WO2015172601A1 - 扬声器模组 - Google Patents

扬声器模组 Download PDF

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Publication number
WO2015172601A1
WO2015172601A1 PCT/CN2015/073941 CN2015073941W WO2015172601A1 WO 2015172601 A1 WO2015172601 A1 WO 2015172601A1 CN 2015073941 W CN2015073941 W CN 2015073941W WO 2015172601 A1 WO2015172601 A1 WO 2015172601A1
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WO
WIPO (PCT)
Prior art keywords
sensor
electronic terminal
fpcb
casing
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/073941
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English (en)
French (fr)
Inventor
孙野
孙洪超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goertek Inc
Original Assignee
Goertek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to US15/302,828 priority Critical patent/US9930154B2/en
Priority to KR1020167030690A priority patent/KR20160144413A/ko
Publication of WO2015172601A1 publication Critical patent/WO2015172601A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/60—Substation equipment, e.g. for use by subscribers including speech amplifiers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/026—Supports for loudspeaker casings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2430/00—Signal processing covered by H04R, not provided for in its groups
    • H04R2430/01—Aspects of volume control, not necessarily automatic, in sound systems
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers

Definitions

  • the invention relates to the technical field of electroacoustic products, and in particular to a speaker module.
  • the speaker module is an important acoustic component in the electronic terminal that converts electrical energy into acoustic energy.
  • the existing speaker module includes a casing, the cavity formed by the casing houses a micro-speaker unit, and an FPCB for electrically connecting the speaker unit and the external circuit of the module (ie, the circuit in the electronic terminal) (Flexible) Printed Circuit Board, flexible printed circuit board).
  • the volume of the current electronic terminal (that is, the size of the sound emitted by the speaker module) is controlled by the volume adjustment button on the electronic terminal. If the volume of the electronic terminal is set small, the external environment is noisy, In this case, it is difficult for people to hear various prompts of the electronic terminal, and thus miss some important events.
  • the volume of the electronic terminal is set small, the external environment is noisy, In this case, it is difficult for people to hear various prompts of the electronic terminal, and thus miss some important events.
  • 3G 3rd-Generation, 3rd generation mobile communication technology).
  • 4G the 4 Generation mobile communication Technology, the fourth generation of mobile communication technology
  • QQ cent instant messaging
  • the technical problem to be solved by the present invention is to provide a speaker module capable of sensing the external environment, so that the electronic terminal can adjust the volume according to the peripheral environment, thereby ensuring that people can listen in time in any environment. A tone to the electronic terminal.
  • the technical solution of the present invention is:
  • a speaker module for mounting in an electronic terminal comprising a casing, wherein the casing houses a speaker unit, the speaker unit is electrically connected to an external circuit of the module through the FPCB, and further comprises a device for detecting external noise a sensor electrically connected to the FPCB, and the sensor is mounted adjacent to the sound hole of the electronic terminal for transmitting the detected external noise signal to the electronic terminal through the FPCB CPU.
  • the probe of the sensor faces the sound hole.
  • the outer casing comprises a first casing and a second casing that are joined together.
  • the outer casing comprises a first casing, a second casing and a third casing joined together.
  • the senor is mounted on a portion of the FPCB located in the cavity of the module, and the second housing is provided with a mounting hole, and the probe of the sensor passes through the mounting hole.
  • the module cavity is provided with a mounting hole, and the probe of the sensor passes through the mounting hole.
  • the senor is mounted on an outer side of the first housing.
  • the senor is mounted on an outer side of the second housing.
  • the senor is mounted on an outer side of the third housing.
  • the second housing is provided with a recess corresponding to the FPCB
  • the first housing is provided with a bump corresponding to the recess corresponding to the recess, the FPCB Passing between the bottom of the groove and the end of the bump.
  • the speaker module of the present invention further includes a sensor for detecting external noise
  • the sensor is electrically connected to the FPCB, and the sensor is mounted near the sound hole of the electronic terminal.
