WO2016029354A1 - 分立式压力感应器和电子设备 - Google Patents
分立式压力感应器和电子设备 Download PDFInfo
- Publication number
- WO2016029354A1 WO2016029354A1 PCT/CN2014/085168 CN2014085168W WO2016029354A1 WO 2016029354 A1 WO2016029354 A1 WO 2016029354A1 CN 2014085168 W CN2014085168 W CN 2014085168W WO 2016029354 A1 WO2016029354 A1 WO 2016029354A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pressure sensor
- force
- panel
- concentrating
- discrete pressure
- Prior art date
Links
- 230000001939 inductive effect Effects 0.000 claims description 17
- 239000000084 colloidal system Substances 0.000 claims description 6
- 230000005489 elastic deformation Effects 0.000 claims description 4
- 238000003825 pressing Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920006328 Styrofoam Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229920006335 epoxy glue Polymers 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000008261 styrofoam Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/9625—Touch switches using a force resistance transducer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/964—Piezoelectric touch switches
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
Definitions
- the present invention relates to the technical field of pressure sensors, and more particularly to a discrete pressure sensor and an electronic device including the same.
- pressure sensors have been gradually applied to various fields, which mainly increase the amount of information detection, and at the same time provide the possibility of control of the force.
- the operation of the pressure can effectively control the operation of the switch, the encryption of information, and the like.
- the pressure sensor in the prior art is generally a capacitive sensing type or a piezoelectric ceramic type.
- Existing pressure sensors are formed by complex circuit design and structural design to form the inductor itself.
- a capacitive sensor needs to obtain pressure information by strictly controlling the distance of each capacitance point from the panel and changing the distance.
- the pressure sensor requires extremely high machining accuracy and assembly precision to be realized; and the piezoelectric ceramic type sensor obtains the pressure by instantaneously impacting on the piezoelectric ceramic to obtain a short voltage change, and the production needs thereof.
- Uniform piezoelectric ceramic parts need to be mounted on the set structure by special mounting methods. In this way, the use cost and the scope of use of the pressure sensor are greatly increased, and the large-scale promotion of the pressure sensor is limited, and the use thereof has limitations.
- the object of the present invention is to provide a discrete pressure sensor, which aims to solve the problem that the pressure sensor of the prior art needs to be extremely high in processing precision and assembly precision, and requires special installation methods to be used, resulting in high use cost and It is difficult to promote the use of the problem.
- the discrete pressure sensor includes a pressure sensing sheet and a force-concentrating sensing plate attached to the pressure sensing sheet, wherein the force-concentrating sensing plate has a hollowed-out region, the hollow region There is a force concentration point for concentrated application on the force concentration sensing plate, and the force concentration point is disposed opposite to the pressure sensing piece.
- the present invention also provides an electronic device comprising the above-described discrete pressure sensor.
- the discrete pressure sensor provided by the present invention concentrates on the force concentration point after the pressure is applied to the hollow area of the force concentration plate member, and is concentratedly transmitted to the pressure sensing sheet, and converted into
- the control information is realized by the circuit of the external electronic device, etc., and the control of the electronic device is realized; the structure is simple, the assembly precision is not high; and in actual application, it can be directly attached to the inner side of the electronic device panel, and the user touches According to the position of the hollow area corresponding to the panel, the control of the electronic device can be realized by the discrete pressure sensor, and the installation requirement is low and the application range is wide.
- FIG. 1 is a front elevational view of a discrete pressure sensor according to an embodiment of the present invention
- FIG. 2 is a front elevational view of a discrete pressure sensor having a panel according to an embodiment of the present invention
- FIG. 3 is a perspective view of a discrete pressure sensor according to an embodiment of the present invention.
- FIG. 4 is a perspective view of a force concentration sensing plate provided by an embodiment of the present invention.
- FIG. 5 is a front elevational view of a force concentration sensing plate provided by an embodiment of the present invention.
