WO2016204231A1

WO2016204231A1 - Laminate film, and laminate-film production method

Info

Publication number: WO2016204231A1
Application number: PCT/JP2016/067946
Authority: WO
Inventors: 将之楠本; 達也大場; 疋田　伸治; 内海　京久
Original assignee: 富士フイルム株式会社
Priority date: 2015-06-17
Filing date: 2016-06-16
Publication date: 2016-12-22
Also published as: CN107708996B; US20180179643A1; KR20180011147A; JPWO2016204231A1; CN107708996A; KR102028470B1; JP6433592B2

Abstract

Provided are: a laminate film which is capable of inhibiting deterioration of quantum dots due to moisture and oxygen, and exhibits high durability, and with which a narrow frame can be achieved, and high productivity is achieved; and a laminate-film production method. The present invention is provided with: a functional layer laminate which is provided with an optical functional layer, and a gas barrier layer laminated on at least one of the main surfaces of the optical functional layer; and end-surface sealing layers formed so as to cover at least portions of end surfaces of the functional layer laminate. The end-surface sealing layers are laminates each comprising at least two layers. Each of the layers comprises metal.

Description

LAMINATED FILM AND METHOD FOR PRODUCING LAMINATED FILM

The present invention relates to a laminated film and a method for producing the laminated film.

Liquid crystal display devices (hereinafter also referred to as LCDs) consume less power and are increasingly used year by year as space-saving image display devices. Further, in recent liquid crystal display devices, further power saving, color reproducibility improvement and the like are required as LCD performance improvement.

Along with the power saving of LCD backlights, it has been proposed to use quantum dots that change the wavelength of incident light and emit light in order to increase light utilization efficiency and improve color reproducibility. .
A quantum dot is a crystal in an electronic state in which the direction of movement is restricted in all three dimensions. When a semiconductor nanoparticle is three-dimensionally surrounded by a high potential barrier, the nanoparticle Becomes a quantum dot. Quantum dots exhibit various quantum effects. For example, the “quantum size effect” in which the density of states of electrons (energy level) is discretized appears. According to this quantum size effect, the absorption wavelength and emission wavelength of light can be controlled by changing the size of the quantum dot.

In general, such quantum dots are dispersed in a resin or the like, and are used, for example, as a quantum dot film that performs wavelength conversion and disposed between a backlight and a liquid crystal panel.
When excitation light enters the film containing quantum dots from the backlight, the quantum dots are excited and emit fluorescence. Here, by using quantum dots having different light emission characteristics, it is possible to realize white light by emitting light having a narrow half-value width of red light, green light, and blue light. Since the half-value width of the fluorescence due to quantum dots is narrow, it is possible to design white light obtained by appropriately selecting the wavelength to have high luminance or excellent color reproducibility.

By the way, the quantum dot is easily deteriorated by moisture and oxygen, and there is a problem that the light emission intensity is reduced by the photooxidation reaction. Therefore, a gas barrier film is laminated on both surfaces of a resin layer containing quantum dots (hereinafter also referred to as “quantum dot layer”) to protect the quantum dot layer.
However, if both main surfaces of the quantum dot layer are only protected by the gas barrier film, there is a problem that moisture and oxygen enter from an end surface not protected by the gas barrier film, and the quantum dots deteriorate.
Therefore, it has been proposed to protect the entire periphery of the quantum dot layer with a gas barrier film.

For example, Patent Document 1 describes a composition in which a quantum dot phosphor is dispersed in a cycloolefin (co) polymer in a concentration range of 0.01% by mass to 20% by mass. The structure which has the gas barrier layer which coat | covers the whole surface of the made resin molding is described. Further, it is described that the gas barrier layer is a gas barrier film in which a silica film or an alumina film is formed on at least one surface of the resin layer.

Patent Document 2 describes a display backlight unit including a remote phosphor film containing a light-emitting quantum dot (QD) population. The QD phosphor material is sandwiched between two gas barrier films, and the QD phosphor material The structure which has the inactive area | region which has gas barrier property in the area | region pinched | interposed into two gas barrier films of the circumference | surroundings is described.
Patent Document 3 discloses a light emitting device including a color conversion layer that converts at least a part of the color light emitted from the light source unit into another color light, and an impermeable sealing sheet that seals the color conversion layer. The apparatus is described, and has a second bonding layer provided in a frame shape along the outer periphery of the phosphor layer, that is, surrounding the planar shape of the phosphor layer, and this second bonding layer is A configuration made of an adhesive material having gas barrier properties is described.

Patent Document 3 describes a configuration in which the upper layer and / or the bottom layer, which is a barrier layer for sealing the QD film, is narrowed to prevent the entry of oxygen and water by narrowing the opening at the end. Has been.
Patent Document 4 includes a quantum point that converts the wavelength of excitation light to generate wavelength-converted light, a wavelength conversion unit that includes a dispersion medium that disperses the quantum point, and a sealing member that seals the wavelength conversion unit. A quantum point wavelength converter is described, and it is described that the wavelength conversion part is sealed by heating and thermally sticking the end region of the sealing sheet.

International Publication No. 2012/102107 Special table 2013-544018 gazette JP 2009-283441 A JP 2010-061098 A

By the way, the film including quantum dots used for the LCD is a thin film of about 50 μm to 350 μm.
It was very difficult to coat the entire surface of the thin quantum dot layer with a gas barrier film, and there was a problem that productivity was poor. In addition, when the gas barrier film is bent, the barrier layer is broken and the gas barrier property is lowered.

On the other hand, in the case of a configuration in which a protective layer having a gas barrier property is formed in the end face region of the quantum dot layer sandwiched between two gas barrier films, for example, the protective layer and the resin layer are formed by a so-called dam fill method. Can be considered. That is, after forming a protective layer on the peripheral portion on one gas barrier film, a resin layer is formed in a region surrounded by the protective layer, and then the other gas barrier film is laminated on the protective layer and the resin layer. It is conceivable to produce a film containing quantum dots.
However, since the material of the protective layer that can be formed by such a method is an adhesive material or the like, high barrier properties cannot be imparted, and gas barrier properties and durability are not sufficient.
In addition, such a dam fill method has a problem that productivity is extremely poor because all processes are batch methods.

In addition, in the configuration in which the opening at the end of the two gas barrier films sandwiching the quantum dot layer is narrowed or sealed, the thickness of the quantum dot layer at the end becomes thin. Cannot be fully expressed, the size of the area that can be used effectively becomes small, and the frame portion becomes large. In general, since a barrier layer having a high gas barrier property is hard and brittle, if the gas barrier film having such a barrier layer is suddenly bent, the barrier layer is cracked, and the gas barrier property is lowered. There has been a problem that it becomes impossible to prevent moisture and oxygen from entering the layer.

The object of the present invention is to solve such problems of the prior art, can prevent optical functional layers such as quantum dot layers from being deteriorated by moisture and oxygen, has high durability, An object of the present invention is to provide a laminated film and a method for producing the laminated film that can be narrowed and have high productivity.

As a result of intensive studies to achieve the above-mentioned problems, the present inventors have obtained a functional layer laminate having an optical functional layer and a gas barrier layer laminated on at least one main surface of the optical functional layer, and a functional layer. An end face sealing layer formed so as to cover at least a part of the end face of the laminate, and the end face sealing layer is composed of at least two layers, and each layer is made of a metal, whereby the above-described problems can be solved. The headline and the present invention were completed.
That is, this invention provides the laminated film of the following structures, and its manufacturing method.

(1) A functional layer laminate having an optical functional layer and a gas barrier layer laminated on at least one main surface of the optical functional layer, and
An end face sealing layer formed to cover at least a part of the end face of the functional layer laminate,
The end face sealing layer is composed of at least two layers, and each layer is a laminated film made of metal.
(2) The laminated film according to (1), wherein at least one layer other than the first layer in contact with the functional layer laminate of the end face sealing layer is a metal plating layer.
(3) The laminated film according to (1) or (2), wherein the outermost surface layer of the end face sealing layer that is farthest from the functional layer laminate is a metal plating layer.
(4) The laminated film according to (2) or (3), wherein the thickness of the metal plating layer is thicker than the thickness of the first layer in contact with the functional layer laminate.
(5) The thickness of the first layer is 0.001 μm to 0.5 μm,
The laminated film according to (4), wherein the thickness of the metal plating layer is 0.01 μm to 100 μm.
(6) The material of the first layer in contact with the functional layer laminate is at least one selected from the group consisting of aluminum, titanium, chromium, copper, and nickel, or an alloy containing at least one of these. ,
The material of each layer other than the first layer is at least one selected from the group consisting of aluminum, titanium, chromium, nickel, tin, copper, silver, and gold, or an alloy containing at least one of these. (1) The laminated film as described in any one of (5).
(7) The laminated film according to any one of (1) to (6), wherein the end face sealing layer has a thickness of 0.1 μm to 100 μm.
(8) The functional layer laminate having an optical functional layer and a gas barrier layer has at least two layers on each side surface, and each layer has an end face sealing layer made of metal. A method for producing a laminated film for producing a laminated film,
A first layer forming step of forming a first layer in contact with the functional layer laminate on an end face of a laminate in which a plurality of functional layer laminates are stacked;
An outermost layer forming step of forming an outermost layer on the first layer formed on the end face of the laminate,
A method for producing a laminated film, wherein the formation method of the first layer is one selected from the group consisting of a sputtering method, a vacuum deposition method, an ion plating method, and a plasma CVD method.
(9) The method for producing a laminated film according to (8), wherein the formation method of at least one layer other than the first layer of the end face sealing layer is a metal plating process.

(10) A functional layer laminate having an optical functional layer and a gas barrier layer laminated on at least one main surface of the optical functional layer, and
An end face sealing layer formed to cover at least a part of the end face of the functional layer laminate,
The end face sealing layer is composed of at least two layers, and each layer is a laminated film made of metal,
The optical functional layer is a laminated film that is a cured layer formed by curing a polymerizable composition containing a phosphor and at least two or more polymerizable compounds.

(11) The laminate according to (10), wherein the polymerizable compound includes at least one first polymerizable compound composed of a monofunctional polymerizable compound and at least one second polymerizable compound composed of a polyfunctional polymerizable compound. the film.
(12) The first polymerizable compound is an aliphatic or aromatic alkyl (meth) acrylate having an alkyl group having 4 to 30 carbon atoms,
The second polymerizable compound is 1,6-hexanediol diacrylate, 1,10-decanediol diacrylate, 1,9-nonanediol di (meth) acrylate, tricyclodecane dimethanol diacrylate, dicyclopentanyl. The laminated film according to (11) selected from di (meth) acrylate and ethoxylated bisphenol A diacrylate.
(13) The laminated film according to any one of (10) to (12), wherein the optical function layer has an elastic modulus at 50 ° C. of 1 MPa to 4000 MPa.
(14) The laminated film according to any one of (10) to (13), wherein the gas barrier layer is laminated on both main surfaces of the optical functional layer.
(15) The laminated film according to any one of (10) to (14), wherein the phosphor of the optical functional layer is a quantum dot, a quantum rod, or a tetrapod type quantum dot.
(16) The laminated film according to any one of (10) to (15), wherein at least one layer of the end face sealing layer other than the first layer in contact with the functional layer laminate is a metal plating layer.
(17) The laminated film according to any one of (10) to (16), wherein the outermost surface layer of the end face sealing layer farthest from the functional layer laminate is a metal plating layer.
(18) The laminated film according to (16) or (17), wherein the thickness of the metal plating layer is thicker than the thickness of the first layer in contact with the functional layer laminate.
(19) The thickness of the first layer is 0.001 μm to 0.5 μm,
The laminated film according to (18), wherein the metal plating layer has a thickness of 0.01 μm to 100 μm.
(20) The material of the first layer in contact with the functional layer laminate is at least one selected from the group consisting of aluminum, titanium, chromium, copper, and nickel, or an alloy containing at least one of these. ,
The material of each layer other than the first layer is at least one selected from the group consisting of aluminum, titanium, chromium, nickel, tin, copper, silver, and gold, or an alloy containing at least one of these. (10) The laminated film as described in any one of (19).
(21) The laminated film according to any one of (10) to (20), wherein the end face sealing layer has a thickness of 0.1 μm to 100 μm.
(22) The functional layer laminate having an optical functional layer and a gas barrier layer has at least two layers on each side surface, and each layer has an end face sealing layer made of metal. A method for producing a laminated film for producing a laminated film,
On the gas barrier film having the gas barrier layer, a functional layer laminate is formed by applying and curing a polymerizable composition containing a phosphor and at least two or more polymerizable compounds,
A first layer forming step of forming a first layer in contact with the functional layer laminate on an end face of a laminate in which a plurality of functional layer laminates are stacked;
An outermost layer forming step of forming an outermost layer on the first layer formed on the end face of the laminate,
A method for producing a laminated film, wherein the formation method of the first layer is one selected from the group consisting of a sputtering method, a vacuum deposition method, an ion plating method, and a plasma CVD method.
(23) The method for producing a laminated film according to (22), wherein the formation method of at least one layer other than the first layer of the end face sealing layer is metal plating.

According to the present invention as described above, it is possible to prevent the quantum dots from being deteriorated by moisture or oxygen, to have high durability, to be able to narrow the frame, and to have high productivity. The manufacturing method of can be provided.

