WO2016187139A1 - System and method for imaging a sample with an illumination source modified by a spatial selective wavelength filter - Google Patents
System and method for imaging a sample with an illumination source modified by a spatial selective wavelength filter Download PDFInfo
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- WO2016187139A1 WO2016187139A1 PCT/US2016/032743 US2016032743W WO2016187139A1 WO 2016187139 A1 WO2016187139 A1 WO 2016187139A1 US 2016032743 W US2016032743 W US 2016032743W WO 2016187139 A1 WO2016187139 A1 WO 2016187139A1
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- wavelengths
- filter element
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- spatial filter
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/203—Filters having holographic or diffractive elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/003—Production of X-ray radiation generated from plasma the plasma being generated from a material in a liquid or gas state
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/008—Production of X-ray radiation generated from plasma involving an energy-carrying beam in the process of plasma generation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8845—Multiple wavelengths of illumination or detection
Definitions
- the present disclosure relates generally to wafer inspection systems, and in particular, to the illumination of a wafer with a spectrally filtered illumination source.
- the minimum feature size that can be resolved by an optical system designed for inspection or fabrication is inversely proportional to the wavelength of the illumination source. There is therefore a constant need to develop sources with shorter wavelengths and higher intensities at these wavelengths.
- the development of increasingly powerful illumination sources presents new challenges for the development of systems and methods for harnessing this illumination.
- One significant challenge associated with optical systems designed to work with wavelengths that span into the ultraviolet is that many materials are highly absorbent to short-wavelength illumination. This high absorption not only leads to a reduction of performance, but can also become a factor that limits the allowable intensity of the illumination source.
- many coatings designed to filter the spectrum of ultraviolet illumination sources are driven to high temperatures due to high absorption of illuminated light, a process called thermal loading. This thermal loading can ultimately lead to component damage or photo-contamination in the system. Therefore, it is desirable to cure the defects identified above in the prior art. .
- the ultraviolet illumination source includes an illumination source configured to generate a beam of illumination that includes a first set of wavelengths.
- the ultraviolet illumination source includes a first set of one or more optical elements, wherein the first set of one or more optical elements includes one or more first dispersive elements positioned to introduce spatial dispersion into the beam.
- the ultraviolet illumination source includes a spatial filter element, wherein the spatial filter element is positioned in a plane conjugate to the illumination source, wherein the spatial filter element is configured to pass at least a portion of the beam, wherein the beam directed from the spatial filter element includes a second set of wavelengths, wherein the second set of wavelengths is a subset of the first set of wavelengths.
- the ultraviolet illumination source includes a second set of one or more optical elements, wherein the second set of one or more optical elements is positioned to collect at least a portion of the beam, wherein the second set of one or more optical elements includes one or more second dispersive elements positioned to remove spatial dispersion from the beam.
- the system includes an illumination source configured to generate a beam of illumination that includes a first set of wavelengths.
- the system includes a wavelength filtering sub-system.
- the wavelength filtering sub-system includes a first set of one or more optical elements, wherein the first set of one or more optical elements includes one or more first dispersive elements positioned to introduce spatial dispersion into the beam.
- the wavelength filtering sub-system includes a spatial filter element, wherein the spatial filter element is positioned in a plane conjugate to the illumination source, wherein the spatial filter element is configured to pass at least a portion of the beam, wherein the beam directed from the spatial filter element includes a second set of wavelengths, wherein the second set of wavelengths is a subset of the first set of wavelengths.
- the wavelength filtering sub-system includes a second set of one or more optical elements, wherein the second set of one or more optical elements is positioned to collect at least a portion of the beam, wherein the second set of one or more optical elements includes one or more second dispersive elements positioned to remove spatial dispersion from the beam.
- the system includes a sample stage for securing one or more samples.
- the system includes an illumination sub-system configured to illuminate at least a portion of the one or more samples with at least a portion of the second set of wavelengths via an illumination pathway.
- the system includes a detector.
- the system includes an objective configured to focus illumination from the surface of the one or more samples and focus the collected iliumination via a collection pathway to the detector to form an image of at least a portion of the surface of the one or more samples on the detector.
- the system includes an illumination source configured to generate a beam of iliumination that includes a first set of wavelengths.
- the system includes a wavelength filtering sub-system.
- the wavelength filtering sub-system includes a first set of one or more optical elements, wherein the first set of one or more optical elements includes one or more first dispersive elements positioned to introduce spatial dispersion into the beam.
