WO2016103385A1

WO2016103385A1 - Method for producing surface-modified base

Info

Publication number: WO2016103385A1
Application number: PCT/JP2014/084267
Authority: WO
Inventors: 拓人山口; 秀樹萩野
Original assignee: 地方独立行政法人大阪府立産業技術総合研究所
Priority date: 2014-12-25
Filing date: 2014-12-25
Publication date: 2016-06-30
Also published as: JP6390056B2; JPWO2016103385A1

Abstract

In a method for producing a surface-modified base according to one embodiment of the present invention, surface modification of a metal base is carried out by irradiating the surface of the metal base with laser light. This method for producing a surface-modified base according to one embodiment of the present invention comprises: a step wherein the surface of the metal base is provided with a resin layer that transmits laser light; and a step wherein the base surface is irradiated with laser light through the resin layer, so that the base surface is melted and the resin layer is thermally decomposed by the heat of the base.

Description

Method for producing surface modified substrate

The present invention relates to a method for producing a surface modified substrate, and more particularly to a method for performing surface modification by irradiating a surface of a metal substrate with laser light.

As surface modification methods for metal substrates, PVD, CVD, carburizing, nitriding, etc. are common methods, but since these methods heat the entire substrate, deformation of the substrate due to thermal effects, Deterioration or the like may occur. Laser surface modification methods are known as methods for surface modification of only necessary portions without heating the entire substrate (see, for example, Patent Documents 1 and 2). According to the laser surface modification, the thermal influence on the substrate is relatively small, and deformation, deterioration, etc. of the substrate can be suppressed.

Patent Document 1 discloses that a carbide layer is formed on the surface of a substrate by irradiating the surface of the substrate supplied with graphite powder with laser light in an inert atmosphere or in a vacuum. Patent Document 2 discloses that a ceramic layer is formed on the surface of the substrate by irradiating the surface of the substrate supplied with the ceramic powder and the bonding metal powder with laser light.

JP-A 61-163283 Japanese Unexamined Patent Publication No. 2-118083

However, in the techniques disclosed in Patent Documents 1 and 2, since powder easily scatters by irradiation with laser light, it is difficult to perform uniform and stable surface modification.

The manufacturing method according to one aspect of the present invention is a method for manufacturing a surface-modified base material that performs surface modification of the base material by irradiating the surface of the metal base material with a laser beam. Providing a resin layer that transmits the laser beam on the surface; irradiating the surface of the substrate with the laser beam through the resin layer to melt the surface of the substrate; and by the heat of the substrate And a step of thermally decomposing the resin layer.

According to the production method which is one embodiment of the present invention, a more uniform and stable surface modification is possible while being a simple method of forming a resin layer on a substrate surface and irradiating a laser beam.

It is a figure which shows the surface modification process of the base material which is an example of embodiment. It is sectional drawing which shows typically the surface modification base material which is an example of embodiment. It is a figure which shows the surface modification process of the base material which is another example of embodiment. It is a microscope image which shows the cross section of the surface modification base material which is an example of embodiment. It is an XRD pattern of the surface modification base material which is an example of embodiment. It is the elemental analysis result by the glow discharge emission spectrometry (GDS) of the surface modification base material which is an example of embodiment. It is the measurement result of the hardness by the nanoindentation method of the surface modification base material which is an example of embodiment. It is a microscope image which shows the base-material surface after the sliding abrasion test of the surface-modified base material which is an example of embodiment.

Hereinafter, an example of an embodiment will be described in detail with reference to the drawings.
In a method for producing a surface-modified base material (surface modification process) as an example of the embodiment, a resin layer that transmits laser light is provided on the surface of a metal base material, and laser light is transmitted to the surface of the base material through the resin layer. Irradiation. Thereby, the surface of the substrate is melted and the resin layer is thermally decomposed by the heat of the substrate. That is, in this manufacturing method, the surface of the base material is irradiated with laser light to selectively heat the surface, and the resin layer is heated and thermally decomposed by the heated base material. And the decomposition component of a resin layer acts as an alloying element, and forms the metal and compound of the base material in a molten state. That is, on the surface of the base material, a decomposition layer (for example, carbon) of the resin layer and a metal constituting the base material are combined to form a modified layer (for example, a film containing metal carbide as a main component).

