WO2015176377A1 - Circuit de refroidissement et borne, et procédé de refroidissement de borne - Google Patents

Circuit de refroidissement et borne, et procédé de refroidissement de borne Download PDF

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Publication number
WO2015176377A1
WO2015176377A1 PCT/CN2014/082539 CN2014082539W WO2015176377A1 WO 2015176377 A1 WO2015176377 A1 WO 2015176377A1 CN 2014082539 W CN2014082539 W CN 2014082539W WO 2015176377 A1 WO2015176377 A1 WO 2015176377A1
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WO
WIPO (PCT)
Prior art keywords
heat
cooling
terminal
refrigeration
refrigeration circuit
Prior art date
Application number
PCT/CN2014/082539
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English (en)
Chinese (zh)
Inventor
崔其晖
吴红
Original Assignee
中兴通讯股份有限公司
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Filing date
Publication date
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Publication of WO2015176377A1 publication Critical patent/WO2015176377A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects

Definitions

  • the invention relates to the field of refrigeration technology, and in particular to a refrigeration circuit and a terminal and terminal refrigeration method.
  • the Peltier effect also known as the second effect of thermoelectricity, refers to the contact point when the current passes through the two metals A and B. In addition to the Joule heat generated by the current flowing through the circuit, it is also in contact. The point produces an endothermic or exothermic effect, which is the inverse of the Seebeck effect. That is, two different metals form a closed loop, and when there is a direct current in the loop, a temperature difference will occur between the two joints. This is the Peltier Effect.
  • the Seebeck effect is usually called the thermoelectric first effect
  • the Peltier effect is called the thermoelectric second effect
  • the Thomson effect is called the thermoelectric third effect.
  • thermoelectric cooler Thermo Electric cooling
  • the charge carrier moves in the conductor to form a current. Since the energy level bands of different materials are different, when a charge carrier transitions from one material to another, it is accompanied by an energy level transition, and when it moves from a high energy level to a low energy level, excess energy is released; Conversely, when moving from a low energy level to a high energy level, energy is absorbed from the outside. The energy is mainly absorbed or released in the form of heat at the interface of the two materials. Taking a P-type semiconductor refrigerating element as an example, as shown in Fig.
  • the hole in the metal is near EF, the price of the EF is higher than that of the P-type semiconductor refrigerating element.
  • the strip is high, so the hole must absorb at least ⁇ ⁇ energy to enter the semiconductor refrigeration element through the contact surface (actually the valence band electrons flow from the semiconductor to the metal copper). After entering the semiconductor refrigeration element, it is necessary to give the energy E to the holes to flow in the semiconductor. Therefore, the holes must absorb at least ⁇ ⁇ + ⁇ through the contact surface.
  • the absorbed part of the energy originates from the thermal vibration of the lattice, so that an endothermic phenomenon occurs at the contact surface, which lowers the temperature and forms a cooling effect, that is, the P-type semiconductor refrigeration element absorbs heat near the positive end, that is, The copper piece attached to the end absorbs energy from the outside, reducing the temperature in the area.
  • the P-type semiconductor refrigeration element absorbs heat near the positive end, that is, The copper piece attached to the end absorbs energy from the outside, reducing the temperature in the area.
  • the other end of the body cooling element i.e., the end near the negative end
  • the main technical problem to be solved by the embodiments of the present invention is that the electronic product generates heat during operation, and if the heat is not dissipated in time, the reliability, performance, and service life of the electronic product are adversely affected.
  • an embodiment of the present invention provides a refrigerating circuit including at least one semiconductor refrigerating component; each of the two ends of the semiconductor refrigerating component is respectively attached with a heat absorbing end and a heat dissipating end, and the heat absorbing end
  • the two ends of the power supply unit are electrically connected to form a cooling unit .
  • the semiconductor refrigerating element when the semiconductor refrigerating element is an N-type semiconductor refrigerating element, an end of the N-type semiconductor refrigerating element near the positive end is connected to the heat dissipating end, and the N-type semiconductor refrigerating element is adjacent to One end of the negative electrode end is connected to the heat absorbing end; when the semiconductor refrigerating element is a P-type semiconductor refrigerating element, one end of the P-type semiconductor refrigerating element near the positive end is connected to the heat absorbing end, and the P-type semiconductor refrigerating An end of the element near the negative terminal is connected to the heat dissipation end.
