WO2016172036A1 - Thermally insulating electrical contact probe - Google Patents

Thermally insulating electrical contact probe Download PDF

Info

Publication number
WO2016172036A1
WO2016172036A1 PCT/US2016/028085 US2016028085W WO2016172036A1 WO 2016172036 A1 WO2016172036 A1 WO 2016172036A1 US 2016028085 W US2016028085 W US 2016028085W WO 2016172036 A1 WO2016172036 A1 WO 2016172036A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrical contact
pin
thermally insulating
mounting plate
pocket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2016/028085
Other languages
French (fr)
Inventor
Michael A. Schrameyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Semiconductor Equipment Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Semiconductor Equipment Associates Inc filed Critical Varian Semiconductor Equipment Associates Inc
Priority to CN201680023023.1A priority Critical patent/CN107535018B/en
Priority to JP2017554466A priority patent/JP6685577B2/en
Priority to KR1020177033351A priority patent/KR102562059B1/en
Priority to KR1020237025854A priority patent/KR102600377B1/en
Priority to CN202010472258.7A priority patent/CN111586904B/en
Publication of WO2016172036A1 publication Critical patent/WO2016172036A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0004—Devices wherein the heating current flows through the material to be heated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating

Definitions

  • Embodiments of the present disclosure relate to the field of electrical connection devices, and more particularly to a thermally insulating electrical contact probe.
  • Ion implantation is a technique for introducing conductivity -altering impurities into a substrate such as a wafer or other workpiece.
  • a desired impurity material is ionized in an ion source of an ion beam implanter, the ions are accelerated to form an ion beam of prescribed energy, and the ion beam is directed at the surface of the substrate.
  • the energetic ions in the ion beam penetrate into the bulk of the substrate material and are embedded into the crystalline lattice of the material to form a region of desired conductivity.
  • a desired doping profile is achieved by implanting ions into a target substrate at high temperatures.
  • Heating a substrate can be achieved by supporting the substrate on a heated platen during an ion implant process.
  • a conventional heated platen may be connected to an electrical power source via a plurality of electrical contact probes. Additional electrical contact probes may be connected to the heated the platen for enabling electrostatic clamping of a substrate.
  • the various electrical contact probes connected to a heated platen may absorb heat from the heated platen and may reduce the temperature of the heated platen in localized areas adjacent to the electrical contact probes.
  • any temperature variations in the material of the heated platen may affect the uniformity of heat transferred to a target substrate supported and heated by the heated platen, potentially having an adverse effect on an ion implant process.
  • temperature variations in a heated platen can cause the heated platen to warp, bow, or even crack.
  • An exemplary embodiment of a thermally insulating electrical contact probe for providing an electrical connection to a heated platen in accordance with the present disclosure may include a mounting plate having a tubular pin guide defining a pin pass-through, a cover coupled to the mounting plate and having a neck portion enclosing the pin guide, and an insulating pin having a shank portion disposed within the pin pass-through and defining a conductor pass-through, a flange portion extending radially outwardly from the shank portion above a top of the pin guide, and a pocket portion extending from the flange portion and defining a pocket.
  • the electrical contact probe may further include a spring disposed intermediate the flange portion and the mounting plate, the spring biasing the flange portion away from the mounting plate, an electrical contact pad disposed within the pocket, and an electrical conductor coupled to the electrical contact pad and extending through the conductor pass-through.
  • the electrical contact probe may further include a coil spring surrounding the pin guide and disposed intermediate the flange portion and the mounting plate, the spring biasing the flange portion away from the mounting plate, an electrical contact pad disposed within the pocket, and an electrical conductor coupled to the electrical contact pad and extending through the conductor pass-through.
  • An exemplary embodiment of a heated platen assembly in accordance with the present disclosure may include a heated platen, a base coupled to the heated platen, a heat shield disposed intermediate, and coupled to, the heated platen and the base, an electrical contact probe coupled to the base and extending through the base and the heat shield, the electrical contact probe including a mounting plate having a tubular pin guide defining a pin pass-through, a cover coupled to the mounting plate and having a neck portion enclosing the pin guide, and an insulating pin having a shank portion disposed within the pin pass-through and defining a conductor pass- through, a flange portion extending radially outwardly from the shank portion above a top of the pin guide, and a pocket portion extending from the flange portion and defining a pocket.
  • the heated platen assembly may further include an electrical contact pad disposed within the pocket, an electrical conductor coupled to the electrical contact pad and extending through the conductor pass-through, and a spring disposed intermediate the flange portion and the mounting plate, the spring biasing the flange portion away from the mounting plate and holding the electrical contact pad in engagement with a metallization layer on a backside of the heated platen.
  • FIG. la is perspective view illustrating an exemplary embodiment of a thermally insulating electrical contact probe in accordance with the present disclosure
  • FIG. lb is cross-sectional view illustrating the thermally insulating electrical contact probe shown in FIG. la taken along plane A-A;
  • FIG. 2 is cross-sectional view illustrating an exemplary embodiment of a heated platen assembly in accordance with the present disclosure including the thermally insulating electrical contact probe shown in FIGS, la and lb.
  • FIG. 3 is bottom perspective view illustrating an exemplary embodiment of a heated platen assembly in accordance with the present disclosure
  • the probe 10 may be provided for establishing an electrical connection between an electrical power source and a heated platen of an ion implanter, such as for heating the platen or for facilitating electrostatic clamping of a substrate disposed on the heated platen.
  • the probe 10 may be operable to minimize an amount of heat absorbed from the heated platen to mitigate temperature variations across the heated platen.
  • the probe 10 may be implemented in a heated platen used to support a substrate during processing thereof.
  • the heated platen may be used to support a substrate during an ion implant process, a plasma deposition process, an etching process, a chemical-mechanical planarization process, or generally any process where a semiconductor substrate is to be supported on a heated platen.
  • an exemplary heated platen assembly is described below. The embodiments of the present disclosure are not limited by the exemplary heated platen assembly described herein and may find application in any of a variety of other platen applications used in a variety of semiconductor manufacturing processes.
  • the probe 10 may generally include a mounting plate 12, a cover 14, an insulating pin 16, a coil spring 18 (FIG. lb), an electrical contact pad 20, and an electrical conductor 22.
  • a mounting plate 12 a cover 14
  • an insulating pin 16 FOG. lb
  • an electrical contact pad 20 FOG. lb
  • an electrical conductor 22 FOG. lb
  • terms such as “top,” “bottom,” “upper,” “lower,” “vertical,” “horizontal,” “lateral,” “longitudinal,” “radial,” “inner,” and “outer” may be used herein to describe the relative placement and orientation of the components of the probe 10 with respect to the geometry and orientation of the probe 10 as it appears in FIGS, la and lb. Said terminology will include the words specifically mentioned, derivatives thereof, and words of similar import.
  • the mounting plate 12 of the probe 10 may include a generally planer base portion 24 having a pair of tubular mounting bosses 26a, 26b extending from a top surface thereof.
  • the mounting bosses 26a, 26b may define respective fastener pass-throughs 28a, 28b extending through the mounting plate 12 for accepting corresponding mechanical fasteners as further described below.
  • the base portion 26 may further have a tubular pin guide 30 (FIG. lb) extending from a top surface thereof intermediate the mounting bosses 26a, 26b.
  • the pin guide 30 may define a pin pass-through 32 extending through the mounting plate 12 for accepting the insulating pin 16 and the electrical conductor 22 as further described below.
  • the mounting plate 12 may be formed of a high-temperature capable, thermally and electrically insulating material, such as Zirconia, Alumina, various thermoplastics, etc.
  • the insulating pin 16 may be a generally tubular member having a pocket portion 34 defining a pocket 36, a shank portion 38 extending from a bottom of the pocket portion 34 and defining a conductor pass- through 40 extending from a bottom of the pocket 36, and a flange portion 42 extending radially-outwardly from a top of the shank portion 38.
  • the conductor pass- through 40 may be coaxial with, and may have a smaller diameter than, the pocket 36.
  • the insulating pin 16 may be formed of a high-temperature capable, thermally and electrically insulating material, such as Zirconia, Alumina, various thermoplastics, etc.
  • the spring 18 may be a coil spring formed of a high-temperature capable metal.
  • the spring 18 may surround and may extend above the pin guide 30, and may be seated within an annular trench 44 in the mounting plate 12 for preventing excessive horizontal movement of the spring 18 relative to the mounting plate 12.
  • the flange portion 42 of the insulating pin 16 may be seated on top of the spring 18, and the shank portion 38 of the insulating pin 16 may extend down through the pin pass-through 32 of the pin guide 30 and may protrude from the bottom of the mounting plate 12.
  • An outer diameter of the shank portion 38 may be smaller (e.g., at least 0.0015 inches smaller) than the diameter of the pin pass-through 32 to establish a free-running, locational clearance fit between the shank portion 38 and the pin guide 30.
  • the shank portion 38 may freely move vertically within the pin pass- through 32, and may also shift or tilt horizontally within the pin pass-through 32 as further described below.
  • the cover 14 of the probe 10 may be formed of a low-emissivity material, such as aluminum or nickel.
  • the cover 14 may be disposed on top of the mounting plate 12 and may include a generally planar base portion 46 and a generally tubular neck portion 48 extending from a top surface of the base portion 46.
  • the neck portion 48 may define an internal chamber 50 housing the pin guide 30, the insulating pin 16, and the spring 18.
  • An annular flange 52 may extend radially inwardly from a top of the neck portion 48 and may define an aperture 54 having a diameter greater than the outer diameter of the pocket portion 34 of the insulating pin 16 and smaller than the outer diameter of the flange portion 42 of the insulating pin 16.
  • the base portion 46 of the cover 14 may include a pair of through- holes 56a, 56b for receiving the mounting bosses 26a, 26b of the mounting plate 12 therethrough, respectively.
  • a first pair of lower insulating washers 58a, 58b may be seated on top of the base portion 24 of the mounting plate 12 surrounding the mounting bosses 26a, 26b, respectively, and may have respective flanged portions 60a, 60b extending into radial gaps 62a, 62b intermediate the mounting bosses 26a, 26b and the cover, respectively.
  • a second pair of upper insulating washers 64a, 64b may be seated on top of the base portion 46 of the cover 14 surrounding the mounting bosses 26a, 26b, respectively, and may have respective flanged portions 66a, 66b extending into the radial gaps 62a, 62b, respectively.
  • a pair of retaining rings 70a, 70b may be removably disposed within respective grooves 72a, 72b in the outer surfaces of mounting bosses 26a, 26b above the upper insulating washers 64a, 64b, thus securing the upper insulating washers 64a, 64b, the base portion 46 of the cover 14, and the lower insulating washers 58a, 58b against the base portion 24 of the mounting plate 12 in a vertically stacked arrangement.
  • the lower insulating washers 58a, 58b and the upper insulating washers 64a, 64b may be formed of a low thermal conductivity material, such as Alumina, Zirconia, various thermoplastics, etc., for mitigating conductive heat transfer between the cover 14 and the mounting plate 12 as further described below.
  • the electrical contact pad 20 may be made from a thermally durable, electrically conducting material, such as nickel, and may be soldered or brazed to the electrical conductor 22.
  • the electrical contact pad 20 may be disposed within the pocket 36 of the pocket portion 34 of the insulating pin 16, and the electrical conductor 22 may extend through the conductor pass-through 40 of the shank portion 38 of the insulating pin 16 and may be coupled to an electrical power source (not shown).
  • the electrical contact pad 20 may have a diameter greater (e.g., at least 0.010 inches greater) than the diameter of the conductor pass-through 40 and smaller (e.g., at least 0.010 inches smaller) than the diameter of the pocket 36.
  • the electrical contact pad 20 may rest on an annular shoulder 74 defined at the juncture of the pocket 36 and the conductor pass-through 40, with the shoulder 74 acting as a lower travel stop for retaining the electrical contact pad 20 within the pocket 36.
  • FIG. 2 is a cross-sectional view illustrating an embodiment of the probe 10 installed in an exemplary heated platen assembly 80.
  • the heated platen assembly 80 may include a heated platen 82, a metallization layer 83, a heat shield 84, and a base 86 coupled together in a vertically-spaced, stacked relationship, in any of a variety of known manners.
  • the metallization layer 83 may include a plurality of metallic traces printed on or otherwise applied to the underside or backside of the heated platen 82 and covered with a layer of glass or other electrically insulating material. When an electric current is applied to the metallization layer 83, the metallization layer 83 may convert an amount of the electrical energy into heat. This heat may be conducted through the heated platen 82, thus heating a substrate disposed thereon.
  • the heat shield 84 may function to reduce an amount of heat transferred from the heated platen 82 to the relatively cold base 86.
  • the heat shield 84 may thus be configured to reflect heat back toward the heated platen 82, away from the base 86.
  • the heated platen 82 may be formed of a thermally durable material, including a ceramic material such as alumina, aluminum nitride, boron nitride or a similar dielectric ceramic.
  • the heat shield 84 may be formed of a thermally -reflective material, such as aluminum, stainless steel, titanium, or other low emissivity metal.
  • the base 86 may be formed of any suitably rigid and durable material and may be part of, or may be coupled to, a scanning mechanism (not shown) capable of orienting the platen 82 at various angular and/or rotational positions during processing operations.
  • the probe 10 may be disposed within a complementary recess 88 in a bottom of the base 86 and may be removably fastened to the base 86 by a pair of mechanical fasteners 90a, 90b (e.g., screws or bolts) extending through the fastener pass-throughs 28a, 28b in the mounting bosses 26a, 26b, respectively.
  • the neck portion 48 of the cover 14 may extend upwardly through respective apertures 92a, 92b in the base 86 and the heat shield 84.
  • the spring 18 of the probe 10 may be held in compression between the mounting plate 12 and the flange portion 42 of the insulating pin 16, and may thus urge the insulating pin 16 upwardly, away from the mounting plate 12.
  • the insulating pin 16, and particularly the shoulder 74 in the pocket portion 34 of the insulating pin 16, may in-turn urge the electrical contact pad 20 upwardly against the metallization layer 83.
  • the spring 18 may allow the electrical contact pad 20 and the insulating pin 16 to be displaced vertically, such as may occur when a substrate is loaded onto, or removed from, the support surface 85 of the heated platen 82, while holding the electrical contact pad 20 in firm engagement with the metallization layer 83 to maintain a desired electrical connection between the electrical conductor 22 and the metallization layer 83.
  • the flange 52 of the neck portion 48 of the cover 14 may act as an upper travel stop for limiting upward movement of the insulating pin 16, and the pin guide 30 of the mounting plate 12 may act as a lower travel stop for limiting downward movement of the insulating pin 16.
  • electrical current may be applied to the metallization layer 83 via the electrical conductor 22 and the electrical contact pad 20.
  • the electrical current may be provided for heating the heated platen 82 in the above-described manner, and/or for generating an electrostatic force for clamping a substrate to the support surface 85 of the heated platen 82.
  • an amount of heat may be transferred from the heated platen 82 to the relatively cold base 86 via conductive and/or radiative heat transfer (convective heat transfer is generally prevented since the platen assembly 80 may be located in a processing environment held at vacuum).
  • Significant heat transfer from the heated platen 82 to the base 86 is generally undesirable since such heat transfer may create temperature variations in the heated platen 82.
  • any temperature variations in the material of the heated platen 82 may affect the uniformity of heat transferred to a target substrate supported by the heated platen 82, adversely affecting an ion 82 may cause the heated platen 82 to warp, bow, or even crack.
  • the above-described structural features and configuration of the probe 10 may cooperate to mitigate heat transfer from the heated platen 82 to the relatively cold base 86, improving temperature uniformity in the heated platen 82.
  • the portion of the probe 10 in direct contact with the metallization layer 83 is merely the electrical contact pad 20, and the electrical contact pad 20 and the attached electrical conductor 22 are thermally insulated from the rest of the probe 10 by the insulating pin 16.
  • This limited contact between the probe 10 and the metallization layer 83 may restrict conductive heat transfer from the heated platen 82 to the base 86 via the probe 10.
  • the bottom surface 90 of the electrical contact pad 20 is in contact with the insulating pin 16, with the sidewall 91 of the electrical contact pad 20 being radially spaced apart from the insulating pin 16.
  • This limited contact between the electrical contact pad 20 and the insulating pin 16 may further restrict conductive heat transfer from the heated platen 82 to the base 86 via the probe 10.
  • the above-described free-running fit between the shank portion 38 of the insulating pin 16 and the pin guide 30 results in minimal physical contact between the shank portion 38 and the pin guide 30. This may further restrict conductive heat transfer from the heated platen 82 to the base 86 via the probe 10.
  • the lower insulating washers 58a, 58b and the upper insulating washers 64a, 64b being formed of a low thermal conductivity material and entirely separating the cover 14 from the mounting plate 12, may restrict conductive transfer from the cover 14 to the mounting plate 12. This may further restrict conductive heat transfer from the heated platen 82 to the base 86 via the probe 10.
  • the cover 14, being formed of a low- emissivity material may act as a radiation shield between the heated platen 82 and the underlying components of the probe 10. This may restrict radiative heat transfer from the heated platen 82 to probe 10, in-tum mitigating conductive heat transfer from the probe 10 to the base 86.
  • the above-described structural features and configuration of the probe 10 may cooperate to allow thermal expansion and contraction of the heated platen 82 relative to the base 86 while maintaining a desired electrical connection with the heated platen 82.
  • the electrical contact pad 20 may be allowed to move horizontally within the pocket 36 when the heated platen 82 expands and contracts while maintaining the physical connection between the electrical contact pad 20 and the heated platen 82.
  • the insulating pin 16 may be allowed to tilt or rock horizontally within the pin guide 30 when the heated platen 82 expands and contracts while holding the electrical contact pad 20 in firm engagement with the heated platen 82.
  • a plurality of electrical contact probes similar to the probe 10 described above may be implemented in a platen assembly in various configurations and arrangements to provide electrical connections for heating a platen, for enabling electrostatic clamping of substrates, and/or for facilitating various other features of a platen assembly requiring electrical power.
  • a first plurality of electrical contact probes ⁇ ⁇ - ⁇ similar to the probe 10 described above may be installed in a base 96 of the platen assembly 94 for enabling electrostatic clamping of substrates to a heated platen 98 of the platen assembly 94.
  • a second plurality of electrical contact probes IO7-10 similar to the probe 10 described above may be installed in the base 96 for heating the heated platen 98.
  • the above-described exemplary probe 10 may provide numerous advantages relative to conventional electrical contact probes commonly employed in platen assemblies for providing electrical connections to heated platens.
  • the probe 10 may greatly mitigate an amount of heat transferred from a heated platen to a relatively cold base of a heated platen assembly. This may improve temperature uniformity in a heated platen, thus improving the reliability of ion implant processes and reducing the likelihood of catastrophic platen failure.
  • the probe 10 may allow thermal expansion and contraction of a heated platen relative to a base of a heated platen assembly while maintaining a desired electrical connection to the heated platen. Still further, the probe 10 may operate effectively, and may confer all of the above-described advantages, within a vacuum environment of a heated platen assembly.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A thermally insulating electrical contact probe including a mounting plate having a tubular pin guide defining a pin pass-through, a cover coupled to the mounting plate and having a neck portion enclosing the pin guide, and an insulating pin having a shank portion disposed within the pin pass-through and defining a conductor pass-through, a flange portion extending radially outwardly from the shank portion above a top of the pin guide, and a pocket portion extending from the flange portion and defining a pocket. The electrical contact probe may further include a spring disposed intermediate the flange portion and the mounting plate, the spring biasing the flange portion away from the mounting plate, an electrical contact pad disposed within the pocket, and an electrical conductor coupled to the electrical contact pad and extending through the conductor pass-through.

