WO2016075104A1

WO2016075104A1 - Sensor housing

Info

Publication number: WO2016075104A1
Application number: PCT/EP2015/076139
Authority: WO
Inventors: Daniel Pantel; Fabian Henrici
Original assignee: Robert Bosch Gmbh
Priority date: 2014-11-10
Filing date: 2015-11-10
Publication date: 2016-05-19
Also published as: CN107076586A; DE102014222899A1; DE102014222899B4; CN107076586B

Abstract

The invention relates to a sensor housing (10) for a sensor (12) and/or an electronic component, a method for manufacturing the sensor housing (10), and the use of the sensor housing (10). At least one sensor (12) or at least one electronic component is accommodated in a cavity (16). The cavity (16) is located inside the sensor housing (10). The sensor housing (10) is made of a media-resistant fluoropolymer material into which contact surfaces (30) that can be contacted from outside the sensor housing (10) are embedded.

Description

Description title

Sensor housing Technical area

The invention relates to a sensor housing for receiving a sensor for monitoring the operating state of battery cells, from

Battery modules or entire battery packs, which are increasingly used as traction batteries in hybrid vehicles or electric vehicles.

State of the art

US 2005/0001214 AI refers to a micro- or

Nanoelectronic component with a power source and means for protecting this power source. Within an outwardly sealed cavity, an unprotected power source is arranged in the form of a microbattery or microcapacitance. Any penetration of ambient atmosphere into the sealed cavity leads to destruction of the power source by oxidation, rendering it unusable. The cavity may have a vacuum or be filled with an inert gas. Within the cavity, a pressure sensor may be arranged which detects a pressure change within the cavity and optionally makes the component contained therein inactive should the pressure change exceed a predetermined threshold. The cavity, or the cavity, is by means of a cover

sealed, or filled with a filling material, for example silicone resin, a polymer material, epoxy, glass or with metal such as indium, tin or lead or alloys with these metallic materials. KR 2011 0038202 A relates to a battery sensor unit and a

Process for its preparation. With the proposed battery sensor and its manufacturing method to damage due to thermal stress and a decline in the properties of a

Electronic component of a circuit board assembly can be prevented. One end of a shunt resistor is bonded to a connection terminal. A printed circuit board assembly directly contacts an oxidation-preventing unit that detects the condition of a battery. A connection terminal connects a bonded part to the other end of the shunt resistor, and connects the other end of the connection terminal to a ground line, and fixes and isolates the central part of the connection terminal to and from a terminal. A protective housing surrounds the entire bonded parts of the circuit board assembly, a shunt resistor and a

Port terminals.

The monitoring of the operating state of battery cells, for example in hybrid or electric vehicles (for example, lithium-ion batteries as traction batteries) is necessary for the safety of these batteries and for effective battery management. At present, the operating state of such battery cells is monitored by externally mounted sensors. It monitors variables such as the voltage or temperature of such battery cells. For a more accurate measurement of these parameters or for measuring other parameters, for example, to measure the pressure, which are becoming increasingly important in the context of today's development, it is advantageous to arrange the sensors within individual battery cells. This is

technically not immediately feasible, since the

Environmental conditions within a battery cell not for classic

Packaging materials (such as molding compound, PCB, adhesives and gels) are suitable. Thus, such packaging materials can be attacked by chemical reactions with the electrolyte and consequently be decomposed. This endangers both the sensors themselves, as well as by the introduction / penetration of foreign materials into the electrolyte, the stability of the respective battery cell. Newer concepts such as the protection of sensors with a battery-compatible film can partially solve these problems, but lead to much larger sizes of sensors or protect the in Framework of the assembly and connection technology used materials inadequate before a chemical reaction with the electrolyte

Battery cell.

Media-resistant sensor housings are also used in other areas, such as sensors used in the exhaust gas system of automobiles, or sensors that come in contact with transmission oil, salt water, and the like of aggressive materials. fluoropolymers

Materials such as polytetrafluoroethylene (PTFE) or fluorinated ethylene-propylene (FEP) are known for their high durability. In the

PCB manufacturing is nowadays standard for PTFE

High frequency circuits used. Here plays the high chemical

Resistance does not matter. PTFE printed circuit boards can be processed in a similar way to other printed circuit board materials and are only slightly more expensive than standard materials. Also films with a thickness of only a few μηη are made of PTFE. As a thermoplastic, PTFE is also available as a material fit.

