WO2016039518A1 - Power inductor and method for manufacturing same - Google Patents
Power inductor and method for manufacturing same Download PDFInfo
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- WO2016039518A1 WO2016039518A1 PCT/KR2015/004139 KR2015004139W WO2016039518A1 WO 2016039518 A1 WO2016039518 A1 WO 2016039518A1 KR 2015004139 W KR2015004139 W KR 2015004139W WO 2016039518 A1 WO2016039518 A1 WO 2016039518A1
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- Prior art keywords
- substrate
- power inductor
- external electrode
- coil
- metal powder
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- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 106
- 229910052751 metal Inorganic materials 0.000 claims description 103
- 239000002184 metal Substances 0.000 claims description 103
- 239000000843 powder Substances 0.000 claims description 79
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 37
- 239000000696 magnetic material Substances 0.000 claims description 37
- 229920000642 polymer Polymers 0.000 claims description 35
- 239000011231 conductive filler Substances 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 25
- 230000035699 permeability Effects 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 19
- 239000011889 copper foil Substances 0.000 claims description 17
- 229910052742 iron Inorganic materials 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 claims description 11
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 8
- 239000003575 carbonaceous material Substances 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 238000007639 printing Methods 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 238000004544 sputter deposition Methods 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 230000008021 deposition Effects 0.000 description 7
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 6
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 6
- 239000006247 magnetic powder Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- -1 iron-aluminum-chromium Chemical compound 0.000 description 4
- 230000005415 magnetization Effects 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000002861 polymer material Substances 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- 239000005751 Copper oxide Substances 0.000 description 3
- JSPBDYKPSGHCQF-UHFFFAOYSA-N [Cu]=O.[Zn].[Ni] Chemical compound [Cu]=O.[Zn].[Ni] JSPBDYKPSGHCQF-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910000428 cobalt oxide Inorganic materials 0.000 description 3
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910000480 nickel oxide Inorganic materials 0.000 description 3
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 3
- 229920000052 poly(p-xylylene) Polymers 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- KSIIOJIEFUOLDP-UHFFFAOYSA-N [Si].[Fe].[Ni] Chemical compound [Si].[Fe].[Ni] KSIIOJIEFUOLDP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 2
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/02—Fixed inductances of the signal type without magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
Definitions
- the present invention relates to a power inductor, and more particularly, to a power inductor capable of preventing a short with a peripheral device and a method of manufacturing the same.
- Power inductors are mainly provided in power supply circuits such as DC-DC converters in portable devices. Such power inductors have been increasingly used in place of the conventional coiled choke coil patterns (Choke Coil) in accordance with the high frequency and miniaturization of the power circuit. In addition, power inductors are being developed in the direction of miniaturization, high current, and low resistance according to the size reduction and multifunction of portable devices.
- the power inductor may be manufactured in the form of a laminate in which ceramic sheets made of a plurality of ferrites or low dielectric constant dielectrics are stacked.
- a metal pattern is formed on the ceramic sheet in the form of a coil pattern, and the coil pattern formed on each ceramic sheet is connected by conductive vias formed in each ceramic sheet, and overlaps along the vertical direction in which the sheets are stacked. Can be achieved.
- the body constituting such a power inductor is conventionally manufactured using a magnetic material composed of quaternary systems of nickel (Ni) -zinc (Zn) -copper (Cu) -iron (Fe).
- the magnetic material may not implement the high current characteristic required by recent portable devices because the saturation magnetization value is lower than that of the metal material. Therefore, by manufacturing the body constituting the power inductor using metal powder, the saturation magnetization value can be relatively increased as compared with the case in which the body is made of magnetic material.
- the saturation magnetization value can be relatively increased as compared with the case in which the body is made of magnetic material.
- eddy current loss and hysteresis loss at high frequencies may increase, resulting in a serious loss of material.
- a structure insulating a polymer between metal powders is applied.
- the power inductor has a structure in which a coil is formed inside the body including the metal powder and the polymer, and an external electrode is formed outside the body to be connected to the coil.
- the external electrodes may be formed on the lower and upper portions as well as on two opposite sides of the body.
- an external electrode formed on the lower surface of the body is mounted on a printed circuit board (PCB).
- the power inductor is mounted adjacent to the power management IC (PMIC).
- the PMIC has a thickness of about 1 mm, and power inductors are also manufactured to the same thickness. Because PMICs generate high-frequency noise that affects peripheral circuits or devices, the PMIC and power inductor are covered with a shield can made of metal, such as stainless steel. However, the power inductor is shorted with the shield can because the external electrode is also formed on the upper side.
- a power inductor manufactured by using a metal powder and a polymer has a problem in that inductance is lowered with increasing temperature. That is, the temperature of the power inductor increases due to the heat generation of the portable device to which the power inductor is applied, and as a result, the inductance decreases while the metal powder forming the body of the power inductor is heated.
- the present invention provides a power inductor capable of preventing a short circuit of an external electrode and a method of manufacturing the same.
- the present invention provides a power inductor capable of preventing a short with a shield can by preventing an external electrode from being formed on an upper side of a body, and a method of manufacturing the same.
- the present invention provides a power inductor capable of improving stability to temperature and thus preventing a decrease in inductance.
- a power inductor includes a body; A substrate provided inside the body; A coil formed on the substrate; First external electrodes connected to the coils and formed on first and second surfaces of the body facing each other; And a second external electrode connected to the first external electrode and formed on a third surface adjacent to the first and second surfaces of the body.
- the second external electrode is mounted on the PCB and is spaced apart from the central portion of the third surface of the body.
- a power inductor comprising: a body having a step formed in a portion of an upper surface thereof; A substrate provided inside the body; A coil formed on the substrate; And external electrodes connected to the coil and formed on the lower and upper portions of the body from first and second surfaces of the body, which are opposed to each other, wherein the external electrodes are formed at a height lower than the step at the top of the body.
- a power inductor includes a body; A substrate provided inside the body; A coil formed on the substrate; An external electrode formed on one surface of the body; And a connection electrode provided inside the body to connect the coil and an external electrode.
- the external electrode is mounted on the PCB and is formed spaced apart from the central portion of the body, the external electrode is formed by growing from the connection electrode.
- the body comprises a metal powder, a polymer and a thermally conductive filler.
- the metal powder includes a metal alloy powder including iron, and at least one of a magnetic body and an insulator is coated on the surface.
- the thermally conductive filler includes one or more selected from the group consisting of MgO, AlN, and carbon-based materials, and is included in an amount of 0.5 wt% to 3 wt% with respect to 100 wt% of the metal powder.
- the substrate is bonded to the copper foil on both sides of the metal plate containing iron.
- a magnetic layer is provided on at least one region of the body and has a magnetic permeability higher than that of the body.
