WO2016150067A1 - 背光源、显示装置 - Google Patents
背光源、显示装置 Download PDFInfo
- Publication number
- WO2016150067A1 WO2016150067A1 PCT/CN2015/086254 CN2015086254W WO2016150067A1 WO 2016150067 A1 WO2016150067 A1 WO 2016150067A1 CN 2015086254 W CN2015086254 W CN 2015086254W WO 2016150067 A1 WO2016150067 A1 WO 2016150067A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solder resist
- resist layer
- guide plate
- light guide
- circuit board
- Prior art date
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Definitions
- the present disclosure relates to the field of liquid crystal display technologies, and in particular, to a backlight and a display device.
- the diffusion sheet has a first region covering the FPC (flexible circuit board), and the region and the light guide plate often have a gap, which affects the display effect when pressed.
- the present disclosure provides a backlight and a display device that reduce a gap between a diffusion sheet and a light guide plate to prevent light leakage.
- a backlight including:
- the light bar includes an LED lamp and a flexible circuit board connected to the LED lamp
- the flexible circuit board includes: a flexible circuit board substrate, respectively disposed on the flexible circuit board substrate a first solder resist layer and a second solder resist layer on both sides, the first solder resist layer is disposed on a side of the flexible circuit board substrate adjacent to the light guide plate, and the second solder resist layer is disposed on the flexible circuit a side of the board substrate away from the light guide plate, the first solder resist layer is connected with an LED lamp;
- Providing one side of the second solder resist layer on the flexible circuit board substrate includes a first region in which the second solder resist layer is disposed and a second region in which the second solder resist layer is not disposed, and the second portion The area is located on a side close to the light guide plate;
- the diffusion sheet has a connecting portion that partially covers or completely covers the second region near an end of the light bar.
- the second solder resist layer is provided with a copper wire layer for electrical connection of the LED lamp, and the area of the wiring region of the copper wire layer is not larger than the area of the second solder resist layer.
- the light guide plate has a bell mouth structure near one end of the light bar, the first One end of the solder resist layer adjacent to the light guide plate is located above the bell mouth structure of the light guide plate.
- the bell mouth structure has a slope on the light exiting side of the light guide plate, and the first solder resist layer is close to the sloped surface.
- the bell mouth structure is a plane on a side opposite to the light exiting side of the light guide plate.
- the thickness of the second solder resist layer is the same as the thickness of the diffusion sheet.
- the diffusion sheet has a thickness of 0.04 to 0.055 mm.
- a white oil character is disposed on the first solder resist layer.
- the present disclosure also discloses a display device including the backlight described above.
- the second solder resist layer does not completely cover the flexible circuit board substrate, and the diffusion sheet directly overlaps the flexible circuit board substrate, thereby reducing the thickness between the diffusion sheet and the light guide plate to avoid light leakage.
- FIG. 1 is a schematic structural view of a backlight in the related art
- FIG. 2 is a schematic view showing the structure of a backlight in an embodiment of the present disclosure.
- the diffusion sheet has a first region covering the FPC (flexible circuit board), and the flexible circuit board includes: a flexible circuit board substrate 1.
- the first solder resist layer 2 and the second solder resist layer 3 on opposite sides of the flexible wiring board substrate 1.
- the first solder resist layer 2 is connected to the LED lamp 6, and the diffusion sheet 4 is overlapped on the second solder resist layer 3.
- the first region of the diffusion sheet 4 and the light guide plate 5 have a gap, and when the FPC is pressed, the backlight effect of the backlight It will change as the gap decreases.
- a backlight including:
- the light bar comprises an LED lamp 6 and a flexible circuit board connected to the LED lamp 6.
- the flexible circuit board comprises: a flexible circuit board substrate 1, and a first solder resist layer 2 respectively disposed on opposite sides of the flexible circuit board substrate 1 And the second solder resist layer 3, the first solder resist layer 2 is disposed on one side of the flexible circuit board substrate 1 adjacent to the light guide plate 5, and the second solder resist layer 3 is disposed on the flexible circuit board substrate 1 away from the light guide plate 5.
- One side, the first solder resist layer 2 is connected with an LED lamp 6;
- the flexible circuit board substrate 1 is provided with one side of the second solder resist layer 3 including a first region in which the second solder resist layer 3 is disposed and a second region in which the second solder resist layer 3 is not disposed, and the second region is located near the lead One side of the light panel 5;
- the end of the diffusion sheet 4 adjacent to the light bar has a connection portion that partially covers or completely covers the second region.
- the flexible wiring board substrate 1 includes a first region in which the second solder resist layer 3 is disposed and a second region in which the second solder resist layer 3 is not disposed, that is, the second solder resist layer 3 does not completely cover the flexible wiring board substrate 1.