In order to measure the voltage and the temperature of battery cells or to measure other variables, the sensors arranged within the battery cells within the scope of today's development trends are to be electrically contacted for evaluating the measurement data and the connections from

Lead out battery cell. It is advantageous to carry out such contacting of the sensors via the current collectors of the battery cells in order to eliminate the additional expense, i. additional electrical feedthroughs out of the battery cell to keep as low as possible in such battery cells.

If metals with different redox potentials are electrically connected to one another in an electrolyte, the less noble of the two compound partners corrodes due to a redox reaction and dissolves. In lithium-ion battery cells, the anode and cathode current collectors are usually made of copper or aluminum. Sensors in a battery cell, which are electrically contacted via the current collector of the battery cell (anode or cathode) to the outside, contact surfaces made of copper or aluminum so that no local elements can arise at the contact between sensor and current collector. Another way to prevent an otherwise possible redox reaction is to completely protect the transition of two different metals and thus one of the two metals by an encapsulation against the electrolyte. However, there are only a few materials that remain chemically stable in the electrolyte in the long term.

In high performance printed circuit boards, where a lot of thermal energy has to be dissipated, copper or aluminum inlays, which are generally designed as solid metal bodies, can now be used as heat sinks.

Presentation of the invention

According to the invention, a sensor housing is proposed for at least one sensor and / or at least one electronic component, wherein the at least one sensor and / or the at least one electronic component

Component is accommodated in a cavity. It is provided that the cavity is formed in the sensor housing, and the sensor housing is made of a media-resistant fluoropolymeric material, in which from outside the sensor housing contactable contacting surfaces are embedded.

The sensor housing is a printed circuit board housing which is made up of at least two printed circuit board layers, wherein the material from which the printed circuit board layers are made has neutral properties with respect to an electrolyte in a battery cell. One of the printed circuit board layers of the sensor housing comprises an electrical rewiring and at least one of the printed circuit board layers may have through holes. The at least two circuit board layers are interconnected vertically in the circuit board manufacturing process. The electrical contacts of the sensor can be guided by the conductor tracks, which represents the rewiring, on the outside of the sensor housing. The sensor housing is made of fluoropolymer material which is extremely media resistant. As a result, the inventively proposed sensor housing inside a battery cell of a battery module or a battery pack, which serves as a traction battery for a hybrid vehicle or an electric vehicle can be used. The fluoropolymeric materials are preferably polytetrafluoroethylene (PTFE), fluorinated ethylene-propylene (FEP) or polychlorotrifluoroethylene (PCTFE) which have high chemical resistance.

The inventively proposed sensor housing comprises a flexible cover layer, with which the cavity is sealed. The flexible cover layer is also a layer of media-resistant fluoropolymeric material having a thickness of <150 μm, a film or a thin one

PCB core, which also has a thickness <150μηη.

The printed circuit boards or the PCB layers can one

PCB core include. A printed circuit board core is a laminate of copper foil / prebake / copper foil. The two copper foils can already be structured as desired. This means that the copper is already removed in some places. At a prebake, what in the context of

PCB core is covered by the two copper foils, it is, for example, a resin impregnated glass fabric, or a

Glass fabric, which is impregnated with PTFE.

In an advantageous embodiment of the invention

proposed sensor housing is the cavity in which there is at least one sensor, filled with a fluid. The fluid can be

For example, to trade an oil or a gel. By filling the cavity which is closed via the covering layer, the pressure transmission can be optimized and the dynamics increased, so that the performance of the sensor with regard to signal quality and signal quality is considerably improved.

In an advantageous embodiment of the invention

proposed sensor housing includes this at least one Cu conductor track and / or on a mounting surface for the at least one sensor provided on the mounting surface Cu layer. By means of this Cu layer, the adhesion of the sensor to the bottom of the cavity can be simplified.

Apart from at least one sensor, at least one further electronic component may be contained in the cavity of the sensor housing,

For example, an ASIC, which is electrically contacted with the at least one Cu conductor track of the sensor housing. The electrical

Contact surfaces, for example, designed as "Kontaktierungspads", can in the inventively proposed sensor housing at the top or at the bottom, in an intermediate plane of

Sensor housing lying or located on the side surfaces of the sensor housing. In the event that the electrical contacting surfaces should be designed as vias, a sealing of these vias can be carried out, for example, by a further sealing layer which extends on the underside of the sensor housing, so that the cavity in which the at least a sensor and / or the at least one electronic component is located, remains sealed against the environment, such as the aggressive environment within a battery cell sealed. In general, the conductor tracks, which run in a first printed circuit board layer of the printed circuit board, are made of copper. In the case of the sensor housing proposed according to the invention, it is possible to manufacture at least one of the contacts on the outside of the sensor housing made of aluminum, or additionally to coat it with aluminum and any intermediate layers so that a material-like connection with the current collectors on a lithium-ion battery cell can be realized , wherein the current collector of a lithium-ion battery cell are usually made of copper or aluminum.

