WO2015178625A1 - Led lighting apparatus having electromagnetic wave shielding circuit applied thereto - Google Patents

Led lighting apparatus having electromagnetic wave shielding circuit applied thereto Download PDF

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Publication number
WO2015178625A1
WO2015178625A1 PCT/KR2015/004840 KR2015004840W WO2015178625A1 WO 2015178625 A1 WO2015178625 A1 WO 2015178625A1 KR 2015004840 W KR2015004840 W KR 2015004840W WO 2015178625 A1 WO2015178625 A1 WO 2015178625A1
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electromagnetic wave
led lighting
heat sink
led
aluminum heat
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PCT/KR2015/004840
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French (fr)
Korean (ko)
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김진형
이병선
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주식회사 디에스피
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Publication of WO2015178625A1 publication Critical patent/WO2015178625A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V25/00Safety devices structurally associated with lighting devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals

Definitions

  • the present invention relates to an LED lighting device to which an electromagnetic wave shielding circuit is applied, and more particularly, to an LED lighting device in which an aluminum heat sink collects electromagnetic waves, converts them into surface currents, and discharges them through ground.
  • a light emitting diode is a device in which electrons and holes meet and emit light at a PN junction by applying an electric current, and are generally manufactured in a package structure in which an LED chip is mounted. It is called 'LED package'.
  • the LED package as described above is generally mounted on a printed circuit board (hereinafter, referred to as a PCB) and configured to emit light by receiving a current from an electrode formed on the printed circuit board.
  • a PCB printed circuit board
  • heat generated from the LED chip directly affects the light emitting performance and the lifetime of the LED package. The reason is that heat generated in an LED chip causes dislocations and mismatches in the crystal structure of the LED chip when the LED chip stays in the LED chip for a long time.
  • a heat sink slug made of a metal material having excellent thermal conductivity is inserted into the package body, and the LED chip is mounted on the heat slug.
  • LED package Such a conventional LED package is arranged so that the heat dissipation slug is in contact with the PCB, the heat of the LED chip is transferred to the PCB via the heat dissipation slug.
  • an LED package is arranged on a metal PCB, and a heat sink is installed under the metal PCB.
  • thermoplastic resins are inferior in heat dissipation because of their extremely low thermal conductivity. Therefore, the thermoplastic resins cannot be used without imparting thermal conductivity to the heat dissipation member for the LED lighting housing.
  • blending a high thermal conductivity filler is proposed.
  • the LED lighting housing requires flame retardancy, insulation, and good molding processability, and since there is no thermoplastic resin that satisfies all of them, resinization of the LED lighting housing has not yet been achieved.
  • the weight reduction by resinization and the beautiful white appearance are calculated
  • LED devices have been in the spotlight as light sources of various lighting devices.
  • the LED element is very small compared to the conventional illumination light source, and has very excellent characteristics such as low power consumption, long life, and fast reaction speed. In addition, it does not emit harmful waves such as ultraviolet rays and is environmentally friendly since it does not use mercury and other discharge gases.
  • the lighting device using the LED element has an electronic circuit built in the power module, the electromagnetic waves of high frequency, high power is emitted to the outside, which may adversely affect the user's body. Specifically, when the human body is exposed to electromagnetic waves, it may result in dermatitis, headache, chronic fatigue, premature birth and birth defects. Therefore, there is a need for a device that effectively blocks electromagnetic waves and a blocking technology.
  • the present invention has been made to solve the above problems, in the LED lighting apparatus to which the electromagnetic wave blocking circuit is applied, a plurality of LED lighting, a flexible circuit board on which the plurality of LED lighting is seated, the flexible flexible LED
  • An aluminum heat sink installed over the entire back surface of the circuit board, an electromagnetic wave blocking circuit module connected to the aluminum heat sink, a converter for converting between AC and DC, a circuit board on which circuit components are installed, a power supply unit for supplying power, and each component Comprising a plurality of conductors electrically connected
  • the aluminum heat sink is an antenna that collects electromagnetic waves, and provides an LED lighting fixture applying an electromagnetic wave blocking circuit that converts the collected electromagnetic waves into a surface current to discharge through the ground.
  • the present invention is a method of electromagnetic shielding of the LED lighting fixture, when the aluminum heat sink first absorbs electromagnetic waves, the surface current is generated on the surface of the aluminum heat sink by the absorbed electromagnetic waves, the surface current of the alternating current in the electromagnetic wave shield circuit module After the conversion to the DC current, the converted DC current is discharged through the ground to provide an electromagnetic shielding method of the LED lighting fixture that can block the electromagnetic waves.
  • the aluminum heat sink of the present invention not only functions to conduct and diffuse heat, but also functions as an antenna for collecting electromagnetic waves, thereby eliminating the need for additional means for collecting and absorbing electromagnetic waves. , Space efficient.
  • the aluminum heat sink of the present invention includes a guide portion for fixing the flexible circuit board, an electromagnetic shielding circuit module, a circuit board, and a storage space for arranging various conductors, thereby securing stability in fixing the LED lighting, and space efficiency. Can increase.
  • 1 is a block diagram showing the basic components of the LED lighting fixture.
  • FIG. 2 is a circuit diagram of an embodiment of an electromagnetic wave blocking circuit module of the present invention.
  • Figure 3 is a flow chart of the electromagnetic wave blocking method of the LED lighting fixture of the present invention.
  • FIG. 4 is an exemplary view of manufacturing the electromagnetic wave blocking circuit module of the present invention integrally with a circuit board.
  • FIG. 5 is an exemplary view of fixing a circuit diagram and a spring to a rear surface of a flexible circuit board to which an LED bulb lamp is fixed as another embodiment of the present invention.
  • the present invention relates to an LED (Light Emitting Diode) luminaire to which an electromagnetic wave shielding circuit is applied, and more particularly, to an LED luminaire that an aluminum heat sink collects electromagnetic waves, converts them into surface current, and sends them to the outside through ground. It is about.