- the second area is located on one side of the first area.
- the diffusion sheet 4 is directly overlapped on the flexible circuit board substrate 1, thereby reducing the thickness between the connection portion of the diffusion sheet 4 and the light guide plate 5, so that pressing the flexible circuit board does not change the effect before the lamp, thereby avoiding diffusion. Light leakage caused by the thickness between the connecting portion of the sheet 4 and the light guide plate 5.
- the second solder resist layer 3 is provided with a copper wire layer (not shown) for electrically connecting the LED lamp 6, and the area of the wiring region of the copper wire layer is not larger than the area of the second solder resist layer 3.
- the reduction in the area of the second solder resist layer 3 does not affect the routing of the copper wires for the electrical connection of the LED lamps 6.
- one end of the light guide plate 5 adjacent to the light bar has a bell mouth structure 51
- one end of the first solder resist layer 2 adjacent to the light guide plate 5 is located above the bell mouth structure 51 of the light guide plate 5 .
- the bell mouth structure 51 is a portion of the light guide plate 5 located below the connecting portion of the diffusion sheet 4.
- the thickness of the bell mouth structure 51 near the end of the LED lamp 6 is greater than the thickness of the end away from the LED lamp 6, and is open. Shaped like a horn.
- the bell mouth structure includes at least one inclined surface, and the inclined surface is located on the light exiting side of the light guide plate 5.
- the bell mouth structure 51 may be a plane or a slope on a side opposite to the light exiting side of the light guide plate 5.
- the bell mouth structure 51 has a slope on the light exiting side of the light guide plate 5, and as shown in FIG. 2, the first solder resist layer 2 is adjacent to the slope. This design is beneficial to the light emitted by the LED lamp 6 completely entering the inside of the light guide plate, thereby improving the utilization of light.
- the bell mouth structure 51 is flat on the side opposite to the light exiting side of the light guide plate 5, so that the thickness of the backlight can be reduced, and the processing difficulty can be reduced.
- the reduction in the overall thickness of the portion of the flexible circuit board located above the light guide plate 5 makes the flexible circuit board more flexible and can be attached more closely to the bell mouth of the light guide plate.
- the thickness of the second solder resist layer 3 is the same as the thickness of the diffusion sheet 4.
- the diffusion sheet 4 has a thickness of 0.04 to 0.055 mm.
- a white oil character (not shown) is disposed on the first solder resist layer 2 as an identifier of the device.
- the present disclosure also discloses a display device including the backlight described above.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Planar Illumination Modules (AREA)
Abstract
Description
Claims (9)
- 一种背光源,包括:导光板;设置于导光板出光侧的扩散片;位于导光板入光侧的灯条,其中,所述灯条包括LED灯和连接于LED灯的柔性线路板,所述柔性线路板包括:柔性线路板基材、分别设置于柔性线路板基材相对的两面的第一阻焊层和第二阻焊层,所述第一阻焊层设置于所述柔性线路板基材上靠近导光板的一面,所述第二阻焊层设置于所述柔性线路板基材上远离导光板的一面,所述第一阻焊层连接有LED灯;其中,所述柔性线路板基材设置所述第二阻焊层的一面包括设置所述第二阻焊层的第一区域和未设置所述第二阻焊层的第二区域,且所述第二区域位于靠近所述导光板的一侧;所述扩散片靠近所述灯条的一端具有部分覆盖或完全覆盖所述第二区域的连接部。
- 根据权利要求1所述的背光源,其中,所述第二阻焊层上设有用于LED灯电连接的铜线层,所述铜线层的布线区的面积不大于所述第二阻焊层的面积。
- 根据权利要求1所述的背光源,其中,所述导光板靠近所述灯条的一端具有喇叭口结构,所述第一阻焊层靠近导光板的一端位于导光板的喇叭口结构上方。
- 根据权利要求3所述的背光源,其中,所述喇叭口结构在导光板出光侧具有一斜面,所述第一阻焊层贴近所述斜面。
- 根据权利要求3或4所述的背光源,其中,所述喇叭口结构在与导光板出光侧相对的一侧为平面。
- 根据权利要求1所述的背光源,其中,所述第二阻焊层的厚度与所述扩散片的厚度相同。
- 根据权利要求1或6所述的背光源,其中,所述扩散片的厚度为 0.04~0.055mm。
- 根据权利要求1所述的背光源,其中,所述第一阻焊层上设置有白油字符。