- the wavelength filtering sub-system includes a spatial filter element, wherein the spatial filter element is positioned in a plane conjugate to the illumination source, wherein the spatial filter element is positioned to reflectively pass at least a portion of the beam, wherein the beam directed from the spatial filter element includes a second set of wavelengths, wherein the second set of wavelengths is a subset of the first set of wavelengths, wherein the beam directed from the spatial filter element propagates back through the one or more optical elements in a mirrored path such that spatial dispersion is removed from the beam.
- the system includes a sample stage for securing one or more samples.
- the system includes an illumination sub-system configured to illuminate at least a portion of the one or more samples with at least a portion of the second set of wavelengths via an illumination pathway.
- the system includes a defector.
- the system includes an objective configured to focus illumination from the surface of the one or more samples and focus the collected illumination via a collection pathway to the detector to form an image of at least a portion of the surface of the one or more samples on the detector.
- the system includes an objective configured to focus illumination from the surface of the one or more samples and focus the collected illumination via a collection pathway to the detector to form an image of at least a portion of the surface of the one or more samples on the defector.
- the method includes generating a beam of illumination including a first set of wavelengths, !n another illustrative embodiment, the method includes introducing spatial dispersion into the beam. In another illustrative embodiment, the method includes directing the beam onto a spatial filter element, such that the beam directed from the spatial filter element includes a second set of wavelengths, wherein the second set of wavelengths is a subset of the first set of wavelengths. In another illustrative embodiment, the method includes collecting at least a portion of the beam directed from the spatial filter element. In another illustrative embodiment, the method includes removing spatial dispersion from the beam.
- FIG. 1A is a conceptual view of a system for imaging a sample with a spectrally filtered illumination source in accordance with one embodiment of the present disclosure.
- FIG. 1 B is a schematic view of a wavelength filtering sub-system in accordance with one embodiment of the present disclosure.
- FIG. 1 C is a schematic view of a wavelength filtering sub-system configured with optically mirrored illumination pathways in accordance with one embodiment of the present disclosure.
- FIG. 1 D is a schematic view of a wavelength filtering sub-system configured with optically mirrored illumination pathways and an extended illumination source in accordance with one embodiment of the present disclosure.
- FIG. 1 E is a conceptual view of a traditional triangular prism used as a dispersive element in accordance with one embodiment of the present disclosure.
- FIG. 1 F is a conceptual view of a prism array used as a dispersive element in accordance with one embodiment of the present disclosure.
- FIG. 2 is a conceptual view of a spatially dispersed image of an extended illumination source configured such that each wavelength is imaged to a line, wherein the width of the line is related to the size of the illumination source, in accordance with one embodiment of the present disclosure.
- FIG. 3 is a schematic view of a system for illuminating a sample with a spectrally filtered illumination source in accordance with one embodiment of the present disclosure.
- FIG. 4 is a flow diagram depicting a method for imaging a sample with a spectrally filtered illumination source in accordance with one embodiment of the present disclosure.
- Embodiments of the present disclosure are directed to the selection of a desired set of wavelengths from the spectrum of an illumination source. Additional embodiments are directed to the coupling of the spectrally filtered wavelengths with illumination optics of a corresponding imaging system (e.g. a wafer inspection subsystem, a metrology sub-system, and the like). Some embodiments of the present disclosure are directed to wavelength selection in high power and extremely short wavelength systems.
- FIG. 1A illustrates a system 100 for imaging a sample with a spectrally filtered portion of an illumination source 101 , in accordance with an embodiment of the present disclosure.
- the illumination source 101 generates an illumination output defining a beam 104 having a spectrum comprised of a first set of wavelengths.
- the first set of wavelengths may include, but is not limited to, wavelengths in the infrared, visible, ultraviolet (UV), deep ultraviolet (DUV), extreme ultraviolet (EUV), and/or vacuum ultraviolet (VUV) regions of the electromagnetic spectrum.
- at least a portion of the beam 104 may be collected and directed by one or more elements 103.
- the one or more optical elements 103 may include, but are not limited to, one or more lenses, prisms, gratings, polarizing elements, waveplates, or apertures. It is further noted that the one or more elements may be configured to modify the temporal or spatial profile of the beam 104 as well as to control the divergence of the beam 104 (e.g. to produce a beam 104 that is coliimated, diverging, or converging).
