WO2015163862A1 - Ensemble de têtes d'impression - Google Patents

Ensemble de têtes d'impression Download PDF

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Publication number
WO2015163862A1
WO2015163862A1 PCT/US2014/035083 US2014035083W WO2015163862A1 WO 2015163862 A1 WO2015163862 A1 WO 2015163862A1 US 2014035083 W US2014035083 W US 2014035083W WO 2015163862 A1 WO2015163862 A1 WO 2015163862A1
Authority
WO
WIPO (PCT)
Prior art keywords
die
printhead
bond pads
flex circuit
pedestal
Prior art date
Application number
PCT/US2014/035083
Other languages
English (en)
Inventor
Silam J. Choy
Peter James Fricke
Original Assignee
Hewlett-Packard Development Company, L.P.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Development Company, L.P. filed Critical Hewlett-Packard Development Company, L.P.
Priority to US15/303,998 priority Critical patent/US9908327B2/en
Priority to PCT/US2014/035083 priority patent/WO2015163862A1/fr
Publication of WO2015163862A1 publication Critical patent/WO2015163862A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04541—Specific driving circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04581—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14032—Structure of the pressure chamber
    • B41J2/1404—Geometrical characteristics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/1433—Structure of nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/20—Modules

Definitions

  • Piezoelectric inkjet printheads use piezoelectric actuators that change shape to generate pressure pulses inside ejection chambers to force fluid out through nozzles. Flex circuits are often used to carry electrical signals to the printheads to drive the piezoelectric actuators.
  • Fig. 1 illustrates one example of a new a printhead assembly such as might be used in an inkjet printer pen or print bar.
  • Fig. 2 includes an exploded view of one of the printheads in the printhead assembly shown in Fig. 1.
  • Figs. 3-6 show a printhead from the assembly of Fig. 1 in more detail.
  • Fig. 7 is a plan view detail of part of a printhead die in the printhead shown in Fig. 3.
  • Fig. 8 is a section taken along the line 8-8 in Fig. 7.
  • a new piezoelectric inkjet printhead architecture has been developed to substantially increase the density of nozzles that can be integrated into each printhead.
  • Driver ICs located immediately adjacent to the printhead die include amplifiers for each piezoelectric actuator and provide a drive waveform tuned to each actuator's electromechanical response.
  • a printhead assembly with a new mounting scheme and flex circuit interconnect has been developed to support the new high nozzle density printhead architecture.
  • multiple printheads are arranged along a line in a staggered configuration in which each printhead in a group of far printheads overlaps a printhead in a group of near printheads.
  • each printhead in the assembly includes a pedestal, a printhead die mounted to the pedestal, a pair of ICs connected to the printhead die to drive fluid ejector elements in the die, and a flex circuit connected to the ICs.
  • the ICs are mounted to the pedestal on opposite sides of the printhead die, in plane with and immediately adjacent to the die.
  • the flex circuit has a body and a tail extending from the body in the same direction as all of the other flex circuit tails.
  • the body of the flex circuit surrounds the printhead die and covers the ICs, and the tail of each flex circuit in a far printhead extends past a pedestal in a near printhead.
  • the pedestals provide a sufficiently large platform to mount two ICs and the flex circuit while still allowing the flex circuits from far printheads to pass the near printheads so that all flex circuits can be efficiently routed to a single PCA on one side of the printhead assembly.
  • the body of the flex circuit surrounding the printhead die enables routing signal traces to ICs on both sides of the die through a single tail on one side of the die.
  • the exposed exterior of the flex circuit body surrounding each printhead die may be used as a capping surface to seal the fluid dispensing nozzles when the printhead is capped during periods of inactivity, thus eliminating the need for an additional shroud or other discrete part to provide the capping surface.
  • Examples of the new printhead assembly are not limited to
  • piezoelectric inkjet printing may be implemented in thermal inkjet and other inkjet type dispensing devices.
  • the examples shown in the Figures and described herein illustrate but do not limit the disclosure, which is defined in the Claims following this Description.
  • a “printhead die” means that part of an inkjet printer or other inkjet type dispenser that can dispense fluid from one or more openings; and an “IC” means an integrated circuit.
  • a “printhead die” is not limited to printing with ink and other printing fluids but also includes inkjet type dispensing of other fluids and/or for uses other than printing.
  • Fig. 1 illustrates a printhead assembly 10 such as might be used in an inkjet pen or print bar.
  • Printhead assembly 10 is shown face-up in Fig. 1 to more clearly show some features of the assembly.
  • a printhead assembly 10 usually would be oriented face-down when installed in a printer.
  • printhead assembly 10 includes printheads 12A-12F mounted to pedestals 14 along a line 16 in a staggered configuration in which each printhead overlaps another printhead.
  • each printhead 12A-12F is mounted to an individual pedestal 14 affixed to a frame 18.
  • Other arrangements for a printhead assembly 10 are possible. For example, more or fewer printheads could be used and/or in a different configuration.
  • Fig. 2 includes an exploded view of printhead 12F in printhead assembly 10.
