WO2016177209A1 - 电流检测电路及电流检测方法 - Google Patents

电流检测电路及电流检测方法 Download PDF

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Publication number
WO2016177209A1
WO2016177209A1 PCT/CN2016/077745 CN2016077745W WO2016177209A1 WO 2016177209 A1 WO2016177209 A1 WO 2016177209A1 CN 2016077745 W CN2016077745 W CN 2016077745W WO 2016177209 A1 WO2016177209 A1 WO 2016177209A1
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current
circuit
pcb
temperature
pcb copper
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PCT/CN2016/077745
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English (en)
French (fr)
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张金涛
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中兴通讯股份有限公司
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Publication of WO2016177209A1 publication Critical patent/WO2016177209A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof

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  • the present invention relates to the field of power supplies, and in particular to a current detecting circuit and a current detecting method.
  • FIG. 1 is a schematic structural diagram of a current detecting circuit according to the related art.
  • the conventional technique for detecting current is to connect a shunt resistor in series in the current path of the power source to obtain a voltage drop across the shunt resistor.
  • the signal is sent to the ADC port of the digital chip after being amplified by a suitable multiple of the op amp, and processed by a software algorithm in the digital chip to output a current value.
  • Commonly used shunt resistors have industry-standard package sizes and corresponding rated powers. Different resistance values and packages can be selected according to the flow-through size.
  • the current application of the 1206 package low-resistance alloy chip resistors is used as an example to illustrate the power supply.
  • the current of the power supply system is 50 amps (A)
  • the resistance of the 1206 package low-resistance alloy chip resistor is 0.001 ohm ( ⁇ ) (the resistance is the minimum resistance value of the 1206 package), then this 1206 package alloy sticker
  • the chip resistor has a power loss of 2.5W, far exceeding its rated power of 0.5W.
  • the inventors found that due to the large size of the shunt resistor of the 1206 package, multiple parallel connections will undoubtedly occupy more printed circuit board (PCB) area, which is not conducive to the power density of the power supply system;
  • PCB printed circuit board
  • the shunt resistor has a certain resistance value, which inevitably has power loss, which is not conducive to the efficiency improvement of the power supply.
  • Embodiments of the present invention provide a current detecting circuit and a current detecting method to solve at least a problem of large power supply power loss caused by detecting a current through a parallel shunt resistor.
  • a current detecting circuit including: a PCB copper trace, a signal amplifying circuit, and a digital processing circuit, wherein the PCB copper trace is a layer of a power supply internal to a power port Or a plurality of parallel PCB copper strips, wherein a first impedance exists between the two ends of the PCB copper trace; the two input ends of the signal amplifying circuit are respectively connected to the two ends of the PCB copper trace.
  • a signal for detecting a voltage drop of the PCB copper trace and amplifying the voltage drop signal the digital processing circuit being connected to the signal amplifying circuit and configured to be based on the voltage drop signal No. Calculates the current sample value flowing through the PCB copper trace.
  • the method further includes: a temperature sensing circuit, wherein the temperature sensing circuit is configured to detect a temperature of the PCB copper trace.
  • the digital processing circuit further includes: a temperature coefficient calculation unit configured to, according to the specific condition, obtain the temperature of the PCB copper trace detected by the temperature sensing circuit at multiple times And calculating a temperature coefficient of the current flowing through the PCB copper trace at the temperature, and calculating a temperature coefficient that characterizes the current as a function of temperature; and a correction unit configured to correct the current sampling value according to the temperature coefficient to obtain a current measurement value.
  • a temperature coefficient calculation unit configured to, according to the specific condition, obtain the temperature of the PCB copper trace detected by the temperature sensing circuit at multiple times And calculating a temperature coefficient of the current flowing through the PCB copper trace at the temperature, and calculating a temperature coefficient that characterizes the current as a function of temperature
  • a correction unit configured to correct the current sampling value according to the temperature coefficient to obtain a current measurement value.
  • the signal current detecting circuit includes: an operational amplifier U1, a RC circuit, a first capacitor C1, a first resistor R5, and a second resistor R6, wherein one end of the first resistor R5 and the PCB One end of the copper wire is connected, and the other end is connected to the non-inverting input terminal of the operational amplifier U1; one end of the second resistor R6 is connected to the other end of the PCB copper trace, and the other end is connected to the operation a negative phase input terminal of the amplifier U1 is connected; one end of the first capacitor C1 is connected to the negative phase input terminal of the operational amplifier U1, and the other end is connected to the non-inverting input terminal of the operational amplifier U1; the operational amplifier U1 a negative input terminal is further connected to one end of the RC circuit, and the other end of the RC circuit is connected to an output end of the operational amplifier U1; an output end of the operational amplifier U1 and the digital processing circuit connection.
  • the RC circuit includes: a third resistor R7 and a second capacitor C2 connected in parallel.
  • the temperature sensing circuit includes: a temperature sensor U2, a fourth resistor R8, and a third capacitor C3, wherein one end of the fourth resistor R8 is connected to an output end of the temperature sensor U2, and the other end is The digital processing circuit is connected; one end of the third capacitor C3 is connected to the output end of the temperature sensor U2, and the other end is grounded.
  • a current detecting method including: detecting a voltage drop signal of a PCB copper trace, and amplifying the voltage drop signal, wherein the PCB copper trace is a power source
  • the PCB copper trace is a power source
  • the method before calculating a current sampling value flowing through the PCB copper trace according to the voltage drop signal, the method further includes: detecting a temperature of the PCB copper trace.
  • calculating a current sampling value flowing through the PCB copper trace according to the voltage drop signal further includes: under certain conditions, acquiring the PCB detected at the plurality of times according to the acquiring the temperature sensing circuit Calculating a temperature coefficient indicating a current change with temperature according to the temperature of the copper trace and the current value flowing through the PCB copper trace at the temperature; correcting the current sampling value according to the temperature coefficient to obtain a current Measurements.
  • a computer storage medium is further provided, and the computer storage medium may store an execution instruction for executing the current detection method in the above embodiment.
