WO2016141619A1 - 板卡防拆装置和方法 - Google Patents

板卡防拆装置和方法 Download PDF

Info

Publication number
WO2016141619A1
WO2016141619A1 PCT/CN2015/076165 CN2015076165W WO2016141619A1 WO 2016141619 A1 WO2016141619 A1 WO 2016141619A1 CN 2015076165 W CN2015076165 W CN 2015076165W WO 2016141619 A1 WO2016141619 A1 WO 2016141619A1
Authority
WO
WIPO (PCT)
Prior art keywords
card
module
signal
damage
alarm
Prior art date
Application number
PCT/CN2015/076165
Other languages
English (en)
French (fr)
Inventor
张贯京
陈兴明
葛新科
张少鹏
方静芳
克里斯基捏·普拉纽克
古列莎·艾琳娜
波达别特·伊万
高伟明
梁昊原
梁艳妮
周荣
徐之艳
周亮
肖应芬
郑慧华
Original Assignee
深圳市贝沃德克生物技术研究院有限公司
深圳市易特科信息技术有限公司
深圳市前海安测信息技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市贝沃德克生物技术研究院有限公司, 深圳市易特科信息技术有限公司, 深圳市前海安测信息技术有限公司 filed Critical 深圳市贝沃德克生物技术研究院有限公司
Publication of WO2016141619A1 publication Critical patent/WO2016141619A1/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/88—Detecting or preventing theft or loss

