05 mm in this example). Open the sample S folded in two and return it to its original position (see white arrow). This series of operations of folding and returning is considered as one time, and the number of times until it breaks is examined. It can be said that it is hard to break, so that there are many times.
  • the impact test is performed as follows. As shown in FIG. 4, a weight w is attached to the tip of a sample S having a distance L between the scores of 1 m (the left figure in FIG. 4), and after lifting the weight w upward by 1 m (the middle figure in FIG. 4), free fall (Right figure in FIG. 4). The weight (kg) of the maximum weight w at which the sample S does not break by this operation was measured, and the product value obtained by multiplying the weight by the gravitational acceleration (9.8 m / s 2 ) and the drop distance 1 m was divided by the drop distance. Impact resistance is evaluated by the magnitude of the value (J / m or (N ⁇ m) / m). It can be said that the larger the impact value, the better the impact resistance and the more difficult it is to break.
  • 1-11 is a thin and narrow band material, it can be seen that it is difficult to break when bent or subjected to an impact.
  • Sample No. with too much Mg It can be seen that 1-101 is very low in electrical conductivity (less than 45% IACS) and easily breaks.
  • Sample No. with too little Si 1-102 shows that the tensile strength is too low (here, less than 100 MPa, and further 90 MPa or less), and it tends to break. Sample No. not softened.
  • 1-103 has an excessively high tensile strength (here, more than 220 MPa, and more than 300 MPa), and is easily broken.
  • Sample No. with too few added elements 1-104 shows that the tensile strength is too low (here, less than 100 MPa, and further 90 MPa or less), and it tends to break.
  • sample No. 1-1-No. All of 1-11 are considered to have high tensile strength and excellent elongation in addition to satisfying a specific range of tensile strength.
  • Sample No. 1-1-No. 1-11 has a 0.2% proof stress of 40 MPa or more, further 50 MPa or more, many samples have 60 MPa or more, and elongation at break of 5% or more, further 6% or more.
  • sample No. 1-1-No. It is conceivable that 1-11 has a fine crystal structure, in particular, a sample containing at least one of Ti and B in a specific range has a finer crystal structure. Sample No. 1-1-No.
  • the average crystal grain size is determined by a cutting method in accordance with JIS G 0551 (steel-crystal grain size microscopic test method, 2005).
  • Test Example 2 Sample No. produced in Test Example 1 Using a strip made of an aluminum alloy having a composition of 1-11, a simulated sample of a lead conductor with resin was prepared, and the diffusion resistance value and the bonding strength of the resin were examined.
  • a simulated sample of the lead conductor with resin was prepared as follows. Sample No. shown in Table 1 1-11 aluminum alloy plate (Mg: 0.48 mass%, Si: 0.19 mass%, Ti: 0.02 mass%, B: 0.005 mass%, thickness 0.05 mm) width A thin and narrow strip is prepared by cutting to 10 mm and a length of 45 mm, and the resin is joined after the surface treatment shown in Table 3 or without the surface treatment.
  • the sample subjected to the surface treatment is subjected to the surface treatment on the entire front and back surfaces of the strip (the entire front and back surfaces are the surface treatment portion), and the end surface and side surfaces of the strip are not subjected to the surface treatment.
  • the details of the surface treatment shown in Table 3 are as follows.
  • the chemical conversion treatments I, III, and IV are chemical conversion treatments using commercially available chemical conversion treatment solutions capable of forming ionomers, and the average thickness of chemical film formation is the values shown in Table 3 (10 nm, 30 nm, 300 nm).
  • the immersion time of the chemical conversion treatment solution is adjusted.
  • Chemical conversion treatment II is a chromate treatment using a commercially available treatment solution.
  • the roughening I and II are etching treatments using a commercially available alkaline etching solution, and the etching time is adjusted so that the average pit depth becomes the values shown in Table 3 (1 ⁇ m, 0.5 ⁇ m).
  • Boehmite I and II are boehmite treatments using pure water at 95 ° C., and the treatment times are different as shown in Table 3 (15 minutes, 20 seconds).
  • Alumite I and II are anodized using an aqueous sulfuric acid solution, and the treatment time is adjusted so that the average thickness of the alumite layer is 0.5 ⁇ m.
  • sealing treatment is not performed after anodization, and in anodized II, sealing treatment is performed after anodization.
  • Blasting is a blasting process performed under the conditions shown in Table 3 (shot material: # 120 alumina particles, pressure: 0.3 MPa) using a commercially available pneumatic blasting apparatus.
  • each sample No. 1 subjected to the above surface treatment was used. 2-11-No. 2-18, no. 2-112 ⁇ No. No. 2-114 strip and sample No. No surface treatment.
  • Resin is bonded to the front and back surfaces of the 2-111 strip.
  • a double-structure resin film including an adhesive layer (thickness 25 ⁇ m) made of acid-modified polypropylene and a surface layer obtained by crosslinking acid-modified polypropylene is used as the resin to be joined in each sample.
  • Two resin films are used for each sample so as to sandwich the front and back surfaces of the strip of each sample.
  • the thickness of the surface layer for each resin film used in each sample is adjusted so that the total thickness of the adhesive layer and the surface layer becomes “resin thickness” in Table 3.
  • the band material is sandwiched between two resin films, and the resin film is bonded to the front and back surfaces of the band material by hot pressing.
  • the joining conditions are heating temperature: 260 ° C., pressure: 0.2 MPa, and heating time: 10 seconds.
  • a simulated sample of a lead conductor with resin in which a part of the strip is exposed from the resin is obtained.
  • a region on one edge side where the lead wire is connected in the strip (10 mm in the region on the upper edge side in FIG. 5 ⁇ 10 mm in length) is exposed from the resin film.
  • Each resin film is 25 mm ⁇ length 45 mm.
  • the regions on both sides of the strip are exposed from the resin film (regions on the left and right sides in FIG. 7).
  • Each resin film is 5 mm ⁇ length 60 mm.
  • an electrochemical measurement cell 300 is constructed using a simulated sample SS1 including a strip S1 simulating a main body of a lead conductor and a resin layer S22, a counter electrode 302, and an electrolytic solution 304. After the simulated sample SS1 is immersed in the liquid 304 for a predetermined time, a diffusion resistance value is calculated using an AC impedance spectrum (see also Patent Document 1). The results are shown in Table 3.
  • the counter electrode 302 is a wire rod (diameter 0.5 mm ⁇ length 50 mm) made of pure aluminum containing 99.999% by mass of Al.
  • the electrolytic solution 304 is used as an electrolytic solution for a lithium ion secondary battery.
  • EC ethylene carbonate
  • DMC dimethyl carbonate
  • DEC diethyl carbonate
  • V / V% means volume ratio.
  • lead wires are connected to the simulated sample SS1 and the counter electrode 302, respectively, and both lead wires are further connected to the AC impedance spectrum measuring device 310.
  • Each simulated sample SS1 is immersed in the electrolytic solution 304, and the counter electrode 302 is immersed in the electrolytic solution 304. In this way, the electrochemical measurement cell 300 is constructed.
  • the above-described electrochemical measurement cell 300 is inserted into a thermostatic bath (not shown), the temperature of the electrolytic solution 304 is maintained at 60 ° C., and this immersion state is maintained for one week (1 W, 168 hours). After one week, the AC impedance spectrum of each simulated sample SS1 is measured in the electrolyte solution 304, and the diffusion resistance value is calculated from the measured AC impedance spectrum.
  • the diffusion resistance value (Warburg impedance) is calculated using analysis by simulation using the equivalent circuit shown in FIG. When the diffusion resistance value is W, the equivalent circuit has a charge transfer resistance Rp in series with the diffusion resistance value W, a capacitance C in parallel with the diffusion resistance value W and the charge transfer resistance Rp, and a series connection with the parallel circuit.
  • the electrolyte resistance Rs is calculated using analysis by simulation using the equivalent circuit shown in FIG. When the diffusion resistance value is W, the equivalent circuit has a charge transfer resistance Rp in series with the diffusion resistance value W, a capacitance C in parallel with the diffusion resistance value
  • the measurement conditions for the AC impedance spectrum are: amplitude: 25 mV, measurement frequency range: 100 kHz to 100 mHz.
  • the number of AC impedance spectrum measurement points is 10 points from 100 kHz to 10 kHz, and 60 points in total.
  • Each data of the AC impedance spectrum at each measurement frequency is reproduced by simulation using the above-described equivalent circuit, and each parameter of the equivalent circuit shown in FIG. 6 is estimated.
  • the diffusion resistance value is calculated using the result of this simulation.
  • AC impedance spectrum can be automatically measured and analyzed using commercially available AC impedance spectrum measuring apparatus, AC impedance spectrum measuring software, and analysis software.
  • AC impedance spectrum measuring apparatus AC impedance spectrum measuring software
  • analysis software For example, VersaSTAT4-400 + VersaSTAT LC (Princeton Applied Research) can be used as the measurement device, VersaStudio (Princeton Applied Research) can be used as the measurement software, and Zview (Scribner Associates Inc.) can be used as the analysis software.
  • the electrolytic solution As the electrolytic solution, the same one as used for measuring the diffusion resistance value (electrolytic solution manufactured by Kishida Chemical Co., Ltd.) is used.
  • the simulated sample SS2 is taken out from the electrolyte, and one resin film S22a and the strip S1 are cut as shown in the left diagram of FIG. Then, it is divided into two (divided piece S1s, divided piece S1l, film piece la, film piece sa).
  • the simulated sample SS2 is divided so that the length of the other divided piece S1l is sufficiently longer than the length of the one divided piece S1s.
  • the divided pieces S1l and divided pieces S1s that are divided are joined to the other resin film S22b. As shown in the right figure of FIG. 8, this other resin film S22b is folded back so that the short divided piece S1s is separated from the long divided piece S1l.
  • the long split piece S1l and the short split piece S1s are gripped by a commercially available tensile tester (not shown), and the split pieces S1l and the split pieces S1s are separated from each other as shown by the black arrows in the right diagram of FIG. Pull up and down in the right figure of 8).
  • surface treatment is performed on a band material made of an Al—Mg—Si alloy having a specific composition containing Mg and Si in a specific range, in particular, chemical conversion treatment, boehmite treatment, alumite It can be seen that by performing one type of surface treatment selected from treatment and etching, or adjusting the treatment conditions, an aluminum alloy having excellent adhesion to the resin layer and a large diffusion resistance value can be obtained.
  • sample no. 2-11-No. 2-18 has a diffusion resistance value of 5 ⁇ 10 5 ⁇ / cm 2 or more, and many samples have a value of 10 ⁇ 10 5 ⁇ / cm 2 or more.
  • the present invention is not limited to these exemplifications, but is defined by the scope of the claims, and is intended to include all modifications within the scope and meaning equivalent to the scope of the claims.
  • the composition of the aluminum alloys of Test Examples 1 and 2 the width and thickness of the strip, the surface treatment method, the treatment conditions, the material and thickness of the coating resin layer, and the like can be changed as appropriate.

Abstract

This lead conductor is for use in a power storage device provided with a positive electrode, a negative electrode, an electrolyte solution, and a container for accommodating the positive electrode, the negative electrode, and the electrolyte solution. The lead conductor is configured from an aluminum alloy containing: 0.1-1.2 mass% of Si; and Mg in a range that is less than 1.5 mass% and that results in the mass ratio of Mg/Si being 0.8-2.7. The lead conductor has a tensile strength of 100-220 MPa and a conductivity of 50% IACS or more.

Description

リード導体、及び電力貯蔵デバイスLead conductor and power storage device
 本発明は、非水電解質電池などの電力貯蔵デバイスに用いられるリード導体、及び電力貯蔵デバイスに関する。特に本発明は、薄く細幅であっても破断し難いリード導体に関するものである。 The present invention relates to a lead conductor used in a power storage device such as a nonaqueous electrolyte battery, and a power storage device. In particular, the present invention relates to a lead conductor that is thin and thin and hardly breaks.
 スマートフォンなどの携帯電話、ノート型パーソナルコンピュータなどといった携帯用電子・電気機器や小型電子・電気機器(以下、携帯機器類と呼ぶことがある)などの電源にリチウムイオン二次電池が利用されている。携帯機器類の電源用途のリチウムイオン二次電池は、袋状の容器に電池要素が収納され、この容器の内部から外部に亘ってリード導体が配置された構成が代表的である(特許文献1の図1,2参照)。 Lithium ion secondary batteries are used as power sources for portable electronic / electrical devices such as mobile phones such as smartphones and notebook personal computers, and small electronic / electrical devices (hereinafter sometimes referred to as portable devices). . A typical lithium-ion secondary battery for use as a power source for portable devices has a configuration in which a battery element is housed in a bag-like container and lead conductors are arranged from the inside to the outside of the container (Patent Document 1). 1 and 2).
 リード導体は、電池と外部の部材との間で電力の授受を行う金属の帯材を主体とする。上述の携帯機器類の電源用途では、正極のリード導体には純アルミニウム、負極のリード導体には純ニッケルや純ニッケルめっき純銅が利用されている。 The lead conductor is mainly made of a metal strip that transfers power between the battery and an external member. In the above-described power supply application for portable devices, pure aluminum is used for the positive lead conductor, and pure nickel or pure nickel-plated pure copper is used for the negative lead conductor.
 上述の袋状の容器は、代表的には金属層を備える。この金属層と金属のリード導体とを絶縁するために、両者は樹脂層を介して接合される。容器はこの樹脂層を介して封止される。金属の帯材に樹脂層が形成された樹脂付きリード導体も利用されている。 The above-mentioned bag-shaped container is typically provided with a metal layer. In order to insulate the metal layer from the metal lead conductor, the two are joined via a resin layer. The container is sealed through this resin layer. A lead conductor with resin in which a resin layer is formed on a metal strip is also used.
特開2014-017175号公報JP 2014-0117175 A
 リチウムイオン二次電池などの電力貯蔵デバイスに用いられるリード導体に対して、薄く細幅であっても破断し難いことが望まれている。 It is desired that lead conductors used for power storage devices such as lithium ion secondary batteries are not easily broken even if they are thin and narrow.
 昨今、携帯用電子・電気機器や小型電子・電気機器のハイスペック化によって、携帯機器類の消費電力が増加している。そのため、携帯機器類の電源に利用されるリチウムイオン二次電池などには、薄型、小型でありながら、電池容量(エネルギー密度)を増大することが要求され、リード導体についても、従来よりも厚さを薄く、幅を細くすることが望まれている。 Recently, the power consumption of portable devices is increasing due to the high specification of portable electronic / electrical devices and small electronic / electrical devices. For this reason, lithium ion secondary batteries and the like used for power supplies of portable devices are required to increase battery capacity (energy density) while being thin and small, and lead conductors are also thicker than before. It is desired to reduce the thickness and the width.
 しかし、上述の純アルミニウムや純ニッケルなどの純金属からなり、薄く細幅、例えば厚さが0.1mm以下で幅が10mm以下のリード導体では、製造過程や携帯機器類に組み付けられた状態で破断する恐れがある。 However, lead conductors made of pure metals such as pure aluminum and pure nickel and having a thin and narrow width, for example, a thickness of 0.1 mm or less and a width of 10 mm or less, are assembled in a manufacturing process or in portable devices. There is a risk of breaking.
 製造過程では、例えば、リード導体を所定の形状に屈曲して、携帯機器類に備える回路基板などの部材に接続することがある。リード導体を屈曲することで、携帯機器類の筐体が薄かったり、小さかったりする場合でも収納可能になる。直角曲げや二つ折れのように曲げ半径を小さくすれば、リード導体の収納容積を更に小さくできる。しかし、薄く細幅の純金属のリード導体では、破断荷重が小さいため、薄い筐体などに収納できるように曲げ半径が小さい屈曲を行うと破断する可能性があり、組付け前の搬送時に落下するなどの衝撃が加わっただけでも破断する可能性がある。 In the manufacturing process, for example, the lead conductor may be bent into a predetermined shape and connected to a member such as a circuit board provided in portable devices. By bending the lead conductor, the portable device can be stored even when the casing of the portable device is thin or small. If the bending radius is reduced, such as right-angle bending or double folding, the storage capacity of the lead conductor can be further reduced. However, thin and narrow pure metal lead conductors have a small breaking load, so if they are bent with a small bending radius so that they can be stored in a thin housing, etc., they may break and fall during transport before assembly. There is a possibility of breaking even if an impact such as doing is applied.
