WO2016124249A1 - Leadframe and chip package comprising a leadframe - Google Patents

Leadframe and chip package comprising a leadframe Download PDF

Info

Publication number
WO2016124249A1
WO2016124249A1 PCT/EP2015/052531 EP2015052531W WO2016124249A1 WO 2016124249 A1 WO2016124249 A1 WO 2016124249A1 EP 2015052531 W EP2015052531 W EP 2015052531W WO 2016124249 A1 WO2016124249 A1 WO 2016124249A1
Authority
WO
WIPO (PCT)
Prior art keywords
leadframe
maximum width
mounting area
housing body
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2015/052531
Other languages
French (fr)
Inventor
Sok Gek Beh
Mei See BOON
Wing Yew WONG
Hui Ying PEE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to PCT/EP2015/052531 priority Critical patent/WO2016124249A1/en
Priority to US15/547,703 priority patent/US10109562B2/en
Priority to DE112015006115.0T priority patent/DE112015006115T5/en
Publication of WO2016124249A1 publication Critical patent/WO2016124249A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/415—Leadframe inner leads serving as die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

  • Leadframe and chip package comprising a leadframe
  • the invention relates to a leadframe and a chip package comprising a leadframe.
  • Leadframes are used to serve as carriers for electronic devices such as light emitting diode chips and as electrical contacts. Chip packages are produced using leadframes and electronic devices, wherein the leadframes are embedded in the housing body. During manufacturing there is risk to damage the housing body in a gap between two leadframe parts and and/or to displace the leadframe parts in the housing body.
  • a leadframe comprises a first part and a second part, wherein the first part and the second part are separated from each other and the first part and the second part each comprise at least one anchoring hole and the first part comprises a mounting area.
  • An arrangement of metal parts stamped out or etched out from a plate is designated to be a leadframe.
  • Leadframes are intended to have further elements like diode chips or wire bonds arranged on them.
  • a leadframe or several component parts of a leadframe are preferably embedded in a housing body, for example a mold compound.
  • a leadframe can comprise several parts in the form of an endless strip. It is possible to produce several electronic devices or components on the leadframe, for example by mounting several diode chips on the leadframe. The leadframe parts are contacted by wire bond connections, for example. Further, it is possible to embed the leadframe in a housing body. While separating the leadframe parts in order to form electronic devices, it is possible that the individual electronic device is damaged. For example, it is possible that while separating, for example sawing, the leadframe and the housing material, the leadframe part can be pulled out from the housing material or at least be displaced. To provide sufficient locking of leadframe parts in the housing material anchoring holes are needed in the leadframe through which the housing material can emerge. Preferrably, the anchoring holes penetrate completely through the leadframe.
  • the mounting area on the first part is provided for an electronic component, for example a light emitting diode chip, to be mounted on which can be electrically connected to the second part of the leadframe, for example by a wire bond.
  • Both the first and the second part comprise at least one anchoring hole for an improved fixing of a housing body.
  • the first part of the leadframe is provided to be contacted to an opposite electrical polarity than the second part. This requires a separation of the first and the second leadframe part, in particular by a gap between them.
  • the second part of the leadframe comprises an edge line facing the first part which is curved.
  • the edge line of the second part of the leadframe which faces the first part, is embodied in a curved fashion.
  • the edge line is preferably shaped in a convex or concave manner.
  • the edge line it is also possible for the edge line to comprise segments, wherein some segments can form a straight line.
  • the edge line of the second part facing the first part it is possible for the edge line of the second part facing the first part to have a polygonal shape.
  • the first part comprises a first portion having a maximum width, a second portion having a maximum width and a third portion having a maximum width, wherein the mounting area is arranged at the third portion.
  • the third portion follows the second portion and the second portion follows the first portion in a direction of a longitudinal extend of the first part such that the third portion faces the second part.
  • widths of the first, the second and the third portion extend in a direction perpendicular to the
  • the leadframe is oriented such that the first portion of the first part of the leadframe faces away from the second part.
  • the first portion can at least partly be provided for
  • the first portion can at least partly remain free of an embedding housing material.
  • the maximum width of the first portion should be as large as possible
  • the second portion has preferrably a small length in comparison with the length of the first and the third
  • the leadframe expands in width in a longitudinal direction away from the second portion. This results in a more stable embedment of the leadframe in a housing body.
  • edge lines of the first and the third portions are non-parallel to each other, as seen in a top view of the first part.
  • the edge lines of the first part can have a polygonal shape.
  • An embodiment of the first part of the leadframe with edge lines which are non-parallel to each other is advantageous while the leadframe is embedded in a housing body, for example in a mold compound.
  • the first part is prevented from being displaced inside the housing body or even pulled out of it during an external processing step, for example sawing of the housing body.
  • the at least one anchoring hole in the first part is located in the third portion between the mounting area and the second portion .
  • the mounting area is provided on the third portion such that it captures an area of the third portion which is as large as possible but does not cover the entire area of the third portion.
  • the at least one anchoring hole is located on the remaining area of the third portion which is not occupied by the mounting area.
  • the number of anchoring holes is reduced in comparison to commonly known leadframes in order to enlarge the mounting area for a chip. In this way, it is possible to maximze the available mounting area and to provide a wire bonding region, which is particularly
  • the first part and the second part comprise two anchoring holes each .
