WO2016028114A1 - Boîtier de del comprenant des blocs de support de partie supérieure/inférieure - Google Patents

Boîtier de del comprenant des blocs de support de partie supérieure/inférieure Download PDF

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Publication number
WO2016028114A1
WO2016028114A1 PCT/KR2015/008746 KR2015008746W WO2016028114A1 WO 2016028114 A1 WO2016028114 A1 WO 2016028114A1 KR 2015008746 W KR2015008746 W KR 2015008746W WO 2016028114 A1 WO2016028114 A1 WO 2016028114A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive pad
conductive
led package
support block
lower support
Prior art date
Application number
PCT/KR2015/008746
Other languages
English (en)
Korean (ko)
Inventor
최인영
Original Assignee
㈜팔콘시스템
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020140109185A external-priority patent/KR101512367B1/ko
Application filed by ㈜팔콘시스템 filed Critical ㈜팔콘시스템
Publication of WO2016028114A1 publication Critical patent/WO2016028114A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to an LED package including upper and lower support blocks, and more particularly, by providing support blocks at upper and lower ends of a sealing housing so as to be mounted or connected to a conductive plate for an LED package without a soldering process.
  • the present invention relates to an LED package including upper and lower support blocks, which do not require a working environment, do not require an expensive printed circuit board, and can be quickly and easily mounted or connected without generating harmful substances.
  • the lighting device includes a display device.
  • an LED package is composed of a sealed housing in which a light emitter is accommodated, and a contact terminal installed on one side of the sealed housing and exposed to the outside of the LED package.
  • the LED package is soldered onto a printed circuit board (PCB). Mechanically mounted and electrically connected.
  • PCB printed circuit board
  • the technologies for mounting a package on a PCB include insert mount technology (IMT) and surface mount technology (SMT). There is).
  • the PCB used for the insertion mounting has a through hole, and the lead of the electronic component package is inserted into the insertion hole and then mounted by soldering.
  • a solder surface is installed on a PCB used for surface mounting, and is mounted by soldering a pad of an electronic component package, that is, a contact terminal by soldering, where two LED packages are placed in one package.
  • a contact terminal by soldering where two LED packages are placed in one package.
  • three or more contact terminals or pads may be included.
  • 1 is a view showing a conventional LED package for insertion mounting.
  • the conventional LED package for inserting mounting includes a sealing housing H formed by molding a sealing material such as epoxy, a first contact terminal 1 installed at one side of the sealing housing H, and The second contact terminal 2 is formed.
  • the light emitting body L which is accommodated in the sealing housing H and emits light due to the voltage difference between both ends, is connected to the first contact terminal 1 through the bonding wire W.
  • a second contact terminal 2 is connected to the first contact terminal 1 through the bonding wire W.
  • the light emitter L that is, the LED
  • the sealing housing H formed by molding the sealing material.
  • the two contact terminals are made of a metal material having the same thermal expansion coefficient as the sealing material so as not to generate a gap. Should be used.
  • the width of the first contact terminal 1 and the second contact terminal 2 exposed to the outside of the sealing housing (H) is very small, less than 1mm, the insertion-mounted printed circuit board is manufactured to fit such a contact terminal, It is fixed by soldering while the externally exposed contact terminal is inserted into the insertion hole of the printed circuit board.
  • the soldering process is required to convert lead to a liquid state by heating more than 300 °C.
  • this process not only generates harmful substances such as lead, mercury, and cadmium, but also requires a high level of soldering process and requires considerable skill.
  • the production time increases there was a problem that the manufacturing cost increases.
  • the process of cutting it is additionally performed, thereby increasing production time. There was a problem.
  • the present invention has been made to solve the above problems, the object of the present invention is to provide a support block on the upper and lower side of the lower side of the sealing housing to be mounted or connected to the conductive plate for LED package without soldering process,
  • the present invention provides an LED package including upper and lower support blocks that do not require a high temperature working environment, do not require an expensive printed circuit board, and can be quickly and easily mounted or connected without generating harmful substances.
  • the LED package is mounted on the light emitting panel, and is formed on one side of the bottom of the sealing housing.
  • An upper support block serving as a connection and fixing means of the conductive pad and the conductive plate;
  • a lower support block formed at one side of the lower end of the pillar to serve as a connection and fixing means of the conductive pad and the conductive plate, wherein the upper support block and the lower support block pressurize the light emitting panel or the conductive plate; It is characterized in that the restraint.
  • a first conductive pad connected to one polarity of the light emitter is exposed to one side of the upper support block, and a second conductive pad connected to the other polarity of the light emitter is exposed to one side of the lower support block.
  • the upper support block is formed integrally with the lower end of the sealing housing so that the first conductive pad is exposed on one side of the bottom surface, and the lower support block is formed in a protrusion shape on one side of the lower end of the column to the second side.
  • the conductive pad may be exposed, wherein the first conductive pad is provided in a hollow shape, and the pillar may be inserted into the hollow.
  • the first conductive pads and the second conductive pads respectively connected to one polarity of the two light emitters are exposed to one side of the upper support block and exposed to the outside of one side of the pillar.
  • the third conductive pad connected to one polarity of the other one of the light emitters is exposed, and the fourth conductive pad connected to the other polarities of the three light emitters is exposed to one side of the lower support block to expose the upper support block and the lower support.