Definitions

  • the present invention relates to the field of electronic information technology, and in particular, to a card tampering device and method.
  • the protection device and method one is to prevent non-professionals from illegally disassembling electronic products, resulting in product unavailability; the second is to prevent competitors from illegally dismantling electronic products for plagiarism, thereby producing similar products through shortcuts and illegally occupying the market. .
  • the existing card tampering device either prevents the illegal dismantling of others through complicated structural components, or prohibits others from illegally disassembling through a closed manner, although it can protect the electronic products to a certain extent, even if others pass When it comes to disassembling electronic products, there is no feasible and effective means and methods to prevent others from plagiarizing.
  • the main object of the present invention is to provide a card tamper-preventing device and method, which solves the problem that the prior art cannot take into consideration the tampering of the card while preventing plagiarism by others.
  • the present invention provides a card tampering device, the card tampering device comprising a detecting module, a monitoring module and a damage module, wherein the card card and the card carrier are connected by a connecting member.
  • the detecting module is disposed at the connecting component and electrically connected to the monitoring module, configured to detect whether the card card is detached from the card carrier, and send a detection signal to the monitoring module;
  • the monitoring module is configured to send an open signal to the damaged module according to the detection signal
  • the damage module is electrically connected to the monitoring module, and is configured to damage the card when receiving the open signal.
  • the damage module comprises a low voltage capacitor disposed on a circuit or an electronic component of the board, and a high voltage signal is applied across the low voltage capacitor to damage a circuit or an electronic component under the capacitor;
  • the damage module includes a voltage conversion circuit for converting the low voltage into a high voltage, and applying a high voltage signal to both ends of the protection circuit in the card to damage the protected circuit;
  • the damage module includes a damaged power source, and the polarity of the electrode of the damaged power source is opposite to the power polarity of the key electronic components in the whole product, and is applied at both ends of the power supply of the key electronic components in the board. Power supplies of opposite polarity to destroy critical electronic components.
  • the detecting module comprises a pressure sensor, the pressure sensor is disposed at a position where the connecting member is in contact with the card carrier, and is configured to detect a pressure signal between the connecting member and the card carrier, and the The pressure signal is sent as a detection signal to the monitoring module;
  • the detecting module includes a light emitting unit and a light receiving unit, the connecting member is disposed between the light emitting unit and the light receiving unit, and the light receiving unit is configured to receive an optical signal emitted by the light emitting unit.
  • the detecting module sends the optical signal as a detection signal to the monitoring module;
  • the detecting module includes a resistor, and the resistor is disposed at a position where the connecting member is in contact with the card carrier, and is configured to detect a resistance value when the connecting member contacts the card carrier, and the resistance value is used as A detection signal is sent to the monitoring module.
  • the damage module comprises a low voltage capacitor disposed on a circuit or an electronic component of the board, and a high voltage signal is applied across the low voltage capacitor to damage a circuit or an electronic component under the capacitor;
  • the damage module includes a voltage conversion circuit for converting the low voltage into a high voltage, and applying a high voltage signal to both ends of the protection circuit in the card to damage the protected circuit;
  • the damage module includes a damaged power source, and the polarity of the electrode of the damaged power source is opposite to the power polarity of the key electronic components in the whole product, and is applied at both ends of the power supply of the key electronic components in the board. Power supplies of opposite polarity to destroy critical electronic components.
  • the card tampering device further includes an alarm module, the alarm module is electrically connected to the monitoring module, and the monitoring module is further configured to send alarm information to the alarm module according to the detection signal, The alarm module is configured to alarm according to the alarm information.
  • the damage module comprises a low voltage capacitor disposed on a circuit or an electronic component of the board, and a high voltage signal is applied across the low voltage capacitor to damage a circuit or an electronic component under the capacitor;
  • the damage module includes a voltage conversion circuit for converting the low voltage into a high voltage, and applying a high voltage signal to both ends of the protection circuit in the card to damage the protected circuit;
  • the damage module includes a damaged power source, and the polarity of the electrode of the damaged power source is opposite to the power polarity of the key electronic components in the whole product, and is applied at both ends of the power supply of the key electronic components in the board. Power supplies of opposite polarity to destroy critical electronic components.
  • the card tampering device further includes an alarm release module, wherein the alarm release module is electrically connected to the monitoring module, configured to acquire alarm release information and send stop alarm information to the monitoring module, the monitoring module The output of the alarm information is stopped when the alarm stop information is received.
  • the damage module comprises a low voltage capacitor disposed on a circuit or an electronic component of the board, and a high voltage signal is applied across the low voltage capacitor to damage a circuit or an electronic component under the capacitor;
  • the damage module includes a voltage conversion circuit for converting the low voltage into a high voltage, and applying a high voltage signal to both ends of the protection circuit in the card to damage the protected circuit;
  • the damage module includes a damaged power source, and the polarity of the electrode of the damaged power source is opposite to the power polarity of the key electronic components in the whole product, and is applied at both ends of the power supply of the key electronic components in the board. Power supplies of opposite polarity to destroy critical electronic components.
  • the present invention further provides a card tampering method, and the card tampering method comprises the following steps:
  • the detecting module detects whether the board is detached from the board carrier, and sends a detection signal to the monitoring module;
  • the monitoring module sends an open signal to the damage module according to the detection signal
  • the damage module destroys the board when receiving the open signal.
  • the step S1 is specifically:
  • the detecting module includes a pressure sensor disposed at a position where the connecting member contacts the card carrier, the pressure sensor detects a pressure signal between the connecting member and the card carrier, and the pressure is Sending a signal as a detection signal to the monitoring module;
  • the detecting module includes a light emitting unit and a light receiving unit
  • the connecting member is disposed between the light emitting unit and the light receiving unit, and the light receiving unit receives the light signal emitted by the light emitting unit, and Transmitting the optical signal as a detection signal to the monitoring module;
  • the detecting module includes a resistor, the resistor is disposed at a position where the connecting member is in contact with the card carrier, and the resistor detects a resistance value when the connecting member contacts the card carrier, and the resistance value is A detection signal is sent to the monitoring module.
  • the card tampering method further includes the following steps:
  • the monitoring module sends an alarm message to the alarm module according to the detection signal
  • S5 The alarm module alarms according to the alarm information.
  • the card tampering method further includes the following steps:
  • the alarm release module acquires the alarm release information and sends the stop alarm information to the monitoring module;
  • the monitoring module stops outputting the alarm information when receiving the alarm stop information.
  • the damage module When the damage module receives the open signal, the card is damaged by one or a combination of the following:
  • the technical solution of the present invention adopts the above technical solution, and the technical effect of the invention is: the invention detects whether the card is detached from the card carrier by the detecting module, and while the electronic product is tamper-proof, the monitoring module sends an opening signal to the damaged module according to the detection signal.
  • the electronic product is damaged by the damage module, thereby preventing others from copying the electronic product.
  • FIG. 1 is a schematic structural view of a first preferred embodiment of a card tampering device according to the present invention
  • FIG. 2 is a schematic structural view of a second preferred embodiment of the card tampering device of the present invention.
  • FIG. 3 is a schematic flow chart of a first preferred embodiment of a card tampering method according to the present invention.
  • FIG. 4 is a schematic flow chart of a second preferred embodiment of the card tampering method of the present invention.
  • the main object of the present invention is to provide a card tamper-preventing device and method, which solves the problem that the prior art cannot take into consideration the tampering of the card while preventing plagiarism by others.
  • the present invention provides a card tampering device.
  • the card tampering device includes a detecting module 10, a monitoring module 20, and a damage module 30. Connected to the board carrier via a connector,
  • the detecting module 10 is disposed at the connecting component and electrically connected to the monitoring module 20, configured to detect whether the card card is detached from the card carrier, and send a detection signal to the monitoring module. 20;
  • the monitoring module 20 is configured to send an open signal to the damage module 30 according to the detection signal;
  • the damage module 30 is electrically connected to the monitoring module 20 for damaging the card when receiving the open signal.
  • the card carrier card of the present invention is coupled to the card carrier by screws.
  • the card includes a circuit for operating an electronic product and an electronic component thereof, and the card is fixed to the card carrier by screws, and the card carrier is connected by screws to form an entire electronic product.
  • the card and the card carrier and between the card carrier and the card carrier may be connected by other connectors, such as studs.
  • a guide rail may be disposed on the board carrier, and the board is fixed to the board by the guide rail.
  • the detecting module 10 is preferably disposed at the connecting component, and when the connecting component is disassembled, the detection signal detected by the detecting module changes, When the detection signal is a preset detection signal, the electronic product is disassembled.
  • the detecting module sends a detection signal to the monitoring module 20, and feeds back the change of the detection signal to the monitoring module 20 in real time.
  • the detection signal is a preset detection signal
  • the card is detached from the card carrier, and the monitoring module 20 sends an opening signal to the damage module 30 to control the damage module 30 to start working.
  • the damage module 30 only damages the card when the open signal is received, that is, if the electronic product is illegally disassembled without authorization, in order to prevent the electronic product from being passed by abnormal means Plagiarism protects electronic products through damage.
  • the open signal is not received, it is in the off state.
  • the invention detects whether the electronic product is disassembled by the detecting module 10, and while the electronic product is tamper-proof, the monitoring module 20 sends an opening signal to the damage module 30 according to the detection signal, and damages the electronic product through the damage module 30, thereby preventing others. Plagiarizing electronic products.
  • the detecting module 10 is configured to detect whether the electronic product is disassembled, and send the detection signal to the monitoring module 20.
  • the possible implementation manners are as follows:
  • the detecting module 10 includes a pressure sensor disposed at a position where the screw contacts the card carrier for detecting a pressure signal between the screw and the card carrier;
  • the pressure sensor is disposed between the board and the board carrier and the screw connected between the board carrier and the board carrier, and can be disposed at each of the connected screws or at several of the screws to detect The card is detached from the card carrier and the card carrier is detached, and the pressure sensor may be disposed at a position where the screw contacts the card carrier (the position of the screw above the card carrier or under the screw and the plate) a position at which the card carrier contacts) for detecting a pressure signal between the screw and the card carrier.
  • the pressure signal is a normal pressure signal, and when the card is detected to be detached In the case of the board carrier, the pressure signal changes and the pressure signal becomes smaller as the screw is released.
  • the detecting module 10 sends the pressure signal as a detection signal to the monitoring module 20, and feeds back the change of the pressure signal to the monitoring module 20 in real time.
  • the detecting module 10 includes a light emitting unit and a light receiving unit, the light receiving unit is configured to receive an optical signal emitted by the light emitting unit, and the screw is disposed on the light emitting unit and the light receiving Between units.
  • the light emitting unit and the light receiving unit are provided as an infrared light emitting unit and an infrared light receiving unit.
  • the infrared light emitting unit emits an infrared light signal within a preset period (for example, 1 s), and the infrared light receiving unit passively receives the infrared light signal.
  • the optical signal emitted by the light emitting unit is blocked by the screw, and the optical signal received by the light receiving unit is weakest, and when the card is detected to be detached from the card carrier
  • the optical signal received by the light receiving signal becomes stronger as the screw is loosened (the optical signal is blocked by the screw, and the optical signal received by the light receiving unit gradually increases and becomes strong)
  • the detecting module 10 sends the optical signal as a detection signal to the monitoring module 20, and feeds back the change of the optical signal to the monitoring module 20 in real time.
