Classifications

• • A—HUMAN NECESSITIES
  • A63—SPORTS; GAMES; AMUSEMENTS
  • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
  • A63H33/00—Other toys
  • A63H33/04—Building blocks, strips, or similar building parts
  • A63H33/042—Mechanical, electrical, optical, pneumatic or hydraulic arrangements; Motors

Definitions

• the present invention relates to a device, a device assembly and a method for manufacturing a device according to independent claims 1, 9 and 12.
• Blocks are known as individual modules which can be easily interconnected to thereby build models on a reduced scale. These building blocks can be stacked or coupled one above the other, side by side or in each case offset in order to emulate any objects or models.
• the blocks each comprise coupling elements by means of which the blocks can be removed by frictional connection
• Building blocks can assume a cuboid shape of different extent, with which, for example, walls of a house to be imitated are constructed in miniature format.
• Further exemplary modules can be a
• Lego bricks are connected in appropriate ways to play on a playful and mentally
• LEDs light-emitting diodes
• These light-emitting diodes are hereby integrated into individual modular components and are used, for example, to emulate real-appearing headlamps, direction indicators or taillights of vehicles of all kinds to be set up.
• the use of an electric motor integrated in a module is just as varied and can be used, for example, in real life
• Any electrical or electronic device e.g. a light emitting diode device or a device with a
• Cable lines are led out of the respective blocks and each with standardized termination modules
• the disadvantage is the wiring itself. On the one hand, the wiring disturbs the appearance of the built-up
• the object of the present invention is to provide a device, a device assembly and a method for manufacturing a device, in which the disadvantages of the prior art are solved.
• a building block comprises a base body with coupling elements for removably coupling the building block with at least one further building block, furthermore comprises a plurality of conductor tracks, wherein
• Conductor tracks with respective interconnects of adjacent further coupled modules are electrically connected.
• Block passed.
• the conductor tracks are in this case on surfaces of the respective blocks plotted that the respective corresponding tracks of different components electrically
• the interconnects are using the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology on the MID (Molded Interconnect Device) technology
• MID technology used in interconnects enables high integration even with the smallest dimensions.
• the MID technology By applying the MID technology, the
• MID technology also reduces production costs. Due to the MID technology, it is basically possible to attach the power supply directly to the components, ie to the substrate of the Building blocks, for example, acrylonitrile-butadiene-styrene (ABS) uraankt.
• Blocks are then lasered onto the tracks, these are then galvanized and thus brought to conductivity and possibly equipped with components.
• the power line can be connected via the mating of these blocks from the power source to the consumer on.
• the base body comprises an electrical
• the opposing interconnects are electrically isolated from each other by the substrate or material of the device, such as plastic. Because the applied voltage is a low voltage
• Building blocks of the aforementioned type are usually produced or cast by injection molding of thermoplastic material (substrate), which simultaneously excellent insulator and provides sufficient resistance to voltage breakdown.
• the conductor tracks are applied on the respective surfaces at least circumferentially.
• Blocks electrically conductive so that the electrical connection with each adjacent, corresponding blocks can be ensured.
• the traces do not need the entire surface on the surfaces
• the module comprises at least one
• the electrical or electronic components have a low
• the electrical or electronic component comprises at least two electrical inputs, which are each electrically connected to the opposite conductor tracks.
• the electrical or electronic component comprises at least two electrical inputs, which are each electrically connected to the opposite conductor tracks.
• the electrical or electronic component comprises a lighting unit, in particular a
• LED Light emitting diode
• switch a switch
• button a button
• electric motor a display unit
• display unit a display unit
• electroacoustic transducer and / or electronic
• Switching unit in particular a miniature processor.
• the electrical or electronic components which are integrated in the module can be reliably supplied with voltage without any conductor wire.
• the device further comprises at least one label applied using MID technology.
• MID technology is the high-quality labeling of components or elements in general.
• adhesive films for labeling the blocks can be saved, their disadvantages in the rapid aging and
• the above object is also achieved by a device arrangement according to independent claim 9.
