WO2016041174A1 - 指纹识别装置 - Google Patents

指纹识别装置 Download PDF

Info

Publication number
WO2016041174A1
WO2016041174A1 PCT/CN2014/086844 CN2014086844W WO2016041174A1 WO 2016041174 A1 WO2016041174 A1 WO 2016041174A1 CN 2014086844 W CN2014086844 W CN 2014086844W WO 2016041174 A1 WO2016041174 A1 WO 2016041174A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead frame
sensor
layer
circuit board
conductive
Prior art date
Application number
PCT/CN2014/086844
Other languages
English (en)
French (fr)
Inventor
彭旭
古蒋林
黄波
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to US15/512,278 priority Critical patent/US10296774B2/en
Priority to CN201480048060.9A priority patent/CN105612532B/zh
Priority to PCT/CN2014/086844 priority patent/WO2016041174A1/zh
Priority to KR1020177008275A priority patent/KR20170046741A/ko
Priority to EP14902245.1A priority patent/EP3179405B1/en
Publication of WO2016041174A1 publication Critical patent/WO2016041174A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
    • G06F21/31—User authentication
    • G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1365—Matching; Classification
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
    • H04L9/32—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system or for message authentication, e.g. authorization, entity authentication, data integrity or data verification, non-repudiation, key authentication or verification of credentials
    • H04L9/3226—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system or for message authentication, e.g. authorization, entity authentication, data integrity or data verification, non-repudiation, key authentication or verification of credentials using a predetermined code, e.g. password, passphrase or PIN
    • H04L9/3231—Biological data, e.g. fingerprint, voice or retina
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Definitions

