WO2016090860A1

WO2016090860A1 - Epoxy resin composition, and prepreg and laminated plate using same

Info

Publication number: WO2016090860A1
Application number: PCT/CN2015/079980
Authority: WO
Inventors: 邓华阳; 杨中强; 刘潜发; 许永静; 王鹏
Original assignee: 广东生益科技股份有限公司
Priority date: 2014-12-11
Filing date: 2015-05-27
Publication date: 2016-06-16
Also published as: CN104497276A

Abstract

The present invention belongs to the technical field of copper-clad laminate and relates to an epoxy resin composition, and prepreg and laminated plate using the same. The thermosetting resin composition comprises: epoxy resin, a flexible primary amine curing agent, phenolic resin and a curing accelerator. The copper-clad laminate prepared using the epoxy resin composition comprises a plurality of laminated prepregs, a copper foil disposed at one side or two sides of the laminated prepreg, each prepreg comprising a reinforcing material and the epoxy resin composition adhered thereon after impregnation and drying. The flexible primary amine applied in the present invention is a curing agent as well as a toughening agent of a phenolic-curing epoxy resin system. The prepared copper-clad laminate has good toughness with no decrease in Tg, thus solving the problem of Tg decrease of copper-clad laminate caused by the use of numerous conventional toughening agents.

Description

Epoxy resin composition and prepreg and laminate using same

Technical field

The invention belongs to the technical field of copper clad laminates, and relates to an epoxy resin composition and a prepreg and a laminate using the same.

Background technique

With the implementation of the PCB lead-free process, the requirements for the heat resistance of the copper clad laminate are further improved. In the past, the technical route of the dicyandiamide cured epoxy resin could not satisfy the lead-free soldering process due to poor heat resistance. To this end, the technical route to meet this lead-free phenolic cured epoxy resin has officially entered the historical stage of copper clad laminates.

The phenolic curing epoxy resin system is a thermosetting material with high crosslinking density. The phenolic resin molecule contains a large amount of aromatic benzene ring structure, and has good thermal stability, so that the crosslinked cured product of phenolic and epoxy has good heat resistance. The high thermal decomposition temperature solves the problem of heat resistance after the implementation of the PCB lead-free process. However, due to the high rigidity and high density of the benzene ring in the phenolic resin, the brittleness of the plate is increased, and the brittleness assembly leads to a series of problems such as easy-to-powder and cracking of the plate punching, which brings great harm to the processing and application of the PCB. . Therefore, how to improve the toughness of the phenolic cured epoxy system copper clad plate has become the focus of research and development of many CCL workers.

CN 102516717 A discloses a heat-shrinkable resin for improving the toughness of an epoxy resin system. Although this method can improve the toughness to a certain extent, the heat-shrinkable resin and the epoxy resin have poor compatibility and are prone to occur. Phase separation results in other performance degradation.

CN102304273 A uses a large molecular weight phenol oxygen type epoxy resin to increase the toughness of the epoxy resin composition. If the amount of the phenol oxygen type epoxy resin is small, the toughening effect is not obvious, and if the amount of addition is large, although the composition is improved, Toughness, but at the same time, the Tg of the composition is greatly reduced.

Another toughening technique is to add a core-shell type rubber polymer for toughening purposes. CN 102079875 A and CN 102558861 A use spherical core-shell rubber to improve toughness and drilling processability, as well as the problem of a drop in Tg.

Summary of the invention

In view of the problems of the prior art, one of the objects of the present invention is to provide an epoxy resin composition using a flexible primary amine as a curing agent and a toughening agent, and the obtained copper clad laminate has excellent toughness and Tg. Do not reduce, the sheet does not drop when punching.

In order to achieve the above object, the present invention adopts the following technical solutions:

An epoxy resin composition comprising an epoxy resin, a flexible primary amine curing agent, a phenolic resin, and a curing accelerator; the flexible primary amine curing agent has the following structural formula:

R1 and R2 are independently a hydrogen atom, an alkyl group, a cycloalkyl group, a heterocyclic group, a heterocycloalkyl group, an alkenyl group, a cycloalkenyl group, an aryl group, a heteroaryl group, an alkylalkyl group, an alkynyl group, an alkylene group, One of an alkylene hydrocarbylene group, an alkenylene group, an alkylene heteroalkenylene group, an alkynylene group or an alkylene alkynylene group; R1 and R2 may be the same or different; R1 and R2 may be adjacent to each other. The carbon atoms are in the same ring structure, and may not be in the same ring structure;