- the substrate is provided with at least two, the coils are each provided on the at least two substrates, the coils are connected by side electrodes formed on the fourth side of the body.
- a method of manufacturing a power inductor includes forming a coil on at least one substrate; Forming a plurality of sheets containing the metal powder and the polymer; Stacking and pressing the plurality of sheets with the substrate therebetween to form a body by molding; Forming a second external electrode on one surface of the body to be spaced apart by a predetermined distance; And forming a first external electrode connected to the second external electrode on a side of the body.
- the second external electrode is formed by bonding a copper foil spaced at a predetermined interval on one surface of the body by bonding a copper foil and then growing a plating layer from the copper foil by performing a plating process.
- a method of manufacturing a power inductor includes forming a coil on at least one substrate; Forming a plurality of sheets containing a metal powder and a polymer and having holes formed in predetermined regions; Stacking and pressing the plurality of sheets with the substrate interposed therebetween to form a body having a through hole for exposing a predetermined region of the coil; Filling the through holes to form a connection electrode; Forming an external electrode on one surface of the body to be connected to the connection electrode.
- connection electrode may be formed by filling an at least part of the through hole by performing an electroless plating process and then performing an electroplating process to fill the through hole, and the external electrode is formed by growing from the connection electrode by an electroplating process. do.
- the substrate is a copper foil bonded to at least one surface of the metal plate containing iron, and the sheet further contains a thermally conductive filler.
- the power inductor according to the present invention forms a second external electrode on the lower surface of the body facing the PCB, and forms a first external electrode on the side of the body to be connected thereto.
- an external electrode is formed on the lower surface of the body facing the PCB, and a connection electrode connected to the coil is formed inside the body to be connected to the external electrode. Therefore, since the external electrode is not formed on the body, it is possible to prevent the shield can and the power inductor from shorting.
- a body including a metal powder, a polymer and a thermally conductive filler, and accordingly it is possible to release the heat of the body by the heating of the metal powder to the outside to prevent the temperature rise of the body to reduce the problem of inductance You can prevent it.
- At least two or more substrates each having a coil pattern formed on at least one surface may be provided in the body to form a plurality of coils in one body, thereby increasing the capacity of the power inductor.
- FIG. 1 is a perspective view of a power inductor according to a first embodiment of the present invention.
- FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG. 1.
- FIG. 3 is a plan view of the lower surface of FIG.
- 4 to 6 are cross-sectional views of a power inductor according to second embodiments of the present invention.
- FIG. 7 is a perspective view of a power inductor according to a third embodiment of the present invention.
- FIG. 8 and 9 are cross-sectional views taken along the line A-A 'and line B-B' of FIG.
- FIG. 10 is a perspective view of a power inductor according to a fourth embodiment of the present invention.
- FIG. 11 is a perspective view of a power inductor according to a fifth embodiment of the present invention.
- FIG. 12 is a cross-sectional view taken along the line AA ′ of FIG. 1.
- FIG. 13 is a plan view of the bottom surface of FIG. 1;
- FIGS. 14 to 17 are diagrams for describing a method of manufacturing a power inductor according to a first embodiment of the present invention.
- 18 to 21 are views for explaining a method of manufacturing a power inductor according to a second embodiment of the present invention.
- FIG. 1 is a perspective view of a power inductor according to a first embodiment of the present invention
- FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG. 1
- FIG. 3 is a bottom plan view of FIG. 1.
- the power inductor according to the first embodiment of the present invention includes a body 100, at least one substrate 200 provided inside the body 100, and at least one substrate 200.
- Coil patterns 310 and 320 formed on at least one surface of the first and second external electrodes 410 and 420 provided on two opposite sides of the body 100 and connected to the coil patterns 310 and 320, respectively.
- second external electrodes 510, 520; 500 which are provided on the lower surface of the body 100 at predetermined intervals and are connected to the first external electrodes 410, 420; 400, respectively.
- the lower surface of the body 100 is a surface mounted on the PCB facing the PCB
- the side surface of the body 100 is a surface between the lower surface of the body 100 and the upper surface opposite thereto.
- the external electrode is not formed on the upper surface of the body 100, and the first and second external electrodes 400 and 500 are formed only on two opposite sides and the lower surface of the body 100. .
- the body 100 may be, for example, a hexahedral shape. However, the body 100 may have a shape of a polyhedron other than a hexahedron.
- the body 100 may include a metal powder 110, a polymer 120, and a thermally conductive filler 130.
- the metal powder 110 may have an average particle diameter of 1 ⁇ m to 50 ⁇ m.
- the metal powder 110 may use a single particle or two or more kinds of particles of the same size, or may use a single particle or two or more kinds of particles having a plurality of sizes. For example, the first metal particles having an average size of 30 ⁇ m and the second metal particles having an average size of 3 ⁇ m may be mixed and used.
- the filling rate of the body 100 may be increased to maximize the capacity. For example, when a metal powder of 30 ⁇ m is used, voids may occur between the metal powder of 30 ⁇ m, and thus the filling rate may be lowered. However, the filling rate can be increased by mixing a smaller 3 ⁇ m metal powder between the 30 ⁇ m metal powder.
- the metal powder 110 may use a metal material including iron (Fe), for example iron-nickel (Fe-Ni), iron-nickel-silicon (Fe-Ni-Si), iron-aluminum- It may include one or more metals selected from the group consisting of silicon (Fe-Al-Si) and iron-aluminum-chromium (Fe-Al-Cr). That is, the metal powder 110 may be formed of a metal alloy having magnetic structure or magnetic properties including iron, and may have a predetermined permeability. In addition, the surface of the metal powder 110 may be coated with a magnetic material, and may be coated with a different material having a different permeability from the metal powder 110.
- Fe iron
- Fe-Ni iron-nickel
- Fe-Si-Si iron-aluminum- It may include one or more metals selected from the group consisting of silicon (Fe-Al-Si) and iron-aluminum-chromium (Fe-Al-Cr). That
- the magnetic body may be formed of a metal oxide magnetic material, and may be formed of a nickel oxide magnetic material, a zinc oxide magnetic material, a copper oxide magnetic material, a manganese oxide magnetic material, a cobalt oxide magnetic material, a barium oxide magnetic material, and a nickel-zinc-copper oxide magnetic material.
- a metal oxide magnetic material may be formed of a nickel oxide magnetic material, a zinc oxide magnetic material, a copper oxide magnetic material, a manganese oxide magnetic material, a cobalt oxide magnetic material, a barium oxide magnetic material, and a nickel-zinc-copper oxide magnetic material.
- One or more oxide magnetic materials selected may be used. That is, the magnetic body coated on the surface of the metal powder 110 may be formed of a metal oxide containing iron, it is preferable to have a higher permeability than the metal powder (110). In addition, the metal powder 110 may have a surface coated with at least one insulator.