  • the number of anchoring holes is reduced to two.
  • the fixing of a housing body at the leadframe is still possible in a sufficient amount by two anchoring holes and the available mounting area for mounting a chip is increased.
  • the second part comprises a wire bonding region.
  • the first part and the second part form a crooked gap between each other.
  • the first part and the second part form a crooked gap between each other.
  • the gap between the first and the second part has a c-shape. Due to the curved shape of the gap the formation of cracks in the housing body between the first and the second part is reduced .
  • the first part comprises a wire bonding region.
  • a wire bonding region on the first part is advantageously arranged on either the first, the second or the third portion of the first part of the leadframe. This is especially useful for chips which are not contacted from their lower side which faces the mounting area of the first part of the leadframe. For example, chips having a sapphire substrate, or other chips which also need two wire bonds for electrical
  • the wire bonding region can be located at any of the first, the second or the third portion of the first part. Preferably, the wire bonding region is located on the third portion between the mounting area and the second portion situated next to an anchoring hole or between a plurality of anchoring holes.
  • the second part comprises edge regions which protrude beyond a central region of the curved edge line facing the first part in a direction towards the first part.
  • the edge line of the second part facing the first part comprises segments, wherein in edge regions of the second part the curved shape of the edge line is achieved by
  • the edge regions of the second part do not comprise any anchoring holes in order to increase the material area of the second part of the leadframe which can be embedded in a housing material. Consequently, the locking force inside a housing body is increased for the second part by means of its edge regions. This can advantegously be achieved by edge lines and segments of the edge line of the second part which are non-parallel to each other.
  • the second part of the leadframe comprises a metal
  • the metal areas in the center of an electronic component comprising said leadframe and a housing body are increased and the locking of the leadframe in the housing body is improved.
  • An improved locking of the leadframe in the housing is achieved against stresses caused by high temperature, high humidity and against impact on the housing by process steps.
  • the leadframe comprises a plurality of first parts and second parts.
  • the first part and the second part can be parts of leadframe strips comprising a plurality of first parts and a plurality of second parts which can be placed during manufacturing adjacent to each other such that in a pair a first part faces a second part. It is advantegous for embedding the strips in a housing body.
  • the individual pairs can then be separated in a manufacturing process, for example by sawing in order to produce a plurality of electronic devices comprising the leadframe parts.
  • the strips can be embodied in form of an endless-strip for machine-processing and automatized
  • a chip package comprises a leadframe having a first part and a second part, wherein a light emitting diode chip is arranged at a mounting area of the first part, and the first part and the second part are embedded at least partly into a housing body such that the housing body penetrates through anchoring holes of the first part and of the second part.
  • electrical contact is made between the light emitting diode chip arranged at the mounting area of the first part and the second part of the leadframe.
  • a second electrical contact with the chip can be made by contact pads placed below the mounting area.
  • the light emitting diode chip is contacted by a wire bond to the wire bonding region of the first part and by another wire bond to a wire bonding region of the second part of the leadframe .
  • a chip which has two upper contacts that are electrically contacted by wire bonds can be advantageously mounted on said first part of the leadframe and contacted to both wire bonding regions.
  • the housing body comprises a mold compound.
  • the first and the second leadframe parts are preferably embedded partly in the housing body.
  • the first part comprises a first portion which remains free of the mold compound.
  • the second part comprises an edge region which faces away from a gap between the first and the second part and which remains free of the material of the housing body. Said part of the second part which remains free of the material of the housing body can be used to attach the leadframe mechanically or electrically to a neighbouring component, for example to a circuit board.
  • the leadframe is preferably sealed with the mold compound such that the mold compound penetrates through anchoring holes and embeds the leadframe, the wire bond(s) and the chip.
  • the mold compound can comprise a resin, an epoxy mold compound (EMC), silicone, hybrid EMC or other encapsulation materials. It is also possible for the mold compound to comprise
  • the mold can be hardened and if the leadframe comprises a
  • the mold can be cut, for example sawed, to individual components comprising pairs of leadframe parts.
  • the light emitting diode chip has a sapphire substrate.
  • Chips comprising a sapphire substrate can have two wire bonds for making electrical contact.
  • the first part of the leadframe can comprise a wire bonding region.
  • Figure 1 shows a schematic illustration of a chip package in a top view in accordance with one exemplary embodiment
  • FIG. 2 shows a schematic illustration of the chip
  • Figures 3a and 3b show a comparison between a chip package comprising a leadframe known from prior art and a chip package comprising a leadframe in
  • Figure 4 shows a schematic illustration of a leadframe comprising a plurality of leadframe parts. Identical or identically acting elements are provided with the same reference signs in the figures. The sizes of the individual elements and the size relationships of the
  • Figure 1 shows a chip package 20 in a top view on the
  • leadframe 1 comprising a first part la and a second part lb.
  • the leadframe parts are preferrably produced as metal parts stamped out or etched out from a plate.
  • the first part la has three portions A, B and C, wherein the first portion A has a maximum width Al, the second portion B has a maximum width Bl and the third portion C has a maximum width CI .
  • the third portion C comprises a mounting area 2.
  • the third portion C follows the second portion B and the second portion B follows the first portion A in a direction of a longitudinal extend L of the first part la such that the third portion C faces the second part lb. Both parts la and lb are electrically
  • the second part lb comprises two anchoring holes 3 penetrating the leadframe completely.
