WO2016099221A2 - Resin composition for film and unpeel film for rubber - Google Patents

Resin composition for film and unpeel film for rubber Download PDF

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WO2016099221A2
WO2016099221A2 PCT/KR2015/013989 KR2015013989W WO2016099221A2 WO 2016099221 A2 WO2016099221 A2 WO 2016099221A2 KR 2015013989 W KR2015013989 W KR 2015013989W WO 2016099221 A2 WO2016099221 A2 WO 2016099221A2
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Prior art keywords
film
resin composition
films
ethylene
rubber
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PCT/KR2015/013989
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French (fr)
Korean (ko)
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WO2016099221A3 (en
Inventor
정정연
박승기
김현태
최지한
박해웅
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(주) 엘지화학
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Priority claimed from KR1020150181456A external-priority patent/KR20160075362A/en
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Publication of WO2016099221A2 publication Critical patent/WO2016099221A2/en
Publication of WO2016099221A3 publication Critical patent/WO2016099221A3/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00Polymerisation catalysts
    • C08F4/42Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors
    • C08F4/44Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides
    • C08F4/60Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides together with refractory metals, iron group metals, platinum group metals, manganese, rhenium technetium or compounds thereof
    • C08F4/62Refractory metals or compounds thereof
    • C08F4/64Titanium, zirconium, hafnium or compounds thereof
    • C08F4/659Component covered by group C08F4/64 containing a transition metal-carbon bond
    • C08F4/6592Component covered by group C08F4/64 containing a transition metal-carbon bond containing at least one cyclopentadienyl ring, condensed or not, e.g. an indenyl or a fluorenyl ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04Homopolymers or copolymers of ethene
    • C08L23/08Copolymers of ethene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L31/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
    • C08L31/02Homopolymers or copolymers of esters of monocarboxylic acids
    • C08L31/04Homopolymers or copolymers of vinyl acetate

Definitions

  • the present invention relates to a resin composition for film and an unpeel film for rubber, and more particularly, at a rubber compounding temperature of 105 ° C. or lower when applying a packaging film of rubber.
  • a rubber compounding temperature of 105 ° C. or lower
  • the resin composition for film can be prevented from breaking during storage while having an excellent effect as an unpeel film even at a low rubber compounding temperature.
  • PE film has excellent transparency and formability, and is widely used for food packaging, agricultural packaging, electronics, and general industrial packaging.
  • Low-density polyethylene (LDPE) and ethylene-vinylacetate copolymer (EVA) are mainly used in products requiring low processing temperature because of their transparency and film formability as well as lower melting temperature than linear low density polyethylene (LLDPE).
  • low density polyethylene (LDPE) or low density polyethylene (LDPE) and ethylene-vinylacetate copolymer (EVA) are used for packaging films of rubber products such as synthetic rubber and EPDM. Since the melting temperature of low-density polyethylene resin is 105 ° C or higher, when the film is blended with rubber without being peeled off (hereinafter referred to as 'unpeel'), the film melts and acts as an impurity in the rubber compound. A process of separately removing the packaging film is required (related prior art information: Korean Patent Registration No. 1019656, Korean Patent Registration No. 0949817, and Korean Patent Publication No. 1995-0008120). In addition, in order to prevent breakage of the packaging film during storage, it is necessary to improve physical properties such as tensile strength and tear strength of the film.
  • LDPE low density polyethylene
  • LDPE low density polyethylene
  • EVA ethylene-vinylacetate copolymer
  • the present invention is excellent in the melting effect of the unfilled packaging film at a low rubber compounding temperature of 105 °C or less may not act as an impurity in the product, furthermore,
  • An object of the present invention is to provide a resin composition for a film having improved mechanical properties so as to prevent breakage, and an unpeel film for rubber obtained therefrom.
  • the present invention is a) a polyolefin resin having a melting temperature (Tm) of 100 °C or less; And b) an ethylene-vinyl acetate copolymer having a melting temperature (Tm) of 101 ° C. or less.
  • the polyolefin resin of a) may be, for example, a polyolefin plastomer.
  • the polyolefin plastomer may have a molecular weight distribution of 3.5 or less.
  • the polyolefin plastomer may be, for example, a melt index (190 ° C., 2.16 kgf load) of 0.5 to 20 g / 10 minutes and a density of 0.87 to 0.92 g / cm 3 .
  • the polyolefin plastomer may be, for example, an ethylene-alpha olefin copolymer.
  • the alpha olefin content in the ethylene-alpha olefin copolymer may be, for example, 2 to 20 mol%.
  • the polyolefin resin of a) may be included in 50 to 90% by weight of the total resin composition for film 100% by weight, for example.
  • the ethylene-vinyl acetate copolymer of b) may include, for example, within 6 to 12% by weight of vinyl acetate monomer.
  • the ethylene-vinyl acetate copolymer of b) is, for example, 10 to 50% by weight in a total of 100% by weight of the resin composition for film. It can be included within the scope.
  • this invention provides the film manufactured from the resin composition mentioned above.
  • the film may have a melting temperature (Tm) of 105 ° C. or less.
  • the film may be, for example, an unpeel packaging film of synthetic rubber.
  • the synthetic rubber may have a blending temperature of 105 ° C. or less.
  • the film may have a thickness of about 10 ⁇ m to about 300 ⁇ m.
  • an unpeel film for a film and an unpeel film for rubber which are excellent in effect as an unpeel film even at a low rubber compounding temperature of 105 ° C. or lower, and which can prevent breakage of the film during storage. It works.
  • the resin composition for films of this invention is a) polyolefin resin whose melting temperature (Tm) is 100 degrees C or less, or 70-100 degreeC; And b) an ethylene-vinyl acetate copolymer having a melting temperature (Tm) of 101 ° C. or lower, or 90 to 101 ° C .;
  • unpeel refers to the use for rubber compounding processing without unpacking the product after packaging of the synthetic rubber or the like, unless otherwise specified.
  • melting temperature refers to a value measured by a dynamic scanning calorimeter (DSC) method, unless otherwise specified.
  • the polyolefin plastomizer is a polyolefin having a property that deformation remains after the external force is removed without breaking against the external force, and in the technical field to which the present invention belongs, It may include all referred to as.
  • the polyolefin resin of a) may be, for example, a metallocene-based polyolefin polymer, and specifically, may be a metallocene-based polyolefin plastomer.
  • the metallocene-based polyolefin plastomer is prepared, for example, in the presence of a metallocene catalyst composition and has a density of 0.87 to 0.92 g / cm 3 , or a density of 0.89 to 0.90 g / cm 3 and 70 to 100 ° C., or 80 It may be a polyolefin copolymer having a melting temperature of to 100 °C. If the temperature is lower than the melting temperature, the heat resistance and film properties are lowered and the adhesion is increased, which makes the film difficult to process. If the melting temperature is exceeded, the film is not suitable for an unfilled film for rubber packaging film.
  • the polyolefin copolymer preferably has a melt index (190 ° C., 2.16 kgf load) of 0.5 to 20 g / 10 min.
  • the melt index suitable for processing varies depending on the film processing method, and the melt index ranges from 0.5 to 3.0 g / 10 min during blow molding, an air blowing film manufacturing method, and cast through a T-Die extruder. In the case of cast molding, the melt index ranges from 3.0 to 20 g / 10 min.
  • the octene content in the ethylene-octene copolymer is, for example, 2 to 20 mol%, and the molecular weight distribution (Mw / Mn) may be, for example, 3.5 or less, 2.0 to 3.5, 2.0 to 3.4, or 2.0 to 3.3. Within the range, there is an effect of satisfying the physical properties required for the packaging film, especially the unfilled film.
  • the Mw and Mn can be measured using GPC (Gel Permeation Chromatography) which is a common measuring method.