  • the sensor can detect whether the environment of the electronic terminal is noisy through the sound hole of the electronic terminal, that is, the sensor can detect the magnitude of the external noise, and transmit the detected signal to the CPU of the electronic terminal through the FPCB (Central) Processing Unit, the central processing unit), the CPU automatically adjusts the size of the sound emitted by the speaker module according to the received sensor signal, that is, adjusts the volume of the electronic terminal.
  • the CPU will automatically increase the volume according to the signal transmitted by the sensor, so that the host can hear various prompts from the electronic terminal in noisy environments. I can't hear the tone and miss important events or calls.
  • FIG. 1 is a perspective exploded structural view of a speaker module of the present invention
  • Figure 2 is a combination view of Figure 1;
  • FIG. 3 is a flow chart showing the working principle of the speaker module of the present invention.
  • first housing 12, bump, 20, second housing, 22, mounting holes, 24, grooves, 30, speaker unit, 40, FPCB, 50, sensor.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • a speaker module for mounting in an electronic terminal includes a first housing 10 and a second housing 20 joined together, a first housing 10 and The space enclosed by the second casing 20 houses the speaker unit 30, and further includes an FPCB 40 for electrically connecting the speaker unit 30 and the external circuit of the module.
  • One end of the FPCB 40 is located in the cavity of the module for electrically connecting the speaker unit.
  • the other end of the FPCB 40 is located outside the cavity of the module for electrically connecting the external circuit of the module.
  • the module further includes a sensor 50 mounted on the FPCB 40 and electrically connected to the FPCB 40.
  • the sensor 50 is mounted on a portion of the FPCB 40 located in the cavity of the module, and the sensor 50 is used to detect external noise.
  • a mounting hole 22 is disposed on the second housing 20 at a position corresponding to the sensor 50.
  • the probe of the sensor 50 passes through the mounting hole 22 to pass through the module cavity, and the sensor 50 and the second housing 20 are glued and sealed.
  • the sensor 50 is mounted close to the sound hole of the electronic terminal.
  • the probe of the sensor 50 is preferably directed toward the sound hole of the electronic terminal, which is more advantageous for the sensor 50 to detect external noise.
  • the sensor 50 transmits the detected external noise signal to the CPU of the electronic terminal through the FPCB 40, and the CPU automatically adjusts the size of the sound emitted by the speaker module according to the received sensor signal.
  • the CPU will According to the signal transmitted by the sensor 50, the volume is automatically increased, so that the owner can hear the sound of the electronic terminal in a noisy environment, and no longer miss important events or calls due to the inability to hear the prompt tone. .
  • a recess 24 is formed on a side wall of the second housing 20 corresponding to the FPCB 40, and a recess is provided on the first housing 10 at a position corresponding to the recess 24.
  • the 24 phase matching bumps 12, the gap between the end of the bump 12 and the bottom of the groove 24 is left for the FPCB 40 to pass through, and one end of the FPCB 40 passes through the cavity of the module from the gap and is electrically connected to the external circuit of the module. connection.
  • the FPCB 40 is glued to the first housing 10 and the second housing 20.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • This embodiment is basically the same as the first embodiment, and the difference is that:
  • the sensor is mounted on the outside of the first housing. In this embodiment, there is no need to provide a mounting hole for the sensor to pass through on the second housing.
  • the structure of the housing is simpler, the assembly process is simpler and easier, but the external space of the module to be occupied is larger.
  • Embodiment 3 is a diagrammatic representation of Embodiment 3
  • This embodiment is basically the same as the first embodiment, and the difference is that:
  • the sensor is mounted on the outside of the second housing. In this embodiment, there is no need to provide a mounting hole for the sensor to pass through on the second housing.
  • the structure of the housing is simpler, the assembly process is simpler and easier, but the external space of the module to be occupied is larger.
  • Embodiment 4 is a diagrammatic representation of Embodiment 4:
  • This embodiment is basically the same as the first embodiment, and the difference is that:
  • the outer casing includes a first housing, a second housing, and a third housing that are joined together.
