WO2015162918A1 - Image-capturing element unit, image-capturing device, and camera-equipped mobile terminal - Google Patents

Image-capturing element unit, image-capturing device, and camera-equipped mobile terminal Download PDF

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Publication number
WO2015162918A1
WO2015162918A1 PCT/JP2015/002185 JP2015002185W WO2015162918A1 WO 2015162918 A1 WO2015162918 A1 WO 2015162918A1 JP 2015002185 W JP2015002185 W JP 2015002185W WO 2015162918 A1 WO2015162918 A1 WO 2015162918A1
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Prior art keywords
image
imaging
lens
unit
image sensor
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PCT/JP2015/002185
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French (fr)
Japanese (ja)
Inventor
政大 齊藤
和宏 八重樫
邦彦 瀬野
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ミツミ電機株式会社
政大 齊藤
和宏 八重樫
邦彦 瀬野
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Publication of WO2015162918A1 publication Critical patent/WO2015162918A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof

Definitions

  • the present invention relates to an imaging element unit, an imaging device, and a mobile terminal with a camera.
  • a small imaging device is mounted on a mobile terminal such as a smartphone.
  • the imaging apparatus includes a lens unit having one or more lens groups, and an imaging element that captures a subject image formed by the lens unit.
  • Some cameras have an autofocus function that automatically adjusts the focus when shooting the subject and a camera shake correction function (OIS: Optical Image Stabilization) that corrects camera shake (vibration) that occurs during shooting.
  • OIS Optical Image Stabilization
  • the resolution R in the imaging apparatus is expressed by the following equation (1), where K is a constant (typically 0.61), ⁇ is the wavelength of light, and NA is the numerical aperture.
  • R K ⁇ ⁇ / NA (1)
  • NA the numerical aperture NA is expressed by the following formula (n), where n is a refractive index of a medium between a proximity lens (a lens disposed closest to the imaging device, also called a final lens) and the imaging device, and ⁇ is an incident angle of light. 2).
  • NA n ⁇ sin ⁇ (2) Since K and ⁇ are constant, the resolution R can be increased by filling the space between the proximity lens and the image sensor with a substance having a large refractive index n.
  • Patent Document 1 discloses an image pickup device unit in which an image pickup device and a proximity lens are housed in a lens barrel (lens barrel) and a transparent substance (for example, water) having a refractive index larger than that of air is filled therebetween. Is disclosed.
  • the imaging element unit is configured to include a proximity lens that is a part of the lens unit, there are limitations in designing lens units having various specifications.
  • the imaging element is housed in the lens barrel, it is difficult to reduce the size.
  • An object of the present invention is to provide an image sensor unit that can easily cope with lens units of various specifications and can be miniaturized, and to provide an image pickup apparatus including the image sensor unit and a camera-equipped mobile terminal. That is.
  • the image pickup device unit is an image pickup device unit that is disposed in the vicinity of a lens unit having one or more lens groups, An image sensor for imaging a subject image formed by the lens unit; A substrate on which the image sensor is mounted; Composed of a transparent material having a refractive index greater than that of air, and an element covering portion disposed so as to cover the imaging area of the imaging element; And an overmold part formed by molding on the peripheral edge of the substrate so as to surround the element covering part.
  • An imaging apparatus includes the above-described imaging element unit; A lens unit including one or more lens groups including a proximity lens close to the image sensor unit.
  • a mobile terminal with a camera according to the present invention includes the above-described imaging device.
  • the image sensor unit according to the present invention does not include a lens portion, and thus can easily cope with lens portions of various specifications and is highly versatile. Further, since the element covering portion is reinforced by the overmold portion, the size can be reduced.
  • FIG. 1 is a perspective view showing an image sensor unit 10 according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view perpendicular to the X axis of the image sensor unit 10.
  • the imaging element unit 10 shown in FIGS. 1 and 2 is disposed in the vicinity of a lens unit having one or more lens groups in the optical system of the imaging apparatus.
  • the image sensor unit 10 includes an image sensor 11, a substrate 12, a glass part 13, and an overmold part 14.
  • the image pickup device 11 is composed of, for example, a CCD (charge coupled device) image sensor, a CMOS (complementary metal oxide) semiconductor image sensor, or the like.
  • the image sensor 11 is mounted on the substrate 12 and is electrically connected to the wiring on the substrate 11 via the bonding wires 16.
  • the image sensor 11 captures a subject image formed by a lens unit (not shown).
  • the center part of the light receiving surface of the image sensor 11 is the imaging area 11a, and the peripheral part excluding the imaging area 11a is the non-imaging area 11b.
  • the glass portion 13 is made of a transparent glass material having a refractive index larger than that of air, and is disposed on the image sensor 11 so as to cover the image area 11a.
  • NA the numerical aperture
  • NA the numerical aperture
  • the diffraction limit decreases, which is suitable for increasing the resolution.
  • dust can be prevented from adhering to the imaging area 11a of the imaging element 11 when the imaging element unit 10 is mounted on the imaging apparatus, good image quality can be realized.
  • the glass part 13 is bonded onto the image sensor 11 via the adhesive layer 15.
