WO2016201676A1 - 一种平板电脑主板 - Google Patents

一种平板电脑主板 Download PDF

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Publication number
WO2016201676A1
WO2016201676A1 PCT/CN2015/081813 CN2015081813W WO2016201676A1 WO 2016201676 A1 WO2016201676 A1 WO 2016201676A1 CN 2015081813 W CN2015081813 W CN 2015081813W WO 2016201676 A1 WO2016201676 A1 WO 2016201676A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
circuit board
dissipation fins
air pump
heat sink
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Application number
PCT/CN2015/081813
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English (en)
French (fr)
Inventor
许亮芳
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许亮芳
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Publication date
Application filed by 许亮芳 filed Critical 许亮芳
Priority to PCT/CN2015/081813 priority Critical patent/WO2016201676A1/zh
Publication of WO2016201676A1 publication Critical patent/WO2016201676A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the present invention relates to an electronic motherboard, and more particularly to a tablet motherboard.
  • the existing tablet motherboards are generally composed of circuit boards, sockets, and electronic components. With the maturity of electronic technology, the demand for tablet motherboards is increasing year by year.
  • the motherboard is the core component of the tablet, which will be generated during work.
  • a large amount of heat, the conventional heat dissipation method is a heat sink and a fan, which cannot meet the purpose of rapid heat dissipation, and as the use time increases, the dust accumulation of the fan, the noise is large, the heat dissipation effect is poor, and the heat dissipation of the circuit board is not timely, and finally burns.
  • the technical problem to be solved by the present invention is to provide a tablet computer motherboard to solve the problem of efficient and long-term heat dissipation of the tablet motherboard.
  • the technical solution of the present invention is: a tablet motherboard comprising a circuit board, a socket and an electronic component, wherein the heat sink and the water cooling component are further disposed on the back of the circuit board, Threaded, the water-cooling assembly comprises a micro air pump and a water pipe, the micro air pump is located on the back of the circuit board, and the two are screwed together, and the water pipes are located between the heat sinks, and the two are snap-connected.
  • micro air pump is further provided with a filter screen, the filter screen is located at the air outlet and the air inlet, and the filter mesh is connected with the air port clamp.
  • the four corners on the outer side of the top of the heat sink are further provided with a concave position, and the shape of the concave position is a rectangle.
  • a rubber pad is further disposed at the four corners of the outer side of the heat sink, and the rubber pad is 4-6 mm higher than the top of the heat sink.
  • the heat sink comprises a heat dissipation plate and a plurality of rows of spacers, and the two are integrated, and the shape of the spacer is 'S'.
  • the top of the heat sink has a hole position, and the shape of the hole is a circular through hole, and the hole is located at a convex shape of the 'S' shape.
  • the heat sink is further provided with an annular buckle, and the buckle is distributed in a concave shape of the 'S' shape, and the two are screwed together.
  • the tablet motherboard has a rubber pad on the outer side of the circuit board with the heat sink on the outer side of the circuit board, so that the circuit board and the heat sink have a gap, and the spacer shape of the heat sink is 'S'.
  • the spacer shape of the heat sink is 'S'.
  • the shape of the 'S' there is a buckle on the concave position of the 'S' shape, a circular hole is formed in the convex position, the water pipe is shaped by the buckle, the circular hole is inserted, and is densely arranged on the heat sink, and the water pipe is filled with the purified water.
  • the air pump realizes rapid cycle cooling, because the air outlet and the air inlet of the air pump have a clamp-fixed filter screen to realize double-layer evolution, ensuring smooth circulation inside the water pipe, and achieving a continuous fast and quiet heat dissipation effect.
  • Figure 1 is a front view of the tablet motherboard.
  • FIG. 2 is a cross-sectional view of the tablet motherboard.
  • the heat sink 4 is located on the back of the circuit board 1 and is screwed together.
  • the water cooling component 5 includes a micro air pump 501 and a water pipe 502.
  • the micro air pump 501 is located on the back of the circuit board 1 and is screwed together.
  • the water pipe 502 is located.
  • the micro air pump 501 is further provided with a filter 503 for filtering
  • the net 503 is located at the air outlet and the air inlet, and the filter 503 is connected to the air port clamp 504.
  • the four corners of the top of the heat sink 4 are further provided with a concave position.
  • the shape of the concave portion is a rectangle, and the top of the heat sink 4 is The outer four corners are further provided with a rubber pad 402.
  • the rubber pad 402 is higher than the top of the heat sink 4 by 4-6 mm.
  • the heat sink 4 includes a heat dissipation plate and a plurality of rows of spacers, and the two are integrated, and the shape of the spacer is ' S-shaped, the heat sink 4 has a hole at the top, the shape of the hole is a circular through hole, the hole is located at the convex shape of the 'S' shape, and the heat sink 4 is further provided with an annular buckle 401, the buckle The 401 is distributed in the concave shape of the 'S' shape, and the two are screwed together.
  • the four corners of the circuit board 1 on the outer side of the circuit board 1 are provided with rubber pads 402 at the four corner recesses, so that the circuit board 1 and the heat sink 4 are provided.
  • the buckle 401 is mounted on the concave position of the 'S' shape, the circular hole is formed in the convex position, and the water pipe 502 is shaped by the buckle 401.
  • the hole is interspersed, densely distributed on the heat sink 4, and the water purification is realized in the water pipe 502, and the rapid circulation cooling is realized through the micro air pump 501 because of the air pump
  • the air outlet and the air inlet have a filter 503 fixed by the clamp 504 to realize double-layer evolution, ensuring smooth circulation inside the water pipe 502, and achieving a rapid and quiet heat dissipation effect.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明公开了一种平板电脑主板，包含电路板、插口和电子元器件，还包括散热片和水冷组件，所述散热片位于电路板背面，二者螺纹相连，水冷组件包含微型气泵和水管，微型气泵位于电路板背面，二者螺纹相连，水管位于散热片之间，二者卡扣相连，这种平板电脑主板的电路板外侧装有散热片的四角凹陷处装有橡胶垫，使电路板和散热片存有间隙，另外散热片的隔片形状是'S'形的，在'S'形的凹位上装有卡扣，凸位上开有圆孔，水管通过卡扣定形，圆孔穿插，密布在散热片上，水管内实现填充净水，在经由微型气泵实现快速循环冷却，气泵的出气口和进气口都有卡箍固定的滤网实现双层进化，保证水管内部循环畅通，达到持续快速安静的散热效果。

