WO2016011608A1 - 一种led光源及led灯 - Google Patents

一种led光源及led灯 Download PDF

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Publication number
WO2016011608A1
WO2016011608A1 PCT/CN2014/082780 CN2014082780W WO2016011608A1 WO 2016011608 A1 WO2016011608 A1 WO 2016011608A1 CN 2014082780 W CN2014082780 W CN 2014082780W WO 2016011608 A1 WO2016011608 A1 WO 2016011608A1
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WO
WIPO (PCT)
Prior art keywords
led light
light source
led
type semiconductor
emitting
Prior art date
Application number
PCT/CN2014/082780
Other languages
English (en)
French (fr)
Inventor
杜鹏
Original Assignee
深圳市国源铭光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市国源铭光电科技有限公司 filed Critical 深圳市国源铭光电科技有限公司
Priority to PCT/CN2014/082780 priority Critical patent/WO2016011608A1/zh
Priority to CN201490001376.8U priority patent/CN206388729U/zh
Publication of WO2016011608A1 publication Critical patent/WO2016011608A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present invention relates to the field of LED technologies, and in particular, to an LED light source and an LED lamp.
  • the LED package generally adopts the following processes: an epitaxial layer is formed on the substrate by chemical deposition, an electrode is arranged on the epitaxial layer, an LED chip is obtained, and the LED chip is fixed on the substrate by flip-chip or formal mounting, and is mounted on the substrate.
  • a cup-shaped bracket is fixed on the upper surface, and the electrode of the LED chip is connected with the related circuit by a gold wire, and the glass-shaped bracket is injected into the cup-shaped bracket, and a hemispherical encapsulation layer is formed on the surface of the lED chip by the cup-shaped bracket.
  • the existing process requires a substrate, and needs to be flip-chip or mounted on the substrate. It needs a gold wire and requires a bracket.
  • the LED light source includes a substrate, an epitaxial layer, an electrode, a substrate, a cup holder, a gold wire, and a package.
  • the prior art process is cumbersome, high in cost, and low in efficiency, and the LED light source made is complicated in structure and high in cost.
  • the invention provides an LED light source and an LED lamp, which solves the problems of complicated structure and high cost of the existing LED light source.
  • the present invention adopts the following technical solutions:
  • An LED light source comprising a substrate, an epitaxial structure fabricated on the substrate, a first connecting unit and a second connecting unit; the epitaxial structure comprising a single light emitting epitaxial layer structure or at least two electrically connected light emitting epitaxes a layer structure having at least one end N-type semiconductor layer and at least one end P-type semiconductor layer; the first connection unit comprising an N-type semiconductor disposed on the epitaxial structure and each of the end portions a first connection end electrically connected to the layer, and a second connection end extending outside the epitaxial structure and for connecting the first connection end to an external circuit, the second connection unit comprising the epitaxial structure disposed a third connection end electrically connected to each of the end P-type semiconductor layers, and a fourth connection extending outside the epitaxial structure and for connecting the third connection end to the external circuit end.
  • the luminescent epitaxial layer structure comprises at least an N-type semiconductor layer, a light-emitting layer and a P-type semiconductor layer from a near to far distance from the substrate; or at least: N from the near to the far side of the substrate a semiconductor layer, a light emitting layer, a P-type semiconductor layer, and a metal reflective layer; or at least: an N-type semiconductor layer from the near to far side of the substrate, a light-emitting layer, and a P-type semiconductor layer having a reflective function.
  • the first connection end is disposed on the epitaxial structure through a metal paste and electrically connected to each of the end N-type semiconductor layers; and/or the third connection end is disposed on the epitaxial structure through a metal paste and Each of the end P-type semiconductor layers is electrically connected.
  • the second connection end and/or the fourth connection end extend beyond the epitaxial structure to form a floating end; or extend beyond the epitaxial structure and with the portion of the epitaxial structure on the substrate
  • the outer region is bonded; or extends beyond the epitaxial structure and is fixed by the intermediate structure to a region on the substrate that is outside the portion occupied by the epitaxial structure.
  • the shape of the second connecting end and/or the fourth connecting end is one or more of a Z shape, a T shape, an L shape, a ten shape, a square shape, an elliptical shape, a circular shape, and an irregular shape.
  • the substrate is one of sapphire, silicon, glass, silicon carbide materials.
  • the first connecting unit and/or the second connecting unit are a one-piece sheet structure.
  • the inscribed circle diameter of the connection region of the second connection end and/or the fourth connection end and the external connection circuit is 200 micrometers to 1500 micrometers.
  • An LED light source comprising: a light emitting unit and an encapsulation layer, wherein the light emitting unit is the LED light source according to any one of the above items,
  • the encapsulation layer is obtained by sealing a part or an entire area of the light-emitting unit except the connection area of the second connection end, the fourth connection end and the external circuit on the light-emitting unit.
  • the encapsulation area includes at least a main light exit area of the light emitting unit.
  • the encapsulation layer is used to encapsulate an area of the main light-emitting surface of the light-emitting unit except the connection area of the second connection end, the fourth connection end and the external circuit; or for encapsulating the a main light-emitting surface of the light-emitting unit, an opposite surface of the main light-emitting surface except the connection area of the second connection end, the fourth connection end, and the external circuit; or a main light-emitting device for encapsulating the light-emitting unit
  • An LED lamp comprising at least one LED light source, and at least two metal connectors for powering each of the LED light sources; the LED light source being the LED light source of any of the above.
  • the LED lamp comprises at least two of the LED light sources; the at least two LED light sources are arranged side by side, or arranged in a shape of a letter, a fold, and the main light exiting surface of each LED light source faces outward.
  • the LED lamp comprises at least three of the LED light sources; the at least three LED light sources are arranged in a polygonal shape, and a main light-emitting surface of each LED light source faces outward; or the at least three LED light sources are arranged in a star shape. And the main light-emitting surface of each LED light source faces outward.
  • the main light-emitting surface of at least one of the LED light sources is at an angle of 20 to 60 degrees from the horizontal plane.
  • the main light-emitting surface of at least one of the LED light sources is at an angle of 45 degrees to the horizontal.
  • the LED lamp further comprises a housing for housing each of the LED light source and the at least two metal connectors.
  • the LED lamp further includes a power supply module and/or a bracket; the power supply module is connected to the at least two metal connectors for supplying power to each of the LED light sources through the at least two metal connectors;
  • the bracket is configured to support at least one of the LED light source, the metal connector, and the power supply module;
  • the housing is further configured to receive the power supply module and/or the bracket.
  • the housing is also filled with a shielding gas.
  • the LED lamp further comprises a main control module electrically connected to the at least two metal connectors for controlling the power supply of the metal connectors to the respective LED light sources.
  • the LED lamp comprises at least two of the LED light sources, and the at least two LED light sources generate different colors of light after being energized.
  • the LED light sources that generate different color lights after being energized are connected in parallel with each other, and the LED light sources that generate the same color light are connected in series after being energized.
  • the LED lamp further includes a communication module electrically connected to the main control module, configured to receive a control instruction of the external control terminal and transmit the control instruction to the main control module, where the main control module is configured to be used according to the control instruction Controls the power supply of the metal connectors to the individual LED sources.
  • a communication module electrically connected to the main control module, configured to receive a control instruction of the external control terminal and transmit the control instruction to the main control module, where the main control module is configured to be used according to the control instruction Controls the power supply of the metal connectors to the individual LED sources.
  • the invention provides an LED light source and an LED lamp.
  • the first connecting unit and the second connecting unit extend out of the second connecting end and the fourth connecting end outside the epitaxial structure for connecting with external related circuits, so that no gold wire is needed.
  • the first connection end and the third connection end are disposed on the epitaxial structure and are electrically connected to the end N-type semiconductor layer and the end P-type semiconductor layer, respectively, so that it is not necessary to additionally fabricate an electrode for the light-emitting epitaxial layer structure.
  • the encapsulation layer is obtained by directly sealing on the light-emitting unit without using the substrate and the bracket. Therefore, the LED light source provided by the invention does not include the substrate, the bracket and the gold wire, and even the light-emitting epitaxy compared with the existing LED light source.
  • the electrodes on the layer structure can be omitted, simplifying the structure of the LED light source and reducing the cost.
  • FIG. 1 is a schematic structural diagram of an LED light source according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic structural diagram of another LED light source according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic structural diagram of another LED light source according to Embodiment 1 of the present invention.
  • FIG. 4 is a schematic structural diagram of another LED light source according to Embodiment 1 of the present invention.
  • FIG. 5 is a schematic structural diagram of another LED light source according to Embodiment 1 of the present invention.
  • FIG. 6 is a schematic structural diagram of another LED light source according to Embodiment 1 of the present invention.
  • FIG. 7 is a schematic structural diagram of another LED light source according to Embodiment 2 of the present invention.
  • FIG. 8 is a schematic structural diagram of another LED light source according to Embodiment 2 of the present invention.
  • FIG. 9 is a schematic structural diagram of another LED light source according to Embodiment 2 of the present invention.
  • FIG. 10 is a schematic structural diagram of an LED lamp according to Embodiment 3 of the present invention.
  • Figure 11 is a schematic view showing the connection relationship between the LED light source and the metal connecting member in the LED lamp shown in Figure 10;
  • FIG. 12 is a schematic structural diagram of another LED lamp according to Embodiment 3 of the present invention.
  • FIG. 13 is a schematic structural diagram of another LED lamp according to Embodiment 3 of the present invention.
  • FIG. 14 is a schematic structural diagram of another LED lamp according to Embodiment 3 of the present invention.
  • FIG. 15 is a schematic structural diagram of another LED lamp according to Embodiment 3 of the present invention.
  • FIG. 16 is a schematic structural diagram of another LED lamp according to Embodiment 3 of the present invention.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • the LED light source provided in the first embodiment includes a substrate, an epitaxial structure fabricated on the substrate, a first connecting unit, and a second connecting unit.