  • Embodiments of the present invention relate to the field of information technology and, more particularly, to a fingerprint recognition apparatus.
  • the active fingerprint sensor has a large recognition distance and can penetrate a thick coating, and has high practicability and reliability.
  • the high-frequency voltage of the stimulus source passes through the stainless steel to the finger, so that an RF field is formed between the finger and the sensor.
  • the sensor consists of a sensor array. Since the finger fingerprint has irregularities, the convex and concave areas have different effects on the RF field.
  • the signal size sensed by the sensor array has a peak in the convex portion and a valley value in the concave region. After comparing the magnitude of the signal strength sensed by each sensor element on the sensor array with the reference stimulus high frequency signal, the signal is amplified by an amplifier. Corresponding to the image of the finger bump on the entire array, that is, the fingerprint image.
  • a fingerprint recognition device uses an active fingerprint sensor and uses a stainless steel frame to generate a radio frequency signal.
  • Embodiments of the present invention provide another fingerprint recognition device.
  • a fingerprint identification device provided by an embodiment of the present invention includes: a conductive housing; a lead frame for transmitting a radio frequency signal; and an insulating layer disposed between the lead frame and the conductive housing.
  • the senor of the fingerprint recognition device is disposed between the fingerprint identification plane and the circuit board, and the device further includes: a fixed layer connected between the circuit board and the lead frame.
  • the conductive layer of the fingerprint recognition device is coupled between the circuit board and the lead frame, wherein the fixed layer is outside the conductive layer.
  • the pinned layer is also used to seal the connection between the circuit board and the lead frame.
  • the conductive layer is a conductive silver paste.
  • the insulating layer is in contact with an outer surface of the sensor of the fingerprint recognition device.
  • the lead frame covers a portion of the outer surface of the sensor.
  • the insulating layer is integrally formed with the lead frame.
  • the device is a terminal.
  • the conductive housing is a rear housing of the terminal.
  • another fingerprint identification device comprising: a lead frame for transmitting a radio frequency signal; a sensor; a circuit board disposed on a lower layer of the sensor; and a fixed layer connected between the circuit board and the lead frame.
  • the conductive layer of the fingerprint recognition device is coupled between the circuit board and the lead frame, wherein the fixed layer is outside the conductive layer.
  • the pinned layer is further used to seal the connection between the circuit board and the lead frame.
  • the conductive layer is a conductive silver paste.
  • the lead frame covers a portion of the outer surface of the sensor.
  • the device is a terminal.
  • Embodiments of the present invention provide an insulating layer disposed between a lead frame and a conductive housing such that the lead frame and the conductive housing are in an insulated state. Since the radio frequency signal of the emission of the lead frame is not affected when the conductive case is grounded, the present invention can be effectively applied to the conductive case.
  • FIG. 1 is a schematic diagram of the operation of a sensor in accordance with one embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a fingerprint recognition apparatus according to another embodiment of the present invention.
  • FIG. 3 is a schematic side structural view of a fingerprint recognition apparatus in accordance with another embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a terminal according to another embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a fingerprint recognition apparatus according to another embodiment of the present invention.
  • FIG. 1 is a schematic diagram of the operation of a sensor in accordance with one embodiment of the present invention.
  • the high frequency voltage of the stimulus source passes through the stainless steel to the finger, creating an RF field between the finger and the sensor.
  • the sensor consists of a sensor array. Since the finger fingerprint has irregularities, the convex and concave areas have different effects on the RF field.
  • the signal size sensed by the sensor array has a peak in the convex portion and a valley value in the concave region. After comparing the magnitude of the signal strength sensed by each sensor element on the sensor array with the reference stimulus high frequency signal, the signal is amplified by passing through the amplifier. Corresponding to the image of the finger bump on the entire array, that is, the fingerprint image. It should be understood that this embodiment is only one specific implementation of the sensor, and embodiments of the present invention are not limited thereto.
  • FIG. 3 is only a preferred embodiment of the present invention, and the corresponding components or components in FIG. 3 are relatively independent. In other words, other embodiments of the invention may be obtained without a combination of all or a portion of these components or elements.
  • the apparatus 200 of Figure 2 includes:
  • the insulating layer 230 is disposed between the lead frame 220 and the conductive housing 210.
  • the conductive housing may be a housing made of any conductor, such as metal or the like.
  • a housing made of an aluminum alloy which may be a front case or a rear case of the terminal, or a case around the fingerprint recognition area at the time of fingerprint recognition, such as a metal portion of the outer surface, may be employed.
  • a lead frame for transmitting a radio frequency signal which may be a frame made of any conductor, for example, a metal frame.
  • a bezel made of stainless steel may be employed.
  • the insulating layer may be composed of any insulating material such as an insulating colloid, a non-metal or the like.
  • the process of fingerprint recognition transmits a radio frequency signal to the conductor frame of the fingerprint recognition device 200, and the sensor recognizes the signal to facilitate fingerprint recognition.
  • Embodiments of the present invention provide an insulating layer disposed between a lead frame and a conductive housing such that the lead frame and the conductive housing are in an insulated state. Since the radio frequency signal of the emission of the lead frame is not affected when the conductive case is grounded, the present invention can be effectively applied to the conductive case.