  • Embodiment 5 is a diagrammatic representation of Embodiment 5:
  • This embodiment is basically the same as the fourth embodiment, and the difference is that:
  • the sensor is mounted on the outside of the first housing. In this embodiment, there is no need to provide a mounting hole for the sensor to pass through on the second housing.
  • the structure of the housing is simpler, the assembly process is simpler and easier, but the external space of the module to be occupied is larger.
  • This embodiment is basically the same as the fourth embodiment, and the difference is that:
  • the sensor is mounted on the outside of the second housing. In this embodiment, there is no need to provide a mounting hole for the sensor to pass through on the second housing.
  • the structure of the housing is simpler, the assembly process is simpler and easier, but the external space of the module to be occupied is larger.
  • This embodiment is basically the same as the fourth embodiment, and the difference is that:
  • the sensor is mounted on the outside of the third housing. In this embodiment, there is no need to provide a mounting hole for the sensor to pass through on the second housing.
  • the structure of the housing is simpler, the assembly process is simpler and easier, but the external space of the module to be occupied is larger.
  • the noise outside the electronic terminal enters the electronic terminal through the sound hole and is detected by the sensor.
  • the sensor transmits the detected external noise signal to the CPU of the electronic terminal, and the terminal CPU processes and calculates the received signal, according to the operation.
  • the result is to determine the degree of noise in the external environment, thereby automatically adjusting the size of the sound emitted by the speaker module.
  • the CPU When the noise level of the external environment is high (that is, when the noise is large), the CPU will increase the volume of the speaker module; when the noise level of the external environment is low (that is, the noise is small), the CPU will reduce the volume of the speaker module. Therefore, it can ensure that the owner can hear the prompt sound emitted by the electronic terminal in any environment, and effectively avoids the occurrence of missing important events or telephones due to the inability to hear the prompt tone, and can appropriately reduce the terminal. Power consumption.
