WO2016068166A1 - エンボスフィルム、枚葉フィルム、転写物、およびエンボスフィルムの製造方法 - Google Patents

エンボスフィルム、枚葉フィルム、転写物、およびエンボスフィルムの製造方法 Download PDF

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Publication number
WO2016068166A1
WO2016068166A1 PCT/JP2015/080331 JP2015080331W WO2016068166A1 WO 2016068166 A1 WO2016068166 A1 WO 2016068166A1 JP 2015080331 W JP2015080331 W JP 2015080331W WO 2016068166 A1 WO2016068166 A1 WO 2016068166A1
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WO
WIPO (PCT)
Prior art keywords
film
recesses
embossed
embossed film
master
Prior art date
Application number
PCT/JP2015/080331
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
穣 村本
正尚 菊池
Original Assignee
デクセリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015209376A external-priority patent/JP6967832B2/ja
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to KR1020227013960A priority Critical patent/KR20220060555A/ko
Priority to US15/523,182 priority patent/US10245780B2/en
Priority to KR1020177006077A priority patent/KR20170038913A/ko
Priority to KR1020187030061A priority patent/KR20180117209A/ko
Priority to CN201580055670.6A priority patent/CN107073806B/zh
Publication of WO2016068166A1 publication Critical patent/WO2016068166A1/ja
Priority to US16/288,430 priority patent/US10890844B2/en
Priority to US17/144,670 priority patent/US11543746B2/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B29C59/046—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts for layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2252/00—Sheets
    • B05D2252/02—Sheets of indefinite length
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/10—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation for articles of indefinite length
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/16—Fillers

Definitions

  • the present invention relates to an embossed film, a sheet-fed film, a transfer product, and a method for producing the embossed film.
  • Examples of a method for producing such an embossed film include a method of forming a concavo-convex structure on a sheet-like transfer film using a stamper master.
  • a stamper master is prepared by forming a stamper master having an inverted shape of the concavo-convex structure formed on the film on the surface (transfer surface) of a flat substrate, and pressing the stamper master against the film to be transferred.
  • the shape of the transfer surface is transferred to the transfer film.
  • Patent Document 1 discloses a method for producing a film having a moth-eye structure having a period of less than or equal to a visible light wavelength by a roll-to-roll method using a cylindrical or columnar master.
  • the technique disclosed in Patent Document 1 is intended to form a concavo-convex structure (for example, 1 ⁇ m or less) formed with a period equal to or less than the visible light wavelength, it does not contribute to solving the above problem. It was.
  • the present invention has been made in view of the above problems, and the object of the present invention is to provide a new and improved embossed film, which has a lower frequency of recesses in the transferred film, and the embossed film. It is in providing the cut sheet
  • a film main body and a plurality of concave portions formed on the surface of the film main body are provided, and the diameter of the opening surface of the concave portion is a visible light wavelength.
  • the arrangement pattern of the recesses has a periodicity along the length direction of the film body, the defect rate of the recesses at one end of the film body, and the other end of the film body
  • An embossed film having a difference from the defect rate of the recesses of 10 ppm or less is provided.
  • the defect rate of the recesses may be calculated based on the recesses in the region corresponding to the same array pattern in one cycle of the array pattern.
  • the film body may be a long film.
  • the recesses formed in the film body may have substantially the same shape.
  • the array pattern of the recesses may be a lattice shape.
  • the number density of the recesses may be 50000000 / cm 2 or less.
  • the film body may include a coating layer made of an inorganic compound on at least a part of the surface including the inside of the recess.
  • the film body may be formed of a curable resin or a plastic resin.
  • a single-wafer film formed by cutting the embossed film described above into a plurality of sheets.
  • a fine solid is transferred to a position corresponding to the arrangement pattern using the embossed film or the single-wafer film described above.
  • a transcript is also provided.
  • a step of forming a plurality of convex portions on a peripheral surface of a cylindrical or columnar master, and the master with respect to the film to be transferred A step of transferring a recess corresponding to the shape of the peripheral surface of the master to the film to be transferred to produce a film body, and the diameter of the opening surface of the recess is greater than the wavelength of visible light.
  • the embossed film manufacturing method is provided, wherein the difference between the defect rate of the recesses at one end of the film body and the defect rate of the recesses at the other end of the film body is 10 ppm or less. .
  • the defect rate of the concave portion at one end portion of the film is formed in the film, the defect rate of the concave portion at one end portion of the film, and the other end portion. It is possible to reduce the difference from the defect rate of the recesses. Therefore, even when the embossed film is formed in a large area, it is possible to reduce the defect frequency of the recesses.
  • FIG. 1 is a cross-sectional view schematically showing a cross-sectional shape when the embossed film 1 according to the present embodiment is cut in the thickness direction.
  • the embossed film 1 includes a film body 10 and a plurality of protrusions 11 and recesses 13 formed on the surface of the film body 10.
  • the laminated structure of the embossed film 1 is not limited to the structure shown in FIG.
  • the embossed film 1 may be formed as a laminated body in which a plurality of resin layers are laminated.
  • the embossed film 1 may have a structure in which a support body (not shown) formed of a resin or the like is laminated on the surface opposite to the surface on which the convex portions 11 and the concave portions 13 of the film body 10 are formed.
  • the support may be formed of any resin, but may be formed of, for example, a PET (polyethylene terephthalate) resin.
