WO2016047802A1 - Abrasive pad - Google Patents
Abrasive pad Download PDFInfo
- Publication number
- WO2016047802A1 WO2016047802A1 PCT/JP2015/077310 JP2015077310W WO2016047802A1 WO 2016047802 A1 WO2016047802 A1 WO 2016047802A1 JP 2015077310 W JP2015077310 W JP 2015077310W WO 2016047802 A1 WO2016047802 A1 WO 2016047802A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- layer sheet
- polishing pad
- polished
- hardness
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
Definitions
- the present invention relates to a polishing pad, and more particularly to a polishing pad suitable for polishing the surface of an object to be polished having a change in thickness.
- the workpiece When machining a shape with a change in thickness by cutting, the workpiece is cut into a predetermined shape using a ball end mill or an R-shaped diamond tool.
- a ball end mill When a ball end mill is used, arc-shaped cutting traces are formed on the processed surface in accordance with the ball diameter of the ball end mill.
- an R-shaped diamond tool it is necessary to form the flat surface and the curved surface by separate cutting processes, so a step is formed at the boundary line between the flat surface and the curved surface, and a uniform surface is processed. I can't.
- unevenness influenced by the surface quality of the mold is formed on the entire surface that is in contact with the mold.
- polishing having a polishing surface smaller than the surface to be processed as described in Patent Document 1 or 2 after cutting.
- a method is used in which a tool is moved in a three-dimensional manner by a predetermined processing program, and the surface to be processed is polished by scanning the surface to be processed.
- JP 2003-62751 A Japanese Patent No. 3030681
- the present invention has been made to solve the above-described problems, and can polish the polishing accuracy when polishing the surface of the object to be polished with a change in thickness. It is an object to provide a polishing pad that can be suppressed.
- the present invention provides a polishing pad formed by laminating at least two sheets of an upper layer sheet and a lower layer sheet having a polishing surface, and the upper layer sheet has a thickness of 1.0 mm to 2.0 mm, Shore A hardness of the polished surface is 20 to 90, and 25% compression hardness when measured using an indenter with a diameter of 10 mm is 0.15 to the entire polishing pad. It is 0.35 MPa, more preferably 0.15 to 0.27 MPa.
- the thickness of the upper layer sheet is 1.0 mm to 2.0 mm
- the Shore A hardness of the polishing surface is 20 to 90
- the diameter is 10 mm with respect to the entire polishing pad.
- the 25% compression hardness when measured using an indenter of 0.15 to 0.35 MPa, more preferably 0.15 to 0.27 MPa, allows the polishing surface to polish the workpiece. Sufficient hardness can be maintained, and the followability of the entire polishing pad to the surface shape of the object to be polished, that is, the followability of the polishing surface to the surface shape of the object to be polished can be maintained.
- polishing pad according to the present invention fine unevenness on the surface to be polished can be suitably polished, and when polishing the surface to be polished having a change in thickness, polishing is performed. Since the pad is deformed according to the shape of the surface to be polished, polishing accuracy can be improved and polishing spots can be suppressed.
- the upper layer sheet is a foamed polyurethane sheet
- the lower layer sheet is a polyethylene foam sheet.
- the bulk density of the foamed polyurethane sheet is 10 times the bulk density of the polyethylene foam sheet. It is preferable to be 20 times.
- the thickness of the lower layer sheet is preferably 2 to 15 mm.
- the ratio of 25% compression hardness when measured using an indenter having a diameter of 10 mm to 25% compression hardness when measured using an indenter having a diameter of 20 mm is 1.70 to 2.70. Preferably there is.
- 25% compression hardness when measured using an indenter having a diameter of 10 mm was measured using an indenter having a diameter of 20 mm. It can be made larger than the 25% compression hardness at the time, that is, 25% compression hardness in a wide area.
- the polishing pad exhibits a relatively high hardness when focusing on a narrow area, and exhibits a relatively low hardness when focusing on a wide area, and exhibits a high hardness against minute irregularities. Since it can be equated with a relatively large unevenness, it exhibits a low hardness for the portion where the thickness changes. Therefore, according to the polishing pad of the present invention, fine irregularities can be suitably polished, and polishing processing with higher surface quality can be performed.
