WO2015193129A3 - Elektronikmodul mit einer vorrichtung zur wärmeabführung von durch eine in einem kunststoffgehäuse angeordnete halbleitereinrichtung erzeugter wärme und verfahren zur herstellung eines elektronikmoduls - Google Patents

Elektronikmodul mit einer vorrichtung zur wärmeabführung von durch eine in einem kunststoffgehäuse angeordnete halbleitereinrichtung erzeugter wärme und verfahren zur herstellung eines elektronikmoduls Download PDF

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Publication number
WO2015193129A3
WO2015193129A3 PCT/EP2015/062635 EP2015062635W WO2015193129A3 WO 2015193129 A3 WO2015193129 A3 WO 2015193129A3 EP 2015062635 W EP2015062635 W EP 2015062635W WO 2015193129 A3 WO2015193129 A3 WO 2015193129A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronics module
semiconductor unit
plastic housing
heat generated
production
Prior art date
Application number
PCT/EP2015/062635
Other languages
English (en)
French (fr)
Other versions
WO2015193129A9 (de
WO2015193129A2 (de
Inventor
Thomas Schneider
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to CN201580033048.5A priority Critical patent/CN106463487B/zh
Priority to US15/317,140 priority patent/US9842796B2/en
Publication of WO2015193129A2 publication Critical patent/WO2015193129A2/de
Publication of WO2015193129A3 publication Critical patent/WO2015193129A3/de
Publication of WO2015193129A9 publication Critical patent/WO2015193129A9/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49537—Plurality of lead frames mounted in one device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Die Erfindung betrifft ein Elektronikmodul mit einer in einem Kunststoffgehäuse (12) angeordneten Halbleitereinrichtung (14), einer elektrisch leitfähigen Plattenanordnung (16), über welche die Halbleitereinrichtung (14) mit elektrischer Leistung versorgbar ist, wobei die elektrisch leitfähige Plattenanordnung (16) mit einer Wärme erzeugenden integrierten Schaltung (14b) der Halbleitereinrichtung (14) über einen Wärmekoppler (18) flächig verbunden ist, und wobei die elektrisch leitfähige Plattenanordnung (16) derart gestaltet ist, dass sie die durch die Wärme erzeugende integrierte Schaltung (14b) der Halbleitereinrichtung (14) erzeugte Wärme an das Kunststoffgehäuse (12) abführt. Die Erfindung betrifft des Weiteren ein Verfahren zur Herstellung eines entsprechenden Elektronikmoduls.
PCT/EP2015/062635 2014-06-17 2015-06-08 Elektronikmodul mit einer vorrichtung zur wärmeabführung von durch eine in einem kunststoffgehäuse angeordnete halbleitereinrichtung erzeugter wärme und verfahren zur herstellung eines elektronikmoduls WO2015193129A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201580033048.5A CN106463487B (zh) 2014-06-17 2015-06-08 具有导热装置的电子模块和制造电子模块的方法
US15/317,140 US9842796B2 (en) 2014-06-17 2015-06-08 Electronic module including a device for dissipating heat generated by a semiconductor unit situated in a plastic housing and method for manufacturing an electronic module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014211524.8 2014-06-17
DE102014211524.8A DE102014211524B4 (de) 2014-06-17 2014-06-17 Elektronikmodul mit einer Vorrichtung zur Wärmeabführung von durch eine in einem Kunststoffgehäuse angeordnete Halbleitereinrichtung erzeugter Wärme und Verfahren zur Herstellung eines Elektronikmoduls

Publications (3)

Publication Number Publication Date
WO2015193129A2 WO2015193129A2 (de) 2015-12-23
WO2015193129A3 true WO2015193129A3 (de) 2016-10-27
WO2015193129A9 WO2015193129A9 (de) 2017-06-22

Family

ID=53298378

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/062635 WO2015193129A2 (de) 2014-06-17 2015-06-08 Elektronikmodul mit einer vorrichtung zur wärmeabführung von durch eine in einem kunststoffgehäuse angeordnete halbleitereinrichtung erzeugter wärme und verfahren zur herstellung eines elektronikmoduls