  • the first part la comprises a wire bonding region 2a for contacting a wire bond 4 outside the mounting area 2 on the third portion C located between the mounting area 2 and the second portion B.
  • a light emitting diode chip 10 is mounted on the mounting area 2.
  • the light emitting diode chip 10 has two electrode pads 8 on its top side which are connected by wire bonds 4 to wire bonding regions 2a of the first part la and the second part lb.
  • the widths Al, Bl and CI extend in a direction perpendicular to the longitudinal extend L of the first part, wherein the maximum width Bl is smaller than the maximum width Al and smaller than the maximum width CI.
  • the leadframe is oriented such that the first portion A of the first part la faces away from the second part lb.
  • Both parts la and lb of the leadframe are embedded in a housing body 11 which comprises preferably a mold compound.
  • the mold extends through the
  • the first and the second part are only partly embedded in the housing body 11.
  • the outer edges of the parts la and lb, such as the first portion A of part la, are partly not embedded in the housing body and serve for electrical and mechanical access to the environment of the leadframe.
  • the second portion B has preferably a small length in
  • the edge lines of the first and of the third portion which extend away from the second portion are preferably not parallel with respect to a line representing the longitudinal extend of the first part.
  • the leadframe expands in width with increasing distance from the second portion what results in a more stable embedment of the leadframe, in particular of the third portion C, in the housing body 11.
  • edge lines of the first and the third portions are non-parallel to each other.
  • the edge lines of the first part la have a polygonal shape, wherein due to the increased width of the third portion in comparison to the second portion and due to only two
  • the second part lb comprises a polygonal shape.
  • the edge line of the second part lb facing the first part la comprises segments, wherein in edge regions lc of the second part lb the curved shape of the edge line is achieved by segments which protrude beyond a central region of the curved edge line in a direction towards the first part la.
  • the edge regions lc of the second part lb do not comprise anchoring holes what results in an increased material area of the second part lb to be embedded in the housing body 11 in the central region of the chip package 20. Consequently, the locking force inside a housing body 11 is increased for the second part lb by means of its edge regions lc.
  • a chip package 20 is achieved which has an increased locking force acting on the leadframe while the leadframe and the housing body are exposed to outer forces and which has an increased mounting area on which larger chips 10, for example chips having a sapphire substrate can be mounted.
  • a crooked gap between the first and the second part makes the chip package more robust against external forces, for example mechanical forces on the leadframe in a direction
  • the gap between the first and the second part has a c-shape. Due to the curved shape of the gap the formation of cracks in the housing body between the first and the second part is advantegously reduced.
  • FIG 2 shows a schematic illustration of a chip package 20 as shown in Figure 1 in a sectional view.
  • the second part lb differs from the illustration shown in Figure 1 in the position of the anchoring hole 3 and the wire bonding region 2a on the second part lb.
  • an anchoring hole 3 is located laterally adjacent to a wire bonding region 2 on the second part lb, wherein the wire bonding region is located between the anchoring hole and an edge of the second part lb which faces the first part la. It can be seen that the anchoring hole 3 completely penetrates the second part lb of the leadframe and that the housing body 11 embeds the first and the second part of the leadframe and penetrates through the anchoring hole 3.
  • the first part la comprises at least one anchoring hole, but in the embodiment shown in Figure 2 the anchoring hole is not located on the cut line through the chip package and thus not shown.
  • the embodiment of the chip package 20 shown in Figure 2 comprises leadframe parts la and lb which are only partly embedded in the housing body 11. The outer portions of the first and the second part are embodied such that they have a larger
  • a chip 10 comprises two contact pads 8 on its top side, preferably the chip 10 comprises a sapphire substrate. Such a chip is characterized by a comparatively large dimension and needs two contacts at its top side. Two wire bonds 4 are led to the contact pads 8 on the top side of the chip 10. One wire bond 4 is connected to a wire bonding region 2a on the first part la and another wire bond 4 is connected to a wire bonding region 2a on the second part lb.
  • the chip 10 having a sapphire substrate can have dimensions of up to 11 mil x 14 mil, as seen in top view on the leadframe. It is also possible for the chip to be as large as the mounting area.
  • Figures 3a and 3b show a comparison between a leadframe according to prior art ( Figure 3a) and a leadframe according to the application ( Figure 3b) .
  • Figure 3a a leadframe comprising two parts la' and lb' with a chip 10' mounted on part la' is shown, wherein both parts comprise three
  • the leadframe of Figure 3a can only allow chips to be mounted on it which have a
  • the leadframe shown in Figure 3a differs from the leadframe shown in Figure 3b by the alignment of the edge lines.
  • the leadframe parts la' and lb' shown in Figure 3a have edge lines which are parallel to each other, for example edge lines are embodied parallel to each other in Figure 3a but not in Figure 3b where the first and the second part la' and lb' are separated by a gap.
  • the embodiment shown in Figure 3b is characterized by an improved locking of leadframe parts la and lb in the housing body.
  • the design of the leadframe parts shown in Figure 3b can provide a locking force inside a housing body which is up to 10 % larger than the locking force provided by a design of leadframe parts la' and lb' shown in Figure 3a.
