WO2016044136A1 - Élement de coupe compact en diamant polycristallin comportant une texturation de surface - Google Patents

Élement de coupe compact en diamant polycristallin comportant une texturation de surface Download PDF

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Publication number
WO2016044136A1
WO2016044136A1 PCT/US2015/049921 US2015049921W WO2016044136A1 WO 2016044136 A1 WO2016044136 A1 WO 2016044136A1 US 2015049921 W US2015049921 W US 2015049921W WO 2016044136 A1 WO2016044136 A1 WO 2016044136A1
Authority
WO
WIPO (PCT)
Prior art keywords
diamond
volume
textured surface
cutter
polycrystallme
Prior art date
Application number
PCT/US2015/049921
Other languages
English (en)
Inventor
Andrew Gledhill
Original Assignee
Diamond Innovations, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diamond Innovations, Inc. filed Critical Diamond Innovations, Inc.
Priority to US15/510,547 priority Critical patent/US20170292332A1/en
Publication of WO2016044136A1 publication Critical patent/WO2016044136A1/fr

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Classifications

    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B10/00—Drill bits
    • E21B10/46—Drill bits characterised by wear resisting parts, e.g. diamond inserts
    • E21B10/56—Button-type inserts
    • E21B10/567—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B10/00—Drill bits
    • E21B10/46—Drill bits characterised by wear resisting parts, e.g. diamond inserts
    • E21B10/56—Button-type inserts
    • E21B10/567—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts
    • E21B10/573—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts characterised by support details, e.g. the substrate construction or the interface between the substrate and the cutting element