- the beam 104 is directed to a wavelength filtering sub-system 102 within the system 100.
- the beam 104 passes through the entrance pupil 1 16 of the wavelength filtering sub-system 102 and is incident on a dispersion element 1 1 1 (e.g. a prism) positioned to introduce spatial dispersion into the beam 104.
- a dispersion element 1 1 1 e.g. a prism
- each wavelength within the first set of wavelengths is directed from the dispersion element 1 1 1 at a different angle.
- a focusing element 1 13 is positioned to collect and focus the beam 104 onto a spatial filter element 1 12 configured to pass only a portion of the beam having a second set of wavelengths.
- the second set of wavelengths is a subset of the first set of wavelengths. Due to the spatial dispersion induced by the dispersion element 1 1 1 , the focusing element 1 13 focuses each wavelength to a different location on the spatial filter element 1 12.
- the spatial filter element 1 12 is an aperture with one or more openings positioned such that only the second set of wavelengths pass through the one or more openings.
- a second focusing element 1 14 is positioned to collect and coiiimate the selected wavelengths of light passed by the spatial filter element 1 12.
- a second dispersion element (e.g. a prism) 1 15 is positioned to remove the spatial dispersion and produce a beam 105.
- the beam 105 that passes through the exit pupil 1 17 of the wavelength filtering sub-system 102 is thus a spectrally filtered version of the beam passing through the entrance pupil 1 16.
- dispersive elements 1 1 1 and/or 1 15 may include any number of dispersive components known in the art and may include, but are not limited to refractive elements (e.g. prisms) and diffractive elements (e.g. diffraction gratings that operate in either reflection or transmission modes).
- dispersive element 1 1 1 includes a prism array 1 1 1 b, or equivalentiy a Fresnel prism 1 1 1 b.
- a prism array 1 1 1 b with an apex angle 136 and a width 134 may introduce the same dispersion to a beam 104 as a traditional prism 1 1 1 a with the same apex angle 136 and a width 132. In this way, a reduction from the thickness 132 to thickness 134 may reduce the absorption of light (e.g. UV light) in the dispersive element 1 1 1. It is further noted that any of the dispersive elements 1 1 1 and/or 1 15 may include any combination of refractive and diffractive elements.
- the dispersive elements 1 1 1 and/or 1 15 may include, but are not limited to, one or more prisms of any one of traditional or Fresnel types.
- the dispersive element 1 1 1 may include, but is not limited to, one diffraction gratings and the dispersive element 1 15 may include, but is not limited to, one or more prisms.
- any lens element in the system 100 e.g., elements 103 and 106) may include one or more Fresnel lenses.
- any of the dispersion elements 1 1 1 and/or 1 15 may be fabricated out of any material known in the art suitable for the purpose of introducing dispersion.
- a transmissive dispersive element 1 1 1 and/or 1 15 such as a prism or a transmission diffraction grating may be formed from a material such as, but not limited to MgF2, LiF, CaF2, sapphire, crystalline quartz, fused silica, SUPRAS!L 1 , SUPRASIL 2, SUPRASIL 300, SUPRAS!L 310, HERALUX PLUS, HERALUX-VUV, and the like.
- a refraction-based dispersive optical element 1 1 1 and/or 1 15 e.g. a prism
- a diffraction-based dispersive element 1 1 1 and/or 1 15 such as a diffraction grating may be fabricated using any manufacturing process known in the art.
- Diffraction-based dispersive elements 1 1 1 and/or 1 15 may include, but are not limited to, holographic gratings, ruled gratings, blazed gratings, Volume Bragg Gratings (VBGs), or gratings fabricated using a direct- write processes such as femtosecond laser direct writing either on the surface of or within the bulk of a material.
- VBGs Volume Bragg Gratings
- the focusing elements 1 13 and 1 14 may not be included.
- the focusing elements 1 13 and/or 1 14 may be formed from any type of lens known in the art.
- the focusing elements 1 13 and/or 1 14 may include, but are not limited to, one or more spherical lenses or one or more cylindrical lenses.
- the shape of the one or more passband regions of the spatial filter element 1 12 may be defined by the shape of the image of the illumination source 101 on the spatial filter element 1 12, which is affected by any elements positioned on the optical path of the beam 104 between the illumination source 101 and the spatial filter element 1 12.