  • Figs. 3-6 show printhead 12F in more detail. In the example shown, each printhead 12A-12F is assembled with the same components.
  • a printhead die 24 is mounted to a corresponding pedestal 14. Ink or other printing fluid is supplied to each die 24 through channels 26, 28 in pedestal 14 and frame 18. Ink or other printing fluid is dispensed from each printhead die 24 through nozzles 30.
  • four supply channels 26, 28 correspond to four arrays 29 of dispensing nozzles 30.
  • An inkjet printhead die 24 is a typically complex MEMS
  • fluid ejector elements and other components in each printhead die 24 are electrically connected to ASICs (application specific integrated circuits) or other suitable driver ICs 32, 34 located immediately adjacent to die 24.
  • ASICs application specific integrated circuits
  • Each IC 32, 34 is connected to a printer controller or other source of power and control signals through traces (not shown) in a flex circuit 36.
  • the electrical connections between die 24 and ICs 32, 34 and between ICs 32, 34 and connections to flex circuit 36 may be made, for example, with wire bonds -- tiny wires (not shown) connecting bond pads 38 on die 24 to bond pads 40 on ICs 32, 34 and connecting bond pads 42 on ICs 32, 34 to bond pads 44 on flex circuit 36.
  • wire bonds -- tiny wires (not shown) connecting bond pads 38 on die 24 to bond pads 40 on ICs 32, 34 and connecting bond pads 42 on ICs 32, 34 to bond pads 44 on flex circuit 36.
  • wire bonds -- tiny wires (not shown) connecting bond pads 38 on die 24 to bond pads 40 on ICs 32, 34 and connecting bond pads 42 on ICs 32, 34 to bond pads 44 on flex circuit 36.
  • wire bonds may be desirable in many implementations because wire bonding technology is well developed to accurately form and connect the small, high density bond pads needed to support higher density nozzle arrays on die 24.
  • each printhead die 24 is mounted to a center part of pedestal 14.
  • Fig. 7 is a plan view detail from Fig. 3 showing one nozzle array 29 on printhead die 24.
  • Fig. 8 is a section taken along the line 8-8 in Fig. 7.
  • each array 29 includes two rows of nozzles 30.
  • Printing fluid is ejected from chambers 46 through corresponding nozzles 30 at the urging of a piezoelectric, thermal or other ejector element 48.
  • each channel 26 in pedestal 14 supplies printing fluid to two rows of ejection chambers 46.
  • Printing fluid flows into each ejection chamber 46 through an inlet 50 from a manifold 52 extending lengthwise along die 24 between two rows of ejection chambers 46. Printing fluid feeds into manifold 52 through multiple ports 54 that are connected to a printing fluid supply channel 26.
  • Other suitable configurations for printhead dies 24 and channels 26 are possible. For example, more or fewer channels 26 supplying more or fewer ejection chambers 46. Also, the idealized
  • FIG. 7 and 8 depicts three layers (substrate 56, chamber layer 58, and nozzle plate 60) for convenience only to clearly show nozzles 30, ejection chambers 46, inlets 50, manifold 52, and ports 54.
  • An actual inkjet printhead die 24 may include fewer or more layers than those shown and/or different paths for supplying fluid to ejection chambers 46.
  • each IC 32, 34 is mounted to pedestal 14 laterally adjacent to die 24.
  • Each IC 32, 34 is electrically connected to and physically flanks one side of printhead die 24, for example to drive ejector elements in die 24 corresponding to the two nozzle arrays 29 closest to the IC 32, 34.
  • flex circuit 36 is affixed to pedestal 14 covering ICs 32, 34. Any suitable technique may be used to affix flex circuit 36 to pedestal 14, for example a film adhesive 62 applied to ICs 32 and 34 and an adhesive paste 64 applied to a flange 66 along the perimeter of pedestal 14, as shown in Fig. 4.
  • the body 70 of flex circuit 36 surrounds printhead 24 to carry signal traces from both ICs 32, 34 to a tail 72 that extends from body 70 on only one side of the printhead.
  • the mounting surfaces bordered by perimeter flange 66 on each pedestal 14 are large enough to support flex circuit body 70
  • the electrical connections to all printheads 12A-12F may be located on just one side of the printhead assembly 10.
  • an overhang 74 at one end of each pedestal 14 allows the tail 72 of the flex circuits 36 on far printheads 12A-12C to pass by near printheads 12D-12F.
  • Flex circuit tails 72 from far side printheads 12A-12C may be staked or otherwise affixed to frame 18 at locations 76 under near side pedestal overhangs 74 as desired to help relieve unwanted stresses in the flex circuits.
  • the wire bonds connecting die 24, ICs 32, 34 and flex circuit 36 may be covered by an epoxy or other suitable protective material 80 as desired to protect the connections from ink and other potentially damaging environmental conditions.
  • ICs 32, 34 are mounted to surface 82 (Fig. 2) on pedestal 14 generally in the same plane as printhead die 24.
  • each IC 32, 34 has a flat exterior surface 84 defining a plane parallel to the exposed planar face 86 of die 24.
  • flex circuit body 70 is affixed to and covers most of the exterior surface 84 of each IC 32, 34.
  • the relative height of ICs 32, 34 and die 24 on pedestal 14 may be adjusted to place IC surface 84 only slightly below die face 86, about 365 m for example, to facilitate wire bonding and encapsulation.
  • Printhead assembly 10 may include interchangeable ICs 32, 34 oriented 180o from one another on each side of each printhead die 24.
  • interchangeable pedestals 14 oriented 180o from one another in far and near printhead groups 20, 22 may be used to support dies 24 and ICs 32, 34. While a pair of ICs 32, 34 flanking both sides of each die 24 is shown, other suitable configurations are possible. For example, a single drive IC flanking one side of a printhead die may be adequate in some implementations.