- Figure 6 is an enlarged schematic view of a portion A in Figure 5;
- FIG. 7 is a front elevational view showing another force-concentrating induction plate member according to an embodiment of the present invention.
- Figure 8 is an enlarged schematic view of the portion B in Figure 7.
- the discrete pressure sensor 1 of the present embodiment includes a force-concentrating sensing plate member 12 and a pressure sensing sheet 14 , wherein the force-concentrating sensing plate member 12 is attached to the pressure sensing sheet 14 , and the two are arranged in a stacked manner.
- the force-concentrating sensing plate member 12 can be directly attached to the upper surface of the pressure sensing sheet 14, or the two can be adhered together by a colloid or the like, depending on actual needs.
- the force-concentrating plate member 12 is provided with a hollow region 122, and the hollow region 122 is located directly above the pressure sensing sheet 14; the hollow region 122 has a force concentration point 1221, and the force concentration point 1221 can be concentratedly applied to the force concentration sensing
- the force on the plate member 12 corresponding to the hollow region 122 is such that the force-concentrating sensing plate member 12 is attached to the upper surface of the pressure sensing sheet 14, so that the force concentrated at the force concentration point 1221 can be transmitted to the pressure sensing sheet. 14, so that the pressure sensing sheet 14 can sense the pressure applied to the corresponding hollow region 122, and correspondingly converts it into control information, transmits control information to an external control circuit through a line or the like, and then controls the electronic device through the control circuit. Corresponding operations, such as controlling switch actions, encrypting information, and so on.
- the above-mentioned separate pressure sensor 1 can be directly attached to the panel of the electronic device.
- the inner side of the 10, that is, the force-concentrating plate 12 is attached to the inner side of the panel 10.
- the hollowed-out area 122 on the force-inducing plate 12 corresponds to the position on the panel 10 where buttons or other marking patterns are arranged, so that the user
- pressure on the panel 10 or the like is directly applied, and the pressure applied to the panel 10 is transmitted to the hollowed-out region 122 of the force-concentrating plate member 12, and concentrated at the force concentration point of the hollow region 122.
- the pressure sensing sheet 14 converts the pressure into control information by the pressure at the inductive force concentration point 1221, thereby controlling the electronic device.
- the pressure sensor 1 provided above adopts the force-concentrating induction plate member 12 and the pressure sensing sheet 14 which are arranged in a stack, and can realize pressure sensing without high processing precision and high assembly precision, and has a simple structure when needed. When it is used, it can be directly attached to the inner side of the panel 10, and it can be used without special installation. Therefore, it is low in use cost and can be used in various electronic devices having the panel 10, and has wide applicability.
- the force concentrating inducing plate member 12 and the pressure sensing sheet 14 may be in the form of a flat plate, a curved plate, or a plate of any other shape, and may be specifically determined according to the actual shape.
- the force concentrates the hollow region 122 in the plate member 12, which includes the above-mentioned force concentration point 1221 and the extended vacancy 1222 formed by the force concentration point 1221 extending toward the periphery, so that the adjacent extension vacancy 1222 Between the entities, the epitaxial vacancies 1222 are collected at the force concentration point 1221, and the entities between the adjacent epitaxial vacancies 1222 form a cantilever structure, so that when pressure is applied to the force concentration sensing plate After the hollowed out area 122 of 12, the pressure is concentrated at the force concentration point 1221 of the hollowed out area 122.
- the force concentration sensing plate member 12 of the present embodiment has a force concentration point 1221 extending outwardly from the four extension vacancies 1222 , and the ends of the extension vacancies 1222 extend toward both sides to form an end.
- Strip vacancies 1223, and strip vacancies 1223 formed at the ends of the epitaxial vacancies 1222 are enclosed in a discontinuous square shape; of course, in this embodiment, the epitaxial vacancies 1222 may be multiple, that is, two or more. Yes, in this way, depending on the number of epitaxial vacancies 1222, the shape formed by the enclosing forms is also different.
- FIG. 7 and FIG. 8 another force-concentrating sensing plate member 12 is provided in the embodiment.