Country Status (4)

Country Link
US (1) US9842796B2 (de)
CN (1) CN106463487B (de)
DE (1) DE102014211524B4 (de)
WO (1) WO2015193129A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017110039A1 (de) * 2016-10-14 2018-04-19 Preh Gmbh Gehauste Schalteinheit für ein Fahrzeug mit verbesserter Wärmeabfuhr
US10939584B1 (en) * 2019-08-22 2021-03-02 Getac Technology Corporation Heat dissipation module and assembly method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6008074A (en) * 1998-10-01 1999-12-28 Micron Technology, Inc. Method of forming a synchronous-link dynamic random access memory edge-mounted device
DE102004021838A1 (de) * 2004-05-04 2005-09-08 Infineon Technologies Ag Halbleiterbauelement mit Kühlvorrichtung
US20090072360A1 (en) * 2007-09-18 2009-03-19 Denso Corporation Molded semiconductor device including IC-chip covered with conductor member
WO2014019780A1 (de) * 2012-08-01 2014-02-06 Saint-Gobain Glass France Verbundscheibe mit elektrischer kontaktierung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1213726A (en) 1968-01-26 1970-11-25 Ferranti Ltd Improvements relating to electrical circuit assemblies
US4829403A (en) 1987-01-20 1989-05-09 Harding Ade Yemi S K Packaging arrangement for energy dissipating devices
FR2620296B1 (fr) 1987-09-03 1990-01-19 Bendix Electronics Sa Boitier pour circuit electronique
DE19910500A1 (de) 1999-03-10 2000-10-05 Bosch Gmbh Robert Elektrisches Gerät
DE10144324A1 (de) 2001-09-10 2003-03-27 Delphi Tech Inc Elektrisches Modul
US9299634B2 (en) * 2006-05-16 2016-03-29 Broadcom Corporation Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages
US9013035B2 (en) * 2006-06-20 2015-04-21 Broadcom Corporation Thermal improvement for hotspots on dies in integrated circuit packages
DE202009000615U1 (de) 2009-01-15 2010-05-27 Danfoss Silicon Power Gmbh Formmassenvergossenes Leistungshalbleiterelement
DE102010002950A1 (de) 2010-03-17 2011-09-22 Robert Bosch Gmbh Schaltungsanordnung und zugehöriges steuergerät für ein kraftfahrzeug
DE102010030838A1 (de) 2010-07-02 2012-01-05 Robert Bosch Gmbh Halbleiterbauteil mit verbesserter Wärmeabfuhr
US10109584B2 (en) * 2014-09-02 2018-10-23 Qualcomm Incorporated Patterned grounds and methods of forming the same
US9674985B1 (en) * 2015-11-24 2017-06-06 Cisco Technology, Inc. Dual purpose wireless device packaging

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6008074A (en) * 1998-10-01 1999-12-28 Micron Technology, Inc. Method of forming a synchronous-link dynamic random access memory edge-mounted device
DE102004021838A1 (de) * 2004-05-04 2005-09-08 Infineon Technologies Ag Halbleiterbauelement mit Kühlvorrichtung
US20090072360A1 (en) * 2007-09-18 2009-03-19 Denso Corporation Molded semiconductor device including IC-chip covered with conductor member
WO2014019780A1 (de) * 2012-08-01 2014-02-06 Saint-Gobain Glass France Verbundscheibe mit elektrischer kontaktierung

Also Published As

Publication number Publication date
CN106463487B (zh) 2019-12-31
US9842796B2 (en) 2017-12-12
US20170125326A1 (en) 2017-05-04
DE102014211524B4 (de) 2022-10-20
WO2015193129A9 (de) 2017-06-22
WO2015193129A2 (de) 2015-12-23
CN106463487A (zh) 2017-02-22
DE102014211524A1 (de) 2015-12-17

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