  • the adhesive layer 15 for example, applies a resin adhesive (for example, silicone-based resin) to the light receiving surface of the image sensor 11, places the glass portion 13 thereon, presses it with a predetermined pressure, and spreads the resin adhesive. Is formed.
  • a resin adhesive for example, silicone-based resin
  • the adhesive layer 15 is preferably formed using a resin adhesive without filler (hereinafter referred to as “first adhesive”) and a resin adhesive containing filler (hereinafter referred to as “second adhesive”).
  • first adhesive a resin adhesive without filler
  • second adhesive a resin adhesive containing filler
  • a portion constituted by the first adhesive in the adhesive layer 15 is referred to as a “first adhesive portion”
  • a portion constituted by the second adhesive is referred to as a “second adhesive portion”.
  • the first adhesive portion is disposed in a region including the imaging area 11a
  • the second adhesive portion is disposed only in the non-imaging area 11b excluding the imaging area 11a. This is because the filler is usually larger than one pixel of the image sensor 11, and if there is a filler in the imaging area 11a, it is reflected in the image and the image quality deteriorates.
  • the thickness of the adhesive layer 15 can be easily controlled by arranging the second adhesive portion containing the filler in the non-imaging area 11b.
  • the type, size, shape, addition amount, and the like of the filler are appropriately adjusted according to the adhesive force required for the adhesive layer 15 and the design thickness of the adhesive layer 15.
  • the thickness of the adhesive layer 15 is preferably 2 ⁇ m or more and 25 ⁇ m or less. This is because if the thickness of the adhesive layer 15 is less than 2 ⁇ m, the image sensor 11 and the glass portion 13 may be peeled off due to thermal stress or the like, and if it exceeds 25 ⁇ m, the image quality may be adversely affected. By adjusting the filler dispersed in the second adhesive, the thickness of the adhesive layer 15 can be easily set to a desired thickness.
  • the overmold part 14 is formed by molding at the peripheral part of the substrate 12 so as to surround the periphery of the glass part 13 excluding the light receiving surface 13a.
  • the overmold part 14 is made of a hard resin material (for example, epoxy resin) having high light shielding properties, and reinforces the glass part 13. Since the overmold portion 14 is formed including the arrangement region of the bonding wire 16 and can be finished to the same size as the outer size of the substrate 12, the overmold portion 14 is reduced in size as compared with the image sensor unit described in Patent Document 1. Can be achieved. Moreover, since the overmold part 14 is also filled in a small gap around the image pickup element 11 and can secure a high light shielding property, it is possible to suppress light scattering.
  • the interface between the glass part 13 and the overmold part 14 is preferably uneven. If the interface between the glass part 13 and the overmold part 14 is flat, light rays that do not contribute to imaging are reflected and incident on the image sensor 11, and flare (light fogging) and ghost (light reflection) occur. It is to do.
  • the interface between the glass part 13 and the overmold part 14 can be formed in a concavo-convex shape by roughening the peripheral surface of the glass part 13.
  • an infrared cut filter (infrared cut layer) may be disposed on the exposed surface of the glass portion 13 that is not covered with the overmold portion 14, that is, the light receiving surface 13a of the glass portion 13.
  • the film thickness of the infrared cut filter is preferably 4 to 7 ⁇ m.
  • FIG. 3 is a diagram illustrating a manufacturing process of the image sensor unit 10. First, as shown in FIG. 3A, the image sensor 11 is mounted on the substrate 12 (first step).
  • a resin adhesive is applied to the light receiving surface of the image sensor 11 (second step).
  • a second resin adhesive 15b containing a filler is applied to the non-imaging area 11b of the imaging element 11 and temporarily cured by heating or light irradiation to form a gel.
  • the second resin adhesive 15b is applied to the outside of the four corners of the imaging area 11a.
  • the 1st resin adhesive 15a without a filler is apply
  • the application amount of the first resin adhesive 15a is set such that the entire surface of the imaging area 11a is covered when the first resin adhesive 15a is expanded by pressing the glass portion 13.
  • the glass portion 13 is placed on the image sensor 11 and pressed with a predetermined pressure (third step).
  • the first resin adhesive 15a without filler is expanded and pushed out of the imaging area 11a through the gap between the second resin adhesive 15b with filler.
  • bubbles are pushed out of the imaging area 11a together with the first resin adhesive 15a.
  • a uniform adhesive layer 15 is formed (see FIG. 4C).
  • the first resin adhesive 15a and the second resin adhesive 15b are fully cured by heating or light irradiation.
  • the second resin adhesive 15b containing filler is also slightly expanded by pressing the glass portion 13, so that the application position and the application amount of the second resin adhesive 15b do not enter the imaging area 11a even if expanded. Should be set.
  • the overmold part 14 is formed around the glass part 13 by molding to complete the imaging element unit 10 (fourth step). After the molding, the upper surface of the overmold part 14 may be polished so that the light receiving surface 13a of the glass part 13 is surfaced.
  • the image sensor unit 10 includes an image sensor (11) that captures a subject image formed by the lens unit, a substrate (12) on which the image sensor (11) is mounted, and a refractive index higher than that of air.