- the dispersive element 1 1 1 is a linear prism positioned such that the beam exhibits linear spatial dispersion in one dimension and a focusing element 1 13 is a cylindrical lens is positioned such that each wavelength from the illumination source 101 is focused to a line on the spatial filter element 1 12. Furthermore, in this configuration, each wavelength is focused onto a different spatial location on the spatial filter.
- FIG. 2 illustrates a conceptual view of the image of the illumination source 101 on the spatial filter element 1 12 in accordance with one embodiment of the present disclosure.
- each wavelength of the illumination source 101 is imaged to a line on the spatial filter element 1 12.
- the width of the line 1 18 is related to the spatial extent of the imaged portion of the illumination source 101 .
- the contrast with which the spatial filter element 1 12 will be able to selectively pass a desired wavelength and block a second wavelength is dependent on the width of the line 1 18 corresponding to each wavelength on the spatial filter element 1 12; the smaller this linewidth, the smaller the spatial overlap of wavelengths on the spatial filter element 1 12 and the higher the contrast of the spatial filter. Referring to the conceptual view in FIG.
- the illumination source 101 may have a spectrum including wavelengths in the wavelength range of 120 nm to 200 nm. Each wavelength is imaged to a line on the spatial filter element 1 12 and the width of each line 1 18 represents the imaged size of the illumination source 101 .
- the system 100 may include elements 103 such as optics or filters (e.g. a spectrally selective coating or a spatial filter) configured to limit the spectral content and/or the effective size of the illumination source 101 as seen by the remainder of the system 100. It is further noted herein that the shape and size of the image of the illumination source 101 on the spatial filter element 1 12 may be designed in order to minimize fabrication constraints on the spatial filter element 1 12.
- imaging the illumination source such that each wavelength is in the shape of a line may make the spatial filter element 1 12 easier and/or cheaper to fabricate relative to imaging the illumination source 101 such that each wavelength is in the shape of a circle.
- the illumination 104 is collimated by any combination of optics including illumination source 101 and optical elements 103. Then, the collimated illumination 104 may be directed to a dispersion element 1 1 1 , and focused onto the spatial filter element 1 12 by a focusing element 1 13.
- the illumination source 101 and the spatial filter element 1 12 are positioned in an infinite conjugate configuration with respect to the focusing element 1 13, which is to say that the image of the illumination source as well as the spatial filter element 1 12 are located at the focal length of the focusing element 1 13. It is noted herein that the present disclosure is not limited to this particular configuration, which is provided merely for illustrative purposes. It is noted that the present disclosure may be extended to any arrangement where the illumination source 101 and the spatial filter element 1 12 are positioned in any number of finite conjugate positions such that the spatial filter element 1 12 is at an image plane of the illumination source 101.
- the function of the dispersion element 1 1 1 and the focusing element 1 13 may be accomplished using a single physical component such as a curved diffraction grating that introduces spatial dispersion into the beam 104 and simultaneously focuses the beam 104 onto the spatial filter element 1 12.
- the functions of the dispersive element 1 15 and focusing element 1 14 may be accomplished using a single physical component
- the spatial filter element 1 12 may include any type of spatial filter known in the art.
- the spatial filter is formed by an aperture that includes one or more openings.
- the second set of wavelengths i.e. those that are passed by the spatial filter element 1 12
- the wavelengths that are rejected by the spatial filter element are absorbed by the spatial filter element 1 12,
- the spatial filter element 1 12 has a highly reflective surface that reflects the rejected wavelengths.
- the spatial filter may be formed by a spatial light modulator having a control unit, wherein the spatial light modulator contains individually addressable regions, or pixels, that can be configured using the control unit to pass or reject wavelengths incident on each pixel.
- a spatial light modulator may operate in either transmission mode in which selected passed wavelengths are directed through the spatial light modulator or reflection mode in which selected passed wavelengths are reflected.
- the spatial filter includes a microelectromechanical system (MEMS) device or a nanoelectromechanical system (NEMS) device that can be configured to pass select wavelengths according to their location on the device.
- MEMS microelectromechanical system
- NEMS nanoelectromechanical system
- a MEMS-based spatial filter element 1 12 may be configured as a deformable mirror such that selected wavelengths to be passed are directed to subsequent elements in the system such as a focusing optic 1 14, while the remaining wavelengths are reflected away from the spatial filter element 1 12 (e.g., reflected to as a beam block or baffle).
- the MEMS-based spatial filter element 1 12 serves to reject the wavelengths not selected for being passed through the spatial filter element 1 12.
