WO2016145906A1 - 一种扬声器模组和电子产品 - Google Patents

一种扬声器模组和电子产品 Download PDF

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Publication number
WO2016145906A1
WO2016145906A1 PCT/CN2015/095419 CN2015095419W WO2016145906A1 WO 2016145906 A1 WO2016145906 A1 WO 2016145906A1 CN 2015095419 W CN2015095419 W CN 2015095419W WO 2016145906 A1 WO2016145906 A1 WO 2016145906A1
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WIPO (PCT)
Prior art keywords
module
sound
speaker
shell
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/CN2015/095419
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English (en)
French (fr)
Inventor
邵明辉
杨健斌
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Goertek Inc
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Goertek Inc
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Filing date
Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to US15/549,605 priority Critical patent/US10334353B2/en
Publication of WO2016145906A1 publication Critical patent/WO2016145906A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2803—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops

Definitions

  • the present invention relates to the field of electroacoustic products, and in particular to a speaker module and an electronic product having the same.
  • the speaker modules of many applications including Pad, laptop, and mobile phones, use a side sounding scheme.
  • the position of the sound holes in the side sounding scheme is often concentrated on one side of the speaker module, and the corresponding system end sounds.
  • the position of the hole is also opened on one of the four sides of the casing.
  • the side-sounding solution can solve the appearance problem of the product well, it can avoid the defects that the radiation surface of the speaker is in the same plane as the screen, but the side sounding scheme introduces the front cavity and the pipeline during the implementation process, which will lead to the high frequency of the product. Features are affected.
  • the present invention provides a speaker module and an electronic product having the speaker module to improve the high frequency characteristics of the speaker module, thereby expanding the high frequency characteristics of the electronic product having the speaker module.
  • an embodiment of the present invention provides a speaker module including a housing and a speaker unit; the housing has a cavity for receiving and fixing the speaker unit, and a diaphragm of the speaker unit The inner cavity is divided into a front acoustic cavity and a rear acoustic cavity;
  • the front acoustic cavity is in communication with at least two sounding holes, and the positions of the at least two sounding holes are distributed on different sides of the casing.
  • the positions of the at least two sound holes are distributed on two adjacent sides of the casing.
  • the housing comprises a module upper shell and a module lower shell, wherein the at least two sound holes are all disposed on the module upper shell, or all are disposed in the module lower shell, or are respectively set In the module upper case and the module lower case.
  • the housing comprises a module upper shell and a module lower shell, and the at least two sound holes are formed by the module upper shell and the module lower shell.
  • the housing comprises a module upper shell and a module lower shell, and a part of the at least two sound holes is disposed on the module upper shell or in the module lower shell Or respectively disposed on the upper shell of the module and the lower shell of the module, and another part of the sound emitting hole is formed by the cooperation of the upper shell of the module and the lower shell of the module.
  • the housing comprises a module upper shell, a module lower shell and a module middle shell, and the at least two sound holes are formed by the module upper shell and the module middle shell.
  • the housing comprises a module upper shell, a module lower shell and a module middle shell, wherein the at least two sound holes are all disposed on the module upper shell or all are disposed in the module
  • the shells are respectively disposed on the upper shell of the module and the middle shell of the module.
  • the housing comprises a module upper shell, a module lower shell and a module middle shell, and a part of the at least two sound holes is disposed on the module upper shell or disposed in the housing
  • the module middle case is respectively disposed on the module upper case and the module middle case, and the other part sound hole is formed by the module upper case and the module middle case.
  • the speaker module of the technical solution is respectively provided with sound holes on different sides of the speaker module housing, and the speaker module with the side sounding structure is designed with openings at least on both sides of the front cavity structure.
  • an embodiment of the present invention provides an electronic product, including: a speaker module provided by the above technical solution; the speaker module is disposed at a corner position of the electronic product, and is disposed corresponding to the speaker module. Different sides of the sound hole are respectively provided with a plurality of sound-permeable openings on different casing side walls of the electronic product.
  • the electronic product of the technical solution is assembled into the corner position of the electronic product, and the sound-transparent opening is respectively set on the different side faces of the sound hole provided corresponding to the speaker module on the side wall of the casing of the electronic product, so that the sound is smooth
  • the sound is made from the side walls of different casings of the electronic product.