 携帯機器類に組み付けられた後にも、携帯機器類を落下するなどして衝撃が加わった場合に、薄く細幅の純金属のリード導体では破断する可能性がある。上述のように折り曲げられた状態で落下などの衝撃が加わると、屈曲部分に許容応力を超えるような過度の曲げが加えられて、薄く細幅の純金属のリード導体は、破断に至る可能性もあると考えられる。 Even after being assembled in mobile devices, if an impact is applied by dropping the mobile devices, etc., there is a possibility that the thin and thin pure metal lead conductor may break. If an impact such as dropping is applied in the bent state as described above, excessive bending that exceeds the allowable stress is applied to the bent part, and the thin and thin pure metal lead conductor may break. It is thought that there is also.
 更に、電力貯蔵デバイスに備えるリード導体は、電力の授受に用いられることから、導電性に優れることも望まれる。 Furthermore, since the lead conductor provided in the power storage device is used for power transfer, it is also desired that the lead conductor is excellent in conductivity.
 本発明は上述の事情を鑑みてなされたものであり、その目的の一つは、薄く細幅であっても破断し難い電力貯蔵デバイス用のリード導体を提供することにある。また、本発明の他の目的は、薄く細幅であっても破断し難いリード導体を備える電力貯蔵デバイスを提供することにある。 The present invention has been made in view of the above circumstances, and one of its purposes is to provide a lead conductor for a power storage device that is thin and thin and hardly breaks. Another object of the present invention is to provide a power storage device including a lead conductor that is thin and thin but hardly broken.
 本発明の一態様に係るリード導体は、正極と、負極と、電解液と、これらを収納する容器とを備える電力貯蔵デバイスに用いられるものである。
 このリード導体は、Siを0.1質量%以上1.2質量%以下含有すると共に、Mgを、質量比でMg/Siが0.8以上2.7以下、かつ1.5質量%未満を満たす範囲で含有するアルミニウム合金から構成される。
 このリード導体の引張強さが100MPa以上220MPa以下である。
 このリード導体の導電率が50%IACS以上である。
The lead conductor which concerns on 1 aspect of this invention is used for an electric power storage device provided with a positive electrode, a negative electrode, electrolyte solution, and the container which accommodates these.
This lead conductor contains 0.1 mass% or more and 1.2 mass% or less of Si, and Mg has a mass ratio of Mg / Si of 0.8 or more and 2.7 or less, and less than 1.5 mass%. It is comprised from the aluminum alloy contained in the range to satisfy | fill.
The tensile strength of this lead conductor is 100 MPa or more and 220 MPa or less.
The conductivity of the lead conductor is 50% IACS or more.
 本発明の一態様に係る電力貯蔵デバイスは、上記のリード導体を備える。 A power storage device according to an aspect of the present invention includes the above lead conductor.
 上記のリード導体は、薄く細幅であっても破断し難い。上記の電力貯蔵デバイスは、リード導体が破断し難い。 The above lead conductors are not easily broken even if they are thin and narrow. In the above power storage device, the lead conductor is not easily broken.
実施形態の電力貯蔵デバイスの一例である非水電解質電池の概略を示す斜視図である。It is a perspective view showing the outline of the nonaqueous electrolyte battery which is an example of the power storage device of an embodiment. 実施形態の非水電解質電池を図1に示す(II)-(II)切断線で切断した断面図である。FIG. 2 is a cross-sectional view of the nonaqueous electrolyte battery of the embodiment taken along the line (II)-(II) shown in FIG. 折り曲げ試験の試験方法を説明する説明図である。It is explanatory drawing explaining the test method of a bending test. 衝撃試験の試験方法を説明する説明図である。It is explanatory drawing explaining the test method of an impact test. 拡散抵抗値の測定に用いる電気化学測定セルの一例を示す概略構成図である。It is a schematic block diagram which shows an example of the electrochemical measurement cell used for the measurement of a diffused resistance value. 拡散抵抗値の算出に用いる等価回路図である。It is an equivalent circuit diagram used for calculation of a diffused resistance value. ピール強度試験に用いる試料の概略図である。It is the schematic of the sample used for a peel strength test. ピール強度試験において、ピール強度測定前の試料と、ピール強度を測定する状態とを示す説明図である。In a peel strength test, it is explanatory drawing which shows the sample before peel strength measurement, and the state which measures peel strength.
 1 リード導体 10 非水電解質電池
 11 容器 110 金属層 112 内側樹脂層 114 外側樹脂層
 13 セパレータ 14 正極 15 負極 16,17 集電体
 19 リード線
 20 樹脂付きリード導体 22 被覆樹脂層 220 接着層 222 表面層
 300 電気化学測定セル 302 対極 304 電解液 310 測定装置
 S 試料 w 錘 SS1,SS2 模擬試料 S1 帯材 S22 樹脂層
 S1l,S1s 分割片 S22a,S22b 樹脂フィルム
 la,sa フィルム片
DESCRIPTION OF SYMBOLS 1 Lead conductor 10 Nonaqueous electrolyte battery 11 Container 110 Metal layer 112 Inner resin layer 114 Outer resin layer 13 Separator 14 Positive electrode 15 Negative electrode 16, 17 Current collector 19 Lead wire 20 Lead conductor with resin 22 Coating resin layer 220 Adhesive layer 222 Surface Layer 300 Electrochemical measurement cell 302 Counter electrode 304 Electrolyte 310 Measuring device S Sample w Weight SS1, SS2 Simulated sample S1 Strip material S22 Resin layer S1l, S1s Split piece S22a, S22b Resin film la, sa Film piece
 本発明者らは、特定の組成の金属で構成されて、引張強さ及び導電率が特定の範囲を満たせば、薄く細幅なリード導体であっても屈曲や衝撃などによって破断し難いとの知見を得た。本発明は、上記知見に基づくものである。
 最初に本発明の実施形態の内容を列記して説明する。
The inventors of the present invention say that a thin and thin lead conductor is not easily broken by bending or impact if it is made of a metal having a specific composition and the tensile strength and conductivity satisfy a specific range. Obtained knowledge. The present invention is based on the above findings.
First, the contents of the embodiment of the present invention will be listed and described.
(1)本発明の一態様に係るリード導体は、正極と、負極と、電解液と、これらを収納する容器とを備える電力貯蔵デバイスに用いられるものである。
 このリード導体は、Siを0.1質量%以上1.2質量%以下含有すると共に、Mgを、質量比でMg/Siが0.8以上2.7以下、かつ1.5質量%未満を満たす範囲で含有するアルミニウム合金から構成される。
 このリード導体の引張強さが100MPa以上220MPa以下である。
 このリード導体の導電率が50%IACS以上である。
(1) The lead conductor which concerns on 1 aspect of this invention is used for an electric power storage device provided with a positive electrode, a negative electrode, electrolyte solution, and the container which accommodates these.
This lead conductor contains 0.1 mass% or more and 1.2 mass% or less of Si, and Mg has a mass ratio of Mg / Si of 0.8 or more and 2.7 or less, and less than 1.5 mass%. It is comprised from the aluminum alloy contained in the range to satisfy.
The tensile strength of this lead conductor is 100 MPa or more and 220 MPa or less.
The conductivity of the lead conductor is 50% IACS or more.
 上記のリード導体は、引張強さが特定の範囲を満たしており、強度が高いものの高過ぎず(硬過ぎず)、靭性(例えば破断伸び)にも優れる。このような高強度で高靭性な上記のリード導体は、薄く細幅であっても、例えば厚さが0.1mm以下、幅が10mm以下であっても、屈曲や衝撃に対する耐性(例えば0.2%耐力)に優れ、所定の屈曲を行ったり、衝撃が加えられたりするなどしても破断し難い。好ましくは、上記のリード導体は、所定の形状に屈曲された状態で衝撃を受けた場合でも破断し難い。 The above lead conductor has a tensile strength that satisfies a specific range, is high in strength but is not too high (not too hard), and is excellent in toughness (for example, elongation at break). Such a lead conductor having high strength and high toughness is thin and thin, for example, with a resistance to bending or impact (for example, 0.1 mm or less) even if the thickness is 0.1 mm or less and the width is 10 mm or less. 2% proof stress), and it is difficult to break even if a predetermined bending is performed or an impact is applied. Preferably, the lead conductor is not easily broken even when subjected to an impact while being bent into a predetermined shape.
 かつ、上記のリード導体は、導電率が特定の範囲を満たしており、導電性にも優れる。ここで、リード導体の構成金属における添加元素の含有量を多くしたり、高い加工度で塑性加工を行って十分に加工硬化させたりするなどすれば強度を高められる。しかし、添加元素の過剰添加や、加工硬化による過度の歪導入などは、導電率の低下を招く。上記のリード導体は、導電率が上述の特定の範囲を満たす範囲で添加元素の含有量が調整されたり、塑性加工や熱処理などの製造条件が調整されたりすることで導電性に優れる。 In addition, the above lead conductor has a specific conductivity and is excellent in conductivity. Here, the strength can be increased by increasing the content of the additive element in the constituent metal of the lead conductor, or by performing sufficient work hardening by plastic working at a high workability. However, excessive addition of additive elements, excessive strain introduction due to work hardening, and the like cause a decrease in conductivity. Said lead conductor is excellent in electroconductivity, when content of an additive element is adjusted in the range with which the electrical conductivity satisfy | fills the above-mentioned specific range, or manufacturing conditions, such as plastic working and heat processing, are adjusted.
 上記のリード導体は、薄く細幅であっても破断し難い上に、導電性に優れるため、携帯機器類の電源に用いられるリチウムイオン二次電池などの非水電解質電池やその他の電力貯蔵デバイスの構成部材として好適に利用できる。 The above lead conductors are thin and thin and difficult to break, and are excellent in conductivity. Therefore, non-aqueous electrolyte batteries such as lithium ion secondary batteries used for power sources of portable devices and other power storage devices It can utilize suitably as a structural member.
 更に、上記のリード導体は、Alよりも電解液に溶出し易いと考えられるMgを含むものの、Siと共に特定の範囲で含有することでSiとの化合物(MgSi)として存在し、電力貯蔵デバイスに組み付けられた場合に電解液に対する耐性にも優れるとの知見を得た。上記のリード導体と電力貯蔵デバイスの容器との間に樹脂層が介在することも、リード導体の構成成分を溶出し難くして、電解液に対する耐性の向上に寄与すると期待される。これらの点からも上記のリード導体は、非水電解質電池などの電力貯蔵デバイスの構成部材として好適に利用できる。 Furthermore, although the above lead conductor contains Mg, which is considered to be more easily eluted into the electrolyte than Al, it exists as a compound with Mg (Mg 2 Si) by containing it in a specific range together with Si, thereby storing power. It was found that when assembled in a device, it also has excellent resistance to electrolytes. The presence of a resin layer between the lead conductor and the container of the power storage device is also expected to make it difficult to elute the constituent components of the lead conductor and contribute to improvement in resistance to the electrolytic solution. Also from these points, the lead conductor can be suitably used as a constituent member of a power storage device such as a nonaqueous electrolyte battery.
(2)上記のリード導体の一例として、0.2%耐力が40MPa以上である形態が挙げられる。 (2) As an example of the above lead conductor, there is a form in which the 0.2% proof stress is 40 MPa or more.
 上記形態は、0.2%耐力が特定の範囲を満たしており、耐力が十分に高く、薄く細幅であっても破断し難い。 In the above form, the 0.2% proof stress satisfies a specific range, the proof stress is sufficiently high, and even if it is thin and thin, it is difficult to break.
(3)上記のリード導体の一例として、厚さが0.03mm以上0.1mm以下、幅が1mm以上10mm以下である形態が挙げられる。 (3) As an example of the lead conductor, a form having a thickness of 0.03 mm to 0.1 mm and a width of 1 mm to 10 mm can be given.
 上記形態は、薄く細幅であるものの薄過ぎたり幅が狭過ぎたりせず、破断し難い。また、上記形態は、薄く細幅であるため、電力貯蔵デバイスの薄型化、小型化の要求に対応できる。 Although the above-mentioned form is thin and narrow, it is not too thin or too narrow, and is difficult to break. Moreover, since the said form is thin and thin, it can respond to the request | requirement of thickness reduction and size reduction of an electric power storage device.
(4)上記のリード導体の一例として、拡散抵抗値が5×10Ω・cm-2以上である形態が挙げられる。上記拡散抵抗値は、以下のように測定する。
 リード導体の一部を所定の樹脂で覆ったものを試料とし、上記電力貯蔵デバイスに用いられる電解液に上記試料における上記樹脂の形成箇所と対極とを接触させ、この電解液を60℃に保持した状態を1週間維持する。1週間経過後、上記試料の交流インピーダンススペクトルを測定し、測定した交流インピーダンススペクトルに基づいて上記試料の抵抗値を求める。求めた抵抗値を拡散抵抗値とする。後述する被覆樹脂層を備える樹脂付きリード導体では、被覆樹脂層を上記所定の樹脂とみなして、拡散抵抗値を測定するとよい。 
(4) As an example of the above lead conductor, a form in which the diffusion resistance value is 5 × 10 5 Ω · cm −2 or more can be mentioned. The diffusion resistance value is measured as follows.
A sample in which a part of the lead conductor is covered with a predetermined resin is used as a sample, and the formation position of the resin and the counter electrode in the sample are brought into contact with the electrolyte used in the power storage device, and the electrolyte is maintained at 60 ° C. Maintain for 1 week. After one week, the AC impedance spectrum of the sample is measured, and the resistance value of the sample is obtained based on the measured AC impedance spectrum. The obtained resistance value is defined as a diffusion resistance value. In a lead conductor with a resin having a coating resin layer to be described later, the diffusion resistance value may be measured by regarding the coating resin layer as the predetermined resin.
 上記形態は、上記所定の樹脂を介して高温の電解液に長時間接触しても拡散抵抗値が高いため、リード導体の構成成分が経時的に電解液に溶出し難いといえる。従って、上記形態は、薄く細幅であっても破断し難い上に、電解液に対する耐性に優れる。 Since the diffusion resistance value is high even if the above-described form is in contact with a high-temperature electrolyte solution for a long time via the predetermined resin, it can be said that the constituent elements of the lead conductor are difficult to elute into the electrolyte solution over time. Therefore, the above-mentioned form is not easily broken even if it is thin and narrow, and is excellent in resistance to the electrolytic solution.
(5)上記のリード導体の一例として、上記リード導体の表面の少なくとも一部に化成処理、ベーマイト処理、アルマイト処理、及びエッチングから選択される1種が施された表面処理部を備える形態が挙げられる。 (5) As an example of the above-described lead conductor, a mode in which at least a part of the surface of the lead conductor is provided with a surface treatment portion on which one kind selected from chemical conversion treatment, boehmite treatment, alumite treatment, and etching is applied. It is done.
 表面処理部は微細な凹凸を有して樹脂層との密着性に優れ、リード導体における樹脂層の形成領域が曲げられたり、衝撃を受けたりしてもリード導体と樹脂層とが剥離し難い。上記形態は、薄く細幅であっても破断し難い上に、樹脂層が密着する点で上述の拡散抵抗値をより高められて電解液に対する耐性により優れる。 The surface treatment part has fine unevenness and excellent adhesion to the resin layer, and the lead conductor and the resin layer are difficult to peel off even if the resin layer formation area in the lead conductor is bent or shocked . The above-described form is not easily broken even if it is thin and thin, and the above-mentioned diffusion resistance value is further enhanced in that the resin layer is in close contact, and the resistance to the electrolytic solution is superior.
(6)上記のリード導体の一例として、上記アルミニウム合金がCu,Fe,Cr,Mn,Zn,Ni,Ag,及びZrから選択される1種以上の元素を合計で0.005質量%以上1質量%以下含有する形態が挙げられる。 (6) As an example of the lead conductor, the aluminum alloy contains 0.005% by mass or more in total of one or more elements selected from Cu, Fe, Cr, Mn, Zn, Ni, Ag, and Zr. The form containing below mass% is mentioned.
 上記形態は、Si及びMgに加えて、上述の列挙した元素を特定の範囲で含有することで、高い導電率を有しつつ強度がより高くなり易く破断し難い。 In the above-mentioned form, in addition to Si and Mg, the elements listed above are contained in a specific range, so that the strength is easily increased and the material is not easily broken.
(7)上記のリード導体の一例として、上記アルミニウム合金がTiを0.01質量%以上0.05質量%以下及びBを0.001質量%以上0.008質量%以下の少なくとも一方を含有する形態が挙げられる。 (7) As an example of the lead conductor, the aluminum alloy contains at least one of Ti of 0.01% by mass to 0.05% by mass and B of 0.001% by mass to 0.008% by mass. A form is mentioned.