  • An element covering portion (glass portion 13) that is made of a large transparent substance and is disposed so as to cover the imaging area (11a) of the imaging element (11), and a substrate (12) so as to surround the element covering portion (13).
  • an overmold part (14) formed by molding at the peripheral part.
  • the image sensor unit 10 since it does not include a lens part, it can easily cope with lens parts of various specifications and is highly versatile. Moreover, since the glass part 13 is reinforced with the overmold part 14, size reduction can be achieved. Moreover, since the light-receiving surface of the image pick-up element 11 is covered with the glass part 13, the high resolution of an image pick-up device can be achieved. Furthermore, since dust does not adhere to the imaging area 11a of the imaging device 11, good image quality can be realized.
  • FIG. 5 is a perspective view showing the imaging apparatus 1 including the imaging element unit 10.
  • FIG. 6 is a diagram illustrating an optical system of the imaging apparatus 1.
  • the imaging apparatus 1 shown in FIGS. 5 and 6 includes the above-described imaging element unit 10 and a lens unit 20 having one or more lens groups (five groups in FIG. 6) including a proximity lens close to the imaging element unit 10.
  • the imaging device 1 is mounted on a camera-equipped mobile terminal such as a smartphone, a mobile phone, a notebook computer, a tablet terminal, a portable game machine, a web camera, or an in-vehicle camera.
  • the lens unit 20 is a so-called zoom lens that can cope with wide-angle shooting (focal length: short) to telephoto shooting (focal length: long).
  • the lens unit 20 includes a first lens group 21, a second lens group 22, a third lens group 23, a fourth lens group 24, and a fifth lens group 25 in order from the subject side.
  • the first lens group 21 is a lens group including a prism, and is fixed during zooming.
  • the second lens group 22 is a variator lens group that moves on the optical axis at the time of zooming and changes the focal length of the entire lens system. For example, in the case of zooming from the wide angle end to the telephoto end, the second lens group 22 moves to the first lens group 21 side.
  • the third lens group 23 is a compensator lens group that moves on the optical axis in conjunction with the movement of the second lens group 22 and corrects a focus shift caused by zooming.
  • the fourth lens group 24 is a lens for camera shake correction.
  • the fifth lens group 25 is a proximity lens close to the light receiving surface of the image sensor unit 10.
  • a second lens group drive unit 32 is connected to the second lens group 22.
  • a driving mechanism of the second lens group 22 is shown in FIG.
  • the second lens group 22 is held by the lens barrel 324.
  • the lens barrel 324 is slidably held on a guide shaft 323 arranged in parallel to the optical axis.
  • the lens barrel 324 is connected to the drive shaft 322 of the drive motor 321.
  • the lens barrel 324 holding the second lens group 22 is moved along the guide shaft 323 by a predetermined distance. Move and change focal length.
  • the third lens group 23 is connected with a third lens group driving unit 33.
  • the third lens group driving unit 33 When the operation of the third lens group driving unit 33 is controlled by a control unit (not shown), the third lens group 23 moves on the optical axis by a predetermined distance. Since the driving mechanism of the third lens group 23 is the same as that of the second lens group 22, the description thereof is omitted.
  • the OIS (Optical Image Stabilization) drive unit 34 is connected to the fourth lens group 24.
  • the OIS drive unit 34 includes, for example, a lens barrel (not shown) that holds the fourth lens group 24, a movable unit having a magnet unit (not shown), and a fixed unit having a coil unit (not shown).
  • the lens barrel is swung using the driving force of the voice coil motor (VCM).
  • VCM voice coil motor
  • a printed wiring board 42 is connected to the second lens group driving unit 32, the third group lens driving unit 33, and the OIS driving unit 34, and signals related to power feeding and driving are input / output via the printed wiring board 42. Is done.
  • the image sensor unit 10 is disposed in proximity to the fifth lens group 25 (proximity lens).
  • the distance between the image sensor unit 10 (the light receiving surface 13a of the glass portion 13 or the infrared cut filter) and the fifth lens group 25 is preferably 0.1 ⁇ m to 2.8 mm. In this case, it is confirmed that the spatial frequency at 30% MTF (Modulation (Transfer Function) on the optical axis is improved by 2.5 times compared to the optical system without the glass portion 13, and the resolution is remarkably improved. ing.
  • the printed wiring board 41 is connected to the substrate 12 of the image pickup device unit 10, and the power supply to the image pickup device 11 and the output of the video signal imaged by the image pickup device 11 are performed via the printed wiring board 41.
  • the imaging apparatus 1 including the imaging element unit 10 high resolution can be achieved. Moreover, since dust does not adhere to the imaging area 11a of the imaging element 11, a certain quality is maintained.
  • the present invention is not limited to the above embodiment, and can be changed without departing from the gist thereof.
  • it can replace with the glass part 13 in embodiment, and the box body which sealed liquids, such as water and oil, can also be applied. That is, the element covering portion in the present invention only needs to be made of a transparent material having a refractive index larger than that of air.
  • positioning location of the 2nd resin adhesive 15b containing a filler in embodiment is not limited to the form shown in FIG.
  • the second resin adhesive 15b may be applied to a plurality of locations (eight locations in FIG. 8A) along the periphery of the imaging area 11a of the imaging device 11.
