WO2016176106A1 - Attache dipôle sans soudure à couplage capacitif - Google Patents

Attache dipôle sans soudure à couplage capacitif Download PDF

Info

Publication number
WO2016176106A1
WO2016176106A1 PCT/US2016/028607 US2016028607W WO2016176106A1 WO 2016176106 A1 WO2016176106 A1 WO 2016176106A1 US 2016028607 W US2016028607 W US 2016028607W WO 2016176106 A1 WO2016176106 A1 WO 2016176106A1
Authority
WO
WIPO (PCT)
Prior art keywords
feedboard
capacitive coupling
coupling surface
radiating element
clip
Prior art date
Application number
PCT/US2016/028607
Other languages
English (en)
Inventor
Steven Lee Schmutzler
Peter J. Bisiules
Douglas J. Blew
Original Assignee
Commscope Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commscope Technologies Llc filed Critical Commscope Technologies Llc
Publication of WO2016176106A1 publication Critical patent/WO2016176106A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H01Q21/26—Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre

Definitions

  • Antenna for wireless voice and/or data communications typically include an array of radiating elements that are connected to one or more feed networks.
  • RF Radio Frequency
  • one or more diversity techniques may be employed.
  • One such diversity technique is polarization diversity, which may be particularly effective in combating multi-path fading.
  • Crossed-dipole members (forming a radiating element) may be used to employ polarization diversity.
  • Each of the crossed dipole members may include a printed circuit board (PCB). Solder and/or adhesives are typically used to attach the dipole PCBs to a feedboard of an antenna.
  • these attachment techniques may be costly, insecure, and may affect RF performance of the radiating element, and, in turn, the overall performance of the antenna.
  • FIG. 1 is a perspective view of a crossed-dipole radiating element retained in a clip mounted on a feedboard according to an aspect of the present disclosure
  • FIG. 2 is a perspective view of a top side of the clip of Fig. 1;
  • FIG. 3 is a perspective view of an underside of the clip of Fig. 1;
  • FIG. 4 is a perspective view of a top side of a clip according to another aspect of the present disclosure.
  • FIG. 5 is a perspective view of the underside of the clip of Fig. 4;
  • Fig. 6 is a cross-sectional view of a first half of the clip of Fig. 4;
  • Fig. 7 is a cross-sectional view of the second half of the clip of Fig. 4;
  • Fig. 8 is a perspective view of a crossed-dipole radiating element connected to the clip of Fig. 4;
  • FIG. 9 is a perspective view of a clip according to aspects of the present disclosure being used to mount a crossed-dipole radiating element on a feedboard;
  • Fig. 10 is an illustration of the locking members of clips according to aspects of the present disclosure that may be used to lock the clips to a reflector.
  • Figs. 11 A and 1 IB are front views of first and second dipole printed circuit boards that may be used in the feedboard assemblies and antennas according to embodiments of the present invention.
  • Fig. 1 is a perspective view of a crossed-dipole radiating element 10 that is mounted on a feedboard 11 according to an aspect of the present disclosure.
  • the crossed-dipole radiating element 10 may include a first dipole printed circuit board (PCB) 12 and a second dipole PCB 14.
  • PCB printed circuit board
  • Each dipole PCB 12, 14 may have a conductive plane, a feed line, and a dipole.
  • the dipole PCBs 12, 14 may be mounted on the feedboard 11 via a clip 16.
  • the clip 16 may act as a socket for the PCBS 12, 14. While the crossed dipole radiating element 10 of Fig. 1 includes first and second dipole PCBs 12, 14, it will be appreciated that other dipole radiating elements may be used.
  • the dipole PCBs 12, 14 may be replaced with metal plated plastic dipole radiating elements, sheet metal dipole radiating elements and the like.
  • the embodiments disclosed herein may use any appropriate form of dipole radiating elements. It will also be appreciated that radiating elements other than dipole radiating elements may be used in some embodiments.
  • the dipole PCB's 12, 14 may fit together such that the dipoles are at
  • Fig. 2 is a perspective view of a top side of the clip 16.
  • Fig. 3 is a perspective view of an underside of the clip 16.
  • the clip 16 may be generally ring shaped when viewed from above, although other shapes may be used.