  • the senor of the fingerprint recognition device is disposed between the fingerprint recognition plane and the circuit board, and the device of FIG. 2 further includes: a fixed layer connected between the circuit board and the lead frame.
  • the anchoring layer can be made of any material that acts as a fixing, such as a thermosetting glue or the like.
  • the fixing layer can also be sealed or unsealed.
  • the circuit board is a sensor module including, but not limited to, a printed circuit board, such as a flexible printed circuit board.
  • the conductive layer of the fingerprint identification device is connected between the circuit board and the lead frame, wherein the fixed layer is outside the conductive layer.
  • the conductive layer may be made of any material that conducts electricity, such as a metal, a dielectric, a conductive colloid (eg, a conductive silver paste), and the like.
  • the fixed layer and the conductive layer may be bonded to the conductor frame and the circuit board by a secondary dispensing process.
  • the colloid of the conductive layer acts as a circuit
  • the colloid of the fixed layer acts as a structure.
  • the colloid of the conductive layer is on the inside of the colloid of the fixed layer, in other words, closer to the chip. Thereby, the colloid of the conductive layer is prevented from being directly corroded or oxidized on the outside.
  • the conductive layer plays a fixed role to a certain extent, it mainly functions as a circuit, and the colloid of the fixed layer mainly bears the structural impact force.
  • the conductor frame height dimension D is smaller than the thickness dimension A of the sensor, as shown in A of FIG.
  • the pinned layer is also used to seal the connection circuit board to the lead frame.
  • the fixing layer Since the fixing layer is sealed, it can function as a waterproof or dustproof, see Figure B in Figure 3.
  • the conductive layer is a conductive silver paste.
  • the insulating layer is in contact with the outer surface of the sensor of the fingerprint recognition device.
  • the lead frame contacts the outer surface of the bezel and the sensor to prevent dust from entering, see Figure B in Figure 3.
  • the lead frame covers a portion of the outer surface of the sensor.
  • the conductor frame covers a portion of the outer surface of the sensor, and the conductor frame may or may not be in contact with the outer surface of the cover. It should also be understood that the lead frame can also cover the insulating layer to make the appearance more aesthetically pleasing.
  • the insulating layer covers a portion of the outer surface of the sensor, and the insulating layer may partially enclose the outer surface of the sensor such that the area of the sensor for contacting the fingerprint is smaller than the size of the sensor chip.
  • the exposed part of the sensor module becomes smaller, so the technical effect of the design is that the proportion of the fingerprint recognition area in the metal back shell is coordinated, due to the fingerprint in contact with the fingerprint.
  • the smaller identification area makes it more in line with actual needs, improves the user experience, and indirectly improves safety, such as better seismic performance.
  • the insulating layer is integrally formed with the lead frame.
  • the insulating layer and the lead frame are integrally formed, on the one hand, the waterproof and dustproof functions can be played, and on the other hand, the thickness scale of the insulating layer and the lead frame can be reduced, so that the fingerprint identification device is more precise and takes up less space.
  • FIG. 4 is a schematic structural diagram of a terminal according to another embodiment of the present invention.
  • the terminal 400 of FIG. 4 corresponds to the fingerprint recognition device described in FIG. 2.
  • the terminal of FIG. 4 may be a smartphone, or any device having a metal casing, and the terminal of FIG. 4 includes an operation panel 410. It should be understood that the terminal may also include other components such as a processor chip, a memory chip, and the like. In this terminal, components for fingerprint recognition can be used in conjunction with other components, such as integration into one chip. It can also be separate, and the components for fingerprint recognition are used relatively independently on the terminal.
  • an insulating layer disposed between the lead frame and the conductive case is provided such that the lead frame and the conductive case are in an insulated state. Since the radio frequency signal emitted by the lead frame is not affected when the conductive case is grounded, the present invention can be effectively applied to a terminal having a conductive case.
  • the electrically conductive housing is a rear case of the terminal.
  • the fingerprint recognition plane is on the rear surface of the terminal, such as the metal backshell of the handset.
  • the multi-terminal housing is made of metal. Since the fingerprint identification device is disposed on the metal back shell of the terminal, the fingerprint recognition function of the terminal is added on the one hand, and the front operation panel of the terminal is not affected, that is, the appearance is not affected, and the user is not affected. The operating habits greatly enhance the user experience.
  • FIG. 5 is a schematic structural diagram of a fingerprint recognition apparatus according to another embodiment of the present invention.
  • the apparatus 500 of FIG. 5 includes a conductor frame 510 for transmitting a radio frequency signal, a sensor 520, a circuit board 530 disposed under the sensor, and a fixed layer 540 connected between the circuit board and the lead frame.
  • the embodiment of the present invention effectively ensures the structural strength of the fingerprint recognition device by using a fixed layer between the circuit board and the lead frame.
  • the conductive layer of the fingerprint identification device is connected between the circuit board and the lead frame, wherein the fixed layer is outside the conductive layer.
  • the pinned layer is also used to seal the connection circuit board to the lead frame.
  • the fixing layer Since the fixing layer is sealed, it can function as a waterproof or dustproof, see Figure B in Figure 3.
  • the conductive layer is a conductive silver paste.
  • the insulating housing of the fingerprint recognition device is in contact with the outer surface of the sensor of the fingerprint recognition device.
  • the lead frame covers a portion of the outer surface of the sensor.
  • the device is a terminal.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • General Health & Medical Sciences (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Biomedical Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

