WO2016130709A1 - Fabrication of three-dimensional structures by in-flight curing of aerosols - Google Patents
Fabrication of three-dimensional structures by in-flight curing of aerosols Download PDFInfo
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- WO2016130709A1 WO2016130709A1 PCT/US2016/017396 US2016017396W WO2016130709A1 WO 2016130709 A1 WO2016130709 A1 WO 2016130709A1 US 2016017396 W US2016017396 W US 2016017396W WO 2016130709 A1 WO2016130709 A1 WO 2016130709A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/159—Processes of additive manufacturing using only gaseous substances, e.g. vapour deposition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/165—Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/245—Platforms or substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0058—Liquid or visquous
- B29K2105/0061—Gel or sol
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/16—Fillers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
- B29K2509/02—Ceramics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
Definitions
- the present invention is related to the fabrication of 3D electrical and mechanical structures, microstructures, and nanostructures by in-flight curing of aerosol jetted nanoparticle and polymeric inks.
- Three-dimensional printing is a rapidly evolving technology which promises to revolutionize additive manufacturing.
- various structural materials such as plastics and metals can be fabricated into net-shaped structures without the need for subtractive machining or etching steps.
- 3D printing technologies are currently available today and it is useful to briefly compare these technologies to the current invention.
- Stereolithography is an additive manufacturing process that works by focusing an ultraviolet (UV) laser on to a vat of photopolymer resin.
- UV ultraviolet
- CAM/CAD computer aided design
- the UV laser is used to draw a pre-programmed design or shape on to the surface of the photopolymer vat.
- photopolymers are photosensitive under ultraviolet light
- the irradiated resin is solidified and forms a single layer of the desired 3D object. This process is repeated for each layer of the design until the 3D object is complete.
- Layer resolution of 50-150 urn is typically with lateral dimension approaching 10 urn.
- the process is generally limited to photopolymer materials and sacrificial structures are required to support overhangs.
- Ink jet technologies are typically used to print graphitic and pigmented inks in 2D. Recent materials innovations enable ink jet printers to jet polymeric and metal nanoparticle inks. Generally the inks used in ink jet printing must have relatively low viscosity, meaning the inks will spread substantially after printing, thus limiting the minimum feature size and aspect ratio of the printed features. The ink jetter does not contact the substrate, but it is in close proximity (less than mm).
- Extrusion technologies are popular for 3D printing of thermoplastic polymers.
- a thermal plastic is heated to the melting point in a nozzle and extruded onto a substrate.
- the plastic rapidly cools and solidifies on contacting the substrate, and a three-dimensional shape can be maintained.
- 3D parts are typically fabricated layer wise, with each layer consisting of a raster pattern of extruded filament. Overhangs can be fabricated by extruding a sacrificial support material and later dissolving or mechanically removing the support structure.
- feature sizes are hundreds of microns, and materials are largely limited to thermoplastics and a few thermoset polymers, as well as conductive pastes.
- the nScrypt tool is capable of printing on 3D surfaces by robotic CAD/CAM control of the nozzle positioning.
- the present invention is a method for fabricating a three-dimensional structure on a substrate, the method comprising propelling aerosol droplets from a deposition head toward the substrate, partially modifying a property of the aerosol droplets in-flight, and fully modifying the property of the aerosol droplets once they have been deposited as part of the three-dimensional structure.
- Modifying a property optionally comprises curing, for example ultraviolet (UV) light curing, or solidifying using electromagnetic radiation.
- aerosol droplets preferably comprise a photocurable polymer, and the fabricated three-dimensional structure comprises a cured polymer.
- the aerosol droplets optionally comprise solid particles dispersed in the photocurable polymer, and the fabricated three-dimensional structure comprises a cured polymer comprising embedded solid particles.
- the solid particles optionally comprise a ceramic, a metal, a fiber, or silicon.
- the aerosol droplets comprise a solvent and modifying a property comprises evaporating the solvent.
- These aerosol droplets optionally comprise metal nanoparticles, in which case the method preferably further comprises irradiating the aerosol droplets with UV radiation, heating the metal nanoparticles, and heating the aerosol droplets sufficiently to at least partially evaporate the solvent. The method preferably further comprises continuing to irradiate the metal nanoparticles after they have been deposited, thereby at least partially sintering the metal nanoparticles.
- the method optionally comprises tilting or translating the deposition head with respect to the substrate.
- the method optionally comprises fabricating an overhanging structure without requiring a sacrificial support or tilting the deposition head or the substrate.
- the standoff distance between the deposition head and the substrate is preferably at least 1 mm, and more preferably at least 2 mm.
- the method preferably comprises increasing the viscosity of the aerosol droplets in-flight, and preferably comprises irradiating the aerosol droplets with electromagnetic radiation in-flight and after the aerosol droplets have been deposited, optionally from more than one direction in-flight.
- the method optionally comprises heating the aerosol droplets with electromagnetic radiation in-flight and after the aerosol droplets have been deposited.
- the fabricated three-dimensional structure optionally comprises a structure selected from the group consisting of a micron-scale surface texture, a mechanical interposer, a precision spacer, a mechanical interposer comprising embedded electrical connectors, an enclosed, hollow structure, a mechanical scaffold, and a functional electrical wire.
- FIG. 1 is a schematic illustrating a mechanism for three-dimensional printing with aerosol jets.
- FIGS. 2A-2C are images of an array of polymer posts printed according to an embodiment of the present invention.
- FIG. 2D is a graph showing the post build rate.
- FIG. 3 is an image of an array of composite posts.
- FIGS. 4A and 4B are perspective and top views, respectively, of an interposer printed in accordance with an embodiment of the present invention.
- FIG. 5A shows three-dimensional jack-like structures printed using the offset approach shown in FIG. 1 .
- FIG. 5B shows an open cone structure.
- FIGS. 6A and 6B show a closed channel having an open interior along the length.
- FIG. 6C shows ink flowing on the inside of the channel.
- FIGS. 7A and 7B show an individual antenna and an array of antennas, respectively, having an L- shape printed post.
- FIGS. 7C and 7D are images of 3D electrical components printed on a microchip.
- FIG. 8A shows freestanding polymer springs fabricated by tilting the print head during printing.
- FIG. 8B shows the springs supporting a mass.
- FIG. 9A is a graph showing the optical density of silver nanoparticles.
- FIG. 9B shows a 3D silver wire array printed with the in-situ illumination method.
- FIGS. 10A-10F are images of various 3D shapes printed using UV polymers and on-the-fly curing.
- the present invention is a method of making three-dimensional structures, such as structures comprising high aspect ratio features, using in-flight curing of aerosols and inks, and direct printing of liquid materials to fabricate three-dimensional, free standing, complex structures.
- embodiments of the present invention combine patented Aerosol Jet dispensing technology, such as that described in U.S. Patent Nos. 7,674,671 , 7,938,079, and 7,987,813, with an in-flight materials processing mechanism that enables liquid droplets to partially solidify before depositing on a surface. After the inflight processing, the droplets can be deposited to form free standing structures.
- Some of the advantages of this approach include ultra-high resolution three-dimensional (3D) printing, with features sizes down to 10 microns, lateral feature resolution to 1 micron, and vertical resolution to 100 nm.
- the aspect ratio of the free standing structures can be more than 100, and the structures can be printed on nearly any surface and surface geometry by manipulating the tilt and location of the print head relative to those surfaces.
- Overhangs and closed cells can be printed directly, without using sacrificial support materials.
- Both metal and insulating materials can be processed, which enables the co-deposition of electronic materials for fabricating circuits in 3D.
- composite materials can be printed, which allow for the tailoring of the mechanical and electrical properties of the 3D structures.
- UV polymers can be cured in-flight as they are impacting on the target, and low sintering temperatures enable metallization of plastics.
- Aerosol Jet process practically any type of material and/or solvent can be printed. The large standoff from the substrate (typically a few millimeters) for this process enables high aspect printing without any z-axis motion. Sub-10 micron focusing of the aerosol jet enables creation of ultrafine features.
- Aerosol Jet printing is a non-contact, aerosol-based jetting technology.
- the starting inks are formulated with low viscosity (0.5 to 1000 cP) and in the typical process they are first aerosolized into a fine droplet dispersion of 1 -5 urn diameter droplets.
- nitrogen gas entrains the droplets and propels them through a fine nozzle (0.1 -1 mm inner diameter) to a target substrate for deposition.
- a co- flowing, preferably nitrogen sheath gas focuses the droplet jet down to a 10 urn diameter, which allows features of this size to be printed.
- the jetting technology is notable for the large standoff distance between the nozzle and substrate (several mm), the fine resolution (feature width 10 urn), volumetric dispense accuracy (10 femptoliter), and wide range of material compatibility. Because of the large standoff distance, it is possible to dry and/or otherwise cure the droplets during their flight to the substrate. In doing so, the viscosity of the droplets can be increased much beyond the starting viscosity. With higher viscosity, the printed inks are self supporting and can be built up into free standing columns and other high aspect ratio features. In order to increase the viscosity, UV light from either a lamp or a UV LED is preferably applied to the interstitial region between the nozzle exit and the target substrate, as shown in FIG. 1 .
- FIG. 1 is a schematic illustrating a mechanism for three-dimensional printing with aerosol jets.
- Micro 3D structures are manufactured preferably by using Aerosol Jet compatible low viscosity photocurable resins, which are preferably printed using Aerosol Jet technology.
- Electromagnetic radiation in this case ultraviolet light, illuminates and partially cures the droplets mid-flight.
- the partial curing increases the viscosity of the droplets, which in turn limits the spreading of the deposit on the substrate.
- the droplets coalesce on the target substrate and then fully cure.
- the top schematic shows the droplets stacking vertically.
- the lower schematic shows the droplets building an overhang structure as the substrate is translated beneath the print head. Up to 45 degree overhangs have been demonstrated, although even greater angles may be achieved.
- FIG. 2A is a photograph of vertical polymer posts printed with Loctite 3104 acrylic urethane and simultaneous UV LED curing.
- the incident UV power was 0.65 mW
- the UV wavelength was 385 nm
- volumetric print rate was 7.5 nL/s.
- the posts can extend from the target substrate substantially to the aerosol jet nozzle outlet.
- FIG. 2B is a magnified image of the post array; the post height is 1 .0mm, the height variation is 1 %, the spacing is 0.5 mm, and diameter is 90 ⁇ .
- FIG. 2C is an image of the top surface of the post array. The top of each post has a rounded, nearly hemispherical shape.
- FIG. 2D is a graph showing the measured build rate of a single post. The post height was found to be proportional to time when the print nozzle was stationary at a given location. The variation in height is approximately 1 %, or alternatively approximately 10 ⁇ for a 1 .0 mm tall post.
- FIG. 3 is an image of an array of composite posts. Silicon powder, having a particle size of less than 500 nm, was dispersed in a UV photopolymer resin at a concentration of 7% by volume. The composite dispersion was then printed and cured in-flight to produce solid posts of cured resin with embedded silicon.
- the post diameter is 120 ⁇ and the height is 1 .1 mm.
- Composite materials are desirable for optimizing mechanical and electrical properties of a 3D structure.
- the composition material is sufficiently transparent to the UV light that it is fully cured, even with single sided UV illumination.
- the composite resin may be opaque to the incident light. In that case, it may be necessary to illuminate the printing area from opposite sides, or illuminate the deposit with a ring lamp.
- the photopolymer can optionally be removed in a post-processing step, such as by heating the 3D structure to beyond the evaporation or decomposition point of the photopolymer.
- FIG. 4 shows images of a printed mechanical interposer, which is an element that provides structural support and precision spacing between two separated components.
- the interposer was printed by stacking multiple layers of UV resin, as can be seen in the perspective view of FIG. 4A.
- FIG. 4B shows the top surface grid pattern.
- an interposer can provide electrical or fluidic routing between one element or connection to another, in which case the interstitial spaces could be filled with conductive material or fluids.
- FIG. 5A shows three-dimensional jack-like structures printed using the offset approach shown in FIG. 1 .