  • the leadframe shown in Figure 3b can provide a locking force of up to 843.71 N and the leadframe shown in Figure 3a can provide a locking force of up to 768.1 N.
  • Figure 4 shows a plurality of chip packages 20 with a
  • leadframe 1 which comprises a plurality of first and second parts la and lb.
  • the plurality of first parts la and second parts lb are embodied as strips comprising a plurality of first parts and a plurality of second parts.
  • a first part la and a second part lb are placed individually adjacent to each other and form a pair of leadframe parts.
  • the strips are embedded partly in a housing body and can be separated into individual pairs in a manufacturing process, for example by sawing in order to produce a plurality of chip packages 20 each comprising the leadframe parts la and lb.
  • the strips are preferably embodied in form of an endless-strip for machine- processing and automatized processing.

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  • Led Device Packages (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)

Abstract

A leadframe (1), comprising a first part (1a) and a second part (1b), wherein the first part (1a) and the second part (1b) are separated from each other,and the first part (1a) and the second part (1b) each comprise at least one anchoring hole (3). The first part (1a) comprises a mounting area (2), the second part (1b) comprises an edge line facing the first part (1a) which is curved, and the first part (1a) comprises a first portion (A) having a maximum width (A1), a second portion (B) having a maximum width (B1) and a third portion (C) having a maximum width (C1), wherein the mounting area (2) is arranged at the third portion (C), and wherein the third portion (C) follows the second portion (B) and the second portion (B) follows the first portion (A) in a direction of a longitudinal extend (L) of the first part (1a) such that the third portion(C) faces the second part (1b). The widths (A1, B1, C1) of the first, the second and the third portion (A, B, C) extend in a direction perpendicular to the longitudinal extend (L) of the first part (1a),and the maximum width (B1) of the second portion (B) is smaller than the maximum width (A1) of the first portion (A) and smaller than the maximum width (C1) of the third portion (C), and edge lines of the first (A) and the third portion (C) are non-parallel to each other, as seen in a top view of the first part (1a).

Description

Description
Leadframe and chip package comprising a leadframe The invention relates to a leadframe and a chip package comprising a leadframe.
Leadframes are used to serve as carriers for electronic devices such as light emitting diode chips and as electrical contacts. Chip packages are produced using leadframes and electronic devices, wherein the leadframes are embedded in the housing body. During manufacturing there is risk to damage the housing body in a gap between two leadframe parts and and/or to displace the leadframe parts in the housing body.
It is at least one object of specific embodiments to specify a leadframe with an improved stability while arranged in a chip package. It is at least one further object of specific embodiments to specify a chip package comprising a leadframe.
These objects are achieved according to the independent patent claims. Advantageous embodiments and developments are characterized in the dependent claims and are furthermore evident from the following description and the drawings.
In accordance with at least one embodiment, a leadframe comprises a first part and a second part, wherein the first part and the second part are separated from each other and the first part and the second part each comprise at least one anchoring hole and the first part comprises a mounting area. An arrangement of metal parts stamped out or etched out from a plate is designated to be a leadframe. Leadframes are intended to have further elements like diode chips or wire bonds arranged on them. A leadframe or several component parts of a leadframe are preferably embedded in a housing body, for example a mold compound. For the purpose of
simplification and automatization of production methods of electronic devices or components having a leadframe, a leadframe can comprise several parts in the form of an endless strip. It is possible to produce several electronic devices or components on the leadframe, for example by mounting several diode chips on the leadframe. The leadframe parts are contacted by wire bond connections, for example. Further, it is possible to embed the leadframe in a housing body. While separating the leadframe parts in order to form electronic devices, it is possible that the individual electronic device is damaged. For example, it is possible that while separating, for example sawing, the leadframe and the housing material, the leadframe part can be pulled out from the housing material or at least be displaced. To provide sufficient locking of leadframe parts in the housing material anchoring holes are needed in the leadframe through which the housing material can emerge. Preferrably, the anchoring holes penetrate completely through the leadframe.
The mounting area on the first part is provided for an electronic component, for example a light emitting diode chip, to be mounted on which can be electrically connected to the second part of the leadframe, for example by a wire bond. Both the first and the second part comprise at least one anchoring hole for an improved fixing of a housing body. The first part of the leadframe is provided to be contacted to an opposite electrical polarity than the second part. This requires a separation of the first and the second leadframe part, in particular by a gap between them. The second part of the leadframe comprises an edge line facing the first part which is curved.
Preferably, in order to prevent generation of cracks in a housing body in a gap between the first and the second part of the leadframe, the edge line of the second part of the leadframe, which faces the first part, is embodied in a curved fashion. The edge line is preferably shaped in a convex or concave manner. Further, it is also possible for the edge line to comprise segments, wherein some segments can form a straight line. For example, it is possible for the edge line of the second part facing the first part to have a polygonal shape.
Further, the first part comprises a first portion having a maximum width, a second portion having a maximum width and a third portion having a maximum width, wherein the mounting area is arranged at the third portion. The third portion follows the second portion and the second portion follows the first portion in a direction of a longitudinal extend of the first part such that the third portion faces the second part.
