WO2016034250A1 - Cryoréfrigérateur à usages multiples dans des systèmes de traitement sous vide - Google Patents

Cryoréfrigérateur à usages multiples dans des systèmes de traitement sous vide Download PDF

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Publication number
WO2016034250A1
WO2016034250A1 PCT/EP2014/068978 EP2014068978W WO2016034250A1 WO 2016034250 A1 WO2016034250 A1 WO 2016034250A1 EP 2014068978 W EP2014068978 W EP 2014068978W WO 2016034250 A1 WO2016034250 A1 WO 2016034250A1
Authority
WO
WIPO (PCT)
Prior art keywords
chamber
cryo
active pumping
processing
pumping surface
Prior art date
Application number
PCT/EP2014/068978
Other languages
English (en)
Inventor
Wolfgang Buschbeck
Jürgen Henrich
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to CN201480081726.0A priority Critical patent/CN106605009A/zh
Priority to PCT/EP2014/068978 priority patent/WO2016034250A1/fr
Publication of WO2016034250A1 publication Critical patent/WO2016034250A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/06—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means
    • F04B37/08—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means by condensing or freezing, e.g. cryogenic pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/3277—Continuous moving of continuous material

Definitions

  • the cold surfaces of the chiller reduce the kinetic energy of the molecules, at which point a "sticking coefficient" becomes operative and the molecules stick to the cold surfaces.
  • the molecules are removed from a gaseous state and less molecules remain in the atmosphere. This causes the pressure in the chamber to decrease.
  • cryo systems are substantially complex and a relatively great amount of electrical energy is consumed to provide a highly efficient cryogenic system.
  • a coating apparatus includes: a coating chamber for depositing a material on a flexible substrate, a winding chamber for guiding the flexible substrate into and out of the coating chamber, a vacuum housing, wherein the coating chamber and the winding chamber are provided in the vacuum housing; a cryo chiller, a cryo surface connected to the cryo chiller, wherein the cryo surface comprises a first active pumping surface in the coating chamber and a second active pumping surface in the winding chamber; a roller arrangement for guiding the flexible substrate, wherein the roller arrangement is insertable in and withdrawable out of the vacuum housing, particularly wherein the roller arrangement provided separates the coating chamber from the winding chamber, and wherein the roller arrangement is arranged on a movable support; and a wall arranged on the movable support for closing the vacuum housing vacuum- tightly.
  • FIG. 1 shows a schematic view of a processing apparatus according to embodiments described herein;
  • the roller arrangement 120 is arranged on a movable support 121.
  • winding motors 122 and 123 are arranged on the movable support 121 and are configured for driving the roller arrangement 120.
  • the movable support is guided through rails 124.
  • the movable support is further guided by wheels on a beam 125 extending from the top of the vacuum housing 110.
  • the movable support 121 is movable with respect to the housing 110 in one direction.
  • the direction of movement of the movable support is perpendicular to the cross section of the housing 110, as shown by arrow 126 in Fig. 1, i.e.
  • the flexible substrate 130 is guided by the roller arrangement 120 from the winding chamber 102 into the processing chamber 101 before processing the substrate 130 and from the processing chamber 101 into the winding chamber 102 after processing the substrate 130.
  • the flexible substrate 130 is directed by rollers from a supply roll 210 disposed on an unwinder 211 to a substrate support, as indicated by a first arrow.
  • the substrate support is configured for supporting the substrate during processing and/or deposition.
  • the substrate support can be a processing drum 212. From the processing drum 212, the substrate 130 is guided to a take-up roll 213 on a winder 214 as indicated by the second arrow.
  • the embodiment depicted in figure 2 includes one deposition source fixedly arranged in the processing chamber 101. Yet, it is to be understood that according to yet further embodiments, which can be combined with other embodiments described herein, one or more deposition sources can be provided. For example, two, three, four or even more such as 8, 10 or 12 deposition sources can be provided.
  • the deposition source can be an evaporator, such as e.g. CVD sources, PECVD sources, PVD sources or the like. However, other sources like sputter targets can also be included.
  • the sum of the areas of the active pumping surfaces connected to the cryo chiller might be larger than the specified area of the cryo chiller.
  • a larger cryo chiller e.g. a cryo chiller with a cooling power for 3 m 2 for the above example, may also be utilized.
  • the cryo chiller 240 is also arranged stationary to the vacuum housing 110.
  • the first active pumping surface 241 and the second active pumping surface 242 are also connected to the cryo chiller 240 in series. Accordingly, also with respect to this embodiment, an evacuation system can be provided wherein only one cryo chiller 240 is needed, while still providing an effective evacuation system in the winding chamber and in the processing chamber.
  • a control panel and a control monitor can be provided. According to typical embodiments, the control panel and the control monitor are arranged outside the vacuum housing.
  • the deposition material may be chosen according to the deposition process and the later application of the coated substrate.
  • the deposition material of the source may be a material selected from the group consisting of: a metal, such as aluminum, molybdenum, titanium, silver, copper, or the like, silicon, indium tin oxide, ZnS, and other transparent conductive oxides such as e.g. Si02, A1203 or the like.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention se rapporte à un appareil de traitement pour le traitement d'un substrat. L'appareil de traitement comprend une chambre de traitement destiné à déposer un matériau sur un substrat flexible, une chambre d'enroulement pour le guidage du substrat flexible dans la chambre de traitement et hors de cette dernière, un refroidisseur cryogénique et une surface cryogénique reliée au refroidisseur cryogénique, la surface cryogénique comprenant une première surface de pompage active dans la chambre de traitement et une seconde surface de pompage active dans la chambre d'enroulement. De plus, la chambre de traitement et la chambre d'enroulement sont disposées dans une enceinte sous vide, un agencement de rouleaux pour le guidage du substrat flexible pouvant être introduit dans l'enceinte sous vide et retiré de cette dernière. En particulier, l'agencement de rouleaux fourni sépare la chambre de traitement de la chambre d'enroulement. En outre, la première surface de pompage active et la seconde surface de pompage active sont reliées au refroidisseur cryogénique en série.
PCT/EP2014/068978 2014-09-05 2014-09-05 Cryoréfrigérateur à usages multiples dans des systèmes de traitement sous vide WO2016034250A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201480081726.0A CN106605009A (zh) 2014-09-05 2014-09-05 真空处理系统中的多用途低温冷却器
PCT/EP2014/068978 WO2016034250A1 (fr) 2014-09-05 2014-09-05 Cryoréfrigérateur à usages multiples dans des systèmes de traitement sous vide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/068978 WO2016034250A1 (fr) 2014-09-05 2014-09-05 Cryoréfrigérateur à usages multiples dans des systèmes de traitement sous vide

