WO2016029354A1 - 分立式压力感应器和电子设备 - Google Patents

分立式压力感应器和电子设备 Download PDF

Info

Publication number
WO2016029354A1
WO2016029354A1 PCT/CN2014/085168 CN2014085168W WO2016029354A1 WO 2016029354 A1 WO2016029354 A1 WO 2016029354A1 CN 2014085168 W CN2014085168 W CN 2014085168W WO 2016029354 A1 WO2016029354 A1 WO 2016029354A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure sensor
force
panel
concentrating
discrete pressure
Prior art date
Application number
PCT/CN2014/085168
Other languages
English (en)
French (fr)
Inventor
李灏
Original Assignee
深圳纽迪瑞科技开发有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=55398571&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2016029354(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 深圳纽迪瑞科技开发有限公司 filed Critical 深圳纽迪瑞科技开发有限公司
Priority to CN201480004304.3A priority Critical patent/CN105518586B/zh
Priority to EP14885854.1A priority patent/EP3009923B1/en
Priority to PCT/CN2014/085168 priority patent/WO2016029354A1/zh
Priority to JP2016544705A priority patent/JP6129424B2/ja
Priority to US14/779,820 priority patent/US9645023B2/en
Publication of WO2016029354A1 publication Critical patent/WO2016029354A1/zh

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96Touch switches
    • H03K17/9625Touch switches using a force resistance transducer
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96Touch switches
    • H03K17/964Piezoelectric touch switches
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper

Definitions

  • the present invention relates to the technical field of pressure sensors, and more particularly to a discrete pressure sensor and an electronic device including the same.
  • pressure sensors have been gradually applied to various fields, which mainly increase the amount of information detection, and at the same time provide the possibility of control of the force.
  • the operation of the pressure can effectively control the operation of the switch, the encryption of information, and the like.
  • the pressure sensor in the prior art is generally a capacitive sensing type or a piezoelectric ceramic type.
  • Existing pressure sensors are formed by complex circuit design and structural design to form the inductor itself.
  • a capacitive sensor needs to obtain pressure information by strictly controlling the distance of each capacitance point from the panel and changing the distance.
  • the pressure sensor requires extremely high machining accuracy and assembly precision to be realized; and the piezoelectric ceramic type sensor obtains the pressure by instantaneously impacting on the piezoelectric ceramic to obtain a short voltage change, and the production needs thereof.
  • Uniform piezoelectric ceramic parts need to be mounted on the set structure by special mounting methods. In this way, the use cost and the scope of use of the pressure sensor are greatly increased, and the large-scale promotion of the pressure sensor is limited, and the use thereof has limitations.
  • the object of the present invention is to provide a discrete pressure sensor, which aims to solve the problem that the pressure sensor of the prior art needs to be extremely high in processing precision and assembly precision, and requires special installation methods to be used, resulting in high use cost and It is difficult to promote the use of the problem.
  • the discrete pressure sensor includes a pressure sensing sheet and a force-concentrating sensing plate attached to the pressure sensing sheet, wherein the force-concentrating sensing plate has a hollowed-out region, the hollow region There is a force concentration point for concentrated application on the force concentration sensing plate, and the force concentration point is disposed opposite to the pressure sensing piece.
  • the present invention also provides an electronic device comprising the above-described discrete pressure sensor.
  • the discrete pressure sensor provided by the present invention concentrates on the force concentration point after the pressure is applied to the hollow area of the force concentration plate member, and is concentratedly transmitted to the pressure sensing sheet, and converted into
  • the control information is realized by the circuit of the external electronic device, etc., and the control of the electronic device is realized; the structure is simple, the assembly precision is not high; and in actual application, it can be directly attached to the inner side of the electronic device panel, and the user touches According to the position of the hollow area corresponding to the panel, the control of the electronic device can be realized by the discrete pressure sensor, and the installation requirement is low and the application range is wide.
  • FIG. 1 is a front elevational view of a discrete pressure sensor according to an embodiment of the present invention
  • FIG. 2 is a front elevational view of a discrete pressure sensor having a panel according to an embodiment of the present invention
  • FIG. 3 is a perspective view of a discrete pressure sensor according to an embodiment of the present invention.
  • FIG. 4 is a perspective view of a force concentration sensing plate provided by an embodiment of the present invention.
  • FIG. 5 is a front elevational view of a force concentration sensing plate provided by an embodiment of the present invention.
  • Figure 6 is an enlarged schematic view of a portion A in Figure 5;
  • FIG. 7 is a front elevational view showing another force-concentrating induction plate member according to an embodiment of the present invention.
  • Figure 8 is an enlarged schematic view of the portion B in Figure 7.
  • the discrete pressure sensor 1 of the present embodiment includes a force-concentrating sensing plate member 12 and a pressure sensing sheet 14 , wherein the force-concentrating sensing plate member 12 is attached to the pressure sensing sheet 14 , and the two are arranged in a stacked manner.
  • the force-concentrating sensing plate member 12 can be directly attached to the upper surface of the pressure sensing sheet 14, or the two can be adhered together by a colloid or the like, depending on actual needs.
  • the force-concentrating plate member 12 is provided with a hollow region 122, and the hollow region 122 is located directly above the pressure sensing sheet 14; the hollow region 122 has a force concentration point 1221, and the force concentration point 1221 can be concentratedly applied to the force concentration sensing
  • the force on the plate member 12 corresponding to the hollow region 122 is such that the force-concentrating sensing plate member 12 is attached to the upper surface of the pressure sensing sheet 14, so that the force concentrated at the force concentration point 1221 can be transmitted to the pressure sensing sheet. 14, so that the pressure sensing sheet 14 can sense the pressure applied to the corresponding hollow region 122, and correspondingly converts it into control information, transmits control information to an external control circuit through a line or the like, and then controls the electronic device through the control circuit. Corresponding operations, such as controlling switch actions, encrypting information, and so on.
  • the above-mentioned separate pressure sensor 1 can be directly attached to the panel of the electronic device.
  • the inner side of the 10, that is, the force-concentrating plate 12 is attached to the inner side of the panel 10.
  • the hollowed-out area 122 on the force-inducing plate 12 corresponds to the position on the panel 10 where buttons or other marking patterns are arranged, so that the user
  • pressure on the panel 10 or the like is directly applied, and the pressure applied to the panel 10 is transmitted to the hollowed-out region 122 of the force-concentrating plate member 12, and concentrated at the force concentration point of the hollow region 122.
  • the pressure sensing sheet 14 converts the pressure into control information by the pressure at the inductive force concentration point 1221, thereby controlling the electronic device.
  • the pressure sensor 1 provided above adopts the force-concentrating induction plate member 12 and the pressure sensing sheet 14 which are arranged in a stack, and can realize pressure sensing without high processing precision and high assembly precision, and has a simple structure when needed. When it is used, it can be directly attached to the inner side of the panel 10, and it can be used without special installation. Therefore, it is low in use cost and can be used in various electronic devices having the panel 10, and has wide applicability.
  • the force concentrating inducing plate member 12 and the pressure sensing sheet 14 may be in the form of a flat plate, a curved plate, or a plate of any other shape, and may be specifically determined according to the actual shape.
  • the force concentrates the hollow region 122 in the plate member 12, which includes the above-mentioned force concentration point 1221 and the extended vacancy 1222 formed by the force concentration point 1221 extending toward the periphery, so that the adjacent extension vacancy 1222 Between the entities, the epitaxial vacancies 1222 are collected at the force concentration point 1221, and the entities between the adjacent epitaxial vacancies 1222 form a cantilever structure, so that when pressure is applied to the force concentration sensing plate After the hollowed out area 122 of 12, the pressure is concentrated at the force concentration point 1221 of the hollowed out area 122.
  • the force concentration sensing plate member 12 of the present embodiment has a force concentration point 1221 extending outwardly from the four extension vacancies 1222 , and the ends of the extension vacancies 1222 extend toward both sides to form an end.
  • Strip vacancies 1223, and strip vacancies 1223 formed at the ends of the epitaxial vacancies 1222 are enclosed in a discontinuous square shape; of course, in this embodiment, the epitaxial vacancies 1222 may be multiple, that is, two or more. Yes, in this way, depending on the number of epitaxial vacancies 1222, the shape formed by the enclosing forms is also different.
  • FIG. 7 and FIG. 8 another force-concentrating sensing plate member 12 is provided in the embodiment.