Further, the widths of the first, the second and the third portion extend in a direction perpendicular to the
longitudinal extend of the first part, wherein the maximum width of the second portion is smaller than the maximum width of the first portion and smaller than the maximum width of the third portion. The leadframe is oriented such that the first portion of the first part of the leadframe faces away from the second part. The first portion can at least partly be provided for
electrically contacting and mechanically fixing the
leadframe. For example, the first portion can at least partly remain free of an embedding housing material. For reasons of mechanical fixing and electrical connetion to a neighbouring component, for example to a circuit board, the maximum width of the first portion should be as large as possible,
preferrably larger than the maximum width of the second portion. The second portion has preferrably a small length in comparison with the length of the first and the third
portion, wherein the length of each portion extends in a direction parallel to the longitudinal extend of the first part. The edge lines of the first and of the third portion which extend away from the second portion are preferrably not parallel with respect to a line representing the longitudinal extend of the first part. In other words, the leadframe expands in width in a longitudinal direction away from the second portion. This results in a more stable embedment of the leadframe in a housing body.
Further, edge lines of the first and the third portions are non-parallel to each other, as seen in a top view of the first part.
The edge lines of the first part can have a polygonal shape. An embodiment of the first part of the leadframe with edge lines which are non-parallel to each other is advantageous while the leadframe is embedded in a housing body, for example in a mold compound. During a manufacturing process of an electronic device which comprises said leadframe, the first part is prevented from being displaced inside the housing body or even pulled out of it during an external processing step, for example sawing of the housing body.
In accordance with a further embodiment of the leadframe, the at least one anchoring hole in the first part is located in the third portion between the mounting area and the second portion .
The mounting area is provided on the third portion such that it captures an area of the third portion which is as large as possible but does not cover the entire area of the third portion. The at least one anchoring hole is located on the remaining area of the third portion which is not occupied by the mounting area. Preferrably, the number of anchoring holes is reduced in comparison to commonly known leadframes in order to enlarge the mounting area for a chip. In this way, it is possible to maximze the available mounting area and to provide a wire bonding region, which is particularly
advantegous for small chip packages. As a result, it is possible to mount a comparatively large chip, in relation to the size of the first part of the leadframe, on the mounting area and to provide more than one wire bonding region. The use of larger chips results in an improved performance of an electronic device comprising a leadframe without a
significant increase in size of the leadframe.
In accordance with a further embodiment of the leadframe, the first part and the second part comprise two anchoring holes each .
In comparison to commonly known leadframes, the number of anchoring holes is reduced to two. As a result, the fixing of a housing body at the leadframe is still possible in a sufficient amount by two anchoring holes and the available mounting area for mounting a chip is increased.
In accordance with a further embodiment of the leadframe, the second part comprises a wire bonding region.
For making electrical contact with a chip which is mounted on the mounting area of the first part it is advantageous to locate the wire bonding region of the second part close to the edge of the second part which faces the third portion of the first part.
In accordance with a further embodiment of the leadframe, the first part and the second part form a crooked gap between each other.
In order to make a device comprising a leadframe in a housing body more robust against external forces, for example
mechanical forces on the leadframe in a direction
perpendicular to the width of the third portion and its longitudinal extend, the first part and the second part form a crooked gap between each other. Preferrably, the gap between the first and the second part has a c-shape. Due to the curved shape of the gap the formation of cracks in the housing body between the first and the second part is reduced .
In accordance with a further embodiment of the leadframe, the first part comprises a wire bonding region.
For making electric contact between a chip which is mounted on the mounting area with the first part of the leadframe a wire bonding region on the first part is advantageously arranged on either the first, the second or the third portion of the first part of the leadframe. This is especially useful for chips which are not contacted from their lower side which faces the mounting area of the first part of the leadframe. For example, chips having a sapphire substrate, or other chips which also need two wire bonds for electrical
contacting. The wire bonding region can be located at any of the first, the second or the third portion of the first part. Preferably, the wire bonding region is located on the third portion between the mounting area and the second portion situated next to an anchoring hole or between a plurality of anchoring holes.
In accordance with a further embodiment of the leadframe, the second part comprises edge regions which protrude beyond a central region of the curved edge line facing the first part in a direction towards the first part.
The edge line of the second part facing the first part comprises segments, wherein in edge regions of the second part the curved shape of the edge line is achieved by
segments which protrude beyond a central region of the curved edge line in a direction towards the first part. Preferably, the edge regions of the second part do not comprise any anchoring holes in order to increase the material area of the second part of the leadframe which can be embedded in a housing material. Consequently, the locking force inside a housing body is increased for the second part by means of its edge regions. This can advantegously be achieved by edge lines and segments of the edge line of the second part which are non-parallel to each other. For the case that the second part of the leadframe comprises a metal, the metal areas in the center of an electronic component comprising said leadframe and a housing body are increased and the locking of the leadframe in the housing body is improved. An improved locking of the leadframe in the housing is achieved against stresses caused by high temperature, high humidity and against impact on the housing by process steps.
In accordance with a further embodiment, the leadframe comprises a plurality of first parts and second parts. The first part and the second part can be parts of leadframe strips comprising a plurality of first parts and a plurality of second parts which can be placed during manufacturing adjacent to each other such that in a pair a first part faces a second part. It is advantegous for embedding the strips in a housing body. The individual pairs can then be separated in a manufacturing process, for example by sawing in order to produce a plurality of electronic devices comprising the leadframe parts. The strips can be embodied in form of an endless-strip for machine-processing and automatized
processing.