Definitions

  • the present disclosure relates to a polycrystalline diamond compact (PCD) cutter having a textured surface for increasing surface area for heat transfer, decreasing chipping or breaking of the cutter and/or providing a termination point for crack formation.
  • PCD polycrystalline diamond compact
  • Abrasive compacts consist of a mass of diamond or cubic boron nitride particles bonded into a coherent, polycrystalline hard conglomerate.
  • the abrasive particle content of abrasive compacts is high and there is an extensive amount of direct particle-to- particle bonding.
  • Abrasive compacts tend to be brittle and in use they are frequently supported by being bonded to a cemented carbide substrate or support.
  • PCD Polycrystalline diamond
  • Cutter performance is limited by the amount of surface area to dissipate heat, as well as friction generated by the chip and coolant flow running across the face of the cutter. Additionally, cutters experience impact damage, resulting in large cracks which propagate through the diamond, leading to large loss of the diamond table.
  • Another problem is that in order to effectively limit propagation of cracks and to limit breaking, spalling or chipping, a fairly large amount of diamond volume is required to be removed when forming the pattern along the top surface of the compact. This compromises the abrasion resistance of the cutter.
  • a polycrystalline diamond compact cutter for a tool includes a substrate of cemented carbide and a volume of polycrystalline diamond bonded to the substrate. At least one chamfer extends along an outer circumference of the volume of polycrystalline diamond. A textured surface is disposed on at least the at least one chamfer. The textured surface provides a termination point for crack formation, an increased surface area for heat transfer, and decreases chipping of the volume of polycrystalline diamond.
  • a method for forming a polycrystalline diamond compact cutter includes the steps of providing a cemented carbide substrate and disposing a volume of polycrystalline diamond material on the cemented carbide substrate.
  • the substrate and volume of diamond material are subjected to a high pressure and a high temperature condition to bond the volume of polycrystalline diamond material and substrate.
  • a textured surface is formed on at least at least one chamfer disposed along an outer circumference of the volume of polycrystalline diamond to provide a termination point for crack formation, an increased surface area for heat transfer, and to decrease chipping of the volume of polycrystalline diamond.
  • a drilling bit includes a cutting element of a volume of polycrystalline diamond.
  • the cutting element includes a cutting edge formed by at least one chamfer extending along an outer circumference of the cutting element.
  • a textured surface is disposed on at least the at least one chamfer to provide a termination point for crack formation, an increased surface area for heat transfer, and decreasing chipping of PATENT
  • the drill bit includes a substrate of cemented carbide, the cutting element being bonded to the substrate.
  • having a textured surface with features patterned on the chamfer of the cutter enhances the toughness of a given cutter in an impact damage mode thereby minimizing spalling and chipping at the cutting edge.
  • the textured surface provides a greater surface area to increase heat transfer at the cutting edge.
  • the textured surface being provided on the chamfer of the cutter limits the amount of diamond removed from the volume allowing the cutter to be leached.
  • Fig. 1 is an image of a conventional PCD cutter having impact damage.
  • Fig. 2 is a perspective view of an embodiment of a surface textured PCD cutter according to the present disclosure.
  • Fig. 3 is a top view of the cutter of Fig. 2.
  • Fig. 4 is a side view of the cutter of Fig. 2.
  • FIG. 5 is a perspective view of another embodiment of a surface textured PCD cutter.
  • Fig. 6 is a top view of the cutter of Fig. 5.
  • Fig. 7 is a side view of the cutter of Fig. 5.
  • Fig. 8 is a perspective view of yet another embodiment of a surface textured PCD cutter.
  • Fig. 9 is a top view of the cutter of Fig. 8.
  • Fig. 10 is a side view of the cutter of Fig. 8.
  • Fig. 11 is a cross-section of the cutter taken along line I-I of Fig. 9.
  • Fig. 12 is still another embodiment of a surface textured PCD cutter.
  • Fig. 13 is an enlarged view of the textured pattern of the cutter of Fig. 12.
  • Fig. 14 is a top view of the cutter of Fig. 12.
  • Fig. 15 is a side view of the cutter of Fig. 12.
  • Fig. 16 is another embodiment of a surface textures PCD cutter.
  • Fig. 17 is a top view of the cutter of Fig. 16.
  • Fig. 18 is a side view of the cutter of Fig. 16.
  • Fig. 19 is yet another embodiment of a surface textures PCD cutter.