- polishing pad that can improve polishing accuracy and suppress polishing spots when polishing the surface of an object to be polished whose thickness has been changed. can do.
- FIG. 1 is a side sectional view of a polishing pad according to an embodiment of the present invention. It is a sectional side view of the polishing pad by embodiment of this invention, and is a figure for demonstrating a use condition.
- FIG. 1 is a side sectional view of the polishing pad according to the present embodiment.
- the polishing pad 1 is formed by laminating an upper layer sheet 3 formed of a foamed polyurethane sheet and a lower layer sheet 5 formed of a polyethylene foam sheet.
- the upper layer sheet 3 and the lower layer sheet 5 are bonded to each other via a double-sided tape 7.
- the surface of the upper layer sheet 3 where the double-sided tape 7 is not attached in other words, the surface of the upper layer sheet 3 that does not face the lower layer sheet 5 constitutes the polishing surface 9 of the polishing pad 1.
- the double-sided tape 11 for affixing the polishing pad 1 to a polishing surface plate is affixed on the surface of the lower layer sheet 5 that is not opposed to the upper layer sheet 3.
- the core material of the double-sided tape 7 and the double-sided tape 11 if a rigidity is the range which does not lose
- the polishing pad 1 formed by laminating the upper layer sheet 3 and the lower layer sheet 5 preferably has a Shore A hardness of the polishing surface 9 of 20 to 90. If the Shore A hardness of the polished surface is 20 or more, the hardness for sufficiently polishing the object to be polished can be maintained. Conversely, if the Shore A hardness of the polished surface 9 is 90 or less, the object to be polished is covered. This is preferable because scratches on the polished surface can be reduced.
- the thickness of the polishing pad 1 is not particularly limited, but is preferably 3 to 17 mm.
- the polishing pad 1 has a 25% compression hardness obtained by a test according to Japanese Industrial Standard (JIS K 6767) of preferably 0.15 to 0.35 MPa, and 0.15 to 0.27 MPa. More preferably.
- JIS K 6767 is the same as JIS K 6767 in that the compression speed, compressing 25% of the initial thickness, stopping and measuring the load after 20 seconds is the same as JIS K 6767.
- the thickness of the test piece is 30 mm ⁇ 30 mm, and the thickness of the test piece is measured with a single piece without overlapping even if it is less than 25 mm, and the indenter is a test using a disk-shaped tip having a diameter of 10 mm.
- the pressing force applied to the object to be polished can be secured, so that polishing can be performed reliably, and conversely if the 25% compression hardness is 0.35 MPa or less.
- the pressure does not become too low, a pressing force works evenly from a flat surface to a curved surface, and polishing spots hardly occur.
- the stress applied to the object to be polished when a certain amount of object is submerged. As an index, 25% compression hardness is used.
- the upper layer sheet 3 is obtained by cutting a polyurethane foam sheet into, for example, a disk shape, and its thickness is preferably 1.0 to 2.0 mm. By setting the thickness of the upper layer sheet 3 to 1.0 mm or more, the product life can be sufficiently ensured. On the contrary, by setting the thickness of the upper layer sheet 3 to 2.0 mm or less, the physical properties of the polishing pad 1 as a whole are increased. It is difficult to be controlled only by the physical properties of the upper layer sheet 3, and it is possible to achieve both grinding force and followability. Further, the upper layer sheet 3 preferably has a Shore A hardness indicating the hardness of the polished surface 9 of 20 to 90, more preferably 20 to 70, and most preferably 20 to 60.
- the Shore A hardness of the upper layer sheet 3 By setting the Shore A hardness of the upper layer sheet 3 to 20 or more, the hardness for sufficiently polishing the object to be polished can be maintained, and by setting the Shore A hardness to 90 or less, the object to be polished is polished. Scratches on the surface can be reduced.
- a polyurethane foam produced by a dry molding method it is preferable to use a polyurethane foam produced by a dry molding method.
- foamed polyurethane using a dry molding method, it can be produced, for example, using the following production method. That is, polyisocyanate compound, polyol compound, curing agent, foaming agent, catalyst, preparatory step for preparing nonreactive gas for each component, mixing each component and nonreactive gas for each component Mixing step for obtaining a mixture for foam molding, foam molding step for molding a polyurethane resin foam from the mixture for foam molding, and slicing the polyurethane resin foam to a thickness required for the polishing pad 1 It can manufacture through each process of the slicing process.