In accordance with at least one embodiment, a chip package comprises a leadframe having a first part and a second part, wherein a light emitting diode chip is arranged at a mounting area of the first part, and the first part and the second part are embedded at least partly into a housing body such that the housing body penetrates through anchoring holes of the first part and of the second part. In accordance with a further embodiment of the chip package, electrical contact is made between the light emitting diode chip arranged at the mounting area of the first part and the second part of the leadframe. A second electrical contact with the chip can be made by contact pads placed below the mounting area. In accordance with a further embodiment of the chip package, the light emitting diode chip is contacted by a wire bond to the wire bonding region of the first part and by another wire bond to a wire bonding region of the second part of the leadframe .
In particular, a chip which has two upper contacts that are electrically contacted by wire bonds can be advantageously mounted on said first part of the leadframe and contacted to both wire bonding regions.
In accordance with a further embodiment of the chip package, the housing body comprises a mold compound.
The first and the second leadframe parts are preferably embedded partly in the housing body. In particular, the first part comprises a first portion which remains free of the mold compound. Also the second part comprises an edge region which faces away from a gap between the first and the second part and which remains free of the material of the housing body. Said part of the second part which remains free of the material of the housing body can be used to attach the leadframe mechanically or electrically to a neighbouring component, for example to a circuit board. The leadframe is preferably sealed with the mold compound such that the mold compound penetrates through anchoring holes and embeds the leadframe, the wire bond(s) and the chip. It is possible for the mold compound to comprise a resin, an epoxy mold compound (EMC), silicone, hybrid EMC or other encapsulation materials. It is also possible for the mold compound to comprise
additional materials such as phosphors. After sealing, the mold can be hardened and if the leadframe comprises a
plurality of pairs of first and second parts the mold can be cut, for example sawed, to individual components comprising pairs of leadframe parts.
In accordance with a further embodiment of the chip package, the light emitting diode chip has a sapphire substrate.
Chips comprising a sapphire substrate can have two wire bonds for making electrical contact. For the purpose of mounting a chip which has a sapphire substrate the first part of the leadframe can comprise a wire bonding region.
Further advantages, advantageous embodiments and developments will become apparent from the exemplary embodiments described below in association with the figures. In the figures:
Figure 1 shows a schematic illustration of a chip package in a top view in accordance with one exemplary embodiment,
Figure 2 shows a schematic illustration of the chip
package in a sectional view in accordance with one exemplary embodiment, Figures 3a and 3b show a comparison between a chip package comprising a leadframe known from prior art and a chip package comprising a leadframe in
accordance with one exemplary embodiment, Figure 4 shows a schematic illustration of a leadframe comprising a plurality of leadframe parts. Identical or identically acting elements are provided with the same reference signs in the figures. The sizes of the individual elements and the size relationships of the
elements among one another should not be regarded as true to scale .
Figure 1 shows a chip package 20 in a top view on the
leadframe 1 comprising a first part la and a second part lb. The leadframe parts are preferrably produced as metal parts stamped out or etched out from a plate. The first part la has three portions A, B and C, wherein the first portion A has a maximum width Al, the second portion B has a maximum width Bl and the third portion C has a maximum width CI . The third portion C comprises a mounting area 2. The third portion C follows the second portion B and the second portion B follows the first portion A in a direction of a longitudinal extend L of the first part la such that the third portion C faces the second part lb. Both parts la and lb are electrically
isolated from each other and are separated by a gap between them so that one part can be contacted to an anode and the other to a cathode or vice versa. In the third portion C two anchoring holes 3 are arranged at the first part la
penetrating the leadframe completely. Likewise, the second part lb comprises two anchoring holes 3 penetrating the leadframe completely.
The first part la comprises a wire bonding region 2a for contacting a wire bond 4 outside the mounting area 2 on the third portion C located between the mounting area 2 and the second portion B. A light emitting diode chip 10 is mounted on the mounting area 2. The light emitting diode chip 10 has two electrode pads 8 on its top side which are connected by wire bonds 4 to wire bonding regions 2a of the first part la and the second part lb.
Due to the fact that the first part comprises only two anchoring holes 3, more space is available for a chip to be mounted on the mounting area 2. The widths Al, Bl and CI extend in a direction perpendicular to the longitudinal extend L of the first part, wherein the maximum width Bl is smaller than the maximum width Al and smaller than the maximum width CI. The leadframe is oriented such that the first portion A of the first part la faces away from the second part lb.
Both parts la and lb of the leadframe are embedded in a housing body 11 which comprises preferably a mold compound. In such a configuration, the mold extends through the
anchoring holes 3 and fixes the parts la and lb in it. The first and the second part are only partly embedded in the housing body 11. The outer edges of the parts la and lb, such as the first portion A of part la, are partly not embedded in the housing body and serve for electrical and mechanical access to the environment of the leadframe.