  • the LED light source is composed of a substrate, an epitaxial structure fabricated on the substrate, a first connecting unit and a second connecting unit.
  • the epitaxial structure comprises a single luminescent epitaxial layer structure A1 or at least two electrically connected luminescent epitaxial layer structures (A1 to An), the at least two electrically connected luminescent epitaxial layer structures (A1 to An) being connected in series, in parallel or Electrically connected in series and in a hybrid manner;
  • the epitaxial structure has at least one end N-type semiconductor layer and at least one end P-type semiconductor layer;
  • the first connection unit includes a first connection end and a second connection end, the first connection end Provided on the epitaxial structure and electrically connected to each end N-type semiconductor layer, the second connection end extends beyond the epitaxial structure and is used for connecting the first connection end to the external circuit, and the second connection unit includes the third connection end And a fourth connection end, the third connection end is disposed on the epitaxial structure and electrically connected to each end P-type semiconductor layer, the fourth connection end extends beyond the epitaxial structure and is used for connecting the third connection end to the external circuit .
  • luminescent epitaxial layer structures There are four types of luminescent epitaxial layer structures:
  • the first type includes at least: an N-type semiconductor layer, a light-emitting layer, a P-type semiconductor layer, and a metal reflective layer, and the N-type semiconductor layer, the light-emitting layer, the P-type semiconductor layer, and the metal reflective layer are close to the substrate Laminated on the substrate in order to the far side; the metal reflective layer has a light reflecting function.
  • the second type includes at least: an N-type semiconductor layer, a light-emitting layer, and a P-type semiconductor layer having a reflective function, and the N-type semiconductor layer, the light-emitting layer, and the P-type semiconductor layer having a reflective function are close to the substrate
  • the substrate is laminated on the substrate in order of distance; the P-type semiconductor layer having a reflective function has a light reflecting function.
  • the substrate is a transparent substrate, and the light emitted by the light-emitting layer is reflected by the metal reflective layer or the P-type semiconductor layer having a reflective function, and the substrate has an epitaxial layer.
  • the opposite side of the side of the structure (assuming that the side having the epitaxial structure is the front side of the substrate, the opposite side of which is the back side of the substrate) is the main light exiting surface of the LED light source.
  • a third type comprising at least an N-type semiconductor layer, a light-emitting layer, and a P-type semiconductor layer, and having no light-emitting function, the N-type semiconductor layer, the light-emitting layer, and the P-type semiconductor layer being sequentially from near to far from the substrate Laminated on the substrate.
  • the fourth type is a vertical structure of the light emitting epitaxial layer structure, wherein the substrate is a metal substrate, and at least includes: a P-type semiconductor layer, a light-emitting layer, and an N-type semiconductor layer, and the P-type semiconductor layer, the light-emitting layer, and the N-type semiconductor layer are stacked on the metal substrate in this order from the near side to the far side.
  • the fourth type is opaque due to the substrate, and the third type is not transparent because the substrate is transparent, and the side having the epitaxial structure on the substrate It is the main light-emitting surface of the LED light source.
  • each of the light emitting epitaxial layers has the same structure, and may be the first, second, and third light emitting epitaxial layer structures.
  • the epitaxial structure comprises a single luminescent epitaxial layer structure
  • the epitaxial structure has an end N-type semiconductor layer and an end P-type semiconductor layer
  • the end N-type semiconductor layer is an N-type semiconductor layer of the single luminescent epitaxial layer structure
  • the end P-type semiconductor layer is a P-type semiconductor layer of the single light-emitting epitaxial layer structure.
  • the epitaxial structure includes at least two electrically connected luminescent epitaxial layer structures
  • the epitaxial structure has an end N-type semiconductor layer and an end P-type a semiconductor layer
  • an N-type semiconductor of a light-emitting epitaxial layer structure at one end of the series circuit is used as an end N-type semiconductor layer of the epitaxial structure
  • a P-type semiconductor layer of a light-emitting epitaxial layer structure at the other end is an end P-type semiconductor of the epitaxial structure.
  • the N-type semiconductor layer of each of the light-emitting epitaxial layer structures serves as an end N-type semiconductor layer of the epitaxial structure
  • the P-type semiconductor layer is an end P-type semiconductor layer of the epitaxial structure, that is, the epitaxial structure has an end N-type semiconductor layer and an end P-type semiconductor layer of the same number as the light-emitting epitaxial layer structure.
  • An N-type semiconductor having a light-emitting epitaxial layer structure at one end of the entire circuit formed by all the light-emitting epitaxial layer structures is used as an end N-type semiconductor layer of the epitaxial structure, and a P-type semiconductor layer having a light-emitting epitaxial layer structure at the other end is the epitaxial structure. End P-type semiconductor layer.
  • the first connection end and the third connection end are disposed on the same side of the substrate, and the first connection end and the third connection end are formed.
  • the electrode fabricated on the epitaxial layer of the existing LED chip including but not limited to: the first connection end is formed by metal paste on the epitaxial structure and electrically connected to each end N-type semiconductor layer, or the first connection The terminal is directly deposited on the epitaxial structure and electrically connected to each end of the N-type semiconductor layer; after the third connection end is fabricated, the metal paste is disposed on the epitaxial structure and electrically connected to each end P-type semiconductor layer, or The three terminals are directly deposited on the epitaxial structure and electrically connected to the respective P-type semiconductor layers.
  • Metal pastes include, but are not limited to, creamy gold, silver, copper, aluminum, tin, or paste metal alloys.
  • the metal substrate is simultaneously used as the second connecting unit, and no second connecting unit is provided, wherein the fourth luminescent epitaxial layer structure is P-type.
  • a portion of the metal substrate occupied by the semiconductor layer is a third connection end, and a portion of the metal substrate extending beyond the structure of the light-emitting epitaxial layer of the vertical structure serves as a fourth connection end.
  • the epitaxial structure includes a single luminescent epitaxial layer structure A1, and is a third luminescent epitaxial layer structure having an end N-type semiconductor layer and an end P-type semiconductor layer, the single illuminating
  • the N-type semiconductor layer of the epitaxial layer structure A1 is an end N-type semiconductor layer of the epitaxial structure
  • the P-type semiconductor layer is an end P-type semiconductor layer of the epitaxial structure
  • the first connection end 2121 is disposed on the luminescent epitaxial layer structure A1.
  • the third connection end 2131 is disposed on the luminescent epitaxial layer structure A1 and electrically connected to the P-type semiconductor layer,
  • the second connection end 2122 and the fourth connection end 2132 extend beyond the illuminating epitaxial layer structure A1 and are used to connect the first connection end 2121 and the third connection end 2131 to an external circuit.
  • the epitaxial structure includes at least two light emitting epitaxial layer structures (A1 to An) electrically connected in series, and each of the light emitting epitaxial layer structures (A1 to An) is the third type, adjacent light emitting epitaxial layer.
  • the structures are connected in series by an electrical connection structure B fabricated on the substrate. Since all of the light-emitting epitaxial layer structures (A1 to An) are connected in series, the epitaxial structure has only one end N-type semiconductor layer and one end P-type semiconductor layer, and the N-type semiconductor of the light-emitting epitaxial layer structure A1 at one end of the series circuit is used.
  • the end N-type semiconductor layer of the epitaxial structure, the P-type semiconductor layer of the other end of the light-emitting epitaxial layer structure An is an end P-type semiconductor layer of the epitaxial structure, and the first connection end 2121 is disposed on the light-emitting epitaxial layer structure A1.
  • the third connection end 2131 is electrically connected to the P-type semiconductor layer of the luminescent epitaxial layer structure An, and is electrically connected to the N-type semiconductor layer of the luminescent epitaxial layer structure A1.
  • the second connecting end 2122 and the fourth connecting end 2132 respectively extend beyond the light emitting epitaxial layer structures A1 and An and are used for connecting the first connecting end 2121 and the third connecting end 2131 to an external circuit.
  • each of the light-emitting epitaxial layer structures (A1 to An) in the epitaxial structure is electrically connected in parallel, and each of the light-emitting epitaxial layer structures (A1 to An) is the third one described above.
  • the epitaxial structure has n end N-type semiconductor layers and n end P-type semiconductor layers, and each of the N-type semiconductors of the light-emitting epitaxial layer structure (A1 to An) serves as an end N-type semiconductor layer of the epitaxial structure.
  • the P-type semiconductor layer is an end P-type semiconductor layer of the epitaxial structure, the first connection end includes n first connection portions, and the third connection end includes n third connection portions, wherein each of the light-emitting epitaxial layer structures emits light
  • Each of the epitaxial layer structures (A1 to An) is provided with a first connecting portion and a third connecting portion.
  • the first connecting portion is disposed on the light emitting epitaxial layer structure and electrically connected to the N-type semiconductor layer of the light emitting epitaxial layer structure.
  • a third connecting portion is disposed on the luminescent epitaxial layer structure and electrically connected to the P-type semiconductor layer of the luminescent epitaxial layer structure, and the second connecting end extends beyond the epitaxial structure and is used for all the n first connecting portions
  • the external circuit that is, one end of the second connection end is electrically connected to the n first connection parts, and the other end is connected to the external circuit; the fourth connection end extends beyond the epitaxial structure and is respectively used for the n third
  • the connecting portion is connected to the external circuit, that is, one end of the fourth connecting end is electrically connected to the n third connecting portions, and the other end is connected to the external circuit.
  • the second connection end and/or the fourth connection end may extend beyond the epitaxial structure to form a floating end; or extend beyond the epitaxial structure and conform to a region outside the portion occupied by the epitaxial structure on the substrate; or extend the epitaxial Outside the structure and through the intermediate structure, it is fixed on a region outside the portion occupied by the epitaxial structure on the substrate.
