WO2016180051A1 - 光波导的制备方法及装置 - Google Patents

光波导的制备方法及装置 Download PDF

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Publication number
WO2016180051A1
WO2016180051A1 PCT/CN2016/071398 CN2016071398W WO2016180051A1 WO 2016180051 A1 WO2016180051 A1 WO 2016180051A1 CN 2016071398 W CN2016071398 W CN 2016071398W WO 2016180051 A1 WO2016180051 A1 WO 2016180051A1
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Prior art keywords
optical waveguide
cladding layer
core layer
groove
etching
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PCT/CN2016/071398
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English (en)
French (fr)
Inventor
王廷云
庞拂飞
邓传鲁
贾娜娜
郭丽丽
赵丽
王玉
刘哲
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中兴通讯股份有限公司
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Publication of WO2016180051A1 publication Critical patent/WO2016180051A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching

Definitions

  • the present application relates to the field of optical communication technologies, for example, to a method and an apparatus for fabricating an optical waveguide.
  • optical communication technology With the development of optical communication technology, the demand for communication transmission bandwidth is constantly increasing, especially in the fields of broadband communication networks, supercomputers and big data storage centers.
  • the electrical interconnection technology based on printed circuit boards has gradually revealed a bottleneck in the transmission rate.
  • medium and short transmission distances for example, 0.3m to 1m
  • most of the electrical interconnection technologies It is only possible to achieve transmissions of up to 10 Gbps, and it is difficult to achieve higher-speed interconnect transmissions such as 25 Gbps and 40 Gbps.
  • the optical printed backplane technology based on optical waveguide theory is in the development stage. Its technical hotspots are the transmission characteristics of optical waveguides and the coupling and connection technology of optical waveguide-fiber.
  • the transmission characteristics of the optical waveguide play a decisive role in the performance of the system, and the factors affecting the transmission characteristics of the optical waveguide are: the inherent loss of the optical waveguide material, the regularity of the optical waveguide geometry, The purity of the optical waveguide material, the preparation process of the optical waveguide, etc., all of which affect the transmission loss of the optical waveguide, thereby affecting the stability of the system.
  • the preparation process of the optical waveguide is an important factor affecting the transmission characteristics of the optical waveguide.
  • the preparation method of the optical waveguide includes a hot stamping method, an ultraviolet photolithography method, a photobleaching method, a doctor blade method, etc., each of which has its own applicable range, characteristics and advantages, for example, a hot stamping method for selecting a selected one.
  • the stability of the fabricated materials is very high, and the hot stamping method is very difficult to apply to optical waveguides longer than 4 inches; the disadvantage of ultraviolet photolithography is that it is difficult to control the size of the optical waveguide core layer; photobleaching
  • the technology is relatively simple, but it is easily limited by the characteristics of the materials produced. In the above preparation method, it is either limited by the material to be produced, or the size of the optical waveguide to be prepared is required, and the preparation efficiency is low.
  • Embodiments of the present invention provide a method and an apparatus for fabricating an optical waveguide, which are intended to solve the limitation of material characteristics and size of an optical waveguide to be prepared in the prior preparation method, and the preparation efficiency is low. Technical problem.
  • an embodiment of the present invention provides a method for fabricating an optical waveguide, and the method for fabricating the optical waveguide includes the following steps:
  • the laser generates a laser beam for preparing the optical waveguide, and controls the laser beam to perform groove etching on the lower cladding layer;
  • An over cladding layer is prepared on the surface of the under cladding layer having the core layer paste and thermally cured to prepare an optical waveguide.
  • the preparation method may further include:
  • the etched grooves may be etched by annealing or by yttrium fluoride laser ablation.
  • the core layer glue is a photosensitive core layer glue
  • the preparation method may further include :
  • the under cladding layer after the core layer was dropped was exposed to ultraviolet light for exposure.
  • the thickness of the upper cladding layer and the lower cladding layer to be prepared may be obtained according to the core layer material of the optical waveguide to be prepared and the wavelength of the transmitted light, and by spin coating.
  • the upper or lower cladding layer is prepared.
  • an embodiment of the present invention further provides an apparatus for fabricating an optical waveguide, where the apparatus for fabricating the optical waveguide includes:
  • a first preparation module for preparing an under cladding layer on a substrate and thermally curing
  • a first control module configured to: after the laser generates a laser beam for preparing the optical waveguide, control the laser beam to perform groove etching on the lower cladding layer;
  • a second control module configured to acquire a drop parameter, and control the drip device to add a core glue to the groove according to the drop parameter, and thermally cure the core layer glue
  • a second preparation module for preparing an over cladding layer on the surface of the under cladding layer having a core layer and thermally curing to prepare an optical waveguide.
  • the apparatus for preparing an optical waveguide may further include: an erosion module for acquiring a parameter of the erosion, The etched groove is subjected to a scouring process according to the scouring parameter.
  • the scouring module can be used for etching the etched groove by annealing or cesium fluoride laser etching
  • the apparatus for preparing an optical waveguide further includes: an exposure module for exposing the under cladding layer after the core layer is dropped to ultraviolet light.
  • the first preparation module or the second preparation module may be configured to obtain the thicknesses of the upper cladding layer and the lower cladding layer to be prepared according to the core layer material of the optical waveguide to be prepared and the wavelength of the transmitted light, and by spin coating
  • the upper or lower cladding layer is prepared in a manner.
  • an optical waveguide can be prepared by etching a groove on a prepared under cladding layer by a CO 2 laser beam, which has no requirement on the characteristics of the material to be fabricated, and can be applied to any optical waveguide for preparation.
  • the material can also be applied to the preparation of large-size and small-sized core layers.
  • the preparation process is simple and feasible, the etching depth and width of the grooves are controllable, and the etching shape is regular, and the core layer size can be adjusted.
  • the number of grooves obtained can be arbitrarily selected, and the etching efficiency is high; under the microscope, the dropping device of the core layer glue can be accurately aligned with the groove, and can be controlled during the dropping process.
  • the speed of the dropping and the flow rate of the core layer glue combine the micromachining and the optical waveguide preparation process to achieve the purpose of maximally saving the core layer glue and avoiding the waste of the core layer glue.