The second portion B has preferably a small length in
comparison to the length of the first portion A and the third portion C, wherein the length of each portion extends in a direction parallel to the longitudinal extend L of the first part la. Further, the edge lines of the first and of the third portion which extend away from the second portion are preferably not parallel with respect to a line representing the longitudinal extend of the first part. In other words, the leadframe expands in width with increasing distance from the second portion what results in a more stable embedment of the leadframe, in particular of the third portion C, in the housing body 11. As seen in a top view, edge lines of the first and the third portions are non-parallel to each other. The edge lines of the first part la have a polygonal shape, wherein due to the increased width of the third portion in comparison to the second portion and due to only two
anchoring holes 3 in the third portion the mounting area 2 is maximized on the first part la of the leadframe. Also the second part lb comprises a polygonal shape. Further, the edge line of the second part lb facing the first part la comprises segments, wherein in edge regions lc of the second part lb the curved shape of the edge line is achieved by segments which protrude beyond a central region of the curved edge line in a direction towards the first part la. The edge regions lc of the second part lb do not comprise anchoring holes what results in an increased material area of the second part lb to be embedded in the housing body 11 in the central region of the chip package 20. Consequently, the locking force inside a housing body 11 is increased for the second part lb by means of its edge regions lc.
Because of the unparallel edge lines, the locking force of the first part la and of the second part lb in the housing body is increased. Consequently, the first part la and the second part lb are prevented from being displaced inside the housing body 11 or even pulled out of it during an external processing step, for example sawing of the housing body while separating it from a larger compound. Advantageously, a chip package 20 is achieved which has an increased locking force acting on the leadframe while the leadframe and the housing body are exposed to outer forces and which has an increased mounting area on which larger chips 10, for example chips having a sapphire substrate can be mounted.
A crooked gap between the first and the second part makes the chip package more robust against external forces, for example mechanical forces on the leadframe in a direction
perpendicular to the width of the third portion C and to its longitudinal extend. The gap between the first and the second part has a c-shape. Due to the curved shape of the gap the formation of cracks in the housing body between the first and the second part is advantegously reduced.
Figure 2 shows a schematic illustration of a chip package 20 as shown in Figure 1 in a sectional view. The second part lb differs from the illustration shown in Figure 1 in the position of the anchoring hole 3 and the wire bonding region 2a on the second part lb. Here, an anchoring hole 3 is located laterally adjacent to a wire bonding region 2 on the second part lb, wherein the wire bonding region is located between the anchoring hole and an edge of the second part lb which faces the first part la. It can be seen that the anchoring hole 3 completely penetrates the second part lb of the leadframe and that the housing body 11 embeds the first and the second part of the leadframe and penetrates through the anchoring hole 3. Also the first part la comprises at least one anchoring hole, but in the embodiment shown in Figure 2 the anchoring hole is not located on the cut line through the chip package and thus not shown. Further, the embodiment of the chip package 20 shown in Figure 2 comprises leadframe parts la and lb which are only partly embedded in the housing body 11. The outer portions of the first and the second part are embodied such that they have a larger
thickness than the inner portions of the first and the second part. The housing embeds the first and the second part such that the outer portions are partly free of the housing body. This is advantageous for providing a mechanical fixing and electrical connetion to a neighbouring component, for example to a circuit board. A chip 10 comprises two contact pads 8 on its top side, preferably the chip 10 comprises a sapphire substrate. Such a chip is characterized by a comparatively large dimension and needs two contacts at its top side. Two wire bonds 4 are led to the contact pads 8 on the top side of the chip 10. One wire bond 4 is connected to a wire bonding region 2a on the first part la and another wire bond 4 is connected to a wire bonding region 2a on the second part lb. For example, the chip 10 having a sapphire substrate can have dimensions of up to 11 mil x 14 mil, as seen in top view on the leadframe. It is also possible for the chip to be as large as the mounting area.
Figures 3a and 3b show a comparison between a leadframe according to prior art (Figure 3a) and a leadframe according to the application (Figure 3b) . In Figure 3a, a leadframe comprising two parts la' and lb' with a chip 10' mounted on part la' is shown, wherein both parts comprise three
anchoring holes 3' and only one wire bonding region on the second part lb' which connects a chip 10' and a wire bond 4' . In comparison to Figure 3b, the leadframe of Figure 3a can only allow chips to be mounted on it which have a
significantly smaller size than the chips which can be mounted on the first part la of the leadframe of Figure 3b. It can clearly be seen that the reduction of anchoring holes 3 to a number of two in Figure 3b allows an increased
mounting area and the possibility to apply also a wire bonding region on the first part la of the leadframe.
Further, the leadframe shown in Figure 3a differs from the leadframe shown in Figure 3b by the alignment of the edge lines. The leadframe parts la' and lb' shown in Figure 3a have edge lines which are parallel to each other, for example edge lines are embodied parallel to each other in Figure 3a but not in Figure 3b where the first and the second part la' and lb' are separated by a gap. The embodiment shown in Figure 3b is characterized by an improved locking of leadframe parts la and lb in the housing body. In particular, the design of the leadframe parts shown in Figure 3b can provide a locking force inside a housing body which is up to 10 % larger than the locking force provided by a design of leadframe parts la' and lb' shown in Figure 3a. For example, the leadframe shown in Figure 3b can provide a locking force of up to 843.71 N and the leadframe shown in Figure 3a can provide a locking force of up to 768.1 N.
External forces, for example mechanical forces, which act on the leadframe in a direction perpendicular to the top side of the leadframe parts can cause cracks in a housing body in the gap between the two leadframe parts. For the crooked gap in Figure 3b the formation of cracks is reduced.