In a further advantageous embodiment possibility of the sensor housing proposed according to the invention, the electrical

Contact surfaces designed as embedded in a media-resistant fluoropolymeric material inlays, for example, as a Cu inlay and as Al inlay. The Al inlay is coated on at least one surface with Cu and uncoated on a surface, with a transition between the coated and uncoated surfaces being enclosed by the fluoropolymeric material. Instead of of an aluminum inlay, which is provided with a copper layer, it is also possible to use a Cu inlay with a sufficiently thick aluminum coating, for example with a thickness of several hundred μm

Aluminiumwalzplattierung. The aluminum surface in this case represents the contact pad of the sensor housing to the outside.

The inlays exposed on an outside of the sensor housing may be located on the top or the bottom, on an intermediate level thereof or on one side of the sensor housing. If the contact pads on two opposite sides, for example in a vertical arrangement one above the other, can be realized by a clamping (Haltekontaktierung) a simple electrical contact.

In a further advantageous embodiment possibility of the sensor housing proposed according to the invention, this further comprises

Balancing pads located on a smooth side, for example on the underside of the sensor housing. These are typically led out of a copper layer and at the bottom of the second

Printed circuit board layer arranged.

In a further advantageous embodiment of the proposed solution according to the invention can then on the rewiring to the

Circuit board layers are dispensed with, and the at least one sensor electrically connected, for example via wire bonds, directly to the Cu inlay or the Al inlay, if a coating of Cu or Al inlays from one side with a wire bondable coating. As wirebondable

Coating can be used, for example, coatings comprising Ni, Pd and / or Au, which are suitable for the electrical connection of the sensor or the at least one further electronic device installed in the cavity

Component, are beneficial.

Following the solution proposed according to the invention, this also relates to a method for producing a sensor housing, wherein the fluid-tight connection for sealing the cavity is effected by a cover layer, which is connected to the sensor housing by a cohesive joining method, For example, the welding or by a thermal joining (sealing) or by gluing is made. The solution proposed according to the invention also provides for the coatings, in particular the Al or Cu coating, which are applied to the Cu inlays or Al inlays to be electrodeposited thereon or applied by roll-plating.

The inventively proposed sensor housing is suitable in

Advantageously, for installation in a battery cell of a battery module or a battery pack as a traction battery of a hybrid or a

Electric vehicle.

Advantages of the invention

The inventively proposed sensor housing allows the installation of at least one sensor and optionally another electronic component within a battery cell, so that other parameters except voltage and temperature, for example, the pressure prevailing in a battery cell, can be measured. Due to the chosen media-resistant fluoropolymer material, the sensor housing can not be attacked or decomposed by chemical reactions with the electrolyte. In addition, it is possible to use the inventively proposed sensor housing in other areas, such as for sensors that are in

Exhaust line of automobiles are used, or sensors that come in contact with gear oil and salt water and the like aggressive substances.

Due to the flexibility of the material of the cover layer, with which the sensor and / or at least one further electronic component

receiving cavity is closed, the pressure transmission is ensured in the sensor housing with simultaneous shielding of the sensor and its electrical contacts against environmental influences. If the cavity in which at least one sensor is received, filled with a fluid, such as a gel or an oil, the pressure transmission is improved, also sets a better momentum. The design and dimensions of suitable for use in the battery cell interior sensor housing according to the invention are not significantly changed over a standard sensor housing, so that no additional space requirements in the interior of a battery cell or even a modification of the battery cell housing when using the sensor housing proposed according to the invention is required.

Due to the sensor housing proposed according to the invention, a contacting of the contacting surfaces of the sensor housing to the

Pantograph a battery cell without formation of a corrosion element are made. The invention proposed massive

Execution of the contacting surfaces, for example, as a Cu inlay or Al inlay allows a cohesive connection, in particular a welding of the sensor housing with the current collector of the battery cell, so that a soldering process can be bypassed. Since this can be bypassed, corrosion phenomena otherwise occurring due to the different electrochemical potentials can be effectively prevented. The electrical contacting surfaces of the at least one sensor can by printed conductors and / or vias of the circuit board, in particular the first

Circuit board position of at least one sensor and the interior of the cavity on the Cu or the Al inlay are performed. So that the Al-inlay is compatible with both the PCB process (not aluminum in copper electroplating) and the chemical conditions in a battery cell (no metallic copper-aluminum transition in the battery cell).