本发明的实施例提供了一种指纹识别装置，包括：导电壳体；用于发射射频信号的导体框；绝缘层，设置在导体框和导电壳体之间。本发明的实施例提供了设置在导体框和导电壳体之间的绝缘层，使得导体框和导电壳体处于绝缘的状态。由于在导电壳体接地时，不会影响到导体框的发射的射频信号，因此，本发明能够有效地应用于导电壳体。

Description

指纹识别装置 技术领域
本发明的实施例涉及信息技术领域，并更具体地，涉及一种指纹识别装置。
背景技术
如今，指纹功能逐渐成为智能手机的新热点。主动式指纹传感器识别距离大，能穿透较厚的涂层，实用性及可靠性较高。主动式指纹传感器在工作时，刺激源的高频电压通过不锈钢到手指，使得手指和传感器之间形成了一个射频场。传感器由传感器阵列组成，由于手指指纹上有凹凸状，凸起和凹下区域对射频场的影响不一样，传感器阵列所感应的信号大小在凸起部分有峰值，在凹下区域是谷值。将传感器阵列上各传感器元素所感应的信号强度的大小与参考刺激高频信号比较之后，在经过放大器，将信号放大。对应得到的就是整个阵列上手指凹凸的图像，也即指纹图像。
现有技术中有一种指纹识别装置采用主动式指纹传感器并采用不锈钢边框产生射频信号。
发明内容
本发明的实施例提供了另一种指纹识别装置。
第一方面，本发明的实施例提供的指纹识别装置，包括：导电壳体；用于发射射频信号的导体框；绝缘层，设置在导体框和导电壳体之间。
结合第一方面，在第一方面的第一种实现方式中，指纹识别装置的传感器设置在指纹识别平面与电路板之间，装置还包括：固定层，连接在电路板与导体框之间。
结合第一方面的第一种实现方式，在第一方面的第二种实现方式中，指纹识别装置的导电层，连接在电路板与导体框之间，其中，固定层在导电层的外侧。
结合第一方面的第二种实现方式，在第一方面的第三种实现方式中，固定层还用于密封连接电路板与导体框。
结合第一方面的第二种或第三种实现方式，在第一方面的第四种实现方式中，导电层为导电银浆。
结合第一方面、第一方面的第一种至第四种中的任一种实现方式，在第一方面的第五种实现方式中，绝缘层与指纹识别装置的传感器的外表面接触。
结合第一方面、第一方面的第一种至第五种中的任一种实现方式，在第一方面的第六种实现方式中，导体框覆盖传感器的部分外表面。
结合第一方面、第一方面的第一种至第六种中的任一种实现方式，在第一方面的第七种实现方式中，绝缘层与导体框一体成型。
结合第一方面、第一方面的第一种至第七种中的任一种实现方式，在第一方面的第八种实现方式中，该装置为一种终端。
结合第一方面的第八种实现方式，在第一方面的第九种实现方式中，导电壳体为终端的后壳。
第二方面，提供另一种指纹识别装置，包括：用于发射射频信号的导体框；传感器；电路板，设置在传感器的下层；固定层，连接在电路板与导体框之间。
结合第二方面，在第二方面的第一种实现方式中，指纹识别装置的导电层，连接在电路板与导体框之间，其中，固定层在导电层的外侧。
结合第二方面的第一种实现方式，在第二方面的第二种实现方式中，固定层还用于密封连接电路板与导体框。
结合第二方面的第一种或第二种实现方式，在第二方面的第三种实现方式中，导电层为导电银浆。
结合第二方面、第二方面的第一种至第三种中的任一种实现方式，在第二方面的第四种实现方式中，指纹识别装置的绝缘壳体与指纹识别装置的传感器的外表面接触。
结合第二方面、第二方面的第一种至第四种中的任一种实现方式，在第二方面的第五种实现方式中，导体框覆盖传感器的部分外表面。
结合第二方面、第二方面的第一种至第五种中的任一种实现方式，在第二方面的第六种实现方式中，该装置为一种终端。