In the conventional powder process, there is a problem that the powder is scattered by laser irradiation. However, in the surface modification process as an example of the embodiment, the resin layer that is an alloying material transmits laser light. Material will not scatter. In addition, in this process, for example, a resin layer can be provided by coating a resin in a region where surface modification is performed. Therefore, compared to a powder process in which powder is supplied to the substrate surface, an alloying material is applied to the substrate surface. It can be supplied uniformly. Therefore, it is possible to form a modified layer that is more uniform than when a conventional powder process is used, and it is possible to stably form the desired modified layer with good reproducibility.

In the surface modification process as an example of the embodiment, the laser irradiation process may be performed in an inert gas atmosphere or in a vacuum. However, when performing processes such as laser irradiation in an inert gas atmosphere or vacuum, it is necessary to place the base material in a highly sealed chamber, and the base material in the chamber is irradiated with laser light through the chamber window. . For this reason, it is easy to receive a restriction | limiting in the dimension, shape, etc. of the base material which can be processed, and control of atmosphere is required. Therefore, it is preferable to irradiate the surface of the base material provided with the resin layer with laser light in an air atmosphere. Surface modification by laser light irradiation is performed on the surface of the substrate covered with a resin layer, and the resin layer blocks the atmosphere, preventing harmful effects (for example, generation of cracks) when laser irradiation is performed in the atmosphere. Is done. Below, it demonstrates as what performs all the processes in an atmospheric condition.

As a conventional laser surface modification method, a gas process for supplying an alloying element with a gas is known. For example, Japanese Patent Laid-Open No. 10-72656 discloses disposing a titanium base material in a chamber filled with nitrogen gas and irradiating the base material surface with laser light to form a nitride layer. ing. If a hydrocarbon gas such as methane gas is used instead of nitrogen gas, a carbide layer can be formed on the substrate surface. Such a gas process is not suitable for surface modification of large parts because a chamber is indispensable, the window of the chamber is contaminated and the irradiation efficiency of the laser beam is deteriorated, and further, a window with dirt is applied to the laser beam. There is also a problem of absorbing heat and generating heat and breaking. In addition, when methane gas or the like is used, there is a problem in terms of safety. When the surface modification process which is an example of the embodiment is performed in an air atmosphere, the chamber is unnecessary, so that it is simple and inexpensive, and the surface modification of a large component can be easily performed.

FIG. 1 is a diagram illustrating a manufacturing process of a surface-modified base material 10 which is an example of an embodiment. The surface-modified base material 10 is a base material whose surface has been modified by irradiation of the laser beam α through the resin layer 20, and the hardness and wear resistance thereof are compared with the base material region 15 as will be described in detail later. It has a modified surface (modified layer 12) with greatly improved physical properties. The base material 10z means a base material before surface modification. The surface-modified base material 10 is suitable for, for example, machine parts, molds, tools, and the like that require wear resistance, but the use is not particularly limited.

As illustrated in FIG. 1, the manufacturing process of the surface modified substrate 10 (hereinafter referred to as “surface modified process P”) includes a step of providing a resin layer 20 on the surface 11 z of the substrate 10 z, And a step of irradiating the surface 11z of the base material 10z with the laser beam α (see FIGS. 1A to 1C). The resin layer 20 is a layer that transmits the laser beam α, and is composed mainly of resin. The resin layer 20 may contain components other than the resin component as long as, for example, the transmittance of the laser beam α is not impaired, but is preferably composed only of the resin component. Hereinafter, the step of providing the resin layer 20 is referred to as “first step or resin layer forming step”, and the step of irradiating the laser light α is referred to as “second step or laser irradiation step”. The second step is a step of melting the surface 11z of the base material 10z by irradiation of the laser beam α through the resin layer 20 and thermally decomposing the resin layer 20 by the heat of the base material 10z.

In the example shown in FIG. 1, a step of removing the resin layer 20 after the irradiation with the laser beam α is provided (see FIG. 1D). The resin layer 20 can be peeled off from the surface-modified base material 10, for example. Alternatively, the resin layer 20 may be removed using a solvent or the like that dissolves the resin layer 20. Depending on the application of the surface-modified base material 10, it may be unnecessary to remove the resin layer 20. The resin layer 20 may be gradually removed, for example, in the process in which the surface modified substrate 10 is used.