  • the detecting module 10 includes a resistor, and the resistor is disposed at a position where the screw contacts the card carrier, and is configured to detect a resistance value when the screw contacts the card carrier; Generally, it is an electric conductor, and the board carrier is equivalent to ground. Therefore, when the screw is in contact with the resistor, it is equivalent to connecting a new resistor in series with the resistor, and the output resistance value of the detecting module is changed due to contact with the screw. Big. When the electronic product is disassembled, the output resistance value of the detecting module becomes smaller as the screw is loosened, that is, the detecting module 10 detects that the output resistance value becomes small, indicating that the card is detached. Board carrier. The detecting module 10 sends the resistance value as a detection signal to the monitoring module 20, and feeds back the change of the resistance value to the monitoring module 20 in real time.
  • the monitoring module 20 is configured to send an enable signal to the damage module 30 according to the detection signal.
  • the detection signal is a preset detection signal
  • the pressure signal sent by the detection module 10 is less than a preset pressure signal (the pressure signal when the screw and the card carrier are tightened) or the optical signal is greater than
  • the monitoring module 20 sends an open signal to the damage module 30 to control the damage module 30 to start working.
  • the damage module 30 is configured to damage the card when the open signal is received, and the possible implementation manners are as follows:
  • the damage module 30 includes a low voltage capacitor disposed above the circuit or electronic component of the board, by applying a high voltage signal across the low voltage capacitor to damage the circuit under the capacitor or Electronic components; thus destroying the board of electronic products, resulting in illegal dismantling personnel unable to obtain a complete board, copying electronic products through illegal means;
  • the damage module 30 includes a voltage conversion circuit for converting a low voltage to a high voltage, and applying a high voltage signal to both ends of the protection circuit in the card to damage the protected circuit, As a result, the key parts of the electronic product are damaged, so that illegal dismantled personnel cannot obtain a complete board and plagiarize electronic products through illegal means;
  • the damage module 30 includes a damaged power source having an electrode polarity opposite to a power polarity of a key electronic component in the complete product, through key electronics in the board.
  • a power supply of opposite polarity is applied to the power supply of the component to damage the key electronic components, thereby damaging the key parts of the electronic product, so that the illegal disassembler cannot obtain a complete board and illegally plagiarize the electronic product.
  • the damage module 30 only destroys the card when receiving the open signal, and is in a non-working state when the open signal is not received.
  • the damage module 30 described above may be implemented by one or a combination of the above.
  • FIG. 2 is a schematic structural view of a second preferred embodiment of the card tampering device of the present invention.
  • the card tampering device further includes an alarm module 40, the alarm module 40 is electrically connected to the monitoring module 20, and the monitoring module 20 is further used for the structure of the card tampering device according to the present invention.
  • Sending alarm information to the alarm module 40 according to the detection signal, the alarm module 40 is configured to alarm according to the alarm information.
  • the detection signal received by the monitoring module 20 is within a preset range (eg, the pressure signal sent by the detection module 10 is less than a preset pressure signal or the optical signal is greater than a preset optical signal or resistance value)
  • the alarm information is sent to the alarm module 40, and the alarm information may be “Please do not disassemble illegally”, and the alarm module 40 is based on the alarm. Information alarm, prompting illegal disassemblers not to try to disassemble.
  • the card tampering device further includes an alarm release module 50, and the alarm release module 50 is electrically connected to the monitoring module 20 for acquiring alarm release information and transmitting stop alarm information to the monitoring module 20, the monitoring The module 20 stops outputting the alarm information upon receiving the alarm stop information.
  • an alarm release button may be disposed on the electronic product, and when the alarm release button is pressed, the alarm release module 50 acquires an alarm release information, and sends a stop alarm information to the monitoring module 20 The monitoring module 20 stops outputting the alarm information when receiving the alarm stop information.
  • the alarm module 40 is prevented from being in an alarm state all the time.
  • the present invention also provides a card tampering method.
  • FIG. 3 is a schematic flow chart of a first preferred embodiment of a card tampering method according to the present invention.
  • the card tampering method includes the following steps:
  • the detecting module detects whether the board is detached from the board carrier, and sends a detection signal to the monitoring module;
  • the monitoring module sends an open signal to the damage module according to the detection signal
  • the damage module destroys the board when receiving the open signal.
  • the electronic product of the present invention includes a card and a plurality of card carriers, and the card carriers are also connected by screws.
  • the card includes a circuit for operating the electronic product and an electronic component thereof, and the card is fixed on the card carrier by screws, and the card carrier is connected by screws to form the entire electronic product.
  • the card and the card carrier and between the card carrier and the card carrier may be connected by other connectors, such as studs.
  • a guide rail may be disposed on the board carrier, and the board is fixed to the board by the guide rail.
  • the card tampering method of the present invention is preferably implemented based on the structural connection relationship of the preferred electronic product described above.
  • the detecting module detects whether the card is detached from the card carrier, and sends a detection signal to the monitoring module.
  • the detecting module is preferably disposed at the connecting component.
  • the connecting member is disassembled, the detection signal detected by the detecting module changes, and when the detecting signal is a preset detecting signal, the electronic product is disassembled.
  • the detecting module sends a detection signal to the monitoring module, and feeds back the change of the detection signal to the monitoring module in real time.
  • the monitoring module sends an enable signal to the damage module according to the detection signal; specifically, when the detection signal is a preset detection signal, the card is detached from the card carrier, and the monitoring module Sending an open signal to the damage module to control the damage module to start working.
  • the damage module destroys the board when receiving the open signal. Specifically, the damage module only damages the card when the open signal is received, that is, if the electronic product is illegally disassembled without authorization, in order to prevent the electronic product from passing abnormally The means were copied and protected by electronic means of damage. When the open signal is not received, it is in the off state.
  • the invention detects whether the card is detached from the card carrier through the detecting module, and while the electronic product is tamper-proof, the monitoring module sends an opening signal to the damage module according to the detection signal, and damages the electronic product through the damaged module, thereby preventing others from Electronic products are plagiarized.
  • Step S1 the detecting module detects whether the card is detached from the card carrier, and sends a detection signal to the monitoring module;
  • the detecting module includes a pressure sensor disposed at a position where the connecting member contacts the card carrier, and the detecting module detects a pressure between the connecting member and the card carrier.
  • the pressure sensor is disposed between the card and the card carrier and a screw connected between the card carrier and the card carrier, and may be disposed at each of the connected screws or at a plurality of screws
  • the device can detect that the card card is detached from the card carrier and the card carrier is detached, and the pressure sensor can be disposed at a position where the screw contacts the card carrier (a position or a screw above the screw contacting the card carrier) The position of the lower contact with the card carrier is used to detect a pressure signal between the screw and the card carrier.
  • the pressure signal is a normal pressure signal, when the card is detected.
  • the pressure signal changes and the pressure signal becomes smaller as the screw is loosened.
  • the detecting module sends the pressure signal as a detection signal to the monitoring module, and feeds back the change of the pressure signal to the monitoring module in real time.
  • the detecting module includes a light emitting unit and a light receiving unit, the light receiving unit is configured to receive an optical signal emitted by the light emitting unit, and the connecting member is disposed on the light emitting unit and the light receiving Between the units, preferably, the light emitting unit and the light receiving unit are provided as an infrared light emitting unit and an infrared light receiving unit.
  • the infrared light emitting unit emits an infrared light signal within a preset period (for example, 1 s), and the infrared light receiving unit passively receives the infrared light signal.
  • the optical signal emitted by the light emitting unit is blocked by the screw, and the optical signal received by the light receiving unit is weakest, and when the card is detected to be detached from the card carrier
  • the optical signal received by the light receiving signal becomes stronger as the screw is loosened (the optical signal is blocked by the screw, and the optical signal received by the light receiving unit gradually increases and becomes strong)
  • the detecting module sends the optical signal as a detection signal to the monitoring module, and feedbacks the change of the optical signal to the monitoring module in real time.
  • the detecting module includes a resistor, the resistor is disposed at a position where the connector contacts the card carrier, and the detecting module detects a resistance value when the connector contacts the card carrier,
  • the screw is generally an electric conductor, and the card carrier is equivalent to ground. Therefore, when the screw is in contact with the resistor, it is equivalent to a new resistor connected in series with the resistor, and the output resistance value of the detecting module is compared with the screw. It becomes bigger by contact.
  • the output resistance value of the detecting module becomes smaller as the screw is loosened, that is, the detecting module detects that the output resistance value becomes small, indicating that the card is detached from the board. Card carrier.
  • the detecting module sends the resistance value as a detection signal to the monitoring module, and feedbacks the change of the resistance value to the monitoring module in real time.
  • Step S2 the monitoring module sends an open signal to the damage module according to the detection signal
  • the detection signal is a preset detection signal
  • the pressure signal sent by the detection module is smaller than a preset pressure signal (the pressure signal when the screw and the board carrier are tightened) or the optical signal is greater than the pre-
  • the monitoring module sends an open signal to the damage module to control the damage module to start working.
  • the high voltage signal is applied across the low voltage capacitor disposed above the circuit or electronic component of the board to damage the circuit or electronic component under the capacitor; thereby damaging the board of the electronic product, Causing illegal dismantled personnel to obtain complete boards and copying electronic products through illegal means;
  • a high voltage signal is applied to both ends of the protection circuit in the card to damage the protected circuit, thereby damaging a critical portion of the electronic product, thereby rendering the illegal disassembler unable to obtain a complete board. Copying electronic products by illegal means;
  • the illegal disassembler cannot Get a complete board and copy the electronic products by illegal means.
  • the damage module only destroys the card when receiving the open signal, and is in a non-working state when the open signal is not received.
  • the above-described damage module may be implemented by one or a combination of the above.
  • FIG. 4 is a schematic flow chart of a second preferred embodiment of the card tampering method according to the present invention.
  • the card tampering method further includes the following steps:
  • the monitoring module sends an alarm message to the alarm module according to the detection signal
  • the alarm release module acquires the alarm release information and sends the stop alarm information to the monitoring module;
  • the monitoring module stops outputting the alarm information when receiving the alarm stop information.
  • the detection signal received by the monitoring module is within a preset range (eg, the pressure signal sent by the detection module is less than a preset pressure signal or the optical signal is greater than a preset optical signal or the resistance value is less than a pre-
  • a preset range eg, the pressure signal sent by the detection module is less than a preset pressure signal or the optical signal is greater than a preset optical signal or the resistance value is less than a pre-
  • an alarm release button may be disposed on the electronic product, and when the alarm release button is pressed, the alarm release module acquires an alarm release information, and sends a stop alarm information to the monitoring module.
  • the monitoring module stops outputting the alarm information when receiving the alarm stop information.
  • the alarm module is prevented from being in an alarm state all the time.
  • the card tampering method after step S3 includes the above steps S4 and S5; in another embodiment, According to the flow chart of the second embodiment of the card tampering method of the present invention, the card tampering method after step S3 includes the above steps S6 and S7.
  • the technical solution of the present invention adopts the above technical solution, and the technical effect of the invention is: the invention detects whether the card is detached from the card carrier by the detecting module, and while the electronic product is tamper-proof, the monitoring module sends an opening signal to the damaged module according to the detection signal.
  • the electronic product is damaged by the damage module, thereby preventing others from copying the electronic product.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Software Systems (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Storage Device Security (AREA)
  • Alarm Systems (AREA)