- the lower layer sheet 5 is obtained by cutting a polyethylene foam sheet into a disk shape having the same diameter as that of the upper layer sheet 3, and the thickness thereof is preferably 2 to 15 mm.
- the thickness of the lower layer sheet 5 is set to 2 mm or more, it is possible to sufficiently sink the object to be polished with respect to the polishing pad 1, excellent followability, and excessively adjusting the thickness of the lower layer sheet 5 to 15 mm or less.
- the polishing layer is less likely to be peeled off due to the deformation.
- the lower layer sheet 5 preferably has a Shore A hardness of 5 to 20.
- the Shore A hardness of the lower layer sheet 5 By setting the Shore A hardness of the lower layer sheet 5 to 5 or more, local deformation of the lower layer sheet 5 can be made difficult to occur, the in-plane uniformity of the object to be polished is excellent, and the Shore A hardness of the lower layer sheet 5 By setting the value to 20 or less, scratches on the workpiece can be reduced.
- the bulk density of the expanded polyurethane sheet constituting the upper layer sheet 3 is preferably 0.3 to 0.6 g / cm 3
- the bulk density of the polyethylene foam sheet constituting the lower layer sheet 5 is 0.03 to is preferably 0.06 g / cm 3, a bulk density of foamed polyurethane sheet constituting the upper layer sheet 3, and particularly preferably 10 to 20 times the bulk density of the polyethylene foam sheet constituting the lower layer sheet 5.
- the polishing pad 1 has a 25% compression hardness (hereinafter sometimes referred to as H (10 mm ⁇ )) when measured using an indenter having a diameter of 10 mm, and 25 when measured using an indenter having a diameter of 20 mm ⁇ .
- % Compression hardness (hereinafter sometimes referred to as H (20 mm ⁇ )) is preferably 1.70 to 2.70.
- the polishing pad 1 exhibits a relatively high hardness when focusing on a narrow region, and exhibits a relatively low hardness when focusing on a wide region, and exhibits a high hardness against minute irregularities. It exhibits a low hardness for the portion where the thickness is changed so that it can be regarded as a relatively large unevenness. Therefore, according to the polishing pad 1 according to the present embodiment, it is possible to suitably polish fine irregularities and perform polishing processing with higher surface quality.
- FIG. 2 is a side sectional view of the polishing pad 1 according to the embodiment, and is a view for explaining a use state.
- FIG. 2 is a diagram for explaining an operation when polishing the workpiece W having a shape in which the outer peripheral portion of the surface to be polished is curved when the vertical cross section is viewed with a change in thickness.
- the polishing surface 9 of the polishing pad 1 is larger than the surface to be polished of the workpiece W, and the polishing pad 1 is arranged so that the polishing pad 1 protrudes in the outer peripheral direction of the workpiece W.
- the polishing pad 1 is deformed according to the shape of the workpiece W.
- the thickness of the upper layer sheet is 1.0 mm to 2.0 mm and the Shore A hardness of the polishing surface is 20 to 90, the polishing surface is flexed and appropriately follows the surface to be polished of the object to be polished. And has the grinding power necessary for polishing.
- the polishing pressure applied from the polishing surface 9 to the surface to be polished is made relatively weak and depends on the shape of the surface to be polished. Therefore, the polishing pressure can be applied uniformly. Thereby, the polishing spot at the time of grinding
- polishing can be suppressed.
- the polishing accuracy can be improved and the polishing spots can be suppressed when the surface of the object to be polished whose thickness is changed is polished.
- Example 1 Polyethylene foam sheets of the lower layer sheet 5 are 10 mm and 5 mm thick, and 10 mm and 10 mm thick are pasted through double-sided tapes (not shown), respectively. They were made together.
- the compressibility and the compressive elastic modulus can be determined using a shopper type thickness measuring instrument (pressure surface: circular shape with a diameter of 1 cm) in accordance with Japanese Industrial Standard (JIS L 1021). Specifically, it is as follows. The thickness t 0 after applying the initial load for 30 seconds from the unloaded state is measured, and then the thickness t 1 after applying the final load for 30 seconds from the state of the thickness t 0 is measured. Next, all loads are removed from the state of the thickness t 1 , and after left for 5 minutes (no load state), the thickness t 0 ′ after the initial load is again applied for 30 seconds is measured.