  • the block is connected to and fixed to the conductive plate, so that the first conductive pad, the second conductive pad, the third conductive pad and the fourth conductive pad are electrically connected to the conductive plate.
  • the LED package when the LED package is fitted to the mounting hole formed on one side of the conductive plate process of mounting the LED package on the conductive plate by preventing the LED package is separated from the mounting hole by the upper and lower support blocks Since the soldering process is not required, the LED package can be mounted quickly and easily, and the LED package can be firmly mounted on the conductive plate, and the material selection limited for the soldering process can be expanded. It has an effect.
  • FIG. 1 is a perspective view and a cross-sectional view of a conventional LED package for insertion mounting.
  • FIG. 2 is a perspective view and a cross-sectional view of the LED package including the upper and lower support blocks according to an embodiment of the present invention.
  • FIG 3 is a perspective view and a cross-sectional view of the LED package including the upper and lower support blocks according to another embodiment of the present invention.
  • FIG. 4 is a perspective view and a cross-sectional view of a three-color light source LED package including upper and lower support blocks according to another embodiment of the present invention.
  • FIG. 5 is an exploded perspective view of the LED lighting apparatus using the LED package according to the embodiment shown in FIG.
  • FIG. 2 is a perspective view and a cross-sectional view of the LED package 10 including the upper and lower support blocks according to an embodiment of the present invention.
  • the LED package 10 includes an upper support block 20 and a lower support block 30.
  • the LED package 10 includes a sealed housing (H) in which the LED is accommodated therein, and a conductive frame installed on one side and the other side of the sealed housing (H), and protects the light emitting body (L) and will be described later.
  • the light is emitted from the light emitting body L according to the power and the signal transmitted from the conductive plate.
  • the sealing housing (H) is formed to surround the light emitting body (L) with a sealing material such as epoxy serves to protect the light emitting body (L) from an external impact.
  • the conductive frame extends downward from one side of the lower side, and is exposed to the outside from one side of the pillar 40 formed under the sealing housing H so that the conductive frame can be contacted and supported by the conductive plate, which are conductive pads 11 and 12. To be.
  • the conductive frame exposing the first conductive pad 11 is installed inside the sealing housing H, and the upper end is electrically bonded to the light emitting body L and the external conductive plate. It serves to transfer the power or electrical signal applied from the light emitter (L).
  • the conductive frame exposing the second conductive pad 12 is installed inside the sealing housing H, and the light emitting body L is installed in electrical contact with the upper end of the conductive frame 12, and a power source or electrical power applied from an external conductive plate is also provided. It serves to transmit a signal to the light emitter (L).
  • the upper support block 20 is formed on one side of the bottom surface of the sealing housing (H) to be a connection and fixing means of the conductive pads (11, 12) and the conductive plate
  • the lower support block (30) Silver is formed on one side of the lower end of the pillar 40 is provided to be a connection and fixing means of the conductive pads (11, 12) and the conductive plate.
  • a first conductive pad 11 connected to one polarity of the light emitter L is exposed to one side of the upper support block 20, and is connected to the other polarity of the light emitter L to the outside of the lower support block 30.
  • the second conductive pad 12 may be exposed.
  • the upper support block 20 is integrally formed with the lower end of the sealing housing H, and the first conductive pad 11 is exposed on one side of the bottom surface, and the lower support block 30 is It is formed in a protrusion shape on one side of the lower end of the column 40 to facilitate insertion into a specific groove, it can be seen that the second conductive pad 12 is exposed on one side.
  • the conductive pads 11 and 12 may be naturally fixed while being electrically connected to the conductive plate.
  • the upper support block 20 is formed directly on the bottom surface of the sealing housing H, the light emitting body L is disposed on the light emitting panel P of the lighting device or the display device including the conductive plate at the time of mounting or connection.
  • the lower support block 30 is mounted or connected to the LED package 10 while mounting all the parts located at the lower portion than the sealing housing.
  • it is to be suitable for the role of supporting the insert so as to be fixed to the inner bottom side of the light emitting panel (P).
  • FIG 3 is a perspective view and a cross-sectional view of the LED package 10 including the upper and lower support blocks according to another embodiment of the present invention.
  • the first conductive pad 11 may be formed in a hollow shape such as a ring body on one side of the upper support block 20.
  • the pillar 40 is inserted and disposed in the hollow, and the pillar 40 is also preferably formed in a cylindrical shape so as to correspond to the ring shape of the first conductive pad 11.
  • the lower support block 30 is formed at the lower end of the pillar 40 as in the previous embodiment, and the second conductive pad 12 is exposed and positioned at one side of the lower support block 30. 40, the lower support block 30, and the second conductive pad 12 are all characterized in that it is possible to be integrally provided.
  • the LED package 10 when manufacturing the LED package 10, after preparing and assembling the first conductive pad 11 and the second conductive pad 12 and mounting the light emitting body (L) on the top of the bonding wire (W) Since the manufacturing of the LED package 10 is completed by providing a sealing housing with a sealing material in the state of connecting, there is an advantage that the LED package 10 can be manufactured very easily.
  • such a structure can be applied not only to a columnar LED package but also to a general substrate type LED package, and in practice, the first conductive pad 11 during operation of a lighting device or a display device to which the present LED package 10 is applied.