By inventively proposed sensor housing is a

Receive sensor housing, which can be manufactured with proven and manufacturing technology reliable PCB processes, which in one embodiment, massive copper and aluminum contact surfaces, just those Cu or Al inlays, to the sensor housing electrically without the formation of a corrosion element with the current collector of a battery cell connect. This is preferably done via a cohesive connection.

Brief description of the drawings

With reference to the drawings, the invention will be described in more detail below. It shows:

FIG. 1 shows a schematic representation of the invention

proposed sensor housing,

Figure 2 shows the sensor housing according to Figure 1 with a cavity which is filled with a fluid, Figure 3 shows a schematic way the components of

Sensor housing,

FIG. 4 shows a top view of the first printed circuit board layer defining the cavity.

Figure 5 shows a plan view of the second circuit board layer, i. the

Circuit board with copper tracks and a mounting surface for the at least one sensor, Figure 6 shows a first possible position of electrical

Contacting surfaces in an intermediate plane of the sensor housing,

Figure 7 shows guided to the top of the sensor housing

Kontaktierungspads,

Figure 8 shows lying on the underside of the sensor housing electrical

Kontaktierungspads,

Figure 9 shows on the side surfaces of the sensor housing opening

Kontaktierungspads,

FIG. 10 shows vias with which a Cu conductor in the sensor housing

is contacted,

FIG. 11 shows the plan view of the upper side of the first printed circuit board layer, FIG. 12 shows a region provided with a Cu layer on the upper side of the first printed circuit board layer,

FIG. 13 shows the sensor housing with an AI conductor track and a Cu track,

FIG. 14 shows a sensor housing with an Al-coated Cu conductor track and a Cu track for electrical contacting,

FIG. 15 shows a sensor housing with a Cu inlay and an Al inlay

FIG. 16 shows laterally contactable Cu and Al inlays, FIG.

FIG. 17 shows contactable Cu or at the top of the sensor housing.

Al inlays, FIG. 18 shows contactable Cu or Al inlays on the underside,

FIG. 19 shows an intermediate plane of the sensor housing

Areas of Cu and Al inlays for electrical contacting, Figure 20 shows one another in a vertically oriented mounting position

arranged inlays for producing an electrical

clamping contact,

Figure 21 shows provided on the underside of the sensor housing

Matching contact pads and

Figure 22 shows designed as Cu or Al inlays electrical

Contact surfaces, which are provided with a wire-bondable coating. variants

In the following description of the embodiments of the invention, the same or similar components and elements are denoted by the same or similar reference numerals, wherein a repeated description of these components or elements is dispensed with in individual cases. The figures illustrate the subject matter of the invention only schematically.

FIG. 1 shows a sensor housing 10 which has a cavity 16. In the cavity 16 is a sensor 12, for example, a pressure sensor. Of the

Sensor 12 is connected via a wire bond 14 with a Cu conductor 18. The Cu conductor 18 extends through a second printed circuit board layer 24. In this case, the exact profile of the Cu conductor 18 in the plane of the printed circuit board layer 24 can not be taken from the side view of FIG. The cavity 16 in which the at least one sensor 12 is located, is by a flexible

Cover layer 20 closed. The cavity 16 is closed in a fluid-tight manner by the flexible covering layer 20, and on the other hand delimited by a first printed circuit board layer 22 which extends between the flexible covering layer 20 and the second

PCB layer 24 is located. In this case, the first printed circuit board layer 22 and the second printed circuit board layer 24 form a printed circuit board.

The flexible cover layer 20 is a flexible, thin material with a thickness of <150 μm, which has neutral properties relative to an electrolyte within a battery cell. Due to the flexible cover layer 20, the cavity 16 is sealed fluid-tight and chemically resistant. The

Bonding is preferably carried out by gluing, welding or thermal deposition or other suitable cohesive bonding methods.

Due to the flexibility of the material of the flexible cover layer 20 is a pressure transfer into the cavity 16 while ensuring the

Shielding of the at least one sensor 12 and its electrical

Permanent protection of contacts against environmental influences. For the sake of completeness, it should be mentioned that the second printed circuit board layer 24, ie the part of the printed circuit board which comprises the printed conductors, has an upper side 52 and a lower side 54. FIG. 2 shows a further embodiment of the invention

proposed sensor housing.

