WO2016177133A1 - Carte de service et dispositif de communication la comprenant - Google Patents

Carte de service et dispositif de communication la comprenant Download PDF

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Publication number
WO2016177133A1
WO2016177133A1 PCT/CN2016/076651 CN2016076651W WO2016177133A1 WO 2016177133 A1 WO2016177133 A1 WO 2016177133A1 CN 2016076651 W CN2016076651 W CN 2016076651W WO 2016177133 A1 WO2016177133 A1 WO 2016177133A1
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WO
WIPO (PCT)
Prior art keywords
service
connector
high speed
low speed
connectors
Prior art date
Application number
PCT/CN2016/076651
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English (en)
Chinese (zh)
Inventor
董超
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2016177133A1 publication Critical patent/WO2016177133A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L41/00—Arrangements for maintenance, administration or management of data switching networks, e.g. of packet switching networks
    • H04L41/08—Configuration management of networks or network elements
    • H04L41/0803—Configuration setting
    • H04L41/0813—Configuration setting characterised by the conditions triggering a change of settings
    • H04L41/0816—Configuration setting characterised by the conditions triggering a change of settings the condition being an adaptation, e.g. in response to network events
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L41/00—Arrangements for maintenance, administration or management of data switching networks, e.g. of packet switching networks
    • H04L41/08—Configuration management of networks or network elements
    • H04L41/0803—Configuration setting
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L69/00—Network arrangements, protocols or services independent of the application payload and not provided for in the other groups of this subclass
    • H04L69/14—Multichannel or multilink protocols

