WO2016032281A1 - Substrat en plastique - Google Patents

Substrat en plastique Download PDF

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Publication number
WO2016032281A1
WO2016032281A1 PCT/KR2015/009064 KR2015009064W WO2016032281A1 WO 2016032281 A1 WO2016032281 A1 WO 2016032281A1 KR 2015009064 W KR2015009064 W KR 2015009064W WO 2016032281 A1 WO2016032281 A1 WO 2016032281A1
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WIPO (PCT)
Prior art keywords
plastic substrate
layer
group
polymer binder
scattering component
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PCT/KR2015/009064
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English (en)
Korean (ko)
Inventor
박상준
이연근
김용남
정혜원
신보라
Original Assignee
주식회사 엘지화학
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Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to EP15835521.4A priority Critical patent/EP3147311B1/fr
Priority to US15/318,928 priority patent/US10109818B2/en
Priority to CN201580037502.4A priority patent/CN106574059B/zh
Priority claimed from KR1020150121560A external-priority patent/KR101788923B1/ko
Publication of WO2016032281A1 publication Critical patent/WO2016032281A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Definitions

  • the present application relates to a plastic substrate, a method of manufacturing the substrate, an organic electronic device, a light source and a lighting device.
  • An organic electronic device is, for example, a device including one or more layers of organic materials capable of conducting current, as disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 1996-176293). to be.
  • the type of organic electronic device includes an organic light emitting diode (OLED), an organic solar cell, an organic photoconductor (OPC), or an organic transistor.
  • An organic light emitting device typically includes a substrate, a first electrode layer, an organic layer, and a second electrode layer sequentially.
  • the first electrode layer may be formed of a transparent electrode layer
  • the second electrode layer may be formed of a reflective electrode layer.
  • the first electrode layer may be formed of a reflective electrode layer
  • the present application provides a plastic substrate, a method of manufacturing the substrate, an organic electronic device, a light source, and a lighting device.
  • the present application relates to a plastic substrate.
  • Exemplary plastic substrates of the present application have a support layer comprising a polymeric binder and scattering components contained within the polymeric binder.
  • 1 exemplarily shows a plastic substrate 1 having a polymeric binder 1011 and a support layer 101 comprising a scattering component 1012 contained in the polymeric binder.
  • the plastic substrate may include the scattering component 1012 completely in the polymer binder 1011 so that the support layer 101 may have a flat surface.
  • the plastic substrate may have the scattering component 1012 exposed to the surface of the polymer binder 1011 so that the surface of the support layer 101 may have an uneven structure.
  • the term "scattering component” has a refractive index different from that of a surrounding material such as a polymer binder and the like, and has an appropriate size to form an area capable of scattering, refracting, or diffracting incident light. It can mean a substance.
  • the scattering component may be, for example, in the form of particles.
  • the content ratio of the scattering component in the polymer binder may be appropriately selected within a range that does not impair the purpose of the present application.
  • the scattering component may be included in the polymer binder in a proportion within the range of 0.05% to 3.75% by weight.
  • the content ratio of the scattering component in the polymer binder is A wt%
  • 100% by weight of the polymer binder may mean a weight ratio based on the weight of the polymer binder excluding the solvent.
  • the upper limit of the content ratio in the polymer binder of the scattering component is specifically 3.75 wt% or less, 3.5 wt% or less, 3.25 wt% or less, 3 wt% or less, 2.75 wt% or less, 2.5 wt% or less, 2.25 wt% or less, 2 wt% % Or less, 1.9% or less, 1.8% or less, or 1.7% or less, or 1.6% or less.
  • the lower limit of the content ratio in the polymer binder of the scattering component is specifically 0.05% by weight, 0.1% by weight, 0.15% by weight, 0.2% by weight, 0.25% by weight, 0.3% by weight, 0.35% by weight, 0.4% by weight. % Or more, 0.45% or more, or 0.5% or more.
  • the content ratio of the scattering component in the polymer binder is not necessarily limited to the above range, and may be adjusted to be below or above the above range in consideration of the haze characteristics of the support layer and / or the plastic substrate to be implemented.
  • the upper limit of the content ratio of the scattering component in the polymer binder may be about 10% by weight. have.
  • the filter may be clogged in the filtering step, and sufficient filtering is not performed, thus including the polymer binder precursor and the scattering component. Since the surface of the coating layer is rough after coating the layer of the composition to be disadvantageous when manufacturing the device.
  • the thickness of the support layer may be appropriately selected within a range that does not impair the purpose of the present application.
  • the thickness of the support layer may be in the range of about 10 ⁇ m to 130 ⁇ m.
  • the upper limit of the thickness of the support layer may be 130 ⁇ m or less, 120 ⁇ m or less, 110 ⁇ m or less, 100 ⁇ m or less, 90 ⁇ m or less, 80 ⁇ m or less, or 70 ⁇ m or less.
  • the lower limit of the thickness of the support layer may be 10 ⁇ m or more, 20 ⁇ m or more, 30 ⁇ m or more, 40 ⁇ m or more, 50 ⁇ m or more, or 60 ⁇ m or more.
  • the thickness of the support layer within the above range means that the support layer itself has a sufficient thickness to function as a substrate such as an organic electronic device. This results in a very thin thickness of the light extraction layer, for example, on a conventional plastic substrate (without light extraction capability) of sufficient thickness to function as a substrate in manufacturing a plastic substrate having conventional light extraction capability. It is different from the structure coated with a thickness of about 2 ⁇ m or less. According to the present application, the support layer is advantageous in terms of fabrication of the substrate since it can simultaneously perform the function of the substrate and the function of the light extraction layer.
  • the haze of the plastic substrate may be appropriately selected within a range that does not impair the purpose of the present application.
  • the haze of the plastic substrate can range from about 5% to 80%.
  • the upper limit of the haze of the plastic substrate is specifically 80% or less, 77.5% or less, 75% or less, 72.5% or less, 70% or less, 67.5% or less, 65% or less, 62.5% or less, 60% or less, 57.5% or less or 55 It may be less than or equal to%.
  • the lower limit of the haze of the plastic substrate is specifically 5% or more, 7.5% or more, 10% or more, 12.5% or more, 15% or more, 17.5% or more, 20% or more, 22.5% or more, 25% or more, 27.5% At least 30%, at least 32.5%, at least 35%, at least 37.%, at least 40%, at least 42.5%, at least 45%, at least 47.5%, at least 50% or at least 52.5%.
  • the haze of the plastic substrate is within the above range, it is possible to provide a plastic substrate having excellent light extraction performance.
  • the method of measuring the haze of the plastic substrate is not particularly limited, and haze may be measured by employing a haze measuring method known in the art.
