WO2015181680A1 - Information processing device - Google Patents

Abstract

Provided is a novel input/output device which is highly reliable and extremely easy to use. Also provided is a novel information processing device which is highly reliable and extremely easy to use. Also provided is a novel information processing device. The information processing device comprises an input unit which supplies a plurality of maps including primary maps, and a storage unit which stores a program. The program comprises a step in which a secondary map is generated from a plurality of primary maps, a step in which an interrupt process which generates a dataset from a secondary map is carried out, and a pattern is extracted from the dataset generated by interrupt process, and if the extracted pattern is included in the reference table, a command associated in the reference table is supplied.

Description

Information processing device

One embodiment of the present invention relates to an input / output device, an information processing device, a program, or a semiconductor device.

Note that one embodiment of the present invention is not limited to the above technical field. The technical field of one embodiment of the invention disclosed in this specification and the like relates to an object, a method, or a manufacturing method. Alternatively, one embodiment of the present invention relates to a process, a machine, a manufacture, or a composition (composition of matter). Therefore, as a technical field of one embodiment of the present invention disclosed more specifically in this specification, a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, a driving method thereof, or a manufacturing method thereof, Can be cited as an example.

The social infrastructure for information transmission means is substantial. As a result, diverse and abundant information can be acquired, processed, or transmitted not only at work and at home but also on the go using the information processing apparatus.

In such a background, portable information processing apparatuses have been actively developed.

For example, portable information processing apparatuses are often used while being carried, and unexpected force may be applied to the information processing apparatus and the display device used for the information processing due to falling. As an example of a display device that is not easily destroyed, a configuration in which adhesion between a structure that separates a light emitting layer and a second electrode layer is improved is known (Patent Document 1).

JP 2012-190794 A

An object of one embodiment of the present invention is to provide a novel input / output device that is highly convenient or reliable. Another object is to provide a novel information processing device that is highly convenient or reliable. Another object is to provide a novel detector or a novel information processing device.

Note that the description of these problems does not disturb the existence of other problems. Note that one embodiment of the present invention does not have to solve all of these problems. Issues other than these will be apparent from the description of the specification, drawings, claims, etc., and other issues can be extracted from the descriptions of the specification, drawings, claims, etc. It is.

One embodiment of the present invention is an information processing device including an input unit that supplies a map and an arithmetic device to which the map is supplied.

The map includes a plurality of primary maps.

The arithmetic device includes a storage unit that stores a program that supplies a predetermined instruction based on the map, and an arithmetic unit that executes the program.

The program executes a first step for permitting interrupt processing, a second step for extracting a pattern included in the data set, and a third step when the pattern is checked against a reference table and matches a predetermined pattern. A third step that proceeds to the second step if not included, and a fourth step that supplies an instruction associated with the predetermined pattern and proceeds to the second step.

The interrupt process includes a fifth step of acquiring a plurality of primary maps, a sixth step of performing a secondary map generation process of generating a secondary map based on the plurality of primary maps, A seventh step of generating a binarized map based on the map; an eighth step of generating labeling data based on the binarized map; generating or updating a data set based on the labeling data; And the ninth step.

The information processing apparatus of one embodiment of the present invention includes an input unit that supplies a map and a storage unit that stores a program. The program also associates an interrupt process for generating a data set from the map, a step for extracting a pattern from the data set generated by the interrupt process, and the reference table if the extracted pattern is included in the reference table. Providing instructions.

The map is data including detection information and position information related to the detected position, and the data set includes a plurality of continuous maps. For example, a time series of maps can be used for the data set.

Thereby, a predetermined command can be supplied using the input unit. As a result, a novel input / output device that is highly convenient or reliable can be provided. A novel information processing apparatus that is highly convenient or reliable can be provided. Alternatively, a novel input / output device or a novel information processing device can be provided.

Further, according to one aspect of the present invention, the secondary map generation process includes a tenth step of generating an averaged primary map from a plurality of primary maps, and an upper limit included in the averaged primary map An information processing apparatus comprising: an eleventh step of converting a value exceeding the value into an upper limit value and converting a value below the lower limit value into a lower limit value.

The information processing apparatus according to one embodiment of the present invention includes a storage unit, and stores a program including a step of generating a primary map averaged from a plurality of primary maps.

As a result, a map from which noise from display information is removed can be supplied from the input unit even when the display unit is not in a blanking period without lowering the signal frequency of the display unit. In addition, a predetermined command can be supplied using a map from which noise is removed. As a result, a novel input / output device that is highly convenient or reliable can be provided. Alternatively, a novel information processing device that is highly convenient or reliable can be provided. Alternatively, a novel input / output device or a novel information processing device can be provided.

Another embodiment of the present invention is the above information processing device in which the input portion can be in a folded state or an unfolded state.

Note that in this specification, a light-emitting device refers to an image display device or a light source (including a lighting device). In addition, a module in which a connector such as an FPC (Flexible printed circuit) or TCP (Tape Carrier Package) is attached to the light emitting device, a module in which a printed wiring board is provided at the end of TCP, or a substrate on which a light emitting element is formed is COG. A module on which an IC (integrated circuit) is directly mounted by a (Chip On Glass) method may include a light emitting device.

In the drawings attached to the present specification, the components are classified by function, and the block diagram is shown as an independent block. However, it is difficult to completely separate the actual components for each function. May involve multiple functions.

In this specification, the terms “source” and “drain” of a transistor interchange with each other depending on the polarity of the transistor or the level of potential applied to each terminal. In general, in an n-channel transistor, a terminal to which a low potential is applied is called a source, and a terminal to which a high potential is applied is called a drain. In a p-channel transistor, a terminal to which a low potential is applied is called a drain, and a terminal to which a high potential is applied is called a source. In this specification, for the sake of convenience, the connection relationship between transistors may be described on the assumption that the source and the drain are fixed. However, the names of the source and the drain are actually switched according to the above-described potential relationship. .

In this specification, the source of a transistor means a source region that is part of a semiconductor film functioning as an active layer or a source electrode connected to the semiconductor film. Similarly, a drain of a transistor means a drain region that is part of the semiconductor film or a drain electrode connected to the semiconductor film. The gate means a gate electrode.

In this specification, the state where the transistors are connected in series means, for example, a state where only one of the source and the drain of the first transistor is connected to only one of the source and the drain of the second transistor. To do. In addition, the state where the transistors are connected in parallel means that one of the source and the drain of the first transistor is connected to one of the source and the drain of the second transistor, and the other of the source and the drain of the first transistor is connected. It means a state of being connected to the other of the source and the drain of the second transistor. Note that the terms “film” and “layer” can be interchanged with each other depending on the case or circumstances. For example, the term “conductive layer” may be changed to the term “conductive film”. Alternatively, for example, the term “insulating film” may be changed to the term “insulating layer” in some cases.

In this specification, connection means electrical connection and corresponds to a circuit configuration capable of supplying or transmitting current, voltage, or potential. Therefore, a connected circuit configuration does not necessarily indicate a directly connected circuit configuration, and wiring, resistors, diodes, transistors can be supplied so that current, voltage, or potential can be supplied or transmitted. A circuit configuration indirectly connected through a circuit element such as the above is also included in the category.

In this specification, even when independent components on the circuit diagram are connected to each other, in practice, for example, when a part of the wiring functions as an electrode, In some cases, it also has the functions of the components. In this specification, the term “connection” includes a case where one conductive film has functions of a plurality of components.

In this specification, one of a first electrode and a second electrode of a transistor refers to a source electrode, and the other refers to a drain electrode.

According to one embodiment of the present invention, a novel input / output device that is highly convenient or reliable can be provided. Alternatively, a novel information processing device that is highly convenient or reliable can be provided. Alternatively, a novel input / output device or a novel information processing device can be provided.

Note that the description of these effects does not disturb the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. It should be noted that the effects other than these are naturally obvious from the description of the specification, drawings, claims, etc., and it is possible to extract the other effects from the descriptions of the specification, drawings, claims, etc. It is.

1 is a block diagram illustrating a configuration of an information processing device according to an embodiment. The flowchart explaining the program which the memory | storage part of the information processing apparatus which concerns on embodiment memorize | stores. 4 is a block diagram illustrating a configuration of an input unit of the information processing device according to the embodiment. FIG. 4 is a timing chart of signals of a display unit and an input unit of the information processing apparatus according to the embodiment. FIG. FIG. 4 is a projection view illustrating a structure of an input / output device according to an embodiment. FIG. 6 is a cross-sectional view illustrating a structure of an input / output device according to an embodiment. FIG. 6 is a schematic diagram illustrating a manufacturing process of a stacked body according to an embodiment. FIG. 6 is a schematic diagram illustrating a manufacturing process of a stacked body according to an embodiment. FIG. 6 is a schematic diagram illustrating a manufacturing process of a stacked body according to an embodiment. 4A and 4B are schematic diagrams illustrating a manufacturing process of a stacked body having an opening in a support according to an embodiment. The schematic diagram explaining the structure of the processing member which concerns on embodiment. FIG. 7 is a projection view illustrating a configuration of an information processing device according to an embodiment. FIG. 7 is a projection view illustrating a configuration of an information processing device according to an embodiment.

An information processing apparatus according to one embodiment of the present invention includes an input unit that supplies a map and a storage unit that stores a program. The program also associates an interrupt process for generating a data set from the map, a step for extracting a pattern from the data set generated by the interrupt process, and the reference table if the extracted pattern is included in the reference table. Providing instructions.

The map is data including detection information and position information related to the detected position, and the data set includes a plurality of continuous maps. For example, a time series of maps can be used for the data set.

Thereby, a predetermined command can be supplied using the input unit. As a result, a novel input / output device that is highly convenient or reliable can be provided. Alternatively, a novel information processing device that is highly convenient or reliable can be provided. Alternatively, a novel input / output device or a novel information processing device can be provided.

Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below. Note that in structures of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description thereof is not repeated. Note that the terms “film” and “layer” can be interchanged with each other depending on the case or circumstances. For example, the term “conductive layer” may be changed to the term “conductive film”. Alternatively, for example, the term “insulating film” may be changed to the term “insulating layer” in some cases.

(Embodiment 1)
In this embodiment, a structure of an information processing device of one embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a block diagram illustrating a configuration of an information processing device of one embodiment of the present invention. FIG. 2 is a flowchart illustrating a program stored in the storage unit of the information processing apparatus according to one embodiment of the present invention. 3A and 3B are a block diagram illustrating a structure of an input portion that can be used in the information processing device of one embodiment of the present invention, and a schematic diagram of a map illustrating operation.

2A is a flowchart for explaining a main part of a program according to one embodiment of the present invention, FIG. 2B is a flowchart for explaining interrupt processing, and FIG. 2C is a secondary map. It is a flowchart explaining a production | generation process.

FIG. 3A-1 is a block diagram illustrating the configuration of the input unit, and FIG. 3A-2 is a circuit diagram illustrating the configuration of the detection unit of the input unit. 3D-1 and 3D-2 are schematic diagrams of maps for explaining the steps of generating a binarized map of the program according to one embodiment of the present invention and the step of generating labeling data. It is.

FIG. 4 is a diagram illustrating a timing chart of signals of the display unit and the input unit when the primary map is acquired a plurality of times.

<Configuration example 1 of information processing apparatus> > The information processing apparatus described in the present embodiment includes an input unit 140 that supplies a map M and an arithmetic unit 110 that is supplied with the map M (see FIG. 1).

The map M includes a plurality of primary maps M1.

The calculation device 110 includes a storage unit 112 and a calculation unit 111.

The storage unit 112 stores a program that supplies a predetermined command based on the map M.

The calculation unit 111 executes a program including the following steps.

<< First Step >> In the first step, interrupt processing is permitted (FIG. 2A (see S1)).

<< Second Step >> In the second step, patterns included in the data set are extracted (see FIG. 2A (see S2)).