- JIS L 1021 Japanese Industrial Standard
- compression rate (%) 100 ⁇ (t 0 ⁇ t 1 ) / t 0 .
- Shore A hardness For the measurement of Shore A hardness, a sample piece (10 cm ⁇ 10 cm) was prepared and measured with an A-type hardness meter (Japanese Industrial Standard, JIS K 7311). The measurement was performed on the upper layer sheet 3 alone, the lower layer sheet 5 alone, and the polishing pad 1 itself of the example and the comparative example, which constitute the polishing pad 1 of the example and the comparative example. For the upper layer sheet 3 alone and the lower layer sheet 5 alone, when the thickness of the sample was less than 4.5 mm, a plurality of samples were stacked so that the total thickness was 4.5 mm or more. With respect to the polishing pad 1, the measurement was performed with one piece without overlapping, with the polishing surface 9 side facing up, and the obtained numerical value was taken as the Shore A hardness of the polishing surface 9.
- the average bubble diameter ( ⁇ m), the number of bubbles per 1 mm 2 was expanded by 175 times in the 1.3 mm square area (excluding the groove) of the pad surface with a microscope (VH-6300, manufactured by KEYENCE). Observe and binarize the obtained image with image processing software (Image Analyzer V20LAB Ver. 1.3, manufactured by Nikon) to confirm the number of bubbles. Also, from the area of each bubble, the equivalent circle diameter and its The average value (average bubble diameter) was calculated. Note that the cutoff value (lower limit) of the bubble diameter was 10 ⁇ m, and noise components were excluded.
- the 25% compression hardness was measured according to the Japanese Industrial Standard (JIS K 6767). That is, the polishing pad 1 of the example and the comparative example was allowed to stand for 24 hours or more in an environment having a temperature of 23 ⁇ 2 ° C. and a relative humidity of 50 ⁇ 5%, and then punched to 30 mm ⁇ 30 mm to produce a sample piece. One sample piece was compressed in parallel with an indenter of a predetermined size from the polishing surface 9 side at a speed of 10 mm / min, and the stress when compressed by 25% from the original thickness was read. Other test conditions were in accordance with JIS K 6767.
- the release paper of the double-sided tape 11 opposite to the polishing surface 9 of the polishing pad 1 produced by the method described above is peeled off and attached to the upper polishing surface plate, and the surface to be polished of the object to be polished is placed on the opposite lower surface plate Fixed on the top.
- a polishing test was performed under the following polishing conditions, and the polishing rate, polishing spots, and scratches were evaluated.
- the polishing rate is the amount of polishing per minute expressed by thickness, polished 120 objects to be polished, the amount of polishing determined from the weight reduction of the substrate before and after polishing, the polishing area of the object to be polished, and From the specific gravity, an arithmetic average of each polishing rate was obtained.
- Example 1 to 14 since the Shore A hardness of the polishing surface 9 is in the range of 20 to 90 and H (10 mm ⁇ ) is in the range of 0.15 to 0.35 MPa, it has a moderate grinding force. Since the curved surface was traced well, the polishing rate was excellent, and polishing spots and scratches were not confirmed. In particular, gloss was confirmed in Examples 2 to 5, Example 8 to 11, and Examples 13 to 14 in which H (10 mm ⁇ ) / H (20 mm ⁇ ) was in the range of 1.70 to 2.70. The reason for this is considered that the polishing pad 1 was moderately along the curvature of the curved surface of the object to be polished, and was able to remove even the swell.
- Comparative Example 2 in which the value of H (10 mm ⁇ ) was low compared to Examples 1 to 14, although the Shore A hardness was in the range of 20 to 90, no scratch was confirmed, but the pressing force applied to the object to be polished.
