WO2015196542A1

WO2015196542A1 - Software version upgrade method and single board

Info

Publication number: WO2015196542A1
Application number: PCT/CN2014/084680
Authority: WO
Inventors: 徐群立; 程兵
Original assignee: 中兴通讯股份有限公司
Priority date: 2014-06-26
Filing date: 2014-08-19
Publication date: 2015-12-30
Also published as: CN105224352A

Abstract

A software version upgrade method comprises the steps of: loading a second BootLoader used for upgrading a first BootLoader sintered in a FLASH chip to a memory chip (S100); acquiring peripheral component configuration parameters of the first BootLoader in the FLASH chip, wherein the peripheral component configuration parameters are stored in a predetermined position of the FLASH chip (S200); writing the peripheral component configuration parameters into a corresponding parameter position of the second BootLoader in the memory chip to obtain a second BootLoader containing the peripheral component configuration parameters (S300); and writing the second BootLoader containing the peripheral component configuration parameters into the FLASH chip so as to replace the first BootLoader (S400). Further provided is a single board. The technical solution reduces the trouble of software upgrade and maintenance, and realizes cost saving.

Description

The present invention relates to the field of software upgrade and maintenance, and in particular, to a software version upgrade method and a board. BACKGROUND OF THE INVENTION Products based on embedded systems often use a variety of peripheral devices of different sizes or models.

(such as RAM/FLASH, etc.) to achieve multiple price levels to meet the needs of different gradient markets. For user applications, the functional items provided do not change, and the product model generally does not need to be changed. In the boot phase, the CPU is initialized with a fixed address of the BootLoader (boot loader) to read the boot parameters and peripheral device configuration parameters such as RAM/FLASH. The configuration parameters are provided by the BootLoader program and must be associated with the board. The device type matches, otherwise it will not start. At this time, if the product model is simply distinguished, only one peripheral device configuration parameter is saved in the BootLoader program, and the independent product types are exponentially increased, and the BootLoader is incompatible with each other, and the maintenance is extremely inconvenient. If a configuration parameter is saved for each combination of peripheral devices in the BootLoader program, the volume of the BootLoader will gradually become larger, which is not conducive to future upgrades and maintenance. SUMMARY OF THE INVENTION The main object of the present invention is to solve the problem of software version upgrade and maintenance based on different peripheral devices of the same model in an embedded system. To achieve the above objective, the embodiment of the present invention provides a software version upgrade method, which is applied to a board. The software version upgrade method includes the following steps: loading a second BootLoader that is set to upgrade the first BootLoader that is sintered in the FLASH chip to a memory chip; acquiring peripheral device configuration parameters of the first BootLoader in the FLASH chip, wherein the peripheral device configuration parameter is stored in a predetermined position of the FLASH chip; writing the peripheral device configuration parameter to the memory chip Corresponding parameter position of the second BootLoader, obtaining a second BootLoader including the peripheral device configuration parameter; writing a second BootLoader including the peripheral device configuration parameter to the Flash chip to replace the first BootLoader The upgrade method further includes: loading other files set to be upgraded to the memory chip, wherein the other files are upgrade files other than the second bootloader; writing the other files to the FLASH chip, Replace the corresponding old version file. Before the step of loading the second BootLoader of the first BootLoader that is sintered in the FLASH chip to the memory chip, the method further includes: establishing a mapping table, and establishing a one-to-one correspondence between the peripheral device and the peripheral device configuration parameter. Preferably, the loading is set to upgrade the second BootLoader of the first BootLoader that is sintered in the FLASH chip to the memory chip, and further includes a CRC check step. If the verification is successful, executing the peripheral device that acquires the first BootLoader in the FLASH chip. The step of configuring the parameter, the CRC checking step is: verifying whether the check value of the first BootLoader and the check value of the second BootLoader are the same, and if they are the same, the verification is successful. Preferably, the step of writing the peripheral device configuration parameter to a corresponding parameter position of the second BootLoader in the memory chip to obtain a second BootLoader including the peripheral device configuration parameter further includes a detecting step if the school If the verification succeeds, the step of writing the second BootLoader including the peripheral device configuration parameter to the Flash chip to replace the first BootLoader is performed, and the detecting step is: detecting the predetermined position of the first BootLoader Whether the corresponding parameter position of the second BootLoader is consistent, and if the positions are consistent, the detection is successful. In order to solve the above technical problem, the embodiment of the present invention further provides a board, where the board includes: a loading module, configured to load a second set to upgrade the first BootLoader sintered in the FLASH chip.