- the metal powder 110 may be coated with an oxide on a surface thereof, or may be coated with an insulating polymer material such as parylene.
- the oxide may be formed by oxidizing the metal powder 110, and may be formed of TiO 2 , SiO 2 , ZrO 2 , SnO 2 , NiO, ZnO, CuO, CoO, MnO, MgO, Al 2 O 3 , Cr 2 O 3 , Fe One selected from 2 O 3 , B 2 O 3 and Bi 2 O 3 may be coated.
- the surface of the metal powder 110 may be coated using various insulating polymer materials in addition to parylene.
- the metal powder 110 may be coated with an oxide having a dual structure, and may be coated with a dual structure of an oxide and a polymer material.
- the metal powder 110 may be coated with an insulating material after the surface is coated with a magnetic material.
- the surface of the metal powder 110 is coated with an insulator, it is possible to prevent a short due to contact between the metal powder 110.
- the polymer 120 may be mixed with the metal powder 110 to insulate between the metal powders 110. That is, the metal powder 110 may have a problem in that the loss of materials is increased due to high eddy current loss and hysteresis loss at a high frequency. 120).
- the polymer 120 may include one or more polymers selected from the group consisting of epoxy, polyimide, and liquid crystal crystalline polymer (LCP), but is not limited thereto.
- the polymer 120 may be formed of a thermosetting resin to provide insulation between the metal powders 110.
- thermosetting resins include Novolac Epoxy Resin, Phenoxy Type Epoxy Resin, BPA Type Epoxy Resin and BPF Type Epoxy Resin.
- the polymer 120 may be included in an amount of 2.0 wt% to 5.0 wt% with respect to 100 wt% of the metal powder.
- the content of the polymer 120 is increased, the volume fraction of the metal powder 110 is lowered, so that the effect of increasing the saturation magnetization value is not properly implemented, and the magnetic properties of the body 100, that is, the permeability may be reduced.
- the content of the polymer 120 decreases, a strong acid or strong base solution used in the manufacturing process of the inductor may penetrate into the inside, thereby reducing the inductance characteristic. Therefore, the polymer 120 may be included in a range not to lower the saturation magnetization value and inductance of the metal powder 110.
- the thermally conductive filler 130 is included to solve the problem that the body 100 is heated by external heat. That is, the metal powder 110 of the body 100 may be heated by external heat, and the heat conductive filler 130 may be included to release heat of the metal powder 110 to the outside.
- the thermally conductive filler 130 may include one or more selected from the group consisting of MgO, AlN, and carbon-based materials, but is not limited thereto.
- the carbon-based material may include carbon and have various shapes, for example, graphite, carbon black, graphene, graphite, or the like.
- the thermally conductive filler 130 may be included in an amount of 0.5 wt% to 3 wt% with respect to 100 wt% of the metal powder 110.
- the thermally conductive filler 130 may have, for example, a size of 0.5 ⁇ m to 100 ⁇ m. That is, the thermally conductive filler 130 may have a size larger or smaller than the metal powder 110.
- the body 100 may be manufactured by stacking a plurality of sheets made of a material including the metal powder 110, the polymer 120, and the thermally conductive filler 130. Here, when the body 100 is manufactured by stacking a plurality of sheets, the content of the thermally conductive filler 130 of each sheet may be different.
- the content of the thermally conductive filler 130 in the sheet may increase as it moves toward the upper side and the lower side with respect to the substrate 200.
- the body 100 is formed by printing a paste made of a material including the metal powder 110, the polymer 120, and the thermally conductive filler 130 to a predetermined thickness, or by pressing such paste into a mold and pressing the paste. If necessary, various methods may be applied and formed. In this case, the number of sheets laminated to form the body 100 or the thickness of the paste printed with a predetermined thickness may be determined to an appropriate number or thickness in consideration of electrical characteristics such as inductance required by the power inductor.
- At least one substrate 200 may be provided inside the body 100.
- the substrate 200 may be provided along the long axis direction of the body 100 inside the body 100.
- the substrate 200 may be provided in one or more, for example, two substrates 200 may be spaced apart by a predetermined interval in a direction orthogonal to the direction in which the external electrode 400 is formed, for example, in a vertical direction.
- the substrate 200 may be made of, for example, copper clad lamination (CCL) or a magnetic metal.
- the substrate 200 may be made of a magnetic metal to increase the effective permeability and facilitate the implementation of the capacity. That is, CCL is manufactured by bonding a copper foil to glass-reinforced fibers.
- the permeability of the power inductor is reduced.
- the magnetic metal is used as the substrate 200, the magnetic magnetic material has a magnetic permeability, so that the magnetic permeability of the power inductor is not lowered.
- Substrate 200 using such a magnetic metal material is a metal containing iron, for example iron-nickel (Fe-Ni), iron-nickel-silicon (Fe-Ni-Si), iron-aluminum-silicon (Fe-Al -Si) and iron-aluminum-chromium (Fe-Al-Cr) can be produced by bonding a copper foil to a plate of a predetermined thickness consisting of at least one metal selected from the group consisting of. That is, the substrate 200 may be manufactured by manufacturing an alloy made of at least one metal including iron into a plate shape having a predetermined thickness, and bonding a copper foil to at least one surface of the metal plate.
- iron-Ni iron-nickel
- Fe-Ni-Si iron-nickel-silicon
- Fe-Al -Si iron-aluminum-silicon
- Fe-Al-Cr iron-aluminum-chromium
- At least one conductive via may be formed in a predetermined region of the substrate 200, and the coil patterns 310 and 320 formed at the upper side and the lower side of the substrate 200 by the conductive via may be electrically connected. Can be connected.
- the conductive via may be formed by forming a via (not shown) that penetrates the substrate 200 along the thickness direction, and then fills the via with a conductive paste.
- the coil patterns 310 and 320 may be formed on at least one surface, and preferably both surfaces of the substrate 200.
- the coil patterns 310 and 320 may be formed in a spiral shape in a predetermined area of the substrate 200, for example, from the center portion to an outward direction, and two coil patterns 310 and 320 formed on the substrate 200 are connected to each other.
- the upper coil pattern 310 and the lower coil pattern 320 may be formed in the same shape.
- the coil patterns 310 and 320 may be formed to overlap each other, or the coil patterns 320 may be formed to overlap the region where the coil patterns 310 are not formed.
- the coil patterns 310 and 320 may be electrically connected by conductive vias formed in the substrate 200.
- the coil patterns 310 and 320 may be formed by, for example, thick film printing, coating, deposition, plating, and sputtering.
- the coil patterns 310 and 320 and the conductive via may be formed of a material including at least one of silver (Ag), copper (Cu), and a copper alloy, but is not limited thereto.
- a plating process for example, a metal layer, for example, a copper layer may be formed on the substrate 200 by a plating process, and patterned by a lithography process. That is, the coil patterns 310 and 320 may be formed by forming and patterning a copper layer by using a copper foil formed on the surface of the substrate 200 as a seed layer.