Definitions

  • the present invention relates to the field of communications, and in particular to a service board and communication settings therewith.
  • PTN Packet Transport Network
  • IP IP Multimedia Subsystem
  • TCO total cost of ownership
  • PTN supports a variety of two-way point-to-point connection channels based on packet switching services. It has the ability to adapt to various granular services and end-to-end networking capabilities, and provides a "flexible" transmission pipeline that is more suitable for IP service characteristics. It can utilize various underlays.
  • a transmission channel (such as SDH/Ethernet/OTN) acts as a service interface.
  • the main purpose of the present invention is to provide a service board and a communication device therewith to solve the problem of low utilization of the service board in the related art.
  • a service board including a service board and an interface card, and the service board further includes: a service backplane, where the first side of the service backplane is connected to the service board, and the service is The second side of the backplane is connected to the interface card, so that the service board is connected to the interface card through the service backplane.
  • the first side of the service backplane is configured with multiple motherboard connectors
  • the service backplane is connected to the service motherboard through multiple motherboard connectors
  • the second interface of the service backplane is configured with multiple interface card connections.
  • the service backplane is connected to the corresponding interface card through an interface card connector group.
  • the plurality of motherboard connectors includes a first power and ground signal connector, a high speed and low speed signal connector set, and a low speed signal connector set, which are sequentially disposed.
  • the high speed and low speed signal connector set includes first high speed and low speed signal connectors, second high speed and low speed signal connectors, and third high speed and low speed signal connectors arranged in sequence, and the first high speed and low speed signal connections And second The high speed and low speed signal connectors are disposed adjacent to each other, and the third high speed and low speed signal connectors are spaced apart from the second high speed and low speed signal connectors.
  • the low speed signal connector group includes a first low speed signal connector and a second low speed signal connector, and the third high speed and low speed signal connector, the first low speed signal connector and the second low speed signal connector are sequentially adjacent Settings.
  • the plurality of motherboard connectors further includes a first guide pin structure disposed between the first power and ground signal connectors and the first high speed and low speed signal connectors.
  • the interface card connector set includes second power and ground signal connectors, high speed signal and ground signal connectors, hybrid connectors and interface connectors, high speed signal and ground signal connectors, hybrid connectors, and
  • the interface connectors are arranged adjacent to each other, and the power and ground signal connectors are spaced apart from the high speed and ground signal connectors.
  • a portion of the hybrid connector is configured to define a high speed signal and a ground signal, and another portion of the hybrid connector is configured to define an interface.
  • the interface card connector set further includes a second guide pin structure disposed between the second power and ground signal connectors and the high speed signal and ground signal connectors.
  • the second side of the service backplane is configured with multiple interface card slots, and each interface card connector group is disposed in a corresponding interface card slot.
  • the second side of the service backplane has a first card layer and a second card layer distributed along a height direction thereof, and the interface card slot is four, wherein two interface card slots are set on the first card.
  • the bit layer, the other two interface card slots are set in the second card layer.
  • a communication setting including a service board, and the service board is the service board described above.
  • the service board of the present invention uses the service backplane to connect the service board and the interface card, so that the service board can be configured with different interface cards through the service backplane, so that the interface can be flexibly configured, so that the service board can be connected with more interfaces. Card matching improves the utilization of the business motherboard.
  • FIG. 1 is a block diagram showing the structure of a service board of the present invention
  • Fig. 2 shows a distribution diagram of respective connectors on the backboard in the present invention.
  • a service board is provided.
  • the service board includes a service board 10 and an interface card 20.
  • the service board further includes: a service backplane 30, and a service backplane 30.
  • the first side of the service is connected to the service card 10, and the second side of the service backplane 30 is connected to the interface card 20, so that the service board 10 is connected to the interface card 20 through the service backplane 30.
  • the service board of the present invention uses the service backplane 30 to connect the service board 10 and the interface card 20, so that the service board 10 can be configured with the interface card 20 through the service backplane 30 to implement flexible configuration of the interface. 10 can be combined with more interface cards 20 to improve the utilization of the service motherboard 10.
  • the first side of the service backplane 30 is provided with a plurality of motherboard connectors, and the service backplane 30 is connected to the service motherboard 10 through a plurality of motherboard connectors, and the second side of the service backplane 30 is disposed.
  • a plurality of motherboard connectors disposed on the first side of the service backplane 30 are disposed corresponding to the connectors on the service motherboard 10, so that the service motherboard 10 and the service backplane can be conveniently implemented.
  • the connection between the two interfaces; the plurality of interface card connector groups disposed on the second side of the service backplane 30 corresponds to the corresponding interface card 20, and one interface card connector group corresponds to one interface card 20, so the service motherboard 10
  • the service backplane 30 can be paired with each interface card 20.
  • the plurality of motherboard connectors include a first power and ground signal connector 101, a high speed and low speed signal connector set, and a low speed signal connector set, which are sequentially disposed.
  • the first power and ground signal connector 101 is a 12V power supply and ground signal connector.
  • the power signal and the ground signal can be transmitted between the service backplane 30 and the service mother board 10 through the first power and ground signal connector 101, and the service can be realized by setting the high speed and low speed signal connector group and the low speed signal connector group. The transmission of the high speed signal and the low speed signal of the backboard 30 and the service motherboard 10.