  • the cooling subunit constitutes a refrigerating unit by electrical connection. It is meant that: the refrigeration unit comprises a plurality of cooling subunits, and the one of the cooling subunits in each of the cooling subunits constitutes the refrigeration unit in parallel.
  • the heat dissipating ends of the plurality of refrigerating subunits are connected to form a common heat dissipating end, and the heat absorbing ends of the plurality of refrigerating subunits are connected to form a heat absorbing end.
  • each of the cooling subunits constitutes a refrigerating unit by electrical connection, which means that: the refrigerating unit includes a plurality of refrigerating subunits; and a refrigerating unit including the N-type semiconductor refrigerating element The unit and the cooling subunit including the P-type semiconductor refrigeration element are alternately connected in series to constitute the refrigeration unit.
  • the two heat dissipating ends of the adjacent cooling subunits are electrically connected to form a common heat dissipating end, and the two adjacent endothermic subunits are electrically connected to each other.
  • the end connections form a common endothermic end.
  • the electrical connection between the semiconductor refrigeration element and the heat absorbing end and the heat sink end is an ohmic contact.
  • the refrigeration circuit further includes at least one heat conducting sheet, the heat conducting sheet is attached to the heat absorbing end or the heat radiating end; and the said heat absorbing end is attached to the at least one heat absorbing end
  • the heat conducting sheet is for transferring heat from the outside to the heat absorbing end of the bonding; the heat conducting sheet attached to the at least one heat radiating end is for transferring heat from the heat radiating end to the outside.
  • the refrigeration unit further includes at least one of: a current control unit configured to control a current flowing through the cooling subunit; and a switch control unit configured to control the Power supply to the cooling subunit.
  • an embodiment of the present invention further provides a terminal, including the above-mentioned refrigeration circuit, further comprising a battery and a terminal body; two power input ends of the refrigeration circuit are respectively connected to the positive terminal and the negative terminal of the battery
  • the heat absorbing end of the refrigeration circuit absorbs the heat of the heat generating component of the terminal body and dissipates heat by the heat radiating end of the refrigeration circuit.
  • the terminal when there is a switch control unit and/or a current control unit in the refrigeration circuit, the terminal further includes a temperature detecting unit, and the temperature detecting unit is configured to detect the terminal body Temperature of the heat generating component, and controlling the switch control according to the result of the detection The operation of the unit and / or current control unit.
  • the heat generating component in the terminal body includes a main working chip, the terminal body is provided with a rear casing; and the heat absorbing end is disposed on the rear casing from the main body An area of the working chip that is less than or equal to a threshold value, and the heat dissipating end is disposed on the rear housing from an area where the main working chip is greater than a threshold.
  • an embodiment of the present invention further provides a terminal cooling control method, wherein a refrigeration circuit as described above is disposed on a terminal, and two power input ends of the refrigeration circuit are connected to a positive or negative battery in the terminal.
  • the temperature detecting unit detects the temperature of the heat generating component, and controls the operation of the cooling circuit according to the detected temperature condition, so that the heat absorbing end of the cooling circuit absorbs the heat of the heat generating component of the terminal body and is radiated by the heat radiating end of the cooling circuit. Heat.
  • the controlling the operation of the refrigeration circuit according to the detected temperature condition comprises: setting a temperature threshold, and controlling the cooling according to a comparison between the detected temperature and the temperature threshold The work of the circuit.
  • the controlling the operation of the refrigeration circuit comprises: controlling the switch control unit to conduct to operate the refrigeration circuit when the detected temperature exceeds or reaches the temperature threshold When the detected temperature is lower than the temperature threshold, the switch control unit is controlled to be turned off to stop the refrigeration circuit from operating.
  • the controlling the operation of the refrigeration circuit further comprises: determining a temperature difference between the detected temperature and the temperature threshold The value of the control current control unit adjusts the current flowing through the semiconductor refrigeration element.
  • the refrigeration circuit and the terminal and terminal refrigeration method provided by the embodiments of the present invention use the semiconductor refrigeration component to absorb heat from the outside when the power is on, and the heat dissipation end can dissipate heat to the outside, and the electronic product works to generate heat in a high temperature place. Passed to a remote low temperature, the electronic product can be quickly cooled at high temperature, avoid the influence of high temperature on electronic products, and improve the reliability, performance and service life of electronic products.