Abstract

一种板卡防拆装置和方法。所述板卡防拆装置包括检测模块（10）、监测模块（20）和损毁模块（30），所述板卡与板卡载体通过连接件连接，所述检测模块（10）用于检测所述板卡是否被拆离所述板卡载体，并将检测信号发送至所述监测模块（20），所述监测模块（20）用于根据所述检测信号发送开启信号至所述损毁模块；所述损毁模块（30）用于在接收到所述开启信号时，损毁所述板卡。通过检测模块（10）检测板卡是否被拆离板卡载体，在对电子产品防拆的同时，监测模块（20）根据检测信号发送开启信号至损毁模块（30），通过损毁模块（30）对电子产品进行损毁，进而防止他人对电子产品进行抄袭。

Description

板卡防拆装置和方法
技术领域
本发明涉及电子信息技术领域，尤其涉及一种板卡防拆装置和方法。
背景技术
随着电子信息技术的发展，电子产品在各个应用领域已经广泛应用，电子产品的设计和生产厂商也越来越多，因此为确保一款创新产品在市场竞争中取得竞争优势，需要设计电子产品的保护装置和方法，一是防止非专业人员对电子产品进行非法拆开导致产品不可用；二是防止竞争对手通过非法拆开电子产品进行抄袭，从而通过捷径生产类似产品，以非法手段占据市场。现有的板卡防拆装置要么通过复杂的结构件来防止他人非法拆开，要么通过密闭的方式禁止他人非法拆开，虽然能够从一定程度上对电子产品起到保护作用，但即使他人通过非常手段拆开电子产品时，没有可行有效的装置和方法防止他人进行抄袭。
基于此有必要提供一种板卡防拆装置和方法，以解决现有技术无法兼顾对板卡防拆的同时，防止他人抄袭的问题。
发明内容
本发明的主要目的在于提供一种板卡防拆装置和方法，以解决现有技术无法兼顾对板卡防拆的同时，防止他人抄袭的问题。
为实现上述目的，本发明提供了一种板卡防拆装置，所述板卡防拆装置包括检测模块、监测模块和损毁模块，所述板卡与板卡载体通过连接件连接，
所述检测模块，设置于所述连接件处，与所述监测模块电连接，用于检测所述板卡是否被拆离所述板卡载体，并发送检测信号至所述监测模块；
所述监测模块，用于根据所述检测信号发送开启信号至所述损毁模块；
所述损毁模块，与所述监测模块电连接，用于在接收到所述开启信号时，损毁所述板卡。
优选地，所述损毁模块包括设置于所述板卡的电路或电子元器件上方的低电压电容，通过在所述低压电容两端施加高压信号，以损毁电容下方的电路或电子元器件；
或者所述损毁模块包括电压转换电路，用于将低电压转换为高电压，通过在所述板卡中被保护电路的两端施加高压信号，以损毁被保护电路；
或者所述损毁模块包括损毁电源，所述损毁电源的电极极性与所述整机产品中关键电子元器件的电源极性相反，通过在所述板卡中关键电子元器件的电源两端施加极性相反的电源，以损毁关键电子元器件。
优选地，所述检测模块包括压力传感器，所述压力传感器设置于所述连接件与板卡载体接触的位置，用于检测所述连接件与板卡载体之间的压力信号，并将所述压力信号作为检测信号发送至所述监测模块；
或者，所述检测模块包括发光单元和光接收单元，所述连接件设置于所述发光单元和所述光接收单元之间，所述光接收单元用于接收所述发光单元发出的光信号，所述检测模块将所述光信号作为检测信号发送至所述监测模块；
或者，所述检测模块包括电阻，所述电阻设置于所述连接件与板卡载体接触的位置，用于检测所述连接件与板卡载体接触时的电阻值，并将所述电阻值作为检测信号发送至所述监测模块。
优选地，所述损毁模块包括设置于所述板卡的电路或电子元器件上方的低电压电容，通过在所述低压电容两端施加高压信号，以损毁电容下方的电路或电子元器件；
或者所述损毁模块包括电压转换电路，用于将低电压转换为高电压，通过在所述板卡中被保护电路的两端施加高压信号，以损毁被保护电路；
或者所述损毁模块包括损毁电源，所述损毁电源的电极极性与所述整机产品中关键电子元器件的电源极性相反，通过在所述板卡中关键电子元器件的电源两端施加极性相反的电源，以损毁关键电子元器件。
进一步地，所述板卡防拆装置还包括报警模块，所述报警模块与所述监测模块电连接，所述监测模块还用于根据所述检测信号发送报警信息至所述报警模块，所述报警模块用于根据所述报警信息报警。
优选地，所述损毁模块包括设置于所述板卡的电路或电子元器件上方的低电压电容，通过在所述低压电容两端施加高压信号，以损毁电容下方的电路或电子元器件；
或者所述损毁模块包括电压转换电路，用于将低电压转换为高电压，通过在所述板卡中被保护电路的两端施加高压信号，以损毁被保护电路；
或者所述损毁模块包括损毁电源，所述损毁电源的电极极性与所述整机产品中关键电子元器件的电源极性相反，通过在所述板卡中关键电子元器件的电源两端施加极性相反的电源，以损毁关键电子元器件。
进一步地，所述板卡防拆装置还包括报警解除模块，所述报警解除模块与所述监测模块电连接，用于获取报警解除信息并发送停止报警信息至所述监测模块，所述监测模块在接收到所述报警停止信息时停止输出报警信息。
优选地，所述损毁模块包括设置于所述板卡的电路或电子元器件上方的低电压电容，通过在所述低压电容两端施加高压信号，以损毁电容下方的电路或电子元器件；
或者所述损毁模块包括电压转换电路，用于将低电压转换为高电压，通过在所述板卡中被保护电路的两端施加高压信号，以损毁被保护电路；
或者所述损毁模块包括损毁电源，所述损毁电源的电极极性与所述整机产品中关键电子元器件的电源极性相反，通过在所述板卡中关键电子元器件的电源两端施加极性相反的电源，以损毁关键电子元器件。
为实现上述目的，本发明还提供了一种板卡防拆方法，所述板卡防拆方法包括如下步骤：
S1：检测模块检测板卡是否被拆离板卡载体，并将检测信号发送至监测模块；
S2：监测模块根据所述检测信号发送开启信号至所述损毁模块；
S3：损毁模块在接收到所述开启信号时，损毁所述板卡。
优选地，所述步骤S1具体为：
所述检测模块包括压力传感器，所述压力传感器设置于所述连接件与板卡载体接触的位置，所述压力传感器检测所述连接件与板卡载体之间的压力信号，并将所述压力信号作为检测信号发送至所述监测模块；
或者，所述检测模块包括发光单元和光接收单元，所述连接件设置于所述发光单元和所述光接收单元之间，所述光接收单元接收所述发光单元发出的光信号，并将所述光信号作为检测信号发送至所述监测模块；
或者，所述检测模块包括电阻，所述电阻设置于所述连接件与板卡载体接触的位置，所述电阻检测所述连接件与板卡载体接触时的电阻值，并将所述电阻值作为检测信号发送至所述监测模块。
进一步地，所述板卡防拆方法还包括如下步骤：
S4：监测模块根据所述检测信号发送报警信息至所述报警模块；
S5：报警模块根据所述报警信息报警。
进一步地，所述板卡防拆方法还包括如下步骤：
S6：报警解除模块获取报警解除信息并发送停止报警信息至所述监测模块；
S7：监测模块在接收到所述报警停止信息时停止输出报警信息。
优选地，所述步骤S3中，
损毁模块接收到所述开启信号时，通过下述中的一种方式或多种方式的组合损毁所述板卡：
通过在设置于所述板卡的电路或电子元器件上方的低电压电容两端施加高压信号以损毁电容下方的电路或电子元器件；
或者通过在所述板卡中被保护电路的两端施加高压信号，以损毁被保护电路；
或者通过在所述板卡中关键电子元器件的电源两端施加极性相反的电源，以损毁关键电子元器件。
本发明采用上述技术方案，带来的技术效果为：本发明通过检测模块检测板卡是否被拆离板卡载体，在对电子产品防拆的同时，监测模块根据检测信号发送开启信号至损毁模块，通过损毁模块对电子产品进行损毁，进而防止他人对电子产品进行抄袭。
附图说明
图1为本发明板卡防拆装置第一较佳实施例结构示意图；
图2为本发明板卡防拆装置第二较佳实施例结构示意图；
图3为本发明板卡防拆方法第一较佳实施例流程示意图；
图4为本发明板卡防拆方法第二较佳实施例流程示意图。
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
本发明的主要目的在于提供一种板卡防拆装置和方法，以解决现有技术无法兼顾对板卡防拆的同时，防止他人抄袭的问题。