The data set is generated or updated in interrupt processing. The data set includes a plurality of continuous labeling data. For example, a time series of labeling data LD can be used for the data set.

Note that the labeling data LD is data in which detection information and position information of what is close to and / or in contact with the input unit 140 are associated with each other.

For example, the number, position, distance to the input unit 140, and the like of what is close to and / or in contact with the input unit 140 can be included in the labeling data LD.

By using such a data set, it is possible to know the trajectory associated with the movement of the object close to and / or in contact with the input unit 140 and extract the pattern.

Specifically, a trajectory drawn by a finger tapping approximately the same place, a trajectory drawn by a finger dragging in one direction, or a trajectory drawn while increasing the interval between two fingers to be pinched can be extracted.

<< Third Step >> In the third step, the pattern is checked against the reference table. If the pattern matches the predetermined pattern, the process proceeds to the fourth step. If the pattern does not match the predetermined pattern, the process proceeds to the second step. FIG. 2A (see S3)).

Thereby, the user of the information processing apparatus 100 moves a finger, a stylus, or the like that is in proximity to and / or in contact with the input unit 140 so as to draw a predetermined pattern, and supplies information based on the gesture to the input unit 140 can do.

<< Fourth Step >> In the fourth step, an instruction associated with a predetermined pattern is supplied, and the process proceeds to the second step (see FIG. 2A (see S4)).

The interrupt process includes the following steps.

<< Fifth Step >> In the fifth step, a plurality of primary maps M1 are acquired (FIG. 2B (see T5)).

<< Sixth Step >> In the sixth step, a secondary map generation process for generating a secondary map M2 is performed based on a plurality of primary maps M1 (see FIG. 2B (see T6)).

Various methods can be used for the secondary map generation process. Details will be described later.

<< Seventh Step >> In the seventh step, a binarized map MBI is generated based on the secondary map M2 (see FIG. 2B (see T7)).

For example, a secondary map M2 of 8 rows and 8 columns is schematically shown (see FIG. 3C-2). In addition, a binarized map MBI obtained by binarizing the secondary map M2 is schematically shown (see FIG. 3D-1). Note that cells with different hatches have different values.

Various methods can be used for binarizing the map values. For example, when 8-bit data is used, the value of each cell can be set to 0 or 255. In addition, the user may determine the threshold value used when binarizing, or the arithmetic unit may determine.

<< Eighth Step >> In the eighth step, labeling data LD is generated based on the binarized map MBI (see FIG. 2B (see T8)).

Various methods can be used for labeling. For example, the step of assigning the same label when the value is the same as the value of an adjacent cell is performed for each cell (see FIG. 3D-2).

Thereby, position information can be specified for each region to which the same label is attached. For example, the center of gravity of a region with the same label can be used as the position information of the region.

As a result, it is possible to generate the labeling data LD in which the detection information and the position information that are close to and / or in contact with the input unit 140 are associated with each other.

<< Ninth Step >> In the ninth step, a data set is generated or updated based on the labeling data LD, and the process proceeds to the first step (FIG. 2B (see T9)).

The data set includes a plurality of consecutive maps. For example, a time series of maps can be used for the data set. By using a data set including a time series of maps, it is possible to know a trajectory associated with the movement of an object that approaches or / and contacts the input unit 140.

The information processing apparatus 100 according to one aspect of the present invention includes the input unit 140 that supplies the map M and the storage unit 112 that stores the program. In addition, the program associates the interrupt process for generating the data set from the map M, the step of extracting the pattern from the data set generated by the interrupt process, and the reference table when the extracted pattern is included in the reference table. Providing a command.

The map M is data including detection information and position information related to the detected position, and the data set includes a plurality of continuous maps. For example, a time series of maps can be used for the data set.

Accordingly, a predetermined command can be supplied using the input unit 140. As a result, a novel input / output device that is highly convenient or reliable can be provided. Alternatively, a novel information processing device that is highly convenient or reliable can be provided. Alternatively, a novel input / output device or a novel information processing device can be provided.

For example, the user of the information processing apparatus 100 can supply various operation commands to the information processing apparatus 100 using a finger, a palm, or the like brought close to the input unit 140.

For example, an operation instruction including an end instruction (an instruction to end the program) can be supplied.

Below, each element which comprises information processing apparatus is demonstrated. Note that these configurations cannot be clearly separated, and one configuration may serve as another configuration or may include a part of another configuration.

For example, a touch panel in which a touch sensor is superimposed on a display panel is not only the display unit 130 but also the input unit 140.

In the present embodiment, a touch sensor having a configuration in which the input unit 140 is superimposed on the display surface side of the display unit 130 will be described as an example, but the present invention is not limited to this configuration. Specifically, the display unit 130 may be stacked on the detection surface side of the input unit 140, or the display unit 130 and the input unit 140 may have an integrated structure. In other words, it may be an on-cell type touch panel or an in-cell type touch panel.

<< Overall Configuration >> The information processing apparatus 100 includes an input / output device 120 or an arithmetic device 110 (see FIG. 1).

<< Input / Output Device 120 >> The input / output device 120 is supplied with the display information V and can supply the map M or the detection information S. In addition, the arithmetic device 110 and the input / output device 120 can supply and supply various information to each other.

The input / output device 120 includes a display unit 130, an input unit 140, an input / output unit 145, a detection unit 150, or a communication unit 160.

<< Display Unit 130 >> The display unit 130 is supplied with the display information V and can display the display information V.

The display unit 130 includes a display area 131 and displays the display information V in the display area 131.

The display area 131 includes a first display area 131 (11), a first bendable display area 131 (21), a second display area 131 (12), a second bendable display area 131 (22), and a first bendable display area 131 (22). Three display areas 131 (13) may be provided.

The first bendable display area 131 (21) and the second bendable display area 131 (22) can not only display the display information V but also bendable.

For example, the first bendable display area 131 (21) and the second bendable display area 131 (22) have a radius of curvature of 10 mm or less, preferably 8 mm or less, more preferably 5 mm or less, and particularly preferably 4 mm or less. Can be bent.

The display unit 130 can be folded so that a first fold is formed in the first bendable display area 131 (21). Further, the display unit 130 can be expanded by expanding the first fold.

The display unit 130 can be folded so that a second fold is formed in the second bendable display region 131 (22). Further, the display unit 130 can be expanded by expanding the second fold.

The first display area 131 (11) and the second display area 131 (12) may be driven by a common drive circuit. For example, one scanning line driving circuit may supply a signal for selecting a scanning line.

The first display area 131 (11) and the second display area 131 (12) may be driven separately. For example, a driving circuit may be provided in each region, and each scanning line driving circuit may supply a signal for selecting each scanning line.

For example, in the standby state of the information processing apparatus 100, only the first region (11) or / and the first bendable region (21) may be driven and driving of other regions may be stopped. Alternatively, even when the information processing apparatus 100 is folded, only the first region (11) and / or the first bendable region (21) is driven, and driving of other invisible regions is stopped. Good. Power consumption can be reduced by stopping driving in other regions.

<< Input Unit 140 >> The input unit 140 supplies the map M. For example, an object close to and / or in contact with the input unit 140 is detected, and the detected information is supplied in association with position information related to the detected position.

The map M is data including detection information and position information related to the detected position. Data including a plurality of continuous maps is called a data set. For example, a time series of maps can be used for the data set.

For example, the input unit 140 includes a plurality of detection units U (m, n) arranged in a matrix of m rows and n columns (see FIG. 3A-1). Note that m and n are natural numbers, and one of m or n is a natural number of 2 or more. Further, it may include a signal line and the like arranged in the column direction, such as a selection signal line for electrically connecting a plurality of detection units arranged in the row direction.

For example, a matrix of m rows and n columns in which the detection signals supplied by the detection units U (m, n) and the arrangement of the detection units U (m, n) are associated can be used as the data format of the map M. Specifically, the value of the element (i, j) of the matrix of m rows and n columns may be in the form of data that is a value based on the detection signal supplied by the detection unit U (i, j). Note that i is a natural number of m or less, and j is a natural number of n or less.

The input unit 140 may include a plurality of detection units U (m, n), selection signal lines, and the like or a base material that supports these. In addition, a driving circuit that can supply a selection signal, a driving circuit that can supply a detection signal, or the like can be included.

The input unit 140 includes a first input unit 141 (11), a second input unit 141 (12), a third input unit 141 (13), a fourth input unit 141 (21), and a fifth input unit 141. (22) is provided.

The input unit 140 may be disposed so as to overlap the display unit 130.

Specifically, the first input unit 141 (11) is overlaid on the first display region 131 (11), and the second input unit 141 (12) is overlaid on the second display region 131 (12). A fourth input unit that can be bent over the third display area 131 (13) by placing the third input section 141 (13) over the first display area 131 (21). 141 (21) is arranged. A fifth input portion 141 (22) that can be bent over the second bendable display area 131 (22) is disposed.

When the input unit 140 is arranged on the user side from the display unit 130, the input unit 140 having translucency is arranged.

The first input unit 141 (11) may be driven by a common drive circuit with other input units, or may be driven by a separate drive circuit.

For example, when the sum of the power consumed by the first input unit 141 (11) and the power consumed by the second input unit 141 (12) is greater than the power consumed by the first input unit 141 (11), In the standby state of the information processing apparatus 100, only the first input unit 141 (11) may be driven, and the driving of the second input unit 140 (12) may be stopped. By stopping the driving of the second input unit 140 (12), power consumption can be reduced.

The detection element disposed in the input unit may be any sensor that can detect proximity or / and contact (for example, a finger or palm). For example, a coil, a magnetic sensor, a photoelectric conversion element, and / or one electrode is a conductive film. A capacitor element electrically connected to the capacitor can be used. Note that a substrate having photoelectric conversion elements can be referred to as an optical touch sensor, and a substrate having capacitor elements in a matrix can be referred to as a capacitive touch sensor.

<< Detection Unit U (m, n) >> The detection unit U (m, n) detects various objects. For example, the detection information is supplied by detecting the proximity or contact. For example, capacitance, illuminance, magnetic force, radio wave, pressure, or the like is detected, and information based on the detected physical quantity is supplied. Specifically, a capacitive element, a photoelectric conversion element, a magnetic sensing element, a piezoelectric element, a resonator, or the like can be used as the sensing element.

Specifically, in the atmosphere, when an object such as a finger having a dielectric constant greater than that of the atmosphere approaches the conductive film, the capacitance between the finger and the conductive film changes. This change in capacitance can be detected and a detection signal can be supplied. Specifically, a conductive film and a capacitor in which one electrode is connected to the conductive film can be used. As the capacitance changes, charge distribution is caused and the voltage at the electrodes at both ends of the capacitive element changes. This change in voltage can be used as a detection signal.

Further, the input unit 140 is arranged in a column direction, a plurality of detection units U arranged in a matrix, a selection signal line G1 electrically connected to the plurality of detection units U arranged in a row direction, and the column direction. In the case of having the signal lines DL electrically connected to the plurality of detection units U to be detected, for example, the detection unit U having the following configuration can be used.

The detection unit U includes a first switch SW1 whose control terminal is electrically connected to the selection signal line G1, and whose first terminal is electrically connected to the signal line DL.

In addition, the amplifier includes an amplification transistor M10 in which the first electrode is electrically connected to the second terminal of the first switch SW1, and the second electrode is electrically connected to the power supply line VPI.

In addition, the capacitor C1 is provided in which the first electrode is electrically connected to the gate and the conductive film of the amplification transistor M10, and the second electrode is electrically connected to the second control line. Note that a node to which the gate of the amplification transistor M10, the second electrode of the capacitor C1, and the conductive film are electrically connected is referred to as a node A. The amplification transistor M10 passes a current having a magnitude based on the potential of the node A between the first electrode and the second electrode. Thereby, for example, detection information based on the detection signal supplied by the detection unit can be supplied using a circuit that supplies information based on the current flowing through the signal line DL.