It is sectional drawing which shows notionally an example of the laminated | multilayer film of this invention. It is sectional drawing which shows notionally an example of the gas barrier film used for a laminated | multilayer film. It is sectional drawing which shows notionally another example of the laminated | multilayer film of this invention. It is a schematic sectional drawing for demonstrating the amount of wraparound of an end surface sealing layer. It is the schematic for demonstrating an example of the manufacturing method of the laminated | multilayer film of this invention. It is the schematic for demonstrating an example of the manufacturing method of the laminated | multilayer film of this invention. It is the schematic for demonstrating an example of the manufacturing method of the laminated | multilayer film of this invention. It is the schematic for demonstrating an example of the manufacturing method of the laminated | multilayer film of this invention. 6 is an optical micrograph of a cross section of an end face of a laminated film of Comparative Example 3.

Hereinafter, the laminated film and the method for producing the laminated film of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
The description of the constituent elements described below may be made based on typical embodiments of the present invention, but the present invention is not limited to such embodiments.
In this specification, a numerical range expressed using “to” means a range including numerical values described before and after “to” as a lower limit value and an upper limit value.

The laminated film of the first aspect of the present invention includes an optical functional layer, a functional layer laminate having a gas barrier layer laminated on at least one main surface of the optical functional layer, and an end surface of the functional layer laminate. Among these, the end surface sealing layer is formed so as to cover at least a part, and the end surface sealing layer is a laminated film composed of at least two layers, and each layer is made of metal.

The laminated film according to the second aspect of the present invention includes an optical functional layer obtained by curing a polymerizable composition containing a phosphor and at least two or more polymerizable compounds, and at least one principal surface of the optical functional layer. A functional layer laminate having a gas barrier layer, and an end face sealing layer formed so as to cover at least a part of the end faces of the functional layer laminate. It is a laminated film consisting of two layers, each layer consisting of metal.

FIG. 1 is a cross-sectional view conceptually showing an example of the laminated film of the present invention.
A laminated film 10 a shown in FIG. 1 covers a functional layer laminate 11 having two gas barrier layers 14 laminated on both main surfaces of the optical functional layer 12 and the optical functional layer 12, and a side surface of the functional layer laminate 11. The end surface sealing layer 16a is formed as described above.

The optical function layer 12 is a layer for expressing a desired function such as wavelength conversion.
As an example, the optical functional layer 12 is a quantum dot layer in which a large number of phosphors (quantum dots) are dispersed in a matrix such as a curable resin, and converts the wavelength of light incident on the optical functional layer 12. And has a function of emitting light.
For example, when blue light emitted from a backlight (not shown) enters the optical functional layer 12, the optical functional layer 12 converts at least part of the blue light into red light or green light due to the effect of quantum dots contained therein. The wavelength is converted into and emitted.

Here, the blue light is light having an emission center wavelength in a wavelength band of 400 nm to 500 nm, and the green light is light having an emission center wavelength in a wavelength band exceeding 500 nm and 600 nm. Means light having an emission center wavelength in a wavelength band of more than 600 nm and 680 nm or less.
The wavelength conversion function exhibited by the quantum dot layer is not limited to a configuration that converts the wavelength of blue light into red light or green light, and may convert at least part of incident light into light of a different wavelength. That's fine.

The quantum dots emit fluorescence by being excited at least by incident excitation light.
There are no particular limitations on the type of quantum dots contained in the quantum dot layer, and various known quantum dots may be appropriately selected according to the required wavelength conversion performance or the like.

Regarding quantum dots, for example, JP 2012-169271 A paragraphs 0060 to 0066 can be referred to, but are not limited to those described here. As the quantum dots, commercially available products can be used without any limitation. The emission wavelength of the quantum dots can usually be adjusted by the composition and size of the particles.

The quantum dots are preferably dispersed uniformly in the matrix, but may be dispersed with a bias in the matrix. Moreover, only 1 type may be used for a quantum dot and it may use 2 or more types together.
When using 2 or more types together, you may use 2 or more types of quantum dots from which the wavelength of emitted light differs.

Specifically, the known quantum dots include a quantum dot (A) having an emission center wavelength in the wavelength band exceeding 600 nm and in the range of 680 nm, and a quantum dot having an emission center wavelength in the wavelength band exceeding 500 nm and 600 nm. (B), there is a quantum dot (C) having an emission center wavelength in the wavelength band of 400 nm to 500 nm. The quantum dot (A) is excited by excitation light to emit red light, and the quantum dot (B) is green light. The quantum dot (C) emits blue light. For example, when blue light is incident as excitation light on a quantum dot-containing laminate including quantum dots (A) and (B), red light emitted from the quantum dots (A) and light emitted from the quantum dots (B) The white light can be realized by the green light and the blue light transmitted through the quantum dot layer. Alternatively, by making ultraviolet light incident on the quantum dot layer including the quantum dots (A), (B), and (C) as excitation light, red light emitted from the quantum dots (A), quantum dots (B) White light can be realized by green light emitted by the blue light and blue light emitted by the quantum dots (C).

Further, as the quantum dot, a so-called quantum rod or a tetrapod type quantum dot that has a rod shape and has directivity and emits polarized light may be used.

In the first aspect, the type of matrix of the quantum dot layer is not particularly limited, and various resins used in known quantum dot layers can be used.
Examples thereof include polyester resins (for example, polyethylene terephthalate, polyethylene naphthalate), (meth) acrylic resins, polyvinyl chloride resins, and polyvinylidene chloride resins. Alternatively, a curable compound having a polymerizable group can be used as the matrix. Although the kind of polymeric group is not specifically limited, Preferably, it is a (meth) acrylate group, a vinyl group, or an epoxy group, More preferably, it is a (meth) acrylate group, More preferably, it is an acrylate group. Moreover, as for the polymerizable monomer which has two or more polymeric groups, each polymeric group may be the same and may differ.

Specifically, for example, a resin containing the following first polymerizable compound and second polymerizable compound can be used as a matrix.

The first polymerizable compound is one or more selected from the group consisting of a bifunctional or higher functional (meth) acrylate monomer and a monomer having two or more functional groups selected from the group consisting of epoxy groups and oxetanyl groups. Preferably it is a compound.

Among the bifunctional or higher functional (meth) acrylate monomers, the bifunctional (meth) acrylate monomers include neopentyl glycol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, tripropylene glycol di (meth) ) Acrylate, ethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, hydroxypivalate neopentyl glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclo Pentenyloxyethyl (meth) acrylate, dicyclopentanyl di (meth) acrylate and the like are preferable examples.

Among the bifunctional or higher functional (meth) acrylate monomers, the trifunctional or higher functional (meth) acrylate monomers include ECH-modified glycerol tri (meth) acrylate, EO-modified glycerol tri (meth) acrylate, and PO-modified glycerol tri (meta). ) Acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, EO modified phosphoric acid triacrylate, trimethylolpropane tri (meth) acrylate, caprolactone modified trimethylolpropane tri (meth) acrylate, EO modified trimethylolpropane tri (meth) acrylate , PO-modified trimethylolpropane tri (meth) acrylate, tris (acryloxyethyl) isocyanurate, dipentaerythritol hexa (meth) a Relate, dipentaerythritol penta (meth) acrylate, caprolactone-modified dipentaerythritol hexa (meth) acrylate, dipentaerythritol hydroxypenta (meth) acrylate, alkyl-modified dipentaerythritol penta (meth) acrylate, dipentaerythritol poly (meth) Preferred examples include acrylate, alkyl-modified dipentaerythritol tri (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, pentaerythritol ethoxytetra (meth) acrylate, pentaerythritol tetra (meth) acrylate and the like.

Monomers having two or more functional groups selected from the group consisting of epoxy groups and oxetanyl groups include, for example, aliphatic cyclic epoxy compounds, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, bromine Bisphenol A diglycidyl ether, brominated bisphenol F diglycidyl ether, brominated bisphenol S diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol S diglycidyl ether, 1,4 -Butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether , Polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ethers; polyether polyols obtained by adding one or more alkylene oxides to aliphatic polyhydric alcohols such as ethylene glycol, propylene glycol and glycerin Glycidyl ethers; diglycidyl esters of aliphatic long-chain dibasic acids; glycidyl esters of higher fatty acids; compounds containing epoxycycloalkanes, etc. are preferably used.

Examples of commercially available products that can be suitably used as monomers having two or more functional groups selected from the group consisting of epoxy groups and oxetanyl groups include Daicel Chemical Industries, Ltd. Celoxide 2021P, Celoxide 8000, Sigma-Aldrich 4- Examples include vinylcyclohexene dioxide. These can be used alone or in combination of two or more.

A monomer having two or more functional groups selected from the group consisting of an epoxy group and an oxetanyl group may be produced by any method. For example, Maruzen KK Publishing Co., Ltd., Fourth Edition Experimental Chemistry Course 20 Organic Synthesis II, 213, 1992, Ed.by Alfred Hasfner, The chemistry of heterocyclic compounds－Small Ring Heterocycles part3 Oxiranes, John & Wiley and Sons, An Interscience Publication, New York, 1985, Yoshimura, Adhesion, Vol. 29, No. 12, 32, 1985, Yoshimura, Adhesion, Vol. 30, No. 5, 42, 1986, Yoshimura, Adhesion, Vol. 30, No. 7, 42, 1986, Japanese Patent Laid-Open No. 11-100308, Japanese Patent No. 2906245, Japanese Patent No. 2926262, etc. Can be synthesized.

The second polymerizable compound has a functional group having hydrogen bonding properties in the molecule and a polymerizable group capable of undergoing a polymerization reaction with the first polymerizable compound.
Examples of the functional group having hydrogen bonding include a urethane group, a urea group, or a hydroxyl group.
As the polymerizable group capable of undergoing a polymerization reaction with the first polymerizable compound, for example, when the first polymerizable compound is a bifunctional or higher (meth) acrylate monomer, it may be a (meth) acryloyl group. When the polymerizable compound is a monomer having two or more functional groups selected from the group consisting of an epoxy group and an oxetanyl group, it may be an epoxy group or an oxetanyl group.

(Meth) acrylate monomers containing urethane groups include diisocyanates such as TDI, MDI, HDI, IPDI, and HMDI, poly (propylene oxide) diol, poly (tetramethylene oxide) diol, ethoxylated bisphenol A, and ethoxylated bisphenol. Reaction of polyols such as S spiro glycol, caprolactone-modified diol, carbonate diol, and hydroxy acrylates such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, glycidol di (meth) acrylate, pentaerythritol triacrylate Monomers and oligomers obtained by the above-described methods. JP-A Nos. 2002-265650, 2002-355936, and 2002-06723 It can be mentioned polyfunctional urethane monomers described in JP-like. Specifically, an adduct of TDI and hydroxyethyl acrylate, an adduct of IPDI and hydroxyethyl acrylate, an adduct of HDI and pentaerythritol triacrylate (PETA), and an adduct of TDI and PETA remained. Examples include compounds obtained by reacting isocyanate and dodecyloxyhydroxypropyl acrylate, adducts of 6,6 nylon and TDI, adducts of pentaerythritol, TDI and hydroxyethyl acrylate, but are not limited thereto. Absent.

Commercially available products that can be suitably used as a (meth) acrylate monomer containing a urethane group include AH-600, AT-600, UA-306H, UA-306T, UA-306I, UA-510H, manufactured by Kyoeisha Chemical Co., Ltd. UF-8001G, DAUA-167, UA-160TM manufactured by Shin-Nakamura Chemical Co., Ltd., UV-4108F manufactured by Osaka Organic Chemical Industry Co., Ltd., UV-4117F, and the like. These can be used alone or in combination of two or more.

Examples of the (meth) acrylate monomer containing a hydroxyl group include compounds synthesized by a reaction between a compound having an epoxy group and (meth) acrylic acid. Typical ones are classified into bisphenol A type, bisphenol S type, bisphenol F type, epoxidized oil type, phenol novolak type, and alicyclic type, depending on the compound having an epoxy group. As a specific example, (meth) acrylate obtained by reacting (meth) acrylic acid with an adduct of bisphenol A and epichlorohydrin, epichlorohydrin was reacted with phenol novolak, and (meth) acrylic acid was reacted ( (Meth) acrylate, bisphenol S and epichlorohydrin adduct was reacted with (meth) acrylic acid (meth) acrylate, bisphenol S and epichlorohydrin adduct was reacted with (meth) acrylic acid ( Examples include (meth) acrylate, (meth) acrylate obtained by reacting (meth) acrylic acid with epoxidized soybean oil, and the like. Other examples of the (meth) acrylate monomer containing a hydroxyl group include, but are not limited to, a (meth) acrylate monomer having a carboxy group or a phosphate group at the terminal.

As a commercially available product that can be suitably used as the second polymerizable compound containing a hydroxyl group, an epoxy ester manufactured by Kyoeisha Chemical Co., Ltd., M-600A, 40EM, 70PA, 200PA, 80MFA, 3002M, 3002A, 3000MK, 3000A, 4-hydroxybutyl acrylate manufactured by Nippon Kasei Co., Ltd., monofunctional acrylate A-SA manufactured by Shin-Nakamura Chemical Co., Ltd., monofunctional methacrylate SA, monofunctional acrylate β-carboxyethyl acrylate manufactured by Daicel Ornex Co., Ltd. And JPA-514 manufactured by Johoku Chemical Industry Co., Ltd. These can be used alone or in combination of two or more.
The mass ratio between the first polymerizable compound and the second polymerizable compound may be 10:90 to 99: 1, and is preferably 10:90 to 90:10. It is also preferable that the content of the first polymerizable compound is larger than the content of the second polymerizable compound. Specifically, (content of the first polymerizable compound) / (of the second polymerizable compound) The content is preferably 2 to 10.