  • a plurality of tabs 18 may be positioned radially from the center of the clip 16 and may aid in the installation of the dipole PCBs 12, 14 into the clip 16.
  • the tabs 18 include retaining members 20.
  • the retaining members may be molded as a part of the tabs 18 in some embodiments, and may be attached to the tabs 18 in other embodiments.
  • Each of the retaining members 20 may define a slot 22 that is
  • the four retaining members 20 may intersect each other at a center of an aperture of the clip 16 and together the four retaining members 20 may form an "X" shape. Molded on, or otherwise attached to, a portion of each of the retaining members 20, is an RF capacitive coupling pad having a dipole PCB capacitive coupling surface 24a (see Fig. 2) and a feedboard capacitive coupling surface 24b (see Fig. 3). Each of the surfaces 24a, 24b of the RF capacitive coupling pad may include a metal trace, or a formed metal surface, to enable capacitive coupling. As best seen in Fig.
  • each dipole PCB capacitive coupling surface 24a extends upwardly and substantially perpendicular to a plane defined by the intersecting retaining members 20, and may be capacitively coupled to a metal trace or surface on a respective one of the dipole PCBs 12, 14.
  • the feedboard capacitive coupling surface 24b may form a substantially right angle with the dipole PCB capacitive coupling surface 24a of the RF capacitive coupling pad, and may be capacitively coupled to traces, pads or the like on the feedboard 11. It should be noted that the feedboard capacitive coupling surface 24b may form other angles with the dipole PCB capacitive coupling surface 24b in other embodiments. As shown in Figs.
  • the clip 16 may include a first dipole PCB capacitive coupling surface 24a and a first feedboard capacitive coupling surface 24b that together form a first RF capacitive coupling pad that is used to capacitively couple a first metal trace/pad on the feedboard 11 to a corresponding metal trace/pad on the first dipole PCB 12, and a second dipole PCB capacitive coupling surface 24a and a second feedboard capacitive coupling surface 24b that together form a second RF capacitive coupling pad that is used to capacitively couple a second metal trace/pad on the feedboard 11 to a corresponding metal trace/pad on the second dipole PCB 14.
  • the clip 16 may include one or more locking members 25 that are positioned on a bottom surface of the clip 1 .
  • the locking members 25 may be configured to lock the clip 16 onto the feedboard 11 and/or onto a reflector 13 (see Fig. 1) that may be, for example, underneath the feedboard 11, as will be discussed in more detail below with respect to Figs. 9 and 10.
  • the clip 16 may capacitively couple the RF feedlines of the dipole PCBs 12, 14 to respective RF connections of the feedboard 11 without the use of any solder.
  • a thin insulating member such as solder mask or the like, may be used on one or more surfaces of one or more of the PCBs discussed
  • hereinthroughout e.g., the dipole PCBs 12, 14 and/or the feedboard 11 so as to reduce or prevent any potential generation of passive intermodulation products.
  • a clip 26 may include capacitive coupling pads for coupling one or more conductive ground planes of the dipole radiating element 10 to the ground of the feedboard 11.
  • Figs. 4-10 illustrate a clip 26 that includes such capacitive coupling pads for coupling conductive ground planes of the dipole radiating element 10 to the ground of the feedboard 11.
  • a perspective view of a top side of the clip 26, and a perspective view of the underside of the clip 26 are shown, respectively.
  • the clip 26 may be generally ring shaped when viewed from the top.
  • a plurality of tabs 28 may be positioned radially from the center of the clip 26 and may aid in the installation of the dipole PCBs 12, 14 into the clip 26.
  • the tabs 28 include retaining members 30.
  • the retaining members may be molded as a part of the tabs 28 in some embodiments, and may be attached to the tabs 28 in other embodiments.
  • the retaining members 30 may define a pair of slots 31-1, 31-2 that are dimensioned to receive the respective dipole PCBs 12, 14.
  • the four retaining members 30 may intersect each other at the center of an aperture of the clip 26. Molded on, or otherwise attached to, a portion of each of the retaining members 30, are capacitive coupling pads 32 and/or 34.