The first terminal is electrically connected to the gate of the amplification transistor M10, the control terminal is electrically connected to the third control line RES, and the second terminal is electrically connected to the second power supply line VRES. A second switch SW2.

<< Detection Unit 150 >> The detection unit 150 can detect the information processing apparatus 100 and / or its surrounding state and supply the detection information S (see FIG. 1).

The detection unit 150 detects whether the input / output device 120 is folded or unfolded, and supplies detection information S including information indicating the folded state or the unfolded state of the input / output device 120. . Specifically, it is detected whether the display unit 130 and / or the input unit 140 is folded or unfolded.

The folded or unfolded state of the input / output device 120 can be detected using various sensors.

For example, the folded state of the input / output device 120 can be detected using a mechanical switch, an optical switch, a magnetic sensor, a photoelectric conversion element, a MEMS pressure sensor, a pressure sensor, or the like.

For example, it is possible to detect the folded state of the display unit 130 by detecting an object that blocks the display of the second display area 131 (12) or the third display area 131 (13).

Specifically, the photoelectric conversion element is arranged in the information processing apparatus 100 so as to detect the display information V displayed in the second display region 131 (12) in a state where the input / output device is folded, and The third display area 131 (13) can be detected using a conversion element, and it can be detected whether the display unit 130 is folded in the second bendable display area 131 (22).

Note that the detection unit 150 may detect, for example, acceleration, angular acceleration, azimuth, pressure, GPS (Global positioning System) signal, temperature or humidity, and supply the information.

<< Communication unit 160 >> The communication unit 160 supplies and supplies communication information COM. The communication unit 160 supplies communication information COM supplied from the arithmetic device 110 to an external device or communication network of the information processing apparatus 100. Further, the communication information COM is acquired from an external device or a communication network and supplied.

The communication information COM can include various instructions in addition to voice information, image information, and the like. For example, an operation command for causing the calculation unit 111 to generate or delete the display information V can be included.

A communication means for connecting to an external device or a communication network, such as a hub, a router, or a modem, can be applied to the communication unit 160. The connection method is not limited to a wired method, and may be wireless (for example, radio waves or infrared rays).

<< Input / Output Unit 145 >> The input / output unit 145 supplies and supplies various information. For example, a camera, a microphone, a read-only external storage unit, an external storage unit, a scanner, a speaker, a printer, or the like can be used for the input / output unit 145.

Specifically, a digital camera, a digital video camera, or the like can be used for the camera.

A hard disk or a removable memory can be used for the external storage unit. Also, CDROM, DVDROM, etc. can be used as a read-only external storage unit.

<< Calculation Device 110 >> The calculation device 110 includes a calculation unit 111 or a storage unit 112. The arithmetic unit 110 supplies the display information V and is supplied with the map M or the detection information S (see FIG. 1).

For example, the arithmetic device 110 supplies display information V including an image to be used for operation of the information processing device 100.

In addition, the arithmetic device 110 may be supplied with the map M.

For example, the user can supply the operation command associated with the image to the arithmetic device 110 by touching the input unit 140 that overlaps the image displayed for the operation displayed on the display unit 130 with a finger or the like.

Further, the arithmetic device 110 may have a transmission path 114 and an input / output interface 115.

<< Calculation Unit 111 >> The calculation unit 111 executes a program stored in the storage unit 112. For example, when position information L of a position where an image used for operation is displayed is supplied, the calculation unit 111 executes a program associated with the image in advance.

<< Storage Unit 112 >> The storage unit 112 stores a program to be executed by the calculation unit 111.

<< Input / Output Interface / Transmission Path >> The input / output interface 115 supplies information and is supplied with information.

The transmission path 114 can supply information, and the calculation unit 111, the storage unit 112, and the input / output interface 115 are supplied with information. The calculation unit 111, the storage unit 112, and the input / output interface 115 can supply information, and the transmission path 114 is supplied with information.

<< Housing >> The information processing apparatus 100 may have a housing. The housing can protect the arithmetic device 110 and the like from various stresses applied to the information processing apparatus 100.

Metal, plastic, glass, ceramics, or the like can be used for the housing.

<Configuration example 2 of information processing apparatus> > Another configuration of the information processing device of one embodiment of the present invention will be described with reference to FIGS.

FIG. 2C is a flowchart illustrating a program stored in the storage unit of the information processing device of one embodiment of the present invention.

3A-1 is a block diagram of the input portion 140 of the information processing device of one embodiment of the present invention, and FIG. 3A-2 illustrates the structure of a detection unit that can be used for the input portion 140. It is a circuit diagram. FIGS. 3B-1 to 3D-2 are schematic diagrams for explaining maps supplied by the input unit 140. FIG.

In the configuration example 2 of the information processing apparatus 100 described in the present embodiment, the information processing apparatus 100 described above is that the storage unit 112 stores a program for performing a secondary map generation process including the following steps. This is different from the first configuration example. Here, different configurations will be described in detail, and the above description is used for the portions where the same configurations can be used.

The calculation unit 111 executes a program including the following steps stored in the storage unit 112.

<< Tenth Step >> In the tenth step, an averaged primary map MA is generated from a plurality of primary maps M1 (FIG. 2 (C-1) (see U10)).

Schematic diagrams of a plurality of primary maps M1 are shown (see FIGS. 3B-1 to 3B-4). Although the illustrated primary map M1 is of 8 rows and 8 columns, it is not limited to this. Further, although four schematic diagrams are shown as a plurality of primary maps, the number of primary maps to be acquired is not limited to this. As shown in FIG. 4, a primary map may be acquired a plurality of times in a period overlapping with a period in which display information is sent to the display unit. The number of times of acquiring the primary map may be determined by comprehensively determining the size and definition of the display unit, the number of scanning lines of the input unit, and the like. If the primary map is acquired about 4, 8, or 16, the noise affected by the display information V or the like can be removed from the map supplied by the input unit. Different cells are given different hatches.

An averaged primary map MA is generated from a plurality of primary maps M1. As a result, information related to what is close to and / or in contact with the input unit 140 can be acquired. For example, it is possible to know the number, position, distance to the input unit, and the like that are close to and / or in contact with the input unit 140 (see FIG. 3C-1).

<< Eleventh Step >> In the eleventh step, a value exceeding the upper limit value included in the averaged primary map MA is converted into an upper limit value, and a value lower than the lower limit value is converted into a lower limit value (FIG. 2 ( C-2) (see U11)). This map becomes the secondary map M2. Further, a value exceeding a certain reference value is converted into an upper limit value in the averaged primary map MA, and a value lower than a certain reference value is converted into a lower limit value to generate a secondary map M2. Also good.

Specifically, when an 8-bit signal is used, an average value greater than 127 is converted to 255 based on the median 127 of the 8-bit signal, and a value smaller than 127 is converted to 0. To do.

Configuration example 2 of the information processing apparatus 100 described in the present embodiment includes a storage unit 112, and the storage unit 112 generates a primary map MA averaged from a plurality of primary maps M1. Remember.

As a result, a map from which noise from display information is removed can be supplied from the input unit even when the display unit is not in a blanking period without lowering the signal frequency of the display unit. In addition, a predetermined command can be supplied using a map from which noise is removed. As a result, a novel input / output device that is highly convenient or reliable can be provided. Alternatively, a novel information processing device that is highly convenient or reliable can be provided. Alternatively, a novel input / output device or a novel information processing device can be provided.

<Configuration example 3 of information processing apparatus> > Another configuration of the information processing device of one embodiment of the present invention will be described.

In the configuration example 3 of the information processing apparatus 100 described in the present embodiment, the point that the storage unit 112 stores the secondary map M2 in place of the tenth step in the generation process is described above. This is different from Configuration Example 1 or Configuration Example 2 of the information processing apparatus 100 that performs the processing. Here, different configurations will be described in detail, and the above description is used for portions where similar configurations can be used.

The calculation unit 111 executes a program including the following steps stored in the storage unit 112.

Generating a primary map MB that is the sum of a plurality of primary maps M1; Alternatively, a step of generating a primary map MB in which a median value is extracted from a plurality of primary maps M1. Alternatively, a step of generating a primary map MB from a plurality of primary maps M1 using LPF (Low Pass Filter) or BPF (Band Pass Filter). Note that the generation step of the primary map MB is not limited to these, and various processes for clarifying the difference between the detection position and the noise from a plurality of primary maps may be performed to generate the primary map MB. .

Thereby, the primary map MB can be generated by various methods. As a result, a novel input / output device that is highly convenient or reliable can be provided. A novel information processing apparatus that is highly convenient or reliable can be provided. Alternatively, a novel input / output device or a novel information processing device can be provided.

Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

Embodiment 2 In this embodiment, a structure of an input / output device that can be used for the information processing device of one embodiment of the present invention will be described with reference to FIGS.

FIG. 5 is a projection view illustrating a structure of the input / output device 500TP of one embodiment of the present invention. For convenience of explanation, a part of the detection unit 602 and a part of the pixel 502 are illustrated in an enlarged manner.

6A is a cross-sectional view illustrating a cross-sectional structure taken along line Z1-Z2 of the input / output device 500TP according to one embodiment of the present invention illustrated in FIG. 5, and FIG. 5B and FIG. It is sectional drawing which shows the some modification of the structure shown to A).

<Configuration Example of Input / Output Device> The input / output device 500TP described in this embodiment includes a display unit 500 and an input unit 600 that overlaps the display unit 500 (see FIG. 3).

The input unit 600 includes a plurality of detection units 602 arranged in a matrix.

In addition, a plurality of detection units 602 arranged in the row direction (indicated by an arrow R in the drawing) include a selection signal line G1 or a control line RES that are electrically connected.

In addition, a plurality of detection units 602 arranged in the column direction (indicated by an arrow C in the drawing) have signal lines DL and the like that are electrically connected.

The detection unit 602 includes a detection circuit. The detection circuit is electrically connected to the selection signal line G1, the control line RES, the signal line DL, or the like.

A transistor or / and a sensing element or the like can be used for the sensing circuit. For example, a conductive film and a capacitor electrically connected to the conductive film can be used for the detection element. Further, a capacitor and a transistor electrically connected to the capacitor can be used.

The capacitor 650 including the insulating layer 653, the first electrode 651 and the second electrode 652 which sandwich the insulating layer 653 can be used (see FIG. 6A).

The detection unit includes a plurality of window portions 667 arranged in a matrix. The window portion 667 may transmit visible light, and the light blocking layer BM may be disposed between the plurality of window portions 667.

A colored layer is provided at a position overlapping the window portion 667. The colored layer transmits light of a predetermined color. Note that the colored layer can be referred to as a color filter. For example, a colored layer CFB that transmits blue light, a colored layer CFG that transmits green light, or a colored layer CFR that transmits red light can be used. Alternatively, a colored layer that transmits yellow light or a layer that transmits white light may be used.

The display unit 500 includes a plurality of pixels 502 arranged in a matrix. The pixel 502 is disposed so as to overlap with the window portion 667 of the input unit 600.

The pixels 502 may be arranged with higher definition than the detection unit 602.

An input / output device 500TP described in this embodiment includes a window portion 667 that transmits visible light, and includes an input portion 600 including a plurality of detection units 602 arranged in a matrix, and a pixel overlapping the window portion 667. A display portion 500 including a plurality of 502, and includes a coloring layer between the window portion 667 and the pixel 502. Each detection unit is provided with a switch that can reduce electrical interference to other detection units. Note that a transistor or the like can be used for the switch.

Thereby, the detection information which each detection unit detects can be supplied with the positional information on a detection unit. In addition, detection information can be supplied in association with position information of a pixel displaying an image. In addition, by making the detection unit that does not supply detection information and the signal line non-conductive, electrical interference to the detection unit that supplies the detection signal can be reduced. As a result, a novel input / output device 500TP that is highly convenient or reliable can be provided.