  • the signal amplification circuit is used to detect the voltage drop signal of the PCB copper trace and amplify the voltage drop signal; the digital processing circuit calculates the current sampling value flowing through the PCB copper trace according to the voltage drop signal, and solves the problem.
  • the problem of large power supply loss caused by current detection by means of parallel shunt resistors reduces power supply power loss.
  • FIG. 1 is a schematic structural view of a current detecting circuit according to the related art
  • FIG. 2 is a flow chart of a current detecting method according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a current detecting circuit according to an embodiment of the present invention.
  • FIG. 4 is a flow chart of a current detecting method in accordance with a preferred embodiment of the present invention.
  • FIG. 5 is a schematic diagram 1 of an alternative structure of a current detecting circuit in accordance with a preferred embodiment of the present invention.
  • FIG. 6 is a second schematic diagram of an alternative structure of a current detecting circuit in accordance with a preferred embodiment of the present invention.
  • FIG. 7 is a third schematic diagram of an optional structure of a current detecting circuit in accordance with a preferred embodiment of the present invention.
  • FIG. 8 is a fourth schematic diagram of an alternative configuration of a current sensing circuit in accordance with a preferred embodiment of the present invention.
  • FIG. 2 is a flowchart of a current detecting method according to an embodiment of the present invention. As shown in FIG. 2, the flow includes the following steps:
  • Step S202 detecting a voltage drop signal of the PCB copper trace and amplifying the voltage drop signal, wherein the PCB copper trace is one or more layers of PCB copper and PCB copper traces connected from the internal to the power port of the power supply. There is a first impedance between the two ends;
  • Step S204 calculating a current sampling value flowing through the copper wire of the PCB according to the voltage drop signal.
  • the voltage drop signal of the PCB copper trace is measured, and then the current sampling value flowing through the PCB copper trace is calculated according to the voltage drop signal of the PCB copper trace, and the method of detecting by the parallel shunt resistor is solved.
  • the problem of large power supply loss caused by current reduces power supply power loss.
  • the power density is improved.
  • the temperature of the PCB copper trace is detected before the current sample value flowing through the PCB copper trace is calculated according to the voltage drop signal.
  • the temperature sensing circuit may be detected at multiple times according to the acquiring temperature under certain conditions.
  • the temperature of the PCB copper trace and the current value flowing through the PCB copper trace calculate the temperature coefficient that characterizes the current as a function of temperature; according to the temperature coefficient, correct the current sample value to obtain the current measurement value.
  • the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course, by hardware, but in many cases, the former is A better implementation.
  • the technical solution of the present invention which is essential or contributes to the prior art, may be embodied in the form of a software product stored in a storage medium (such as ROM/RAM, disk,
  • the optical disc includes a number of instructions for causing a terminal device (which may be a cell phone, a computer, a server, or a network device, etc.) to perform the methods described in various embodiments of the present invention.
  • a current detecting circuit is also provided, which is used to implement the above-mentioned embodiments and preferred embodiments, and has not been described again.
  • the term “module” may implement a combination of software and/or hardware of a predetermined function.
  • the apparatus described in the following embodiments is preferably implemented in software, hardware, or a combination of software and hardware, is also possible and contemplated.
  • the current detecting circuit includes: a PCB copper trace, a signal amplifying circuit, and a digital processing circuit, wherein the PCB copper trace is One or more layers of PCB copper in parallel between the power supply and the power port, and a first impedance between the two ends of the PCB copper trace;
  • the two input ends of the signal amplifying circuit are respectively connected with the two ends of the PCB copper trace, and are set to detect the voltage drop signal of the PCB copper trace and amplify the voltage drop signal;
  • the digital processing circuit is coupled to the signal amplifying circuit and configured to calculate a current sample value flowing through the copper trace of the PCB according to the voltage drop signal.
  • the current detecting circuit further includes: a temperature sensing circuit, wherein the temperature sensing circuit is configured to detect a temperature of the PCB copper trace.
  • the digital processing circuit further includes: a temperature coefficient calculation unit configured to, under certain conditions, flow through the PCB copper skin according to the temperature and temperature of the PCB copper trace detected by the temperature sensing circuit at a plurality of times.
  • the current value of the line is calculated to characterize the temperature coefficient of the current as a function of temperature;
  • the correction unit is coupled to the temperature coefficient calculation unit and configured to correct the current sample value according to the temperature coefficient to obtain a current measurement value.
  • the signal current detecting circuit includes: an operational amplifier U1, a RC circuit, a first capacitor C1, a first resistor R5, and a second resistor R6, wherein
  • One end of the first resistor R5 is connected to one end of the PCB copper trace, and the other end is connected to the non-inverting input terminal of the operational amplifier U1;
  • One end of the second resistor R6 is connected to the other end of the PCB copper trace, and the other end is connected to the negative input terminal of the operational amplifier U1;
  • One end of the first capacitor C1 is connected to the negative phase input terminal of the operational amplifier U1, and the other end is connected to the non-inverting input terminal of the operational amplifier U1;
  • the negative input terminal of the operational amplifier U1 is also connected to one end of the RC circuit, and the other end of the RC circuit is connected to the output end of the operational amplifier U1;
  • the output of operational amplifier U1 is coupled to a digital processing circuit.
  • the RC circuit includes: a third resistor R7 and a second capacitor C2 connected in parallel.
  • the temperature sensing circuit includes: a temperature sensor U2, a fourth resistor R8, and a third capacitor C3, wherein
  • One end of the fourth resistor R8 is connected to the output end of the temperature sensor U2, and the other end is connected to the digital processing circuit;
  • One end of the third capacitor C3 is connected to the output end of the temperature sensor U2, and the other end is grounded.
  • Embodiments of the present invention also provide a software for performing the technical solutions described in the above embodiments and preferred embodiments.
  • Embodiments of the present invention also provide a storage medium.