• the inventive device arrangement comprises a plurality of coupled components according to one of claims 1 to 8, which are coupled to each other such that on each opposite surfaces of the blocks applied conductor tracks are each electrically connected to each other.
• This block arrangement offers in addition to advantageous structural or design
• an electrical or electronic component can be supplied via the conductor tracks as an electrical conductor easily with electrical power.
• an electrical voltage is applied between the opposing interconnects of this module only on one of the components.
• the opposing tracks are electrically isolated from each other by the material of the device.
• a current can flow across the tracks and through the respective integrated electrical component, e.g. a light-emitting diode, fHessen.
• the package arrangement further comprises
• At least one electrical power source for applying a voltage between two on opposite
• the applied voltage can include discrete voltages.
• the voltage may be stepwise variable, for example from 0V to 12V.
• the block arrangement allows a
• Modularization of functions in the building blocks such as lighting, motor functions, etc., and combines the basic principle of assembling an assembly or a construction by multiple blocks with simultaneous power management structure.
• the electrical power source comprises a voltage transformer, at least one battery or a rechargeable battery and / or at least one solar cell.
• a voltage transformer at least one battery or a rechargeable battery and / or at least one solar cell.
• the above object is also achieved by a method for producing a device according to one of claims 1 to 8 according to independent claim 12.
• the inventive method comprises an injection molding of a base body, and an application of at least one
• the traces are formed using the MID technology on the surfaces of the package
• a very significant advantage of using the MID technology is in accurately positioning the electrical components, e.g. Lighting units,
• Illumination patterns and displays are integrated by the MID technology, directly on the material or substrate of the building blocks.
• the method comprises applying at least one label to at least one
• Figure 1 is a representation of a block according to the prior art in a perspective view
• FIG. 2 shows a representation of a module according to the invention in perspective view
• FIG. 3 shows a representation of the module according to the invention in a further embodiment in FIG
• FIG. 4 shows a representation of the module according to the invention in a further embodiment in FIG.
• FIG. 5 shows a representation of the module according to the invention in a further embodiment in FIG.
• FIG. 6 shows a block arrangement according to the invention in FIG.
• Figure 7 is a view of a wiring arrangement for
• FIG. 1 shows a module 10 according to the prior art
• This building block 10 also known as Lego stone, is a so-called 3 1
• the module 10 shown in Figure 1 comprises three nubs 12 in a row.
• This module 10 is hollowed out and comprises in the hollowed-out interior, a plurality of tubes (not shown), which are in the one shown in FIG.
• These tubes are in this case designed such that they with nubs of a couplable below the block 10 block a frictional connection and
• outer surfaces of nubs of a building block can be
• the blocks are in this case positively connected in the vertical direction, while they form fit in the horizontal direction
• the component 10 shown in FIG. 1 is part of a modular system.
• Other devices may include an I-1 device, a 2-by-2 device, a 4-by-2 device, and so on. Due to the high degree of freedom of the coupling of the modular building blocks with each other, there are no limits to designing or constructing different building block arrangements on a reduced scale, for example houses, vehicles, airplanes, etc.
• the building blocks can be colored differently, so that also color Aspects can be considered.
• the module 10 shown in Figure 1 is made of plastic, for example, acrylonitrile-butadiene-styrene (ABS). For the production of the module 10 is suitable
• FIG. 2 shows a block 100 according to the invention in a perspective view.
• the module 100 comprises a main body 102 and three nubs 104 for coupling the
• Base 102 in the orientation shown in the figure each include a conductive trace 106, 106 'of conductive metal.
• MID technology For applying the conductor tracks 106, 106 ', the MID technology is used.
• various MID methods can be used, the most common of which are briefly explained below:
• the plastic substrate is metallized and structured in one step.
• Plastic substrate pressed.
• the substrate is melted by the heat at the surface.
• Conductors are sheared out of the copper foil and connected to the substrate.
• Conditioning process under temperature goes the primer a chemical bond with the substrate surface and ensures good adhesion. During this process, the film is simultaneously formed. Subsequently, the film is placed in an injection molding machine and
• Plastic still to be treated.
• the sprue is placed again in a mold and not with
• Substrate serves a plastic injection molded part, in which the surface is first prepared for pickling by pickling or etching. Subsequently, the