  • the metallocene catalyst composition is represented by the following formula 1
  • R 1 , R 2 , R 3 , and R 4 are the same as or different from each other, and each independently a hydrogen atom; Alkyl, aryl or silyl radicals having 1 to 20 carbon atoms; Alkenyl, alkylaryl or arylalkyl radicals having 1 to 20 carbon atoms; Or a metalloid radical of a Group 14 metal substituted with hydrocarbyl; R 1 , R 2 , R 3 , and R 4 may be linked to each other by an alkylidine radical including an alkyl or aryl radical having 1 to 20 carbon atoms to form a ring;
  • R 5 , R 6 , and R 7 are the same as or different from each other, and each independently a hydrogen atom; Halogen radicals; Or an alkyl, aryl radical, alkoxy, aryloxy, amido radical having 1 to 20 carbon atoms; Two or more of R 5 , R 6 , and R 7 may be linked to each other to form an aliphatic or aromatic ring;
  • R 8 is a hydrogen atom, an alkyl, aryl, alkylaryl or arylalkyl radical having 1 to 20 carbon atoms;
  • Cy is a substituted or unsubstituted aliphatic or aromatic ring
  • M is a Group 4 transition metal
  • Q 1 , Q 2 , and Q 3 are each independently a halogen radical; Alkyl or aryl amido radicals having 1 to 20 carbon atoms; Alkyl, alkenyl, aryl, alkylaryl or arylalkyl radicals having 1 to 20 carbon atoms; Or an alkylidene radical having 1 to 20 carbon atoms.) And a metallocene catalyst and a transition metal.
  • the metallocene catalyst composition may further include at least one cocatalyst selected from compounds represented by the following Chemical Formulas 2, 3, and 4, for example.
  • R 9 is each independently a halogen radical; a hydrocarbyl radical having 1 to 20 carbon atoms; or a hydrocarbyl radical having 1 to 20 carbon atoms substituted with halogen; a is an integer of 2 or more.
  • R 10 is each independently a halogen radical; a hydrocarbyl radical having 1 to 20 carbon atoms; or a hydrocarbyl radical having 1 to 20 carbon atoms substituted with halogen);
  • L is a neutral or cationic Lewis acid
  • H is a hydrogen atom
  • Z is a Group 13 element
  • A is each independently one or more hydrogen atoms are halogen, hydrocarbyl having 1 to 20 carbon atoms, alkoxy Or an aryl or alkyl radical of 6 to 20 carbon atoms substituted with a phenoxy radical.
  • the polyolefin resin of a) may be included, for example, in the range of 50 to 90% by weight, or 60 to 80% by weight of the total 100% by weight of the resin composition for the film. It can provide an excellent effect.
  • the ethylene-vinyl acetate copolymer of b) may be, for example, a copolymer in which the vinyl acetate monomer is included in the range of 6 to 12 wt%, or 6 to 9 wt%.
  • the ethylene-vinyl acetate copolymer of component b) may be prepared by a polymerization process by a high pressure radical method using an oxygen or a peroxide initiator.
  • the ethylene-vinyl acetate copolymer may be polymerized under an appropriate temperature and pressure after the ethylene monomer and the vinyl acetate monomer are added to the tubular reactor and oxygen or a peroxide-based initiator is added.
  • the content of the ethylene monomer may be adjusted according to the b) vinyl acetate content of the above-mentioned b) ethylene-vinyl acetate copolymer.
  • the ethylene-vinyl acetate copolymer of b) may be included, for example, within a range of 10 to 50% by weight, or 20 to 40% by weight, in a total of 100% by weight of the resin composition for film. Stability may be lowered, and when the content exceeds the content range, physical properties such as tensile strength, tearing strength, and impact strength of the film may be lowered.
  • the composition may have a melting temperature (Tm) of 100 ° C. or less, or 80 to 100 ° C.
  • Tm melting temperature
  • the film manufactured from the resin composition mentioned above is provided.
  • the film is generically made in the form of a thin film, and may include all that are commonly called sheets, wraps, and the like.
  • the film may have a melting temperature (Tm) of 100 ° C. or less, or 80 to 100 ° C.
  • the film may be an unpeel packaging film of synthetic rubber such as EPDM.
  • the synthetic rubber is not otherwise specified, and may be a synthetic rubber compoundable at 105 ° C. or lower, or 80 to 105 ° C.
  • the film may have a thickness of 10 to 300 ⁇ m, or 20 to 100 ⁇ m, and has excellent packaging properties within this range.
  • the processing of the film is not specific to this, but when the blown film processing method is described as an example, the film is expanded and stabilized in the horizontal / vertical direction before the molten resin is cooled and cooled, thereby producing a stable film.
  • the shaking of the bubble can be evaluated by the bubble stability that the so-called tube bubble shakes left and right while the film thickness is generated, the film processed in this case is excellent in the bubble stability.
  • POP1 A product manufactured according to the contents of Korean Patent Laid-Open No. 2012-0090927, which is prepared using the metallocene catalyst of Formula 1, and has a melt index (190 ° C., 2.16 kgf load) of 1.2 g / 10 minutes and a density of It is a metallocene-based polyolefin plastomer of 0.903 g / cm 3 and melting temperature (Tm) of 96 ° C. It is sold by LG Chem under the LF100 brand name.
  • POP2 A product manufactured according to the contents of Korean Patent Publication No. 2012-0090927, which is prepared using the metallocene catalyst of Formula 1, and has a melt index (190 ° C., 2.16 kgf load) of 1.2 g / 10 minutes and a density of It is a metallocene-based polyolefin plastomer of 0.885 g / cm 3 and melting temperature (Tm) of 73 ° C, and is sold under the name LC180 brand by LG Chem.
  • EVA 1 ethylene-vinyl acetate copolymer with melt index (190 °C, 2.16 kgf load) of 1.0 g / 10 min, vinyl acetate monomer content of 6 wt% and melting temperature (Tm) of 101 °C, EF320 from LG Chem. It is sold under the brand name.
  • EVA 2 Ethylene-vinyl acetate copolymer with melt index (190 °C, 2.16 kgf load) of 1.0 g / 10 min, vinyl acetate monomer content of 9% by weight and melting temperature (Tm) of 94 °C. It is sold under the brand name.
  • EVA3 An ethylene-vinyl acetate copolymer with a melt index (190 °C, 2.16 kgf load) of 1.1 g / 10 minutes, a vinyl acetate monomer content of 12% by weight, and a melting temperature (Tm) of 90 °C. Sell by name.
  • LDPE Low density polyethylene with a melt index (190 °C, 2.16 kgf load) of 3.0 g / 10 min, density 0.920 g / cm 3 and melting temperature (Tm) of 105 °C, sold by LG Chem under the BF500 brand name. .
  • MD is the machine direction in which the film is coming out
  • TD is the cross direction.
  • Haze Haze was measured by ASTM D1003 method.
  • Bubble Stability When the bubble is shaken, the thickness variation of the film may occur, so when the film is formed by inflation molding of the bubble shake, the bubble is visually checked to ensure the stability of the bubble.
  • melting temperature (Tm) which is one component which comprises the composition of this invention in the film of the comparative example 1 which used the low density polyethylene which is not the resin composition of this invention alone, and the low density polyethylene of the comparative example 1, ethylene of 101 degrees C or less
  • Tm melting temperature
  • Example 1 The same experiment as in Example 1 was repeated except that the POP content was replaced by 50% by weight and the EVA 1 content by 50% by weight.
  • the measured physical properties were: 589 g fall impact strength, 363 kg / cm 2 (MD) / 379 kg / cm 2 (TD), elongation 545% (MD) / 680% (TD), Elmendorf tear strength 3.5 g / ⁇ m (MD) /7.4 g / ⁇ m (TD), cloudiness of 9.5%, compared with Examples 1 to 5 it was confirmed that the impact strength, tensile strength and Elmendorf tear strength is lowered.
  • the EPDM rubber packaged with the 50 ⁇ m thick film prepared in Example 1 was blended at 105 ° C., but the compounding process was carried out in an unpeel state without peeling off the film. It was confirmed that the dispersion was uniform in color.

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Abstract

The present invention relates to a resin composition for film and an unpeel film for rubber. The present invention advantageously provides a resin composition for film and an unpeel film for rubber such that the problem of a packaging film, when applied as a rubber packaging film, remaining as impurities, if the same is melted without being removed at a rubber mixing temperature of 105°C or less, due to non-melting, is resolved; the same has an excellent effect as an unpeel film even at a lower rubber mixing temperature; and damage to the film can be prevented during storage.