When a resin containing the first polymerizable compound and the second polymerizable compound is used as the matrix, it is preferable that the matrix further contains a monofunctional (meth) acrylate monomer. Monofunctional (meth) acrylate monomers include acrylic acid and methacrylic acid, derivatives thereof, and more specifically, monomers having one polymerizable unsaturated bond ((meth) acryloyl group) of (meth) acrylic acid in the molecule Can be mentioned. Specific examples thereof include the following compounds, but the present invention is not limited thereto.
Methyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isononyl (meth) acrylate, n-octyl (meth) acrylate, lauryl (meth) acrylate, stearyl ( Alkyl (meth) acrylates having an alkyl group such as meth) acrylate having 1 to 30 carbon atoms; aralkyl (meth) acrylates having an aralkyl group such as benzyl (meth) acrylate having 7 to 20 carbon atoms; butoxyethyl (meth) ) An alkoxyalkyl (meth) acrylate having 2 to 30 carbon atoms of an alkoxyalkyl group such as acrylate; the total carbon number of a (monoalkyl or dialkyl) aminoalkyl group such as N, N-dimethylaminoethyl (meth) acrylate; 1-2 An aminoalkyl (meth) acrylate which is: (meth) acrylate of diethylene glycol ethyl ether, (meth) acrylate of triethylene glycol butyl ether, (meth) acrylate of tetraethylene glycol monomethyl ether, (meth) acrylate of hexaethylene glycol monomethyl ether, Octaethylene glycol monomethyl ether (meth) acrylate, nonaethylene glycol monomethyl ether (meth) acrylate, dipropylene glycol monomethyl ether (meth) acrylate, heptapropylene glycol monomethyl ether (meth) acrylate, tetraethylene glycol monoethyl Alkyl chain such as ether (meth) acrylate has 1 to 10 carbon atoms and terminal alkyl (Meth) acrylate of polyalkylene glycol alkyl ether having 1 to 10 carbon atoms in ether; alkylene chain such as (meth) acrylate of hexaethylene glycol phenyl ether having 1 to 30 carbon atoms and terminal aryl ether having 6 carbon atoms (Meth) acrylate of -20 polyalkylene glycol aryl ethers; cycloaliphatic structures such as cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, isobornyl (meth) acrylate, and methylene oxide-added cyclodecatriene (meth) acrylate (Meth) acrylates having a total carbon number of 4 to 30; fluorinated alkyl (meth) acrylates having a total carbon number of 4 to 30 such as heptadecafluorodecyl (meth) acrylate; 2-hydroxyethyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, mono (meth) acrylate of triethylene glycol, tetraethylene glycol mono (meth) acrylate, hexaethylene glycol mono (meth) acrylate, octapropylene glycol mono (Meth) acrylate, (meth) acrylate having a hydroxyl group such as glycerol mono- or di (meth) acrylate; (meth) acrylate having a glycidyl group such as glycidyl (meth) acrylate; tetraethylene glycol mono (meth) acrylate, hexa Polyethylene glycol mono (meth) having an alkylene chain of 1 to 30 carbon atoms such as ethylene glycol mono (meth) acrylate and octapropylene glycol mono (meth) acrylate. ) Acrylate; (meth) acrylamide, N, N- dimethyl (meth) acrylamide, N- isopropyl (meth) acrylamide, 2-hydroxyethyl (meth) acrylamide, acryloyl morpholine (meth) acrylamide and the like.
The monofunctional (meth) acrylate monomer is preferably contained in an amount of 1 to 300 parts by mass, and 50 to 150 parts by mass with respect to a total mass of 100 parts by mass of the first polymerizable compound and the second polymerizable compound. More preferably it is included.

Further, it preferably contains a compound having a long-chain alkyl group having 4 to 30 carbon atoms. Specifically, at least one of the first polymerizable compound, the second polymerizable compound, and the monofunctional (meth) acrylate monomer preferably has a long-chain alkyl group having 4 to 30 carbon atoms. The long chain alkyl group is more preferably a long chain alkyl group having 12 to 22 carbon atoms. This is because the dispersibility of the quantum dots is improved. As the dispersibility of the quantum dots improves, the amount of light that goes straight from the light conversion layer to the exit surface increases, which is effective in improving front luminance and front contrast.
Specific examples of the monofunctional (meth) acrylate monomer having a long-chain alkyl group having 4 to 30 carbon atoms include butyl (meth) acrylate, octyl (meth) acrylate, lauryl (meth) acrylate, and oleyl (meth) acrylate. , Stearyl (meth) acrylate, behenyl (meth) acrylate, butyl (meth) acrylamide, octyl (meth) acrylamide, lauryl (meth) acrylamide, oleyl (meth) acrylamide, stearyl (meth) acrylamide, behenyl (meth) acrylamide, etc. preferable. Of these, lauryl (meth) acrylate, oleyl (meth) acrylate, and stearyl (meth) acrylate are particularly preferable.

In the laminated film of the second aspect of the present invention, the optical functional layer is a cured layer obtained by curing a polymerizable composition containing at least two or more polymerizable compounds. The polymerizable groups of the polymerizable compounds used in combination of at least two may be the same or different, and preferably the at least two compounds have at least one common polymerizable group. preferable.
The type of the polymerizable group is not particularly limited, but is preferably a (meth) acrylate group, a vinyl group or an epoxy group, or an oxetanyl group, more preferably a (meth) acrylate group, and still more preferably an acrylate group. It is.

The polymerizable compound of the present invention preferably contains at least one first polymerizable compound composed of a monofunctional polymerizable compound and at least one second polymerizable compound composed of a polyfunctional polymerizable compound.
Specifically, for example, an embodiment including the following third polymerizable compound and fourth polymerizable compound can be employed.

The third polymerizable compound is a monofunctional (meth) acrylate monomer and a monomer having one functional group selected from the group consisting of an epoxy group and an oxetanyl group.

Monofunctional (meth) acrylate monomers include acrylic acid and methacrylic acid, derivatives thereof, more specifically, (meth) acrylic acid polymerizable unsaturated bond (meth) acryloyl group in the molecule, alkyl Mention may be made of aliphatic or aromatic monomers whose group has 1 to 30 carbon atoms. Specific examples thereof include the following compounds, but the present invention is not limited thereto.
Aliphatic monofunctional (meth) acrylate monomers include methyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isononyl (meth) acrylate, n-octyl ( Alkyl (meth) acrylates having 1 to 30 carbon atoms in the alkyl group, such as (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate;
An alkoxyalkyl (meth) acrylate having 2 to 30 carbon atoms in the alkoxyalkyl group such as butoxyethyl (meth) acrylate;
Aminoalkyl (meth) acrylates in which the total number of carbon atoms of the (monoalkyl or dialkyl) aminoalkyl group is 1-20, such as N, N-dimethylaminoethyl (meth) acrylate;
(Meth) acrylate of diethylene glycol ethyl ether, (meth) acrylate of triethylene glycol butyl ether, (meth) acrylate of tetraethylene glycol monomethyl ether, (meth) acrylate of hexaethylene glycol monomethyl ether, monomethyl ether of octaethylene glycol (meth) Alkylene chain such as acrylate, monomethyl ether (meth) acrylate of nonaethylene glycol, monomethyl ether (meth) acrylate of dipropylene glycol, monomethyl ether (meth) acrylate of heptapropylene glycol, monoethyl ether (meth) acrylate of tetraethylene glycol A polyalkylene having 1 to 10 carbon atoms and a terminal alkyl ether having 1 to 10 carbon atoms Recall alkyl ether (meth) acrylate;
(Meth) acrylates of polyalkylene glycol aryl ethers having an alkylene chain of 1 to 30 carbon atoms and a terminal aryl ether of 6 to 20 carbon atoms such as (meth) acrylate of hexaethylene glycol phenyl ether;
(Meth) acrylates having a total carbon number of 4 to 30 and having an alicyclic structure such as cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, isobornyl (meth) acrylate, and methylene oxide-added cyclodecatriene (meth) acrylate; Fluorinated alkyl (meth) acrylates having 4 to 30 carbon atoms in total, such as heptadecafluorodecyl (meth) acrylate;
2-hydroxyethyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, triethylene glycol mono (meth) acrylate, tetraethylene glycol mono (meth) acrylate, hexaethylene glycol mono (Meth) acrylate having a hydroxyl group such as (meth) acrylate, octapropylene glycol mono (meth) acrylate, mono (meth) acrylate of glycerol;
(Meth) acrylates having a glycidyl group such as glycidyl (meth) acrylate;
Polyethylene glycol mono (meth) acrylate having 1 to 30 carbon atoms in the alkylene chain, such as tetraethylene glycol mono (meth) acrylate, hexaethylene glycol mono (meth) acrylate and octapropylene glycol mono (meth) acrylate;
Examples include (meth) acrylamide such as (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-isopropyl (meth) acrylamide, 2-hydroxyethyl (meth) acrylamide, acryloylmorpholine, and the like.
Examples of the aromatic monofunctional acrylate monomer include aralkyl (meth) acrylates having 7 to 20 carbon atoms in the aralkyl group such as benzyl (meth) acrylate.
Of the first polymerizable compounds, aliphatic or aromatic alkyl (meth) acrylates having an alkyl group with 4 to 30 carbon atoms are preferred, and n-octyl (meth) acrylate, lauryl (meth) acrylate are also preferred. ) Acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, isobornyl (meth) acrylate, and methylene oxide-added cyclodecatriene (meth) acrylate. This is because the dispersibility of the quantum dots is improved. As the dispersibility of the quantum dots improves, the amount of light that goes straight from the light conversion layer to the exit surface increases, which is effective in improving front luminance and front contrast.

The third polymerizable compound is preferably contained in an amount of 5 to 99.9 parts by mass with respect to a total mass of 100 parts by mass of the third polymerizable compound and the fourth polymerizable compound, It is preferable for the reason mentioned later that the mass part is contained.

The fourth polymerizable compound is a monomer having two or more functional groups in the molecule selected from the group consisting of a polyfunctional (meth) acrylate monomer and an epoxy group or an oxetanyl group.

Among the bifunctional or higher polyfunctional (meth) acrylate monomers, the bifunctional (meth) acrylate monomers include neopentyl glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9- Nonanediol di (meth) acrylate, 1,10-decanediol diacrylate, tripropylene glycol di (meth) acrylate, ethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, hydroxypivalate neopentyl glycol di Preferred examples include (meth) acrylate, polyethylene glycol di (meth) acrylate, tricyclodecane dimethanol diacrylate, ethoxylated bisphenol A diacrylate, and the like.

Among polyfunctional (meth) acrylate monomers having two or more functions, trifunctional or more (meth) acrylate monomers include ECH-modified glycerol tri (meth) acrylate, EO-modified glycerol tri (meth) acrylate, and PO-modified glycerol trimethyl. (Meth) acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, EO modified phosphoric acid triacrylate, trimethylolpropane tri (meth) acrylate, caprolactone modified trimethylolpropane tri (meth) acrylate, EO modified trimethylolpropane tri (meta ) Acrylate, PO-modified trimethylolpropane tri (meth) acrylate, tris (acryloxyethyl) isocyanurate, dipentaerythritol hexa (meth) ) Acrylate, dipentaerythritol penta (meth) acrylate, caprolactone modified dipentaerythritol hexa (meth) acrylate, dipentaerythritol hydroxypenta (meth) acrylate, alkyl modified dipentaerythritol penta (meth) acrylate, dipentaerythritol poly (meta) ) Acrylate, alkyl-modified dipentaerythritol tri (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, pentaerythritol ethoxytetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, and the like.

Further, as a polyfunctional monomer, a (meth) acrylate monomer having a urethane bond in the molecule, specifically, an adduct of TDI and hydroxyethyl acrylate, an adduct of IPDI and hydroxyethyl acrylate, HDI and pentaerythritol tris. Adducts with acrylate (PETA), compounds obtained by reacting the remaining isocyanate with dodecyloxyhydroxypropyl acrylate, adducts of 6,6 nylon and TDI, pentaerythritol, TDI and hydroxy An adduct of ethyl acrylate can also be used.

Examples of commercially available products that can be suitably used as a monomer having two or more functional groups selected from the group consisting of epoxy groups and oxetanyl groups include Daicel Chemical Industries, Ltd. Celoxide 2021P, Celoxide 8000, and Sigma Aldrich 4- Examples include vinylcyclohexene dioxide.

The fourth polymerizable compound is preferably contained in an amount of 0.1 to 95 parts by mass with respect to 100 parts by mass of the total mass of the third polymerizable compound and the fourth polymerizable compound, and 15 parts by mass. The content is preferably from 80 parts by mass to 80 parts by mass for the reason described later.

Here, in providing an end face sealing layer to be described later on the optical functional layer of the present application, a metal thin film is formed on the end face of the functional laminate by sputtering, vacuum deposition, ion plating, and plasma CVD. . For example, if a metal thin film is formed on the matrix end face of a cured product made of only a monofunctional (meth) acrylate compound by a sputtering method, the matrix cannot withstand the internal stress of the metal thin film, resulting in defects, and sufficient barrier properties cannot be imparted. On the other hand, in the matrix consisting only of the polyfunctional (meth) acrylate compound, the defect of the metal thin film does not occur, but since it is hard and brittle, the smoothness of the end face is poor, and the metal thin film cannot cover the end face uniformly. As a result, the barrier property is impaired. Therefore, in the present invention, by mixing the monofunctional (meth) acrylate monomer and the polyfunctional (meth) acrylate monomer in the appropriate range described above, the film can withstand film shrinkage during the formation of the metal thin film, and defects in the metal thin film on the matrix end face. In addition, it is possible to ensure smoothness and to form an end surface sealing layer having high barrier properties on the end surface.