- the coil patterns 310 and 320 may be formed in multiple layers. That is, a plurality of coil patterns may be further formed above the coil pattern 310 formed above the substrate 200, and a plurality of coil patterns may be formed below the coil pattern 320 formed below the substrate 200. It may be further formed.
- an insulating layer may be formed between the lower layer and the upper layer, and conductive vias (not shown) may be formed in the insulating layer to connect the multilayer coil patterns.
- the first external electrodes 410, 420; 400 may be formed at both ends of the body 100.
- the first external electrode 400 may be formed on two side surfaces facing each other in the long axis direction of the body 100.
- the first external electrodes 410 and 420 may be electrically connected to the coil patterns 310 and 320 formed on the substrate 200. That is, at least one end of the coil patterns 310 and 320 is exposed to the outside of the body 100 in a direction opposite to each other, and the first external electrodes 410 and 420 are connected to the ends of the coil patterns 310 and 320, respectively. It may be formed to.
- the first external electrodes 410 and 420 may be formed on both ends of the body 100 by applying a side surface of the body 100 to a conductive paste or by various methods such as printing, deposition, and sputtering. In this case, when the conductive paste is applied to the first external electrodes 410 and 420, the conductive paste is formed only on the side surface of the body 100 without immersing the side surface of the body 100 to a predetermined depth. In addition, the first external electrodes 410 and 420 may be patterned by photo and etching processes as necessary.
- the first external electrodes 410 and 420 may be formed of a metal having electrical conductivity, for example, at least one metal selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof. Can be formed.
- the first external electrodes 410 and 420 may further have a nickel-plated layer (not shown) or a tin plating layer (not shown) on the surface thereof.
- the first external electrodes 410 and 420 may be formed by contacting only the side surfaces of the body 100 with the conductive paste and then performing a plating process.
- the second external electrodes 510, 520 and 500 may be formed to be spaced apart from each other under the body 100.
- the second external electrodes 510 and 520 may be formed to be connected to the first external electrodes 410 and 420 formed on the side surfaces of the body 100. Therefore, the second external electrodes 510 and 520 may be connected to the coils inside the body 100 through the first external electrodes 410 and 420.
- the second external electrodes 510 and 520 may be formed on the lower surface of the body 100 by various methods such as immersing the lower surface of the body 100 in a conductive paste or printing, vapor deposition, and sputtering. At this time, if necessary, a patterning process may be performed.
- the body 100 when the lower surface of the body 100 is immersed in a conductive paste or the second external electrodes 510 and 520 are formed by a printing, deposition, and sputtering process, the body ( The conductive layer may be formed on the entire lower surface of the substrate 100, and may be patterned to be spaced apart from the center portion by performing a photolithography and etching process.
- the second external electrodes 510 and 520 may not be patterned by forming a seed layer only at a lower edge of the body 100 and then performing a plating process.
- a copper foil may be formed at the edge of the lower surface of the body 100 to form a seed layer, and then a plating process may be performed to form the second external electrodes 510 and 520.
- the second external electrodes 510 and 520 may be formed as a stacked structure of a seed layer and a plating layer.
- the second external electrodes 510 and 520 may be formed of a metal having electrical conductivity, for example, at least one metal selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof. Can be formed.
- the second external electrodes 510 and 520 may further have a nickel-plated layer (not shown) or a tin plating layer (not shown) on its surface.
- an insulating layer 600 may be further formed between the coil patterns 310 and 320 and the body 100 to insulate the coil patterns 310 and 320 and the metal powder 110. That is, the insulating layer 600 may be formed on the upper and lower portions of the substrate 200 to cover the coil patterns 310 and 320.
- the insulating layer 600 may include one or more materials selected from the group consisting of epoxy, polyimide, and liquid crystal crystalline polymer. That is, the insulating layer 600 may be made of the same material as the polymer 120 forming the body 100.
- the insulating layer 600 may be coated with an insulating polymer material such as parylene on the coil patterns 310 and 320. That is, the insulating layer 600 may be coated with a uniform thickness along the steps of the coil patterns 310 and 320.
- the insulating layer 600 may be formed on the coil patterns 310 and 320 using the insulating sheet.
- the power inductor forms second external electrodes 510 and 520 on the lower surface of the body 100 facing the PCB, and is formed on the side of the body 100 adjacent thereto. 1 External electrodes 410 and 420 are formed. Therefore, since the external electrode is not formed on the body 100, the short of the shield can and the power inductor can be prevented.
- the body 100 may be manufactured by including the metal powder 110, the polymer 120, and the thermally conductive filler 130. Therefore, the heat of the body 100 due to the heating of the metal powder 110 can be released to the outside to prevent the temperature rise of the body 100, thereby preventing problems such as inductance lowering.
- by reducing the magnetic permeability of the power inductor by forming the substrate 200 inside the body 100 using a magnetic metal material.
- FIG. 4 is a cross-sectional view of a power inductor according to a second embodiment of the present invention.
- a power inductor may include a body 100, at least one substrate 200 provided inside the body 100, and at least one surface of each of the at least one substrate 200.
- the second external electrodes 510, 520; 500 and the upper and lower portions of the body 100 are provided on the bottom surface of the body 100 and are spaced apart from each other at predetermined intervals and are connected to the first external electrodes 410, 420; 400, respectively.
- It may include at least one magnetic layer (710, 720) provided.
- the insulation layer 600 may be further formed on the coil pattern 300.
- the magnetic layers 710, 720; 700 may be provided in at least one region of the body 100. That is, the first magnetic layer 710 may be formed on the upper surface of the body 100, and the second magnetic layer 720 may be formed on the lower surface of the body 100.
- the first and second magnetic layers 710 and 720 are provided to increase the magnetic permeability of the body 100, and may be made of a material having a higher magnetic permeability than the body 100.
- the permeability of the body 100 is 20 and the first and second magnetic layers 710 and 720 may be provided to have permeability of 40 to 1000.
- the first and second magnetic layers 710 and 720 may be manufactured using, for example, magnetic powder and a polymer.
- the first and second magnetic layers 710 and 720 may be formed of a material having a higher magnetism than the magnetic body of the body 100 or have a higher content of the magnetic body so as to have a higher magnetic permeability than the body 100.
- the polymer may be added at 15 wt% with respect to 100 wt% of the metal powder.
- the magnetic powder is nickel magnetic (Ni Ferrite), zinc magnetic (Zn Ferrite), copper magnetic (Cu Ferrite), manganese magnetic (Mn Ferrite), cobalt magnetic (Co Ferrite), barium magnetic (Ba Ferrite) and nickel-zinc
- Ni Ferrite nickel magnetic
- Zn Ferrite zinc magnetic
- Cu Ferrite copper magnetic
- Mn Ferrite manganese magnetic
- Co Ferrite cobalt magnetic
- nickel-zinc nickel-zinc
- One or more or one or more oxide magnetic materials thereof selected from the group consisting of -Ni-Zn-Cu Ferrite can be used.