本发明的实施例提供了设置在导体框和导电壳体之间的绝缘层，使得导体框和导电壳体处于绝缘的状态。由于在导电壳体接地时，不会影响到导体框的发射的射频信号，因此，本发明能够有效地应用于导电壳体。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对本发明实施例中所需要使用的附图作简单地介绍，显而易见地，下面所描述的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是根据本发明的一个实施例的传感器工作原理的示意图。
图2是根据本发明的另一实施例的指纹识别装置的示意性结构图。
图3是根据本发明的另一实施例的指纹识别装置的示意性侧视结构图。
图4是根据本发明的另一实施例的终端的示意性结构图。
图5是根据本发明的另一实施例的指纹识别装置的示意性结构图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明的一部分实施例，而不是全部实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都应属于本发明保护的范围。
图1是根据本发明的一个实施例的传感器工作原理的示意图。如图所示，刺激源的高频电压通过不锈钢到手指，使得手指和传感器之间形成了一个射频场。传感器由传感器阵列组成，由于手指指纹上有凹凸状，凸起和凹下区域对射频场的影响不一样，传感器阵列所感应的信号大小在凸起部分有峰值，在凹下区域是谷值。将传感器阵列上各传感器元素感应的信号强度的大小与参考刺激高频信号比较之后，在经过放大器，将信号放大。对应得到的就是整个阵列上手指凹凸的图像，也即指纹图像。应理解，本实施例只是传感器的一个具体的实施方式，本发明的实施例不限于此。
图2是根据本发明的另一实施例的指纹识别装置的示意性结构图。为了更好的理解本发明的技术方案，结合图3来进行描述，应理解图3所示的装置仅为本发明的一个优选的实施例，图3中相应的部件或元件是相对独立的，换句话说，将这些部件或元件的全部或部分的组合，在不需创造性劳动的前提下，可以得到本发明的其他实施例。图2的装置200包括：
导电壳体210；
用于发射射频信号的导体框220；
绝缘层230，设置在导体框220和导电壳体210之间。
应理解，导电壳体可以是由任意的导体制成的壳体，例如金属等。作为优选的实施例可以采用由铝合金制成的壳体，导电壳体可以是终端的前壳、后壳，也可是在指纹识别时指纹识别区域周围的壳体，例如外表面的金属部分。导体框，用于发射射频信号，可以是任意的导体制成的框，例如、金属框。作为优选的实施例，可以采用不锈钢制成的边框。绝缘层可以由任何起绝缘作用的物质组成，例如，绝缘胶体，非金属等。
换句换说，指纹识别的过程为指纹识别装置200的导体框发射射频信号，并由传感器识别信号，以便于进行指纹识别。
本发明的实施例提供了设置在导体框和导电壳体之间的绝缘层，使得导体框和导电壳体处于绝缘的状态。由于在导电壳体接地时，不会影响到导体框的发射的射频信号，因此，本发明能够有效地应用于导电壳体。
根据本发明的实施例，指纹识别装置的传感器设置在指纹识别平面与电路板之间，图2的装置还包括：固定层，连接在电路板与导体框之间。
应理解，固定层可以是任何起固定作用的物质制成，例如，热固胶等。该固定层还可以是密封的，也可以是非密封的。电路板属于传感器模组，包括但不限于印制电路板，例如、柔性印制电路板。
根据本发明的实施例，指纹识别装置的导电层，连接在电路板与导体框之间，其中，固定层在导电层的外侧。
应理解，导电层可以是任何起导电作用的物质制成，例如，金属，电介质，导电的胶体(例如、导电银浆)等。此外，可以采用二次点胶工艺将固定层和导电层粘接导体框与电路板。例如，导电层的胶体起电路导通作用，固定层的胶体起结构粘固作用。
导电层的胶体在固定层的胶体的内侧，换句换说，更靠近芯片。从而避免了导电层的胶体直接暴露在外侧被腐蚀或氧化。导电层虽然在一定程度上也起到固定的作用，但主要起电路导通作用，固定层的胶体主要承担结构冲击力。另外由于固定层和导电层具有一定厚度，因此，作为优选的实施例，导体框高度尺寸D小于传感器的厚度尺寸A，如图3的A图示出的。