- the number of physical elements in the system 100 can be reduced by utilizing a configuration that is optically symmetric around a spatial filter element 1 12, !n this regard, the spatial filter element 1 12 is configured to operate in a reflective mode: the selected second set of wavelengths are reflected from the spatial filter element 1 12, and propagate through the dispersive element 1 1 1 along a mirrored optical path such that the spatial dispersion in the beam 104 is removed.
- Simplified schematic views illustrating this embodiment are shown in FIG. 1 C and FIG. 1 D, showing an illumination source 101 configured to be a point source and an extended source, respectively.
- a beam 104 is incident on a dispersive element 1 1 1 (e.g. a prism) positioned to introduce spatial dispersion into the beam 104.
- a focusing element 1 13 is positioned to collect and focus the beam 104 onto a spatial filter element 1 12 configured to operate in reflective mode.
- a selected second set of wavelengths are reflected from the spatial filter element 1 12 and pass through elements 1 1 1 and 1 13 a second time through a mirrored optical path.
- An output beam 105 may be selected and differentiated from the input beam 104 through any method known in the art.
- optical elements 103 may be configured to include a polarizing beam splitter and a quarter-wave plate for selected wavelengths such that the second set of wavelengths passed by the spatial filter element 1 12 are deflected along a different optical path than the input beam 104 upon interaction with the polarizing beam splitter on the second pass.
- the resulting beam 105 would then be directed to the illumination pathway 121 and uitimateiy to the sample 107.
- the wavelength filtering subsystem 102 is improved performance for short-wavelength illumination 104 (e.g. UV, EUV, DUV, and/or VUV illumination).
- the thermal properties of the material out of which the spatial filter element 1 12 is fabricated will, in part, control the maximum power limit of the wavelength filtering subsystem 102 inasmuch as at least a portion of the energy associated with wavelengths rejected by the spatial filter element 1 12 may be absorbed, !n one non-limiting example, the spatial filter element 1 12 is made of a metal capable of absorbing and dissipating (e.g. via an attached heat sink) the thermal load induced by the absorption of the wavelengths rejected by the spatial filter element 1 12.
- the spatial filter element 1 12 is configured to have a highly reflective surface such that a minimal fraction of the energy of the wavelengths rejected by the spatial filter element 1 12 are absorbed by the spatial filter element 1 12; rather, this energy is reflected away from the spatial filter element 1 12 to additional elements within the system 100 such as beam blocks or baffles designed to absorb and dissipate the energy.
- additional elements within the system 100 such as beam blocks or baffles designed to absorb and dissipate the energy.
- the illumination source 101 comprises a laser-sustained plasma (LSP) source configured to generate illumination 104 of a set of wavelengths or a wavelength range, such as, but not limited to infrared radiation, visible radiation, UV radiation, DUV radiation, and/or VUV radiation.
- the illumination source 101 is a laser-sustained plasma source, which generates broadband light via a plasma maintained within a plasma lamp.
- the plasma lamp of a LSP- based illumination source may include, but is not limited to, a plasma cell or plasma bulb.
- the illumination source 101 includes includes a discharge source such as, but not limited to, a plasma discharge lamp.
- the illumination source 101 may include, but is not limited to, a deuterium lamp.
- the illumination source 101 may include two or more light sources in order to produce an illumination source 101 having a larger number of wavelengths than possible with a single source.
- the illumination source is comprised of one or more narrowband illumination sources such as one or more laser sources.
- the illumination source 101 may include any laser system known in the art.
- the illumination source 101 may include any laser system known in the art configured to generate a set of wavelengths or a wavelength range, such as, but not limited to infrared radiation, visible radiation, UV radiation, DUV radiation, and/or VUV radiation.
- the illumination source 101 may include a laser system configured to emit continuous wave (CW) laser radiation.
- CW continuous wave
- the pump source 104 may include one or more CW ultraviolet laser sources configured for use in wafer inspection tool where it is desirable to have a short- wavelength source such as UV, DUV, EUV, or VUV illumination in order to achieve a desired resolution.
- a short- wavelength source such as UV, DUV, EUV, or VUV illumination
- an illumination source 101 configured to produce CW illumination is not limiting and any illumination source 101 known in the art may be implemented in the context of the present invention.
- the illumination source may be a pulsed laser source with pulse lengths of timescales including, but not limited to milliseconds, microseconds, nanoseconds, picoseconds, or femtoseconds.