- the pressure decreased and the polishing rate tended to be lower than in Examples 1-14. Further, since the pressing force was small, polishing could not be performed reliably, and polishing spots were confirmed in more than half of the objects to be polished.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
実施例および比較例では、以下の表1及び表2に記載された発泡ポリウレタンからなる上層シート3とポリエチレンフォームシートからなる下層シート5とを両面テープ7を介して貼り合わせた後、下層シート5の上層シート3と反対面側に更に両面テープ11を貼り付け研磨パッド1を作製した。なお実施例1及び比較例1においてのみ、下層シート5のポリエチレンフォームシートは10mmと5mmの厚さのもの、10mmと10mmの厚さのものを、それぞれ両面テープ(図示せず)を介して貼り合わせ作製した。 (Polishing pad manufacturing method)
In Examples and Comparative Examples, the upper layer sheet 3 made of foamed polyurethane and the
圧縮率および圧縮弾性率は、日本工業規格(JIS L 1021)に従い、ショッパー型厚さ測定器(加圧面:直径1cmの円形)を使用して求めることが出来る。具体的には、以下の通りである。無荷重状態から初荷重を30秒間かけた後の厚さt0を測定し、次に、厚さt0の状態から最終荷重を30秒間かけた後の厚さt1を測定する。次に、厚さt1の状態から全ての荷重を除き、5分放置後(無荷重状態とした)後、再び初荷重を30秒間かけた後の厚さt0‘を測定する。圧縮率は、圧縮率(%)=100×(t0-t1)/t0の式で算出することができる。圧縮弾性率は、圧縮弾性率(%)=100×
(t0’-t1)/(t0-t1)の式で算出することができる。(なお、初荷重は300g/cm2、最終圧力は1800g/cm2である。) (Compression rate)
The compressibility and the compressive elastic modulus can be determined using a shopper type thickness measuring instrument (pressure surface: circular shape with a diameter of 1 cm) in accordance with Japanese Industrial Standard (JIS L 1021). Specifically, it is as follows. The thickness t 0 after applying the initial load for 30 seconds from the unloaded state is measured, and then the thickness t 1 after applying the final load for 30 seconds from the state of the thickness t 0 is measured. Next, all loads are removed from the state of the thickness t 1 , and after left for 5 minutes (no load state), the thickness t 0 ′ after the initial load is again applied for 30 seconds is measured. The compression rate can be calculated by the equation: compression rate (%) = 100 × (t 0 −t 1 ) / t 0 . Compression modulus is compression modulus (%) = 100 ×
It can be calculated by the equation (t 0 '−t 1 ) / (t 0 −t 1 ) (The initial load is 300 g / cm 2 and the final pressure is 1800 g / cm 2. )
ショアA硬度の測定は、試料片(10cm×10cm)を用意し、A型硬度計(日本工業規格、JIS K 7311)にて測定した。測定は、実施例および比較例の研磨パッド1を構成する上層シート3単体、下層シート5単体、および、実施例及び比較例の研磨パッド1そのものに対して行った。上層シート3単体および下層シート5単体については、試料の厚みが4.5mmに満たない場合は、総厚みが4.5mm以上になるよう試料を複数枚重ねて測定を行った。研磨パッド1については重ねず一枚で、研磨面9側を上にして測定を行い、得られた数値を研磨面9のショアA硬度とした。 (Shore A hardness)
For the measurement of Shore A hardness, a sample piece (10 cm × 10 cm) was prepared and measured with an A-type hardness meter (Japanese Industrial Standard, JIS K 7311). The measurement was performed on the upper layer sheet 3 alone, the
平均気泡径(μm)、1mm2当たりの気泡個数は、マイクロスコープ(VH-6300、KEYENCE製)でパッド表面の約1.3mm四方の範囲(溝の部分を除く)を175倍に拡大して観察し、得られた画像を画像処理ソフト(Image Analyzer V20LAB Ver. 1.3、ニコン製)により二値化処理して気泡個数を確認し、また、各々の気泡の面積から円相当径及びその平均値(平均気泡径)を算出した。なお、気泡径のカットオフ値(下限)を10μmとし、ノイズ成分を除外した。 (Average bubble diameter and number of bubbles)
The average bubble diameter (μm), the number of bubbles per 1 mm 2 was expanded by 175 times in the 1.3 mm square area (excluding the groove) of the pad surface with a microscope (VH-6300, manufactured by KEYENCE). Observe and binarize the obtained image with image processing software (Image Analyzer V20LAB Ver. 1.3, manufactured by Nikon) to confirm the number of bubbles. Also, from the area of each bubble, the equivalent circle diameter and its The average value (average bubble diameter) was calculated. Note that the cutoff value (lower limit) of the bubble diameter was 10 μm, and noise components were excluded.