Description

필름용 수지 조성물 및 고무용 언필 필름Resin composition for film and unfilled film for rubber
〔출원(들)과의 상호 인용〕[Reciprocal citation with application (s)]
본 출원은 2014년 12월 19일자 한국 특허 출원 제10-2014-0183711호 및 2015년 12월 18일자 한국 특허 출원 제10-2015-0181456호에 기초한 우선권의 이익을 주장하며, 해당 한국 특허 출원의 문헌에 개시된 모든 내용은 본 명세서의 일부로서 포함된다.This application claims the benefit of priority based on Korean Patent Application No. 10-2014-0183711 dated December 19, 2014 and Korean Patent Application No. 10-2015-0181456 dated December 18, 2015. All content disclosed in the literature is included as part of this specification.
본 발명은 필름용 수지 조성물 및 고무용 언필(unpeel) 필름에 관한 것으로, 보다 상세하게는 고무의 포장 필름 적용시 고무 배합온도 105 ℃ 이하에서 포장 필름을 벗기지 않고 용융시킬 경우 미용융에 의해 불순물로 잔류하던 문제를 해소하고 낮은 고무 배합온도에서도 언필(unpeel) 필름으로서 효과가 뛰어남과 동시에 보관시 필름의 파손을 방지할 수 있는 필름용 수지 조성물 및 이로부터 수득된 고무용 언필(unpeel) 필름에 관한 것이다.The present invention relates to a resin composition for film and an unpeel film for rubber, and more particularly, at a rubber compounding temperature of 105 ° C. or lower when applying a packaging film of rubber. When the packaging film is melted without peeling off, the problem of residual impurities due to unmelting can be eliminated, and the resin composition for film can be prevented from breaking during storage while having an excellent effect as an unpeel film even at a low rubber compounding temperature. And an unpeel film for rubber obtained therefrom.
일반적으로 폴리에틸렌(PE) 필름은 투명성과 성형성이 우수하여 식품용 포장, 농업용 포장, 전자제품 및 일반 산업용 포장재로 많이 사용된다. 이중 저밀도 폴리에틸렌(LDPE)과 에틸렌-비닐아세테이트 공중합체(EVA)는 투명성, 필름 성형성뿐만 아니라 용융온도가 선형 저밀도 폴리에틸렌(LLDPE) 대비 낮아서 낮은 가공온도가 필요한 제품에서 주로 사용된다. In general, polyethylene (PE) film has excellent transparency and formability, and is widely used for food packaging, agricultural packaging, electronics, and general industrial packaging. Low-density polyethylene (LDPE) and ethylene-vinylacetate copolymer (EVA) are mainly used in products requiring low processing temperature because of their transparency and film formability as well as lower melting temperature than linear low density polyethylene (LLDPE).
특히 합성고무 및 EPDM과 같은 고무 제품의 포장 필름용으로 저밀도 폴리에틸렌(LDPE) 또는 저밀도 폴리에틸렌(LDPE)과 에틸렌-비닐아세테이트 공중합체(EVA)가 혼합 사용되는데, 상기 고무의 배합 온도가 105℃ 이하인 경우 저밀도 폴리에틸렌 수지의 용융온도는 105 ℃ 이상인 관계로 포장 필름을 벗기지 않고(이하, '언필(unpeel)'이라 칭함) 고무와 함께 배합할 경우에는 필름이 미용융되어 배합고무 제품 내 불순물로 작용하기 때문에 포장 필름을 별도로 제거하는 공정이 필요하다(관련 선행문헌 정보: 한국특허등록번호 제1019656호, 한국특허등록번호 제0949817호, 한국특허공개번호 제1995-0008120호). 또한, 보관시 포장 필름의 파손 방지를 목적으로 필름의 인장강도, 찢김 강도 등의 물성 향상이 필요한 실정이다. In particular, low density polyethylene (LDPE) or low density polyethylene (LDPE) and ethylene-vinylacetate copolymer (EVA) are used for packaging films of rubber products such as synthetic rubber and EPDM. Since the melting temperature of low-density polyethylene resin is 105 ° C or higher, when the film is blended with rubber without being peeled off (hereinafter referred to as 'unpeel'), the film melts and acts as an impurity in the rubber compound. A process of separately removing the packaging film is required (related prior art information: Korean Patent Registration No. 1019656, Korean Patent Registration No. 0949817, and Korean Patent Publication No. 1995-0008120). In addition, in order to prevent breakage of the packaging film during storage, it is necessary to improve physical properties such as tensile strength and tear strength of the film.
상기와 같은 종래기술의 문제점을 해결하고자, 본 발명은 105 ℃ 이하의 낮은 고무 배합 온도에서도 언필(unpeel) 포장 필름의 용융 효과가 뛰어나 제품 내 불순물로 작용하지 않을 수 있고, 나아가 보관시 포장 필름의 파손을 방지할 수 있도록 기계적 물성이 향상된 필름용 수지 조성물 및 이로부터 수득된 고무용 언필(unpeel) 필름을 제공하는 것을 목적으로 한다.In order to solve the problems of the prior art as described above, the present invention is excellent in the melting effect of the unfilled packaging film at a low rubber compounding temperature of 105 ℃ or less may not act as an impurity in the product, furthermore, An object of the present invention is to provide a resin composition for a film having improved mechanical properties so as to prevent breakage, and an unpeel film for rubber obtained therefrom.
상기의 목적을 달성하기 위하여, 본 발명은 a) 용융온도(Tm)가 100 ℃ 이하인 폴리올레핀 수지; 및 b) 용융온도(Tm)가 101 ℃ 이하인 에틸렌-아세트산비닐 공중합체;를 포함하는 필름용 수지 조성물을 제공한다. In order to achieve the above object, the present invention is a) a polyolefin resin having a melting temperature (Tm) of 100 ℃ or less; And b) an ethylene-vinyl acetate copolymer having a melting temperature (Tm) of 101 ° C. or less.
상기 a)의 폴리올레핀 수지는 일례로 폴리올레핀 플라스토머일 수 있다.The polyolefin resin of a) may be, for example, a polyolefin plastomer.
상기 폴리올레핀 플라스토머는 일례로 분자량 분포도가 3.5 이하일 수 있다.For example, the polyolefin plastomer may have a molecular weight distribution of 3.5 or less.
상기 폴리올레핀 플라스토머는 일례로 용융지수(190 ℃, 2.16 kgf 하중)가 0.5 내지 20 g/10분이고 밀도가 0.87 내지 0.92 g/cm3일 수 있다.The polyolefin plastomer may be, for example, a melt index (190 ° C., 2.16 kgf load) of 0.5 to 20 g / 10 minutes and a density of 0.87 to 0.92 g / cm 3 .
상기 폴리올레핀 플라스토머는 일례로 에틸렌-알파 올레핀 공중합체일 수 있다.The polyolefin plastomer may be, for example, an ethylene-alpha olefin copolymer.
상기 에틸렌-알파 올레핀 공중합체 내 알파 올레핀 함량은 일례로 2 내지 20 몰%일 수 있다.The alpha olefin content in the ethylene-alpha olefin copolymer may be, for example, 2 to 20 mol%.
상기 a)의 폴리올레핀 수지는 일례로 필름용 수지 조성물 총 100 중량% 중 50 내지 90 중량% 범위 내로 포함될 수 있다.The polyolefin resin of a) may be included in 50 to 90% by weight of the total resin composition for film 100% by weight, for example.
상기 b)의 에틸렌-아세트산비닐 공중합체는 일례로 아세트산 비닐 단량체가 6 내지 12 중량% 범위 내로 포함될 수 있다.The ethylene-vinyl acetate copolymer of b) may include, for example, within 6 to 12% by weight of vinyl acetate monomer.
상기 b)의 에틸렌-아세트산비닐 공중합체는 일례로 필름용 수지 조성물 총 100 중량% 중 10 내지 50 중량% 범위 내로 포함될 수 있다.The ethylene-vinyl acetate copolymer of b) is, for example, 10 to 50% by weight in a total of 100% by weight of the resin composition for film. It can be included within the scope.