 Ti及びBはいずれも、鋳造時にアルミニウム合金の結晶を微細にする効果がある。上記形態は、Si及びMgに加えて、TiやBを特定の範囲で含有することで、リード導体の構成金属を、微細な結晶組織を有するアルミニウム合金とすることができ、強度がより高くなり易く破断し難い。 Both Ti and B have the effect of making the crystal of the aluminum alloy fine during casting. In the above embodiment, in addition to Si and Mg, Ti and B are contained in a specific range, so that the constituent metal of the lead conductor can be an aluminum alloy having a fine crystal structure, and the strength becomes higher. Easy to break.
(8)上記のリード導体の一例として、上記リード導体における上記容器との固定領域に接合される被覆樹脂層を備え、上記被覆樹脂層が異なる樹脂からなる多層構造であり、上記被覆樹脂層の合計厚さが20μm以上300μm以下である形態が挙げられる。 (8) As an example of the lead conductor, the lead conductor includes a coating resin layer bonded to a fixed region of the lead conductor with the container, and the coating resin layer has a multilayer structure made of different resins. The form whose total thickness is 20 micrometers or more and 300 micrometers or less is mentioned.
 被覆樹脂層は、リード導体と電力貯蔵デバイスの容器との間に介在されて絶縁体として機能する。被覆樹脂層が多層構造であれば、種々の材質の樹脂、特に密着性に優れる樹脂を含むことができる。被覆樹脂層が多層構造であっても、その厚さが上述の特定の範囲であれば、薄い樹脂付きリード導体とすることができる。従って、上記形態は、容器との絶縁を確保できる上に電力貯蔵デバイスの薄型化に寄与する。この被覆樹脂層は、上記(5)の表面処理部に備えると、上述のようにリード導体との密着性に優れて好ましい。 The coating resin layer is interposed between the lead conductor and the container of the power storage device and functions as an insulator. If the coating resin layer has a multilayer structure, it can contain resins of various materials, particularly resins having excellent adhesion. Even if the coating resin layer has a multi-layer structure, a thin lead conductor with a resin can be obtained as long as the thickness thereof is within the specific range described above. Therefore, the said form can ensure insulation with a container and contributes to thickness reduction of an electric power storage device. When this coating resin layer is provided in the surface treatment portion of (5) above, it is preferable because of excellent adhesion to the lead conductor as described above.
(9)本発明の一態様に係る電力貯蔵デバイスは、上記(1)~(8)のいずれか1つに記載のリード導体を備える。 (9) A power storage device according to an aspect of the present invention includes the lead conductor according to any one of (1) to (8) above.
 上記の電力貯蔵デバイスに備えるリード導体が薄く細幅であっても、製造過程で曲げられたり、任意のときに落下などして衝撃を受けたりするなどした際にリード導体が破断し難い。従って、上記の電力貯蔵デバイスは、携帯機器類の電源に利用される際に、リード導体の破断に起因する歩留りの低下を低減したり、導電性に優れる上記のリード導体を長期に亘り維持でき、外部との電力の授受を良好に行えたりできる。 Even if the lead conductor provided in the above power storage device is thin and thin, the lead conductor is not easily broken when it is bent during the manufacturing process or when it is subjected to an impact by dropping it at any time. Therefore, when the power storage device is used as a power source for portable equipment, it is possible to reduce a decrease in yield due to breakage of the lead conductor or to maintain the lead conductor having excellent conductivity for a long period of time. , Can exchange power with the outside.
 [本発明の実施形態の詳細]
 以下、図面を適宜参照して、本発明の実施形態に係るリード導体、本発明の実施形態に係る電力貯蔵デバイスを説明する。図中、同一符号は同一名称物を示す。
[Details of the embodiment of the present invention]
Hereinafter, a lead conductor according to an embodiment of the present invention and a power storage device according to an embodiment of the present invention will be described with reference to the drawings as appropriate. In the figure, the same reference numerals indicate the same names.
(リード導体)
 実施形態のリード導体1(図1,図2)は、電力貯蔵デバイス(図1では非水電解質電池10)に用いられる導電部材であり、容器11内に収納された正極14,負極15(図2)と、外部の部材(図示せず)とを電気的に接続して電力の授受に利用される。リード導体1は、代表的には、長方形状の金属の帯材であり、その表面のうち少なくとも容器11との固定領域に樹脂層が接触した状態、好ましくは密着した状態で利用される。樹脂層は、後述の被覆樹脂層22、容器11自体に備える内側樹脂層112(図2)、リード導体1と容器11との間に別途接合された接合樹脂層(図示せず)の少なくとも一つが挙げられる(以下、単に樹脂層と呼ぶことがある)。
(Lead conductor)
The lead conductor 1 (FIGS. 1 and 2) of the embodiment is a conductive member used in a power storage device (nonaqueous electrolyte battery 10 in FIG. 1), and includes a positive electrode 14 and a negative electrode 15 (see FIG. 1) housed in a container 11. 2) and an external member (not shown) are electrically connected to be used for power transfer. The lead conductor 1 is typically a rectangular metal strip, and is used in a state where the resin layer is in contact with, preferably in close contact with, at least a fixed region of the surface with the container 11. The resin layer is at least one of a coating resin layer 22 described later, an inner resin layer 112 (FIG. 2) provided in the container 11 itself, and a bonding resin layer (not shown) separately bonded between the lead conductor 1 and the container 11. (Hereinafter, simply referred to as a resin layer).
 実施形態のリード導体1は、Mg,Siを特定の範囲で含む特定の組成のアルミニウム合金で構成されていることを特徴の一つとする。以下、このアルミニウム合金の組成をまず説明し、次に、リード導体1の特性や構造などについて説明する。 One feature of the lead conductor 1 according to the embodiment is that it is made of an aluminum alloy having a specific composition containing Mg and Si in a specific range. Hereinafter, the composition of this aluminum alloy will be described first, and then the characteristics and structure of the lead conductor 1 will be described.
・組成
 実施形態のリード導体1を構成するアルミニウム合金は、Siを0.1質量%以上1.2質量%以下含有すると共に、Mgを、質量比でMg/Siが0.8以上2.7以下、かつ1.5質量%未満を満たす範囲で含有し、残部がAl(アルミニウム)及び不可避不純物であるAl-Mg-Si系合金である。Mg/Siから換算して、Mgの含有量の下限は0.08質量%以上である。
 又は、実施形態のリード導体1を構成するアルミニウム合金は、Si及びMgを上述の特定の範囲で含有すると共に、Cu,Fe,Cr,Mn,Zn,Ni,Ag,及びZrから選択される1種以上の元素(以下、特定の元素と呼ぶことがある)を合計で0.005質量%以上1質量%以下含有し、残部がAl及び不可避不純物であるAl-Mg-Si系合金である。
 以下、元素の含有量は、質量%を示す。
Composition The aluminum alloy constituting the lead conductor 1 of the embodiment contains 0.1% by mass or more and 1.2% by mass or less of Si, and Mg contains Mg / Si in a mass ratio of 0.8 or more and 2.7. An Al—Mg—Si based alloy that is contained in a range satisfying less than 1.5% by mass below, the balance being Al (aluminum) and inevitable impurities. In terms of Mg / Si, the lower limit of the Mg content is 0.08% by mass or more.
Or the aluminum alloy which comprises the lead conductor 1 of embodiment contains Si and Mg in the above-mentioned specific range, and is selected from Cu, Fe, Cr, Mn, Zn, Ni, Ag, and Zr. It is an Al—Mg—Si based alloy containing a total of 0.005 mass% or more and 1 mass% or less of elements (hereinafter sometimes referred to as specific elements), with the balance being Al and inevitable impurities.
Hereinafter, the element content indicates mass%.
・・Si(珪素)及びMg(マグネシウム)
 Siを0.1%以上とMgを0.08%以上含有するAl-Mg-Si系合金は、引張強さや0.2%耐力が高く、強度や耐力に優れる。このようなAl-Mg-Si系合金は、製造過程で時効処理を行った場合には時効硬化による強度や耐力の更なる向上を望める。このようなAl-Mg-Si系合金は、自然時効によって経時的に強度が向上する場合がある。このように高強度なAl-Mg-Si系合金は、例えば、塑性加工後に軟化処理を行って靭性や導電率を高めた場合でも高い強度を維持できる。この場合、高強度、高靭性、高導電性を有することができる。このようなAl-Mg-Si系合金で構成されるリード導体1は、薄く細幅であっても、所定の曲げを行ったり、衝撃を受けたりした際に破断し難い。
..Si (silicon) and Mg (magnesium)
An Al—Mg—Si alloy containing 0.1% or more of Si and 0.08% or more of Mg has high tensile strength and 0.2% yield strength, and is excellent in strength and yield strength. Such an Al—Mg—Si-based alloy can be expected to further improve the strength and yield strength by age hardening when it is subjected to an aging treatment in the production process. Such an Al—Mg—Si based alloy may improve in strength over time due to natural aging. Such a high-strength Al—Mg—Si-based alloy can maintain high strength even when, for example, softening is performed after plastic working to increase toughness or conductivity. In this case, it can have high strength, high toughness, and high conductivity. Even if the lead conductor 1 made of such an Al—Mg—Si alloy is thin and thin, it is difficult to break when subjected to predetermined bending or impact.
 このようなAl-Mg-Si系合金は、Mg,Siの含有量が高いほど、高強度になり易い。例えば、このようなAl-Mg-Si系合金は、Siの含有量を0.2%以上、更に0.3%以上、0.35%以上、Mgの含有量を0.1%以上、0.2%以上、更に0.3%以上とすることができる。 Such an Al—Mg—Si alloy tends to have higher strength as the Mg and Si contents are higher. For example, such an Al—Mg—Si-based alloy has a Si content of 0.2% or more, further 0.3% or more, 0.35% or more, a Mg content of 0.1% or more, 0% .2% or more, and further 0.3% or more.
 このようなAl-Mg-Si系合金は、Mg,Siの含有量が多過ぎると、導電率が低下したり(特にMg過剰の場合)、MgとSiとを含む析出物が多過ぎたり粗大になったりして、析出物を起点とする破断が生じ易くなったりする。そのため、Siの含有量を0.9%以下、更に0.8%以下、0.7%以下、Mgの含有量を1.4%以下、1.2%以下、更に1.0%以下とすることができる。 In such an Al—Mg—Si based alloy, if the content of Mg and Si is too large, the conductivity decreases (especially when Mg is excessive), the precipitate containing Mg and Si is too much or coarse. Or the fracture starting from the precipitate is likely to occur. Therefore, the Si content is 0.9% or less, further 0.8% or less, 0.7% or less, and the Mg content is 1.4% or less, 1.2% or less, and further 1.0% or less. can do.
 このようなAl-Mg-Si系合金は、Siに対するMgの質量比をMg/Siとし、このMg/Siが0.8以上であるため、金属成分が多く導電率が高くなり易い。Mg/Siの下限を0.9以上、更に0.95以上、1以上とすることができる。Mg/Siが2.7以下であるため、MgとSiとを含む析出物などが適切に存在できて強度が高くなり易い。Mg/Siの上限を2.6以下、更に2.5以下、2.0以下とすることができる。 Such an Al—Mg—Si based alloy has a mass ratio of Mg to Si of Mg / Si, and since this Mg / Si is 0.8 or more, there are many metal components and the conductivity tends to be high. The lower limit of Mg / Si can be 0.9 or more, further 0.95 or more, and 1 or more. Since Mg / Si is 2.7 or less, precipitates containing Mg and Si can be appropriately present and the strength tends to increase. The upper limit of Mg / Si can be 2.6 or less, further 2.5 or less, or 2.0 or less.
 Mg単体では、Alよりも電解液に溶出し易いと考えられる。Al-Mg-Si系合金は、Mgを含むものの、MgをSiに対して特定の範囲で含有すると共に1.5%未満の範囲で含有することで、MgはSiとの化合物(MgSi)を形成して存在できる。MgSiは電気を流し難いため、Mgの溶出に起因する短絡などを防止できると考えられる。なお、本発明者らは、種々の組成のアルミニウム合金や純アルミニウムからなる作用電極と、プラチナからなる対極との2極の電気化学セルを構成し、両極を電解液に浸漬して所定の電圧を印加した際に流れる電流量を測定した。その結果、Siを上述の特定の範囲で含有すると共にMg/Siが2.7を超え、かつMgが1.5質量%以上であるMgが過剰な場合には電流量が非常に大きく、Mg/Siが2.7以下であり、かつMgが1.5質量%未満の場合(例えば、Al-0.65%Si-0.9%Mg、Mg/Si≒1.4)には、上記のMgが過剰な場合の1/10以下程度と電流量が非常に少なく、純アルミニウムと同程度であることを確認している。電解液に対する耐性をも考慮して、実施形態のリード導体1では、Siの含有量,Mgの含有量及びMg/Siを規定する。 It is considered that Mg alone is easier to elute into the electrolyte than Al. Although the Al—Mg—Si based alloy contains Mg, it contains Mg in a specific range with respect to Si and less than 1.5%, so that Mg is a compound with Si (Mg 2 Si ). Since Mg 2 Si is difficult to pass electricity, it is considered that short circuiting caused by elution of Mg can be prevented. The inventors of the present invention configured a two-electrode electrochemical cell of a working electrode made of aluminum alloy or pure aluminum having various compositions and a counter electrode made of platinum, and both electrodes were immersed in an electrolyte solution to obtain a predetermined voltage. The amount of current that flows when sapphire was measured was measured. As a result, when Si is contained in the specific range described above, Mg / Si exceeds 2.7, and Mg having an amount of 1.5% by mass or more is excessive, the amount of current is very large. / Si is 2.7 or less and Mg is less than 1.5% by mass (for example, Al-0.65% Si-0.9% Mg, Mg / Si≈1.4) It has been confirmed that the amount of current is about 1/10 or less of the excess Mg, which is almost the same as that of pure aluminum. In consideration of resistance to the electrolytic solution, the lead conductor 1 of the embodiment defines the Si content, the Mg content, and Mg / Si.
・・その他の添加元素
 実施形態のリード導体1を構成するアルミニウム合金は、Mg及びSiに加えて、上述の特定の元素を特定の範囲で含有すると強度が高くなり易い。上述の特定の元素のうち、Cuは導電率の低下が少なく、強度を向上できる。Fe,Cr,Mn,Ni,Zrは導電率の低下がある程度大きいものの、強度の向上効果が高い。Zn,Agは、導電率の低下が少なく、強度の向上効果をある程度有する。これらの元素を1種のみ含有する形態、2種以上含有する形態のいずれも利用できる。
.. Other additive elements The aluminum alloy constituting the lead conductor 1 of the embodiment is likely to have high strength when it contains the above-mentioned specific element in a specific range in addition to Mg and Si. Of the above-mentioned specific elements, Cu has little decrease in conductivity and can improve strength. Although Fe, Cr, Mn, Ni, and Zr have a large decrease in conductivity, the effect of improving the strength is high. Zn and Ag have little decrease in electrical conductivity and have a certain degree of strength improvement effect. Either a form containing only one kind of these elements or a form containing two or more kinds can be used.
 このようなアルミニウム合金は、上記特定の元素の合計含有量が0.005%以上であれば、強度が高められて破断し難い。上記合計含有量が多いほど強度を高められ、下限を0.01%以上、更に0.05%以上、0.1%以上とすることができる。 Such an aluminum alloy has high strength and hardly breaks when the total content of the specific elements is 0.005% or more. The greater the total content, the higher the strength, and the lower limit can be 0.01% or more, further 0.05% or more, 0.1% or more.