  • the force concentrated vacancy in the force-concentrating sensing plate member 12 extends outwardly to the six epitaxial vacancies 1222.
  • the six epitaxial vacancies are extended.
  • the end of 1222 forms an arc vacancy 1224, and the six arc vacancies 1224 are enclosed to form a discontinuous circular shape; of course, in this embodiment, the epitaxial vacancies 1222 may be multiple, ie two or more, both It is possible that, in this way, depending on the number of epitaxial vacancies 1222, the shape formed by the enclosing forms is also different.
  • the hollow region 122 may be in various other shapes. As long as the force concentration point 1221 extends toward the epitaxial recess 1222, the shape and path of the outer edge of the epitaxial space 1222 may be various. It is not limited to the shape in this embodiment.
  • the force concentrates the hollowed-out area 122 in the plate member 12, which divides the position of the corresponding panel 10 in the force-concentrating plate member 12 into several parts, and each part is reserved with a short entity connected to the force-concentrating induction plate member 12.
  • a fixed structure is disposed on the outer circumference of the force-concentrating sensing plate member 12 to facilitate When the force-concentrating inducing plate member 12 is disposed on the pressure sensing sheet 14, it can be fixed in position.
  • the fixing structure includes a fixing side strip 121 disposed on the outer circumference of the force-concentrating inducing plate member 12, and is bent downwardly, and is bent with the force-concentrating sensing plate member 12, thereby
  • the entire force-concentrating inducing plate member 12 has an inverted hat shape.
  • the fixed structure on the force-concentrating inducing plate member 12 may be in various other forms, such as supporting ribs disposed around the periphery of the force-concentrating inducing plate member 12.
  • the pressure sensing sheet includes a substrate and an inductive component disposed on the substrate.
  • the strain sensing film 14 is used to implement a pressure sensing function, which specifically includes a film substrate and an inductive component disposed on the film substrate.
  • the material of the substrate may be PET, PC, PI, or the like.
  • the force-concentrating inducing plate member 12 When the force-concentrating inducing plate member 12 is disposed on the pressure sensing sheet 14, the inductive members on the substrate are aligned with the hollowed regions 122 in the force-concentrating inducing plate member 12.
  • the inductive component is a pressure-sensitive coating or line printed on the pressure-sensitive layer.
  • the pressure sensing sheet 14 may be a polymer coating having pressure sensing properties, or may be a sintered piezoelectric ceramic coating or the like, but is not limited thereto, and the pressure sensing sheet 14 may be a single independent A pressure-sensing sensor, or any measuring device capable of sensing pressure.
  • the pressure sensing sheet 14 may employ other techniques, such as quantum tunneling composites, capacitive sensors, or other pressure sensitive resistor technologies.
  • the discrete pressure sensor 1 further includes a detecting circuit 16, and the pressure sensing sheet 14 is connected to the detecting circuit 16 through a connecting line 15.
  • the connecting line 15 is only described.
  • the pressure sensing sheet 14 and the detecting circuit 16 are combined.
  • the pressure sensing sheet 14 can be directly or indirectly connected to the detecting circuit 16 by other means.
  • the detection circuit 16 can serve as a control center that accepts control information transmitted by the pressure sensing sheet 14, thereby controlling electronic devices and the like, which are generally described as a combination of hardware and software having various processing methods.
  • the hardware, software is configured to communicate control information input by the pressure sensing sheet 14 through feedback or a system associated with the customer and perform additional related tasks or functions.
  • the detection circuit 16 can be implemented as a general purpose processor, a content addressable memory, a digital signal processor, a digital to analog conversion switch, a programmable logic device, a discrete hardware component, or other combination; There are algorithms and software information related to the pressure touch screen/pressure sensing system.
  • the hardware, software in the detection circuit 16 is configured to perform a variety of functions, techniques, feedback, and processing tasks associated with the client system.
  • the force-concentrating plate member 12 and the pressure sensing sheet 14 are directly bonded through the first colloid 11 .
  • the first colloid 11 may be a double-sided tape, a VHB acrylic styrofoam, an epoxy glue, or a polyurethane. Glue, silica gel or the like. The material selection and thickness of these rubber materials are determined according to the materials of the force-sensitive sensing plate member 12 and the pressure sensing sheet 14.
  • the pressure sensor 1 in order to facilitate the use of the pressure sensor 1 in the present embodiment, it can be directly attached to the inner side of the electronic device panel 10, and the second surface of the force-concentrating plate member 12 is attached with the second colloid 13.
  • the dicolloid 13 can also be a double-sided tape, a VHB acrylic styrofoam, an epoxy glue, a urethane glue, a silica gel or the like. In this way, the user directly attaches the pressure sensor 1 to the inner side of the panel 10 of the electronic device by using the second colloid 13 on the force-inducing plate member 12.
  • the discrete pressure sensor 1 further includes a panel 10 which is attached to the upper surface of the force-concentrating sensing plate member 12.
  • the panel 10 is a plate member having a certain elastic deformation property, and is available for the user. The operation and maintenance of the structural rigidity of the user itself; in the sense that the panel 10 has a certain elastic deformation property, the panel 10 is elastically deformable and can be restored to its original shape, and the original state here includes maintaining its own electronic and structural functions.
  • the panel 10 may be bent and deformed along the central axis; or, the panel 10 may be deformed along a little collapse, or the panel 10 has sufficient elastic deformation to conform to the underlying force-concentrating sensing plate member 12 and the pressure sensing sheet 14, That is, the panel 10, the force-concentrating sensing plate member 12, and the pressure sensing sheet 14 are synchronously deformed, and no misalignment occurs.
  • the panel 10 has a rigid structure that maintains itself because the panel 10 itself should not be deformed or collapsed without external force.
  • the panel 10 may be stainless steel, metal, glass or plastic having a certain thickness; alternatively, the panel 10 may be a transparent material having a thickness sufficient to maintain the flatness of the panel 10. In short, the panel 10 may be made of any material as long as it has sufficient rigidity and is elastically deformed and restored in shape.
  • the outer surface of the panel 10 has a marking pattern, so that after the force-concentrating sensing plate member 12 is attached to the surface, the upper hollow region 122 can be aligned with the marking pattern to identify the predetermined pressing position.
  • the embodiment further provides an electronic device comprising the discrete pressure sensor 1 provided above, the discrete pressure sensor 1 being attached to the inner side of the electronic device panel, thereby touching the marking pattern on the surface of the panel,
  • an electronic device comprising the discrete pressure sensor 1 provided above, the discrete pressure sensor 1 being attached to the inner side of the electronic device panel, thereby touching the marking pattern on the surface of the panel,
  • the pressure can be concentratedly transmitted to the pressure sensing sheet 14 by the force-concentrating sensing plate member 12, whereby the pressure is converted into control information, thereby controlling the operation of the electronic device.
  • the discrete pressure sensor 1 can be directly attached to the inner side of the panel, and does not require high-precision installation requirements, and has the advantages of simple structure, low cost, convenient installation and wide application range.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Measuring Fluid Pressure (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Measurement Of Force In General (AREA)
  • Pressure Sensors (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