  • 1 is a schematic diagram of the principle of refrigeration of a semiconductor refrigeration element provided by the background art
  • 2 is a schematic diagram of a refrigeration circuit of a P-type semiconductor refrigeration device according to Embodiment 1 of the present invention
  • FIG. 3 is a schematic diagram of a refrigeration circuit in which a plurality of P-type semiconductor refrigeration components are connected in parallel according to Embodiment 2 of the present invention
  • FIG. 4 is a schematic diagram of another refrigeration circuit in which a plurality of P-type semiconductor refrigeration components are connected in parallel according to Embodiment 2 of the present invention
  • FIG. 5 is a schematic diagram of a refrigeration circuit in which an N-type semiconductor refrigerating component and a P-type semiconductor refrigerating component are connected in series according to Embodiment 3 of the present invention
  • FIG. 6 is a schematic diagram of another refrigeration circuit in which an N-type semiconductor refrigerating component and a P-type semiconductor refrigerating component are connected in series according to Embodiment 3 of the present invention
  • FIG. 7 is a schematic diagram of a refrigeration circuit in which a plurality of N-type semiconductor refrigeration components and a plurality of P-type semiconductor refrigeration components are connected in series according to Embodiment 3 of the present invention
  • FIG. 8 is a schematic diagram of another refrigeration circuit in which a plurality of N-type semiconductor refrigerating elements and a plurality of P-type semiconductor refrigerating elements are connected in series according to Embodiment 3 of the present invention;
  • FIG. 9 is a schematic diagram of a refrigeration circuit in which a heat dissipating end and a heat absorbing end of a refrigeration circuit are bonded to a heat conducting sheet according to Embodiment 3 of the present invention.
  • FIG. 10 is a schematic diagram of another refrigeration circuit in which a heat dissipating end and a heat absorbing end of a refrigerating circuit are bonded to a heat conducting sheet according to Embodiment 3 of the present invention;
  • FIG. 11 is a schematic diagram of a connection current control unit and a switch control unit in a refrigeration circuit according to Embodiment 4 of the present invention.
  • FIG. 12 is a schematic structural diagram of a refrigeration circuit according to Embodiment 5 of the present invention, which is attached to a terminal housing;
  • FIG. 13 is a flowchart of a method for cooling a terminal according to Embodiment 6 of the present invention.
  • the refrigeration circuit of the embodiment includes at least one semiconductor refrigeration element, one end of which is attached to one heat dissipation end, and the other end is attached to a heat absorption end, and the semiconductor refrigeration element is connected with the heat dissipation end and the heat absorption end to form a cooling subunit, each of which The cooling subunits are connected by a wire connection or other means capable of electrical connection to form a refrigeration unit.
  • the refrigeration unit has two power input ends, and the two power input ends are respectively connected to the positive terminal and the negative terminal.
  • the heat absorbing end and the heat dissipating end of the embodiment both use materials having heat conducting and conducting properties, and it should be understood that all materials having heat conduction and conductivity in the prior art can be used as the heat absorbing end and heat dissipation in this embodiment. end.
  • a metal material is selected as the heat dissipation end and the heat absorption end, and preferably an alloy such as copper or aluminum is selected.
  • the semiconductor refrigerating element herein includes a semiconductor element which is capable of conducting conductance and has refrigerating.
  • a semiconductor element having high conductivity is selected, for example, a P-type semiconductor refrigerating element and an N-type semiconductor refrigerating element are selected, and preferably a germanium oxide-based device is selected.
  • Semiconductor component of the compound when the semiconductor refrigeration component is an N-type semiconductor refrigeration component, an end of the N-type semiconductor refrigeration component near the positive terminal is connected to the heat dissipation end, and an end of the N-type semiconductor refrigeration component is adjacent to the negative terminal is connected to the heat absorption end; and the semiconductor refrigeration component is a P-type semiconductor refrigeration component. When the P-type semiconductor refrigeration element is adjacent to the positive end, one end is connected to the heat absorption end, and the end of the P-type semiconductor refrigeration element close to the negative end is connected to the heat dissipation end.