The sensor housing 10 shown in FIG. 2 corresponds to the sensor housing 10 already described in connection with FIG

Difference that the cavity 16 is filled with a fluid 26. In the fluid 26 to improve the pressure transfer into the cavity 16, i. into the interior of the sensor housing 10 and the at least one sensor 12, it may be a gel or an oil. The fluid 26, with which the cavity 16 of the

Sensor housing 10 is filled, not only improves the pressure transmission to the at least one sensor 12, but also increases the dynamics of the at least one sensor 12. The design and dimensions for a battery cell internal installation of the sensor housing 10 are not significantly different from a standard sensor housing.

Figure 3 shows an exploded view of the components of the sensor housing.

FIG. 3 shows that the sensor housing 10 is essentially formed by the flexible cover layer 20, the first circuit board layer 22 and the second circuit board layer 24. The second printed circuit board layer 24 has the upper side 52, next to it a lower side 54. At least one Cu printed conductor 18 is embedded in the upper side 52 of the second printed circuit board layer. Together with the first printed circuit board layer 22, the second printed circuit board layer 24 forms the printed circuit board.

FIG. 4 shows in plan view the cavity 16 which is delimited by the circulating first printed circuit board layer 22. The first printed circuit board layer 22 forms a border of the cavity 16.

Figure 5 shows in plan view the top of the circuit board layer of

Sensor housing.

From the top view according to FIG. 5, it can be seen that two copper conductor tracks 18 are embedded in the upper side 52 of the second printed circuit board layer 24.

Dashed is a mounting surface 28 for the at least one sensor 12th indicated. On this mounting surface 28 of at least one sensor 12, for example, a pressure sensor, on the upper side 52 of the second

PCB layer, i. mounted the actual circuit board, preferably glued.

FIG. 6 shows the sensor housing proposed according to the invention with electrical in an intermediate plane of the sensor housing

Contact surfaces (contact pads).

The sensor housing 10 comprises the cavity 16, which through the flexible cover layer 20, the first circuit board layer 22 and the top 52 of the second

Printed circuit board layer 24 is formed. In the interior of the cavity 16, in addition to the at least one sensor 12, there is another electronic component 13, which may, for example, be an ASIC. As can be seen from the illustration according to FIG. 6, at least one Cu conductor track 18 lies in the upper side 52 of the second printed circuit board layer 24

Contact surfaces 30 in the form of contact pads are arranged laterally lying in an intermediate plane 69 of the sensor housing 10. The two contact surfaces 30 designed as contact pads are located in a first position 32 in the intermediate plane 69, laterally pulled out of the sensor housing 10.

FIG. 7 shows a further possible embodiment for the orientation

electrical contact surfaces of the inventively proposed sensor housing.

Also in the embodiment variant of the sensor housing 10 shown in FIG. 7, the cavity 16 is bounded by the flexible cover layer 20, the first printed circuit board layer 22 and the second printed circuit board layer 24. In the cavity 16 are located next to the at least one sensor 12, which may be formed, for example, as a pressure sensor, another electronic component 13 in the form of an ASIC. The at least one sensor 12 is connected to the at least one electronic component 13 via a respective wire bond 14 and the at least one electronic component 13 is in turn connected to the at least one Cu printed conductor 18. This has executed as contact pads Contacting surfaces 30, which are in the embodiment of Figure 7 in a second position 34 on the top of the sensor housing 10 lying electrically contacted. Via vias 40, the contacting surfaces 30 designed as contact pads are connected to the at least one Cu conductor track 18. A sealing of the vias 40 is achieved here by the first printed circuit board layer 22 arranged above it.

FIG. 8 shows a further embodiment of the invention

proposed sensor housing, with contact pads on the underside of the sensor housing.

The sensor housing 10 comprises the cavity 16, which through the cover layer flexible 20, the first circuit board layer 22 and the top 52 of the second

PCB layer 24 is limited. At the top 52 of the second

PCB layer 24 is the at least one Cu conductor 18, via which via wire bonds 14 of the at least one sensor 12 and the at least one electronic component 13 are electrically contacted. In the embodiment variant shown in FIG. 8, the contacting surfaces 30 designed as contact pads extend in a third position 36 in the direction of the lower side 54, the second printed circuit board layer 24 representing the printed circuit board and are again connected via vias 40 to the at least one Cu conductor track 18.

Finally, FIG. 9 shows a further embodiment of the invention

According to the invention proposed sensor housing.

The illustration according to FIG. 9 is a sensor housing 10, in which-analogous to the previous exemplary embodiments according to FIGS. 6, 7 and 8-at least one sensor 12 and an electronic component 13, for example an ASIC, are arranged in the cavity 16 , Via wire bonds 14, the at least one sensor 12, or the at least one electronic component 13, is electrically contacted with the at least one Cu conductor track 18. A Cu conductor 18 according to the embodiment variant of the sensor housing 10 according to FIG. 9 extends in the horizontal direction through the second printed circuit board layer 24 to a side surface of the sensor housing 10, another Cu conductor 18 extends to the other side surface of the sensor housing 10 and can be electrically contacted there in a fourth position 38.