分立式压力感应器(1)和包括分立式压力感应器(1)的电子设备,分立式压力感应器(1)包括压力感应片(14)以及贴设于压力感应片(14)上的力集中感应板件(12),力集中感应板件(12)中具有镂空区域(122),镂空区域(122)中具有用于集中施加在力集中感应板件(12)上的力集中点位(1221),力集中点位(1221)与压力感应片(14)正对布置。当压力施加在力集中感应板件(12)的镂空区域(122)后,集中在力集中点位(1221),被集中传递至压力感应片(14)上,转换为控制信息,通过外界电子设备的电路等,对电子设备控制;其结构简单,组装精度要求不高;在实际运用中,直接将其贴设在电子设备面板的内侧,用户通过触按面板(10)对应镂空区域(122)的位置,从而可以通过该分立式压力感应器(1),实现对电子设备的控制。

Description

分立式压力感应器和电子设备 技术领域
本发明涉及压力感应器的技术领域,尤其涉及分立式压力感应器和包括该分立式压力感应器的电子设备。
背景技术
目前,压力感应器已开始逐渐应用到各个领域,其主要增加了信息的检测量,同时为力度的控制提供了可能。通过压力的操作,能够有效地控制开关的动作、信息的加密等。
现有技术中的压力感应器,一般为电容感应型或压电陶瓷型等。现有的压力感应器均是通过复杂的电路设计和结构设计来形成感应器本身的。比如电容感应器,其需要通过严格控制各个电容点距离面板的距离,通过该距离的改变来获得压力信息的。这样,使得压力感应器则需要极高的加工精度及组装精度才能实现;而压电陶瓷型感应器是通过瞬间冲击在压电陶瓷上,获得短暂的电压变化来获得压力大小的,其制作需要统一一致的压电陶瓷件,并需要通过特殊的安装方法安装在设定的结构上。这样,则大大增高了压力感应器的使用成本及使用范围,限制了压力感应器的大规模推广,其使用具有局限性。
技术问题
本发明的目的在于提供分立式压力感应器,旨在解决现有技术中的压力感应器存在需要极高加工精度及组装精度才能实现,以及需要特殊安装方法才能使用,导致使用成本较高以及难以推广使用的问题。
技术解决方案
本发明是这样实现的,分立式压力感应器,包括压力感应片以及贴设于所述压力感应片上的力集中感应板件,所述力集中感应板件中具有镂空区域,所述镂空区域中具有用于集中施加在所述力集中感应板件上的力集中点位,所述力集中点位与所述压力感应片正对布置。
本发明还提供了电子设备,包括上述的分立式压力感应器。
有益效果
与现有技术相比,本发明提供的分立式压力感应器,当压力施加在力集中感板件的镂空区域后,集中在力集中点位,从而被集中传递至压力感应片上,转换为控制信息,通过外界电子设备的电路等,实现对电子设备的控制;其结构简单,组装精度要求不高;且在实际运用中,可以直接将其贴设在电子设备面板的内侧,用户通过触按面板对应镂空区域的位置,从而,则可以通过该分立式压力感应器,实现对电子设备的控制,其安装要求低,适用范围广。
附图说明
图1是本发明实施例提供的分立式压力感应器的主视示意图;
图2是本发明实施例提供的具有面板的分立式压力感应器的主视示意图;
图3是本发明实施例提供的分立式压力感应器的立体示意图;
图4是本发明实施例提供的力集中感应板件的立体示意图;
图5是本发明实施例提供的力集中感应板件的主视示意图;
图6是图5中A处的放大示意图;
图7是本发明实施例提供的另一力集中感应板件的主视示意图;
图8是图7中B处的放大示意图。
本发明的实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
以下结合具体实施例对本发明的实现进行详细的描述。
如图1~8所示,为本发明提供的较佳实施例。
本实施例提供的分立式压力感应器1包括力集中感应板件12以及压力感应片14,其中,力集中感应板件12贴设于所述压力感应片14上,两者呈层叠方式布置。当然,此处,力集中感应板件12可以直接贴设在压力感应片14的上表面上,或者,两者之间也可以通过胶体等黏贴在一起,具体可视实际需要而定。
力集中感应板件12中设有镂空区域122,镂空区域122位于压力感应片14的正上方;该镂空区域122中具有力集中点位1221,该力集中点位1221可以集中施加在力集中感应板件12上对应镂空区域122的力,这样,由于力集中感应板件12贴设在压力感应片14的上表面,从而,集中在力集中点位1221处的力,可以传递至压力感应片14上,从而压力感应片14可以感应到施加在对应镂空区域122上的压力,并对应转换为控制信息,通过线路等将控制信息传递至外部的控制电路等,进而通过控制电路控制电子设备等的相应操作,如控制开关动作、信息加密等等。
在实际使用中,可以直接将上述的分离式压力感应器1贴设在电子设备的面板 10的内侧,也就是力集中感应板件12贴设在面板10的内侧,当然,力集中感应板件12上的镂空区域122对应着面板10上设置按键或者其它标示图案的位置,这样,用户需要对电子设备进行操作时,直接施加压力在面板10的按键等,进而施加的面板10上的压力,传递至力集中感应板件12的镂空区域122,并集中在镂空区域122的力集中点位1221,压力感应片14则通过感应力集中点位1221处的压力,将压力转换为控制信息,进而对电子设备进行控制。
上述提供的压力感应器1,其采用叠层布置的力集中感应板件12以及压力感应片14则可,不需要加工精度较高以及组装精度较高才能实现压力感应,其结构简单,当需要使用时,直接贴在面板10的内侧则可,不需要特殊安装才能使用,因此,其使用成本低,可以运用在各种具有面板10的电子设备中,适用性广。
另外,上述的力集中感应板件12以及压力感应片14,其可以是平板状,也可以曲面板状,或者其它各种形状的板状,具体可根据实际需要形状而定。
具体地,力集中感应板件12中的镂空区域122,其包括上述的力集中点位1221以及由该力集中点位1221朝四周延伸形成的外延空位1222,这样,在相邻的外延空位1222之间则为实体,外延空位1222汇集在力集中点位1221处,相邻外延空位1222之间的实体则形成悬臂结构,从而,当有压力作用在力集中感应板件 12的镂空区域122上后,压力则会被集中在镂空区域122的力集中点位1221处。