  • LED Light Emitting Diode
  • the luminaire may be any one of an LED fluorescent lamp, an LED bulb (bulb), a downlight factory lamp, a flat panel lamp (panel lamp) or a spotlight, but is not limited thereto.
  • the aluminum heat sink 30 of the present invention functions as an antenna for collecting electromagnetic waves in addition to functioning as a heat sink, and the electromagnetic waves collected by the aluminum heat sink 30 are in the form of an alternating current by free electron vibration of an aluminum surface as a conductor. It is converted into surface current, which flows to the electromagnetic wave shield circuit module 40.
  • the aluminum heat sink 30 includes a guide part 31 for fixing the flexible circuit board 20 on which the plurality of LED lights 10 are seated, the electromagnetic wave blocking circuit module 40, and a circuit board on which the circuit parts are installed. It is preferable that the structure has a storage space (not shown) for accommodating the 60 and the conductive wire 80.
  • the aluminum heat sink 30 may be applied in various forms, including concave and convex shapes including concave and convex portions in order to increase the surface area and increase conversion efficiency.
  • the aluminum heat sink 30 of the present invention is an aluminum heat sink 30 installed over the entire back surface of the flexible circuit board 20, and collects electromagnetic waves generated from the LED light 10 and converts them into surface current, or the converter.
  • An aluminum heat dissipation plate 30 provided in the front portion of the unit 50 collects electromagnetic waves generated from the converter 50 and converts them into surface current.
  • the collected electromagnetic waves are converted into surface currents, which are alternating currents, and flowed to the electromagnetic wave blocking circuit module 40.
  • the alternating current is a surface current generated by electromagnetic waves touching a conductive object, and the surface current may flow along the surface of the conductive object.
  • the alternating current is a current in which electromagnetic waves generated from various electronic devices are converted into surface current and flows to the ground, or the alternating current is converted into surface current in electronic devices inside and outside the building, and flows to the ground of the building. It can be a current.
  • the present invention rectifies the surface current, which is the alternating current, including the electromagnetic wave blocking circuit module to convert the direct current into a direct current.
  • 2 illustrates an embodiment of the electromagnetic wave blocking circuit module 40.
  • the input unit 41 into which the AC current converted from the surface of the aluminum heat sink 30 is input, and the AC current input to the input unit 41 is input.
  • the rectifier 42 is converted into a DC current, an input terminal 43 for receiving a voltage input from the outside, and a ground providing unit 44 for generating ground with the voltage received from the input terminal 43.
  • This limits the inrush current of the NTC limits the surge by using a varistor, and limits the voltage of the input current by using Ohm's law, and adjusts the input voltage to almost zero in the rectifier circuit.
  • it is not limited to the circuit diagram shown in FIG.
  • the converter 50 may be a converter built-in type installed in the storage space of the aluminum heat sink 30 or a converter external type installed outside the aluminum heat sink 30.
  • the data obtained by repeatedly measuring a total of five times by installing the electromagnetic wave blocking circuit module (device) in the converter external converter and the converter internal converter are shown in Table 1 below.
  • the difference between not applying the electromagnetic wave shielding circuit module and applying the converter 50 and the electromagnetic wave shielding circuit module 40 to the outside was reduced to a maximum of 2%. 50) and when the electromagnetic wave shield circuit module 40 is applied inside, it is possible to completely block the electromagnetic waves.
  • FIG. 3 is a flowchart of a method for blocking electromagnetic waves of the LED lighting device of the present invention.
  • the aluminum heat sink 30 absorbs electromagnetic waves
  • surface current is generated on the surface of the aluminum heat sink 30 by the absorbed electromagnetic waves.
  • the phosphorus surface current is converted into a direct current in the rectifier 42 of the electromagnetic wave shield circuit module 40
  • the converted direct current is discharged through the ground, thereby blocking electromagnetic waves.
  • the ground may be at least one selected from an outlet ground, a neutral ground, a virtual ground, or a ground rod of a building.
  • FIG. 4 is an exemplary embodiment of the present invention, in which an electromagnetic wave blocking circuit module 40 of the present invention is integrally formed with an LED fluorescent lamp with a circuit board 60, and the input unit 41 shown in FIG. It is a way to protrude, and when the sliding fixed to the aluminum heat sink 30, it is in a form that can be immediately contacted.
  • FIG. 5 is an exemplary embodiment of the present invention, in which a circuit diagram and a spring are fixed to a rear surface of a flexible circuit board on which an LED bulb (bulb) lamp is fixed.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The present invention relates to an LED lighting apparatus having an electromagnetic wave shielding circuit applied thereto and, more specifically, to an LED lighting apparatus in which an aluminum radiator panel collects electromagnetic waves, converts the electromagnetic waves to a surface current, and discharges the surface current through grounding. Applying the LED lighting apparatus makes it possible to efficiently shield an electromagnetic wave occurring in an LED light, a converter, or other parts.

Description

전자파 차단회로를 적용한 엘이디 조명기구LED luminaire with electromagnetic wave blocking circuit
본 발명은 전자파 차단회로를 적용한 엘이디 조명기구에 관한 것으로, 보다 상세하게는 알루미늄 방열판이 전자파를 포집하여 표면전류로 변환하고 이것을 접지를 통해 방전하는 엘이디 조명기구에 관한 것이다.The present invention relates to an LED lighting device to which an electromagnetic wave shielding circuit is applied, and more particularly, to an LED lighting device in which an aluminum heat sink collects electromagnetic waves, converts them into surface currents, and discharges them through ground.