The BootLoader to the memory chip; the acquiring module is configured to obtain a peripheral device configuration parameter of the first BootLoader in the FLASH chip, wherein the peripheral device configuration parameter is stored in a predetermined position of the FLASH chip; the writing module is set to be written The peripheral device configuration parameter to a corresponding parameter position of the second BootLoader in the memory chip, to obtain a second BootLoader including the peripheral device configuration parameter; and further configured to write a second BootLoader including the peripheral device configuration parameter To the flash chip to replace the first BootLoader The board, the loading module, further includes a writing module, configured to load other files set to be upgraded to the memory chip, where the other files are upgrade files other than the second bootloader; It is also arranged to write the other file to the FLASH chip to replace the corresponding old version file. The board further includes a mapping module, configured to establish a mapping table, and establish a one-to-one correspondence between the peripheral device and the peripheral device configuration parameters. The board further includes a check module, and checks whether the check value of the first BootLoader and the check value of the second BootLoader are the same. If they are the same, the check succeeds. The board further includes a detecting module that detects the predetermined position and the second of the first BootLoader

Whether the corresponding parameter positions of the BootLoader are consistent. If the positions are consistent, the detection is successful. The software version upgrade method provided by the embodiment of the present invention includes the following steps: loading a second BootLoader that is set to upgrade the first BootLoader that is sintered in the FLASH chip to the memory chip; acquiring peripheral device configuration parameters of the first BootLoader in the FLASH chip, where The peripheral device configuration parameter is stored in a predetermined position of the FLASH chip; writing the peripheral device configuration parameter to a corresponding parameter position of the second BootLoader in the memory chip, to obtain a second parameter including the peripheral device configuration parameter The second bootloader that includes the peripheral device configuration parameter is written to the flash chip to replace the first bootloader. The software version upgrade method provided by the embodiment of the present invention can achieve the beneficial effect that the same model is upgraded subsequently. When the software of the product is upgraded, it is not necessary to upgrade the software of different types according to the peripheral devices. Only one configuration parameter and one upgrade version of the software can be reserved to solve the problem of compatibility with the peripheral devices during the software upgrade, thereby reducing the software upgrade and Maintenance troubles, realized costs Savings. 1 is a schematic flowchart of a first embodiment of a software version upgrade method according to the present invention; FIG. 2 is a schematic flowchart of a second embodiment of a software version upgrade method according to the present invention; FIG. 4 is a schematic structural view of an embodiment of a single board according to the present invention. The implementation, functional features, and advantages of the present invention will be further described with reference to the accompanying drawings. The specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. The present invention provides a software version upgrade method. Referring to FIG. 1, FIG. 1 is a schematic flowchart of a first embodiment of a software version upgrade method according to the present invention. In the first embodiment, the software version upgrade method includes: Step S100, loading settings To upgrade the second BootLoader of the first BootLoader sintered in the FLASH chip to the memory chip. The dual-use system adopts the "bootLoader+OS (Operating System)" structure, the BootLoader uses the uboot (Universal Boot Loader), and the OS uses the Linux system. When the BootLoader