- the lower 4 legs were printed while translating the print head in x- and y- directions to a vertex point.
- the angled post is at an approximate 45 degree angle with respect to the substrate.
- the top legs were printed by translating the print head away from the vertex.
- the overall height is 4mm and the individual post diameters are 60 ⁇ .
- FIG. 5B shows an open cone structure. This was printed by translating the stage in a repeating circular motion with increasing radius. If desired the cone could be closed by continuing the circular motion and decreasing the radius to zero.
- FIGS. 6A and 6B show a closed channel having an open interior along the length.
- Each sidewall of the channel was printed by stacking lines of photocurable polymer and sequentially offsetting by approximately 1 ⁇ 2 of a linewidth. This process resulted in a wall tilted at approximately 45 degrees in the direction of the offset. By offsetting in opposite directions, the walls touch at the midpoint.
- FIG. 6C depicts a drop of pigmented ink placed near the entrance to a channel, which is seen to be pulled through the channel by surface tension forces. This demonstrates that the channel is enclosed along the length but the channel is completely open from end to end.
- FIG. 7A shows a photocured post used as a mechanical support for an electrical component.
- the polymer post was fabricated using the process in FIG. 1 and it is approximately 1 mm tall by 0.1 mm wide.
- Silver ink was printed on the sidewall of the post and substrate by tilting the print head at 45 degrees with respect to each. The silver ink has low viscosity during printing and consequently will spread slightly on the substrate.
- the silver ink can be printed in three dimensions along the surface of the support.
- the silver ink was thermally sintered in a box oven at 150°C for 60 minutes.
- the resulting conductive pattern serves as a freestanding, millimeter wave dipole antenna.
- FIG. 7B shows an array of micro-antennas.
- FIGS. 1 shows an array of micro-antennas.
- 7C and 7D are images of 3D electrical components printed on a microchip.
- the process of the present invention eliminates complicated connections and waveguides that would otherwise have to be built into a package.
- This example shows that functional devices such as 3D electrical components (for example, heaters, antenna, and interconnects) can be printed directly on a driver chip.
- FIG. 8A shows freestanding polymer springs fabricated by tilting the print head during printing. The print head was tilted from 0° to -30° and back to 0° during build of each spring.
- FIG. 8B depicts a demonstration showing that the spring array can support a mechanical mass. In contrast to the vertical posts described previously, the springs provide a flexible interposer connection between two surfaces.
- FIG. 9 shows such an extension of the in-situ curing process to non- photocurable materials.
- FIG. 9A is a graph showing the increasing optical density (i.e. absorption spectra) of silver nanoparticles at UV wavelengths as the particle size decreases. The curves are strongly peaked around 410 nm, but the absorption edge extends into the visible, making the in-flight processing possible with common UV LED and Hg lamps.
- Ink droplets comprising silver nanoparticles dispersed in a solvent can thus be heated by absorbing UV light at wavelengths near 400 nm. If heated in-flight, the solvent will largely evaporate and result in a highly concentrated silver drop when it impacts on a surface.
- the metal nanoparticle droplets can retain their 3D shape, both because the carrier solvent is evaporated and also because the particles are partially sintered.
- the now higher viscosity silver droplets can be stacked in 3D, similar to the stacking of the photopolymer. Further illumination after printing, which heats the nanoparticles beyond the level required for evaporating the solvent, will cause the nanoparticles to at least partially sinter and become conductive.
- FIG. 9B shows a 3D silver wire array printed with the in-situ illumination method.
- the wire width is 40 ⁇ and the height is 0.8 mm.
- the wires are slightly bent due to the fact that only single sided illumination was used, which causes the wires to be heated more on the illumination side, leading to asymmetrical shrinkage.
- FIGS. 10A-10F are images of various 3D shapes printed using UV polymers and on-the-fly curing.
- FIG. 10A shows pillars (0.1 mm pitch, 0.25 mm tall).
- FIG. 10B shows a twisted sheet (0.5 mm width, 2 mm tall).
- FIG. 10C shows a box (1 mm length, 0.25 mm tall, 0.03 mm wall).
- FIG. 10D shows a hat (0.5 mm diameter, 0.5 mm tall).
- FIG. 10E shows a cone (0.5 mm diameter, 0.5 mm tall).
- FIG. 10F shows a bubble (0.5 mm diameter, 1 mm tall).
- UV illumination is being used to modify the properties of aerosol droplets as they are jetted onto a target surface.
- the UV light is at least partially curing photopolymer droplets, and the resulting increased viscosity facilitates the formation of free standing structures.
- the UV light alternatively causes droplets of solvent-based nanoparticle dispersions to rapidly dry in-flight, likewise enabling 3D fabrication.
- This 3D fabrication can be performed using a wide variety of photopolymer, nanoparticle dispersion, and composite materials.
- the resulting 3D shapes can be free standing, without supports, and can attain arbitrary shapes by manipulating the print nozzle relative to the target substrate.
- the feature size is primarily determined by the jetting process, and can go down to 10 ⁇ or even lower.
Abstract
A method for fabricating three-dimensional structures. In-flight heating or UV illumination modifies the properties of aerosol droplets as they are jetted onto a target surface. The UV light at least partially cures photopolymer droplets, or alternatively causes droplets of solvent-based nanoparticle dispersions to rapidly dry in-flight, and the resulting increased viscosity of the aerosol droplets facilitates the formation of free standing three-dimensional structures. This 3D fabrication can be performed using a wide variety of photopolymer, nanoparticle dispersion, and composite materials. The resulting 3D shapes can be free standing, fabricated without supports, and can attain arbitrary shapes by manipulating the print nozzle relative to the target substrate.
Description
INTERNATIONAL PATENT APPLICATION
FABRICATION OF THREE-DIMENSIONAL STRUCTURES BY IN-FLIGHT CURING OF AEROSOLS
CROSS-REFERENCE TO RELATED APPLICATIONS
This application claims priority to and the benefit of the filing of U.S. Provisional Patent
Application Serial No. 62/1 14,354, entitled "MICRO 3D PRINTING", filed on February 10, 2015, and the specification and claims thereof are incorporated herein by reference.
BACKGROUND OF THE INVENTION
Field Of The Invention (Technical Field)
The present invention is related to the fabrication of 3D electrical and mechanical structures, microstructures, and nanostructures by in-flight curing of aerosol jetted nanoparticle and polymeric inks.
Background Art
Note that the following discussion may refer to a number of publications and references.
Discussion of such publications herein is given for more complete background of the scientific principles and is not to be construed as an admission that such publications are prior art for patentability determination purposes.
Three-dimensional printing is a rapidly evolving technology which promises to revolutionize additive manufacturing. With 3D printing, various structural materials such as plastics and metals can be fabricated into net-shaped structures without the need for subtractive machining or etching steps. There is little materials waste and the reduced processing steps promise to make 3D printing a cost-effective, green technology. Several 3D printing technologies are currently available today and it is useful to briefly compare these technologies to the current invention.
Stereolithography is an additive manufacturing process that works by focusing an ultraviolet (UV) laser on to a vat of photopolymer resin. With the help of computer aided manufacturing or computer aided design (CAM/CAD) software, the UV laser is used to draw a pre-programmed design or shape on to the surface of the photopolymer vat. Because photopolymers are photosensitive under ultraviolet light,
the irradiated resin is solidified and forms a single layer of the desired 3D object. This process is repeated for each layer of the design until the 3D object is complete. Layer resolution of 50-150 urn is typically with lateral dimension approaching 10 urn. The process is generally limited to photopolymer materials and sacrificial structures are required to support overhangs.
Ink jet technologies are typically used to print graphitic and pigmented inks in 2D. Recent materials innovations enable ink jet printers to jet polymeric and metal nanoparticle inks. Generally the inks used in ink jet printing must have relatively low viscosity, meaning the inks will spread substantially after printing, thus limiting the minimum feature size and aspect ratio of the printed features. The ink jetter does not contact the substrate, but it is in close proximity (less than mm).
Extrusion technologies are popular for 3D printing of thermoplastic polymers. In this case, a thermal plastic is heated to the melting point in a nozzle and extruded onto a substrate. The plastic rapidly cools and solidifies on contacting the substrate, and a three-dimensional shape can be maintained. 3D parts are typically fabricated layer wise, with each layer consisting of a raster pattern of extruded filament. Overhangs can be fabricated by extruding a sacrificial support material and later dissolving or mechanically removing the support structure. Typically feature sizes are hundreds of microns, and materials are largely limited to thermoplastics and a few thermoset polymers, as well as conductive pastes. The nScrypt tool is capable of printing on 3D surfaces by robotic CAD/CAM control of the nozzle positioning. SUMMARY OF THE INVENTION (DISCLOSURE OF THE INVENTION)
The present invention is a method for fabricating a three-dimensional structure on a substrate, the method comprising propelling aerosol droplets from a deposition head toward the substrate, partially modifying a property of the aerosol droplets in-flight, and fully modifying the property of the aerosol droplets once they have been deposited as part of the three-dimensional structure. Modifying a property optionally comprises curing, for example ultraviolet (UV) light curing, or solidifying using electromagnetic radiation. In this embodiment aerosol droplets preferably comprise a photocurable polymer, and the fabricated three-dimensional structure comprises a cured polymer. The aerosol droplets optionally comprise solid particles dispersed in the photocurable polymer, and the fabricated three-dimensional structure comprises a cured polymer comprising embedded solid particles. The solid particles optionally
comprise a ceramic, a metal, a fiber, or silicon. In another embodiment, the aerosol droplets comprise a solvent and modifying a property comprises evaporating the solvent. These aerosol droplets optionally comprise metal nanoparticles, in which case the method preferably further comprises irradiating the aerosol droplets with UV radiation, heating the metal nanoparticles, and heating the aerosol droplets sufficiently to at least partially evaporate the solvent. The method preferably further comprises continuing to irradiate the metal nanoparticles after they have been deposited, thereby at least partially sintering the metal nanoparticles.
The method optionally comprises tilting or translating the deposition head with respect to the substrate. The method optionally comprises fabricating an overhanging structure without requiring a sacrificial support or tilting the deposition head or the substrate. The standoff distance between the deposition head and the substrate is preferably at least 1 mm, and more preferably at least 2 mm. The method preferably comprises increasing the viscosity of the aerosol droplets in-flight, and preferably comprises irradiating the aerosol droplets with electromagnetic radiation in-flight and after the aerosol droplets have been deposited, optionally from more than one direction in-flight. The method optionally comprises heating the aerosol droplets with electromagnetic radiation in-flight and after the aerosol droplets have been deposited. The fabricated three-dimensional structure optionally comprises a structure selected from the group consisting of a micron-scale surface texture, a mechanical interposer, a precision spacer, a mechanical interposer comprising embedded electrical connectors, an enclosed, hollow structure, a mechanical scaffold, and a functional electrical wire.
Objects, advantages and novel features, and further scope of applicability of the present invention will be set forth in part in the detailed description to follow, taken in conjunction with the accompanying drawings, and in part will become apparent to those skilled in the art upon examination of the following, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS
The accompanying drawings, which are incorporated into and form a part of the specification, illustrate several embodiments of the present invention and, together with the description, serve to explain
the principles of the invention. The drawings are only for the purpose of illustrating a preferred embodiment of the invention and are not to be construed as limiting the invention. In the drawings:
FIG. 1 is a schematic illustrating a mechanism for three-dimensional printing with aerosol jets.
FIGS. 2A-2C are images of an array of polymer posts printed according to an embodiment of the present invention. FIG. 2D is a graph showing the post build rate.
FIG. 3 is an image of an array of composite posts.
FIGS. 4A and 4B are perspective and top views, respectively, of an interposer printed in accordance with an embodiment of the present invention.
FIG. 5A shows three-dimensional jack-like structures printed using the offset approach shown in FIG. 1 . FIG. 5B shows an open cone structure.
FIGS. 6A and 6B show a closed channel having an open interior along the length. FIG. 6C shows ink flowing on the inside of the channel.