 このようなアルミニウム合金は、上記特定の元素の合計含有量が1%以下であれば、導電率の低下を低減して導電性に優れる。ここで、リード導体1の構成成分が電解液に溶出すると、溶出した成分によって正極14と負極15とが短絡したり、電力貯蔵デバイスの特性が低下したりする可能性がある。上記合計含有量が1%以下であれば、上記構成成分の溶出を十分に低減できる。上述のように電力貯蔵デバイスに取り付けられたリード導体1では、樹脂層が密着した状態であれば、上記構成成分の溶出をより効果的に低減できる。上記合計含有量の上限を0.9%以下、更に0.8%以下、0.7%以下とすることができる。
 各元素の含有量は、例えば以下が挙げられる。
 Cu 0.01%以上0.9%以下、更に0.03%以上0.8%以下
 Fe 0.005%以上0.9%以下、更に0.01%以上0.5%以下
 Cr 0.005%以上0.8%以下、更に0.01%以上0.7%以下
 Mn 0.005%以上0.8%以下、更に0.01%以上0.7%以下
 Zn,Ni,Ag,Zr 合計で0.005%以上0.2%以下、更に合計で0.005%以上0.15%以下
If the total content of the specific element is 1% or less, such an aluminum alloy is excellent in conductivity by reducing the decrease in conductivity. Here, when the constituent components of the lead conductor 1 are eluted in the electrolytic solution, there is a possibility that the positive electrode 14 and the negative electrode 15 are short-circuited or the characteristics of the power storage device are deteriorated due to the eluted components. If the total content is 1% or less, the elution of the constituent components can be sufficiently reduced. In the lead conductor 1 attached to the power storage device as described above, the elution of the constituent components can be more effectively reduced if the resin layer is in close contact. The upper limit of the total content can be 0.9% or less, further 0.8% or less, or 0.7% or less.
Examples of the content of each element include the following.
Cu 0.01% to 0.9%, further 0.03% to 0.8% Fe 0.005% to 0.9%, further 0.01% to 0.5% Cr 0.005 % To 0.8%, further 0.01% to 0.7% Mn 0.005% to 0.8%, further 0.01% to 0.7% Zn, Ni, Ag, Zr Total 0.005% or more and 0.2% or less, and in total, 0.005% or more and 0.15% or less
・・Ti(チタン)、B(ホウ素)
 アルミニウム合金は、Mg及びSiに加えて、又はMg及びSiと上記特定の元素とに加えて、Ti及びBの少なくとも一方を特定の範囲で含有すると強度を高め易い。TiやBは、鋳造時のアルミニウム合金の結晶を微細にする効果があり、微細な結晶組織を有すると強度が高められるからである。アルミニウム合金は、Bを含有する形態でもよいが、Tiを含有する形態、更にTi及びBの双方を含有する形態であると、結晶の微細化効果をより得易い。
..Ti (titanium), B (boron)
In addition to Mg and Si or in addition to Mg and Si and the specific element, the aluminum alloy can easily increase the strength when it contains at least one of Ti and B in a specific range. This is because Ti and B have an effect of making the crystal of the aluminum alloy fine at the time of casting, and the strength is enhanced if it has a fine crystal structure. Although the form containing B may be sufficient as an aluminum alloy, the refinement | miniaturization effect of a crystal | crystallization is easier to obtain if it is the form containing Ti, and also the form containing both Ti and B.
 アルミニウム合金はTiやBの含有量が多いほど、結晶の微細化効果を得易いものの、多過ぎると導電率の低下を招く。また、結晶の微細化効果は、TiやBの含有量が以下の上限値程度で飽和すると考えられる。このことから、アルミニウム合金のTiの含有量は0.01%以上0.05%以下が挙げられ、0.015%以上0.045%以下、更に0.02%以上0.04%以下とすることができる。アルミニウム合金のBの含有量は0.001%以上0.008%以下が挙げられ、0.003%以上0.007%以下、更に0.004%以上0.006%以下とすることができる。 An aluminum alloy is more likely to obtain a crystal refinement effect as the content of Ti or B is larger, but if it is too much, the electrical conductivity is lowered. Moreover, it is thought that the refinement | miniaturization effect of a crystal | crystallization is saturated with the content of Ti and B about the following upper limit values. From this, the Ti content of the aluminum alloy is 0.01% or more and 0.05% or less, 0.015% or more and 0.045% or less, and further 0.02% or more and 0.04% or less. be able to. Examples of the B content of the aluminum alloy include 0.001% to 0.008%, 0.003% to 0.007%, and further 0.004% to 0.006%.
・組織
 リード導体1を構成するアルミニウム合金の組織として、上述の微細な結晶組織が挙げられる。例えば、平均結晶粒径が1μm以上50μm以下、更に2μm以上40μm以下更には30μm以下を満たすことが挙げられる。リード導体1がこのような微細な結晶組織を有すると、強度に優れて、薄く細幅であっても破断し難い上に、リード導体1の内部に電解液が浸透し難く、リード導体1の構成成分が電解液に溶出する量を低減して、電解液に対する耐性を高め易いと期待される。結晶粒径は、上述の添加元素の含有量、製造過程での塑性加工の条件や熱処理条件などを調整して、所定の大きさに制御するとよい。
-Structure As the structure of the aluminum alloy constituting the lead conductor 1, the fine crystal structure described above can be cited. For example, the average crystal grain size may be 1 μm or more and 50 μm or less, 2 μm or more and 40 μm or less, and further 30 μm or less. When the lead conductor 1 has such a fine crystal structure, the lead conductor 1 is excellent in strength and is not easily broken even if it is thin and thin, and the electrolyte does not easily penetrate into the lead conductor 1. It is expected that the amount of the constituent component eluted into the electrolytic solution is reduced and the resistance to the electrolytic solution is easily increased. The crystal grain size may be controlled to a predetermined size by adjusting the content of the above-described additive elements, the conditions of plastic working in the manufacturing process, the heat treatment conditions, and the like.
・機械的特性
・・引張強さ
 実施形態のリード導体1は、引張強さが100MPa以上220MPa以下であることを特徴の一つとする。リード導体1は、引張強さが十分に高いことで薄く細幅であっても破断し難い。引張強さが高いほど強度に優れて破断し難くなることから、引張強さの下限を110MPa以上、更に120MPa以上、125MPa以上とすることができる。リード導体1は、引張強さが高過ぎないことで、塑性加工時に導入された歪に起因する導電率の低下が少なく導電性に優れたり、伸びなどの靭性にも優れたりする。そのため、リード導体1は、引張強さは210MPa以下、更に200MPa以下、190MPa以下とすることができる。
-Mechanical characteristics-Tensile strength The lead conductor 1 of the embodiment is characterized in that the tensile strength is 100 MPa or more and 220 MPa or less. Since the lead conductor 1 has a sufficiently high tensile strength, it is difficult to break even if it is thin and narrow. Since the higher the tensile strength, the better the strength and the more difficult it is to break, the lower limit of the tensile strength can be 110 MPa or more, further 120 MPa or more, 125 MPa or more. Since the lead conductor 1 is not too high in tensile strength, the electrical conductivity is reduced due to strain introduced during plastic working, and the electrical conductivity is excellent, and the toughness such as elongation is also excellent. Therefore, the lead conductor 1 can have a tensile strength of 210 MPa or less, further 200 MPa or less, and 190 MPa or less.
・・耐力
 実施形態のリード導体1は引張強さが高い上に、代表的には耐力にも優れており、薄く細幅であっても破断し難い。具体的には0.2%耐力が40MPa以上を満たすリード導体1が挙げられる。リード導体1は、耐力が高いほど破断し難い傾向にあり、0.2%耐力を45MPa以上、更に50MPa以上、55MPa以上とすることができる。0.2%耐力が高過ぎる場合、引張強さも高過ぎる傾向にあり、上述の導電率の低下や靭性の低下が懸念される。
0.2%耐力の上限は100MPa程度以下が挙げられる。
.. Strength The lead conductor 1 of the embodiment has high tensile strength and typically excellent strength, and it is difficult to break even if it is thin and narrow. Specifically, a lead conductor 1 having a 0.2% proof stress satisfying 40 MPa or more can be mentioned. The lead conductor 1 has a tendency that the higher the yield strength, the more difficult it is to break, and the 0.2% yield strength can be set to 45 MPa or more, further 50 MPa or more, 55 MPa or more. When the 0.2% proof stress is too high, the tensile strength tends to be too high, and there is a concern about the above-described decrease in conductivity and toughness.
The upper limit of 0.2% proof stress is about 100 MPa or less.
・・伸び
 実施形態のリード導体1は引張強さや耐力といった強度に優れる上に、代表的には伸びといった靭性にも優れており、薄く細幅であっても破断し難い。具体的には破断伸びが5%以上を満たすリード導体1が挙げられる。リード導体1は、伸びが高いほど破断し難い傾向にあり、破断伸びを6%以上、更に7%以上、8%以上とすることができる。リード導体1は、破断伸びが高過ぎる場合、引張強さや0.2%耐力が低くなり過ぎる傾向にあり、強度の低下が懸念される。破断伸びの上限は40%程度以下が挙げられる。
-Elongation The lead conductor 1 of the embodiment is excellent in strength such as tensile strength and proof stress, and is typically excellent in toughness such as elongation, and it is difficult to break even if it is thin and narrow. Specifically, the lead conductor 1 satisfying a breaking elongation of 5% or more can be mentioned. The lead conductor 1 tends to be more difficult to break as the elongation is higher, and the elongation at break can be 6% or more, further 7% or more, or 8% or more. When the elongation at break of the lead conductor 1 is too high, the tensile strength and the 0.2% proof stress tend to be too low, and there is a concern that the strength may decrease. The upper limit of breaking elongation is about 40% or less.
・導電率
 実施形態のリード導体1は、強度や靭性に優れる上に、導電性にも優れており、導電率が50%IACS以上を満たすことを特徴の一つとする。リード導体1は、導電率が高いほど好ましく、導電率を51%IACS以上、更に52%IACS以上、53%IACS以上とすることができる。
-Conductivity The lead conductor 1 of the embodiment is excellent in strength and toughness, and is also excellent in conductivity, and has a conductivity satisfying 50% IACS or more. The lead conductor 1 preferably has higher electrical conductivity, and the electrical conductivity can be 51% IACS or higher, further 52% IACS or higher, or 53% IACS or higher.
・大きさ
 実施形態のリード導体1の大きさ(厚さ、幅、長さ)は適宜選択できる。厚さが薄く、幅が細いリード導体1であれば、薄型化、小型化が望まれている電力貯蔵デバイスの構成部材に好適に利用できる。薄肉で細幅のリード導体1として、厚さが0.03mm以上0.1mm以下、幅が1mm以上10mm以下を満たすものが挙げられる。リード導体1の長さは、電力貯蔵デバイスに組み付け前に、適宜切断して調整するとよい。
-Size The size (thickness, width, length) of the lead conductor 1 of the embodiment can be selected as appropriate. The lead conductor 1 having a small thickness and a narrow width can be suitably used as a constituent member of a power storage device for which a reduction in thickness and size is desired. Examples of the thin and narrow lead conductor 1 include those having a thickness of 0.03 mm to 0.1 mm and a width of 1 mm to 10 mm. The length of the lead conductor 1 may be adjusted by appropriately cutting before assembling to the power storage device.
 厚さが0.03mm以上であれば幅が1mm程度と細くても破断し難い。厚さを0.035mm以上、更に0.04mm以上とすることができる。厚さが0.1mm以下であれば、電力貯蔵デバイスの薄型化、小型化に寄与できる。厚さを0.08mm以下、更に0.07mm以下、0.05mm以下とすることができる。 If the thickness is 0.03 mm or more, it is difficult to break even if the width is as thin as about 1 mm. The thickness can be 0.035 mm or more, and further 0.04 mm or more. If thickness is 0.1 mm or less, it can contribute to thickness reduction and size reduction of an electric power storage device. The thickness can be 0.08 mm or less, further 0.07 mm or less, and 0.05 mm or less.
 リード導体1は、幅が1mm以上であれば、厚さが0.03mm程度と薄くても破断し難い。リード導体1は、幅を2mm以上、更に3mm以上とすることができる。リード導体1は、幅が10mm以下であれば、電力貯蔵デバイスの小型化に寄与できる。リード導体1は、幅を9mm以下、更に8mm以下、7mm以下とすることができる。 If the width of the lead conductor 1 is 1 mm or more, it is difficult to break even if the thickness is as thin as about 0.03 mm. The lead conductor 1 can have a width of 2 mm or more, and further 3 mm or more. If the width | variety of the lead conductor 1 is 10 mm or less, it can contribute to size reduction of an electric power storage device. The lead conductor 1 can have a width of 9 mm or less, further 8 mm or less, or 7 mm or less.
・電解液に対する耐性
 実施形態のリード導体1は、電解液に対する耐性にも優れており、リード導体1の構成成分が電解液に溶出し難い。この特性を示すパラメータとして、上述の拡散抵抗値(特許文献1も参照)を用いると、実施形態のリード導体1は、拡散抵抗値が高く、5×10Ω・cm-2(=5×10Ω/cm)以上を満たすものが挙げられる。リード導体1は、拡散抵抗値が高いほど、上記構成成分の電解液への溶出量が少なく、電解液に対する耐性に優れると考えられ、拡散抵抗値は6×10Ω・cm-2以上、更に7×10Ω・cm-2以上、7.5×10Ω・cm-2以上を満たすことが好ましい。拡散抵抗値を高めるには、樹脂層との接触領域に後述の特定の表面処理部を備えることが好ましい。 
-Resistance to electrolyte solution The lead conductor 1 of the embodiment is also excellent in resistance to the electrolyte solution, and the constituent components of the lead conductor 1 are difficult to elute into the electrolyte solution. When the above-described diffusion resistance value (see also Patent Document 1) is used as a parameter indicating this characteristic, the lead conductor 1 of the embodiment has a high diffusion resistance value of 5 × 10 5 Ω · cm −2 (= 5 × 10 5 Ω / cm 2 ) or more is mentioned. It is considered that the lead conductor 1 has a higher diffusion resistance value, so that the amount of the above constituent components eluted into the electrolyte solution is smaller and the resistance to the electrolyte solution is better, and the diffusion resistance value is 6 × 10 5 Ω · cm −2 or more, Furthermore, it is preferable to satisfy 7 × 10 5 Ω · cm −2 or more and 7.5 × 10 5 Ω · cm −2 or more. In order to increase the diffusion resistance value, it is preferable to provide a specific surface treatment section described later in the contact area with the resin layer.
・表面処理部
 実施形態のリード導体1は、その表面の少なくとも一部、好ましくは表裏の両面における少なくとも容器11との固定領域に後述の表面処理が施された表面処理部を備えると、樹脂層との密着性を高められる。密着した樹脂層によってリード導体1における容器11内の電解液との接触面積が小さくなり、リード導体1の構成成分が電解液に溶出することを低減できる。このようなリード導体1は上述の拡散抵抗値が高い。また、リード導体1と樹脂層とが密着すると、電力貯蔵デバイスの容器11の封止状態を良好に維持でき、電解液の容器11外への漏出、容器11内への外部からの水分の浸入などを防止できる。
-Surface treatment part When the lead conductor 1 of embodiment is provided with the surface treatment part by which the below-mentioned surface treatment was given to the fixed area | region with the container 11 at least on the surface of at least one part of the surface, Preferably both surfaces of a front and back, a resin layer Adhesion can be improved. The contact area of the lead conductor 1 with the electrolytic solution in the container 11 in the lead conductor 1 is reduced due to the closely adhered resin layer, and the components of the lead conductor 1 can be reduced from being eluted into the electrolytic solution. Such a lead conductor 1 has a high diffusion resistance value. Further, when the lead conductor 1 and the resin layer are in close contact with each other, the sealed state of the container 11 of the power storage device can be maintained satisfactorily, leakage of the electrolyte solution to the outside of the container 11, and intrusion of moisture from the outside into the container 11 Can be prevented.
 リード導体1の表面における容器11との固定領域にのみ表面処理部を備える形態(固定領域にのみ表面処理が施された形態)、リード導体1の表裏面全体に表面処理部を備える形態(表裏面を繋ぐ端面・側面に表面処理が施されていない形態)、リード導体1の外面全体に表面処理部を備える形態(表裏面、及び表裏面を繋ぐ端面・側面の全てに表面処理が施された形態)のいずれも利用できる。 Form in which the surface treatment part is provided only in the fixed region with the container 11 on the surface of the lead conductor 1 (form in which surface treatment is performed only in the fixed area), and form in which the surface treatment part is provided on the entire front and back surfaces of the lead conductor 1 Surface treatment is applied to the end surface / side surface connecting the back surface), and the surface treatment portion is provided on the entire outer surface of the lead conductor 1 (surface treatment is applied to all of the end surface / side surface connecting the front and back surfaces and the front and back surfaces. Can be used.
 表面処理は、例えば、化成処理、ベーマイト処理、アルマイト処理、エッチング、ブラスト処理、ブラシ研磨などが挙げられる。各処理の条件は、従来のリード導体に対して行われている公知条件を利用できる。 Examples of the surface treatment include chemical conversion treatment, boehmite treatment, alumite treatment, etching, blast treatment, and brush polishing. As the conditions for each treatment, known conditions that have been applied to conventional lead conductors can be used.