  • first and second housings or the first, second and third housings referred to in this embodiment are only for distinguishing technical features and do not represent between the two or the three.
  • the present invention has been described in detail by taking the speaker module shown in the drawings as an example. This does not mean that the scope of protection of the present invention is limited to the speaker module of this structure.
  • a noise detecting sensor is added to the group, and the technical solution for automatically controlling the volume by the sensor and the electronic terminal CPU can be applied to any type of speaker module, so whether the speaker module is rectangular, circular or racetrack Other shapes, regardless of the structure of the housing of the speaker module and the internal speaker unit, are all included in the protection scope of the present invention as long as the noise detecting sensor is added to control the volume of the speaker module.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Telephone Set Structure (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

一种扬声器模组，涉及电声产品技术领域，用于安装在电子终端内，包括外壳，所述外壳内收容有扬声器单体（30），所述扬声器单体（30）通过FPCB（40）与模组外部电路电连接，还包括一用于检测外界噪声的传感器（50），所述传感器（50）与所述FPCB（40）电连接，且所述传感器（50）的安装位置靠近所述电子终端的出声孔，用于将检测到的外界的噪声信号通过FPCB（40）传输给所述电子终端的CPU。安装了所述扬声器模组的电子终端可以根据外界环境的嘈杂度来自动调节扬声器模组的音量大小，从而可以保证主人无论在什么环境中都能及时的听到电子终端发出的提示音，有效的避免了因听不到提示音而错过重要的事件或电话的情况发生。

Description

扬声器模组 技术领域
本发明涉及电声产品技术领域，特别涉及一种扬声器模组。
发明背景
扬声器模组是电子终端中的重要声学部件，可以将电能转换为声能辐射出去。现有的扬声器模组包括外壳，外壳构成的腔体内收容有微型扬声器单体，以及用于电连接扬声器单体与模组外部电路（即电子终端中的电路）的FPCB（Flexible Printed Circuit Board，柔性印刷电路板）。
目前的电子终端的音量大小（即扬声器模组发出的声音大小）都是通过电子终端上的音量调节键来控制的，如果电子终端的音量设置得较小，而外界环境又比较嘈杂，在这种情况下人们就很难听到电子终端的各类提示音，从而错过一些重要的事件。以我们最常见的手机为例：我们都知道手机上有来电提示音、短信提示音及一些个人设置的重要事件的提示音等，在现在盛行的3G（3rd-Generation，第三代移动通信技术）或4G（the 4 Generation mobile communication technology，第四代移动通信技术）手机中还会有QQ（腾讯即时通信）信息提示音、微信信息提示音及一些邮件等的提示音，如果处在一个嘈杂的环境中，手机的音量又调得很小，则会导致手机的主人听不见手机的提示音，从而错过重要的电话或其它一些事件等。