为实现上述目的，本发明提供了一种板卡防拆装置。
参照图1，如图1所示为本发明板卡防拆装置第一较佳实施例结构示意图，所述板卡防拆装置包括检测模块10、监测模块20和损毁模块30，所述板卡与板卡载体通过连接件连接，
所述检测模块10，设置于所述连接件处，与所述监测模块20电连接，用于检测所述板卡是否被拆离所述板卡载体，并将检测信号发送至所述监测模块20；
所述监测模块20，用于根据所述检测信号发送开启信号至所述损毁模块30；
所述损毁模块30，与所述监测模块20电连接，用于在接收到所述开启信号时，损毁所述板卡。
在一个实施例中，本发明所述板卡载体板卡与板卡载体之间通过螺钉连接。具体地，所述板卡上包括有使电子产品正常工作的电路及其电子元器件，所述板卡通过螺钉固定于板卡载体上，板卡载体之间通过螺钉连接构成整个电子产品。在其他实施例中，所述板卡与板卡载体之间以及板卡载体与板卡载体之间还可以通过其他连接件连接，例如螺柱。另外，还可以在板卡载体上设置导轨，板卡通过导轨固定于板卡上。板卡和板卡载体之间以及板卡载体之间无论采用何种连接件，当板卡被拆离板卡载体时或者板卡载体被拆开时，连接件与板卡或者连接件与板卡载体之间的机械状态都会放生相对变化。
具体地，根据上述电子产品的构成及连接关系，所述检测模块10优选设置于连接件处，当所述连接件被拆开时，所述检测模块检测到的检测信号会发生变化，当所述检测信号为预设的检测信号时，说明所述电子产品被拆开。所述检测模块发送检测信号至所述监测模块20，实时将所述检测信号的变化反馈至所述监测模块20。
具体地，当所述检测信号为预设的检测信号时，说明所述板卡被拆离板卡载体，所述监测模块20发送开启信号至所述损毁模块30以控制损毁模块30开启工作。
所述损毁模块30只有在接收到所述开启信号时，才损毁所述板卡，即电子产品在未授权的情况下被非法拆开的情况下，为防止所述电子产品通过非正常手段被抄袭，通过毁损的方式保护电子产品。在没有接收到所述开启信号时，处于关闭状态。
本发明通过检测模块10检测电子产品是否被拆开，在对电子产品防拆的同时，监测模块20根据检测信号发送开启信号至损毁模块30，通过损毁模块30对电子产品进行损毁，进而防止他人对电子产品进行抄袭。
下面以连接件为螺钉为例，介绍本发明实施例中各模块的具体实施方式：
上述检测模块10，用于检测电子产品是否被拆开，并将检测信号发送至监测模块20，其可能的实施方式如下：
在其中一个实施例中，所述检测模块10包括压力传感器，所述压力传感器设置于所述螺钉与板卡载体接触的位置，用于检测所述螺钉与板卡载体之间的压力信号；所述压力传感器设置于板卡与板卡载体之间以及板卡载体与板卡载体之间连接的螺钉处，可在每个连接的螺钉处均设置一个或者在其中几个螺钉处设置，能够检测板卡被拆离板卡载体以及板卡载体被拆开即可，所述压力传感器可以设置于所述螺钉与板卡载体接触的位置（螺钉上方与板卡载体接触的位置或螺钉下方与板卡载体接触的位置），用于检测所述螺钉与板卡载体之间的压力信号，当电子产品正常工作时，所述压力信号为正常的压力信号，当检测到所述板卡被拆离板卡载体时，所述压力信号发生变化，压力信号会随着螺钉的松开而变小。所述检测模块10将所述压力信号作为检测信号发送至所述监测模块20，实时将所述压力信号的变化反馈至所述监测模块20。
在其中一个实施例中，所述检测模块10包括发光单元和光接收单元，所述光接收单元用于接收所述发光单元发出的光信号，所述螺钉设置于所述发光单元和所述光接收单元之间。优选地，所述发光单元和所述光接收单元设置为红外光发光单元和红外光接收单元。所述红外光发光单元在预设的周期内（例如1s）发射红外光信号，所述红外光接收单元被动接收所述红外光信号。所述电子产品未被拆开时，所述发光单元发出的光信号被所述螺钉挡住，所述光接收单元接收到的光信号最弱，当检测到所述板卡被拆离板卡载体时，所述光接收信号接收到的光信号随着所述螺钉的松开而变强（所述光信号因为没有被螺钉挡住，所述光接收单元接收到的光信号逐渐增多而变强），所述检测模块10将所述光信号作为检测信号发送至所述监测模块20，实时将所述光信号的变化反馈至所述监测模块20。
在其中一个实施例中，所述检测模块10包括电阻，所述电阻设置于所述螺钉与板卡载体接触的位置，用于检测所述螺钉与板卡载体接触时的电阻值；所述螺钉一般为导电体，板卡载体相当于地，因此，当所述螺钉与所述电阻接触时，相当于为所述电阻串联了一个新电阻，检测模块的输出电阻值因为与螺钉的接触而变大。当所述电子产品被拆开时，所述检测模块的输出电阻值随着所述螺钉的松开而变小，即检测模块10检测到输出电阻值变小时，说明所述板卡被拆离板卡载体。所述检测模块10将所述电阻值作为检测信号发送至所述监测模块20，实时将所述电阻值的变化反馈至所述监测模块20。
上述监测模块20，用于根据所述检测信号发送开启信号至所述损毁模块30。具体地，当所述检测信号为预设的检测信号时，例如所述检测模块10发送的压力信号小于预设的压力信号（所述螺钉与板卡载体拧紧时的压力信号）或光信号大于预设的光信号（所述螺钉与板卡载体拧紧时的光信号）或电阻值小于预设的电阻值（所述螺钉与板卡载体拧紧时的电阻值），说明所述板卡被拆离板卡载体，所述监测模块20发送开启信号至所述损毁模块30以控制损毁模块30开启工作。
上述损毁模块30，用于当接收到所述开启信号时，损毁所述板卡，其可能的实施方式如下：
在其中一个实施例中，所述损毁模块30包括设置于所述板卡的电路或电子元器件上方的低电压电容，通过在所述低压电容两端施加高压信号，以损毁电容下方的电路或电子元器件；从而损毁电子产品的板卡，致使非法拆机人员无法获得完整的板卡，通过非法手段抄袭电子产品；
在其中一个实施例中，所述损毁模块30包括电压转换电路，用于将低电压转换为高电压，通过在所述板卡中被保护电路的两端施加高压信号，以损毁被保护电路，从而损毁电子产品的关键部分，致使非法拆机人员无法获得完整的板卡，通过非法手段抄袭电子产品；
在其中一个实施例中，所述损毁模块30包括损毁电源，所述损毁电源的电极极性与所述整机产品中关键电子元器件的电源极性相反，通过在所述板卡中关键电子元器件的电源两端施加极性相反的电源，以损毁关键电子元器件，从而损毁电子产品的关键部分，致使非法拆机人员无法获得完整的板卡，通过非法手段抄袭电子产品。
所述损毁模块30只有在接收到所述开启信号时，才损毁所述板卡，在没有接收到所述开启信号时，处于非工作状态。在一些实施例中，上述损毁模块30可以通过上述中的一种方式或多种方式的组合实现。
参照图2，如图2所示为本发明板卡防拆装置第二较佳实施例结构示意图。基于本发明板卡防拆装置第一实施例结构示意图，所述板卡防拆装置还包括报警模块40，所述报警模块40与所述监测模块20电连接，所述监测模块20还用于根据所述检测信号发送报警信息至所述报警模块40，所述报警模块40用于根据所述报警信息报警。
具体地，当所述监测模块20接收到的所述检测信号在预设范围内（例如所述检测模块10发送的压力信号小于预设的压力信号或光信号大于预设的光信号或电阻值小于预设的电阻值，说明所述电子产品已经被拆开）时，发送报警信息至所述报警模块40，报警信息可以是“请不要非法拆机”，所述报警模块40根据所述报警信息报警，提示非法拆机者不要再尝试拆机。
所述板卡防拆装置还包括报警解除模块50，所述报警解除模块50与所述监测模块20电连接，用于获取报警解除信息并发送停止报警信息至所述监测模块20，所述监测模块20在接收到所述报警停止信息时停止输出报警信息。
具体地，可以在所述电子产品上设置一报警解除按钮，当所述报警解除按钮被按下时，所述报警解除模块50获取到报警解除信息，并发送停止报警信息至所述监测模块20，所述监测模块20在接收到所述报警停止信息时停止输出报警信息。防止所述报警模块40一直处于报警状态。
为实现上述目的，本发明还提供了一种板卡防拆方法。
参照图3，图3为本发明板卡防拆方法第一较佳实施例流程示意图。