  • the second resin adhesive 15b may be applied in a strip shape along the periphery of the imaging area 11a of the imaging device 11. That is, the second resin adhesive 15b may be applied so as to have a gap through which the second resin adhesive 15a without filler is pushed out of the imaging area 11a.

Abstract

　The objectives of the present invention are to provide an image-capturing element unit that is capable of easily becoming compatible with lens sections of various specifications and capable of being reduced in size, and to provide an image-capturing device and a camera-equipped mobile terminal that are provided with the image-capturing element unit. An image-capturing element unit (10) is disposed in proximity to a lens section that has one or more lens groups. The image-capturing element unit (10) is provided with an image-capturing element (11) for capturing an image of an object that is to be imaged by the lens section, a substrate (12) on which the image-capturing element (11) is mounted, an element-covering part (glass part) (13) that is configured using a transparent material having an index of refraction larger than that of the air and that is disposed to cover an image-capture area (11a) of the image-capturing element (11), and an overmold part (14) that is formed by being molded onto the peripheral edges of the substrate (12) to enclose the element-covering part (13).

Description

撮像素子ユニット、撮像装置、及びカメラ付き携帯端末Imaging device unit, imaging device, and portable terminal with camera
　本発明は、撮像素子ユニット、撮像装置、及びカメラ付き携帯端末に関する。 The present invention relates to an imaging element unit, an imaging device, and a mobile terminal with a camera.
　一般に、スマートフォン等の携帯端末には、小型の撮像装置が搭載されている。撮像装置は、１以上のレンズ群を有するレンズ部と、レンズ部により結像された被写体像を撮像する撮像素子を備える。被写体を撮影するときのピント合わせを自動的に行うオートフォーカス機能及び撮影時に生じる手振れ（振動）を補正して画像の乱れを軽減する手振れ補正機能（ＯＩＳ：Optical Image Stabilization）を備えているものも多い。近年では、画像のさらなる高精細化に対応すべく、高解像度の撮像装置が要求されている。 Generally, a small imaging device is mounted on a mobile terminal such as a smartphone. The imaging apparatus includes a lens unit having one or more lens groups, and an imaging element that captures a subject image formed by the lens unit. Some cameras have an autofocus function that automatically adjusts the focus when shooting the subject and a camera shake correction function (OIS: Optical Image Stabilization) that corrects camera shake (vibration) that occurs during shooting. Many. In recent years, there has been a demand for high-resolution imaging devices in order to cope with higher definition of images.
　撮像装置における分解能Ｒは、Ｋ：定数（代表的には０．６１）、λ：光の波長、ＮＡ：開口数として、下式（１）で表される。
　　Ｒ＝Ｋ・λ／ＮＡ　・・・（１）
　また、開口数ＮＡは、ｎ：近接レンズ（撮像素子の最も近くに配置されるレンズ、最終レンズとも呼ばれる）と撮像素子の間の媒質の屈折率、θ：光の入射角として、下式（２）で表される。
　　ＮＡ＝ｎ・ｓｉｎθ　・・・（２）
　Ｋ、λは一定なので、屈折率ｎの大きい物質で近接レンズと撮像素子の間を充填することで、分解能Ｒを高くすることができる。 The resolution R in the imaging apparatus is expressed by the following equation (1), where K is a constant (typically 0.61), λ is the wavelength of light, and NA is the numerical aperture.
R = K · λ / NA (1)
In addition, the numerical aperture NA is expressed by the following formula (n), where n is a refractive index of a medium between a proximity lens (a lens disposed closest to the imaging device, also called a final lens) and the imaging device, and θ is an incident angle of light. 2).
NA = n · sin θ (2)
Since K and λ are constant, the resolution R can be increased by filling the space between the proximity lens and the image sensor with a substance having a large refractive index n.
　例えば、特許文献１には、レンズバレル（鏡筒）内に撮像素子及び近接レンズを収容し、これらの間に空気よりも屈折率の大きい透明物質（例えば水）を充填してなる撮像素子ユニットが開示されている。 For example, Patent Document 1 discloses an image pickup device unit in which an image pickup device and a proximity lens are housed in a lens barrel (lens barrel) and a transparent substance (for example, water) having a refractive index larger than that of air is filled therebetween. Is disclosed.
特開２００５－３０３１４８号公報JP 2005-303148 A
　しかしながら、特許文献１に記載の撮像装置においては、撮像素子ユニットがレンズ部の一部である近接レンズを含んで構成されるため、様々な仕様のレンズ部を設計する上で制約がある。また、レンズバレル内に撮像素子が収容される構成となっているため、小型化を図ることが困難である。 However, in the imaging device described in Patent Document 1, since the imaging element unit is configured to include a proximity lens that is a part of the lens unit, there are limitations in designing lens units having various specifications. In addition, since the imaging element is housed in the lens barrel, it is difficult to reduce the size.