일반적으로, 발광다이오드(LED: Light Emitting Diode)는 전류 인가에 의해 P-N 반도체 접합(P-N junction)에서 전자와 정공이 만나 빛을 발하는 소자로서, 통상 LED 칩이 탑재된 패키지의 구조로 제작되며, 흔히 'LED 패키지'라고 칭해지고 있다. 위와 같은 LED 패키지는 일반적으로 인쇄회로기판(Printed Circuit Board: 이하, 'PCB'라 한다) 상에 장착되어 그 인쇄회로기판에 형성된 전극으로부터 전류를 인가받아 발광 동작하도록 구성된다. 상기 LED 패키지에 있어서, LED 칩으로부터 발생한 열은 LED 패키지의 발광 성능 및 수명에 직접적인 영향을 미친다. 그 이유는 LED 칩에 발생한 열이 그 LED 칩에 오래 머무르는 경우 LED 칩을 이루는 결정 구조에 전위(dislocation) 및 부정합(mismatch)을 일으키기 때문이다.In general, a light emitting diode (LED) is a device in which electrons and holes meet and emit light at a PN junction by applying an electric current, and are generally manufactured in a package structure in which an LED chip is mounted. It is called 'LED package'. The LED package as described above is generally mounted on a printed circuit board (hereinafter, referred to as a PCB) and configured to emit light by receiving a current from an electrode formed on the printed circuit board. In the LED package, heat generated from the LED chip directly affects the light emitting performance and the lifetime of the LED package. The reason is that heat generated in an LED chip causes dislocations and mismatches in the crystal structure of the LED chip when the LED chip stays in the LED chip for a long time.
이에 따라, 종래에는 LED 칩으로부터 발생한 열의 방출을 촉진시키기 위한 기술들이 제안된 바 있다. 그 중 대표적인 것은, LED 칩을 리드프레임 상에 장착하는 대신에, 패키지 몸체 내부에 열전도성이 뛰어난 금속소재의 방열 슬러그(Heat Sink-Slug)를 삽입 설치하고, 그 방열 슬러그에 LED 칩을 장착한 LED 패키지이다. 이러한 종래의 LED 패키지는 방열 슬러그가 PCB에 접하도록 배치되어, LED칩의 열이 방열 슬러그를 거쳐 PCB로 전달된다. 종래의 LED 방열 장치는 금속 PCB 위에 LED 패키지가 배치(Array)되어 있고, 상기 금속 PCB 아래에 방열판(Heat sink)이 설치되어 있다.Accordingly, in the related art, techniques for promoting the emission of heat generated from the LED chip have been proposed. Among them, instead of mounting the LED chip on the lead frame, a heat sink slug made of a metal material having excellent thermal conductivity is inserted into the package body, and the LED chip is mounted on the heat slug. LED package. Such a conventional LED package is arranged so that the heat dissipation slug is in contact with the PCB, the heat of the LED chip is transferred to the PCB via the heat dissipation slug. In a conventional LED heat dissipation device, an LED package is arranged on a metal PCB, and a heat sink is installed under the metal PCB.
현재의 LED 조명 하우징용 방열부재에는 금속 알루미늄이 사용되고 있는데, 열방사율이 극히 작기 때문에 알루마이트 처리나 도장, 핀형상으로 가공함으로써 열방사율을 부여하여 사용되고 있다. 따라서 생산성 악화와 고비용인 것이 과제가 되어 있는데, 금속 알루미늄으로부터 생산성이 우수한 열가소성 수지를 사용한 사출성형체로의 대체 요구가 강해지고 있다. 그러나 금속 알루미늄에 대조적으로 열가소성 수지는 열전도성이 극히 작기 때문에 방열성이 떨어지므로, LED조명 하우징용 방열부재에 사용하려면 열전도성을 부여하지 않고는 사용할 수 없다.Metal aluminum is currently used as a heat radiating member for LED lighting housings. Since the thermal emissivity is extremely small, it is used by giving heat emissivity by processing into anodizing, painting, or fin shape. Therefore, a problem of deterioration in productivity and high cost has been a problem, and there is an increasing demand for replacement from metallic aluminum to an injection molded product using a thermoplastic resin having excellent productivity. However, in contrast to metallic aluminum, thermoplastic resins are inferior in heat dissipation because of their extremely low thermal conductivity. Therefore, the thermoplastic resins cannot be used without imparting thermal conductivity to the heat dissipation member for the LED lighting housing.
열가소성 수지에 열전도성을 부여하는 방법으로서, 고열전도성 필러를 배합하는 방법이 제안되어 있다. 그러나 LED 조명 하우징에는 방열성 이외에도 난연성, 절연성, 양호한 성형 가공성이 필요한데, 이것들을 모두 충족하는 열가소성 수지가 없기 때문에 LED 조명 하우징의 수지화는 아직 달성되지 않았다. 또 최근에는 수지화에 의한 경량화나 백색의 미려한 외관도 요구되고 있다.As a method of providing thermal conductivity to a thermoplastic resin, the method of mix | blending a high thermal conductivity filler is proposed. However, in addition to heat dissipation, the LED lighting housing requires flame retardancy, insulation, and good molding processability, and since there is no thermoplastic resin that satisfies all of them, resinization of the LED lighting housing has not yet been achieved. Moreover, in recent years, the weight reduction by resinization and the beautiful white appearance are calculated | required.
최근 각종 조명장치의 광원으로 엘이디 소자가 각광받고 있다. 엘이디 소자는 종래의 조명광원에 비해 극소형이며, 소비전력이 적고, 수명이 길며, 반응속도가 빠른 등 매우 우수한 특성을 나타낸다. 이와 더불어서, 자외선과 같은 유해파를 방출하지 않으며, 수은 및 기타 방전용 가스를 사용하지 않으므로 환경친화적이다. 그러나, 상기 LED 소자를 이용한 조명장치는 전원 모듈 내에 전자회로가 내장되어 있어, 외부로 고주파, 고출력의 전자파가 방출되고, 이로 인해 사용자의 인체에 악영향을 끼칠 수 있다. 구체적으로, 인체가 전자파에 노출되는 경우, 피부염, 두통, 만성피로, 조산, 기형아 출산과 같은 결과를 초래할 수 있다. 따라서 전자파를 효과적으로 차단하는 장치와 차단 기술이 요구되는 실정이다.Recently, LED devices have been in the spotlight as light sources of various lighting devices. The LED element is very small compared to the conventional illumination light source, and has very excellent characteristics such as low power consumption, long life, and fast reaction speed. In addition, it does not emit harmful waves such as ultraviolet rays and is environmentally friendly since it does not use mercury and other discharge gases. However, the lighting device using the LED element has an electronic circuit built in the power module, the electromagnetic waves of high frequency, high power is emitted to the outside, which may adversely affect the user's body. Specifically, when the human body is exposed to electromagnetic waves, it may result in dermatitis, headache, chronic fatigue, premature birth and birth defects. Therefore, there is a need for a device that effectively blocks electromagnetic waves and a blocking technology.