25%圧縮硬さは日本工業規格(JIS K 6767)に準じて測定を行った。すなわち、実施例及び比較例の研磨パッド1を温度23±2℃及び相対湿度50±5%の環境に24時間以上静置した後、30mm×30mmに打ち抜いて試料片を作製し、得られた試料片1枚を研磨面9側から10mm/分の速度で所定サイズの圧子により平行に圧縮し、元の厚みから25%圧縮させた際の応力を読み取った。その他の試験条件については、JIS K 6767に従った。 (25% compression hardness)
The 25% compression hardness was measured according to the Japanese Industrial Standard (JIS K 6767). That is, the
・使用研磨機:不二越機械工業社製両面研磨装置
・研磨速度(保持プレート回転数):40rpm
・研磨圧:1100g/cm2
・研磨剤:酸化セリウムスラリー 10%水溶液
・被研磨物:ガラス基板(65mm×65mm×10mm 端部に曲面加工済み)×10枚/バッチ
・研磨時間:15min/バッチ (Polishing conditions)
-Polishing machine used: Double-side polishing machine manufactured by Fujikoshi Kikai Kogyo Co., Ltd.-Polishing speed (retention plate rotation speed): 40 rpm
Polishing pressure: 1100 g / cm 2
・ Abrasive: 10% aqueous solution of cerium oxide slurry ・ Polished object: glass substrate (65 mm × 65 mm × 10 mm curved at end) × 10 sheets / batch ・ Polishing time: 15 min / batch
研磨レートは、1分間あたりの研磨量を厚さで表したものであり、被研磨物を120枚研磨し、研磨加工前後の基板の重量減少から求めた研磨量、被研磨物の研磨面積および比重から、各研磨レートの相加平均を求めた。 (Polishing rate)
The polishing rate is the amount of polishing per minute expressed by thickness, polished 120 objects to be polished, the amount of polishing determined from the weight reduction of the substrate before and after polishing, the polishing area of the object to be polished, and From the specific gravity, an arithmetic average of each polishing rate was obtained.
研磨終了後の120枚の被研磨物の各被研磨面に対し、その他の部位と質感の異なる研磨斑の部分の有無について目視にて確認した。120枚の被研磨物全てにおいて研磨斑が確認されず且つ少なくとも1枚以上光沢確認されたものを◎、全てにおいて研磨斑が確認されなかったものを○、研磨斑が確認されたものが一部含まれていたものの製品として十分使用可能な場合を△、半数以上の被研磨物で研磨斑が確認された場合を×と評価した。結果を表に示す。 (Evaluation of polishing spots)
With respect to each surface to be polished of 120 objects to be polished after completion of polishing, the presence or absence of a polishing spot portion having a texture different from other portions was visually confirmed. All of 120 objects to be polished had no polishing spots and at least one gloss was confirmed ◎, all had no polishing spots ○, some of which were confirmed polishing spots The case where it was contained but was sufficiently usable as a product was evaluated as Δ, and the case where polishing spots were confirmed on more than half of the objects to be polished was evaluated as ×. The results are shown in the table.
スクラッチの発生状況については、研磨加工後の被研磨物の被研磨面に対し目視鏡観察することでスクラッチの有無を判定した。すなわちスクラッチが確認されなかった場合を○、確認された場合を×と判定した。 (Scratch confirmation)
About the generation | occurrence | production condition of a scratch, the presence or absence of the scratch was determined by carrying out a visual mirror observation with respect to the to-be-polished surface of the to-be-polished thing after grinding | polishing. That is, the case where no scratch was confirmed was judged as ◯, and the case where it was confirmed was judged as ×.