  • Fig. 20 is a top view of the cutter of Fig. 19.
  • Fig. 21 is a side view of the cutter of Fig. 19.
  • Fig. 22 is still another embodiment of a surface textures PCD cutter.
  • Fig. 23 is a top view of the cutter of Fig. 22.
  • Fig. 24 is a side view of the cutter of Fig. 22.
  • Fig. 25 is an image of a PCD cutter of the present disclosure having limited crack propogation.
  • a polycrystalline diamond (“PCD”) cutter may be formed by placing a cemented carbide substrate into the container of a press.
  • a mixture of diamond grains or diamond PATENT may be formed by placing a cemented carbide substrate into the container of a press.
  • PCD compacts are used extensively in cutting, milling, grinding, drilling and other abrasive operations. In some of these applications large forces act on the point or cutting edge and cracks develop in or behind the cutting edge or point.
  • a conventional PCD cutter 5 is shown having frontal impact damage 7.
  • the embodiments of the present disclosure have a textured surface along the top and chamfer, and/or bevel that are patterned in a way such as to increase the surface area for heat transfer, to act as a chip breaker, and/or to act as a termination point for crack formation.
  • improved toughness and thermal stability occur due to the pattern feature on the diamond table.
  • the articles “a” and “an” are used herein to refer to one or more than one object of the article.
  • an element means one or more than one element.
  • the term “about” will be understood by persons of ordinary skill in the art to depend on the context in which it is used. As used herein, “about” encompasses variations from ⁇ 10% of the reported nominal value. For example, “about 40” is meant to encompass from 36 to 44.
  • a polycrystalline diamond "PCD" cutter 10 includes a substrate 12, preferably comprised of cemented metal carbide, and a bed or volume 14 of diamond particles or grains disposed on substrate 12.
  • Substrate 12 is preferably a cobalt bonded tungsten carbide (Co-WC) substrate.
  • Co-WC cobalt bonded tungsten carbide
  • volume of PCD 14 and substrate 12 can be coated with a suitable material.
  • PCD volume 14 includes a cutting surface 16 and an outer circumference 18 along which a cutting edge 20 is disposed.
  • a chamfer 24 extends along an outer circumference 18 from cutting edge 20 by an angle, for example 45°. Although only one chamfer is shown it should be appreciated that a plurality of chamfers, either stacked above one another or extending along portions of the outer circumference 18, can be provided. Moreover, chamfer 24 can extend only partially along the height of an outer
  • Cutting surface 16 and chamfer 24 includes a textured surface 30 formed therein.
  • textured surface 30 can be applied into a plurality of different patterns by using a laser cutting technique.
  • the laser cutting technique may incorporate a laser having wavelength and power selected to super-heat metal solvent catalyst material that remains in the polycrystalline diamond from the synthesis procedure.
  • the superheating of the solvent metal catalyst may vaporize the solvent metal catalyst, and may carry diamond away, thereby forming a channel in the underlying diamond.
  • the channel generally has a "u-shaped" form having a round bottom at positions generally parallel with the underlying diamond surface into which the channel is formed.
  • the laser cutting technique may also cut diamond through an ablation mechanism.
  • the laser cutting technique may be applied across multiple areas of the diamond, thereby forming a textured surface 30 on the diamond.
  • the channel appears as a line that is formed in the exterior surfaces of the diamond.
  • textured surface 30 is formed by a radially-arrayed grid pattern 32 formed by a plurality of intersecting radial lines 34 and radial circles 36.
  • the texture surface 30 may not extend to the cylindrical surface of the PCD volume 14 that is spaced apart from the chamfer 24 and positioned opposite from the cutting surface 16.
  • the radially arrayed elements that form the textured surface 30 on the chamfer 24 may include at least two adjacent repeating elements that are spaced apart about 6 degrees or less from one another.
  • the radially arrayed elements that form the textured surface 30 on the chamfer 24 may include at least three adjacent repeating elements, where the outside repeating elements are spaced apart from the center PATENT
  • the adjacent repeating elements may be spaced apart from one another in a range from out 2 degrees to about 6 degrees, for example, from about 3.6 to about 4.4 degrees, for example, about 4 degrees, or from about 2 degrees to about 4.4 degrees, for example, from about 2.7 degrees to about 4.4 degrees.