Description

一种平板电脑主板 技术领域
本发明涉及电子主板，尤其涉及一种平板电脑主板。
背景技术
现有的平板电脑主板一般由电路板、插口、和电子元器件等部件组成，随着电子技术的愈加成熟，平板电脑主板的需求量逐年增长，主板是平板电脑的核心部件，工作时会产生大量热量，常规的散热方法是散热片和风扇，不能满足快速散热的目的，而且随着使用时间增长，风扇的灰尘积淀，噪音大，散热效果差，造成电路板散热不及时，最后烧毁。鉴于上述缺陷，实有必要设计一种平板电脑主板。
发明内容
本发明所要解决的技术问题在于：提供一种平板电脑主板，来解决平板电脑主板高效长时间散热问题。
为解决上述技术问题，本发明的技术方案是：一种平板电脑主板，包含电路板、插口和电子元器件，其中，还包括散热片和水冷组件，所述散热片位于电路板背面，二者螺纹相连，所述水冷组件包含微型气泵和水管，所述微型气泵位于电路板背面，二者螺纹相连，所述水管位于散热片之间，二者卡扣相连。
进一步，所述微型气泵还设有滤网，滤网位于出气口和进气口，滤网与气口卡箍相接。
进一步，所述散热片顶部外侧的四角处还设有凹位，凹位的形状是矩形。
进一步,所述散热片顶部外侧的四角凹位处还设有橡胶垫，橡胶垫高于散热片顶部4-6mm。
进一步，所述散热片包含散热板和多列隔片，二者为一体，隔片的形状‘S’形。
进一步，所述散热片顶部还有孔位，孔的形状是圆形通孔，孔位于‘S’形的凸形处。
进一步，所述散热片还设有环形卡扣，卡扣分布在‘S’形的凹形处，二者螺纹相连。
与现有技术相比，这种平板电脑主板的电路板外侧装有散热片的四角凹陷处装有橡胶垫，使电路板和散热片存有间隙，另外散热片的隔片形状是‘S’形的，在‘S’形的的凹位上装有卡扣，凸位上开有圆孔，水管通过卡扣定形，圆孔穿插，密布在散热片上，水管内实现填充净水，在经由微型气泵实现快速循环冷却，因为气泵的出气口和进气口都有卡箍固定的滤网实现双层进化，保证水管内部循环畅通，达到持续快速安静的散热效果。
附图内容
图1是平板电脑主板的主视图。
图2是平板电脑主板的剖视图。
电路板            1      微型气泵         501
插口              2      水管             502
电子元器件        3      滤网             503
散热片            4      卡箍             504
水冷组件          5      卡扣             401
橡胶垫            402
如下具体实施方式将结合上述附图进一步说明。
具体实施方式
在下文中，阐述了多种特定细节，以便提供对构成所描述实施例基础的概念的透彻理解。然而，对本领域的技术人员来说，很显然所描述的实施例可以在没有这些特定细节中的一些或者全部的情况下来实践。在其他情况下，没有具体描述众所周知的处理步骤。
如图1所示，包括电路板1、插口2、电子元器件3、散热片4、水冷组件5、微型气泵501、水管502、滤网503，卡箍504、卡扣401、橡胶垫402，所述散热片4位于电路板1背面，二者螺纹相连，所述水冷组件5包含微型气泵501和水管502，所述微型气泵501位于电路板1背面，二者螺纹相连，所述水管502位于散热片4之间，二者卡扣相连，所述微型气泵501还设有滤网503，滤 网503位于出气口和进气口，滤网503与气口卡箍504相接，所述散热片4顶部外侧的四角处还设有凹位，凹位的形状是矩形，所述散热片4顶部外侧的四角凹位处还设有橡胶垫402，橡胶垫402高于散热片4顶部4-6mm，所述散热片4包含散热板和多列隔片，二者为一体，隔片的形状‘S’形，所述散热片4顶部还有孔位，孔的形状是圆形通孔，孔位于‘S’形的凸形处，所述散热片4还设有环形卡扣401，卡扣401分布在‘S’形的凹形处，二者螺纹相连，这种平板电脑主板的电路板1外侧装有散热片4的四角凹陷处装有橡胶垫402，使电路板1和散热片4存有间隙，另外散热片4的隔片形状是‘S’形的，在‘S’形的凹位上装有卡扣401，凸位上开有圆孔，水管502通过卡扣401定形，圆孔穿插，密布在散热片4上，水管502内实现填充净水，在经由微型气泵501实现快速循环冷却，因为气泵的出气口和进气口都有卡箍504固定的滤网503实现双层进化，保证水管502内部循环畅通，达到持续快速安静的散热效果。
本发明不局限于上述具体的实施方式，本领域的普通技术人员从上述构思出发，不经过创造性的劳动，所做出的种种变换，均落在本发明的保护范围之内。