发明内容
本发明所要解决的技术问题是提供一种扬声器模组，此扬声器模组能够感知外界的环境，从而使得电子终端可以根据外围环境来调节音量大小，从而保证人们在任何环境下都能够及时的听到电子终端发出的提示音。
为解决上述技术问题，本发明的技术方案是：
一种扬声器模组，用于安装在电子终端内，包括外壳，所述外壳内收容有扬声器单体，所述扬声器单体通过FPCB与模组外部电路电连接，还包括一用于检测外界噪声的传感器，所述传感器与所述FPCB电连接，且所述传感器的安装位置靠近所述电子终端的出声孔，用于将检测到的外界的噪声信号通过所述FPCB传输给所述电子终端的CPU。
其中，所述传感器的探头朝向所述出声孔。
其中，所述外壳包括结合在一起的第一壳体和第二壳体。
其中，所述外壳包括结合在一起的第一壳体、第二壳体和第三壳体。
作为一种实施方式，所述传感器安装在所述FPCB位于所述模组内腔的部位上，所述第二壳体上设有一安装孔，所述传感器的探头从所述安装孔处穿出所述模组内腔。
作为另一种实施方式，所述传感器安装在所述第一壳体的外侧。
作为再一种实施方式，所述传感器安装在所述第二壳体的外侧。
作为再一种实施方式，所述传感器安装在所述第三壳体的外侧。
其中，所述第二壳体上对应所述FPCB的位置设有一凹槽，所述第一壳体上对应所述凹槽的位置设有与所述凹槽相配合的凸块，所述FPCB从所述凹槽的底部与所述凸块的端部之间穿过。
采用了上述技术方案后，本发明的有益效果是：
由于本发明扬声器模组还包括一个用于检测外界噪声的传感器，传感器与FPCB电连接，且传感器靠近电子终端的出声孔安装。传感器通过电子终端的出声孔可以检测到电子终端所处环境是否嘈杂，即传感器可以检测到外界噪音的大小，并将检测到的信号通过FPCB传输给电子终端的CPU（Central Processing Unit，中央处理器），CPU根据接收到的传感器信号来自动调节扬声器模组发出声音的大小，即调节电子终端的音量大小。当传感器检测到外界环境很嘈杂时，CPU会根据传感器传输过来的信号自动将音量调大，从而可以保证主人在嘈杂的环境中也能够听到电子终端发出的各种提示音，不会再因听不到提示音而错过重要的事件或电话等。
上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手段，而可依照说明书的内容予以实施，并且为了让本发明的上述和其它目的、特征和优点能够更明显易懂，以下特举本发明的具体实施方式。
附图简要说明
通过阅读下文优选实施方式的详细描述，各种其他的优点和益处对于本领域普通技术人员将变得清楚明了。附图仅用于示出优选实施方式的目的，而并不认为是对本发明的限制。在附图中：
图1是本发明扬声器模组的立体分解结构示意图；
图2是图1的组合图；
图3是本发明扬声器模组的工作原理流程图；
图中：10、第一壳体，12、凸块，20、第二壳体，22、安装孔，24、凹槽，30、扬声器单体，40、FPCB，50、传感器。
具体实施方式
在下面的描述中，只通过说明的方式描述了本发明的某些示范性实施例。毋庸置疑，本领域的普通技术人员可以认识到，在不偏离本发明的精神和范围的情况下，可以用各种不同的方式对所述实施例进行修正。因此，附图和描述在本质上是说明性的，而不是用于限制权利要求的保护范围。在本说明书中，相同的附图标记表示相同或相似的部分。
下面结合附图和实施例，进一步阐述本发明。
实施例一：
如图1所示，一种扬声器模组，用于安装在电子终端（图中未示出）内，包括结合在一起的第一壳体10和第二壳体20，第一壳体10和第二壳体20围成的空间内收容有扬声器单体30，还包括用于电连接扬声器单体30与模组外部电路的FPCB40，FPCB40的一端位于模组内腔中用于电连接扬声器单体30，FPCB40的另一端位于模组内腔的外部用于电连接模组外部电路。
如图1和图2共同所示，模组还包括安装在FPCB40上并与FPCB40电连接的传感器50，传感器50安装在FPCB40位于模组内腔中的部位，传感器50用于检测外界噪声。在第二壳体20上对应传感器50的位置设有一安装孔22，传感器50的探头通过安装孔22穿出模组内腔，传感器50与第二壳体20之间涂胶密封。传感器50的安装位置应靠近电子终端的出声孔，本实施例优选为传感器50的探头朝向电子终端的出声孔，这样更有利于传感器50检测外界的噪声。传感器50将检测到的外界的噪声信号通过FPCB40传输给电子终端的CPU，CPU根据接收到的传感器信号来自动调节扬声器模组发出声音的大小，当传感器50检测到外界环境很嘈杂时，CPU会根据传感器50传输过来的信号自动将音量加大，从而可以保证主人在嘈杂的环境中也能够听到电子终端发出的提示音，不会再因听不到提示音而错过重要的事件或电话等。
如图1和图2共同所示，第二壳体20的一个侧壁上对应FPCB40穿出的位置设有一凹槽24，在第一壳体10上对应凹槽24的位置设有一与凹槽24相配合的凸块12，凸块12的端部与凹槽24的底部之间留有用于FPCB40穿过的缝隙，FPCB40的一端从此缝隙处穿出模组内腔并与模组外部电路电连接。FPCB40与第一壳体10和第二壳体20之间涂胶密封。