Description

THERMALLY INSULATING ELECTRICAL CONTACT PROBE
Field of the Disclosure
[0001] Embodiments of the present disclosure relate to the field of electrical connection devices, and more particularly to a thermally insulating electrical contact probe.
Background of the Disclosure
[0002] Ion implantation is a technique for introducing conductivity -altering impurities into a substrate such as a wafer or other workpiece. A desired impurity material is ionized in an ion source of an ion beam implanter, the ions are accelerated to form an ion beam of prescribed energy, and the ion beam is directed at the surface of the substrate. The energetic ions in the ion beam penetrate into the bulk of the substrate material and are embedded into the crystalline lattice of the material to form a region of desired conductivity.
[0003] In some ion implant processes, a desired doping profile is achieved by implanting ions into a target substrate at high temperatures. Heating a substrate can be achieved by supporting the substrate on a heated platen during an ion implant process. A conventional heated platen may be connected to an electrical power source via a plurality of electrical contact probes. Additional electrical contact probes may be connected to the heated the platen for enabling electrostatic clamping of a substrate. [0004] During operation, the various electrical contact probes connected to a heated platen may absorb heat from the heated platen and may reduce the temperature of the heated platen in localized areas adjacent to the electrical contact probes. As will be appreciated, any temperature variations in the material of the heated platen may affect the uniformity of heat transferred to a target substrate supported and heated by the heated platen, potentially having an adverse effect on an ion implant process. In some instances, temperature variations in a heated platen can cause the heated platen to warp, bow, or even crack.
[0005] In view of the foregoing, there is a need to mitigate heat losses via electrical connections in heated platens in order to achieve uniform platen temperatures.
Summary
[0006] This Summary is provided to introduce a selection of concepts in a simplified form. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended as an aid in determining the scope of the claimed subject matter.
[0007] An exemplary embodiment of a thermally insulating electrical contact probe for providing an electrical connection to a heated platen in accordance with the present disclosure may include a mounting plate having a tubular pin guide defining a pin pass-through, a cover coupled to the mounting plate and having a neck portion enclosing the pin guide, and an insulating pin having a shank portion disposed within the pin pass-through and defining a conductor pass-through, a flange portion extending radially outwardly from the shank portion above a top of the pin guide, and a pocket portion extending from the flange portion and defining a pocket. The electrical contact probe may further include a spring disposed intermediate the flange portion and the mounting plate, the spring biasing the flange portion away from the mounting plate, an electrical contact pad disposed within the pocket, and an electrical conductor coupled to the electrical contact pad and extending through the conductor pass-through.
[0008] Another exemplary embodiment of a thermally insulating electrical contact probe for providing an electrical connection to a heated platen in accordance with the present disclosure may include a mounting plate having a tubular pin guide defining a pin pass-through, a cover coupled to the mounting plate and having a neck portion enclosing the pin guide, a mounting boss extending from the mounting plate and through a through-hole in the cover, a first insulating washer disposed on a top surface of the mounting plate and having a flange extending into a radial gap intermediate the mounting boss and the cover, a second insulating washer disposed on a top surface of the cover and having a flange extending into the radial gap intermediate the mounting boss and the cover, and an insulating pin having a shank portion disposed within the pin pass-through and defining a conductor pass-through, a flange portion extending radially outwardly from the shank portion above a top of the pin guide, and a pocket portion extending from the flange portion and defining a pocket. The electrical contact probe may further include a coil spring surrounding the pin guide and disposed intermediate the flange portion and the mounting plate, the spring biasing the flange portion away from the mounting plate, an electrical contact pad disposed within the pocket, and an electrical conductor coupled to the electrical contact pad and extending through the conductor pass-through.
[0009] An exemplary embodiment of a heated platen assembly in accordance with the present disclosure may include a heated platen, a base coupled to the heated platen, a heat shield disposed intermediate, and coupled to, the heated platen and the base, an electrical contact probe coupled to the base and extending through the base and the heat shield, the electrical contact probe including a mounting plate having a tubular pin guide defining a pin pass-through, a cover coupled to the mounting plate and having a neck portion enclosing the pin guide, and an insulating pin having a shank portion disposed within the pin pass-through and defining a conductor pass- through, a flange portion extending radially outwardly from the shank portion above a top of the pin guide, and a pocket portion extending from the flange portion and defining a pocket. The heated platen assembly may further include an electrical contact pad disposed within the pocket, an electrical conductor coupled to the electrical contact pad and extending through the conductor pass-through, and a spring disposed intermediate the flange portion and the mounting plate, the spring biasing the flange portion away from the mounting plate and holding the electrical contact pad in engagement with a metallization layer on a backside of the heated platen.
Brief Description of the Drawings
[0010] By way of example, various embodiments of the disclosed apparatus will now be described, with reference to the accompanying drawings, wherein: [0011] FIG. la is perspective view illustrating an exemplary embodiment of a thermally insulating electrical contact probe in accordance with the present disclosure;
[0012] FIG. lb is cross-sectional view illustrating the thermally insulating electrical contact probe shown in FIG. la taken along plane A-A;
[0013] FIG. 2 is cross-sectional view illustrating an exemplary embodiment of a heated platen assembly in accordance with the present disclosure including the thermally insulating electrical contact probe shown in FIGS, la and lb.
[0014] FIG. 3 is bottom perspective view illustrating an exemplary embodiment of a heated platen assembly in accordance with the present disclosure
Detailed Description
[0015] Referring to FIGS, la and lb, an exemplary embodiment of a thermally-insulating electrical contact probe 10 (hereinafter "the probe 10") in accordance with the present disclosure is shown. The probe 10 may be provided for establishing an electrical connection between an electrical power source and a heated platen of an ion implanter, such as for heating the platen or for facilitating electrostatic clamping of a substrate disposed on the heated platen. During operation, the probe 10 may be operable to minimize an amount of heat absorbed from the heated platen to mitigate temperature variations across the heated platen. As will be appreciated, the probe 10 may be implemented in a heated platen used to support a substrate during processing thereof. For example, the heated platen may be used to support a substrate during an ion implant process, a plasma deposition process, an etching process, a chemical-mechanical planarization process, or generally any process where a semiconductor substrate is to be supported on a heated platen. As such, an exemplary heated platen assembly is described below. The embodiments of the present disclosure are not limited by the exemplary heated platen assembly described herein and may find application in any of a variety of other platen applications used in a variety of semiconductor manufacturing processes.
[0016] The probe 10 may generally include a mounting plate 12, a cover 14, an insulating pin 16, a coil spring 18 (FIG. lb), an electrical contact pad 20, and an electrical conductor 22. For the sake of convenience and clarity, terms such as "top," "bottom," "upper," "lower," "vertical," "horizontal," "lateral," "longitudinal," "radial," "inner," and "outer" may be used herein to describe the relative placement and orientation of the components of the probe 10 with respect to the geometry and orientation of the probe 10 as it appears in FIGS, la and lb. Said terminology will include the words specifically mentioned, derivatives thereof, and words of similar import.
[0017] The mounting plate 12 of the probe 10 may include a generally planer base portion 24 having a pair of tubular mounting bosses 26a, 26b extending from a top surface thereof. The mounting bosses 26a, 26b may define respective fastener pass-throughs 28a, 28b extending through the mounting plate 12 for accepting corresponding mechanical fasteners as further described below. The base portion 26 may further have a tubular pin guide 30 (FIG. lb) extending from a top surface thereof intermediate the mounting bosses 26a, 26b. The pin guide 30 may define a pin pass-through 32 extending through the mounting plate 12 for accepting the insulating pin 16 and the electrical conductor 22 as further described below. The mounting plate 12 may be formed of a high-temperature capable, thermally and electrically insulating material, such as Zirconia, Alumina, various thermoplastics, etc.
[0018] Referring to FIG. lb, the insulating pin 16 may be a generally tubular member having a pocket portion 34 defining a pocket 36, a shank portion 38 extending from a bottom of the pocket portion 34 and defining a conductor pass- through 40 extending from a bottom of the pocket 36, and a flange portion 42 extending radially-outwardly from a top of the shank portion 38. The conductor pass- through 40 may be coaxial with, and may have a smaller diameter than, the pocket 36. The insulating pin 16 may be formed of a high-temperature capable, thermally and electrically insulating material, such as Zirconia, Alumina, various thermoplastics, etc.
[0019] The spring 18 may be a coil spring formed of a high-temperature capable metal. The spring 18 may surround and may extend above the pin guide 30, and may be seated within an annular trench 44 in the mounting plate 12 for preventing excessive horizontal movement of the spring 18 relative to the mounting plate 12. The flange portion 42 of the insulating pin 16 may be seated on top of the spring 18, and the shank portion 38 of the insulating pin 16 may extend down through the pin pass-through 32 of the pin guide 30 and may protrude from the bottom of the mounting plate 12. An outer diameter of the shank portion 38 may be smaller (e.g., at least 0.0015 inches smaller) than the diameter of the pin pass-through 32 to establish a free-running, locational clearance fit between the shank portion 38 and the pin guide 30. Thus, the shank portion 38 may freely move vertically within the pin pass- through 32, and may also shift or tilt horizontally within the pin pass-through 32 as further described below.
[0020] The cover 14 of the probe 10 may be formed of a low-emissivity material, such as aluminum or nickel. The cover 14 may be disposed on top of the mounting plate 12 and may include a generally planar base portion 46 and a generally tubular neck portion 48 extending from a top surface of the base portion 46. The neck portion 48 may define an internal chamber 50 housing the pin guide 30, the insulating pin 16, and the spring 18. An annular flange 52 may extend radially inwardly from a top of the neck portion 48 and may define an aperture 54 having a diameter greater than the outer diameter of the pocket portion 34 of the insulating pin 16 and smaller than the outer diameter of the flange portion 42 of the insulating pin 16.