  • the film body 10 is formed of a curable or plastic resin. Any known resin can be used for the film body 10 as long as it is a curable or plastic resin. Specifically, the film body 10 may be formed of a photocurable resin or a thermosetting resin that is a curable resin, or a thermoplastic resin that is a plastic resin (more specifically, a crystal that melts by heat. Resin). The curable or plastic resin may be mixed with other film forming materials.
  • the film main body 10 is formed of a thermoplastic resin
  • the cylindrical main body or the columnar master is pressed to form the uneven structure formed on the surface of the master. 10 can be transferred.
  • the film body 10 is formed of a photocurable resin
  • the photocurable resin is applied to the support, and the photocurable resin is cured by irradiating light while pressing the cylindrical or columnar master.
  • the concavo-convex structure formed on the surface of the master can be transferred to the film body 10.
  • the thickness of the film body 10 is not particularly limited, but may be, for example, 8 ⁇ m or more and 200 ⁇ m or less. Moreover, when the embossed film 1 is formed as a laminated body of a support body and the film main body 10, the thickness of the whole embossed film 1 is not specifically limited, For example, 10 micrometers or more and 300 micrometers or less may be sufficient. In such a case, the thickness of only the film main body 10 may be 1 ⁇ m or more and 50 ⁇ m or less, and the thickness of only the support may be 9 ⁇ m or more and 250 ⁇ m or less.
  • the convex portion 11 and the concave portion 13 are concavo-convex structures formed on the film body 10.
  • the planes and cross-sectional shapes of the projections 11 and the recesses 13 are arbitrary, but the size of the plane shapes of the projections 11 and the recesses 13 are formed to be larger than the visible light wavelength.
  • the recess 13 is formed so that the diameter of the opening surface is larger than the visible light wavelength.
  • the recessed part 13 is formed so that the diameter of the circumscribed circle of the shape of an opening surface may become larger than visible light wavelength.
  • the recess 13 may be formed such that the length of one side of the opening surface is longer than the visible light wavelength.
  • the recess 13 may be formed so that the diameter of the opening surface is 0.8 ⁇ m or more and 500 ⁇ m or less, preferably 1.0 ⁇ m or more and 300 ⁇ m or less, Preferably, it may be formed to be larger than 1.6 ⁇ m and smaller than 300 ⁇ m. That is, the diameter of the opening surface of the recess 13 is preferably 0.8 ⁇ m or more, more preferably 1.0 ⁇ m or more, and further preferably larger than 1.6 ⁇ m. The diameter of the opening surface of the recess 13 is preferably 500 ⁇ m or less, more preferably 300 ⁇ m or less, and even more preferably less than 300 ⁇ m.
  • the shape of the opening surface of the recess 13 may be any shape as described above.
  • the shape of the opening surface of the recess 13 may be a circle, an ellipse, a rectangle, and a polygon.
  • the shape of the opening surface of the recessed part 13 may be a shape partially including a curve. Note that the area of the opening surface of the recess 13 may not be constant as long as the diameter of the opening surface satisfies the above conditions.
  • the depth of the recess 13 may be, for example, 0.08 ⁇ m or more and 30 ⁇ m or less, and preferably 15 ⁇ m or less.
  • the aspect ratio of the recess 13 may be 0.1 or more and 10 or less.
  • the aspect ratio of the recess 13 was defined as a ratio obtained by dividing the depth of the recess 13 by the minimum diameter or the length of the minimum side of the opening surface of the recess 13.
  • the depth of the recess 13 exceeds 30 ⁇ m or the aspect ratio of the recess 13 exceeds 10, it is not preferable because the formation of the recess 13 becomes difficult. Moreover, when the depth of the recessed part 13 is less than 0.08 ⁇ m, or the aspect ratio of the recessed part 13 is less than 0.1, the effect of embossing the film body 10 is lowered, which is not preferable.
  • the depth of the recess 13 does not exceed the thickness of the film main body 10.
  • the depth of the concave portion 13 may exceed the thickness of the film main body 10 (that is, the concave portion 13 is formed of the film main body 10. May be formed).
  • the cross-sectional shape of the recess 13 is preferably substantially the same for the film body 10 having the same opening shape and depth.
  • the shape of the opening surface of the recess 13 is preferably substantially the same over the entire film body 10.
  • a coating layer may be provided on at least a part of the surface of the film body 10 on which the convex portions 11 and the concave portions 13 are formed. Specifically, a coating layer may be provided on all of the top surface of the projection 11 of the film body 10, the side wall and the bottom surface of the recess 13, and the coating layer is provided on a part of the side wall and bottom surface of the recess 13 of the film body 10. It may be provided. However, the thickness of the coating layer may be substantially constant over the entire surface regardless of the shape of the recess 13.
  • the coating layer may be, for example, a layer made of an inorganic compound or a layer made of an organic compound such as a surface modifier.
  • a coating layer is a layer which consists of organic compounds
  • the material of a coating layer differs from the material of the film main body 10 in which the recessed part 13 is formed.
  • the coating layer has a thickness that can be recognized as being deposited on a part of the concave portion 13.
  • the volume of the deposited coating layer is the entire space of the concave portion 13. It is preferably 30% by volume or less of the product.
  • the surface state of the embossed film 1 can be further stabilized.
  • the coating layer may be formed so as to incline the wall surface of the recess 13. In such a case, the transfer of the filler filled in the concave portion 13 can be facilitated in a usage example described later.