- the force concentrated vacancy in the force-concentrating sensing plate member 12 extends outwardly to the six epitaxial vacancies 1222.
- the six epitaxial vacancies are extended.
- the end of 1222 forms an arc vacancy 1224, and the six arc vacancies 1224 are enclosed to form a discontinuous circular shape; of course, in this embodiment, the epitaxial vacancies 1222 may be multiple, ie two or more, both It is possible that, in this way, depending on the number of epitaxial vacancies 1222, the shape formed by the enclosing forms is also different.
- the hollow region 122 may be in various other shapes. As long as the force concentration point 1221 extends toward the epitaxial recess 1222, the shape and path of the outer edge of the epitaxial space 1222 may be various. It is not limited to the shape in this embodiment.
- the force concentrates the hollowed-out area 122 in the plate member 12, which divides the position of the corresponding panel 10 in the force-concentrating plate member 12 into several parts, and each part is reserved with a short entity connected to the force-concentrating induction plate member 12.
- a fixed structure is disposed on the outer circumference of the force-concentrating sensing plate member 12 to facilitate When the force-concentrating inducing plate member 12 is disposed on the pressure sensing sheet 14, it can be fixed in position.
- the fixing structure includes a fixing side strip 121 disposed on the outer circumference of the force-concentrating inducing plate member 12, and is bent downwardly, and is bent with the force-concentrating sensing plate member 12, thereby
- the entire force-concentrating inducing plate member 12 has an inverted hat shape.
- the fixed structure on the force-concentrating inducing plate member 12 may be in various other forms, such as supporting ribs disposed around the periphery of the force-concentrating inducing plate member 12.
- the pressure sensing sheet includes a substrate and an inductive component disposed on the substrate.
- the strain sensing film 14 is used to implement a pressure sensing function, which specifically includes a film substrate and an inductive component disposed on the film substrate.
- the material of the substrate may be PET, PC, PI, or the like.
- the force-concentrating inducing plate member 12 When the force-concentrating inducing plate member 12 is disposed on the pressure sensing sheet 14, the inductive members on the substrate are aligned with the hollowed regions 122 in the force-concentrating inducing plate member 12.
- the inductive component is a pressure-sensitive coating or line printed on the pressure-sensitive layer.
- the pressure sensing sheet 14 may be a polymer coating having pressure sensing properties, or may be a sintered piezoelectric ceramic coating or the like, but is not limited thereto, and the pressure sensing sheet 14 may be a single independent A pressure-sensing sensor, or any measuring device capable of sensing pressure.
- the pressure sensing sheet 14 may employ other techniques, such as quantum tunneling composites, capacitive sensors, or other pressure sensitive resistor technologies.
- the discrete pressure sensor 1 further includes a detecting circuit 16, and the pressure sensing sheet 14 is connected to the detecting circuit 16 through a connecting line 15.
- the connecting line 15 is only described.
- the pressure sensing sheet 14 and the detecting circuit 16 are combined.
- the pressure sensing sheet 14 can be directly or indirectly connected to the detecting circuit 16 by other means.
- the detection circuit 16 can serve as a control center that accepts control information transmitted by the pressure sensing sheet 14, thereby controlling electronic devices and the like, which are generally described as a combination of hardware and software having various processing methods.
- the hardware, software is configured to communicate control information input by the pressure sensing sheet 14 through feedback or a system associated with the customer and perform additional related tasks or functions.
- the detection circuit 16 can be implemented as a general purpose processor, a content addressable memory, a digital signal processor, a digital to analog conversion switch, a programmable logic device, a discrete hardware component, or other combination; There are algorithms and software information related to the pressure touch screen/pressure sensing system.
- the hardware, software in the detection circuit 16 is configured to perform a variety of functions, techniques, feedback, and processing tasks associated with the client system.
- the force-concentrating plate member 12 and the pressure sensing sheet 14 are directly bonded through the first colloid 11 .