The base material 10z applicable to the surface modification step P is a metal base material, and is composed, for example, of a metal whose main component is at least the surface 11z combined with a decomposition component of the resin layer 20 to form a compound. . Although the base material 10z may have a laminated structure of dissimilar metals, the following description will be made assuming that the whole base material 10z is configured with the same composition. As the metal components constituting the substrate 10z, iron (Fe), titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), tungsten (W) Molybdenum n (Mo), chromium (Cr), manganese (Mn), and the like. The base material 10z preferably contains a metal component that has a strong tendency to generate carbides. For example, when a Ti substrate 10z is used, carbon (C), which is a decomposition component of the resin layer 20, and Ti are bonded to form a titanium carbide (TiC) layer on the substrate surface. In addition, the shape of the base material 10z, a dimension, etc. are not specifically limited. The surface 11z of the base material 10z is not limited to a flat surface, and may be, for example, curved or uneven.

As shown in FIG. 1A, in the first step, a resin layer 20 is provided on the surface 11z of the substrate 10z. The resin layer 20 is provided in at least a region (planned modification region) whose surface is modified by irradiation with the laser beam α in the surface 11z of the substrate 10z. The resin layer 20 may be provided outside the region to be modified, for example, when the region to be modified is a part of the surface 11z, the resin layer 20 may be provided over the entire surface 11z. In the first step, a resin substrate or a resin film may be disposed on the surface 11z of the base material 10z, and the resin film or the like may be used as the resin layer 20. When providing the resin layer 20 using the resin film etc. which were produced previously, it is preferable to press the resin film etc. against the surface 11z and to adhere to the surface 11z. As will be described in detail later, it is particularly preferable to provide the resin layer 20 by a coating process.

The resin layer 20 is a layer that transmits the laser beam α used in the second step, and is thermally decomposed by being heated by the base material 10z that has generated heat by absorbing the laser beam α. The decomposition component of the resin layer 20 acts as an alloying element as described above, and is combined with the metal constituting the base material 10z to form a compound. That is, the resin layer 20 becomes a supply source of the alloying element. The resin layer 20 generates carbon or a reactive gas containing carbon by, for example, thermal decomposition. The resin layer 20 plays a role of blocking the atmosphere and preventing the surface 11z of the base material 10z from being exposed to the atmosphere. The resin layer 20 functions like a chamber and prevents adverse effects when the laser beam α is irradiated in the atmosphere, for example, generation of cracks.

It is preferable that the resin layer 20 has a higher transmittance of the laser beam α than that of the substrate 10z, and has a larger amount of heat generated by indirect heating from the substrate 10z that generates heat than the amount of heat generated by absorption of the laser beam α. . When the resin layer 20 generates heat due to the absorption of the laser beam α, the amount of the laser beam α irradiated to the base material 10z is reduced, so that the irradiation efficiency is lowered, and the resin layer 20 is a part away from the surface 11z of the base material 10z. May not be able to supply a sufficient alloying element to the surface 11z. The transmittance of the laser beam α of the resin layer 20 is preferably as high as possible, at least 50% or more, more preferably 70% or more, and particularly preferably 80% or more. The transmittance of the resin layer 20 can be measured using a spectrophotometer. The thickness of the resin layer 20 is determined in consideration of the transmittance of the laser beam α, the blocking of atmospheric components, the amount of alloying element supplied, and the like, for example, 1 μm to 1000 μm, and preferably 100 μm to 500 μm.

The resin layer 20 includes, for example, a polyvinyl alcohol resin (PVA), a polyester resin such as polyethylene terephthalate, a polycarbonate resin, a polyolefin resin such as polyethylene, polypropylene, and cyclic polyolefin, a polyvinyl ester resin such as polyvinyl acetate, and polymethyl Polymethacrylate such as methacrylate, acrylic resin such as polyacrylate, aromatic vinyl resin such as polystyrene, polyurethane resin, epoxy resin, polyamide resin, polyimide resin, polysulfone resin, polytetra Consists of at least one resin selected from the group consisting of fluorine resins such as fluoroethylene and polyvinylidene fluoride, chlorine resins such as polyvinyl chloride and polyvinylidene chloride, and silicone resins. That. The resin constituting the resin layer 20 may be either a thermoplastic resin or a curable resin. The curable resin may be a thermosetting type, an ultraviolet curable type, or a two-component curable type.

Examples of the polyvinyl alcohol resin (PVA) include, for example, Kuraray Kuraraypoval PVA235, Kuraraypoval PVA117, Nippon Synthetic Chemical Co., Ltd. Gohsenol KH20 and other acetoacetylated polyvinyls such as Nippon Synthetic Chemical Co., Ltd. Examples thereof include alcohol and water-based polyvinyl acetal such as SLECK KX series manufactured by Sekisui Chemical Co., Ltd. The transmittance of the laser light α of the resin layer 20 (thickness: 100 μm) made of PVA is, for example, about 90%.