[0021] The base portion 46 of the cover 14 may include a pair of through- holes 56a, 56b for receiving the mounting bosses 26a, 26b of the mounting plate 12 therethrough, respectively. A first pair of lower insulating washers 58a, 58b may be seated on top of the base portion 24 of the mounting plate 12 surrounding the mounting bosses 26a, 26b, respectively, and may have respective flanged portions 60a, 60b extending into radial gaps 62a, 62b intermediate the mounting bosses 26a, 26b and the cover, respectively. Similarly, a second pair of upper insulating washers 64a, 64b may be seated on top of the base portion 46 of the cover 14 surrounding the mounting bosses 26a, 26b, respectively, and may have respective flanged portions 66a, 66b extending into the radial gaps 62a, 62b, respectively. A pair of retaining rings 70a, 70b may be removably disposed within respective grooves 72a, 72b in the outer surfaces of mounting bosses 26a, 26b above the upper insulating washers 64a, 64b, thus securing the upper insulating washers 64a, 64b, the base portion 46 of the cover 14, and the lower insulating washers 58a, 58b against the base portion 24 of the mounting plate 12 in a vertically stacked arrangement. The lower insulating washers 58a, 58b and the upper insulating washers 64a, 64b may be formed of a low thermal conductivity material, such as Alumina, Zirconia, various thermoplastics, etc., for mitigating conductive heat transfer between the cover 14 and the mounting plate 12 as further described below.
[0022] The electrical contact pad 20 may be made from a thermally durable, electrically conducting material, such as nickel, and may be soldered or brazed to the electrical conductor 22. The electrical contact pad 20 may be disposed within the pocket 36 of the pocket portion 34 of the insulating pin 16, and the electrical conductor 22 may extend through the conductor pass-through 40 of the shank portion 38 of the insulating pin 16 and may be coupled to an electrical power source (not shown). The electrical contact pad 20 may have a diameter greater (e.g., at least 0.010 inches greater) than the diameter of the conductor pass-through 40 and smaller (e.g., at least 0.010 inches smaller) than the diameter of the pocket 36. Thus, the electrical contact pad 20 may rest on an annular shoulder 74 defined at the juncture of the pocket 36 and the conductor pass-through 40, with the shoulder 74 acting as a lower travel stop for retaining the electrical contact pad 20 within the pocket 36.
[0023] FIG. 2 is a cross-sectional view illustrating an embodiment of the probe 10 installed in an exemplary heated platen assembly 80. The heated platen assembly 80 may include a heated platen 82, a metallization layer 83, a heat shield 84, and a base 86 coupled together in a vertically-spaced, stacked relationship, in any of a variety of known manners.
[0024] The metallization layer 83 may include a plurality of metallic traces printed on or otherwise applied to the underside or backside of the heated platen 82 and covered with a layer of glass or other electrically insulating material. When an electric current is applied to the metallization layer 83, the metallization layer 83 may convert an amount of the electrical energy into heat. This heat may be conducted through the heated platen 82, thus heating a substrate disposed thereon.
[0025] The heat shield 84 may function to reduce an amount of heat transferred from the heated platen 82 to the relatively cold base 86. The heat shield 84 may thus be configured to reflect heat back toward the heated platen 82, away from the base 86.
[0026] The heated platen 82 may be formed of a thermally durable material, including a ceramic material such as alumina, aluminum nitride, boron nitride or a similar dielectric ceramic. The heat shield 84 may be formed of a thermally -reflective material, such as aluminum, stainless steel, titanium, or other low emissivity metal. The base 86 may be formed of any suitably rigid and durable material and may be part of, or may be coupled to, a scanning mechanism (not shown) capable of orienting the platen 82 at various angular and/or rotational positions during processing operations.
[0027] The probe 10 may be disposed within a complementary recess 88 in a bottom of the base 86 and may be removably fastened to the base 86 by a pair of mechanical fasteners 90a, 90b (e.g., screws or bolts) extending through the fastener pass-throughs 28a, 28b in the mounting bosses 26a, 26b, respectively. The neck portion 48 of the cover 14 may extend upwardly through respective apertures 92a, 92b in the base 86 and the heat shield 84.
[0028] The spring 18 of the probe 10 may be held in compression between the mounting plate 12 and the flange portion 42 of the insulating pin 16, and may thus urge the insulating pin 16 upwardly, away from the mounting plate 12. The insulating pin 16, and particularly the shoulder 74 in the pocket portion 34 of the insulating pin 16, may in-turn urge the electrical contact pad 20 upwardly against the metallization layer 83. Thus, the spring 18 may allow the electrical contact pad 20 and the insulating pin 16 to be displaced vertically, such as may occur when a substrate is loaded onto, or removed from, the support surface 85 of the heated platen 82, while holding the electrical contact pad 20 in firm engagement with the metallization layer 83 to maintain a desired electrical connection between the electrical conductor 22 and the metallization layer 83. The flange 52 of the neck portion 48 of the cover 14 may act as an upper travel stop for limiting upward movement of the insulating pin 16, and the pin guide 30 of the mounting plate 12 may act as a lower travel stop for limiting downward movement of the insulating pin 16.
[0029] During operation of the platen assembly 80, electrical current may be applied to the metallization layer 83 via the electrical conductor 22 and the electrical contact pad 20. The electrical current may be provided for heating the heated platen 82 in the above-described manner, and/or for generating an electrostatic force for clamping a substrate to the support surface 85 of the heated platen 82. In either case, an amount of heat may be transferred from the heated platen 82 to the relatively cold base 86 via conductive and/or radiative heat transfer (convective heat transfer is generally prevented since the platen assembly 80 may be located in a processing environment held at vacuum). Significant heat transfer from the heated platen 82 to the base 86 is generally undesirable since such heat transfer may create temperature variations in the heated platen 82. As will be appreciated, any temperature variations in the material of the heated platen 82 may affect the uniformity of heat transferred to a target substrate supported by the heated platen 82, adversely affecting an ion 82 may cause the heated platen 82 to warp, bow, or even crack.
[0030] The above-described structural features and configuration of the probe 10 may cooperate to mitigate heat transfer from the heated platen 82 to the relatively cold base 86, improving temperature uniformity in the heated platen 82. For example, the portion of the probe 10 in direct contact with the metallization layer 83 is merely the electrical contact pad 20, and the electrical contact pad 20 and the attached electrical conductor 22 are thermally insulated from the rest of the probe 10 by the insulating pin 16. This limited contact between the probe 10 and the metallization layer 83 may restrict conductive heat transfer from the heated platen 82 to the base 86 via the probe 10. Furthermore, since the diameter of the pocket 36 of the pocket portion 34 of the insulating pin 16 is larger than the diameter of the electrical contact pad 20, the bottom surface 90 of the electrical contact pad 20 is in contact with the insulating pin 16, with the sidewall 91 of the electrical contact pad 20 being radially spaced apart from the insulating pin 16. This limited contact between the electrical contact pad 20 and the insulating pin 16 may further restrict conductive heat transfer from the heated platen 82 to the base 86 via the probe 10. Still further, the above-described free-running fit between the shank portion 38 of the insulating pin 16 and the pin guide 30 results in minimal physical contact between the shank portion 38 and the pin guide 30. This may further restrict conductive heat transfer from the heated platen 82 to the base 86 via the probe 10. Still further, the lower insulating washers 58a, 58b and the upper insulating washers 64a, 64b, being formed of a low thermal conductivity material and entirely separating the cover 14 from the mounting plate 12, may restrict conductive transfer from the cover 14 to the mounting plate 12. This may further restrict conductive heat transfer from the heated platen 82 to the base 86 via the probe 10. Still further, the cover 14, being formed of a low- emissivity material, may act as a radiation shield between the heated platen 82 and the underlying components of the probe 10. This may restrict radiative heat transfer from the heated platen 82 to probe 10, in-tum mitigating conductive heat transfer from the probe 10 to the base 86.
[0031] In addition to mitigating heat transfer from the heated platen 82 to the relatively cold base 86, the above-described structural features and configuration of the probe 10 may cooperate to allow thermal expansion and contraction of the heated platen 82 relative to the base 86 while maintaining a desired electrical connection with the heated platen 82. For example, since the diameter of the pocket 36 of the pocket portion 34 of the insulating pin 16 is larger than the diameter of the electrical contact pad 20, the electrical contact pad 20 may be allowed to move horizontally within the pocket 36 when the heated platen 82 expands and contracts while maintaining the physical connection between the electrical contact pad 20 and the heated platen 82. Furthermore, since the outer diameter of the shank portion 38 of the insulating pin 16 is smaller than the diameter of the pin pass-through 32 in the pin guide 30, the insulating pin 16 may be allowed to tilt or rock horizontally within the pin guide 30 when the heated platen 82 expands and contracts while holding the electrical contact pad 20 in firm engagement with the heated platen 82.
[0032] In further embodiments, a plurality of electrical contact probes similar to the probe 10 described above may be implemented in a platen assembly in various configurations and arrangements to provide electrical connections for heating a platen, for enabling electrostatic clamping of substrates, and/or for facilitating various other features of a platen assembly requiring electrical power. For example, referring to the bottom perspective view of the platen assembly 94 shown in FIG. 3, a first plurality of electrical contact probes Ι Οι-β similar to the probe 10 described above may be installed in a base 96 of the platen assembly 94 for enabling electrostatic clamping of substrates to a heated platen 98 of the platen assembly 94. A second plurality of electrical contact probes IO7-10 similar to the probe 10 described above may be installed in the base 96 for heating the heated platen 98.
[0033] Thus, the above-described exemplary probe 10 may provide numerous advantages relative to conventional electrical contact probes commonly employed in platen assemblies for providing electrical connections to heated platens. For example, the probe 10 may greatly mitigate an amount of heat transferred from a heated platen to a relatively cold base of a heated platen assembly. This may improve temperature uniformity in a heated platen, thus improving the reliability of ion implant processes and reducing the likelihood of catastrophic platen failure. Additionally, the probe 10 may allow thermal expansion and contraction of a heated platen relative to a base of a heated platen assembly while maintaining a desired electrical connection to the heated platen. Still further, the probe 10 may operate effectively, and may confer all of the above-described advantages, within a vacuum environment of a heated platen assembly.
[0034] The present disclosure is not to be limited in scope by the specific embodiments described herein. Indeed, other various embodiments of and modifications to the present disclosure, in addition to those described herein, will be apparent to those of ordinary skill in the art from the foregoing description and accompanying drawings. Thus, such other embodiments and modifications are intended to fall within the scope of the present disclosure. Furthermore, while the present disclosure has been described herein in the context of a particular implementation in a particular environment for a particular purpose, those of ordinary skill in the art will recognize its usefulness is not limited thereto. Embodiments of the present disclosure may be beneficially implemented in any number of environments for any number of purposes. Accordingly, the claims set forth below must be construed in view of the full breadth and spirit of the present disclosure as described herein.