For example, the input unit 600 of the input / output device 500TP can detect the detection information and supply it together with the position information. Specifically, the user of the input / output device 500TP can input information based on various gestures (tap, drag, swipe, pinch-in, etc.) using a finger or the like touching the input unit 600 as a pointer.

The input unit 600 can detect a finger or the like approaching or touching the input unit 600 and supply detection information including the detected position or locus.

The arithmetic device determines whether the supplied information satisfies a predetermined condition based on a program or the like, and executes a command associated with a predetermined gesture.

Thereby, the user of the input unit 600 can supply information based on a predetermined gesture using a finger or the like, and cause the arithmetic device to execute a command associated with the predetermined gesture.

For example, the input unit 600 of the input / output device 500TP selects one detection unit from a plurality of detection units that can supply detection information to one signal line, and other detection units excluding the selected detection unit. And the one signal line can be turned off. Thereby, the interference to the selected detection unit which the other detection unit which is not selected brings about can be reduced.

Specifically, the interference of the selected detection unit to the detection element caused by the detection element of the unselected detection unit can be reduced.

For example, when a conductive film in which a capacitor element and one electrode of the capacitor element are electrically connected is used as a detection element, the conductivity of the selected detection unit is caused by the potential of the conductive film of an unselected detection unit. Interference with the membrane potential can be reduced. Specifically, it can contribute to noise reduction.

Accordingly, the input / output device 500TP can drive the detection unit and supply detection information without depending on the size of the input / output device 500TP. For example, the input / output device 500TP of various sizes can be provided from a size that can be used for a handheld type to a size that can be used for an electronic blackboard.

In addition, the input / output device 500TP can be in a folded state and an unfolded state, and the detection unit that is not selected in the folded state and the unfolded state provides an electrical connection to the selected detection unit. Even when the interference is different, the detection unit can be driven to supply the detection information without depending on the state of the input / output device 500TP.

The display unit 500 of the input / output device 500TP can be supplied with the display information V. For example, the arithmetic unit can supply the display information V.

In addition to the above configuration, the input / output device 500TP may have the following configuration.

The input unit 600 of the input / output device 500TP may include a drive circuit 603g or a drive circuit 603d. Moreover, you may electrically connect with flexible printed circuit board FPC1.

The display portion 500 of the input / output device 500TP may include a driver circuit 503g, a driver circuit 503s, a wiring 511, or a terminal 519. Moreover, you may electrically connect with flexible printed circuit board FPC2.

In addition, a protective layer 670 that protects the input / output device 500TP by preventing generation of scratches may be provided. For example, a ceramic coat layer or a hard coat layer can be used for the protective layer 670. Specifically, a layer containing aluminum oxide or a UV curable resin can be used. Further, an antireflection layer 670p that reduces the intensity of external light reflected by the input / output device 500TP can be used. Specifically, a circularly polarizing plate or the like can be used.

Hereinafter, individual elements constituting the input / output device 500TP will be described. Note that these configurations cannot be clearly separated, and one configuration may serve as another configuration or may include a part of another configuration.

For example, the input unit 600 including a colored layer at a position overlapping with the plurality of window portions 667 is not only the input unit 600 but also a color filter.

For example, the input / output device 500TP in which the input unit 600 is superimposed on the display unit 500 is the input unit 600 and the display unit 500. Note that the input / output device 500TP in which the input unit 600 is superimposed on the display unit 500 is also referred to as a touch panel.

<< Overall Configuration >> The input / output device 500TP described in this embodiment includes an input unit 600 or a display unit 500.

Note that an example of a method for manufacturing the input / output device 500TP will be described in detail in Embodiments 3 to 5.

<< Input Unit >> The input unit 600 includes a detection unit 602, a selection signal line G1, a signal line DL, or a base 610.

Note that the input unit 600 may be formed by forming a film for forming the input unit 600 on the base 610 and processing the film.

Alternatively, the input unit 600 may be formed using a method in which a part of the input unit 600 is formed on another base material and the part is transferred to the base material 610.

<< Detection Unit >> The detection unit 602 detects a proximity or contact object and supplies a detection signal. For example, capacitance, illuminance, magnetic force, radio wave, pressure, or the like is detected, and information based on the detected physical quantity is supplied. Specifically, a capacitive element, a photoelectric conversion element, a magnetic sensing element, a piezoelectric element, a resonator, or the like can be used as the sensing element.

The detection unit 602 detects, for example, a change in electrostatic capacitance between the proximity unit and the contact unit. Specifically, a conductive film and a detection circuit electrically connected to the conductive film may be used.

In the atmosphere, when an object having a dielectric constant greater than that of the atmosphere, such as a finger, approaches the conductive film, the capacitance between the finger and the conductive film changes. Detection information can be supplied by detecting the change in capacitance. Specifically, a detection circuit including a conductive film and a capacitor in which one electrode is connected to the conductive film can be used for the detection unit 602.

For example, with the change in capacitance, charge is distributed to the capacitive element, and the voltage at the electrodes at both ends of the capacitive element changes. This change in voltage can be used as a detection signal. Specifically, the voltage between the electrodes of the capacitor 650 is changed by the proximity of a conductive film electrically connected to one electrode (see FIG. 6A).

<< Switch, Transistor >> The detection unit 602 includes a switch that can be turned on or off based on a control signal. For example, the transistor M12 can be used as a switch.

A transistor that amplifies the detection signal can be used for the detection unit 602.

Transistors that can be manufactured in the same process can be used for transistors and switches that amplify a detection signal. Thereby, the input unit 600 with a simplified manufacturing process can be provided.

The transistor includes a semiconductor layer. For example, a Group 14 element, compound semiconductor, or oxide semiconductor can be used for the semiconductor layer. Specifically, a semiconductor containing silicon, a semiconductor containing gallium arsenide, an oxide semiconductor containing indium, or the like can be used for the semiconductor layer. An organic semiconductor or the like can be used for the semiconductor layer. Acenes such as tetracene and pentacene, oligothiophene derivatives, phthalocyanines, perylene derivatives, rubrene, Alq3, TTF-TCNQ, polythiophene (such as poly-3-hexylthiophene), polyacetylene, polyfluorene, polyphenylene vinylene, polypyrrole, polyaniline, pentacene Anthracene, rubrene, tetracyanoquinodimethane (TCNQ), polyacetylene, poly-3-hexylthiophene (P3HT), polyparaphenylenevinylene (PPV), phthalocyanine, and the like can be used for the organic semiconductor.

Semiconductor layers having various crystallinities can be used for the transistor. For example, a semiconductor layer containing non-crystal, a semiconductor layer containing microcrystal, a semiconductor layer containing polycrystal, a semiconductor layer containing single crystal, or the like can be used. Specifically, amorphous silicon, polysilicon crystallized by a process such as laser annealing, or a semiconductor layer formed using SOI (Silicon On Insulator) technology can be used.

An oxide semiconductor used for the semiconductor layer includes, for example, at least indium (In), zinc (Zn), and M (metal such as Al, Ga, Ge, Y, Zr, Sn, La, Ce, or Hf). It is preferable to include a film represented by -Zn oxide. Or it is preferable that both In and Zn are included.

Examples of the stabilizer include gallium (Ga), tin (Sn), hafnium (Hf), aluminum (Al), and zirconium (Zr). Other stabilizers include lanthanoids such as lanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb). ), Dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), and the like.

Examples of the oxide semiconductor that forms the oxide semiconductor film include an In—Ga—Zn-based oxide, an In—Al—Zn-based oxide, an In—Sn—Zn-based oxide, an In—Hf—Zn-based oxide, In-La-Zn-based oxide, In-Ce-Zn-based oxide, In-Pr-Zn-based oxide, In-Nd-Zn-based oxide, In-Sm-Zn-based oxide, In-Eu-Zn Oxide, In-Gd-Zn oxide, In-Tb-Zn oxide, In-Dy-Zn oxide, In-Ho-Zn oxide, In-Er-Zn oxide, In -Tm-Zn-based oxide, In-Yb-Zn-based oxide, In-Lu-Zn-based oxide, In-Sn-Ga-Zn-based oxide, In-Hf-Ga-Zn-based oxide, In- Al-Ga-Zn-based oxide, In-Sn-Al-Zn-based oxide, In-Sn-Hf- n based oxide, In-Hf-Al-Zn-based oxide can be used an In-Ga-based oxide.

Note that here, an In—Ga—Zn-based oxide means an oxide containing In, Ga, and Zn as its main components, and there is no limitation on the ratio of In, Ga, and Zn. Moreover, metal elements other than In, Ga, and Zn may be contained.

<< Wiring >> The input unit 600 includes a selection signal line G1, a control line RES, a signal line DL, and the like.

A conductive material can be used for the selection signal line G1, the control line RES, the signal line DL, or the like.

For example, an inorganic conductive material, an organic conductive material, a metal, a conductive ceramic, or the like can be used for the wiring.

Specifically, a metal element selected from aluminum, gold, platinum, silver, chromium, tantalum, titanium, molybdenum, tungsten, nickel, iron, cobalt, yttrium, zirconium, palladium, or manganese, and an alloy containing the above metal elements Alternatively, an alloy or the like in which the above metal elements are combined can be used for the wiring or the like. In particular, it is preferable that one or more elements selected from aluminum, chromium, copper, tantalum, titanium, molybdenum, and tungsten are included. In particular, an alloy of copper and manganese is suitable for fine processing using a wet etching method.

Specifically, a two-layer structure in which a titanium film is laminated on an aluminum film, a two-layer structure in which a titanium film is laminated on a titanium nitride film, a two-layer structure in which a tungsten film is laminated on a titanium nitride film, a tantalum nitride film or A two-layer structure in which a tungsten film is stacked over a tungsten nitride film, a titanium film, and a three-layer structure in which an aluminum film is stacked over the titanium film and a titanium film is further formed thereon can be used.

Specifically, a stacked structure in which an alloy film selected from titanium, tantalum, tungsten, molybdenum, chromium, neodymium, and scandium, or a combination of a plurality of nitride films is stacked on an aluminum film can be used.

Alternatively, a conductive oxide such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, or zinc oxide to which gallium is added can be used.

Alternatively, graphene or graphite can be used. The film containing graphene can be formed, for example, by reducing a film containing graphene oxide formed in a film shape. Examples of the reduction method include a method of applying heat and a method of using a reducing agent.

Alternatively, a conductive polymer can be used.

<< Drive Circuit >> The drive circuit 603g can supply a selection signal at a predetermined timing, for example. Specifically, the selection signal is supplied in a predetermined order for each selection signal line G1. Various circuits can be used for the driver circuit 603g. For example, a shift register, a flip-flop circuit, a combination circuit, or the like can be used. For example, the drive circuit 603g may supply the selection signal so that the input unit 140 operates based on a predetermined operation of the display unit 130. Specifically, the selection signal may be supplied so that the input unit operates during the operation of the display unit 130. Thereby, the input unit 140 can be detected without reducing the operating frequency of the display unit 130. Note that the selection signal may be supplied so that the input unit operates during the blanking period of the display unit 130. Thereby, the malfunction that the input part 140 detects the noise by various factors can be reduced significantly.

The drive circuit 603d supplies detection information based on the detection signal supplied from the detection unit U. Various circuits can be used for the driver circuit 603d. For example, a circuit that can form a source follower circuit or a current mirror circuit by being electrically connected to a detection circuit provided in the detection unit can be used for the drive circuit 603d. Moreover, you may provide the analog digital conversion circuit which converts a detection signal into a digital signal.