  • FIG. 2 is a top view showing an example of an arrangement pattern of the recesses 13 of the embossed film 1 according to the present embodiment.
  • FIG. 3 is a schematic view showing an example of a cylindrical master for forming the recess 13 of the embossed film 1 shown in FIG.
  • the film body 10 is, for example, a long film.
  • the lower limit of the length of the film body 10 may be any of 5 m, 10 m, 30 m, 50 m, 100 m, 200 m, 300 m, and 500 m.
  • variety of the film main body 10 is not specifically limited, For example, they are 0.05 cm or more and 300 cm or less.
  • the arrangement pattern of the recesses 13 formed in the film body 10 has a periodicity along the length direction of the film body 10. This is because, in the embossed film 1 according to the present embodiment, the convex portion 11 and the concave portion 13 are formed by pressing a cylindrical or columnar master on the film body 10 in a roll-to-roll manner. Therefore, the embossed film 1 is formed with the convex portions 11 and the concave portions 13 in an array pattern having at least a periodicity corresponding to one round of a cylindrical or columnar master.
  • FIG. 3 shows an example of a cylindrical master 4 for forming the recess 13 of the embossed film 1 shown in FIG.
  • a concavo-convex structure 41 corresponding to the convex portion 11 and the concave portion 13 shown in FIG. 2 is formed on the outer peripheral surface of the cylindrical master 4.
  • the A direction in the uneven structure 41 formed on the outer peripheral surface of the cylindrical master 4 is the width direction in the embossed film 1
  • the B direction in the uneven structure 41 is the length direction in the embossed film 1.
  • the concavo-convex structure 41 may be an array pattern having a periodicity such as a hexagonal lattice, or an arbitrary array pattern having no periodicity.
  • the cylindrical master 4 presses the film body 10 while rotating to transfer the concavo-convex structure 41 to the film body 10, the arrangement pattern of the protrusions 11 and the recesses 13 formed on the embossed film 1 is cylindrical. It must have a periodicity corresponding to one round of the master 4 of the shape.
  • the arrangement pattern of the recesses 13 formed in the film body 10 may have periodicity along a direction orthogonal to the length direction of the film body 10 (that is, the width direction of the film body 10). That is, the concave portion 13 having the same shape may be repeatedly formed along the width direction of the film body 10. Further, the arrangement pattern of the recesses 13 may have the same repetition period in both the length direction and the width direction of the film body 10. This is because when the formed embossed film 1 is cut to form a single sheet film, substantially the same film can be obtained in both the length direction and the width direction.
  • the defective portion 15 represents, for example, a portion in which the concave portion 13 is not formed at a position where the concave portion 13 should be formed in the transferred arrangement pattern.
  • Such a defect 15 is caused by wear of the convex structure or clogging of the resin into the concave structure due to continuous use of the pattern master. Therefore, the defect portion 15 tends to increase cumulatively as the concavo-convex structure is transferred to the film body 10 having a larger area.
  • the difference between the defect rate of the recess 13 at one end of the film body 10 and the defect rate of the recess 13 at the other end of the film body 10 is 10 ppm or less.
  • the defect rate represents the ratio of the defect part 15 to all the recesses 13 in a predetermined region.
  • the lower limit of the difference between the defect rate of the recess 13 at one end of the film body 10 and the defect rate of the recess 13 at the other end of the film body 10 is not particularly limited, but it is preferably as small as possible. Needless to say, 0 is most preferable.
  • the defect rate of the recess 13 in the region F that is one end of the film body 10 and the other of the film body 10 The difference from the defect rate of the recess 13 in the region R which is the end of the region is 10 ppm or less.
  • the regions F and R have the recesses 13 having the same arrangement pattern in one cycle of the arrangement pattern.
  • the formed area is selected. That is, the defect rate of the recesses 13 formed in the film body 10 is compared between regions having the same arrangement pattern of the recesses 13.
  • the number of continuous defects 15 in the range of 10 cm 2 of the film body 10 can be 10 or less, preferably 5 or less.
  • deletion part 15 represents that the adjacent recessed part 13 is not pattern-formed, but is the defect
  • deletion parts 15 in the range of 10 cm ⁇ 2 > of the film main body 10 is although it does not specifically limit, Needless to say, it is so preferable that there are few and 0 is the most preferable.
  • the arrangement pattern of the recesses 13 is not particularly limited, and may be an arbitrary arrangement pattern.
  • the number density of the recesses 13 is preferably 50000000 / cm 2 or less.
  • the lower limit of the number density of the recesses 13 is not particularly limited, but may be, for example, 100 pieces / cm 2 or more.
  • the interval between the recesses 13 (that is, the pitch of the recesses 13 of the arrangement pattern) may be, for example, 0.5 ⁇ m or more and 1000 ⁇ m or less.
  • the interval between the recesses 13 refers to the distance between the centers of the opening surfaces of the adjacent recesses 13.
  • the shape and arrangement pattern of the opening surface of the recess 13 various shapes can be exemplified, and as an example, a lattice shape such as a tetragonal lattice, an orthorhombic lattice, a hexagonal lattice, a parallel lattice, and the like can be exemplified.
  • the shape of the opening surface of the recess 13 may be circular, rectangular, or a shape including a curve.