实施例二：
本实施方式与实施例一基本相同，其不同之处在于：
传感器安装在第一壳体的外侧，此实施方式中第二壳体上不需要设置用于传感器穿出的安装孔。
此实施方式与实施例一相比壳体的结构更为简单，组装工艺更为简单易行，但需要占用的模组外部空间更大。
实施例三：
本实施方式与实施例一基本相同，其不同之处在于：
传感器安装在第二壳体的外侧，此实施方式中第二壳体上不需要设置用于传感器穿出的安装孔。
此实施方式与实施例一相比壳体的结构更为简单，组装工艺更为简单易行，但需要占用的模组外部空间更大。
实施例四：
本实施方式与实施例一基本相同，其不同之处在于：
外壳包括结合在一起的第一壳体、第二壳体和第三壳体。
实施例五：
本实施方式与实施例四基本相同，其不同之处在于：
传感器安装在第一壳体的外侧，此实施方式中第二壳体上不需要设置用于传感器穿出的安装孔。
此实施方式与实施例四相比壳体的结构更为简单，组装工艺更为简单易行，但需要占用的模组外部空间更大。
实施例六：
本实施方式与实施例四基本相同，其不同之处在于：
传感器安装在第二壳体的外侧，此实施方式中第二壳体上不需要设置用于传感器穿出的安装孔。
此实施方式与实施例四相比壳体的结构更为简单，组装工艺更为简单易行，但需要占用的模组外部空间更大。
实施例七：
本实施方式与实施例四基本相同，其不同之处在于：
传感器安装在第三壳体的外侧，此实施方式中第二壳体上不需要设置用于传感器穿出的安装孔。
此实施方式与实施例四相比壳体的结构更为简单，组装工艺更为简单易行，但需要占用的模组外部空间更大。
如图3所示，本发明的工作原理如下：
电子终端外界的噪声通过出声孔进入到电子终端内部并被传感器检测到，传感器将检测到的外界噪声信号传输给电子终端的CPU，终端CPU将接收到的信号进行处理和运算后，根据运算的结果来判定外界环境的嘈杂程度，由此来自动调节扬声器模组发出声音的大小。当外界环境的嘈杂程度高时（即噪声大时），CPU就将扬声器模组的音量调大；当外界环境的嘈杂程度低时（即噪声小时），CPU就将扬声器模组的音量调小，从而可以保证主人无论在什么环境中都能及时的听到电子终端发出的提示音，有效的避免了因听不到提示音而错过重要的事件或电话的情况发生，并可以适当的减少终端的耗电量。
本实施例中涉及到的第一壳体和第二壳体或第一壳体、第二壳体和第三壳体的命名仅是为区别技术特征，并不代表二者或三者之间的位置关系与安装顺序等。
本说明书仅以附图所示出的扬声器模组为例对本发明的发明构思进行了详细的阐述，这并不代表本发明的保护范围就仅限于此种结构的扬声器模组，实际中在模组中增加噪声检测传感器，通过传感器与电子终端CPU相配合来自动控制音量的技术方案可以应用到任何一种扬声器模组上，因此，无论该扬声器模组是矩形的、圆形的还是跑道形等其它形状的，也不论该扬声器模组的壳体及内部扬声器单体的结构如何，只要是增加了噪声检测传感器用以控制扬声器模组音量的产品均落入本发明的保护范围内。
本发明不局限于上述具体的实施方式，本领域的普通技术人员从上述构思出发，不经过创造性的劳动，所作出的种种变换，均落在本发明的保护范围之内。

Claims (9)

  1. 扬声器模组，用于安装在电子终端内，包括外壳，所述外壳内收容有扬声器单体，所述扬声器单体通过FPCB与模组外部电路电连接，其特征在于，还包括一用于检测外界噪声的传感器，所述传感器与所述FPCB电连接，且所述传感器的安装位置靠近所述电子终端的出声孔，用于将检测到的外界的噪声信号通过所述FPCB传输给所述电子终端的CPU。
  2. 根据权利要求1所述的扬声器模组，其特征在于，所述传感器的探头朝向所述出声孔。
  3. 根据权利要求2所述的扬声器模组，其特征在于，所述外壳包括结合在一起的第一壳体和第二壳体。
  4. 根据权利要求2所述的扬声器模组，其特征在于，所述外壳包括结合在一起的第一壳体、第二壳体和第三壳体。
  5. 根据权利要求3或4所述的扬声器模组，其特征在于，所述传感器安装在所述FPCB位于所述模组内腔的部位上，所述第二壳体上设有一安装孔，所述传感器的探头从所述安装孔处穿出所述模组内腔。
  6. 根据权利要求3或4所述的扬声器模组，其特征在于，所述传感器安装在所述第一壳体的外侧。
  7. 根据权利要求3或4所述的扬声器模组，其特征在于，所述传感器安装在所述第二壳体的外侧。
  8. 根据权利要求3或4所述的扬声器模组，其特征在于，所述第二壳体上对应所述FPCB的位置设有一凹槽，所述第一壳体上对应所述凹槽的位置设有与所述凹槽相配合的凸块，所述FPCB从所述凹槽的底部与所述凸块的端部之间穿过。
  9. 根据权利要求4所述的扬声器模组，其特征在于，所述传感器安装在所述第三壳体的外侧。
PCT/CN2015/073941 2014-05-13 2015-03-10 扬声器模组 Ceased WO2015172601A1 (zh)

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