  • a cooling subunit constitutes a refrigerating unit, and a cooling subunit is formed by a heat radiating end and a heat absorbing end bonded to both ends of a semi-conductor refrigerating element.
  • the P-type semiconductor refrigeration element in the refrigeration circuit is respectively provided with a thin copper piece at one end, one end is a heat absorption end, and one end is a heat dissipation end, and the P-type semiconductor refrigeration element is connected to the heat dissipation end and sucked.
  • the hot end is connected to the positive and negative ends to form a loop, the heat sink end near the positive end, and the heat sink end near the negative end.
  • it can also be connected to form a loop, which is near the positive end and is the heat sink end, and close to the negative end is the heat sink end.
  • the refrigeration unit is composed of a plurality of refrigeration subunits, and each of the refrigeration subunits is a semiconductor refrigeration element of the same type, and the plurality of refrigeration subunits are connected in series with each other in series and at the positive and negative ends to form a loop.
  • the plurality of cooling subunits can also be connected in parallel to form a loop with the positive and negative terminals.
  • the connection between the cooling subunits is not limited to the series and parallel connections given. It should be understood that no matter how the multiple sub-units are connected, as long as these refrigerators are guaranteed.
  • the heat absorbing end or the heat radiating end of the plurality of cooling subunits may be connected together, that is, set to the same Shared heat sink or shared heat sink.
  • FIG. 3 there are four P-type semiconductor refrigeration components, and each of the four P-type semiconductor refrigeration components is respectively connected with a heat dissipation end and a heat absorption end, and four P-type semiconductor refrigeration components are connected in series with the positive and negative terminals.
  • the connection forms a loop, the heat sink end near the positive terminal and the heat sink end near the negative terminal.
  • the heat absorbing ends of the four P-type semiconductor refrigeration components are connected together to be the same common heat absorbing end; the heat dissipation ends of the four P-type semiconductor refrigeration components are connected together to be the same common The heat sink end.
  • the P cold component is used for the connection, except that the heat sink is near the positive terminal and the heat sink is near the negative terminal.
  • the refrigeration unit in the refrigeration circuit has a plurality of cooling subunits
  • the cooling subunit includes an N-type semiconductor refrigerating element and a P-type semiconductor refrigerating element
  • the plurality of refrigerating subunits can be connected to the positive and negative terminals of the power supply to form a loop.
  • a plurality of cooling subunits may also be connected to form a series connection and then connected to the positive and negative terminals of the power supply to form a loop.
  • the same type of cooling sub-units can be first connected in parallel and then connected to other different types of cooling sub-units in series and the positive and negative ends of the power supply to form a loop, as long as the heat-dissipating ends and the heat-absorbing ends of the different cooling sub-units are made.
  • the heat dissipation end of the cooling subunit is disposed away from the heat absorption end of the cooling subunit.
  • the heat dissipation end and the heat absorption end of two different types of cooling subunits connected end to end may be connected to form a heat dissipation end or a heat absorption end.
  • the refrigeration circuit has two cooling subunits, one of which is composed of an N-type semiconductor refrigeration element and one P-type semiconductor refrigeration element.
  • the N-type semiconductor refrigeration element and the P-type semiconductor refrigeration element in the refrigeration circuit are connected in series to form a series connection and form a loop with the positive and negative terminals.
  • two heat-dissipating ends with electrical connections can be connected together to form a common heat-dissipating end.
  • the N-type semiconductor refrigerating element and the P-type semiconductor refrigerating element are connected in series, and electrically connected to the endothermic end, the two endothermic ends having the electrical connection may be connected together. A shared endothermic end.
  • the refrigeration circuit has four cooling subunits, two of which are composed of an N-type semiconductor refrigerating element and two P-type semiconductor refrigerating elements.
  • the cooling subunit of the N-type semiconductor refrigerating element and the cooling subunit of the P-type semiconductor refrigerating element are alternately connected in series and connected to the positive and negative electrodes to form a circuit.
  • two heat-dissipating ends with electrical connections can be connected together to form a common heat-dissipating end.
  • the heat conducting sheet can be attached to the heat radiating end and the heat absorbing end.
  • the heat conducting sheet attached to the at least one heat absorbing end is used for transferring heat from the outside to the heat absorbing end of the bonding; the heat conducting sheet attached to the at least one heat radiating end is for transferring heat from the heat dissipating end of the bonding end. Passed to the outside.