3 上層シート
5 下層シート 1 Polishing pad 3
Claims (5)
- 研磨面を有する上層シート及び下層シートの少なくとも二枚のシートを貼り合わせて構成された研磨パッドであって、上層シートの厚みは1.0mm~2.0mmであり、研磨面のショアA硬度が20~90であり、且つ研磨パッド全体に対して、直径10mmの圧子を用いて測定したときの25%圧縮硬さが、0.15~0.35MPaである、研磨パッド。 A polishing pad configured by laminating at least two sheets of an upper layer sheet and a lower layer sheet having a polishing surface, wherein the upper layer sheet has a thickness of 1.0 mm to 2.0 mm, and the Shore A hardness of the polishing surface is A polishing pad having a hardness of 20 to 90 and a 25% compression hardness of 0.15 to 0.35 MPa when measured using an indenter having a diameter of 10 mm with respect to the entire polishing pad.
- 研磨パッド全体に対して、直径10mmの圧子を用いて測定したときの25%圧縮硬さが、0.15~0.27MPaである、請求項1に記載の研磨パッド。 The polishing pad according to claim 1, wherein the entire polishing pad has a 25% compression hardness of 0.15 to 0.27 MPa when measured using an indenter having a diameter of 10 mm.
- 前記上層シートは、発泡ポリウレタンシートであり、前記下層シートは、ポリエチレンフォームシートであり、前記発泡ポリウレタンシートのかさ密度が、前記ポリエチレンフォームシートのかさ密度の10~20倍である、請求項1又は2に記載の研磨パッド。 The upper layer sheet is a foamed polyurethane sheet, the lower layer sheet is a polyethylene foam sheet, and the bulk density of the foamed polyurethane sheet is 10 to 20 times the bulk density of the polyethylene foam sheet. 2. The polishing pad according to 2.
- 前記下層シートの厚さは、2~15mmである、請求項1乃至3の何れか1項に記載の研磨パッド。 The polishing pad according to any one of claims 1 to 3, wherein the lower layer sheet has a thickness of 2 to 15 mm.
- 直径10mmの圧子を用いて測定したときの25%圧縮硬さと、直径20mmの圧子を用いて測定したときの25%圧縮硬さとの比が1.70~2.70である、請求項1乃至4の何れか1項に記載の研磨パッド。 The ratio of 25% compression hardness when measured using an indenter having a diameter of 10 mm to 25% compression hardness when measured using an indenter having a diameter of 20 mm is 1.70 to 2.70. 5. The polishing pad according to any one of 4 above.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201580051608.XA CN107073676B (en) | 2014-09-26 | 2015-09-28 | Polishing pad |
KR1020177010875A KR102393013B1 (en) | 2014-09-26 | 2015-09-28 | Abrasive pad |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-196447 | 2014-09-26 | ||
JP2014196447A JP6399393B2 (en) | 2014-09-26 | 2014-09-26 | Polishing pad |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016047802A1 true WO2016047802A1 (en) | 2016-03-31 |
Family
ID=55581317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2015/077310 WO2016047802A1 (en) | 2014-09-26 | 2015-09-28 | Abrasive pad |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6399393B2 (en) |
KR (1) | KR102393013B1 (en) |
CN (1) | CN107073676B (en) |
WO (1) | WO2016047802A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6852658B2 (en) | 2017-11-24 | 2021-03-31 | 株式会社デンソー | Vehicle control device |
TW202023805A (en) * | 2018-09-28 | 2020-07-01 | 日商福吉米股份有限公司 | Polishing pad, and polishing method using same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004323679A (en) * | 2003-04-24 | 2004-11-18 | Toyo Ink Mfg Co Ltd | Double-sided pressure sensitive adhesive sheet and abrasive cloth laminate |
JP2005072496A (en) * | 2003-08-27 | 2005-03-17 | Shin Etsu Polymer Co Ltd | Substrate holder |
US20100247868A1 (en) * | 2009-03-24 | 2010-09-30 | Yoon Jong CHA | Polyurethane porous product and manufacturing method thereof and polishing pad having polyurethane porous product |
JP2013082029A (en) * | 2011-10-07 | 2013-05-09 | Sekisui Chem Co Ltd | Cushion material for polishing |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3030681U (en) | 1996-04-30 | 1996-11-01 | キャタラー工業株式会社 | Exhaust gas purification catalytic converter |
JP2003062751A (en) | 2001-08-23 | 2003-03-05 | Ricoh Co Ltd | Waviness removing method, polishing device, workpiece, mold for molding optical element, optical element and printing processor |
US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
WO2008029538A1 (en) * | 2006-09-08 | 2008-03-13 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