如图5及6所示,为本实施例提供的力集中感应板件12,其力集中点位1221朝外延伸出四条外延空位1222,并且,各外延空位1222的末端朝两侧延伸,形成条状空位1223,并且,外延空位1222的末端形成的条状空位1223围合呈不连续的方形状;当然,此实施例中,外延空位1222可以是多个,即两个或两个以上,都可以,这样,根据外延空位1222的数目,其围合形成的形状也不同。
如图7及8所示,为本实施例提供的另一种力集中感应板件12,该力集中感应板件12中的力集中空位朝外延伸出六条外延空位1222,该六个外延空位1222的末端形成弧条空位1224,并且,六个弧条空位1224围合形成不连续的圆形状;当然,此实施例中,外延空位1222可以是多个,即两个或两个以上,都可以,这样,根据外延空位1222的数目,其围合形成的形状也不同。
当然,作为其它实施例,镂空区域122还可以是其它各种形状,只要是力集中点位1221朝外延伸出外延空位1222则可,外延空位1222外沿的形状以及路径可以是多种多样,并不仅限制于本实施例中的形状。
力集中感应板件12中的镂空区域122,其将力集中感应板件12中对应面板10按键的位置分为数份,每部分均预留短小的实体与力集中感应板件12相连。
本实施例中,参照图4所示,为了提高力集中感应板件12自身的强度,以及便于力集中感应板件12的固定,在力集中感应板件12的外周设置有固定结构,以便于当力集中感应板件12设置在压力感应片14上后,其可以固定位置。
具体地,上述的固定结构包括固定边条121,该固定边条121设置在力集中感应板件12的外周,且朝下弯折布置,与力集中感应板件12呈弯折状,从而,整个力集中感应板件12呈倒扣帽子形状。
或者,作为其它实施例,力集中感应板件12上的固定结构还可以是其它多种形式结构,如布置在力集中感应板件12周边的支撑筋等等。
压力感应片包括衬底以及设置在衬底上的感应部件;在本实施例中,应变感应薄膜14用于实现压力感应功能,其具体包括薄膜衬底以及设置在薄膜衬底上的感应部件,衬底的材料可以是PET、PC、PI等。
当力集中感应板件12设置在压力感应片14上后,衬底上的感应部件与力集中感应板件12中的镂空区域122对齐布置。
具体地,感应部件为印刷在压力感应层上的具有压力感应作用的涂层或线路。
在实际运用中,压力感应片14可以为印刷具有压力感应性能的聚合物涂层,或者,可以是烧结的压电陶瓷涂层等等,但是不限于此,压力感应片14可以为单个独立的压力感应传感器,或是能够感应压力的任何一种测量装置。
或者,作为其它实施例,压力感应片14可采用其他技术,例如量子隧道复合物、电容性传感器或其他压力敏感电阻器技术。
本实施例中,参照图1~3所示,分立式压力感应器1还包括检测电路16,压力感应片14通过连接线15与该检测电路16连接,当然,该连接线15仅仅在于描述压力感应片14和检测电路16的结合方式,作为其它实施例,压力感应片14还可以通过其它方式直接或间接地与检测电路16电性连接。
检测电路16可以作为控制中心,其接受压力感应片14传递的控制信息,进而对电子设备等进行控制,其通常被描述为具有多种处理方法的硬件、软件的组合。所述的硬件、软件被配置成将压力感应片14输入的控制信息通过反馈或与客户相关联的系统进行通讯并执行附加的相关任务或功能。
本实施例中,检测电路16可实现为通用处理器、内容可寻址存储器、数字信号处理器、数模转换开关、可编程逻辑器件、分立的硬件组成或其他组合;同时其内部还内嵌有与压力触摸屏/压力感应系统相关的算法、软件信息。
检测电路16中的硬件、软件被配置成执行多种功能、技术、反馈以及与客户系统相关联的处理任务。
本实施例中,力集中感应板件12与压力感应片14直接通过第一胶体11粘合,当然,该第一胶体11可以是为双面胶、VHB亚克力发泡胶、环氧胶、聚氨酯胶、硅胶或其他类似物。这些胶材的材料选择及厚度根据力集中感应板件12及压力感应片14的材质决定。
另外,为了便于本实施例中的压力感应器1在使用时,可以直接贴设在电子设备面板10的内侧,力集中感应板件12的上表面贴设有第二胶体13,当然,该第二胶体13也可以为双面胶、VHB亚克力发泡胶、环氧胶、聚氨酯胶、硅胶或其他类似物。这样,用户直接将该压力感应器1,利用力集中感应板件12上第二胶体13,贴设在电子设备的面板10内侧则可。
本实施例中,分立式压力感应器1还包括面板10,该面板10贴设在力集中感应板件12的上表面,该面板10是具有一定的弹性形变性能的板件,可供用户操作及维持用户本身的结构刚性;面板10具有一定弹性形变性能这个意义上说,面板10为可以弹性的变形,并能恢复原状,此处的原状包括维持其本身的电子和结构功能。例如,面板10可以沿中心轴进行弯曲变形;或者,面板10亦可沿一点塌陷变形,或者,面板10具有足够的弹性形变以与下层的力集中感应板件12、压力感应片14顺应,也就是面板10、力集中感应板件12以及压力感应片14同步变形,不会出现错位现象。
面板10具有维持本身的刚性结构,其原因在于形成面板10本身不应在无外力作用下变形、塌陷。
具体地,面板10可以是具有一定厚度的不锈钢、金属、玻璃或塑料;或者,面板10可以是透明的材料,该材料的厚度足以维持该面板10的平整。总之,面板 10可以是任何材料制成,只要其具有足够的刚度,且具有弹性变形并恢复形状则可。
另外,面板10的外表面具有的标示图案,从而,力集中感应板件12贴合在面上后,其上镂空区域122可以与该标示图案对齐,标识预设的按压位置。
本实施例还提供了电子设备,其包括上述提供的分立式压力感应器1,该分立式压力感应器1贴合在电子设备面板的内侧,从而,通过触按面板表面的标示图案,如按键等,则可以通过力集中感应板件12将压力集中传递至压力感应片14上,从而,压力转换为控制信息,进而控制电子设备的操作。
利用该分立式压力感应器1,其直接贴设在面板内侧则可,不需要高精度的安装要求,其本身结构简单,具有成本低,安装方便且适用范围广的优点。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。