  • the second connecting end 2122 and the fourth connecting end 2132 extend beyond the epitaxial structure to form a floating end, and are horizontally suspended; as shown in FIG. 3, the second connecting end 2122 and the fourth connection The end 2132 is suspended downward; as shown in FIG. 4, the second connecting end 2122 and the fourth connecting end 2132 are suspended upward; as shown in FIG.
  • the second connecting end 2122 and the fourth connecting end 2132 extend beyond the extension structure and Adhering to a region other than the portion occupied by the epitaxial structure on the substrate; as shown in FIG. 6, the second connection end 2122 and the fourth connection end 2132 extend beyond the epitaxial structure and are fixed to the substrate through the intermediate structure 214.
  • the intermediate structure 214 may be a floating point, or may be an epitaxial layer which is extra when an epitaxial structure is formed on the substrate.
  • the second connection end and the fourth connection end are electrically connected to the external circuit by means of electric welding; or are electrically connected to the external circuit through the connection terminal.
  • one end of the connection terminal is electrically connected to the external circuit, and the other end has a connection port.
  • the connection port can be matched with the shape of the second connection end, and the second connection end is received therein and electrically connected to the external circuit, or
  • the connecting port houses the second connecting end and a part of the substrate under the second connecting end together and electrically connects the second connecting end to the external circuit.
  • the shape of the second connecting end and/or the fourth connecting end is one or more of a Z shape, a T shape, an L shape, a ten shape, a square shape, an elliptical shape, a circular shape, and an irregular shape.
  • the first connecting unit and/or the second connecting unit are a one-piece sheet structure.
  • the first connecting unit and the second connecting unit of the integrated sheet structure may be fabricated first, and then one end is disposed on the epitaxial structure through the metal paste, and is respectively electrically connected to each end N-type semiconductor layer and the end P-type semiconductor layer. Sexually connect and reserve the other end to extend beyond the epitaxial structure for external circuitry.
  • the inscribed circle diameter of the connection region of the second connection end and the external circuit is 200 micrometers to 1500 micrometers.
  • the inscribed circle diameter of the connection region of the fourth connection terminal and the external circuit is 200 micrometers to 1500 micrometers. This size is different from the size of the electrodes of existing LED chips, and the connection area of this size can be directly and firmly connected to an external circuit.
  • the substrate is one of sapphire, silicon, glass, silicon carbide materials.
  • the sapphire substrate is a transparent substrate.
  • the LED light source provided in Embodiment 1 includes a substrate, an epitaxial structure fabricated on the substrate, a first connecting unit and a second connecting unit, and the first connecting unit and the second connecting unit extend beyond the epitaxial structure
  • the second connection end and the fourth connection end are used for connecting with an external related circuit, so that no gold wire is required;
  • the first connection end and the third connection end are disposed on the epitaxial structure and respectively have N-type semiconductor layers and end portions P at their ends
  • the type semiconductor layers are electrically connected, so that it is not even necessary to additionally fabricate electrodes for the light-emitting epitaxial layer structure. It is also possible to seal directly on the LED light source to change the color of the light of the LED light source without the need for a substrate and a support.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • the LED light source provided in the second embodiment includes the light emitting unit and the encapsulating layer, wherein the light emitting unit is the LED light source of any one of the above embodiments. Therefore, the LED light source provided in the second embodiment is different from the first embodiment.
  • the LED light source shown in the first embodiment is used as the light emitting unit, and further includes a part of the light emitting unit except the connection area of the second connection end, the fourth connection end and the external circuit on the light emitting unit. Or an encapsulation layer obtained by encapsulating the entire area.
  • the encapsulation area of the encapsulation layer includes at least a main light-emitting surface of the light-emitting unit.
  • the LED light source provided in the second embodiment does not have a substrate, a bracket, or a gold wire.
  • it consists of a light-emitting unit and an encapsulation layer formed on the light-emitting unit.
  • the encapsulation layer is curved.
  • the light exiting region of the light emitting unit refers to a region on the light emitting unit that actually emits light, and preferably includes an outer surface of the light emitting epitaxial layer structure, and if it is a transparent substrate, a mapping region in which the light emitting epitaxial layer structure is mapped on the other side of the substrate.
  • the main light exit area refers to the area with the highest light extraction efficiency, and the surface where the main light emitting area is located is the main light exit surface of the light emitting unit.
  • the opposite side of the substrate having the epitaxial structure (assuming the side having the epitaxial structure)
  • the front surface of the substrate is the front surface of the substrate, which is the main light-emitting surface of the light-emitting unit; for the light-emitting unit having the epitaxial structure composed of the third and fourth light-emitting epitaxial layer structures, the light emitted by the light-emitting layer is not
  • the side that is reflected and has an epitaxial structure on the substrate is the main light-emitting surface of the light-emitting unit.
  • the encapsulation layer is used to encapsulate an area of the main light-emitting surface of the light-emitting unit except the connection area of the second connection end, the fourth connection end and the external circuit; or to package the light-emitting unit a main light-emitting surface, an opposite surface of the main light-emitting surface except the connection area of the second connection end, the fourth connection end, and the external circuit; or a main light-emitting surface for encapsulating the light-emitting unit, An opposite surface of the main light-emitting surface and a region on a part or all of the side between the main light-emitting surface and the opposite surface except the connection region of the second connection end, the fourth connection end, and the external circuit.
  • the LED light sources shown in FIGS. 7 and 8 are obtained by the following manufacturing method: the connection area of the second connection end 2122, the fourth connection end 2132 and the external circuit on the main light-emitting surface of the light-emitting unit In the outer region, the continuous aligning is performed along the alignment trajectory of the luminescent epitaxial layer structure (A1 to An), and after curing, a continuous encapsulation layer 220 is formed.
  • the substrate in FIG. 7 is a transparent substrate, and each of the light-emitting epitaxial layer structures (A1 to An) connected in series includes a metal mirror layer or a P-type semiconductor layer having a reflective function, and thus has a substrate thereon.
  • the opposite side of the side of the epitaxial structure (assuming that the side having the epitaxial structure is the front side of the substrate, the opposite side of which is the back side of the substrate) is the main light-emitting surface of the light-emitting unit.
  • the substrate in FIG. 8 is a non-transparent substrate (or each of the light-emitting epitaxial layer structures (A1 to An) has no light-emitting function, for example, no metal mirror layer, and the P-type semiconductor layer does not have a reflective function), on the substrate.
  • the side having the epitaxial structure is the main light-emitting surface of the light-emitting unit. Therefore, the LED light source shown in FIG.
  • the LED light source shown in FIG. 8 is a mobile continuous injection on the side having an epitaxial structure on the substrate, and the cured encapsulation layer 220 is formed on the side having the epitaxial structure except the second connection end 2122.
  • the fourth connection end 2132 is packaged integrally with an area other than the connection area of the external circuit.
  • the main light-emitting surfaces of the respective light-emitting epitaxial layer structures (A1 to An) may be separately packaged and packaged into a plurality of independent package layers.
  • the LED light source shown in FIG. 9 is obtained by the following method: first placing one of the main light-emitting surfaces of the light-emitting unit or its opposite surface face up; on the upward side, except for the second connection In a region other than the connection region of the end 2122 and the fourth connection terminal 2132 and the external circuit, the continuous aligning is performed along the alignment trajectory of the luminescent epitaxial layer structure (A1 to An), and a solid is formed on the surface after curing.
  • the body encapsulation layer; the light-emitting unit is flipped 180 degrees, that is, the other side of the main light-emitting surface of the light-emitting unit or the opposite surface thereof faces upward, and the light-emitting unit is combined with the un-gel-filled area of the light-emitting unit to emit light
  • the unit is fixed to suspend the sealed area; and the second connection end 2122, the fourth connection end 2132 and the external circuit are further disposed on the upward side (the other of the main light emitting surface of the light emitting unit or the opposite side thereof)
  • the continuous priming along the aligning trajectory of the luminescent epitaxial layer structure (A1 to An) due to the fluidity of the colloid, the formed body formed on the main illuminating surface and the opposite surface thereof after curing Encapsulation layer is connected to one Final piece encapsulation layer 220 forming four faces of a light emitting element package, the light emitting unit except it a second connection terminal 2122, a fourth connection 2132 to connection
  • the LED light source provided in the second embodiment is different from the first embodiment, and includes the LED light source provided in the first embodiment and the encapsulation layer directly encapsulated thereon.
  • the gold wire is not required, the substrate and the bracket are not required, and even
  • the luminescent epitaxial layer structure creates additional electrodes, which simplifies the structure of the LED light source and reduces the cost.
  • Embodiment 3 is a diagrammatic representation of Embodiment 3
  • the present invention also provides an LED lamp comprising at least one LED light source, and at least two metal connectors for powering each of the LED light sources, the LED light source being any one of the above embodiments light source. If the LED lamp includes two or more of the LED light sources, the LED light sources may be connected in series, in parallel, or in series and parallel to form at least one circuit, and the at least two metal connectors may be used for each circuit. Connect to the power supply module to supply power.
  • the power supply module can be an integral part of the LED light or an external module independent of the LED light.
  • the metal connector is made of a hard material for supplying power to each of the LED light sources, and is also for supporting each of the LED light sources, thereby maintaining each of the LED light sources in a fixed position.
  • at least two of the metal connectors are made of a material having a high thermal conductivity through which heat of the LED light source connected thereto can be dissipated to the lamp cap. Materials with high thermal conductivity such as copper.
  • the main light-emitting surface of at least one of the LED light sources is at an angle of 20 to 60 degrees with respect to the horizontal plane, and more preferably at an angle of 45 degrees.
  • the light emitted by the main light exiting surface can be emitted at a preset angle, so that the target area corresponding to the entire angle is illuminated.
  • the LED lamp comprises at least two of the LED light sources, preferably, the at least two LED light sources are arranged side by side, or arranged in a shape of a letter, a fold, and the main light exiting surface of each LED light source faces outward.
  • the colors of the at least two LED light sources after energization may be the same or different.