  • FIG. 1 is a schematic diagram of the appearance of a speaker module according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of a speaker module along a section line AA-BB according to an embodiment of the present invention
  • FIG. 3 is a schematic structural diagram of a speaker module according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of an appearance of an assembled speaker module for an electronic product according to an embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view showing an assembled speaker module for an electronic product according to an embodiment of the present invention.
  • housing 11, module upper shell; 12, module middle shell; 13, module lower shell; 2, speaker unit; 3, sound hole; 4, front sound chamber; Group; 6, the side wall of the casing; 7, through the sound opening.
  • the high frequency characteristics of the product are affected by the volume of the front cavity and the size (cross-sectional area and length) of the sound hole.
  • the smaller the front cavity volume the better the high frequency effect.
  • the volume of the front sound chamber is constant, the larger the cross-sectional area of the sound hole, the longer the length of the sound hole, the better the high frequency characteristics of the product.
  • the volume of the front cavity is affected by the vibration space of the product, which is difficult to achieve, and is limited by the overall thickness of the product, and the height of the sound tube of the front cavity is difficult to enlarge.
  • the present invention performs opening design on at least two sides around the front cavity structure, and achieves the effect of equivalently extending the length of the sound hole by increasing the number of sound holes, thereby realizing the extended product.
  • the purpose of high frequency characteristics is to be described in detail below.
  • a speaker module includes a housing 1 and a speaker unit 2 .
  • the housing 1 has a cavity for housing the speaker unit 2 .
  • the diaphragm of the speaker unit 1 separates the inner cavity into a front sound chamber and a rear sound chamber.
  • the cavity between the diaphragm of the speaker unit 2 and the sound hole 3 of the module is a front sound cavity, and the front sound cavity is connected with the sound hole 3; the other cavity corresponding to the front sound cavity is a rear sound cavity, and the rear sound cavity is
  • the seal design communicates with the outside only through the orifice, ensuring that the air pressure in the rear chamber is the same as that in the front chamber.
  • a material such as sound absorbing cotton is disposed in the rear acoustic cavity to adjust the acoustic performance of the speaker module.
  • the arrangement of the sound hole in the present invention is particularly suitable for a speaker module having a side sound structure.
  • the front acoustic cavity is in communication with at least two sound emitting holes 3, and the positions of the at least two sound emitting holes 3 are distributed on different sides of the casing 1, such as different sides of the hexahedron in FIG. It can be understood that different sides in the technical solution may be different sides corresponding to prisms, cylinders or other regular or irregular polyhedrons.
  • the at least two sound holes 3 are distributed on two adjacent sides of the casing 1.
  • FIG. 1 exemplarily shows that two sound holes 3 are respectively distributed on two adjacent sides of the casing 1.
  • each side of the embodiment is not limited to providing only one sound hole.
  • sound holes are respectively disposed on different sides of the speaker module housing, and the speaker module having the side sounding structure is designed to have at least two sides around the front cavity structure, thereby reducing the number of openings.
  • the lateral sounding scheme can realize the effect of equivalently extending the length of the sound hole by increasing the number of sound holes, thereby expanding the high frequency characteristics of the speaker module.
  • the housing includes a module upper case and a module lower case, and the module upper case and the module lower case cooperate to form an inner cavity for housing the speaker unit.
  • the distribution position and the formation manner of the sound hole can be specifically designed according to the overall design requirements of the speaker module, and are not specifically limited in this embodiment.
  • the at least two sound holes are all disposed on the module.
  • the shells are all disposed in the lower shell of the module or respectively disposed on the upper shell of the module and the lower shell of the module; or, formed by the upper shell of the module and the lower shell of the module; or a part of the sound hole is disposed in the module
  • the upper shell is disposed on the lower shell of the module, or is respectively disposed on the upper shell of the module and the lower shell of the module, and the other sound hole is formed by the cooperation of the upper shell of the module and the lower shell of the module.
  • the outer shape and the structure of the housing of the speaker module are not specifically limited, as long as the housing can meet the design requirements.
  • the housing in this embodiment may also be a module.