Claims (12)

  1. 分立式压力感应器,其特征在于,包括压力感应片以及贴设于所述压力感应片上的力集中感应板件,所述力集中感应板件中具有镂空区域,所述镂空区域中具有用于集中施加在所述力集中感应板件上的力集中点位,所述力集中点位与所述压力感应片正对布置。
  2. 如权利要求1所述的分立式压力感应器,其特征在于,所述镂空区域包括所述力集中点位以及由所述力集中点位朝外延伸形成的外沿空位。
  3. 如权利要求2所述的分立式压力感应器,其特征在于,所述力集中点位朝外延伸多个所述外沿空位,所述外沿空位的末端朝两侧延伸,形成条形状空位。
  4. 如权利要求2所述的分立式压力感应器,其特征在于,所述力集中点位朝外延伸多个所述外沿空位,所述外沿空位的末端朝两侧延伸,形成弧条状空位。
  5. 如权利要求1至4任一项所述的分立式压力感应器,其特征在于,所述力集中感应板件的周边设有朝下弯折延伸的固定边条。
  6. 如权利要求1至4任一项所述的分立式压力感应器,其特征在于,所述力集中感应板件与所述压力感应片之间通过第一胶体粘合。
  7. 如权利要求1至4任一项所述的分立式压力感应器,其特征在于,所述分立式压力感应器还包括检测电路,所述检测电路电性连接于所述压力感应片。
  8. 如权利要求1至4任一项所述的分立式压力感应器,其特征在于,所述分立式压力感应器还包括面板,所述面板贴设于所述力集中感应板件上。
  9. 如权利要求8所述的分立式压力感应器,其特征在于,所述面板与所述力集中感应板件通过第二胶体粘合。
  10. 如权利要求8所述的分立式压力感应器,其特征在于,所述面板为具有弹性变形性能的板件。
  11. 如权利要求8所述的分立式压力感应器,其特征在于,所述面板上设有与所述力集中板件中的镂空区域对齐的标示图案。
  12. 电子设备,其特征在于,包括权利要求1~11任一项所述的分立式压力感应器。
PCT/CN2014/085168 2014-08-26 2014-08-26 分立式压力感应器和电子设备 WO2016029354A1 (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201480004304.3A CN105518586B (zh) 2014-08-26 2014-08-26 分立式压力感应器和电子设备
EP14885854.1A EP3009923B1 (en) 2014-08-26 2014-08-26 Discrete pressure sensor and electronic device
PCT/CN2014/085168 WO2016029354A1 (zh) 2014-08-26 2014-08-26 分立式压力感应器和电子设备
JP2016544705A JP6129424B2 (ja) 2014-08-26 2014-08-26 分離式圧力センサ及び電子装置
US14/779,820 US9645023B2 (en) 2014-08-26 2014-08-26 Discrete pressure sensor with cantilevered force centralizers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/085168 WO2016029354A1 (zh) 2014-08-26 2014-08-26 分立式压力感应器和电子设备

Publications (1)

Publication Number Publication Date
WO2016029354A1 true WO2016029354A1 (zh) 2016-03-03

Family

ID=55398571

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/085168 WO2016029354A1 (zh) 2014-08-26 2014-08-26 分立式压力感应器和电子设备

Country Status (5)