  • the second conductive pad 12 and the conductive plate are in strong contact with each other to facilitate heat dissipation, and to increase the contact area between each of the conductive pads 11 and 12 and the conductive plate to facilitate the contact state. There is a feature that can be maintained.
  • FIG. 4 is a perspective view and a cross-sectional view of a three-color light source LED package 10 including upper and lower support blocks according to another embodiment of the present invention
  • FIG. 5 is a view showing an LED package 10 according to the embodiment shown in FIG. 4.
  • the LED package 10 according to another embodiment of the present invention is a structure applicable to the LED package 10 that can implement a three-color light source in a single package.
  • the LED package 10 has a structure in which three light emitters L are provided therein so as to be applied to the light emitting panel P of the display apparatus.
  • (-) of each light emitter L is provided.
  • the conductive pad connected to the polarity is provided to be exposed to one side of the upper support block 20, and the conductive pad connected to the positive polarity extends into the pillar 40 to the lower support block 30 to the lower side of the lower support block 30. It may be provided so as to expose.
  • the first conductive pad 11 and the second conductive pad 12 connected to one polarity of the two light emitters L, respectively, are easily supported so as to be easily connected to the conductive plate.
  • the third conductive pad 13 connected to one polarity of the other light emitter L may be provided to be exposed to the outside on one side of the block 20 so as to be exposed to the outside on one side of the pillar 40. .
  • the pillars 40 as pockets 50 to enable such a structure, and the fourth conductive pads 14 are formed to be connected to the other polarities of the three light emitting bodies L at once, and the lower support block ( 30) It is preferable to be provided to be exposed to the outside on one side.
  • FIG. 5 an exemplary view for coupling the LED package 10 according to the exemplary embodiment of the present invention shown in FIG. 4 to the light emitting panel P for configuring the actual display device is shown.
  • the LED package 10 is inserted into the LED package insertion hole 10a formed in the light emitting panel P.
  • the first conductive pad 11 is the first conductive pad connecting portion 11a formed on the first conductive plate 100
  • the second conductive pad 12 is the second conductive pad formed on the second conductive plate 200.
  • the contact portion 12a is in contact with each other.
  • the first conductive pad connecting portion 11a and the second conductive pad connecting portion 12a have fixing grooves formed on one side of the conductive plate, so that the upper surface of the conductive plate is in close contact with the bottom surface of the upper support block 20 of the LED package 10.
  • the first conductive pads 11 and the second conductive pads 12 are fitted into the fixing grooves, thereby binding.
  • the first conductive plate 100 and the second conductive plate 200 are inserted into the first conductive plate mounting groove 100a and the second conductive plate mounting groove 200a formed on one side of the upper portion of the light emitting panel P.
  • the third conductive plate 300 exposed to the side surface portion of one side of the pillar 40 provided in the form of a pocket 50 and the third conductive plate 300 in contact with the third conductive pad connecting portion 13a includes a light emitting panel ( Insertion is made perpendicular to the third conductive plate mounting groove 300a formed in P).
  • the third conductive pad connection part 13a is provided to form a protrusion by forming a protrusion toward the third conductive pad 13 to press and elastically support the third conductive pad 13 through the protrusion to bond.
  • the fourth conductive pad 14 exposed to the lower support block 30 is in contact with the fourth conductive plate 400 formed at one lower side of the light emitting panel P.
  • the fourth conductive plate 400 is inserted into the fourth conductive plate mounting groove 400a formed at the lower end of the light emitting panel P, and thus the lower support block insertion hole 30a and the lower support block fixing hole 30b are formed at one side. ).
  • the three conductive pads exposed between the upper support block 20 and the lower support block 30 are connected to each of the corresponding conductive plates, and then inserted into the LED package insertion hole 10a of the light emitting panel P, At the lower end of the light emitting panel P, the lower support block 30 is inserted into the lower support block insertion hole 30a of the fourth conductive plate 400.
  • a fourth conductive pad connecting portion 14 is formed at one side of the lower support block fixing hole 30b so that the lower support block 30 can be operated while being bound to the lower support block fixing hole 30b.
  • the pad 14 and the fourth conductive plate 400 may be in contact with each other.
  • each conductive plate 100, 200, 300, or 400 through each conductive pad are transferred to the light emitter L inside the LED package 10.
  • the LED package 10 can be mounted on the light emitting panel (P) structure including the conductive plate without a separate soldering process, and the binding can be securely prevented from leaving.
  • P light emitting panel
  • each LED package 10 be connected in parallel, but also can be connected in series by using each conductive plate in contact with the neighboring LED package 10 as one plate.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention porte sur un boîtier de DEL comprenant des blocs de support de partie supérieure/inférieure et, plus particulièrement, sur un boîtier de DEL comprenant des blocs de support de partie supérieure/inférieure, le boîtier de DEL comprenant des blocs de support sur les parties supérieure et inférieure du côté fond d'un boîtier d'étanchéité de telle sorte qu'un montage ou une connexion sur une plaque conductrice de boîtier de DEL est possible sans processus de soudage. Par conséquent, des environnements de travail à haute température ne sont pas requis, aucune PCB onéreuse n'est nécessaire, et une tâche de montage ou de connexion peut être effectuée rapidement et facilement sans générer de substances nocives.
PCT/KR2015/008746 2014-08-21 2015-08-21 Boîtier de del comprenant des blocs de support de partie supérieure/inférieure WO2016028114A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140109185A KR101512367B1 (ko) 2013-11-21 2014-08-21 상하부 지지블럭을 포함하는 led 패키지
KR10-2014-0109185 2014-08-21