The elastic modulus at 50 ° C. of the cured matrix forming the optical functional layer of the present application is preferably 1 MPa or more and 4000 MPa or less, and more preferably 10 MPa or more and 3000 MPa or less. The reason why the elastic modulus at 50 ° C. is used is that, for example, in the sputtering method, the film surface temperature reaches about 50 ° C. during film formation, so that the physical property value of the matrix that resists film shrinkage is used. By setting it in this range, it becomes possible to reduce defects in the metal thin film of the end sealing layer.

(Viscosity modifier)
The polymerizable composition may contain a viscosity modifier as necessary. The viscosity modifier is preferably a filler having a particle size of 5 nm to 300 nm. The viscosity modifier is also preferably a thixotropic agent. In the present invention and the present specification, thixotropic property refers to a property of reducing the viscosity with respect to an increase in shear rate in a liquid composition, and a thixotropic agent is a composition obtained by including it in the liquid composition. It refers to a material having a function of imparting thixotropy to an object. Specific examples of thixotropic agents include fumed silica, alumina, silicon nitride, titanium dioxide, calcium carbonate, zinc oxide, talc, mica, feldspar, kaolinite (kaolin clay), pyrophyllite (waxite clay), and sericite. (Sericite), bentonite, smectite vermiculites (montmorillonite, beidellite, nontronite, saponite, etc.), organic bentonite, organic smectite and the like.
In one embodiment, the polymerizable composition has a viscosity of 3 mPa · s to 50 mPa · s when the shear rate is 500 s ⁻¹ , and preferably 100 mPa · s or more when the shear rate is 1 s ⁻¹ . In order to adjust the viscosity in this way, it is preferable to use a thixotropic agent. The viscosity of the polymerizable composition is a 3mPa · s ~ 50mPa · s when the shear rate 500 s ^-1, why is preferably 100 mPa · s or more at a shear rate of 1s ^-1 is as follows .
As an example of the method for producing the functional laminate, as described later, after applying the polymerizable composition to the first substrate, the second substrate is pasted on the polymerizable composition. From the above, a production method including the step of curing the polymerizable composition to form the wavelength conversion layer can be mentioned. In the above production method, it is desirable to uniformly apply the coating composition so that no coating stripes are formed when the polymerizable composition is applied to the first substrate, and for this purpose, the coating property is uniform. From the viewpoint of leveling properties, the coating solution (polymerizable composition) preferably has a low viscosity. On the other hand, in order to uniformly bond the second substrate onto the coating solution applied to the first substrate, it is preferable that the resistance to pressure at the time of bonding is high. A coating solution is preferred. The shear rate of 500 s ⁻¹ is a representative value of the shear rate applied to the coating solution applied to the first substrate, and the shear rate of 1 s ⁻¹ is immediately before the second substrate is bonded to the coating solution. This is a representative value of the shear rate applied to the coating solution. Note that the shear rate 1 s ⁻¹ is merely a representative value. When the second substrate is bonded onto the coating solution applied to the first substrate, the first substrate and the second substrate are bonded to each other while being transported at the same speed. The applied shear rate is approximately ^{0 s −1} , and the shear rate applied to the coating solution in the actual manufacturing process is not limited to 1 s ⁻¹ . Similarly, the shear rate of 500 s ⁻¹ is merely a representative value, and the shear rate applied to the coating solution in the actual manufacturing process is not limited to 500 s ⁻¹ . From the viewpoint of uniform application and bonding, the viscosity of the polymerizable composition is 3 mPa · s when the representative value of the shear rate applied to the coating liquid is 500 s ⁻¹ when the coating liquid is applied to the first substrate. 50 mPa · s, which is 100 mPa · s or more when the representative value of the shear rate applied to the coating solution is 1 s ⁻¹ immediately before the second substrate is bonded onto the coating solution applied to the first substrate. It is preferable to adjust to.

(solvent)
The said polymerizable composition may contain the solvent as needed. In this case, the type and amount of the solvent used are not particularly limited. For example, one or a mixture of two or more organic solvents can be used as the solvent.

In addition, in the matrix resin, trifluoroethyl (meth) acrylate, pentafluoroethyl (meth) acrylate, (perfluorobutyl) ethyl (meth) acrylate, perfluorobutyl-hydroxypropyl (meth) acrylate, (perfluoro Hexyl) ethyl (meth) acrylate, octafluoropentyl (meth) acrylate, perfluorooctylethyl (meth) acrylate, tetrafluoropropyl (meth) acrylate and other compounds having a fluorine atom may be included. By including these compounds, the coating property can be improved.
Further, the total amount of the resin serving as a matrix in the quantum dot layer is not particularly limited, but is preferably 90 to 99.9 parts by mass with respect to 100 parts by mass of the total amount of the quantum dot layer, and 92 parts by mass. More preferred is from 99 parts by mass to 99 parts by mass.

The thickness of the quantum dot layer is not particularly limited, but is preferably 5 μm to 200 μm and more preferably 10 μm to 150 μm from the viewpoints of handleability and light emission characteristics.
In addition, the said thickness intends average thickness, average thickness calculates | requires the thickness of arbitrary 10 points | pieces or more of a quantum dot layer, and calculates | requires them arithmetically.

In the first aspect, the method for forming the quantum dot layer is not particularly limited, and may be formed by a known method. For example, it can be formed by preparing a coating composition in which quantum dots, a matrix resin, and a solvent are mixed, applying the coating composition on the gas barrier layer 14, and curing the coating composition.
In the second embodiment, the quantum dot layer is formed by adjusting a polymerizable composition containing a phosphor (quantum dot) and at least two or more polymerizable compounds, and applying this coating composition on the gas barrier layer 14. Then, it can be formed by curing.
In addition, you may add a polymerization initiator, a silane coupling agent, etc. to the coating composition used as a quantum dot layer as needed.

The gas barrier layer 14 is a layer having a gas barrier property, which is laminated on the main surface of the optical functional layer 12. That is, the gas barrier layer 14 is a member that covers the main surface of the optical functional layer 12 and suppresses the intrusion of moisture and oxygen from the main surface of the optical functional layer 12.

The gas barrier layer 14 preferably has a water vapor permeability of 1 × 10 ⁻³ [g / (m ² · day)] or less.
The gas barrier layer 14 preferably has an oxygen permeability of 1 × 10 ⁻² [cc / (m ² · day · atm)] or less.
By using the gas barrier layer 14 having a low water vapor permeability and oxygen permeability, that is, a high gas barrier property, the penetration of moisture and oxygen into the optical functional layer 12 is prevented, and the optical functional layer 12 is more preferably prevented from being deteriorated. can do.
The water vapor permeability was measured by the Mocon method under the conditions of a temperature of 40 ° C. and a relative humidity of 90% RH. When the water vapor permeability exceeded the measurement limit of the Mocon method, it was measured by the calcium corrosion method (the method described in JP-A-2005-283561).
Moreover, the oxygen permeability was measured under the conditions of a temperature of 25 ° C. and a humidity of 60% RH using a measuring device (manufactured by Nippon API Co., Ltd.) using an APIMS method (atmospheric pressure ionization mass spectrometry). It is known that there is fm / (s · Pa) as an SI unit of oxygen permeability. 1 fm / (s · Pa) = 8.752 cc / (m ² · day · atm) (fm: femtometer).

The thickness of the gas barrier layer 14 is preferably 5 μm to 100 μm, more preferably 10 μm to 70 μm, and particularly preferably 15 μm to 55 μm.
Setting the thickness of the gas barrier layer 14 to 100 μm or less is preferable in that the thickness of the entire laminated film 10a including the optical functional layer 12 can be reduced.
Further, the thickness of the gas barrier layer 14 is preferably 5 μm or more, which is preferable in that the thickness of the optical functional layer 12 can be made uniform when the optical functional layer 12 is formed between the two gas barrier layers 14. .

Here, there is no limitation in particular as the gas barrier layer 14, The gas barrier film which has desired gas barrier property can be utilized suitably.
As an example, a gas barrier film having at least one organic layer and at least one inorganic layer as the barrier layer 32 on the gas barrier support 30 is preferably used.
FIG. 2 is a sectional view conceptually showing an example of the gas barrier film.
A gas barrier film (gas barrier layer) 14 shown in FIG. 2 has a barrier layer 32 formed by laminating an organic layer 34, an inorganic layer 36, and an organic layer 38 in this order, and a gas barrier support 30 that supports the barrier layer 32. It becomes.

The gas barrier film 14 only needs to have at least one inorganic layer 36 on the gas barrier support 30, and one combination of the inorganic layer 36 and the organic layer 34 that is the base of the inorganic layer 36. It is preferable to have the above. Accordingly, the gas barrier layer 14 may have two combinations of the inorganic layer 36 and the underlying organic layer 34, or may have three or more. The organic layer 34 functions as a base layer for properly forming the inorganic layer 36, and has an excellent gas barrier property as the number of layers of the combination of the base organic layer 34 and the inorganic layer 36 increases. A gas barrier film can be obtained.

In the illustrated example, the outermost layer of the barrier layer 32 (the layer opposite to the gas barrier support 30) is the organic layer 38, but is not limited thereto, and the outermost layer may be the inorganic layer 36.
Here, the optical functional layer 12 is basically laminated on the barrier layer 32 side. Therefore, even when outgas is released from the gas barrier support 30 or the organic layer 34 by stacking the optical functional layer 12 on the barrier layer 32 side by forming the outermost layer of the barrier layer 32 as an inorganic layer 36, the outgas is not removed from the inorganic layer. It is shielded by 36 and can be prevented from reaching the optical function layer 12.

As the gas barrier support 30 of the gas barrier layer 14, various types that are used as a support in a known gas barrier film can be used.
Among them, films made of various plastics (polymer materials / resin materials) are preferably used in that they are easy to be thinned and lightened and are suitable for flexibility.
Specifically, polyethylene (PE), polyethylene naphthalate (PEN), polyamide (PA), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyvinyl alcohol (PVA), polyacrylonitrile (PAN), polyimide ( PI), transparent polyimide, polymethyl methacrylate resin (PMMA), polycarbonate (PC), polyacrylate, polymethacrylate, polypropylene (PP), polystyrene (PS), ABS, cyclic olefin copolymer (COC), cycloolefin polymer ( COP) and a plastic film made of triacetyl cellulose (TAC) are preferably exemplified.

What is necessary is just to set the thickness of the gas barrier support body 30 suitably according to a use or a magnitude | size. Here, according to the study of the present inventor, the thickness of the gas barrier support 30 is preferably about 10 μm to 100 μm. By setting the thickness of the gas barrier support 30 within this range, preferable results are obtained in terms of weight reduction and thinning.
The gas barrier support 30 may be provided with functions such as antireflection, retardation control, and improvement of light extraction efficiency on the surface of such a plastic film.

The barrier layer 32 includes an inorganic layer 36 that mainly exhibits gas barrier properties, an organic layer 34 that serves as a base layer for the inorganic layer 36, and an organic layer 38 that protects the inorganic layer 36.

The organic layer 34 is a base layer of the inorganic layer 36 that mainly exhibits gas barrier properties in the gas barrier film 14.
As the organic layer 34, various types of known gas barrier films that are used as the organic layer 34 can be used. For example, the organic layer 34 is a film containing an organic compound as a main component, and basically formed by crosslinking monomers and / or oligomers.
The gas barrier film 14 includes the organic layer 34 that is the base of the inorganic layer 36, thereby embedding irregularities on the surface of the gas barrier support 30, foreign matters attached to the surface, and the like to form the inorganic layer 36. The surface can be made appropriate. As a result, the appropriate inorganic layer 36 can be formed on the entire surface of the film formation without gaps and without cracks or cracks. As a result, the water vapor permeability is 1 × 10 ⁻³ [g / (m ² · day)] or less, and the oxygen permeability is 1 × 10 ⁻² [cc / (m ² · day · atm)] or less. Such a high gas barrier performance can be obtained.

Further, since the gas barrier film 14 has the organic layer 34 as the base, the organic layer 34 also functions as a cushion for the inorganic layer 36. Therefore, the inorganic layer 36 can be prevented from being damaged by the cushion effect of the organic layer 34 when the inorganic layer 36 receives an impact from the outside.
Thereby, in laminated film 10a, gas barrier film 14 expresses gas barrier performance appropriately, and can prevent degradation of optical function layer 12 by moisture or oxygen suitably.

In the gas barrier film 14, various organic compounds (resins / polymer compounds) can be used as a material for forming the organic layer 34.
Specifically, polyester, acrylic resin, methacrylic resin, methacrylic acid-maleic acid copolymer, polystyrene, transparent fluororesin, polyimide, fluorinated polyimide, polyamide, polyamideimide, polyetherimide, cellulose acylate, polyurethane, poly Ether ether ketone, polycarbonate, alicyclic polyolefin, polyarylate, polyether sulfone, polysulfone, fluorene ring modified polycarbonate, alicyclic modified polycarbonate, fluorene ring modified polyester, acryloyl compound, thermoplastic resin, or polysiloxane, etc. An organic silicon compound film is preferably exemplified. A plurality of these may be used in combination.

Among them, the organic layer 34 composed of a polymer of a radical polymerizable compound and / or a cationic polymerizable compound having an ether group as a functional group is preferable in terms of excellent glass transition temperature and strength.
In particular, in addition to the above strength, the glass transition temperature is 120 ° C. mainly composed of acrylate and / or methacrylate monomers and oligomer polymers in terms of low refractive index, high transparency and excellent optical properties. The above acrylic resin and methacrylic resin are preferably exemplified as the organic layer 34. Among them, in particular, dipropylene glycol di (meth) acrylate (DPGDA), trimethylolpropane tri (meth) acrylate (TMPTA), dipentaerythritol hexa (meth) acrylate (DPHA), etc. Acrylic resins and methacrylic resins, which are mainly composed of a polymer of acrylate and / or methacrylate monomers or oligomers, are preferred. It is also preferable to use a plurality of these acrylic resins and methacrylic resins.
By forming the organic layer 34 with such an acrylic resin or methacrylic resin, the inorganic layer 36 can be formed on the base having a solid skeleton, so that the inorganic layer 36 with higher density and higher gas barrier properties can be formed. .