  • the above storage medium may be configured to store program code for performing the following steps:
  • Step S202 detecting a voltage drop signal of the PCB copper trace and amplifying the voltage drop signal, wherein the PCB copper trace is one or more layers of PCB copper and PCB copper traces connected from the internal to the power port of the power supply. There is a first impedance between the two ends;
  • Step S204 calculating a current sampling value flowing through the copper wire of the PCB according to the voltage drop signal.
  • the foregoing storage medium may include, but is not limited to, a USB flash drive, a Read-Only Memory (ROM), and a Random Access Memory (RAM).
  • ROM Read-Only Memory
  • RAM Random Access Memory
  • a preferred embodiment of the present invention provides a circuit for detecting current based on a copper chip of a digital chip, comprising:
  • a piece of PCB copper wire is routed, and a piece of PCB copper wire is one or more layers of PCB copper which are connected in parallel from the power supply to the power port.
  • the current density of the copper wire is appropriately set according to the flow size, and a piece of PCB copper is provided.
  • a signal amplifying circuit for amplifying a voltage drop signal generated at both ends of a copper strip of the PCB, and outputting a voltage drop amplification signal
  • a temperature sensing circuit for measuring the temperature of a piece of PCB copper trace and outputting a copper skin temperature signal
  • the digital processing circuit is configured to receive a copper skin temperature signal and a voltage drop amplification signal, and output a current value flowing through a piece of PCB copper.
  • the signal amplifying circuit comprises: an operational amplifier U1, a resistive capacitor circuit, a capacitor C1, a resistor R5, and a resistor R6.
  • One end of the resistor R5 is connected to one end of a PCB copper trace, and the other end is connected to the positive input terminal of the operational amplifier U1;
  • resistor R6 One end of the resistor R6 is connected to the other end of the PCB copper trace, and the other end is connected to the negative input terminal of the operational amplifier U1;
  • One end of the capacitor C1 is connected to the negative phase input terminal of the operational amplifier U1, and the other end is connected to the positive phase input terminal of the operational amplifier U1;
  • the negative input terminal of the operational amplifier U1 is also connected to one end of the RC circuit, and the other end of the RC circuit is connected to the output end of the operational amplifier U1;
  • the output of the operational amplifier U1 is connected to the ADC2 port of the digital chip U3;
  • the RC circuit includes a resistor R7 and a capacitor C2 connected in parallel.
  • the temperature sensing circuit comprises: a temperature sensor U2, a resistor R8, and a capacitor C3. One end of the resistor R8 is connected to the output end of the temperature sensor U2, and the other end is connected to the port of the ADC1 of the digital chip U3;
  • One end of the capacitor C3 is connected to the output end of the temperature sensor U2, and the other end is grounded.
  • the digital processing circuit comprises: a digital chip U3, the digital chip U3 has not less than two ADC converters therein; the digital chip U3 performs numerical operation and compensation algorithm processing on the copper skin temperature signal and the voltage drop amplified signal, and the output flows through The current value of a piece of PCB copper.
  • the shunt resistor In view of the large size of the shunt resistor using the 1206 package existing in the prior art, multiple parallel connections will undoubtedly occupy more PCB area, and the shunt resistor has a certain impedance, which inevitably has power loss, etc. problem.
  • the current passing through a piece of PCB copper trace is compared with the prior art, and the shunt resistor required for completing the function in the prior art is eliminated, thereby effectively reducing the PCB.
  • the board area also removes the power loss on the shunt resistor, further improving the efficiency of the power supply system and increasing the power density.
  • the voltage drop signal of a piece of PCB copper is generated when a current flows through a piece of PCB copper.
  • the signal amplifying circuit is composed of an operational amplifier
  • the temperature sensing circuit is composed of a temperature sensor
  • the digital processing circuit is It consists of a digital chip.
  • a method for implementing copper-based detection current based on a digital chip in this example includes a PCB copper sheath, a signal amplifying circuit, a temperature sensing circuit, and a digital processing circuit.
  • the voltage drop signal of a piece of PCB copper is generated when a current flows through a piece of PCB copper.
  • the voltage drop signal is amplified by an operational amplifier and then output a voltage drop amplification signal.
  • the copper skin temperature signal is output by the temperature sensor, and the voltage drop is amplified.
  • the copper skin temperature signal is connected to the digital chip, and after the numerical operation and the compensation algorithm are processed inside the digital chip, the current value flowing through a piece of PCB copper is output.
  • FIG. 4 is a flow chart of a current detecting method according to a preferred embodiment of the present invention. As shown in FIG. 4, the method includes the following steps:
  • Step 1 the circuit is initialized
  • Step 2 Obtain temperature values and current values of a plurality of times (T0, T1, etc.) under specific conditions; the specific conditions are: a fixed input voltage, a fixed output voltage, and a fixed load current.
  • Step 3 calculating a temperature coefficient a
  • Step 4 obtaining a temperature value Tp of the PCB copper trace
  • Step 5 Obtain a current sampling value at a temperature value Tp of the current PCB copper trace
  • Step 6 using the temperature coefficient a to calibrate the current sample value at the temperature value Tp;
  • Step 7 calculating the actual current value after calibration, for example, multiplying the temperature value Tp by the temperature coefficient a to obtain a current standard value corresponding to the temperature value Tp, and then performing an arithmetic mean or a weighted average on the current sample value according to the current standard value. Wait for the algorithm to calibrate.
  • the signal amplifying circuit and the temperature sensing circuit may be configured as a device, and the voltage drop signal of a piece of PCB copper is when a current flows through a piece of PCB copper.
  • the device integrated with the signal amplifying circuit and the temperature sensing circuit is composed of an operational amplifier and a temperature sensor, and the digital processing circuit is composed of a digital chip.
  • a digital chip-based copper detection current in this example includes a piece of PCB copper, a device integrated with a signal amplifying circuit and a temperature sensing circuit, and a digital processing circuit.
  • the signal amplifying circuit and the digital processing circuit may be configured as a device, and a voltage drop signal of a piece of PCB copper is generated when a current flows through a piece of PCB copper.