software is created, multiple BootLoader upgrade softwares may be created according to different types and sizes of peripheral devices and software upgrade methods. For example, the peripheral device may be a memory chip or a flash memory chip. In this embodiment, The memory chip uses a RAM chip, and the flash chip uses a Flash chip. The Flash chip and the RAM chip use chips of different sizes and different types. Among them, the optional Flash chip includes small page 256Mb Nand Flash and large page 1Gb Nand Flash. The selected RAM chip includes 1Gb DDR2 (Double Data Rate 2, four times data rate dynamic random access memory), 1Gb DDR3 (Double Data Rate 3, eight times data rate synchronous dynamic random access memory), 512Mb DDR2, 512Mb Four kinds of DDR3, the software writing method includes the flash chip burning mode and the single board upgrade mode. For the whole product of the dual-entry system, if the storage space is different, and the overall provided functional items are unchanged, then the product is in the The model will not change when naming, guarantee the flash chip and RAM chip in hardware. Small and model compatible, if you follow the existing software writing method, in terms of software, you need to be compatible with 8 types of peripheral chips and two different software writing methods, 8 sintering version software, 8 version upgrades are required. Software, at least 16 files need to be produced to ensure that the product is fully operational. In this example, as long as 8 sintered version software and 1 upgrade version software are produced, the product can be fully operated. Because the sintered version software is already written when the production line is mass-produced, only one is needed in the later product maintenance. The software upgrade is compatible with different peripheral devices. When the sintered version software is programmed, according to the configuration of the peripheral devices on the board, the board writes the first BootLoader of the corresponding version of the peripheral device and the kernel and file system of the OS into the address of the Flash chip, the core of the OS. And the file system can be directly written without modification. The peripheral device configuration parameters are placed in the predetermined position of the first BootLoader, and the board can start the sintered version software normally. When the software is upgraded and maintained, the board is connected to the network. The second BootLoader of the upgraded version is downloaded to the board through the network. The board has its own. In the Linux operating system, the board is loaded to upgrade the second BootLoader of the first BootLoader that is sintered in the FLASH chip to the memory chip. Step S200: Acquire peripheral device configuration parameters of the first BootLoader in the FLASH chip, where the peripheral device configuration parameters are stored in a predetermined position of the FLASH chip. The board obtains the peripheral device configuration parameters of the first BootLoader stored in the predetermined position of the FLASH chip, and the surrounding device configuration parameters and the current peripheral devices on the board can be matched. Step S300, writing the peripheral device configuration parameter to a corresponding parameter position of the second BootLoader in the memory chip, to obtain a second BootL _0a der including the peripheral device configuration parameter. During software upgrade and maintenance, the board saves the upgraded version software to the memory of the board. The upgrade version software does not add any parameters to the corresponding parameter position during the production. Before the upgrade, the board writes the peripheral device configuration parameters. Enter the corresponding parameter location of the second BootLoader of the upgraded version software to obtain a second BootLoader that includes the peripheral device configuration parameters. Step S400: Write a second BootLoader including the peripheral device configuration parameter to the Flash chip to replace the first BootLoader. The board temporarily stores the second configuration parameter of the peripheral device in the memory chip of the single board.