  • the repeating elements may be evenly spaced around the circumference of the chamfer 24. In other embodiments, the repeating elements may be unevenly spaced around the circumference of the chamfer 24.
  • textured surface 30 can be provided along a periphery portion 28 of cutting surface 16.
  • periphery portion 28 having textured surface 30 can be approximately 20% of the geometric area of the cutting surface 16.
  • more or less of the cutting surface 16 can include the texturing, for example, up to about 50%> of the geometric area, as long as the volume of diamond is not decreased to the point to negatively affect performance.
  • the percentage loss of diamond is smaller, for example, less than 5%.
  • Radial lines 34 and radial circles 36 can have a depth of about 10 ⁇ to about 0.1 mm and a width of about 0.002" (inches) to about 0.004" (inches). Radial lines 34 are spaced at about 4 degrees. Radial circles 36 are spaced at about 0.020" from one another. The PCD volume 14 has a nominal outer diameter of 16 mm.
  • textured surface 30 can be formed by a pattern of a plurality of the radial circles 36. In this embodiment, the radial circles can have the same depth and width as described above, however, the spacing of the lines along periphery portion 28 can be decreased to about 0.004".
  • textured surface 30 can also be a pattern formed solely by radial lines 34, with the dimensions thereof being the same as described above.
  • the spacing between at least two adjacent radial lines may be selected in a range from about 2 degrees to about 6 degrees, for example, from about 3.6 to about 4.4 degrees, for example, about 4 degrees, or from about 2 degrees to about 4.4 degrees, for example, PATENT
  • the spacing between adjacent radial lines may be approximately even when evaluated around the diameter of the PCD volume 14. In other embodiments, the spacing between adjacent radial lines may be uneven when evaluated around the diameter of the PCD volume 14.
  • Radial lines 34 can extend completely through the volume of diamond or as shown in Fig. 11 , the radial lines can extend a distance into the volume of diamond that is less than the complete thickness of the diamond, as will be described further herein.
  • textured surface 30 can be formed with a pattern of a plurality of radial circles 38 having repeating spherical shapes that are superimposed on the radial circles 38 and located along both periphery portion 28 and chamfer 24, forming so-called spherical radial circles 38.
  • the repeating spherical shapes may have a nominal diameter of from about 0.010" to about 0.050".
  • Spherical radial circles 38 can have the same depth and width as described above.
  • radial lines are not limited to straight or smooth lines. Wavy, or irregular lines may also assist with heat dissipation.
  • PCD cutter 10 has a textured surface 30 having a pattern 40 cut into the periphery portion 28.
  • lines 42 of pattern 40 extend into chamfer 24.
  • the width of each line 42 of the pattern can be about 10 ⁇ to about 0.5 mm and the depth about 10 ⁇ to about 0.1 mm, measured into the surface.
  • Pattern 40 can be a repeat of pattern sections 44, for example, from about 3 (as shown) to about 5 sections disposed about the periphery portion 28.
  • the cutter may have a plurality of areas such that when one section 44 is worn, the cutter can be rotated to another section in which the pattern 40 repeats, and the cutter may be run again, presenting equivalent textured surfaces for the material removal operation.
  • PCD cutter 10 can have the textured surface 30 only on chamfer 24.
  • cutting surface 16 can be free of texturing/patterning.
  • Textured surface 30 can be formed by radial lines 46. As depicted in FIG. 19, the radial lines 46 may be oriented to be non-planar with an axis of symmetry of the PCD cutter 10. In other PATENT
  • the radial lines 46 may be oriented to be planar with an axis of symmetry of the PCD cutter 10.
  • the radial lines 46 terminate at locations corresponding to the termination of the chamfer 24 at the cutting surface 16 and the generally-cylindrical surface along the outer diameter of the volume 14 of diamond particles.
  • Radial lines 46 have a maximum depth of about 10 ⁇ to about 0.1 mm and a width of about 0.002" to about 0.004". It should be appreciated that the depth of each radial line can vary from, for example, the inside to outside (cutting edge to substrate).
  • the radial lines can be spaced from about 0.01" to about 0.02" apart from one another.
  • the spacing between the radial lines determines how aggressively the cutter engages the rock or other material being drilled.
  • the size and the spacing of the radial lines provides more diamond along the chamfer 24 than void along the chamfer 24. For example, with a spacing of 0.01" and a width of 0.004", diamond accounts for approximately 60% of the material along the chamfer 24. With a spacing of 0.02" and a width of 0.002", diamond accounts for approximately 90% of the material along the chamfer 24.