  • the temperature sensing circuit is composed of a temperature sensor, and the device integrating the signal amplifying circuit and the digital processing circuit is composed of an operational amplifier and a digital chip.
  • a copper chip based on a digital chip detects current.
  • the implementation method includes a piece of PCB copper, a device integrated with a signal amplifying circuit and a digital processing circuit, and a temperature sensing circuit.
  • the signal amplifying circuit, the temperature sensing circuit, and the digital processing circuit may be configured as a device, and a voltage drop signal of a piece of PCB copper is current flowing through a section.
  • the device that integrates the signal amplifying circuit, the temperature sensing circuit and the digital processing circuit generated by the PCB copper is composed of an operational amplifier, a temperature sensor and a digital chip.
  • a copper chip based on the digital chip in this example The method for detecting the current includes a piece of PCB copper, a device integrated with a signal amplifying circuit, a temperature sensing circuit, and a digital processing circuit.
  • the temperature sensing circuit and the digital processing circuit may be configured as a device, and the voltage drop signal of a piece of PCB copper is when a current flows through a piece of PCB copper.
  • the signal amplifying circuit is composed of an operational amplifier, and the device integrating the temperature sensing circuit and the digital processing circuit is composed of a temperature sensor and a digital chip.
  • a copper chip detecting current based on the digital chip in this example includes a piece of PCB copper, a device integrated with a temperature sensing circuit and a digital processing circuit, and a signal amplifying circuit.
  • the above embodiments and preferred embodiments of the present invention provide an implementation method that can reduce the occupation of the PCB board area and reduce the power loss of the current-sense circuit, and overcomes the existence of the conventional shunt resistor detection current.
  • the problem is that the PCB area is large and the power loss is large.
  • modules or steps of the present invention described above can be implemented by a general-purpose computing device that can be centralized on a single computing device or distributed across a network of multiple computing devices. Alternatively, they may be implemented by program code executable by the computing device such that they may be stored in the storage device by the computing device and, in some cases, may be different from the order herein.
  • the steps shown or described are performed, or they are separately fabricated into individual integrated circuit modules, or a plurality of modules or steps thereof are fabricated as a single integrated circuit module.
  • the invention is not limited to any specific combination of hardware and software.