- the illumination source 101 may be configured to produce a modulated output.
- the illumination source 101 may be modulated with an accousto-optic or an electro-optic modulator to produce temporally shaped illumination.
- the illumination source 101 may include one or more excimer laser systems.
- the illumination source may include an excimer laser configured to use molecular fluorine as an active gas to emit 157 nm laser light.
- the illumination source 101 may include one or more diode laser systems.
- the illumination source may include a diode laser configured to emit at 445 nm.
- the illumination source 101 may include one or more frequency converted laser systems.
- the illumination source 101 may include a gas ion laser with a nominal central illumination wavelength of 458 nm coupled with a Beta Barium Borate (BBO) crystal to produce illumination with a 229 nm central wavelength.
- BBO Beta Barium Borate
- the system 100 includes a stage assembly 108 suitable for securing a sample 107.
- the stage assembly 108 may include any sample stage architecture known in the art.
- the stage assembly 108 may include, but is not limited to, any combination of linear stages, rotational stages or multi-axis stages.
- the sample 107 may include a wafer, such as, but not limited to, a semiconductor wafer.
- the system 100 includes an imaging sub-system 121 .
- the imaging sub-system 121 may include, but is not limited to, lenses 120, and beam splitters 1 10. Additionally, the imaging sub-system 121 may include, but is not limited to, apertures, filters, homogenizers, polarizers, beam splitters, and/or beam -shaping elements suitable for delivering illumination from the wavelength-filtering sub-system 102 to the one or more samples 107.
- the imaging sub-system 121 may be coupled to the illumination output of the wavelength-filtering sub-system 102 and that it works in tandem with the objective 108. In this regard, the imaging subsystem 121 may inspect, or otherwise analyze, one or more samples 107 utilizing the illumination output (e.g., UV, DUV, EUV, or VUV light with selected wavelengths) from the wavelength-filtering sub-system 102.
- the illumination output e.g., UV, DUV, EUV, or VUV light with selected wavelengths
- the imaging sub-system 122 includes an objective 106 and a detector 109.
- the objective 106 may collect illumination after it is scattered or reflected from one or more portions of the one or more samples 107 (or particles disposed on the sample 107), The objective may additionally focus the collected Illumination via a collection pathway 123 to a detector 109 to form an image of one or more portions of the surface of the one or more samples 107.
- the objective 106 may include any objective known in the art suitable for performing inspection (e.g., darkfield inspection or brightfield inspection) or optica! metrology.
- the detector 109 may include any optical detector known in the art suitable for measuring illumination received from the one or more samples 107.
- the detector 109 may include, but is not limited to, a CCD detector, a TDI detector, or the like.
- the system 100 is configured to direct short-wavelength illumination onto a sample 107.
- the illumination source 101 includes a laser-sustained plasma source generating illumination with a first set of wavelengths in the range of 190 nm - 450 nm.
- the beam of illumination 104 is collected and collimated by an off-axis parabolic mirror 103.
- the beam 104 is then further directed to a dispersive element 1 1 1 (e.g. a prism), which introduces spatial dispersion into the beam 104.
- the beam is then incident on a focusing element 1 13 (e.g.
- a cylindrical mirror and focused onto a spatial filter element 1 12 configured to include an aperture with one or more openings, wherein the spatial filter element 1 12 is positioned to pass a second set of wavelengths.
- the beam 104 directed from the spatial filter element 1 12 is collected and collimated by a focusing element 1 14 (e.g. a cylindrical mirror) and further directed to a dispersive element 1 15 (e.g. a prism), which removes the spatial dispersion from the beam 104.
- the beam 104 is then collected by a second off-axis parabolic mirror and directed to a sample 107.
- any of the elements in the system 100 may be configured to include one or more coatings, including, but not limited to, anti-reflective coatings or spectrally selective coatings.
- a spectrally selective coating may be placed on the faces of the dispersing element 1 1 1 and/or 1 15, focusing elements 1 13 and/or 1 14, and/or the spatial filter element 1 12 in order to further lim it the spectral content of the beam 104 and/or 105.
- anti-reflective coatings may be placed on non-optical elements of the system 100 including an enclosing chamber for the purposes of reducing stray light throughout the system 100.
- one or more optical filters may be positioned along either the illumination pathway or the collection pathway in order to filter illumination prior to light entering the wavelength filtering sub-system 102 or to filter illumination following the wavelength-filtering sub-system 102.