  • PCD cutter 10 can have a textured surface 50 having a plurality of different patterns 52, 54, 56, 58 located at different areas of the cutter and even superimposed upon each other.
  • the particular form of the patterns 52, 54, 56, 58 can be varied and the actual design thereof is not limited.
  • textured surface 50 located on periphery portion 28 can have circle pattern 52, spherical radial circle 54 and curved radial lines 56.
  • Textured surface 50 located on chamfer can have a similar pattern or a different pattern 58 as shown.
  • the negative portions of patterned, textured surfaces 30 and 50 can be coated or filled with an appropriate material. Examples of materials include those materials that would reduce the coefficient of friction at the cutting edge, such as a soft, non-catalytic metal, for example, copper, lead, bismuth, aluminum, or carbides or nitrides thereof.
  • the PCD cutters of the present disclosure can be formed by providing a cemented carbide substrate, disposing a volume of polycrystalline diamond material on the PATENT
  • the textured surface is formed by laser cutting.
  • the compact is placed in a laser cutting machine and aligned properly so that the CAD-driven laser cuts the pattern appropriately.
  • the pattern of the textured surface can be applied to a desired portion of the PCD volume.
  • the textured surface if formed on at least a chamfer disposed along an outer circumference of the volume of polycrystalline diamond to provide a termination point for crack propagation and to decrease chipping of the volume of polycrystalline diamond.
  • a crack may run along the pre-cut line of the textured surface in the chamfer and terminate before the crack grows into the cutting surface, thereby preserving the structural integrity of the surrounding portions of the cutter.
  • the textured surface can have a variety of patterns.
  • the cutter can be finished, for example, leached, cleaned or machined.
  • Another feature of the PCD cutter of the present disclosure is that leaching to remove retained metal solvent catalyst that remains in the diamond from the synthesis process is improved due to the positioning of the radial lines of the pattern and volume removal. It is believed that it is not feasible to leach a cutter that has been cut deeply. Such cutters that are deeply cut may expose the carbide to the leaching acid, thereby impairing the structural integrity of the cutter.
  • the PCD cutter of the present disclosure having cuts that extend a distance less than the thickness of the diamond will still allow the cutter to be leachable.
  • leaching flow shown by line 70, varies from leached to non-leached portions, i.e., where the leaching agent extends into the grooves of the patterns of the textured surface. The thermal expansion difference is PATENT
  • a polycrystallme diamond cutter for a tool comprising: a substrate of cemented carbide; a volume of polycrystallme diamond bonded to said substrate; at least one chamfer extending along an outer circumference of the volume of polycrystallme diamond; and a textured surface disposed on at least the at least one chamfer, wherein the textured surface has at least about 60% diamond along the at least one chamfer, and the textured surface provides a termination point for crack formation, an increased surface area for heat transfer, and decreasing chipping of the volume of polycrystallme diamond.
  • each of the radial circles and/or each of the radial lines has a depth of about 10 ⁇ to about 0.1 mm and a width of about 0.002" to about 0.004".
  • a method for forming a polycrystalline diamond cutter comprising the steps of: providing a cemented carbide substrate; disposing a volume of polycrystalline diamond material on the cemented carbide substrate; subjecting said substrate and volume of diamond material to a high pressure and a high temperature condition to bond said volume of diamond material and substrate; and forming a textured surface on at least at least one chamfer disposed along an outer circumference of the volume of polycrystalline diamond, wherein the textured surface has at least about 60% diamond along the at least one chamfer, and the textured surface providing a termination point for crack formation, an increased surface area for heat transfer, and to decrease chipping of the volume of polycrystalline diamond.
  • volume of polycrystalline diamond includes a cutting surface having a periphery portion, the textured surface being disposed on the periphery portion and the at least one chamfer.
  • each of the radial circles and/or each of the radial lines has a depth of about 10 ⁇ to about 0.1 mm and a width of about 0.002" to about 0.004".