  • the high speed and low speed signal connector set includes first and second high speed and low speed signal connectors 103, second high speed and low speed signal connectors 104, and third high speed and low speed signal connections.
  • the first high speed and low speed signal connector 103 is disposed adjacent to the second high speed and low speed signal connector 104, and the third high speed and low speed signal connector 105 is spaced apart from the second high speed and low speed signal connector 104.
  • the high speed signal types defined by the first high speed and low speed signal connector 103, the second high speed and low speed signal connector 104, and the third high speed and low speed signal connector 105 are SERDES (parallel and serial to parallel converters). ), XAUI (10G Ethernet unit interface) and ground signal, the rate reached 1.25G and 3.125G respectively.
  • the low speed signal connector group includes a first low speed signal connector 106 and a second low speed signal connector 107, and the third high speed and low speed signal connector 105, the first low speed signal connection
  • the device 106 and the second low speed signal connector 107 are sequentially disposed adjacent to each other.
  • the signal types defined by the first low speed signal connector 106 and the second low speed signal connector 107 mainly include: a PCIE (Fast Local Bus) interface, a JTAG (Joint Test Behavior Organization) interface, and a Local Bus (Local Bus). Interface, SMI (Serial Management Interface), I2C (Internal Integrated Circuit) interface, clock signal, power control signal, interrupt signal, reset signal, and hardware status indication signal
  • the plurality of motherboard connectors further include a first guide pin structure member 102 disposed at the first power and ground signal connector 101 and the first high speed and low speed signal connector 103 between.
  • the first guide pin structure member 102 is provided with a guide hole
  • the service mother board 10 is provided with a guide pin, by inserting the guide pin on the service mother board 10 into the first guide pin structure member 102.
  • the guiding function is implemented, and the connection between the service board 10 and the service back board 30 is conveniently implemented.
  • the interface card connector group includes second power and ground signal connectors, high-speed signal and ground signal connectors, hybrid connectors, and interface connectors, high-speed signal and ground signal connectors, and hybrid interfaces.
  • the interface and interface connectors are arranged adjacent to each other, and the power and ground signal connectors are spaced apart from the high speed and ground signal connectors.
  • the second power and ground signal connectors are 12V power and ground signal connectors.
  • the power signal and the ground signal can be transmitted between the service backplane 30 and the interface card 20 through the second power and ground signal connectors, and the service backplane 30 and the interface card 20 can be realized by setting the high speed and ground signal connectors.
  • the high-speed signal and the ground signal are transmitted, and the interface between the service backplane 30 and the interface card 20 can be realized by setting the interface connector.
  • a portion of the hybrid connector is configured to define a high speed signal and a ground signal, and another portion of the hybrid connector is configured to define an interface.
  • a portion of the hybrid connector and the high speed signal and ground signal connector all define a high speed signal and a ground signal
  • another portion of the hybrid connector and the interface connector all define various interfaces.
  • the interface card connector set further includes a second guide pin structure member disposed between the second power source and the ground signal connector and the high speed signal and the ground signal connector.
  • the second guide pin structure member is provided with a guide hole
  • the interface card 20 is provided with a guide pin
  • the guide pin on the interface card 20 is inserted into the jack on the second guide pin structure member,
  • the guiding function is implemented, and the connection between the interface card 20 and the service backboard 30 is conveniently implemented.
  • the second side of the service backplane 30 is provided with a plurality of interface card slots, and each interface card connector group is disposed in a corresponding interface card slot.
  • the second side of the service backplane 30 has a first card layer and a second card layer distributed along a height direction thereof, and the interface card slot is four, and two interface card slots are disposed at The first card level layer and the other two interface card slots are disposed on the second card layer.
  • the second side of the service backplane 30 is provided with four interface card slots, and the four interface card slots are located on the second side of the service backplane 30 and are divided into two.
  • the interface card has two interface card slots.
  • the interface card slot at the upper left is slot 1.
  • the interface card slot at the upper right is slot 2.
  • the slot on the lower left is the slot.
  • the slot on the lower right side is the slot 4, and the first side of the service backplane 30 is defined as the rear end of the backplane.
  • the second side of the service backplane 30 is defined as the front side of the backplane.
  • slot 1 there is a first set of interface card connector groups, the second power and ground signal connector in the interface card connector group is 201, the second guide pin structure is 202, high speed signal and ground signal connection The device is 203, the hybrid connector is 204, and the interface connector is 205.
  • slot 2 there is a second set of interface card connectors, the second power and ground signal connector in the interface card connector set is 301, the second guide pin structure is 302, high speed signal and ground signal connector The value is 303, the hybrid connector is 304, and the interface connector is 305.
  • slot 3 there is a third set of interface card connectors, the second power and ground signal connector in the interface card connector set is 401, the second guide pin structure is 402, high speed signal and ground signal connector The value is 403, the hybrid connector is 404, and the interface connector is 405.
  • slot 3 there is a fourth set of interface card connectors, the second power and ground signal connector in the interface card connector set is 501, the second guide pin structure is 502, high speed signal and ground signal connector It is 503, the hybrid connector is 504, and the interface connector is 505.
  • 201 is a 12V power supply and ground signal connector
  • 202 is a guide pin structure
  • all of 203 and a portion of 204 define a high speed signal SERDES, XAUI and ground.
  • the signal, another portion of 204 and 205 define a PCIE interface, a JTAG interface, a Local Bus interface, an SMI, an I2C interface, a clock signal, a power control signal, an interrupt signal, a reset signal, and a hardware status indication signal.