<< Base Material >> The base material 610 is not particularly limited as long as it has heat resistance enough to withstand the manufacturing process and thickness and size applicable to the manufacturing apparatus. In particular, when a flexible material is used for the base 610, the input unit 600 can be folded or unfolded. Note that a light-transmitting material is used for the base 610 in the case where the input unit 600 is arranged on the display side of the display unit 500.

An organic material, an inorganic material, or a composite material such as an organic material and an inorganic material can be used for the substrate 610.

For example, an inorganic material such as glass, ceramics, or metal can be used for the base material 610.

Specifically, alkali-free glass, soda-lime glass, alkali glass, crystal glass, or the like can be used for the base material 610.

Specifically, a metal oxide film, a metal nitride film, a metal oxynitride film, or the like can be used for the base 610. For example, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, an aluminum oxide film, or the like can be used for the base 610.

For example, an organic material such as a resin, a resin film, or plastic can be used for the base 610.

Specifically, a resin film or a resin plate such as polyester, polyolefin, polyamide, polyimide, polycarbonate, or an acrylic resin can be used for the substrate 610.

For example, a composite material in which a thin glass plate or a film of an inorganic material or the like is bonded to a resin film or the like can be used for the substrate 610.

For example, a composite material in which a fibrous or particulate metal, glass, inorganic material, or the like is dispersed in a resin film can be used for the substrate 610.

For example, a composite material in which a fibrous or particulate resin, an organic material, or the like is dispersed in an inorganic material can be used for the substrate 610.

Further, a single layer material or a stacked material in which a plurality of layers are stacked can be used for the substrate 610. For example, a stacked material in which a base material and an insulating layer that prevents diffusion of impurities contained in the base material are stacked can be used for the base material 610.

Specifically, a laminated material in which one or a plurality of films selected from glass, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or the like that prevents diffusion of impurities contained in the glass is laminated on the base material 610. Applicable.

Alternatively, a stacked material in which a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or the like that prevents diffusion of resin and impurities that pass through the resin can be applied to the base 610.

Specifically, a stack of a base material 610b having flexibility, a barrier film 610a that prevents diffusion of impurities, and a resin layer 610c that bonds the base material 610b and the barrier film 610a can be used (FIG. 6A). reference).

<< Flexible Printed Circuit Board >> The flexible printed circuit board FPC1 supplies a timing signal, a power supply potential, and the like, and is supplied with a detection signal.

<< Display Unit >> The display unit 500 includes pixels 502, scanning lines, signal lines, or a substrate 510 (see FIG. 5).

Note that a film for forming the display portion 500 may be formed over the base 510, and the display portion 500 may be formed by processing the film.

Alternatively, a part of the display unit 500 may be formed on another base material, and the part may be transferred to the base material 510 to form the display unit 500.

<< Pixel >> The pixel 502 includes a sub-pixel 502B, a sub-pixel 502G, and a sub-pixel 502R. Each sub-pixel includes a display element and a pixel circuit that drives the display element.

<< Pixel Circuit >> An active matrix method in which an active element is included in a pixel or a passive matrix method in which an active element is not included in a pixel can be used for the display portion.

In the active matrix system, not only transistors but also various active elements (active elements and nonlinear elements) can be used as active elements (active elements and nonlinear elements). For example, MIM (Metal Insulator Metal) or TFD (Thin Film Diode) can also be used. Since these elements have few manufacturing steps, manufacturing cost can be reduced or yield can be improved. Alternatively, since these elements have small element sizes, the aperture ratio can be improved, and power consumption and luminance can be increased.

As a method other than the active matrix method, a passive matrix type that does not use an active element (an active element or a non-linear element) can be used. Since no active element (active element or non-linear element) is used, the number of manufacturing steps is small, so that manufacturing costs can be reduced or yield can be improved. Alternatively, since an active element (an active element or a non-linear element) is not used, an aperture ratio can be improved, power consumption can be reduced, or luminance can be increased.

The pixel circuit includes, for example, a transistor 502t.

The display portion 500 includes an insulating film 521 that covers the transistor 502t. The insulating film 521 can be used as a layer for planarizing unevenness caused by the pixel circuit. Alternatively, the insulating film 521 can be a stacked film including a layer that can suppress diffusion of impurities. Accordingly, a decrease in reliability of the transistor 502t and the like due to impurity diffusion can be suppressed.

<< Display Element >> Various display elements can be used for the display portion 500. For example, a display element (also referred to as electronic ink) that performs display by an electrophoresis method, an electro-powder fluid (registered trademark) method, an electrowetting method, a shutter-type MEMS display device, an optical interference-type MEMS display device, a liquid crystal device Etc. can be used.

In addition, a display element that can be used for a transmissive liquid crystal display, a transflective liquid crystal display, a reflective liquid crystal display, a direct-view liquid crystal display, or the like can be used.

For example, you may apply the organic electroluminescent element from which the color of the emitted light differs for every subpixel.

For example, an organic electroluminescence element that emits white light can be applied.

For example, the light-emitting element 550R includes a lower electrode, an upper electrode, and a layer containing a light-emitting organic compound between the lower electrode and the upper electrode.

The subpixel 502R includes a light emitting module 580R. The sub-pixel 502R includes a pixel circuit including a light-emitting element 550R and a transistor 502t that can supply power to the light-emitting element 550R. The light emitting module 580R includes a light emitting element 550R and an optical element (for example, a colored layer CFR).

Note that a microresonator structure can be provided in the light emitting module 580R so that light of a specific wavelength can be extracted efficiently. Specifically, a layer containing a light-emitting organic compound may be disposed between a film that reflects visible light and a semi-reflective / semi-transmissive film that is arranged so that specific light can be efficiently extracted.

The light emitting module 580R has a colored layer CFR in the direction of extracting light. The colored layer may be any layer that transmits light having a specific wavelength. For example, a layer that selectively transmits light such as red, green, or blue can be used. Note that another sub-pixel may be arranged so as to overlap with a window portion where the colored layer is not provided, and light emitted from the light-emitting element may be emitted without passing through the colored layer.

The colored layer CFR is in a position overlapping the light emitting element 550R. Thus, part of the light emitted from the light emitting element 550R passes through the colored layer CFR and is emitted to the outside of the light emitting module 580R in the direction of the arrow shown in the drawing.

There is a light-shielding layer BM so as to surround the colored layer (for example, the colored layer CFR).

Note that in the case where the sealing material 560 is provided on the light extraction side, the sealing material 560 may be in contact with the light-emitting element 550R and the coloring layer CFR.

The lower electrode is disposed on the insulating film 521. A partition wall 528 provided with an opening overlapping the lower electrode is provided. Note that a part of the partition wall 528 overlaps with an end portion of the lower electrode.

A light emitting element (for example, light emitting element 550R) is configured by sandwiching a layer containing a light emitting organic compound between the lower electrode and the upper electrode. The pixel circuit supplies power to the light emitting element.

In addition, a spacer for controlling the distance between the base material 610 and the base material 510 is provided over the partition wall 528.

Note that in the case of realizing a transflective liquid crystal display or a reflective liquid crystal display, part or all of the pixel electrode may have a function as a reflective electrode. For example, part or all of the pixel electrode may have aluminum, silver, or the like.

Further, a memory circuit such as an SRAM can be provided under the reflective electrode. Thereby, power consumption can be further reduced. In addition, a structure suitable for a display element to be applied can be selected from various pixel circuits and used.

<< Base Material >> A flexible material can be used for the base material 510. For example, a material similar to a material that can be used for the substrate 610 can be used for the substrate 510.

Note that in the case where the substrate 510 does not require translucency, for example, a material that does not have translucency, specifically, SUS or aluminum can be used.

For example, a laminate in which a flexible base material 510b, a barrier film 510a that prevents diffusion of impurities, and a resin layer 510c that bonds the base material 510b and the barrier film 510a are laminated is preferably used as the base material 510. It can be used (see FIG. 6A).

<< Sealing Material >> The sealing material 560 bonds the base material 610 and the base material 510 together. The encapsulant 560 has a higher refractive index than air. In the case where light is extracted to the sealing material 560 side, the sealing material 560 may serve as an optical bonding layer.

Note that the pixel circuit or the light-emitting element (e.g., the light-emitting element 550 </ b> R) is between the base material 510 and the base material 610.

<< Configuration of Drive Circuit >> The drive circuit 503g supplies a selection signal. For example, a selection signal is supplied to the scanning line.

Further, a drive circuit 503s that supplies an image signal may be provided. For example, the transistor 503t or the capacitor 503c can be used for the driver circuit 503s.

For example, a shift register, a flip-flop circuit, a combination circuit, or the like can be used for the driver circuit 503g or the driver circuit 503s.

Note that a transistor which can be formed over the same substrate in the same process as the pixel circuit can be used for the driver circuit.

<< Wiring >> The display unit 500 includes wiring such as scanning lines, signal lines, and power supply lines. Various conductive films can be used. For example, a material similar to that of the conductive film that can be used for the input portion 600 can be used.

The display portion 500 includes a wiring 511 that can supply a signal, and a terminal 519 is provided in the wiring 511. Note that a flexible printed circuit board FPC2 that can supply signals such as an image signal and a synchronization signal is electrically connected to the terminal 519.

Note that a printed wiring board (PWB) may be attached to the flexible printed circuit board FPC2.

<< Other Configurations >> The input / output device 500TP includes the antireflection layer 670p at a position overlapping the pixels. For example, a circularly polarizing plate can be used as the antireflection layer 670p.

<Modification of Input / Output Device> Various transistors can be applied to the input unit 600 and / or the display unit 500.

A structure in the case where a bottom-gate transistor is applied to the input portion 600 is illustrated in FIG.

A structure in the case of applying a bottom-gate transistor to the display portion 500 is illustrated in FIGS.

For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

For example, a semiconductor layer containing polycrystalline silicon crystallized by a process such as laser annealing can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

A structure in the case where a top-gate transistor is applied to the display portion 500 is illustrated in FIG.

For example, a semiconductor layer including a single crystal silicon film or the like transferred from a polycrystalline silicon, a single crystal silicon substrate, or the like can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

Embodiment 3 In this embodiment, a method for manufacturing a stack which can be used for manufacturing an input portion, a display portion, or an input / output device of one embodiment of the present invention will be described with reference to FIGS. To do.

FIG. 7 is a schematic view for explaining a process for producing a laminate. 7 is a cross-sectional view illustrating the configuration of the processed member and the laminate, and a corresponding top view is shown on the right side excluding FIG. 7C.

<Method for Producing Laminate> A method for producing the laminate 81 from the processed member 80 will be described with reference to FIG.

The processing member 80 includes a first substrate F1, a first peeling layer F2 on the first substrate F1, a first peeling layer F3 whose one surface is in contact with the first peeling layer F2, and a first A bonding layer 30 having one surface in contact with the other surface of the layer to be peeled F3 and a base material S5 in contact with the other surface of the bonding layer 30 (FIGS. 7A-1 and 7A). 2)).

Details of the configuration of the processed member 80 will be described in the fifth embodiment.

<< Formation of Starting Point of Peeling >> A processed member 80 is prepared in which a peeling starting point F3s is formed in the vicinity of the end of the bonding layer 30.

The peeling start point F3s has a structure in which a part of the first layer to be peeled F3 is separated from the first substrate F1.

A part of the first layer to be peeled F3 using a method of piercing the first layer to be peeled F3 with a sharp tip from the first substrate F1 side or a method using a laser or the like (for example, laser ablation method). Can be partially peeled from the release layer F2. Thereby, the peeling start point F3s can be formed.

<< First Step >> A processed member 80 is prepared in which a separation starting point F3s is formed in the vicinity of the end of the bonding layer 30 in advance (see FIGS. 7B-1 and 7B-2).

<< Second Step >> One surface layer 80b of the processed member 80 is peeled off. As a result, the first remaining portion 80a is obtained from the processed member 80.