Country Link
US (1) US9645023B2 (zh)
EP (1) EP3009923B1 (zh)
JP (1) JP6129424B2 (zh)
CN (1) CN105518586B (zh)
WO (1) WO2016029354A1 (zh)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017172241A1 (en) * 2016-03-31 2017-10-05 Apple Inc. Electronic device having direction-dependent strain elements
US9874965B2 (en) 2015-09-11 2018-01-23 Apple Inc. Transparent strain sensors in an electronic device
US9886118B2 (en) 2015-09-30 2018-02-06 Apple Inc. Transparent force sensitive structures in an electronic device
US9952703B2 (en) 2013-03-15 2018-04-24 Apple Inc. Force sensing of inputs through strain analysis
US9983715B2 (en) 2012-12-17 2018-05-29 Apple Inc. Force detection in touch devices using piezoelectric sensors
US10006820B2 (en) 2016-03-08 2018-06-26 Apple Inc. Magnetic interference avoidance in resistive sensors
US10055048B2 (en) 2015-07-31 2018-08-21 Apple Inc. Noise adaptive force touch
US10088937B2 (en) 2012-05-03 2018-10-02 Apple Inc. Touch input device including a moment compensated bending sensor for load measurement on platform supported by bending beams
US10120478B2 (en) 2013-10-28 2018-11-06 Apple Inc. Piezo based force sensing
US10133418B2 (en) 2016-09-07 2018-11-20 Apple Inc. Force sensing in an electronic device using a single layer of strain-sensitive structures
US10139294B2 (en) 2015-07-21 2018-11-27 Apple Inc. Strain sensors in an electronic device
US10309846B2 (en) 2017-07-24 2019-06-04 Apple Inc. Magnetic field cancellation for strain sensors
US10423265B2 (en) 2014-01-13 2019-09-24 Apple Inc. Temperature compensating force sensor
US10444091B2 (en) 2017-04-11 2019-10-15 Apple Inc. Row column architecture for strain sensing
US10782818B2 (en) 2018-08-29 2020-09-22 Apple Inc. Load cell array for detection of force input to an electronic device enclosure
CN114208140A (zh) * 2019-08-14 2022-03-18 三星电子株式会社 包括开口的电子装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3379222B1 (en) 2017-03-22 2020-12-30 Methode Electronics Malta Ltd. Magnetoelastic based sensor assembly
US10670479B2 (en) 2018-02-27 2020-06-02 Methode Electronics, Inc. Towing systems and methods using magnetic field sensing
US11221262B2 (en) 2018-02-27 2022-01-11 Methode Electronics, Inc. Towing systems and methods using magnetic field sensing
US11014417B2 (en) 2018-02-27 2021-05-25 Methode Electronics, Inc. Towing systems and methods using magnetic field sensing
US11491832B2 (en) 2018-02-27 2022-11-08 Methode Electronics, Inc. Towing systems and methods using magnetic field sensing
US11135882B2 (en) 2018-02-27 2021-10-05 Methode Electronics, Inc. Towing systems and methods using magnetic field sensing
US11084342B2 (en) 2018-02-27 2021-08-10 Methode Electronics, Inc. Towing systems and methods using magnetic field sensing

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2026178A1 (en) * 2007-08-10 2009-02-18 IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A. Touchpad with strip-shaped input
CN202887136U (zh) * 2012-10-24 2013-04-17 深圳纽迪瑞科技开发有限公司 一种新型金属面板触摸屏
CN202887103U (zh) * 2012-10-30 2013-04-17 深圳纽迪瑞科技开发有限公司 一种新型超薄键盘
US20140022177A1 (en) * 2012-06-13 2014-01-23 Microsoft Corporation Input Device Configuration having Capacitive and Pressure Sensors
CN103854903A (zh) * 2014-02-21 2014-06-11 博罗承创精密工业有限公司 按键用弹性触片
CN203721565U (zh) * 2014-02-21 2014-07-16 博罗承创精密工业有限公司 按键用弹性触片

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4166998A (en) * 1977-06-22 1979-09-04 Gould Inc., Statham Instrument Division Force transducer
DE3232817C1 (de) * 1982-09-03 1988-09-08 Endress U. Hauser Gmbh U. Co, 7867 Maulburg Biegefeder
US4994781A (en) * 1988-04-07 1991-02-19 Sahagen Armen N Pressure sensing transducer employing piezoresistive elements on sapphire
EP0489344A1 (fr) * 1990-12-03 1992-06-10 I.E.E. International Electronics & Engineering S.à.r.l. Procédé d'identification d'une touche activée d'un clavier à touches
JP3149544B2 (ja) * 1992-06-22 2001-03-26 株式会社デンソー 半導体圧力検出装置
US5402666A (en) * 1994-07-26 1995-04-04 Scanivalve Corporation Method and apparatus for precise measurement of differential pressures
US5600071A (en) * 1995-09-05 1997-02-04 Motorola, Inc. Vertically integrated sensor structure and method
JP4295883B2 (ja) * 1999-12-13 2009-07-15 株式会社ワコー 力検出装置
JP2004177343A (ja) * 2002-11-28 2004-06-24 Fujikura Ltd 圧力センサ
US7772960B2 (en) * 2007-11-27 2010-08-10 Interlink Electronics, Inc. Pre-loaded force sensing resistor and method
JP5286153B2 (ja) * 2009-04-28 2013-09-11 アズビル株式会社 圧力センサの製造方法
CN102375586B (zh) * 2010-08-19 2014-12-03 苏州敏芯微电子技术有限公司 识别指向与力度的操纵系统
JP2012122823A (ja) * 2010-12-08 2012-06-28 Seiko Epson Corp 検出装置、電子機器、及びロボット
US8693200B2 (en) * 2012-02-07 2014-04-08 International Business Machines Corporation Semiconductor device cooling module
EP3044470B1 (en) * 2013-09-11 2019-07-10 Xdot Engineering and Analysis, PLLC Wing foil bearings and methods of manufacturing same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2026178A1 (en) * 2007-08-10 2009-02-18 IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A. Touchpad with strip-shaped input
US20140022177A1 (en) * 2012-06-13 2014-01-23 Microsoft Corporation Input Device Configuration having Capacitive and Pressure Sensors
CN202887136U (zh) * 2012-10-24 2013-04-17 深圳纽迪瑞科技开发有限公司 一种新型金属面板触摸屏
CN202887103U (zh) * 2012-10-30 2013-04-17 深圳纽迪瑞科技开发有限公司 一种新型超薄键盘
CN103854903A (zh) * 2014-02-21 2014-06-11 博罗承创精密工业有限公司 按键用弹性触片
CN203721565U (zh) * 2014-02-21 2014-07-16 博罗承创精密工业有限公司 按键用弹性触片