根据本发明的实施例，固定层还用于密封连接电路板与导体框。
由于该固定层是密封的，可以起到防水或防尘的作用，参见图3中的B图。
根据本发明的实施例，导电层为导电银浆。
根据本发明的实施例，绝缘层与指纹识别装置的传感器的外表面接触。
具体地，导体框使边框和传感器的外表面接触，可以防止灰尘进入，参见图3中的B图。
根据本发明的实施例，导体框覆盖传感器的部分外表面。
应理解，导体框覆盖传感器的部分外表面，可以是导体框与覆盖的外表面是接触的，也可以是不接触的。还应理解，导体框还可以覆盖绝缘层，使得外观更加美观。
应理解，绝缘层覆盖传感器的部分外表面，可以是绝缘层部分包裹传感器的外表面，使得传感器用于接触指纹的区域小于，传感器芯片的尺寸。换句话说，通过传感器下沉的设计方式，使得传感器的模组外露的部分变小，这样设计产生的技术效果是，使得金属后壳中的指纹识别区域的比例协调，由于与指纹接触的指纹识别区域较小使得更符合实际的需求，提高了用户体验，也间接的提高了安全性，例如更好的抗震性能。
根据本发明的实施例，绝缘层与导体框一体成型。
应理解，由于绝缘层与导体框一体成型，一方面可以起到防水防尘的作用，另一方面可以减少绝缘层与导体框的厚度尺度，使得指纹识别装置更加精密，占用的空间更小。
图4是根据本发明的另一实施例的终端的示意性结构图。图4的终端400对应于图2中描述的指纹识别装置。
图4的终端可以是智能手机，或者任何具有金属外壳的设备，图4的终端包括操作面板410。应理解，该终端还可以包括其他的部件，例如，处理器芯片，存储器芯片等。在该终端中，用于指纹识别的部件可以和其他的部件配合使用，例如集成一个芯片中。也可以是分离的，用于指纹识别的部件在该终端上相对独立的使用。
根据本发明的实施例的终端，提供了设置在导体框和导电壳体之间的绝缘层，使得导体框和导电壳体处于绝缘的状态。由于在导电壳体接地时，不会影响到导体框的发射的射频信号，因此，本发明能够有效地应用于带有导电壳体的终端。
根据本发明的实施例，导电壳体为终端的后壳。
具体地，指纹识别平面在终端的后表面上，例如手机的金属后壳上。很 多终端外壳都是金属的，由于指纹识别装置设置在终端的金属后壳上，一方面增加了终端的指纹识别功能，同时不影响终端的前面的操作面板，即不影响美观，也不影响用户的操作习惯，极大地提升了用户体验。
另外，现有技术中的指纹识别装置的结构的工艺复杂，本发明提供了一种指纹识别装置，能够有效地在保证结构强度的前提下，降低工艺的复杂性。图5是根据本发明的另一实施例的指纹识别装置的示意性结构图。图5的装置500包括：用于发射射频信号的导体框510；传感器520；电路板530，设置在传感器的下层；固定层540，连接在电路板与导体框之间。
本发明的实施例由于采用了电路板与导体框之间的固定层，有效地保证了指纹识别装置的结构强度。
根据本发明的实施例，指纹识别装置的导电层，连接在电路板与导体框之间，其中，固定层在导电层的外侧。
根据本发明的实施例，固定层还用于密封连接电路板与导体框。
由于该固定层是密封的，可以起到防水或防尘的作用，参见图3中的B图。
根据本发明的实施例，导电层为导电银浆。
根据本发明的实施例，指纹识别装置的绝缘壳体与指纹识别装置的传感器的外表面接触。
根据本发明的实施例，导体框覆盖传感器的部分外表面。
根据本发明的实施例，该装置为一种终端。
图5的装置的相应部件的功能与描述可以参照图2的装置，此处不作赘述。
另外，以上所述仅为本发明技术方案的较佳实施例而已，并非用于限定本发明的保护范围。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (17)