Specifically, the first substrate F1 is separated from the first peelable layer F3 together with the first peelable layer F2 from the peeling start point F3s formed in the vicinity of the end of the bonding layer 30 (FIG. 7C )reference). Thereby, the 1st remaining part 80a provided with the base material S5 which the 1st to-be-separated layer F3, the bonding layer 30 in which one surface contact | connects the 1st to-be-separated layer F3, and the other surface of the bonding layer 30 contacts is obtained.

Alternatively, the vicinity of the interface between the peeling layer F2 and the layer to be peeled F3 may be irradiated with ions to peel off while removing static electricity. Specifically, you may irradiate the ion produced | generated using the ionizer.

Further, when the layer to be peeled is peeled from the peeling layer F2, the liquid is permeated into the interface between the peeling layer F2 and the layer to be peeled F3. Alternatively, the liquid may be ejected from the nozzle 99 and sprayed. For example, water, a polar solvent, or the like can be used for the liquid to be permeated or the liquid to be sprayed.

By infiltrating the liquid, it is possible to suppress the influence of static electricity or the like generated with the peeling. Moreover, you may peel, infiltrating the liquid which melt | dissolves a peeling layer.

In particular, when a film containing tungsten oxide is used for the peeling layer F2, if the first peeled layer F3 is peeled while infiltrating or spraying a liquid containing water, the stress accompanying the peeling applied to the first peeled layer F3 Can be reduced.

<< 3rd step >> The 1st adhesive layer 31 is formed in the 1st remaining part 80a, and the 1st remaining part 80a and the 1st support body 41 are bonded together using the 1st adhesive layer 31 (FIG. 7 ( D-1) and FIG. 7 (D-2)). Thereby, the laminated body 81 is obtained from the 1st remaining part 80a.

Specifically, the first support 41, the first adhesive layer 31, the first peeled layer F3, the bonding layer 30 whose one surface is in contact with the first peeled layer F3, and the bonding layer The base material S5 which the base material S5 which the other surface of 30 touches is obtained (refer FIG. 7 (E-1) and FIG. 7 (E-2)).

Various methods can be used for forming the bonding layer 30. For example, the bonding layer 30 is formed using a dispenser, a screen printing method, or the like. The bonding layer 30 is cured using a method corresponding to the material used for the bonding layer 30. For example, in the case where a photocurable adhesive is used for the bonding layer 30, light including light having a predetermined wavelength is irradiated.

Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

Embodiment 4 In this embodiment, a method for manufacturing a stack which can be used for manufacturing an input portion, a display portion, or an input / output device of one embodiment of the present invention is described with reference to FIGS. While explaining.

FIG. 8 and FIG. 9 are schematic views for explaining a process for producing a laminated body. 8 and 9 are cross-sectional views illustrating the configuration of the processed member and the laminated body, and the corresponding top views are shown except for FIGS. 8C, 9B, and 9C. Shown on the right.

<Method for Producing Laminate> A method for producing the laminate 92 from the processed member 90 will be described with reference to FIGS.

The processed member 90 is different from the processed member 80 in that the other surface of the bonding layer 30 is in contact with one surface of the second layer to be peeled S3 instead of the substrate S5.

Specifically, instead of the base material S5, the second substrate S1, the second peeling layer S2 on the second substrate S1, and the second peeling layer where the second peeling layer S2 is in contact with the other surface. It has S3, and is different in that one surface of the second peelable layer S3 is in contact with the other surface of the bonding layer 30.

The processed member 90 includes a first substrate F1, a first peeling layer F2, a first peeling layer F3 whose one surface is in contact with the first peeling layer F2, and the other of the first peeling layer F3. A bonding layer 30 with one surface in contact with the other surface, a second layer to be peeled S3 with one surface in contact with the other surface of the bonding layer 30, and one surface with the other surface of the second layer to be peeled S3. The second peeling layer S2 in contact with the second substrate S1 and the second substrate S1 are arranged in this order (see FIGS. 8A-1 and 8A-2).

Details of the configuration of the processed member 90 will be described in a fifth embodiment.

<< First Step >> A processed member 90 is prepared in which a separation starting point F3s is formed in the vicinity of the end of the bonding layer 30 (see FIGS. 8B-1 and 8B-2).

The peeling start point F3s has a structure in which a part of the first layer to be peeled F3 is separated from the first substrate F1.

For example, by using a method of piercing the first layer to be peeled F3 with a sharp tip from the first substrate F1 side, a method using a laser or the like (for example, a laser ablation method), etc., the first layer to be peeled F3 A part can be partially peeled from the peeling layer F2. Thereby, the peeling start point F3s can be formed.

<< Second Step >> One surface layer 90b of the workpiece 90 is peeled off. As a result, the first remaining portion 90a is obtained from the processed member 90.

Specifically, the first substrate F1 is separated from the first peelable layer F3 together with the first peelable layer F2 from the peeling start point F3s formed near the end of the bonding layer 30 (FIG. 8C )reference). Accordingly, the first layer to be peeled F3, the bonding layer 30 in which one surface is in contact with the first layer to be peeled F3, and the second layer to be peeled S3 in which one surface is in contact with the other surface of the bonding layer 30. Then, the first remaining portion 90a in which the second peeling layer S2 whose one surface is in contact with the other surface of the second layer to be peeled S3 and the second substrate S1 are arranged in this order is obtained.

Alternatively, the interface between the release layer S2 and the layer to be peeled S3 may be irradiated with ions to release the static electricity while removing the static electricity. Specifically, you may irradiate the ion produced | generated using the ionizer.

Further, when the layer to be peeled is peeled from the peeling layer S2, the liquid is permeated into the interface between the peeling layer S2 and the layer to be peeled S3. Alternatively, the liquid may be ejected from the nozzle 99 and sprayed. For example, water, a polar solvent, or the like can be used for the liquid to be permeated or the liquid to be sprayed.

By infiltrating the liquid, it is possible to suppress the influence of static electricity or the like generated with the peeling. Moreover, you may peel, infiltrating the liquid which melt | dissolves a peeling layer.

In particular, when a film containing tungsten oxide is used for the peeling layer S2, if the first peeled layer S3 is peeled while infiltrating or spraying a liquid containing water, the stress accompanying the peeling applied to the first peeled layer S3 Can be reduced.

<< Third Step >> The first adhesive layer 31 is formed on the first remaining portion 90a (see FIG. 8D-1 and FIG. 8D-2), and the first adhesive layer 31 is used to form the first adhesive layer 31. The remaining one 90a and the first support 41 are bonded together. Thereby, the laminated body 91 is obtained from the 1st remaining part 90a.

Specifically, the first support 41, the first adhesive layer 31, the first peeled layer F3, the bonding layer 30 whose one surface is in contact with the first peeled layer F3, and the bonding layer A second peelable layer S3 in which one surface is in contact with the other surface of 30; a second peelable layer S2 in which one surface is in contact with the other surface of the second peelable layer S3; and a second substrate S1 Then, a laminated body 91 is arranged in this order (see FIGS. 8E-1 and 8E-2).

<< Sixth Step >> A part of the second layer to be peeled S3 in the vicinity of the end of the first adhesive layer 31 of the laminated body 91 is separated from the second substrate S1, and the second peeling starting point 91s is formed.

For example, the first support body 41 and the first adhesive layer 31 are cut from the first support body 41 side, and the second object is formed along the edge of the newly formed first adhesive layer 31. A part of the release layer S3 is separated from the second substrate S1.

Specifically, the first adhesive layer 31 and the first support body 41 in the region where the second layer to be peeled S3 is provided on the peeling layer S2 are used by using a blade having a sharp tip or the like. A part of the second layer to be peeled S3 is separated from the second substrate S1 along the edge of the first adhesive layer 31 that has been cut and newly formed (FIG. 9A-1) and (See FIG. 9A-2).

By this step, a separation starting point 91 s is formed in the vicinity of the end portions of the newly formed first support body 41 b and the first adhesive layer 31.

<< Seventh Step >> The second remaining portion 91a is separated from the laminate 91. Thereby, the second remaining portion 91a is obtained from the stacked body 91. (See FIG. 9C).

Specifically, the second substrate S1 is separated from the second peelable layer S3 together with the second peelable layer S2 from the peeling starting point 91s formed near the end of the first adhesive layer 31. Thus, the first support 41b, the first adhesive layer 31, the first peeled layer F3, the bonding layer 30 whose one surface is in contact with the first peeled layer F3, and the bonding layer 30 A second remaining portion 91a is obtained in which the second layer to be peeled S3 whose one surface is in contact with the other surface is disposed in this order.

Alternatively, the interface between the release layer S2 and the layer to be peeled S3 may be irradiated with ions to release the static electricity while removing the static electricity. Specifically, you may irradiate the ion produced | generated using the ionizer.

Further, when the layer to be peeled is peeled from the peeling layer S2, the liquid is permeated into the interface between the peeling layer S2 and the layer to be peeled S3. Alternatively, the liquid may be ejected from the nozzle 99 and sprayed. For example, water, a polar solvent, or the like can be used for the liquid to be permeated or the liquid to be sprayed.

By infiltrating the liquid, it is possible to suppress the influence of static electricity or the like generated with the peeling. Moreover, you may peel, infiltrating the liquid which melt | dissolves a peeling layer.

In particular, when a film containing tungsten oxide is used for the peeling layer S2, if the first peeled layer S3 is peeled while infiltrating or spraying a liquid containing water, the stress accompanying the peeling applied to the first peeled layer S3 Can be reduced.

<< Ninth Step >> The second adhesive layer 32 is formed on the second remaining portion 91a (see FIGS. 9D-1 and 9D-2).

The second remaining portion 91 a and the second support 42 are bonded together using the second adhesive layer 32. Through this step, the stacked body 92 is obtained from the second remaining portion 91a (see FIGS. 9E-1 and 9E-2).

Specifically, the first support 41b, the first adhesive layer 31, the first peeled layer F3, the bonding layer 30 whose one surface is in contact with the first peeled layer F3, and the bonding layer The stacked body 92 is provided with the second peelable layer S3 whose one surface is in contact with the other surface 30, the second adhesive layer 32, and the second support 42 in this order.

<Method for Producing Laminate Having Opening in Support> A method for producing a laminate having an opening in the support will be described with reference to FIG.

FIG. 10 is a diagram illustrating a method for manufacturing a stacked body having an opening through which a part of a layer to be peeled is exposed in a support. A cross-sectional view illustrating the configuration of the stacked body is shown on the left side of FIG. 10, and a corresponding top view is shown on the right side.

10A-1 to 10B-2 are diagrams illustrating a method for manufacturing a stacked body 92c having an opening using a second support 42b smaller than the first support 41b. is there.

FIGS. 10C-1 to 10D-2 are diagrams illustrating a method for manufacturing a stacked body 92d having an opening formed in the second support 42. FIGS.

<< Example 1 of Manufacturing Method of Laminated Body Having Opening in Support >> In the ninth step, a second support 42b smaller than the first support 41b is used instead of the second support 42. Except for the difference in use, this is a method for manufacturing a laminate having similar steps. Accordingly, a stacked body in which part of the second layer to be peeled S3 is exposed can be manufactured (see FIGS. 10A-1 and 10A-2).

A liquid adhesive can be used for the second adhesive layer 32. Alternatively, an adhesive (also referred to as a sheet-like adhesive) that is suppressed in fluidity and is previously formed into a sheet shape can be used. If a sheet-like adhesive is used, the amount of the adhesive layer 32 that protrudes outside the second support 42b can be reduced. Further, the thickness of the adhesive layer 32 can be easily made uniform.

Alternatively, the exposed portion of the second layer to be peeled S3 may be cut out so that the first layer to be peeled F3 is exposed (see FIGS. 10B-1 and 10B-2). ).