  • the arrangement pattern of the recesses 13 may be an arbitrary arrangement pattern as long as it has periodicity. For example, a plurality of arrangement patterns may be mixed. When a plurality of arrangement patterns are mixed, the number density of the depressions 13 is preferably 50000000 / cm 2 or less in the total of the depressions 13 of each arrangement pattern.
  • a convex portion 11 having the shape and arrangement pattern of the concave portion 13 described above can be formed. That is, it is also possible to form the convex portion 11 having the inverted shape of the arrangement pattern of the concave portions 13 described above.
  • the convex portion 11 is formed in a lattice shape such as a square lattice, an oblique lattice, a hexagonal lattice, a parallel lattice, or the like. It can also be formed. In such a case, it is preferable to calculate the defect rate described later using the presence or absence of the defect of the convex portion 11.
  • the embossed film 1 may have seams or seams derived from the pattern master. This is because such a seam or seam has a small influence on the embossed film 1 if it is in a minute range. For example, if such a joint or seam is a line formed by interspersed with concave or convex portions having a size equal to or smaller than the visible light wavelength, the influence on the embossed film 1 can be reduced. . In addition, when the embossed film 1 is a long film, such a joint or seam can be used for specifying coordinates in the embossed film 1.
  • the embossed film 1 according to this embodiment has a difference between the defect rate of the recess 13 at one end of the film body 10 and the defect rate of the recess 13 at the other end of the film body 10. 10 ppm or less. That is, the embossed film 1 according to the present embodiment has little damage to the convex structure or the concave structure when the cylindrical or columnar master is continuously used for transfer. Therefore, even when the recessed part 13 is formed with respect to the large film main body 10, the cumulative increase amount of the defect
  • the embossed film 1 according to the present embodiment can improve the uniformity of the concavo-convex structure in the large-area film main body 10 and can reduce the occurrence frequency of the defect portions 15.
  • embossed film 1 according to the present embodiment and a multi-layered sheet film produced by cutting the embossed film 1 are also included in the scope of the present invention.
  • FIG. 4 is an explanatory diagram for explaining one use example of the embossed film 1 according to the present embodiment.
  • the embossed film 1 according to the present embodiment can be used as a transfer film when fine solids such as fillers are arranged on a resin sheet or the like in a predetermined arrangement pattern.
  • the recess 13 of the embossed film 1 is filled with a filler 20.
  • the filler 20 can be transferred to the transfer sheet 30 side by pressing the surface of the embossed film 1 filled with the filler 20 against the transfer sheet 30.
  • the fine filler can be easily arranged on the surface of the transfer sheet 30 according to the arrangement pattern of the recesses 13 formed in the embossed film 1.
  • distributing the filler 20 on the embossed film 1, for example. Etc. can be used.
  • the size of the weave or stitch of the fibrous body used for the wipe is preferably smaller than the diameter of the filler 20.
  • the filler 20 filled in the concave portion 13 of the embossed film 1 includes an inorganic material, an organic material, an inorganic material having a multi-layer structure, and a mixture of an inorganic material and an organic material (for example, a fine solid material made of an organic material coated with an inorganic material. ) Etc. can be used.
  • the filler 20 may be a pigment, a dye, or the like.
  • the specific gravity (based on water) of the filler 20 may be, for example, 0.8 or more and 23 or less.
  • the filler 20 may be provided with various physical properties or functionality.
  • the shape of the filler 20 may be any shape, but is preferably a shape having a substantially isotropic property or a shape in which a crystalline substance is crushed.
  • the filler 20 may have any size as long as it can be filled in the recess 13 of the embossed film 1. However, it is preferable that the maximum length of the line segment connecting any two points on the contour line of the filler 20 is not more than the minimum length of the line segment connecting any two points on the contour line of the opening surface of the recess 13.
  • the concave portion 13 of the embossed film 1 may not be filled with the same filler 20.
  • a plurality of types of fillers 20 having different shapes or materials may be filled in the recesses 13 of the embossed film 1.
  • a plurality of types of fillers 20 can be simultaneously arranged on the surface of the transfer sheet 30.
  • a coating layer made of an inorganic compound or the like may be formed on a part of the surface of the convex portion 11 and the concave portion 13 of the embossed film 1.
  • the coating layer is formed on a part of the surface of the convex portion 11 and the concave portion 13, the releasability between the concave portion 13 of the embossed film 1 and the filler 20 can be improved. Transferability can be improved.
  • FIG. 5A and FIG. 5B show a transfer sheet 30 which is a transfer product thus produced.
  • FIG. 5A is a cross-sectional view schematically showing a cross-sectional shape when a transfer product using the embossed film 1 according to the present embodiment is cut in the thickness direction
  • FIG. 5B is an embossed film 1 according to the present embodiment.
  • the material of the transfer sheet 30 is not particularly limited, but is preferably an adhesive sheet, for example.
  • the transfer sheet 30 has adhesiveness, the transferability of the filler 20 filled in the embossed film 1 can be improved.
  • the transfer rate of the filler 20 to the transfer sheet 30 may be 99.99% or more (that is, the defect rate is 100 ppm or less). it can.
  • the transfer rate is the number of the concave portions 13 formed in the embossed film 1 (including the defective portions 15 in which the concave portions 13 are not actually formed) as the number of fillers 20 transferred to the surface of the transfer sheet 30. Indicates the division ratio.
  • the usage example of the embossed film 1 according to the present embodiment has been described.