R3 and R4 are independently an alkylene group, an alkylene hydrocarbylene group, an alkenylene group, an alkylene alkenylene group, an alkylene heteroalkenylene group, an alkynylene group, a cycloalkylene group, an alkylene cycloalkylene group, or a sub Hydrocarbon cycloalkylene alkylene, enecycloalkylene, enecycloalkylene alkenylene, alkylene cycloalkenylene alkenylene, alkyncycloalkylene, alkynylene naphthylene, heterocycle Alkylene group, alkylene heterocycloalkylene group, alkylene heterocycloalkylene hydrocarbon group, alkylene heterocycloalkylene group, alkylene heteroalkenylene group, alkylene heterocycloalkenylene group, alkyne heterocycle Alkylene group, alkyne heterocycloalkane Base, cycloalkenylene, alkylene cycloalkenylene, alkylene cycloalkenylene, eneene cycloalkenyl, enelenene alkenylene, alkylene cycloalkenylene, alkyne ring Alkylene, alkynylene, alkynylene, heterocycloalkenyl, alkyleneheteroene, alkylene heteroalkylene, alkene heteroalkylene, eneeneene Base, alkylene heterocycloalkenylene, alkyne heterocycloalkenylene, alkyne heteroalkenylene alkynylene, arylene, alkylene aromatic, alkylene aromatic alkylene, alkylene aromatic , an alkylene aromatic alkenylene group, an alkylene aromatic alkenylene group, an alkyne aromatic group, an alkyne aromatic alkynylene group, a heteroaromatic group, an alkylene heteroaryl group, an alkylene heteroaromatic hydrocarbon group , an alkene heteroaryl group, an eneene heteroalkenylene group, an alkylene heteroalkenylene group, an alkyne heteroaryl group, an alkyne heteroalkenylene group, a 1,4-alkyl substituted group Any one of a azine, a carbonyl group or a thiocarbonyl group; R3 and R4 may be the same or different.

Preferably, the epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, isocyanate modified epoxy resin, o-cresol epoxy resin, naphthalene ring Oxygen resin, alicyclic epoxy resin, resorcinol type epoxy resin, polyethylene glycol type epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin, dicyclopentadiene epoxy resin or Any one of phenolic epoxy resins or a mixture of at least two.

Preferably, the flexible primary amine curing agent is a linear primary amine, and further preferably the flexible primary amine curing agent is:

Preferably, the phenolic resin is a mixture of a phenolic phenolic resin, a thermosetting phenolic resin or an oily phenolic resin which is obtained by polycondensation of phenol and formaldehyde under a catalyst condition, neutralized, and washed with water, or a mixture of at least two.

Preferably, the ratio of the number of moles of epoxy groups in the epoxy resin to the sum of the number of moles of hydroxyl groups of the living wave hydrogen and the phenolic resin in the primary amine curing agent is from 0.9 to 1.1 (for example, 0.92, 0.94, 0.96, 0.98, 1) , 1.02, 1.04, 1.06 or 1.08), wherein the ratio of the number of moles of living wave hydrogen in the flexible primary amine curing agent to the number of moles of hydroxyl groups of the phenolic resin is from 1:1 to 1:8, for example 1:1.5, 1:2. 1:2.5, 1:3, 1:3.5, 1:4, 1:4.5, 1:5, 1:5.5, 1:6, 1:6.5, 1:7 or 1:7.5.

Preferably, the curing accelerator is 2-methylimidazole, 1-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2 Any one or a mixture of at least two of phenylimidazole, 2-undecylimidazole or 2-phenyl-4-methylimidazole.

"Include" in the context of the present invention means that in addition to the components, it may include other components which impart different characteristics to the epoxy resin composition. In addition, the "include" of the present invention may also be replaced by a closed "for" or "consisting of".

For example, the epoxy resin composition may further contain various additives, and specific examples thereof include flame retardants, antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, pigments, colorants, or lubricants. Wait. These various additives may be used singly or in combination of two or more kinds.

Another object of the present invention is to provide a resin glue obtained by dissolving or dispersing the epoxy resin composition as described above in a solvent.