 特に、リード導体1は、化成処理、ベーマイト処理、アルマイト処理、及びエッチングから選択される1種が施された表面処理部を備えると、処理条件にもよるが、樹脂層との密着性により優れるリード導体1になり易い。リード導体1は、化成処理又はエッチングが施された表面処理部を備えると、樹脂層との密着性に更に優れる。リード導体1と樹脂層との密着性により優れることで、構成成分の溶出量の低減、拡散抵抗値の増大、良好な封止状態の維持などを図ることができる。この表面処理部の表面粗さは、例えば、算術平均粗さRaで0.1μm以上0.5μm以下が挙げられる。 In particular, when the lead conductor 1 includes a surface treatment portion to which one type selected from chemical conversion treatment, boehmite treatment, alumite treatment, and etching is provided, the lead conductor 1 is more excellent in adhesion to the resin layer, depending on the treatment conditions. It tends to be the lead conductor 1. When the lead conductor 1 includes a surface treatment portion subjected to chemical conversion or etching, the lead conductor 1 is further excellent in adhesion to the resin layer. By being superior in the adhesion between the lead conductor 1 and the resin layer, it is possible to reduce the elution amount of the constituent components, increase the diffusion resistance value, maintain a good sealing state, and the like. As for the surface roughness of this surface treatment part, 0.1 micrometer or more and 0.5 micrometer or less are mentioned by arithmetic mean roughness Ra, for example.
・被覆樹脂層
 実施形態のリード導体1の一例として、上述の特定の組成のアルミニウム合金から構成されるリード導体1の本体と、リード導体1の本体における容器11との固定領域に接合される被覆樹脂層22とを備える樹脂付きリード導体20が挙げられる。被覆樹脂層22は、電力貯蔵デバイスの容器11が金属層110を備える場合にリード導体1の本体と金属層110との間の絶縁体として機能する。被覆樹脂層22の形成には、公知の樹脂付きリード導体の製造条件を利用できる。
Covering resin layer As an example of the lead conductor 1 of the embodiment, a coating bonded to a fixed region between the main body of the lead conductor 1 made of an aluminum alloy having the above-described specific composition and the container 11 in the main body of the lead conductor 1 A lead conductor with resin 20 including the resin layer 22 is exemplified. The covering resin layer 22 functions as an insulator between the main body of the lead conductor 1 and the metal layer 110 when the container 11 of the power storage device includes the metal layer 110. For the formation of the coating resin layer 22, known manufacturing conditions for lead conductors with resin can be used.
 被覆樹脂層22の構成材料は、代表的には、熱可塑性ポリオレフィンが挙げられる。具体的には、ポリエチレン、酸変性ポリエチレン、ポリプロピレン、エチレン酢酸ビニル共重合体、酸変性ポリプロピレン(例えば無水マレイン酸変性ポリプロピレン)、アイオノマーなどのイオン性高分子、マレイン酸変性ポリオレフィン(例えば、マレイン酸変性低密度ポリエチレン)、又はこれらの混合物が挙げられる。
 上記アイオノマーは、エチレンとメタクリル酸などの共重合体をNa,Mg,K,Ca,Zrなどの金属イオン、又は金属錯体、又はアンモニウム塩などのカチオンなどで架橋させたものが挙げられる。
A typical example of the constituent material of the coating resin layer 22 is thermoplastic polyolefin. Specifically, polyethylene, acid-modified polyethylene, polypropylene, ethylene vinyl acetate copolymer, acid-modified polypropylene (for example, maleic anhydride-modified polypropylene), ionic polymers such as ionomer, maleic acid-modified polyolefin (for example, maleic acid-modified polyolefin) Low density polyethylene), or mixtures thereof.
Examples of the ionomer include those obtained by crosslinking a copolymer such as ethylene and methacrylic acid with a metal ion such as Na, Mg, K, Ca, or Zr, a metal complex, or a cation such as an ammonium salt.
 被覆樹脂層22は、単層構造、成分や架橋状態などが異なる樹脂からなる多層構造のいずれも利用できる。多層構造の被覆樹脂層22として、接着層と表面層とを備える二層構造のものが挙げられる。例えば、接着層は上述の熱可塑性ポリオレフィン、表面層は上述の熱可塑性ポリオレフィンを架橋したもの(例えば、接着層の構成樹脂と同じ樹脂であって架橋したもの)が挙げられる。 The covering resin layer 22 can be a single layer structure or a multilayer structure made of resins having different components and cross-linked states. Examples of the coating resin layer 22 having a multilayer structure include a two-layer structure including an adhesive layer and a surface layer. For example, the adhesive layer includes the above-described thermoplastic polyolefin, and the surface layer includes the above-described thermoplastic polyolefin cross-linked (for example, the same resin as the constituent resin of the adhesive layer and cross-linked).
 多層構造の被覆樹脂層22では、成分や架橋状態などを選択することで、例えば、リード導体1の本体と被覆樹脂層22との密着性、容器11と被覆樹脂層22との密着性の双方を高められる。その結果、樹脂付きリード導体20における被覆樹脂層22を有する部分が曲げられたり、衝撃を受けたりしても、リード導体1の本体と被覆樹脂層22との間や容器11と被覆樹脂層22との間での被覆樹脂層22が剥離し難い。このような樹脂付きリード導体20を備える電力貯蔵デバイスは、リード導体1の本体に密着する被覆樹脂層22によって、リード導体1の本体の構成成分における電解液への溶出量を低減できる上に、容器11の封止状態を良好に維持できる。リード導体1の本体が上述の表面処理部を備える場合、この表面処理部に被覆樹脂層22を備えると、被覆樹脂層22の密着性がより優れて好ましい。 In the coating resin layer 22 having a multilayer structure, for example, both the adhesion between the main body of the lead conductor 1 and the coating resin layer 22 and the adhesion between the container 11 and the coating resin layer 22 can be selected by selecting a component, a crosslinked state, and the like. Can be enhanced. As a result, even if the portion having the coating resin layer 22 in the lead conductor 20 with resin is bent or subjected to an impact, the container 11 and the coating resin layer 22 are disposed between the main body of the lead conductor 1 and the coating resin layer 22. The covering resin layer 22 is difficult to peel off. The power storage device including such a lead conductor 20 with resin can reduce the amount of elution into the electrolyte in the constituent components of the main body of the lead conductor 1 by the coating resin layer 22 that is in close contact with the main body of the lead conductor 1. The sealed state of the container 11 can be maintained satisfactorily. When the main body of the lead conductor 1 includes the above-described surface treatment portion, it is preferable that the surface treatment portion includes the coating resin layer 22 because the adhesion of the coating resin layer 22 is more excellent.
 被覆樹脂層22の厚さがある程度厚いと、樹脂付きリード導体20が曲げられたり衝撃を受けたりした場合に被覆樹脂層22が破損し難く、逆に被覆樹脂層22の厚さが厚過ぎないことで樹脂付きリード導体20を薄くできる。被覆樹脂層22の厚さは、例えば20μm以上300μm以下が挙げられ、30μm以上290μm以下、更に40μm以上280μm以下、50μm以上200μm以下とすることができる。この厚さは、リード導体1の本体の表裏面にそれぞれ被覆樹脂層22を備える場合にはリード導体1の本体の一面に設けられた被覆樹脂層22の厚さとし、一面に設けられた被覆樹脂層22が多層構造であれば合計厚さとする。 If the coating resin layer 22 is thick to some extent, the coating resin layer 22 is not easily damaged when the lead conductor 20 with resin is bent or subjected to an impact, and conversely, the coating resin layer 22 is not too thick. Thus, the lead conductor 20 with resin can be thinned. The thickness of the coating resin layer 22 is, for example, 20 μm or more and 300 μm or less, and can be 30 μm or more and 290 μm or less, 40 μm or more and 280 μm or less, and 50 μm or more and 200 μm or less. This thickness is the thickness of the coating resin layer 22 provided on one surface of the main body of the lead conductor 1 when the coating resin layers 22 are provided on the front and back surfaces of the main body of the lead conductor 1, respectively. If the layer 22 has a multilayer structure, the total thickness is taken.
・用途
 実施形態のリード導体1や樹脂付きリード導体20は、電力貯蔵デバイスの正極、負極のいずれにも利用できるが、正極用リード導体に好適である。
-Use Although the lead conductor 1 of embodiment and the lead conductor 20 with resin can be utilized for any of the positive electrode of a power storage device, and a negative electrode, it is suitable for the lead conductor for positive electrodes.
・製造方法
 上述の特定の組成を有し、かつ高強度で導電性にも優れるリード導体1、更には伸びにも優れるリード導体1は、特定の組成のアルミニウム合金を用意し、圧延などの塑性加工と熱処理とを施すことで製造できる。
 塑性加工に供する素材としては、連続鋳造材やビレット鋳造材、その他連続鋳造圧延材を押し出した押出材などが挙げられる。
 熱処理は、軟化処理を含み、軟化処理の前後に塑性加工を行うことができる。このようなリード導体1としては、軟材、1/2硬材などが挙げられる。1/2硬材は、軟化処理後にある程度塑性加工を行ったり、塑性加工後に強度が低下し過ぎない程度に軟化処理を施したりすることで製造できる。少なくとも、引張強さ及び導電率が上述の特定の範囲を満たすように、熱処理条件や塑性加工の加工度などを調整する。
Manufacturing method The lead conductor 1 having the above-mentioned specific composition and having high strength and excellent conductivity, and the lead conductor 1 also excellent in elongation are prepared by preparing an aluminum alloy having a specific composition, and plasticity such as rolling. Manufactured by processing and heat treatment.
Examples of the material used for plastic working include a continuous cast material, a billet cast material, and an extruded material obtained by extruding a continuous cast rolled material.
The heat treatment includes softening treatment, and plastic processing can be performed before and after the softening treatment. Examples of the lead conductor 1 include soft materials and ½ hard materials. The ½ hard material can be manufactured by performing plastic processing to some extent after the softening treatment, or by performing a softening treatment to such an extent that the strength does not decrease too much after the plastic working. At least the heat treatment conditions and the degree of plastic working are adjusted so that the tensile strength and the electrical conductivity satisfy the specific ranges described above.
 被覆樹脂層22を備える樹脂付きのリード導体20は、例えば、以下の製造方法(A)又は(B)などによって製造すると、被覆樹脂層22の密着性に優れて好ましい。
(A)鋳造板を作製する⇒鋳造板に圧延を施す⇒圧延板に熱処理(軟化処理)を施す⇒ 表面処理を行う⇒処理板を帯状に切り離す⇒被覆樹脂層を形成する
(B)連続鋳造圧延材(ワイヤロッド)を作製する⇒
ワイヤロッドをコンフォーム押出によって板状に押し出す⇒押出板に圧延を施す⇒
圧延板に熱処理(軟化処理)を施す⇒表面処理を行う⇒処理板を帯状に切り離す⇒
被覆樹脂層を形成する
The lead conductor 20 with a resin including the coating resin layer 22 is preferably manufactured by, for example, the following manufacturing method (A) or (B) because the adhesiveness of the coating resin layer 22 is excellent.
(A) Fabricate the cast plate ⇒ Roll the cast plate ⇒ Apply heat treatment (softening treatment) to the rolled plate ⇒ Perform surface treatment ⇒ Cut the treated plate into strips ⇒ Form a coating resin layer (B) Continuous casting Create rolled material (wire rod) ⇒
Extrude wire rod into plate by conform extrusion ⇒ Roll the extruded plate ⇒
Apply heat treatment (softening treatment) to the rolled plate ⇒ Apply surface treatment ⇒ Cut the processed plate into strips ⇒
Form a coating resin layer
 表面処理の詳細は、上述の表面処理部の項を参照するとよい。被覆樹脂層22の詳細は、上述の被覆樹脂層22の項を参照するとよい。 For details of the surface treatment, refer to the section of the surface treatment section described above. The details of the coating resin layer 22 may be referred to the section of the coating resin layer 22 described above.
 軟化処理前の任意の時期に時効処理を行うことができる。時効処理を行う場合、時効処理前の任意の時期に溶体化処理を行うことができる。連続鋳造を行う場合には溶体化処理を省略することができる。時効処理によって、MgとSiとを含む化合物を析出させて、この析出物などによる分散強化による強度の向上と、AlへのMg及びSiの固溶量の低減による導電率の向上とを図ることができる。 Aging treatment can be performed at any time before softening treatment. When the aging treatment is performed, the solution treatment can be performed at any time before the aging treatment. When continuous casting is performed, the solution treatment can be omitted. A compound containing Mg and Si is precipitated by aging treatment, and the strength is improved by dispersion strengthening by the precipitates and the electrical conductivity is improved by reducing the solid solution amount of Mg and Si in Al. Can do.
・・圧延以前の工程
 (A)の鋳造板は、連続鋳造材とすると、急冷によって結晶を微細化し易い、長尺材が得られる、急冷によって過飽和固溶体を得易い、といった利点を有する。
 (B)の連続鋳造圧延材にコンフォーム押出を施すことで所望の形状、大きさの押出板を容易に形成できる上に、微細な結晶組織を有する押出板が得られる。
 圧延に供する素材が微細組織を有することで塑性加工性に優れ、圧延を良好に行える。 
.. Process before rolling When the cast plate of (A) is a continuous cast material, it has the advantages that it is easy to refine crystals by rapid cooling, a long material is obtained, and a supersaturated solid solution is easily obtained by rapid cooling.
By subjecting the continuous cast rolled material (B) to conform extrusion, an extruded plate having a desired shape and size can be easily formed, and an extruded plate having a fine crystal structure can be obtained.
Since the material used for rolling has a fine structure, it is excellent in plastic workability and can be rolled well.
・・圧延工程
 所望の厚さの圧延板(リード導体1の厚さである場合がある)が得られるように圧下率を調整して、熱間圧延や冷間圧延を行う。冷間圧延を施すことで、結晶をより一層微細にでき、適宜な時期に熱処理を行った場合でも微細な結晶組織を有するリード導体1を得易い。圧延途中で中間熱処理を行うことができる。中間熱処理を行うと、塑性加工性を高められる。
.. Rolling process Hot rolling or cold rolling is performed by adjusting the rolling reduction so as to obtain a rolled sheet having a desired thickness (which may be the thickness of the lead conductor 1). By performing cold rolling, the crystal can be made finer, and even when heat treatment is performed at an appropriate time, the lead conductor 1 having a fine crystal structure can be easily obtained. Intermediate heat treatment can be performed during rolling. When the intermediate heat treatment is performed, the plastic workability can be improved.
・・熱処理工程
 軟化処理や時効処理、溶体化処理といった熱処理は、長尺な素材に対して連続して行う連続処理、素材を雰囲気炉などの加熱用容器に封入した状態で行うバッチ処理のいずれも利用できる。連続処理は、直接通電方式、間接通電方式、炉式などが挙げられる。引張強さ及び導電率が所望の値となるように、連続処理方法に応じた制御パラメータ、例えば保持温度、保持時間、素材の供給速度、電流値、炉内温度などを調整する。
・ ・ Heat treatment process Heat treatment such as softening treatment, aging treatment, and solution treatment can be either continuous treatment for long materials or batch treatment in which the materials are sealed in a heating container such as an atmospheric furnace. Can also be used. Examples of the continuous treatment include a direct energization method, an indirect energization method, and a furnace method. Control parameters such as holding temperature, holding time, material supply speed, current value, furnace temperature, and the like are adjusted in accordance with the continuous processing method so that the tensile strength and the electrical conductivity become desired values.
 バッチ処理による溶体化処理、時効処理、軟化処理の条件の一例を以下に示す。
溶体化処理 保持温度:500℃以上580℃以下、保持時間:0.01時間以上10時間以下
時効処理 保持温度:100℃以上250℃以下、保持時間:2時間以上20時間以下
軟化処理 保持温度:250℃以上500℃以下、保持時間:0.5時間以上6時間以下 
An example of conditions for solution treatment, aging treatment, and softening treatment by batch treatment is shown below.