FIGS. 7A and 7B show an individual antenna and an array of antennas, respectively, having an L- shape printed post. FIGS. 7C and 7D are images of 3D electrical components printed on a microchip.
FIG. 8A shows freestanding polymer springs fabricated by tilting the print head during printing. FIG. 8B shows the springs supporting a mass.
FIG. 9A is a graph showing the optical density of silver nanoparticles. FIG. 9B shows a 3D silver wire array printed with the in-situ illumination method.
FIGS. 10A-10F are images of various 3D shapes printed using UV polymers and on-the-fly curing.
DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION
The present invention is a method of making three-dimensional structures, such as structures comprising high aspect ratio features, using in-flight curing of aerosols and inks, and direct printing of liquid materials to fabricate three-dimensional, free standing, complex structures. Specifically, embodiments of the present invention combine patented Aerosol Jet dispensing technology, such as that described in U.S. Patent Nos. 7,674,671 , 7,938,079, and 7,987,813, with an in-flight materials processing mechanism that enables liquid droplets to partially solidify before depositing on a surface. After the inflight processing, the droplets can be deposited to form free standing structures. Some of the advantages
of this approach include ultra-high resolution three-dimensional (3D) printing, with features sizes down to 10 microns, lateral feature resolution to 1 micron, and vertical resolution to 100 nm. The aspect ratio of the free standing structures can be more than 100, and the structures can be printed on nearly any surface and surface geometry by manipulating the tilt and location of the print head relative to those surfaces. Overhangs and closed cells can be printed directly, without using sacrificial support materials. Both metal and insulating materials can be processed, which enables the co-deposition of electronic materials for fabricating circuits in 3D. Furthermore, composite materials can be printed, which allow for the tailoring of the mechanical and electrical properties of the 3D structures. Ultraviolet (UV) polymers can be cured in-flight as they are impacting on the target, and low sintering temperatures enable metallization of plastics. Using an Aerosol Jet process, practically any type of material and/or solvent can be printed. The large standoff from the substrate (typically a few millimeters) for this process enables high aspect printing without any z-axis motion. Sub-10 micron focusing of the aerosol jet enables creation of ultrafine features.
Aerosol Jet printing is a non-contact, aerosol-based jetting technology. The starting inks are formulated with low viscosity (0.5 to 1000 cP) and in the typical process they are first aerosolized into a fine droplet dispersion of 1 -5 urn diameter droplets. Preferably nitrogen gas entrains the droplets and propels them through a fine nozzle (0.1 -1 mm inner diameter) to a target substrate for deposition. A co- flowing, preferably nitrogen sheath gas focuses the droplet jet down to a 10 urn diameter, which allows features of this size to be printed. The jetting technology is notable for the large standoff distance between the nozzle and substrate (several mm), the fine resolution (feature width 10 urn), volumetric dispense accuracy (10 femptoliter), and wide range of material compatibility. Because of the large standoff distance, it is possible to dry and/or otherwise cure the droplets during their flight to the substrate. In doing so, the viscosity of the droplets can be increased much beyond the starting viscosity. With higher viscosity, the printed inks are self supporting and can be built up into free standing columns and other high aspect ratio features. In order to increase the viscosity, UV light from either a lamp or a UV LED is preferably applied to the interstitial region between the nozzle exit and the target substrate, as shown in FIG. 1 . If the starting ink comprises a photopolymer with an absorption band overlapping the UV emission spectrum, the UV light can either fully or partially cure the photopolymer droplet in-flight, thereby increasing the viscosity.
FIG. 1 is a schematic illustrating a mechanism for three-dimensional printing with aerosol jets. Micro 3D structures are manufactured preferably by using Aerosol Jet compatible low viscosity photocurable resins, which are preferably printed using Aerosol Jet technology. Electromagnetic radiation, in this case ultraviolet light, illuminates and partially cures the droplets mid-flight. The partial curing increases the viscosity of the droplets, which in turn limits the spreading of the deposit on the substrate. The droplets coalesce on the target substrate and then fully cure. The top schematic shows the droplets stacking vertically. The lower schematic shows the droplets building an overhang structure as the substrate is translated beneath the print head. Up to 45 degree overhangs have been demonstrated, although even greater angles may be achieved.
FIG. 2A is a photograph of vertical polymer posts printed with Loctite 3104 acrylic urethane and simultaneous UV LED curing. The incident UV power was 0.65 mW, the UV wavelength was 385 nm and volumetric print rate was 7.5 nL/s. The posts can extend from the target substrate substantially to the aerosol jet nozzle outlet. FIG. 2B is a magnified image of the post array; the post height is 1 .0mm, the height variation is 1 %, the spacing is 0.5 mm, and diameter is 90 μηι. FIG. 2C is an image of the top surface of the post array. The top of each post has a rounded, nearly hemispherical shape. FIG. 2D is a graph showing the measured build rate of a single post. The post height was found to be proportional to time when the print nozzle was stationary at a given location. The variation in height is approximately 1 %, or alternatively approximately 10 μηι for a 1 .0 mm tall post.
In-flight processing is also possible when solid particles, such as ceramics, metals, or fibers, are dispersed in the photopolymer ink. In this case, the cured photopolymer serves as a 3D mechanical support for the solid particles. The mechanical and electrical properties of this composite material can be optimized by, for example, providing wear and abrasion resistance, as well as forming 3D electrical conductors. FIG. 3 is an image of an array of composite posts. Silicon powder, having a particle size of less than 500 nm, was dispersed in a UV photopolymer resin at a concentration of 7% by volume. The composite dispersion was then printed and cured in-flight to produce solid posts of cured resin with embedded silicon. The post diameter is 120 μηι and the height is 1 .1 mm. Composite materials are desirable for optimizing mechanical and electrical properties of a 3D structure. In this example the composition material is sufficiently transparent to the UV light that it is fully cured, even with single sided UV illumination. At greater concentrations and with highly absorbing particles, the composite resin may
be opaque to the incident light. In that case, it may be necessary to illuminate the printing area from opposite sides, or illuminate the deposit with a ring lamp. As long as the UV resin is curing near the outer surface of the 3D structure, sufficient mechanical support will allow the structure to build vertically. The photopolymer can optionally be removed in a post-processing step, such as by heating the 3D structure to beyond the evaporation or decomposition point of the photopolymer.
FIG. 4 shows images of a printed mechanical interposer, which is an element that provides structural support and precision spacing between two separated components. The interposer was printed by stacking multiple layers of UV resin, as can be seen in the perspective view of FIG. 4A. FIG. 4B shows the top surface grid pattern. In some embodiments an interposer can provide electrical or fluidic routing between one element or connection to another, in which case the interstitial spaces could be filled with conductive material or fluids.
FIG. 5A shows three-dimensional jack-like structures printed using the offset approach shown in FIG. 1 . The lower 4 legs were printed while translating the print head in x- and y- directions to a vertex point. The angled post is at an approximate 45 degree angle with respect to the substrate. The top legs were printed by translating the print head away from the vertex. The overall height is 4mm and the individual post diameters are 60 μηι. FIG. 5B shows an open cone structure. This was printed by translating the stage in a repeating circular motion with increasing radius. If desired the cone could be closed by continuing the circular motion and decreasing the radius to zero.
FIGS. 6A and 6B show a closed channel having an open interior along the length. Each sidewall of the channel was printed by stacking lines of photocurable polymer and sequentially offsetting by approximately ½ of a linewidth. This process resulted in a wall tilted at approximately 45 degrees in the direction of the offset. By offsetting in opposite directions, the walls touch at the midpoint. FIG. 6C depicts a drop of pigmented ink placed near the entrance to a channel, which is seen to be pulled through the channel by surface tension forces. This demonstrates that the channel is enclosed along the length but the channel is completely open from end to end.
FIG. 7A shows a photocured post used as a mechanical support for an electrical component. The polymer post was fabricated using the process in FIG. 1 and it is approximately 1 mm tall by 0.1 mm wide. Silver ink was printed on the sidewall of the post and substrate by tilting the print head at 45 degrees with respect to each. The silver ink has low viscosity during printing and consequently will
spread slightly on the substrate. By providing a mechanical support, the silver ink can be printed in three dimensions along the surface of the support. After printing, the silver ink was thermally sintered in a box oven at 150°C for 60 minutes. The resulting conductive pattern serves as a freestanding, millimeter wave dipole antenna. FIG. 7B shows an array of micro-antennas. FIGS. 7C and 7D are images of 3D electrical components printed on a microchip. The process of the present invention eliminates complicated connections and waveguides that would otherwise have to be built into a package. This example shows that functional devices such as 3D electrical components (for example, heaters, antenna, and interconnects) can be printed directly on a driver chip.
FIG. 8A shows freestanding polymer springs fabricated by tilting the print head during printing. The print head was tilted from 0° to -30° and back to 0° during build of each spring. FIG. 8B depicts a demonstration showing that the spring array can support a mechanical mass. In contrast to the vertical posts described previously, the springs provide a flexible interposer connection between two surfaces.
In the case of solvent based inks, such as metal nanoparticle dispersions, the droplet viscosity can be increased by partially or fully drying the droplet during flight. Since metal nanoparticles are known to be highly absorbing to UV light, exposing the droplets to UV illumination will heat the nanoparticles and accelerate the solvent evaporation. FIG. 9 shows such an extension of the in-situ curing process to non- photocurable materials. FIG. 9A is a graph showing the increasing optical density (i.e. absorption spectra) of silver nanoparticles at UV wavelengths as the particle size decreases. The curves are strongly peaked around 410 nm, but the absorption edge extends into the visible, making the in-flight processing possible with common UV LED and Hg lamps. Ink droplets comprising silver nanoparticles dispersed in a solvent can thus be heated by absorbing UV light at wavelengths near 400 nm. If heated in-flight, the solvent will largely evaporate and result in a highly concentrated silver drop when it impacts on a surface. The metal nanoparticle droplets can retain their 3D shape, both because the carrier solvent is evaporated and also because the particles are partially sintered. The now higher viscosity silver droplets can be stacked in 3D, similar to the stacking of the photopolymer. Further illumination after printing, which heats the nanoparticles beyond the level required for evaporating the solvent, will cause the nanoparticles to at least partially sinter and become conductive. FIG. 9B shows a 3D silver wire array printed with the in-situ illumination method. The wire width is 40 μηι and the height is 0.8 mm. The wires
are slightly bent due to the fact that only single sided illumination was used, which causes the wires to be heated more on the illumination side, leading to asymmetrical shrinkage.
FIGS. 10A-10F are images of various 3D shapes printed using UV polymers and on-the-fly curing. FIG. 10A shows pillars (0.1 mm pitch, 0.25 mm tall). FIG. 10B shows a twisted sheet (0.5 mm width, 2 mm tall). FIG. 10C shows a box (1 mm length, 0.25 mm tall, 0.03 mm wall). FIG. 10D shows a hat (0.5 mm diameter, 0.5 mm tall). FIG. 10E shows a cone (0.5 mm diameter, 0.5 mm tall). FIG. 10F shows a bubble (0.5 mm diameter, 1 mm tall).
In embodiments of the present invention, UV illumination is being used to modify the properties of aerosol droplets as they are jetted onto a target surface. Specifically, the UV light is at least partially curing photopolymer droplets, and the resulting increased viscosity facilitates the formation of free standing structures. The UV light alternatively causes droplets of solvent-based nanoparticle dispersions to rapidly dry in-flight, likewise enabling 3D fabrication. This 3D fabrication can be performed using a wide variety of photopolymer, nanoparticle dispersion, and composite materials. The resulting 3D shapes can be free standing, without supports, and can attain arbitrary shapes by manipulating the print nozzle relative to the target substrate. The feature size is primarily determined by the jetting process, and can go down to 10 μηι or even lower.
Although the invention has been described in detail with particular reference to the disclosed embodiments, other embodiments can achieve the same results. Variations and modifications of the present invention will be obvious to those skilled in the art and it is intended to cover all such
modifications and equivalents. The entire disclosures of all patents and publications cited above are hereby incorporated by reference.