Claims

Claims
1. A thermally insulating electrical contact probe comprising:
a mounting plate having a tubular pin guide defining a pin pass- through;
a cover coupled to the mounting plate and having a neck portion enclosing the pin guide;
an insulating pin having a shank portion disposed within the pin pass- through and defining a conductor pass-through, a flange portion extending radially outwardly from the shank portion above a top of the pin guide, and a pocket portion extending from the flange portion and defining a pocket;
a spring disposed intermediate the flange portion and the mounting plate, the spring biasing the flange portion away from the mounting plate;
an electrical contact pad disposed within the pocket; and
an electrical conductor coupled to the electrical contact pad and extending through the conductor pass-through.
2. The thermally insulating electrical contact probe of claim 1, further comprising at least one thermally insulating washer disposed intermediate, and separating, the cover and the mounting plate.
3. The thermally insulating electrical contact probe of claim 1, further comprising a mounting boss extending from the mounting plate and through a through-hole in the cover.
4. The thermally insulating electrical contact probe of claim 3, further comprising a thermally insulating washer disposed on a top surface of the mounting plate and having a flange extending into a radial gap intermediate the mounting boss and the cover.
5. The thermally insulating electrical contact probe of claim 3, further comprising a thermally insulating washer disposed on a top surface of the cover and having a flange extending into a radial gap intermediate the mounting boss and the cover.
6. The thermally insulating electrical contact probe of claim 1 , wherein a diameter of the pocket is at least 0.010 inches greater than a diameter of the electrical contact pad to allow the electrical contact pad to move horizontally within the pocket.
7. The thermally insulating electrical contact probe of claim 1 , wherein a diameter of the pin pass-through is at least 0.0015 inches greater than a diameter of the shank portion of the insulating pin to establish a free-running fit between the shank portion and the pin guide and to allow the shank portion to tilt within the pin pass-through.
8. The thermally insulating electrical contact probe of claim 1 , wherein an annular shoulder is defined at a juncture of the pocket and the conductor pass-through, the shoulder providing a travel stop for limiting movement of the electrical contact pad.
9. A heated platen assembly comprising:
a heated platen;
a base coupled to the heated platen;
a heat shield disposed intermediate, and coupled to, the heated platen and the base;
an electrical contact probe coupled to the base and extending through the base and the heat shield, the electrical contact probe comprising:
a mounting plate having a tubular pin guide defining a pin pass- through;
a cover coupled to the mounting plate and having a neck portion enclosing the pin guide;
an insulating pin having a shank portion disposed within the pin pass- through and defining a conductor pass-through, a flange portion extending radially outwardly from the shank portion above a top of the pin guide, and a pocket portion extending from the flange portion and defining a pocket;
an electrical contact pad disposed within the pocket;
an electrical conductor coupled to the electrical contact pad and extending through the conductor pass-through; and
a spring disposed intermediate the flange portion and the mounting plate, the spring biasing the flange portion away from the mounting plate and holding the electrical contact pad in engagement with a metallization layer on a backside of the heated platen.
10. The thermally insulating electrical contact probe of claim 9, further comprising a mounting boss extending from the mounting plate and through a through-hole in the cover.
11. The thermally insulating electrical contact probe of claim 10, further comprising a thermally insulating washer disposed on a top surface of the mounting plate and having a flange extending into a radial gap intermediate the mounting boss and the cover.
12. The thermally insulating electrical contact probe of claim 10, further comprising a thermally insulating washer disposed on a top surface of the cover and having a flange extending into a radial gap intermediate the mounting boss and the cover.
13. The thermally insulating electrical contact probe of claim 9, wherein a diameter of the pocket is at least 0.010 inches greater than a diameter of the electrical contact pad to allow the electrical contact pad to move horizontally within the pocket.
14. The thermally insulating electrical contact probe of claim 9, wherein a diameter of the pin pass-through is at least 0.0015 inches greater than a diameter of the shank portion of the insulating pin to establish a free-running fit between the shank portion and the pin guide and to allow the shank portion to tilt within the pin pass-through.
15. The thermally insulating electrical contact probe of claim 9, wherein an annular shoulder is defined at ajuncture of the pocket and the conductor pass-through, the shoulder providing a travel stop for limiting movement of the electrical contact pad.
PCT/US2016/028085 2015-04-21 2016-04-18 Thermally insulating electrical contact probe Ceased WO2016172036A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201680023023.1A CN107535018B (en) 2015-04-21 2016-04-18 Thermally isolated electrical contact probe and heated platen assembly
JP2017554466A JP6685577B2 (en) 2015-04-21 2016-04-18 Thermally isolated electrical contact probe and heated platen assembly
KR1020177033351A KR102562059B1 (en) 2015-04-21 2016-04-18 Thermally insulated electrical contact probe and heated platen assembly
KR1020237025854A KR102600377B1 (en) 2015-04-21 2016-04-18 Thermally insulating electrical contact probe and heated platen assembly
CN202010472258.7A CN111586904B (en) 2015-04-21 2016-04-18 Thermally isolated electrical contact probe and heated platen assembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/692,031 US9887478B2 (en) 2015-04-21 2015-04-21 Thermally insulating electrical contact probe
US14/692,031 2015-04-21

Publications (1)

Publication Number Publication Date
WO2016172036A1 true WO2016172036A1 (en) 2016-10-27

Family

ID=57144172

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2016/028085 Ceased WO2016172036A1 (en) 2015-04-21 2016-04-18 Thermally insulating electrical contact probe

Country Status (6)

Country Link
US (2) US9887478B2 (en)
JP (2) JP6685577B2 (en)
KR (2) KR102562059B1 (en)
CN (2) CN107535018B (en)
TW (2) TWI671528B (en)
WO (1) WO2016172036A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019138768A (en) * 2018-02-09 2019-08-22 株式会社村田製作所 probe