Solution treatment Holding temperature: 500 ° C. or more and 580 ° C. or less, Holding time: 0.01 hour or more and 10 hours or less Aging treatment Holding temperature: 100 ° C. or more and 250 ° C. or less, Holding time: 2 hours or more and 20 hours or less Softening treatment Holding temperature: 250 to 500 ° C., holding time: 0.5 to 6 hours
 熱処理の雰囲気は、酸素含有量が少ない雰囲気とすると、酸化膜の生成を抑制できる。具体的な雰囲気は、大気雰囲気、非酸化性雰囲気が挙げられる。非酸化性雰囲気は、減圧雰囲気(真空雰囲気)、窒素やアルゴンなどの不活性ガス雰囲気、水素や炭酸ガスなどを含む還元ガス雰囲気などが挙げられる。 If the atmosphere of the heat treatment is an atmosphere having a low oxygen content, generation of an oxide film can be suppressed. Specific atmospheres include an air atmosphere and a non-oxidizing atmosphere. Examples of the non-oxidizing atmosphere include a reduced pressure atmosphere (vacuum atmosphere), an inert gas atmosphere such as nitrogen and argon, and a reducing gas atmosphere containing hydrogen and carbon dioxide gas.
・・切り離し工程
 作製した所定の厚さのアルミニウム合金板をリード導体1の所定の幅に応じて切断して帯材とする。ここで、作製したアルミニウム合金板が例えば0.1mm以下といった薄板であっても、幅広の薄板の断面積はある程度大きいため、破断などし難く取り扱い易い。この幅広の薄板を例えば幅10mm以下に切断して細幅の帯材にすると断面積が小さくなる。しかし、この薄く細幅の帯材は、上述の特定の組成のアルミニウム合金で構成されて、引張強さ及び導電率が特定の範囲を満たすため、破断荷重が大きく破断し難い。従って、この薄く細幅の帯材(実施形態のリード導体1の一例)は、リード導体1自体の製造過程において破断し難く取り扱い易い上に、電力貯蔵デバイスの製造過程において屈曲されたり、衝撃を受けたりした場合にも破断し難い。帯材が長尺であれば、所定の長さに適宜切断するとよい。
.. Separation process The produced aluminum alloy plate having a predetermined thickness is cut according to a predetermined width of the lead conductor 1 to form a strip. Here, even if the produced aluminum alloy plate is a thin plate of, for example, 0.1 mm or less, the cross-sectional area of the wide thin plate is large to some extent, so that it is difficult to break and is easy to handle. When this wide thin plate is cut into, for example, a width of 10 mm or less to form a narrow strip, the cross-sectional area is reduced. However, this thin and narrow strip is made of the aluminum alloy having the specific composition described above, and the tensile strength and the electrical conductivity satisfy a specific range, so that the breaking load is large and it is difficult to break. Accordingly, this thin and narrow strip (an example of the lead conductor 1 of the embodiment) is not easily broken and easy to handle in the manufacturing process of the lead conductor 1 itself, and is bent or shocked in the manufacturing process of the power storage device. It is difficult to break even if it is received. If the strip is long, it may be appropriately cut to a predetermined length.
(電力貯蔵デバイス)
 実施形態の電力貯蔵デバイスは、正極と、負極と、電解液と、これらを収納する容器と、正極と外部の部材との間、負極と外部の部材との間をそれぞれ電気的に接続する2つのリード導体とを備える。実施形態の電力貯蔵デバイスは、2つのリード導体のうち、1つ又は2つが上述の実施形態のリード導体1(樹脂付きリード導体20の場合もある)である。
(Power storage device)
The power storage device according to the embodiment electrically connects a positive electrode, a negative electrode, an electrolyte, a container that stores these, a positive electrode and an external member, and a negative electrode and an external member. One lead conductor. In the power storage device of the embodiment, one or two of the two lead conductors are the lead conductor 1 of the above-described embodiment (there may be a lead conductor 20 with resin).
 各リード導体は、上記容器の内部から外部に亘って配置されて、一端側に正極又は負極が接続され、他端側に回路基板などの外部の部材が半田付けなどによって接続され、中間部に容器との固定領域を備える。リード導体の固定領域と容器との間には、樹脂層(上述の被覆樹脂層22、内側樹脂層112、及び接合樹脂層の少なくとも一つ)が介在する。  Each lead conductor is arranged from the inside to the outside of the container, and a positive electrode or a negative electrode is connected to one end side, and an external member such as a circuit board is connected to the other end side by soldering or the like. A fixing area with the container is provided. A resin layer (at least one of the above-described coating resin layer 22, inner resin layer 112, and bonding resin layer) is interposed between the lead conductor fixing region and the container. *
 実施形態の電力貯蔵デバイスのより具体的な形態は、非水電解液を用いる非水電解質電池や電気二重層キャパシタ、電解液の主溶媒を水とする水系電解質電池が挙げられる。非水電解質電池や電気二重層キャパシタ、水系電解質電池の基本的な構成、各構成要素の材質などは、公知技術を適用できる。 Specific examples of the power storage device of the embodiment include a non-aqueous electrolyte battery using a non-aqueous electrolyte, an electric double layer capacitor, and an aqueous electrolyte battery using water as a main solvent of the electrolyte. Known techniques can be applied to the basic configuration of the nonaqueous electrolyte battery, the electric double layer capacitor, the aqueous electrolyte battery, the material of each component, and the like.
 図1,図2は非水電解質電池10の一例を示す。
 この非水電解質電池10は、正極14と、負極15と、電解液(ここでは非水電解液)が含浸されたセパレータ13と、これらの電池要素を収納する袋状の容器11と、容器11に固定された二つの樹脂付きリード導体20とを備える。少なくとも一方の樹脂付きリード導体20(例えば、正極)は、上述の特定の組成のアルミニウム合金からなるリード導体1の本体と、リード導体1の本体の表裏面に接合された被覆樹脂層22とを備える。負極用リード導体(本体)として、例えば純ニッケルや純銅、純ニッケルめっき純銅などから構成されるものを利用できる。
 図2に示す被覆樹脂層22は、リード導体1の本体に接する接着層220と、容器11の内面に接する表面層222とを備える二重構造である。
1 and 2 show an example of a nonaqueous electrolyte battery 10.
The nonaqueous electrolyte battery 10 includes a positive electrode 14, a negative electrode 15, a separator 13 impregnated with an electrolytic solution (here, a nonaqueous electrolytic solution), a bag-like container 11 that houses these battery elements, and a container 11. And two lead conductors 20 with resin fixed to each other. At least one of the lead conductors 20 with resin (for example, positive electrode) includes a main body of the lead conductor 1 made of an aluminum alloy having the specific composition described above, and a coating resin layer 22 bonded to the front and back surfaces of the main body of the lead conductor 1. Prepare. As the negative electrode lead conductor (main body), for example, one made of pure nickel, pure copper, pure nickel-plated pure copper, or the like can be used.
The covering resin layer 22 shown in FIG. 2 has a double structure including an adhesive layer 220 in contact with the main body of the lead conductor 1 and a surface layer 222 in contact with the inner surface of the container 11.
 非水電解質電池10の正極14及び負極15は、代表的には、活物質を含む粉末成形体などから構成される活物質層であり、金属箔から構成される集電体16,集電体17上にそれぞれ形成される。集電体16(又は集電体17)とリード導体1の本体とは、例えばリード線19によって接続される(図2)。
 電気二重層キャパシタの正極及び負極はそれぞれ、固体活性炭が挙げられる。
The positive electrode 14 and the negative electrode 15 of the nonaqueous electrolyte battery 10 are typically an active material layer composed of a powder molded body containing an active material, etc., and are a current collector 16 and a current collector composed of metal foil. 17 is formed on each. The current collector 16 (or current collector 17) and the main body of the lead conductor 1 are connected by, for example, a lead wire 19 (FIG. 2).
As the positive electrode and the negative electrode of the electric double layer capacitor, solid activated carbon is exemplified.
 容器11は、金属層と樹脂層とを備えるものが代表的である。図2の容器11は、内側から順に内側樹脂層112、金属層110、外側樹脂層114を備える両面多層フィルムから構成された例を示す。容器11は、両面多層フィルムの周縁部分を熱融着することで密閉されて、図1に示すような袋状に形成される。容器11におけるリード導体1の固定領域では、容器11の内側樹脂層112と、樹脂付きリード導体20の被覆樹脂層22(ここでは表面層222)とを熱融着することで、樹脂付きリード導体20を容器11に固定すると共に容器11を密閉する。 The container 11 is typically provided with a metal layer and a resin layer. The container 11 of FIG. 2 shows the example comprised from the double-sided multilayer film provided with the inner side resin layer 112, the metal layer 110, and the outer side resin layer 114 in order from the inner side. The container 11 is sealed by heat-sealing the peripheral portion of the double-sided multilayer film, and is formed into a bag shape as shown in FIG. In the fixing region of the lead conductor 1 in the container 11, the inner resin layer 112 of the container 11 and the covering resin layer 22 (here, the surface layer 222) of the lead conductor 20 with resin are heat-sealed, thereby providing the lead conductor with resin. 20 is fixed to the container 11 and the container 11 is sealed.
 [試験例1]
 種々の組成のアルミニウム合金板から細幅の帯材を作製して、機械的特性、導電率を調べた。
[Test Example 1]
Narrow strips were made from aluminum alloy plates of various compositions, and the mechanical properties and conductivity were examined.
 各試料の帯材は、以下のように製造した。
 表1に示す組成(残部Al及び不可避不純物)の原料を用意して、以下の工程(I)又は(II)によって、厚さ0.05mmのアルミニウム合金板を作製する。得られた各アルミニウム合金板を幅5mm又は幅4mmに切断して、細幅の帯材とする。
(I)連続鋳造⇒コンフォーム押出⇒冷間圧延⇒軟化処理
(II)ビレット鋳造⇒溶体化処理⇒冷間圧延⇒軟化処理
The strip material of each sample was manufactured as follows.
A raw material having the composition shown in Table 1 (remainder Al and inevitable impurities) is prepared, and an aluminum alloy plate having a thickness of 0.05 mm is manufactured by the following step (I) or (II). Each obtained aluminum alloy plate is cut into a width of 5 mm or a width of 4 mm to obtain a narrow strip.
(I) Continuous casting ⇒ Conform extrusion ⇒ Cold rolling ⇒ Softening treatment (II) Billet casting ⇒ Solution treatment ⇒ Cold rolling ⇒ Softening treatment
 一部の試料には、冷間圧延の途中の適宜な時期に時効処理を行う。時効処理の条件は、保持温度が180℃、保持時間が16時間、表1では「180℃×16H」と示す。
 圧延後に軟化処理(この試験では最終熱処理)を施す。軟化処理の条件(軟化温度、雰囲気)を表1に示す。この試験では軟化処理をバッチ処理で行い、軟化温度の保持時間は、主として引張強さを指標として調整した。
 試料No.1-103には軟化処理を行っていない。
Some samples are subjected to an aging treatment at an appropriate time during the cold rolling. The conditions for the aging treatment are a holding temperature of 180 ° C., a holding time of 16 hours, and “180 ° C. × 16 H” in Table 1.
A softening treatment (final heat treatment in this test) is performed after rolling. Table 1 shows the conditions of the softening treatment (softening temperature, atmosphere). In this test, the softening treatment was performed by batch treatment, and the softening temperature holding time was adjusted mainly using the tensile strength as an index.
Sample No. No softening treatment is performed on 1-103.
 作製した各試料の帯材のうち、幅5mmの帯材を用いて引張試験(室温)を行い、引張強さ(MPa)、0.2%耐力(MPa)、破断伸び(%)を調べた。その結果を表2に示す。引張試験は、JIS Z 2241(2011年)に基づいて行う。 A tensile test (room temperature) was performed using a strip of 5 mm width among the strips of each sample prepared, and tensile strength (MPa), 0.2% proof stress (MPa), and elongation at break (%) were examined. . The results are shown in Table 2. The tensile test is performed based on JIS Z 2241 (2011).
 作製した各試料の帯材のうち、幅5mmの帯材を用いて四端子法で導電率(IACS%)を調べた。その結果を表2に示す。 The electrical conductivity (IACS%) was examined by a four-terminal method using a strip having a width of 5 mm among the strips of each prepared sample. The results are shown in Table 2.
 作製した各試料の帯材のうち、幅4mmの帯材を用いて、折り曲げ試験、衝撃試験を行い、破断するまでの折り曲げ回数(回)、衝撃によって破断する際のエネルギー(J/m)を調べた。その結果を表2に示す。 Using the 4 mm wide strip of each sample strip, the bending test and the impact test were performed. The number of times of folding until the fracture occurred (times) and the energy (J / m) at the time of the fracture due to the impact were calculated. Examined. The results are shown in Table 2.
 折り曲げ試験は、以下のように行う。図3に示すように、評点間距離Lが30mmの試料S(帯材)を二つ折れにする(黒塗り矢印参照)。二つ折れによって近接した試料Sの端部間の間隔Cが試料Sの厚さ0.05mmの2倍(ここでは0.1mm)と等しくなるように折り曲げる。二つ折れにした試料Sを開いて元に戻す(白抜き矢印参照)。この二つ折れと戻しとの一連の操作を1回とし、破断するまでの回数を調べる。回数が多いほど破断し難いといえる。 The bending test is performed as follows. As shown in FIG. 3, the sample S (strip) having a distance L between the scores of 30 mm is folded into two (see black arrows). Bending is performed so that the distance C between the ends of the sample S adjacent by folding is equal to twice the thickness of the sample S (0.05 mm in this example). Open the sample S folded in two and return it to its original position (see white arrow). This series of operations of folding and returning is considered as one time, and the number of times until it breaks is examined. It can be said that it is hard to break, so that there are many times.
 衝撃試験は、以下のように行う。図4に示すように、評点間距離Lが1mの試料Sの先端に錘wを取り付け(図4の左図)、錘wを1m上方に持ち上げた後(図4の中図)、自由落下させる(図4の右図)。この操作で試料Sが断線しない最大の錘wの重量(kg)を測定し、この重量に重力加速度(9.8m/s)と落下距離1mとをかけた積値を落下距離で割った値(J/m又は(N・m)/m)の大小で耐衝撃性を評価する。衝撃値が大きいほど、耐衝撃性に優れて破断し難いといえる。 The impact test is performed as follows. As shown in FIG. 4, a weight w is attached to the tip of a sample S having a distance L between the scores of 1 m (the left figure in FIG. 4), and after lifting the weight w upward by 1 m (the middle figure in FIG. 4), free fall (Right figure in FIG. 4). The weight (kg) of the maximum weight w at which the sample S does not break by this operation was measured, and the product value obtained by multiplying the weight by the gravitational acceleration (9.8 m / s 2 ) and the drop distance 1 m was divided by the drop distance. Impact resistance is evaluated by the magnitude of the value (J / m or (N · m) / m). It can be said that the larger the impact value, the better the impact resistance and the more difficult it is to break.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
 表2に示すようにMg及びSiを特定の範囲で含有する特定の組成のAl-Mg-Si系合金で構成された試料No.1-1~No.1-11はいずれも、引張強さが100MPa以上220MPa以下を満たし、かつ導電率が50%IACS以上であり、高強度で導電性にも優れることが分かる。試料No.1-1~No.1-11はいずれも引張強さが120MPa以上であり、多くの試料が130MPa以上である。また、試料No.1-1~No.1-11のうち多くの試料は、導電率が55%IACS以上、更に56%IACS以上である。そして、これらの試料No.1-1~No.1-11はいずれも、薄く細幅な帯材であるものの、屈曲したり衝撃を受けたりした場合に破断し難いことが分かる。Mgが多過ぎる試料No.1-101は、導電率が非常に低い上に(45%IACS未満)、破断し易いことが分かる。Siが少な過ぎる試料No.1-102は、引張強さが低過ぎ(ここでは100MPa未満、更に90MPa以下)、破断し易いことが分かる。軟化処理を行っていない試料No.1-103は引張強さが高過ぎ(ここでは220MPa超、更には300MPa以上)、破断し易いことが分かる。添加元素が少な過ぎる試料No.1-104は引張強さが低過ぎ(ここでは100MPa未満、更に90MPa以下)、破断し易いことが分かる。 As shown in Table 2, a sample No. composed of an Al—Mg—Si alloy having a specific composition containing Mg and Si in a specific range. 1-1-No. It can be seen that 1-11 has a tensile strength of 100 MPa or more and 220 MPa or less, an electrical conductivity of 50% IACS or more, high strength and excellent conductivity. Sample No. 1-1-No. No. 1-11 has a tensile strength of 120 MPa or more, and many samples have 130 MPa or more. Sample No. 1-1-No. Many of the samples 1-11 have a conductivity of 55% IACS or more, and further 56% IACS or more. These sample Nos. 1-1-No. Although 1-11 is a thin and narrow band material, it can be seen that it is difficult to break when bent or subjected to an impact. Sample No. with too much Mg It can be seen that 1-101 is very low in electrical conductivity (less than 45% IACS) and easily breaks. Sample No. with too little Si 1-102 shows that the tensile strength is too low (here, less than 100 MPa, and further 90 MPa or less), and it tends to break. Sample No. not softened. It can be seen that 1-103 has an excessively high tensile strength (here, more than 220 MPa, and more than 300 MPa), and is easily broken. Sample No. with too few added elements 1-104 shows that the tensile strength is too low (here, less than 100 MPa, and further 90 MPa or less), and it tends to break.