  • the upper shell, the middle shell of the module and the lower shell of the module are combined, and the outer shape of the shell may be a hexahedron or other regular or irregular polyhedron.
  • the housing in this embodiment includes a module upper shell 11, a module lower shell 13, and a module middle shell 12, on the module.
  • the housing surrounded by the casing 11, the module lower casing 13 and the module middle casing 12 houses the speaker unit 2.
  • At least two sound holes are formed by the combination of the upper shell of the module and the middle shell of the module; or all are disposed on the upper shell of the module, or are all disposed in the middle shell of the module, or are respectively disposed on the upper shell and the module of the module
  • the middle shell; or a part of the sound hole is disposed in the upper shell of the module, or is disposed in the middle shell of the module, or is respectively disposed in the upper shell of the module and the middle shell of the module, and the other sound hole is formed by the upper shell and the mold
  • the middle shell of the group is formed.
  • FIG. 2 and FIG. 3 exemplarily shows the distribution and formation of two sound holes 3, wherein one sound hole 3 is provided in the module upper case 13 of the housing 1, and the other sounds.
  • the hole 3 is formed by the cooperation of the module upper case 11 and the module middle case 12.
  • the two sound holes 3 in this embodiment may also be disposed on the module upper shell 11 or the module middle shell 12, or one of them may be disposed on the module upper shell 11 and the other may be disposed in the mold.
  • the middle casing 12; or the two sound holes 3 in this embodiment are formed by the cooperation of the module upper casing 11 and the module middle casing 12.
  • FIG. 4 and FIG. 5 Another embodiment of the present invention provides an electronic product, as shown in FIG. 4 and FIG. 5, the electronic product includes the speaker module 5 of the above embodiment, and the speaker module 5 is disposed at a corner position of the electronic product. Corresponding sides of the sound hole provided in the speaker module are respectively provided with a plurality of sound-transmissive openings 7 on different casing side walls 6 of the electronic product.