The BootLoader is written to the flash chip of the board. At this time, the peripheral device configuration parameters match the current peripheral devices of the board. The board can start the new version of the upgrade software normally. In the upgrade and maintenance of the software, only one upgrade software is required. Completion of compatibility with different peripheral devices. The software version upgrade method of the embodiment includes the following steps: Step S100: loading a second BootLoader that is set to upgrade the first BootLoader that is sintered in the FLASH chip to the memory chip; Step S200: Acquire a peripheral device configuration parameter of the first BootLoader in the FLASH chip The peripheral device configuration parameter is stored in a predetermined position of the FLASH chip; step S300, writing the peripheral device configuration parameter to a corresponding parameter position of the second BootLoader in the memory chip, to obtain the peripheral a second BootLoader of the device configuration parameter; Step S400, writing a second BootLoader including the peripheral device configuration parameter to the Flash chip to replace the first BootLoader. The software version upgrade method provided by this embodiment can achieve the beneficial effect that when upgrading the software of the same model, it is not necessary to upgrade different types of software according to different peripheral devices, and only one configuration parameter and one upgrade version are reserved. The software can solve the problem of compatibility with peripheral devices during software upgrade, thereby reducing the trouble of software upgrade and maintenance, and achieving cost savings. Referring to FIG. 2, FIG. 2 is a schematic flowchart of another embodiment of a software version upgrade method according to the present invention. In this embodiment, the upgrade method further includes: Step S100: loading other files set to be upgraded to a memory chip, where The other file is an upgrade file other than the second bootloader. When the software is upgraded, the board also loads other files set to be upgraded to the memory chip, where the other files include the kernel and file system of the OS. Step S400a, writing the other file to the FLASH chip to replace the corresponding old version file. The kernel and file system of the OS of the new version of the upgrade software can be directly written to the FLASH chip without modification, to replace the corresponding sintered version software. The software version upgrade method includes: Step S100A: Establish a mapping table, and establish a one-to-one correspondence between the peripheral device of the single board and the peripheral device configuration parameter. The board establishes a peripheral device configuration parameter mapping table, and the peripheral device configuration parameter mapping table establishes a one-to-one correspondence according to the type and size of different peripheral devices of the board and the peripheral device configuration parameters. For example, the type of the peripheral device may be a memory chip, In the embodiment, the memory chip uses a RAM chip, and the flash chip uses a Flash chip. The flash chip and the RAM chip use chips of different sizes and different types. Among them, the optional flash chip includes a small page 256Mb Nand. There are two types of Flash and large page 1Gb Nand Flash. The available RAM chips include 1Gb DDR2, 1Gb DDR3, 512Mb DDR2, and 512Mb DDR3. In terms of the design of the corresponding peripheral chip configuration parameters, according to the combination relationship, two different types. The peripheral chips need to exist at the same time, that is, 8 peripheral chip configuration parameters need to be made to ensure complete compatibility on the hardware when the product is fully operational. The board establishes a mapping table and identifies the type of the peripheral chip on the board, and the matching peripheral chip configuration parameters corresponding to the writing according to different peripheral chips of the board. With reference to FIG. 3, the embodiment provides a software version upgrade method. Before the step S200, the method further includes: Step S200A: Verifying whether the check value of the first BootLoader and the check value of the second BootLoader are the same. If they are the same, the verification is successful. The board performs a CRC check on the upgraded version of the software. If the checksum value of the second BootLoader stored in the upgraded version of the memory chip of the board is verified, the checksum of the first BootLoader in the software of the sintered version is the same. , the software that upgrades the software to be upgraded is the software that is upgraded, that is, the software is valid, and the verification is successful. The upgraded version software is written to the board's Flash chip. If it is detected that the check value of the second BootLoader in the upgraded version software is different from the check value of the first BootLoader in the sintered version software, it is determined that the upgraded version software is not a single. If the software required for the board, that is, illegal software, the verification fails, the peripheral device configuration parameters of the parameter position of the first BootLoader written to the sintered version software are not allowed to be removed. With reference to FIG. 3, the embodiment provides a software version upgrade method. Before the step S400, the method further includes: Step S400A: detecting whether the predetermined location of the first BootLoader and the corresponding parameter location of the second BootLoader are consistent. If the positions are consistent, the test is successful. When the BootLoader upgrade software is created, the location information consistency between the sintered version software and the upgraded version software should be maintained. When the software is upgraded, the location information is verified. If the first BootLoader in the sintered version software has the parameter location and If the corresponding parameter positions of the