Claims
1 . A method for fabricating a three-dimensional structure on a substrate, the method comprising:
propelling aerosol droplets from a deposition head toward the substrate;
partially modifying a property of the aerosol droplets in-flight; and
fully modifying the property of the aerosol droplets once they have been deposited as part of the three-dimensional structure.
2. The method of claim 1 wherein modifying a property comprises curing or solidifying using electromagnetic radiation.
3. The method of claim 2 wherein curing comprises ultraviolet (UV) light curing.
4. The method of claim 2 wherein the aerosol droplets comprise a photocurable polymer, and the fabricated three-dimensional structure comprises a cured polymer.
5. The method of claim 4 wherein the aerosol droplets comprise solid particles dispersed in the photocurable polymer, and the fabricated three-dimensional structure comprises a cured polymer comprising embedded solid particles.
6. The method of claim 5 wherein the solid particles comprise a ceramic, a metal, a fiber, or silicon.
7. The method of claim 1 wherein the aerosol droplets comprise a solvent and modifying a property comprises evaporating the solvent.
8. The method of claim 7 wherein the aerosol droplets comprise metal nanoparticles, the method further comprising:
irradiating the aerosol droplets with UV radiation;
heating the metal nanoparticles; and
heating the aerosol droplets sufficiently to at least partially evaporate the solvent.
9. The method of claim 8 further comprises continuing to irradiate the metal nanoparticles after they have been deposited, thereby at least partially sintering the metal nanoparticles.
10. The method of claim 1 further comprising tilting or translating the deposition head with respect to the substrate.
1 1 . The method of claim 1 comprising fabricating an overhanging structure without requiring a sacrificial support or tilting the deposition head or the substrate.
12. The method of claim 1 wherein the standoff distance between the deposition head and the substrate is at least 1 mm.
13. The method of claim 12 wherein the standoff distance between the deposition head and the substrate is at least 2 mm.
14. The method of claim 1 comprising increasing the viscosity of the aerosol droplets in-flight.
15. The method of claim 1 comprising irradiating the aerosol droplets with electromagnetic radiation in-flight and after the aerosol droplets have been deposited.
16. The method of claim 15 comprising irradiating the aerosol droplets with electromagnetic radiation from more than one direction in-flight.
17. The method of claim 1 comprising heating the aerosol droplets with electromagnetic radiation in-flight and after the aerosol droplets have been deposited.
18. The method of claim 1 wherein the fabricated three-dimensional structure comprises a structure selected from the group consisting of a micron-scale surface texture, a mechanical interposer, precision spacer, a mechanical interposer comprising embedded electrical connectors, an enclosed, hollow structure, a mechanical scaffold, and a functional electrical wire.
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EP16749823.7A EP3256308B1 (en) | 2015-02-10 | 2016-02-10 | Fabrication of three-dimensional structures by in-flight curing of aerosols |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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US11518086B2 (en) | 2020-12-08 | 2022-12-06 | Palo Alto Research Center Incorporated | Additive manufacturing systems and methods for the same |
US11679556B2 (en) | 2020-12-08 | 2023-06-20 | Palo Alto Research Center Incorporated | Additive manufacturing systems and methods for the same |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10500784B2 (en) | 2016-01-20 | 2019-12-10 | Palo Alto Research Center Incorporated | Additive deposition system and method |
US10434703B2 (en) * | 2016-01-20 | 2019-10-08 | Palo Alto Research Center Incorporated | Additive deposition system and method |
EP3448655B1 (en) | 2016-04-28 | 2021-09-01 | Hewlett-Packard Development Company, L.P. | 3-dimensional printing method and 3-dimensional printing material set |
US11465341B2 (en) | 2016-04-28 | 2022-10-11 | Hewlett-Packard Development Company, L.P. | 3-dimensional printed parts |
BR112018015592A2 (en) | 2016-04-28 | 2018-12-26 | Hewlett Packard Development Co | photoluminescent material sets |
US10493483B2 (en) | 2017-07-17 | 2019-12-03 | Palo Alto Research Center Incorporated | Central fed roller for filament extension atomizer |
US10919215B2 (en) | 2017-08-22 | 2021-02-16 | Palo Alto Research Center Incorporated | Electrostatic polymer aerosol deposition and fusing of solid particles for three-dimensional printing |
US10632746B2 (en) | 2017-11-13 | 2020-04-28 | Optomec, Inc. | Shuttering of aerosol streams |
KR102006451B1 (en) * | 2018-03-14 | 2019-08-01 | 포항공과대학교 산학협력단 | Manufacturing apparatus and method for 3d structure using in-situ light-guiding mechanism |
JP7204276B2 (en) * | 2018-12-06 | 2023-01-16 | エルジー・ケム・リミテッド | DISCHARGED APPARATUS, FORMING APPARATUS, AND METHOD FOR MANUFACTURING MOLDED BODY |
JP7248972B2 (en) * | 2018-12-19 | 2023-03-30 | 武藤工業株式会社 | Three-dimensional modeling apparatus and three-dimensional modeling method |
ES2955597T3 (en) * | 2018-12-20 | 2023-12-04 | Jabil Inc | Additive manufacturing apparatus, system and method using ultrafine injected material |
CN113310761B (en) * | 2021-05-08 | 2022-08-23 | 中国辐射防护研究院 | Preparation method of standard aerosol sample containing radionuclide |
CN113683052B (en) * | 2021-09-14 | 2023-09-05 | 深圳清华大学研究院 | Manufacturing and using method of super-talc ink island moving assembly |
FR3134679A1 (en) * | 2022-04-13 | 2023-10-20 | Safran | Process for manufacturing nested electronic modules by additive manufacturing |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08156106A (en) * | 1992-11-13 | 1996-06-18 | Japan Atom Energy Res Inst | Manufacture of three dimensional object |
WO1997038810A1 (en) * | 1996-04-17 | 1997-10-23 | Philips Electronics N.V. | Method of manufacturing a sintered structure on a substrate |
EP1163552A1 (en) | 1999-05-27 | 2001-12-19 | Patterning Technologies Limited | Method of forming a masking pattern on a surface |
EP1452326A2 (en) * | 2003-02-26 | 2004-09-01 | Seiko Epson Corporation | Method and apparatus for fixing a functional material onto a surface |
EP1507832A1 (en) | 2002-05-24 | 2005-02-23 | Huntsman Advanced Materials (Switzerland) GmbH | Jettable compositions |
EP1670610A2 (en) | 2003-09-26 | 2006-06-21 | Optomec Design Company | Laser processing for heat-sensitive mesoscale deposition |
WO2013162856A1 (en) * | 2012-04-25 | 2013-10-31 | Applied Materials, Inc. | Printed chemical mechanical polishing pad |
US20140027952A1 (en) | 2012-07-24 | 2014-01-30 | Integrated Deposition Solutions, Inc. | Methods for Producing Coaxial Structures Using a Microfluidic Jet |
US8916084B2 (en) * | 2008-09-04 | 2014-12-23 | Xerox Corporation | Ultra-violet curable gellant inks for three-dimensional printing and digital fabrication applications |
Family Cites Families (332)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3474971A (en) | 1967-06-14 | 1969-10-28 | North American Rockwell | Two-piece injector |
US3590477A (en) | 1968-12-19 | 1971-07-06 | Ibm | Method for fabricating insulated-gate field effect transistors having controlled operating characeristics |
US3808550A (en) | 1969-12-15 | 1974-04-30 | Bell Telephone Labor Inc | Apparatuses for trapping and accelerating neutral particles |
US3642202A (en) | 1970-05-13 | 1972-02-15 | Exxon Research Engineering Co | Feed system for coking unit |
US3808432A (en) | 1970-06-04 | 1974-04-30 | Bell Telephone Labor Inc | Neutral particle accelerator utilizing radiation pressure |
US3846661A (en) | 1971-04-29 | 1974-11-05 | Ibm | Technique for fabricating integrated incandescent displays |
US3715785A (en) | 1971-04-29 | 1973-02-13 | Ibm | Technique for fabricating integrated incandescent displays |
US3777983A (en) | 1971-12-16 | 1973-12-11 | Gen Electric | Gas cooled dual fuel air atomized fuel nozzle |
US3816025A (en) | 1973-01-18 | 1974-06-11 | Neill W O | Paint spray system |
US3854321A (en) | 1973-04-27 | 1974-12-17 | B Dahneke | Aerosol beam device and method |
US3901798A (en) | 1973-11-21 | 1975-08-26 | Environmental Research Corp | Aerosol concentrator and classifier |
US4036434A (en) | 1974-07-15 | 1977-07-19 | Aerojet-General Corporation | Fluid delivery nozzle with fluid purged face |
US3982251A (en) | 1974-08-23 | 1976-09-21 | Ibm Corporation | Method and apparatus for recording information on a recording medium |
US3959798A (en) | 1974-12-31 | 1976-05-25 | International Business Machines Corporation | Selective wetting using a micromist of particles |
DE2517715C2 (en) | 1975-04-22 | 1977-02-10 | Hans Behr | PROCESS AND DEVICE FOR MIXING AND / OR DISPERSING AND BLASTING THE COMPONENTS OF A FLOWABLE MATERIAL FOR COATING SURFACES |
US4019188A (en) | 1975-05-12 | 1977-04-19 | International Business Machines Corporation | Micromist jet printer |
US3974769A (en) | 1975-05-27 | 1976-08-17 | International Business Machines Corporation | Method and apparatus for recording information on a recording surface through the use of mists |
US4004733A (en) | 1975-07-09 | 1977-01-25 | Research Corporation | Electrostatic spray nozzle system |
US4016417A (en) | 1976-01-08 | 1977-04-05 | Richard Glasscock Benton | Laser beam transport, and method |
US4046073A (en) | 1976-01-28 | 1977-09-06 | International Business Machines Corporation | Ultrasonic transfer printing with multi-copy, color and low audible noise capability |
US4046074A (en) | 1976-02-02 | 1977-09-06 | International Business Machines Corporation | Non-impact printing system |
US4034025A (en) | 1976-02-09 | 1977-07-05 | Martner John G | Ultrasonic gas stream liquid entrainment apparatus |
US4092535A (en) | 1977-04-22 | 1978-05-30 | Bell Telephone Laboratories, Incorporated | Damping of optically levitated particles by feedback and beam shaping |
US4171096A (en) | 1977-05-26 | 1979-10-16 | John Welsh | Spray gun nozzle attachment |
US4112437A (en) | 1977-06-27 | 1978-09-05 | Eastman Kodak Company | Electrographic mist development apparatus and method |
US4235563A (en) | 1977-07-11 | 1980-11-25 | The Upjohn Company | Method and apparatus for feeding powder |
JPS592617B2 (en) | 1977-12-22 | 1984-01-19 | 株式会社リコー | ink jetting device |
US4132894A (en) | 1978-04-04 | 1979-01-02 | The United States Of America As Represented By The United States Department Of Energy | Monitor of the concentration of particles of dense radioactive materials in a stream of air |
US4200669A (en) | 1978-11-22 | 1980-04-29 | The United States Of America As Represented By The Secretary Of The Navy | Laser spraying |