이에 본 발명은 상기의 과제를 해결하기 위해 안출된 것으로, 전자파 차단회로를 적용한 엘이디 조명기구에 있어서, 다수의 엘이디 조명, 상기 다수의 엘이디 조명이 안착되는 연성회로기판, 상기 엘이디 조명이 안착되는 연성회로기판 이면의 전체에 걸쳐서 설치되는 알루미늄 방열판, 상기 알루미늄 방열판에 연결되는 전자파 차단 회로 모듈, 교류와 직류간의 변환을 위한 컨버터, 회로 부품들이 설치되는 회로기판, 전원을 공급하는 전원부 및 각 구성요소를 전기적으로 연결하는 다수의 도선을 포함하여 구성되며, 상기 알루미늄 방열판은 전자파를 포집하는 안테나이며 포집된 전자파를 표면전류로 변환하여 접지를 통해 방전하는 전자파 차단회로를 적용한 엘이디 조명기구을 제공한다.Accordingly, the present invention has been made to solve the above problems, in the LED lighting apparatus to which the electromagnetic wave blocking circuit is applied, a plurality of LED lighting, a flexible circuit board on which the plurality of LED lighting is seated, the flexible flexible LED An aluminum heat sink installed over the entire back surface of the circuit board, an electromagnetic wave blocking circuit module connected to the aluminum heat sink, a converter for converting between AC and DC, a circuit board on which circuit components are installed, a power supply unit for supplying power, and each component Comprising a plurality of conductors electrically connected, the aluminum heat sink is an antenna that collects electromagnetic waves, and provides an LED lighting fixture applying an electromagnetic wave blocking circuit that converts the collected electromagnetic waves into a surface current to discharge through the ground.
또한 본 발명은 엘이디 조명기구의 전자파 차단방법으로서, 먼저 알루미늄 방열판이 전자파를 흡수하면, 흡수된 전자파에 의해 알루미늄 방열판 표면에서 표면전류가 발생하게 되고, 상기 교류전류인 표면전류가 전자파 차단 회로 모듈에서 직류전류로 변환된 후, 상기 변환된 직류전류가 접지를 통해 방전됨으로써 전자파를 차단하는 것이 가능한 엘이디 조명기구의 전자파 차단방법을 제공한다.In addition, the present invention is a method of electromagnetic shielding of the LED lighting fixture, when the aluminum heat sink first absorbs electromagnetic waves, the surface current is generated on the surface of the aluminum heat sink by the absorbed electromagnetic waves, the surface current of the alternating current in the electromagnetic wave shield circuit module After the conversion to the DC current, the converted DC current is discharged through the ground to provide an electromagnetic shielding method of the LED lighting fixture that can block the electromagnetic waves.
본 발명의 전자파 차단회로를 적용한 엘이디 조명기구과 전자파 차단 방법을 적용하면, 첫 번째로 엘이디 조명, 컨버터 또는 그 외의 부품에서 발생되는 전자파를 효율적으로 차단하는 것이 가능하다.By applying the LED lighting device and the electromagnetic wave shielding method to which the electromagnetic wave shielding circuit of the present invention is applied, it is possible to effectively block electromagnetic waves generated from the LED lighting, the converter, or other components.
두 번째로 본 발명의 알루미늄 방열판은 열을 전도 및 확산시키는 기능을 할 뿐만 아니라 이에 나아가 전자파를 포집하는 안테나의 기능을 함으로써, 전자파를 포집 및 흡수하기 위한 별도의 수단을 추가할 필요가 없어 경제적이며, 공간 효율적이다.Secondly, the aluminum heat sink of the present invention not only functions to conduct and diffuse heat, but also functions as an antenna for collecting electromagnetic waves, thereby eliminating the need for additional means for collecting and absorbing electromagnetic waves. , Space efficient.
세 번째로 본 발명의 알루미늄 방열판은 연성회로기판을 고정하기 위한 가이드부와, 전자파 차단회로 모듈, 회로기판 및 여러 도선을 정리하는 수납공간을 구비하여 엘이디 조명을 고정하는데 안정성을 도모하며, 공간적 효율을 높일 수 있다.Thirdly, the aluminum heat sink of the present invention includes a guide portion for fixing the flexible circuit board, an electromagnetic shielding circuit module, a circuit board, and a storage space for arranging various conductors, thereby securing stability in fixing the LED lighting, and space efficiency. Can increase.
도 1은 엘이디 조명기구의 기본적 구성요소를 나타낸 블럭 구성도이다.1 is a block diagram showing the basic components of the LED lighting fixture.
도 2는 본 발명의 전자파 차단회로 모듈의 일실시예인 회로도이다.2 is a circuit diagram of an embodiment of an electromagnetic wave blocking circuit module of the present invention.
도 3은 본 발명의 엘이디 조명기구의 전자파 차단방법 순서도이다.Figure 3 is a flow chart of the electromagnetic wave blocking method of the LED lighting fixture of the present invention.
도 4는 본 발명의 전자파 차단회로 모듈을 회로기판과 일체형으로 제작한 실제 예시도이다.4 is an exemplary view of manufacturing the electromagnetic wave blocking circuit module of the present invention integrally with a circuit board.
도 5는 본 발명의 다른 실시예로서 엘이디 벌브(전구) 램프가 고정된 연성회로기판 뒷면에 회로도와 스프링이 고정된 실제 예시도이다.FIG. 5 is an exemplary view of fixing a circuit diagram and a spring to a rear surface of a flexible circuit board to which an LED bulb lamp is fixed as another embodiment of the present invention.