- the magnetic layer 600 may be formed using metal alloy powder containing iron or metal alloy oxide containing iron.
- the magnetic powder may be coated on the metal alloy powder to form the magnetic powder.
- one or more oxide magnetic materials selected from the group consisting of nickel oxide magnetic materials, zinc oxide magnetic materials, copper oxide magnetic materials, manganese oxide magnetic materials, cobalt oxide magnetic materials, barium oxide magnetic materials, and nickel-zinc-copper oxide magnetic materials, for example, iron It may be coated on the metal alloy powder to form a magnetic powder. That is, the magnetic oxide powder may be formed by coating the metal oxide including iron on the metal alloy powder.
- the first and second magnetic layers 710 and 720 may further include a thermally conductive filler in the metal powder and the polymer. The thermally conductive filler may be contained in an amount of 0.5 wt% to 3 wt% with respect to 100 wt% of the metal powder.
- the first and second magnetic layers 710 and 720 may be manufactured in the form of a sheet and may be provided on the upper and lower portions of the body 100 in which a plurality of sheets are stacked.
- the body 100 after forming a body 100 for printing a paste made of a material including the metal powder 110, the polymer 120 and the thermally conductive filler 130 to a predetermined thickness or by inserting the paste into a mold to press the body 100
- the first and second magnetic layers 710 and 720 may be formed on the top and the bottom of the bottom surface, respectively.
- the magnetic layers 710 and 720 may be formed using a paste, and the magnetic layers 710 and 720 may be formed by applying a magnetic material to the upper and lower portions of the body 100.
- the third and fourth magnetic layers 730 and 740 are disposed on the upper and lower portions between the body 100 and the at least two substrates 200.
- the fifth and sixth magnetic layers 750 and 760 may be further provided between them, as shown in FIG. 6. That is, at least one magnetic layer 700 may be provided in the body 100.
- the magnetic layer 700 may be manufactured in the form of a sheet and may be provided between the bodies 100 in which a plurality of sheets are stacked. That is, at least one magnetic layer 700 may be provided between the plurality of sheets for manufacturing the body 100.
- a magnetic layer may be formed during printing.
- the magnetic layer can be pressed in between.
- the magnetic layer 700 may be formed using a paste.
- a soft magnetic material may be applied to form the magnetic layer 700 in the body 100.
- the power inductor according to another embodiment of the present invention may improve the permeability of the power inductor by forming at least one magnetic layer 700 having a higher permeability than the body 100 in the body 100.
- FIG. 7 is a perspective view of a power inductor according to a third exemplary embodiment of the present invention.
- FIG. 8 is a cross-sectional view of the power inductor taken along the AA ′ line of FIG. 7, and
- FIG. 9 is a cut along the BB ′ line of FIG. 7. It is a cross section of.
- a power inductor may include a body 100, at least one substrate 200 provided inside the body 100, and at least one substrate 200.
- Coil patterns 310 and 320 formed on at least one surface of the first and second external electrodes 410 and 420 provided on two opposite sides of the body 100 and connected to the coil patterns 310 and 320, respectively.
- second external electrodes 510, 520; 500 which are provided on the lower surface of the body 100, and are connected to the first external electrodes 410, 420; 400, respectively, and the outside of the body 100.
- the side electrodes 800 may be provided to be spaced apart from the external electrodes 400 and 500 and connected to at least one coil pattern 300 formed on each of the at least two substrates 200 in the body 100.
- At least two substrates 210, 220, and 200 may be provided inside the body 100.
- the at least two substrates 200 may be provided along the major axis direction of the body 100 inside the body 100 and spaced apart at a predetermined interval in the thickness direction of the body 100.
- the substrate 200 may be made of, for example, copper clad lamination (CCL) or a magnetic metal, but is preferably made of a magnetic metal.
- the coil patterns 310, 320, 330, 340; 300 may be formed on at least one side of each of the at least two substrates 200, preferably on both sides.
- the coil patterns 310 and 320 may be formed on the lower and upper portions of the first substrate 210, respectively, and may be electrically connected to each other by conductive vias formed in the first substrate 210.
- the coil patterns 330 and 340 may be formed on the lower and upper portions of the second substrate 220 and electrically connected to each other by conductive vias formed on the second substrate 220. That is, two or more coils may be formed in one body 100.
- the coil patterns 310 and 330 on the upper side of the substrate 200 and the coil patterns 320 and 340 on the lower side may be formed in the same shape.
- the plurality of coil patterns 300 may be formed to overlap each other, or the lower coil patterns 320 and 340 may be formed to overlap the region where the upper coil patterns 310 and 330 are not formed.
- the plurality of coil patterns 300 may be formed by, for example, thick film printing, coating, deposition, plating, and sputtering.
- the side electrode 800 may be formed on at least one side of the body 100 in which the first external electrode 400 is not formed.
- the side electrode 800 connects at least one of the coil patterns 310 and 320 formed on the first substrate 210 and at least one of the coil patterns 330 and 340 formed on the second substrate 220. Is prepared to. Accordingly, the coil patterns 310 and 320 formed on the first substrate 210 and the coil patterns 330 and 340 formed on the second substrate 220 are electrically formed by the side electrodes 800 outside the body 100. Can be connected to each other.
- the side electrode 800 may be formed on one side of the body 100 through various methods such as immersing the body 100 in the conductive paste, or printing, deposition and sputtering.
- Side electrode 800 is a metal capable of imparting electrical conductivity, and may include, for example, one or more metals selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof. In this case, a nickel-plating layer (not shown) or tin plating layer (not shown) may be further formed on the surface of the side electrode 800 if necessary.
- At least two or more substrates 200 each having a coil pattern 300 formed on at least one surface thereof are provided in the body 100, and the side surface outside the body 100.
- the electrode 800 By being connected by the electrode 800, a plurality of coils may be formed in one body 100, thereby increasing the capacity of the power inductor.
- FIG. 10 is a cross-sectional view of a power inductor according to a fourth embodiment of the present invention.
- the power inductor according to the fourth embodiment of the present invention may include a body 100 having a step 150 formed in at least one region of an upper surface thereof, and at least one substrate 200 provided inside the body 100. And external coils 310 and 320 formed on at least one surface of the at least one substrate 200 and two sides of the body 100 facing each other and connected to the coil patterns 310 and 320, respectively. It may include an electrode 900. That is, the embodiments described with reference to FIGS. 1 to 9 of the present invention are formed such that the external electrodes 400 and 500 are not formed on the upper surface of the body 100. However, another embodiment of the present invention shown in FIG.