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Geology (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

L'invention concerne un élément de coupe (10) compact en diamant polycristallin destiné à un outil et qui comprend un substrat (12) de carbure cémenté et un volume de diamant polycristallin (14) lié au substrat. Au moins un chanfrein (24) s'étend le long d'une circonférence extérieure du volume de diamant polycristallin. Une surface texturée (30) est placée sur le(s) chanfrein(s). La surface texturée confère un point de terminaison pour la formation de fissures, une superficie accrue pour le transfert de chaleur et permet de réduire l'ébrèchement du volume de diamant polycristallin.
PCT/US2015/049921 2014-09-15 2015-09-14 Élement de coupe compact en diamant polycristallin comportant une texturation de surface WO2016044136A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/510,547 US20170292332A1 (en) 2014-09-15 2015-09-14 Polycrystalline Diamond Compact Cutter Having Surface Texturing

Applications Claiming Priority (2)

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US201462050616P 2014-09-15 2014-09-15
US62/050,616 2014-09-15

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Cited By (9)

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Publication number Priority date Publication date Assignee Title
US10022840B1 (en) 2013-10-16 2018-07-17 Us Synthetic Corporation Polycrystalline diamond compact including crack-resistant polycrystalline diamond table
USD835163S1 (en) 2016-03-30 2018-12-04 Us Synthetic Corporation Superabrasive compact
US10399206B1 (en) 2016-01-15 2019-09-03 Us Synthetic Corporation Polycrystalline diamond compacts, methods of fabricating the same, and methods of using the same
US10400517B2 (en) 2017-05-02 2019-09-03 Baker Hughes, A Ge Company, Llc Cutting elements configured to reduce impact damage and related tools and methods
US10570668B2 (en) 2018-07-27 2020-02-25 Baker Hughes, A Ge Company, Llc Cutting elements configured to reduce impact damage and mitigate polycrystalline, superabrasive material failure earth-boring tools including such cutting elements, and related methods
US10577870B2 (en) 2018-07-27 2020-03-03 Baker Hughes, A Ge Company, Llc Cutting elements configured to reduce impact damage related tools and methods—alternate configurations
US20230417109A1 (en) * 2020-11-24 2023-12-28 Schlumberger Technology Corporation Pdc cutter with enhanced performance and durability
US11920409B2 (en) 2022-07-05 2024-03-05 Baker Hughes Oilfield Operations Llc Cutting elements, earth-boring tools including the cutting elements, and methods of forming the earth-boring tools
US12123262B2 (en) * 2021-11-23 2024-10-22 Schlumberger Technology Corporation PDC cutter with enhanced performance and durability

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US9062505B2 (en) 2011-06-22 2015-06-23 Us Synthetic Corporation Method for laser cutting polycrystalline diamond structures
GB201622474D0 (en) * 2016-12-31 2017-02-15 Element Six (Uk) Ltd Superhard constructions & methods of making same
WO2023172401A1 (fr) * 2022-03-10 2023-09-14 Us Synthetic Corporation Élément en diamant polycristallin comprenant au moins une caractéristique de lixiviation, inserts d'outil de coupe et systèmes les incorporant, et procédés associés

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WO2013040125A2 (fr) * 2011-09-16 2013-03-21 Baker Hughes Incorporated Éléments de coupe pour des outils de forage du sol, outils de forage du sol comprenant de tels éléments de coupe et procédés associés
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CN201202408Y (zh) * 2008-06-04 2009-03-04 河南四方达超硬材料股份有限公司 表面刻槽的聚晶金刚石硬质合金复合片
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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10022840B1 (en) 2013-10-16 2018-07-17 Us Synthetic Corporation Polycrystalline diamond compact including crack-resistant polycrystalline diamond table
US10864614B1 (en) 2013-10-16 2020-12-15 Us Synthetic Corporation Methods of forming polycrystalline diamond compact including crack-resistant polycrystalline diamond table
US10399206B1 (en) 2016-01-15 2019-09-03 Us Synthetic Corporation Polycrystalline diamond compacts, methods of fabricating the same, and methods of using the same
US11865672B1 (en) 2016-01-15 2024-01-09 Us Synthetic Corporation Polycrystalline diamond compacts, methods of fabricating the same, and methods of using the same
USD835163S1 (en) 2016-03-30 2018-12-04 Us Synthetic Corporation Superabrasive compact
US10400517B2 (en) 2017-05-02 2019-09-03 Baker Hughes, A Ge Company, Llc Cutting elements configured to reduce impact damage and related tools and methods
US10914124B2 (en) 2017-05-02 2021-02-09 Baker Hughes, A Ge Company, Llc Cutting elements comprising waveforms and related tools and methods
US10570668B2 (en) 2018-07-27 2020-02-25 Baker Hughes, A Ge Company, Llc Cutting elements configured to reduce impact damage and mitigate polycrystalline, superabrasive material failure earth-boring tools including such cutting elements, and related methods
US10577870B2 (en) 2018-07-27 2020-03-03 Baker Hughes, A Ge Company, Llc Cutting elements configured to reduce impact damage related tools and methods—alternate configurations
US20230417109A1 (en) * 2020-11-24 2023-12-28 Schlumberger Technology Corporation Pdc cutter with enhanced performance and durability
US12123262B2 (en) * 2021-11-23 2024-10-22 Schlumberger Technology Corporation PDC cutter with enhanced performance and durability
US11920409B2 (en) 2022-07-05 2024-03-05 Baker Hughes Oilfield Operations Llc Cutting elements, earth-boring tools including the cutting elements, and methods of forming the earth-boring tools

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