  • a heat spreader is attached to each of the heat sink ends.
  • the thermal conductive sheet is generally made of a relatively light and thin material, and the material for the thermal conductive sheet here has a function of rapidly transferring heat.
  • a plurality of heat dissipation ends or heat absorption ends may be attached to one heat conductive sheet.
  • a plurality of heat dissipation ends or heat absorption ends are attached to the same heat conduction sheet.
  • the heat conduction sheets here are insulated. material.
  • the magnitude of the current through the semiconductor refrigeration element is related to the effect of the refrigeration, such as the large current, the fast cooling; the small current, the cooling is slow.
  • a current control unit is connected to the refrigeration circuit for controlling the current flowing through the cooling subunit. This adjusts the amount of current in the cooling subunit based on the required cooling needs.
  • the circuit control unit herein is to be understood to include a refrigeration control circuit as well as any existing circuit or device component capable of controlling the current in the circuit.
  • a switch control unit can also be connected in the refrigeration circuit, and the switch control unit is used to control the on and off of the cooling subunit. For example, it can be set to automatically turn on and off the refrigeration circuit when certain preset conditions are met.
  • the switch control unit should be a component, for example, a MOS tube can be selected as the switch control unit.
  • a refrigeration unit, a switch control unit, and/or a current empty unit are connected to the refrigeration circuit.
  • the terminal can be a mobile terminal.
  • the mobile communication terminal is a mobile phone, and in the embodiment, a mobile phone is used as an example of a mobile communication terminal.
  • the mobile communication terminal can also be other mobile devices having communication functions such as a tablet computer.
  • the handset includes the refrigeration circuit of all of the above embodiments, and the circuit is attached to the rear case or the back cover of the handset. Of course, it is not only limited to being attached to a mobile phone, but also can be directly disposed inside the mobile phone, and the mobile phone and the refrigeration circuit can be combined by other means.
  • the terminal includes a refrigeration circuit, a battery, and a terminal body; the body further includes a main working chip, the terminal body is further provided with a rear casing, and two power input ends of the refrigeration circuit are respectively connected to the positive terminal and the negative terminal of the battery; The heat absorbing end of the refrigeration circuit absorbs heat of the heat generating component of the terminal body and dissipates heat by the heat radiating end of the refrigeration circuit.
  • the terminal further includes a temperature detecting unit, the temperature detecting unit detects the temperature of the main working chip of the terminal, and feeds the temperature back to the main working chip of the terminal, and the main working chip of the terminal controls according to the temperature.
  • Switch control circuit and / or current control unit When the switch control unit and/or the current control unit are present in the refrigeration circuit, the terminal further includes a temperature detecting unit, the temperature detecting unit detects the temperature of the main working chip of the terminal, and feeds the temperature back to the main working chip of the terminal, and the main working chip of the terminal controls according to the temperature. Switch control circuit and / or current control unit.
  • the embodiment further provides a method for cooling a terminal, the method comprising: setting a refrigeration circuit as described above on a terminal, and connecting two power input ends of the refrigeration circuit to the positive and negative poles of the battery in the terminal; and the temperature detecting unit The temperature of the heat-generating component is detected, and the operation of the refrigeration circuit is controlled according to the detected temperature condition, so that the heat-absorbing end of the refrigeration circuit absorbs the heat of the heat-generating component of the terminal body and dissipates heat by the heat-dissipating end of the refrigeration circuit.
  • the method controls the operation of the refrigeration circuit according to the detected temperature condition, including setting the temperature threshold, and controlling the operation of the refrigeration circuit according to the comparison between the detected temperature and the temperature threshold.
  • the temperature threshold here can be set according to the situation, for example, set to 40 degrees or 45 degrees, preferably set to a value that is not much different from the current ambient temperature.
  • the method controls the switch control unit to be turned on to operate the refrigeration circuit, and when the detected temperature is lower than the temperature threshold, the control switch control unit is disconnected such that the refrigeration circuit stop working. That is, when the temperature detected by the detecting unit exceeds a certain threshold, the switch control unit is automatically activated to cool the switch. When the temperature is lowered, the switch control unit stops the refrigeration circuit and saves energy.