또한, 본 발명은 상술한 수지 조성물로 제조된 필름을 제공한다.Moreover, this invention provides the film manufactured from the resin composition mentioned above.
상기 필름은 일례로 용융온도(Tm)가 105 ℃ 이하일 수 있다.For example, the film may have a melting temperature (Tm) of 105 ° C. or less.
상기 필름은 일례로 합성고무의 언필(unpeel) 포장 필름일 수 있다.The film may be, for example, an unpeel packaging film of synthetic rubber.
상기 합성고무는 일례로 배합온도가 105 ℃ 이하일 수 있다.For example, the synthetic rubber may have a blending temperature of 105 ° C. or less.
상기 필름은 일례로 두께가 10 내지 300 ㎛일 수 있다.For example, the film may have a thickness of about 10 μm to about 300 μm.
본 발명에 따르면, 105 ℃ 이하의 낮은 고무 배합온도에서도 언필(unpeel) 필름으로서 효과가 뛰어남과 동시에 보관시 필름의 파손을 방지할 수 있는 필름용 수지 조성물 및 고무용 언필(unpeel) 필름을 제공하는 효과가 있다. According to the present invention, there is provided an unpeel film for a film and an unpeel film for rubber, which are excellent in effect as an unpeel film even at a low rubber compounding temperature of 105 ° C. or lower, and which can prevent breakage of the film during storage. It works.
이하 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail.
본 발명의 필름용 수지 조성물은, a) 용융온도(Tm)가 100 ℃ 이하, 혹은 70 내지 100 ℃인 폴리올레핀 수지; 및 b) 용융온도(Tm)가 101℃ 이하, 혹은 90 내지 101 ℃인 에틸렌-아세트산비닐 공중합체;를 포함하는 것을 특징으로 한다. The resin composition for films of this invention is a) polyolefin resin whose melting temperature (Tm) is 100 degrees C or less, or 70-100 degreeC; And b) an ethylene-vinyl acetate copolymer having a melting temperature (Tm) of 101 ° C. or lower, or 90 to 101 ° C .;
상기 용어 "언필(unpeel)"은 달리 특정하지 않는 한, 합성 고무 등의 제품 포장후 포장을 벗기지 않고, 고무 배합 가공에 사용하는 것을 지칭한다. The term " unpeel " refers to the use for rubber compounding processing without unpacking the product after packaging of the synthetic rubber or the like, unless otherwise specified.
상기 용어 "용융온도(Tm, Melting Temperature)"는 달리 특정하지 않는 한, 동적주사열량계(Dynamic Scanning Calorimeter; DSC) 방식으로 측정한 값을 지칭한다. The term "melting temperature (Tm)" refers to a value measured by a dynamic scanning calorimeter (DSC) method, unless otherwise specified.
본 기재에서 폴리올레핀 플라스토머란 외력에 대해 파괴됨 없이 외력이 제거된 후에도 변형이 남아 있는 성질을 가진 폴리올레핀으로, 본 발명이 속한 기술분야에서 폴리올레핀 플라스토머, 소성 폴리올레핀, 폴리올레핀 소성체 및 소성 폴리올레핀 중합체로 지칭되는 것을 모두 포함할 수 있다.In the present description, the polyolefin plastomizer is a polyolefin having a property that deformation remains after the external force is removed without breaking against the external force, and in the technical field to which the present invention belongs, It may include all referred to as.
상기 a)의 폴리올레핀 수지는 일례로, 메탈로센계 폴리올레핀 중합체일 수 있고, 구체적으로는 메탈로센계 폴리올레핀 플라스토머일 수 있다. The polyolefin resin of a) may be, for example, a metallocene-based polyolefin polymer, and specifically, may be a metallocene-based polyolefin plastomer.
상기 메탈로센계 폴리올레핀 플라스토머는 일례로, 메탈로센 촉매 조성물의 존재 하에 제조되고, 0.87 내지 0.92 g/cm3의 밀도, 혹은 0.89 내지 0.90 g/cm3의 밀도와 70 내지 100 ℃, 혹은 80 내지 100 ℃의 용융온도를 갖는, 폴리올레핀 공중합체일 수 있다. 상기 용융온도 미만에서는 내열안정성 및 필름 물성이 저하되고 접착성이 증가하여 필름의 가공이 어려우며, 상기 용융온도를 초과하면 고무포장필름용 언필 필름에 적합하지 않다. The metallocene-based polyolefin plastomer is prepared, for example, in the presence of a metallocene catalyst composition and has a density of 0.87 to 0.92 g / cm 3 , or a density of 0.89 to 0.90 g / cm 3 and 70 to 100 ° C., or 80 It may be a polyolefin copolymer having a melting temperature of to 100 ℃. If the temperature is lower than the melting temperature, the heat resistance and film properties are lowered and the adhesion is increased, which makes the film difficult to process. If the melting temperature is exceeded, the film is not suitable for an unfilled film for rubber packaging film.
상기 폴리올레핀 공중합체는 용융지수(190℃, 2.16kgf 하중)가 0.5 내지 20 g/10min인 것이 바람직하다. 필름 가공방법에 따라 가공에 적합한 용융지수가 다르며, 공기취입형 필름 제조방법인 블로운(Blown) 성형시에는 용융지수가 0.5 ~ 3.0 g/10min 범위가 적합하고, T-Die 압출기를 통한 캐스트(Cast) 성형시에는 용융지수가 3.0 ~ 20 g/10min 범위가 적합하다. The polyolefin copolymer preferably has a melt index (190 ° C., 2.16 kgf load) of 0.5 to 20 g / 10 min. The melt index suitable for processing varies depending on the film processing method, and the melt index ranges from 0.5 to 3.0 g / 10 min during blow molding, an air blowing film manufacturing method, and cast through a T-Die extruder. In the case of cast molding, the melt index ranges from 3.0 to 20 g / 10 min.
상기 에틸렌-옥텐 공중합체 내 옥텐 함량은 일례로, 2 내지 20 몰%이고, 분자량 분포도(Mw/Mn)는 일례로 3.5 이하, 2.0 내지 3.5, 2.0 내지 3.4, 또는 2.0 내지 3.3일 수 있으며, 이 범위 내에서 포장 필름, 특히 언필 필름에 요구되는 물성을 만족시키는 효과가 있다. The octene content in the ethylene-octene copolymer is, for example, 2 to 20 mol%, and the molecular weight distribution (Mw / Mn) may be, for example, 3.5 or less, 2.0 to 3.5, 2.0 to 3.4, or 2.0 to 3.3. Within the range, there is an effect of satisfying the physical properties required for the packaging film, especially the unfilled film.
상기 Mw 및 Mn은 통상적인 측정방법인 GPC(Gel Permeation Chromatography)를 사용하여 측정할 수 있다.The Mw and Mn can be measured using GPC (Gel Permeation Chromatography) which is a common measuring method.