The thickness of the organic layer 34 is preferably 1 μm to 5 μm.
By setting the thickness of the organic layer 34 to 1 μm or more, the film-forming surface of the inorganic layer 36 is made more suitable, and the appropriate inorganic layer 36 without cracks or cracks is formed over the entire film-forming surface. A film can be formed.
Further, by setting the thickness of the organic layer 34 to 5 μm or less, it is possible to suitably prevent the occurrence of problems such as cracks in the organic layer 34 and curling of the gas barrier film 14 due to the organic layer 34 being too thick. be able to.
Considering the above points, the thickness of the organic layer 34 is more preferably 1 μm to 5 μm.

In addition, when the gas barrier film has a plurality of organic layers 34 as the underlayer, the thickness of each organic layer may be the same or different from each other.
Moreover, when it has two or more organic layers 34, the formation material of each organic layer may be the same or different. However, in terms of productivity and the like, it is preferable to form all organic layers with the same material.

The organic layer 34 may be formed by a known method such as a coating method or flash vapor deposition.
Moreover, in order to improve adhesiveness with the inorganic layer 36 which is the lower layer of the organic layer 34, the organic layer 34 preferably contains a silane coupling agent.

An inorganic layer 36 is formed on the organic layer 34 with the organic layer 34 as a base. The inorganic layer 36 is a film containing an inorganic compound as a main component, and the gas barrier layer 14 mainly exhibits gas barrier properties.

As the inorganic layer 36, various kinds of films made of an inorganic compound such as oxide, nitride, oxynitride and the like that exhibit gas barrier properties can be used.
Specifically, metal oxides such as aluminum oxide, magnesium oxide, tantalum oxide, zirconium oxide, titanium oxide, and indium tin oxide (ITO); metal nitrides such as aluminum nitride; metal carbides such as aluminum carbide; silicon oxide, Silicon oxides such as silicon oxynitride, silicon oxycarbide and silicon oxynitride carbide; silicon nitrides such as silicon nitride and silicon nitride carbide; silicon carbides such as silicon carbide; hydrides thereof; mixtures of two or more of these; and Films made of inorganic compounds such as these hydrogen-containing materials are preferably exemplified.
In particular, a film made of a silicon compound such as silicon oxide, silicon nitride, silicon oxynitride and silicon oxide is preferably exemplified in that it has high transparency and can exhibit excellent gas barrier properties. Among these, in particular, a film made of silicon nitride is preferable because it has high transparency in addition to more excellent gas barrier properties.

In addition, when a gas barrier film has the some inorganic layer 36, the formation material of the inorganic layer 36 may mutually differ. However, if productivity etc. are considered, it is preferable to form all the inorganic layers 36 with the same material.

What is necessary is just to determine the thickness of the inorganic layer 36 suitably according to a forming material, the thickness which can express the target gas barrier property. According to the study of the present inventors, the thickness of the inorganic layer 36 is preferably 10 nm to 200 nm.
By setting the thickness of the inorganic layer 36 to 10 nm or more, the inorganic layer 36 that stably exhibits sufficient gas barrier performance can be formed. In addition, the inorganic layer 36 is generally brittle, and if it is too thick, there is a possibility of causing cracks, cracks, peeling, etc. Can be prevented.
In consideration of such points, the thickness of the inorganic layer 36 is preferably 10 nm to 100 nm, and more preferably 15 nm to 75 nm.
When the gas barrier film has a plurality of inorganic layers 36, the thickness of each inorganic layer 36 may be the same or different.

The inorganic layer 36 may be formed by a known method according to the forming material. Specifically, CCP (Capacitively upCoupled ＣＶＤPlasma capacitively coupled plasma) -CVD (chemical vapor deposition) and ICP (Inductively Coupled Plasma inductively coupled plasma) -CVD etc., plasma CVD, sputtering such as magnetron sputtering and reactive sputtering, vacuum deposition For example, a vapor deposition method is preferably exemplified.

The organic layer 38 is a layer formed as the outermost layer of the barrier layer 32 and is a layer for protecting the inorganic layer 36.
As the organic layer 38, various types similar to the organic layer 34 described above can be used.
Also, the organic layer 38 may be formed by a known method such as a coating method or flash vapor deposition as in the case of the organic layer 34 described above.

In addition, the thickness of the organic layer 38 which is the outermost layer of the barrier layer 32 is preferably 80 nm to 1000 nm. By setting the thickness of the organic layer 38 to 80 nm or more, the inorganic layer 36 can be sufficiently protected. Moreover, it is preferable to make the thickness of the organic layer 38 into 1000 nm or less at the point which can prevent a crack and the fall of the transmittance | permeability etc.
From the above viewpoint, the thickness of the organic layer 38 is more preferably 80 nm to 500 nm.

Note that the organic layer 38 as the protective layer and the organic layer 34 as the underlayer may be formed of the same material or different materials. However, in terms of productivity and the like, it is preferable to form all organic layers with the same material.
Moreover, in order to improve adhesiveness with the inorganic layer 36 which is the lower layer of the organic layer 38, the organic layer 38 preferably contains a silane coupling agent.

Next, the end surface sealing layer 16a will be described.
The end surface sealing layer 16a is a member formed to cover at least a part of the end surface of the functional layer laminate 11 including the optical functional layer 12 and the two gas barrier layers 14 laminated so as to sandwich the optical functional layer 12. It is.
In the present invention, the end-face sealing layer 16a is a member that is made of at least two layers, each layer is made of metal, exhibits gas barrier properties, and suppresses intrusion of moisture and oxygen from the end face of the optical functional layer 12. .

In the laminated film 10 a shown in FIG. 1, the end surface sealing layer 16 a includes a first layer 18 formed in contact with the end surface of the functional layer laminated body 11 and a functional layer laminated body laminated on the first layer 18. 11 and the outermost layer 20 which is the farthest layer from 11.
Here, in this invention, an end surface sealing layer is not limited to 2 layer structure, Three layers or more may be sufficient. For example, like the end surface sealing layer 16b of the laminated film 10b shown in FIG. 3, the first layer 18 formed in contact with the end surface of the functional layer laminate 11, and the second layer laminated on the first layer 18 It is good also as a 3 layer structure which has 22 and the outermost layer 20 which is laminated | stacked on the 2nd layer 22, and is the layer farthest from the functional layer laminated body 11. FIG.
As shown in FIGS. 1 and 3, the end surface sealing layer 16 is laminated on the end surface of the functional layer laminate 11, and therefore each layer constituting the end surface sealing layer 16 (the first layer 18 and the second layer 22). The stacking direction of the outermost layer 20) is a direction perpendicular to the end face of the functional layer stack 11, and is a direction orthogonal to the stacking direction of the functional layer stack 11.

In the present invention, each of the layers constituting the end face sealing layer 16 is a layer made of metal. That is, in the laminated film 10a shown in FIG. 1, the first layer 18 and the outermost layer 20 are made of metal, and in the laminated film 10b shown in FIG. 3, the first layer 18, the second layer 22 and the outermost layer are formed. Reference numeral 20 denotes a metal layer.

As described above, gas barrier films are laminated on both main surfaces of a quantum dot layer including quantum dots that are easily deteriorated by moisture and oxygen to protect the quantum dot layer. If only the gas barrier film is protected, moisture and oxygen enter from the end face not protected by the gas barrier film, and the quantum dots deteriorate.
On the other hand, in order to suppress the intrusion of moisture and oxygen from the end face, the structure of protecting the entire surface of the quantum dot layer with a gas barrier film, or the end face region of the quantum dot layer sandwiched between two gas barrier films, A configuration for forming a protective layer having a gas barrier property, a configuration for narrowing the openings at the ends of two gas barrier films sandwiching the quantum dot layer, and the like have been proposed.

However, it is very difficult to cover the entire surface of the thin quantum dot layer with a gas barrier film, resulting in poor productivity. Further, when the gas barrier film is bent, there is a problem that the barrier layer is broken and the gas barrier property is lowered.
In the case where a protective layer having a gas barrier property is formed in the end face region of the quantum dot layer sandwiched between two gas barrier films, a material having a high barrier property can be used as the material of the protective layer. In addition, gas barrier properties and durability are not sufficient, and when such a laminated film is produced, there is a problem that productivity is extremely poor because all processes are batch processes.
In addition, in the case of a configuration in which the opening of the end portion of the two gas barrier films sandwiching the quantum dot layer is narrowed, the thickness of the quantum dot layer at the end portion becomes thin, so that the end portion has sufficient function. In other words, the size of the area that can be used effectively is reduced, and the frame portion is increased. In general, since a barrier layer having a high gas barrier property is hard and brittle, if the gas barrier film having such a barrier layer is suddenly bent, the barrier layer is cracked, and the gas barrier property is lowered. There has been a problem that it becomes impossible to prevent moisture and oxygen from entering the layer.

On the other hand, the present invention provides a functional layer laminate having an optical functional layer and a gas barrier layer laminated on at least one main surface of the optical functional layer, and at least one of end faces of the functional layer laminate. The end surface sealing layer is formed so as to cover the part, and the end surface sealing layer is composed of at least two layers, and each layer is composed of a metal.
By sealing the end face of the functional layer laminate with two or more metal layers, high gas barrier properties can be achieved, and the penetration of moisture and oxygen into the optical functional layer is suppressed, and the quantum dots deteriorate due to moisture and oxygen. Can be prevented, the life can be extended, and the durability can be improved.
In addition, since the end face sealing layer made of metal is only formed on the end face of the functional layer laminate, the optical functional layer is not thinned and the gas barrier layer is not curved. The available area can be kept large and the frame can be narrowed.
In addition, the first layer of the end face sealing layer that is in contact with the end face of the functional layer laminate is a material having high adhesion to the functional layer laminate, and is formed by a formation method that can increase adhesion, and the second and subsequent layers. Since a layer exhibiting high gas barrier properties can be formed, the end face sealing layer can be prevented from peeling off from the functional layer laminate, and high durability can be obtained.
Further, as will be described in detail later, when forming the end surface sealing layer, each layer of the end surface sealing layer can be formed in a state where a plurality of functional layer stacks are stacked. And the productivity can be increased.

Here, the end face sealing layer 16 preferably has an oxygen permeability of 1 × 10 ⁻² [cc / (m ² · day · atm)] or less.
By forming the end face sealing layer 16 having a low oxygen permeability, that is, a high gas barrier property, on the end face of the functional layer laminate 11, it is possible to more suitably prevent moisture and oxygen from entering the optical functional layer 12. Deterioration of the optical function layer 12 can be more suitably prevented.

The thickness of the end face sealing layer 16 in the direction perpendicular to the end face of the functional layer laminate 11 is preferably in the range of 0.1 μm to 100 μm, more preferably 0.5 μm to 50 μm. It is particularly preferable that the thickness is ˜10 μm.
By setting the thickness of the end surface sealing layer 16 to 0.1 μm or more, sufficient gas barrier performance can be stably exhibited. Moreover, it can prevent suitably that a crack generate | occur | produces by making the thickness of the end surface sealing layer 16 into 100 micrometers or less.
Further, as described later, the laminated film of the present invention is preferably produced by forming an end face sealing layer on the end face in a state where a plurality of functional layer laminates are stacked, and then separating the end face sealing layer. Since it will become difficult to isolate | separate if the sealing layer 16 is too thick, it is preferable also from this point that the thickness of the end surface sealing layer 16 shall be 100 micrometers or less.

Moreover, the end surface sealing layer 16 should just be formed so that at least one part of the end surface of the functional layer laminated body 11 may be covered, but it is preferable that it is formed covering the perimeter of an end surface.
For example, when the main surface of the functional layer laminate 11 is rectangular, it is sufficient that the end surface sealing layer 16 is formed on at least one end surface, and the end surface sealing layer 16 is formed on all four end surfaces. It is preferable.
In addition, the shape of the main surface of the functional layer laminate 11 (the shape of the laminated film 10) is not limited to a rectangular shape, and may be various shapes such as a square shape, a circular shape, and a polygonal shape. Therefore, the end surface protective layer may be formed so as to cover at least a part of the end surface, and is preferably formed so as to cover the entire circumference.

In addition, the end surface sealing layer 16 is preferably formed only on the end surface of the functional layer laminate 11, and it is preferable that there is little wraparound to the main surface of the functional layer laminate 11. The reason is that if the wraparound is large, the flatness of the entire laminated film 10 may be impaired due to the rise of the wraparound portion of the end surface sealing layer 16 to the main surface, and the wraparound portion functions as a light shielding layer. There is a possibility that a non-light emitting area is generated at the end of 10 and the frame portion becomes large, and the area that can be effectively used becomes narrow, that is, it may be an obstacle when applied to a narrow frame module such as a mobile display. There are some things.
From the viewpoint described above, the wraparound width d (see FIG. 4) of the end surface sealing layer 16 to the main surface of the functional layer laminate 11 is preferably 1 mm or less, more preferably 0.5 mm or less, and the wraparound. It is particularly preferable that the area is 0.1 mm or less where the presence of the region is difficult to see.
The wraparound width d of the end face sealing layer 16 can be measured, for example, by cutting a cross section of the laminated film with a retotom REM-710 manufactured by Daiwa Kogyo Co., Ltd. and observing the cross section with an optical microscope.
As shown in FIG. 4, the wraparound width d is the main surface of the functional layer laminate 11 of the end surface sealing layer 16 when viewed in a cross section orthogonal to the extending direction of the end surface of the functional layer laminate 11. The width of the region formed above (the width in the direction perpendicular to the end face of the functional layer stack 11).