In the embodiment according to FIG. 10, a sensor housing 10 according to the invention is shown, in which vias 40 extend from the at least one Cu conductor track 18, which is embedded in the second printed circuit board layer 24. In the second printed circuit board layer 24 of the sensor housing 10 extend from the at least one Cu trace 18 substantially in the vertical direction vias 40, which are sealed by a seal 42. In the embodiment variant of the sensor housing 10 according to FIG. 10, the vias 40 are closed by the additional seal 42 so that the cavity 16, bounded by the flexible cover layer 20, the first circuit board layer 22 and the second circuit board layer 24 representing the circuit board, are still sealed is.

FIGS. 11 and 12 each show top views of the top side of the first printed circuit board layer of the sensor housing.

FIG. 11 shows that the second printed circuit board layer 24 has a PTFE upper side 44. On the upper side 52 of the second printed circuit board layer 24, the copper printed conductors 18 extend substantially parallel to one another. The mounting surface 28 shown in dashed lines shows the installation location on which the at least one sensor 12, for example a pressure sensor, is preferably glued. FIG. 12 shows that, in this embodiment variant of the sensor housing 10 proposed according to the invention, the mounting surface 28 on the upper side 52 of the second printed circuit board layer 24 is provided with an additional Cu layer 46. The Cu layer 46 may be patterned as a pedel to facilitate bonding of the at least one sensor 12 to the circuit board core, since the media-resistant fluoropolymeric materials have very little

Have surface tension.

FIGS. 13 and 14 show alternative embodiments of the sensor housing proposed according to the invention with interconnects of different types

Materials. For example, in FIG. 13, the sensor housing 10 is shown, which contains the cavity 16. In the cavity 16 is at least one sensor 12 and at least one electronic component 13, which are connected, for example via wire bonds 14 with the at least one Cu conductor track 18. The cavity 16 is bounded by the flexible cover layer 20, the first printed circuit board layer 22 and the second printed circuit board layer 24. At the upper side 52 of the second printed circuit board layer 24, the Cu conductor track 18 extends in an intermediate plane 69 lying outward, while an Al conductor 48, which is also in the

Intermediate plane 69 is located on the other side of the sensor housing 10 extends to the outside. According to an embodiment variant shown in Figure 14, at least one of the contacts on the outside of the sensor housing 10 may be made of aluminum, or in addition with aluminum and any

Intermediate layers are coated, as shown in Figure 14 cf. Reference numeral 50, is shown. In the embodiment according to FIG. 14, the at least one Cu conductor track 18 is provided with an Al coating 50 at a location lying in the intermediate plane 69. Through the embodiments according to Figures 13 and 14, a material-like connection between the as

Contact pads executed contacting surfaces 30 on the outside of the sensor housing 10 on the one hand and the current collector of a lithium-ion battery cell, which in turn are made of copper or aluminum, realized.

According to the embodiment variants shown in FIGS. 13 and 14, the respective cavities 16 of the sensor housing 10 are each sealed by the flexible cover layer 20, the first circuit board layer 22 and the top side 52 of the second circuit board layer 24. They are provided with at least one sensor 12 and at least one additional electronic device Component 13, for example, an ASIC equipped, which via the AI conductor 48 and the Cu conductor 18, or via the at least one Cu conductor 18 and a provided with the Al coating 50 Cu conductor 18 from the outside of the sensor housing 10th can be contacted electrically.

FIG. 15 shows a variant embodiment of the sensor housing 10 proposed according to the invention, in which the cavity 16 is analogous to the above Embodiment variants of the sensor housing 10 by the flexible cover layer 20, the first circuit board layer 22 and in this embodiment is limited by a circuit board core 60 of a circuit board. Within the cavity 16 is the at least one sensor 12, which is electrically connected via the wire bond 14 with the at least one Cu conductor track 18. The at least one Cu conductor 18 in turn contacts a Cu inlay 56 and an Al inlay 58, which in turn is provided with a copper layer 59. The Cu inlay 56 and the Al inlay 58 are open at their lower sides, ie pressed into the media-resistant fluoropolymeric material of the sensor housing 10 and at the

Bottom of the sensor housing 10 electrically contacted. In the embodiment variant of the sensor housing 10 shown in FIG. 15, the Cu inlay 56 and the Al inlay 58 serve as contacting areas 30. As shown in FIG. 15, the Al inlay 58 is provided with the copper layer 59 on at least one surface and at least a surface uncoated. The transition between the coated and the uncoated surface is not open, that is, it is enclosed by the material of the sensor housing 10.