상기 메탈로센 촉매 조성물은 하기 식 1The metallocene catalyst composition is represented by the following formula 1
[식 1][Equation 1]
Figure PCTKR2015013989-appb-I000001
Figure PCTKR2015013989-appb-I000001
(상기 식 1에서, (In Formula 1,
R1, R2, R3, 및 R4는 서로 동일하거나 상이하고, 각각 독립적으로 수소 원자; 탄소수 1 내지 20의 알킬, 아릴 또는 실릴 라디칼; 탄소수 1 내지 20의 알케닐, 알킬아릴 또는 아릴알킬 라디칼; 또는 하이드로카르빌로 치환된 14족 금속의 메탈로이드 라디칼이며; 상기 R1, R2, R3, 및 R4는 탄소수 1 내지 20의 알킬 또는 아릴 라디칼을 포함하는 알킬리딘 라디칼에 의해 서로 연결되어 고리를 형성할 수 있으며;R 1 , R 2 , R 3 , and R 4 are the same as or different from each other, and each independently a hydrogen atom; Alkyl, aryl or silyl radicals having 1 to 20 carbon atoms; Alkenyl, alkylaryl or arylalkyl radicals having 1 to 20 carbon atoms; Or a metalloid radical of a Group 14 metal substituted with hydrocarbyl; R 1 , R 2 , R 3 , and R 4 may be linked to each other by an alkylidine radical including an alkyl or aryl radical having 1 to 20 carbon atoms to form a ring;
R5, R6, 및 R7은 서로 동일하거나 상이하고, 각각 독립적으로 수소 원자; 할로겐 라디칼; 또는 탄소수 1 내지 20의 알킬, 아릴 라디칼, 알콕시, 아릴옥시, 아미도 라디칼이며; 상기 R5, R6, 및 R7 중에서 2개 이상이 서로 연결되어 지방족 또는 방향족 고리를 형성할 수 있으며;R 5 , R 6 , and R 7 are the same as or different from each other, and each independently a hydrogen atom; Halogen radicals; Or an alkyl, aryl radical, alkoxy, aryloxy, amido radical having 1 to 20 carbon atoms; Two or more of R 5 , R 6 , and R 7 may be linked to each other to form an aliphatic or aromatic ring;
R8은 수소 원자, 탄소수 1 내지 20의 알킬, 아릴, 알킬아릴 또는 아릴알킬 라디칼이며;R 8 is a hydrogen atom, an alkyl, aryl, alkylaryl or arylalkyl radical having 1 to 20 carbon atoms;
Cy는 치환되거나 치환되지 않은 지방족 또는 방향족 고리이며;Cy is a substituted or unsubstituted aliphatic or aromatic ring;
M은 4족 전이금속이며;M is a Group 4 transition metal;
Q1, Q2, 및 Q3는 각각 독립적으로 할로겐 라디칼; 탄소수 1 내지 20의 알킬 또는 아릴 아미도 라디칼; 탄소수 1 내지 20의 알킬, 알케닐, 아릴, 알킬아릴 또는 아릴알킬 라디칼; 또는 탄소수 1 내지 20의 알킬리덴 라디칼임.)로 나타낸 메탈로센 촉매 및 전이금속을 포함할 수 있다. Q 1 , Q 2 , and Q 3 are each independently a halogen radical; Alkyl or aryl amido radicals having 1 to 20 carbon atoms; Alkyl, alkenyl, aryl, alkylaryl or arylalkyl radicals having 1 to 20 carbon atoms; Or an alkylidene radical having 1 to 20 carbon atoms.) And a metallocene catalyst and a transition metal.
상기 메탈로센 촉매 조성물은 일례로, 하기 화학식 2, 화학식 3 및 화학식 4로 표시되는 화합물 중 선택되는 1종 이상의 조촉매를 추가로 포함할 수 있다. The metallocene catalyst composition may further include at least one cocatalyst selected from compounds represented by the following Chemical Formulas 2, 3, and 4, for example.
[화학식 2][Formula 2]
-[Al(R9)-O]a- - [Al (R 9) -O ] a -
(상기 식 2에서, R9는 각각 독립적으로 할로겐 라디칼; 탄소수 1 내지 20의 하이드로카르빌 라디칼; 또는 할로겐으로 치환된 탄소수 1 내지 20의 하이드로카르빌 라디칼이며; a는 2 이상의 정수임)(In Formula 2, R 9 is each independently a halogen radical; a hydrocarbyl radical having 1 to 20 carbon atoms; or a hydrocarbyl radical having 1 to 20 carbon atoms substituted with halogen; a is an integer of 2 or more.)
[화학식 3][Formula 3]
Al(R10)3 Al (R 10 ) 3
(상기 식 3에서, R10은 각각 독립적으로 할로겐 라디칼; 탄소수 1 내지 20의 하이드로카르빌 라디칼; 또는 할로겐으로 치환된 탄소수 1 내지 20의 하이드로카르빌 라디칼임);(In Formula 3, R 10 is each independently a halogen radical; a hydrocarbyl radical having 1 to 20 carbon atoms; or a hydrocarbyl radical having 1 to 20 carbon atoms substituted with halogen);
[화학식 4][Formula 4]
[L-H]+[ZA4]- 또는 [L]+[ZA4]- [LH] + [ZA 4] - or [L] + [ZA 4] -
(상기 식 4에서, L은 중성 또는 양이온성 루이스 산이고; H는 수소 원자이며; Z는 13족 원소이고; A는 각각 독립적으로 1 이상의 수소 원자가 할로겐, 탄소수 1 내지 20의 하이드로카르빌, 알콕시 또는 페녹시 라디칼로 치환된 탄소수 6 내지 20의 아릴 또는 알킬 라디칼임).(In Formula 4, L is a neutral or cationic Lewis acid; H is a hydrogen atom; Z is a Group 13 element; A is each independently one or more hydrogen atoms are halogen, hydrocarbyl having 1 to 20 carbon atoms, alkoxy Or an aryl or alkyl radical of 6 to 20 carbon atoms substituted with a phenoxy radical.
상기 a)의 폴리올레핀 수지는 일례로, 상기 필름용 수지 조성물 총 100 중량% 중 50 내지 90 중량%, 혹은 60 내지 80 중량% 범위 내로 포함될 수 있고, 이 범위 내에서 제조한 필름은 가공성과 물성이 우수한 효과를 제공할 수 있다. The polyolefin resin of a) may be included, for example, in the range of 50 to 90% by weight, or 60 to 80% by weight of the total 100% by weight of the resin composition for the film. It can provide an excellent effect.
상기 b)의 에틸렌-아세트산비닐 공중합체는 일례로, 아세트산 비닐 단량체가 6 내지 12 중량%, 혹은 6 내지 9 중량% 범위 내로 포함된 공중합체일 수 있다.The ethylene-vinyl acetate copolymer of b) may be, for example, a copolymer in which the vinyl acetate monomer is included in the range of 6 to 12 wt%, or 6 to 9 wt%.
상기 성분 b)의 에틸렌-아세트산비닐 공중합체는 산소나 퍼옥사이드계 개시제를 이용한 고압 라디칼법에 의한 중합공정으로 제조될 수 있다. 예를 들어, 상기 b) 에틸렌-아세트산비닐 공중합체는 관형 반응기에 에틸렌 단량체 및 비닐 아세테이트 단량체를 투입하고, 산소나 퍼옥사이드계 개시제를 첨가한 이후 적절한 온도 및 압력 하에서 중합될 수 있다. 상기 에틸렌 단량체의 함량은 상기 언급한 b) 에틸렌-아세트산비닐 공중합체의 아세트산비닐 함량에 따라 조절될 수 있다. The ethylene-vinyl acetate copolymer of component b) may be prepared by a polymerization process by a high pressure radical method using an oxygen or a peroxide initiator. For example, b) the ethylene-vinyl acetate copolymer may be polymerized under an appropriate temperature and pressure after the ethylene monomer and the vinyl acetate monomer are added to the tubular reactor and oxygen or a peroxide-based initiator is added. The content of the ethylene monomer may be adjusted according to the b) vinyl acetate content of the above-mentioned b) ethylene-vinyl acetate copolymer.
상기 b)의 에틸렌-아세트산비닐 공중합체는 일례로, 필름용 수지 조성물 총 100 중량% 중 10 내지 50 중량%, 혹은 20 내지 40 중량% 범위 내로 포함될 수 있고, 상기 함량 범위 미만에서는 필름 가공시 버블안정성이 저하될 수 있고, 상기 함량 범위를 초과하면 필름의 인장강도, 찢김강도 및 충격강도 등의 물성이 저하될 수 있다. The ethylene-vinyl acetate copolymer of b) may be included, for example, within a range of 10 to 50% by weight, or 20 to 40% by weight, in a total of 100% by weight of the resin composition for film. Stability may be lowered, and when the content exceeds the content range, physical properties such as tensile strength, tearing strength, and impact strength of the film may be lowered.
상기 조성물은 일례로 용융온도(Tm)가 100 ℃ 이하, 또는 80 내지 100 ℃일 수 있다. For example, the composition may have a melting temperature (Tm) of 100 ° C. or less, or 80 to 100 ° C.
본 발명에 따르면, 상술한 수지 조성물로 제조된 필름을 제공한다. According to this invention, the film manufactured from the resin composition mentioned above is provided.