JP5078527B2 (en) * | 2007-09-28 | 2012-11-21 | 富士紡ホールディングス株式会社 | Polishing cloth |
US20110045753A1 (en) * | 2008-05-16 | 2011-02-24 | Toray Industries, Inc. | Polishing pad |
JP5521243B2 (en) * | 2009-07-03 | 2014-06-11 | 日本発條株式会社 | Polishing holding pad |
DE102013201663B4 (en) * | 2012-12-04 | 2020-04-23 | Siltronic Ag | Process for polishing a semiconductor wafer |
-
2014
- 2014-09-26 JP JP2014196447A patent/JP6399393B2/en active Active
-
2015
- 2015-09-28 KR KR1020177010875A patent/KR102393013B1/en active IP Right Grant
- 2015-09-28 WO PCT/JP2015/077310 patent/WO2016047802A1/en active Application Filing
- 2015-09-28 CN CN201580051608.XA patent/CN107073676B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004323679A (en) * | 2003-04-24 | 2004-11-18 | Toyo Ink Mfg Co Ltd | Double-sided pressure sensitive adhesive sheet and abrasive cloth laminate |
JP2005072496A (en) * | 2003-08-27 | 2005-03-17 | Shin Etsu Polymer Co Ltd | Substrate holder |
US20100247868A1 (en) * | 2009-03-24 | 2010-09-30 | Yoon Jong CHA | Polyurethane porous product and manufacturing method thereof and polishing pad having polyurethane porous product |
JP2013082029A (en) * | 2011-10-07 | 2013-05-09 | Sekisui Chem Co Ltd | Cushion material for polishing |
Also Published As
Publication number | Publication date |
---|---|
KR20170063771A (en) | 2017-06-08 |
JP6399393B2 (en) | 2018-10-03 |
CN107073676A (en) | 2017-08-18 |
JP2017226016A (en) | 2017-12-28 |
CN107073676B (en) | 2020-12-01 |
KR102393013B1 (en) | 2022-05-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0413568A (en) | Backing pad, precise flattening method thereof and polishing method thereof for semiconductor wafer | |
WO2016047802A1 (en) | Abrasive pad | |
JPWO2013108725A1 (en) | Manufacturing method of glass plate, manufacturing method of glass substrate for display, and glass plate | |
JP6011627B2 (en) | Glass substrate polishing method | |
JP5072072B2 (en) | Polishing pad | |
JP6582057B2 (en) | Polishing pad, polishing method using the polishing pad, and method of using the polishing pad | |
WO2014119367A1 (en) | Polishing pad | |
JP2015035245A (en) | Glass substrate carrier, polishing method of glass substrate for magnetic recording medium, and manufacturing method of glass substrate for magnetic recording medium | |
JP2010247254A (en) | Method of preparing polishing head and polishing apparatus | |
JP2010240770A (en) | Polishing pad and method of manufacturing the same | |
JP4627149B2 (en) | Polishing pad and semiconductor device manufacturing method | |
KR20210001793U (en) | Two-layer polishing pad made of nonwoven fabric | |
JP6604472B2 (en) | Polishing pad | |
JP2017177266A (en) | Holding tool | |
JP7089905B2 (en) | Polishing pad | |
JP2017064849A (en) | Object to be polished holding material and object to be polished holding tool | |
JP5671305B2 (en) | Mask blank substrate manufacturing method, mask blank manufacturing method, and transfer mask manufacturing method | |
JP2010240769A (en) | Polishing pad and method of manufacturing the same | |
JP2010005746A (en) | Polishing pad and its manufacturing method | |
JP6345977B2 (en) | Polishing pad, polishing method using the polishing pad, and method of using the polishing pad | |
JP2021522079A (en) | Conformity polished article | |
JP4535675B2 (en) | Double-sided adhesive sheet | |
WO2021193970A1 (en) | Carrier and method for manufacturing substrate | |
KR100662738B1 (en) | Polishing device for a large diameter non-spherical optical sysstem | |
JP2009028889A (en) | Method and device for manufacturing silicon carbide single crystal substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 15844364 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20177010875 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 15844364 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: JP |