　本発明の目的は、様々な仕様のレンズ部に容易に対応できるとともに小型化を図ることができる撮像素子ユニットを提供すること、並びにこの撮像素子ユニットを備える撮像装置及びカメラ付き携帯端末を提供することである。 An object of the present invention is to provide an image sensor unit that can easily cope with lens units of various specifications and can be miniaturized, and to provide an image pickup apparatus including the image sensor unit and a camera-equipped mobile terminal. That is.
　本発明に係る撮像素子ユニットは、１以上のレンズ群を有するレンズ部に近接して配置される撮像素子ユニットであって、
　前記レンズ部により結像される被写体像を撮像する撮像素子と、
　前記撮像素子が実装される基板と、
　空気よりも屈折率の大きい透明物質で構成され、前記撮像素子の撮像エリアを覆うように配置される素子被覆部と、
　前記素子被覆部を囲繞するように前記基板の周縁部にモールド成形によって形成されるオーバーモールド部と、を備えることを特徴とする。 The image pickup device unit according to the present invention is an image pickup device unit that is disposed in the vicinity of a lens unit having one or more lens groups,
An image sensor for imaging a subject image formed by the lens unit;
A substrate on which the image sensor is mounted;
Composed of a transparent material having a refractive index greater than that of air, and an element covering portion disposed so as to cover the imaging area of the imaging element;
And an overmold part formed by molding on the peripheral edge of the substrate so as to surround the element covering part.
　本発明に係る撮像装置は、上記の撮像素子ユニットと、
　前記撮像素子ユニットに近接する近接レンズを含む１以上のレンズ群を有するレンズ部と、を備えることを特徴とする。 An imaging apparatus according to the present invention includes the above-described imaging element unit;
A lens unit including one or more lens groups including a proximity lens close to the image sensor unit.
　本発明に係るカメラ付き携帯端末は、上記の撮像装置を備えることを特徴とする。 A mobile terminal with a camera according to the present invention includes the above-described imaging device.
　本発明に係る撮像素子ユニットによれば、レンズ部を含まないので、様々な仕様のレンズ部に容易に対応することができ、汎用性が高い。また、オーバーモールド部によって素子被覆部を補強するので、小型化を図ることができる。 The image sensor unit according to the present invention does not include a lens portion, and thus can easily cope with lens portions of various specifications and is highly versatile. Further, since the element covering portion is reinforced by the overmold portion, the size can be reduced.
本発明の一実施の形態に係る撮像素子ユニットを示す斜視図である。It is a perspective view showing an image sensor unit according to an embodiment of the present invention. 撮像素子ユニットのＸ軸に垂直な断面図である。It is sectional drawing perpendicular | vertical to the X-axis of an image pick-up element unit. 撮像素子ユニットの製造工程を示す図である。It is a figure which shows the manufacturing process of an image pick-up element unit. 樹脂接着剤の塗布状態の一例を示す図である。It is a figure which shows an example of the application | coating state of a resin adhesive. 撮像素子ユニットを備える撮像装置を示す斜視図である。It is a perspective view showing an imaging device provided with an image sensor unit. 撮像装置の光学系を示す図である。It is a figure which shows the optical system of an imaging device. 第２レンズ群の駆動機構を示す図である。It is a figure which shows the drive mechanism of a 2nd lens group. 樹脂接着剤の塗布状態の他の一例を示す図である。It is a figure which shows another example of the application | coating state of a resin adhesive.
　以下、本発明の実施の形態を図面に基づいて詳細に説明する。
　図１は、本発明の一実施の形態に係る撮像素子ユニット１０を示す斜視図である。図２は、撮像素子ユニット１０のＸ軸に垂直な断面図である。
　図１、２に示す撮像素子ユニット１０は、撮像装置の光学系において、１以上のレンズ群を有するレンズ部に近接して配置されるものである。撮像素子ユニット１０は、撮像素子１１、基板１２、ガラス部１３、及びオーバーモールド部１４を備える。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a perspective view showing an image sensor unit 10 according to an embodiment of the present invention. FIG. 2 is a cross-sectional view perpendicular to the X axis of the image sensor unit 10.
The imaging element unit 10 shown in FIGS. 1 and 2 is disposed in the vicinity of a lens unit having one or more lens groups in the optical system of the imaging apparatus. The image sensor unit 10 includes an image sensor 11, a substrate 12, a glass part 13, and an overmold part 14.
　撮像素子１１は、例えばＣＣＤ（chargecoupled device）型イメージセンサー、ＣＭＯＳ（complementary metal oxide semiconductor）型イメージセンサー等により構成される。撮像素子１１は、基板１２に実装され、ボンディングワイヤー１６を介して基板１１上の配線に電気的に接続される。撮像素子１１は、レンズ部（図示略）により結像された被写体像を撮像する。撮像素子１１の受光面のうち中央部が撮像エリア１１ａであり、撮像エリア１１ａを除く周縁部が非撮像エリア１１ｂである。 The image pickup device 11 is composed of, for example, a CCD (charge coupled device) image sensor, a CMOS (complementary metal oxide) semiconductor image sensor, or the like. The image sensor 11 is mounted on the substrate 12 and is electrically connected to the wiring on the substrate 11 via the bonding wires 16. The image sensor 11 captures a subject image formed by a lens unit (not shown). The center part of the light receiving surface of the image sensor 11 is the imaging area 11a, and the peripheral part excluding the imaging area 11a is the non-imaging area 11b.