상기 필름은, 얇은 막의 형태로 이루어진 것을 총칭하는 것으로, 통상 시트(sheet), 랩(wrap) 등으로 불리우는 것들을 모두 포함할 수 있다. The film is generically made in the form of a thin film, and may include all that are commonly called sheets, wraps, and the like.
상기 필름은 일례로, 용융온도(Tm)가 100 ℃ 이하, 또는 80 내지 100 ℃일 수 있다. For example, the film may have a melting temperature (Tm) of 100 ° C. or less, or 80 to 100 ° C.
상기 필름은 구체적인 예로, EPDM과 같은 합성고무의 언필(unpeel) 포장 필름일 수 있다. 상기 합성고무는 달리 특정하는 것은 아니며, 105 ℃ 이하, 또는 80 내지 105 ℃에서 배합 가능한 합성고무일 수 있다. As a specific example, the film may be an unpeel packaging film of synthetic rubber such as EPDM. The synthetic rubber is not otherwise specified, and may be a synthetic rubber compoundable at 105 ° C. or lower, or 80 to 105 ° C.
상기 필름은 일례로 두께가 10 내지 300 ㎛, 혹은 20 내지 100 ㎛인 것일 수 있고, 이 범위 내에서 포장 특성이 우수한 효과가 있다. For example, the film may have a thickness of 10 to 300 μm, or 20 to 100 μm, and has excellent packaging properties within this range.
상기 필름의 가공은 이에 특정하는 것은 아니나 블로운(Blown) 타입 필름 가공법을 일례로 설명하면, 가공시 용융된 수지가 나오면서 냉각되기 전에 가로/세로 방향으로 팽창되고 안정된 상태의 필름을 생성하게 되는데, 버블이 흔들리는 것은 소위 튜브라고 하는 필름 버블이 좌우로 흔들리면서 필름의 두께 편차가 발생하는 것을 버블 안정성으로 평가할 수 있고, 본건에서 가공된 필름은 상기 버블 안정성이 탁월하다. The processing of the film is not specific to this, but when the blown film processing method is described as an example, the film is expanded and stabilized in the horizontal / vertical direction before the molten resin is cooled and cooled, thereby producing a stable film. The shaking of the bubble can be evaluated by the bubble stability that the so-called tube bubble shakes left and right while the film thickness is generated, the film processed in this case is excellent in the bubble stability.
이하, 본 발명의 이해를 돕기 위하여 바람직한 실시예를 제시하나, 하기 실시예는 본 발명을 예시하는 것일 뿐 본 발명의 범주 및 기술사상 범위 내에서 다양한 변경 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속하는 것도 당연한 것이다.Hereinafter, preferred examples are provided to aid the understanding of the present invention, but the following examples are merely for exemplifying the present invention, and it will be apparent to those skilled in the art that various changes and modifications can be made within the scope and spirit of the present invention. It is natural that such variations and modifications fall within the scope of the appended claims.
[실시예]EXAMPLE
실시예 1 내지 6, 비교예 1 내지 3 및 대조예 1 내지 2Examples 1 to 6, Comparative Examples 1 to 3 and Control Examples 1 to 2
필름용 수지 조성물로서 하기 표 1에 제시한 성분 및 함량 범위로 배합하고 블로운 성형 방식의 압출기로 두께 50 ㎛의 필름으로 압출하여 시편을 제작하였다. As a resin composition for the film was formulated in the component and content ranges shown in Table 1 below and extruded into a film having a thickness of 50 ㎛ with an extruded blow molding method to prepare a specimen.
상기 실시예 및 비교예에서 사용된 원료는 다음과 같다:The raw materials used in the above examples and comparative examples are as follows:
* POP1 : 한국특허공개 2012-0090927호 내용에 따라 제조된 제품으로서 상기 식 1의 메탈로센 촉매를 사용하여 제조되고, 용융지수(190 ℃, 2.16 kgf 하중)이 1.2 g/10분이고, 밀도가 0.903 g/cm3이고 용융온도(Tm)이 96℃인 메탈로센계 폴리올레핀 플라스토머이며, LG화학에서 LF100 브렌드 이름으로 판매하고 있다. * POP1 : A product manufactured according to the contents of Korean Patent Laid-Open No. 2012-0090927, which is prepared using the metallocene catalyst of Formula 1, and has a melt index (190 ° C., 2.16 kgf load) of 1.2 g / 10 minutes and a density of It is a metallocene-based polyolefin plastomer of 0.903 g / cm 3 and melting temperature (Tm) of 96 ° C. It is sold by LG Chem under the LF100 brand name.
*POP2 : 한국특허공개 2012-0090927호 내용에 따라 제조된 제품으로서 상기 식 1의 메탈로센 촉매를 사용하여 제조되고, 용융지수(190 ℃, 2.16 kgf 하중)이 1.2 g/10분이고, 밀도가 0.885 g/cm3이고 용융온도(Tm)이 73℃인 메탈로센계 폴리올레핀 플라스토머이며, LG화학에서 LC180 브렌드 이름으로 판매하고 있다.* POP2: A product manufactured according to the contents of Korean Patent Publication No. 2012-0090927, which is prepared using the metallocene catalyst of Formula 1, and has a melt index (190 ° C., 2.16 kgf load) of 1.2 g / 10 minutes and a density of It is a metallocene-based polyolefin plastomer of 0.885 g / cm 3 and melting temperature (Tm) of 73 ° C, and is sold under the name LC180 brand by LG Chem.
* EVA1 : 용융지수(190 ℃, 2.16 kgf 하중)이 1.0 g/10분이고, 아세트산비닐 단량체 함량이 6 중량%이고 용융온도(Tm)이 101℃인 에틸렌-아세트산 비닐 공중합체이며 LG화학에서 EF320 브렌드 이름으로 판매하고 있다. * EVA 1: ethylene-vinyl acetate copolymer with melt index (190 ℃, 2.16 kgf load) of 1.0 g / 10 min, vinyl acetate monomer content of 6 wt% and melting temperature (Tm) of 101 ℃, EF320 from LG Chem. It is sold under the brand name.
* EVA2 : 용융지수(190 ℃, 2.16 kgf 하중)이 1.0 g/10분이고, 아세트산비닐 단량체 함량이 9 중량%이고 용융온도(Tm)이 94℃인 에틸렌-아세트산 비닐 공중합체이며 LG화학에서 EF321 브렌드 이름으로 판매하고 있다. * EVA 2: Ethylene-vinyl acetate copolymer with melt index (190 ℃, 2.16 kgf load) of 1.0 g / 10 min, vinyl acetate monomer content of 9% by weight and melting temperature (Tm) of 94 ℃. It is sold under the brand name.
* EVA3 : 용융지수(190 ℃, 2.16 kgf 하중)이 1.1 g/10분이고, 아세트산비닐 단량체 함량이 12 중량%이고 용융온도(Tm)이 90℃인 에틸렌-아세트산 비닐 공중합체이며 LG화학에서 EF443 브렌드 이름으로 판매하고 있다. * EVA3 : An ethylene-vinyl acetate copolymer with a melt index (190 ℃, 2.16 kgf load) of 1.1 g / 10 minutes, a vinyl acetate monomer content of 12% by weight, and a melting temperature (Tm) of 90 ℃. Sell by name.
* LDPE : 용융지수(190 ℃, 2.16 kgf 하중)이 3.0 g/10분이고, 밀도가 0.920 g/cm3이고 용융온도(Tm)이 105℃인 저밀도 폴리에틸렌이며 LG화학에서 BF500 브렌드 이름으로 판매하고 있다. * LDPE : Low density polyethylene with a melt index (190 ℃, 2.16 kgf load) of 3.0 g / 10 min, density 0.920 g / cm 3 and melting temperature (Tm) of 105 ℃, sold by LG Chem under the BF500 brand name. .