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9887478B2 (en) * 2015-04-21 2018-02-06 Varian Semiconductor Equipment Associates, Inc. Thermally insulating electrical contact probe
US10141670B1 (en) * 2017-08-21 2018-11-27 Lam Research Corporation Substrate connector including a spring pin assembly for electrostatic chucks
KR101926502B1 (en) * 2018-03-27 2018-12-07 주식회사 기가레인 board mating connector including PIMD enhanced signal contact part
CN209090065U (en) * 2018-09-30 2019-07-12 深圳市艾维普思科技有限公司 The mounting structure and electronic cigarette of the conductive contact piece of electronic cigarette
TWI736145B (en) * 2020-02-25 2021-08-11 利亙通國際有限公司 Pogo pin interface applied to automatic test system
JP7243860B2 (en) * 2020-07-14 2023-03-22 株式会社村田製作所 Inspection probe device and connector inspection method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006078585A2 (en) * 2005-01-18 2006-07-27 Asm America, Inc. Wafer support pin assembly
US20090295388A1 (en) * 2008-05-30 2009-12-03 Xiao Zhang Hybrid automatic tuning/matching for nmr probes
US20130101241A1 (en) * 2011-10-20 2013-04-25 Applied Materials, Inc. Substrate support bushing
WO2014143505A1 (en) * 2013-03-11 2014-09-18 Applied Materials, Inc. Susceptor support shaft for improved wafer temperature uniformity and process repeatability
US20140332161A1 (en) * 2004-12-30 2014-11-13 Lam Research Corporation Apparatus for spatial and temporal control of temperature on a substrate