Figure 4 shows a plurality of chip packages 20 with a
leadframe 1 which comprises a plurality of first and second parts la and lb. The plurality of first parts la and second parts lb are embodied as strips comprising a plurality of first parts and a plurality of second parts. A first part la and a second part lb are placed individually adjacent to each other and form a pair of leadframe parts. The strips are embedded partly in a housing body and can be separated into individual pairs in a manufacturing process, for example by sawing in order to produce a plurality of chip packages 20 each comprising the leadframe parts la and lb. The strips are preferably embodied in form of an endless-strip for machine- processing and automatized processing. Furthermore, other combinations of the features described in the figures and also in the embodiments in the general part are also possible, even if they are not explicitly shown in the figures. The invention is not restricted to the exemplary embodiments by the description on the basis of said exemplary
embodiments. Rather, the invention encompasses any novel feature and also any combination of features, which in particular includes any combination of features in the patent claims, even if this feature or this combination itself is not explicitly specified in the patent claims or exemplary embodiments .

Claims

- IS
A leadframe (1), comprising a first part (la) and a second part (lb), wherein
- the first part (la) and the second part (lb) are separated from each other,
- the first part (la) and the second part (lb) each comprise at least one anchoring hole (3) ,
- the first part (la) comprises a mounting area (2),
- the second part (lb) comprises an edge line facing the first part (la) which is curved,
- the first part (la) comprises a first portion (A) having a maximum width (Al), a second portion (B) having a maximum width (Bl) and a third portion (C) having a maximum width (CI), wherein the mounting area (2) is arranged at the third portion (C) , and wherein
- the third portion (C) follows the second portion (B) and the second portion (B) follows the first portion (A) in a direction of a longitudinal extend (L) of the first part (la) such that the third portion (C) faces the second part (lb),
- the widths (Al, Bl, CI) of the first, the second and the third portion (A, B, C) extend in a direction perpendicular to the longitudinal extend (L) of the first part ( la) ,
- the maximum width (Bl) of the second portion (B) is smaller than the maximum width (Al) of the first portion (A) and smaller than the maximum width (CI) of the third portion (C) , and
- edge lines of the first (A) and the third portion (C) are non-parallel to each other, as seen in a top view of the first part (la) .
The leadframe (1) according to the preceding claim, wherein the at least one anchoring hole (3) in the first part (la) is located in the third portion (C) between the mounting area (2) and the second portion (B) .
The leadframe (1) according to any of the preceding claims, wherein the first part (la) and the second part (lb) comprise two anchoring holes (3) each.
The leadframe (1) according to any of the preceding claims, wherein the second part (lb) comprises a wire bonding region (2a) .
The leadframe (1) according to any of the preceding claims, wherein the first part (la) and the second part (lb) form a crooked gap between each other.
The leadframe (1) according to any of the preceding claims, wherein the first part (la) comprises a wire bonding region (2a) .
The leadframe (1) according to any of the preceding claims, wherein the second part (lb) comprises edge regions (lc) which protrude beyond a central region of the curved edge line facing the first part (la) in a direction towards the first part (la) .
The leadframe (1) according to any of the preceding claims, wherein the leadframe (1) comprises a plurality of first parts (la) and second parts (lb) .
9. A chip package (20) comprising a leadframe (1) having a first part (la) and a second part (lb) according to any of the previous claims, wherein
- a light emitting diode chip (10) is arranged at the mounting area (2) of the first part (la) , and
- the first part (la) and the second part (lb) are embedded at least partly into a housing body (11) such that the housing body (11) penetrates through the anchoring holes (3) of the first part (la) and of the second part (lb) .
10. A chip package (20) according to the preceding claim, wherein electrical contact is made between the light emitting diode chip (10) arranged at the mounting area (2) of the first part (la) and the second part (lb) of the leadframe .
11. A chip package (20) according to any of claims 9 and 10 wherein the light emitting diode chip (10) is contacted by a wire bond (4) to the wire bonding region (2a) of the first part (la) and by another wire bond (4) to a wire bonding region (2a) of the second part (lb) of the leadframe (1) .
12. A chip package (20) according to any of claims 9 to 11, wherein the housing body (11) comprises a mold compound
13. A chip package (20) according to any of claims 9 to 12, wherein the light emitting diode chip (10) has a sapphire substrate.
PCT/EP2015/052531 2015-02-06 2015-02-06 Leadframe and chip package comprising a leadframe Ceased WO2016124249A1 (en)

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PCT/EP2015/052531 WO2016124249A1 (en) 2015-02-06 2015-02-06 Leadframe and chip package comprising a leadframe
US15/547,703 US10109562B2 (en) 2015-02-06 2015-02-06 Leadframe and chip package comprising a leadframe
DE112015006115.0T DE112015006115T5 (en) 2015-02-06 2015-02-06 Leadframe and chip package with leadframe

Applications Claiming Priority (1)

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US11101419B2 (en) * 2019-11-04 2021-08-24 Shenzhen Yong Yu Photoelectric Co, Ltd Package structure of light-emitting diode and method for packaging light-emitting diode
CN114121840A (en) * 2020-08-31 2022-03-01 苏州兴锝电子有限公司 Semiconductor silicon controlled module
WO2022164574A1 (en) * 2021-01-29 2022-08-04 Microchip Technology Incorporated Lead frames for semiconductor packages with increased reliability and related packages and methods
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