　ガラス部１３は、空気よりも屈折率の大きい透明なガラス材で構成され、撮像エリア１１ａを覆うように撮像素子１１上に配置される。撮像素子１１の撮像エリア１１ａにガラス部１３を配置することにより、開口数ＮＡ（＝ｎ・ｓｉｎθ）が大きくなり回折限界が小さくなるので、高解像度化を図るのに好適である。また、撮像素子ユニット１０を撮像装置に実装する際に、撮像素子１１の撮像エリア１１ａに塵埃が付着するのを防止できるので、良好な画像品質を実現することができる。 The glass portion 13 is made of a transparent glass material having a refractive index larger than that of air, and is disposed on the image sensor 11 so as to cover the image area 11a. By arranging the glass portion 13 in the imaging area 11a of the imaging device 11, the numerical aperture NA (= n · sin θ) increases and the diffraction limit decreases, which is suitable for increasing the resolution. Moreover, since dust can be prevented from adhering to the imaging area 11a of the imaging element 11 when the imaging element unit 10 is mounted on the imaging apparatus, good image quality can be realized.
　ガラス部１３は、接着層１５を介して撮像素子１１上に接着される。接着層１５は、例えば撮像素子１１の受光面に樹脂接着剤（例えばシリコーン系樹脂）を塗布し、その上にガラス部１３を載置して所定の圧力で押圧し、樹脂接着剤を押し拡げることにより形成される。 The glass part 13 is bonded onto the image sensor 11 via the adhesive layer 15. The adhesive layer 15, for example, applies a resin adhesive (for example, silicone-based resin) to the light receiving surface of the image sensor 11, places the glass portion 13 thereon, presses it with a predetermined pressure, and spreads the resin adhesive. Is formed.
　接着層１５は、フィラー無しの樹脂接着剤（以下「第１の接着剤」）とフィラー入りの樹脂接着剤（以下「第２の接着剤」）を用いて形成するのが好ましい。接着層１５のうち第１の接着剤で構成される部分を「第１の接着部」、第２の接着剤構成される部分を「第２の接着部」と称する。
　第１の接着部は、撮像エリア１１ａを含む領域に配置され、第２の接着部は、撮像エリア１１ａを除く非撮像エリア１１ｂにだけ配置される。通常、フィラーは撮像素子１１の１画素よりも大きく、撮像エリア１１ａ内にフィラーがあると画像に映り込んで画像品質が劣化するためである。 The adhesive layer 15 is preferably formed using a resin adhesive without filler (hereinafter referred to as “first adhesive”) and a resin adhesive containing filler (hereinafter referred to as “second adhesive”). A portion constituted by the first adhesive in the adhesive layer 15 is referred to as a “first adhesive portion”, and a portion constituted by the second adhesive is referred to as a “second adhesive portion”.
The first adhesive portion is disposed in a region including the imaging area 11a, and the second adhesive portion is disposed only in the non-imaging area 11b excluding the imaging area 11a. This is because the filler is usually larger than one pixel of the image sensor 11, and if there is a filler in the imaging area 11a, it is reflected in the image and the image quality deteriorates.
　ガラス部１３を押圧してもフィラーは容易に損壊しないので、非撮像エリア１１ｂにフィラー入りの第２の接着部を配置することにより、接着層１５の厚さを容易に制御することができる。フィラーの種類、大きさ、形状、添加量などは、接着層１５に要求される接着力や接着層１５の設計厚さに応じて適宜に調整される。 Since the filler is not easily damaged even when the glass portion 13 is pressed, the thickness of the adhesive layer 15 can be easily controlled by arranging the second adhesive portion containing the filler in the non-imaging area 11b. The type, size, shape, addition amount, and the like of the filler are appropriately adjusted according to the adhesive force required for the adhesive layer 15 and the design thickness of the adhesive layer 15.
　接着層１５の厚さは、２μｍ以上２５μｍ以下であることが好ましい。接着層１５の厚さが２μｍ未満であると撮像素子１１とガラス部１３が熱応力等によって剥離する虞があり、２５μｍを超えると画像品質に悪影響を及ぼす虞があるためである。第２の接着剤に分散されるフィラーを調整することにより、接着層１５の厚さを容易に所望の厚さとすることができる。 The thickness of the adhesive layer 15 is preferably 2 μm or more and 25 μm or less. This is because if the thickness of the adhesive layer 15 is less than 2 μm, the image sensor 11 and the glass portion 13 may be peeled off due to thermal stress or the like, and if it exceeds 25 μm, the image quality may be adversely affected. By adjusting the filler dispersed in the second adhesive, the thickness of the adhesive layer 15 can be easily set to a desired thickness.