  • the above technical solution provided by the embodiment of the present invention can be applied to a current detecting process, using a signal amplifying circuit to detect a voltage drop signal of a PCB copper trace and amplifying a voltage drop signal; the digital processing circuit calculates a flow through the PCB according to the voltage drop signal.
  • the method of current sampling value of the copper wire routing solves the problem that the power loss of the power source is large due to the detection of the current by the parallel shunt resistor, and the power loss of the power source is reduced.

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Abstract

一种电流检测电路及电流检测方法，其中，该电流检测电路包括：信号放大电路，用于检测PCB铜皮走线的电压降信号，并放大电压降信号（S202）；数字处理电路，设置为根据电压降信号计算流经PCB铜皮走线的电流采样值（S204）。本方法解决了通过并联分流电阻的方式检测电流导致的电源功率损耗大的问题，降低了电源功率损耗。

Description

电流检测电路及电流检测方法 技术领域
本发明涉及电源领域，具体而言，涉及一种电流检测电路及电流检测方法。
背景技术
随着通信、宽带网络等行业的不断发展，要求电源供电系统体积越来越小，功率密度越来越高。图1是根据相关技术的电流检测电路的结构示意图，如图1所示，在通信电源上，现有检测电流的一般技术是在电源的电流路径上串联分流电阻，取得分流电阻上的电压降信号，并把该电压降信号经运放放大合适的倍数后送到数字芯片的ADC端口，经数字芯片内的软件算法处理后输出电流数值。
常用分流电阻有工业标准的封装尺寸及对应的额定功率，可根据通流大小选取不同的阻值和封装，以现今应用较多的1206封装低阻值合金贴片电阻为例来说明，假设电源供电系统的电流为50安培(A)，选取1206封装低阻值合金贴片电阻的阻值为0.001欧姆(Ω)(该阻值为1206封装最小的电阻值)，则这一个1206封装合金贴片电阻的功率损耗为2.5W，远远超出了其额定功率0.5W。
为了满足1206封装合金贴片电阻的功率降额以及降低整个检流电路的功率损耗，需采用多个分流电阻的并联来减小检流电路的阻值。经过计算，需要至少并联三个1206封装0.001Ω阻值的合金贴片电阻才能满足50A电流的检测，此时三个分流电阻的功率损耗为0.833W。
发明人在研究过程中发现，由于1206封装的分流电阻尺寸较大，多个并联将毫无疑问地占用较多的印刷电路板(PCB)面积，不利于电源供电系统的功率密度提升；同时，分流电阻有一定的阻值，不可避免地会有功率损耗，也不利于电源的效率提升。
针对相关技术中通过并联分流电阻的方式检测电流导致的电源功率损耗大的问题，目前尚未提出有效的解决方案。
发明内容
本发明实施例提供了一种电流检测电路及电流检测方法，以至少解决通过并联分流电阻的方式检测电流导致的电源功率损耗大的问题。
根据本发明的一个实施例，提供了一种电流检测电路，包括：PCB铜皮走线、信号放大电路和数字处理电路，其中，所述PCB铜皮走线为电源内部至电源端口的一层或者多层并联的PCB铜皮，所述PCB铜皮走线的两端之间存在第一阻抗；所述信号放大电路的两个输入端分别与所述PCB铜皮走线的两端连接，设置为检测所述PCB铜皮走线的电压降信号，并放大所述电压降信号；所述数字处理电路，与所述信号放大电路连接，设置为根据所述电压降信 号计算流经所述PCB铜皮走线的电流采样值。
可选地，还包括：温度传感电路，其中，所述温度传感电路，设置为检测所述PCB铜皮走线的温度。
可选地，所述数字处理电路还包括：温度系数计算单元，设置为在特定条件下，根据获取所述温度传感电路在多个时刻检测到的所述PCB铜皮走线的所述温度以及所述温度下流经所述PCB铜皮走线的电流值，计算表征电流随温度变化的温度系数；校正单元，设置为根据所述温度系数，校正所述电流采样值，得到电流测量值。
可选地，所述信号电流检测电路电路包括：运算放大器U1，阻容电路，第一电容C1，第一电阻R5，第二电阻R6，其中，所述第一电阻R5的一端与所述PCB铜皮走线的一端连接，另一端与所述运算放大器U1的正相输入端连接；所述第二电阻R6的一端与所述PCB铜皮走线的另一端连接，另一端与所述运算放大器U1的负相输入端连接；所述第一电容C1的一端与所述运算放大器U1的负相输入端连接，另一端与所述运算放大器U1的正相输入端连接；所述运算放大器U1的负相输入端还与所述阻容电路的一端连接，且所述阻容电路的另一端与所述运算放大器U1的输出端连接；所述运算放大器U1的输出端与所述数字处理电路连接。
可选地，所述阻容电路包括：并联连接的第三电阻R7及第二电容C2。
可选地，所述温度传感电路包括：温度传感器U2，第四电阻R8，第三电容C3，其中，所述第四电阻R8的一端与所述温度传感器U2的输出端连接，另一端与所述数字处理电路连接；所述第三电容C3的一端的与所述温度传感器U2的输出端连接，另一端接地。
根据本发明的另一个实施例，还提供了一种电流检测方法，包括：检测PCB铜皮走线的电压降信号，并放大所述电压降信号，其中，所述PCB铜皮走线为电源内部至电源端口的一层或者多层并联的PCB铜皮，所述PCB铜皮走线的两端之间存在第一阻抗；根据所述电压降信号计算流经所述PCB铜皮走线的电流采样值。
可选地，在根据所述电压降信号计算流经所述PCB铜皮走线的电流采样值之前，所述方法还包括：检测所述PCB铜皮走线的温度。
可选地，根据所述电压降信号计算流经所述PCB铜皮走线的电流采样值还包括：在特定条件下，根据获取所述温度传感电路在多个时刻检测到的所述PCB铜皮走线的所述温度以及所述温度下流经所述PCB铜皮走线的电流值，计算表征电流随温度变化的温度系数；根据所述温度系数，校正所述电流采样值，得到电流测量值。
在本发明实施例中，还提供了一种计算机存储介质，该计算机存储介质可以存储有执行指令，该执行指令用于执行上述实施例中的电流检测方法。
通过本发明实施例，采用信号放大电路检测PCB铜皮走线的电压降信号，并放大电压降信号；数字处理电路根据电压降信号计算流经PCB铜皮走线的电流采样值的方式，解决了通过并联分流电阻的方式检测电流导致的电源功率损耗大的问题，降低了电源功率损耗。
附图说明
此处所说明的附图用来提供对本发明的进一步理解，构成本申请的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1是根据相关技术的电流检测电路的结构示意图；
图2是根据本发明实施例的电流检测方法的流程图；
图3是根据本发明实施例的电流检测电路的结构示意图；
图4是根据本发明优选实施例的电流检测方法的流程图；
图5是根据本发明优选实施例的电流检测电路的可选结构示意图一；
图6是根据本发明优选实施例的电流检测电路的可选结构示意图二；
图7是根据本发明优选实施例的电流检测电路的可选结构示意图三；
图8是根据本发明优选实施例的电流检测电路的可选结构示意图四。