  • the LED lamp comprises at least three of the LED light sources, preferably, the at least three LED light sources are polygonal, and the main light exiting faces of the LED light sources face outward; or the at least three LED light sources are arranged in a star shape And the main light-emitting surface of each LED light source faces outward.
  • the main light-emitting surface facing outward can cause the light emitted from the main light-emitting surface to be emitted outward, thereby improving the illumination brightness.
  • the LED lamp further comprises a power supply module connected to the at least two metal connectors for supplying power to each of the LED light sources through the at least two metal connectors.
  • the power supply module includes a power converter to convert external alternating current into direct current.
  • the LED lamp further includes a bracket for supporting at least one of the LED light source, the metal connector, and the power supply module.
  • the position of the supported portion is fixed.
  • the bracket is made of soft glass that is transparent with respect to visible light, thereby suppressing loss of light from the LED light source by the bracket, and also preventing the LED light source from forming a shadow due to the bracket.
  • the LED lamp further comprises a housing for housing each of the LED light source and the at least two metal connectors.
  • the utility model is further configured to receive the power supply module and/or the bracket.
  • the housing is also filled with a shielding gas.
  • the housing comprises a lamp cap and a hollow and light-transmissive lampshade, the lamp cover is closed at one end and the other end has an opening, and each of the LED light sources is disposed in a hollow state by a metal connector made of at least two rigid materials.
  • the lamp cap includes a threaded portion on the side and an eyelet portion at the bottom of the lamp cap; if the LED lamp further includes a power supply module, the power supply module is received in the lamp cap, and the at least two metal connectors are from the opening of the lamp cover The portion extending into the lamp cap is connected to the power supply module, and the power supply module is further connected to the threaded portion and the eyelet portion of the lamp cap, and is connected to the external DC power source through the threaded portion and the eyelet portion of the lamp cap, and is converted and passed through the at least two metals.
  • the connecting member supplies power to each of the LED light sources; if the LED light has no power supply module, the at least two metal connecting members directly intersect with the threaded portion and the hole of the lamp cap Portion connected by a threaded portion, an eyelet access to external power supply module.
  • the LED lamp further includes a bracket, the bracket can extend from the opening portion of the lamp cover into the lamp cover, and the bracket, the opening portion of the lamp cover and the lamp cap are installed in such a manner that the opening portion of the lamp cover is blocked, and each of the LED light sources passes through the hollow state.
  • the bracket is disposed at a substantially central position within the hollow shade, in which case the metal connector need not support other components.
  • the LED lamp further includes a main control module electrically connected to the at least two metal connectors for controlling the power supply of the metal connector to each LED light source, including controlling power, power off, and brightness of each LED light source. Wait.
  • the LED lamp can emit monochromatic light, can be mixed, and its color, brightness, saturation, etc. can be controlled.
  • the LED lamp comprises at least two LED light sources, and the at least two LED light sources generate different colors of light after being energized, and the power supply of each LED light source is controlled by the main control module, so that the color of the LED light can be switched.
  • the LED light sources that generate different color lights after being energized are connected in parallel with each other, and the LED light sources that generate the same color light are connected in series after being energized.
  • the LED lamp further includes a communication module electrically connected to the main control module, configured to receive a control instruction of the external control terminal and transmit the control instruction to the main control module, where the main control module is configured to control the metal connection according to the control instruction
  • the power supply to each LED light source Including controlling the power, power off, brightness, etc. of each LED light source.
  • the external control terminal is a mobile phone, a remote controller, or the like.
  • the communication module is a WIFI module, a Bluetooth module, a ZigBee communication module, and the like.
  • the lamp housing 311 includes a base 311 and a lamp cover 312.
  • the lamp cover 312 is hollow and transparent. One end is closed, and the other end has an opening. The opening of the lamp cover 312 is mounted in a blocked manner.
  • the lamp cover 312 is filled with a protective gas.
  • the lamp cap 311 is filled with a protective gas.
  • the threaded portion 3111 on the side and the eyelet portion 3112 at the bottom of the base 311 are included.
  • the first LED light source 34 and the second LED light source 35 are supported by the bracket 36 at a substantially central position in the lamp cover 312 and arranged in a line shape.
  • the substrates of the first LED light source 34 and the second LED light source 35 are The transparent substrate is thus light-emitting on all six sides (only the arrows show the four-sided light-emitting condition in the figure, the front and rear sides of the LED light are not shown), the main light-emitting surface is the back surface of the substrate, and the main light-emitting surface is closed toward the lampshade 312.
  • the main light-emitting surface of each of the first LED light source 34 and the second LED light source 35 is parallel to the horizontal plane.
  • the bracket 36 is T-shaped and connected to the first LED light source 34.
  • the portion between the second LED light source 35 and the second LED light source 35 is a hollow structure for routing to electrically connect the first LED light source 34 and the second LED light source 35.
  • the first LED light source 34 is electrically connected to the second connection end 2132 of the front surface of the substrate and the second connection end 2122' of the second LED light source 35 on the front surface of the substrate.
  • the first metal connection member 321 and the first An LED light source 34 is electrically connected to the second connection end 2122 of the front surface of the substrate, and the second metal connection member 322 is electrically connected to the fourth connection end 2132' of the second LED light source 35 on the front surface of the substrate.
  • the first LED The light source 34 and the second LED light source 35 are connected in series by two metal connectors (321, 322).
  • the power supply module 3 is housed in the lamp cap 311.
  • the two metal connectors (321, 322) extend from the opening of the lamp cover 312 into the lamp cap 311 and are connected to the power supply module 33.
  • the power supply module 33 is also connected to the threaded portion 3111 of the base 311.
  • the 3112 is respectively connected, and the external DC power source is connected through the threaded portion 3111 of the lamp cap and the eyelet portion 3112, and is converted to supply power to the first LED light source 34 and the second LED light source 35 through the two metal connectors (321, 322).
  • the LED lamp further includes a third LED light source 37.
  • the bracket 36 has an umbrella structure, and the first LED light source 34 and the second LED are provided.
  • the light source 35 and the third LED light source 37 are supported by a bracket 36 at a substantially central position within the globe 312 and are enclosed in a triangular shape.
  • the three LED light sources are connected in series by two metal connectors (321, 322).
  • the main light-emitting surfaces of the three LED light sources face the closed end of the lampshade 312. When the LED light is installed in a vertical horizontal plane, the main light-emitting surfaces of the three LED light sources are at an angle of 45 degrees to the horizontal plane.
  • the LED lamp further includes a third LED light source 37 and a fourth LED light source 38.
  • the bracket 36 has an umbrella structure and the first LED.
  • the light source 34, the second LED light source 35, the third LED light source 37, and the fourth LED light source 38 are supported by the bracket 36 at a substantially central position within the globe 312, and are arranged in a star shape.
  • This embodiment is arranged in a special type.
  • the star shape, that is, the cross shape, the LED lamp shown in the present embodiment includes a parallel circuit, and the first LED light source 34 and the second LED light source 35 are connected in series through two metal connectors (321, 322), and through the other two metals.
  • the third LED light source 37 and the fourth LED light source 38 connected in series with the connectors (323, 324) are connected in parallel.
  • the main light-emitting surfaces of the four LED light sources face the closed end of the lampshade 312. When the LED light is installed in a vertical horizontal plane, the main light-emitting surfaces of the four LED light sources are horizontal to the horizontal plane.
  • the LED lamp further includes a third LED light source 37, a fourth LED light source 38, a fifth LED light source 39, and a sixth LED light source. 40.
  • a total of six LED light sources, together with the first LED light source 34 and the second LED light source 35, are supported by a bracket 36 of an umbrella structure at a substantially central position within the globe 312 and are hexagonal.
  • the LED lamp shown in this embodiment is connected to two parallel circuits through two metal connectors (321, 322), and the first LED light source 34, the second LED light source 35 and the third LED light source 37 are connected in series, and the fourth LED light source. 38.
  • the other circuit in which the fifth LED light source 39 and the sixth LED light source 40 are connected in series is connected in parallel.
  • the main light-emitting surfaces of the six LED light sources face the closed end of the lampshade 312. When the LED light is installed in a vertical horizontal plane, the main light-emitting surfaces of the six LED light sources are horizontal to the horizontal plane.
  • the LED lamp further includes a third LED light source 37, and a total of three LEDs of the first LED light source 34 and the second LED light source 35.
  • the two metal connectors (321, 322) made of a hard material are supported at substantially central positions within the globe 312 and arranged side by side.
  • the three LED light sources are connected in series by two metal connectors (321, 322).
  • the respective main light-emitting surfaces face the closed end of the lampshade 312. When the LED light is installed in a vertical horizontal plane, the main light-emitting surfaces of the three LED light sources are horizontal to the horizontal. This embodiment does not require a separate bracket.
  • the third LED light source 37, the first LED light source 34, and the second LED light source 35 have a total of three LED light sources made of a hard material.
  • the two metal connectors (321, 322) are supported at substantially central positions within the globe 312 and are arranged in a folded configuration.
  • the three LED light sources are connected in series by two metal connectors (321, 322).
  • the respective main light-emitting surfaces face the closed end of the lampshade 312. When the LED light is installed in a vertical horizontal plane, the main light-emitting surfaces of the three LED light sources are horizontal to the horizontal. This embodiment does not require a separate bracket.
  • the LED lamp provided by the invention adopts the LED light source provided by the invention, has a simplified structure, is simple to install, and reduces the cost.