所述板卡防拆方法包括如下步骤：
S1：检测模块检测板卡是否被拆离板卡载体，并将检测信号发送至监测模块；
S2：监测模块根据所述检测信号发送开启信号至所述损毁模块；
S3：损毁模块在接收到所述开启信号时，损毁所述板卡。
在一个实施例中，本发明所述电子产品包括板卡和多个板卡载体，板卡载体之间亦通过螺钉连接。具体地，所述板卡上包括有使所述电子产品正常工作的电路及其电子元器件，所述板卡通过螺钉固定于板卡载体上，板卡载体之间通过螺钉连接构成整个电子产品。在其他实施例中，所述板卡与板卡载体之间以及板卡载体与板卡载体之间还可以通过其他连接件连接，例如螺柱。另外，还可以在板卡载体上设置导轨，板卡通过导轨固定于板卡上。板卡和板卡载体之间以及板卡载体之间无论采用何种连接件，当板卡被拆离板卡载体时或者板卡载体被拆开时，连接件与板卡或者连接件与板卡载体之间的机械状态都会放生相对变化。
本发明所述板卡防拆方法优选地基于上述优选的电子产品的结构连接关系实现。
S1：检测模块检测板卡是否被拆离板卡载体，并将检测信号发送至监测模块；具体地，根据上述电子产品的构成及连接关系，所述检测模块优选设置于连接件处，当所述连接件被拆开时，所述检测模块检测到的检测信号会发生变化，当所述检测信号为预设的检测信号时，说明所述电子产品被拆开。所述检测模块发送检测信号至所述监测模块，实时将所述检测信号的变化反馈至所述监测模块。
S2：监测模块根据所述检测信号发送开启信号至所述损毁模块；具体地，当所述检测信号为预设的检测信号时，说明所述板卡被拆离板卡载体，所述监测模块发送开启信号至所述损毁模块以控制损毁模块开启工作。
S3：损毁模块在接收到所述开启信号时，损毁所述板卡。具体地，所述损毁模块只有在接收到所述开启信号时，才损毁所述板卡，即电子产品在未授权的情况下被非法拆开的情况下，为防止所述电子产品通过非正常手段被抄袭，通过毁损的方式保护电子产品。在没有接收到所述开启信号时，处于关闭状态。
本发明通过检测模块检测板卡是否被拆离板卡载体，在对电子产品防拆的同时，监测模块根据检测信号发送开启信号至损毁模块，通过损毁模块对电子产品进行损毁，进而防止他人对电子产品进行抄袭。
下面以电子产品的连接件为螺钉为例，介绍本发明板卡防拆方法实施例中各步骤的具体实施方式：
上述步骤S1：检测模块检测板卡是否被拆离板卡载体，并将检测信号发送至监测模块；
在其中一个实施例中，所述检测模块包括压力传感器，所述压力传感器设置于所述连接件与板卡载体接触的位置，所述检测模块检测所述连接件与板卡载体之间的压力信号，所述压力传感器设置于板卡与板卡载体之间以及板卡载体与板卡载体之间连接的螺钉处，可在每个连接的螺钉处均设置一个或者在其中几个螺钉处设置，能够检测板卡被拆离板卡载体以及板卡载体被拆开即可，所述压力传感器可以设置于所述螺钉与板卡载体接触的位置（螺钉上方与板卡载体接触的位置或螺钉下方与板卡载体接触的位置），用于检测所述螺钉与板卡载体之间的压力信号，当电子产品正常工作时，所述压力信号为正常的压力信号，当检测到所述板卡被拆离板卡载体时，所述压力信号发生变化，压力信号会随着螺钉的松开而变小。所述检测模块将所述压力信号作为检测信号发送至所述监测模块，实时将所述压力信号的变化反馈至所述监测模块。
在其中一个实施例中，所述检测模块包括发光单元和光接收单元，所述光接收单元用于接收所述发光单元发出的光信号，所述连接件设置于所述发光单元和所述光接收单元之间，优选地，所述发光单元和所述光接收单元设置为红外光发光单元和红外光接收单元。所述红外光发光单元在预设的周期内（例如1s）发射红外光信号，所述红外光接收单元被动接收所述红外光信号。所述电子产品未被拆开时，所述发光单元发出的光信号被所述螺钉挡住，所述光接收单元接收到的光信号最弱，当检测到所述板卡被拆离板卡载体时，所述光接收信号接收到的光信号随着所述螺钉的松开而变强（所述光信号因为没有被螺钉挡住，所述光接收单元接收到的光信号逐渐增多而变强），所述检测模块将所述光信号作为检测信号发送至所述监测模块，实时将所述光信号的变化反馈至所述监测模块。
在其中一个实施例中，所述检测模块包括电阻，所述电阻设置于所述连接件与板卡载体接触的位置，所述检测模块检测所述连接件与板卡载体接触时的电阻值，所述螺钉一般为导电体，板卡载体相当于地，因此，当所述螺钉与所述电阻接触时，相当于为所述电阻串联了一个新电阻，检测模块的输出电阻值因为与螺钉的接触而变大。当所述电子产品被拆开时，所述检测模块的输出电阻值随着所述螺钉的松开而变小，即检测模块检测到输出电阻值变小时，说明所述板卡被拆离板卡载体。所述检测模块将所述电阻值作为检测信号发送至所述监测模块，实时将所述电阻值的变化反馈至所述监测模块。
上述步骤S2：监测模块根据所述检测信号发送开启信号至所述损毁模块；
具体地，当所述检测信号为预设的检测信号时，例如所述检测模块发送的压力信号小于预设的压力信号（所述螺钉与板卡载体拧紧时的压力信号）或光信号大于预设的光信号（所述螺钉与板卡载体拧紧时的光信号）或电阻值小于预设的电阻值（所述螺钉与板卡载体拧紧时的电阻值），说明所述板卡被拆离板卡载体，所述监测模块发送开启信号至所述损毁模块以控制损毁模块开启工作。
上述步骤S3：损毁模块在接收到所述开启信号时，损毁所述板卡。其可能的实施方式如下：
在其中一个实施例中，通过在设置于所述板卡的电路或电子元器件上方的低电压电容两端施加高压信号以损毁电容下方的电路或电子元器件；从而损毁电子产品的板卡，致使非法拆机人员无法获得完整的板卡，通过非法手段抄袭电子产品；
在其中一个实施例中，通过在所述板卡中被保护电路的两端施加高压信号，以损毁被保护电路，从而损毁电子产品的关键部分，致使非法拆机人员无法获得完整的板卡，通过非法手段抄袭电子产品；
在其中一个实施例中，通过在所述板卡中关键电子元器件的电源两端施加极性相反的电源，以损毁关键电子元器件，从而损毁电子产品的关键部分，致使非法拆机人员无法获得完整的板卡，通过非法手段抄袭电子产品。
所述损毁模块只有在接收到所述开启信号时，才损毁所述板卡，在没有接收到所述开启信号时，处于非工作状态。在一些实施例中，上述损毁模块可以通过上述中的一种方式或多种方式的组合实现。
参照图4，图4为本发明板卡防拆方法第二较佳实施例流程示意图。
基于本发明板卡防拆方法第二实施例流程示意图，在步骤S3之后所述板卡防拆方法还包括如下步骤：
S4：监测模块根据所述检测信号发送报警信息至所述报警模块；
S5：报警模块根据所述报警信息报警；
S6：报警解除模块获取报警解除信息并发送停止报警信息至所述监测模块；
S7：监测模块在接收到所述报警停止信息时停止输出报警信息。
具体地，当所述监测模块接收到的所述检测信号在预设范围内（例如所述检测模块发送的压力信号小于预设的压力信号或光信号大于预设的光信号或电阻值小于预设的电阻值，说明所述电子产品已经被拆开）时，发送报警信息至所述报警模块，报警信息可以是“请不要非法拆机”，所述报警模块根据所述报警信息报警，提示非法拆机者不要再尝试拆机。
具体地，可以在所述电子产品上设置一报警解除按钮，当所述报警解除按钮被按下时，所述报警解除模块获取到报警解除信息，并发送停止报警信息至所述监测模块，所述监测模块在接收到所述报警停止信息时停止输出报警信息。防止所述报警模块一直处于报警状态。
在另外一个实施例中，所述基于本发明板卡防拆方法第二实施例流程示意图，在步骤S3之后所述板卡防拆方法包括上述步骤S4和步骤S5；在另外一个实施例中，所述基于本发明板卡防拆方法第二实施例流程示意图，在步骤S3之后所述板卡防拆方法包括上述步骤S6和步骤S7。
本发明采用上述技术方案，带来的技术效果为：本发明通过检测模块检测板卡是否被拆离板卡载体，在对电子产品防拆的同时，监测模块根据检测信号发送开启信号至损毁模块，通过损毁模块对电子产品进行损毁，进而防止他人对电子产品进行抄袭。
以上仅为本发明的较佳实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (13)