In addition, from the viewpoint of improving the gas barrier property of the end face sealing layer 16, it is preferable that the end face sealing layer 16 has few pinholes. The pinhole in the present invention means an uncovered portion (a missing portion of the metal film) having a size of 1 μm or more, which is seen when the end face sealing layer 16 is observed with an optical microscope, and the shape thereof is a circle or a polygon. , Any shape such as a line. The number of pinholes is preferably 50 / mm 2 or less, more preferably 20 / mm 2 or less, and particularly preferably 5 / mm 2 or less. The smaller the number of pinholes, the better. There is no particular lower limit.

Further, from the viewpoint of forming the end surface sealing layer 16 with few pinholes, the end surface of the functional layer laminate 11 on which the end surface sealing layer 16 is formed is preferably smooth. The surface roughness of the end face of the functional layer laminate 11 is preferably 0.001 μm to 10 μm, and more preferably 0.001 μm to 2 μm.

Here, it is preferable that at least one layer other than the first layer 18 in contact with the functional layer laminate 11 among the layers constituting the end face sealing layer 16 is a metal plating layer. In each of the laminated films shown in FIGS. 1 and 3, the outermost layer 20 farthest from the functional layer laminate 11 is a metal plating layer. Thus, the outermost layer 20 is more preferably a metal plating layer.
By forming at least one layer other than the first layer 18 as a metal plating layer, this layer can be formed thick and sufficient gas barrier properties can be exhibited.

The first layer 18 provided in contact with the end surface of the functional layer stack 11 is a metal layer formed by any one of sputtering, vacuum deposition, ion plating, and plasma CVD. It is preferable to use a sputtering method that has good adhesion and enables low-temperature film formation.
Since the functional layer laminate 11 is mainly formed of resin, when a metal plating layer is directly formed on the functional layer laminate 11 by electrolytic plating, a metal film cannot be obtained because there is no conductive path. In addition, when a metal plating layer is formed by electroless plating, the adhesion between the functional layer laminate 11 and the metal plating layer is poor, and sufficient durability and gas barrier properties cannot be obtained, and only the end surface is selected. Film cannot be formed.

On the other hand, in this invention, it has the 1st layer 18 which consists of a metal formed by said method on the side surface of the functional layer laminated body 11, and it is the functional layer laminated body 11 and the end surface sealing layer 16 between. Adhesion can be improved.
In addition, when the metal plating layer is formed as a layer other than the first layer 18, by having the first layer 18 made of metal on the side surface of the functional layer laminate 11, the first layer acts as an electrode. A metal plating layer can be formed appropriately. In addition, during the plating process, the first layer protects the functional layer laminate 11 and can prevent the functional layer laminate 11 from being damaged.

Here, when only one metal layer is formed by any of the sputtering method, the vacuum deposition method, the ion plating method, and the plasma CVD method, the adhesion with the functional layer laminate is Although it can be improved, it is difficult to form a thick thickness or it is unavoidable to form a thick one because the productivity is very poor. Therefore, it cannot be formed with a uniform thickness on the end surface of the functional layer laminate, and sufficient gas barrier properties cannot be obtained.
On the other hand, in the present invention, the first layer formed by any one of the sputtering method, the vacuum deposition method, the ion plating method, and the plasma CVD method, and the metal plating layer are used. Adhesion with the layer laminate can be improved and sufficient gas barrier properties can be obtained.

In addition, the thickness of the metal plating layer formed as a layer other than the first layer 18 is preferably thicker than the thickness of the first layer 18 in contact with the functional layer laminate 11.
By making the thickness of the metal plating layer thicker than the thickness of the first layer 18, sufficient gas barrier properties can be expressed more reliably.
The thickness of the first layer 18 and the thickness of the metal plating layer are thicknesses in the direction perpendicular to the end surface of the functional layer laminate 11.

Specifically, the thickness of the first layer 18 is preferably 0.001 μm to 0.5 μm, and preferably 0.01 μm to 0.5 μm from the viewpoint of adhesion to the functional layer laminate 11, productivity, and the like. More preferably, it is 3 μm.
The thickness of the metal plating layer is preferably 0.01 μm to 100 μm, more preferably 1 μm to 10 μm, from the viewpoint of ensuring gas barrier properties and productivity.

The material for forming the first layer 18 in contact with the functional layer laminate 11 is not particularly limited as long as it is a metal, but any one of the above-described sputtering method, vacuum deposition method, ion plating method, and plasma CVD method may be used. It is preferable that the metal can be formed by a method, and it is preferable to use a metal having a high ionization tendency from the viewpoint of improving the adhesion with the resin constituting the functional layer laminate 11. Accordingly, at least one selected from the group consisting of aluminum, titanium, chromium, copper, and nickel, or an alloy containing at least one of these is preferable, and selected from the group consisting of aluminum, titanium, and chromium. Particularly preferred are at least one selected from the above, or alloys containing at least one of these. If a metal with a high ionization tendency is used, the metal, such as oxygen atoms, nitrogen atoms, and carbon atoms that form the resin, forms a compound, and metal oxides, metal nitrides, and metal carbides are easily formed at the interface with the resin. It is presumed that the adhesion will be high.
By using these metals or alloys as the material for forming the first layer 18, the first layer 18 can be formed by any one of sputtering, vacuum deposition, ion plating, and plasma CVD. The adhesion between the layer 18 and the side surface of the functional layer laminate 11 can be increased.

The material for forming each layer other than the first layer 18 is not particularly limited as long as it is a metal, but at least selected from the group consisting of aluminum, titanium, chromium, nickel, tin, copper, silver, and gold. One kind or an alloy containing at least one of these is preferable.
By using these metals or alloys as the material for forming each layer other than the first layer 18, it can be formed by plating and can exhibit high gas barrier properties.

It should be noted that at least one layer other than the first layer 18 may be formed by plating, and any of the sputtering method, the vacuum deposition method, the ion plating method, or the plasma CVD method may be used except for the metal plating layer. It may be formed by a method. At this time, at least the outermost layer 20 is preferably formed by plating.
For example, the laminated film 10b shown in FIG. 3 has the end surface sealing layer 16b in which the first layer 18 and the second layer 22 are each formed by sputtering and the outermost layer 20 is formed by plating. For example, the first layer 18 may be formed by a sputtering method, the second layer 22 may be formed by a plating process, and the outermost layer 20 may be formed by a sputtering method.

Further, the forming material of each layer constituting the end face sealing layer 16 may be the same or different from each other. That is, for example, the first layer 18 may be a nickel layer formed by sputtering, and the outermost layer 20 may be a nickel layer formed by plating.

The laminated film 10a shown in FIG. 1 has a configuration in which three layers of the gas barrier layer 14, the optical functional layer 12, and the gas barrier layer 14 are laminated, and the end face sealing layer 16a is disposed on the end face. Is not limited to this, and may have other layers. For example, you may have a hard-coat layer, an optical compensation layer, a transparent conductive layer, etc.

Next, the manufacturing method of the laminated film of the present invention (hereinafter also referred to as “the manufacturing method of the present invention”) will be described.
The method for producing a laminated film according to the first aspect of the present invention comprises:
A side surface of a functional layer laminate having an optical functional layer and a gas barrier layer is a method for producing a laminated film, which comprises a laminated film having at least two layers, each layer having an end face sealing layer made of metal,
A first layer forming step of forming a first layer in contact with the functional layer laminate on an end face of a laminate in which a plurality of functional layer laminates are stacked;
An outermost layer forming step of forming an outermost layer on the first layer formed on the end face of the laminate,
The first layer forming method is a method for producing a laminated film which is one selected from the group consisting of sputtering, vacuum deposition, ion plating, and plasma CVD.
Moreover, the manufacturing method of the laminated | multilayer film of the 2nd aspect of this invention is as follows.
A side surface of a functional layer laminate having an optical functional layer and a gas barrier layer is a method for producing a laminated film, which comprises a laminated film having at least two layers, each layer having an end face sealing layer made of metal,
On the gas barrier film having the gas barrier layer, a functional layer laminate is formed by applying and curing a polymerizable composition containing a phosphor and at least two or more polymerizable compounds,
A first layer forming step of forming a first layer in contact with the functional layer laminate on an end face of a laminate in which a plurality of functional layer laminates are stacked;
An outermost layer forming step of forming an outermost layer on the first layer formed on the end face of the laminate, and the first layer forming method includes a sputtering method, a vacuum evaporation method, an ion plating method, an electroless method This is a method for producing a laminated film which is one type selected from the group consisting of plating and plasma CVD.

In the production method of the present invention, as a preferred embodiment, the method for forming at least one layer other than the first layer of the end face sealing layer is a metal plating treatment. Hereinafter, an example of the manufacturing method of the present invention will be described with reference to FIGS. 5A to 5D.

First, a functional layer laminate 11 having an optical functional layer 12 and two gas barrier layers 14 laminated on both main surfaces of the optical functional layer 12 is prepared.
As described above, as a method for producing the functional layer laminate 11, for example, a coating composition in which quantum dots, a matrix resin and a solvent are mixed is prepared, and this coating composition is applied on the gas barrier film 14 and cured. Thus, the optical functional layer (quantum dot layer) 12 can be formed, and the other gas barrier film 14 can be laminated on the other main surface of the formed optical functional layer 12.
In the present invention, the gas barrier layer may be laminated on at least one main surface of the optical functional layer. In this case, when the laminated film of the present invention is finally assembled with a backlight unit such as an LCD together with other members, the other main surface is protected from intrusion of oxygen and moisture, thereby Performance degradation can be prevented.

Further, the functional layer laminate 11 may be produced by a so-called single-wafer type method in which the functional layer laminate 11 is produced one by one, or while the long gas barrier film 14 is conveyed in the longitudinal direction, The optical functional layer 12 is formed on the optical functional layer, and another gas barrier film is laminated on the optical functional layer thus formed to continuously produce the functional layer laminate 11, so-called roll-to-roll (hereinafter referred to as “Roll to Roll”). Or RtoR).

Moreover, you may have the process of cutting the produced functional layer laminated body 11 to a desired magnitude | size as needed.
The cutting method of the functional layer laminate 11 is not limited, and various known methods such as a method of physically cutting using a cutting tool such as a Thomson blade and a method of cutting by irradiating with a laser can be used.
By cutting by laser cutting, the surface roughness of the end face of the functional layer laminate 11 can be reduced.
Moreover, after processing the functional layer laminated body 11 into a predetermined shape, you may perform the grinding | polishing process etc. for controlling the surface roughness of an end surface. For example, the surface roughness can be controlled by cutting, polishing, and melting the end face after cutting with a blade.
As a specific example, the surface roughness can be controlled by cutting the end face of the cut functional layer laminate 11 with a retotome REM-710 manufactured by Daiwa Kogyo Co., Ltd. or the like. More specifically, the smoothness increases as the angle at which the cutting blade hits the functional layer laminate 11, that is, the angle formed by the blade traveling direction and the blade surface is closer to the right angle. The angle at which the cutting blade strikes the functional layer laminate 11 is preferably in the range of 70 ° to 110 °, more preferably in the range of 80 to 100 °, and still more preferably in the range of 85 ° to 95 °. Conventionally, an angle formed by a direction perpendicular to the moving direction of the blade and the blade surface may be referred to as a “blade angle”. In addition, the surface roughness can also be controlled by appropriately controlling the width (cut amount) of the removed portion by cutting. The cutting depth is preferably in the range of 1 to 20 μm, more preferably in the range of 5 to 15 μm. The change in the surface roughness due to such cutting conditions is presumed to be caused by the rocking of the cut surface caused by distortion or twist of the functional layer laminate 11 that occurs when the cutting blade hits the functional layer laminate 11. Therefore, it is preferable to appropriately set conditions according to the balance of hardness, brittleness and viscosity of the functional layer laminate 11 to be applied.
In addition, since cutting waste generated during cutting may cause problems in the subsequent first layer forming step and the outermost layer forming step, it is preferably removed as soon as possible after cutting. Examples of the process for removing cutting waste include air cleaning, ultrasonic cleaning in a state immersed in a cleaning liquid, adhesion and peeling method of an adhesive sheet, and a wiping method.

Next, as the first layer forming step, a plurality of the prepared functional layer laminates 11 are stacked to form a laminate 50 (see FIG. 5A), and the first layer 18A is formed on the end face of the laminate 50 (FIG. 5B). reference).
As described above, the first layer 18A is formed by any one of sputtering, vacuum deposition, ion plating, electroless plating, and plasma CVD, and the first layer 18A is made of aluminum. A layer made of at least one selected from the group consisting of titanium, chromium, copper, and nickel, or an alloy containing at least one of these is formed on the end face of the laminate 50.

Note that there are no particular limitations on the processing method, processing conditions, etc. in the sputtering method, vacuum deposition method, ion plating method, electroless plating, or plasma CVD method when forming the first layer 18A. Accordingly, the first layer 18A may be formed by a conventionally known processing method and processing conditions.
Further, a masking process or the like is performed by a known method on a region other than the end surface of the functional layer stack 11, that is, a region where the first layer 18 A is not formed, and the first layer 18 A is formed on the end surface of the functional layer stack 11. What is necessary is just to form.

Further, the number of functional layer laminates 11 in the laminate 50 when forming the first layer 18A is not particularly limited, and the size of the device for forming the first layer 18A and the thickness of the functional layer laminate 11 are not limited. The first layer 18A is preferably formed by stacking 500 to 4000 functional layer laminates 11 in a suitable manner.