  • the capacitive coupling pads 32, 34 include ground capacitive coupling pads 32-1 through 32-3 and feed capacitive coupling pads 34-1 and 34-2.
  • one of the retaining members 30 may include two capacitive coupling pads 32, 34 while the other of the retaining members 30 may include a single capacitive coupling pad 32, 34 each. It should be understood, however, that the retaining members 30 may include different numbers of capacitive coupling pads 32, 34 in other embodiments.
  • the capacitive coupling pads 32, 34 may be configured to couple RF signals between each of the dipole PCBs 12, 14 and the feedboard 11.
  • Each of the ground capacitive coupling pads 32 may include a surface extending upwardly and substantially perpendicular to the plane defined by the retaining members 30 ("dipole ground coupling surfaces 32a"). These dipole ground coupling surfaces 32a may be capacitively coupled to a conductive ground planes on respective ones of the dipole PCBs 12, 14. Further, each of the ground capacitive coupling pads 32 may include a surface extending substantially perpendicular to the dipole ground coupling surfaces 32a that is referred to herein as a feedboard ground coupling surface 32b.
  • feedboard ground coupling surfaces 32b may be capacitively coupled to a ground plane on the feedboard 11. Because the dipole ground coupling surfaces 32a are connected to, or otherwise in contact with, the respective feedboard ground coupling surfaces 32b, the ground capacitive coupling pads 32 may capacitively couple the conductive ground plane of each of the dipole PCBs 12, 14 to the ground plane on the feedboard 11.
  • Each of the feed capacitive coupling pads 34 may include a surface extending upwardly and substantially perpendicular to the plane defined by the retaining members ("dipole PCB capacitive coupling surfaces 34a"). Each dipole PCB capacitive coupling surface 34a may be capacitively coupled to an RF feedline of a respective one of the dipole PCBs 12, 14. Further, each of the feed capacitive coupling pads 34 may include a surface extending substantially perpendicular to the dipole PCB capacitive coupling surfaces 34a that is referred to herein as a feedboard capacitive coupling surface 34b. The feedboard capacitive coupling surfaces 34b may be capacitively coupled to RF connections of the feedboard 11.
  • the feed capacitive coupling pads 34 may capacitively couple RF feedlines of each of the dipole PCBs 12, 14 to RF connections of the feedboard 11.
  • Fig. 6 is a cross-sectional view of half of the clip 26 of Figs. 4-5.
  • the dipole PCB capacitive coupling surface 34a of the feed capacitive coupling pad 34 is in contact with, or otherwise coupled to, the feedboard capacitive coupling surface 34b of the feed capacitive coupling pad 34.
  • the dipole ground coupling surface 32a of the ground capacitive coupling pad 32 is in contact with, or otherwise coupled to, feedboard ground coupling surface 32b of the ground capacitive coupling pad 32.
  • Fig. 7 is a cross-sectional view of the other half of the clip 26.
  • two of the ground capacitive coupling pads 32 may include respective dipole ground coupling surfaces 32a, extending upwardly from the retaining members 30. Between the ground capacitive coupling pads 32 and connected to an intersecting retaining member 30, the dipole PCB capacitive coupling surface 34a of the feed capacitive coupling pad 34 is shown.
  • Figs. 11A and 1 IB are front views of the first and second dipole PCBs 100, 150 that may be used to implement the above-described dipole PCBs 12, 14. It will be understood that the dipole PCBs 100, 150 could also be replaced with other types of dipoles such as plated plastic dipoles, sheet metal dipoles and the like.
  • the first dipole PCB 100 comprises a generally T-shaped substrate 110 that has a base 112, a crossbar 114 and a vertical slot 116 that bisects the crossbar 1 14 structure and extends about halfway down the base 112 of the T-shaped substrate 110.
  • Metal plating is 120 is provided on the surface of the substrate 110.
  • the metal plating 120 may comprise two generally upside-down L-shaped metal plated areas 122, 124.
  • a horizontal plated metal connector 126 connects the two metal plated areas 122, 124.