  • FIG. 1 is a schematic flow chart of a method of fabricating an optical waveguide according to an embodiment of the present invention
  • FIG. 2 is a schematic view showing preparation of a lower cladding layer on a substrate in the preparation method shown in FIG. 1;
  • FIG. 3 is a schematic view showing a laser beam transformation in the preparation method shown in FIG. 1;
  • FIG. 4 is a schematic view of etching a groove on an under cladding layer in the preparation method shown in FIG. 1;
  • Figure 5 is a schematic view showing the core layer of glue added to the groove in the preparation method shown in Figure 1;
  • FIG. 6 is a schematic view showing the preparation of an over cladding layer on a surface of a lower cladding layer having a core layer in the preparation method shown in FIG. 1;
  • FIG. 7 is a schematic view showing a cross-sectional topography of a core layer of an optical waveguide prepared according to the preparation method shown in FIG. 1 and a cross-sectional shape of an optical waveguide core layer produced by other methods in the prior art;
  • FIG. 8 is a schematic structural view of an apparatus for fabricating an optical waveguide according to an embodiment of the present invention.
  • An embodiment of the present invention provides a method for fabricating an optical waveguide.
  • a method for fabricating the optical waveguide includes:
  • Step S101 preparing a lower cladding layer on the substrate and thermally curing
  • the optical waveguide is prepared in the optical waveguide manufacturing apparatus, and the lower cladding layer is prepared on the cleaned PCB (Printed Circuit Board) substrate.
  • the PCB substrate 1 may be an FR4 (Flame Retardant-4) printed circuit board substrate material or other material, and the lower cladding layer 2 is prepared on the PCB substrate 1.
  • an optical waveguide capable of transmitting light of 850 nm wavelength can be prepared.
  • the thickness of the under cladding layer 2 to be prepared can be determined.
  • the thickness of the lower cladding layer 2 is, for example, 100. Micron.
  • the lower cladding layer can be prepared by spin coating, and then the lower cladding layer is thermally cured.
  • Step S102 the laser generates a laser beam for preparing an optical waveguide, and controls the laser beam to perform groove etching on the lower cladding layer;
  • the laser can be a CO 2 laser that produces a CO 2 laser beam.
  • the etching parameters are input in the preparation device, wherein the etching parameters include an etching energy of the laser beam, an etching time, an etching advance speed, and a depth of the groove obtained by etching.
  • a laser beam corresponding to the etching parameter is generated, and then the size of the optical waveguide to be prepared is input, for example, the size of the optical waveguide to be prepared is 50 ⁇ m ⁇ 50 ⁇ m, according to the light to be prepared
  • the size of the waveguide transforms the laser beam through a transforming device to obtain a laser beam that is sized to match the size of the optical waveguide to be fabricated.
  • the CO 2 laser beam 3 can be incident on a good-performing zinc selenide (ZnSe) lens 4, and after passing through the ZnSe lens 4, a spot having a size matching the size of the optical waveguide core layer can be obtained, and then the light is irradiated. ⁇ 5, a spot 6 (i.e., a laser beam) having a size equal to that of the optical waveguide core layer is obtained, and thus, a laser beam required for preparing the optical waveguide is finally obtained.
  • ZnSe zinc selenide
  • the lower cladding layer 2 is directly etched by using the laser beam 6 obtained by the above-mentioned aperture 5 to obtain the groove 7, and the depth of the groove 7 obtained by etching is controlled to be 50 micrometers.
  • the groove can be etched on the prepared lower cladding layer by the CO 2 laser beam, the preparation process is simple and feasible, the etching depth and width of the groove are controllable, and the etching shape is regular, and the core layer can be achieved.
  • the number of grooves obtained by etching is arbitrarily selectable, and the etching efficiency is high.
  • Step S103 obtaining a dropping parameter, controlling the dropping device according to the dropping parameter to drop the core glue into the groove, and thermally curing the core layer glue;
  • the sample of the etched groove is placed under the microscope to precisely control the dropping device 8 and the optical waveguide groove 7.
  • the alignment ensures that the dropping device 8 is aligned with the groove 7.
  • the dropping parameter is obtained, and the dropping parameter includes the flow rate and the flow rate of the core layer glue, and the core layer glue is added to the groove 7 by the dropping device 8 according to the dropping parameter.
  • the dropping device may be a capillary tube or a three-dimensional printing device.
  • the working platform of the sample in which the etched groove is placed has a certain inclination angle with the horizontal plane, which facilitates the flow of the core layer glue dropped to the groove 7, relying on the core
  • the fluidity of the layer is filled over the entire groove 7.
  • the core layer rubber added by thermal curing is further subjected to obtain a core layer 9, wherein the thickness of the core layer 9 is determined by the core material of the optical waveguide to be prepared and the wavelength of light transmitted.
  • This step is operated under the microscope, and the dropping device of the core layer glue can be accurately aligned with the groove, and during the dropping process, the speed of the dropping and the flow rate of the core layer glue can be controlled, and the micro-mechanical
  • the processing and optical waveguide preparation processes are combined to achieve the goal of maximally saving the core layer glue and avoiding waste of the core layer glue.
  • Step S104 preparing an over cladding layer on the surface of the under cladding layer having the core layer glue and thermally curing to prepare an optical waveguide.
  • the upper cladding layer 10 is prepared on the surface of the under cladding layer having the core layer rubber, wherein the core layer material and the transmitted light are also according to the optical waveguide.
  • the thickness of the upper cladding layer 10 to be prepared can be determined, and the upper cladding layer 10 can also be prepared by spin coating.
  • the thickness of the upper cladding layer 10 is 50 micrometers, and then the upper cladding layer 10 is thermally cured. So far, the fabrication of the optical waveguide is completed.
  • the cross-sectional morphology of the optical waveguide core layer 9 prepared in this embodiment includes, but is not limited to, a cross section (a) as shown in FIG.
  • the cross section (a) the cross section of the core layer 9 in contact with the upper cladding layer 10 is a strictly right-angled topography, and the cross section of the core layer 9 in the lower cladding layer 2 is approximately an arc-shaped angular appearance; when the groove is etched
  • the cross section of the core layer 9 in the lower cladding layer 2 is approximately a semi-circular topography or a semi-elliptical topography; however, in the cross section (b) of the optical waveguide core layer fabricated according to other methods: the core layer 9 The cross section at the contact with the upper cladding layer 10 is an arc-shaped angular shape, and the cross section of the core layer 9 in the lower cladding layer 2 is a right-angled topography; in
  • the present embodiment can prepare an optical waveguide by etching a groove on the prepared lower cladding layer by a CO 2 laser beam, and has no requirement on the characteristics of the fabricated material, and can be applied to any optical waveguide for preparing.