  • the positions of the at least two sound holes of the speaker module 5 are distributed on two adjacent sides of the housing; correspondingly, the adjacent two side walls 6 of the electronic product correspond to each other.
  • the speaker module 5 is provided with a plurality of sound-permeable openings 7 respectively on two adjacent sides of the sound hole.
  • the speaker module is assembled to the corner position of the electronic product, and the sound-transparent opening is respectively set on the different side faces of the sound hole provided corresponding to the speaker module on the side wall of the casing of the electronic product, so that the sound smoothly passes from The side walls of different casings of the electronic product make sound.
  • the present invention provides a speaker module and an electronic product having the speaker module, wherein the speaker module is provided with sound holes respectively on different sides of the speaker module housing.
  • the acoustic module of the sound structure has an opening design at least on both sides around the front cavity structure, thereby reducing the pipeline introduced during the realization of the side sounding scheme, and the equivalent extension can be achieved by increasing the number of sound holes.
  • the effect of the sound hole length further expands the high frequency characteristics of the electronic product having the above speaker module.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)

Abstract

本发明公开了一种扬声器模组和电子产品，所述扬声器模组，包括壳体、扬声器单体；所述壳体具有收容固定所述扬声器单体的内腔，所述扬声器单体的振膜将所述内腔分隔成前声腔和后声腔；所述前声腔与至少两个出声孔连通，所述至少两个出声孔的位置分布在所述壳体的不同侧面。所述电子产品包括上述的扬声器模组。本发明的技术方案，在扬声器模组壳体的不同侧面上分别设置出声孔，这种具有侧出声结构的扬声器模组，由于在前腔结构周围至少两侧进行了开孔设计，从而减少了侧出声方案在实现过程中引入的管道，并且通过增加出声孔的数量能够达到等效延长出声孔长度的效果，进而扩展具有该扬声器模组的电子产品的高频特性。

Description

一种扬声器模组和电子产品 技术领域
本发明涉及电声产品技术领域，特别涉及一种扬声器模组和具有该扬声器模组的电子产品。
发明背景
目前，包括Pad、笔记本电脑、手机在内的很多应用的扬声器模组都采用侧出声方案，侧出声方案中声孔的位置往往集中在扬声器模组的一侧，相应的系统端的出声孔的位置也开设在机壳的四个侧面中的一面。
虽然侧出声方案可以很好地解决产品的外观问题，能够避免扬声器辐射面与屏幕处于同一平面的缺陷，但侧出声方案在实现过程中引入了前腔和管道，会导致产品的高频特性受到影响。
发明内容
本发明提供了一种扬声器模组和具有该扬声器模组的电子产品，以提高扬声器模组的高频特性，进而扩展具有该扬声器模组的电子产品的高频特性。
为达到上述目的，本发明的技术方案是这样实现的：