　オーバーモールド部１４は、受光面１３ａを除くガラス部１３の周囲を囲繞するように基板１２の周縁部にモールド成形によって形成される。オーバーモールド部１４は、遮光性が高い、硬質の樹脂材料（例えばエポキシ樹脂）で構成され、ガラス部１３を補強する。オーバーモールド部１４は、ボンディングワイヤー１６の配置領域を含んで形成され、基板１２の外形サイズと同等に仕上げることができるので、特許文献１に記載されるような撮像素子ユニットに比較して小型化を図ることができる。また、オーバーモールド部１４は、撮像素子１１の周囲の小さな隙間にも充填され、高い遮光性を確保できるので、光の散乱を抑制することができる。 The overmold part 14 is formed by molding at the peripheral part of the substrate 12 so as to surround the periphery of the glass part 13 excluding the light receiving surface 13a. The overmold part 14 is made of a hard resin material (for example, epoxy resin) having high light shielding properties, and reinforces the glass part 13. Since the overmold portion 14 is formed including the arrangement region of the bonding wire 16 and can be finished to the same size as the outer size of the substrate 12, the overmold portion 14 is reduced in size as compared with the image sensor unit described in Patent Document 1. Can be achieved. Moreover, since the overmold part 14 is also filled in a small gap around the image pickup element 11 and can secure a high light shielding property, it is possible to suppress light scattering.
　ガラス部１３とオーバーモールド部１４の界面は凹凸状になっていることが好ましい。ガラス部１３とオーバーモールド部１４の界面が平坦になっていると、撮像に寄与しない光線が反射して撮像素子１１に入射し、フレア（光のかぶり）やゴースト（光の映り込み）が発生するためである。例えば、ガラス部１３の周面に粗面加工を施すことにより、ガラス部１３とオーバーモールド部１４の界面を凹凸状に形成することができる。 The interface between the glass part 13 and the overmold part 14 is preferably uneven. If the interface between the glass part 13 and the overmold part 14 is flat, light rays that do not contribute to imaging are reflected and incident on the image sensor 11, and flare (light fogging) and ghost (light reflection) occur. It is to do. For example, the interface between the glass part 13 and the overmold part 14 can be formed in a concavo-convex shape by roughening the peripheral surface of the glass part 13.
　なお、ガラス部１３のうちオーバーモールド部１４で覆われていない露出面、すなわちガラス部１３の受光面１３ａには、赤外線カットフィルタ（赤外線カット層）を配置するようにしてもよい。この場合、赤外線カットフィルタの膜厚は、４～７μｍとするのが好ましい。 Note that an infrared cut filter (infrared cut layer) may be disposed on the exposed surface of the glass portion 13 that is not covered with the overmold portion 14, that is, the light receiving surface 13a of the glass portion 13. In this case, the film thickness of the infrared cut filter is preferably 4 to 7 μm.
　図３は、撮像素子ユニット１０の製造工程を示す図である。
　まず、図３Ａに示すように、基板１２に撮像素子１１を実装する（第１の工程）。 FIG. 3 is a diagram illustrating a manufacturing process of the image sensor unit 10.
First, as shown in FIG. 3A, the image sensor 11 is mounted on the substrate 12 (first step).
　次に、図３Ｂに示すように、撮像素子１１の受光面に樹脂接着剤を塗布する（第２の工程）。具体的には、図４Ａに示すように、撮像素子１１の非撮像エリア１１ｂにフィラー入りの第２の樹脂接着剤１５ｂを塗布し、加熱又は光照射により仮硬化させて、ゲル状とする。図４Ａでは、撮像エリア１１ａの四隅の外側に第２の樹脂接着剤１５ｂを塗布している。
　そして、図４Ｂに示すように、撮像エリア１１ａ内にフィラー無しの第１の樹脂接着剤１５ａを塗布する。第１の樹脂接着剤１５ａの塗布量は、ガラス部１３を押圧して第１の樹脂接着剤１５ａが押し拡げられるときに、撮像エリア１１ａの全面が覆われる程度に設定される。 Next, as shown in FIG. 3B, a resin adhesive is applied to the light receiving surface of the image sensor 11 (second step). Specifically, as shown in FIG. 4A, a second resin adhesive 15b containing a filler is applied to the non-imaging area 11b of the imaging element 11 and temporarily cured by heating or light irradiation to form a gel. In FIG. 4A, the second resin adhesive 15b is applied to the outside of the four corners of the imaging area 11a.
And as shown to FIG. 4B, the 1st resin adhesive 15a without a filler is apply | coated in the imaging area 11a. The application amount of the first resin adhesive 15a is set such that the entire surface of the imaging area 11a is covered when the first resin adhesive 15a is expanded by pressing the glass portion 13.
　次に、図３Ｃに示すように、撮像素子１１にガラス部１３を載置し、所定の圧力で押圧する（第３の工程）。このとき、フィラー無しの第１の樹脂接着剤１５ａは押し拡げられて、フィラー入りの第２の樹脂接着剤１５ｂの隙間から撮像エリア１１ａ外にも押し出される。また、第１の樹脂接着剤１５ａとともに気泡も撮像エリア１１ａ外に押し出される。これにより、均一な接着層１５が形成される（図４Ｃ参照）。そして、加熱又は光照射により第１の樹脂接着剤１５ａ及び第２の樹脂接着剤１５ｂを本硬化させる。 Next, as shown in FIG. 3C, the glass portion 13 is placed on the image sensor 11 and pressed with a predetermined pressure (third step). At this time, the first resin adhesive 15a without filler is expanded and pushed out of the imaging area 11a through the gap between the second resin adhesive 15b with filler. In addition, bubbles are pushed out of the imaging area 11a together with the first resin adhesive 15a. As a result, a uniform adhesive layer 15 is formed (see FIG. 4C). Then, the first resin adhesive 15a and the second resin adhesive 15b are fully cured by heating or light irradiation.