  • Metal plating on the other side of the substrate 110 (not shown in Fig. 11A) is provided that couples to one of the feed capacitive coupling pads 34 when the first dipole PCB 100 is received within a slot 31 of the clip 26.
  • the second dipole PCB 150 comprises a generally T- shaped substrate 160 that has a base 162, a crossbar 164 and a vertical slot 166 that bisects the bottom of the T-shaped substrate 160 and extends about halfway up down the base 162 of the T- shaped substrate 160.
  • Metal plating is provided on the surface of the substrate 160.
  • the metal plating may comprise two generally upside-down L-shaped metal plated areas 172, 174.
  • the metal-plated areas 172, 174 are not connected to each other.
  • Metal plating on the other side of the substrate 160 (not shown in Fig. 11B) is provided that couples to one of the feed capacitive coupling pads 34 when the second dipole PCB 150 is received within a slot 31 of the clip 26.
  • Dipole 100 may be placed in slot 31-1 so that the metal plating 120 couples to the ground coupling surface 32a of ground capacitive coupling pad 32-3 and the metal plating on the other side of the substrate 110 contacts the dipole PCB capacitive coupling surface 34a of feed capacitive coupling pad 34-1. Since the horizontal plated metal connector 126 connects the two metal plated areas 122, 124, both legs of the dipole may be connected to ground through the ground capacitive coupling pad 32-3.
  • dipole 150 may be rotated 90 degrees with respect to dipole PCB 100 and placed in slot 31-2 so that vertical slot 166 of dipole PCB 150 is received within the vertical slot 116 of dipole PCB 100.
  • the metal plated area 172 on dipole PCB 150 couples to the ground coupling surface 32a of ground capacitive coupling pad 32-1 and the metal plated area 174 on dipole PCB 150 couples to the ground coupling surface 32a of ground capacitive coupling pad 32-2.
  • the metal plating on the other side of the substrate 160 contacts the dipole PCB capacitive coupling surface 34a of feed capacitive coupling pad 34- 2.
  • connections to two ground capacitive coupling pads 32-1, 32-2 are provided since the metal plated areas 172, 174 are not connected to each other.
  • Fig. 8 is a perspective view of the dipole radiating element 10 connected to the clip 26.
  • each of the clips 16, 26 may include locking members 25 positioned on the bottom surface of the clips 16, 26.
  • each of the locking members 25 may be dimensioned to fit through openings in the feedboard 11 and reflector 13. After the locking members 25 are fit through the openings of the feedboard 11 and reflector 13, the clip 16, 26 may be rotated so that the locking members 25 may abut another portion of the reflector 26 so as to lock the clip 16, 26 to the feedboard 11 and reflector 13.
  • the capacitive coupling surfaces of the clip 16, 26 may line up and be capacitively coupled to the feedboard traces, without the use of any solder, an example of which is illustrated in Fig. 10. It also should be noted that a thin insulating member, such as solder mask or the like, may be used on one or more surfaces of one or more of the PCBs discussed hereinthroughout, so as to reduce or prevent any potential generation of passive intermodulation products.
  • the dipole radiating elements depicted in the drawings are fully implemented on PCBs, in other embodiments the radiating elements may comprise PCB-based feed stalks with non-PCB dipoles mounted thereon. As another example, the radiating elements need not be cross-polarized radiating elements. Additionally, radiating elements other than dipole-based radiating elements may be used in other embodiments such as, for example, patch radiating elements that are mounted on PCB feed stalks.
  • the shape of the clip 16, 26, the shapes of the retaining members 20, 30 and slots 31 may likewise be changed as can the shapes and locations of the various capacitive coupling surfaces.
  • Other locking members 25 may also be used to lock the clips 16, 26 to an underlying surface.
  • the tabs 18, 28 may have different shapes and/or configurations, and may be omitted in some embodiments.
  • the clips 16, 26 are provided merely so this specification will fully disclose example embodiments and it will be understood that the disclosed clips 16, 26 are not intended to be limiting with respect to the broader scope of the invention to solderless attachment mechanisms for radiating elements having one or more PCB-based feed stalks.