Next, as the outermost layer forming step, the outermost layer 20A is formed on the first layer 18A of the laminate 52 having the first layer 18A formed on the end face (FIG. 5C).
As described above, the outermost layer 20A is preferably formed by plating. The outermost layer 20A is selected from the group consisting of aluminum, titanium, chromium, nickel, tin, copper, silver, and gold. A layer made of at least one or an alloy containing at least one of these is formed on the first layer 18A of the laminate 52.

There are no particular limitations on the treatment method, treatment conditions, and the like of the plating treatment when forming the outermost layer 20A, and the outermost layer 20A may be formed by a conventionally known treatment method and treatment conditions according to the forming material and the like.

Next, the laminate 54 in which the outermost layer 20A is formed is separated for each functional layer laminate 11 to obtain the functional layer laminate 11 having the end surface sealing layer 16a formed on the end face, that is, the laminated film 10a. (FIG. 5D).
A method for separating the laminated film 10a from the laminate 54 is not particularly limited, but the laminate 54 on which the outermost layer 20A is formed is sheared by applying an external force in the horizontal direction with respect to the surface, such as bending and twisting. It can be separated by a method or a method of inserting a sharp tip such as a blade into the interface of the functional layer laminate 10a.
From the viewpoint of preventing the end face sealing layer from peeling, chipping or cracking, it is preferable to separate the laminated film 10a by shearing with an external force.

Thus, the manufacturing method of this invention can form each layer of the end surface sealing layer 16 in the state which accumulated the several function layer laminated body 11, when forming each layer of the end surface sealing layer 16 in this way. Therefore, the several laminated | multilayer film 10 can be produced collectively, and productivity can be made high.

Here, the surface roughness Ra of the end face of the functional layer laminate 11 is preferably 2.0 μm or less. Adhesiveness with the 1st layer 18 formed in an end surface can be improved more by making surface roughness Ra of the end surface of functional layer layered product 11 into 2.0 micrometers or less.

Moreover, in the above, although the manufacturing method in case the end surface sealing layer 16 produces the laminated film 10a of 2 layers was demonstrated as an example, when the end surface sealing layer 16 is three layers or more, it is 1st layer. What is necessary is just to have the process of forming each layer after the 2nd layer between a formation process and an outermost layer formation process.
Each layer after the second layer can be formed by a method similar to the formation method in the first layer formation step or the formation method in the outermost layer formation step, except that the underlying layer is different.

Further, in the manufacturing method of the present invention, rust prevention treatment or the like may be performed in order to prevent the end face sealing layer 16 made of metal from rusting.

As mentioned above, although the laminated | multilayer film of this invention and its manufacturing method were demonstrated in detail, this invention is not limited to the said embodiment, Even if various improvements and changes are performed in the range which does not deviate from the summary of this invention. Of course it is good.

Hereinafter, specific examples of the present invention will be given and the present invention will be described in more detail. In addition, this invention is not limited to the Example described below, The material, usage-amount, ratio, processing content, processing procedure, etc. which are shown in the following Example are suitably changed unless it deviates from the meaning of this invention. can do.

[Example 1]
For the laminated film of the second aspect of the present invention, a laminated film 10b shown in FIG.

<Production of gas barrier film>
(Gas barrier support)
As the gas barrier film 14, a gas barrier film in which an organic layer 34, an inorganic layer 36, and an organic layer 38 were formed in this order on a gas barrier support 30 was used.
As the gas barrier support 30, a polyethylene terephthalate film (PET film, manufactured by Toyobo Co., Ltd., trade name: Cosmo Shine A4300, thickness 50 μm, width 1000 mm, length 100 m) was used.

(Formation of the first organic layer)
An organic layer (hereinafter referred to as a first organic layer) 34 was formed on one main surface of the gas barrier support 30.
First, a coating liquid (first organic layer forming coating liquid) for forming the first organic layer was prepared as follows.
Prepare TMPTA (trimethylolpropane triacrylate, manufactured by Daicel Cytec Co., Ltd.) and a photopolymerization initiator (Lamberti, ESACUREKTO46) so that the weight ratio of TMPTA: photopolymerization initiator is 95: 5. Then, these were weighed and dissolved in methyl ethyl ketone to prepare a coating solution having a solid concentration of 15%.

This coating solution for forming the first organic layer was applied to the gas barrier support 30 by roll-to-roll using a die coater. The gas barrier support 30 after coating was passed through a drying zone at 50 ° C. for 3 minutes, and then irradiated with ultraviolet rays (integrated irradiation amount: about 600 mJ / cm ² ), and cured by UV curing. A protective film of polyethylene film (PE film, manufactured by Sanei Kaken Co., Ltd., trade name: PAC2-30-T) was attached with a pass roll immediately after UV curing, conveyed, and wound. The thickness of the first organic layer 34 formed on the gas barrier support 30 was 1 μm.

(Formation of inorganic layer)
Next, an inorganic layer 36 having a thickness of 50 nm was formed on the first organic layer 34 by CCP-CVD using a general RtoR CVD apparatus.
Specifically, the first organic layer 34 is formed on the gas barrier support 30, and the laminate in which the protective film is stuck on the first organic layer 34 is sent out from the feeder and before the inorganic layer is formed. After passing through the last film surface touch roll, the protective film was peeled off to form an inorganic layer 36 on the exposed first organic layer 34.
Silane gas (SiH ₄ ), ammonia gas (NH ₃ ), nitrogen gas (N ₂ ), and hydrogen gas (H ₂ ) were used as source gases. The supply amounts of gas were 160 sccm for silane gas, 370 sccm for ammonia gas, 240 sccm for nitrogen gas, and 590 sccm for hydrogen gas. The film forming pressure was 40 Pa. That is, the inorganic layer 36 is a silicon nitride film. The plasma excitation power was 2.5 kW at a frequency of 13.56 MHz.

(Formation of second organic layer)
Next, an organic layer 38 (hereinafter referred to as a second organic layer) that protects the inorganic layer was formed on the surface of the formed inorganic layer 36.
First, a coating solution (second organic layer forming coating solution) for forming the second organic layer was prepared as follows.
Urethane bond-containing acrylic polymer (Acrit 8BR500 manufactured by Taisei Fine Chemical Co., Ltd., weight average molecular weight 250,000) and photopolymerization initiator (Irgacure 184 manufactured by BASF) were weighed to a mass ratio of 95: 5, and these were methyl ethyl ketone. And a coating solution having a solid content concentration of 15% by mass was prepared.

The prepared coating liquid for forming the second organic layer was applied to the surface of the inorganic layer 36 by a roll-to-roll using a die coater, passed through a drying zone at 100 ° C. for 3 minutes, and wound up. The thickness of the second organic layer thus formed was 1 μm.
Immediately after the formation of the second organic layer, a protective PE film was attached at the film surface touch roll part, and the second organic layer was transported without touching the pass roll, and then wound.

As described above, the gas barrier film 14 in which the first organic layer 34, the inorganic layer 36, and the second organic layer 38 were laminated in this order on the gas barrier support 30 was produced.
When the oxygen permeability of the produced gas barrier film 14 was measured by the APIMS method, the oxygen permeability at a temperature of 25 ° C. and a humidity of 60% RH was 1 × 10 ⁻³ [cc / (m ² · day · atm)]. It was.

<Production of functional layer laminate>
(Formation of optical functional layer)
Next, after peeling off the protective PE film, a coating solution for forming the optical functional layer 12 (a coating solution for forming an optical functional layer) is applied on the second organic layer 38 of the gas barrier film 14 to form a coating film. The gas barrier film 14 produced in the same manner as described above was laminated on the coating film, and the coating film was sandwiched between the gas barrier film 14 in a nitrogen atmosphere, and then the UV coating was applied in a nitrogen atmosphere to cure the coating film. The optical functional layer 12 was formed.

(Composition of coating solution for forming optical functional layer)
-Quantum dot 1 in toluene dispersion (maximum emission: 520 nm)-10 parts by mass-Toluene dispersion in quantum dot 2 (emission maximum: 630 nm)-1 part by mass-Lauryl acrylate-2.4 parts by mass-1,9-nonanediol di Acrylate 0.54 parts by mass / photopolymerization initiator 0.003 parts by mass (Irgacure 819 (manufactured by BASF))
As the quantum dots 1 and 2, nanocrystals having the following core-shell structure (InP / ZnS) were used.

・ Quantum dot 1: INP530-10 (manufactured by NN-labs)
Quantum dot 2: INP620-10 (manufactured by NN-labs)
The viscosity of the coating solution for forming an optical functional layer was 50 mPa · s.

(Sheet processing)
The laminated body of the two gas barrier films 14 and the optical functional layer 12 was punched into an A4 size sheet using a Thomson blade having a blade edge angle of 17 ° to obtain a functional layer laminated body 11.

<Formation of end face sealing layer>
(Formation of the first layer)
The first layer 18A was formed on the side surface of a laminate 50 in which 1000 functional layer laminates 11 cut into a sheet were stacked and a plurality of functional layer laminates 11 were stacked using a general sputtering apparatus. Titanium was used as the target and argon was used as the discharge gas. The film formation pressure was 0.5 Pa, the film formation output was 400 W, and the ultimate film thickness was 10 nm.

(Formation of the second layer)
Subsequently, a second layer having a thickness of 75 nm was formed on the first layer 18A in the same manner as the formation of the first layer except that the target was changed from titanium to copper.

(Formation of the outermost layer)
Further, the outermost layer 20A was formed on the second layer as follows.
First, the laminate on which the first layer 18A and the second layer were formed was washed with pure water and immersed in a bathtub filled with a commercially available surfactant for 20 seconds for degreasing. Next, after washing with water, it was immersed in a 5% aqueous sulfuric acid solution for 5 seconds to perform acid activation treatment, and washed again with water.
The laminate washed with water was fixed on a jig and fixed with a tester. After immersing it in a 5% nitric acid aqueous solution for 10 seconds, it was subjected to an acid activation treatment, and a current density of 3.0 A / dm ² in a copper sulfate bath. Electrolytic plating treatment was performed under the conditions of minutes to form an outermost layer as a metal plating layer on the second layer. Then, after passing through water washing and rusting treatment, excess moisture was removed with air to obtain a laminate in which three metal layers were formed on the end faces.

(Separation process)
Next, the laminate in which the three metal layers are formed on the end face is separated for each functional layer laminate 11 by shearing with the surface of the functional layer laminate 11 by an external force in the horizontal direction, and the end face is sealed on the end face. The functional layer laminated body 11 in which the stop layer 16b was formed, ie, the laminated film 10b, was obtained.

[Examples 2 to 22, Comparative Examples 1 to 4]
Example 1 except that the material, film thickness, and surface roughness Ra of the end surface of the functional layer laminate 11 were changed as shown in Table 1 below for each of the first layer 18, the second layer 22, and the outermost layer 20. In the same manner as above, a laminated film 10b was produced.

[Example 23]
Quantum dots 1 (CZ520-10, manufactured by NN-labs) and quantum dots 4 (CZ620-10, manufactured by NN-labs) of the quantum dot 1 and quantum dot 2 of the coating liquid for forming an optical functional layer were used. A laminated film 10b was produced in the same manner as in Example 19 except that the toluene dispersion was used.

[Evaluation]
<Evaluation of end face sealing performance>
The laminated films of Examples 1 to 23 and Comparative Examples 1 to 4 thus prepared were subjected to the following tests to evaluate the end face sealing performance.
First, the initial luminance (Y0) of one separated laminated film was measured by the following procedure. A commercially available tablet device (Amazon Kindle (registered trademark) Fire HDX 7 ”) was disassembled and the backlight unit was taken out. A laminated film was placed on the light guide plate of the taken out backlight unit, and the orientation was placed on it. Two prism sheets orthogonal to each other were placed on top of each other, and a luminance meter in which the luminance of light emitted from a blue light source and transmitted through the laminated film and the two prism sheets was set at a position of 740 mm perpendicular to the surface of the light guide plate (SR3, manufactured by TOPCON) and measured as the brightness of the laminated film.
Next, the laminated film was put into a thermostat kept at 60 ° C. and a relative humidity of 90%, and stored for 1000 hours. After 1000 hours, the laminated film was taken out, and the luminance (Y1) after the high temperature and high humidity test was measured in the same procedure as described above. Like the following formula, the change rate (ΔY) of the luminance (Y1) after the high-temperature and high-humidity test with respect to the initial luminance value (Y0) was calculated, and evaluated as the luminance change index according to the following criteria.
ΔY [%] = (Y0−Y1) / Y0 × 100
If the evaluation result is C or more, it can be determined that the light emission efficiency at the end is well maintained even after the high temperature and high humidity test.
A: ΔY ≦ 5%
B: 5% <ΔY <10%
C: 10% ≦ ΔY <15%
D: 15% ≦ ΔY

<Evaluation of adhesion>
Adhesiveness between the end face of the functional layer laminate and the end face sealing layer using the sample in which the end face sealing layer is formed on the end face of the laminate of the plurality of functional layer laminates before the separation step A cross cut test of 100 squares (in accordance with JIS D0202-1988) was performed, and the evaluation was performed based on the number of squares that did not peel off.
The evaluation criteria for adhesion are as follows. A to C are acceptable and D is unacceptable.
A: 100
B: 95 or more and 99 or less C: 90 or more and 94 or less D: Less than 90

<Measurement of elastic modulus>
A composition for preparing a model film is prepared by removing the toluene dispersion of quantum dots 1 and 2 from the composition of the quantum dot-containing polymerizable composition used in each example and comparative example. A model film having a thickness of 60 μm was prepared. Specifically, a model film was produced by the following method.
After applying the model film composition to a release film (Lumirror # 50 manufactured by Toray Industries Inc., 50 μm thick) with a wire bar, another release film is laminated thereon, and an air-cooled metal halide lamp of 200 W / cm (Made by Eye Graphics Co., Ltd.) was used to cure by irradiating ultraviolet rays with 1000 mJ / cm ² from the coated surface. The above steps were all performed in a nitrogen atmosphere. The model film was cut into 5 mm × 30 mm, and the release films on both sides of the cured film thus obtained were peeled off to obtain a single resin layer film (model film) having a thickness of 60 μm.
The model membrane was conditioned at 25 ° C. and 60% RH for 2 hours or more and then measured with a dynamic viscoelasticity measuring device (Vibron: DVA-225 (produced by IT Measurement Control Co., Ltd.)). Measurement was performed at 2 ° C./minute, a measurement temperature range of 30 ° C. to 150 ° C., and a frequency of 1 Hz, and the value of the storage elastic modulus at 50 ° C. was used as the elastic modulus.
The results are shown in Table 1 below.