Publications (1)

Publication Number Publication Date
WO2016028114A1 true WO2016028114A1 (fr) 2016-02-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/008746 WO2016028114A1 (fr) 2014-08-21 2015-08-21 Boîtier de del comprenant des blocs de support de partie supérieure/inférieure

Country Status (1)

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WO (1) WO2016028114A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0182048B1 (ko) * 1995-10-12 1999-04-15 김광호 밀착형 이미지 센서 및 그 제조방법
KR20090021201A (ko) * 2009-01-08 2009-02-27 주식회사 필룩스 엘이디 패키지
JP4543813B2 (ja) * 2004-08-04 2010-09-15 ソニー株式会社 バックライト装置及びこのバックライト装置を備えた液晶表示装置
KR101034465B1 (ko) * 2011-03-10 2011-05-17 주식회사 혜성엘앤엠 Ｌｅｄ 조명기구
US8338851B2 (en) * 2010-03-17 2012-12-25 GEM Weltronics TWN Corporation Multi-layer LED array engine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0182048B1 (ko) * 1995-10-12 1999-04-15 김광호 밀착형 이미지 센서 및 그 제조방법
JP4543813B2 (ja) * 2004-08-04 2010-09-15 ソニー株式会社 バックライト装置及びこのバックライト装置を備えた液晶表示装置
KR20090021201A (ko) * 2009-01-08 2009-02-27 주식회사 필룩스 엘이디 패키지
US8338851B2 (en) * 2010-03-17 2012-12-25 GEM Weltronics TWN Corporation Multi-layer LED array engine
KR101034465B1 (ko) * 2011-03-10 2011-05-17 주식회사 혜성엘앤엠 Ｌｅｄ 조명기구

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