In the first step, it is preferable that the resin layer 20 is formed by coating the surface 11z of the substrate 10z with a resin. By applying the coating process, the resin layer 20 having good adhesion to the surface 11z can be formed, and the resin layer 20 is hardly peeled off in the second step or the like, and between the surface 11z and the resin layer 20 It becomes easy to suppress the bubble from entering the surface. Resin coating can be performed by a conventionally known method.

The resin layer 20 can be formed by applying a resin to the surface 11z of the substrate 10z and drying or curing the coating film. For example, a resin solution is prepared by dissolving a resin in a solvent, and the resin layer 20 is formed by volatilizing and removing the solvent in the coating film after the solution is applied to the surface 11z. In the case of using PVA, an aqueous PVA solution is prepared, and the aqueous solution is applied to the surface 11z to form the resin layer 20. Instead of the resin solution, an emulsion in which a resin is dispersed can be used. Moreover, when using curable resin, after apply | coating an uncured component to the surface 11z, the coating film can be hardened and the resin layer 20 can be formed.

As shown in FIG. 1B, in the second step, the surface 11z of the base material 10z is irradiated with laser light α through the resin layer 20 to melt the surface 11z of the base material 10z. And as shown in FIG.1 (c), the resin layer 20 is heated and thermally decomposed with the heat | fever of the base material 10z. That is, in the second step, the surface 11z is irradiated through the resin layer 20 with laser light α having energy for melting the surface 11z of the base material 10z. On the surface 11z irradiated with the laser beam α and in the vicinity thereof, a molten region 12z in which the metal constituting the substrate 10z is melted is formed. For example, the adjacent region 21 in contact with the molten region 12z in the resin layer 20 is heated and heated. Decompose. In general, the melting region 12z can be formed deeper as the output of the laser beam α is increased or the irradiation time is increased. In the second step, the modified component 12 is formed by combining the decomposition component of the resin layer 20 with the metal of the base material 10z in a molten state.

Since the main decomposition component of the resin layer 20 contains carbon (C), the modified layer 12 contains metal carbide. The decomposition component of the resin layer 20 varies depending on the resin constituting the layer. For example, in addition to C, oxygen (O), nitrogen (N), sulfur (S), fluorine (F), chlorine (Cl), silicon (Si) may be included. For example, the modified layer 12 containing a metal nitride can be formed by forming the resin layer 20 using a resin containing N such as a polyamide-based resin or a polyimide-based resin. Further, when the resin layer 20 is formed using a resin containing S such as a polysulfone-based resin, the modified layer 12 containing a metal sulfide can be formed. Thus, according to the surface modification step P, the composition of the modified layer 12 can be changed by changing the composition of the resin layer 20.

The laser device used in the second step is not particularly limited as long as it can melt the surface 11z of the base material 10z. For example, the peak oscillation wavelength ranges from the visible light region to the near infrared region (500 nm to 1200 nm). A device capable of outputting the laser light α in FIG. If the peak transmission wavelength is within the range, the laser light α is hardly absorbed by the resin layer 20 and the irradiation efficiency with respect to the base material 10z is improved. Specific examples of laser devices applicable to the second step include a Yb fiber laser, a Yb disk laser (peak oscillation wavelength: 1000 nm to 1100 nm), an Nd: YAG laser (peak oscillation wavelength: 1064 nm), an argon laser, and an AlGaAs semiconductor. Examples thereof include high-power semiconductor lasers such as lasers and InGaAs-based semiconductor lasers.

In the second step, the laser beam α is scanned over the region to be modified of the substrate 10z. The laser beam α can be scanned using, for example, a galvano scanner. Moreover, the base material 10z may be installed on an XY table or the like, and the base material 10z may be moved with respect to the irradiation spot of the laser light α. The thickness, composition, and the like of the modified layer 12 can be adjusted by irradiation conditions such as the output, wavelength, and irradiation time (scanning speed) of the laser beam α. In general, the thickness of the modified layer 12 increases as the output of the laser beam α is higher and the irradiation time is longer.