[Supplement under rule 26 24.08.2016]

As shown in Table 1 above, in the example of the laminated film of the second aspect of the present invention, the non-light emitting region at the end is reduced as compared with the comparative example, and the end surface is composed of two or more metal layers. It can be seen that deterioration of the quantum dot layer (optical functional layer) can be prevented by blocking oxygen and water by the sealing layer.
In addition, from the comparison between the examples and the comparative examples, the monofunctional polymerizable compound and the polyfunctional polymerizable compound are used in combination, and the elastic modulus is set within a predetermined range, so that the film stress during the formation of the metal thin film can be reduced. The matrix can withstand, the defects of the metal thin film on the end face can be eliminated, smoothness can be ensured, and an end face sealing layer having a high barrier property on the end face can be obtained.

[Example 24]
Next, for the laminated film of the first aspect of the present invention, a laminated film 10b shown in FIG.
In the laminated film of Example 24, the composition of the coating solution for forming an optical functional layer was changed to the following composition, and in the sheet processing step, 1000 laminated laminates cut into a sheet shape were stacked, and then Daiwa Koki Kogyo Co., Ltd. It was produced in the same manner as in Example 1 except that the end surface of the laminate was adjusted by cutting the laminate end surface under the conditions of a blade angle of 0 ° and a cutting depth of 10 μm using a company retotome REM-710.
When the surface roughness Ra of the end surface of the produced functional layer laminate 11 was measured with an interference microscope (vertscan 2.0, manufactured by Ryoka Systems Co., Ltd.), the surface roughness Ra was 0.6 μm.

(Composition of coating solution for forming optical functional layer)
-Toluene dispersion of quantum dots 1 (luminescence maximum: 520 nm) 10 parts by mass-Toluene dispersion of quantum dots 2 (luminescence maximum: 630 nm) 1 part by weight-Lauryl methacrylate 2.4 parts by weight-Trimethylolpropane triacrylate 0. 54 parts by mass / photopolymerization initiator 0.009 parts by mass (Irgacure 819 (manufactured by BASF))

[Examples 25 to 29]
Example 24, except that the material, film thickness, and surface roughness Ra of the end surface of the functional layer laminate 11 were changed as shown in Table 2 below for each of the first layer 18, the second layer 22, and the outermost layer 20. In the same manner as above, a laminated film 10b was produced.
In Example 27, end face cutting was performed under the conditions of a blade angle of 0 ° and a cutting depth of 20 μm. In Example 29, end face cutting was performed under the conditions of a blade angle of 25 ° and a cutting depth of 20 μm.

[Example 30]
Example 24, except that the second layer 22 is not formed and the first layer 18 and the outermost layer 20 are formed in two layers, and the material and film thickness of the first layer 18 are changed as shown in Table 2 below. In the same manner as above, a laminated film 10a was produced.

[Comparative Example 5]
A laminated film was produced in the same manner as in Example 24 except that the end face sealing layer was not formed.

[Comparative Example 6]
A laminated film was produced in the same manner as in Example 24 except that the end face sealing layer was one layer and the material and film thickness of this layer were changed as shown in Table 2 below.

[Comparative Example 7]
As an end face sealing layer, Loctite E-30CL manufactured by Henkel Japan Co., Ltd. was formed on the end face of the functional layer laminate by a dip method.

[Evaluation]
<Evaluation of end face sealing performance>
For the produced laminated films of Examples 24 to 30 and Comparative Examples 5 to 7, the end face sealing performance was evaluated in the same manner as described above.

<Evaluation of adhesion>
The adhesion of the produced laminated films of Examples 24 to 30 and Comparative Examples 5 to 7 was evaluated in the same manner as described above.

<Evaluation of the number of pinholes>
The number of pinholes in the end face sealing layer of the produced laminated film was measured as follows.
The end face sealing layers on the four sides were observed with an optical microscope, an uncoated portion having a size of 1 μm or more was used as a pinhole, and the number x was measured to obtain the number of pinholes per 1 mm ² .
Evaluation was made according to the following criteria as an index of the number of pinholes. If the evaluation result is C or more, it can be determined that the number of pinholes is small and the end sealing layer has a sufficient gas barrier property.
A: x ≦ 5 / mm ²
B: 5 pieces / mm ² <x <10 pieces / mm ²
C: 10 pieces / mm ² ≦ x <20 pieces / mm ²
D: 20 pieces / mm ² ≦ x

<Evaluation of wraparound width>
The wraparound width to the main surface of the end face sealing layer of the produced laminated film was measured as follows.
The laminated film was cut in a cross section under the conditions of a blade angle of 0 ° and a cutting depth of 10 μm using a Retotom REM-710 manufactured by Daiwa Koki Kogyo Co., Ltd., and the cross section was observed with an optical microscope to obtain a wraparound width d.
As an index of the wraparound width d, evaluation was performed according to the following criteria. If the evaluation result is C or more, it can be determined that the wraparound width is small and the non-light-emitting portion at the end of the film can be suppressed.
A: d ≦ 0.1 mm
B: 0.1 mm <d <0.5 mm
C: 0.5 mm ≦ d <1 mm
D: 1 mm ≦ d
Moreover, the optical microscope photograph of the cross section of the end surface of the laminated film of the comparative example 7 is shown in FIG.
The results are shown in Table 2 below.

As shown in Table 2 above, in the example of the laminated film of the first aspect of the present invention, the non-light-emitting region at the end is reduced compared to the comparative example, and the end surface is composed of two or more metal layers. It turns out that deterioration of a quantum dot (optical function layer) can be prevented by interrupting | blocking oxygen and water with a sealing layer.
Further, from comparison between Example 24, Example 26, and Comparative Example 6, it can be seen that the thicker the end face sealing layer, the lower the oxygen permeability and the higher the sealing performance.

Moreover, it turns out from the comparison of Example 24, Example 27, and Example 29 that sealing performance becomes higher, so that the surface roughness Ra of a functional layer laminated body is small. It is presumed that this is because if the surface roughness Ra of the functional layer laminate is large, it is difficult to uniformly cover the end face sealing layer, and pinholes are generated. From this result, it can be seen that the surface roughness Ra of the functional layer laminate is preferably 2.0 μm or less.
Further, from the comparison of Example 24, Example 28, and Example 30, the material of the first layer in contact with the end face of the functional layer laminate is higher than any one of aluminum, titanium, chromium, and nickel. It can be seen that adhesion can be obtained.
From the above results, the effects of the present invention are clear.

10a, 10b Laminated film 11 Functional layer laminate 12 Optical functional layer 14 Gas barrier layer (gas barrier film)
16a, 16b End

face sealing layer

18,

18A First layer

20, 20A Outermost layer 22 Second layer 30 Gas barrier support 32 Barrier layer 34 Organic layer 36 Inorganic layer 38 Organic layer 50 Laminate 52 Laminate with first layer formed 54 Laminate with outermost layer formed

Claims

A functional layer laminate having an optical functional layer and a gas barrier layer laminated on at least one main surface of the optical functional layer; and
An end face sealing layer formed to cover at least a part of the end face of the functional layer laminate,
The end face sealing layer is composed of at least two layers, and each layer is composed of a metal.
The laminated film according to claim 1, wherein at least one layer other than the first layer in contact with the functional layer laminate of the end face sealing layer is a metal plating layer.
The laminated film according to claim 1 or 2, wherein the outermost surface layer of the end face sealing layer farthest from the functional layer laminate is a metal plating layer.
The laminated film according to claim 2 or 3, wherein the thickness of the metal plating layer is thicker than the thickness of the first layer in contact with the functional layer laminate.
The first layer has a thickness of 0.001 μm to 0.5 μm;
The laminated film according to claim 4, wherein the metal plating layer has a thickness of 0.01 μm to 100 μm.
The material of the first layer in contact with the functional layer laminate is at least one selected from the group consisting of aluminum, titanium, chromium, copper, and nickel, or an alloy containing at least one of these,
The material of each layer other than the first layer is at least one selected from the group consisting of aluminum, titanium, chromium, nickel, tin, copper, silver, and gold, or an alloy containing at least one of these. The laminated film according to any one of claims 1 to 5.
The laminated film according to any one of claims 1 to 6, wherein the end face sealing layer has a thickness of 0.1 µm to 100 µm.
The laminated film according to any one of claims 1 to 7, wherein the functional film laminate having the optical functional layer and the gas barrier layer has at least two layers, and each layer has an end face sealing layer made of metal. A method for producing a laminated film to be produced,
A first layer forming step of forming the first layer in contact with the functional layer laminate on an end face of a laminate in which a plurality of the functional layer laminates are stacked;
An outermost layer forming step of forming an outermost layer on the first layer formed on the end surface of the laminate,
A method for producing a laminated film, wherein the method for forming the first layer is one selected from the group consisting of a sputtering method, a vacuum deposition method, an ion plating method, and a plasma CVD method.
The method for producing a laminated film according to claim 8, wherein the formation method of at least one layer other than the first layer of the end face sealing layer is a metal plating process.
A functional layer laminate having an optical functional layer and a gas barrier layer laminated on at least one main surface of the optical functional layer; and
An end face sealing layer formed to cover at least a part of the end face of the functional layer laminate,
The end face sealing layer is composed of at least two layers, and each layer is a laminated film made of metal,
The laminated film, wherein the optical functional layer is a cured layer obtained by curing a polymerizable composition containing a phosphor and at least two or more polymerizable compounds.
The laminated film according to claim 10, wherein the polymerizable compound contains at least one kind of a first polymerizable compound made of a monofunctional polymerizable compound and at least one kind of a second polymerizable compound made of a polyfunctional polymerizable compound.
The first polymerizable compound is an aliphatic or aromatic alkyl (meth) acrylate having an alkyl group with 4 to 30 carbon atoms,
The second polymerizable compound is 1,6-hexanediol diacrylate, 1,10-decanediol diacrylate, 1,9-nonanediol di (meth) acrylate, tricyclodecane dimethanol diacrylate, dicyclopenta. The laminated film according to claim 11, which is selected from nildi (meth) acrylate and ethoxylated bisphenol A diacrylate.
The laminated film according to any one of claims 10 to 12, wherein the optical function layer has an elastic modulus at 50 ° C of 1 MPa to 4000 MPa.
The laminated film according to any one of claims 10 to 13, wherein the gas barrier layer is laminated on both main surfaces of the optical functional layer.
The laminated film according to any one of claims 10 to 14, wherein the phosphor of the optical functional layer is a quantum dot, a quantum rod, or a tetrapod type quantum dot.
The laminated film according to any one of claims 10 to 15, wherein at least one layer other than the first layer in contact with the functional layer laminate in the end face sealing layer is a metal plating layer.
The laminated film according to any one of claims 10 to 16, wherein the outermost surface layer of the end face sealing layer that is farthest from the functional layer laminate is a metal plating layer.
The laminated film according to claim 16 or 17, wherein the thickness of the metal plating layer is thicker than the thickness of the first layer in contact with the functional layer laminate.
The first layer has a thickness of 0.001 μm to 0.5 μm;
The laminated film according to claim 18, wherein the metal plating layer has a thickness of 0.01 袖 m to 100 袖 m.
The material of the first layer in contact with the functional layer laminate is at least one selected from the group consisting of aluminum, titanium, chromium, copper, and nickel, or an alloy containing at least one of these,
The material of each layer other than the first layer is at least one selected from the group consisting of aluminum, titanium, chromium, nickel, tin, copper, silver, and gold, or an alloy containing at least one of these. The laminated film according to any one of claims 10 to 19.
The laminated film according to any one of claims 10 to 20, wherein the end face sealing layer has a thickness of 0.1 µm to 100 µm.
The laminated film according to any one of claims 10 to 21, which comprises at least two layers on each side surface of the functional layer laminate having an optical functional layer and a gas barrier layer, and each layer has an end face sealing layer made of metal. A method for producing a laminated film to be produced,
On the gas barrier film having the gas barrier layer, a functional layer laminate is formed by applying and curing a polymerizable composition containing a phosphor and at least two or more polymerizable compounds,
A first layer forming step of forming the first layer in contact with the functional layer laminate on an end face of a laminate in which a plurality of the functional layer laminates are stacked;
An outermost layer forming step of forming an outermost layer on the first layer formed on the end surface of the laminate,
A method for producing a laminated film, wherein the method for forming the first layer is one selected from the group consisting of a sputtering method, a vacuum deposition method, an ion plating method, and a plasma CVD method.
The method for producing a laminated film according to claim 22, wherein the formation method of at least one layer other than the first layer of the end face sealing layer is a metal plating process.