본 발명은 전자파 차단회로를 적용한 엘이디(LED: Light Emitting Diode) 조명기구에 관한 것으로, 보다 상세하게는 알루미늄 방열판이 전자파를 포집하여 표면전류로 변환하고 이것을 접지를 통해 외부로 흘려보내는 엘이디 조명기구에 관한 것이다. 이하 첨부되는 도면을 참조하여 본 발명을 상세히 설명한다.The present invention relates to an LED (Light Emitting Diode) luminaire to which an electromagnetic wave shielding circuit is applied, and more particularly, to an LED luminaire that an aluminum heat sink collects electromagnetic waves, converts them into surface current, and sends them to the outside through ground. It is about. Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
도 1은 엘이디 조명기구의 기본적 구성요소를 나타낸 블럭 구성도로서, 엘이디 조명(10), 상기 다수의 엘이디 조명(10)이 안착되는 연성회로기판(20), 교류와 직류간의 변환을 위한 컨버터, 엘이디 조명(10) 및 컨버터(50)에서 발열된 열을 전도 및 확산시키는 알루미늄 방열판(30), 상기 알루미늄 방열판(30)에 연결되는 전자파 차단 회로 모듈(40), 회로 부품들이 설치되는 회로기판(60) 및 전원을 공급하는 전원부(70)를 포함하며, 다수의 도선(80) 등으로 연결된 각 구성요소의 전기적 연결관계를 나타내고 있다. 상기 조명기구로는 엘이디 형광등, 엘이디 벌브(전구), 다운라이트 공장등, 평판등(판넬등) 또는 스포트라이트 중에서 어느 하나가 가능하나 이에 한정하지 않음은 물론이다.1 is a block diagram showing the basic components of the LED lighting fixture, LED lighting 10, a flexible circuit board 20 on which the plurality of LED lighting 10 is mounted, a converter for converting between alternating current and direct current, An aluminum heat sink 30 for conducting and diffusing heat generated by the LED lighting 10 and the converter 50, an electromagnetic wave blocking circuit module 40 connected to the aluminum heat sink 30, and a circuit board on which circuit components are installed ( 60) and a power supply unit 70 for supplying power, and shows electrical connection relations between the components connected to the plurality of conductive wires 80 and the like. The luminaire may be any one of an LED fluorescent lamp, an LED bulb (bulb), a downlight factory lamp, a flat panel lamp (panel lamp) or a spotlight, but is not limited thereto.
본 발명의 알루미늄 방열판(30)은 방열판으로서 기능 외에, 전자파를 포집하는 안테나로서 기능을 하며, 상기 알루미늄 방열판(30)에 의해 포집된 전자파는 도전체인 알루미늄 표면의 자유전자 진동에 의해 교류전류 형태의 표면전류로 변환되고, 이것은 전자파 차단회로 모듈(40)로 흐르게 된다. 이때 상기 알루미늄 방열판(30)은 상기 다수의 엘이디 조명(10)이 안착되는 연성회로기판(20)을 고정하는 가이드부(31)와 상기 전자파 차단회로 모듈(40), 상기 회로부품들이 설치된 회로기판(60) 및 상기 도선(80)을 수납하는 수납공간(미도시)을 갖춘 구조인 것이 바람직하다. 또한 상기 알루미늄 방열판(30)은 표면적을 넓혀 전환 효율을 높이기 위해 오목부와 볼록부를 포함하는 요철 형태를 비롯한 다양한 형태로의 응용이 가능하다.The aluminum heat sink 30 of the present invention functions as an antenna for collecting electromagnetic waves in addition to functioning as a heat sink, and the electromagnetic waves collected by the aluminum heat sink 30 are in the form of an alternating current by free electron vibration of an aluminum surface as a conductor. It is converted into surface current, which flows to the electromagnetic wave shield circuit module 40. In this case, the aluminum heat sink 30 includes a guide part 31 for fixing the flexible circuit board 20 on which the plurality of LED lights 10 are seated, the electromagnetic wave blocking circuit module 40, and a circuit board on which the circuit parts are installed. It is preferable that the structure has a storage space (not shown) for accommodating the 60 and the conductive wire 80. In addition, the aluminum heat sink 30 may be applied in various forms, including concave and convex shapes including concave and convex portions in order to increase the surface area and increase conversion efficiency.
본 발명의 알루미늄 방열판(30)은 연성회로기판(20) 이면의 전체에 걸쳐서 설치된 알루미늄 방열판(30)으로서, 상기 엘이디 조명(10)으로부터 발생되는 전자파를 포집하고 표면전류로 변환하거나, 또는 상기 컨버터(50)의 전면부에 설치된 알루미늄 방열판(30)으로서, 상기 컨버터(50)로부터 발생되는 전자파를 포집하고 표면전류로 변환하게 된다. 이렇게 포집된 전자파를 교류전류인 표면전류로 변환하고 상기 전자파 차단회로 모듈(40)로 흘려 보내게 된다. 이에 추가적으로 상기 엘이디 조명(10)의 전면부를 감싸며 반투명 재질의 조명 커버를 구비하는 것도 가능하다.The aluminum heat sink 30 of the present invention is an aluminum heat sink 30 installed over the entire back surface of the flexible circuit board 20, and collects electromagnetic waves generated from the LED light 10 and converts them into surface current, or the converter. An aluminum heat dissipation plate 30 provided in the front portion of the unit 50 collects electromagnetic waves generated from the converter 50 and converts them into surface current. The collected electromagnetic waves are converted into surface currents, which are alternating currents, and flowed to the electromagnetic wave blocking circuit module 40. In addition to this, it is also possible to surround the front part of the LED lighting 10 and have a translucent lighting cover.
상기 교류전류는 전자파가 전도성 물체에 닿아 생성된 표면전류로서, 상기 표면전류는 전도성 물체의 표면을 따라 흐를 수 있다. 예컨데 상기 교류전류는 다양한 전자기기에서 발생된 전자파가 표면전류로 변환되어 접지로 흘러가는 전류이거나, 상기 교류전류는 건물 내외부의 전자 기기에서 발생된 전자기파가 표면전류로 변환되어 건물의 접지로 흘러가는 전류일 수 있다.The alternating current is a surface current generated by electromagnetic waves touching a conductive object, and the surface current may flow along the surface of the conductive object. For example, the alternating current is a current in which electromagnetic waves generated from various electronic devices are converted into surface current and flows to the ground, or the alternating current is converted into surface current in electronic devices inside and outside the building, and flows to the ground of the building. It can be a current.