  • the usage example of the embossed film 1 which concerns on this embodiment is not limited to said illustration.
  • the embossed film 1 according to the present embodiment can be used as a known heat insulating or heat dissipating material, matte film, anti-sticking film or the like as an example of use of the embossed film.
  • the embossed film 1 according to this embodiment can be used for printed electronics.
  • the filler 20 transferred using the embossed film 1 according to the present embodiment can be used for surface modification (eg, glazing) of a vehicle, for example.
  • the use of the filler 20 transferred using the embossed film 1 according to the present embodiment and the transfer target including the transferred filler 20 is not particularly limited.
  • the transferred filler 20 and the transferred object including the transferred filler 20 are not limited to the above fields, and can be used as a functional film (or a functional device).
  • the transferred filler 20 and the transferred material including the transferred filler 20 may be used in the medical, bio, health care, and life science fields as a biosensor or a diagnostic device. May be used as
  • the transferred filler 20 and the transferred object including the transferred filler 20 may be used in a battery or energy-related field or an in-vehicle related field (that is, an automotive related field).
  • the embossed film 1 according to the present embodiment may be used to transfer the filler 20 to another film, and the other film having the filler 20 transferred may be further laminated to another film.
  • the case where a part or the whole of the filler 20 is provided at a predetermined position of another film by repeating transfer and lamination is also included in the scope of the present invention.
  • a transfer layer 62 (corresponding to the film body 10) made of a photocurable resin is applied to a base material 61 that is a support, and the master 4 is pressed against the transfer layer 62. It can be produced by forming the recess 13 in the transfer layer 62.
  • the master 4 transferred to the embossed film 1 according to the present embodiment can form an uneven structure 41 having an arbitrary arrangement pattern by using, for example, an exposure apparatus 7 shown in FIG.
  • the master 4 having a resist layer formed on the outer peripheral surface is irradiated with laser light by the exposure device 7 to expose the resist layer at a position corresponding to an arbitrary arrangement pattern.
  • the concave / convex structure 41 having an arbitrary arrangement pattern is formed on the master 4 by performing etching or the like on the master 4 on which the resist pattern corresponding to the arbitrary arrangement pattern is formed. Can be formed.
  • FIG. 6 is an explanatory diagram showing the configuration of the exposure apparatus 7 that draws an arbitrary pattern on the master 4 used in the present embodiment.
  • the exposure apparatus 7 includes a laser light source 71, a first mirror 73, a photodiode (PD) 74, a condensing lens 76, and an electro-optic deflector (Electro Optical Defect: EOD). ) 79, a collimator lens 78, a control mechanism 87, a second mirror 81, a moving optical table 82, a spindle motor 85, and a turntable 86.
  • the master 4 is placed on the turntable 86 and can rotate.
  • the laser light source 71 is, for example, a semiconductor laser.
  • the laser light source 71 may be a blue semiconductor laser that emits a laser beam having a blue light wavelength of 400 nm to 500 nm.
  • the spot diameter (diameter) of the laser light 70 emitted from the laser light source 71 may be about 200 nm, for example.
  • the laser light 70 emitted from the laser light source 71 travels straight as a parallel beam and is reflected by the first mirror 73. Further, the laser beam 70 reflected by the first mirror 73 is condensed by the condensing lens 76 onto the electro-optic deflection element 79 and then converted into a parallel beam by the collimator lens 78 again. The parallel laser beam 70 is reflected by the second mirror 81 and guided horizontally and parallel onto the moving optical table 82.
  • the first mirror 73 is composed of a polarization beam splitter, and has a function of reflecting one of the polarization components and transmitting the other of the polarization components.
  • the polarized light component transmitted through the first mirror 73 is received by the photodiode 74 and subjected to photoelectric conversion.
  • the light reception signal photoelectrically converted by the photodiode 74 is input to the laser light source 71, and the laser light source 71 modulates the laser light 70 based on the input light reception signal.
  • the electro-optic deflection element 79 is an element that can control the irradiation position of the laser beam 70.
  • the exposure apparatus 7 can also change the irradiation position of the laser beam 70 guided onto the moving optical table 82 by the electro-optic deflection element 79.
  • the control mechanism 87 includes a formatter 89 and a driver 88, and controls the irradiation of the laser light 70.
  • the formatter 89 generates a control signal for irradiating the master 4 with the laser light 70 based on an input image on which an arbitrary pattern to be drawn on the master 4 is drawn. Specifically, first, the formatter 89 acquires an input image on which an arbitrary pattern to be drawn on the master 4 is drawn. The input image is an image corresponding to a developed view of the outer peripheral surface of the master 4 that is cut out in the axial direction and extended to one plane. Next, the formatter 89 divides the input image into small areas of a predetermined size (for example, in a grid pattern), and determines whether each small area includes a drawing pattern.
  • a predetermined size for example, in a grid pattern
  • the formatter 89 generates a control signal for controlling to irradiate the laser light 70 to each small area determined to include the drawing pattern. Further, the driver 88 controls the output of the laser light source 71 based on the control signal generated by the formatter 89. Thereby, irradiation of the laser beam 70 to the master 4 is controlled.
  • the moving optical table 82 includes a beam expander (BEX) 83 and an objective lens 84.
  • BEX beam expander
  • the laser beam 70 guided to the moving optical table 82 is shaped into a desired beam shape by the beam expander 83 and then irradiated to the outer peripheral surface of the master 4 through the objective lens 84.