  • the haze can be measured using a D65 light source with a hazemeter known in the art, for example, the HM-150 device from MURAKAMI.
  • the plastic substrate may exhibit the haze range even in a state in which no haze-inducing element is included in addition to the scattering component of the support layer.
  • the plastic substrate does not include a haze-inducing element other than the scattering component of the support layer
  • the only haze-inducing component in the plastic substrate is a scattering component
  • further includes a haze-inducing layer or a haze-inducing component in the polymerization of the polymer binder It may mean that no additional addition.
  • the plastic substrate of the present application may exhibit haze in the range of about 5% to 80% without including a haze causing element other than the scattering component of the support layer.
  • the upper limit of the haze of the plastic substrate is specifically 80% or less, 77.5% or less, 75% or less, 72.5% or less, 70% or less, 67.5% or less, 65% or less, 62.5% or less, 60% or less, 57.5% or less or 55 It may be less than or equal to%.
  • the lower limit of the haze of the plastic substrate is specifically 5% or more, 7.5% or more, 10% or more, 12.5% or more, 15% or more, 17.5% or more, 20% or more, 22.5% or more, 25% or more, 27.5% At least 30%, at least 32.5%, at least 35%, at least 37.%, at least 40%, at least 42.5%, at least 45%, at least 47.5%, at least 50% or at least 52.5%.
  • the plastic substrate is manufactured by superimposing the scattering components before the conversion from the polymer binder precursor to the polymer binder, it is possible to ensure stable dispersibility of the scattering components in the polymer binder, and thus a haze-inducing element in addition to the scattering components Even if it does not include the excellent haze characteristics as shown above.
  • the plastic substrate of the present application also has excellent surface roughness characteristics.
  • the excellent surface roughness characteristics of the substrate in the present specification may mean that the surface is flat because the surface roughness of the substrate is low.
  • the support layer including the polymer binder and the scattering component it is generally expected that the higher the content ratio of the scattering component, the thicker the support layer, the higher the haze.
  • the content ratio of the scattering component is relatively low and the thickness of the support layer is relatively high, even if it exhibits similar haze characteristics, compared with the case where the ratio of the scattering component is relatively high and the thickness of the support layer is relatively low, It can exhibit excellent surface roughness characteristics. This may be attributed to the relatively low content of the scattering component.
  • the plastic substrate of the present application is manufactured by superimposing the scattering component on the polymer binder precursor, in which case the dispersibility of the scattering component in the support layer can be stably secured, as compared to the method of post-adding. This is because scattering components at the surface can reduce aggregation. When scattering components are agglomerated on the surface of the plastic substrate, a short may occur, which is disadvantageous for device fabrication.
  • the plastic substrate of the present application is more advantageous in terms of the dispersion stability of the scattering components in the support layer, the uniformity of the scattering components and the surface roughness characteristics.
  • the support layer may have a surface roughness (Ra) in a range of about 0.1 nm to 30 nm measured in a region of 20 ⁇ m ⁇ 20 ⁇ m or more. More specifically, the upper limit of the surface roughness Ra may be 30 nm or less, 27.5 nm or less, 25 nm or less, 22.5 nm or less, 20 nm or less, 17.5 nm or less, 15 nm or less, or 12.5 nm or less.
  • the lower limit of the surface roughness Ra is more specifically 0.1 nm or more, 1 nm or more, 2 nm or more, 3 nm or more, 4 nm or more, 5 nm or more, 6 nm or more, 7 nm or more, 8 nm or more. Or 9 nm or more.
  • the plastic substrate may exhibit excellent surface roughness characteristics, and when the plastic substrate is applied to the substrate of the organic electronic device described later, it is advantageous in terms of device fabrication of the organic electronic device, and short Does not cause problems such as
  • the method of measuring the surface roughness is not particularly limited, and the surface roughness may be measured by employing a surface roughness measuring method known in the art.
  • the surface roughness is AFM (atomic force microscope) equipment known in the art, for example, NS4 D3100 DEN P-4 Rev.
  • a device can be used for non-contact (vibrating) measurements.
  • the plastic substrate of the present application also shows excellent light transmittance.
  • the plastic substrate has a transmittance of at least 80%, at least 82%, at least 84%, at least 86%, at least 88% for light of at least one wavelength in the visible region, for example, at a wavelength of 550 nm or at 638 nm. Or 90% or more.
  • Plastic substrate of the present application includes a relatively small amount of scattering components in order to exhibit the haze characteristics and / or light extraction performance to be implemented, and because of using a relatively thick thickness of the support layer, it can exhibit such excellent light transmittance have. Since the plastic substrate of the present application has excellent light transmittance as described above, the plastic substrate may be suitable as a substrate of an organic electronic device of a bottom emission type, but is not limited thereto.
  • the plastic substrate of the present application may exhibit excellent durability, peeling resistance and the like even in the process of forming an organic electronic device requiring high temperature.
  • the thermal expansion coefficient of the plastic substrate may be in the range of 10 ppm / ° C. to 50 ppm / ° C., but is not limited thereto.
  • the plastic substrate of the present application may exhibit high refractive index.
  • the plastic substrate may have a refractive index of at least about 1.5, at least about 1.6, at least about 1.65, or at least about 1.7 for light having a wavelength of 550 nm or 633 nm.
  • the upper limit of the refractive index is not particularly limited, but may be, for example, 1.9 or less, 1.85 or less, 1.80 or less, or 1.75 or less.
  • Such a refractive index range can be ensured by, for example, forming a plastic substrate from a polymer material having a high refractive index or by blending high refractive index particles with a material of the plastic substrate.
  • the refractive index of the plastic substrate satisfies the above range, the total reflection phenomenon may be solved or alleviated in the substrate, thereby realizing an organic electronic device having excellent light extraction performance.
  • the polymer binder may include polyimide, polyethylene naphthalate, polycarbonate, acrylic resin, polyethylene terephthalate, polysulfone, polyether sulfide, polypropylene, polyether ether ketone or polydimethylsilonic acid
  • polyimide may be selected and used as the polymer binder in terms of process temperature or light extraction performance.
  • Such a polyimide can be manufactured using the monomer which introduce
  • the polymer binder may include a polyimide compound including a repeating unit of Formula 1 below.
  • R 1 to R 20 are each independently a hydrogen, an alkyl group, an alkoxy group, an aryl group or a functional group containing a halogen atom, a sulfur atom or a phosphorus atom, and n is an integer of 1 or more.
  • R 1 to R 20 There is no substituent substituted on a carbon atom connecting two of the ring structure. For example, R 2 and R 5 are not present when the carbon atom to which R 2 is connected and the carbon atom to which R 8 is connected connect the benzene ring.