  1. 一种指纹识别装置，其特征在于，包括：
    导电壳体；
    用于发射射频信号的导体框；
    绝缘层，设置在所述导体框和所述导电壳体之间。
  2. 根据权利要求1所述的装置，其特征在于，所述指纹识别装置的传感器设置在指纹识别平面与电路板之间，
    所述装置还包括：
    固定层，连接在所述电路板与所述导体框之间。
  3. 根据权利要求2中所述的装置，其特征在于，所述指纹识别装置的导电层，连接在所述电路板与所述导体框之间，其中，所述固定层在所述导电层的外侧。
  4. 根据权利要求3中所述的装置，其特征在于，所述固定层还用于密封连接所述电路板与所述导体框。
  5. 根据权利要求3或4中所述的装置，其特征在于，所述导电层为导电银浆。
  6. 根据权利要求1-5中的任一项所述的装置，其特征在于，所述绝缘层与所述指纹识别装置的传感器的外表面接触。
  7. 根据权利要求1-6中的任一项所述的装置，其特征在于，所述导体框覆盖所述传感器的部分外表面。
  8. 根据权利要求1-7中的任一项所述的装置，其特征在于，所述绝缘层与所述导体框一体成型。
  9. 根据权利要求1-8中的任一项所述的装置，其特征在于，所述装置为一种终端。
  10. 根据权利要求9中所述的装置，其特征在于，所述导电壳体为所述终端的后壳。
  11. 一种指纹识别装置，其特征在于，包括：
    用于发射射频信号的导体框；
    传感器；
    电路板，设置在传感器的下层；
    固定层，连接在所述电路板与所述导体框之间。
  12. 根据权利要求11中所述的装置，其特征在于，所述指纹识别装置的导电层，连接在所述电路板与所述导体框之间，其中，所述固定层在所述导电层的外侧。
  13. 根据权利要求12中所述的装置，其特征在于，所述固定层还用于密封连接所述电路板与所述导体框。
  14. 根据权利要求12或13中所述的装置，其特征在于，所述导电层为导电银浆。
  15. 根据权利要求11-14中的任一项所述的装置，其特征在于，所述指纹识别装置的绝缘壳体与所述指纹识别装置的传感器的外表面接触。
  16. 根据权利要求11-15中的任一项所述的装置，其特征在于，所述导体框覆盖所述传感器的部分外表面。
  17. 根据权利要求11-16中的任一项所述的装置，其特征在于，所述装置为一种终端。
PCT/CN2014/086844 2014-09-18 2014-09-18 指纹识别装置 WO2016041174A1 (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US15/512,278 US10296774B2 (en) 2014-09-18 2014-09-18 Fingerprint recognition apparatus
CN201480048060.9A CN105612532B (zh) 2014-09-18 2014-09-18 指纹识别装置
PCT/CN2014/086844 WO2016041174A1 (zh) 2014-09-18 2014-09-18 指纹识别装置
KR1020177008275A KR20170046741A (ko) 2014-09-18 2014-09-18 지문 인식 장치
EP14902245.1A EP3179405B1 (en) 2014-09-18 2014-09-18 Fingerprint identification apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/086844 WO2016041174A1 (zh) 2014-09-18 2014-09-18 指纹识别装置