- the first colloid 11 may be a double-sided tape, a VHB acrylic styrofoam, an epoxy glue, or a polyurethane. Glue, silica gel or the like. The material selection and thickness of these rubber materials are determined according to the materials of the force-sensitive sensing plate member 12 and the pressure sensing sheet 14.
- the pressure sensor 1 in order to facilitate the use of the pressure sensor 1 in the present embodiment, it can be directly attached to the inner side of the electronic device panel 10, and the second surface of the force-concentrating plate member 12 is attached with the second colloid 13.
- the dicolloid 13 can also be a double-sided tape, a VHB acrylic styrofoam, an epoxy glue, a urethane glue, a silica gel or the like. In this way, the user directly attaches the pressure sensor 1 to the inner side of the panel 10 of the electronic device by using the second colloid 13 on the force-inducing plate member 12.
- the discrete pressure sensor 1 further includes a panel 10 which is attached to the upper surface of the force-concentrating sensing plate member 12.
- the panel 10 is a plate member having a certain elastic deformation property, and is available for the user. The operation and maintenance of the structural rigidity of the user itself; in the sense that the panel 10 has a certain elastic deformation property, the panel 10 is elastically deformable and can be restored to its original shape, and the original state here includes maintaining its own electronic and structural functions.
- the panel 10 may be bent and deformed along the central axis; or, the panel 10 may be deformed along a little collapse, or the panel 10 has sufficient elastic deformation to conform to the underlying force-concentrating sensing plate member 12 and the pressure sensing sheet 14, That is, the panel 10, the force-concentrating sensing plate member 12, and the pressure sensing sheet 14 are synchronously deformed, and no misalignment occurs.
- the panel 10 has a rigid structure that maintains itself because the panel 10 itself should not be deformed or collapsed without external force.
- the panel 10 may be stainless steel, metal, glass or plastic having a certain thickness; alternatively, the panel 10 may be a transparent material having a thickness sufficient to maintain the flatness of the panel 10. In short, the panel 10 may be made of any material as long as it has sufficient rigidity and is elastically deformed and restored in shape.
- the outer surface of the panel 10 has a marking pattern, so that after the force-concentrating sensing plate member 12 is attached to the surface, the upper hollow region 122 can be aligned with the marking pattern to identify the predetermined pressing position.
- the embodiment further provides an electronic device comprising the discrete pressure sensor 1 provided above, the discrete pressure sensor 1 being attached to the inner side of the electronic device panel, thereby touching the marking pattern on the surface of the panel,
- an electronic device comprising the discrete pressure sensor 1 provided above, the discrete pressure sensor 1 being attached to the inner side of the electronic device panel, thereby touching the marking pattern on the surface of the panel,
- the pressure can be concentratedly transmitted to the pressure sensing sheet 14 by the force-concentrating sensing plate member 12, whereby the pressure is converted into control information, thereby controlling the operation of the electronic device.