  • single bond may mean that no separate atom or atom group exists at the corresponding site.
  • benzene on both sides of -L- may be directly connected to form a biphenyl structure.
  • the alkyl group may be, for example, a straight or branched chain alkyl group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms, unless otherwise specified. .
  • the alkyl group may be optionally substituted with one or more substituents.
  • an alkoxy group may mean an alkoxy group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms.
  • the alkoxy group may be linear, branched or cyclic.
  • the alkoxy group may be optionally substituted by one or more substituents.
  • the aryl group or the arylene group herein includes, unless otherwise specified, an aromatic compound comprising a benzene or a structure containing two or more benzene condensed or bonded while sharing two or one carbon atom or It may mean a monovalent residue or a divalent residue derived from a derivative.
  • the aryl group or arylene group may be, for example, an aryl group or arylene group having 6 to 22 carbon atoms, 6 to 20 carbon atoms, 6 to 18 carbon atoms, 6 to 16 carbon atoms, 6 to 14 carbon atoms or 6 to 12 carbon atoms.
  • the aryl group or arylene group may be optionally substituted by one or more substituents.
  • the alkylene group or the alkylidene group may be, for example, an alkylene group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms. It may mean a leaden group.
  • the alkylene group or alkylidene group may be, for example, linear, branched or cyclic. In addition, the alkylene group or alkylidene group may be optionally substituted by one or more substituents.
  • the alkenylene group or alkynyldene group includes, for example, an alkenylene group having 2 to 20 carbon atoms, 2 to 16 carbon atoms, 2 to 12 carbon atoms, 2 to 8 carbon atoms, or 2 to 4 carbon atoms. Or an alkynylidene group.
  • the alkenylene group or alkynylidene group may be, for example, linear, branched or cyclic.
  • the alkenylene group or alkynylidene group may be optionally substituted with one or more substituents.
  • the alkenyl group may be, for example, an alkenyl group having 2 to 20 carbon atoms, 2 to 16 carbon atoms, 2 to 12 carbon atoms, 2 to 8 carbon atoms, or 2 to 4 carbon atoms.
  • the alkenyl group may be, for example, linear, branched or cyclic.
  • the alkenyl group may be optionally substituted with one or more substituents.
  • substituents that may be substituted with an alkyl group, an alkoxy group, an aryl group, an alkylene group, an alkylidene group, an alkenylene group, an alkynylene group, an arylene group, or the like include a halogen atom such as fluorine, chlorine, bromine or iodine, A functional group, a phenyl group, a benzyl group, a naphthyl group, or a thiophenyl group, including a sulfur atom or a phosphorus atom, etc. may be exemplified, but is not limited thereto.
  • the polymeric binder may be a homopolymer formed of only the repeating unit of Formula 1, or may be a block or random copolymer including other units other than the repeating unit of Formula 1.
  • both ends of the polymer may be independently a hydrogen, an alkyl group, an alkoxy group aryl group or a functional group including a halogen atom, a sulfur atom or a phosphorus atom.
  • the kind and ratio of another repeating unit can be suitably selected in the range which does not inhibit a desired refractive index, heat resistance, a light transmittance, etc., for example.
  • the polymer binder including the repeating unit of Chemical Formula 1 may be, for example, about 10,000 to 100,000 or about 10,000 to 50,000 in terms of weight average molecular weight in terms of standard polystyrene measured by gel permeation chromatography (GPC).
  • the polymeric binder having a repeating unit of formula (1) also has a light transmittance of 80% or more, 85% or more or 90% or more in the visible light region, and is excellent in heat resistance.
  • the average particle diameter of the scattering component may be in the range of 150 nm to 300 nm.
  • the lower limit of the average particle diameter of the scattering component may be 150 nm or more, 160 nm or more, 170 nm or more, 180 mm or more, 190 mm or 200 nm or more.
  • an upper limit of the average particle diameter of the scattering component may be specifically 300 nm or less, 290 nm or less, 280 nm or less, 270 nm or less, 260 nm or less, or 250 nm or less.
  • the scattering component may have a higher or lower refractive index than the surrounding material, for example, a polymeric binder.
  • the absolute value of the difference in refractive index for the light of the wavelength of 550 nm or 633 nm of the polymeric binder and the scattering component may be in the range of 0.5 to 1.2.
  • the lower limit of the absolute value of the difference in refractive index may be specifically 0.5 or more, 0.55 or more, 0.6 or more, 0.65 or more, or 0.7 or more.
  • an upper limit of the absolute value of the difference in refractive index may be specifically 1.2 or less, 1.15 or less, 1.1 or less, 1.05 or less, or 1 or less.
  • an organic electronic device having excellent light extraction performance can be provided by appropriately scattering, refracting, or diffracting light incident on the plastic substrate.
  • the shape of the scattering component may be appropriately selected within a range that does not impair the purpose of the present application.
  • the scattering component may have a shape such as spherical, oval, polyhedron or amorphous, but is not limited thereto.
  • the scattering component a material capable of forming a region capable of scattering, refracting, or diffracting light incident in a state contained in a polymer binder may be appropriately selected from known materials known in the art. Can be used.
  • the scattering component may include, for example, an organic material and / or an inorganic material.
  • the organic material include acrylic resins, styrene resins, olefin resins, nylon resins, melamine resins, formaldehyde resins, silicone resins, urethane resins, polyester resins, polycarbonate resins and derivatives thereof.
  • An organic material including one or more may be exemplified, but is not limited thereto.
  • the inorganic material may be a metal or an oxide of a metal, but is not limited thereto.
  • the inorganic substance include TiO 2 , HfO 2 , BaTiO 3 , SnO 2 , ZrO 2 , ZnO, Al 2 O 3, and SiO 2.
  • Minerals including one or more selected from the group consisting of may be exemplified, but are not limited thereto.
  • the scattering component may be formed of only one of the above materials or two or more of the above materials. For example, hollow particles such as hollow silica or particles having a core / cell structure may be used as the scattering component.
  • a barrier layer may be further formed on one or both surfaces of the support layer.
  • the term "barrier layer” may mean a layer having a function of preventing permeation of oxygen, moisture, nitrogen oxides, sulfur oxides, or ozone in the atmosphere.
  • the barrier layer is not particularly limited as long as it has the above function, and may be appropriately selected depending on the intended use.
  • the barrier layer may be formed on one side or both sides of the plastic substrate via a buffer layer. That is, the plastic substrate may further include a buffer layer formed between the barrier layer and the support layer.
  • the buffer layer may serve to improve adhesion between the barrier layer and the base layer.