Family Cites Families (182)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2043777A (en) * 1933-05-26 1936-06-09 Chicago Telephone Supply Co Rheostat
US2284132A (en) * 1938-08-25 1942-05-26 Electrical Products Company Electric ironing device
US2337457A (en) * 1942-01-08 1943-12-21 Dzus William Fastening device
US2716173A (en) * 1951-01-12 1955-08-23 Gen Mills Inc Electric switches
US2742543A (en) * 1951-07-07 1956-04-17 Clifford W Hurd Electrical contacting device
US2765421A (en) * 1952-02-08 1956-10-02 Bell Telephone Labor Inc Electron discharge devices
US2713173A (en) 1953-03-31 1955-07-19 Walter O Runcie Flush valve
US2723340A (en) * 1953-04-20 1955-11-08 Wiegand Co Edwin L Corrosion resistant immersion heater
US2923785A (en) * 1954-01-21 1960-02-02 Ernst A Longenecker Engine distributor and method of adjustment thereof
US2997682A (en) * 1956-08-16 1961-08-22 David D Grimes Connector
US2946905A (en) * 1958-02-13 1960-07-26 Nutone Inc Single coil repeater solenoid
US3059168A (en) * 1959-12-07 1962-10-16 Gen Motors Corp Brushless generator rectifier assembly
US3056879A (en) * 1960-03-24 1962-10-02 Thermo Craft Electric Corp Electric heating element for water tanks and method
US3108172A (en) * 1961-03-06 1963-10-22 Edwards Jones Burnett Electric cigarette lighter and process
US3109997A (en) * 1961-07-10 1963-11-05 Bell Telephone Labor Inc Double circuit coaxial jack with automatic cross-connection upon plug removal and automatic termination of idle line upon plug insertion
US3247344A (en) * 1962-06-26 1966-04-19 Bristol Company Subminiature polarized electrically actuated contactor
US3223960A (en) * 1962-12-07 1965-12-14 Elco Corp Contact with wave shaped tail sections
US3345561A (en) * 1963-09-26 1967-10-03 Sperry Rand Corp Mount for supporting dual bolometers at same temperature
US3295092A (en) * 1964-01-31 1966-12-27 Products Inc Comp Coaxial patchbay system for electronic computers
US3341851A (en) * 1965-08-11 1967-09-12 Royston Deceleration recorder and/or signaler
US3387116A (en) * 1965-10-08 1968-06-04 Contiental Can Company Inc Contacts for vaporizers employed in vacuum metallizing
NL140373C (en) * 1966-07-25
US3416125A (en) * 1966-10-20 1968-12-10 Ostby & Barton Co Co-axial connector
US3764871A (en) 1971-05-27 1973-10-09 Design & Mfg Corp Starting circuit for induction motor
NL154368B (en) * 1971-05-28 1977-08-15 Amp Inc ELECTRICAL CONNECTION DEVICE WITH A PLATE-SHAPED CONTACTOR THAT IS DETACHABLE, RESILIENTLY HELD IN A THROUGH OPENING.
US3733568A (en) * 1971-09-30 1973-05-15 Essex Push button relay
US3835296A (en) * 1972-01-27 1974-09-10 Dravo Corp Improvement in industrial electric resistance heater
US3889133A (en) * 1972-03-16 1975-06-10 Matsushita Electric Industrial Co Ltd Output-voltage variable device
US3932711A (en) * 1973-09-13 1976-01-13 O'brien Gerard J Transmission of voice or sound through telegraphy
US4058701A (en) * 1974-05-14 1977-11-15 Schoeller & Co. Elektrotechnische Fabrik Gmbh & Co. Glow element arrangement for electric cigarette lighters
US4032775A (en) * 1974-08-12 1977-06-28 Emerson Electric Co. Illumination system
US4022594A (en) * 1975-05-02 1977-05-10 Baysek Edward L Electrostatic precipitator
US4017714A (en) * 1975-08-04 1977-04-12 Electro-Therm, Inc. Segmented sacrificial anode attachment to water heating element
US4097919A (en) * 1975-10-24 1978-06-27 Emerson Electric Co. Illumination system
US4178495A (en) * 1976-01-12 1979-12-11 Trw, Inc. Apparatus for welding studs to workpieces
US4238788A (en) * 1978-01-03 1980-12-09 Teledyne Industries, Inc. System for detecting a combustion process
US4145107A (en) * 1978-01-09 1979-03-20 Abbott/Interfast Corporation Terminal assembly with captive self-emergent screw post
US4211625A (en) * 1978-09-11 1980-07-08 Borg-Warner Corporation Impressed current cathodic protection system for submersible downhole pumping assembly
US4313792A (en) * 1979-06-13 1982-02-02 Scandpower, Inc. Miniature gamma thermometer slideable through bore for measuring linear heat generation rate
EP0034312B1 (en) * 1980-02-14 1985-01-16 Aeroquip GmbH Quick-connection coupling also connectable under pressure
US4323871A (en) * 1980-03-21 1982-04-06 A. B. Chance Company Circuit protecting apparatus including resettable vacuum fuse and switch
US4359764A (en) * 1980-04-08 1982-11-16 Block Roger R Connector for electromagnetic impulse suppression
CH645730A5 (en) * 1982-01-08 1984-10-15 Technobal Sa TEST CONTACT FOR TESTING PRINTED CIRCUITS, AND REMOVABLE CONTACT HEAD FOR SUCH A TEST CONTACT.
US4518477A (en) * 1982-02-03 1985-05-21 Orbisphere Corporation Wilmington Thermal protection for electroanalytical cell and amperometric probe
US4434449A (en) * 1982-05-28 1984-02-28 Bell Telephone Laboratories, Incorporated Protector unit for telecommunications circuits
JPS5946213U (en) * 1982-09-20 1984-03-27 三洋電機株式会社 heating melting equipment
US4528439A (en) * 1982-10-29 1985-07-09 Standard Oil Company Portable thermally insulated case
US4513347A (en) * 1983-07-28 1985-04-23 Herman Miller, Inc. Static protective chair
US4488209A (en) * 1983-08-29 1984-12-11 Federal Signal Corporation Portable lighting apparatus
US4568804A (en) * 1983-09-06 1986-02-04 Joslyn Mfg. And Supply Co. High voltage vacuum type circuit interrupter
US4513214A (en) * 1983-10-03 1985-04-23 Allied Corporation Dynamoelectric machine
US4575694A (en) * 1984-03-05 1986-03-11 Allied Corporation Coaxial connector
US4897043A (en) * 1986-06-23 1990-01-30 Feinmetall Gmbh Resilient contact pin
US4734051A (en) * 1987-02-02 1988-03-29 G & H Technology, Inc. Electrical connector butt contact
US4848616A (en) * 1987-02-05 1989-07-18 Rheem Manufacturing Company Electric immersion heating unit with readily removable and replaceable galvanic current control resistor
US4935696A (en) * 1987-04-16 1990-06-19 Teradyne, Inc. Test pin assembly for circuit board tester
EP0294696A3 (en) * 1987-06-10 1989-04-26 Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung Spring loaded contact pin
WO1989012918A1 (en) * 1988-06-20 1989-12-28 Gte Rotaflex Limited Electric current distribution apparatus
US4904935A (en) * 1988-11-14 1990-02-27 Eaton Corporation Electrical circuit board text fixture having movable platens
US4904213A (en) * 1989-04-06 1990-02-27 Motorola, Inc. Low impedance electric connector
US5009613A (en) * 1990-05-01 1991-04-23 Interconnect Devices, Inc. Spring contact twister probe for testing electrical printed circuit boards
JPH0425766A (en) * 1990-05-21 1992-01-29 Matsushita Electric Ind Co Ltd Free terminal
US5149282A (en) * 1990-08-30 1992-09-22 Lightolier Division Of The Genlyte Group, Inc. Modular stem system for lighting applications
US5387138A (en) * 1991-07-09 1995-02-07 Texas Instruments Incorporated Printed circuit connector apparatus and method for making same
US5167520A (en) * 1991-10-18 1992-12-01 Amp Incorporated Cup fit plug connector
US5290980A (en) * 1992-07-08 1994-03-01 Indak Manufacturing Corp. Rotary vacuum-electric switch
US5548164A (en) * 1992-10-07 1996-08-20 Hillard; John N. Automotive adaptable security module for a starter solenoid
US5335311A (en) * 1993-01-19 1994-08-02 Glengarry Industries Ltd. Modular galvanic current control resistor assembly for mounting on an electric immersion heater
US5495389A (en) * 1993-10-08 1996-02-27 International Business Machines Corporation Personal computer with configurational flexibility and service features
US5936421A (en) * 1994-10-11 1999-08-10 Virginia Panel Corporation Coaxial double-headed spring contact probe assembly and coaxial surface contact for engagement therewith
FR2726858A1 (en) * 1994-11-14 1996-05-15 Schlumberger Services Petrol TEST ROD SHUTTERING APPARATUS FOR TUBE UNDERWATER OIL WELL
US5557213A (en) * 1994-12-01 1996-09-17 Everett Charles Technologies, Inc. Spring-loaded electrical contact probe
JP2648120B2 (en) * 1995-02-08 1997-08-27 山一電機株式会社 Surface contact type connector
DE19507127A1 (en) * 1995-03-01 1996-09-12 Test Plus Electronic Gmbh Adapter system for component boards, to be used in a test facility
US6153859A (en) * 1995-07-31 2000-11-28 Strix Limited Liquid heating vessels
US5628644A (en) * 1995-09-08 1997-05-13 Packard Hughes Interconnect Company Negligible insert force power connector
US5641315A (en) * 1995-11-16 1997-06-24 Everett Charles Technologies, Inc. Telescoping spring probe
CA2241245A1 (en) * 1996-01-05 1997-07-17 Tdk Corporation Of America Clinch assembly lift mechanism
GB9608840D0 (en) * 1996-04-30 1996-07-03 Tronic Ltd Hose and adaptor
CH693478A5 (en) * 1996-05-10 2003-08-15 E Tec Ag Contact socket for detachable connection of IC to PCB
JP3064906B2 (en) * 1996-06-12 2000-07-12 株式会社村田製作所 Coaxial connector
US5749754A (en) * 1996-07-19 1998-05-12 Ericsson, Inc. Radiotelephone having a combination fastener and electrical connector
US5804984A (en) * 1996-08-02 1998-09-08 International Business Machines Corporation Electronic component test apparatus with rotational probe
US5936581A (en) * 1997-03-03 1999-08-10 Motorola, Inc. Radio frequency switch assembly
US5899753A (en) * 1997-04-03 1999-05-04 Raytheon Company Spring-loaded ball contact connector
US5980266A (en) * 1997-05-02 1999-11-09 Hsu; Shih-Min Conductive strap device for providing dual electrical paths
HUP0003296A3 (en) * 1997-07-22 2001-09-28 Qiagen Genomics Inc Bothell Apparatus and methods for arraying solution onto a solid support
US6271672B1 (en) * 1997-11-17 2001-08-07 Delaware Capital Formation, Inc. Biased BGA contactor probe tip
US6224407B1 (en) * 1997-12-17 2001-05-01 The Whitaker Corporation Coaxial switch connector assembly
US6328096B1 (en) * 1997-12-31 2001-12-11 Temptronic Corporation Workpiece chuck