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Abstract

一种LED光源及LED灯。LED光源包括衬底、在衬底上制作的外延结构、第一连接单元及第二连接单元；外延结构具有至少一个端部N型、端部P型半导体层；第一连接单元包括与各端部N型半导体层电性连接的第一连接端（2121）、接入外部电路的第二连接端（2122），第二连接单元包括与各端部P型半导体层电性连接的第三连接端（2131）、接入外部电路的第四连接端（2132）；第一、三连接端（2121、2131）设置在外延结构上，第二、四连接端（2122、2132）延伸出外延结构之外。另一个LED光源还包括在上述结构上对除第二连接端（2122）、第四连接端（2132）之外的局部或整体区域进行封胶得到的封装层（220）。LED灯包括上述任一种LED光源。通过以上技术方案，解决现有LED光源结构复杂、成本高的问题。

Description

一种LED光源及LED灯 技术领域
本发明涉及LED技术领域，尤其涉及一种LED光源及LED灯。
 背景技术
目前，LED封装通常采用以下工艺：在衬底上采用化学沉积法制作外延层，在外延层上布置电极，得到LED芯片，将LED芯片采用倒装或正装的方式固设于基板，并在基板上固设杯状支架，用金线将LED芯片的电极与相关电路连接，在杯状支架内注胶，借助杯状支架在lED芯片表面形成半球型封装层。现有工艺需要基板，并需要倒装或正装工艺安装于基板上，需要接金线，需要支架，做成的LED光源包括衬底、外延层、电极、基板、杯状支架、金线和封装层。现有技术工艺繁琐、成本高、效率低，做成的LED光源结构复杂、成本高。
 技术问题
本发明提供一种LED光源及LED灯，解决现有LED光源结构复杂、成本高的问题。
 技术解决方案
为解决上述技术问题，本发明采用以下技术方案:
一种LED光源，包括衬底、在所述衬底上制作的外延结构、第一连接单元以及第二连接单元；所述外延结构包括单个发光外延层结构或者至少两个电性连接的发光外延层结构，所述外延结构具有至少一个端部N型半导体层和至少一个端部P型半导体层；所述第一连接单元包括设置在所述外延结构上且与各所述端部N型半导体层电性连接的第一连接端，以及延伸出所述外延结构之外且用于将所述第一连接端接入外部电路的第二连接端，第二连接单元包括设置在所述外延结构上且与各所述端部P型半导体层电性连接的第三连接端，以及延伸出所述外延结构之外且用于将所述第三连接端接入所述外部电路的第四连接端。
优选的，所述发光外延层结构至少包括：距离所述衬底由近到远的N型半导体层、发光层和P型半导体层；或者至少包括：距离所述衬底由近到远的N型半导体层、发光层、P型半导体层和金属反射层；或者至少包括：距离所述衬底由近到远的N型半导体层、发光层和具有反射功能的P型半导体层。
优选的，第一连接端通过金属膏设置在所述外延结构上且与各所述端部N型半导体层电性连接；和/或第三连接端通过金属膏设置在所述外延结构上且与各所述端部P型半导体层电性连接。
优选的，第二连接端和/或第四连接端延伸出所述外延结构之外形成悬空端；或者延伸出所述外延结构之外并与所述衬底上所述外延结构所占部分之外的区域贴合；或者延伸出所述外延结构之外并通过中间结构固设于所述衬底上所述外延结构所占部分之外的区域。
优选的，第二连接端和/或第四连接端的形状为Z形、T形、L形、十形、方形、椭圆形、圆形、不规则形状中的一种或多种。
优选的，所述衬底为蓝宝石、硅、玻璃、碳化硅材料中的一种。
优选的，第一连接单元和/或第二连接单元为一体式片状结构。
优选的，第二连接端和/或第四连接端与所述外部电路的连接区域的内切圆直径为200微米至1500微米。
一种LED光源，其特征在于，包括发光单元和封装层，所述发光单元为上述任一项所述的LED光源，
所述封装层由在所述发光单元上，对除所述第二连接端、第四连接端与所述外部电路的连接区域之外的所述发光单元的局部或整体区域进行封胶得到，封胶区域至少包括所述发光单元的主出光区。
优选的，所述封装层用于封装所述发光单元的主出光面上除所述第二连接端、第四连接端与所述外部电路的连接区域之外的区域；或者用于封装所述发光单元的主出光面、主出光面的相对面上除所述第二连接端、第四连接端与所述外部电路的连接区域之外的区域；或者用于封装所述发光单元的主出光面、主出光面的相对面以及主出光面和其相对面之间的部分或全部侧面上除所述第二连接端、第四连接端与所述外部电路的连接区域之外的区域。
一种LED灯，包括至少一个LED光源，以及用于给各个所述LED光源供电的至少两个金属连接件；所述LED光源为上述任一项所述的LED光源。
优选的，该LED灯包括至少两个所述LED光源；所述至少两个LED光源并列排列，或排列成一字形、折合形，且各LED光源的主出光面朝外。
优选的，该LED灯包括至少三个所述LED光源；所述至少三个LED光源围成多边形，且各LED光源的主出光面朝外；或者所述至少三个LED光源排列成星形，且各LED光源的主出光面朝外。
优选的，至少一个所述LED光源的主出光面与水平面成20至60度夹角。优选的，至少一个所述LED光源的主出光面与水平面成45度夹角。
优选的，该LED灯还包括壳体，用于收纳各个所述LED光源和所述至少两个金属连接件。
优选的，该LED灯还包括供电模块和/或支架；所述供电模块与所述至少两个金属连接件连接，用于通过所述至少两个金属连接件给各个所述LED光源供电；所述支架用于支承所述LED光源、金属连接件、供电模块中的至少一种；所述壳体还用于收纳所述供电模块和/或支架。
优选的，所述壳体内还填充有保护气体。
优选的，该LED灯还包括与所述至少两个金属连接件电性连接的主控模块，用于控制金属连接件对各个LED光源的供电。
优选的，该LED灯包括至少两个所述LED光源，所述至少两个LED光源通电后产生不同颜色光。优选的，通电后产生不同颜色光的LED光源相互并联，通电后产生相同颜色光的LED光源串联。
优选的，该LED灯还包括与所述主控模块电性连接的通信模块，用于接收外部控制端的控制指令并传输至所述主控模块，所述主控模块用于根据所述控制指令控制金属连接件对各个LED光源的供电。
 有益效果
本发明提供一种LED光源及LED灯，第一连接单元、第二连接单元延伸出外延结构之外的第二连接端和第四连接端用于与外部相关电路连接，因此不需要接金线；第一连接端、第三连接端设置在外延结构上且分别与其端部N型半导体层、端部P型半导体层电性连接，因此甚至无需额外对发光外延层结构制作电极。封装层由直接在发光单元上进行封胶得到，不需要借助基板和支架，因此，本发明提供的LED光源相比现有LED光源而言，不包括基板、支架和金线，甚至连发光外延层结构上的电极都可以省去，简化了LED光源的组成结构，降低了成本。
 附图说明
图1为本发明实施例一提供的一种LED光源的结构示意图；
图2为本发明实施例一提供的另一种LED光源的结构示意图；
图3为本发明实施例一提供的另一种LED光源的结构示意图；
图4为本发明实施例一提供的另一种LED光源的结构示意图；
图5为本发明实施例一提供的另一种LED光源的结构示意图；
图6为本发明实施例一提供的另一种LED光源的结构示意图；
图7为本发明实施例二提供的另一种LED光源的结构示意图；
图8为本发明实施例二提供的另一种LED光源的结构示意图；
图9为本发明实施例二提供的另一种LED光源的结构示意图；
图10为本发明实施例三提供的一种LED灯的结构示意图；
图11为图10所示LED灯中LED光源与金属连接件的连接关系示意图；
图12为本发明实施例三提供的另一种LED灯的结构示意图；
图13为本发明实施例三提供的另一种LED灯的结构示意图；
图14为本发明实施例三提供的另一种LED灯的结构示意图；
图15为本发明实施例三提供的另一种LED灯的结构示意图；
图16为本发明实施例三提供的另一种LED灯的结构示意图。
 本发明的最佳实施方式
本发明的实施方式
下面通过具体实施方式结合附图对本发明作进一步详细说明。为了更好的示意组成结构，附图中各部分的比例不做限制。
实施例一：
本实施例一提供的LED光源包括衬底、在所述衬底上制作的外延结构、第一连接单元以及第二连接单元。优选的，该LED光源由衬底、在所述衬底上制作的外延结构、第一连接单元以及第二连接单元组成。
外延结构包括单个发光外延层结构A1或者至少两个电性连接的发光外延层结构（A1至An），所述至少两个电性连接的发光外延层结构（A1至An）通过串联、并联或串并混合联的方式电性连接；外延结构具有至少一个端部N型半导体层和至少一个端部P型半导体层；第一连接单元包括第一连接端和第二连接端，第一连接端设置在外延结构上且与各端部N型半导体层电性连接，第二连接端延伸出外延结构之外且用于将第一连接端接入外部电路，第二连接单元包括第三连接端和第四连接端，第三连接端设置在外延结构上且与各端部P型半导体层电性连接，第四连接端延伸出外延结构之外且用于将第三连接端接入外部电路。
发光外延层结构有以下四种：
第一种，至少包括：N型半导体层、发光层、P型半导体层和金属反射层，且所述N型半导体层、发光层、P型半导体层、金属反射层距离所述衬底由近到远依次层叠在衬底上；金属反射层具有光反射功能。
第二种，至少包括：N型半导体层、发光层和具有反射功能的P型半导体层，且所述N型半导体层、发光层、具有反射功能的P型半导体层距离所述衬底由近到远依次层叠在衬底上；具有反射功能的P型半导体层具有光反射功能。
若外延结构中的发光外延层结构为上述第一、二种，则衬底为透明衬底，发光层发出的光被金属反射层或具有反射功能的P型半导体层反射，衬底上具有外延结构那一面的相对面（假设在具有外延结构的那一面为衬底正面，则其相对面为衬底背面）为LED光源的主出光面。
第三种，至少包括N型半导体层、发光层和P型半导体层，且不具有光发射功能，所述N型半导体层、发光层、P型半导体层距离所述衬底由近到远依次层叠在衬底上。