  • the material can also be applied to the preparation of large-size and small-sized core layers.
  • the preparation process is simple and feasible, the etching depth and width of the grooves are controllable, and the etching shape is regular, and the core layer size can be adjusted.
  • the number of grooves obtained can be arbitrarily selected, and the etching efficiency is high; under the microscope, the dropping device of the core layer glue can be accurately aligned with the groove, and can be controlled during the dropping process.
  • the speed of the dropping and the flow rate of the core layer glue combine the micromachining and the optical waveguide preparation process to achieve the purpose of maximally saving the core layer glue and avoiding the waste of the core layer glue.
  • the method further includes: acquiring a scouring parameter, according to The scouring parameter etches the etched groove.
  • the erosion parameters are determined according to the type of erosion used.
  • the groove may be etched by annealing or by krypton fluoride KrF laser etching to reduce the roughness of the groove side.
  • the etching parameters are the annealing temperature and the etching time, and the annealing temperature and the etching time must be determined in advance to be etched;
  • the parameters of the erosion are laser energy and erosion time, and the laser energy and the erosion time must be determined in advance to be eroded.
  • the method comprises the following steps: exposing the under cladding layer after the core layer is added to the ultraviolet light.
  • the core layer glue is a photosensitive core layer glue
  • the optical waveguide sample of the prepared core layer is placed on an ultraviolet exposure machine for ultraviolet lamp exposure, and the ultraviolet light emitted by the ultraviolet lamp is directly irradiated on the optical waveguide sample.
  • the irradiated core layer is chemically reacted and then thermally cured.
  • the core layer adhesive having no photosensitive property can omit this exposure operation.
  • the embodiment of the present invention further provides a device for preparing an optical waveguide.
  • the device for preparing the optical waveguide includes: a first preparation module 101, a first control module 102, a second control module 103, and a second preparation. Module 104.
  • the first preparation module 101 is for preparing an under cladding layer on a substrate and thermally curing.
  • the optical waveguide is prepared in the optical waveguide manufacturing apparatus, and the lower cladding layer is prepared on the cleaned PCB substrate.
  • the PCB substrate 1 may be an FR4 printed circuit board substrate.
  • the under cladding layer 2 is prepared on the PCB substrate 1 by materials or other materials.
  • an optical waveguide capable of transmitting light of 850 nm wavelength can be prepared.
  • the thickness of the under cladding layer 2 to be prepared can be determined.
  • the thickness of the lower cladding layer 2 is, for example, 100. Micron.
  • the lower cladding layer can be prepared by spin coating, and then the lower cladding layer is thermally cured.
  • the first control module 102 is configured to control the laser beam to perform groove etching on the lower cladding layer after the laser generates a laser beam for preparing the optical waveguide.
  • the laser can be a CO 2 laser that produces a CO 2 laser beam.
  • the etching parameters are input in the preparation device, wherein the etching parameters include an etching energy of the laser beam, an etching time, an etching advance speed, and a depth of the groove obtained by etching.
  • a laser beam corresponding to the etching parameter is generated, and then the size of the optical waveguide to be prepared is input, for example, the size of the optical waveguide to be prepared is 50 ⁇ m ⁇ 50 ⁇ m, according to the light to be prepared
  • the size of the waveguide transforms the laser beam through a transforming device to obtain a laser beam that is sized to match the size of the optical waveguide to be fabricated.
  • the CO 2 laser beam 3 can be incident on a good-performing zinc selenide (ZnSe) lens 4, and after passing through the ZnSe lens 4, a spot having a size matching the size of the optical waveguide core layer can be obtained, and then the light is irradiated. ⁇ 5, a spot 6 (i.e., a laser beam) having a size equal to that of the optical waveguide core layer is obtained, and thus, a laser beam required for preparing the optical waveguide is finally obtained.
  • ZnSe zinc selenide
  • the lower cladding layer 2 is directly etched by using the laser beam 6 obtained by the above-mentioned aperture 5 to obtain the groove 7, and the depth of the groove 7 obtained by etching is controlled to be 50 micrometers.
  • the groove can be etched on the prepared lower cladding layer by the CO 2 laser beam, the preparation process is simple and feasible, the etching depth and width of the groove are controllable, and the etching shape is regular, and the core layer can be achieved.
  • the number of grooves obtained by etching is arbitrarily selectable, and the etching efficiency is high.
  • the second control module 103 is configured to acquire a drop parameter, and the drip device is controlled to drop the core glue into the groove according to the drop parameter, and thermally cure the core glue.
  • the sample of the etched groove is placed under the microscope to precisely control the dropping device 8 and the optical waveguide groove 7.
  • the alignment ensures that the dropping device 8 is aligned with the groove 7.
  • the dropping parameter is obtained, and the dropping parameter includes the flow rate and the flow rate of the core layer glue, and the core layer glue is added to the groove 7 by the dropping device 8 according to the dropping parameter.
  • the dropping device may be a capillary tube or a three-dimensional printing device.
  • the working platform of the sample in which the etched groove is placed has a certain inclination angle with the horizontal plane, which facilitates the flow of the core layer glue dropped to the groove 7, relying on the core
  • the fluidity of the layer is filled over the entire groove 7. After the dropping operation is completed, the hot curing is added dropwise.
  • the core layer is glued to obtain a core layer 9, wherein the thickness of the core layer 9 is determined by the core material of the optical waveguide to be prepared and the wavelength of light transmitted.
  • the dropping of the core layer glue is operated under the microscope, and the dropping device of the core layer glue can be accurately aligned with the groove, and during the dropping process, the speed of the dropping and the flow rate of the core layer glue can be controlled. Combine the micromachining and optical waveguide preparation processes to achieve the goal of maximizing the savings of the core layer and avoiding the waste of the core layer.
  • the second preparation module 104 is configured to prepare an upper cladding layer on the surface of the lower cladding layer having the core layer rubber and heat-curing to prepare an optical waveguide.
  • the upper cladding layer 10 is prepared on the surface of the under cladding layer having the core layer rubber, wherein the core layer material and the transmitted light are also according to the optical waveguide.