US6019164A (en) * 1997-12-31 2000-02-01 Temptronic Corporation Workpiece chuck
US6222377B1 (en) * 1998-01-13 2001-04-24 Masatoshi Kato Circuit board probe device
US6208158B1 (en) * 1998-06-03 2001-03-27 Schein Research, Inc. Zero static force assembly for wireless test fixtures
US6071144A (en) * 1998-09-09 2000-06-06 Tang; Danny Q. Hermetically sealed F-connector
US6205160B1 (en) * 1998-09-24 2001-03-20 Branson Ultrasonics Corporation Laser diode array
JP2003526874A (en) * 1998-11-25 2003-09-09 リカ エレクトロニクス インターナショナル インコーポレイテッド Electric contact device
JP3027570B1 (en) * 1998-12-10 2000-04-04 山一電機株式会社 Connector structure
US6377059B2 (en) * 1999-02-19 2002-04-23 Delaware Capital Formation, Inc. Crown shaped contact barrel configuration for spring probe
DE19907727A1 (en) * 1999-02-23 2000-08-24 Test Plus Electronic Gmbh Test adapter for contacting assembled printed circuit boards
DE19912000A1 (en) * 1999-03-17 2000-10-19 Ims Connector Systems Gmbh Connectors
US6439906B1 (en) * 1999-03-25 2002-08-27 Itt Manufacturing Enterprises, Inc. Coax switch assembly
US6464511B1 (en) * 1999-11-17 2002-10-15 Advantest Corporation IC socket and IC tester
DE19962437A1 (en) * 1999-12-22 2001-07-05 Ims Connector Systems Gmbh Socket part, plug part and electrical plug connection with such a socket part and / or plug part
JP4521083B2 (en) * 2000-02-15 2010-08-11 株式会社ブリヂストン Heater electrode and semiconductor manufacturing apparatus
US6679724B2 (en) * 2000-04-06 2004-01-20 Tronic Limited Connector
JP2002025758A (en) * 2000-05-02 2002-01-25 Ibiden Co Ltd Hot plate unit
KR100745104B1 (en) * 2000-06-16 2007-08-01 니혼 하츠쵸 가부시키가이샤 Combination of contactor probes, electrical probe units, probe assemblies and insulators for contactor probes and elastic conductive probe assemblies for contactor probes
US6538424B1 (en) * 2000-07-31 2003-03-25 Le Croy Corporation Notched electrical test probe tip
JP3446726B2 (en) * 2000-08-11 2003-09-16 株式会社村田製作所 Movable terminal, coaxial connector and communication device
US6808021B2 (en) * 2000-08-14 2004-10-26 Schlumberger Technology Corporation Subsea intervention system
US6763889B2 (en) * 2000-08-14 2004-07-20 Schlumberger Technology Corporation Subsea intervention
US6511335B1 (en) * 2000-09-07 2003-01-28 Schlumberger Technology Corporation Multi-contact, wet-mateable, electrical connector
US6533594B1 (en) * 2000-11-16 2003-03-18 Ati Industrial Automation Apparatus and method for transferring secondary current across a robotic tool changer
US6663439B2 (en) * 2001-03-02 2003-12-16 Tyco Electronics Corporation Electrical connector with spring biased contacts
JP3767810B2 (en) * 2001-04-27 2006-04-19 株式会社ヨコオ Spring connector
US6685150B2 (en) * 2001-08-01 2004-02-03 Ross Anderson Conductive speaker mounting system
US6788966B2 (en) * 2001-10-22 2004-09-07 Transscan Medical Ltd. Diagnosis probe
ES2223970T3 (en) 2002-01-12 2005-03-01 Agru Kunststofftechnik Gmbh DEVICE FOR DERIVING PIPES.
US6846988B2 (en) * 2002-01-18 2005-01-25 Adc Telecommunications, Inc. Triaxial connector including cable clamp
US6561848B1 (en) * 2002-01-18 2003-05-13 Adc Telecommunications, Inc. Triaxial connector adapter and method
US6575786B1 (en) * 2002-01-18 2003-06-10 Adc Telecommunications, Inc. Triaxial connector and method
US6634902B1 (en) * 2002-05-17 2003-10-21 Light Sources, Inc. Purification lamp connector
US7316592B2 (en) * 2002-05-20 2008-01-08 Vtech Telecommunications Limited Electrostatic discharge enhanced charge contact design
JP3565824B2 (en) * 2002-05-31 2004-09-15 沖電気工業株式会社 Semiconductor package test probe and test method
US6837724B2 (en) * 2002-06-27 2005-01-04 Molex Incvorporated Electrical connector with an internal switch
GB2390756A (en) * 2002-07-11 2004-01-14 Itt Mfg Enterprises Inc PCB-mounted switch of a connector
US6844749B2 (en) * 2002-07-18 2005-01-18 Aries Electronics, Inc. Integrated circuit test probe
US6716038B2 (en) * 2002-07-31 2004-04-06 Medallion Technology, Llc Z-axis connection of multiple substrates by partial insertion of bulges of a pin
US20040077225A1 (en) * 2002-10-21 2004-04-22 L & K Precision Industry Co., Ltd. Electrical connector with movable pin
JP3923889B2 (en) * 2002-12-11 2007-06-06 シチズン電子株式会社 Manufacturing method of surface mount type spring connector
US6878016B2 (en) * 2002-12-12 2005-04-12 Symbol Technologies, Inc. High cycle connector contact system
TW563929U (en) * 2002-12-24 2003-11-21 Molex Inc Press connection terminal
US6929484B2 (en) * 2003-01-09 2005-08-16 Roger E. Weiss Apparatus for applying a mechanically-releasable balanced compressive load to an assembly such as a compliant anisotropic conductive elastomer electrical connector
DE20303526U1 (en) * 2003-02-28 2003-05-22 Tyco Electronics AMP GmbH, 64625 Bensheim Microcircuit connector
US7261162B2 (en) * 2003-06-25 2007-08-28 Schlumberger Technology Corporation Subsea communications system
US6923688B1 (en) * 2003-07-16 2005-08-02 Plantronics, Inc. Charging interface
JP2005050738A (en) * 2003-07-31 2005-02-24 Jst Mfg Co Ltd Electrical connector
JP4258309B2 (en) * 2003-08-01 2009-04-30 住友電気工業株式会社 Susceptor for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus equipped with the same
CN2660716Y (en) * 2003-09-23 2004-12-01 富士康(昆山)电脑接插件有限公司 Electrical connector
JP4194923B2 (en) * 2003-11-28 2008-12-10 小島プレス工業株式会社 Contact device
JP4224389B2 (en) * 2003-12-16 2009-02-12 株式会社ヨコオ Spring connector
JP2005251746A (en) * 2004-03-02 2005-09-15 Tyco Electronics Amp Gmbh Plug socket connector of very small size
JP4686996B2 (en) * 2004-03-30 2011-05-25 住友電気工業株式会社 Heating device
WO2005112200A1 (en) * 2004-05-17 2005-11-24 Wako Seiki Co., Ltd. Conductive pin
GB2415838B (en) * 2004-07-01 2008-05-21 Abb Offshore Systems Ltd Cable connection
US7626408B1 (en) * 2005-02-03 2009-12-01 KK Technologies, Inc. Electrical spring probe
JP2006242774A (en) * 2005-03-03 2006-09-14 Tokyo Electron Ltd Probes and probe cards
US7295013B2 (en) * 2005-04-11 2007-11-13 Schlumberger Technology Corporation Remotely operable measurement system and method employing same
US7298153B2 (en) * 2005-05-25 2007-11-20 Interconnect Devices, Inc. Eccentric offset Kelvin probe
US7279912B2 (en) * 2005-10-13 2007-10-09 Hewlett-Packard Development Company, L.P. Dual arcuate blade probe tip
SG131790A1 (en) * 2005-10-14 2007-05-28 Tan Yin Leong Probe for testing integrated circuit devices
GB2431702B (en) * 2005-10-25 2008-06-04 Diamould Ltd Connection device for an underwater service line and associated mounting and ROV handle assemblies
GB2434698B (en) * 2006-01-26 2009-03-25 Diamould Ltd Contact pin assembly for a high voltage electrical connection
JP4702799B2 (en) * 2006-03-17 2011-06-15 ルネサスエレクトロニクス株式会社 Bolt and semiconductor manufacturing equipment
US7217142B1 (en) * 2006-07-03 2007-05-15 Hon Hai Precision Ind. Co., Ltd. Cable connector assembly with improved contacts
US7285026B1 (en) * 2006-10-16 2007-10-23 Lotes Co., Ltd. Compressed contact electrical connector
US8517749B2 (en) * 2007-09-07 2013-08-27 American Superconductor Corporation System for quick disconnect termination or connection for cryogenic transfer lines with simultaneous electrical connection
US7762852B2 (en) * 2008-02-28 2010-07-27 Btx Technologies, Inc. D-subminiature connector assemblies and a housing therefore
JP2010113935A (en) * 2008-11-06 2010-05-20 Shin-Etsu Chemical Co Ltd Heating unit
US7736202B1 (en) * 2009-01-14 2010-06-15 Gm Global Technology Operations, Inc. Contact assembly for attachment to an electronics module
JP5391776B2 (en) * 2009-03-27 2014-01-15 富士通株式会社 heatsink
US8493085B2 (en) * 2009-03-27 2013-07-23 Essai, Inc. Spring contact pin for an ic test socket and the like
US9046568B2 (en) * 2009-03-27 2015-06-02 Essai, Inc. Universal spring contact pin and IC test socket therefor
US8900000B2 (en) * 2010-02-19 2014-12-02 Teledyne Odi, Inc. Robotically mateable rotary joint electrical connector
JP5370323B2 (en) * 2010-09-22 2013-12-18 富士電機株式会社 Probe unit
US8465312B2 (en) * 2010-12-07 2013-06-18 Centipede Systems, Inc. Socket cartridge and socket cartridge assembly
JP5203482B2 (en) * 2011-03-28 2013-06-05 株式会社小松製作所 Heating device
JP5810807B2 (en) * 2011-09-30 2015-11-11 富士通株式会社 Electronics
GB201117069D0 (en) * 2011-10-04 2011-11-16 Tronic Ltd .Installation method and system
KR101330999B1 (en) 2011-12-05 2013-11-20 (주)아이윈 Plungers interconnected pogo pin and manufacturing method of it
JP5979407B2 (en) * 2012-02-23 2016-08-24 第一精工株式会社 Coaxial connector with switch
US20130330944A1 (en) * 2012-06-07 2013-12-12 Andrew Llc Spring-loaded blind-mate electrical interconnect
JP5964673B2 (en) * 2012-06-28 2016-08-03 タイコエレクトロニクスジャパン合同会社 Electrical connector and female terminal
US9059545B2 (en) * 2012-07-11 2015-06-16 Tyco Electronics Corporations Socket connectors and methods of assembling socket connectors
JP2014123482A (en) * 2012-12-21 2014-07-03 Murata Mfg Co Ltd Coaxial connector for inspection
JP5972800B2 (en) * 2013-01-09 2016-08-17 株式会社ヨコオ Electrical connector
KR101439343B1 (en) * 2013-04-18 2014-09-16 주식회사 아이에스시 Probe member for pogo pin
CN104236445B (en) * 2013-06-06 2017-03-29 纬创资通股份有限公司 Detection tool and detection method for detecting the degree of concave deformation by using the detection tool
TWM475066U (en) * 2013-10-21 2014-03-21 Santa Electronics Inc Electrical connector
US9246272B2 (en) * 2014-05-02 2016-01-26 Onesubsea Ip Uk Limited Latching connector system and associated method
US9887478B2 (en) * 2015-04-21 2018-02-06 Varian Semiconductor Equipment Associates, Inc. Thermally insulating electrical contact probe
JP6909698B2 (en) * 2017-10-05 2021-07-28 株式会社ヨコオ Spring connector