• Metallization For structuring, a photoresist is applied and exposed through a three-dimensional mask with UV light. After development of the photoresist, the exposed metal layer is galvanically reinforced and coated with an etching mask. After removal of the photoresist, the remaining metal is etched away and then the surface is finished. In contrast to the mask method, the direct laser structuring structures the etching resist directly with the laser. At the locations where the etch resist was removed by the laser, the metal is etched away.
• the two interconnects 106, 106 ' are advantageously formed by the material or substrate of the main body 102, for example acrylonitrile-butadiene-styrene (ABS),
• a device array having two opposing surfaces is provided, the interconnect sections being separated from each other
• Module with an integrated electrical component are supplied with voltage, without requiring an external wiring between this component and a
• FIG. 3 shows the module 100 according to the invention in a first embodiment.
• This device 100 includes an integrated electrical switch as an example of an electrical component. Same as in Figure 2
• the edge portion of the two surfaces with the conductor tracks 106, 106 ' is provided.
• the electrical switching element is inside the
• Basic body 102 is integrated or cast in and can be switched on or off by actuation on the front surface. For example, by a
• FIG. 4 shows a building block 100 according to the invention in a further embodiment. According to the invention are on both surfaces of the body 102 respectively
• the package 100 includes two illumination units 108, 108 as an example of an electrical component.
• Lighting units 108, 108 ⁇ may for example be designed as light emitting diodes (LED).
• LED light emitting diodes
• Voltage inputs of the two illumination units 108, 108 ⁇ extend within the main body 102 to the respective interconnects 106, 106 ⁇ (not shown). When a voltage is applied between the two conductor tracks 106, 106, the two illumination units 108, 108 ⁇ can thus be illuminated.
• a significant advantage is that, in the case of an arrangement of this module 100 with a variety of others
• FIG. 5 shows the module 100 according to the invention in a further embodiment in a sectional view in a horizontal plane.
• This module 100 includes, integrated or embedded in the interior of the body 102, two schematically illustrated processor units 110, 110 ', whose electrical inputs are each electrically connected to the conductor tracks 106, 106 ⁇ .
• these processor units 110, 110 are ⁇ supplied via the tracks 106, 106 ⁇ with voltage.
• FIG. 6 shows a package arrangement 200 in one
• the module arrangement 200 is composed of a plurality of individual modules 100, which, coupled together in the vertical direction, are non-positively coupled (vertically) and positively (horizontally) to one another.
• electrically conductive tracks 106, 106 ⁇ are applied, which are each electrically connected to tracks of both adjacent to each other or over or attached to each other building blocks.
• the package arrangement 200 comprises a module 100, which is equipped with lighting units 108, 108 ⁇ , which are integrated directly in the module 100 and emit their light directed upwards.
• Lighting units 108, 108 ⁇ are also not shown via conductor connections each with the
• Lighting units 108, 108 simply and reliably lit up once at any point
• FIG. 7 shows an exemplary prior art wiring arrangement 300. More specifically, a view of a wiring assembly 300 for wiring a device-integrated electrical device according to the prior art is shown.
• two light-emitting elements 310, 310 as ⁇ miniature headlights of a block assembly for constructing a miniature vehicle (not shown) are performed.
• To supply power to these luminous elements 310, 310 serve two cable strands 320, 320 which are each paired in the form of dual ribbon cables to a first adapter module 330 out.
• Both adapter blocks 330, 350 (not shown) having electrical contacts may be provided, via which the two light-emitting elements 310, 310 ⁇ , either individually or can be supplied with voltage in common.
• a disadvantage of this wiring arrangement 300 is the unsightly wiring itself, which disturbs the appearance of a painstakingly constructed block arrangement.
• the wiring can be difficult to implement, especially if the cable strands 320, 320 ', 340 must be installed in a greatly reduced space within the device block.
• Another disadvantage is a high probability of faulty cabling. Another source of error is that the

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• Illuminated Signs And Luminous Advertising (AREA)
• Toys (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=52011162

Family Applications (1)

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Families Citing this family (2)

Citations (5)

• 2014
  • 2014-06-03 CH CH00845/14A patent/CH709778A2/de not_active Application Discontinuation
  • 2014-11-20 WO PCT/EP2014/075117 patent/WO2015185167A1/de active Application Filing
• 2015
  • 2015-06-01 TW TW104117658A patent/TW201545794A/zh unknown

Patent Citations (5)

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