 この試験では、厚さ0.1mm以下、幅10mm以下の薄く細幅な帯材に対して、曲げ半径が試料の厚さ以下である曲げを行っているものの、更には繰り返し曲げを行っているものの、試料No.1-1~No.1-11はいずれも折り曲げ回数が5回以上であり、破断し難いことが分かる。ここで、例えば、リチウムイオン二次電池などの電力貯蔵デバイスに備えるリード導体を所定の形状に折り曲げて外部の部材に固定した場合、その後の製造過程で、この折り曲げ部分を開くような操作を行うことは通常無い。しかし、上記電力貯蔵デバイスを備える携帯機器類を落下するなどして、リード導体が衝撃を受けた場合に上記折り曲げ部分を開くような力が加わる可能性がある。試料No.1-1~No.1-11の薄く細幅の帯材はいずれも、繰り返しの曲げによっても破断し難いため、リチウムイオン二次電池などの電力貯蔵デバイスのリード導体に利用されて落下などの衝撃を受けた場合でも、破断せず、所定の折り曲げ形状を良好に維持できると期待される。 In this test, a thin and narrow strip having a thickness of 0.1 mm or less and a width of 10 mm or less is bent with a bending radius equal to or less than the thickness of the sample, but is further repeatedly bent. However, sample no. 1-1-No. It can be seen that 1-11 has a number of folding times of 5 or more and is difficult to break. Here, for example, when a lead conductor provided in a power storage device such as a lithium ion secondary battery is bent into a predetermined shape and fixed to an external member, an operation for opening the bent portion is performed in the subsequent manufacturing process. There is usually no such thing. However, there is a possibility that a force is applied to open the bent portion when the lead conductor receives an impact, for example, by dropping portable devices including the power storage device. Sample No. 1-1-No. Any of the thin and thin strips of 1-11 are not easily broken by repeated bending, so even if they are used as lead conductors for power storage devices such as lithium ion secondary batteries and are subjected to impacts such as dropping. It is expected that the predetermined bent shape can be satisfactorily maintained without breaking.
 また、この試験では、厚さ0.1mm以下、幅10mm以下の薄く細幅な帯材に対して、2.0J/m以上といった大きな衝撃荷重を受けた場合でも破断し難いことが分かる。このような耐衝撃性に優れる試料No.1-1~No.1-11の薄く細幅の帯材はいずれも、リチウムイオン二次電池などの電力貯蔵デバイスのリード導体に利用されて落下などの衝撃を受けた場合でも、破断し難いと期待される。更にはこのような耐衝撃性に優れる特定組成の試料群の薄く細幅の帯材は上述のような所定の形状に折り曲げられた状態で衝撃を受けた場合にも破断し難いと期待される。 Also, in this test, it can be seen that it is difficult to break even when a thin impact material having a thickness of 0.1 mm or less and a width of 10 mm or less is subjected to a large impact load of 2.0 J / m or more. Sample No. having such excellent impact resistance. 1-1-No. Any of the thin and thin strips of 1-11 is expected to hardly break even when it is used as a lead conductor of a power storage device such as a lithium ion secondary battery and receives an impact such as dropping. Furthermore, a thin and narrow strip of a sample group having a specific composition excellent in impact resistance is expected to be difficult to break even when subjected to an impact in a state of being bent into a predetermined shape as described above. .
 このような結果が得られた理由の一つとして、試料No.1-1~No.1-11はいずれも、引張強さが特定の範囲を満たすことに加えて、耐力が高く、更には伸びにも優れることが考えられる。具体的には、試料No.1-1~No.1-11はいずれも、0.2%耐力が40MPa以上、更には50MPa以上であり、多くの試料は60MPa以上であり、破断伸びが5%以上、更には6%以上である。別の理由の一つとして、試料No.1-1~No.1-11はいずれも、微細な結晶組織を有していること、特にTi及びBの少なくとも一方を特定の範囲で含有する試料は、より微細な結晶組織を有していることが考えられる。試料No.1-1~No.1-11の断面を光学顕微鏡で観察して結晶粒径を調べたところ、いずれの試料も平均結晶粒径が50μm以下であり、TiやBを含有する試料では更に微細な結晶であった。平均結晶粒径は、JIS G 0551(鋼-結晶粒度の顕微鏡試験方法、2005年)に準拠して切断法によって求める。 As one of the reasons why such a result was obtained, sample No. 1-1-No. All of 1-11 are considered to have high tensile strength and excellent elongation in addition to satisfying a specific range of tensile strength. Specifically, Sample No. 1-1-No. 1-11 has a 0.2% proof stress of 40 MPa or more, further 50 MPa or more, many samples have 60 MPa or more, and elongation at break of 5% or more, further 6% or more. As another reason, sample No. 1-1-No. It is conceivable that 1-11 has a fine crystal structure, in particular, a sample containing at least one of Ti and B in a specific range has a finer crystal structure. Sample No. 1-1-No. When the crystal grain size was examined by observing the section 1-11 with an optical microscope, all of the samples had an average crystal grain size of 50 μm or less, and the samples containing Ti and B were finer crystals. The average crystal grain size is determined by a cutting method in accordance with JIS G 0551 (steel-crystal grain size microscopic test method, 2005).
 その他、この試験から以下のことが分かる。
・MgやSiの含有量を特定の範囲内で多くしたり、又はCuなどの特定の添加元素を特定の範囲で含有したりすることで、引張強さや耐力をより高め易い。
・薄く細幅であっても、高強度で破断し難く、導電性にも優れる帯材は、特定の成分とすると共に塑性加工と熱処理との条件を制御することで製造できる。
 例えば、同じ組成である試料No.1-4と試料No.1-103とを比較すれば、塑性加工材に軟化処理を行うことで、高強度で伸びにも優れるものが得られることが分かる。同じ組成である試料No.1-4と試料No.1-5とを比較すれば、適宜な時期に時効処理を行うことで強度により優れるものが得られることが分かる。
In addition, the following can be understood from this test.
-Increasing the content of Mg or Si within a specific range or containing a specific additive element such as Cu within a specific range makes it easier to increase the tensile strength and the yield strength.
-Even if it is thin and narrow, it can be manufactured by controlling the conditions of plastic working and heat treatment while using a specific component as well as having a high strength, being difficult to break, and excellent in electrical conductivity.
For example, Sample No. having the same composition. 1-4 and Sample No. Comparing with 1-103, it can be seen that a plastic material having a high strength and excellent elongation can be obtained by performing a softening treatment. Sample No. having the same composition. 1-4 and Sample No. Comparing with 1-5, it can be seen that an aging treatment can be performed at an appropriate time to obtain a superior strength.
 [試験例2]
 試験例1で作製した試料No.1-11の組成のアルミニウム合金からなる帯材を用いて樹脂付きリード導体の模擬試料を作製し、拡散抵抗値と樹脂の接合強度とを調べた。
[Test Example 2]
Sample No. produced in Test Example 1 Using a strip made of an aluminum alloy having a composition of 1-11, a simulated sample of a lead conductor with resin was prepared, and the diffusion resistance value and the bonding strength of the resin were examined.
 樹脂付きリード導体の模擬試料は、以下のように作製した。
 表1に示す試料No.1-11の組成のアルミニウム合金板(Mg:0.48質量%、Si:0.19質量%、Ti:0.02質量%、B:0.005質量%、厚さ0.05mm)を幅10mm、長さ45mmに切断して薄く細幅の帯材を作製し、表3に示す表面処理を施してから又は表面処理を行わず、樹脂を接合する。
A simulated sample of the lead conductor with resin was prepared as follows.
Sample No. shown in Table 1 1-11 aluminum alloy plate (Mg: 0.48 mass%, Si: 0.19 mass%, Ti: 0.02 mass%, B: 0.005 mass%, thickness 0.05 mm) width A thin and narrow strip is prepared by cutting to 10 mm and a length of 45 mm, and the resin is joined after the surface treatment shown in Table 3 or without the surface treatment.
 表面処理を施す試料は、帯材の表裏面の全面に表面処理を施し(表裏面全面が表面処理部である)、帯材の端面及び側面には表面処理を施していない。なお、前記試料は切断前のアルミニウム合金板の表裏面に表面処理を施した後、帯材に切断してもよい。 The sample subjected to the surface treatment is subjected to the surface treatment on the entire front and back surfaces of the strip (the entire front and back surfaces are the surface treatment portion), and the end surface and side surfaces of the strip are not subjected to the surface treatment. In addition, you may cut | disconnect the said sample, after giving surface treatment to the front and back of the aluminum alloy plate before a cutting | disconnection.
 表3に示す表面処理の詳細は以下の通りである。
・化成処理I,III,IVは、アイオノマーを形成可能な市販の化成処理液を用いた化成処理とし、化成膜の平均厚さが表3に示す値(10nm,30nm,300nm)となるように化成処理液の浸漬時間を調整する。
・化成処理IIは、市販の処理液を用いたクロメート処理である。
・粗面化I,IIは、市販のアルカリ系エッチング液を用いたエッチング処理とし、平均ピット深さが表3に示す値(1μm,0.5μm)となるようにエッチング時間を調整する。
・ベーマイトI,IIは、95℃の純水を用いたベーマイト処理とし、表3に示すように処理時間が異なる(15分間、20秒間)。
・アルマイトI,IIは、硫酸水溶液を用いた陽極酸化処理とし、アルマイト層の平均厚さが0.5μmとなるように処理時間を調整する。アルマイトIでは、陽極酸化後に封孔処理を行わず、アルマイトIIでは、陽極酸化後に封孔処理を行う。
・ブラストは、市販の空気式ブラスト装置を用いて、表3に示す条件(ショット材:#120のアルミナ粒子、圧力:0.3MPa)で行うブラスト処理である。
The details of the surface treatment shown in Table 3 are as follows.
The chemical conversion treatments I, III, and IV are chemical conversion treatments using commercially available chemical conversion treatment solutions capable of forming ionomers, and the average thickness of chemical film formation is the values shown in Table 3 (10 nm, 30 nm, 300 nm). The immersion time of the chemical conversion treatment solution is adjusted.
Chemical conversion treatment II is a chromate treatment using a commercially available treatment solution.
The roughening I and II are etching treatments using a commercially available alkaline etching solution, and the etching time is adjusted so that the average pit depth becomes the values shown in Table 3 (1 μm, 0.5 μm).
Boehmite I and II are boehmite treatments using pure water at 95 ° C., and the treatment times are different as shown in Table 3 (15 minutes, 20 seconds).
Alumite I and II are anodized using an aqueous sulfuric acid solution, and the treatment time is adjusted so that the average thickness of the alumite layer is 0.5 μm. In anodized I, sealing treatment is not performed after anodization, and in anodized II, sealing treatment is performed after anodization.
Blasting is a blasting process performed under the conditions shown in Table 3 (shot material: # 120 alumina particles, pressure: 0.3 MPa) using a commercially available pneumatic blasting apparatus.
 上述の表面処理を施した各試料No.2-11~No.2-18,No.2-112~No.2-114の帯材、及び表面処理を施していない試料No.2-111の帯材の表裏面に樹脂を接合する。
 各試料における接合する樹脂は、酸変性ポリプロピレンからなる接着層(厚さ25μm)と、酸変性ポリプロピレンを架橋した表面層とを備える二重構造の樹脂フィルムを用いる。各試料の帯材の表裏面を挟むように、試料ごとに2枚の樹脂フィルムを用いる。
 各試料に用いる樹脂フィルムごとの表面層の厚さは、接着層と表面層との合計厚さが表3の「樹脂厚さ」となるように調整する。
Each sample No. 1 subjected to the above surface treatment was used. 2-11-No. 2-18, no. 2-112 ~ No. No. 2-114 strip and sample No. No surface treatment. Resin is bonded to the front and back surfaces of the 2-111 strip.
As the resin to be joined in each sample, a double-structure resin film including an adhesive layer (thickness 25 μm) made of acid-modified polypropylene and a surface layer obtained by crosslinking acid-modified polypropylene is used. Two resin films are used for each sample so as to sandwich the front and back surfaces of the strip of each sample.
The thickness of the surface layer for each resin film used in each sample is adjusted so that the total thickness of the adhesive layer and the surface layer becomes “resin thickness” in Table 3.
 各試料の帯材の表裏面における所定の領域を除いて、2枚の樹脂フィルムで帯材を挟み、熱プレスによって樹脂フィルムを帯材の表裏面に接合する。接合条件は、加熱温度:260℃、圧力:0.2MPa、加熱時間:10秒である。この工程によって、帯材の一部が樹脂から露出した樹脂付きリード導体の模擬試料が得られる。
 拡散抵抗値の測定に用いる模擬試料では、帯材においてリード線を接続する一縁側の領域(図5では上端縁側の領域で10mm×長さ10mm)を樹脂フィルムから露出させる。各樹脂フィルムは、25mm×長さ45mmである。
 樹脂の接合強度の測定に用いる模擬試料では、帯材において、両縁側の領域を樹脂フィルムから露出させる(図7では左右縁側の領域)。各樹脂フィルムは、5mm×長さ60mmである。
Except for a predetermined region on the front and back surfaces of the band material of each sample, the band material is sandwiched between two resin films, and the resin film is bonded to the front and back surfaces of the band material by hot pressing. The joining conditions are heating temperature: 260 ° C., pressure: 0.2 MPa, and heating time: 10 seconds. By this step, a simulated sample of a lead conductor with resin in which a part of the strip is exposed from the resin is obtained.
In the simulated sample used for the measurement of the diffusion resistance value, a region on one edge side where the lead wire is connected in the strip (10 mm in the region on the upper edge side in FIG. 5 × 10 mm in length) is exposed from the resin film. Each resin film is 25 mm × length 45 mm.
In the simulated sample used for measuring the bonding strength of the resin, the regions on both sides of the strip are exposed from the resin film (regions on the left and right sides in FIG. 7). Each resin film is 5 mm × length 60 mm.
(拡散抵抗値)
 図5に示すように、リード導体の本体を模擬した帯材S1と樹脂層S22とを備える模擬試料SS1と、対極302と、電解液304とを用いて電気化学測定セル300を構築し、電解液304に模擬試料SS1を所定時間浸漬した後に交流インピーダンススペクトルを用いて、拡散抵抗値を算出する(特許文献1も参照)。その結果を表3に示す。
(Diffusion resistance value)
As shown in FIG. 5, an electrochemical measurement cell 300 is constructed using a simulated sample SS1 including a strip S1 simulating a main body of a lead conductor and a resin layer S22, a counter electrode 302, and an electrolytic solution 304. After the simulated sample SS1 is immersed in the liquid 304 for a predetermined time, a diffusion resistance value is calculated using an AC impedance spectrum (see also Patent Document 1). The results are shown in Table 3.
 いずれの試料についても、対極302は、Alを99.999質量%含む純アルミニウムからなる線材(直径0.5mm×長さ50mm)とする。対極302には、電解液304に対する耐性を十分に有し、かつ電位安定性に優れる種々のものを適宜利用できる。
 いずれの試料についても、電解液304は、リチウムイオン二次電池の電解液に利用されているものとする。ここでは、電解質がLiPF(電解質のモル濃度:1mol/L)、溶媒がEC:DMC:DEC=1:1:1(V/V%)の混合有機溶媒であるもの(キシダ化学株式会社製電解液)とする。ECはエチレンカーボネート、DMCはジメチルカーボネート、DECはジエチルカーボネート、V/V%は、体積比を意味する。
In any sample, the counter electrode 302 is a wire rod (diameter 0.5 mm × length 50 mm) made of pure aluminum containing 99.999% by mass of Al. As the counter electrode 302, various electrodes having sufficient resistance to the electrolytic solution 304 and excellent in potential stability can be used as appropriate.
In any sample, the electrolytic solution 304 is used as an electrolytic solution for a lithium ion secondary battery. Here, the electrolyte is LiPF 6 (molar concentration of electrolyte: 1 mol / L) and the solvent is a mixed organic solvent of EC: DMC: DEC = 1: 1: 1 (V / V%) (manufactured by Kishida Chemical Co., Ltd.) Electrolyte). EC is ethylene carbonate, DMC is dimethyl carbonate, DEC is diethyl carbonate, and V / V% means volume ratio.