- the step 150 is formed to be higher than the thickness of the external electrode 900 formed on the upper portion of the body 100 so as not to contact the shield can even when the external electrode 900 is formed.
- the step 150 is formed on the upper portion of the body 100, the side and upper surface from the lower surface of the body 100 by immersing the two opposite sides of the body 100 to the conductive paste to the depth of the step 150 is formed Until the external electrode 900 can be formed. Therefore, the process of forming the external electrode 900 can be simplified.
- FIG. 11 is a perspective view of a power inductor according to a fifth embodiment of the present invention
- FIG. 12 is a cross-sectional view taken along the line AA ′ of FIG. 11
- FIG. 13 is a bottom plan view of FIG. 11.
- a power inductor includes a body 100, at least one base material 200 provided inside the body 100, and at least one base material 200.
- Connection electrodes 1110, 1120 and 1100 connecting the 300 and the external electrode 1000 may be included.
- the lower surface of the body 100 is a surface mounted on the PCB facing the PCB. Therefore, in one embodiment of the present invention, the external electrode 1000 is formed only on the bottom surface of the body 100, without forming the external electrode on the top surface of the body 100.
- the external electrodes 1010, 1020 and 1000 may be formed on the bottom surface of the body 100 to be spaced apart from each other.
- the external electrodes 1010 and 1020 may be formed to be connected to the connection electrodes 1110, 1120 and 1100 formed inside the body 100. Therefore, the external electrodes 1010 and 1020 may be connected to the coils inside the body 100 through the connection electrodes 1110 and 1120.
- the external electrodes 1010 and 1020 may be formed by immersing the lower surface of the body 100 in a conductive paste, or by various methods such as printing, deposition, and sputtering.
- the external electrodes 1010 and 1020 may be photographed as necessary. And patterning by an etching process.
- the conductive layer in the center portion is removed to a predetermined width to form the external electrodes 1010 and 1020 at a predetermined width from the edge of the lower surface of the body 100. can do.
- the external electrodes 1010 and 1020 may be formed by growing from the connection electrodes 1110 and 1120. That is, the connection electrodes 1110 and 1120 may be formed by the plating process, and the external electrodes 1010 and 1020 may be formed therefrom.
- an electroless plating process may be performed to form a part of the connection electrodes 1110 and 1120, and then an electroplating process may be performed to form the connection electrodes 1110 and 1120 from the coil pattern 320.
- 1010 and 1020 may be formed.
- the external electrodes 1010 and 1020 may be formed of a metal having electrical conductivity.
- the external electrodes 1010 and 1020 may be formed of one or more metals selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof. Can be.
- the external electrodes 1010 and 1020 may further have a nickel-plated layer (not shown) or tin plating layer (not shown) on the surface thereof.
- connection electrodes 1110, 1120 and 1100 are formed in the body 100 to connect the coil patterns 310 and 320 to the external electrodes 1010 and 1020. That is, at least two connection electrodes 1100 may be formed in a predetermined region of the lower surface of the main body 100. For example, a hole may be formed in a predetermined region of the body 100 so that the coil pattern 320 formed under the substrate 200 is exposed, and a conductive material may be filled in the hole to form the connection electrode 1100.
- the connection electrode 1100 may be formed by filling a conductive material in a hole to be formed in the body 100 by an electroless plating and an electrolytic plating process.
- the external electrode 1000 may be formed from the connection electrode 1100, and the connection electrode 1100 is formed by filling a hole in the body 100, and then electroplating the electrode 100 to form the body 100 from the connection electrode 1100.
- the conductive layer may be grown on the lower surface and patterned to form external electrodes 1010 and 1020. That is, the external electrodes 1010 and 1020 may be formed by electroplating using the connection electrode 1100 as a seed.
- the hole for forming the connection electrode 1100 may be formed by etching a predetermined region of the body 100 so that at least one of the coil patterns 310 and 320 is exposed after the body 100 is formed. For example, a hole may be formed by punching a predetermined region of the main body 100 using a laser.
- the body 100 with a metal mold can be used to form a hole in a predetermined region
- a metal mold when forming a body 100 using a plurality of sheets a plurality of sheets in which a hole is formed in a predetermined region It may be formed by laminating.
- At least one magnetic layer 700 may be provided inside the body 100 as described in the second embodiments.
- at least two substrates 200 are provided, and coil patterns 310, 320; 300 are formed on at least one surface of the at least two substrates 200, and the body 100 may be formed.
- the plurality of coil patterns 300 may be connected by the connection electrode 800 formed on the outer side.
- the external electrodes 1010 and 1020 are formed on the lower surface of the body 100 facing the PCB, and the coil pattern 310 is formed inside the body 100. And connection electrodes 1110 and 1120 connecting the external electrodes 1010 and 1020 to each other. Therefore, since the external electrode is not formed on the body 100, the short of the shield can and the power inductor can be prevented.
- 14 to 17 are cross-sectional views sequentially illustrating a method of manufacturing a power inductor according to a first embodiment of the present invention.
- coil patterns 310 and 320 having a predetermined shape are formed on at least one surface, preferably one surface and the other surface of the substrate 200.
- the substrate 200 may be made of CCL or a magnetic metal, and it is preferable to use a magnetic metal that can increase the effective permeability and facilitate the implementation of the capacity.
- the substrate 200 may be manufactured by bonding copper foil to one side and the other side of a metal plate having a predetermined thickness made of a metal alloy containing iron.
- the coil patterns 310 and 320 may be formed as coil patterns formed in a spiral shape from a predetermined region of the substrate 200, for example, a central portion thereof.
- the coil pattern 310 is formed on one surface of the substrate 200, and then a conductive via penetrates a predetermined region of the substrate 200 and is filled with a conductive material, and the coil pattern is formed on the other surface of the substrate 200.
- 320 may be formed.
- the conductive via may be formed by forming a via hole in the thickness direction of the substrate 200 using a laser or the like, and then filling the via hole with a conductive paste.
- the coil pattern 310 may be formed by, for example, a plating process. For this, a plating process using a copper foil on the substrate 200 as a seed is formed by forming a photoresist pattern having a predetermined shape on one surface of the substrate 200.
- the coil pattern 320 may be formed on the other surface of the substrate 200 in the same manner as the coil pattern 310.
- the coil patterns 310 and 320 may be formed in multiple layers.
- an insulating layer may be formed between the lower layer and the upper layer, and conductive vias (not shown) may be formed in the insulating layer to connect the multilayer coil patterns.
- the insulating layer 500 is formed to cover the coil patterns 310 and 320.
- the insulating layer 500 may be formed by closely contacting the sheet including one or more materials selected from the group consisting of epoxy, polyimide, and liquid crystal crystalline polymer on the coil patterns 310 and 320.