Figures 16, 17, 18 and 19 show different embodiments of the arrangement of electrical contact surfaces, also as

Contact pads called.

The outwardly exposed inlays, ie the Cu inlay 56 and the Al inlay 58, can be electrically contacted laterally on the sensor housing 10 according to FIG. 16 in a fourth position 68, according to FIG. 17 in a second position 64 on the upper side of the sensor housing 10 are electrically contacted, and - as shown in Figure 18 - analogously to the illustration of Figure 15 on the underside of the sensor housing 10 in a third position 66 are electrically contacted. Furthermore, according to the embodiment variant of the sensor housing 10 proposed according to the invention, the inlays recessed in the sensor housing 10, ie the Cu inlay 56 and the Al inlay 58, can be provided with the copper layer 59 in a fourth position 68 , ie lying in an intermediate plane 69 of the sensor housing 10, to contact electrically. All variants of the invention proposed

Sensor housing 10 according to FIGS. 16, 17, 18 and 19 has in common that the cavity 16 is delimited by the flexible cover layer 20, the printed circuit board systems and side surfaces corresponding to the first printed circuit board layer 22. In the embodiment 16 of FIGS. 16, 17, 18 and 19, a sensor 12 is arranged in the cavity 16 and is electrically contacted via the wire bond 14 to the at least one copper printed conductor 18.

FIG. 20 shows a further possible embodiment of the sensor housing proposed according to the invention.

In the embodiment according to FIG. 20, the Cu inlay 56 and the Al inlay 58 provided with the copper layer 59 are in one

superimposed arrangement 70. Both inlays 56, 58 are electrically contacted via the at least one Cu conductor track 18 which extends through the printed circuit board core 60. In the cavity 16 of the sensor housing 10 is the sensor 12, for example, formed as a pressure sensor, which is electrically connected via the wire bond 14 with the at least one Cu conductor 18 in contact. The cavity 16 is closed by the flexible cover layer 20. If contacting of the inlays 70, 58 arranged in superimposed arrangement 70, a simple electrical contact can be realized by a Klemmkontaktierung 76.

FIG. 21 shows a further possible embodiment of the sensor housing proposed according to the invention.

According to the sensor housing 10 shown in FIG. 21, a number of slots are located on the underside 54 of the sensor housing 10

Balancing pads 72. These are each electrically connected to the at least one Cu trace 18 extending through the cavity 16

Connection. In the cavity 16, which is closed by the flexible cover layer 20, there is the at least one sensor 12, which is electrically contacted via the wire bond 14 with the at least one Cu conductor track 18. In this embodiment, the two inlays 56, 58 are separated from each other in a horizontal arrangement within the sensor housing 10 and can from the Outside of the sensor housing 10 are electrically contacted at the positions 68.

Finally, FIG. 22 shows a further embodiment of the sensor housing 10 proposed according to the invention, in which a rewiring in the form of a Cu conductor track 18 can be dispensed with. The prerequisite for this is that both the Cu inlay 56 and the Al inlay 58, which are embedded in the core 60, are provided with a wire-bondable coating 74. The wire-bondable coating 74 is in particular a

Coating of Ni, Pd or Au. As FIG. 22 shows, the

Wire bonds 14 of at least one sensor 12 are connected directly to the Cu inlay 56 and the Al inlay 58. In this case, the copper coating of the Al inlay 58, cf. Reference numerals 59 in FIG. 19 are dispensed with.

In a manufacturing process, the copper layers, i. the rewiring in the form of at least one Cu conductor track 18, the second circuit board layer 24 structured such as they are necessary for the electrical connection of the at least one sensor 12. The first circuit board layer 22 has a thickness which corresponds at least to the thickness of the at least one sensor 12 and is patterned, for example by milling or lasering, to obtain through holes whose lateral dimensions are greater than the dimensions of the sensor 12 and possible contacting surfaces for are the same. Subsequently, both layers, i. the first circuit board layer 22 and the second

PCB layer 24, connected by compression under pressure and temperature input, so that by the one-sided locking the

Through holes in the second circuit board layer 24 cavities arise. in the

Subsequent step, the at least one sensor 12 can be placed in the resulting cavity 16 and electrically connected to the second circuit board layer 24. As a last step, the cavity 16 is closed by the flexible cover layer 20, for example in the form of a film, which takes place by pressing under the action of temperature, by welding or by gluing.