  • the thickness of the upper cladding layer 10 to be prepared can be determined, and the upper cladding layer 10 can also be prepared by spin coating.
  • the thickness of the upper cladding layer 10 is 50 micrometers, and then the upper cladding layer 10 is thermally cured. So far, the fabrication of the optical waveguide is completed.
  • the cross-sectional topography of the optical waveguide core layer 9 prepared in this embodiment is different from the cross-sectional shape of the optical waveguide core layer fabricated by using other preparation means, including but not limited to the cross section as shown in FIG.
  • the cross section (a) the cross section of the core layer 9 in contact with the upper cladding layer 10 is a strictly right-angled topography, and the cross section of the core layer 9 in the lower cladding layer 2 is approximately an arc-shaped angular appearance; when etched When the groove width is small, the cross section of the core layer 9 in the lower cladding layer 2 is approximately a semicircular topography or a semi-elliptical topography; however, in the cross section (b) of the optical waveguide core layer fabricated according to other methods: The cross section of the core layer 9 in contact with the upper cladding layer 10 is an arc-shaped angular shape, and the cross section of the core layer 9 in the lower cladding layer 2 is a right-angled topography; the cross section of the optical waveguide
  • the present embodiment can prepare an optical waveguide by etching a groove on the prepared lower cladding layer by a CO 2 laser beam, and has no requirement on the characteristics of the fabricated material, and can be applied to any optical waveguide for preparing.
  • the material can also be applied to the preparation of large-size and small-sized core layers.
  • the preparation process is simple and feasible, the etching depth and width of the grooves are controllable, and the etching shape is regular, and the core layer size can be adjusted.
  • the number of grooves obtained can be arbitrarily selected, and the etching efficiency is high; under the microscope, the dropping device of the core layer glue can be accurately aligned with the groove, and can be controlled during the dropping process.
  • the speed of the dropping and the flow rate of the core layer glue combine the micromachining and the optical waveguide preparation process to achieve the purpose of maximally saving the core layer glue and avoiding the waste of the core layer glue.
  • the optical waveguide manufacturing apparatus further includes: a scouring module, configured to acquire a scoping parameter, and the etched concave according to the eroding parameter The groove is subjected to a scouring process.
  • the erosion parameters are determined according to the type of erosion used.
  • the groove may be etched by annealing or by krypton fluoride KrF laser etching to reduce the roughness of the groove side.
  • the etching parameters are the annealing temperature and the etching time, and the annealing temperature and the etching time must be determined in advance to be etched;