GB2052566B (en) | 1979-03-30 | 1982-12-15 | Rolls Royce | Laser aplication of hard surface alloy |
US4323756A (en) | 1979-10-29 | 1982-04-06 | United Technologies Corporation | Method for fabricating articles by sequential layer deposition |
JPS5948873B2 (en) | 1980-05-14 | 1984-11-29 | ペルメレック電極株式会社 | Method for manufacturing electrode substrate or electrode provided with corrosion-resistant coating |
US4453803A (en) | 1981-06-25 | 1984-06-12 | Agency Of Industrial Science & Technology | Optical waveguide for middle infrared band |
US4605574A (en) | 1981-09-14 | 1986-08-12 | Takashi Yonehara | Method and apparatus for forming an extremely thin film on the surface of an object |
US4485387A (en) | 1982-10-26 | 1984-11-27 | Microscience Systems Corp. | Inking system for producing circuit patterns |
US4685563A (en) | 1983-05-16 | 1987-08-11 | Michelman Inc. | Packaging material and container having interlaminate electrostatic shield and method of making same |
US4497692A (en) | 1983-06-13 | 1985-02-05 | International Business Machines Corporation | Laser-enhanced jet-plating and jet-etching: high-speed maskless patterning method |
US4601921A (en) | 1984-12-24 | 1986-07-22 | General Motors Corporation | Method and apparatus for spraying coating material |
US4694136A (en) | 1986-01-23 | 1987-09-15 | Westinghouse Electric Corp. | Laser welding of a sleeve within a tube |
US4689052A (en) | 1986-02-19 | 1987-08-25 | Washington Research Foundation | Virtual impactor |
US4823009A (en) | 1986-04-14 | 1989-04-18 | Massachusetts Institute Of Technology | Ir compatible deposition surface for liquid chromatography |
US4670135A (en) | 1986-06-27 | 1987-06-02 | Regents Of The University Of Minnesota | High volume virtual impactor |
JPS6359195A (en) | 1986-08-29 | 1988-03-15 | Hitachi Ltd | Magnetic recording and reproducing device |
DE3686161D1 (en) | 1986-09-25 | 1992-08-27 | Lucien Diego Laude | DEVICE FOR LASER SUPPORTED, ELECTROLYTIC METAL DEPOSITION. |
US4733018A (en) | 1986-10-02 | 1988-03-22 | Rca Corporation | Thick film copper conductor inks |
US4927992A (en) | 1987-03-04 | 1990-05-22 | Westinghouse Electric Corp. | Energy beam casting of metal articles |
US4724299A (en) | 1987-04-15 | 1988-02-09 | Quantum Laser Corporation | Laser spray nozzle and method |
US4904621A (en) | 1987-07-16 | 1990-02-27 | Texas Instruments Incorporated | Remote plasma generation process using a two-stage showerhead |
US4893886A (en) | 1987-09-17 | 1990-01-16 | American Telephone And Telegraph Company | Non-destructive optical trap for biological particles and method of doing same |
US4997809A (en) | 1987-11-18 | 1991-03-05 | International Business Machines Corporation | Fabrication of patterned lines of high Tc superconductors |
US4920254A (en) | 1988-02-22 | 1990-04-24 | Sierracin Corporation | Electrically conductive window and a method for its manufacture |
JPH0621335B2 (en) | 1988-02-24 | 1994-03-23 | 工業技術院長 | Laser spraying method |
US4895735A (en) | 1988-03-01 | 1990-01-23 | Texas Instruments Incorporated | Radiation induced pattern deposition |
US4917830A (en) | 1988-09-19 | 1990-04-17 | The United States Of America As Represented By The United States Department Of Energy | Monodisperse aerosol generator |
US4971251A (en) | 1988-11-28 | 1990-11-20 | Minnesota Mining And Manufacturing Company | Spray gun with disposable liquid handling portion |
US5614252A (en) | 1988-12-27 | 1997-03-25 | Symetrix Corporation | Method of fabricating barium strontium titanate |
US6056994A (en) | 1988-12-27 | 2000-05-02 | Symetrix Corporation | Liquid deposition methods of fabricating layered superlattice materials |
US4911365A (en) | 1989-01-26 | 1990-03-27 | James E. Hynds | Spray gun having a fanning air turbine mechanism |
US5038014A (en) | 1989-02-08 | 1991-08-06 | General Electric Company | Fabrication of components by layered deposition |
US5043548A (en) | 1989-02-08 | 1991-08-27 | General Electric Company | Axial flow laser plasma spraying |
US5064685A (en) | 1989-08-23 | 1991-11-12 | At&T Laboratories | Electrical conductor deposition method |
US5017317A (en) | 1989-12-04 | 1991-05-21 | Board Of Regents, The Uni. Of Texas System | Gas phase selective beam deposition |
US5032850A (en) | 1989-12-18 | 1991-07-16 | Tokyo Electric Co., Ltd. | Method and apparatus for vapor jet printing |
US4978067A (en) | 1989-12-22 | 1990-12-18 | Sono-Tek Corporation | Unitary axial flow tube ultrasonic atomizer with enhanced sealing |
DE4000690A1 (en) | 1990-01-12 | 1991-07-18 | Philips Patentverwaltung | PROCESS FOR PRODUCING ULTRAFINE PARTICLES AND THEIR USE |
DE69130184T2 (en) | 1990-02-23 | 1999-02-11 | Fuji Photo Film Co Ltd | Process for the production of multilayer coatings |
DE4006511A1 (en) | 1990-03-02 | 1991-09-05 | Krupp Gmbh | DEVICE FOR FEEDING POWDERED ADDITIVES IN THE AREA OF A WELDING POINT |
US5176328A (en) | 1990-03-13 | 1993-01-05 | The Board Of Regents Of The University Of Nebraska | Apparatus for forming fin particles |
US5126102A (en) | 1990-03-15 | 1992-06-30 | Kabushiki Kaisha Toshiba | Fabricating method of composite material |
CN2078199U (en) | 1990-06-15 | 1991-06-05 | 蒋隽 | Multipurpose protable ultrasonic atomizer |
US5152462A (en) * | 1990-08-10 | 1992-10-06 | Roussel Uclaf | Spray system |
JPH04120259A (en) | 1990-09-10 | 1992-04-21 | Agency Of Ind Science & Technol | Method and device for producing equipment member by laser beam spraying |
FR2667811B1 (en) | 1990-10-10 | 1992-12-04 | Snecma | POWDER SUPPLY DEVICE FOR LASER BEAM TREATMENT COATING. |
US5245404A (en) | 1990-10-18 | 1993-09-14 | Physical Optics Corportion | Raman sensor |
US5170890A (en) | 1990-12-05 | 1992-12-15 | Wilson Steven D | Particle trap |
US5634093A (en) | 1991-01-30 | 1997-05-27 | Kabushiki Kaisha Toshiba | Method and CAD system for designing wiring patterns using predetermined rules |
US6175422B1 (en) | 1991-01-31 | 2001-01-16 | Texas Instruments Incorporated | Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data |
ATE117027T1 (en) | 1991-02-02 | 1995-01-15 | Theysohn Friedrich Fa | METHOD FOR PRODUCING A WEAR-REDUCING LAYER. |
CA2061069C (en) | 1991-02-27 | 1999-06-29 | Toshio Kubota | Method of electrostatically spray-coating a workpiece with paint |
US5292418A (en) | 1991-03-08 | 1994-03-08 | Mitsubishi Denki Kabushiki Kaisha | Local laser plating apparatus |
WO1992018323A1 (en) | 1991-04-09 | 1992-10-29 | Haber Michael B | Computerised macro-assembly manufacture |
US5173220A (en) | 1991-04-26 | 1992-12-22 | Motorola, Inc. | Method of manufacturing a three-dimensional plastic article |
US5176744A (en) | 1991-08-09 | 1993-01-05 | Microelectronics Computer & Technology Corp. | Solution for direct copper writing |
US5164535A (en) | 1991-09-05 | 1992-11-17 | Silent Options, Inc. | Gun silencer |
US5314003A (en) | 1991-12-24 | 1994-05-24 | Microelectronics And Computer Technology Corporation | Three-dimensional metal fabrication using a laser |
FR2685922B1 (en) | 1992-01-07 | 1995-03-24 | Strasbourg Elec | COAXIAL NOZZLE FOR SURFACE TREATMENT UNDER LASER IRRADIATION, WITH SUPPLY OF MATERIALS IN POWDER FORM. |
US5495105A (en) | 1992-02-20 | 1996-02-27 | Canon Kabushiki Kaisha | Method and apparatus for particle manipulation, and measuring apparatus utilizing the same |
US5194297A (en) | 1992-03-04 | 1993-03-16 | Vlsi Standards, Inc. | System and method for accurately depositing particles on a surface |
US5378508A (en) | 1992-04-01 | 1995-01-03 | Akzo Nobel N.V. | Laser direct writing |
JPH05283708A (en) | 1992-04-02 | 1993-10-29 | Mitsubishi Electric Corp | Nonvolatile semiconductor memory, its manufacturing method and testing method |
JPH05318748A (en) | 1992-05-21 | 1993-12-03 | Brother Ind Ltd | Method for forming drive electrode for liquid droplet jet device |
AU4668393A (en) | 1992-07-08 | 1994-01-31 | Nordson Corporation | Apparatus and methods for applying discrete foam coatings |
US5335000A (en) | 1992-08-04 | 1994-08-02 | Calcomp Inc. | Ink vapor aerosol pen for pen plotters |
US5294459A (en) | 1992-08-27 | 1994-03-15 | Nordson Corporation | Air assisted apparatus and method for selective coating |
IL107120A (en) * | 1992-09-29 | 1997-09-30 | Boehringer Ingelheim Int | Atomising nozzle and filter and spray generating device |
US5344676A (en) | 1992-10-23 | 1994-09-06 | The Board Of Trustees Of The University Of Illinois | Method and apparatus for producing nanodrops and nanoparticles and thin film deposits therefrom |
US5322221A (en) | 1992-11-09 | 1994-06-21 | Graco Inc. | Air nozzle |
US5775402A (en) | 1995-10-31 | 1998-07-07 | Massachusetts Institute Of Technology | Enhancement of thermal properties of tooling made by solid free form fabrication techniques |
US5449536A (en) | 1992-12-18 | 1995-09-12 | United Technologies Corporation | Method for the application of coatings of oxide dispersion strengthened metals by laser powder injection |
US5529634A (en) | 1992-12-28 | 1996-06-25 | Kabushiki Kaisha Toshiba | Apparatus and method of manufacturing semiconductor device |
US5359172A (en) | 1992-12-30 | 1994-10-25 | Westinghouse Electric Corporation | Direct tube repair by laser welding |
US5270542A (en) | 1992-12-31 | 1993-12-14 | Regents Of The University Of Minnesota | Apparatus and method for shaping and detecting a particle beam |
US5366559A (en) | 1993-05-27 | 1994-11-22 | Research Triangle Institute | Method for protecting a substrate surface from contamination using the photophoretic effect |
US5733609A (en) | 1993-06-01 | 1998-03-31 | Wang; Liang | Ceramic coatings synthesized by chemical reactions energized by laser plasmas |
IL106803A (en) | 1993-08-25 | 1998-02-08 | Scitex Corp Ltd | Ink jet print head |
US5398193B1 (en) | 1993-08-20 | 1997-09-16 | Alfredo O Deangelis | Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor |
US5491317A (en) | 1993-09-13 | 1996-02-13 | Westinghouse Electric Corporation | System and method for laser welding an inner surface of a tubular member |
US5403617A (en) | 1993-09-15 | 1995-04-04 | Mobium Enterprises Corporation | Hybrid pulsed valve for thin film coating and method |
US5736195A (en) | 1993-09-15 | 1998-04-07 | Mobium Enterprises Corporation | Method of coating a thin film on a substrate |
US5518680A (en) | 1993-10-18 | 1996-05-21 | Massachusetts Institute Of Technology | Tissue regeneration matrices by solid free form fabrication techniques |
US5554415A (en) | 1994-01-18 | 1996-09-10 | Qqc, Inc. | Substrate coating techniques, including fabricating materials on a surface of a substrate |
US5477026A (en) | 1994-01-27 | 1995-12-19 | Chromalloy Gas Turbine Corporation | Laser/powdered metal cladding nozzle |
US5512745A (en) | 1994-03-09 | 1996-04-30 | Board Of Trustees Of The Leland Stanford Jr. University | Optical trap system and method |
EP0705483B1 (en) | 1994-04-25 | 1999-11-24 | Koninklijke Philips Electronics N.V. | Method of curing a film |