- a plurality of sheets 100a to 100h made of a material including the metal powder 110, the polymer 120, and the thermally conductive filler 130 are prepared.
- the metal powder 110 may use a metal material including iron (Fe)
- the polymer 120 may use an epoxy, polyimide, or the like, which may insulate between the metal powders 110, and may be thermally conductive.
- the filler 130 may use MgO, AlN, a carbon-based material or the like capable of releasing the heat of the metal powder 110 to the outside.
- the surface of the metal powder 110 may be coated with a magnetic material, for example, a metal oxide magnetic material.
- the polymer 120 may be included in an amount of 2.0 wt% to 5.0 wt% with respect to 100 wt% of the metal powder, and the thermally conductive filler 130 may be 0.5 wt% to 3 wt% with respect to 100 wt% of the metal powder 110. It may be included in the content.
- the plurality of sheets 100a to 100h are disposed above and below the substrate 200 on which the coil patterns 310 and 320 are formed. Meanwhile, the plurality of sheets 100a to 100h may have different contents of the thermally conductive filler 130.
- the content of the thermally conductive filler 130 may increase from one side and the other side of the substrate 200 toward the upper side and the lower side.
- the content of the thermally conductive fillers 130 of the sheets 100b and 100e positioned above and below the sheets 100a and 100d in contact with the substrate 200 is greater than that of the thermally conductive fillers 130 of the sheets 100a and 100d.
- the content of the thermally conductive fillers 130 of the sheets 100c and 100f positioned above and below the sheets 100b and 100e is higher than the content of the thermally conductive fillers 130 of the sheets 100b and 100e. Can be higher.
- the content of the thermally conductive filler 130 may increase, thereby further improving heat transfer efficiency.
- a plurality of sheets 100a to 100h are laminated and pressed with a substrate 200 therebetween to form a body 100 by molding.
- Second external electrodes 510 and 520 are formed on a lower surface of the body 100, that is, a lower surface of the body 100 facing the PCB and to be mounted on the PCB.
- the second external electrodes 510 and 520 may be formed on one surface orthogonal to two opposite surfaces to which the coil patterns 300 of the body 100 are exposed, and are spaced apart from each other in a central region.
- the second external electrodes 510 and 520 may be formed by bonding a copper foil to an edge of one side of the body 100 to form a seed layer and then performing a plating process to form a plating layer on the seed layer.
- the second external electrodes 510 and 520 may be formed by forming a metal layer on one surface of the body 100 by a deposition method such as sputtering and then patterning the same by a photo and etching process.
- first external electrodes 410 and 420 are formed at both ends of the body 100 to be electrically connected to the drawn portions of the coil patterns 310 and 320 and to be connected to the second external electrode 500.
- the first external electrodes 410 and 420 may be formed on both ends of the body 100 by applying a side surface of the body 100 to a conductive paste or by various methods such as printing, deposition, and sputtering. In this case, when the conductive paste is applied to the first external electrodes 410 and 420, the conductive paste is formed only on the side surface of the body 100 without immersing the side surface of the body 100 to a predetermined depth.
- 18 to 21 are cross-sectional views sequentially illustrating a method of manufacturing a power inductor according to a second embodiment of the present invention.
- the insulating layer 500 to cover the coil patterns 310 and 320.
- a portion of the insulation layer 500 for example, a portion of the insulation layer 500 formed on the coil pattern 320 is removed to expose a predetermined region of the coil pattern 320.
- a plurality of sheets 100a to 100h made of a material including a metal powder 110, a polymer 120, and a thermally conductive filler 130 are prepared.
- holes 101 to 104 which are vertically penetrated are formed in predetermined regions of the sheets 100e to 100h provided below the substrate 200 among the sheets 100a to 100h.
- the holes 101 to 104 are formed in the same region as the region where a portion of the insulating layer 500 is removed to expose the coil pattern 320.
- the body 100 is formed by stacking and pressing a plurality of sheets 100a to 100h with the substrate 200 therebetween. Therefore, a hole (not shown) exposing at least a portion of the coil pattern 300 is formed in a predetermined region of the lower surface of the body 100, that is, the lower surface of the body 100 facing the PCB and to be mounted on the PCB. In addition, at least one side of the coil patterns 310 and 320 may be exposed on at least one side of the body 100. Subsequently, a plating process is performed to grow a conductive layer from the coil pattern 300, and fill the holes therein to form connection electrodes 1110 and 1120.
- connection electrodes 1110 and 1120 may be formed to be formed on a part of a hole, for example, a sidewall of the hole by performing an electroless plating process, and then formed to grow from the coil pattern 300 by performing an electroplating process.
- a plating process is performed to form a conductive layer on the bottom surface of the body 100.
- a conductive layer may be formed on the lower surface of the body 100 from the coil pattern 320 or the connection electrode 1100 by a subsequent electrolytic plating process. have.
- the conductive layers on the bottom surface of the body 100 may be photographed and etched to remove the center portion, thereby forming external electrodes 1010, 1020; 1000 spaced apart from each other.
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Abstract
Description
Claims (18)
- 바디;body;상기 바디 내부에 마련된 기재;A substrate provided inside the body;상기 기재 상에 형성된 코일;A coil formed on the substrate;상기 코일과 연결되며 상기 바디의 서로 대향되는 제 1 및 제 2 면에 형성된 제 1 외부 전극; 및First external electrodes connected to the coils and formed on first and second surfaces of the body facing each other; And상기 제 1 외부 전극과 연결되어 상기 바디의 제 1 및 제 2 면과 인접하는 제 3 면에 형성된 제 2 외부 전극을 포함하는 파워 인덕터.And a second external electrode connected to the first external electrode and formed on a third surface adjacent to the first and second surfaces of the body.
- 청구항 1에 있어서, 상기 제 2 외부 전극은 PCB에 실장되며 상기 바디의 제 3 면의 중앙부로부터 이격되어 형성된 파워 인덕터.The power inductor of claim 1, wherein the second external electrode is mounted on a PCB and is spaced apart from a center portion of the third surface of the body.
- 상면의 일부 영역에 단차가 형성된 바디;A body having a step formed in a portion of the upper surface;상기 바디 내부에 마련된 기재;A substrate provided inside the body;상기 기재 상에 형성된 코일; 및A coil formed on the substrate; And상기 코일과 연결되며 상기 바디의 서로 대향되는 제 1 및 제 2 면으로부터 상기 바디의 하부 및 상부에 형성된 외부 전극을 포함하고,An external electrode connected to the coil and formed on the lower and upper portions of the body from first and second surfaces facing each other;상기 외부 전극은 상기 바디의 상부에서 상기 단차보다 낮은 높이로 형성된 파워 인덕터.And the external electrode is formed at a height lower than the step at the top of the body.