Claims (7)

  1. 一种平板电脑主板，包含电路板、插口和电子元器件，其中，包括散热片和水冷组件，所述散热片位于电路板背面，二者螺纹相连，所述水冷组件包含微型气泵和水管，所述微型气泵位于电路板背面，二者螺纹相连，所述水管位于散热片之间，二者卡扣相连。
  2. 如权利要求1所述的平板电脑主板，其中，所述微型气泵还设有滤网，滤网位于出气口和进气口，滤网与气口卡箍相接。
  3. 如权利要求1所述的平板电脑主板，其中，所述散热片顶部外侧的四角处还设有凹位，凹位的形状是矩形。
  4. 如权利要求3所述的平板电脑主板，其中，所述散热片顶部外侧的四角凹位处还设有橡胶垫，橡胶垫高于散热片顶部4-6mm。
  5. 如权利要求1所述的平板电脑主板，其中，所述散热片包含散热板和多列隔片，二者为一体，隔片的形状‘S’形。
  6. 如权利要求5所述的平板电脑主板，其中，所述散热片顶部还有孔位，孔的形状是圆形通孔，孔位于‘S’形的凸形处。
  7. 如权利要求6所述的平板电脑主板，其中，所述散热片还设有环形卡扣，卡扣分布在‘S’形的凹形处，二者螺纹相连。
PCT/CN2015/081813 2015-06-18 2015-06-18 一种平板电脑主板 WO2016201676A1 (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111666264A (zh) * 2020-05-16 2020-09-15 深圳市知小兵科技有限公司 一种数据库同步信息传输用处理装置

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Publication number Priority date Publication date Assignee Title
CN202887086U (zh) * 2012-09-29 2013-04-17 四川奥格科技有限公司 一种侧吹水冷式cpu散热器
CN204028755U (zh) * 2014-06-23 2014-12-17 安徽省磊鑫科技有限公司 一种散热平板电脑主板
CN204347688U (zh) * 2014-12-02 2015-05-20 朱小涛 一种平板电脑散热主板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202887086U (zh) * 2012-09-29 2013-04-17 四川奥格科技有限公司 一种侧吹水冷式cpu散热器
CN204028755U (zh) * 2014-06-23 2014-12-17 安徽省磊鑫科技有限公司 一种散热平板电脑主板
CN204347688U (zh) * 2014-12-02 2015-05-20 朱小涛 一种平板电脑散热主板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111666264A (zh) * 2020-05-16 2020-09-15 深圳市知小兵科技有限公司 一种数据库同步信息传输用处理装置
CN111666264B (zh) * 2020-05-16 2021-08-17 江苏有线数据网络有限责任公司 一种数据库同步信息传输用处理装置

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