  • the buffer layer may be formed by, for example, depositing an inorganic layer such as SiO 2 , SiONx or SiNx by a sputtering method or a known vacuum deposition method. If necessary, the buffer layer may be formed by a method of organic / inorganic coating.
  • the material of the barrier layer may be selected and used without limitation, a material having a function of preventing the substances that promote device degradation such as moisture and oxygen from entering the device.
  • the barrier layer may be formed of a metal such as In, Sn, Pb, Au, Cu, Ag, Al, Ti, and Ni; TiO, TiO 2 , Ti 3 O 3 , Al 2 O 3 , MgO, SiO, SiO 2 , GeO, NiO, CaO, BaO, Fe 2 O 3 , Y2O 3 , ZrO 2 , Nb 2 O 3 and CeO 2 and Metal oxides such as; Metal nitrides such as SiN; Metal oxynitrides such as SiON; Metal fluorides such as MgF 2 , LiF, AlF 3 and CaF 2 ; Polyethylene, polypropylene, polymethylmethacrylate, polyimide, polyurea, polytetrafluoroethylene, polychlorotrifluoroethylene, polydichlorodifluoroethylene, or chlorotrifluoroethylene and dichlorodifluoroethylene Copolymers; Copolymers obtained by copolymerizing a com
  • the material of the barrier layer may be a metal oxide.
  • the material of the barrier layer may be a high refractive index metal oxide.
  • the refractive index of the barrier layer may be, for example, about 1.45 or more, about 1.5 or more, about 1.6 or more, about 1.65 or more, or about 1.7 or more with respect to a wavelength of 633 nm.
  • the upper limit of the refractive index of the barrier layer can be appropriately adjusted according to the desired function, for example, the refractive index for the wavelength of 633 nm may be 2.6 or less, 2.3 or less, 2.0 or less or 1.8 or less.
  • the barrier layer may be a single layer structure or a multilayer structure.
  • the single layer structure may include, for example, a material of one kind of barrier layer, or may include a mixture of two or more types of barrier layers.
  • the multilayer structure may be, for example, a structure in which two or more layers of the single layer structure are stacked, and in one suitable example, the barrier layer may include a titanium oxide layer (eg, TiO 2 layer) and an aluminum oxide layer (eg, For example, the Al 2 O 3 layer) may be a multilayer structure sequentially stacked.
  • the thickness of the barrier layer is not particularly limited and may be appropriately selected depending on the intended use. In one example, the thickness of the barrier layer can be 5 nm to 1000 nm, 7 nm to 750 nm or 10 nm to 500 nm.
  • the light transmittance of the barrier layer is not particularly limited and may be appropriately selected depending on the intended use. In one example, the light transmittance of the barrier layer may be at least about 80%, at least 85%, or at least 90%.
  • the barrier layer can have a refractive index that is comparable to the adjacent layer.
  • the barrier layer may have a refractive index of 1.5 or more for light having a wavelength of 550 nm or 633 nm. Accordingly, since the total reflection phenomenon at the interface between the barrier layer and the electrode layer can be solved or alleviated, an organic electronic device having excellent light extraction performance can be realized.
  • the barrier layer may have a water vapor transmission rate (WVTR) of 10 ⁇ 4 g / m 2 ⁇ day or less.
  • the water vapor transmission rate may be, for example, a value measured at a temperature of 40 ° C. and a relative humidity of 90%.
  • the water vapor transmission rate can be measured using, for example, a water vapor transmission rate meter (manufactured by PERMATRAN-W3 / 31, manufactured by MOCON, Inc.).
  • a water vapor transmission rate meter manufactured by PERMATRAN-W3 / 31, manufactured by MOCON, Inc.
  • the barrier layer is, for example, ALD (Atomic Layer Deposition) method, vacuum deposition method, sputtering method, reactive sputtering method, MBE (molecular beam epitaxy) method, cluster ion beam method, ion plating method, plasma polymerization method (high frequency excitation ion plating method), It may be a layer formed by plasma CVD method, laser CVD method, thermal CVD method, gas source CVD method or coating method, and may be an atomic layer deposition layer formed by ALD method as one suitable example.
  • ALD Atomic Layer Deposition
  • the plastic substrate of the present application may further include a flat layer.
  • the flat layer may be formed on one or both surfaces of the support layer, for example.
  • the flat layer has such a concave-convex structure when the scattering component 1012 is exposed to the surface of the polymeric binder 1011 such that the surface of the support layer has a concave-convex structure, such as the plastic substrate illustrated in FIG. 2. It may be formed on the upper surface of the support layer.
  • 3 exemplarily illustrates a plastic substrate 1 having a structure in which a flat layer 301 is formed on an upper surface of a support layer 101 having an uneven structure.
  • the planarization layer can include high refractive particles, for example, with a binder.
  • the flat layer may be formed using a composition in which high refractive particles are mixed with a binder.
  • the flat layer may provide a surface on which an organic electronic device including an electrode layer and the like may be formed, and have light scattering properties to improve light extraction performance of the device.
  • the flat layer may have a refractive index that is equal to or greater than that of the adjacent electrode layer, and for example, the refractive index of light having a wavelength of 550 nm or 633 nm may be 1.5 or more.
  • the binder of the flat layer a known material can be used without particular limitation.
  • various organic binders, inorganic binders or organic-inorganic binders known in the art can be used.
  • the organic binder, the inorganic binder, or the organic / inorganic binder having excellent heat resistance and chemical resistance may be selected and used in consideration of excellent resistance to a high temperature process, a photo process or an etching process performed during the life of the device or the fabrication process.
  • the binder may, for example, have a refractive index of at least about 1.4, at least about 1.45, at least about 1.5, at least about 1.6, at least about 1.65, or at least about 1.7.
  • the upper limit of the refractive index of the binder may be selected in a range capable of satisfying the refractive index of the flat layer in consideration of the refractive index of the particles to be blended together.
  • the binder for example, epoxy resin, polysiloxane or polyimide can be exemplified.
  • a high refractive binder or a low refractive binder can be used, for example.
  • the term "high refractive index binder” means a binder having a refractive index of about 1.7 to 2.5 or about 1.7 to 2.0
  • the term "low refractive binder” may mean a binder having a refractive index of about 1.4 or more and less than about 1.7. have.
  • Such binders are variously known, and suitable binders may be selected and used among various kinds of binders described above or other known binders.
  • the flat layer may further comprise high refractive particles.
  • high refractive particles may mean, for example, particles having a refractive index of 1.8 or more, 2.0 or more, 2.2 or more, 2.5 or more, 2.6 or more, or 2.7 or more.