- One or more optical filters may further be positioned in the illumination sub-system 122 or a collection pathway 123.
- FIG. 4 illustrates a flow diagram depicting a method for imaging a sample with an illumination source having a filtered spectral content, in accordance with one embodiment of the present disclosure.
- a beam of illumination 104 including a first set of wavelengths (e.g. illumination with a set of wavelengths or a wavelength range in the infrared, visible, UV, DUV, EUV, and/or VUV portions of the electromagnetic spectrum).
- spatial dispersion is introduced into the beam 104 using a dispersion element 1 1 1 .
- the beam 104 having spatial dispersion is directed to a spatial filter element 1 12 such that the beam directed from the spatial filter element 1 12 includes a second set of wavelengths, wherein the second set of wavelengths is a subset of the first set of wavelengths.
- the beam 104 directed from the spatial filter element 1 12 is collected.
- spatial dispersion is removed from the beam 104.
- the spatial dispersion may be removed by a second dispersive element 1 15.
- the spatial filter element 1 12 is configured to reflect the selected wavelengths in a mirror configuration such that the spatial dispersion may be removed by the same dispersion element 1 1 1 that initially produced the dispersion.
- one or more samples are illuminated with at least a portion of the selected second set of wavelengths via an illumination pathway 121 coupled with an objective 106.
- illumination from the one or more samples 107 is collected.
- light scattered or reflected from the one or more samples 107 may be imaged via a combination of the objective 106 and a collection pathway 123 onto a detector 109.
- any two components herein combined to achieve a particular functionality can be seen as “associated with” each other such that the desired functionality is achieved, irrespective of architectures or intermedial components.
- any two components so associated can also be viewed as being “connected”, or “coupled”, to each other to achieve the desired functionality, and any two components capable of being so associated can also be viewed as being “coupiable”, to each other to achieve the desired functionality.
- Specific examples of coupiable include but are not limited to physically interactabie and/or physically interacting components and/or wirelessly interactabie and/or wirelessiy interacting components and/or logically interactabie and/or logically interacting components.
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Abstract
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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CN202210656062.2A CN115060650A (en) | 2015-05-20 | 2016-05-16 | System and method for imaging a sample with an illumination source modified by a spatially selective wavelength filter |
JP2017560148A JP2018514788A (en) | 2015-05-20 | 2016-05-16 | System and method for imaging a sample using a light source modified by a spatially selective wavelength filter |
KR1020177036597A KR102381155B1 (en) | 2015-05-20 | 2016-05-16 | Systems and methods for imaging a sample with an illumination source modified by a spatially selective wavelength filter |
CN201680028562.4A CN107636449A (en) | 2015-05-20 | 2016-05-16 | For with by the light source that spatial selectivity wavelength filter is changed by the system and method for imaging samples |
JP2021196124A JP7344952B2 (en) | 2015-05-20 | 2021-12-02 | System and method for imaging a sample using a light source modified with a spatially selective wavelength filter and an ultraviolet light source |
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US201562164085P | 2015-05-20 | 2015-05-20 | |
US62/164,085 | 2015-05-20 | ||
US14/839,338 | 2015-08-28 | ||
US14/839,338 US10616987B2 (en) | 2015-08-28 | 2015-08-28 | System and method for imaging a sample with an illumination source modified by a spatial selective wavelength filter |
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WO2016187139A1 true WO2016187139A1 (en) | 2016-11-24 |
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PCT/US2016/032743 WO2016187139A1 (en) | 2015-05-20 | 2016-05-16 | System and method for imaging a sample with an illumination source modified by a spatial selective wavelength filter |
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JP (2) | JP2018514788A (en) |
KR (1) | KR102381155B1 (en) |
CN (2) | CN115060650A (en) |