一方面，本发明实施例提供了一种扬声器模组，包括壳体、扬声器单体；所述壳体具有收容固定所述扬声器单体的内腔，所述扬声器单体的振膜将所述内腔分隔成前声腔和后声腔；
所述前声腔与至少两个出声孔连通，所述至少两个出声孔的位置分布在所述壳体的不同侧面。
优选地，所述至少两个出声孔的位置分布在所述壳体的相邻两个侧面。
优选地，所述壳体包括模组上壳和模组下壳，所述至少两个出声孔全部设置在所述模组上壳、或者全部设置在所述模组下壳、或者分别设置在所述模组上壳和模组下壳。
优选地，所述壳体包括模组上壳和模组下壳，所述至少两个出声孔由所述模组上壳和所述模组下壳配合形成。
优选地，所述壳体包括模组上壳和模组下壳，所述至少两个出声孔中的一部分出声孔设置在所述模组上壳、或者设置在所述模组下壳、或者分别设置在所述模组上壳和模组下壳，另一部分出声孔由所述模组上壳和所述模组下壳配合形成。
优选地，所述壳体包括模组上壳、模组下壳以及模组中壳，所述至少两个出声孔由所述模组上壳和所述模组中壳配合形成。
优选地，所述壳体包括模组上壳、模组下壳以及模组中壳，所述至少两个出声孔全部设置在所述模组上壳、或者全部设置在所述模组中壳、或者分别设置在所述模组上壳和模组中壳。
优选地，所述壳体包括模组上壳、模组下壳以及模组中壳，所述至少两个出声孔中的一部分出声孔设置在所述模组上壳、或者设置在所述模组中壳、或者分别设置在所述模组上壳和模组中壳，另一部分出声孔由所述模组上壳和所述模组中壳配合形成。
本技术方案的扬声器模组在扬声器模组壳体的不同侧面上分别设置出声孔，这种具有侧出声结构的扬声器模组，由于在前腔结构周围至少两侧进行了开孔设计，从而减少了侧出声方案在实现过程中引入的管道，并且通过增加出声孔的数量能够达到等效延长出声孔长度的效果，进而扩展扬声器模组的高频特性。
另一方面，本发明实施例提供了一种电子产品，包括：上述技术方案提供的扬声器模组；所述扬声器模组设置在所述电子产品的边角位置，对应所述扬声器模组设置出声孔的不同侧面在所述电子产品的不同机壳侧壁上分别设有若干个透声开口。
本技术方案的电子产品通过将扬声器模组组装到电子产品的边角位置，并在电子产品的机壳侧壁上对应扬声器模组设置出声孔的不同侧面分别设置透声开口，使声音顺利地从电子产品的不同机壳侧壁进行出声。
附图说明
附图仅用于示出优选实施方式的目的，而并不认为是对本发明的限制。在附图中：
图1为本发明实施例提供的扬声器模组外观示意图；
图2为本发明实施例提供的扬声器模组沿剖面线AA-BB的剖面图；
图3为本发明实施例提供的扬声器模组的组成结构示意图；
图4为本发明实施例提供的电子产品装配扬声器模组的外观示意图；
图5为本发明实施例提供的电子产品装配扬声器模组的剖面示意图；
图中：1、壳体；11、模组上壳；12、模组中壳；13、模组下壳；2、扬声器单体；3、出声孔；4、前声腔；5、扬声器模组；6、机壳侧壁；7、透声开口。
具体实施方式
对于带有前声腔结构的扬声器模组，产品的高频特性受到前声腔体积和出声孔的尺寸（横截面积与长度）的影响。前声腔体积越小，高频效果越好。在前声腔体积一定的情况下，出声孔的横截面积越大，出声孔的长度越长，产品的高频特性越好。
前声腔的体积受产品的振动空间影响，很难做到很小，而受产品整体厚度限制，前声腔的声管道的高度也很难做到放大。
针对上述情况，为进一步扩展产品的高频特性，本发明在前腔结构周围至少两侧进行开孔设计，通过增加出声孔的数量达到等效延长出声孔长度的效果，从而实现扩展产品高频特性的目的。
为使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明实施方式作进一步地详细描述。
如图1、图2和图3共同所示，本发明的一实施例提供的扬声器模组，包括壳体1、扬声器单体2；其中，壳体1具有收容固定扬声器单体2的内腔，扬声器单体1的振膜将内腔分隔成前声腔和后声腔。
其中，扬声器单体2的振膜与模组出声孔3之间的空腔为前声腔，前声腔与出声孔3连通；与前声腔对应的另一部分腔体为后声腔，后声腔为密封设计，仅通过阻尼孔与外界连通，保证后声腔内气压与前声腔相同。优选地，后声腔内设置吸音棉等材料调节扬声器模组的声学性能。
需要说明的是，本发明中的出声孔的设置方案尤其适用于具有侧出声结构的扬声器模组。
本实施例中前声腔与至少两个出声孔3连通，所述至少两个出声孔3的位置分布在上述壳体1的不同侧面，如图1中的六面体的不同侧面。可以理解的是，本技术方案中的不同侧面可以是棱柱体、柱体或或者其他规则或不规则的多面体对应的不同侧面。
优选地，上述至少两个出声孔3分布在壳体1的相邻两个侧面。如图1所示，图1中示例性示出两个出声孔3分别分布在壳体1的两个相邻侧面。显然，本实施例中每一个侧面并不局限于仅设置一个出声孔。
由于出声孔尺寸和前声腔体积影响扬声器模组的高频截止频率，出声孔尺寸（横截面积与长度）越大，前声腔体积越小，高频效果越好。因此本实施例在扬声器模组壳体的不同侧面上分别设置出声孔，这种具有侧出声结构的扬声器模组，由于在前腔结构周围至少两侧进行了开孔设计，从而减少了侧出声方案在实现过程中引入的管道，并且通过增加出声孔的数量能够达到等效延长出声孔长度的效果，进而扩展扬声器模组的高频特性。