  • the upper limit of the refractive index of the high refractive particles may be selected in a range capable of satisfying the refractive index of the flat layer, for example, in consideration of the refractive index of the binder and the like blended together.
  • the high refractive particles may be, for example, about 1 nm to 100 nm, 10 nm to 90 nm, 10 nm to 80 nm, 10 nm to 70 nm, 10 nm to 60 nm, 10 nm to 50 nm or about 10 nm to 45 nm. It may have an average particle diameter of.
  • the high refractive particles for example, alumina, aluminosilicate, titanium oxide or zirconium oxide and the like can be exemplified.
  • rutile titanium oxide can be used, for example, as particles having a refractive index of 2.5 or more.
  • Titanium oxide of the rutile type has a high refractive index compared to other particles, and therefore can be adjusted to the desired refractive index in a relatively small proportion.
  • the refractive index of the high refractive particles may be a refractive index measured for light of 550 nm wavelength or 633 nm.
  • the flat layer may include high refractive particles having a refractive index of 1.8 or more and an average particle diameter of 50 nm or less for light having a wavelength of 633 nm.
  • the ratio of the high refractive particles in the flat layer is not particularly limited and may be adjusted within a range in which the refractive index of the flat layer described above can be secured.
  • the high refractive particles are 300 parts by weight or less, 250 parts by weight or less, 200 parts by weight or less relative to 100 parts by weight of the binder. It may be included in the flat layer in a ratio of 150 parts by weight or less or 120 parts by weight or less.
  • the ratio of the high refractive particles may be, for example, 40 parts by weight or more, 60 parts by weight or more, 80 parts by weight or more, or 100 parts by weight or more.
  • unit weight part means the ratio of weight between components, unless otherwise specified.
  • the flat layer may be, for example, a wet coating method using a coating liquid containing a binder and high refractive particles, a deposition method such as a sol-gel method, a chemical vapor deposition (CVD) or a physical vapor deposition (PVD) method, or a micro It can be formed through an embossing method, but is not limited thereto.
  • a wet coating method using a coating liquid containing a binder and high refractive particles a deposition method such as a sol-gel method, a chemical vapor deposition (CVD) or a physical vapor deposition (PVD) method, or a micro It can be formed through an embossing method, but is not limited thereto.
  • the flat layer may be formed using a material in which a compound such as alkoxide or acylate of a metal such as zirconium, titanium or cerium is combined with a binder having a polar group such as a carboxyl group or a hydroxy group.
  • a compound such as alkoxides or acylates may be condensed with the polar groups in the binder, and the high refractive index may be realized by including the metal in the binder.
  • the alkoxide or acylate compound include titanium alkoxides such as tetra-n-butoxy titanium, tetraisopropoxy titanium, tetra-n-propoxy titanium or tetraethoxy titanium, titanium stearate and the like.
  • Zirconium such as zirconium alkoxides such as titanium acylate, titanium chelates, tetra-n-butoxy zirconium, tetra-n-propoxy zirconium, tetraisopropoxy zirconium or tetraethoxy zirconium and zirconium tributoxy stearate Acylate, zirconium chelates, etc. can be illustrated.
  • the flat layer may also be formed by a sol-gel coating method in which a metal alkoxide, such as titanium alkoxide or zirconium alkoxide, and a solvent such as alcohol or water are prepared to prepare a coating liquid, and after the coating is applied, the coating solution is baked at an appropriate temperature.
  • the plastic substrate of the present application may further include a carrier substrate attached to one surface of the support layer.
  • a carrier substrate attached to one surface of the support layer.
  • the carrier substrate may use a glass substrate or a rigid substrate, for example.
  • a glass substrate an appropriate material can be used without particular limitation, and for example, a base layer such as soda lime glass, barium / strontium-containing glass, lead glass, aluminosilicate glass, borosilicate glass, barium borosilicate glass, or quartz can be used. It may be illustrated, but is not limited thereto.
  • the carrier substrate may be formed to be detachable from the plastic substrate.
  • the present application also relates to a method of manufacturing the plastic substrate.
  • Exemplary plastic substrate manufacturing methods of the present application include forming a layer of a composition comprising a polymeric binder precursor and a scattering component, and converting the polymeric binder precursor into a polymeric binder in the layer.
  • the composition including the polymer binder precursor and the scattering component may include the scattering component in a ratio within the range of about 0.05% to 3.75% by weight based on 100% by weight of the polymer binder precursor.
  • “100 wt% polymer binder precursor” may refer to a weight ratio based on the weight of the polymer binder precursor except for the solvent. Specific matters regarding the content ratio of the scattering component may be equally applicable to the content ratio of the scattering component in the polymer binder described in the item of the plastic substrate.
  • the layer of the composition may be formed to a thickness within the range of about 10 ⁇ m to 130 ⁇ m.
  • the layer of the composition may be the support layer described in the section of the plastic substrate by converting the polymeric binder precursor to a polymeric binder. Therefore, the details regarding the thickness of the layer of the composition may be equally applicable to the contents of the thickness of the support layer described in the item of the plastic substrate.
  • the manufacturing method relates to a manufacturing method of the plastic substrate
  • the contents described in the items of the plastic substrate are equally applied to matters other than the content ratio of the scattering component and the thickness of the layer of the composition. Can be. Therefore, when manufacturing a plastic substrate by the said manufacturing method, the plastic substrate which exhibits the haze characteristic described in the item of the said plastic substrate can be manufactured.
  • the manufacturing method produces a plastic substrate by sintering the scattering component.
  • the term “addition” means that in the method of manufacturing a plastic substrate having a support layer comprising a polymer binder and a scattering component, the step of adding the scattering component is performed before the polymer binder precursor is converted into the polymer binder. can do. That is, the term “addition” in the present specification may mean that the scattering component is added to the polymer binder precursor in the manufacturing method of the plastic substrate.
  • the term “post-addition” may mean that in the method of manufacturing the plastic substrate, the step of adding the scattering component is performed after the polymer binder precursor is converted into the polymer binder. That is, in the present specification, the term “post-addition” may mean that the scattering component is added to the polymer binder in the method of manufacturing the plastic substrate.
  • polymer binder precursor may refer to a material that is a material required to form a polymer binder or a material of a previous stage of the polymer binder in a series of reactions forming the polymer binder.
  • the high molecular weight binder precursor may be appropriately selected depending on the type of the polymeric binder.
  • the polymer binder is polyimide
  • the polymer binder precursor may mean a polyamic acid or a monomer compound for synthesizing the polyamic acid.
  • the production method may be said to be heavy when the scattering component is blended with the polyamic acid or the monomer compound for synthesizing the polyamic acid.