Publications (1)

Publication Number Publication Date
WO2016034250A1 true WO2016034250A1 (fr) 2016-03-10

Family

ID=51535423

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2014/068978 WO2016034250A1 (fr) 2014-09-05 2014-09-05 Cryoréfrigérateur à usages multiples dans des systèmes de traitement sous vide

Country Status (2)

Country Link
CN (1) CN106605009A (fr)
WO (1) WO2016034250A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3338063A (en) * 1966-01-17 1967-08-29 500 Inc Cryopanels for cryopumps and cryopumps incorporating them
US20080041301A1 (en) * 2004-05-25 2008-02-21 Stefan Hein Band Processing Plant
WO2011046050A1 (fr) * 2009-10-16 2011-04-21 東洋紡績株式会社 Dispositif de fabrication et procédé de fabrication pour film conducteur transparent

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201215426Y (zh) * 2008-05-13 2009-04-01 博源科技材料（烟台）有限公司 真空镀铝机卷绕室制冷系统

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3338063A (en) * 1966-01-17 1967-08-29 500 Inc Cryopanels for cryopumps and cryopumps incorporating them
US20080041301A1 (en) * 2004-05-25 2008-02-21 Stefan Hein Band Processing Plant
WO2011046050A1 (fr) * 2009-10-16 2011-04-21 東洋紡績株式会社 Dispositif de fabrication et procédé de fabrication pour film conducteur transparent

Also Published As

Publication number Publication date
CN106605009A (zh) 2017-04-26

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