具体实施方式
下文中将参考附图并结合实施例来详细说明本发明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。
需要说明的是，本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
在本实施例中提供了一种电流检测方法，图2是根据本发明实施例的电流检测方法的流程图，如图2所示，该流程包括如下步骤：
步骤S202，检测PCB铜皮走线的电压降信号，并放大电压降信号，其中，PCB铜皮走线为电源内部至电源端口的一层或者多层并联的PCB铜皮，PCB铜皮走线的两端之间存在第一阻抗；
步骤S204，根据电压降信号计算流经PCB铜皮走线的电流采样值。
通过上述步骤，对PCB铜皮走线的电压降信号进行测量，进而根据PCB铜皮走线的电压降信号计算流经PCB铜皮走线的电流采样值，解决了通过并联分流电阻的方式检测电流导致的电源功率损耗大的问题，降低了电源功率损耗。另外，由于不需要额外增加分流电阻，有利于功率密度的提升。
可选地，在根据电压降信号计算流经PCB铜皮走线的电流采样值之前，检测PCB铜皮走线的温度。
可选地，在步骤S204中，可以在特定条件下，根据获取温度传感电路在多个时刻检测到 的PCB铜皮走线的温度以及温度下流经PCB铜皮走线的电流值，计算表征电流随温度变化的温度系数；根据温度系数，校正电流采样值，得到电流测量值。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到根据上述实施例的方法可借助软件加必需的通用硬件平台的方式来实现，当然也可以通过硬件，但很多情况下前者是更佳的实施方式。基于这样的理解，本发明的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质(如ROM/RAM、磁碟、光盘)中，包括若干指令用以使得一台终端设备(可以是手机，计算机，服务器，或者网络设备等)执行本发明各个实施例所述的方法。
在本实施例中还提供了一种电流检测电路，该装置用于实现上述实施例及优选实施方式，已经进行过说明的不再赘述。如以下所使用的，术语“模块”可以实现预定功能的软件和/或硬件的组合。尽管以下实施例所描述的装置较佳地以软件来实现，但是硬件，或者软件和硬件的组合的实现也是可能并被构想的。
图3是根据本发明实施例的电流检测电路的结构示意图，如图3所示，该电流检测电路包括：PCB铜皮走线、信号放大电路和数字处理电路，其中，PCB铜皮走线为电源内部至电源端口的一层或者多层并联的PCB铜皮，PCB铜皮走线的两端之间存在第一阻抗；
信号放大电路的两个输入端分别与PCB铜皮走线的两端连接，设置为检测PCB铜皮走线的电压降信号，并放大电压降信号；
数字处理电路，与信号放大电路连接，设置为根据电压降信号计算流经PCB铜皮走线的电流采样值。
可选地，电流检测电路还包括：温度传感电路，其中，温度传感电路，设置为检测PCB铜皮走线的温度。
可选地，数字处理电路还包括：温度系数计算单元，设置为在特定条件下，根据获取温度传感电路在多个时刻检测到的PCB铜皮走线的温度以及温度下流经PCB铜皮走线的电流值，计算表征电流随温度变化的温度系数；校正单元，耦合至温度系数计算单元，设置为根据温度系数，校正电流采样值，得到电流测量值。
参照图3，可选地，信号电流检测电路电路包括：运算放大器U1，阻容电路，第一电容C1，第一电阻R5，第二电阻R6，其中，
第一电阻R5的一端与PCB铜皮走线的一端连接，另一端与运算放大器U1的正相输入端连接；
第二电阻R6的一端与PCB铜皮走线的另一端连接，另一端与运算放大器U1的负相输入端连接；
第一电容C1的一端与运算放大器U1的负相输入端连接，另一端与运算放大器U1的正相输入端连接；
运算放大器U1的负相输入端还与阻容电路的一端连接，且阻容电路的另一端与运算放大器U1的输出端连接；
运算放大器U1的输出端与数字处理电路连接。
可选地，阻容电路包括：并联连接的第三电阻R7及第二电容C2。
可选地，温度传感电路包括：温度传感器U2，第四电阻R8，第三电容C3，其中，
第四电阻R8的一端与温度传感器U2的输出端连接，另一端与数字处理电路连接；
第三电容C3的一端的与温度传感器U2的输出端连接，另一端接地。
本发明的实施例还提供了一种软件，该软件用于执行上述实施例及优选实施方式中描述的技术方案。
本发明的实施例还提供了一种存储介质。在本实施例中，上述存储介质可以被设置为存储用于执行以下步骤的程序代码：
步骤S202，检测PCB铜皮走线的电压降信号，并放大电压降信号，其中，PCB铜皮走线为电源内部至电源端口的一层或者多层并联的PCB铜皮，PCB铜皮走线的两端之间存在第一阻抗；
步骤S204，根据电压降信号计算流经PCB铜皮走线的电流采样值。
可选地，在本实施例中，上述存储介质可以包括但不限于：U盘、只读存储器(Read-Only Memory，简称为ROM)、随机存取存储器(Random Access Memory，简称为RAM)、移动硬盘、磁碟或者光盘等各种可以存储程序代码的介质。
可选地，本实施例中的具体示例可以参考上述实施例及可选实施方式中所描述的示例，本实施例在此不再赘述。
为了使本发明实施例的描述更加清楚，下面结合优选实施例进行描述和说明。
本发明优选实施例提供了一种基于数字芯片的铜皮检测电流的电路，包括：
一段PCB铜皮走线，一段PCB铜皮走线为电源内部至电源端口的一层或多层并联的PCB铜皮，根据通流大小合适地设置铜皮走线的电流密度，一段PCB铜皮走线的两端之间存在阻抗(Rcopper)，可用于取得电流流经一段PCB铜皮的电压降信号；
信号放大电路，用于放大一段PCB铜皮走线两端产生的电压降信号，输出电压降放大信号；
温度传感电路，用于测量一段PCB铜皮走线的温度，输出铜皮温度信号；
数字处理电路，用于接收铜皮温度信号和电压降放大信号，输出流经一段PCB铜皮的电流数值。
其中，信号放大电路包括：一运算放大器U1，一阻容电路，一电容C1，一电阻R5，一电阻R6。电阻R5的一端与一段PCB铜皮走线的一端连接，另一端与运算放大器U1的正相输入端连接；
电阻R6的一端与一段PCB铜皮走线的另一端连接，另一端与运算放大器U1的负相输入端连接；
电容C1的一端与运算放大器U1的负相输入端连接，另一端与与运算放大器U1的正相输入端连接；
运算放大器U1的负相输入端还与阻容电路的一端连接，且阻容电路的另一端与运算放大器U1的输出端连接；
运算放大器U1的输出端与数字芯片U3的ADC2端口连接；
可选地，阻容电路包括并联连接的电阻R7及电容C2。
其中，温度传感电路包括：一温度传感器U2，一电阻R8，一电容C3。电阻R8的一端与温度传感器U2的输出端连接，另一端与数字芯片U3的ADC1的端口连接；
电容C3的一端的与温度传感器U2的输出端连接，另一端接地。
其中，数字处理电路包括：一数字芯片U3，数字芯片U3内部有不少于两个ADC转换器；数字芯片U3对铜皮温度信号和电压降放大信号进行数值运算和补偿算法处理，输出流经一段PCB铜皮的电流数值。
针对现有技术中存在的采用1206封装分流电阻的尺寸较大，多个并联将毫无疑问地占用较多的PCB板面积，同时，分流电阻有一定的阻抗，不可避免地会有功率损耗等问题。采用本发明优选实施例提供的上述电路，与现有技术相比，通过一段PCB铜皮走线检测通过的电流，无需现有技术中完成此功能需要的分流电阻，既有效地减小了PCB占板面积，又去除了分流电阻上的功率损耗，进一步提升电源供电系统的效率、提高功率密度。