second BootLoader in the upgraded version are inconsistent, the combined upgraded version software is not allowed to be written into the Flash chip, and the sintered version software is replaced. The positional relationship includes the starting address and the offset. In order to be compatible with this verification, and other areas that cannot be modified, when the upgraded version of the software is produced, the location information should remain unchanged, but the usage still needs to be differentiated according to the actual configuration. For example, when reading and writing the Flash chip, the large page should be distinguished. And the small page type is read to a different address. As shown in FIG. 4, the embodiment further provides a single board, where the board includes: a loading module 20, configured to load a second BootLoader that is configured to upgrade the first BootLoader sintered in the FLASH chip to the memory chip; The obtaining module 40 is configured to acquire a peripheral device configuration parameter of the first BootLoader in the FLASH chip, where the peripheral device configuration parameter is stored in a predetermined position of the FLASH chip; and the writing module 50 is configured to write to the periphery Setting a device configuration parameter to a corresponding parameter location of the second BootLoader in the memory chip to obtain a second BootLoader including the peripheral device configuration parameter; further configured to write a second BootLoader including the peripheral device configuration parameter to the The Flash chip replaces the first BootLoader and the system uses the "BootLoader+OS (Operating System)" structure, the BootLoader uses the uboot (Universal Boot Loader), and the OS uses the Linux system. When the BootLoader software is created, multiple BootLoader upgrade softwares may be created according to different types and sizes of peripheral devices and software upgrade methods. For example, the peripheral device may be a memory chip or a flash memory chip. In this embodiment, The memory chip uses a RAM chip, and the flash chip uses a Flash chip, of which Flash The chip and RAM chip will use different sizes and different types of chips. Among them, the optional Flash chip includes small page 256Mb Nand Flash and large page 1Gb Nand Flash. The optional RAM chip includes 1Gb DDR2 (Double Data Rate 2, four Double data rate with dynamic random access memory), 1Gb DDR3 (Double Data Rate 3, 8 times data rate synchronous dynamic random access memory), 512Mb DDR2, 512Mb DDR3, software writing method including Flash chip burning mode And the board upgrade mode, for the overall product of the dual-entry system, if only the storage space is different, and the overall provided function items are unchanged, then the product model will not change when naming, and the Flash chip and the hardware are guaranteed. RAM chip size and model compatibility, if you follow the existing software writing method, in software, you need to be compatible with the 8 types of peripheral chips and two different software writing methods, you need 8 sintered version software, 8 copies For version upgrade software, you need to make at least 16 files to ensure that the product is fully operational. In this example, as long as 8 sintered version software and 1 upgrade version software are produced, the product can be fully operated. Because the sintered version software is already written when the production line is mass-produced, only one is needed in the later product maintenance. The software upgrade is compatible with different peripheral devices. When the sintered version software is programmed, according to the configuration of the peripheral devices on the board, the board writes the first BootLoader of the corresponding version of the peripheral device and the kernel and file system of the OS into the address of the Flash chip, the core of the OS. And the file system can be directly written without modification. The peripheral device configuration parameters are placed in the predetermined position of the first BootLoader, and the board can start the sintered version software normally. When the software is upgraded and maintained, the board is connected to the network. The second BootLoader of the upgraded version is downloaded to the board through the network. The board has its own Linux operating system, and the board loads the module 20. The loading is set to upgrade the flash in the FLASH chip. A BootLoader's second BootLoader to the memory chip. The board obtaining module 40 acquires peripheral device configuration parameters of the first BootLoader stored in a predetermined position of the FLASH chip, and the surrounding device configuration parameters and the current peripheral devices on the board can be matched. During software upgrade and maintenance, the board saves the upgraded version software to the memory of the board. The upgrade version software is not filled with any parameters in the corresponding parameter position. Before the upgrade, the board write module 50 will be peripheral. The device configuration parameter is written to the corresponding parameter location of the second BootLoader of the upgraded version software to obtain a second BootL _0a der including the peripheral device configuration parameter. The board write module 50 writes the second BootLoader that is temporarily stored in the board memory chip and includes the peripheral device configuration parameters, and writes the board to the board flash chip. At this time, the peripheral device configuration parameters match the current board peripheral devices. The board can start the new version of the upgrade software normally. That is, in the upgrade and maintenance of the later software, only one upgrade software is needed to complete the compatibility of different peripheral devices. The board provided in this embodiment includes: a loading module 20, configured to load a second BootLoader that is set to upgrade the first BootLoader sintered in the FLASH chip to the memory chip; and acquire the module 40, set to obtain a peripheral device configuration parameter of the first BootLoader in the FLASH chip, wherein the peripheral device configuration parameter is stored in a predetermined position of the FLASH chip; the writing module 50 is configured to write the peripheral device configuration parameter into the memory chip Corresponding parameter position of the second BootLoader, obtaining a second BootLoader including the peripheral device configuration parameter; further configured to write a second BootLoader including the peripheral device configuration parameter to the Flash chip, to replace the The first BootLoader. The beneficial effect that can be achieved in this embodiment is that when upgrading the software of the same model product, it is not necessary to upgrade different types of software according to different peripheral devices, and only one configuration parameter and one upgrade version software can be retained to solve the software. The problem of compatibility with peripheral devices during upgrades reduces the hassle of software upgrades and maintenance and achieves cost savings. With reference to FIG. 4, the board in this embodiment further includes a mapping module 10, configured to establish a mapping table, and establish a one-to-one correspondence between the peripheral devices of the single board and the peripheral device configuration parameters. The board mapping module 10 establishes a peripheral device configuration parameter mapping table, and the peripheral device configuration parameter mapping table establishes a one-to-one correspondence according to the type and size of different peripheral devices of the board and the peripheral device configuration parameters. For example, the type of the peripheral device may be a memory. The chip may also be a flash memory chip. In this embodiment, the memory chip uses a RAM chip, and the flash chip uses a flash chip, wherein the flash chip and the RAM chip use chips of different sizes and different types, wherein the optional flash chip includes small. Page 256Mb Nand Flash and P large page 1Gb There are 2 types of Nand Flash. The available RAM chips include 1Gb DDR2, 1Gb DDR3, 512Mb DDR2, 512Mb DDR3. In terms of the design of the corresponding peripheral chip configuration parameters, according to the combination relationship, Two different types of peripheral chips need to exist at the same time, that is, 8 peripheral chip configuration parameters need to be made to ensure complete compatibility on the hardware when the product is fully operational. The board establishes a mapping table and identifies the type of the peripheral chip on the board, and the matching peripheral chip configuration parameters corresponding to the writing according to different peripheral chips of the board. With reference to FIG. 4, the board in this embodiment further includes a verification module 30, and verifies whether the check value of the first BootLoader and the check value of the second BootLoader are the same. . The board verification module 30 performs a CRC check on the upgraded version software, if the checksum value of the second BootLoader stored in the upgraded version software of the board memory chip is verified, and the first BootLoader in the sintered version software is verified. If the checksum value is the same, the upgraded version of the software is the software to be upgraded. If the software is valid, the verification is successful. The software to be upgraded is written to the board. If the software is detected in the upgraded version. The checksum of the second BootLoader is different from the checksum of the first BootLoader in the software. The upgraded version of the software is not required by the board. If the software is illegal, the verification fails. Peripheral device configuration parameters into the parameter location of the first BootLoader of the sintered version software. With reference to FIG. 4, the board in this embodiment further includes a detecting module 60, configured to detect whether the predetermined position of the first BootLoader and the corresponding parameter position of the second BootLoader are consistent, and if the positions are consistent, The test was successful. When the BootLoader upgrade software is created, the location information consistency between the sintered version software and the upgraded version software should be maintained. When the software is upgraded, the detection module 60 checks the location information, if the first BootLoader in the sintered version software If the predetermined location and the corresponding parameter location of the second BootLoader in the upgraded version software are inconsistent, the combined upgraded version software is not allowed to be written into the Flash chip, and the sintered version software is replaced. The positional relationship includes the starting address and the offset. In order to be compatible with this verification, and other areas that cannot be modified, when the upgraded version of the software is produced, the location information should remain unchanged, but the usage still needs to be differentiated according to the actual configuration. For example, when reading and writing the Flash chip, the large page should be distinguished. And the small page type is read to a different address. The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalent structure or equivalent process transformations made by the description of the present invention and the drawings are used directly or indirectly in other related technical fields. The same is included in the scope of patent protection of the present invention. INDUSTRIAL APPLICABILITY As described above, a software version upgrade method and a board provided by an embodiment of the present invention have the following beneficial effects: When upgrading software of the same model product, it is not necessary to upgrade different types of software according to different peripheral devices. By retaining one configuration parameter and one upgraded version of the software, the problem of compatibility with peripheral devices during software upgrades can be solved, thereby reducing the trouble of software upgrade and maintenance, and achieving cost savings.

Claims

The software version upgrade method includes the following steps: loading a second BootLoader that is set to upgrade the first BootLoader that is sintered in the FLASH chip to the memory chip;

Obtaining a peripheral device configuration parameter of the first BootLoader in the FLASH chip, where the peripheral device configuration parameter is stored in a predetermined position of the FLASH chip;

Writing the peripheral device configuration parameter to a corresponding parameter position of the second BootLoader in the memory chip, to obtain a second BootLoader including the peripheral device configuration parameter;

Writing a second BootLoader containing the peripheral device configuration parameters to the Flash chip to replace the first BootLoader. The software version upgrade method of claim 1, wherein the upgrading method further comprises: loading other files set to be upgraded to the memory chip, wherein the other files are upgrades other than the second bootloader File; write the other file to the FLASH chip to replace the corresponding old version file. The software version upgrade method of claim 1, wherein the loading is set to upgrade the second BootLoader of the first BootLoader that is sintered in the FLASH chip to the memory chip, and further includes:

A mapping table is established to establish a one-to-one correspondence between the peripheral device and the peripheral device configuration parameters. The software version upgrade method according to claim 1, wherein the loading is set to upgrade the second BootLoader of the first BootLoader sintered in the FLASH chip to the memory chip, and further includes a CRC check step, if the verification is successful, Performing the step of acquiring peripheral device configuration parameters of the first BootLoader in the FLASH chip, where the CRC check step is:

Check whether the check value of the first BootLoader and the check value of the second BootLoader are the same. If they are the same, the check succeeds. The software version upgrade method according to any one of claims 1 to 4, wherein the writing the peripheral device configuration parameter to a corresponding parameter position of the second BootLoader in the memory chip, to obtain the peripheral The second BootLoader of the device configuration parameter further includes a detection step, if the school If the verification succeeds, the step of writing the second BootLoader including the peripheral device configuration parameter to the Flash chip to replace the first BootLoader is performed, and the detecting step is:

And detecting whether the predetermined position of the first BootLoader and the corresponding parameter position of the second BootLoader are consistent. If the locations are consistent, the detection is successful. A board, the board includes:

The loading module is configured to load a second BootLoader that is set to upgrade the first BootLoader that is sintered in the FLASH chip to the memory chip; and the acquiring module is configured to obtain a peripheral device configuration parameter of the first BootLoader in the FLASH chip, where the peripheral device The configuration parameter is stored in a predetermined position of the FLASH chip; the writing module is configured to write the peripheral device configuration parameter to a corresponding parameter position of the second BootLoader in the memory chip, to obtain a configuration parameter including the peripheral device The second BootLoader is further configured to write a second BootLoader including the peripheral device configuration parameter to the Flash chip to replace the first BootLoader. The board of claim 6, wherein the board, the loading module further includes a writing module, configured to load other files set to be upgraded to the memory chip, wherein the other files are An upgrade file other than the second bootloader; the write module is further configured to write the other file to the FLASH chip to replace the corresponding old version file. The board of claim 6, wherein the board further comprises a mapping module, configured to establish a mapping table, and establish a one-to-one correspondence between the peripheral device and the peripheral device configuration parameters. The board of claim 6, wherein the board further includes a verification module, and verifying whether the check value of the first BootLoader and the check value of the second BootLoader are the same. The verification is successful. The processor of any one of claims 6 to 9, wherein the board further includes a detecting module configured to detect the predetermined position of the first BootLoader and the corresponding correspondence of the second BootLoader Whether the parameter positions are consistent. If the positions are consistent, the detection is successful.