Publications (1)

Publication Number Publication Date
WO2016041174A1 true WO2016041174A1 (zh) 2016-03-24

Family

ID=55532460

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/086844 WO2016041174A1 (zh) 2014-09-18 2014-09-18 指纹识别装置

Country Status (5)

Country Link
US (1) US10296774B2 (zh)
EP (1) EP3179405B1 (zh)
KR (1) KR20170046741A (zh)
CN (1) CN105612532B (zh)
WO (1) WO2016041174A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI697019B (zh) * 2018-06-11 2020-06-21 海華科技股份有限公司 支架、光學組件及光學模組

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102133719B1 (ko) * 2018-12-24 2020-07-14 주식회사 동운아나텍 지문 도어락용 베젤 및 지문 센서 모듈

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1766904A (zh) * 2004-10-29 2006-05-03 乐金电子(中国)研究开发中心有限公司 指纹识别传感器及移动通信终端指纹识别装置
CN103793691A (zh) * 2014-01-28 2014-05-14 深圳市汇顶科技股份有限公司 指纹识别装置及具有其的移动终端
CN103942538A (zh) * 2014-04-04 2014-07-23 南昌欧菲生物识别技术有限公司 指纹识别传感器封装结构

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6067368A (en) 1996-01-26 2000-05-23 Authentec, Inc. Fingerprint sensor having filtering and power conserving features and related methods
ATE222010T1 (de) * 1998-05-19 2002-08-15 Infineon Technologies Ag Sensoreinrichtung zur erfassung von biometrischen merkmalen, insbesondere fingerminutien
ATE280976T1 (de) 2000-03-24 2004-11-15 Infineon Technologies Ag Gehäuse für biometrische sensorchips
FR2827028B1 (fr) * 2001-07-06 2003-09-26 Airbus France Aeronef a carenage ventral et joint pour un tel aeronef
WO2004093005A1 (ja) 2003-04-15 2004-10-28 Fujitsu Limited 情報処理装置
RU2506363C2 (ru) * 2005-03-11 2014-02-10 Интернэшнл Пэйпа Кампани Бумажная или картонная основа, содержащая целлюлозные волокна и расширяемые микросферы, и упаковочная тара, содержащая эту основу
US8358816B2 (en) 2005-10-18 2013-01-22 Authentec, Inc. Thinned finger sensor and associated methods
TW201019628A (en) 2008-08-15 2010-05-16 Ivi Smart Technologies Inc RF power conversion circuits & methods, both for use in mobile devices
US20100321159A1 (en) * 2009-06-18 2010-12-23 Authentec, Inc. Touch based data communication using biometric finger sensor and associated methods
CN102870273B (zh) * 2011-04-26 2015-09-30 丰田自动车株式会社 电源装置
CN202948464U (zh) * 2012-11-08 2013-05-22 南昌大学 生物识别无线充电超薄有源电子标签
JP5759660B2 (ja) * 2013-06-21 2015-08-05 レノボ・シンガポール・プライベート・リミテッド タッチ・スクリーンを備える携帯式情報端末および入力方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1766904A (zh) * 2004-10-29 2006-05-03 乐金电子(中国)研究开发中心有限公司 指纹识别传感器及移动通信终端指纹识别装置
CN103793691A (zh) * 2014-01-28 2014-05-14 深圳市汇顶科技股份有限公司 指纹识别装置及具有其的移动终端
CN103942538A (zh) * 2014-04-04 2014-07-23 南昌欧菲生物识别技术有限公司 指纹识别传感器封装结构

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3179405A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI697019B (zh) * 2018-06-11 2020-06-21 海華科技股份有限公司 支架、光學組件及光學模組

Also Published As

Publication number Publication date
CN105612532B (zh) 2019-08-13
EP3179405A1 (en) 2017-06-14
EP3179405A4 (en) 2017-11-01
US10296774B2 (en) 2019-05-21
US20170277932A1 (en) 2017-09-28
CN105612532A (zh) 2016-05-25
EP3179405B1 (en) 2019-07-31
KR20170046741A (ko) 2017-05-02

Similar Documents

Publication Publication Date Title
WO2017162136A1 (zh) 天线装置、金属外壳及移动终端
US11157718B2 (en) Fingerprint identification module and terminal device
KR20190024558A (ko) 실제 필기 스타일러스와 터치 장치
JP2013546199A5 (zh)
EP3457315A1 (en) Fingerprint module and mobile terminal having same
US20090073672A1 (en) Electromagnetic shield and electronic device using the same
TWI599919B (zh) 具有雙發射電極之電容筆
CN109492504B (zh) 超声波生物识别装置及其制备方法和电子设备
TW201442508A (zh) 相機模組
TWM542272U (zh) 電連接器
TWI513102B (zh) 通訊裝置
WO2016041174A1 (zh) 指纹识别装置
WO2017201755A1 (zh) 指纹模组及电子设备
CN105048203B (zh) 连接器
CN203858645U (zh) 指纹识别传感器封装结构
TWM430047U (en) Connector with thin film shielding structure
WO2021008389A1 (zh) 终端设备
JP5462118B2 (ja) 電界通信装置ホルダー
US9531853B2 (en) Electronic module and electronic device
WO2019052552A1 (zh) 一种降低补光灯干扰wifi信号接收的移动终端
CN106887702B (zh) 移动终端及其天线金属插座组件
CN208539090U (zh) 壳体、天线装置和终端设备
US9442582B2 (en) Portable electronic device with a surface mounted technology touch pad
JP4724410B2 (ja) コンデンサマイクロホン
CN103313175A (zh) 微机电麦克风封装模块

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14902245

Country of ref document: EP

Kind code of ref document: A1

REEP Request for entry into the european phase

Ref document number: 2014902245

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2014902245

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 15512278

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20177008275

Country of ref document: KR

Kind code of ref document: A