  • drawing is performed on the master 4 by rotating the master 4 at a constant speed on the turntable 86 and irradiating the laser beam 70 while scanning at a constant speed in the axial direction of the master 4.
  • the scanning of the laser beam 70 is performed by moving the laser beam 70 in the arrow S direction at a constant speed by the moving optical table 82.
  • the master 4 can form the concavo-convex structure 41 having an arbitrary arrangement pattern by using other methods.
  • the master 4 can form the concavo-convex structure 41 having an arbitrary arrangement pattern on the outer peripheral surface by using ultra-precise cutting with a single crystal diamond tool.
  • FIG. 7 is an explanatory view showing a configuration of a transfer device for producing the embossed film 1 according to the present embodiment.
  • the transfer device 6 includes a master 4, a base material supply roll 51, a winding roll 52, guide rolls 53 and 54, a nip roll 55, a peeling roll 56, a coating apparatus 57, A light source 58.
  • the master 4 is a cylindrical or columnar master in which an uneven structure 41 having an arbitrary arrangement pattern is formed on the outer peripheral surface.
  • the material of the master 4 is not particularly limited, and quartz glass (SiO 2 ) such as fused quartz glass or synthetic quartz glass, stainless steel, or the like can be used.
  • the size of the master 4 is not particularly limited.
  • the axial length may be 100 mm or more
  • the outer diameter may be 50 mm or more and 300 mm or less
  • the thickness is 2 mm or more and 50 mm. It may be the following.
  • a concavo-convex structure 41 is formed, which is an inverted shape of the convex portions 11 and the concave portions 13 formed on the embossed film 1.
  • the uneven structure 41 formed on the outer peripheral surface of the master 4 may have an arbitrary shape.
  • a seam or a seam at the time of production may be formed on the outer peripheral surface of the master 4. Such a seam or seam has a small influence on the embossed film 1 as long as it is in a minute range, and can be used as a mark for specifying coordinates in the embossed film 1.
  • the base material supply roll 51 is a roll in which a base material 61 that is a sheet-like support is wound in a roll shape, and the take-up roll 52 winds the embossed film 1 with the concavo-convex structure 41 transferred to the transfer layer 62. It is a roll to take. Further, the guide rolls 53 and 54 are rolls for transporting the base material 61.
  • the nip roll 55 is a roll that presses the substrate 61 on which the transfer layer 62 is laminated against the master 4, and the peeling roll 56 has the concavo-convex structure 41 transferred after the concavo-convex structure 41 is transferred to the transfer layer 62. It is a roll for peeling the embossed film 1 (that is, the base material 61 on which the transfer layer 62 is laminated) from the master 4.
  • the coating device 57 includes coating means such as a coater, and applies the photocurable resin composition to the substrate 61 to form the transfer layer 62.
  • the coating device 57 may be, for example, a gravure coater, a wire bar coater, or a die coater.
  • the light source 58 is a light source that emits light having a wavelength capable of curing the photocurable resin composition, and may be, for example, an ultraviolet lamp.
  • the light irradiation angle may be inclined from the vertical direction of the transfer layer 62. In such a case, a difference occurs in the curing rate of the surface of the concavo-convex structure formed in the transfer layer 62, and it partially cures, so that the transfer rate of the embossed film 1 can be improved.
  • the photo-curable resin composition is a resin that is hardened due to a decrease in fluidity when irradiated with light having a predetermined wavelength.
  • the photocurable resin composition may be an ultraviolet curable resin such as an acrylic resin.
  • the photocurable resin composition may contain an initiator, a filler, a functional additive, a solvent, an inorganic material, a pigment, an antistatic agent, a sensitizing dye, or the like, if necessary.
  • the base material 61 is continuously sent from the base material supply roll 51 through the guide roll 53.
  • the photocurable resin composition is applied to the delivered base material 61 by the coating device 57, and the transfer layer 62 is laminated on the base material 61.
  • the substrate 61 on which the transfer layer 62 is laminated is brought into close contact with the master 4 by the nip roll 55.
  • the concavo-convex structure 41 formed on the outer peripheral surface of the master 4 is transferred to the transfer layer 62.
  • the transfer layer 62 is cured by light irradiation from the light source 58.
  • the base material 61 that is, the embossed film 1 on which the cured transfer layer 62 is laminated is peeled from the master 4 by the peeling roll 56, and taken up by the winding roll 52 through the guide roll 54.
  • the embossed film 1 according to the present embodiment can be continuously produced.
  • the substrate 61 may be switched to another lot in the middle in order to perform continuous transfer.
  • FIGS. FIG. 8 and FIG. 9 are observation images of the embossed film 1 according to the present embodiment by a scanning electron microscope (SEM).
  • SEM scanning electron microscope
  • 8A and 9A are SEM images obtained by observing the upper surface of the embossed film 1
  • FIGS. 8B and 9B are cross-sectional views of the embossed film 1 shown in FIGS. 8A and 9A cut along the line XX.
  • 8A and 9A the vertical direction of the SEM image corresponds to the length direction of the embossed film 1
  • the horizontal direction corresponds to the width direction of the embossed film 1.
  • the embossed film 1 according to the present embodiment can form an uneven structure having an arbitrary arrangement pattern.