구분(wt%)Classification (wt%) POP1POP1 POP2POP2 EVA1EVA1 EVA2EVA2 EVA3EVA3 LDPELDPE
실시예1Example 1 8080 2020
실시예2Example 2 6060 4040
실시예3Example 3 8080 2020
실시예4Example 4 6060 4040
실시예5Example 5 8080 2020
실시예6Example 6 6060 4040
비교예1Comparative Example 1 100100
비교예2Comparative Example 2 8080 2020
비교예3Comparative Example 3 8080 2020
대조예1Comparative Example 1 100100
대조예2Comparative Example 2 100100
[시험예 1]  [Test Example 1]
준비된 시편을 사용하여 다음과 같은 물성을 측정하고 그 결과를 하기 표 2로서 정리하였다. Using the prepared specimens to measure the following physical properties and summarized the results as Table 2 below.
<시험 항목><Test item>
* 낙추충격강도 (Dart Impact Strength): ASTM D-1709에 준하여 한 필름 시료당 20회 이상 측정 후 그 값을 구하였다. * Impact impact strength (Dart Impact Strength): in accordance with ASTM D-1709 to obtain the value after 20 or more measurements per film sample.
* 파단점인장강도 (Tensile Strength at Breat ) 및 파단신율 (Elongation at Breat): 파단인장강도 및 파단신율은 일정 두께의 필름을 다이 커터(Cutter)로 시험편 형태로 잘라낸 후 ASTM D-882에 의거하여 측정하였다. 이때 인장속도는 500mm/분으로 하였으며, 한 시편당 10회 측정하여 그 평균치를 취하였다. * Tensile Tensile Strength (Tensile Strength at Breat) and breaking elongation (Elongation at Breat): after cutting the breaking tensile strength and the elongation at break is a film having a predetermined thickness by the die cutter (Cutter) a specimen form the basis of the ASTM D-882 Measured. At this time, the tensile speed was 500mm / min, and measured 10 times per specimen to take the average value.
* 엘멘도프 ( Elmendorf ) 찢김강도 (MD/TD): ASTM D-1922에 의거하여 측정하였다. MD는 필름이 나오는 방향이 기계방향이며, TD는 교차 방향이다. - Elmendorf (Elmendorf) tear strength (MD / TD): was measured according to ASTM D-1922. MD is the machine direction in which the film is coming out, TD is the cross direction.
* 흐림도(Haze): ASTM D1003법으로 측정하였다. * Haze: Haze was measured by ASTM D1003 method.
* 버블 안정성: 버블이 흔들리면 필름의 두께 편차가 발생할 수 있으므로, 버블의 흔들림을 인플레이션 성형으로 필름 성형을 수행할 때 버블을 육안으로 확인하여 버블의 안정성이 * Bubble Stability : When the bubble is shaken, the thickness variation of the film may occur, so when the film is formed by inflation molding of the bubble shake, the bubble is visually checked to ensure the stability of the bubble.
a) 안정하여 흔들림이 보이지 않는 것을 ○, a) It is stable and shows no shaking ○,
b) 안정성이 약간 나빠서 흔들림이 보이는 것을 △,b) the stability is slightly poor, showing shaking, △,
c) 안정성이 없어서 버블이 올라오지 않는 것 또는 흔들림이 심해서 주름이 많아지는 등의 필름 제작이 곤란한 것을 X로 하였다. c) The thing which is difficult to produce films, such as a thing which does not have stability, a bubble does not rise, or a shake is severe, and wrinkles were made into X was made into X.
○로 가까이 갈수록 성형성이 보다 바람직한 것을 나타낸다. The closer to ○, the more preferable the moldability.
필름 물성Film properties 낙추 충격강도 (g)Fall impact strength (g) 인장강도(kg/cm2)Tensile Strength (kg / cm 2 ) 신율(%)% Elongation 엘멘도프 찢김 강도(g/㎛)Elmendorf Tearing Strength (g / μm) 흐림도(%)Cloudiness (%) 버블 안정성Bubble stability
MD*MD * TD*TD * MD*MD * TD*TD * MD*MD * TD*TD *
실시예1Example 1 1,1131,113 398398 381381 550550 650650 4.74.7 8.58.5 7.97.9
실시예2Example 2 680680 371371 386386 522522 675675 3.63.6 7.97.9 9.49.4
실시예3Example 3 1,2101,210 401401 452452 521521 663663 5.85.8 7.37.3 7.47.4
실시예4Example 4 765765 366366 358358 540540 647647 3.23.2 7.17.1 8.58.5
실시예5Example 5 1,2891,289 403403 433433 533533 657657 5.55.5 7.17.1 7.07.0
실시예6Example 6 824824 363363 347347 525525 641641 3.13.1 6.96.9 7.57.5
비교예1Comparative Example 1 165165 233233 193193 356356 563563 2.22.2 2.62.6 1919
비교예2Comparative Example 2 336336 259259 226226 338338 591591 1.41.4 2.12.1 9.59.5
비교예3Comparative Example 3 390 390 191191 225225 350350 584584 2.02.0 2.42.4 7.37.3
대조예1Comparative Example 1 >1700> 1700 427427 428428 533533 650650 4.54.5 6.56.5 10.210.2
대조예2Comparative Example 2 >1700> 1700 560560 660660 610610 650650 5.15.1 7.17.1 7.27.2
*MD: 시편의 흐름방향, TD: 시편의 흐름 반대방향을 각각 지칭함. * MD: Flow direction of specimen, TD: Reverse direction of specimen flow.
상기 표 2에 나타낸 바와 같이, 본 발명의 a) 용융온도(Tm)가 100 ℃ 이하인 폴리올레핀 플라스토머 수지; 및 b) 용융온도(Tm)가 101 ℃ 이하, 특히 90 내지 101 ℃인 에틸렌-아세트산비닐 공중합체;를 포함하는 수지 조성물로 제조한 필름은 낙추 충격강도, 인장강도, 신율, 찢김강도, 흐림도, 버블 안정성 등 측정한 모든 물성에서 개선된 효과를 확인할 수 있었다. As shown in Table 2, a) the polyolefin plastomer resin having a) melting temperature (Tm) of the present invention 100 ℃ or less; And b) an ethylene-vinyl acetate copolymer having a melting temperature (Tm) of 101 ° C. or lower, particularly 90 to 101 ° C .; The improved effect was confirmed in all measured physical properties such as bubble stability.
반면, 본 발명의 수지 조성물이 아닌 저밀도 폴리에틸렌을 단독 사용한 비교예 1의 필름, 과 비교예 1의 저밀도 폴리에틸렌에 본 발명의 조성물을 구성하는 일 성분인 b) 용융온도(Tm)가 101 ℃ 이하인 에틸렌-아세트산비닐 공중합체를 과량 투여한 비교예 2와 3의 필름은 실시예 1 내지 6 대비 낙추 충격강도, 인장강도, 신율, 찢김 강도, 흐림도, 버블 안정성 등 측정한 모든 물성에서 불량한 효과를 확인하였다. On the other hand, b) melting temperature (Tm) which is one component which comprises the composition of this invention in the film of the comparative example 1 which used the low density polyethylene which is not the resin composition of this invention alone, and the low density polyethylene of the comparative example 1, ethylene of 101 degrees C or less The films of Comparative Examples 2 and 3 in which the vinyl acetate copolymer was excessively administered showed poor effects on all measured physical properties such as impact impact strength, tensile strength, elongation, tear strength, cloudiness, and bubble stability compared to Examples 1 to 6. It was.
<추가 실험예 1>Additional Experimental Example 1
상기 실시예 1에서 POP 함량을 50 중량%로 그리고 EVA 1 함량을 50 중량%로 대체한 것을 제외하고는 실시예 1과 동일한 실험을 반복하였다. The same experiment as in Example 1 was repeated except that the POP content was replaced by 50% by weight and the EVA 1 content by 50% by weight.
그 결과 측정된 물성은, 낙추 충격강도 589g, 인장강도 363 kg/cm2(MD)/ 379 kg/cm2 (TD), 신율 545%(MD)/ 680%(TD), 엘멘도프 찢김 강도 3.5g/㎛(MD)/ 7.4g/㎛(TD), 흐림도 9.5%로, 실시예 1 내지 5 대비 낮추 충격강도, 인장강도 및 엘멘도프 찢김강도가 저하됨을 확인할 수 있었다. The measured physical properties were: 589 g fall impact strength, 363 kg / cm 2 (MD) / 379 kg / cm 2 (TD), elongation 545% (MD) / 680% (TD), Elmendorf tear strength 3.5 g / μm (MD) /7.4 g / μm (TD), cloudiness of 9.5%, compared with Examples 1 to 5 it was confirmed that the impact strength, tensile strength and Elmendorf tear strength is lowered.