An example of the irradiation condition of the laser beam α in the second step is as follows.
Laser device: Yb Faber laser Peak oscillation wavelength: 1070 nm
Oscillation mode: CW
Output: 40W
Irradiation spot diameter: 30 μm
Scanning speed: 100 to 250 mm / s

FIG. 2 is a cross-sectional view schematically showing the surface modified substrate 10 obtained by the surface modification step P. As illustrated in FIG. 2, the surface-modified base material 10 has a modified layer 12 formed in a predetermined depth range from the surface 11. The modified layer 12 is a laser alloy region formed by combining the decomposition component of the resin layer 20 and the metal constituting the substrate 10z by irradiation with the laser beam α. As will be described in detail later, in particular, the physical properties such as hardness and friction characteristics of the first region 13 are compared with the physical properties of the base material region 15 (region not subjected to surface modification), which is a region not irradiated with the laser light α. Greatly improved. The first region 13 is formed, for example, in a shallow range from the surface 11, for example, in a range from 0.5 μm to 5 μm in depth from the surface. Note that the modified layer 12 formed by the surface modification step P may not be clearly confirmed by a microscopic image, and the boundary between the modified layer 12 and the base material region 15, and the first region 13 and the second region. It is not necessary that the boundary with 14 is clear.

FIG. 3 is a view showing a modification of the surface modification step P. In the surface modification process illustrated in FIG. 3, in addition to the resin layer forming step and the laser irradiation step, an additive material 30 that forms a compound by bonding with a decomposition component of the resin layer 20 is disposed on the surface 11z of the base material 10z. The method further includes a step. The additive material 30 is provided at least on the planned modification region before the resin layer 20 is provided. And as shown to Fig.3 (a), the resin layer 20 covers the additive material 30, and is provided in the surface 11z of the base material 10z. As shown in FIGS. 3B to 3D, the subsequent steps are the same as the surface modification step P, and the surface 11z of the substrate 10z is irradiated with the laser beam α through the resin layer 20. Since the additive material 30 is covered with the resin layer 20, the additive material 30 is not scattered by the irradiation of the laser beam α. For the resin layer 20 and the laser beam α irradiated in the laser irradiation step, the same material as in the surface modification step P can be applied.

As the additive material 30, it is preferable to use a material that combines with the decomposition component of the resin layer 20 to form a compound by irradiation with the laser beam α and is combined with the metal of the base material 10z. The additive material 30 is supplied in the form of, for example, a powder or a foil, and is formed in a layer form on the surface 11z of the substrate 10z. A binder may be used to form the layer made of the additive material 30. In the second step, the additive material 30 absorbs the laser beam α to be in a molten state, and is compounded with the metal of the base material 10z that is also in the molten state and the decomposition component of the resin layer 20. Thereby, the surface modification base material 10x which has the modification layer 12x is obtained. For example, when the base material 10z has iron (Fe) as a main component, titanium carbide (TiC) is used on the surface of the base material having iron as a main component by using titanium (Ti) particles or foil as the additive material 30. ) And the like can be formed.

According to the surface modification process illustrated in FIG. 3, the composition of the modified layer 12 x can be changed by changing the composition of the additive material 30 and the resin layer 20. The reactivity with a decomposition component may be low. That is, the use of the additive material 30 increases the choice of the base material 10z, and the application range of this process using the resin layer 20 is expanded. In addition, since the additive material 30 is covered with the resin layer 20, scattering of the additive material 30 due to the irradiation of the laser beam α is prevented, and uniform and stable surface modification can be performed. Further, since the resin layer 20 blocks the atmosphere, the surface of the base material is not exposed to the atmosphere, and the occurrence of cracks and the like is prevented.

The physical properties of the surface modified substrate 10 obtained by the surface modification step P will be described in detail with reference to FIGS. Hereinafter, a case where a titanium base material is applied to the base material 10z and a layer made of polyvinyl alcohol-based resin (PVA) is applied to the resin layer 20 (hereinafter referred to as “TiC / Ti base material”) will be described as an example. To do. The PVA layer was formed by applying a PVA aqueous solution to the substrate surface and drying it so that the thickness after drying was 100 μm. The Yb Faber laser described above was used for the laser irradiation process.

FIG. 4 is a microscopic image showing a cross section of the TiC / Ti substrate. 4A is an image (OM image) photographed using an optical microscope, and FIG. 4B is an image photographed using an electron microscope (SEM image). From the OM image, it can be seen that a layer (modified layer) having a different state from the base material region is formed within a predetermined depth from the surface of the TiC / Ti substrate. Further, it can be seen from the SEM image that a dendritic crystal layer (first region) is formed in a shallow range from the substrate surface. The modified layer is a laser alloy region formed by combining the decomposition component of the PVA layer and molten titanium, and is formed in a range of about 50 μm from the surface of the base material. That is, the thickness of the modified layer is about 50 μm. Of the modified layer, the thickness of the first region, which is a dendritic crystal layer, is about 5 μm. The thicknesses of the modified layer and the first region can be increased, for example, by reducing the scanning speed of the laser beam α.