  • the plastic substrate when the plastic substrate is manufactured by squeezing the scattering component, it is possible to secure stable dispersibility of the scattering component in the polymer binder precursor and / or the polymer binder, and thus exhibit a haze suitable for light extraction performance.
  • the plastic substrate which is excellent in a roughness characteristic can be manufactured.
  • the plastic substrate when the plastic substrate is manufactured by post-scattering the scattering component, it is impossible to secure the dispersibility of the scattering component in the polymer binder. Therefore, aggregation of the scattering component may occur inside the polymer binder or on the surface of the layer of the composition. It is difficult to represent a haze suitable for the light extraction performance and the surface roughness characteristics are also lowered there is a disadvantage in manufacturing the device.
  • the composition may be prepared by dissolving the polymer binder precursor and the scattering component in a suitable solvent.
  • a solvent well-known organic solvents, such as toluene, xylene, cyclopentanone, or cyclohexanone, can be used.
  • the composition may further include additives such as a polymerization initiator, a surfactant, and the like.
  • the layer of the composition can be formed by applying a composition comprising a polymeric binder precursor and a scattering component onto a suitable substrate.
  • the substrate may use the carrier substrate described in the section of the plastic substrate.
  • the coating method is not particularly limited and a known coating method can be applied.
  • a roll coating, a printing method, an inkjet coating, a slit nozzle method, a bar coating, a comma coating, a spin coating or a gravure coating may be exemplified.
  • the polymeric binder precursor may be polyamic acid.
  • a polyamic acid the well-known polyamic acid which can form a polyimide can be used.
  • a polyamic acid including a repeating unit represented by the following Formula 2 may be used as the polyamic acid.
  • R 1 to R 20 do not have a substituent substituted on a carbon atom connecting two ring structures to each other. For example if, when R 2 is attached is a carbon atom and a carbon atom connected to R 8 is connected, R 2 and R 8 is absent, -NH- group and R 14 is a carbon atom connected to R 14 is coupled from the formula (2) Does not exist.
  • the step of converting the polymer binder precursor to the polymer binder in the layer of the composition may be performed by a step of imidizing the polyamic acid.
  • the condition or method of the imidation reaction is not particularly limited, and conditions or methods of the imidation reaction for converting a polyamic acid known in the art to polyimide may be applied.
  • the present application also relates to the use of the plastic substrate.
  • the present application relates to an organic electronic device including the plastic substrate.
  • the organic electronic device includes a polymer binder; And a scattering component contained in the binder at a ratio within the range of 0.05% to 3.75% by weight, the support layer having a thickness in the range of 10 ⁇ m to 130 ⁇ m, and having a haze in the range of 5% to 80%.
  • Board A first electrode layer formed on the substrate; It may include an organic layer formed on the first electrode layer and a second electrode layer formed on the organic layer.
  • the contents described in the items of the plastic substrate may be applied in the same manner.
  • the organic layer may include at least a light emitting layer.
  • a light emitting layer For example, when the first electrode layer is transparently implemented and the second electrode layer is a reflective electrode layer, a lower light emitting device in which light generated in the light emitting layer of the organic layer is emitted to the base layer side through the optical functional layer may be implemented.
  • the organic electronic device may be an organic light emitting device.
  • the organic electronic device may have a structure in which an organic layer including at least the light emitting layer is interposed between the hole injection electrode layer and the electron injection electrode layer.
  • the first electrode layer formed on the plastic substrate may be a hole injection electrode layer
  • the second electrode layer formed on the organic layer may be an electron injection electrode layer.
  • the first electrode layer may be a transparent electrode layer.
  • the organic layer existing between the electron and the hole injection electrode layer may include at least one light emitting layer.
  • the organic layer may include a plurality of light emitting layers of two or more layers. When two or more light emitting layers are included, the light emitting layers may have a structure divided by an intermediate electrode layer or a charge generating layer (CGL) having charge generation characteristics.
  • CGL charge generating layer
  • the light emitting layer can be formed using, for example, various fluorescent or phosphorescent organic materials known in the art.
  • Examples of the material of the light emitting layer include tris (4-methyl-8-quinolinolate) aluminum (III) (tris (4-methyl-8-quinolinolate) aluminum (III)) (Alg3), 4-MAlq3 or Gaq3.
  • the light emitting layer includes the material as a host, and further includes perylene, distyrylbiphenyl, DPT, quinacridone, rubrene, BTX, ABTX, or DCJTB. It may have a host-dopant system including a dopant.
  • the light emitting layer can be formed by appropriately adopting a kind showing light emission characteristics among the electron-accepting organic compound or electron donating organic compound described later.
  • the organic layer may be formed in various structures further including other various functional layers known in the art, as long as it includes a light emitting layer.
  • Examples of the layer that may be included in the organic layer may include an electron injection layer, a hole blocking layer, an electron transport layer, a hole transport layer, a hole injection layer, and the like.
  • the electron injection layer or the electron transport layer can be formed using, for example, an electron accepting organic compound.
  • an electron accepting organic compound any compound known without particular limitation may be used.
  • organic compounds include polycyclic compounds such as p-terphenyl or quaterphenyl or derivatives thereof, naphthalene, tetratracene, pyrene, coronene, and coronene.
  • Polycyclic hydrocarbon compounds or derivatives thereof such as chrysene, anthracene, diphenylanthracene, naphthacene or phenanthrene, phenanthroline, vasophenanthrol Heterocyclic compounds or derivatives thereof, such as lean (bathophenanthroline), phenanthridine, acridine (acridine), quinoline (quinoline), quinoxaline or phenazine (phenazine) and the like.
  • fluoroceine perylene, phthaloperylene, naphthaloperylene, naphthaloperylene, perynone, phthaloperinone, naphtharoferinone, diphenylbutadiene ( diphenylbutadiene, tetraphenylbutadiene, oxadiazole, ardazine, bisbenzoxazoline, bisstyryl, pyrazine, cyclopentadiene , Oxine, aminoquinoline, imine, diphenylethylene, vinylanthracene, diaminocarbazole, pyrane, thiopyrane, polymethine, mero Cyanine (merocyanine), quinacridone or rubrene, or derivatives thereof, JP-A-1988-295695, JP-A-1996-22557, JP-A-1996-81472, Japanese Patent Laid-Open Publication No.