The invention is not limited to the embodiments described herein and the aspects highlighted therein. Rather, within the by the Claims specified range a variety of modifications possible, which are within the scope of expert action.

Claims

claims

1. sensor housing (10) for at least one sensor (12) and / or

at least one electronic component (13), wherein the at least one sensor (12) and / or the at least one electronic

Component (13) in a cavity (16) is received, which is formed in the sensor housing (10), characterized in that the sensor housing (10) is made of a media-resistant fluoropolymeric material, in which contactable from outside the sensor housing (10) Contact surfaces (30, 56, 58) are embedded.

2. sensor housing (10) according to claim 1, characterized in that the media-resistant fluoropolymeric material polytetrafluoroethylene (PTFE), fluorinated ethylene-propylene (FEP) or

Polychlorotrifluorethylene (PCTFE) is.

3. sensor housing (10) according to one of the preceding claims, characterized in that the media-resistant fluoropolymeric material has neutral properties with respect to an electrolyte in a battery cell.

4. sensor housing (10) according to one of the preceding claims, characterized in that the cavity (16) by a flexible cover layer (20) of <150 μηη thickness, a film or a thin circuit board core having a thickness of <150 μηη fluid-tightly closed.

5. Sensor housing (10) according to one of the preceding claims, characterized in that the cavity (16) is filled with a fluid (26).

6. Sensor housing (10) according to one of the preceding claims, characterized in that the sensor housing (10) at least a Cu conductor track (18) and / or on a mounting surface (28) for the at least one sensor (12) or the at least one

electronic component (13) is provided a Cu layer (46).

Sensor housing (10) according to claim 6, characterized in that in the cavity (16) in addition to the at least one sensor (12) at least one further electronic component (13) is included, which electrically contacted with the at least one Cu conductor track (18) is.

Sensor housing (10) according to one of the preceding claims, characterized in that from outside the sensor housing (10) electrically contactable Kontaktlerungsflächen (30; 56, 58) in a first position (32, 62) in an intermediate plane (69), or in a second position (34, 64) on the upper side or in a third position (36, 66) on the underside, or in a fourth position (38, 68) laterally on the sensor housing (10) are executed.

Sensor housing (10) according to one of the preceding claims, characterized in that the Kontaktlerungsflächen (30) are designed as vias (40) on an underside (54) of the sensor housing (10) by an additional seal (42) or by a via These lying second circuit board layer (24) are sealed fluid-tight.

Sensor housing (10) according to one of the preceding claims, characterized in that one of the electrically contactable Kontaktlerungsflächen (30; 56, 58) as AI conductor track (48) or as Cu- conductor track (18) with an Al coating (50) is.

Sensor housing (10) according to one of the preceding claims, characterized in that the contact surfaces (30) are designed as embedded in the media-resistant fluoropolymer polymeric Cu inlay (56) and Al inlay (58), the Al inlay (58) on at least one surface portion has a Cu coating (59) and is uncoated on another surface portion and a transition between the coated and uncoated surface portions is enclosed by the fluoropolymeric material, or the contact surfaces (30) are configured as two Cu inlays (56). Sensor housing (10) according to claim 11, characterized in that instead of the Al inlay (58) with Cu coating (59), a Cu inlay (56) with Al coating is used, wherein the Al coating has a contacting surface ( 30).

Sensor housing (10) according to one of the preceding claims, characterized in that when superimposed arrangement (70) of the contacting surfaces (56, 58) a Klemmkontaktierung (76) is realized.

Sensor housing (10) according to one of the preceding claims, characterized in that the sensor housing (10) additional adjustment Kontaktierungspads (72) for the at least one sensor (12) and / or the at least one electronic component (13).

Sensor housing (10) according to one of the preceding claims, characterized in that the contacting surfaces (30) of the Cu inlay (56) comprise a wire-bondable coating (74) comprising Ni, Pd and / or Au and the at least one sensor (12) and / or the at least one electronic component (13) via a

Wire bond (14) is contacted directly with the at least one contacting surface (30).

A method for producing a sensor housing (10) according to any one of claims 1 to 15, characterized in that a fluidly sealed connection of a flexible cover layer (20) with the sensor housing (10) by a cohesive joining method, by thermal joining, by sealing or gluing takes place and a Cu coating (59) of an Al inlay (58) or an Al coating of a Cu inlay (56) is applied by electroplating or by roll cladding.

Use of the sensor housing (10) according to one of claims 1 to 15 in a battery cell of a battery module or a

Battery pack as a traction battery of a hybrid vehicle or an electric vehicle.