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)

Abstract

La présente invention concerne un ensemble de têtes d'impression qui, dans un exemple, comprend plusieurs têtes d'impression disposées le long d'une ligne dans une configuration en quinconce, dans laquelle chaque tête d'impression dans un groupe de têtes d'impression distantes chevauche une tête d'impression dans un groupe de têtes d'impression proches. Chaque tête d'impression comprend un socle, une matrice de tête d'impression montée sur le socle, un circuit intégré pour entraîner des éléments d'éjection de fluide dans la matrice de tête d'impression, et un circuit souple. Le circuit intégré est connecté à la matrice de tête d'impression et monté sur le socle à côté de la matrice. Le corps d'un circuit souple est connecté au circuit intégré et le recouvre. La queue de chaque circuit souple à partir d'une tête d'impression distante s'étend au-delà d'un socle dans une tête d'impression proche.
PCT/US2014/035083 2014-04-23 2014-04-23 Ensemble de têtes d'impression WO2015163862A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US15/303,998 US9908327B2 (en) 2014-04-23 2014-04-23 Printhead assembly
PCT/US2014/035083 WO2015163862A1 (fr) 2014-04-23 2014-04-23 Ensemble de têtes d'impression

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/035083 WO2015163862A1 (fr) 2014-04-23 2014-04-23 Ensemble de têtes d'impression

Publications (1)

Publication Number Publication Date
WO2015163862A1 true WO2015163862A1 (fr) 2015-10-29

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ID=54332894

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2014/035083 WO2015163862A1 (fr) 2014-04-23 2014-04-23 Ensemble de têtes d'impression

Country Status (2)

Country Link
US (1) US9908327B2 (fr)
WO (1) WO2015163862A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3263342A1 (fr) * 2016-06-30 2018-01-03 Brother Kogyo Kabushiki Kaisha Tête d'éjection de liquide
WO2018085326A3 (fr) * 2016-11-04 2019-06-06 Cc3D Llc Système de fabrication additive ayant une configuration de buse réglable