The solvent in the present invention is not particularly limited, and specific examples thereof include alcohols such as methanol, ethanol, and butanol, ethyl cellosolve, butyl cellosolve, ethylene glycol-methyl ether, carbitol, and butyl. Ethers such as carbitol, ketones such as acetone, methyl ethyl ketone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and mesitylene; An ester such as ethyl acetate or ethyl acetate; a nitrogen-containing solvent such as N,N-dimethylformamide, N,N-dimethylacetamide or N-methyl-2-pyrrolidone. These solvents may be used alone or in combination of two or more. Preferred are aromatic hydrocarbon solvents such as toluene, xylene, and mesitylene, and acetone, methyl ethyl ketone, methyl ethyl ketone, and methyl group. A ketone flux such as butyl ketone or cyclohexanone is used in combination. The amount of the solvent used can be selected by a person skilled in the art according to his own experience, so that the solid content of the obtained resin glue can reach 50 to 70%.

A third object of the present invention is to provide a prepreg comprising a reinforcing material and an epoxy resin composition as described above adhered to the reinforcing material by impregnation and drying.

A fourth object of the present invention is to provide a laminate comprising at least one prepreg as described above.

A fifth object of the present invention is to provide a copper clad laminate comprising at least one laminated prepreg as described above and laminated on one side of the laminated prepreg Or copper foil on both sides.

At the time of production, the thermosetting epoxy resin composition is dissolved by a solvent, the reinforcing material is wetted, baked to form a prepreg, and the prepreg is pressed against the copper foil to obtain a copper-clad laminate.

A sixth object of the present invention is to provide a printed circuit board comprising at least one prepreg as described above.

Compared with the prior art, the present invention has the following beneficial effects:

The epoxy resin composition of the present invention uses a flexible primary amine as a curing agent and a toughening agent, which effectively improves the toughness of the phenolic cured epoxy system, and the Tg of the cured product does not decrease. In addition, the epoxy resin composition of the present invention is also effective for improving the punching and dusting property of the copper clad laminate, so that the sheet does not fall off when punched.

detailed description

The technical solution of the present invention will be further described below by way of specific embodiments.

Example 1

Biphenyl epoxy resin, NC-3000H, epoxy equivalent of 288 g/mol, Nippon Kayaku Co., Ltd.

Linear phenolic curing agent, 2812, hydroxyl equivalent 105g/mol, Momentive Specialty Chemicals.

Flexible primary amine curing agent

Prepared according to the method of CN 103435504 A.

2-methylimidazole, Japan Shikoku Chemical Co., Ltd.

Butanone, Lanzhou Petrochemical Co., Ltd.

Take 140 parts of the above biphenyl epoxy, 21 parts of novolac resin, 11 parts of ketal primary amine curing agent, 2- 0.05 parts of methylimidazole and 125 parts of butanone were prepared into a gelatin solution having a solid content of 58%, and mixed to obtain a uniformly dispersed glue. A 2116 glass fiber cloth was immersed in the composition for sizing, and baked in an oven at 155 ° C for 5 minutes to prepare a prepreg.

Then, a plurality of the above prepregs are superposed, and one 35 μm electrolytic copper foil is placed on the upper and lower sides, and hot pressed in a vacuum press at 180 ° C under a pressure of 35 kgf/cm ² for 90 minutes to obtain a thickness of 0.8mm double-sided copper clad laminate.

Example 2

Flexible primary amine curing agent

Prepared according to the method of CN 103435504 A.

2-methylimidazole, Japan Shikoku Chemical Co., Ltd.

Butanone, Lanzhou Petrochemical Co., Ltd.

Take 100 parts of the above biphenyl epoxy, 21 parts of novolac resin, 5.5 parts of ketal primary amine curing agent, 0.05 parts of 2-methylimidazole, 174.8 parts of methyl ethyl ketone, and prepared into a solid content of 58%, and mixed to obtain dispersion. A uniform glue. A 2116 glass fiber cloth was immersed in the composition for sizing, and baked in an oven at 155 ° C for 5 minutes to prepare a prepreg.

Example 3

Flexible primary amine curing agent

Prepared according to the method of CN 103435504 A.

2-methylimidazole, Japan Shikoku Chemical Co., Ltd.

Butanone, Lanzhou Petrochemical Co., Ltd.

Take 100 parts of the above biphenyl epoxy, 21 parts of novolac resin, 5.5 parts of ketal primary amine curing agent, 0.06 parts of 2-methylimidazole, 176.5 parts of methyl ethyl ketone, and prepare a solid content of 58% glue, which is mixed to obtain dispersion. A uniform glue. A 2116 glass fiber cloth was dipped into the composition for sizing, and baked in an oven at 155 ° C for 5.5 min to prepare a prepreg.