 図5に示すように模擬試料SS1及び対極302にそれぞれリード線を接続し、両リード線を更に交流インピーダンススペクトルの測定装置310に接続する。有底筒状の容器に電解液304を充填し、各模擬試料SS1の樹脂層S22のみが電解液304に接触し、帯材S1におけるリード線の接続箇所が電解液304に接触しないように、各模擬試料SS1を電解液304に浸漬すると共に対極302を電解液304に浸漬する。こうすることで、電気化学測定セル300を構築する。
 上述の電気化学測定セル300を恒温槽(図示せず)に装入して、電解液304の温度を60℃に維持し、この浸漬状態を1週間(1W、168時間)保持する。
 1週間後、各模擬試料SS1の交流インピーダンススペクトルを電解液304中で測定し、測定した交流インピーダンススペクトルから拡散抵抗値を算出する。
 拡散抵抗値(ワールブルグインピーダンス)は、図6に示す等価回路を用いたシミュレーションによる解析を利用して算出する。等価回路は、拡散抵抗値をWとするとき、拡散抵抗値Wに直列な電荷移動抵抗Rpと、拡散抵抗値Wと電荷移動抵抗Rpとに並列する静電容量Cと、この並列回路に直列する電解液抵抗Rsとによって表わされる。
As shown in FIG. 5, lead wires are connected to the simulated sample SS1 and the counter electrode 302, respectively, and both lead wires are further connected to the AC impedance spectrum measuring device 310. Fill the bottomed cylindrical container with the electrolytic solution 304, so that only the resin layer S22 of each simulated sample SS1 is in contact with the electrolytic solution 304, and the connection portion of the lead wire in the strip S1 is not in contact with the electrolytic solution 304. Each simulated sample SS1 is immersed in the electrolytic solution 304, and the counter electrode 302 is immersed in the electrolytic solution 304. In this way, the electrochemical measurement cell 300 is constructed.
The above-described electrochemical measurement cell 300 is inserted into a thermostatic bath (not shown), the temperature of the electrolytic solution 304 is maintained at 60 ° C., and this immersion state is maintained for one week (1 W, 168 hours).
After one week, the AC impedance spectrum of each simulated sample SS1 is measured in the electrolyte solution 304, and the diffusion resistance value is calculated from the measured AC impedance spectrum.
The diffusion resistance value (Warburg impedance) is calculated using analysis by simulation using the equivalent circuit shown in FIG. When the diffusion resistance value is W, the equivalent circuit has a charge transfer resistance Rp in series with the diffusion resistance value W, a capacitance C in parallel with the diffusion resistance value W and the charge transfer resistance Rp, and a series connection with the parallel circuit. The electrolyte resistance Rs.
 交流インピーダンススペクトルの測定条件は、振幅:25mV、測定周波数範囲:100kHz~100mHzである。
 測定周波数(=交流インピーダンススペクトルの測定点)は、周波数の変化量が10倍になるごとに10点とし、対数スケールで周波数を変えて、交流インピーダンススペクトルを測定する。この例では、交流インピーダンススペクトルの測定点数は、100kHz~10kHzで10点、全体で60点である。各測定周波数における交流インピーダンススペクトルの各データを、上述の等価回路を用いたシミュレーションによって再現して、図6に示す等価回路の各パラメータを見積もる。このシミュレーションの結果を利用して拡散抵抗値を算出する。
 交流インピーダンススペクトルの測定装置、交流インピーダンススペクトルの測定ソフトウェア、解析ソフトウェアには、市販のものを利用して、交流インピーダンススペクトルを自動的に測定、解析を行うことができる。
 例えば、測定装置は、VersaSTAT4-400+VersaSTAT LC(プリンストンアプライドリサーチ社)、測定ソフトウェアはVersaStudio(プリンストンアプライドリサーチ社)、解析ソフトウェアはZview(Scribner Associates Inc.)などが利用できる。
The measurement conditions for the AC impedance spectrum are: amplitude: 25 mV, measurement frequency range: 100 kHz to 100 mHz.
The measurement frequency (= measurement point of the AC impedance spectrum) is 10 points every time the frequency change amount is 10 times, and the AC impedance spectrum is measured by changing the frequency on a logarithmic scale. In this example, the number of AC impedance spectrum measurement points is 10 points from 100 kHz to 10 kHz, and 60 points in total. Each data of the AC impedance spectrum at each measurement frequency is reproduced by simulation using the above-described equivalent circuit, and each parameter of the equivalent circuit shown in FIG. 6 is estimated. The diffusion resistance value is calculated using the result of this simulation.
AC impedance spectrum can be automatically measured and analyzed using commercially available AC impedance spectrum measuring apparatus, AC impedance spectrum measuring software, and analysis software.
For example, VersaSTAT4-400 + VersaSTAT LC (Princeton Applied Research) can be used as the measurement device, VersaStudio (Princeton Applied Research) can be used as the measurement software, and Zview (Scribner Associates Inc.) can be used as the analysis software.
(樹脂の接合強度)
 図7に示すリード導体の本体を模擬した帯材S1と、その表裏面にそれぞれ接合された樹脂フィルムS22a,樹脂フィルムS22bとを備える模擬試料SS2の全体を電解液に所定時間浸漬した後、以下のようにしてピール強度を測定する。その結果を表3に示す。
(Resin bond strength)
After immersing the entire simulated sample SS2 including the strip material S1 simulating the main body of the lead conductor shown in FIG. 7 and the resin film S22a and the resin film S22b respectively bonded to the front and back surfaces in an electrolytic solution for a predetermined time, The peel strength is measured as follows. The results are shown in Table 3.
 電解液は、拡散抵抗値の測定に用いたものと同様のもの(キシダ化学株式会社製電解液)を用いる。恒温槽を利用して、電解液の温度を80℃に維持し、この浸漬状態を1週間(1W=168時間)、4週間(4W)、8週間(8W)保持する。
 所定の浸漬時間経過後(ここでは1W後又は4W後又は8W後)、電解液から模擬試料SS2を取り出し、図8の左図に示すように一方の樹脂フィルムS22aと帯材S1とを切断して、二つに分割する(分割片S1s,分割片S1l、フィルム片la,フィルム片sa)。模擬試料SS2は一方の分割片S1sの長さよりも、他方の分割片S1lの長さが十分に長くなるように分割する。
 分割された分割片S1l,分割片S1sは、他方の樹脂フィルムS22bに接合されている。この他方の樹脂フィルムS22bを図8の右図に示すように、長い分割片S1lから短い分割片S1sが離れるように折り返す。
 長い分割片S1lと短い分割片S1sとを市販の引張試験装置(図示せず)に把持させて、図8の右図の黒矢印に示すように分割片S1l,分割片S1sが離れる方向(図8の右図では上下方向)に引っ張る。引っ張る力が大きくなるにつれて、他方の樹脂フィルムS22bは、長い分割片S1lから剥がされる。
 この試験では、他方の樹脂フィルムS22bが長い分割片S1lから完全に剥がされるまでの最大の引張力をピール強度(N)とし、n=3の平均値を表3に示す。ピール強度(N)が大きいほど、帯材S1と樹脂フィルムS22bとの密着性に優れるといえる。
As the electrolytic solution, the same one as used for measuring the diffusion resistance value (electrolytic solution manufactured by Kishida Chemical Co., Ltd.) is used. The temperature of the electrolytic solution is maintained at 80 ° C. using a thermostatic bath, and this immersion state is maintained for 1 week (1 W = 168 hours), 4 weeks (4 W), and 8 weeks (8 W).
After a predetermined immersion time has elapsed (here, after 1 W, after 4 W, or after 8 W), the simulated sample SS2 is taken out from the electrolyte, and one resin film S22a and the strip S1 are cut as shown in the left diagram of FIG. Then, it is divided into two (divided piece S1s, divided piece S1l, film piece la, film piece sa). The simulated sample SS2 is divided so that the length of the other divided piece S1l is sufficiently longer than the length of the one divided piece S1s.
The divided pieces S1l and divided pieces S1s that are divided are joined to the other resin film S22b. As shown in the right figure of FIG. 8, this other resin film S22b is folded back so that the short divided piece S1s is separated from the long divided piece S1l.
The long split piece S1l and the short split piece S1s are gripped by a commercially available tensile tester (not shown), and the split pieces S1l and the split pieces S1s are separated from each other as shown by the black arrows in the right diagram of FIG. Pull up and down in the right figure of 8). As the pulling force increases, the other resin film S22b is peeled off from the long divided piece S1l.
In this test, the maximum tensile force until the other resin film S22b is completely peeled from the long segment S1l is defined as peel strength (N), and the average value of n = 3 is shown in Table 3. It can be said that the greater the peel strength (N), the better the adhesion between the strip S1 and the resin film S22b.
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000003
 表3に示すように、Mg及びSiを特定の範囲で含有する特定の組成のAl-Mg-Si系合金で構成された帯材に表面処理を行うことで、特に化成処理、ベーマイト処理、アルマイト処理、及びエッチングから選択される1種の表面処理を行ったり、その処理条件を調整したりすることで、樹脂層との密着性に優れ、拡散抵抗値が大きいアルミニウム合金となることが分かる。 As shown in Table 3, surface treatment is performed on a band material made of an Al—Mg—Si alloy having a specific composition containing Mg and Si in a specific range, in particular, chemical conversion treatment, boehmite treatment, alumite It can be seen that by performing one type of surface treatment selected from treatment and etching, or adjusting the treatment conditions, an aluminum alloy having excellent adhesion to the resin layer and a large diffusion resistance value can be obtained.
 この試験では、試料No.2-11~No.2-18はいずれも、拡散抵抗値が5×10Ω/cm以上であり、多くの試料は10×10Ω/cm以上である。また、試料No.2-11~No.2-18はいずれも、8W後のピール強度が3N以上であり、多くの試料は4N以上であり、更には5N以上の試料も多く、長期に亘り、樹脂層が剥離し難いことが分かる。このことから、拡散抵抗値が大きい理由の一つとして、樹脂層が剥離せず密着しており、各試料の帯材における電解液との接触面積を低減できたことが考えられる。 In this test, sample no. 2-11-No. 2-18 has a diffusion resistance value of 5 × 10 5 Ω / cm 2 or more, and many samples have a value of 10 × 10 5 Ω / cm 2 or more. Sample No. 2-11-No. As for 2-18, the peel strength after 8 W is 3N or more, many samples are 4N or more, and further, many samples are 5N or more, and it can be seen that the resin layer is difficult to peel over a long period of time. From this, it is considered that one of the reasons why the diffusion resistance value is large is that the resin layer is in close contact without being peeled off, and the contact area with the electrolytic solution in the strip of each sample can be reduced.
 拡散抵抗値が大きい試料No.2-11~No.2-18の帯材を電力貯蔵デバイスのリード導体に利用した場合、帯材の構成成分が電解液に溶出することを低減でき、電解液に対する耐性にも優れると期待される。また、適切な表面処理方法や処理条件を選択することで、このような電解液に対する耐性にも優れるリード導体が得られるといえる。 Sample No. with large diffusion resistance 2-11-No. When the 2-18 strip is used as the lead conductor of the power storage device, it is expected that the constituent components of the strip can be reduced from being eluted into the electrolyte, and the resistance to the electrolyte is excellent. Moreover, it can be said that the lead conductor excellent also in the tolerance with respect to such electrolyte solution is obtained by selecting an appropriate surface treatment method and process conditions.
 試料No.2-11~No.2-18の帯材について表面処理部の算術平均粗さRa(JIS B 0601、2001年)を市販の粗さ測定機によって測定したところ(評価長さ3μm、n=9の平均値)、0.1μm以上0.5μm以下である。このように適切に粗面化されていることで、樹脂との密着性に優れると考えられる。 Sample No. 2-11-No. The arithmetic average roughness Ra (JIS B 0601, 2001) of the surface-treated portion of the 2-18 strip was measured with a commercially available roughness measuring machine (evaluation length 3 μm, n = 9 average value). .1 μm or more and 0.5 μm or less. Thus, it is thought that it is excellent in adhesiveness with resin by roughening appropriately.
 本発明は、これらの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味及び範囲内での全ての変更が含まれることが意図される。例えば、試験例1,2のアルミニウム合金の組成、帯材の幅及び厚さ、表面処理方法、処理条件、被覆樹脂層の材質・厚さなどを適宜変更することができる。 The present invention is not limited to these exemplifications, but is defined by the scope of the claims, and is intended to include all modifications within the scope and meaning equivalent to the scope of the claims. For example, the composition of the aluminum alloys of Test Examples 1 and 2, the width and thickness of the strip, the surface treatment method, the treatment conditions, the material and thickness of the coating resin layer, and the like can be changed as appropriate.

Claims (9)

  1.  正極と、負極と、電解液と、これらを収納する容器とを備える電力貯蔵デバイスに用いられるリード導体であって、
     Siを0.1質量%以上1.2質量%以下含有すると共に、
     Mgを、質量比でMg/Siが0.8以上2.7以下、かつ1.5質量%未満を満たす範囲で含有するアルミニウム合金から構成され、
     引張強さが100MPa以上220MPa以下であり、
     導電率が50%IACS以上であるリード導体。
    A lead conductor used in a power storage device including a positive electrode, a negative electrode, an electrolytic solution, and a container for storing these,
    While containing 0.1 mass% or more and 1.2 mass% or less of Si,
    Mg is composed of an aluminum alloy containing Mg / Si in a range satisfying a mass ratio of 0.8 to 2.7 and less than 1.5% by mass,
    Tensile strength is 100 MPa or more and 220 MPa or less,
    A lead conductor having a conductivity of 50% IACS or more.
  2.  0.2%耐力が40MPa以上である請求項1に記載のリード導体。 The lead conductor according to claim 1, wherein the 0.2% proof stress is 40 MPa or more.
  3.  厚さが0.03mm以上0.1mm以下、幅が1mm以上10mm以下である請求項1又は請求項2に記載のリード導体。 The lead conductor according to claim 1, wherein the lead conductor has a thickness of 0.03 mm to 0.1 mm and a width of 1 mm to 10 mm.
  4.  拡散抵抗値が5×10Ω・cm-2以上である請求項1~請求項3のいずれか1項に記載のリード導体。 4. The lead conductor according to claim 1, wherein the diffusion resistance value is 5 × 10 5 Ω · cm −2 or more.
  5.  前記リード導体の表面の少なくとも一部に化成処理、ベーマイト処理、アルマイト処理、及びエッチングから選択される1種が施された表面処理部を備える請求項1~請求項4のいずれか1項に記載のリード導体。 The surface treatment portion according to any one of claims 1 to 4, further comprising a surface treatment portion on which at least a part selected from chemical conversion treatment, boehmite treatment, alumite treatment, and etching is applied to at least a part of the surface of the lead conductor. Lead conductor.
  6.  前記アルミニウム合金は、Cu,Fe,Cr,Mn,Zn,Ni,Ag,及びZrから選択される1種以上の元素を合計で0.005質量%以上1質量%以下含有する請求項1~請求項5のいずれか1項に記載のリード導体。 The aluminum alloy contains a total of one or more elements selected from Cu, Fe, Cr, Mn, Zn, Ni, Ag, and Zr in a range of 0.005% by mass to 1% by mass. 6. The lead conductor according to any one of items 5.
  7.  前記アルミニウム合金は、Tiを0.01質量%以上0.05質量%以下及びBを0.001質量%以上0.008質量%以下の少なくとも一方を含有する請求項1~請求項6のいずれか1項に記載のリード導体。 7. The aluminum alloy according to claim 1, wherein the aluminum alloy contains at least one of Ti of 0.01% by mass to 0.05% by mass and B of 0.001% by mass to 0.008% by mass. The lead conductor according to item 1.
  8.  前記リード導体における前記容器との固定領域に接合される被覆樹脂層を備え、
     前記被覆樹脂層は、異なる樹脂からなる多層構造であり、
     前記被覆樹脂層の合計厚さが20μm以上300μm以下である請求項1~請求項7のいずれか1項に記載のリード導体。
    A coating resin layer bonded to a fixed region with the container in the lead conductor,
    The coating resin layer is a multilayer structure made of different resins,
    The lead conductor according to any one of claims 1 to 7, wherein a total thickness of the coating resin layer is 20 袖 m to 300 袖 m.
  9.  請求項1~請求項8のいずれか1項に記載のリード導体を備える電力貯蔵デバイス。 A power storage device comprising the lead conductor according to any one of claims 1 to 8.
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