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130106954A1 (en) * 2010-08-19 2013-05-02 Silam J. Choy Wide-array inkjet printhead assembly
US20130155153A1 (en) * 2006-04-28 2013-06-20 Fujifilm Dimatix, Inc. Printhead Module
US20130201255A1 (en) * 2010-11-30 2013-08-08 Daniel D. Dowell Manifold assembly for fluid-ejection device
US20140028748A1 (en) * 2010-09-08 2014-01-30 Ten Cate Advanced Textiles B.V. Print head module
JP2014054849A (ja) * 2008-07-04 2014-03-27 Ricoh Co Ltd 液体吐出ヘッドユニット及び画像形成装置

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US5063655A (en) 1990-04-02 1991-11-12 International Business Machines Corp. Method to integrate drive/control devices and ink jet on demand devices in a single printhead chip
JP2001212995A (ja) 2000-01-31 2001-08-07 Sony Corp プリンタ及びプリンタ用ヘッド
WO2001062499A1 (fr) 2000-02-25 2001-08-30 Matsushita Electric Industrial Co., Ltd. Tete a jet d'encre et dispositif d'enregistrement a jet d'encre
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JP2006116767A (ja) 2004-10-20 2006-05-11 Seiko Epson Corp 液滴吐出ヘッド、液滴吐出装置
KR20060125859A (ko) 2006-08-17 2006-12-06 실버브룩 리서치 피티와이 리미티드 프린트헤드 조립체 및 같은 것을 위한 프린트헤드 모듈
US7654640B2 (en) 2007-03-21 2010-02-02 Silverbrook Research Pty Ltd Printhead with drive circuitry components adjacent the printhead IC
WO2012023939A1 (fr) 2010-08-19 2012-02-23 Hewlett-Packard Development Company, L.P. Ensemble tête d'impression à jet d'encre à groupement large comportant un écran
US9144973B2 (en) 2012-04-29 2015-09-29 Hewlett-Packard Development Company, L.P. Piezoelectric inkjet die stack

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130155153A1 (en) * 2006-04-28 2013-06-20 Fujifilm Dimatix, Inc. Printhead Module
JP2014054849A (ja) * 2008-07-04 2014-03-27 Ricoh Co Ltd 液体吐出ヘッドユニット及び画像形成装置
US20130106954A1 (en) * 2010-08-19 2013-05-02 Silam J. Choy Wide-array inkjet printhead assembly
US20140028748A1 (en) * 2010-09-08 2014-01-30 Ten Cate Advanced Textiles B.V. Print head module
US20130201255A1 (en) * 2010-11-30 2013-08-08 Daniel D. Dowell Manifold assembly for fluid-ejection device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10486423B2 (en) 2016-06-30 2019-11-26 Brother Kogyo Kabushiki Kaisha Liquid ejection head
CN107554077A (zh) * 2016-06-30 2018-01-09 兄弟工业株式会社 液体喷射头
JP2018001551A (ja) * 2016-06-30 2018-01-11 ブラザー工業株式会社 液体吐出ヘッド
US9975337B2 (en) 2016-06-30 2018-05-22 Brother Kogyo Kabushiki Kaisha Liquid ejection head
US10124590B2 (en) 2016-06-30 2018-11-13 Brother Kogyo Kabushiki Kaisha Liquid ejection head
EP3263342A1 (fr) * 2016-06-30 2018-01-03 Brother Kogyo Kabushiki Kaisha Tête d'éjection de liquide
US10946657B2 (en) 2016-06-30 2021-03-16 Brother Kogyo Kabushiki Kaisha Liquid ejection head
JP2021138149A (ja) * 2016-06-30 2021-09-16 ブラザー工業株式会社 液体吐出ヘッド
JP7226476B2 (ja) 2016-06-30 2023-02-21 ブラザー工業株式会社 液体吐出ヘッド
US11673391B2 (en) 2016-06-30 2023-06-13 Brother Kogyo Kabushiki Kaisha Liquid ejection head
JP7464157B2 (ja) 2016-06-30 2024-04-09 ブラザー工業株式会社 液体吐出ヘッド
WO2018085326A3 (fr) * 2016-11-04 2019-06-06 Cc3D Llc Système de fabrication additive ayant une configuration de buse réglable
US10828829B2 (en) 2016-11-04 2020-11-10 Continuous Composites Inc. Additive manufacturing system having adjustable nozzle configuration

Also Published As

Publication number Publication date
US20170028713A1 (en) 2017-02-02
US9908327B2 (en) 2018-03-06

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