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10088937B2 (en) 2012-05-03 2018-10-02 Apple Inc. Touch input device including a moment compensated bending sensor for load measurement on platform supported by bending beams
US9983715B2 (en) 2012-12-17 2018-05-29 Apple Inc. Force detection in touch devices using piezoelectric sensors
US10275068B2 (en) 2013-03-15 2019-04-30 Apple Inc. Force sensing of inputs through strain analysis
US9952703B2 (en) 2013-03-15 2018-04-24 Apple Inc. Force sensing of inputs through strain analysis
US10496212B2 (en) 2013-03-15 2019-12-03 Apple Inc. Force sensing of inputs through strain analysis
US10120478B2 (en) 2013-10-28 2018-11-06 Apple Inc. Piezo based force sensing
US10423265B2 (en) 2014-01-13 2019-09-24 Apple Inc. Temperature compensating force sensor
US10139294B2 (en) 2015-07-21 2018-11-27 Apple Inc. Strain sensors in an electronic device
US10055048B2 (en) 2015-07-31 2018-08-21 Apple Inc. Noise adaptive force touch
US9874965B2 (en) 2015-09-11 2018-01-23 Apple Inc. Transparent strain sensors in an electronic device
US9886118B2 (en) 2015-09-30 2018-02-06 Apple Inc. Transparent force sensitive structures in an electronic device
US10006820B2 (en) 2016-03-08 2018-06-26 Apple Inc. Magnetic interference avoidance in resistive sensors
US10209830B2 (en) 2016-03-31 2019-02-19 Apple Inc. Electronic device having direction-dependent strain elements
WO2017172241A1 (en) * 2016-03-31 2017-10-05 Apple Inc. Electronic device having direction-dependent strain elements
US10133418B2 (en) 2016-09-07 2018-11-20 Apple Inc. Force sensing in an electronic device using a single layer of strain-sensitive structures
US10444091B2 (en) 2017-04-11 2019-10-15 Apple Inc. Row column architecture for strain sensing
US10309846B2 (en) 2017-07-24 2019-06-04 Apple Inc. Magnetic field cancellation for strain sensors
US10782818B2 (en) 2018-08-29 2020-09-22 Apple Inc. Load cell array for detection of force input to an electronic device enclosure
US11340725B2 (en) 2018-08-29 2022-05-24 Apple Inc. Load cell array for detection of force input to an electronic device enclosure
CN114208140A (zh) * 2019-08-14 2022-03-18 三星电子株式会社 包括开口的电子装置

Also Published As

Publication number Publication date
US9645023B2 (en) 2017-05-09
US20160238474A1 (en) 2016-08-18
JP6129424B2 (ja) 2017-05-17
EP3009923A1 (en) 2016-04-20
CN105518586A (zh) 2016-04-20
EP3009923A4 (en) 2017-03-01
CN105518586B (zh) 2018-08-03
EP3009923B1 (en) 2023-05-31
JP2016534372A (ja) 2016-11-04

Similar Documents

Publication Publication Date Title
WO2016029354A1 (zh) 分立式压力感应器和电子设备
US10198116B2 (en) Pressure sensing device, pressure measuring apparatus, touch control board, and display apparatus
US8270148B2 (en) Suspension for a pressure sensitive touch display or panel
WO2015035546A9 (zh) 一种压力感应式触摸屏和触摸显示屏及电子设备
TWI537790B (zh) Electronic machine with touch display function and its control method
US20100127140A1 (en) Suspension for a pressure sensitive touch display or panel
WO2016023203A1 (zh) 一种压力检测结构及触控装置
CN103954382A (zh) 一种变介质式电容柔性三维力触觉传感器
CA2353697A1 (en) Touch sensitive membrane
US10473538B2 (en) Pressure sensing device having a rigid force conductor and a soft deformable object sensing arrangement
CN101436111A (zh) 力成像输入设备和系统
WO2009157614A1 (en) Touch inputting apparatus integral sensors and method for acquiring location and intensity of force
JP2015106243A (ja) 入力装置
CN108540119B (zh) 压力感应按键装置及压力感应按键测量电路
JP2012003554A (ja) 静電容量式近接センサ装置、及びそれを用いた入力装置
KR20130103254A (ko) 복수 개의 변형 및 떨림 측정 센서를 설치하여 터치 위치와 터치 감을 구분하는 터치 스크린 및 터치키
CN106406588B (zh) 触控显示装置
JP5537717B1 (ja) 電子機器
US20110214923A1 (en) Light weight and full planar electromagnetic digitizer
US20230341980A1 (en) Touch pad, force touch apparatus, and electronic device
CN206639200U (zh) 具有压感功能的显示装置以及电子设备
CN210091138U (zh) 压力检测触控装置及电子设备
CN106575171B (zh) 压力感应器、显示装置及电子设备
KR101924546B1 (ko) 압력 계측 장치
CN210091137U (zh) 压力检测触控装置及电子设备

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2016544705

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 14779820

Country of ref document: US

Ref document number: 2014885854

Country of ref document: EP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14885854

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE