WO2015193763A1 - Wavelength converted light emitting device with small source size - Google Patents
Wavelength converted light emitting device with small source size Download PDFInfo
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- WO2015193763A1 WO2015193763A1 PCT/IB2015/054261 IB2015054261W WO2015193763A1 WO 2015193763 A1 WO2015193763 A1 WO 2015193763A1 IB 2015054261 W IB2015054261 W IB 2015054261W WO 2015193763 A1 WO2015193763 A1 WO 2015193763A1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Definitions
- Wavelength converted light emitting device with small source size Wavelength converted light emitting device with small source size
- the present invention relates to a wavelength converted semiconductor light emitting device.
- LEDs light emitting diodes
- RCLEDs resonant cavity light emitting diodes
- VCSELs vertical cavity laser diodes
- edge emitting lasers are among the most efficient light sources currently available.
- Materials systems currently of interest in the manufacture of high-brightness light emitting devices capable of operation across the visible spectrum include Group III-V semiconductors, particularly binary, ternary, and quaternary alloys of gallium, aluminum, indium, and nitrogen, also referred to as Ill-nitride materials.
- Ill-nitride light emitting devices are fabricated by epitaxially growing a stack of semiconductor layers of different
- MOCVD metal-organic chemical vapor deposition
- MBE molecular beam epitaxy
- the stack often includes one or more n-type layers doped with, for example, Si, formed over the substrate, one or more light emitting layers in an active region formed over the n-type layer or layers, and one or more p-type layers doped with, for example, Mg, formed over the active region. Electrical contacts are formed on the n- and p-type regions.
- Figs. 1 A, IB, 1C, and ID illustrate a method of forming a phosphor-converted LED, described in more detail in US 2013/0187174.
- a base 410 is provided and light emitting elements (LEEs) 210 are placed on or adhered to base 410 with contacts 220 adjacent to base 410.
- the LEEs 210 have a spacing 405 between adjacent elements.
- Base 410 may also be referred to as a "mold substrate.”
- base 410 includes or consists essentially of an adhesive film or tape.
- base 410 includes or consists essentially of a material to which has a relatively low adhesion to phosphor 230, that is, it permits removal of cured phosphor 230 from base 410.
- barriers 450 are formed. Barriers 450 are shown as perpendicular or substantially perpendicular to a surface 435. The spacing 405 between adjacent LEEs 210 may be adjusted to control the width of cured phosphor 230 around the sides of LEEs 210 as shown in Fig. ID.
- Spacing 405 between LEEs 210 is approximately determined by the sum of twice the desired sidewall thickness of the phosphor and the kerf (where the kerf is the width of the region removed during the singulation process of finished dies 200, for example identified as kerf 470 in Fig. ID.
- the thickness of cured phosphor 230 over the LEEs 210 may be controlled by controlling a thickness 425 of phosphor 420 that is formed or dispensed as shown in Fig. IB. Thickness 260 of cured phosphor 230 over LEE 210 is given
- Phosphor 420 includes or consists essentially of a phosphor and a binder. Phosphor 420 is contained or bounded by surface 435 of base 410 and optional sides or barriers 450. Phosphor 420 has a bottom surface or face 460 and a top surface or face 440, which are substantially parallel to each other.
- Phosphor 420 is then cured, producing cured phosphor 230 as shown in Fig.
- white dies 200 are separated or singulated from the structure shown in Fig. ID.
- White dies 200 may have a size ranging from about 0.25 mm to about 5 mm.
- a lighting structure includes a semiconductor light emitting device and a flat wavelength converting element attached to the semiconductor light emitting device.
- the flat wavelength converting element includes a wavelength converting layer for absorbing light emitted by the semiconductor light emitting device and emitting light of a different wavelength.
- the flat wavelength converting element further includes a transparent layer. The wavelength converting layer is formed on the transparent layer.
- a method includes forming a wavelength converting element including a wavelength converting layer disposed on a transparent layer.
- the wavelength converting element is then attached to a wafer of semiconductor light emitting devices.
- the wavelength converting element and the wafer of semiconductor light emitting devices are then diced to form a plurality of lighting elements.
- the plurality of lighting elements are then disposed on a handling substrate.
- a reflective material is disposed between the plurality of lighting elements.
- a method includes forming a wavelength converting element, the wavelength converting element including a wavelength converting layer disposed on a transparent layer.
- the wavelength converting element is then attached to a plurality of diced semiconductor light emitting devices disposed on a handling substrate.
- the wavelength converting element is then diced to form a plurality of lighting elements.
- Figs. 1 A, IB, 1C, and ID illustrate a method of forming a phosphor-converted light emitting element.
- Fig. 2 illustrates one example of a Ill-nitride LED.
- Fig. 3 illustrates a wavelength converting layer disposed on a transparent layer.
- Fig. 4 illustrates the structure of Fig. 3 attached to a wafer of LEDs.
- Fig. 5 illustrates the structure of Fig. 4 after dicing the wafer into individual LEDs, attaching the LEDs to a handling substrate, and forming a reflective material over the LEDs.
- Fig. 6 illustrates the structure of Fig. 5 after removing excess reflective material.
- Fig. 7 illustrates individual LEDs disposed on a handling substrate with a wavelength converting layer disposed on a transparent layer attached to the LEDs.
- Fig. 8 illustrates singulating two of the LEDs illustrated in Fig. 7.
- Fig. 9 illustrates the singulated LEDs of Fig. 7 disposed on a handling substrate, with a reflective material disposed over the LEDs.
- Fig. 10 illustrates the structure of Fig. 9 after removing excess reflective material.
- Fig. 1 1 illustrates the structure of Fig. 10 after removing the substrate from the wavelength converting layer.
- the devices illustrated in Fig. ID have a larger source size than the light emitting diode without the phosphor layer. Because of the large source size, the devices illustrated in Fig. ID may be less bright than the same amount of light emitted in a smaller source size. The large source size makes the devices illustrated in Fig. ID undesirable in some applications.
- Embodiments of the invention include wavelength converted devices with a relatively small source size, which may be inexpensive to manufacture.
- the semiconductor light emitting device are III- nitride LEDs that emits blue or UV light
- semiconductor light emitting devices besides LEDs such as laser diodes and semiconductor light emitting devices made from other materials systems such as other III-V materials, Ill-phosphide, Ill-arsenide, II-VI materials, ZnO, or Si- based materials may be used.
- Fig. 2 illustrates a Ill-nitride LED 1 that may be used in embodiments of the present invention.
- Any suitable semiconductor light emitting device may be used and embodiments of the invention are not limited to the device illustrated in Fig. 2.
- the device of Fig. 2 is formed by growing a Ill-nitride semiconductor structure on a growth substrate 10 as is known in the art.
- the growth substrate is often sapphire but may be any suitable substrate such as, for example, SiC, Si, GaN, or a composite substrate.
- a surface of the growth substrate on which the Ill-nitride semiconductor structure is grown may be patterned, roughened, or textured before growth, which may improve light extraction from the device.
- a surface of the growth substrate opposite the growth surface i.e. the surface through which a majority of light is extracted in a flip chip configuration
- the semiconductor structure includes a light emitting or active region sandwiched between n- and p-type regions.
- An n-type region 16 may be grown first and may include multiple layers of different compositions and dopant concentration including, for example, preparation layers such as buffer layers or nucleation layers, and/or layers designed to facilitate removal of the growth substrate, which may be n-type or not intentionally doped, and n- or even p-type device layers designed for particular optical, material, or electrical properties desirable for the light emitting region to efficiently emit light.
- a light emitting or active region 18 is grown over the n-type region. Examples of suitable light emitting regions include a single thick or thin light emitting layer, or a multiple quantum well light emitting region including multiple thin or thick light emitting layers separated by barrier layers.
- a p- type region 20 may then be grown over the light emitting region.
- the p-type region may include multiple layers of different composition, thickness, and dopant concentration, including layers that are not intentionally doped, or n-type layers.
- a p-contact is formed on the surface of the p-type region.
- the p- contact 21 often includes multiple conductive layers such as a reflective metal and a guard metal which may prevent or reduce electromigration of the reflective metal.
- the reflective metal is often silver but any suitable material or materials may be used.
- a portion of the p-contact 21, the p-type region 20, and the active region 18 is removed to expose a portion of the n-type region 16 on which an n-contact 22 is formed.
- the n- and p-contacts 22 and 21 are electrically isolated from each other by a gap 25 which may be filled with a dielectric such as an oxide of silicon or any other suitable material.
- n-contact vias may be formed; the n- and p-contacts 22 and 21 are not limited to the arrangement illustrated in Fig. 2.
- the n- and p-contacts may be redistributed to form bond pads with a dielectric/metal stack, as is known in the art.
- one or more interconnects 26 and 28 are formed on or electrically connected to the n- and p-contacts 22 and 21.
- Interconnect 26 is electrically connected to n-contact 22 in Fig. 2.
- Interconnect 28 is electrically connected to p-contact 21.
- Interconnects 26 and 28 are electrically isolated from the n- and p-contacts 22 and 21 and from each other by dielectric layer 24 and gap 27.
- Interconnects 26 and 28 may be, for example, solder, stud bumps, gold layers, or any other suitable structure.
- interconnects 26 and 28 are shown in the following figures as LED structure 12.
- the substrate 10 may be thinned or entirely removed.
- the surface of substrate 10 exposed by thinning is patterned, textured, or roughened to improve light extraction.
- the combined thickness of substrate 10 and LED structure 12 may be at least 50 ⁇ in some embodiments, no more than 500 ⁇ in some embodiments, at least 100 ⁇ in some embodiments, and no more than 250 ⁇ in some embodiments.
- the substrate 10 may be no more than 250 ⁇ thick in some embodiments, no more than 150 ⁇ thick in some embodiments, and at least 100 ⁇ thick in some embodiments.
- the wavelength converting element includes a support substrate 30 and a wavelength converting layer 32.
- the wavelength converting element is formed on a wafer scale, meaning that the wavelength converting element illustrated in Fig. 3 can be thought of as a wafer of many individual wavelength converting elements.
- the support substrate 30 becomes part of the light emitting device.
- the support substrate 30 may be transparent to the light emitted by the LED and/or the light emitted by the phosphor.
- the support substrate may also be sufficiently robust to withstand any processing steps that occur after attaching the wavelength converting element to an LED and to withstand the operating conditions of the light emitting device, and may be formed of a material that is optically suitable for the light emitting device.
- the support substrate 30 may be, for example, glass, silicone, polymer, polyethylene terephthalate (PET), or any other suitable material.
- the support substrate 30 is removed, and does not become part of the light emitting device.
- the support substrate 30 material is selected for cost and suitability for the processing steps to which the support substrate 30 is subjected. If the support substrate 30 is removed after processing, the support substrate need not be transparent.
- the wavelength converting layer 32 includes a wavelength converting material which may be, for example, conventional phosphors, organic phosphors, quantum dots, organic semiconductors, II-VI or III-V semiconductors, II-VI or III-V semiconductor quantum dots or nanocrystals, dyes, polymers, or other materials that luminesce.
- the wavelength converting material absorbs light emitted by the LED and emits light of one or more different wavelengths. Unconverted light emitted by the LED is often part of the final spectrum of light extracted from the structure, though it need not be.
- Examples of common combinations include a blue-emitting LED combined with a yellow-emitting wavelength converting material, a blue-emitting LED combined with green- and red-emitting wavelength converting materials, a UV-emitting LED combined with blue- and yellow-emitting wavelength converting materials, and a UV-emitting LED combined with blue-, green-, and red-emitting wavelength converting materials.
- Wavelength converting materials emitting other colors of light may be added to tailor the spectrum of light extracted from the structure.
- the wavelength converting layer 32 may include a transparent material such as silicone that is mixed with the wavelength converting material.
- the wavelength converting layer 32 is formed and attached to the support substrate 30 by any suitable technique.
- a wavelength converting layer 32 that is a wavelength converting material mixed with a transparent material is dispensed, screen printed, stenciled, spin-casted, laminated, molded or otherwise formed on a glass support substrate 30.
- the wavelength converting layer 32 may be formed by a process that includes curing, for example by exposing the wavelength converting layer to light and/or to elevated temperature.
- a laminated wavelength converting layer 32 may be cured at a temperature greater than 120 °C in some embodiments and less than 180 °C in some embodiments.
- the wavelength converting layer 32 is partially cured when it is disposed on the support substrate, and partially cured during a later processing step such as, for example, when it is attached to light emitting devices.
- the wavelength converting layer 32 may have a thickness of at least 30 ⁇ in some embodiments, no more than 100 ⁇ in some embodiments, at least 50 ⁇ in some embodiments, and no more than 80 ⁇ in some embodiments.
- the support substrate 30 may be thinner than the wavelength converting layer 32 in some embodiments, though this is not required.
- a transparent support substrate 30 such as glass may have a thickness of at least 10 ⁇ in some embodiments, at least 20 ⁇ in some embodiments, no more than 200 ⁇ in some embodiments, no more than 150 ⁇ in some embodiments, no more than 60 ⁇ in some embodiments, and no more than 50 ⁇ in some embodiments.
- the wavelength converting element illustrated in Fig. 3 is attached to a wafer of LEDs before the LED wafer is diced.
- the surface of the wavelength converting layer 32 opposite the support substrate 30 is attached to the surface of substrate 10 opposite the LED structures 12A - 12F.
- the wavelength converting element may be attached to the LED wafer by any suitable technique, such as gluing with silicone or any other suitable adhesive, or heating the wavelength converting element such that the transparent material in the wavelength converting layer 32 adheres to the substrate 10.
- the structure illustrated in Fig. 4 is then diced into individual LEDs, or groups of LEDs.
- the structure illustrated in Fig. 4 is diced for example by cutting through the support substrate 30, the wavelength converting layer 32, the substrate 10, and a portion of the LED structures 12A-12F in the regions 34 illustrated in Fig. 4.
- the layers may be cut together in a single cutting step, or individual layers may be separately cut in multiple cutting steps.
- the substrate 10 and LED structure 12 may be cut by, for example, scribing and breaking, before or after the support substrate 30 and wavelength converting layer 32 are cut by, for example, sawing. Any suitable cutting technique(s) may be used such as, for example, sawing, laser scribing, scribe-and-break, blade cutting, or any other suitable process.
- an LED wafer may include many more individual LEDs.
- the LEDs that were diced in Fig. 4 are placed on a handling substrate 40. Only a portion of a single handling substrate 40 including three LEDs 38 A, 38B, and 38C is illustrated in Fig. 5.
- the processes illustrated in Figs. 5 and 6 may be undertaken at a scale where hundreds or thousands of LEDs are disposed on a single handling substrate 40.
- the handling substrate 40 is any suitable structure from which the LEDs may be later removed, such as, for example, wafer handling tape.
- the LEDs may be spaced at least 100 ⁇ apart in some embodiments, at least 150 ⁇ apart in some embodiments, at least 200 ⁇ apart in some embodiments, and no more than 500 ⁇ apart in some embodiments.
- a reflective material 36 is disposed over LEDs 38 A, 38B, and 38C.
- Reflective material may be, for example, white or reflective particles such as Ti0 2 disposed in a transparent material.
- the reflective particles and the transparent material may form a contrast in index of refraction, which scatters and/or reflects light.
- the reflective material may be formed by any suitable technique; for example the reflective material may be molded, dispensed, laminated, or otherwise disposed over the LEDs.
- the excessive material 42 illustrated in Fig. 5 may be removed, as illustrated in Fig. 6.
- the excessive material 42 may be removed by any suitable technique, including dry bead blasting, wet bead blasting, grinding, polishing, mechanical techniques, or etching. After the excessive material is removed, the tops 46 of LEDs 38 A, 38B, and 38C are exposed.
- the top surface 46 is a surface of support substrate 30 opposite the wavelength converting layer 32.
- the technique for removing excessive material 42 is selected to roughen, polish, texture, or pattern the top surface 46, for example to improve light extraction from the device. Alternatively, the top surface may be roughened, polished, textured, or patterned in a separate processing step.
- the top surface 48 of reflective material 36 between LEDs is at the same level as the top surface of LEDs 38A, 38B, 38C.
- the top surface 48 of reflective material 36 between LEDs is at a different level than the top surface of LEDs 38A, 38B, 38C.
- the top surface 48 of reflective material 36 between LEDs may be below the top surface of LEDs 38A, 38B, 38C. Reducing the thickness of the reflective material to below the top surface of the LEDs may be useful, for example, in embodiments as described below where the support substrate 30 is removed after forming the reflective material.
- the LEDs may then be separated into individual devices or groups of devices by cutting the reflective material between LEDs, for example in regions 50 illustrated in Fig. 6.
- the LEDs may then be removed from the handling substrate 40 by any technique suitable to the particular handling substrate used. Because reflective material 36 is disposed on the sides of the LED, light is extracted from the final device primarily through the top surface of the LED (the surface of the support substrate 30 of the wavelength converting member in the embodiment illustrated in Fig. 6).
- the thickness of the reflective material on the sides of the LEDs after cutting may be at least 30 ⁇ in some embodiments, at least 50 ⁇ in some embodiments, at least 100 ⁇ in some embodiments, and no more than 500 ⁇ in some embodiments.
- the wavelength converting element wafer illustrated in Fig. 3 is attached to a group of LEDs after the LEDs are separated from a wafer of LEDs.
- the LED wafer is diced before the wavelength converting element wafer. It may be difficult to simultaneously dice the wavelength converting element and the LED wafer, as described above in reference to Fig. 4.
- Fig. 7 previously diced LEDs are disposed on a handling substrate 40. Only a portion of a single handling substrate 40 including four LEDs 52A, 52B, 52C, and 52D is illustrated in Fig. 7. The processes illustrated in Figs. 7-1 1 may be undertaken at a scale where hundreds of LEDs are disposed on a single handling substrate 40.
- the handling substrate 40 is any suitable structure from which the LEDs may be later removed, such as, for example, wafer handling tape.
- a wavelength converting element wafer as described above in Fig. 3, is attached to a top surface of the LEDs by any appropriate material or technique.
- the wavelength converting element wafer may be attached such that the wavelength converting layer 32 is disposed between the LEDs and the support substrate 30, as illustrated in Fig. 7, though the opposite orientation, where the support substrate 30 is disposed between the LEDs and the wavelength converting layer 32, is also possible.
- the wavelength converting element wafer is then cut in regions 51 to form single devices or groups of devices. Cutting the wavelength converting element wafer between two LEDs 52A and 52B is illustrated in Fig. 8.
- the wavelength converting member over a single LED is preferably as close as possible to the size of the top surface of the LED, in order to limit the source size and thereby improve the efficiency of the device.
- the width of the kerf may vary depending on the cutting technique used.
- a kerf 56 formed by, for example, sawing may be no more than 75 ⁇ wide in some embodiments, no more than 50 ⁇ wide in some embodiments, no more than 25 ⁇ wide in some embodiments, and at least 10 ⁇ wide in some embodiments.
- the spacing 54 between neighboring devices may be no more than 150 ⁇ in some embodiments, no more than 100 ⁇ in some embodiments, no more than 50 ⁇ in some embodiments, and at least 30 ⁇ in some embodiments.
- the overhang 58, or the length that the wavelength converting member extends out beyond the LED after cutting, may be no more than 50 ⁇ in some embodiments, no more than 30 ⁇ in some embodiments, no more than 20 ⁇ in some embodiments, and at least 10 ⁇ in some embodiments.
- the wavelength converting layer 32 over each LED is substantially flat in that it does not extend down over the sides of the LED.
- the area of the wavelength converting layer is larger than the area of the top surface of the LED.
- the area of the wavelength converting layer may be at least 100 % of the area of the top surface of the LED in some embodiments, at least 1 10 % of the area of the top surface of the LED in some embodiments, no more than 125 % of the area of the top surface of the LED in some embodiments, no more than 150 % of the area of the top surface of the LED in some embodiments, and no more than 200 % of the area of the top surface of the LED in some embodiments.
- the area of the wavelength converting layer is the same as the area of the top surface of the LED, or even slightly smaller than the area of the top surface of the LED.
- the LEDs 60A, 60B and 60C are removed from the handling substrate 40 and placed on a different handling substrate 41.
- the different handling substrate 41 may be any suitable material and may be the same type of handling substrate as handling substrate 40, such as, for example, wafer handling tape.
- the LEDs may be left on the handling substrate 40 illustrated in Fig. 8, which may be stretched to space the LEDs further apart.
- the LEDs in Fig. 9 may be spaced at least 100 ⁇ apart in some embodiments, at least 150 ⁇ apart in some embodiments, at least 200 ⁇ apart in some embodiments, and no more than 500 ⁇ apart in some embodiments.
- a reflective material 36 is molded over the LEDs, as described above in reference to Fig. 5.
- Fig. 10 excessive reflective material over the tops of the LEDs is removed, as described above in reference to Fig. 6. As described above in reference to Fig. 6, after the excessive material is removed, the tops 64 of LEDs 60A, 60B, and 60C are exposed.
- the top surface 64 is a surface of support substrate 30 opposite the wavelength converting layer 32.
- the technique for removing excessive reflective material is selected to roughen, polish, texture, or pattern the top surface 64, for example to improve light extraction from the device.
- the top surface 62 of reflective material 36 between LEDs is at the same level as the top surface of LEDs 60A, 60B, 60C. In some embodiments, as illustrated in Fig. 10, after removing the excessive reflective material, the top surface 62 of reflective material 36 between LEDs is at a different level than the top surface 64 of LEDs 60A, 60B, 60C. In particular, the top surface 62 of reflective material 36 between LEDs may be below the top surface 64 of LEDs 60A, 60B, 60C. Reducing the thickness of the reflective material to below the top surface of the LEDs may be useful, for example, in embodiments as described below where the support substrate 30 is removed after forming the reflective material.
- the reflective material may be cut in regions 68 to form individual LEDs or groups of LEDs, then the devices are removed from the handling substrate 41, as described above in reference to Fig. 6.
- Fig. 1 1 illustrates a device where the support substrate 30 is removed from the wavelength converting layer 32.
- the support substrate 30 is removed from the devices.
- the support substrate may be a material that is selected for ease of removal.
- the support substrate may be PET.
- a layer of adhesive such as a silicone adhesive or a thermal release adhesive may be disposed between the wavelength converting layer 32 and the support substrate 30 when the wavelength converting element illustrated in Fig. 3 is formed.
- the support substrate pieces 30 illustrated in Figs. 6 or 10 may be removed by, for example, tape-to-tape transfer, thermal release, or any other suitable technique, resulting in the structure illustrated in Fig. 1 1.
- the top surface 66 of each of the three LEDs 72A, 72B, and 72C is a surface of the wavelength converting layer 32.
- the surface of wavelength converting layer 32 may be textured, patterned, or roughened, for example to improve light extraction, during or after the removal of the support substrate.
- the reflective material may be thinned such that after removing the support substrate, the top surface 66 of the LEDs is at substantially the same level as the top surface 62 of the reflective material 36, though this is not required - the top surfaces 66 of the LEDs may be above or below the top surface 62 of the reflective material.
- the reflective material between LEDs is cut in regions 70, to separate the devices into individual LEDs or groups of LEDs.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Optical Filters (AREA)
- Led Devices (AREA)
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
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CN201580044286.6A CN106575693B (en) | 2014-06-19 | 2015-06-05 | Wavelength converted light emitting device with small source size |
US15/318,143 US10090444B2 (en) | 2014-06-19 | 2015-06-05 | Wavelength converted light emitting device with small source size |
JP2016573841A JP2017520118A (en) | 2014-06-19 | 2015-06-05 | Wavelength-converted light-emitting device with small light source |
EP15730288.6A EP3158594A1 (en) | 2014-06-19 | 2015-06-05 | Wavelength converted light emitting device with small source size |
KR1020177001561A KR102408839B1 (en) | 2014-06-19 | 2015-06-05 | Wavelength converted light emitting device with small source size |
US16/042,660 US20180331261A1 (en) | 2014-06-19 | 2018-07-23 | Wavelength converted light emitting device with small source size |
US16/890,655 US11133442B2 (en) | 2014-06-19 | 2020-06-02 | Wavelength converted light emitting device with small source size |
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US201462014288P | 2014-06-19 | 2014-06-19 | |
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US201615318143A Continuation | 2014-06-19 | 2016-12-12 | |
US16/042,660 Continuation US20180331261A1 (en) | 2014-06-19 | 2018-07-23 | Wavelength converted light emitting device with small source size |
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EP (1) | EP3158594A1 (en) |
JP (3) | JP2017520118A (en) |
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CN (2) | CN106575693B (en) |
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Also Published As
Publication number | Publication date |
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EP3158594A1 (en) | 2017-04-26 |
JP7136834B2 (en) | 2022-09-13 |
TWI663752B (en) | 2019-06-21 |
US20200295241A1 (en) | 2020-09-17 |
KR20170023097A (en) | 2017-03-02 |
CN106575693B (en) | 2020-07-31 |
US10090444B2 (en) | 2018-10-02 |
TW201608739A (en) | 2016-03-01 |
TW201933632A (en) | 2019-08-16 |
CN106575693A (en) | 2017-04-19 |
KR102408839B1 (en) | 2022-06-14 |
US20180331261A1 (en) | 2018-11-15 |
JP2020145472A (en) | 2020-09-10 |
CN111816750A (en) | 2020-10-23 |
JP2022177058A (en) | 2022-11-30 |
JP2017520118A (en) | 2017-07-20 |
US20170133559A1 (en) | 2017-05-11 |
TWI734110B (en) | 2021-07-21 |
US11133442B2 (en) | 2021-09-28 |
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