US5609921A (en) | 1994-08-26 | 1997-03-11 | Universite De Sherbrooke | Suspension plasma spray |
FR2724853B1 (en) | 1994-09-27 | 1996-12-20 | Saint Gobain Vitrage | DEVICE FOR DISPENSING POWDERY SOLIDS ON THE SURFACE OF A SUBSTRATE FOR LAYING A COATING |
US5732885A (en) | 1994-10-07 | 1998-03-31 | Spraying Systems Co. | Internal mix air atomizing spray nozzle |
US5486676A (en) | 1994-11-14 | 1996-01-23 | General Electric Company | Coaxial single point powder feed nozzle |
US5541006A (en) | 1994-12-23 | 1996-07-30 | Kennametal Inc. | Method of making composite cermet articles and the articles |
US5861136A (en) | 1995-01-10 | 1999-01-19 | E. I. Du Pont De Nemours And Company | Method for making copper I oxide powders by aerosol decomposition |
US5770272A (en) | 1995-04-28 | 1998-06-23 | Massachusetts Institute Of Technology | Matrix-bearing targets for maldi mass spectrometry and methods of production thereof |
US5814152A (en) | 1995-05-23 | 1998-09-29 | Mcdonnell Douglas Corporation | Apparatus for coating a substrate |
US5612099A (en) | 1995-05-23 | 1997-03-18 | Mcdonnell Douglas Corporation | Method and apparatus for coating a substrate |
TW284907B (en) | 1995-06-07 | 1996-09-01 | Cauldron Lp | Removal of material by polarized irradiation and back side application for radiation |
US5882722A (en) | 1995-07-12 | 1999-03-16 | Partnerships Limited, Inc. | Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds |
GB9515439D0 (en) | 1995-07-27 | 1995-09-27 | Isis Innovation | Method of producing metal quantum dots |
US5779833A (en) | 1995-08-04 | 1998-07-14 | Case Western Reserve University | Method for constructing three dimensional bodies from laminations |
US5997956A (en) | 1995-08-04 | 1999-12-07 | Microcoating Technologies | Chemical vapor deposition and powder formation using thermal spray with near supercritical and supercritical fluid solutions |
US5837960A (en) | 1995-08-14 | 1998-11-17 | The Regents Of The University Of California | Laser production of articles from powders |
US5746844A (en) | 1995-09-08 | 1998-05-05 | Aeroquip Corporation | Method and apparatus for creating a free-form three-dimensional article using a layer-by-layer deposition of molten metal and using a stress-reducing annealing process on the deposited metal |
US5607730A (en) | 1995-09-11 | 1997-03-04 | Clover Industries, Inc. | Method and apparatus for laser coating |
US5653925A (en) | 1995-09-26 | 1997-08-05 | Stratasys, Inc. | Method for controlled porosity three-dimensional modeling |
ATE219165T1 (en) | 1995-12-14 | 2002-06-15 | Imperial College | FILM OR LAYER DEPOSITION AND POWDER PRODUCTION |
US6015083A (en) | 1995-12-29 | 2000-01-18 | Microfab Technologies, Inc. | Direct solder bumping of hard to solder substrate |
US5772106A (en) | 1995-12-29 | 1998-06-30 | Microfab Technologies, Inc. | Printhead for liquid metals and method of use |
US5993549A (en) | 1996-01-19 | 1999-11-30 | Deutsche Forschungsanstalt Fuer Luft- Und Raumfahrt E.V. | Powder coating apparatus |
US5676719A (en) | 1996-02-01 | 1997-10-14 | Engineering Resources, Inc. | Universal insert for use with radiator steam traps |
US5772964A (en) | 1996-02-08 | 1998-06-30 | Lab Connections, Inc. | Nozzle arrangement for collecting components from a fluid for analysis |
CN1093783C (en) | 1996-02-21 | 2002-11-06 | 松下电器产业株式会社 | Liquid application nozzle, method of manufacturing same, liquid application method, liquid application device, and method of manufacturing cathode-ray tube |
US5705117A (en) | 1996-03-01 | 1998-01-06 | Delco Electronics Corporaiton | Method of combining metal and ceramic inserts into stereolithography components |
CN1137285C (en) | 1997-04-30 | 2004-02-04 | 高松研究所 | Metal paste and method for production of metal film |
US5844192A (en) | 1996-05-09 | 1998-12-01 | United Technologies Corporation | Thermal spray coating method and apparatus |
US6116184A (en) | 1996-05-21 | 2000-09-12 | Symetrix Corporation | Method and apparatus for misted liquid source deposition of thin film with reduced mist particle size |
US5854311A (en) | 1996-06-24 | 1998-12-29 | Richart; Douglas S. | Process and apparatus for the preparation of fine powders |
US6046426A (en) | 1996-07-08 | 2000-04-04 | Sandia Corporation | Method and system for producing complex-shape objects |
CN1226960A (en) | 1996-07-08 | 1999-08-25 | 康宁股份有限公司 | Gas-assisted atomizing device |
US5772963A (en) | 1996-07-30 | 1998-06-30 | Bayer Corporation | Analytical instrument having a control area network and distributed logic nodes |
US6544599B1 (en) | 1996-07-31 | 2003-04-08 | Univ Arkansas | Process and apparatus for applying charged particles to a substrate, process for forming a layer on a substrate, products made therefrom |
US5707715A (en) | 1996-08-29 | 1998-01-13 | L. Pierre deRochemont | Metal ceramic composites with improved interfacial properties and methods to make such composites |
JP3867176B2 (en) | 1996-09-24 | 2007-01-10 | アール・アイ・ディー株式会社 | Powder mass flow measuring device and electrostatic powder coating device using the same |
US6143116A (en) | 1996-09-26 | 2000-11-07 | Kyocera Corporation | Process for producing a multi-layer wiring board |
US5742050A (en) | 1996-09-30 | 1998-04-21 | Aviv Amirav | Method and apparatus for sample introduction into a mass spectrometer for improving a sample analysis |
US6144008A (en) | 1996-11-22 | 2000-11-07 | Rabinovich; Joshua E. | Rapid manufacturing system for metal, metal matrix composite materials and ceramics |
US5578227A (en) | 1996-11-22 | 1996-11-26 | Rabinovich; Joshua E. | Rapid prototyping system |
CA2276018C (en) | 1997-01-03 | 2004-11-23 | Mds Inc. | Spray chamber with dryer |
US5969352A (en) * | 1997-01-03 | 1999-10-19 | Mds Inc. | Spray chamber with dryer |
US6379745B1 (en) | 1997-02-20 | 2002-04-30 | Parelec, Inc. | Low temperature method and compositions for producing electrical conductors |
US6699304B1 (en) | 1997-02-24 | 2004-03-02 | Superior Micropowders, Llc | Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom |
US5936627A (en) | 1997-02-28 | 1999-08-10 | International Business Machines Corporation | Method and system for performing perspective divide operations on three-dimensional graphical object data within a computer system |
US5894403A (en) | 1997-05-01 | 1999-04-13 | Wilson Greatbatch Ltd. | Ultrasonically coated substrate for use in a capacitor |
US5849238A (en) | 1997-06-26 | 1998-12-15 | Ut Automotive Dearborn, Inc. | Helical conformal channels for solid freeform fabrication and tooling applications |
US7164818B2 (en) | 2001-05-03 | 2007-01-16 | Neophontonics Corporation | Integrated gradient index lenses |
US6890624B1 (en) | 2000-04-25 | 2005-05-10 | Nanogram Corporation | Self-assembled structures |
US6391494B2 (en) | 1999-05-13 | 2002-05-21 | Nanogram Corporation | Metal vanadium oxide particles |
US6952504B2 (en) | 2001-12-21 | 2005-10-04 | Neophotonics Corporation | Three dimensional engineering of planar optical structures |
US5847357A (en) | 1997-08-25 | 1998-12-08 | General Electric Company | Laser-assisted material spray processing |
US6021776A (en) | 1997-09-09 | 2000-02-08 | Intertex Research, Inc. | Disposable atomizer device with trigger valve system |
US6548122B1 (en) | 1997-09-16 | 2003-04-15 | Sri International | Method of producing and depositing a metal film |
US5980998A (en) | 1997-09-16 | 1999-11-09 | Sri International | Deposition of substances on a surface |
WO1999019900A2 (en) | 1997-10-14 | 1999-04-22 | Patterning Technologies Limited | Method of forming an electronic device |
US6007631A (en) | 1997-11-10 | 1999-12-28 | Speedline Technologies, Inc. | Multiple head dispensing system and method |
US5993416A (en) | 1998-01-15 | 1999-11-30 | Medtronic Ave, Inc. | Method and apparatus for regulating the fluid flow rate to and preventing over-pressurization of a balloon catheter |
US5993554A (en) | 1998-01-22 | 1999-11-30 | Optemec Design Company | Multiple beams and nozzles to increase deposition rate |
US6967183B2 (en) | 1998-08-27 | 2005-11-22 | Cabot Corporation | Electrocatalyst powders, methods for producing powders and devices fabricated from same |
US20050097987A1 (en) | 1998-02-24 | 2005-05-12 | Cabot Corporation | Coated copper-containing powders, methods and apparatus for producing such powders, and copper-containing devices fabricated from same |
US6349668B1 (en) | 1998-04-27 | 2002-02-26 | Msp Corporation | Method and apparatus for thin film deposition on large area substrates |
WO1999060397A1 (en) | 1998-05-18 | 1999-11-25 | University Of Washington | Liquid analysis cartridge |
DE19822674A1 (en) | 1998-05-20 | 1999-12-09 | Gsf Forschungszentrum Umwelt | Gas inlet for an ion source |
DE19822672B4 (en) | 1998-05-20 | 2005-11-10 | GSF - Forschungszentrum für Umwelt und Gesundheit GmbH | Method and device for producing a directional gas jet |
FR2780170B1 (en) | 1998-06-19 | 2000-08-11 | Aerospatiale | AUTONOMOUS DEVICE FOR LIMITING THE FLOW OF A FLUID IN A PIPING AND FUEL CIRCUIT FOR AN AIRCRAFT COMPRISING SUCH A DEVICE |
US6410105B1 (en) | 1998-06-30 | 2002-06-25 | Jyoti Mazumder | Production of overhang, undercut, and cavity structures using direct metal depostion |
US6159749A (en) | 1998-07-21 | 2000-12-12 | Beckman Coulter, Inc. | Highly sensitive bead-based multi-analyte assay system using optical tweezers |
US6149076A (en) | 1998-08-05 | 2000-11-21 | Nordson Corporation | Dispensing apparatus having nozzle for controlling heated liquid discharge with unheated pressurized air |
KR100271208B1 (en) | 1998-08-13 | 2000-12-01 | 윤덕용 | Selective infiltration manufacturing method and apparatus |
US7347850B2 (en) | 1998-08-14 | 2008-03-25 | Incept Llc | Adhesion barriers applicable by minimally invasive surgery and methods of use thereof |
US6697694B2 (en) | 1998-08-26 | 2004-02-24 | Electronic Materials, L.L.C. | Apparatus and method for creating flexible circuits |
US7098163B2 (en) | 1998-08-27 | 2006-08-29 | Cabot Corporation | Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells |
DE19841401C2 (en) | 1998-09-10 | 2000-09-21 | Lechler Gmbh & Co Kg | Two-component flat jet nozzle |
US7938079B2 (en) | 1998-09-30 | 2011-05-10 | Optomec Design Company | Annular aerosol jet deposition using an extended nozzle |
US7045015B2 (en) | 1998-09-30 | 2006-05-16 | Optomec Design Company | Apparatuses and method for maskless mesoscale material deposition |
US6291088B1 (en) | 1998-09-30 | 2001-09-18 | Xerox Corporation | Inorganic overcoat for particulate transport electrode grid |
US20050156991A1 (en) | 1998-09-30 | 2005-07-21 | Optomec Design Company | Maskless direct write of copper using an annular aerosol jet |
US7108894B2 (en) | 1998-09-30 | 2006-09-19 | Optomec Design Company | Direct Write™ System |
US6265050B1 (en) | 1998-09-30 | 2001-07-24 | Xerox Corporation | Organic overcoat for electrode grid |