  • the front and rear ends of the service backplane 30 are not assigned except the power source and the ground signal, and all other signals are defined according to the general signal group of the front interface board slot.
  • Four groups are defined by the connector at the back end of the service backplane 30, and the front end of the service backplane 30 is evenly distributed to four slots.
  • the power signal is located at each of the rear end and the front end of the service backplane 30.
  • a separate power connector provides all the power signals in the same network. It does not need to be defined separately for each sub-slot.
  • the location defined by the ground signal is mainly configured according to the requirements of power supply reflow and signal integrity. It needs to meet each front-end interface board.
  • the ground signal corresponding to the slot position is the same.
  • the high-speed signal SERDES defines 32 pairs on the back end of the service backplane
  • XAUI defines 4 groups
  • the SERDES allocated to the front interface board slot is 8 pairs per slot
  • XAUI is 1 group
  • the SMI, I2C, clock, power control, interrupt, reset, and hardware status indications define four groups at the back end, and the slots allocated to the front panel are one set per slot.
  • the front end of the service backplane 30 needs to support three types of interface boards: 10G Ethernet interface board, 1G Ethernet interface board, and narrowband interface board.
  • the high-speed interfaces of the three interface boards use one set of XAUI and 8 pairs respectively.
  • SERDES and 2 pairs of SERDES for this case, the signal definition of the connector is optimized, or the slot 1 of the front panel of the middle backplane is taken as an example, and the 8 pairs of SERDES used by the 1G Ethernet interface board are defined in the high speed signal.
  • a set of XAUI and 2 pairs of SERDES used by the ground signal connector 203, the 10G Ethernet interface board and the narrowband interface board are defined in the hybrid connector 204, so that no high-speed signal and no use are required on the Ethernet interface board and the narrowband interface board.
  • the connector corresponding to the ground signal connector 203 reduces one connector on the interface board, reducing the cost of the single board.
  • the back end of the service backplane 30 supports two service boards 10, and the processing capabilities provided are different.
  • the 32 pairs of SERDES+4 groups of XAUIs are the maximum processing power that one of the full configuration service boards can provide. It also supports a semi-configured service board that supports only 24 pairs of SERDES+2 sets of XAUIs.
  • the middle backplane backend connector is defined, the pair of semi-matched and fully-equipped service boards supports 24 pairs of SERDES+2 groups simultaneously.
  • the XAUI is defined at the second high speed and low speed signal connector 104, the third high speed and low speed signal connector 105, and the eight pairs of SERDES+2 sets of XAUI additionally supported by the full service motherboard 10 are defined in the first high speed and low speed signal connector 103. Therefore, when the service backplane 30 is used with the semi-equipped service board, the first high-speed and low-speed signal connector 103 need not be installed, and when the semi-matched service board is used, some corresponding sockets of the front-end interface board slot may not be used. Use, this can further reduce the number of connectors and reduce costs.
  • a communication setting including a service board, and the service board is the service board described above.
  • the service backplane 30 of the present invention is a double-sided plug-in backplane.
  • the service backplane 30 adopts a front and rear pluggable manner to increase the density of the single board, and different service mothers are allocated through signal distribution.
  • the processing capability of the board 10 can be maximized, and the flexible configuration of multiple interface boards can be supported, thereby reducing the cost of board development.
  • the technical problem to be solved by the present invention is how to implement flexible configuration of interfaces on the same service mother board, so that the service board can achieve maximum performance.
  • the front end surface of the service backplane of the present invention includes at least two interface board slots, and each slot has at least one connector configured to insert the interface board, and a guiding structure for assisting the card insertion and removal.
  • the connector signal definition includes at least one of a power, ground, and low speed interface signal, such as at least one of LOCALBUS, SMI, I2C, high speed interface signals, such as SERDES, PCIE, XAUI, HiGig, InterLaken signals, clock signals, hardware status signals, JTAG signals, interrupt signals, reset signals, and power control signals.
  • a common set of interface signal groups is defined as the signal definition of the front-end connector, so that each slot in the front-end can support more. Types of interface boards.
  • the front end of the service backplane has the same function of the pin signal definition corresponding to the connector with electrical connections in each slot.
  • the rear end surface of the service backplane includes at least one connector disposed to be inserted into the service motherboard, and a guiding structure member for inserting and removing the auxiliary card.
  • the connector signal definition includes at least power, ground, and low speed interface signals such as LOCALBUS, SMI, I2C, high speed interface signals such as SERDES, XAUI, HiGig, InterLaken signals, clock signals, hardware status signals, JTAG signals, interrupt signals, reset signals And power control signals.
  • the power and ground signals, the front-end and the back-end connectors share the same network.
  • the connector at the back end of the service backplane 30 provides the same number of sets of signals according to the number of slots in the front-end interface board. Connected to the front connector of the service backplane 30 one by one.
  • the invention adopts the double-sided service backplane mode, and the single board can be inserted on both sides, thereby improving the utilization efficiency of the backplane area, reducing the height of the whole service board, thereby improving the slot utilization rate of the rack, and additionally
  • the multi-interface board slot and flexible signal definition design enable the service board to be matched with different interface boards to implement flexible interface configuration and adapt to various application environments.
  • the service board in the present invention uses the service backplane to connect the service board and the interface card, so that the service board can pass the service.
  • the backplane is configured with different interface cards to implement flexible interface configuration. This allows the service board to be used with more interface cards to improve the utilization of the service board.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Computer Security & Cryptography (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structure Of Telephone Exchanges (AREA)