- the discrete pressure sensor 1 can be directly attached to the inner side of the panel, and does not require high-precision installation requirements, and has the advantages of simple structure, low cost, convenient installation and wide application range.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Measuring Fluid Pressure (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Measurement Of Force In General (AREA)
- Pressure Sensors (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
Description
Claims (12)
- 分立式压力感应器,其特征在于,包括压力感应片以及贴设于所述压力感应片上的力集中感应板件,所述力集中感应板件中具有镂空区域,所述镂空区域中具有用于集中施加在所述力集中感应板件上的力集中点位,所述力集中点位与所述压力感应片正对布置。
- 如权利要求1所述的分立式压力感应器,其特征在于,所述镂空区域包括所述力集中点位以及由所述力集中点位朝外延伸形成的外沿空位。
- 如权利要求2所述的分立式压力感应器,其特征在于,所述力集中点位朝外延伸多个所述外沿空位,所述外沿空位的末端朝两侧延伸,形成条形状空位。
- 如权利要求2所述的分立式压力感应器,其特征在于,所述力集中点位朝外延伸多个所述外沿空位,所述外沿空位的末端朝两侧延伸,形成弧条状空位。
- 如权利要求1至4任一项所述的分立式压力感应器,其特征在于,所述力集中感应板件的周边设有朝下弯折延伸的固定边条。
- 如权利要求1至4任一项所述的分立式压力感应器,其特征在于,所述力集中感应板件与所述压力感应片之间通过第一胶体粘合。
- 如权利要求1至4任一项所述的分立式压力感应器,其特征在于,所述分立式压力感应器还包括检测电路,所述检测电路电性连接于所述压力感应片。
- 如权利要求1至4任一项所述的分立式压力感应器,其特征在于,所述分立式压力感应器还包括面板,所述面板贴设于所述力集中感应板件上。
- 如权利要求8所述的分立式压力感应器,其特征在于,所述面板与所述力集中感应板件通过第二胶体粘合。
- 如权利要求8所述的分立式压力感应器,其特征在于,所述面板为具有弹性变形性能的板件。
- 如权利要求8所述的分立式压力感应器,其特征在于,所述面板上设有与所述力集中板件中的镂空区域对齐的标示图案。
- 电子设备,其特征在于,包括权利要求1~11任一项所述的分立式压力感应器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201480004304.3A CN105518586B (zh) | 2014-08-26 | 2014-08-26 | 分立式压力感应器和电子设备 |
EP14885854.1A EP3009923B1 (en) | 2014-08-26 | 2014-08-26 | Discrete pressure sensor and electronic device |
PCT/CN2014/085168 WO2016029354A1 (zh) | 2014-08-26 | 2014-08-26 | 分立式压力感应器和电子设备 |
JP2016544705A JP6129424B2 (ja) | 2014-08-26 | 2014-08-26 | 分離式圧力センサ及び電子装置 |
US14/779,820 US9645023B2 (en) | 2014-08-26 | 2014-08-26 | Discrete pressure sensor with cantilevered force centralizers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2014/085168 WO2016029354A1 (zh) | 2014-08-26 | 2014-08-26 | 分立式压力感应器和电子设备 |
Publications (1)
Publication Number | Publication Date |
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WO2016029354A1 true WO2016029354A1 (zh) | 2016-03-03 |
Family
ID=55398571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/CN2014/085168 WO2016029354A1 (zh) | 2014-08-26 | 2014-08-26 | 分立式压力感应器和电子设备 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9645023B2 (zh) |
EP (1) | EP3009923B1 (zh) |
JP (1) | JP6129424B2 (zh) |
CN (1) | CN105518586B (zh) |
WO (1) | WO2016029354A1 (zh) |
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WO2017172241A1 (en) * | 2016-03-31 | 2017-10-05 | Apple Inc. | Electronic device having direction-dependent strain elements |
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CN114208140A (zh) * | 2019-08-14 | 2022-03-18 | 三星电子株式会社 | 包括开口的电子装置 |
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US10670479B2 (en) | 2018-02-27 | 2020-06-02 | Methode Electronics, Inc. | Towing systems and methods using magnetic field sensing |
US11221262B2 (en) | 2018-02-27 | 2022-01-11 | Methode Electronics, Inc. | Towing systems and methods using magnetic field sensing |
US11014417B2 (en) | 2018-02-27 | 2021-05-25 | Methode Electronics, Inc. | Towing systems and methods using magnetic field sensing |
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US11135882B2 (en) | 2018-02-27 | 2021-10-05 | Methode Electronics, Inc. | Towing systems and methods using magnetic field sensing |
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Also Published As
Publication number | Publication date |
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US9645023B2 (en) | 2017-05-09 |
US20160238474A1 (en) | 2016-08-18 |
JP6129424B2 (ja) | 2017-05-17 |
EP3009923A1 (en) | 2016-04-20 |
CN105518586A (zh) | 2016-04-20 |
EP3009923A4 (en) | 2017-03-01 |
CN105518586B (zh) | 2018-08-03 |
EP3009923B1 (en) | 2023-05-31 |
JP2016534372A (ja) | 2016-11-04 |
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