  • the parameters of the erosion are laser energy and erosion time, and the laser energy and the erosion time must be determined in advance to be eroded.
  • the apparatus for fabricating an optical waveguide further includes: an exposure module for exposing the under cladding layer after the core layer is dropped to ultraviolet light.
  • the core layer glue is a photosensitive core layer glue
  • the optical waveguide sample of the prepared core layer is placed on an ultraviolet exposure machine for ultraviolet lamp exposure, and the ultraviolet light emitted by the ultraviolet lamp is directly irradiated on the sample, and is irradiated.
  • the core layer gel is chemically reacted and then thermally cured.
  • the core layer adhesive having no photosensitive property can omit this exposure operation.
  • the method and apparatus for fabricating an optical waveguide according to an embodiment of the present invention can prepare an optical waveguide by etching a groove on a prepared under cladding layer by a laser beam, which has no requirement on the characteristics of the material to be fabricated, and is applicable to any light for preparing light.
  • the material of the waveguide and the core layer of any size are simple and feasible, the etching depth and width of the groove are controllable, the etching shape is regular, the size of the core layer can be adjusted, and the etching efficiency is high, and
  • the micro-machining and optical waveguide preparation processes are combined in the process of dropping the core layer glue, thereby achieving the purpose of maximally saving the core layer glue and avoiding waste of the core layer glue.

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Abstract

一种光波导的制备方法及装置，所述光波导的制备方法包括：在基板（1）上制备下包层（2）并热固化；激光器产生用于制备光波导的激光束（3），控制所述激光束（3）对所述下包层（2）进行凹槽（7）刻蚀；获取滴加参数，根据所述滴加参数控制滴加装置（8）滴加芯层胶至所述凹槽（7）中，并热固化所述芯层胶；在所述下包层（2）的具有芯层胶的表面制备上包层（10）并热固化，以制备得到光波导。该技术方案不受所制备光波导材料的特性限制、所制备的光波导的尺寸大小也不受限制，且制备效率高。

Description

光波导的制备方法及装置 技术领域
本申请涉及光通信技术领域，例如涉及一种光波导的制备方法及装置。
背景技术
随着光通信技术的发展，人们对通信传输带宽的需求在不断提高，尤其在宽带通信网、超级计算机和大数据存储中心领域表现得尤为突出。但是在这些领域中，在高速数据传输方面，基于印刷电路板的电互连技术已经逐渐显现出在传输速率上的瓶颈，对于中短传输距离(例如0.3m～1m)，电互连技术大多只能实现最高10Gbps速率的传输，而难以实现25Gbps、40Gbps等更高速的互连传输。同时，基于光波导理论的光印刷背板技术处于发展阶段，其技术热点为光波导的传输特性及光波导-光纤的耦合连接技术。
在光印刷背板传输系统中，光波导的传输特性对系统性能的优劣起着决定作用，而影响光波导传输特性的因素主要有：光波导材料的固有损耗、光波导几何尺寸的规整、光波导材料的纯净度、光波导的制备工艺等，这些因素都会影响光波导的传输损耗，从而影响系统的稳定性。其中，光波导的制备工艺是影响光波导传输特性的一个重要因素。目前，光波导的制备方法包括热模压印法、紫外光刻法、光漂白法、刮刀法等，每一种制备方法都各有适用范围、特点及优势，例如，热模压印法对选取的制作材料的稳定性要求很高，且热模压印法应用于长度超过4英寸的光波导时具有很大的难度；紫外光刻法的缺点是控制光波导芯层的尺寸较难；光漂白法技术比较简单，但是很容易受到制作材料特性的限制等。上述的制备方法中，要么受到制作材料的限制，要么对所要制备的光波导的尺寸大小有要求，且制备效率低。
上述内容仅用于辅助理解本申请的技术方案，并不代表承认上述内容是现有技术。
发明内容
本发明实施例提供一种光波导的制备方法及装置，旨在解决现有的制备方法中受到所要制备的光波导的材料特性及尺寸大小的限制，且制备效率低 的技术问题。
为此，本发明实施例提供一种光波导的制备方法，所述光波导的制备方法包括以下步骤：
在基板上制备下包层并热固化；
激光器产生用于制备光波导的激光束，控制所述激光束对所述下包层进行凹槽刻蚀；
获取滴加参数，根据所述滴加参数控制滴加装置滴加芯层胶至所述凹槽中，并热固化所述芯层胶；
在所述下包层的具有芯层胶的表面制备上包层并热固化，以制备得到光波导。
在所述激光器产生用于制备光波导的激光束，控制所述激光束对预先旋涂在基板上的下包层进行凹槽刻蚀之后，所述制备方法还可以包括：
获取扫蚀参数，根据所述扫蚀参数对所刻蚀的凹槽进行扫蚀处理。
可以通过退火的方式或者氟化氪激光扫蚀的方式对所刻蚀的凹槽进行扫蚀处理。
所述芯层胶为光敏芯层胶，并且在所述获取滴加参数，根据所述滴加参数控制滴加装置滴加芯层胶至所述凹槽中之后，所述制备方法还可以包括：