第四种，为垂直结构的发光外延层结构，其衬底为金属衬底，至少包括： P型半导体层、发光层和N型半导体层，且所述P型半导体层、发光层、N型半导体层距离所述金属衬底由近到远依次层叠在所述金属衬底上。
若外延结构中的发光外延层结构为上述第三、四种，第四种因衬底为不透明，第三种不论衬底是否透明因不具有光发射功能，衬底上具有外延结构的那一面为LED光源的主出光面。
若外延结构包括至少两个电性连接的发光外延层结构，优选的，各个发光外延层结构相同，可以为以上第一、二、三种发光外延层结构。
若外延结构包括单个发光外延层结构，则该外延结构具有一个端部N型半导体层和一个端部P型半导体层，端部N型半导体层为该单个发光外延层结构的N型半导体层，端部P型半导体层为该单个发光外延层结构的P型半导体层。
对于外延结构包括至少两个电性连接的发光外延层结构的情况，若其中的全部发光外延层结构均串联电性连接，则该外延结构具有一个端部N型半导体层和一个端部P型半导体层，位于串联电路一端的发光外延层结构的N型半导体作为该外延结构的端部N型半导体层，另一端的发光外延层结构的P型半导体层为该外延结构的端部P型半导体层；若全部发光外延层结构均并联电性连接，则各个发光外延层结构的N型半导体层作为该外延结构的一个端部N型半导体层， P型半导体层为该外延结构的一个端部P型半导体层，即该外延结构具有与发光外延层结构个数相同的端部N型半导体层和端部P型半导体层。总之， 将全部发光外延层结构所构成的整个电路一端的发光外延层结构的N型半导体作为该外延结构的端部N型半导体层，另一端的发光外延层结构的P型半导体层为该外延结构的端部P型半导体层。
若外延结构中各发光外延层结构为上述第一、二或三种，则第一连接端和第三连接端设置在衬底的同一侧，第一连接端、第三连接端的形成方式，可参考现有LED芯片外延层上制作的电极，包括但不局限于：第一连接端制作好后通过金属膏设置在外延结构上且与各端部N型半导体层电性连接，或者第一连接端直接沉积在外延结构上且与各端部N型半导体层电性连接；第三连接端制作好后通过金属膏设置在外延结构上且与各端部P型半导体层电性连接，或者第三连接端直接沉积在外延结构上且与各端部P型半导体层电性连接。金属膏包括但不局限于膏状的金、银、铜、铝、锡，或者膏状的金属合金。
若外延结构中的发光外延层结构为上述第四种，优选的，将金属衬底同时作为第二连接单元，不另设第二连接单元，其中，该第四种发光外延层结构的P型半导体层所占部分金属衬底为第三连接端，延伸出该垂直结构的发光外延层结构之外的部分金属衬底作为第四连接端。
如图1所示，外延结构包括单个发光外延层结构A1，且为上述第三种发光外延层结构，该外延结构具有一个端部N型半导体层和一个端部P型半导体层，该单个发光外延层结构A1的N型半导体层为该外延结构的端部N型半导体层、P型半导体层为该外延结构的端部P型半导体层，第一连接端2121设置在该发光外延层结构A1上且与其N型半导体层电性连接，第三连接端2131设置在该发光外延层结构A1上且与其P型半导体层电性连接, 第二连接端2122、第四连接端2132延伸出发光外延层结构A1之外且用于将第一连接端2121、第三连接端2131接入外部电路。
如图2所示，外延结构包括至少两个串联电性连接的发光外延层结构（A1至An），且各发光外延层结构（A1至An）均为上述第三种，相邻发光外延层结构之间通过在衬底上制作的电性连接结构B串联。由于全部发光外延层结构（A1至An）均串联，该外延结构只具有一个端部N型半导体层和一个端部P型半导体层，位于串联电路一端的发光外延层结构A1的N型半导体作为该外延结构的端部N型半导体层，另一端的发光外延层结构An的P型半导体层为该外延结构的端部P型半导体层，第一连接端2121设置在发光外延层结构A1上且与该发光外延层结构A1的N型半导体层电性连接，第三连接端2131设置在发光外延层结构An上且与该发光外延层结构An的P型半导体层电性连接, 第二连接端2122、第四连接端2132分别延伸出发光外延层结构A1、An之外且用于将第一连接端2121、第三连接端2131接入外部电路。
若外延结构中的全部发光外延层结构（A1至An）均并联电性连接，且各发光外延层结构（A1至An）均为上述第三种。则该外延结构具有n个端部N型半导体层和n个端部P型半导体层，各个发光外延层结构（A1至An）的N型半导体均作为该外延结构的一个端部N型半导体层， P型半导体层均为该外延结构的一个端部P型半导体层，第一连接端包括n个第一连接部，第三连接端包括n个第三连接部，其中，各个发光外延层结构发光外延层结构（A1至An）上均设置有一个第一连接部和一个第三连接部，第一连接部设置在发光外延层结构上且与该发光外延层结构的N型半导体层电性连接，第三连接部设置在发光外延层结构上且与该发光外延层结构的P型半导体层电性连接，而第二连接端延伸出外延结构之外且用于该n个第一连接部全部入外部电路，即第二连接端的一端与该n个第一连接部分别电性连接，另一端接入外部电路；第四连接端延伸出外延结构之外且分别用于将该n个第三连接部接入外部电路，即第四连接端的一端与该n个第三连接部分别电性连接，另一端接入外部电路。
第二连接端和/或第四连接端可以延伸出外延结构之外形成悬空端；或者延伸出外延结构之外并与衬底上外延结构所占部分之外的区域贴合；或者延伸出外延结构之外并通过中间结构固设于衬底上外延结构所占部分之外的区域。如图1和图2所示，第二连接端2122和第四连接端2132延伸出外延结构之外形成悬空端，且为水平悬空；如图3所示，第二连接端2122和第四连接端2132向下悬空；如图4所示，第二连接端2122和第四连接端2132向上悬空；如图5所示，第二连接端2122和第四连接端2132延伸出外延结构之外并与衬底上该外延结构所占部分之外的区域贴合；如图6所示，第二连接端2122和第四连接端2132延伸出外延结构之外并通过中间结构214固设于衬底上该外延结构所占部分之外的区域，中间结构214可以为浮点，或者，还可以为衬底上制作外延结构时多出的外延层。
优选的，第二连接端、第四连接端通过电焊的方式与外部电路电性连接；或者通过连接端子与外部电路电性连接。例如，连接端子一端与外部电路电性连接，另一端具有连接端口，连接端口可以与第二连接端的形状相匹配的，将第二连接端容纳其中并使其与外部电路电性连接，或者，该连接端口将第二连接端和第二连接端下方的部分衬底一并容纳其中并使第二连接端与外部电路电性连接。
优选的，第二连接端和/或第四连接端的形状为Z形、T形、L形、十形、方形、椭圆形、圆形、不规则形状中的一种或多种。
优选的，第一连接单元和/或第二连接单元为一体式片状结构。一体式片状结构的第一连接单元、第二连接单元可以先制作好后，再将一端通过金属膏设置在外延结构上且分别与各端部N型半导体层、端部P型半导体层电性连接，并预留另一端延伸出外延结构之外用于接外部电路。
优选的，第二连接端与外部电路的连接区域的内切圆直径为200微米至1500微米。和/或，第四连接端与外部电路的连接区域的内切圆直径为200微米至1500微米。这种尺寸不同于现有LED芯片的电极的尺寸，这种尺寸的连接区域可直接、并牢固地接入外部电路。
优选的，衬底为蓝宝石、硅、玻璃、碳化硅材料中的一种。其中蓝宝石衬底为透明衬底。
实施例一提供的LED光源，包括衬底、在所述衬底上制作的外延结构、第一连接单元以及第二连接单元，第一连接单元、第二连接单元延伸出外延结构之外的第二连接端和第四连接端用于与外部相关电路连接，因此不需要接金线；第一连接端、第三连接端设置在外延结构上且分别与其端部N型半导体层、端部P型半导体层电性连接，因此甚至无需额外对发光外延层结构制作电极。还可直接在该LED光源上进行封胶，改变该LED光源的光颜色，而不需要基板和支架。
实施例二：
实施例二提供的LED光源包括发光单元和封装层，其中，发光单元为上述实施例一中的任一种结构的LED光源，因此，实施例二所提供的LED光源相比实施例一不同之处在于，是将实施例一所示LED光源作为发光单元，还包括由在该发光单元上，对除第二连接端、第四连接端与外部电路的连接区域之外的该发光单元的局部或整体区域进行封胶得到的封装层。该封装层的封胶区域至少包括该发光单元的主出光面。实施例二提供的LED光源不具有基板、支架、金线。优选的，由发光单元和在该发光单元上封胶成型的封装层组成。优选的，封装层为弧形。
发光单元的出光区指的是发光单元上实际出光的区域，优选的，包括发光外延层结构的外表面，若是透明衬底，还包括发光外延层结构映射在衬底另一面的映射区。主出光区指的是出光效率最高的区域，主发光区所在的面为发光单元的主出光面。
对于外延结构由上述第一、二种发光外延层结构构成的发光单元而言，由于发光层发出的光被反射，衬底上具有外延结构那一面的相对面（假设在具有外延结构的那一面为衬底正面，则其相对面为衬底背面）为发光单元的主出光面；对于外延结构由上述第三、四种发光外延层结构构成的发光单元而言，由于发光层发出的光没有被反射，衬底上具有外延结构的那一面为发光单元的主出光面。
优选的，封装层用于封装所述发光单元的主出光面上除所述第二连接端、第四连接端与所述外部电路的连接区域之外的区域；或者用于封装所述发光单元的主出光面、主出光面的相对面上除所述第二连接端、第四连接端与所述外部电路的连接区域之外的区域；或者用于封装所述发光单元的主出光面、主出光面的相对面以及主出光面和其相对面之间的部分或全部侧面上除所述第二连接端、第四连接端与所述外部电路的连接区域之外的区域。