FIG. 5 is an XRD pattern (lower) of the modified surface of the TiC / Ti substrate, and shows an XRD pattern (upper) of the base material region as a comparison. For XRD measurement, SmartLab (CuKα line, 40 mA · 150 kV) manufactured by Rigaku was used. As shown in FIG. 5, in the XRD pattern of the modified surface of the TiC / Ti substrate, there are peaks (peaks indicated by ●) caused by TiC, TiN, and TiO that are not seen in the XRD pattern of the base material region. confirmed.

FIG. 6 shows the results of elemental analysis of the TiC / Ti substrate by glow discharge emission spectrometry (GDS). As shown in FIG. 6, as a result of elemental analysis by GDS, the presence of Ti, C, N, and O was confirmed within a depth range of about 50 μm from the substrate surface. In particular, in the range of a depth of 5 μm or less near the substrate surface, a large amount of C which is a decomposition component of the PVA layer is present, and it is considered that a modified layer mainly composed of TiC is formed. The modified layer contains TiO and TiN. O is considered to be caused by a decomposition component of PVA and oxygen in the atmosphere, and N is considered to be mainly caused by nitrogen in the atmosphere.

FIG. 7 shows the measurement results of the hardness of the modified surface of the TiC / Ti substrate by the nanoindentation method. For the measurement of hardness, an ultra-fine indentation hardness tester ENT-1100a (load: 2 mN) manufactured by Elionix was used. As shown in FIG. 7, it can be seen that the hardness of the dendritic crystal layer (first region) formed in a shallow depth range from the surface of the base material is significantly higher than the hardness of the base material region. . The hardness of the modified surface of the TiC / Ti substrate is 2000 HV or higher, which is comparable to the ceramic coating.

FIG. 8 is an SEM image (bottom) after the sliding wear test of the modified surface of the TiC / Ti substrate, and shows an SEM image (top) after the sliding wear test of the base material region as a comparison.
The sliding wear test was performed under the following conditions.
Equipment: Tribogear TYPE manufactured by Shinto Scientific Co., Ltd .: 14FW
Ball material: Fe-1.0C-1.4Cr
Load: 0.98N
Sliding distance: 72m
Other: Drying conditions, temperature 25 ° C, humidity 50%
As shown in FIG. 8, large wear marks are formed on the surface of the base material region, but no wear marks are formed on the modified surface. That is, the modified surface of the TiC / Ti substrate has excellent wear resistance.

As described above, according to the surface modification process in which the resin layer that transmits the laser beam is provided on the surface of the metal substrate and the substrate surface is irradiated with the laser beam through the resin layer, there is no crack even in the air atmosphere. High quality products can be provided. That is, since this process does not require a chamber, it is simple and inexpensive, and surface modification of large parts can be easily performed. The substrate surface modified by this process has significantly improved hardness, wear resistance and the like compared to the base material region.

10, 10x surface modified substrate, 10z substrate, 11, 11z surface, 12, 12x modified layer, 12z melted region, 13 first region, 14 second region, 15 base material region, 20 resin layer, 21 proximity Area, 30 additive material

Claims

A method for producing a surface-modified base material that irradiates the surface of a metal base material with laser light to perform surface modification of the base material,
Providing a resin layer that transmits the laser light on the surface of the substrate;
Irradiating the surface of the substrate with the laser light through the resin layer, melting the surface of the substrate, and thermally decomposing the resin layer by heat of the substrate;
A method for producing a surface-modified substrate comprising:
The resin layer is made of polyvinyl alcohol resin, polyester resin, polycarbonate resin, polyolefin resin, polyvinyl ester resin, acrylic resin, aromatic vinyl resin, polyurethane resin, epoxy resin, polyamide resin, polyimide. The manufacturing method of Claim 1 comprised with at least 1 sort (s) of resin selected from the group which consists of a resin based, a polysulfone resin, a fluorine resin, a chlorine resin, and a silicone resin.
The manufacturing method according to claim 2, wherein the resin layer is formed by coating the surface of the substrate with the resin.
The manufacturing method according to any one of claims 1 to 3, wherein the laser light is irradiated on a surface of the base material provided with the resin layer in an air atmosphere.
Further comprising a step of disposing an additive material that binds to the decomposition component of the resin layer to form a compound on the surface of the base material;
The manufacturing method according to any one of claims 1 to 4, wherein the resin layer is provided on a surface of the base material so as to cover the additive material.