将滴加芯层胶后的下包层置于紫外光下进行曝光。
在制备上包层或下包层时，可以根据所要制备的光波导的芯层材料及所传输的光波长获取所要制备的所述上包层及下包层的厚度，并通过旋涂的方式制备所述上包层或下包层。
此外，本发明实施例还提供一种光波导的制备装置，所述光波导的制备装置包括：
第一制备模块，用于在基板上制备下包层并热固化；
第一控制模块，用于当激光器产生用于制备光波导的激光束后，控制所述激光束对所述下包层进行凹槽刻蚀；
第二控制模块，用于获取滴加参数，根据所述滴加参数控制滴加装置滴加芯层胶至所述凹槽中，并热固化所述芯层胶；
第二制备模块，用于在所述下包层的具有芯层胶的表面制备上包层并热固化，以制备得到光波导。
所述光波导的制备装置还可以包括：扫蚀模块，用于获取扫蚀参数，根 据所述扫蚀参数对所刻蚀的凹槽进行扫蚀处理。
所述扫蚀模块可用于通过退火的方式或者氟化氪激光扫蚀的方式对所刻蚀的凹槽进行扫蚀处理
所述光波导的制备装置还包括：曝光模块，用于将滴加芯层胶后的下包层置于紫外光下进行曝光。
所述第一制备模块或第二制备模块可用于根据所要制备的光波导的芯层材料及所传输的光波长获取所要制备的所述上包层及下包层的厚度，并通过旋涂的方式制备所述上包层或下包层。
根据上述光波导的制备方法及装置，可通过CO2激光束在制备好的下包层上刻蚀凹槽来制备光波导，对制作材料的特性没有要求，可适用于任何用于制备光波导的材料，还可以适用于制备大尺寸及小尺寸的芯层，制备工艺简单可行，凹槽的刻蚀深度及宽度可控，刻蚀形状较规整，可以达到芯层尺寸规整的目的，刻蚀所得凹槽的数量任意可选，刻蚀的效率较高；在显微镜下操作，可以将滴加芯层胶的滴加装置与凹槽进行精确的对准，并且在滴加过程中，可以控制滴加的速度及芯层胶的流量，将微机械加工和光波导制备工艺结合起来，从而达到最大限度节省芯层胶的目的，避免造成芯层胶的浪费。
附图说明
图1为根据本发明实施例的光波导的制备方法的流程示意图；
图2为图1所示制备方法中在基板上制备下包层的示意图；
图3为图1所示制备方法中对激光束变换的示意图；
图4为图1所示制备方法中在下包层上刻蚀凹槽的示意图；
图5为图1所示制备方法中在凹槽上滴加芯层胶的示意图；
图6为图1所示制备方法中在下包层的具有芯层胶的表面制备上包层的示意图；
图7为根据图1中所示制备方法所制备得到的光波导的芯层的横截面形貌与现有技术中其他方法制作的光波导芯层的横截面形貌的示意图；
图8为根据本发明实施例的光波导的制备装置的结构示意图。
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。
本发明实施例提供一种光波导的制备方法，参照图1，在一实施例中，该光波导的制备方法包括：
步骤S101，在基板上制备下包层并热固化；
本实施例中，在光波导的制备装置中制备光波导，需在清洗洁净的PCB(Printed Circuit Board，印刷电路板)基板上制备下包层。如图2所示，PCB基板1可以为FR4(阻燃-4)印刷电路板衬底材料或者其他材料，在PCB基板1上制备下包层2。以制备可以传输850nm波长光的某种光波导为例，根据该光波导的芯层材料及所传输的光波长，可以确定所要制备的下包层2的厚度，下包层2厚度例如为100微米。
本实施例中可以采用旋涂的方式制备下包层，然后热固化下包层。
步骤S102，激光器产生用于制备光波导的激光束，控制所述激光束对所述下包层进行凹槽刻蚀；
本实施例中，激光器可以为CO2激光器，其产生CO2激光束。在制备装置中输入刻蚀参数，其中刻蚀参数包括激光束的刻蚀能量、刻蚀时间、刻蚀前进速度及刻蚀得到的凹槽的深度等。当输入刻蚀参数后，产生与该刻蚀参数对应的激光束，然后，输入所要制备的光波导的尺寸大小，例如所要制备的光波导的尺寸为50微米×50微米，根据所要制备的光波导的尺寸将激光束经变换装置变换后得到与所要制备的光波导的尺寸大小一致的激光束。
如图3所示，可将CO2激光束3入射到性能良好的硒化锌(ZnSe)透镜4，经ZnSe透镜4后获得尺寸与光波导芯层尺寸匹配的光斑，然后再将其经光阑5，获得尺寸与光波导芯层尺寸一致的光斑6(即激光束)，这样，最终得到用于制备光波导所需的激光束。
本实施例中，如图4所示，直接利用上述经光阑5后得到的激光束6对下包层2刻蚀得到凹槽7，刻蚀所得凹槽7的深度控制为50微米。
本实施例中，可通过CO2激光束在制备好的下包层上刻蚀凹槽，制备工艺简单可行，凹槽的刻蚀深度及宽度可控，刻蚀形状较规整，可以达到芯层尺寸规整的目的，刻蚀所得凹槽的数量任意可选，刻蚀的效率较高。
步骤S103，获取滴加参数，根据所述滴加参数控制滴加装置滴加芯层胶至所述凹槽中，并热固化所述芯层胶；
本实施例中，如图5所示，在滴加芯层胶至凹槽7之前，将已刻蚀凹槽的样品置于显微镜之下，以精确调控滴加装置8与光波导凹槽7的对准度，保证滴加装置8对准凹槽7。同时，获取滴加参数，滴加参数包括芯层胶的流量及流速，根据滴加参数控制滴加装置8滴加芯层胶至凹槽7中。
滴加装置可以是毛细针管或者三维打印设备。
另外，在滴加芯层胶至凹槽7中时，放置已刻蚀凹槽的样品的工作平台与水平面具有一定的倾斜角度，便于滴加至凹槽7的芯层胶的流动，依靠芯层胶的流动性注满整个凹槽7。待滴加操作完毕后，再进行热固化所滴加的芯层胶，得到芯层9，其中，芯层9的厚度由所要制备的光波导的芯层材料及所传输的光波长来确定。
本步骤在显微镜下操作，可以将滴加芯层胶的滴加装置与凹槽进行精确的对准，并且在滴加过程中，可以控制滴加的速度及芯层胶的流量，将微机械加工和光波导制备工艺结合起来，从而达到最大限度节省芯层胶的目的，避免造成芯层胶的浪费。
步骤S104，在所述下包层的具有芯层胶的表面制备上包层并热固化，以制备得到光波导。
本实施例中，当芯层胶固化后，如图6所示，在下包层的具有芯层胶的表面制备上包层10，其中，同样根据该光波导的芯层材料及所传输的光波长，可以确定所要制备的上包层10的厚度，还可以采用旋涂的方式制备上包层10，上包层10的厚度为50微米，然后热固化上包层10。至此，完成光波导的制作。
区别于其他方法制作的光波导芯层的横截面形貌，本实施例中所制备的光波导芯层9的横截面形貌包括但不限定于如图7所示的横截面(a)，在横截面(a)中：芯层9与上包层10接触处的截面为严格的直角形貌，芯层9在下包层2中的截面近似为弧状角形貌；当所刻蚀的凹槽宽带较小时，芯层9在下包层2中的截面近似为半圆形形貌或半椭圆形形貌；但是，在根据其他方法制作的光波导芯层的横截面(b)中：芯层9与上包层10接触处的截面为弧状角形貌，而芯层9在下包层2中的截面为直角形貌；在根据其他方法制作的光波导芯层的横截面(c)中：芯层9的横截面为梯形形貌。
与现有技术相比，本实施例可通过CO2激光束在制备好的下包层上刻蚀凹槽来制备光波导，对制作材料的特性没有要求，可适用于任何用于制备光波导的材料，还可以适用于制备大尺寸及小尺寸的芯层，制备工艺简单可行，凹槽的刻蚀深度及宽度可控，刻蚀形状较规整，可以达到芯层尺寸规整的目的，刻蚀所得凹槽的数量任意可选，刻蚀的效率较高；在显微镜下操作，可以将滴加芯层胶的滴加装置与凹槽进行精确的对准，并且在滴加过程中，可以控制滴加的速度及芯层胶的流量，将微机械加工和光波导制备工艺结合起来，从而达到最大限度节省芯层胶的目的，避免造成芯层胶的浪费。
在一些实施例中，在上述图1的实施例的基础上，在上述控制激光束对预先旋涂在基板上的下包层进行凹槽刻蚀的步骤之后还包括：获取扫蚀参数，根据所述扫蚀参数对所刻蚀的凹槽进行扫蚀处理。