  • Fluorescent brighteners such as a benzooxazole compound, a benzothiazole compound or a benzoimidazole compound; 1,4-bis (2-methylstyryl) benzene, 1,4-bis (3-methylstyryl) benzene, 1,4-bis (4-methylstyryl) benzene, distyrylbenzene, 1,4- Bis (2-ethylstyryl) benzyl, 1,4-bis (3-ethylstyryl) benzene, 1,4-bis (2-methylstyryl) -2-methylbenzene or 1,4-bis (2- Distyrylbenzene compounds such as methylstyryl) -2-ethylbenzene and the like; 2,5-bis (4-methylstyryl) pyrazine, 2,5-bis (4-ethylstyryl) pyrazine, 2,5-bis [2- (1-naphthyl) vinyl
  • Namin (silanamine) derivative disclosed in Japanese Patent Laid-Open No. 194-279322 or Japanese Patent Laid-Open No. 194-279323 Polyfunctional styryl compound, an oxadiazole derivative disclosed in Japanese Patent Application Laid-Open No. 194-107648 or Japanese Patent Application Laid-Open No. 194-092947, an anthracene compound disclosed in Japanese Patent Application Laid-Open No. 194-206865, Japanese Patent Oxynate derivative disclosed in Japanese Patent Application Laid-Open No. 194-145146, tetraphenylbutadiene compound disclosed in Japanese Patent Application Laid-Open No. 1992-96990, organic trifunctional compound disclosed in Japanese Patent Application Laid-Open No.
  • the electron injection layer may be formed using, for example, a material such as LiF or CsF.
  • the hole blocking layer is a layer capable of preventing the injected holes from entering the electron injection electrode layer through the light emitting layer to improve the life and efficiency of the device, and if necessary, using a known material, the light emitting layer and the electron injection electrode layer It can be formed in a suitable portion in between.
  • the hole injection layer or hole transport layer may comprise, for example, an electron donating organic compound.
  • the electron donating organic compound include N, N ', N'-tetraphenyl-4,4'-diaminophenyl, N, N'-diphenyl-N, N'-di (3-methylphenyl) -4, 4'-diaminobiphenyl, 2,2-bis (4-di-p-tolylaminophenyl) propane, N, N, N ', N'-tetra-p-tolyl-4,4'-diamino ratio Phenyl, bis (4-di-p-tolylaminophenyl) phenylmethane, N, N'-diphenyl-N, N'-di (4-methoxyphenyl) -4,4'-diaminobiphenyl, N , N, N ', N'-tetraphenyl-4,4'-diaminodiphenylether
  • the hole injection layer or the hole transport layer may be formed by dispersing an organic compound in a polymer or using a polymer derived from the organic compound. Also, such as polyparaphenylene vinylene and derivatives thereof, so-called ⁇ -conjugated polymers, hole-transporting non-conjugated polymers such as poly (N-vinylcarbazole), or ⁇ -conjugated polymers of polysilane may also be used. Can be.
  • the hole injection layer is formed by using electrically conductive polymers such as metal phthalocyanine such as copper phthalocyanine, non-metal phthalocyanine, carbon film and polyaniline, or by reacting the aryl amine compound with Lewis acid as an oxidizing agent. You may.
  • electrically conductive polymers such as metal phthalocyanine such as copper phthalocyanine, non-metal phthalocyanine, carbon film and polyaniline, or by reacting the aryl amine compound with Lewis acid as an oxidizing agent. You may.
  • the organic light emitting device may include: (1) a hole injection electrode layer / organic light emitting layer / electron injection electrode layer formed sequentially; (2) the form of a hole injection electrode layer / hole injection layer / organic light emitting layer / electron injection electrode layer; (3) the form of a hole injection electrode layer / organic light emitting layer / electron injection layer / electron injection electrode layer; (4) the form of a hole injection electrode layer / hole injection layer / organic light emitting layer / electron injection layer / electron injection electrode layer; (5) the form of a hole injection electrode layer / organic semiconductor layer / organic light emitting layer / electron injection electrode layer; (6) the form of a hole injection electrode layer / organic semiconductor layer / electron barrier layer / organic light emitting layer / electron injection electrode layer; (7) the form of a hole injection electrode layer / organic semiconductor layer / organic light emitting layer / adhesion improvement layer / electron injection electrode layer; (8) the form of a hole injection electrode layer / hole injection layer / hole transport layer;
  • the organic electronic device may further include an encapsulation structure.
  • the encapsulation structure may be a protective structure to prevent foreign substances such as moisture or oxygen from flowing into the organic layer of the organic electronic device.
  • the encapsulation structure may be, for example, a can such as a glass can or a metal can, or a film covering the entire surface of the organic layer.
  • FIG. 4 shows that the first electrode layer 401, the organic layer 402, and the second electrode layer 403 sequentially formed on the plastic substrate 1 are encapsulated in a can structure such as a glass can or a metal can. Illustrate the protected form.
  • the encapsulation structure 404 may be attached to the plastic substrate 1 by, for example, an adhesive. In this way it is possible to maximize the protective effect through the encapsulation structure.
  • the encapsulation structure may be, for example, a film covering the entire surface of the first electrode layer, the organic layer, and the second electrode layer.
  • 5 exemplarily illustrates an encapsulation structure 501 in the form of a film covering the entire surface of the first electrode layer 401, the organic layer 402, and the second electrode layer 403.
  • the encapsulation structure 501 in the form of a film covers the entire surface of the first electrode layer 401, the organic layer 402, and the second electrode layer 403, as shown in FIG.
  • the two substrates 502 may be bonded to each other.
  • the second substrate for example, a glass substrate, a metal substrate, a polymer film or a barrier layer may be exemplified.
  • the encapsulation structure in the form of a film is formed by applying, curing, and curing a liquid material that is cured by heat or ultraviolet (UV) irradiation or the like, for example, an epoxy resin, or by using the epoxy resin or the like beforehand It can be formed by laminating the substrate and the upper substrate using an adhesive sheet prepared in the form.
  • a liquid material that is cured by heat or ultraviolet (UV) irradiation or the like, for example, an epoxy resin, or by using the epoxy resin or the like beforehand
  • UV ultraviolet
  • the encapsulation structure may include a metal oxide such as calcium oxide, beryllium oxide, a metal halide such as calcium chloride, or a water adsorbent such as phosphorus pentoxide, or a getter material.
  • the moisture adsorbent or getter material may be included, for example, inside the encapsulation structure in the form of a film, or may be present at a predetermined position of the encapsulation structure in the can structure.
  • the encapsulation structure may further include a barrier film, a conductive film, or the like.
  • the present application also relates to the use of such organic electronic devices, for example organic light emitting devices.
  • the present application relates to a light source for a display including the organic electronic device.
  • the present application relates to a lighting device including the organic electronic device.
  • the light source for the display may be a backlight of a liquid crystal display (LCD), a light source, a light source of various sensors, a printer, a copier, a vehicle instrument light source, a signal lamp, an indicator light, a display device, a light source of an area light emitting body, a display, A decoration or various lights etc. can be illustrated.