Example 4

Flexible primary amine curing agent

Prepared according to the method of CN 103435504 A.

2-methylimidazole, Japan Shikoku Chemical Co., Ltd.

Butanone, Lanzhou Petrochemical Co., Ltd.

Example 5

Flexible primary amine curing agent

Prepared according to the method of CN 103435504 A.

2-methylimidazole, Japan Shikoku Chemical Co., Ltd.

Butanone, Lanzhou Petrochemical Co., Ltd.

Take 160 parts of the above biphenyl epoxy, 21 parts of novolac resin, 22 parts of ketal primary amine curing agent, 0.05 parts of 2-methylimidazole, 174.8 parts of methyl ethyl ketone, and prepare a solid content of 54% glue, which is mixed and dispersed. A uniform glue. A 2116 glass fiber cloth was immersed in the composition for sizing, and baked in an oven at 155 ° C for 5 minutes to prepare a prepreg.

Example 6

Isocyanate modified epoxy resin, XZ97103, epoxy equivalent weight 290 g/mol, DOW CHEMICAL.

Flexible primary amine curing agent

Prepared according to the method of CN 103435504 A.

2-methylimidazole, Japan Shikoku Chemical Co., Ltd.

Butanone, Lanzhou Petrochemical Co., Ltd.

Take 140 parts of the above isocyanate modified epoxy resin, 21 parts of novolac resin, 11 parts of ketal primary amine curing agent, 0.05 parts of 2-methylimidazole, 125 parts of methyl ethyl ketone, and prepared into a solid content of 58% glue, mixed A well-dispersed glue is obtained. 2116 glass fiber cloth was dipped into the composition for sizing and baked at 155 ° C In the box, bake for 5 min to prepare a prepreg.

Example 7

Bisphenol A type phenolic curing agent, F2110, hydroxyl equivalent weight 110g/mol, KOLON INDUSTRIES.

Flexible primary amine curing agent

Prepared according to the method of CN 103435504 A.

2-methylimidazole, Japan Shikoku Chemical Co., Ltd.

Butanone, Lanzhou Petrochemical Co., Ltd.

Take 140 parts of the above isocyanate modified epoxy resin, 23 parts of bisphenol A type phenolic resin, 11 parts of ketal primary amine curing agent, 0.05 parts of 2-methylimidazole, 125 parts of butanone, and formulated into a solid content of 58% The liquid is mixed to obtain a uniformly dispersed glue. A 2116 glass fiber cloth was immersed in the composition for sizing, and baked in an oven at 155 ° C for 5 minutes to prepare a prepreg.

Comparative example 1

Dicyandiamide curing agent, DICY, Ningxia Darong Chemical Co., Ltd.

2-methylimidazole, Japan Shikoku Chemical Co., Ltd.

Butanone, Lanzhou Petrochemical Co., Ltd.

Take 100 parts of the above biphenyl epoxy, 21 parts of novolac resin, 5.0 parts of dicyandiamide curing agent, 0.06 parts of 2-methylimidazole, 176.5 parts of methyl ethyl ketone, and prepare a solid content of 58%, and mix to obtain uniform dispersion. Glue. A 2116 glass fiber cloth was dipped into the composition for sizing, and baked in an oven at 155 ° C for 5.5 min to prepare a prepreg.

Comparative example 2

Phenolic resin, 53-BH-35, HEXION EPONOL.

2-methylimidazole, Japan Shikoku Chemical Co., Ltd.

Butanone, Lanzhou Petrochemical Co., Ltd.

100 parts of the above biphenyl epoxy, 21 parts of novolac resin, 6.0 parts of phenolic resin, 0.06 parts of 2-methylimidazole, and 176.5 parts of methyl ethyl ketone were prepared to prepare a gel with a solid content of 58%, and mixed to obtain a uniformly dispersed glue. liquid. A 2116 glass fiber cloth was dipped into the composition for sizing, and baked in an oven at 155 ° C for 5.5 min to prepare a prepreg.

Comparative example 3

Core-shell rubber, DOW 351, DOW CHEMICAL.

2-methylimidazole, Japan Shikoku Chemical Co., Ltd.

Butanone, Lanzhou Petrochemical Co., Ltd.