本发明的一个实施例中，上述壳体包括模组上壳和模组下壳，模组上壳和模组下壳配合形成收容扬声器单体的内腔。在实际设计中，出声孔的分布位置以及形成方式可以根据扬声器模组的整体设计要求具体设计，本实施例中不做具体限制，例如，上述至少两个出声孔全部设置在模组上壳、或者全部设置在模组下壳、或者分别设置在模组上壳和模组下壳；或者，由模组上壳和模组下壳配合形成；或者，一部分出声孔设置在模组上壳、或设置在模组下壳、或分别设置在模组上壳和模组下壳，另一部出声孔由模组上壳和模组下壳配合形成。
需要说明的是，本实施例中并不对扬声器模组的壳体外形以及构造方式做具体限定，只要壳体能够满足设计上的要求即可，例如本实施例中的壳体也可以由模组上壳、模组中壳以及模组下壳共同组成，壳体外形可以是六面体或者其他规则或不规则的多面体。
如图2和图3共同所示，为了方便该扬声器模组装配上的要求，本实施例中的壳体包括模组上壳11、模组下壳13以及模组中壳12，模组上壳11、模组下壳13以及模组中壳12围成的空间收容扬声器单体2。
其中，至少两个出声孔由模组上壳和模组中壳配合形成；或者全部设置在模组上壳、或者全部设置在模组中壳、或者分别设置在模组上壳和模组中壳；或者一部分出声孔设置在模组上壳、或者设置在模组中壳、或者分别设置在模组上壳和模组中壳，另一部出声孔由模组上壳和模组中壳配合形成。
图2和图3共同所示的实施例中示例性示出两个出声孔3的分布与形成方式，其中一个出声孔3设置在壳体1的模组上壳13，另一个出声孔3由模组上壳11和模组中壳12配合形成。
需要说明的是，本实施例中的两个出声孔3也可以均设置在模组上壳11或模组中壳12，也可以其中一个设置在模组上壳11，另一个设置在模组中壳12；或者，本实施例中的两个出声孔3均由模组上壳11和模组中壳12配合形成。
本发明的另一实施例提供的一种电子产品，如图4和图5共同所示，该电子产品包括上述实施例的扬声器模组5，扬声器模组5设置在电子产品的边角位置，对应上述扬声器模组设置出声孔的不同侧面在电子产品的不同机壳侧壁6上分别设有若干个透声开口7。
本实施例的一优选方案中，扬声器模组5的至少两个出声孔的位置分布在壳体的相邻两个侧面；相应地，电子产品的相邻两个机壳侧壁6上对应扬声器模组5设置出声孔的相邻两个侧面分别设置若干个透声开口7。
本实施例中通过将扬声器模组组装到电子产品的边角位置，并在电子产品的机壳侧壁上对应扬声器模组设置出声孔的不同侧面分别设置透声开口，使声音顺利地从电子产品的不同机壳侧壁进行出声。
综上所述，本发明实施提供的扬声器模组和具有该扬声器模组的电子产品，所述扬声器模组通过在扬声器模组壳体的不同侧面上分别设置出声孔，这种具有侧出声结构的扬声器模组，由于在前腔结构周围至少两侧进行了开孔设计，从而减少了侧出声方案在实现过程中引入的管道，并且通过增加出声孔的数量能够达到等效延长出声孔长度的效果，进而扩展具有上述扬声器模组的电子产品的高频特性。
以上所述仅为本发明的较佳实施例而已，并非用于限定本发明的保护范围。凡在本发明的精神和原则之内所作的任何修改、等同替换、改进等，均包含在本发明的保护范围内。

Claims (9)

  1. 一种扬声器模组，包括壳体、扬声器单体；所述壳体具有收容固定所述扬声器单体的内腔，所述扬声器单体的振膜将所述内腔分隔成前声腔和后声腔；其特征在于，所述前声腔与至少两个出声孔连通，所述至少两个出声孔的位置分布在所述壳体的不同侧面。
  2. 根据权利要求1所述的扬声器模组，其特征在于，所述至少两个出声孔的位置分布在所述壳体的相邻两个侧面。
  3. 根据权利要求1所述的扬声器模组，其特征在于，所述壳体包括模组上壳和模组下壳，所述至少两个出声孔全部设置在所述模组上壳、或者全部设置在所述模组下壳、或者分别设置在所述模组上壳和模组下壳。
  4. 根据权利要求1所述的扬声器模组，其特征在于，所述壳体包括模组上壳和模组下壳，所述至少两个出声孔由所述模组上壳和所述模组下壳配合形成。
  5. 根据权利要求1所述的扬声器模组，其特征在于，所述壳体包括模组上壳和模组下壳，所述至少两个出声孔中的一部分出声孔设置在所述模组上壳、或者设置在所述模组下壳、或者分别设置在所述模组上壳和模组下壳，另一部分出声孔由所述模组上壳和所述模组下壳配合形成。
  6. 根据权利要求1所述的扬声器模组，其特征在于，所述壳体包括模组上壳、模组下壳以及模组中壳，所述至少两个出声孔由所述模组上壳和所述模组中壳配合形成。
  7. 根据权利要求1所述的扬声器模组，其特征在于，所述壳体包括模组上壳、模组下壳以及模组中壳，所述至少两个出声孔全部设置在所述模组上壳、或者全部设置在所述模组中壳、或者分别设置在所述模组上壳和模组中壳。
  8. 根据权利要求1所述的扬声器模组，其特征在于，所述壳体包括模组上壳、模组下壳以及模组中壳，所述至少两个出声孔中的一部分出声孔设置在所述模组上壳、或者设置在所述模组中壳、或者分别设置在所述模组上壳和模组中壳，另一部分出声孔由所述模组上壳和所述模组中壳配合形成。
  9. 一种电子产品，其特征在于，包括：权利要求1-8任一项所述的扬声器模组；所述扬声器模组设置在所述电子产品的边角位置，对应所述扬声器模组设置出声孔的不同侧面在所述电子产品的不同机壳侧壁上分别设有若干个透声开口。　
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