  • 8B and 9B it can be seen that the depth of the formed concavo-convex structure is about 3.4 ⁇ m to 3.5 ⁇ m.
  • Example> the embossed film which concerns on this embodiment is demonstrated in detail, referring an Example and a comparative example.
  • the Example shown below is one example of conditions for showing the feasibility and effect of the embossed film which concerns on this embodiment, and this invention is not limited to a following example.
  • a cylindrical master was produced. Specifically, DLC (Diamond Like Carbon) is formed on the outer peripheral surface of a 4.5 mm-thick cylindrical quartz glass with a film thickness of 800 nm by CVD (Chemical Vapor Deposition) using a hydrocarbon-based gas. A film was formed as an intermediate layer. Next, a tungsten oxide film was formed on the intermediate layer with a film thickness of 55 nm by a sputtering method to form a resist layer.
  • CVD Chemical Vapor Deposition
  • thermal lithography using a laser beam was performed by the exposure apparatus shown in FIG. 6 to form a latent image on the resist layer.
  • a blue semiconductor laser that emits laser light having a wavelength of 405 nm was used as the laser light source of the exposure apparatus.
  • As the exposure pattern an array pattern in which circles having a diameter of 7 ⁇ m were arranged in a hexagonal lattice at a pitch of 10 ⁇ m (distance between the centers of the circles) was used.
  • a portion other than the circle with a diameter of 7 ⁇ m is exposed by an exposure apparatus so that a circle with a diameter of 7 ⁇ m becomes a convex portion on the master (that is, a circle with a diameter of 7 ⁇ m becomes a concave portion in the embossed film after transfer). did.
  • TMAH tetramethylammonium hydroxide
  • the intermediate layer was etched by reactive ion etching with O 2 gas using the developed resist layer as a mask. Subsequently, using the resist layer and the intermediate layer as a mask, the substrate was etched by reactive ion etching using a CF-based gas. The etching of the base material was performed until the height of the convex portion became 7 ⁇ m so that the aspect ratio of the concave portion in the embossed film was 1. Through the above steps, a cylindrical master having an uneven structure formed on the outer peripheral surface was produced.
  • a photocurable resin composition containing 100 parts by mass of an acrylate resin M208 (manufactured by Toagosei) and 2 parts by mass of a photopolymerization initiator IRGCUR184 (manufactured by BASF) in a base film (film thickness 50 ⁇ m) made of 50 cm wide PET.
  • the product was applied at a film thickness of 30 ⁇ m.
  • the master was pressed against the base film, and was irradiated with light of 1000 mJ with a high-pressure mercury lamp to transfer the concavo-convex structure to the base film of 1000 m.
  • the defect rate of the recessed part of the embossed film which concerns on the Example produced above was evaluated. Specifically, at a predetermined distance from the transfer start position, a surface field of 200 ⁇ m ⁇ 200 ⁇ m is observed at a plurality of locations with an optical microscope until it becomes 25 cm 2 minutes, and the defect portions 15 for all the concave portions 13 in the observation area are observed. The percentage was calculated. Such evaluation of the defect rate was performed in a transfer distance range of 1 to 1000 m when the transfer start position from the master was 0. Table 1 below shows the calculated defect rate.
  • the embossed film according to the example has a defect rate of recesses at one end of the film (position at a distance of 1 m from the transfer start position) and the other end of the film (transfer) It was found that the difference from the defect rate of the recesses at a distance of 1000 m from the start position was 1 ppm or less.
  • the length of the embossed film is 1000 m
  • the embossed film according to the example from the position of 0.1% with respect to the entire length of the film (that is, the position at a distance of 1 m from the transfer start position), 0.1%, 25%, 50%, 75%, and 100% calculated every 25% up to a position of 100% with respect to the total length of the film (that is, a position at a distance of 1000 m from the transfer start position) It can be seen that the defect rates at each of the points are almost the same.
  • the distances 100 m and 200 m from the transfer start position are not shown in Table 1, but were the same as the distance 1 m from the transfer start position.
  • the distance 300 m from the transfer start position is not shown in Table 1, but was the same as the distance 250 m from the transfer start position.
  • the numerical value which fell within the range of the defect rate in 500m and 750m was also shown between 500m and 750m. The same was true between 750 m and 1000 m.
  • the embossed film according to the example was filled with a resin filler, and the resin filler was transferred to a transfer sheet.
  • a resin filler Eposta MA1006 (manufactured by Nippon Shokubai Co., Ltd.), which is a polymethyl methacrylate-based crosslinked product, is classified using an image type particle size analyzer FPIA3000 (manufactured by Malvern) so that the average particle diameter (diameter) is 5 ⁇ m. And then used.
  • An embossed film with a distance of 1 m, 30 m, and 150 m from the transfer start position is extracted, and the resin filler is filled with a wipe with a fibrous body, and 60 parts by mass of phenoxy resin YP-50 (manufactured by Nippon Steel Chemical Co., Ltd.), epoxy Resin filler was transferred to an adhesive transfer sheet comprising 40 parts by mass of resin jER828 (Mitsubishi Chemical Corporation) (note that the temperature during transfer was 60 ° C. and the pressure was 2 MPa).
  • the transfer failure of the resin filler transferred using an optical microscope (that is, the portion where the resin filler has not been transferred) was confirmed.
  • the transfer failure is less than 1% with respect to the total number of resin fillers. It was.
  • no positional deviation occurred in the resin filler that was successfully transferred.