Take 100 parts of the above biphenyl epoxy, 21 parts of novolac resin, 6.0 parts of core-shell rubber, 0.06 parts of 2-methylimidazole, and 176.5 parts of methyl ethyl ketone, which are formulated into a solid content of 58%, and mixed to obtain a uniform dispersion. Glue. A 2116 glass fiber cloth was dipped into the composition for sizing, and baked in an oven at 155 ° C for 5.5 min to prepare a prepreg.

Comparative example 4

Flexible primary amine curing agent

Prepared according to the method of CN 103435504 A.

2-methylimidazole, Japan Shikoku Chemical Co., Ltd.

Butanone, Lanzhou Petrochemical Co., Ltd.

Take 70 parts of the above biphenyl epoxy, 21 parts of novolac resin, 1.0 part of ketal primary amine curing agent, 0.05 part of 2-methylimidazole, 174.8 parts of butanone, and make a solid content of 58%, and mix to obtain dispersion. A uniform glue. A 2116 glass fiber cloth was immersed in the composition for sizing, and baked in an oven at 155 ° C for 5 minutes to prepare a prepreg.

Comparative Example 5

Flexible primary amine curing agent

Prepared according to the method of CN 103435504 A.

2-methylimidazole, Japan Shikoku Chemical Co., Ltd.

Butanone, Lanzhou Petrochemical Co., Ltd.

Take 125 parts of the above biphenyl epoxy, 10.5 parts of novolac resin, 10 parts of ketal primary amine curing agent, 0.05 parts of 2-methylimidazole, 174.8 parts of methyl ethyl ketone, and prepared into a solid content of 58%, and mixed to obtain dispersion. A uniform glue. A 2116 glass fiber cloth was immersed in the composition for sizing, and baked in an oven at 155 ° C for 5 minutes to prepare a prepreg.

For the copper clad laminate produced above, properties such as glass transition temperature (Tg), flexural strength, flexural modulus, peel strength, and punching powder dropability were tested. The test results are shown in Tables 1 and 2 below.

Table 1

Table 2

The above performance test methods are as follows:

Tg: GBT 19466.2-2004;

Bending strength: ASTM D790-10;

Flexural modulus: ASTM D790-10;

Peel strength: The test uses the IPC-TM-650 2.4.8 method.

Punching powder drop: After punching out a circle with a diameter of 5 cm, observe whether there is powder falling around the circle.

It can be seen from Examples 1-3 and Comparative Example 1 that the flexible primary amine curing agent can effectively improve the punching and dusting property of the phenolic curing epoxy system compared with the conventional amine curing agent; 4, the linear flexible primary amine in Example 2 has a more toughening effect, and is more excellent in bending strength and modulus performance; from Examples 1-3 and Comparative Examples 2-3, a flexible primary amine is known. Compared with the toughening of the phenolic resin and the toughening of the core-shell rubber, the curing agent does not lower the Tg of the cured product; it can be seen from Examples 1-3 that the flexible primary amine curing agents of different structures have better toughening effects. . It can be seen from Comparative Example 4 and Comparative Example 5 that the addition amount of the flexible primary amine curing agent is too small, and the toughening effect is not so obvious, but the excessive addition amount of the flexible primary amine curing agent may cause the rigidity of the copper clad laminate to decrease. The amount of flexible primary amine curing agent must be controlled within a reasonable range to achieve better results.

The embodiments described above are merely preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, equivalent changes in the structures, features, and principles described in the claims of the present invention. Or modifications are included in the scope of the present invention.

The Applicant declares that the present invention illustrates the detailed method of the present invention by the above embodiments, but the present invention It is not limited to the above detailed method, that is, it does not mean that the invention must be implemented by the detailed method described above. It should be apparent to those skilled in the art that any modifications of the present invention, equivalent substitution of the various materials of the products of the present invention, addition of auxiliary components, selection of specific means, and the like, are all within the scope of the present invention.