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WO (1) | WO2016187139A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020517096A (en) * | 2017-04-05 | 2020-06-11 | ケーエルエー コーポレイション | Metering system and method with layer-specific illumination spectrum |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5793049A (en) * | 1995-07-06 | 1998-08-11 | Yale University | Optical filtering and spectroscopic imaging |
US20060192951A1 (en) * | 2000-05-04 | 2006-08-31 | Wayne Chen | System and methods for classifying anomalies of sample surfaces |
WO2007064830A1 (en) * | 2005-12-02 | 2007-06-07 | Massachusetts Institute Of Technology | Method and apparatus for two-dimensional spectroscopy |
US20080165343A1 (en) * | 2003-06-24 | 2008-07-10 | Kla-Tencor Technologies Corporation | Optical System For Detecting Anomalies And/Or Features Of Surfaces |
US7492451B2 (en) * | 2002-04-18 | 2009-02-17 | Kla-Tencor Technologies Corporation | Simultaneous multi-spot inspection and imaging |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4833833A (en) * | 1971-09-03 | 1973-05-14 | ||
US3907430A (en) * | 1973-08-13 | 1975-09-23 | Northrop Corp | Optical bandpass filter |
US5142132A (en) * | 1990-11-05 | 1992-08-25 | Litel Instruments | Adaptive optic wafer stepper illumination system |
TW567406B (en) * | 2001-12-12 | 2003-12-21 | Nikon Corp | Diffraction optical device, refraction optical device, illuminating optical device, exposure system and exposure method |
JP4508708B2 (en) * | 2004-04-12 | 2010-07-21 | キヤノン株式会社 | Exposure apparatus and exposure method using EUV light |
JP2010010607A (en) | 2008-06-30 | 2010-01-14 | Seiko Epson Corp | Laser light source device, projector, and monitor device |
DE102009043745A1 (en) * | 2009-09-30 | 2011-04-07 | Carl Zeiss Microlmaging Gmbh | Variable filtering spectral detector by spatial color separation and laser scanning microscope |
US9239263B2 (en) * | 2010-12-14 | 2016-01-19 | William Marsh Rice University | Image mapped spectropolarimetry |
US9097577B2 (en) * | 2011-06-29 | 2015-08-04 | KLA—Tencor Corporation | Adaptive optics for compensating aberrations in light-sustained plasma cells |
JP5609932B2 (en) * | 2012-08-07 | 2014-10-22 | 株式会社島津製作所 | Sample measurement method using photometer |
CN110474685A (en) * | 2013-12-02 | 2019-11-19 | 吴东辉 | A kind of method and system and device using lighting source transmission information |
-
2016
- 2016-05-16 CN CN202210656062.2A patent/CN115060650A/en active Pending
- 2016-05-16 JP JP2017560148A patent/JP2018514788A/en active Pending
- 2016-05-16 WO PCT/US2016/032743 patent/WO2016187139A1/en active Application Filing
- 2016-05-16 KR KR1020177036597A patent/KR102381155B1/en active IP Right Grant
- 2016-05-16 CN CN201680028562.4A patent/CN107636449A/en active Pending
- 2016-05-20 TW TW105115828A patent/TWI702387B/en active
-
2021
- 2021-12-02 JP JP2021196124A patent/JP7344952B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5793049A (en) * | 1995-07-06 | 1998-08-11 | Yale University | Optical filtering and spectroscopic imaging |
US20060192951A1 (en) * | 2000-05-04 | 2006-08-31 | Wayne Chen | System and methods for classifying anomalies of sample surfaces |
US7492451B2 (en) * | 2002-04-18 | 2009-02-17 | Kla-Tencor Technologies Corporation | Simultaneous multi-spot inspection and imaging |
US20080165343A1 (en) * | 2003-06-24 | 2008-07-10 | Kla-Tencor Technologies Corporation | Optical System For Detecting Anomalies And/Or Features Of Surfaces |
WO2007064830A1 (en) * | 2005-12-02 | 2007-06-07 | Massachusetts Institute Of Technology | Method and apparatus for two-dimensional spectroscopy |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020517096A (en) * | 2017-04-05 | 2020-06-11 | ケーエルエー コーポレイション | Metering system and method with layer-specific illumination spectrum |
JP7200127B2 (en) | 2017-04-05 | 2023-01-06 | ケーエルエー コーポレイション | Weighing system and method with layer-specific illumination spectrum |
US11852590B1 (en) | 2017-04-05 | 2023-12-26 | Kla Corporation | Systems and methods for metrology with layer-specific illumination spectra |
Also Published As
Publication number | Publication date |
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TW201706589A (en) | 2017-02-16 |
CN107636449A (en) | 2018-01-26 |
CN115060650A (en) | 2022-09-16 |
JP7344952B2 (en) | 2023-09-14 |
JP2022029462A (en) | 2022-02-17 |
KR20180000734A (en) | 2018-01-03 |
KR102381155B1 (en) | 2022-03-30 |
JP2018514788A (en) | 2018-06-07 |
TWI702387B (en) | 2020-08-21 |
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