下面对基于上述电路的本发明优选实施例的实施方案进行描述和说明。
如图3所示，一段PCB铜皮的电压降信号是有电流流经一段PCB铜皮时产生的，信号放大电路是由运算放大器组成，温度传感电路是由温度传感器组成，数字处理电路是由数字芯片组成，换句话说，本例中一种基于数字芯片的铜皮检测电流的实现方法包括一段PCB铜皮、信号放大电路、温度传感电路和数字处理电路。一段PCB铜皮的电压降信号是有电流流经一段PCB铜皮时产生的，电压降信号经运算放大器放大后输出电压降放大信号，铜皮温度信号是由温度传感器输出的，电压降放大信号和铜皮温度信号连接至数字芯片，在数字芯片内部进行数值运算和补偿算法处理后，输出流经一段PCB铜皮的电流数值。
图4是根据本发明优选实施例的电流检测方法的流程图，如图4所示，该方法包括如下步骤：
步骤1，电路初始化；
步骤2，在特定条件下获取多个时刻(T0、T1等)的温度值及电流值；特定条件是指：固定的输入电压、固定的输出电压以及固定的负载电流。
步骤3，计算温度系数a；
步骤4，获取PCB铜皮走线的温度值Tp；
步骤5，获取当前PCB铜皮走线的温度值Tp下电流采样值；
步骤6，使用温度系数a校准温度值Tp下电流采样值；
步骤7，计算校准后的实际电流值，例如，将温度值Tp与温度系数a相乘，得到该温度值Tp对应的电流标准值，再根据电流标准值对电流采样值通过算术平均或者加权平均等算法进行校准。
可选地，如图5所示，本发明的优选实施例中，信号放大电路和温度传感电路可以设置为一个装置，一段PCB铜皮的电压降信号是有电流流经一段PCB铜皮时产生的，集成了信号放大电路和温度传感电路的装置是由运算放大器和温度传感器组成，数字处理电路是由数字芯片组成，换句话说，本例中一种基于数字芯片的铜皮检测电流的实现方法包括一段PCB铜皮、集成了信号放大电路和温度传感电路的装置和数字处理电路。
可选地，如图6所示，本发明的优选实施例中，信号放大电路和数字处理电路可以设置为一个装置，一段PCB铜皮的电压降信号是有电流流经一段PCB铜皮时产生的，温度传感电路是由温度传感器组成，集成了信号放大电路和数字处理电路的装置是由运算放大器和数字芯片组成，换句话说，本例中一种基于数字芯片的铜皮检测电流的实现方法包括一段PCB铜皮、集成了信号放大电路和数字处理电路的装置和温度传感电路。
可选地，如图7所示，本发明的优选实施例中，信号放大电路、温度传感电路和数字处理电路可以设置为一个装置，一段PCB铜皮的电压降信号是有电流流经一段PCB铜皮时产生的，集成了信号放大电路、温度传感电路和数字处理电路的装置是由运算放大器、温度传感器和数字芯片组成，换句话说，本例中一种基于数字芯片的铜皮检测电流的实现方法包括一段PCB铜皮、集成了信号放大电路、温度传感电路和数字处理电路的装置。
可选地，如图8所示，本发明的优选实施例中，温度传感电路和数字处理电路可以设置为一个装置，一段PCB铜皮的电压降信号是有电流流经一段PCB铜皮时产生的，信号放大电路是由运算放大器组成，集成了温度传感电路和数字处理电路的装置是由温度传感器和数字芯片组成，换句话说，本例中一种基于数字芯片的铜皮检测电流的实现方法包括一段PCB铜皮、集成了温度传感电路和数字处理电路的装置和信号放大电路。
综上所述，通过本发明的上述实施例和优选实施例，提供了一种既能减小占用PCB板面积又能降低检流电路功率损耗的实现方法，克服了传统的分流电阻检测电流存在的占PCB板面积大、功率损耗较大等问题。
显然，本领域的技术人员应该明白，上述的本发明的各模块或各步骤可以用通用的计算装置来实现，它们可以集中在单个的计算装置上，或者分布在多个计算装置所组成的网络上，可选地，它们可以用计算装置可执行的程序代码来实现，从而，可以将它们存储在存储装置中由计算装置来执行，并且在某些情况下，可以以不同于此处的顺序执行所示出或描述的步骤，或者将它们分别制作成各个集成电路模块，或者将它们中的多个模块或步骤制作成单个集成电路模块来实现。这样，本发明不限制于任何特定的硬件和软件结合。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
工业实用性
本发明实施例提供的上述技术方案，可以应用于电流检测过程中，采用信号放大电路检测PCB铜皮走线的电压降信号，并放大电压降信号；数字处理电路根据电压降信号计算流经PCB铜皮走线的电流采样值的方式，解决了通过并联分流电阻的方式检测电流导致的电源功率损耗大的问题，降低了电源功率损耗。

Claims (9)

  1. 一种电流检测电路，包括：PCB铜皮走线、信号放大电路和数字处理电路，其中，
    所述PCB铜皮走线为电源内部至电源端口的一层或者多层并联的PCB铜皮，所述PCB铜皮走线的两端之间存在第一阻抗；
    所述信号放大电路的两个输入端分别与所述PCB铜皮走线的两端连接，设置为检测所述PCB铜皮走线的电压降信号，并放大所述电压降信号；
    所述数字处理电路，与所述信号放大电路连接，设置为根据所述电压降信号计算流经所述PCB铜皮走线的电流采样值。
  2. 根据权利要求1所述的电流检测电路，其中，还包括：温度传感电路，其中，
    所述温度传感电路，设置为检测所述PCB铜皮走线的温度。
  3. 根据权利要求2所述的电流检测电路，其中，所述数字处理电路还包括：
    温度系数计算单元，设置为在特定条件下，根据获取所述温度传感电路在多个时刻检测到的所述PCB铜皮走线的所述温度以及所述温度下流经所述PCB铜皮走线的电流值，计算表征电流随温度变化的温度系数；
    校正单元，设置为根据所述温度系数，校正所述电流采样值，得到电流测量值。
  4. 根据权利要求1所述的电流检测电路，其中，所述信号电流检测电路电路包括：运算放大器(U1)，阻容电路，第一电容(C1)，第一电阻(R5)，第二电阻(R6)，其中，
    所述第一电阻(R5)的一端与所述PCB铜皮走线的一端连接，另一端与所述运算放大器(U1)的正相输入端连接；
    所述第二电阻(R6)的一端与所述PCB铜皮走线的另一端连接，另一端与所述运算放大器(U1)的负相输入端连接；
    所述第一电容(C1)的一端与所述运算放大器(U1)的负相输入端连接，另一端与所述运算放大器(U1)的正相输入端连接；
    所述运算放大器(U1)的负相输入端还与所述阻容电路的一端连接，且所述阻容电路的另一端与所述运算放大器(U1)的输出端连接；
    所述运算放大器(U1)的输出端与所述数字处理电路连接。
  5. 根据权利要求4所述的电流检测电路，其中，所述阻容电路包括：
    并联连接的第三电阻(R7)及第二电容(C2)。
  6. 根据权利要求2所述的电流检测电路，其中，所述温度传感电路包括：温度传感器(U2)，第四电阻(R8)，第三电容(C3)，其中，
    所述第四电阻(R8)的一端与所述温度传感器(U2)的输出端连接，另一端与所述数字处理电路连接；
    所述第三电容(C3)的一端的与所述温度传感器(U2)的输出端连接，另一端接地。
  7. 一种电流检测方法，包括：
    检测PCB铜皮走线的电压降信号，并放大所述电压降信号，其中，所述PCB铜皮走线为电源内部至电源端口的一层或者多层并联的PCB铜皮，所述PCB铜皮走线的两端之间存在第一阻抗；
    根据所述电压降信号计算流经所述PCB铜皮走线的电流采样值。