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  • Support Of Aerials (AREA)

Abstract

Une antenne comprend une carte d'alimentation, un élément rayonnant qui comprend une carte de circuit imprimé s'étendant perpendiculairement à la carte d'alimentation, et une attache qui reçoit la carte de circuit imprimé et permet le montage de la carte de circuit imprimé sur la carte d'alimentation. La carte de circuit imprimé est connectée électriquement à la carte d'alimentation par l'intermédiaire d'une connexion sans soudure.
PCT/US2016/028607 2015-04-28 2016-04-21 Attache dipôle sans soudure à couplage capacitif WO2016176106A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562153680P 2015-04-28 2015-04-28
US62/153,680 2015-04-28

Publications (1)

Publication Number Publication Date
WO2016176106A1 true WO2016176106A1 (fr) 2016-11-03

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PCT/US2016/028607 WO2016176106A1 (fr) 2015-04-28 2016-04-21 Attache dipôle sans soudure à couplage capacitif

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WO (1) WO2016176106A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111525229A (zh) * 2019-02-01 2020-08-11 上海诺基亚贝尔股份有限公司 用于形成偶极天线阵列的支撑构件以及偶极天线阵列
WO2024158734A1 (fr) * 2023-01-25 2024-08-02 Commscope Technologies Llc Éléments rayonnants compacts à directivité élevée ayant des bras dipôles avec des paires de pièces en tôle pliée

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040201537A1 (en) * 2003-04-10 2004-10-14 Manfred Stolle Antenna having at least one dipole or an antenna element arrangement which is similar to a dipole
US20040217910A1 (en) * 2003-02-13 2004-11-04 Mark Montgomery Monolithic low profile omni-directional surface-mount antenna
KR20060099061A (ko) * 2005-03-10 2006-09-19 주식회사 케이엠더블유 광대역 다이폴 안테나
KR20130112518A (ko) * 2012-04-04 2013-10-14 엘에스전선 주식회사 광대역용 이중편파 다이폴 안테나 및 안테나 어레이
US20130314292A1 (en) * 2012-05-24 2013-11-28 Andrew Llc Dipole Strength Clip

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040217910A1 (en) * 2003-02-13 2004-11-04 Mark Montgomery Monolithic low profile omni-directional surface-mount antenna
US20040201537A1 (en) * 2003-04-10 2004-10-14 Manfred Stolle Antenna having at least one dipole or an antenna element arrangement which is similar to a dipole
KR20060099061A (ko) * 2005-03-10 2006-09-19 주식회사 케이엠더블유 광대역 다이폴 안테나
KR20130112518A (ko) * 2012-04-04 2013-10-14 엘에스전선 주식회사 광대역용 이중편파 다이폴 안테나 및 안테나 어레이
US20130314292A1 (en) * 2012-05-24 2013-11-28 Andrew Llc Dipole Strength Clip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111525229A (zh) * 2019-02-01 2020-08-11 上海诺基亚贝尔股份有限公司 用于形成偶极天线阵列的支撑构件以及偶极天线阵列
WO2024158734A1 (fr) * 2023-01-25 2024-08-02 Commscope Technologies Llc Éléments rayonnants compacts à directivité élevée ayant des bras dipôles avec des paires de pièces en tôle pliée

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