Specifically, scratches are formed on the exposed second layer to be peeled S3 using a blade or the like having a sharp tip. Next, for example, an adhesive tape or the like is applied to a part of the exposed second peelable layer S3 so that stress is concentrated in the vicinity of the scratch, and the second peelable layer S3 is attached together with the applied tape or the like. A part of the film can be peeled off, and the part can be selectively excised.

Further, a layer capable of suppressing the adhesion force of the bonding layer 30 to the first layer to be peeled F3 may be selectively formed on a part of the first layer to be peeled F3. For example, a material that is difficult to adhere to the bonding layer 30 may be selectively formed. Specifically, the organic material may be deposited in an island shape. As a result, a part of the bonding layer 30 can be easily selectively removed together with the second layer to be peeled S3. As a result, the first layer to be peeled F3 can be exposed.

For example, when the first layer to be peeled F3 includes a functional layer and a conductive layer F3b electrically connected to the functional layer, the conductive layer F3b is exposed to the opening of the second stacked body 92c. be able to. Thereby, for example, the conductive layer F3b exposed in the opening can be used as a terminal to which a signal is supplied.

As a result, the conductive layer F3b partially exposed in the opening can be used as a terminal from which a signal supplied from the functional layer can be extracted. Alternatively, a signal to which a functional layer is supplied can be used for a terminal to which an external device can supply.

<< Example 2 of Method for Manufacturing Laminate Having Opening on Support >> A mask 48 having an opening provided so as to overlap with the opening provided on the second support 42 is formed on the stack 92. Next, the solvent 49 is dropped into the opening of the mask 48. Thus, the second support 42 exposed to the opening of the mask 48 can be swollen or dissolved using the solvent 49 (see FIGS. 10C-1 and 10C-2).

After the excess solvent 49 is removed, stress is applied by rubbing the second support 42 exposed in the opening of the mask 48. Thereby, the second support 42 and the like that overlap the opening of the mask 48 can be removed.

In addition, if a solvent that swells or dissolves the bonding layer 30 is used, the first peelable layer F3 can be exposed (see FIGS. 10D-1 and 10D-2).

Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

(Embodiment 5) In this embodiment, a structure of a processed member that can be processed into the input portion, the display portion, or the input / output device of one embodiment of the present invention will be described with reference to FIGS.

FIG. 11 is a schematic diagram illustrating the configuration of a processed member that can be processed into a laminate.

FIG. 11A-1 is a cross-sectional view illustrating a configuration of a processed member 80 that can be processed into a laminate, and FIG. 11A-2 is a corresponding top view.

FIG. 11B-1 is a cross-sectional view illustrating a configuration of a processed member 90 that can be processed into a laminate, and FIG. 11B-2 is a corresponding top view.

<1. Example of Configuration of Processing Member> The processing member 80 includes a first substrate F1, a first peeling layer F2 on the first substrate F1, and a first peeled surface in which one surface is in contact with the first peeling layer F2. 11 (A-1) including the layer F3, the bonding layer 30 in which one surface is in contact with the other surface of the first peelable layer F3, and the base material S5 in which the other surface of the bonding layer 30 is in contact. FIG. 11 (A-2).

The separation starting point F3s may be provided in the vicinity of the end of the bonding layer 30.

<< 1st board | substrate >> The 1st board | substrate F1 will not be specifically limited if it is provided with the heat resistance of the grade which can endure a manufacturing process, and the thickness and magnitude | size applicable to a manufacturing apparatus.

An organic material, an inorganic material, a composite material of an organic material and an inorganic material, or the like can be used for the first substrate F1.

For example, an inorganic material such as glass, ceramics, or metal can be used for the first substrate F1.

Specifically, alkali-free glass, soda-lime glass, potash glass, crystal glass, or the like can be used for the first substrate F1.

Specifically, a metal oxide film, a metal nitride film, a metal oxynitride film, or the like can be used for the first substrate F1. For example, silicon oxide, silicon nitride, silicon oxynitride, an alumina film, or the like can be used for the first substrate F1.

Specifically, SUS (stainless steel), aluminum, or the like can be used for the first substrate F1.

For example, an organic material such as a resin, a resin film, or plastic can be used for the first substrate F1.

Specifically, a resin film or a resin plate such as polyester, polyolefin, polyamide, polyimide, polycarbonate, or acrylic resin can be used for the first substrate F1.

For example, a composite material in which a film such as a metal plate, a thin glass plate, or an inorganic material is bonded to a resin film or the like can be used for the first substrate F1.

For example, a composite material in which a fibrous or particulate metal, glass, inorganic material, or the like is dispersed in a resin film can be used for the first substrate F1.

For example, a composite material in which a fibrous or particulate resin, an organic material, or the like is dispersed in an inorganic material can be used for the first substrate F1.

In addition, a single layer material or a stacked material in which a plurality of layers are stacked can be used for the first substrate F1. For example, a stacked material in which a base material and an insulating layer that prevents diffusion of impurities contained in the base material are stacked can be used for the first substrate F1.

Specifically, a laminated material in which one or a plurality of films selected from glass, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or the like that prevents diffusion of impurities contained in the glass is laminated, is used as the first substrate. Applicable to F1.

Alternatively, a stacked material in which a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or the like that prevents resin and diffusion of impurities that permeate the resin is stacked can be applied to the first substrate F1.

<< First Release Layer >> The first release layer F2 is provided between the first substrate F1 and the first peel-off layer F3. The first peeling layer F2 is a layer in which a boundary capable of separating the first peeling layer F3 from the first substrate F1 is formed in the vicinity thereof. The first release layer F2 is not particularly limited as long as the release layer is formed on the first release layer F2 and has heat resistance enough to withstand the manufacturing process of the first release layer F3.

For example, an inorganic material, an organic resin, or the like can be used for the first peeling layer F2.

Specifically, a metal containing an element selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, iridium, silicon, an alloy containing the element, or the An inorganic material such as a compound containing an element can be used for the first release layer F2.

Specifically, an organic material such as polyimide, polyester, polyolefin, polyamide, polycarbonate, or acrylic resin can be used.

For example, a single layer material or a material in which a plurality of layers are stacked can be used for the first peeling layer F2.

Specifically, a material in which a layer containing tungsten and a layer containing an oxide of tungsten are stacked can be used for the first separation layer F2.

Note that the layer containing an oxide of tungsten can be formed by a method in which another layer is stacked on the layer containing tungsten. Specifically, a layer containing an oxide of tungsten may be formed by a method of stacking silicon oxide, silicon oxynitride, or the like on a layer containing tungsten.

In addition, a layer containing tungsten oxide, a surface of the layer containing tungsten is subjected to thermal oxidation treatment, oxygen plasma treatment, nitrous oxide (N ₂ O) plasma treatment, or a solution having strong oxidizing power (eg, ozone water). You may form by the process etc. to be used.

Specifically, a layer containing polyimide can be used for the first peeling layer F2. The layer containing polyimide has heat resistance enough to withstand various manufacturing processes required when forming the first layer to be peeled F3.

For example, the layer containing polyimide has heat resistance of 200 ° C. or higher, preferably 250 ° C. or higher, more preferably 300 ° C. or higher, more preferably 350 ° C. or higher.

A film containing polyimide condensed by heating the film containing the monomer formed on the first substrate F1 can be used.

<< First Peeling Layer >> The first peeling layer F3 is not particularly limited as long as it can be separated from the first substrate F1 and has heat resistance enough to withstand the manufacturing process.

The boundary where the first peelable layer F3 can be separated from the first substrate may be formed between the first peelable layer F3 and the first peelable layer F2, and the first peelable layer F2 And the first substrate F1.

In the case where a boundary is formed between the first peelable layer F3 and the first peelable layer F2, the first peelable layer F2 is not included in the stacked body, and the first peelable layer F2 and the first substrate F1. In the case where a boundary is formed between the first release layer F2 and the first release layer F2 is included in the laminate.

An inorganic material, an organic material, a single layer material, a stacked material layer in which a plurality of layers are stacked, or the like can be used for the first peel-off layer F3.

For example, an inorganic material such as a metal oxide film, a metal nitride film, or a metal oxynitride film can be used for the first peel-off layer F3.

Specifically, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, an aluminum oxide film, or the like can be used for the first peel-off layer F3.

For example, a resin, a resin film, a plastic, or the like can be used for the first layer to be peeled F3.

Specifically, a polyimide film or the like can be used for the first layer to be peeled F3.

For example, a functional layer that overlaps with the first release layer F2 and an insulating layer that can prevent unintended diffusion of impurities that impair the function of the functional layer are stacked between the first release layer F2 and the functional layer. A material having a different structure can be used.

Specifically, a laminated material in which a glass plate having a thickness of 0.7 mm is used for the first substrate F1 and a silicon oxynitride film having a thickness of 200 nm and a tungsten film having a thickness of 30 nm are sequentially stacked from the first substrate F1 side. Used for the first release layer F2. A film including a stacked material in which a silicon oxynitride film having a thickness of 600 nm and a silicon nitride having a thickness of 200 nm are stacked in this order from the first peeling layer F2 side can be used for the first peeling layer F3. Note that the silicon oxynitride film has a higher oxygen composition than the nitrogen composition, and the silicon nitride oxide film has a higher nitrogen composition than the oxygen composition.

Specifically, instead of the first layer to be peeled F3, a silicon oxynitride film with a thickness of 600 nm, a silicon nitride with a thickness of 200 nm, and a silicon oxynitride with a thickness of 200 nm are sequentially formed from the first peeling layer F2 side. A film including a stacked material in which a film, a silicon nitride oxide film with a thickness of 140 nm and a silicon oxynitride film with a thickness of 100 nm are stacked can be used as the layer to be peeled.

Specifically, a stacked material in which a polyimide film, a layer containing silicon oxide, silicon nitride, or the like, and a functional layer are sequentially stacked from the first release layer F2 side can be used.

<< Functional Layer >> The functional layer is included in the first layer to be peeled F3.

For example, a functional circuit, a functional element, an optical element, a functional film, or the like, or a layer including a plurality selected from these can be used for the functional layer.

Specifically, a display element that can be used in a display device, a pixel circuit that drives the display element, a drive circuit that drives the pixel circuit, a color filter, a moisture-proof film, or a layer including a plurality selected from these Can do.

<< Joint Layer >> The joint layer 30 is not particularly limited as long as it joins the first peelable layer F3 and the substrate S5.

An inorganic material, an organic material, a composite material of an inorganic material and an organic material, or the like can be used for the bonding layer 30.

For example, a glass layer or an adhesive having a melting point of 400 ° C. or lower, preferably 300 ° C. or lower can be used.

For example, an organic material such as a photocurable adhesive, a reactive curable adhesive, a thermosetting adhesive, and / or an anaerobic adhesive can be used for the bonding layer 30.

Specifically, an adhesive including epoxy resin, acrylic resin, silicone resin, phenol resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resin, and the like. Can be used.

<< Substrate >> The substrate S5 is not particularly limited as long as it has heat resistance enough to withstand the manufacturing process and a thickness and size applicable to the manufacturing apparatus.

As a material that can be used for the base material S5, for example, the same material as that of the first substrate F1 can be used.

<< Starting Point of Separation >> The processed member 80 may have a starting point F3s of peeling near the end of the bonding layer 30.

The peeling start point F3s has a structure in which a part of the first layer to be peeled F3 is separated from the first substrate F1.

A part of the first layer to be peeled F3 using a method of piercing the first layer to be peeled F3 with a sharp tip from the first substrate F1 side or a method using a laser or the like (for example, laser ablation method). Can be partially peeled from the release layer F2. Thereby, the peeling start point F3s can be formed.

<2. Configuration Example 2 of Processing Member> A configuration of a processing member different from the above, which can be a laminated body, will be described with reference to FIGS. 11B-1 and 11B-2.

The processed member 90 is different from the processed member 80 in that the other surface of the bonding layer 30 is in contact with one surface of the second layer to be peeled S3 instead of the substrate S5.