이에 나아가 본 발명은 전자파 차단회로 모듈을 포함하여 상기 교류전류인 표면전류를 정류하여 직류전류로 변환한다. 도 2는 상기 전자파 차단회로 모듈(40)의 일실시예에 관한 것으로, 상기 알루미늄 방열판(30) 표면에서 변환된 교류전류가 입력되는 입력부(41), 상기 입력부(41)에 입력된 교류전류가 직류전류로 변환되는 정류부(42), 외부로부터 입력되는 전압을 수신하는 입력단자(43), 및 상기 입력단자(43)로부터 수신된 전압으로 접지를 생성하는 접지제공부(44)를 포함한다. 이것은 NTC의 돌입전류를 제한하고, 배리스터를 이용하여 서지를 제한하며, 옴의 법칙을 이용하여 입력전류의 전압을 제한하여, 정류회로에서 입력전압을 거의 0으로 조절하게 되어, 쿨선과 0 전위의 상호관계를 통해 전자파의 표면전류를 원활하게 접지를 통해 방전시키기 위함이며, 도 2에 도시된 회로도에 국한되지 않음은 물론이다.In addition, the present invention rectifies the surface current, which is the alternating current, including the electromagnetic wave blocking circuit module to convert the direct current into a direct current. 2 illustrates an embodiment of the electromagnetic wave blocking circuit module 40. The input unit 41 into which the AC current converted from the surface of the aluminum heat sink 30 is input, and the AC current input to the input unit 41 is input. The rectifier 42 is converted into a DC current, an input terminal 43 for receiving a voltage input from the outside, and a ground providing unit 44 for generating ground with the voltage received from the input terminal 43. This limits the inrush current of the NTC, limits the surge by using a varistor, and limits the voltage of the input current by using Ohm's law, and adjusts the input voltage to almost zero in the rectifier circuit. In order to smoothly discharge the surface current of the electromagnetic wave through the ground through the mutual relationship, of course, it is not limited to the circuit diagram shown in FIG.
상기 컨버터(50)는 상기 알루미늄 방열판(30)의 수납공간에 설치되는 컨버터 내장형과 또는 상기 알루미늄 방열판(30) 외부에 설치되는 컨버터 외장형이 가능하다. 컨버터 외장형과 컨버터 내장형의 각각 컨버터에 상기 전자파 차단회로 모듈(장치)을 설치하여 총 5회 반복 측정한 실시 데이터는 다음 표 1과 같다.The converter 50 may be a converter built-in type installed in the storage space of the aluminum heat sink 30 or a converter external type installed outside the aluminum heat sink 30. The data obtained by repeatedly measuring a total of five times by installing the electromagnetic wave blocking circuit module (device) in the converter external converter and the converter internal converter are shown in Table 1 below.
표 1
전자파 세기(V/M): 1회 전자파 세기(V/M): 2회 전자파 세기(V/M): 3회 전자파 세기(V/M): 4회 전자파 세기(V/M): 5회
장치 미적용 1000 초과 1000 초과 1000 초과 1000 초과 1000 초과
장치 외부적용 30 50 20 60 30
장치 내부적용 0 10 0 7 10
Table 1
Electromagnetic intensity (V / M): 1 time Electromagnetic strength (V / M): 2 times Electromagnetic intensity (V / M): 3 times Electromagnetic intensity (V / M): 4 times Electromagnetic intensity (V / M): 5 times
Device not applied More than 1000 More than 1000 More than 1000 More than 1000 More than 1000
External device application 30 50 20 60 30
Internal device application 0 10 0 7 10
상기 실시 데이터 결과 전자파 차단회로 모듈을 적용하지 않은 것과 컨버터(50)와 전자파 차단회로 모듈(40)을 외부에 적용했을 때의 차이는 최대 2% 정도로 감소가 가능한 것으로 나타났으며, 이에 나아가 컨버터(50)와 전자파 차단회로 모듈(40)을 내부에 적용했을 때에는 전자파를 완전히 차단하는 것이 가능한 것으로 나타났다.As a result of the implementation data, the difference between not applying the electromagnetic wave shielding circuit module and applying the converter 50 and the electromagnetic wave shielding circuit module 40 to the outside was reduced to a maximum of 2%. 50) and when the electromagnetic wave shield circuit module 40 is applied inside, it is possible to completely block the electromagnetic waves.
도 3은 본 발명의 엘이디 조명기구의 전자파 차단방법 순서도로서, 먼저 알루미늄 방열판(30)이 전자파를 흡수하면, 흡수된 전자파에 의해 알루미늄 방열판(30) 표면에서 표면전류가 발생하게 되고, 상기 교류전류인 표면전류가 전자파 차단회로 모듈(40)의 정류부(42)에서 직류전류로 변환된 후, 상기 변환된 직류전류가 접지를 통해 방전됨으로써 전자파를 차단하는 것이 가능하다. 이때 상기 접지는 콘센트 접지, 중성선 접지, 가상 접지 또는 건물의 접지봉 중에서 선택된 적어도 어느 하나일 수 있다.3 is a flowchart of a method for blocking electromagnetic waves of the LED lighting device of the present invention. First, when the aluminum heat sink 30 absorbs electromagnetic waves, surface current is generated on the surface of the aluminum heat sink 30 by the absorbed electromagnetic waves. After the phosphorus surface current is converted into a direct current in the rectifier 42 of the electromagnetic wave shield circuit module 40, the converted direct current is discharged through the ground, thereby blocking electromagnetic waves. In this case, the ground may be at least one selected from an outlet ground, a neutral ground, a virtual ground, or a ground rod of a building.