<추가 실험예 2>Additional Experimental Example 2
밀도가 0.87 g/cm3 미만의 POP를 사용한 경우 용융온도가 낮고 스티키(sticky)하여 필름가공이 잘 되지 않았고, 용융지수(190℃, 2.16kgf)가 20 g/10분을 초과하는 POP를 사용한 경우 또한 필름가공이 잘 되지 않았다.When the density of POP less than 0.87 g / cm 3 was used, the melt temperature was low and sticky, so the film was not processed well, and the melt index (190 ℃, 2.16kgf) exceeded 20 g / 10min. In addition, film processing was not good.
<사용예 1><Example 1>
상기 실시예 1에서 제조된 50㎛ 두께의 필름으로 포장된 EPDM 고무를 105 ℃에서 배합시키되, 상기 필름을 벗기지 않고 언필(unpeel) 상태로 배합 공정을 수행하고, 결과 얻어진 고무 배합품은 포장 필름이 잘 분산되어 균일한 색상을 보이는 것을 확인하였다. The EPDM rubber packaged with the 50 μm thick film prepared in Example 1 was blended at 105 ° C., but the compounding process was carried out in an unpeel state without peeling off the film. It was confirmed that the dispersion was uniform in color.
<사용예 2><Example 2>
상기 사용예 2에서 실시예 1에서 제조된 50㎛ 두께의 필름을 비교예 2에서 제조된 50㎛ 필름으로 대체한 것을 제외하고는 동일하게 언필(unpeel) 상태로 배합 공정을 수행하였다. 결과 얻어진 고무 배합품은 포장 필름이 잘 용융되지 않아 불순물로 작용하여 균일한 색상을 보이지 못하는 것을 확인하였다.Except for replacing the 50 ㎛ film prepared in Example 1 to 50 ㎛ film prepared in Comparative Example 2 in the use example 2 was carried out in the same unpeel (unpeel) blending process. The resultant rubber compound was confirmed that the packaging film did not melt well and acted as an impurity to show a uniform color.

Claims (14)

  1. a) 용융온도(Tm)가 100 ℃ 이하인 폴리올레핀 수지; 및 b) 용융온도(Tm)가 101 ℃ 이하인 에틸렌-아세트산비닐 공중합체;를 포함하는 a) polyolefin resin having a melting temperature (Tm) of 100 ° C. or less; And b) an ethylene-vinyl acetate copolymer having a melting temperature (Tm) of 101 ° C. or less.
    필름용 수지 조성물. Resin composition for films.
  2. 제 1항에 있어서, The method of claim 1,
    상기 a)의 폴리올레핀 수지는 폴리올레핀 플라스토머인 것을 특징으로 하는 The polyolefin resin of a) is characterized in that the polyolefin plastomer
    필름용 수지 조성물. Resin composition for films.
  3. 제 2항에 있어서, The method of claim 2,
    상기 폴리올레핀 플라스토머는 분자량 분포도가 3.5 이하인 것을 특징으로 하는The polyolefin plastomer is characterized in that the molecular weight distribution is 3.5 or less
    필름용 수지 조성물.Resin composition for films.
  4. 제 2항에 있어서, The method of claim 2,
    상기 폴리올레핀 플라스토머는 용융지수(190 ℃, 2.16 kgf 하중)가 0.5 내지 20 g/10분이고 밀도가 0.87 내지 0.92 g/cm3인 것을 특징으로 하는The polyolefin plastomer is characterized in that the melt index (190 ℃, 2.16 kgf load) is 0.5 to 20 g / 10 minutes and the density is 0.87 to 0.92 g / cm 3
    필름용 수지 조성물.Resin composition for films.
  5. 제 2항에 있어서, The method of claim 2,
    상기 폴리올레핀 플라스토머는 에틸렌-알파 올레핀 공중합체인 것을 특징으로 하는The polyolefin plastomer is characterized in that the ethylene-alpha olefin copolymer
    필름용 수지 조성물.Resin composition for films.
  6. 제 5항에 있어서, The method of claim 5,
    상기 에틸렌-알파 올레핀 공중합체 내 알파 올레핀 함량은 2 내지 20 몰%인 것을 특징으로 하는The alpha olefin content in the ethylene-alpha olefin copolymer is characterized in that 2 to 20 mol%.
    필름용 수지 조성물.Resin composition for films.
  7. 제 1항에 있어서, The method of claim 1,
    상기 a)의 폴리올레핀 수지는 필름용 수지 조성물 총 100 중량% 중 50 내지 90 중량% 범위 내로 포함된 것을 특징으로 하는The polyolefin resin of a) is characterized in that contained within 50 to 90% by weight of the total 100% by weight of the resin composition for the film
    필름용 수지 조성물. Resin composition for films.
  8. 제 1항에 있어서, The method of claim 1,
    상기 b)의 에틸렌-아세트산비닐 공중합체는 아세트산비닐 단량체가 6 내지 12 중량% 범위 내로 포함된 것을 특징으로 하는The ethylene-vinyl acetate copolymer of b) is characterized in that the vinyl acetate monomer is included in the range of 6 to 12% by weight
    필름용 수지 조성물. Resin composition for films.
  9. 제 1항에 있어서, The method of claim 1,
    상기 b)의 에틸렌-아세트산비닐 공중합체는 필름용 수지 조성물 총 100 중량% 중 10 내지 50 중량% 범위 내로 포함된 것을 특징으로 하는The ethylene-vinyl acetate copolymer of b) is 10 to 50% by weight in a total of 100% by weight of the resin composition for film Characterized in that included within the scope
    필름용 수지 조성물. Resin composition for films.
  10. 제 1항 내지 제 9항 중 어느 한 항의 수지 조성물로 제조된 필름. A film made of the resin composition of any one of claims 1 to 9.
  11. 제 10항에 있어서,The method of claim 10,
    상기 필름은 용융온도(Tm)가 105 ℃ 이하인 것을 특징으로 하는 필름The film is characterized in that the melting temperature (Tm) is 105 ℃ or less
  12. 제 10항에 있어서,The method of claim 10,
    상기 필름은 합성고무의 언필(unpeel) 포장 필름인 것을 특징으로 하는 필름.The film is an unpeel packaging film of synthetic rubber.
  13. 제 12항에 있어서,The method of claim 12,
    상기 합성고무는 연화점이 105 ℃ 이하인 것을 특징으로 하는 필름.The synthetic rubber has a softening point of 105 ℃ or less film.
  14. 제 10항에 있어서, The method of claim 10,
    상기 필름은, 두께가 10 내지 300 ㎛인 것을 특징으로 하는 필름.The film has a thickness of 10 to 300 ㎛.
PCT/KR2015/013989 2014-12-19 2015-12-19 Resin composition for film and unpeel film for rubber WO2016099221A2 (en)

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KR10-2014-0183711 2014-12-19
KR1020150181456A KR20160075362A (en) 2014-12-19 2015-12-18 Resin composition for film and unpeel film for rubber
KR10-2015-0181456 2015-12-18

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CN112980096A (en) * 2019-12-02 2021-06-18 中国石油天然气股份有限公司 Soluble membrane composition, soluble membrane and preparation method and application thereof

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JP3748639B2 (en) * 1996-10-17 2006-02-22 旭化成ライフ&リビング株式会社 Polyolefin resin composition
JPH10237190A (en) * 1997-02-25 1998-09-08 Ube Ind Ltd Film for packaging rubber
JP2000038483A (en) * 1998-07-24 2000-02-08 Sumitomo Chem Co Ltd Ethylene-alfa-olefin copolymer composition and film therefrom
KR20020046388A (en) * 2000-12-13 2002-06-21 유현식 Highly adhesive resin composition for extrusion coating
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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