  1. 一种板卡防拆装置，其特征在于，所述板卡防拆装置包括检测模块、监测模块和损毁模块，所述板卡与板卡载体通过连接件连接，
    所述检测模块，设置于所述连接件处，与所述监测模块电连接，用于检测所述板卡是否被拆离所述板卡载体，并发送检测信号至所述监测模块；
    所述监测模块，用于根据所述检测信号发送开启信号至所述损毁模块；
    所述损毁模块，与所述监测模块电连接，用于在接收到所述开启信号时，损毁所述板卡。
  2. 如权利要求1所述的板卡防拆装置，其特征在于，所述损毁模块包括设置于所述板卡的电路或电子元器件上方的低电压电容，通过在所述低压电容两端施加高压信号，以损毁电容下方的电路或电子元器件；
    或者所述损毁模块包括电压转换电路，用于将低电压转换为高电压，通过在所述板卡中被保护电路的两端施加高压信号，以损毁被保护电路；
    或者所述损毁模块包括损毁电源，所述损毁电源的电极极性与所述整机产品中关键电子元器件的电源极性相反，通过在所述板卡中关键电子元器件的电源两端施加极性相反的电源，以损毁关键电子元器件。
  3. 如权利要求1所述的板卡防拆装置，其特征在于，
    所述检测模块包括压力传感器，所述压力传感器设置于所述连接件与板卡载体接触的位置，用于检测所述连接件与板卡载体之间的压力信号，并将所述压力信号作为检测信号发送至所述监测模块；
    或者，所述检测模块包括发光单元和光接收单元，所述连接件设置于所述发光单元和所述光接收单元之间，所述光接收单元用于接收所述发光单元发出的光信号，并将所述光信号作为检测信号发送至所述监测模块；
    或者，所述检测模块包括电阻，所述电阻设置于所述连接件与板卡载体接触的位置，用于检测所述连接件与板卡载体接触时的电阻值，并将所述电阻值作为检测信号发送至所述监测模块。
  4. 如权利要求3所述的板卡防拆装置，其特征在于，所述损毁模块包括设置于所述板卡的电路或电子元器件上方的低电压电容，通过在所述低压电容两端施加高压信号，以损毁电容下方的电路或电子元器件；
    或者所述损毁模块包括电压转换电路，用于将低电压转换为高电压，通过在所述板卡中被保护电路的两端施加高压信号，以损毁被保护电路；
    或者所述损毁模块包括损毁电源，所述损毁电源的电极极性与所述整机产品中关键电子元器件的电源极性相反，通过在所述板卡中关键电子元器件的电源两端施加极性相反的电源，以损毁关键电子元器件。
  5. 如权利要求1所述的板卡防拆装置，其特征在于，所述板卡防拆装置还包括报警模块，所述报警模块与所述监测模块电连接，所述监测模块还用于根据所述检测信号发送报警信息至所述报警模块，所述报警模块用于根据所述报警信息报警。
  6. 如权利要求5所述的板卡防拆装置，其特征在于，所述损毁模块包括设置于所述板卡的电路或电子元器件上方的低电压电容，通过在所述低压电容两端施加高压信号，以损毁电容下方的电路或电子元器件；
    或者所述损毁模块包括电压转换电路，用于将低电压转换为高电压，通过在所述板卡中被保护电路的两端施加高压信号，以损毁被保护电路；
    或者所述损毁模块包括损毁电源，所述损毁电源的电极极性与所述整机产品中关键电子元器件的电源极性相反，通过在所述板卡中关键电子元器件的电源两端施加极性相反的电源，以损毁关键电子元器件。
  7. 如权利要求5所述的板卡防拆装置，其特征在于，所述板卡防拆装置还包括报警解除模块，所述报警解除模块与所述监测模块电连接，用于获取报警解除信息并发送停止报警信息至所述监测模块，所述监测模块在接收到所述报警停止信息时停止输出报警信息。
  8. 如权利要求7所述的板卡防拆装置，其特征在于，所述损毁模块包括设置于所述板卡的电路或电子元器件上方的低电压电容，通过在所述低压电容两端施加高压信号，以损毁电容下方的电路或电子元器件；
    或者所述损毁模块包括电压转换电路，用于将低电压转换为高电压，通过在所述板卡中被保护电路的两端施加高压信号，以损毁被保护电路；
    或者所述损毁模块包括损毁电源，所述损毁电源的电极极性与所述整机产品中关键电子元器件的电源极性相反，通过在所述板卡中关键电子元器件的电源两端施加极性相反的电源，以损毁关键电子元器件。
  9. 一种板卡防拆方法，其特征在于，所述板卡防拆方法包括如下步骤：
    S1：检测模块检测板卡是否被拆离板卡载体，并将检测信号发送至监测模块；
    S2：监测模块根据所述检测信号发送开启信号至所述损毁模块；
    S3：损毁模块在接收到所述开启信号时，损毁所述板卡。
  10. 如权利要求9所述的板卡防拆方法，其特征在于，所述步骤S1具体为：
    所述检测模块包括压力传感器，所述压力传感器设置于所述连接件与板卡载体接触的位置，所述压力传感器检测所述连接件与板卡载体之间的压力信号，并将所述压力信号作为检测信号发送至所述监测模块；
    或者，所述检测模块包括发光单元和光接收单元，所述连接件设置于所述发光单元和所述光接收单元之间，所述光接收单元接收所述发光单元发出的光信号，并将所述光信号作为检测信号发送至所述监测模块；
    或者，所述检测模块包括电阻，所述电阻设置于所述连接件与板卡载体接触的位置，所述电阻检测所述连接件与板卡载体接触时的电阻值，并将所述电阻值作为检测信号发送至所述监测模块。
  11. 如权利要求9所述的板卡防拆方法，其特征在于，所述板卡防拆方法还包括如下步骤：
    S4：监测模块根据所述检测信号发送报警信息至所述报警模块；
    S5：报警模块根据所述报警信息报警。
  12. 如权利要求11所述的板卡防拆方法，其特征在于，所述板卡防拆方法还包括如下步骤：
    S6：报警解除模块获取报警解除信息并发送停止报警信息至所述监测模块；
    S7：监测模块在接收到所述报警停止信息时停止输出报警信息。
  13. 如权利要求10所述的板卡防拆方法，其特征在于，所述步骤S3中，损毁模块接收到所述开启信号时，通过下述中的一种方式或多种方式的组合损毁所述板卡：
    通过在设置于所述板卡的电路或电子元器件上方的低电压电容两端施加高压信号以损毁电容下方的电路或电子元器件；
    或者通过在所述板卡中被保护电路的两端施加高压信号，以损毁被保护电路；
    或者通过在所述板卡中关键电子元器件的电源两端施加极性相反的电源，以损毁关键电子元器件。
PCT/CN2015/076165 2015-03-10 2015-04-09 板卡防拆装置和方法 WO2016141619A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510105347.7 2015-03-10
CN201510105347.7A CN104820810A (zh) 2015-03-10 2015-03-10 板卡防拆装置和方法