- 一种显示装置,包括权利要求1-8任一项所述的背光源。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/908,498 US10338293B2 (en) | 2015-03-26 | 2015-08-06 | Backlight source and display device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520175601.6U CN204466035U (zh) | 2015-03-26 | 2015-03-26 | 一种背光源、显示装置 |
CN201520175601.6 | 2015-03-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016150067A1 true WO2016150067A1 (zh) | 2016-09-29 |
Family
ID=53672852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2015/086254 WO2016150067A1 (zh) | 2015-03-26 | 2015-08-06 | 背光源、显示装置 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN204466035U (zh) |
WO (1) | WO2016150067A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN204466035U (zh) * | 2015-03-26 | 2015-07-08 | 京东方光科技有限公司 | 一种背光源、显示装置 |
US10338293B2 (en) | 2015-03-26 | 2019-07-02 | Boe Technology Group Co., Ltd. | Backlight source and display device |
CN107479127A (zh) * | 2017-09-11 | 2017-12-15 | 苏州天禄光科技股份有限公司 | 一种喇叭口导光板及整片导光板热转印方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050002205A1 (en) * | 2003-07-02 | 2005-01-06 | Chuan-Pei Yu | Backlight module |
CN201242066Y (zh) * | 2008-07-30 | 2009-05-20 | 比亚迪股份有限公司 | 背光模组以及背光模组中的胶框 |
CN201666517U (zh) * | 2010-03-30 | 2010-12-08 | 比亚迪股份有限公司 | 一种背光模组 |
CN201875648U (zh) * | 2010-11-25 | 2011-06-22 | 台龙电子(昆山)有限公司 | Led灯条与导光板连接结构 |
CN102102831A (zh) * | 2009-12-16 | 2011-06-22 | 三星移动显示器株式会社 | 背光单元和具有该背光单元的液晶显示装置 |
CN204466035U (zh) * | 2015-03-26 | 2015-07-08 | 京东方光科技有限公司 | 一种背光源、显示装置 |
-
2015
- 2015-03-26 CN CN201520175601.6U patent/CN204466035U/zh active Active
- 2015-08-06 WO PCT/CN2015/086254 patent/WO2016150067A1/zh active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050002205A1 (en) * | 2003-07-02 | 2005-01-06 | Chuan-Pei Yu | Backlight module |
CN201242066Y (zh) * | 2008-07-30 | 2009-05-20 | 比亚迪股份有限公司 | 背光模组以及背光模组中的胶框 |
CN102102831A (zh) * | 2009-12-16 | 2011-06-22 | 三星移动显示器株式会社 | 背光单元和具有该背光单元的液晶显示装置 |
CN201666517U (zh) * | 2010-03-30 | 2010-12-08 | 比亚迪股份有限公司 | 一种背光模组 |
CN201875648U (zh) * | 2010-11-25 | 2011-06-22 | 台龙电子(昆山)有限公司 | Led灯条与导光板连接结构 |
CN204466035U (zh) * | 2015-03-26 | 2015-07-08 | 京东方光科技有限公司 | 一种背光源、显示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN204466035U (zh) | 2015-07-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI656390B (zh) | 面光源裝置、顯示裝置以及電子機器 | |
JP5368277B2 (ja) | 発光モジュールおよび光源装置 | |
WO2019000824A1 (zh) | Oled显示面板、线路结构及oled显示设备 | |
JP2016130820A5 (zh) | ||
RU2009134481A (ru) | Устройство подсветки и устройство плоского дисплея, использующее его | |
WO2016150067A1 (zh) | 背光源、显示装置 | |
TW201603247A (zh) | 畫素陣列基板與面板 | |
TWI576880B (zh) | 背光模組及使用其之鍵盤 | |
US20140369042A1 (en) | Light Source Module | |
JP2010078840A5 (zh) | ||
US8779292B2 (en) | Substrate and substrate bonding device using the same | |
TWI525370B (zh) | 液晶顯示裝置 | |
JP2011119180A (ja) | 照明装置 | |
JP6131068B2 (ja) | 表示装置 | |
JP6409459B2 (ja) | 照明装置 | |
US20080203423A1 (en) | Light-emitting diode | |
US11145707B2 (en) | Organic light emitting diode display panel, trace structure and organic light emitting diode display apparatus | |
TW201320302A (zh) | 電路板電路裝置及光源裝置 | |
JP6307936B2 (ja) | フレキシブルプリント基板、面光源装置、表示装置、及び、電子機器 | |
WO2019210765A1 (zh) | 光源、背光模组及其制造方法、及显示装置 | |
KR102056832B1 (ko) | 인쇄회로기판 및 그 인쇄회로기판을 포함하는 조명 유닛 | |
TWI522868B (zh) | 觸控面板 | |
US10338293B2 (en) | Backlight source and display device | |
JP2010040825A (ja) | 発光装置 | |
TWI475267B (zh) | 導光結構 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 14908498 Country of ref document: US |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 15885999 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 15885999 Country of ref document: EP Kind code of ref document: A1 |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205 DATED 01.03.2018) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 15885999 Country of ref document: EP Kind code of ref document: A1 |