如图7和8所示，图7、8所示的LED光源均通过如下制作方法得到：在发光单元的主出光面上除第二连接端2122、第四连接端2132与外部电路的连接区域之外的区域中，沿着发光外延层结构（A1至An）的排列轨迹移动式连续注胶，经固化后形成一个连体封装层220。所不同的是，图7中的衬底为透明衬底，且串联的各发光外延层结构（A1至An）包括金属反射镜层或包括具有反射功能的P型半导体层，因此衬底上具有外延结构那一面的相对面（假设在具有外延结构的那一面为衬底正面，则其相对面为衬底背面）为发光单元的主出光面。而图8中的衬底为非透明衬底（或者各发光外延层结构（A1至An）没有光发射功能，例如没有金属反射镜层，P型半导体层也不具有反射功能），衬底上具有外延结构的那一面为该发光单元的主出光面。因此，图7所示LED光源是在衬底上具有外延结构那一面的相对面上进行移动式连续注胶，经固化后形成的连体封装层220将该相对面上除第二连接端2122、第四连接端2132与外部电路的连接区域之外的区域封装成一体。而图8所示LED光源是在衬底上具有外延结构那一面上进行移动式连续注胶，经固化后形成的连体封装层220将该具有外延结构那一面上除第二连接端2122、第四连接端2132与外部电路的连接区域之外的区域封装成一体。
当然，在其他实施例中，也可以将各个发光外延层结构（A1至An）的主出光面单独封装，封装成多个独立封装层。
如图9所示，图9所示的LED光源通过如下制作方法得到：先将发光单元的主出光面或其相对面中之一面朝上放置；在该朝上的一面上除第二连接端2122、第四连接端2132与外部电路的连接区域之外的区域中，沿着发光外延层结构（A1至An）的排列轨迹移动式连续注胶，经固化后在该面上形成一个连体封装层；将发光单元进行180度翻转，即使得该发光单元的主出光面或其相对面中之另一面朝上，并通过支架与发光单元上未被注胶的区域进行配合将发光单元固定，使被封胶的区域悬空；再在该朝上的一面（发光单元的主出光面或其相对面中之另一面）上除第二连接端2122、第四连接端2132与外部电路的连接区域之外的区域中，沿着发光外延层结构（A1至An）的排列轨迹移动式连续注胶，由于胶体的流动性，经固化后主出光面和其相对面上形成的连体封装层连为一体，最终形成一个包裹发光单元4个面的连体封装层220，它将发光单元上除第二连接端2122、第四连接端2132与外部电路的连接区域之外的整体封装为一体。
实施例二提供的LED光源不同于实施例一，其包括实施例一提供的LED光源和直接在其上封胶得到的封装层，不需要金线、不需要基板和支架，甚至不需要对各发光外延层结构制作额外的电极，简化了LED光源的组成结构，降低了成本。
实施例三：
本发明还提供一种LED灯，包括至少一个LED光源，以及用于给各个所述LED光源供电的至少两个金属连接件，所述LED光源为上述实施例一或二中的任一种LED光源。若该LED灯包括两个或两个以上的所述LED光源时，各LED光源之间可以串联、并联，或者串并联混合，形成至少一路电路，所述至少两个金属连接件将各路电路接入供电模块，以实现供电。供电模块可以为该LED灯的组成部分，也可以是独立于该LED灯之外的外部模块。
优选的，金属连接件为硬性材质制成，用于给各个所述LED光源供电的同时，还用于支承各个所述LED光源，由此将各个所述LED光源保持在一个固定位置。优选的，至少两个金属连接件采用热传导率高的材料制成，与其连接的LED光源的热量能够通过它向灯头散发。热传导率高的材料如铜。
优选的，至少一个所述LED光源的主出光面与水平面成20至60度夹角，更优的，成45度夹角。这样能够使得主出光面发出的光成预设角度发射出去，使整个角度对应的目标区域被照亮。
若该LED灯包括至少两个所述LED光源，优选的，所述至少两个LED光源并列排列，或排列成一字形、折合形，且各LED光源的主出光面朝外。所述至少两个LED光源通电后的颜色可以相同或不同。若该LED灯包括至少三个所述LED光源，优选的，所述至少三个LED光源围成多边形，且各LED光源的主出光面朝外；或者所述至少三个LED光源排列成星形，且各LED光源的主出光面朝外。主出光面朝外能够使得主出光面发出的光向外发射，提高照射亮度。
优选的，该LED灯还包括供电模块，与所述至少两个金属连接件连接，用于通过所述至少两个金属连接件给各个所述LED光源供电。优选的，供电模块中包括电源转换器，将外部交流电变换成直流电。
优选的，该LED灯还包括支架，用于支承所述LED灯源、金属连接件、供电模块中的至少一种。使得被支承的部分位置固定。优选的，支架采用相对于可见光是透明的软质玻璃制成，由此能够抑制LED灯源的光因支架而损失，另外，还能够防止LED光源因支架而形成影子。
优选的，该LED灯还包括壳体，用于收纳各个所述LED灯源和所述至少两个金属连接件。进一步的，还用于收纳上述供电模块和/或支架。优选的，壳体内还填充有保护气体。
优选的，该壳体包括灯头和中空且透光的灯罩，灯罩一端封闭，另一端具有开口部，各个所述LED灯源以中空状态通过至少两个硬性材质制成的金属连接件被配置在中空的灯罩内的大致中央位置，这样各个所述LED灯源被中空地保持在灯罩内，即各个所述LED灯源在灯罩内成为相对于灯罩内表面的悬空状态，灯罩的开口部以被堵塞的方式安装灯头，灯头包括侧面的螺纹部和灯头底部的孔眼部；若该LED灯还包括供电模块，则将供电模块收纳在灯头内，所述至少两个金属连接件从灯罩的开口部延伸进灯头与供电模块连接，供电模块还与灯头的螺纹部、孔眼部分别连接，通过灯头的螺纹部、孔眼部接入外部直流电源，并进行转换后通过所述至少两个金属连接件给各个所述LED光源供电；若该LED灯没有供电模块，则所述至少两个金属连接件直接与灯头的螺纹部、孔眼部连接，通过螺纹部、孔眼部接入外部供电模块。若该LED灯还包括支架，支架可从灯罩的开口部延伸进灯罩内，且支架、灯罩的开口部和灯头以灯罩的开口部被堵塞的方式安装，各个所述LED灯源以中空状态通过支架被配置在中空的灯罩内的大致中央位置，这种情况下金属连接件不需要支承其他部件。
优选的，该LED灯还包括与所述至少两个金属连接件电性连接的主控模块，用于控制金属连接件对各个LED光源的供电，包括控制各个LED光源的通电、断电、亮度等。这样在主控模块的控制下，该LED灯可发出单色光、可混光，而且，其颜色、亮度、饱和度等均可控。
优选的，该LED灯包括至少两个所述LED光源，所述至少两个LED光源通电后产生不同颜色光，通过主控模块控制对各个LED光源的供电，可以实现该LED灯发光颜色的切换。优选的，所述至少两个LED光源中，通电后产生不同颜色光的LED光源相互并联，通电后产生相同颜色光的LED光源串联。
优选的，该LED灯还包括与该主控模块电性连接的通信模块，用于接收外部控制端的控制指令并传输至该主控模块，该主控模块用于根据所述控制指令控制金属连接件对各个LED光源的供电。包括控制各个LED光源的通电、断电、亮度等。优选的，外部控制端为手机、遥控器等。优选的，通信模块为WIFI模块、蓝牙模块、ZigBee通信模块等。
以球泡灯为例，如图10至16所示。
如图10、11为本发明一实施例，LED灯包括壳体、两个金属连接件（321、322）、供电模块33、第一LED光源34、第二LED光源35和支架36。壳体包括灯头311和灯罩312，灯罩312中空且透光，一端封闭，另一端具有开口部，灯罩312的开口部以被堵塞的方式安装灯头311，灯罩312内还填充有保护气体，灯头311包括侧面的螺纹部3111和灯头311底部的孔眼部3112。第一LED光源34和第二LED光源35通过支架36被支承在灯罩312内的大致中央位置，且排列成一字形，本实施例中，第一LED光源34和第二LED光源35的衬底为透明衬底，因此其六面均出光（图中仅用箭头示出四面的出光情况，LED灯前后两面未示出），各自的主出光面为衬底背面，主出光面朝向灯罩312的封闭端，当将该LED灯垂直水平面安装时，第一LED光源34和第二LED光源35各自的主出光面与水平面平行，该实施例中，支架36为T字形，连接在第一LED光源34和第二LED光源35之间的部分为中空结构，用于走线，以将第一LED光源34和第二LED光源35电性连接。第一LED光源34位于衬底正面的第四连接端2132与第二LED光源35位于衬底正面的第二连接端2122′电性连接，如图11所示，第一金属连接件321与第一LED光源34位于衬底正面的第二连接端2122电性连接，第二金属连接件322与第二LED光源35位于衬底正面的第四连接端2132′电性连接，因此，第一LED光源34和第二LED光源35通过两个金属连接件（321、322）实现了串联。供电模块3收纳在灯头311内，两个金属连接件（321、322）从灯罩312的开口部延伸进灯头311与供电模块33连接，供电模块33还与灯头311的螺纹部3111、孔眼部3112分别连接，通过灯头的螺纹部3111、孔眼部3112接入外部直流电源，并进行转换后通过两个金属连接件（321、322）给第一LED光源34和第二LED光源35供电。
如图12所示为另一实施例，与上述图10所示实施例不同的是，该LED灯还包括第三LED光源37，支架36为伞状结构，第一LED光源34、第二LED光源35和第三LED光源37通过支架36被支承在灯罩312内的大致中央位置，且围合成三边形，这3个LED光源通过两个金属连接件（321、322）实现了串联。这三个LED光源各自的主出光面朝向灯罩312的封闭端，当将该LED灯垂直水平面安装时，这3个LED光源各自的主出光面与水平面成45度角。
如图13所示为另一实施例，与上述图10所示实施例不同的是，该LED灯还包括第三LED光源37和第四LED光源38，支架36为伞状结构，第一LED光源34、第二LED光源35、第三LED光源37和第四LED光源38通过支架36被支承在灯罩312内的大致中央位置，且排列成星形，本实施例排列成的是一种特殊的星形，即十字架形，本实施所示的LED灯包括并联电路，第一LED光源34和第二LED光源35通过两个金属连接件（321、322）串联，再与通过另两个金属连接件（323、324）串联的第三LED光源37和第四LED光源38并联。这四个LED光源各自的主出光面朝向灯罩312的封闭端，当将该LED灯垂直水平面安装时，这4个LED光源各自的主出光面与水平面水平。