  8. 根据权利要求7所述的方法，其中，在根据所述电压降信号计算流经所述PCB铜皮走线的电流采样值之前，所述方法还包括：
    检测所述PCB铜皮走线的温度。
  9. 根据权利要求8所述的方法，其中，根据所述电压降信号计算流经所述PCB铜皮走线的电流采样值还包括：
    在特定条件下，根据获取所述温度传感电路在多个时刻检测到的所述PCB铜皮走线的所述温度以及所述温度下流经所述PCB铜皮走线的电流值，计算表征电流随温度变化的温度系数；
    根据所述温度系数，校正所述电流采样值，得到电流测量值。
PCT/CN2016/077745 2015-09-30 2016-03-29 电流检测电路及电流检测方法 WO2016177209A1 (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107677883A (zh) * 2017-10-20 2018-02-09 厦门马恒达汽车零部件有限公司 一种电流传感器精度修正装置及方法
WO2024021752A1 (zh) * 2022-07-25 2024-02-01 中兴通讯股份有限公司 电阻值校准方法、校准电路、终端设备及存储介质

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108535535B (zh) * 2018-04-02 2021-02-09 苏州浪潮智能科技有限公司 一种用于集成芯片的电流侦测方法及系统
CN108918947B (zh) * 2018-06-12 2020-04-17 浙江大学 一种pcb型低电感电流传感器

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6819124B1 (en) * 2001-09-02 2004-11-16 Arizona Board Or Regents Detection of electromigration in integrated circuits
CN1979207A (zh) * 2005-11-02 2007-06-13 美国凹凸微系有限公司 电池电量计量电路
US7683604B1 (en) * 2008-10-01 2010-03-23 Texas Instruments Incorporated Amplifier topology and method for connecting to printed circuit board traces used as shunt resistors
CN201984104U (zh) * 2010-11-19 2011-09-21 宁波信泰机械有限公司 用电设备的大电流检测装置
CN202171609U (zh) * 2011-05-31 2012-03-21 广州市芯科电子科技有限公司 一种电流感应探测电路
CN202502131U (zh) * 2012-02-29 2012-10-24 北京优尔特科技股份有限公司 一种电压/电流检测电路
CN104638604A (zh) * 2013-11-11 2015-05-20 四川融鑫信息科技有限公司 电流监测系统
CN104914383A (zh) * 2015-06-26 2015-09-16 双竞科技有限公司 电池健康状况检测模块和系统及带有该检测模块的电池

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100515871B1 (ko) * 2003-09-08 2005-09-20 텍사스 인스트루먼트 코리아 주식회사 트라이액을 이용한 교류 전류 센서 및 교류 전류 감지 방법
EP1936391B1 (en) * 2006-12-19 2011-02-09 ABB Technology AG Apparatus and method for improving the accuracy of instrument transformers
CN101776932B (zh) * 2009-12-25 2012-09-26 天津诺尔哈顿电器制造有限公司 精密电压调整电路
CN102944737B (zh) * 2012-11-22 2014-12-24 中国科学院电工研究所 一种测量大电流的智能传感器
DE102012224099A1 (de) * 2012-12-20 2014-06-26 Continental Teves Ag & Co. Ohg Verfahren zum Kalibrieren eines Stromsensors
CN103760413A (zh) * 2013-12-27 2014-04-30 航天科工深圳（集团）有限公司 故障指示器电流检测系统及电流检测低温补偿方法
CN104793172A (zh) * 2015-05-04 2015-07-22 武汉中原电子信息公司 一种电能计量装置的温度分段校准及计量方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6819124B1 (en) * 2001-09-02 2004-11-16 Arizona Board Or Regents Detection of electromigration in integrated circuits
CN1979207A (zh) * 2005-11-02 2007-06-13 美国凹凸微系有限公司 电池电量计量电路
US7683604B1 (en) * 2008-10-01 2010-03-23 Texas Instruments Incorporated Amplifier topology and method for connecting to printed circuit board traces used as shunt resistors
CN201984104U (zh) * 2010-11-19 2011-09-21 宁波信泰机械有限公司 用电设备的大电流检测装置
CN202171609U (zh) * 2011-05-31 2012-03-21 广州市芯科电子科技有限公司 一种电流感应探测电路
CN202502131U (zh) * 2012-02-29 2012-10-24 北京优尔特科技股份有限公司 一种电压/电流检测电路
CN104638604A (zh) * 2013-11-11 2015-05-20 四川融鑫信息科技有限公司 电流监测系统
CN104914383A (zh) * 2015-06-26 2015-09-16 双竞科技有限公司 电池健康状况检测模块和系统及带有该检测模块的电池

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107677883A (zh) * 2017-10-20 2018-02-09 厦门马恒达汽车零部件有限公司 一种电流传感器精度修正装置及方法
WO2024021752A1 (zh) * 2022-07-25 2024-02-01 中兴通讯股份有限公司 电阻值校准方法、校准电路、终端设备及存储介质

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