  • the positional deviation means that the center position of the resin filler is displaced by 10% (0.5 ⁇ m in this embodiment) or more of the average particle diameter of the resin filler from the target position.
  • the concave portions are arranged in a hexagonal lattice shape which is the most dense arrangement pattern. Therefore, when the embossed film according to the example is filled with a resin filler and transferred, the resin filler is transferred with the densest arrangement pattern. Referring to the results of the embossed film according to the example, even when the transfer is performed in the densest arrangement pattern, the success rate of the transfer of the resin filler is high, the transfer failure is less than 1%, and the position of the resin filler There were no deviations.
  • the embossed film according to the present embodiment is 0.67% (that is, a distance of 1 m), 20% (that is, a distance of 30 m), and 100% (that is, a distance of 150 m) when 150 m is 100%. It can be seen that the transfer is stable. In addition, substantially the same results were shown at each point between 0.67% and 20% and between 20% and 100%. Therefore, the embossed film according to the present embodiment and the transfer product using the embossed film are expected to have the same effects as in the examples even when the concave portions are arranged in any arrangement pattern as long as the concave portions are provided. it can.
  • a photocurable resin composition containing 100 parts by mass of an acrylate resin M208 (manufactured by Toagosei) and 2 parts by mass of a photopolymerization initiator IRGCUR184 (manufactured by BASF) in a base film (film thickness 50 ⁇ m) made of 50 cm wide PET.
  • the product was applied at a film thickness of 30 ⁇ m.
  • the above stamper master was repeatedly pressed against such a base film at a temperature of 60 ° C. and a pressure of 2 MPa to transfer the concavo-convex structure to produce an embossed film.
  • the stamper master was used by spraying a fluorine-based release agent Die Free GA70500 (manufactured by Daikin Industries) on the transfer surface.
  • the embossed film according to the comparative example every time the transfer was repeated, defects occurred due to resin clogging on the stamper master. Specifically, when the defect rate was evaluated with an optical microscope at a point of 20 m (200 transfer times) in the same manner as in the example, it was 500 ppm (0.5%). Further, in the embossed film according to the comparative example, since the film feed is not constant, the concavo-convex structure is displaced every time the stamper master is transferred.
  • the embossed film according to the comparative example has a larger displacement of the recesses and a defect rate than the embossed film according to the example. For this reason, the embossed film according to the comparative example is expected to have more transfer defects than the embossed film according to the example in the transfer product in which the resin filler is transferred after filling the resin filler.
  • the embossed film according to the present embodiment is such that the difference between the defect rate of the recesses at one end of the embossed film and the defect rate of the recesses at the other end of the embossed film is 10 ppm or less. all right. Therefore, the embossed film according to the present embodiment can suppress the cumulative increase in the deficiency of the recesses even when the recesses are formed on the large-area film.
  • the embossed film according to the present embodiment can improve the uniformity of the concavo-convex structure in a large-area film and can reduce the occurrence frequency of defects in the dents.

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PCT/JP2015/080331 2014-10-28 2015-10-28 エンボスフィルム、枚葉フィルム、転写物、およびエンボスフィルムの製造方法 WO2016068166A1 (ja)

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KR1020227013960A KR20220060555A (ko) 2014-10-28 2015-10-28 엠보스 필름, 매엽 필름, 전사물, 및 엠보스 필름의 제조 방법
US15/523,182 US10245780B2 (en) 2014-10-28 2015-10-28 Embossed film, sheet film, transfer copy, and method for producing embossed film
KR1020177006077A KR20170038913A (ko) 2014-10-28 2015-10-28 엠보스 필름, 매엽 필름, 전사물, 및 엠보스 필름의 제조 방법
KR1020187030061A KR20180117209A (ko) 2014-10-28 2015-10-28 엠보스 필름, 매엽 필름, 전사물, 및 엠보스 필름의 제조 방법
CN201580055670.6A CN107073806B (zh) 2014-10-28 2015-10-28 压花膜、片状膜、转印物以及压花膜的制造方法
US16/288,430 US10890844B2 (en) 2014-10-28 2019-02-28 Embossed film, sheet film, transfer copy, and method for producing embossed film
US17/144,670 US11543746B2 (en) 2014-10-28 2021-01-08 Embossed film, sheet film, transfer copy, and method for producing embossed film

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Publication number Priority date Publication date Assignee Title
JP2007136680A (ja) * 2005-11-14 2007-06-07 Asia Genshi Kk 感熱孔版用版材
WO2012018048A1 (ja) * 2010-08-06 2012-02-09 綜研化学株式会社 ナノインプリント用樹脂製モールドおよびその製造方法
WO2014034741A1 (ja) * 2012-08-29 2014-03-06 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
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KR20100116523A (ko) 2008-02-27 2010-11-01 소니 가부시끼가이샤 반사 방지용 광학 소자 및 원반의 제조 방법
JP2010033793A (ja) * 2008-07-28 2010-02-12 Tokai Rubber Ind Ltd 粒子転写膜の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007136680A (ja) * 2005-11-14 2007-06-07 Asia Genshi Kk 感熱孔版用版材
WO2012018048A1 (ja) * 2010-08-06 2012-02-09 綜研化学株式会社 ナノインプリント用樹脂製モールドおよびその製造方法
WO2014034741A1 (ja) * 2012-08-29 2014-03-06 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法

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