US6340216B1 (en) | 1998-09-30 | 2002-01-22 | Xerox Corporation | Ballistic aerosol marking apparatus for treating a substrate |
US20030020768A1 (en) | 1998-09-30 | 2003-01-30 | Renn Michael J. | Direct write TM system |
US6290342B1 (en) | 1998-09-30 | 2001-09-18 | Xerox Corporation | Particulate marking material transport apparatus utilizing traveling electrostatic waves |
US6467862B1 (en) | 1998-09-30 | 2002-10-22 | Xerox Corporation | Cartridge for use in a ballistic aerosol marking apparatus |
US6116718A (en) | 1998-09-30 | 2000-09-12 | Xerox Corporation | Print head for use in a ballistic aerosol marking apparatus |
US6416156B1 (en) | 1998-09-30 | 2002-07-09 | Xerox Corporation | Kinetic fusing of a marking material |
US6251488B1 (en) | 1999-05-05 | 2001-06-26 | Optomec Design Company | Precision spray processes for direct write electronic components |
US6636676B1 (en) | 1998-09-30 | 2003-10-21 | Optomec Design Company | Particle guidance system |
WO2000023825A2 (en) | 1998-09-30 | 2000-04-27 | Board Of Control Of Michigan Technological University | Laser-guided manipulation of non-atomic particles |
US6416157B1 (en) | 1998-09-30 | 2002-07-09 | Xerox Corporation | Method of marking a substrate employing a ballistic aerosol marking apparatus |
US20040197493A1 (en) | 1998-09-30 | 2004-10-07 | Optomec Design Company | Apparatus, methods and precision spray processes for direct write and maskless mesoscale material deposition |
US7294366B2 (en) | 1998-09-30 | 2007-11-13 | Optomec Design Company | Laser processing for heat-sensitive mesoscale deposition |
US6454384B1 (en) | 1998-09-30 | 2002-09-24 | Xerox Corporation | Method for marking with a liquid material using a ballistic aerosol marking apparatus |
US6511149B1 (en) | 1998-09-30 | 2003-01-28 | Xerox Corporation | Ballistic aerosol marking apparatus for marking a substrate |
US8110247B2 (en) | 1998-09-30 | 2012-02-07 | Optomec Design Company | Laser processing for heat-sensitive mesoscale deposition of oxygen-sensitive materials |
US6136442A (en) | 1998-09-30 | 2000-10-24 | Xerox Corporation | Multi-layer organic overcoat for particulate transport electrode grid |
US6151435A (en) | 1998-11-01 | 2000-11-21 | The United States Of America As Represented By The Secretary Of The Navy | Evanescent atom guiding in metal-coated hollow-core optical fibers |
US6001304A (en) | 1998-12-31 | 1999-12-14 | Materials Modification, Inc. | Method of bonding a particle material to near theoretical density |
JP2000238270A (en) | 1998-12-22 | 2000-09-05 | Canon Inc | Ink jet recording head and manufacture thereof |
KR100284607B1 (en) | 1998-12-31 | 2001-08-07 | 하상채 | Electrostatic Powder Coating System with Residual Paint Recovery System |
US6280302B1 (en) | 1999-03-24 | 2001-08-28 | Flow International Corporation | Method and apparatus for fluid jet formation |
DE19913451C2 (en) | 1999-03-25 | 2001-11-22 | Gsf Forschungszentrum Umwelt | Gas inlet for generating a directed and cooled gas jet |
AU4856100A (en) | 1999-05-17 | 2000-12-05 | Stephen T Flock | Electromagnetic energy driven separation methods |
US6405095B1 (en) | 1999-05-25 | 2002-06-11 | Nanotek Instruments, Inc. | Rapid prototyping and tooling system |
US20020128714A1 (en) | 1999-06-04 | 2002-09-12 | Mark Manasas | Orthopedic implant and method of making metal articles |
US6520996B1 (en) | 1999-06-04 | 2003-02-18 | Depuy Acromed, Incorporated | Orthopedic implant |
US6267301B1 (en) | 1999-06-11 | 2001-07-31 | Spraying Systems Co. | Air atomizing nozzle assembly with improved air cap |
US6391251B1 (en) | 1999-07-07 | 2002-05-21 | Optomec Design Company | Forming structures from CAD solid models |
US6811744B2 (en) * | 1999-07-07 | 2004-11-02 | Optomec Design Company | Forming structures from CAD solid models |
US6656409B1 (en) | 1999-07-07 | 2003-12-02 | Optomec Design Company | Manufacturable geometries for thermal management of complex three-dimensional shapes |
US20060003095A1 (en) | 1999-07-07 | 2006-01-05 | Optomec Design Company | Greater angle and overhanging materials deposition |
US6348687B1 (en) | 1999-09-10 | 2002-02-19 | Sandia Corporation | Aerodynamic beam generator for large particles |
US6293659B1 (en) | 1999-09-30 | 2001-09-25 | Xerox Corporation | Particulate source, circulation, and valving system for ballistic aerosol marking |
US6328026B1 (en) | 1999-10-13 | 2001-12-11 | The University Of Tennessee Research Corporation | Method for increasing wear resistance in an engine cylinder bore and improved automotive engine |
US6486432B1 (en) | 1999-11-23 | 2002-11-26 | Spirex | Method and laser cladding of plasticating barrels |
US6318642B1 (en) | 1999-12-22 | 2001-11-20 | Visteon Global Tech., Inc | Nozzle assembly |
KR20010063781A (en) | 1999-12-24 | 2001-07-09 | 박종섭 | Fabricating method for semiconductor device |
JP3736607B2 (en) | 2000-01-21 | 2006-01-18 | セイコーエプソン株式会社 | Semiconductor device and manufacturing method thereof, circuit board, and electronic apparatus |
US6423366B2 (en) | 2000-02-16 | 2002-07-23 | Roll Coater, Inc. | Strip coating method |
US6564038B1 (en) | 2000-02-23 | 2003-05-13 | Lucent Technologies Inc. | Method and apparatus for suppressing interference using active shielding techniques |
US6384365B1 (en) | 2000-04-14 | 2002-05-07 | Siemens Westinghouse Power Corporation | Repair and fabrication of combustion turbine components by spark plasma sintering |
AU5273401A (en) * | 2000-04-18 | 2001-11-12 | Kang-Ho Ahn | Apparatus for manufacturing ultra-fine particles using electrospray device and method thereof |
US20020063117A1 (en) | 2000-04-19 | 2002-05-30 | Church Kenneth H. | Laser sintering of materials and a thermal barrier for protecting a substrate |
US6572033B1 (en) | 2000-05-15 | 2003-06-03 | Nordson Corporation | Module for dispensing controlled patterns of liquid material and a nozzle having an asymmetric liquid discharge orifice |
CN100398321C (en) | 2000-05-24 | 2008-07-02 | 西尔弗布鲁克研究有限公司 | Ink jet nozzle assembly with external nozzle controller |
US6521297B2 (en) | 2000-06-01 | 2003-02-18 | Xerox Corporation | Marking material and ballistic aerosol marking process for the use thereof |
US6576861B2 (en) | 2000-07-25 | 2003-06-10 | The Research Foundation Of State University Of New York | Method and apparatus for fine feature spray deposition |
US20020082741A1 (en) | 2000-07-27 | 2002-06-27 | Jyoti Mazumder | Fabrication of biomedical implants using direct metal deposition |
US6416389B1 (en) | 2000-07-28 | 2002-07-09 | Xerox Corporation | Process for roughening a surface |
JP3686317B2 (en) | 2000-08-10 | 2005-08-24 | 三菱重工業株式会社 | Laser processing head and laser processing apparatus provided with the same |
US6781673B2 (en) | 2000-08-25 | 2004-08-24 | Asml Netherlands B.V. | Mask handling apparatus, lithographic projection apparatus, device manufacturing method and device manufactured thereby |
ATE525730T1 (en) | 2000-10-25 | 2011-10-15 | Harima Chemicals Inc | ELECTROCONDUCTIVE METAL PASTE AND METHOD FOR PRODUCING IT |
EP1215705A3 (en) | 2000-12-12 | 2003-05-21 | Nisshinbo Industries, Inc. | Transparent electromagnetic radiation shielding material |
US6607597B2 (en) | 2001-01-30 | 2003-08-19 | Msp Corporation | Method and apparatus for deposition of particles on surfaces |
US6471327B2 (en) | 2001-02-27 | 2002-10-29 | Eastman Kodak Company | Apparatus and method of delivering a focused beam of a thermodynamically stable/metastable mixture of a functional material in a dense fluid onto a receiver |
US6780368B2 (en) | 2001-04-10 | 2004-08-24 | Nanotek Instruments, Inc. | Layer manufacturing of a multi-material or multi-color 3-D object using electrostatic imaging and lamination |
US6657213B2 (en) | 2001-05-03 | 2003-12-02 | Northrop Grumman Corporation | High temperature EUV source nozzle |
EP1258293A3 (en) | 2001-05-16 | 2003-06-18 | Roberit Ag | Apparatus for spraying a multicomponent mix |
US6811805B2 (en) | 2001-05-30 | 2004-11-02 | Novatis Ag | Method for applying a coating |
NO316775B1 (en) | 2001-06-11 | 2004-05-03 | Optoplan As | Method of Coating a Fiber with Fiber Optic Bragg Grids (FBG) |
JP2003011100A (en) | 2001-06-27 | 2003-01-15 | Matsushita Electric Ind Co Ltd | Accumulation method for nanoparticle in gas flow and surface modification method |
US7469558B2 (en) | 2001-07-10 | 2008-12-30 | Springworks, Llc | As-deposited planar optical waveguides with low scattering loss and methods for their manufacture |
US6998785B1 (en) | 2001-07-13 | 2006-02-14 | University Of Central Florida Research Foundation, Inc. | Liquid-jet/liquid droplet initiated plasma discharge for generating useful plasma radiation |
US6706234B2 (en) | 2001-08-08 | 2004-03-16 | Nanotek Instruments, Inc. | Direct write method for polarized materials |
US7629017B2 (en) | 2001-10-05 | 2009-12-08 | Cabot Corporation | Methods for the deposition of conductive electronic features |
US20030108664A1 (en) | 2001-10-05 | 2003-06-12 | Kodas Toivo T. | Methods and compositions for the formation of recessed electrical features on a substrate |
US7524528B2 (en) | 2001-10-05 | 2009-04-28 | Cabot Corporation | Precursor compositions and methods for the deposition of passive electrical components on a substrate |
WO2003062796A1 (en) | 2002-01-22 | 2003-07-31 | Dakocytomation Denmark A/S | Environmental containment system for a flow cytometer |
US6593540B1 (en) | 2002-02-08 | 2003-07-15 | Honeywell International, Inc. | Hand held powder-fed laser fusion welding torch |
US20040029706A1 (en) | 2002-02-14 | 2004-02-12 | Barrera Enrique V. | Fabrication of reinforced composite material comprising carbon nanotubes, fullerenes, and vapor-grown carbon fibers for thermal barrier materials, structural ceramics, and multifunctional nanocomposite ceramics |
CA2374338A1 (en) | 2002-03-01 | 2003-09-01 | Ignis Innovations Inc. | Fabrication method for large area mechanically flexible circuits and displays |
US6705703B2 (en) | 2002-04-24 | 2004-03-16 | Hewlett-Packard Development Company, L.P. | Determination of control points for construction of first color space-to-second color space look-up table |
US7601406B2 (en) | 2002-06-13 | 2009-10-13 | Cima Nanotech Israel Ltd. | Nano-powder-based coating and ink compositions |
US7566360B2 (en) | 2002-06-13 | 2009-07-28 | Cima Nanotech Israel Ltd. | Nano-powder-based coating and ink compositions |
US7736693B2 (en) | 2002-06-13 | 2010-06-15 | Cima Nanotech Israel Ltd. | Nano-powder-based coating and ink compositions |
AU2003255254A1 (en) | 2002-08-08 | 2004-02-25 | Glenn J. Leedy | Vertical system integration |
JP4388263B2 (en) | 2002-09-11 | 2009-12-24 | 日鉱金属株式会社 | Iron silicide sputtering target and manufacturing method thereof |
US7067867B2 (en) | 2002-09-30 | 2006-06-27 | Nanosys, Inc. | Large-area nonenabled macroelectronic substrates and uses therefor |
JP2004122341A (en) | 2002-10-07 | 2004-04-22 | Fuji Photo Film Co Ltd | Filming method |