  • the method of controlling the refrigeration circuit further comprises: controlling the current control unit according to the temperature difference between the detected temperature and the temperature threshold to adjust the current flowing through the semiconductor refrigeration component .
  • the circuit control unit increases the current flowing through the semiconductor refrigerating element, which is a rapid temperature drop of the terminal.
  • a refrigeration circuit is set on the mobile phone.
  • the surface temperature detecting unit of the outer casing detects the surface temperature in real time, and feeds the detection data back to the main chip of the mobile phone, when the feedback temperature is higher than a preset value.
  • the switch control unit controls the current loop path to cause it to cool down the handset.
  • the switch control circuit is disconnected.
  • the preset threshold temperature is 40 degrees.
  • the refrigeration circuit can be made. Stop working and save mobile phone power. If the temperature difference between the temperature detected by the detecting unit and the temperature threshold is large, the current control unit can be controlled to control the magnitude of the current passing through the semiconductor cooling unit to control the speed of cooling the terminal. For example, the currently detected temperature is 50 degrees, and the preset threshold is 40 degrees, and the current temperature difference reaches 10 degrees. In order to lower the temperature of the mobile phone as soon as possible, the current through the semiconductor refrigeration element can be controlled by the control current control unit. Increase, let the cooling circuit cool down quickly.
  • the heat absorbing end when the semiconductor refrigerating element is energized, the heat absorbing end can absorb heat from the outside, and the heat dissipating end can dissipate heat to the outside, and the heat generated by the electronic product to generate a high temperature place is transmitted to a distant low temperature to make the electronic product high temperature. Quickly cool down, avoid the impact of high temperature on electronic products, and improve the reliability, performance and service life of electronic products.

Abstract

La présente invention concerne un circuit de refroidissement et une borne, et un procédé de refroidissement de borne. Le circuit de refroidissement comprend au moins un élément de refroidissement à semi-conducteur ; les deux extrémités de chaque élément de réfrigération à semi-conducteur se joignent à une extrémité d'absorption de chaleur et à une extrémité de dissipation de chaleur, respectivement, et sont électriquement connectées à l'extrémité d'absorption de chaleur et à l'extrémité de dissipation de chaleur pour constituer des sous-unités de refroidissement. Les sous-unités de refroidissement sont électriquement connectées pour constituer une unité de refroidissement qui possède deux bornes d'entrée d'alimentation électrique ; les deux bornes d'entrée d'alimentation électrique sont connectées à une borne d'électrode positive et à une borne d'électrode négative, respectivement. Le procédé de refroidissement de borne utilise une extrémité d'absorption de chaleur d'un élément de refroidissement de semi-conducteur pour absorber la chaleur provenant de l'extérieur, et utilise une extrémité de dissipation de chaleur pour émettre de la chaleur vers l'extérieur, de telle sorte que la partie à haute température d'un produit électronique refroidisse rapidement, ce qui permet d'améliorer les performances et d'augmenter la durée de vie du produit électronique.
PCT/CN2014/082539 2014-05-20 2014-07-18 Circuit de refroidissement et borne, et procédé de refroidissement de borne WO2015176377A1 (fr)

Applications Claiming Priority (2)

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CN201410213968.2 2014-05-20
CN201410213968.2A CN105091399A (zh) 2014-05-20 2014-05-20 一种制冷电路和终端及终端制冷方法

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CN108990363A (zh) * 2017-06-05 2018-12-11 北京小米移动软件有限公司 电子设备和散热片
CN110049655A (zh) * 2018-01-15 2019-07-23 西安中兴新软件有限责任公司 散热方法、散热装置及终端
CN108987559B (zh) * 2018-06-28 2022-06-21 江苏师范大学 一种基于石墨烯材料的集成电路热管理系统
CN109764575A (zh) * 2018-12-15 2019-05-17 中国科学院理化技术研究所 一种热电制冷和磁制冷耦合装置
CN110958817B (zh) * 2019-12-11 2020-12-25 珠海格力电器股份有限公司 一种基于珀尔帖效应的散热结构及电子设备
CN112702888A (zh) * 2020-12-15 2021-04-23 南京贝迪新材料科技股份有限公司 一种基于超薄散热膜的移动设备热管理方法及系统

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