Claims

An epoxy resin composition comprising an epoxy resin, a flexible primary amine curing agent, a phenolic resin, and a curing accelerator; the flexible primary amine curing agent has the following structural formula:

R1 and R2 are independently a hydrogen atom, an alkyl group, a cycloalkyl group, a heterocyclic group, a heterocycloalkyl group, an alkenyl group, a cycloalkenyl group, an aryl group, a heteroaryl group, an alkylalkyl group, an alkynyl group, an alkylene group, One of an alkylene hydrocarbylene group, an alkenylene group, an alkylene heteroalkenylene group, an alkynylene group or an alkylene alkynylene group;

R3 and R4 are independently an alkylene group, an alkylene hydrocarbylene group, an alkenylene group, an alkylene alkenylene group, an alkylene heteroalkenylene group, an alkynylene group, a cycloalkylene group, an alkylene cycloalkylene group, or a sub Hydrocarbon cycloalkylene alkylene, enecycloalkylene, enecycloalkylene alkenylene, alkylene cycloalkenylene alkenylene, alkyncycloalkylene, alkynylene naphthylene, heterocycle Alkylene group, alkylene heterocycloalkylene group, alkylene heterocycloalkylene hydrocarbon group, alkylene heterocycloalkylene group, alkylene heteroalkenylene group, alkylene heterocycloalkenylene group, alkyne heterocycle Alkylene group, alkynylene alkynylene group, cycloalkenylene group, alkylene cycloalkenylene group, alkylene cycloalkenylene group, eneene cycloalkenylene group, eneeneene alkenylene group, sub a hydrocarbon cycloalkenylene alkenylene group, an alkynylene cycloalkenylene group, an alkynylene cycloalkenylene group, a heterocycloalkenylene group, an alkylene heterocycloalkenylene group, an alkylene heterocyclic alkylene group, an alkylene heterocycle Alkene group, alkylene heteroalkenylene group, alkylene heteroalkenylene alkenylene group, alkyne heterocycloalkenylene group, alkyne heteroalkenylene alkynylene group, aromatic group, alkylene aromatic group, sub Hydrocarbon aromatic hydrocarbon group, alkylene aromatic group, alkylene aromatic alkenylene group, sub Hydrocarbon aromatic alkenylene, alkyne aromatic group, alkyne aromatic alkynylene group, heteroaromatic group, alkylene heteroaryl group, alkylene heteroalkylene group, alkylene aromatic group, alkylene Any of a heteroaromatic alkenylene group, an alkylene heteroalkenylene group, an alkyne heteroaryl group, an alkyne heteroalkenylene group, a 1,4-alkyl substituted piperazine, a carbonyl group or a thiocarbonyl group. One.
The epoxy resin composition according to claim 1, wherein said epoxy resin is Bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, isocyanate modified epoxy resin, o-cresol epoxy resin, naphthalene epoxy resin, alicyclic epoxy Any one of a resin, a resorcinol type epoxy resin, a polyethylene glycol type epoxy resin, a trifunctional epoxy resin, a tetrafunctional epoxy resin, a dicyclopentadiene epoxy resin, or a phenolic epoxy resin Kind or a mixture of at least two.
The epoxy resin composition according to claim 1 or 2, wherein the flexible primary amine curing agent is a linear primary amine.
The epoxy resin composition according to claim 3, wherein said flexible primary amine curing agent is:
The epoxy resin composition according to any one of claims 1 to 4, wherein the phenol resin is a linear phenolic resin obtained by polycondensation of phenol and formaldehyde under a catalyst condition, neutralized, and washed with water, and thermosetting. Any one or a mixture of at least two of a phenol resin or an oily phenol resin.
The epoxy resin composition according to any one of claims 1 to 5, wherein the number of moles of epoxy groups in the epoxy resin and the number of moles of hydroxyl groups of the living wave hydrogen and the phenolic resin in the flexible primary amine curing agent The ratio of the sum is 0.9 to 1.1, and the ratio of the number of moles of hydrogen in the flexible primary amine curing agent to the number of moles of hydroxyl groups of the phenolic resin is 1:1 to 1:8.
The epoxy resin composition according to any one of claims 1 to 6, wherein the curing accelerator is 2-methylimidazole, 1-methylimidazole, 2-ethyl-4-methylimidazole, Any one or at least two of 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole or 2-phenyl-4-methylimidazole mixture.
A resin glue obtained by dissolving or dispersing the epoxy resin composition according to any one of claims 1 to 7 in a solvent.
A prepreg comprising a reinforcing material and an epoxy resin composition according to any one of claims 1 to 7 adhered to the reinforcing material by impregnation and drying.
A laminate comprising at least one prepreg according to claim 9.
A copper clad laminate comprising at least one laminated prepreg according to claim 9 and copper laminated on one or both sides of the laminated prepreg Foil.
A printed circuit board comprising at least one prepreg according to claim 9.