도 4는 본 발명의 일실시예로서, 엘이디 형광등에 본 발명의 전자파 차단회로 모듈(40)을 회로기판(60)과 일체형으로 제작한 실제 예시도로서 도 2에 도시된 입력부(41)가 상부로 돌출되는 방식이며, 이것을 상기 알루미늄 방열판(30)에 슬라이딩 고정시, 곧바로 접촉할 수 있는 형태이다. 도 5는 본 발명의 다른 실시예로서, 엘이디 벌브(전구) 램프가 고정된 연성회로기판 뒷면에 회로도와 스프링이 고정된 실제 예시도이다.4 is an exemplary embodiment of the present invention, in which an electromagnetic wave blocking circuit module 40 of the present invention is integrally formed with an LED fluorescent lamp with a circuit board 60, and the input unit 41 shown in FIG. It is a way to protrude, and when the sliding fixed to the aluminum heat sink 30, it is in a form that can be immediately contacted. FIG. 5 is an exemplary embodiment of the present invention, in which a circuit diagram and a spring are fixed to a rear surface of a flexible circuit board on which an LED bulb (bulb) lamp is fixed.
본 발명을 첨부된 도면과 함께 설명하였으나, 이는 본 발명의 요지를 포함하는 다양한 실시 형태 중의 하나의 실시예에 불과하며, 당업계에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 하는 데에 그 목적이 있는 것으로, 본 발명은 상기 설명된 실시예에만 국한되는 것이 아님은 명확하다. 따라서, 본 발명의 보호범위는 하기의 청구범위에 의해 해석되어야 하며, 본 발명의 요지를 벗어나지 않는 범위 내에서의 변경, 치환, 대체 등에 의해 그와 동등한 범위 내에 있는 모든 기술 사상은 본 발명의 권리범위에 포함될 것이다. 또한, 도면의 일부 구성은 구성을 보다 명확하게 설명하기 위한 것으로 실제보다 과장되거나 축소되어 제공된 것임을 명확히 한다.Although the present invention has been described with reference to the accompanying drawings, it is merely one example of various embodiments including the gist of the present invention, which can be easily implemented by those skilled in the art. It is clear that the present invention is not limited to the above-described embodiment only. Therefore, the protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent to the change, substitution, substitution, etc. within the scope not departing from the gist of the present invention shall be the right of the present invention. It will be included in the scope. In addition, some of the components of the drawings are intended to more clearly describe the configuration, and it is clear that the exaggerated or reduced size is provided.

Claims (13)

  1. 전자파 차단회로를 적용한 엘이디 조명기구에 있어서,In the LED lighting device to which the electromagnetic wave blocking circuit is applied,
    엘이디 조명;LED lighting;
    상기 다수의 엘이디 조명이 안착되는 연성회로기판;A flexible circuit board on which the plurality of LED lights are mounted;
    상기 엘이디 조명이 안착되는 연성회로기판 이면의 전체에 걸쳐서 설치되는 알루미늄 방열판;An aluminum heat sink installed over the entire back surface of the flexible circuit board on which the LED lighting is mounted;
    상기 알루미늄 방열판에 연결되는 전자파 차단회로 모듈;An electromagnetic wave blocking circuit module connected to the aluminum heat sink;
    교류와 직류간의 변환을 위한 컨버터;A converter for converting between alternating current and direct current;
    회로 부품들이 설치되는 회로기판;A circuit board on which circuit components are installed;
    전원을 공급하는 전원부; 및A power supply unit supplying power; And
    각 구성요소를 전기적으로 연결하는 도선;Conducting wires electrically connecting each component;
    을 포함하여 구성되며,It is configured to include,
    상기 알루미늄 방열판은 전자파를 포집하는 안테나인 것을 특징으로 하는 전자파 차단회로를 적용한 엘이디 조명기구.The aluminum heat sink is an LED lighting fixture to which the electromagnetic wave blocking circuit, characterized in that the antenna for collecting electromagnetic waves.
  2. 제 1항에 있어서,The method of claim 1,
    상기 알루미늄 방열판은,The aluminum heat sink,
    상기 다수의 엘이디 조명이 안착되는 연성회로기판을 고정하는 가이드부; 및A guide part fixing the flexible circuit board on which the plurality of LED lights are mounted; And
    상기 전자파 차단 모듈, 상기 회로부품들이 설치된 회로기판 및 상기 도선을 수납하는 수납공간;A receiving space accommodating the electromagnetic wave blocking module, the circuit board on which the circuit parts are installed, and the conductive wire;
    을 포함하는 것을 특징으로 하는 전자파 차단회로를 적용한 엘이디 조명기구.LED lighting device to which the electromagnetic wave blocking circuit comprising a.
  3. 제 1항에 있어서,The method of claim 1,
    상기 알루미늄 방열판은 상기 연성회로기판 이면의 전체에 걸쳐서 설치되어, 상기 엘이디 조명으로부터 발생되는 전자파를 포집하고 표면전류로 변환하는 것을 특징으로 하는 전자파 차단회로를 적용한 엘이디 조명기구.The aluminum heat sink is installed over the entire back surface of the flexible circuit board, LED luminaires to which the electromagnetic shielding circuit is applied, characterized in that to collect the electromagnetic waves generated from the LED illumination and converts to a surface current.
  4. 제 1항에 있어서,The method of claim 1,
    상기 알루미늄 방열판은 상기 컨버터의 전면부에 설치되어, 상기 컨버터로부터 발생되는 전자파를 포집하고 표면전류로 변환하는 것을 특징으로 하는 전자파 차단회로를 적용한 엘이디 조명기구.The aluminum heat sink is installed on the front of the converter, LED lighting fixtures to which the electromagnetic wave blocking circuit, characterized in that to collect the electromagnetic waves generated from the converter and convert to a surface current.
  5. 제 1항에 있어서,The method of claim 1,
    상기 알루미늄 방열판은 포집된 전자파를 교류전류인 표면전류로 변환하여 상기 전자파 차단 모듈의 입력부로 보내는 것을 특징으로 하는 전자파 차단회로를 적용한 엘이디 조명기구.The aluminum heat sink is an LED luminaire applying an electromagnetic wave shield circuit, characterized in that the electromagnetic wave is converted into an alternating current surface current and sent to the input of the electromagnetic wave blocking module.