Specifically, the processed member 90 includes a first substrate F1 on which a first peeling layer F3 having a first surface in contact with the first peeling layer F2 and the first peeling layer F2, and a second substrate F1 is formed. The second substrate S1 on which the second layer to be peeled S3 in contact with the peeling layer S2 and the second peeling layer S2 is formed, and one surface on the other surface of the first peeling layer F3. And a bonding layer 30 in contact with one surface of the second layer to be peeled S3 and the other surface. (See FIGS. 11B-1 and 11B-2).

<< Second Substrate >> The second substrate S1 can be the same as the first substrate F1. Note that the second substrate S1 need not have the same configuration as the first substrate F1.

<< Second Release Layer >> The second release layer S2 can have the same configuration as the first release layer F2. Further, the second release layer S2 can have a different structure from the first release layer F2.

<< Second Peeled Layer >> The second peelable layer S3 can have the same structure as the first peelable layer F3. Further, the second layer to be peeled S3 may have a different structure from the first layer to be peeled F3.

Specifically, the first peel-off layer F3 may include a functional circuit, and the second peel-off layer S3 may include a functional layer that prevents diffusion of impurities into the functional circuit.

Specifically, the first peelable layer F3 includes a light emitting element that emits light toward the second peelable layer, a pixel circuit that drives the light emitting element, and a drive circuit that drives the pixel circuit. The second peelable layer S3 may include a color filter that transmits part of light emitted from the element and a moisture-proof film that prevents diffusion of impurities into the light-emitting element. Note that the processed member having such a structure can be a stacked body that can be used as a flexible display device.

Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

Embodiment 6 In this embodiment, the structure of an information processing device of one embodiment of the present invention will be described with reference to FIG.

FIG. 12 illustrates an information processing device of one embodiment of the present invention.

12A is a projection view illustrating a state where the input / output device K20 of the information processing device K100 according to one embodiment of the present invention is developed, and FIG. 12B is a cut line X1- in FIG. It is sectional drawing of information processing apparatus K100 in X2. FIG. 12C is a projection view illustrating a state in which the input / output device K20 is folded.

<Configuration Example of Information Processing Device> The information processing device K100 described in the present embodiment includes an input / output device K20, an arithmetic device K10, and housings K01 (1) to K01 (3) (FIG. 12). reference).

<< Input / Output Device >> The input / output device K20 includes a display unit K30 and an input unit K40. The input / output device K20 is supplied with the image information V and supplies the detection information S.

The display unit K30 is supplied with the image information V, and the input unit K40 supplies the detection information S (see FIG. 12B).

The input / output device K20 in which the input unit K40 and the display unit K30 are overlapped with each other is the display unit K30 and the input unit K40.

The input / output device K20 using a touch sensor for the input unit K40 and a display panel for the display unit K30 is a touch panel.

<< Display Unit >> The display unit K30 includes a first region K31 (11), a first bendable region K31 (21), a second region K31 (12), a second bendable region K31 (22), and a first bendable region K31 (22). Three regions K31 (13) have regions K31 arranged in a stripe pattern in this order (see FIG. 12A).

The display unit K30 is folded at the first fold formed in the first bendable region K31 (21) and the second fold formed in the second bendable region K31 (22), and An expanded state can be obtained (see FIGS. 12A and 12C).

<< Calculation Device >> The calculation device K10 includes a calculation unit and a storage unit that stores a program to be executed by the calculation unit. In addition, image information V and detection information S are supplied.

<< Housing >> The housing includes a housing K01 (1), a hinge K02 (1), a housing K01 (2), a hinge K02 (2), and a housing K01 (3), which are arranged in this order.

The housing K01 (3) houses the arithmetic device K10. The housings K01 (1) to K01 (3) can hold the input / output device K20 so that the input / output device K20 can be folded or unfolded (FIG. 12B). reference).

In the present embodiment, an information processing apparatus having a configuration in which three housings are connected using two hinges is illustrated. An information processing apparatus having this configuration can fold the input / output device K20 at two locations.

Note that n (n is a natural number of 2 or more) casings may be connected using (n−1) hinges. An information processing apparatus having this configuration can fold the input / output device K20 at (n-1) locations.

The housing K01 (1) overlaps with the first region K31 (11) and includes a button K45 (1).

The housing K01 (2) overlaps with the second region K31 (12).

The housing K01 (3) overlaps with the third region K31 (13) and houses the arithmetic device K10, the antenna K10A, and the battery K10B.

The hinge K02 (1) overlaps the first bendable region K31 (21) and connects the housing K01 (1) to the housing K01 (2) so as to be rotatable.

The hinge K02 (2) overlaps the second bendable region K31 (22), and connects the housing K01 (2) to the housing K01 (3) so as to be rotatable.

The antenna K10A is electrically connected to the arithmetic device K10 and is supplied with or supplied with a signal.

The antenna K10A is wirelessly supplied with power from an external device, and supplies power to the battery K10B.

The battery K10B is electrically connected to the arithmetic device K10 and supplies or supplies power.

<< Folding sensor >> The folding sensor K41 detects whether the casing is folded or unfolded, and supplies information indicating the state of the casing.

The arithmetic device K10 is supplied with information indicating the state of the housing.

When the information indicating the state of the housing is information indicating the folded state, the arithmetic device K10 supplies the image information V including the first image to the first region K31 (11) (FIG. 12C). reference).

When the information indicating the state of the housing K01 is information indicating the developed state, the arithmetic device K10 supplies the image information V to the region K31 of the display unit K30 (FIG. 12A).

Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

Embodiment 7 In this embodiment, a structure of an information processing device of one embodiment of the present invention will be described with reference to FIG.

FIG. 13 illustrates an information processing device of one embodiment of the present invention.

13A-1 to 13A-3 are projection views of an information processing device of one embodiment of the present invention.

13B-1 and 13B-2 are projection views of an information processing device of one embodiment of the present invention.

13C-1 to 13C-2 are a top view and a bottom view of an information processing device of one embodiment of the present invention.

<< Information Processing Device A >> The information processing device 3000A includes an input / output unit 3120 and a housing 3101 that supports the input / output unit 3120 (see FIGS. 13A-1 to 13A-3).

The information processing device 3000A includes a power source such as a calculation unit and a storage unit that stores a program to be executed by the calculation unit, and a battery that supplies power for driving the calculation unit.

Note that the housing 3101 houses a calculation unit, a storage unit, a battery, or the like.

The information processing apparatus 3000A can display display information on a side surface and / or an upper surface.

A user of the information processing apparatus 3000A can supply an operation command using a finger in contact with the side surface and / or the upper surface.

<< Information Processing Device B >> The information processing device 3000B includes an input / output unit 3120 and an input / output unit 3120b (see FIGS. 13B-1 and 13B-2).

The information processing apparatus 3000B includes a housing 3101 that supports the input / output unit 3120 and a flexible belt-shaped housing 3101b.

The information processing apparatus 3000B includes a housing 3101 that supports the input / output unit 3120b.

The information processing device 3000B includes a power source such as a calculation unit and a storage unit that stores a program to be executed by the calculation unit, and a battery that supplies power for driving the calculation unit.

Note that the housing 3101 houses a calculation unit, a storage unit, a battery, or the like.

The information processing device 3000B can display display information on the input / output unit 3120 supported by the flexible belt-shaped housing 3101b.

A user of the information processing device 3000B can supply an operation command using a finger in contact with the input / output unit 3120.

<< Information Processing Device C >> The information processing device 3000C includes an input / output unit 3120 and a housing 3101 and a housing 3101b that support the input / output unit 3120 (see FIGS. 13C-1 to 13C-2). ).

The input / output unit 3120 and the housing 3101b have flexibility.

The information processing device 3000C includes a power source such as a calculation unit and a storage unit that stores a program to be executed by the calculation unit, and a battery that supplies power for driving the calculation unit.

Note that the housing 3101 houses a calculation unit, a storage unit, a battery, or the like.

The information processing apparatus 3000C can be folded in two at the housing 3101b.

Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

C1 Capacitance element FPC1 Flexible printed circuit board FPC2 Flexible printed circuit board F1 Board F2 Peeled layer F3 Peeled layer F3b Conductive layer F3s Starting point G1 Selection signal line K01 Housing K02 Hinge K10 Arithmetic device K10A Antenna K10B Battery K20 Input / output device K30 Display unit K31 Area K40 Input unit K41 Sensor K45 Button K100 Information processing device M1 Primary map MA Primary map MB Primary map M2 Secondary map M10 Amplifying transistor M12 Transistor S1 Substrate S2 Peeling layer S3 Peeled layer S5 Base SW1 First switch SW2 Second switch Switch U Detection unit 30 Bonding layer 31 Adhesive layer 32 Adhesive layer 41 Support body 41b Support body 42 Support body 42b Support body 48 Mask 49 Solvent 80 Processing member 80a Remaining 8 b Surface layer 81 Laminated body 90 Processing member 90a Remaining portion 90b Surface layer 91 Laminated body 91a Remaining portion 91s Starting point 92 Laminated body 92c Laminated body 92d Laminated body 99 Nozzle 100 Information processing apparatus 110 Arithmetic apparatus 111 Arithmetic section 112 Storage section 114 Transmission path 115 Input / output interface 120 Input / Output Device 130 Display Unit 131 Display Area 140 Input Unit 141 Input Unit 145 Input / Output Unit 150 Detection Unit 160 Communication Unit 500 Display Unit 500TP Input / Output Device 502 Pixel 502B Subpixel 502G Subpixel 502R Subpixel 502t Transistor 503c Capacity 503g Drive Circuit 503s Drive circuit 503t Transistor 510 Base material 510a Barrier film 510b Base material 510c Resin layer 511 Wiring 519 Terminal 521 Insulating film 528 Partition 550R Light emitting element 56 0 Sealant 580R Light emitting module 600 Input unit 602 Detection unit 603d Drive circuit 603g Drive circuit 610 Base material 610a Barrier film 610b Base material 610c Resin layer 650 Capacitor element 651 Electrode 652 Electrode 653 Insulating layer 667 Window part 670 Protective layer 670p Antireflection Layer 3000A Information processing device 3000B Information processing device 3000C Information processing device 3101 Case 3101b Case 3120 Input / output unit 3120b Input / output unit

Claims (4)

1. An input unit and an arithmetic unit;
   The computing device is supplied with a map;
   The map includes a plurality of primary maps;
   The arithmetic unit is:
   A storage unit for storing a program for supplying a predetermined command based on the map;
   An arithmetic unit that executes the program,
   The program is
   A first step of permitting interrupt processing;
   A second step of extracting patterns contained in the data set;
   Checking the pattern against a reference table and proceeding to a third step if the pattern matches a predetermined pattern; otherwise, proceeding to the second step;
   Providing a command associated with the predetermined pattern and proceeding to the second step, and a fourth step,
   The interrupt process is
   A fifth step of obtaining the plurality of primary maps;
   A sixth step of performing a secondary map generation process for generating a secondary map based on the plurality of primary maps;
   A seventh step of generating a binarization map based on the secondary map;
   An eighth step of generating labeling data based on the binarization map;
   And a ninth step of generating or updating the data set based on the labeling data and proceeding to the first step.
2. The secondary map generation process
   A tenth step of generating an average value from the plurality of primary maps and generating a map obtained by averaging the plurality of primary maps;
   The information processing apparatus according to claim 1, further comprising: an eleventh step of converting a value exceeding an upper limit value included in the averaged map into an upper limit value and converting a value lower than the lower limit value into a lower limit value. .
3. Having a display,
   The information processing apparatus according to claim 1, wherein a period during which a signal for driving the display unit is transmitted and a period during which the plurality of primary maps are acquired include a period at least partially overlapping.
4. The information processing apparatus according to any one of claims 1 to 3, wherein the input unit can be in a developed state or a folded state.

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