  • LCD liquid crystal display
  • the organic electronic device when the organic electronic device is applied to the light source for the display, the lighting device, or other uses, other components constituting the light source for the display or the lighting device, or a configuration method thereof are not particularly limited, and the organic electronic device is applied. As far as possible, any material or method known in the art may be employed.
  • Plastic substrate of the present application is excellent in light extraction performance and surface roughness characteristics.
  • the method of manufacturing a plastic substrate of the present application may produce the plastic substrate through a process of adding a scattering component.
  • the plastic substrate of the present application may be used as a substrate of the organic electronic device, the organic electronic device may be used as a light source and a lighting device for a display.
  • 1-3 show exemplary plastic substrates.
  • FIG. 6 shows an SEM cross-sectional image of the plastic substrate of Example 1.
  • Example 7 shows an optical microscope surface image of a dark field mode of the plastic substrates of Example 4 and Comparative Examples 5 and 6 (scale bar: 20 ⁇ m).
  • FIG. 8 shows SEM surface images of the plastic substrates of Example 4 and Comparative Examples 5 and 6.
  • FIG. 9 is a graph showing the transmittance of the visible light region of the plastic substrate and the absolute quantum efficiency of the organic light emitting device.
  • the transmittance of the plastic substrate was measured using an integrating sphere. More specifically, the brightness of the integrating sphere is set to L 0 while the self-absorption correction lamp in the integrating sphere is turned on.
  • the brightness of the integrating sphere when the sample to be measured in the integrating sphere is centered is referred to as Ls.
  • L D the brightness of the plastic substrate transmittance
  • Substrate transmittance (%) (Ls-L D ) / (L 0 -L D ) x 100
  • the haze of a plastic substrate was measured using the D65 light source with the HM-150 apparatus of MURAKAMI.
  • the surface roughness of the plastic substrate is AFM (atomic force microscope) equipment, for example, Digital Instrument's NS4 D3100 DEN P-4 Rev. A-device was used for non-contact (vibrating) measurement.
  • AFM atomic force microscope
  • Absolute quantum efficiency of the organic light emitting device was measured using an integrated hemisphere device of OTSUKA Corporation.
  • the glass substrate was used as a carrier substrate, and the plastic substrate which has a support layer was produced.
  • TiO 2 reffractive index: 2.7
  • for light having a wavelength of 633 nm was mixed in an amount such that the content ratio of the scattering component to 100% by weight of polyimide in the finally prepared support layer may be about 0.1% by weight.
  • Polyamic acid: scattering component 100: 0.1 weight
  • the coating solution was coated on the glass substrate in a range such that the thickness of the supporting layer finally prepared was about 30 ⁇ m, followed by imidization, and the refractive index of the light having a wavelength of 633 nm was about 1.6.
  • distributed in the polyimide was manufactured.
  • the prepared plastic substrate had a transmittance of about 88% and a haze of about 5%.
  • a hole injection electrode layer including ITO Indium Tin Oxide
  • ITO Indium Tin Oxide
  • the prepared plastic substrate had a transmittance of about 84% and a haze of about 26%.
  • the prepared plastic substrate had a transmittance of about 81% and a haze of about 32%.
  • the haze of the prepared plastic substrate was about 33%.
  • 7 (a) and 8 (a) show optical microscope surface images (dark field mode) and SEM surface images of the prepared plastic substrate, respectively.
  • the plastic substrate and the organic electronic device were manufactured in the same manner as in Example 1 except that the polyamic acid polymerization liquid was changed so as not to include scattering particles.
  • the prepared plastic substrate had a transmittance of about 94% and a haze of about 1%.
  • the prepared plastic substrate had a transmittance of about 78% and a haze of about 65%.
  • the prepared plastic substrate had a transmittance of about 72% and a haze of about 84%.
  • the content ratio of the scattering component to 100% by weight of the polyimide will be about 2% by weight in the support layer finally prepared in the polyimide subjected to the imidization reaction without adding the scattering particles to the polyamic acid polymerization liquid.
  • Comparative Example 4 has a higher content of the scattering component compared to Example 3, but is prepared by adding the scattering component after the completion of the polymerization of the polyamic acid, which ensures stable dispersibility in the polyimide by agglomeration of the scattering component Not so, local high haze was expressed. As a result of the haze measurement, the comparative example 4 did not show the haze characteristic of the grade suitable for the light extraction performance, and was confirmed to show the haze about 50% or more locally.
  • the haze of the prepared plastic substrate was about 3%.
  • 7 (b) and 8 (b) show optical microscope surface images (dark field mode) and SEM surface images of the prepared plastic substrate, respectively.
  • a plastic substrate and an organic electronic device were manufactured by the same method as Comparative Example 4, except that the coating solution was coated on the glass substrate in a range in which the thickness of the supporting layer finally prepared was about 2 ⁇ m. It was.
  • the haze of the prepared plastic substrate was about 51%.
  • 7 (c) and 8 (c) show optical microscope surface images (dark field mode) and SEM surface images of the prepared plastic substrate, respectively.

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Abstract

La présente invention concerne un substrat en plastique, un procédé de production de ce dernier, un dispositif électronique organique, ainsi qu'une source de lumière d'affichage et un appareil d'éclairage. Le substrat en plastique selon la présente invention présente une excellente efficacité d'extraction de lumière et présente une excellente caractéristique de rugosité de surface. En outre, le procédé de production du substrat en plastique selon la présente invention permet de produire le substrat en plastique au moyen d'un procédé dans lequel sont ajoutés de façon secondaire des constituants de diffusion. De plus, le substrat en plastique selon la présente invention peut être utilisé en tant que substrat pour un dispositif électronique organique, et le dispositif électronique organique peut être utilisé comme source de lumière d'affichage et appareil d'éclairage.
PCT/KR2015/009064 2014-08-28 2015-08-28 Substrat en plastique WO2016032281A1 (fr)

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EP15835521.4A EP3147311B1 (fr) 2014-08-28 2015-08-28 Substrat en plastique
US15/318,928 US10109818B2 (en) 2014-08-28 2015-08-28 Plastic substrate
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KR20130025910A (ko) * 2010-06-03 2013-03-12 인텔 코포레이션 지연 동기 루프 및 위상 동기 루프를 위한 방법 및 장치
KR20130111482A (ko) * 2012-03-30 2013-10-10 주식회사 엘지화학 유기전자소자용 기판
KR20140018806A (ko) * 2012-07-31 2014-02-13 주식회사 엘지화학 유기전자소자용 기판
KR20140070491A (ko) * 2012-11-30 2014-06-10 주식회사 엘지화학 유기전자소자용 기판

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