如图14所示为另一实施例，与上述图10所示实施例不同的是，该LED灯还包括第三LED光源37、第四LED光源38、第五LED光源39和第六LED光源40，与第一LED光源34和第二LED光源35一共6个LED光源通过伞状结构的支架36被支承在灯罩312内的大致中央位置，且围成六边形。本实施所示的LED灯通过两个金属连接件（321、322）连接两并联电路，第一LED光源34、第二LED光源35和第三LED光源37串联成的一路，与第四LED光源38、第五LED光源39和第六LED光源40串联成的另一路并联。这6个LED光源各自的主出光面朝向灯罩312的封闭端，当将该LED灯垂直水平面安装时，这6个LED光源各自的主出光面与水平面水平。
如图15所示为另一实施例，与上述图10所示实施例不同的是，该LED灯还包括第三LED光源37，与第一LED光源34和第二LED光源35一共3个LED光源通过硬性材质制成的两个金属连接件（321、322）被支承在灯罩312内的大致中央位置，且并列排列。这3个LED光源通过两个金属连接件（321、322）串联。各自的主出光面朝向灯罩312的封闭端，当将该LED灯垂直水平面安装时，这3个LED光源各自的主出光面与水平面水平。本实施例不需另设支架。
如图16所示为另一实施例，与上述图15所示实施例不同的是，第三LED光源37、第一LED光源34和第二LED光源35一共3个LED光源通过硬性材质制成的两个金属连接件（321、322）被支承在灯罩312内的大致中央位置，且排列成折合形。这3个LED光源通过两个金属连接件（321、322）串联。各自的主出光面朝向灯罩312的封闭端，当将该LED灯垂直水平面安装时，这3个LED光源各自的主出光面与水平面水平。本实施例也不需另设支架。
本发明提供的LED灯采用本发明提供的LED光源，组成结构得到简化，安装简单，且降低了成本。
以上内容是结合具体的实施方式对本发明所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本发明的保护范围。
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  1. 一种LED光源，其特征在于，包括衬底、在所述衬底上制作的外延结构、第一连接单元以及第二连接单元；所述外延结构包括单个发光外延层结构或者至少两个电性连接的发光外延层结构，所述外延结构具有至少一个端部N型半导体层和至少一个端部P型半导体层；所述第一连接单元包括设置在所述外延结构上且与各所述端部N型半导体层电性连接的第一连接端，以及延伸出所述外延结构之外且用于将所述第一连接端接入外部电路的第二连接端，第二连接单元包括设置在所述外延结构上且与各所述端部P型半导体层电性连接的第三连接端，以及延伸出所述外延结构之外且用于将所述第三连接端接入所述外部电路的第四连接端。
  2. 如权利要求1所述的LED光源，其特征在于，所述发光外延层结构至少包括：距离所述衬底由近到远的N型半导体层、发光层和P型半导体层；或者至少包括：距离所述衬底由近到远的N型半导体层、发光层、P型半导体层和金属反射层；或者至少包括：距离所述衬底由近到远的N型半导体层、发光层和具有反射功能的P型半导体层。
  3. 如权利要求1所述的LED光源，其特征在于，第一连接端通过金属膏设置在所述外延结构上且与各所述端部N型半导体层电性连接；和/或第三连接端通过金属膏设置在所述外延结构上且与各所述端部P型半导体层电性连接。
  4. 如权利要求1所述的LED光源，其特征在于，第二连接端和/或第四连接端延伸出所述外延结构之外形成悬空端；或者延伸出所述外延结构之外并与所述衬底上所述外延结构所占部分之外的区域贴合；或者延伸出所述外延结构之外并通过中间结构固设于所述衬底上所述外延结构所占部分之外的区域。
  5. 如权利要求1所述的LED光源，其特征在于，第二连接端和/或第四连接端的形状为Z形、T形、L形、十形、方形、椭圆形、圆形、不规则形状中的一种或多种。
  6. 如权利要求1所述的LED光源，其特征在于，所述衬底为蓝宝石、硅、玻璃、碳化硅材料中的一种。
  7. 如权利要求1至6任一项所述的LED光源，其特征在于，第一连接单元和/或第二连接单元为一体式片状结构。
  8. 如权利要求7所述的LED光源，其特征在于，第二连接端和/或第四连接端与所述外部电路的连接区域的内切圆直径为200微米至1500微米。
  9. 一种LED光源，其特征在于，包括发光单元和封装层，所述发光单元为如权利要求1至8任一项所述的LED光源，
    所述封装层由在所述发光单元上，对除所述第二连接端、第四连接端与所述外部电路的连接区域之外的所述发光单元的局部或整体区域进行封胶得到，封胶区域至少包括所述发光单元的主出光区。
  10. 如权利要求11所述的LED光源，其特征在于，所述封装层用于封装所述发光单元的主出光面上除所述第二连接端、第四连接端与所述外部电路的连接区域之外的区域；或者用于封装所述发光单元的主出光面、主出光面的相对面上除所述第二连接端、第四连接端与所述外部电路的连接区域之外的区域；或者用于封装所述发光单元的主出光面、主出光面的相对面以及主出光面和其相对面之间的部分或全部侧面上除所述第二连接端、第四连接端与所述外部电路的连接区域之外的区域。
  11. 如权利要求9或10所述的LED光源，其特征在于，所述封装层为一个连体封装层。
  12. 如权利要求9或10所述的LED光源，其特征在于，所述封装层为弧形。
  13. 一种LED灯，其特征在于，包括至少一个LED光源，以及用于给各所述LED光源供电的至少两个金属连接件；所述LED光源为如权利要求1至8任一项所述的LED光源或如权利要求9至12任一项所述的LED光源。
  14. 如权利要求13所述的LED灯，其特征在于，包括至少两个所述LED光源；所述至少两个LED光源并列排列，或排列成一字形、折合形，且各LED光源的主出光面朝外。
  15. 如权利要求13所述的LED灯，其特征在于，包括至少三个所述LED光源；所述至少三个LED光源围成多边形，且各LED光源的主出光面朝外；或者所述至少三个LED光源排列成星形，且各LED光源的主出光面朝外。
  16. 如权利要求13所述的LED灯，其特征在于，至少一个所述LED光源的主出光面与水平面成20至60度夹角。
  17. 如权利要求16所述的LED灯，其特征在于，至少一个所述LED光源的主出光面与水平面成45度夹角。
  18. 如权利要求13所述的LED灯，其特征在于，还包括壳体，用于收纳各个所述LED光源和所述至少两个金属连接件。
  19. 如权利要求18所述的LED灯，其特征在于，还包括供电模块和/或支架；所述供电模块与所述至少两个金属连接件连接，用于通过所述至少两个金属连接件给各个所述LED光源供电；所述支架用于支承所述LED光源、金属连接件、供电模块中的至少一种；所述壳体还用于收纳所述供电模块和/或支架。
  20. 如权利要求18所述的LED灯，其特征在于，所述壳体内还填充有保护气体。
  21. 如权利要求13至20任一项所述的LED灯，其特征在于，还包括与所述至少两个金属连接件电性连接的主控模块，用于控制金属连接件对各个LED光源的供电。
  22. 如权利要求21所述的LED灯，其特征在于，包括至少两个所述LED光源，所述至少两个LED光源通电后产生不同颜色光。
  23. 如权利要求22所述的LED灯，其特征在于，通电后产生不同颜色光的LED光源相互并联，通电后产生相同颜色光的LED光源串联。
  24. 如权利要求21所述的LED灯，其特征在于，还包括与所述主控模块电性连接的通信模块，用于接收外部控制端的控制指令并传输至所述主控模块，所述主控模块用于根据所述控制指令控制金属连接件对各个LED光源的供电。
PCT/CN2014/082780 2014-07-23 2014-07-23 一种led光源及led灯 WO2016011608A1 (zh)

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CN101075656A (zh) * 2006-05-16 2007-11-21 三星电机株式会社 氮化物基半导体发光二极管
US20090045428A1 (en) * 2007-08-16 2009-02-19 Lin Peter P W Polarless surface mounting light emitting diode
CN102109115A (zh) * 2010-12-29 2011-06-29 葛世潮 一种P-N结4π出光的高压LED及LED灯泡
CN103325933A (zh) * 2012-03-23 2013-09-25 株式会社东芝 半导体发光器件及其制造方法
CN103400916A (zh) * 2013-08-21 2013-11-20 深圳市凯信光电有限公司 一种led晶片结构
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JP2004014899A (ja) * 2002-06-10 2004-01-15 Para Light Electronics Co Ltd 発光ダイオードチップの直列構造
CN101075656A (zh) * 2006-05-16 2007-11-21 三星电机株式会社 氮化物基半导体发光二极管
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CN102109115A (zh) * 2010-12-29 2011-06-29 葛世潮 一种P-N结4π出光的高压LED及LED灯泡
CN103325933A (zh) * 2012-03-23 2013-09-25 株式会社东芝 半导体发光器件及其制造方法
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CN203456493U (zh) * 2013-08-21 2014-02-26 深圳市凯信光电有限公司 一种led晶片结构

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