Publications (1)

Publication Number Publication Date
WO2016141619A1 true WO2016141619A1 (zh) 2016-09-15

Family

ID=53731103

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/076165 WO2016141619A1 (zh) 2015-03-10 2015-04-09 板卡防拆装置和方法

Country Status (2)

Country Link
CN (1) CN104820810A (zh)
WO (1) WO2016141619A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111999686A (zh) * 2020-07-25 2020-11-27 苏州浪潮智能科技有限公司 一种提高扣板通信稳定性的装置及方法
CN113543547A (zh) * 2021-07-12 2021-10-22 重庆昕晟环保科技有限公司 一种二次供水用防破解控制器

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017219328A1 (zh) * 2016-06-23 2017-12-28 彭鹏 电子产品防拆检测装置
WO2017219329A1 (zh) * 2016-06-23 2017-12-28 彭鹏 整机产品防拆检测装置
CN109945911A (zh) * 2017-12-15 2019-06-28 富泰华工业（深圳）有限公司 电子装置、拆机监测装置及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2133812A1 (en) * 2007-03-26 2009-12-16 Pingxiao Deng A tamper-resistant detecting device with self-destructed protection function and a method thereof
CN102541766A (zh) * 2011-12-14 2012-07-04 北京博大光通国际半导体技术有限公司 基于wsn基站控制的具有安全信息防护功能的涉密存储器
CN103456108A (zh) * 2013-08-29 2013-12-18 深圳市新国都技术股份有限公司 一种带非接触式保护开关的机壳和pos机
CN103839014A (zh) * 2014-03-19 2014-06-04 深圳市亿道信息技术有限公司 一种平板电脑存储设备自毁电路
CN203896618U (zh) * 2014-04-30 2014-10-22 深圳市海能达通信有限公司 电路防拆保护装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1458624A (zh) * 2003-05-15 2003-11-26 薛根 一种能发出自毁命令的用户识别卡卡座
TW201009636A (en) * 2008-08-18 2010-03-01 Gemtek Technology Co Ltd Electronic device for preventing improper disassembling
CN201667075U (zh) * 2010-03-22 2010-12-08 深圳市新国都技术股份有限公司 一种用于保护数据电路的螺钉防护装置
CN201667076U (zh) * 2010-04-02 2010-12-08 深圳市新国都技术股份有限公司 一种机壳防拆保护结构
CN102509052B (zh) * 2011-10-28 2014-05-07 深圳市新国都技术股份有限公司 电子设备触摸屏安全保护方法与装置
CN103294141A (zh) * 2012-04-16 2013-09-11 关涛 一种安全防护电脑机箱
CN103942509A (zh) * 2014-04-11 2014-07-23 立德高科(北京)数码科技有限责任公司 带有自毁性防护组件的防伪识别设备以及自毁性防护方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2133812A1 (en) * 2007-03-26 2009-12-16 Pingxiao Deng A tamper-resistant detecting device with self-destructed protection function and a method thereof
CN102541766A (zh) * 2011-12-14 2012-07-04 北京博大光通国际半导体技术有限公司 基于wsn基站控制的具有安全信息防护功能的涉密存储器
CN103456108A (zh) * 2013-08-29 2013-12-18 深圳市新国都技术股份有限公司 一种带非接触式保护开关的机壳和pos机
CN103839014A (zh) * 2014-03-19 2014-06-04 深圳市亿道信息技术有限公司 一种平板电脑存储设备自毁电路
CN203896618U (zh) * 2014-04-30 2014-10-22 深圳市海能达通信有限公司 电路防拆保护装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111999686A (zh) * 2020-07-25 2020-11-27 苏州浪潮智能科技有限公司 一种提高扣板通信稳定性的装置及方法
CN111999686B (zh) * 2020-07-25 2022-10-18 苏州浪潮智能科技有限公司 一种提高扣板通信稳定性的装置及方法
CN113543547A (zh) * 2021-07-12 2021-10-22 重庆昕晟环保科技有限公司 一种二次供水用防破解控制器

Also Published As

Publication number Publication date
CN104820810A (zh) 2015-08-05

Similar Documents

Publication Publication Date Title
WO2016141619A1 (zh) 板卡防拆装置和方法
WO2011113332A1 (zh) 电子密码开锁方法和电子密码锁装置
WO2012015171A2 (ko) 해커 바이러스 보안통합관리기
WO2013036065A2 (ko) 비접촉식 온도 감시 장치
US7764176B2 (en) Entry and exit confirmation system and method
WO2020048009A1 (zh) 过流保护驱动电路及显示装置
WO2016141617A1 (zh) 电子产品保护装置和方法
WO2019203409A1 (ko) 부가기능 확장형 화재감지기
WO2019164047A1 (ko) 열화상을 이용한 수배전반 모니터링 장치, 방법 및 컴퓨터-판독가능기록매체
WO2011019144A2 (ko) 전자 패치 장치, 네트워크 시스템 및 네트워크 시스템에서의 동작 방법
WO2017096934A1 (zh) 一种基于移动终端的健康数据授权方法及服务器
WO2014038835A1 (ko) 네트워크 백업 장치 및 이를 구비한 네트워크 시스템
WO2018139802A1 (ko) 전력 공급 장치 및 그 전력 공급 장치를 포함하는 전력 공급 시스템
WO2021118062A1 (ko) 태양전지 모듈 모니터링 장치 및 방법
WO2023075228A1 (ko) 전력 설비를 위한 양방향 제어시스템
WO2019245185A1 (en) Electronic apparatus and control method thereof
WO2015053462A1 (ko) 패치패널 및 이를 구비하는 패치코드 관리 시스템
WO2022019496A1 (ko) 디스플레이 장치, 그 제어 방법 및 ic 칩
WO2021221323A1 (ko) 주소형 화재감지장치 및 이를 포함하는 주소형 화재감지시스템
WO2013151217A1 (en) Protection apparatus and control method for the same
WO2019103443A1 (en) Method, apparatus and system for managing electronic fingerprint of electronic file
WO2017099448A1 (ko) 법정선량계를 결합하는 스마트 선량계
WO2019221362A1 (ko) 셀프 파워 계전기 및 이의 오동작 방지 방법
WO2022065606A1 (ko) 신체 부착이 가능한 체온 이상 알림 장치
WO2017116028A1 (ko) 센서 제어 시스템 및 방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15884302

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15884302

Country of ref document: EP

Kind code of ref document: A1