本实施例中，扫蚀参数根据所使用的扫蚀方式来确定。对于加工完成的凹槽，可通过退火的方式或者氟化氪KrF激光扫蚀的方式对凹槽进行扫蚀处理，从而降低凹槽侧面的粗糙度。
其中，在采用退火的方式扫蚀凹槽时，扫蚀参数为退火温度和扫蚀时间，须预先确定退火温度和扫蚀时间再扫蚀；在采用氟化氪KrF激光器扫蚀凹槽时，扫蚀参数为激光能量和扫蚀时间，也须预先确定激光能量和扫蚀时间再扫蚀。
在一些实施例中，在上述图1的实施例的基础上，在上述的获取滴加参数，根据所述滴加参数控制滴加装置滴加芯层胶至所述凹槽中的步骤之后还包括：将滴加芯层胶后的下包层置于紫外光下进行曝光。
本实施例中，当芯层胶为光敏芯层胶时，须将已制备芯层的光波导样品放在紫外曝光机上进行紫外灯曝光，紫外灯发出的紫外光直接照射在光波导样品上，被照射的芯层胶发生化学反应，然后再进行热固化处理。另外，没有光敏性质的芯层胶可以省略此曝光操作。
本发明实施例还提供一种光波导的制备装置，如图8所示，所述光波导的制备装置包括：第一制备模块101，第一控制模块102，第二控制模块103和第二制备模块104。
第一制备模块101用于在基板上制备下包层并热固化。
本实施例中，在光波导的制备装置中制备光波导，需在清洗洁净的PCB基板上制备下包层。如图2所示，PCB基板1可以为FR4印刷电路板衬底材 料或者其他材料，在PCB基板1上制备下包层2。以制备可以传输850nm波长光的某种光波导为例，根据该光波导的芯层材料及所传输的光波长，可以确定所要制备的下包层2的厚度，下包层2厚度例如为100微米。
本实施例中可以采用旋涂的方式制备下包层，然后热固化下包层。
第一控制模块102，用于当激光器产生用于制备光波导的激光束后，控制所述激光束对所述下包层进行凹槽刻蚀。
本实施例中，激光器可以为CO2激光器，其产生CO2激光束。在制备装置中输入刻蚀参数，其中刻蚀参数包括激光束的刻蚀能量、刻蚀时间、刻蚀前进速度及刻蚀得到的凹槽的深度等。当输入刻蚀参数后，产生与该刻蚀参数对应的激光束，然后，输入所要制备的光波导的尺寸大小，例如所要制备的光波导的尺寸为50微米×50微米，根据所要制备的光波导的尺寸将激光束经变换装置变换后得到与所要制备的光波导的尺寸大小一致的激光束。
如图3所示，可将CO2激光束3入射到性能良好的硒化锌(ZnSe)透镜4，经ZnSe透镜4后获得尺寸与光波导芯层尺寸匹配的光斑，然后再将其经光阑5，获得尺寸与光波导芯层尺寸一致的光斑6(即激光束)，这样，最终得到用于制备光波导所需的激光束。
本实施例中，如图4所示，直接利用上述经光阑5后得到的激光束6对下包层2刻蚀得到凹槽7，刻蚀所得凹槽7的深度控制为50微米。
本实施例中，可通过CO2激光束在制备好的下包层上刻蚀凹槽，制备工艺简单可行，凹槽的刻蚀深度及宽度可控，刻蚀形状较规整，可以达到芯层尺寸规整的目的，刻蚀所得凹槽的数量任意可选，刻蚀的效率较高。
第二控制模块103，用于获取滴加参数，根据所述滴加参数控制滴加装置滴加芯层胶至所述凹槽中，并热固化所述芯层胶。
本实施例中，如图5所示，在滴加芯层胶至凹槽7之前，将已刻蚀凹槽的样品置于显微镜之下，以精确调控滴加装置8与光波导凹槽7的对准度，保证滴加装置8对准凹槽7。同时，获取滴加参数，滴加参数包括芯层胶的流量及流速，根据滴加参数控制滴加装置8滴加芯层胶至凹槽7中。
滴加装置可以是毛细针管或者三维打印设备。
另外，在滴加芯层胶至凹槽7中时，放置已刻蚀凹槽的样品的工作平台与水平面具有一定的倾斜角度，便于滴加至凹槽7的芯层胶的流动，依靠芯层胶的流动性注满整个凹槽7。待滴加操作完毕后，再进行热固化所滴加的 芯层胶，得到芯层9，其中，芯层9的厚度由所要制备的光波导的芯层材料及所传输的光波长来确定。
滴加芯层胶在显微镜下操作，可以将滴加芯层胶的滴加装置与凹槽进行精确的对准，并且在滴加过程中，可以控制滴加的速度及芯层胶的流量，将微机械加工和光波导制备工艺结合起来，从而达到最大限度节省芯层胶的目的，避免造成芯层胶的浪费。
第二制备模块104，用于在所述下包层的具有芯层胶的表面制备上包层并热固化，以制备得到光波导。
本实施例中，当芯层胶固化后，如图6所示，在下包层的具有芯层胶的表面制备上包层10，其中，同样根据该光波导的芯层材料及所传输的光波长，可以确定所要制备的上包层10的厚度，还可以采用旋涂的方式制备上包层10，上包层10的厚度为50微米，然后热固化上包层10。至此，完成光波导的制作。
区别于利用其他制备装置制作的光波导芯层的横截面形貌，本实施例中所制备的光波导芯层9的横截面形貌包括但不限定于如图7所示的横截面(a)，在横截面(a)中：芯层9与上包层10接触处的截面为严格的直角形貌，芯层9在下包层2中的截面近似为弧状角形貌；当所刻蚀的凹槽宽带较小时，芯层9在下包层2中的截面近似为半圆形形貌或半椭圆形形貌；但是，在根据其他方法制作的光波导芯层的横截面(b)中：芯层9与上包层10接触处的截面为弧状角形貌，而芯层9在下包层2中的截面为直角形貌；在根据其他方法制作的光波导芯层的横截面(c)中：芯层9的横截面为梯形形貌。
与现有技术相比，本实施例可通过CO2激光束在制备好的下包层上刻蚀凹槽来制备光波导，对制作材料的特性没有要求，可适用于任何用于制备光波导的材料，还可以适用于制备大尺寸及小尺寸的芯层，制备工艺简单可行，凹槽的刻蚀深度及宽度可控，刻蚀形状较规整，可以达到芯层尺寸规整的目的，刻蚀所得凹槽的数量任意可选，刻蚀的效率较高；在显微镜下操作，可以将滴加芯层胶的滴加装置与凹槽进行精确的对准，并且在滴加过程中，可以控制滴加的速度及芯层胶的流量，将微机械加工和光波导制备工艺结合起来，从而达到最大限度节省芯层胶的目的，避免造成芯层胶的浪费。
在一些实施例中，在上述图8的实施例的基础上，所述光波导的制备装置还包括：扫蚀模块，用于获取扫蚀参数，根据所述扫蚀参数对所刻蚀的凹 槽进行扫蚀处理。
本实施例中，扫蚀参数根据所使用的扫蚀方式来确定。对于加工完成的凹槽，可通过退火的方式或者氟化氪KrF激光扫蚀的方式对凹槽进行扫蚀处理，从而降低凹槽侧面的粗糙度。
其中，在采用退火的方式扫蚀凹槽时，扫蚀参数为退火温度和扫蚀时间，须预先确定退火温度和扫蚀时间再扫蚀；在采用氟化氪KrF激光器扫蚀凹槽时，扫蚀参数为激光能量和扫蚀时间，也须预先确定激光能量和扫蚀时间再扫蚀。
在一些实施例中，在上述图8的实施例的基础上，光波导的制备装置还包括：曝光模块，用于将滴加芯层胶后的下包层置于紫外光下进行曝光。
本实施例中，当芯层胶为光敏芯层胶时，须将已制备芯层的光波导样品放在紫外曝光机上进行紫外灯曝光，紫外灯发出的紫外光直接照射在样品上，被照射的芯层胶发生化学反应，然后再进行热固化处理。另外，没有光敏性质的芯层胶可以省略此曝光操作。
以上仅为本发明的一些实施例，并非因此限制本申请的保护范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的保护范围内。
工业实用性
根据本发明实施例的光波导的制备方法及装置可通过激光束在制备好的下包层上刻蚀凹槽来制备光波导，对制作材料的特性没有要求，可适用于任何用于制备光波导的材料以及任何尺寸的芯层，制备工艺简单可行，凹槽的刻蚀深度及宽度可控，刻蚀形状较规整，可以达到芯层尺寸规整的目的，而且刻蚀的效率较高，并且滴加芯层胶的过程中将微机械加工和光波导制备工艺结合起来，从而能够达到最大限度节省芯层胶的目的，避免造成芯层胶的浪费。