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140332161A1 (en) * 2004-12-30 2014-11-13 Lam Research Corporation Apparatus for spatial and temporal control of temperature on a substrate
WO2006078585A2 (en) * 2005-01-18 2006-07-27 Asm America, Inc. Wafer support pin assembly
US20090295388A1 (en) * 2008-05-30 2009-12-03 Xiao Zhang Hybrid automatic tuning/matching for nmr probes
US20130101241A1 (en) * 2011-10-20 2013-04-25 Applied Materials, Inc. Substrate support bushing
WO2014143505A1 (en) * 2013-03-11 2014-09-18 Applied Materials, Inc. Susceptor support shaft for improved wafer temperature uniformity and process repeatability

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019138768A (en) * 2018-02-09 2019-08-22 株式会社村田製作所 probe

Also Published As

Publication number Publication date
US20180131115A1 (en) 2018-05-10
KR102562059B1 (en) 2023-08-01
CN107535018A (en) 2018-01-02
JP6685577B2 (en) 2020-04-22
US9887478B2 (en) 2018-02-06
KR20170139597A (en) 2017-12-19
JP6934080B2 (en) 2021-09-08
TW201638590A (en) 2016-11-01
US10826218B2 (en) 2020-11-03
KR20230118195A (en) 2023-08-10
KR102600377B1 (en) 2023-11-09
CN111586904A (en) 2020-08-25
JP2020115559A (en) 2020-07-30
CN111586904B (en) 2022-04-19
TW201944079A (en) 2019-11-16
JP2018516366A (en) 2018-06-21
TWI693407B (en) 2020-05-11
CN107535018B (en) 2020-06-30
TWI671528B (en) 2019-09-11
US20160315407A1 (en) 2016-10-27

Similar Documents

Publication Publication Date Title
US10826218B2 (en) Thermally insulating electrical contact probe
US10607867B2 (en) Bolted wafer chuck thermal management systems and methods for wafer processing systems
TWI703671B (en) Bolted wafer chuck thermal management systems and methods for wafer processing systems
CN101989544B (en) Structure capable of reducing substrate back polymer
US7397648B2 (en) Electrostatic chuck including a heater mechanism
JP2018516366A5 (en) Thermally isolated electrical contact probe and heating platen assembly
TWI385725B (en) A structure that reduces the deposition of polymer on the backside of the substrate
CN110911332A (en) electrostatic chuck
CN110581384A (en) Thermal insulation electric contact probe
CN101989543B (en) Device for reducing polymers at back side of substrate
US10847401B2 (en) Wafer holding apparatus and baseplate structure
US9338829B2 (en) Heated platen with improved temperature uniformity
JP2013042049A (en) Wafer support device
US20150243470A1 (en) Platen support structure

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16783647

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2017554466

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20177033351

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 16783647

Country of ref document: EP

Kind code of ref document: A1