- 바디;body;상기 바디 내부에 마련된 기재;A substrate provided inside the body;상기 기재 상에 형성된 코일;A coil formed on the substrate;상기 바디의 일 면에 형성된 외부 전극; 및An external electrode formed on one surface of the body; And상기 바디 내부에 마련되어 상기 코일과 외부 전극을 연결시키는 연결 전극을 포함하는 파워 인덕터.And a connection electrode provided in the body to connect the coil and an external electrode.
- 청구항 4에 있어서, 상기 외부 전극은 PCB에 실장되며 상기 바디의 중앙부로부터 이격되어 형성된 파워 인덕터.The power inductor of claim 4, wherein the external electrode is mounted on a PCB and spaced apart from a center portion of the body.
- 청구항 5에 있어서, 상기 외부 전극은 상기 연결 전극으로부터 성장되어 성장되어 형성된 파워 인덕터.The power inductor of claim 5, wherein the external electrode is grown by growing from the connection electrode.
- 청구항 1 내지 청구항 6중 어느 한 항에 있어서, 상기 바디는 금속 분말, 폴리머 및 열 전도성 필러를 포함하는 파워 인덕터.The power inductor of claim 1, wherein the body comprises a metal powder, a polymer, and a thermally conductive filler.
- 청구항 7에 있어서, 상기 금속 분말은 철을 포함하는 금속 합금 분말을 포함하며, 자성체 및 절연체의 적어도 하나가 표면에 코팅된 파워 인덕터.The power inductor of claim 7, wherein the metal powder comprises a metal alloy powder including iron, and at least one of a magnetic material and an insulator is coated on a surface thereof.
- 청구항 8에 있어서, 상기 열 전도성 필러는 MgO, AlN, 카본 계열의 물질로 구성된 군으로부터 선택된 하나 이상을 포함하며, 상기 금속 분말 100wt%에 대하여 0.5wt% 내지 3wt%의 함량으로 포함되는 파워 인덕터.The power inductor of claim 8, wherein the thermally conductive filler includes at least one selected from the group consisting of MgO, AlN, and carbon-based materials, and is included in an amount of 0.5 wt% to 3 wt% with respect to 100 wt% of the metal powder.
- 청구항 7에 있어서, 상기 기재는 철을 포함하는 금속판의 양면 상에 구리 포일이 접합된 파워 인덕터.8. The power inductor of claim 7, wherein the substrate is bonded to a copper foil on both sides of a metal plate comprising iron.
- 청구항 7에 있어서, 상기 바디의 적어도 일 영역에 마련되며 상기 바디의 투자율보다 높은 투자율을 갖는 자성층을 더 포함하는 파워 인덕터.The power inductor of claim 7, further comprising a magnetic layer provided in at least one region of the body and having a magnetic permeability higher than that of the body.
- 청구항 7에 있어서, 상기 기재는 적어도 둘 이상 마련되고, 상기 코일은 상기 적어도 둘 이상의 기재 상에 각각 마련되며, 상기 코일들은 상기 바디의 제 4 면 상에 형성된 측면 전극에 의해 연결되는 파워 인덕터.The power inductor of claim 7, wherein at least two substrates are provided, the coils are respectively provided on the at least two substrates, and the coils are connected by side electrodes formed on a fourth side of the body.
- 적어도 하나의 기재 상에 코일을 형성하는 단계;Forming a coil on at least one substrate;금속 분말 및 폴리머를 함유하는 복수의 시트를 형성하는 단계;Forming a plurality of sheets containing the metal powder and the polymer;상기 기재를 사이에 두고 상기 복수의 시트를 적층 및 가압한 후 성형하여 바디를 형성하는 단계;Stacking and pressing the plurality of sheets with the substrate therebetween to form a body by molding;상기 바디의 일면 상에 소정 간격 이격되도록 제 2 외부 전극을 형성하는 단계; 및Forming a second external electrode on one surface of the body to be spaced apart by a predetermined distance; And상기 바디의 측면에 상기 제 2 외부 전극과 연결되는 제 1 외부 전극을 형성하는 단계를 포함하는 파워 인덕터 제조 방법.And forming a first external electrode connected to the second external electrode on a side of the body.
- 청구항 13에 있어서, 상기 제 2 외부 전극은 상기 바디의 일면 상에 소정 간격 이격되어 구리 포일을 접합하여 형성한 후 도금 공정을 실시하여 구리 포일로부터 도금층을 성장시켜 형성하는 파워 인덕터의 제조 방법.The method of claim 13, wherein the second external electrode is formed by bonding copper foils spaced a predetermined distance on one surface of the body and then performing a plating process to grow a plating layer from the copper foils.
- 적어도 하나의 기재 상에 코일을 형성하는 단계;Forming a coil on at least one substrate;금속 분말 및 폴리머를 함유하며 소정 영역에 홀이 형성된 복수의 시트를 형성하는 단계;Forming a plurality of sheets containing a metal powder and a polymer and having holes formed in predetermined regions;상기 기재를 사이에 두고 상기 복수의 시트를 적층 및 가압한 후 성형하여 상기 코일의 소정 영역을 노출시키는 관통 홀이 형성된 바디를 형성하는 단계;Stacking and pressing the plurality of sheets with the substrate interposed therebetween to form a body having a through hole for exposing a predetermined region of the coil;상기 관통 홀을 매립하여 연결 전극을 형성하는 단계;Filling the through holes to form a connection electrode;상기 연결 전극과 연결되도록 상기 바디의 일면 상에 외부 전극을 형성하는 단계를 포함하는 파워 인덕터 제조 방법.And forming an external electrode on one surface of the body to be connected to the connection electrode.
- 청구항 15에 있어서, 상기 연결 전극은 무전해 도금 공정을 실시하여 상기 관통 홀의 적어도 일부를 매립한 후 전해 도금 공정을 실시하여 상기 관통 홀이 매립되도록 형성되고, 상기 외부 전극은 전해 도금 공정으로 상기 연결 전극으로부터 성장되어 형성된 파워 인덕터의 제조 방법.The method of claim 15, wherein the connection electrode is formed to fill the at least a portion of the through-holes by performing an electroless plating process and then performing an electroplating process to fill the through-holes, the external electrode is connected to the electroplating process A method of manufacturing a power inductor formed by growing from an electrode.
- 청구항 13 내지 청구항 16중 어느 한 항에 있어서, 상기 기재는 상기 철을 포함하는 금속판의 적어도 일면에 구리 포일이 접합된 파워 인덕터의 제조 방법.The method of manufacturing a power inductor according to any one of claims 13 to 16, wherein the base material is a copper foil bonded to at least one surface of a metal plate containing iron.
- 청구항 17에 있어서, 상기 시트는 열 전도성 필러를 더 함유하는 파워 인덕터의 제조 방법.The method of claim 17, wherein the sheet further contains a thermally conductive filler.
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