Claims (10)

  1. 一种光波导的制备方法，包括：
    在基板上制备下包层并热固化；
    激光器产生用于制备光波导的激光束，控制所述激光束对所述下包层进行凹槽刻蚀；
    获取滴加参数，根据所述滴加参数控制滴加装置滴加芯层胶至所述凹槽中，并热固化所述芯层胶；
    在所述下包层的具有芯层胶的表面制备上包层并热固化，以制备得到光波导。
  2. 如权利要求1所述的光波导的制备方法，其中，在所述激光器产生用于制备光波导的激光束，控制所述激光束对预先旋涂在基板上的下包层进行凹槽刻蚀之后，所述制备方法还包括：
    获取扫蚀参数，根据所述扫蚀参数对所刻蚀的凹槽进行扫蚀处理。
  3. 如权利要求2所述的光波导的制备方法，其中，通过退火的方式或者氟化氪激光扫蚀的方式对所刻蚀的凹槽进行扫蚀处理。
  4. 如权利要求1所述的光波导的制备方法，其中，所述芯层胶为光敏芯层胶，并且在所述获取滴加参数，根据所述滴加参数控制滴加装置滴加芯层胶至所述凹槽中之后，所述制备方法还包括：
    将滴加芯层胶后的下包层置于紫外光下进行曝光。
  5. 如权利要求1所述的光波导的制备方法，其中，在制备上包层或下包层时，根据所要制备的光波导的芯层材料及所传输的光波长获取所要制备的所述上包层及下包层的厚度，并通过旋涂的方式制备所述上包层或下包层。
  6. 一种光波导的制备装置，包括：
    第一制备模块，设置为在基板上制备下包层并热固化；
    第一控制模块，设置为当激光器产生用于制备光波导的激光束后，控制 所述激光束对所述下包层进行凹槽刻蚀；
    第二控制模块，设置为获取滴加参数，根据所述滴加参数控制滴加装置滴加芯层胶至所述凹槽中，并热固化所述芯层胶；
    第二制备模块，设置为在所述下包层的具有芯层胶的表面制备上包层并热固化，以制备得到光波导。
  7. 如权利要求6所述的光波导的制备装置，其中，所述光波导的制备装置还包括：扫蚀模块，设置为获取扫蚀参数，根据所述扫蚀参数对所刻蚀的凹槽进行扫蚀处理。
  8. 如权利要求7所述的光波导的制备装置，其中，所述扫蚀模块设置为通过退火的方式或者氟化氪激光扫蚀的方式对所刻蚀的凹槽进行扫蚀处理
  9. 如权利要求6所述的光波导的制备装置，其中，所述光波导的制备装置还包括：曝光模块，设置为将滴加芯层胶后的下包层置于紫外光下进行曝光。
  10. 如权利要求6所述的光波导的制备装置，其中，所述第一制备模块或第二制备模块设置为根据所要制备的光波导的芯层材料及所传输的光波长获取所要制备的所述上包层及下包层的厚度，并通过旋涂的方式制备所述上包层或下包层。
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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108490538B (zh) * 2018-03-21 2021-02-05 河南工业大学 一种利用芯壳玻璃浇注和飞秒激光直写技术制备磁光平面波导的方法
CN108415124A (zh) * 2018-05-08 2018-08-17 上海美维科技有限公司 一种高密度光波导结构及印制电路板及其制备方法
CN110716261B (zh) * 2019-09-18 2022-03-18 东南大学 多层柔性波导写入装置及多包层聚合物波导的制备方法
CN111123616A (zh) * 2019-11-19 2020-05-08 中山大学 一种基于硫化物-氮化硅混合波导及其制备方法
CN111168237B (zh) * 2020-01-16 2021-07-27 吉林大学 一种制备任意截面聚合物波导的方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1142743A (zh) * 1995-08-07 1997-02-12 三菱电机株式会社 电路底板激光加工法及其加工装置和二氧化碳激光振荡器
JP2002365460A (ja) * 2001-04-03 2002-12-18 Fujikura Ltd 光導波路部品の製造方法
CN101122655A (zh) * 2007-09-25 2008-02-13 晶方半导体科技（苏州）有限公司 光波导及其制造方法
CN101334504A (zh) * 2007-06-27 2008-12-31 中国科学院半导体研究所 紫外光直写制作掺铒杂化SiO2光波导放大器的方法
CN102565942A (zh) * 2012-01-09 2012-07-11 吉林大学 紫外纳米压印技术制备有机聚合物光波导放大器的方法
CN103135170A (zh) * 2013-03-18 2013-06-05 江苏荣邦微电子有限公司 一种光波导及其加工方法
CN203117454U (zh) * 2013-03-18 2013-08-07 江苏荣邦微电子有限公司 光波导
CN204740369U (zh) * 2015-07-03 2015-11-04 苏州峰通光电有限公司 一种有机无机混合集成热光调制型光栅

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4067504B2 (ja) * 2004-03-17 2008-03-26 三洋電機株式会社 光導波路及びその製造方法
JP2014052525A (ja) * 2012-09-07 2014-03-20 Nitto Denko Corp ポリマー光導波路の製造方法
CN103592721B (zh) * 2013-11-11 2016-08-17 华南师范大学 一种全聚合物平面光路的制作方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1142743A (zh) * 1995-08-07 1997-02-12 三菱电机株式会社 电路底板激光加工法及其加工装置和二氧化碳激光振荡器
JP2002365460A (ja) * 2001-04-03 2002-12-18 Fujikura Ltd 光導波路部品の製造方法
CN101334504A (zh) * 2007-06-27 2008-12-31 中国科学院半导体研究所 紫外光直写制作掺铒杂化SiO2光波导放大器的方法
CN101122655A (zh) * 2007-09-25 2008-02-13 晶方半导体科技（苏州）有限公司 光波导及其制造方法
CN102565942A (zh) * 2012-01-09 2012-07-11 吉林大学 紫外纳米压印技术制备有机聚合物光波导放大器的方法
CN103135170A (zh) * 2013-03-18 2013-06-05 江苏荣邦微电子有限公司 一种光波导及其加工方法
CN203117454U (zh) * 2013-03-18 2013-08-07 江苏荣邦微电子有限公司 光波导
CN204740369U (zh) * 2015-07-03 2015-11-04 苏州峰通光电有限公司 一种有机无机混合集成热光调制型光栅

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