US20040080917A1 (en) | 2002-10-23 | 2004-04-29 | Steddom Clark Morrison | Integrated microwave package and the process for making the same |
US20040185388A1 (en) * | 2003-01-29 | 2004-09-23 | Hiroyuki Hirai | Printed circuit board, method for producing same, and ink therefor |
US20040151978A1 (en) | 2003-01-30 | 2004-08-05 | Huang Wen C. | Method and apparatus for direct-write of functional materials with a controlled orientation |
US6921626B2 (en) | 2003-03-27 | 2005-07-26 | Kodak Polychrome Graphics Llc | Nanopastes as patterning compositions for electronic parts |
US7009137B2 (en) | 2003-03-27 | 2006-03-07 | Honeywell International, Inc. | Laser powder fusion repair of Z-notches with nickel based superalloy powder |
US7579251B2 (en) | 2003-05-15 | 2009-08-25 | Fujitsu Limited | Aerosol deposition process |
WO2004112151A2 (en) | 2003-06-12 | 2004-12-23 | Patterning Technologies Limited | Transparent conducting structures and methods of production thereof |
US6855631B2 (en) | 2003-07-03 | 2005-02-15 | Micron Technology, Inc. | Methods of forming via plugs using an aerosol stream of particles to deposit conductive materials |
US20050002818A1 (en) | 2003-07-04 | 2005-01-06 | Hitachi Powdered Metals Co., Ltd. | Production method for sintered metal-ceramic layered compact and production method for thermal stress relief pad |
KR20070019651A (en) | 2003-09-17 | 2007-02-15 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Methods for forming a coating layer having substantially uniform thickness, and die coaters |
EP1663510A1 (en) * | 2003-09-17 | 2006-06-07 | 3M Innovative Properties Company | Methods for forming a coating layer having substantially uniform thickness, and die coaters |
TWI242606B (en) * | 2003-09-26 | 2005-11-01 | Optomec Design | Laser treatment process for maskless low-temperature deposition of electronic materials |
EP1530065B1 (en) | 2003-11-06 | 2008-09-10 | Rohm and Haas Electronic Materials, L.L.C. | Opticle article with conductive pattern |
US20050147749A1 (en) | 2004-01-05 | 2005-07-07 | Msp Corporation | High-performance vaporizer for liquid-precursor and multi-liquid-precursor vaporization in semiconductor thin film deposition |
KR20060128997A (en) | 2004-02-04 | 2006-12-14 | 가부시키가이샤 에바라 세이사꾸쇼 | Composite nanoparticle and process for producing the same |
US20050184328A1 (en) | 2004-02-19 | 2005-08-25 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and its manufacturing method |
JP4593947B2 (en) | 2004-03-19 | 2010-12-08 | キヤノン株式会社 | Film forming apparatus and film forming method |
US20050205415A1 (en) | 2004-03-19 | 2005-09-22 | Belousov Igor V | Multi-component deposition |
KR101054129B1 (en) | 2004-03-31 | 2011-08-03 | 이스트맨 코닥 캄파니 | Deposition of a Uniform Layer of Particulate Material |
US7220456B2 (en) | 2004-03-31 | 2007-05-22 | Eastman Kodak Company | Process for the selective deposition of particulate material |
CA2463409A1 (en) | 2004-04-02 | 2005-10-02 | Servo-Robot Inc. | Intelligent laser joining head |
US7736582B2 (en) | 2004-06-10 | 2010-06-15 | Allomet Corporation | Method for consolidating tough coated hard powders |
EP1625893A1 (en) | 2004-08-10 | 2006-02-15 | Konica Minolta Photo Imaging, Inc. | Spray coating method, spray coating device and inkjet recording sheet |
JP2006051413A (en) | 2004-08-10 | 2006-02-23 | Konica Minolta Photo Imaging Inc | Spray coating method of surface layer, spray coating apparatus for coating surface layer and ink jet recording paper |
US7129567B2 (en) | 2004-08-31 | 2006-10-31 | Micron Technology, Inc. | Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements |
US7575999B2 (en) | 2004-09-01 | 2009-08-18 | Micron Technology, Inc. | Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies |
US7235431B2 (en) | 2004-09-02 | 2007-06-26 | Micron Technology, Inc. | Methods for packaging a plurality of semiconductor dice using a flowable dielectric material |
US20060280866A1 (en) | 2004-10-13 | 2006-12-14 | Optomec Design Company | Method and apparatus for mesoscale deposition of biological materials and biomaterials |
US7732349B2 (en) | 2004-11-30 | 2010-06-08 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of insulating film and semiconductor device |
US7674671B2 (en) | 2004-12-13 | 2010-03-09 | Optomec Design Company | Aerodynamic jetting of aerosolized fluids for fabrication of passive structures |
US7938341B2 (en) | 2004-12-13 | 2011-05-10 | Optomec Design Company | Miniature aerosol jet and aerosol jet array |
US20080013299A1 (en) | 2004-12-13 | 2008-01-17 | Optomec, Inc. | Direct Patterning for EMI Shielding and Interconnects Using Miniature Aerosol Jet and Aerosol Jet Array |
WO2006076606A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Optimized multi-layer printing of electronics and displays |
WO2006076603A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electrical conductors |
US20060189113A1 (en) * | 2005-01-14 | 2006-08-24 | Cabot Corporation | Metal nanoparticle compositions |
US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
US7178380B2 (en) | 2005-01-24 | 2007-02-20 | Joseph Gerard Birmingham | Virtual impactor device with reduced fouling |
US7393559B2 (en) | 2005-02-01 | 2008-07-01 | The Regents Of The University Of California | Methods for production of FGM net shaped body for various applications |
US8715772B2 (en) | 2005-04-12 | 2014-05-06 | Air Products And Chemicals, Inc. | Thermal deposition coating method |
ATE443658T1 (en) | 2005-11-21 | 2009-10-15 | Mannkind Corp | POWDER DISPENSING AND COLLECTION APPARATUS AND METHOD |
US20070154634A1 (en) * | 2005-12-15 | 2007-07-05 | Optomec Design Company | Method and Apparatus for Low-Temperature Plasma Sintering |
US20070240454A1 (en) | 2006-01-30 | 2007-10-18 | Brown David P | Method and apparatus for continuous or batch optical fiber preform and optical fiber production |
US7841336B2 (en) | 2006-03-30 | 2010-11-30 | Carefusion 2200, Inc. | Nebulize with pressure-based fluidic control and related methods |
CA2648771C (en) | 2006-04-14 | 2010-11-09 | Hitachi Metals, Ltd. | Process for producing low-oxygen metal powder |
KR100763837B1 (en) | 2006-07-18 | 2007-10-05 | 삼성전기주식회사 | Manufacturing method of printed circuit board |
US20080099456A1 (en) | 2006-10-25 | 2008-05-01 | Schwenke Robert A | Dispensing method for variable line volume |
US20100029460A1 (en) * | 2007-02-22 | 2010-02-04 | Nippon Sheet Glass Company, Limited | Glass for anodic bonding |
DE102007017032B4 (en) | 2007-04-11 | 2011-09-22 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Method for the production of surface size or distance variations in patterns of nanostructures on surfaces |
WO2009021123A1 (en) | 2007-08-07 | 2009-02-12 | Tsi Incorporated | A size segregated aerosol mass concentration measurement device |
TWI482662B (en) | 2007-08-30 | 2015-05-01 | Optomec Inc | Mechanically integrated and closely coupled print head and mist source |
TWI538737B (en) | 2007-08-31 | 2016-06-21 | 阿普托麥克股份有限公司 | Material deposition assembly |
TW200918325A (en) | 2007-08-31 | 2009-05-01 | Optomec Inc | AEROSOL JET® printing system for photovoltaic applications |
KR101566573B1 (en) * | 2008-12-09 | 2015-11-05 | 인벤사스 코포레이션 | Semiconductor die interconnect formed by aerosol application of electrically conductive material |
DE102009007800A1 (en) | 2009-02-06 | 2010-08-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Aerosol printers, their use and methods of producing line breaks in continuous aerosol printing processes |
KR101982887B1 (en) * | 2011-07-13 | 2019-05-27 | 누보트로닉스, 인크. | Methods of fabricating electronic and mechanical structures |
US8919899B2 (en) * | 2012-05-10 | 2014-12-30 | Integrated Deposition Solutions | Methods and apparatuses for direct deposition of features on a surface using a two-component microfluidic jet |
US10124602B2 (en) * | 2014-10-31 | 2018-11-13 | Integrated Deposition Solutions, Inc. | Apparatuses and methods for stable aerosol deposition using an aerodynamic lens system |
US10086432B2 (en) * | 2014-12-10 | 2018-10-02 | Washington State University | Three dimensional sub-mm wavelength sub-THz frequency antennas on flexible and UV-curable dielectric using printed electronic metal traces |
US9811327B2 (en) | 2015-12-21 | 2017-11-07 | Quixey, Inc. | Dependency-aware transformation of multi-function applications for on-demand execution |
-
2016
- 2016-02-10 KR KR1020177025561A patent/KR102444204B1/en active IP Right Grant
- 2016-02-10 EP EP16749823.7A patent/EP3256308B1/en active Active
- 2016-02-10 WO PCT/US2016/017396 patent/WO2016130709A1/en active Application Filing
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- 2016-02-10 CN CN201680020145.5A patent/CN107548346B/en active Active
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Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08156106A (en) * | 1992-11-13 | 1996-06-18 | Japan Atom Energy Res Inst | Manufacture of three dimensional object |
WO1997038810A1 (en) * | 1996-04-17 | 1997-10-23 | Philips Electronics N.V. | Method of manufacturing a sintered structure on a substrate |
EP1163552A1 (en) | 1999-05-27 | 2001-12-19 | Patterning Technologies Limited | Method of forming a masking pattern on a surface |
EP1507832A1 (en) | 2002-05-24 | 2005-02-23 | Huntsman Advanced Materials (Switzerland) GmbH | Jettable compositions |
EP1452326A2 (en) * | 2003-02-26 | 2004-09-01 | Seiko Epson Corporation | Method and apparatus for fixing a functional material onto a surface |
EP1670610A2 (en) | 2003-09-26 | 2006-06-21 | Optomec Design Company | Laser processing for heat-sensitive mesoscale deposition |
US8916084B2 (en) * | 2008-09-04 | 2014-12-23 | Xerox Corporation | Ultra-violet curable gellant inks for three-dimensional printing and digital fabrication applications |
WO2013162856A1 (en) * | 2012-04-25 | 2013-10-31 | Applied Materials, Inc. | Printed chemical mechanical polishing pad |
US20140027952A1 (en) | 2012-07-24 | 2014-01-30 | Integrated Deposition Solutions, Inc. | Methods for Producing Coaxial Structures Using a Microfluidic Jet |
Non-Patent Citations (1)
Title |
---|
See also references of EP3256308A4 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106696275A (en) * | 2016-12-14 | 2017-05-24 | 芜湖纯元光电设备技术有限公司 | Waste gas purifying device for light curing machine |
US11518086B2 (en) | 2020-12-08 | 2022-12-06 | Palo Alto Research Center Incorporated | Additive manufacturing systems and methods for the same |
US11679556B2 (en) | 2020-12-08 | 2023-06-20 | Palo Alto Research Center Incorporated | Additive manufacturing systems and methods for the same |
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KR102444204B1 (en) | 2022-09-19 |
KR20170117159A (en) | 2017-10-20 |
TWI735425B (en) | 2021-08-11 |
CN107548346B (en) | 2021-01-05 |
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US10994473B2 (en) | 2021-05-04 |
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