Abstract

L'invention concerne une carte de service et un dispositif de communication la comprenant. La carte de service comprend une carte mère de service et une carte d'interface ; et la carte de service comprend également : un panneau de service, un premier côté du panneau de service étant relié à la carte mère de service, et un second côté du panneau de service étant relié à la carte d'interface, de sorte que le carte mère de service soit reliée à la carte d'interface par le panneau de service. Dans la carte de service selon la présente invention, un panneau de service sert à relier une carte mère de service et une carte d'interface. De cette manière, la carte mère de service peut correspondre à différentes cartes d'interface par le panneau de service, de manière à réaliser la configuration flexible d'interfaces, de sorte que la carte mère de service puisse correspondre à plusieurs cartes d'interface, ce qui permet d'améliorer le facteur d'utilisation de la carte mère de service.
PCT/CN2016/076651 2015-07-01 2016-03-17 Carte de service et dispositif de communication la comprenant WO2016177133A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510379018.1 2015-07-01
CN201510379018.1A CN106330514A (zh) 2015-07-01 2015-07-01 业务板及具有其的通信设备

Publications (1)

Publication Number Publication Date
WO2016177133A1 true WO2016177133A1 (fr) 2016-11-10

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PCT/CN2016/076651 WO2016177133A1 (fr) 2015-07-01 2016-03-17 Carte de service et dispositif de communication la comprenant

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WO (1) WO2016177133A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1661974A (zh) * 2004-02-25 2005-08-31 华为技术有限公司 一种宽带接入的组网设备及方法
CN101320313A (zh) * 2008-06-26 2008-12-10 华为技术有限公司 存储设备
CN101883117A (zh) * 2010-06-30 2010-11-10 中兴通讯股份有限公司 接口业务集中处理方法和系统
CN102307142A (zh) * 2011-08-19 2012-01-04 中兴通讯股份有限公司 背板系统
CN103491458A (zh) * 2013-09-24 2014-01-01 北京国科环宇空间技术有限公司 无配线通信模块
EP2770682A1 (fr) * 2012-12-27 2014-08-27 Huawei Technologies Co., Ltd. Dispositif de fond de panier et appareil de communication

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1661974A (zh) * 2004-02-25 2005-08-31 华为技术有限公司 一种宽带接入的组网设备及方法
CN101320313A (zh) * 2008-06-26 2008-12-10 华为技术有限公司 存储设备
CN101883117A (zh) * 2010-06-30 2010-11-10 中兴通讯股份有限公司 接口业务集中处理方法和系统
CN102307142A (zh) * 2011-08-19 2012-01-04 中兴通讯股份有限公司 背板系统
EP2770682A1 (fr) * 2012-12-27 2014-08-27 Huawei Technologies Co., Ltd. Dispositif de fond de panier et appareil de communication
CN103491458A (zh) * 2013-09-24 2014-01-01 北京国科环宇空间技术有限公司 无配线通信模块

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