  6. 제 1항에 있어서,The method of claim 1,
    상기 알루미늄 방열판은 상기 엘이디 조명 또는 컨버터에서 발열된 열을 전도 및 확산시키는 것을 특징으로 하는 전자파 차단회로를 적용한 엘이디 조명기구.The aluminum heat sink is an LED lighting device to which the electromagnetic wave blocking circuit, characterized in that to conduct and diffuse the heat generated by the LED lighting or the converter.
  7. 제 1항에 있어서,The method of claim 1,
    상기 알루미늄 방열판은 오목부와 볼록부를 포함하는 요철 형태인 것을 특징으로 하는 전자파 차단회로를 적용한 엘이디 조명기구.The aluminum heat sink is an LED lighting device to which the electromagnetic wave blocking circuit, characterized in that the concave-convex shape including a concave portion and a convex portion.
  8. 제 1항에 있어서,The method of claim 1,
    상기 전자파 차단회로 모듈은,The electromagnetic wave blocking circuit module,
    상기 알루미늄 방열판 표면에서 변환된 교류전류가 입력되는 입력부;An input unit to which an AC current converted from the surface of the aluminum heat sink is input;
    상기 입력부에 입력된 교류전류가 직류전류로 변환되는 정류부;A rectifier for converting an AC current input to the input unit into a DC current;
    외부로부터 입력되는 전압을 수신하는 입력단자; 및An input terminal for receiving a voltage input from the outside; And
    상기 입력단자로부터 수신된 전압으로 접지를 생성하는 접지제공부;A ground providing unit generating ground with a voltage received from the input terminal;
    를 포함하는 것을 특징으로 하는 전자파 차단회로를 적용한 엘이디 조명기구.LED lighting device applying a electromagnetic wave blocking circuit comprising a.
  9. 제 2항에 있어서,The method of claim 2,
    상기 컨버터는 상기 알루미늄 방열판의 수납공간에 설치되는 것을 특징으로 하는 전자파 차단회로를 적용한 엘이디 조명기구.The converter is an LED lighting device to which the electromagnetic shielding circuit, characterized in that installed in the storage space of the aluminum heat sink.
  10. 제 2항에 있어서,The method of claim 2,
    상기 컨버터는 상기 알루미늄 방열판 외부에 설치되는 것을 특징으로 하는 전자파 차단회로를 적용한 엘이디 조명기구.The converter is an LED luminaire to which the electromagnetic wave shield circuit is installed outside the aluminum heat sink.
  11. 제 1항에 있어서,The method of claim 1,
    상기 엘이디 조명기구는 엘이디 형광등, 엘이디 벌브(전구), 다운라이트 공장등, 평판등(판넬등) 또는 스포트라이트 중에서 선택된 적어도 어느 하나인 것을 특징으로 하는 전자파 차단회로를 적용한 엘이디 조명기구.The LED lighting device is an LED lighting device to which the electromagnetic wave shield circuit is applied, characterized in that at least any one selected from LED fluorescent lamp, LED bulb (bulb), downlight factory light, flat panel (panel light) or spotlight.
  12. 제 1항 내지 제 11항 중 어느 한 항의 엘이디 조명기구의 전자파 차단방법에 있어서,In the electromagnetic shielding method of the LED lighting device of any one of claims 1 to 11,
    알루미늄 방열판이 전자파를 흡수하는 단계;The aluminum heat sink absorbs electromagnetic waves;
    전자파에 의해 알루미늄 방열판 표면에서 표면전류가 발생하는 단계;Generating surface current on the surface of the aluminum heat sink by electromagnetic waves;
    상기 교류전류인 표면전류가 전자파 차단회로 모듈의 정류부에서 직류전류로 변환되는 단계; 및Converting the surface current, which is the alternating current, into a direct current at a rectifier of the electromagnetic wave shielding circuit module; And
    상기 변환된 직류전류가 접지를 통해 방전되는 단계;Discharging the converted direct current through ground;
    를 포함하는 것을 특징으로 하는 엘이디 조명기구의 전자파 차단방법.Electromagnetic wave blocking method of the LED lighting device, characterized in that it comprises a.
  13. 제 12항에 있어서,The method of claim 12,
    상기 접지는 콘센트 접지, 중성선 접지, 가상 접지 또는 건물의 접지봉 중에서 선택된 적어도 어느 하나인 것을 특징으로 하는 엘이디 조명기구의 전자파 차단방법.Wherein the ground is at least one selected from the outlet ground, neutral ground, virtual ground, or ground rod of the building electromagnetic shielding method of the LED lighting fixture.
PCT/KR2015/004840 2014-05-19 2015-05-14 Led lighting apparatus having electromagnetic wave shielding circuit applied thereto WO2015178625A1 (en)

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JP2011044401A (en) * 2009-08-24 2011-03-03 Panasonic Electric Works Co Ltd Lighting system
KR101214378B1 (en) * 2012-05-30 2012-12-21 엔엘티테크주식회사 Led lighting apparatus
JP2013069530A (en) * 2011-09-22 2013-04-18 Toyoda Gosei Co Ltd Led lighting device
JP2013196926A (en) * 2012-03-21 2013-09-30 Iris Ohyama Inc Lighting system

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Publication number Priority date Publication date Assignee Title
KR200459630Y1 (en) * 2009-07-10 2012-04-04 이호일 Heat discharging device and led lighting appatatus using said it

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011044401A (en) * 2009-08-24 2011-03-03 Panasonic Electric Works Co Ltd Lighting system
JP2013069530A (en) * 2011-09-22 2013-04-18 Toyoda Gosei Co Ltd Led lighting device
JP2013196926A (en) * 2012-03-21 2013-09-30 Iris Ohyama Inc Lighting system
KR101214378B1 (en) * 2012-05-30 2012-12-21 엔엘티테크주식회사 Led lighting apparatus

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