　なお、ガラス部１３の押圧によってフィラー入りの第２の樹脂接着剤１５ｂも若干押し拡げられるので、拡がっても撮像エリア１１ａに侵入しないように、第２の樹脂接着剤１５ｂの塗布位置及び塗布量を設定するべきである。 Note that the second resin adhesive 15b containing filler is also slightly expanded by pressing the glass portion 13, so that the application position and the application amount of the second resin adhesive 15b do not enter the imaging area 11a even if expanded. Should be set.
　次に、図３Ｄに示すように、ガラス部１３の周囲にモールド成形によってオーバーモールド部１４を形成し、撮像素子ユニット１０が完成する（第４の工程）。モールド成形後に、オーバーモールド部１４の上面を研磨して、ガラス部１３の受光面１３ａの面出しを行うようにしてもよい。 Next, as shown in FIG. 3D, the overmold part 14 is formed around the glass part 13 by molding to complete the imaging element unit 10 (fourth step). After the molding, the upper surface of the overmold part 14 may be polished so that the light receiving surface 13a of the glass part 13 is surfaced.
　このように、撮像素子ユニット１０は、レンズ部により結像される被写体像を撮像する撮像素子（１１）と、撮像素子（１１）が実装される基板（１２）と、空気よりも屈折率の大きい透明物質で構成され、撮像素子（１１）の撮像エリア（１１ａ）を覆うように配置される素子被覆部（ガラス部１３）と、素子被覆部（１３）を囲繞するように基板（１２）の周縁部にモールド成形によって形成されるオーバーモールド部（１４）と、を備える。 As described above, the image sensor unit 10 includes an image sensor (11) that captures a subject image formed by the lens unit, a substrate (12) on which the image sensor (11) is mounted, and a refractive index higher than that of air. An element covering portion (glass portion 13) that is made of a large transparent substance and is disposed so as to cover the imaging area (11a) of the imaging element (11), and a substrate (12) so as to surround the element covering portion (13). And an overmold part (14) formed by molding at the peripheral part.
　撮像素子ユニット１０によれば、レンズ部を含まないので、様々な仕様のレンズ部に容易に対応することができ、汎用性が高い。また、オーバーモールド部１４によってガラス部１３を補強するので、小型化を図ることができる。また、撮像素子１１の受光面がガラス部１３で覆われるので、撮像装置の高解像度化を図ることができる。さらには、撮像素子１１の撮像エリア１１ａに塵埃が付着しないので、良好な画像品質を実現することができる。 According to the image sensor unit 10, since it does not include a lens part, it can easily cope with lens parts of various specifications and is highly versatile. Moreover, since the glass part 13 is reinforced with the overmold part 14, size reduction can be achieved. Moreover, since the light-receiving surface of the image pick-up element 11 is covered with the glass part 13, the high resolution of an image pick-up device can be achieved. Furthermore, since dust does not adhere to the imaging area 11a of the imaging device 11, good image quality can be realized.
　図５は、撮像素子ユニット１０を備える撮像装置１を示す斜視図である。図６は、撮像装置１の光学系を示す図である。
　図５、図６に示す撮像装置１は、上述した撮像素子ユニット１０と、撮像素子ユニット１０に近接する近接レンズを含む１以上のレンズ群（図６では５群）を有するレンズ部２０とを備える。撮像装置１は、例えばスマートフォン、携帯電話機、ノート型パソコン、タブレット端末、携帯型ゲーム機、ｗｅｂカメラ、車載用カメラ等のカメラ付き携帯端末に搭載される。 FIG. 5 is a perspective view showing the imaging apparatus 1 including the imaging element unit 10. FIG. 6 is a diagram illustrating an optical system of the imaging apparatus 1.
The imaging apparatus 1 shown in FIGS. 5 and 6 includes the above-described imaging element unit 10 and a lens unit 20 having one or more lens groups (five groups in FIG. 6) including a proximity lens close to the imaging element unit 10. Prepare. The imaging device 1 is mounted on a camera-equipped mobile terminal such as a smartphone, a mobile phone, a notebook computer, a tablet terminal, a portable game machine, a web camera, or an in-vehicle camera.
　レンズ部２０は、広角撮影（焦点距離：短）から望遠撮影（焦点距離：長）に対応できる、いわゆるズームレンズである。レンズ部２０は、被写体側から順に、第１レンズ群２１、第２レンズ群２２、第３レンズ群２３、第４レンズ群２４、及び第５レンズ群２５を有する。 The lens unit 20 is a so-called zoom lens that can cope with wide-angle shooting (focal length: short) to telephoto shooting (focal length: long). The lens unit 20 includes a first lens group 21, a second lens group 22, a third lens group 23, a fourth lens group 24, and a fifth lens group 25 in order from the subject side.
　第１レンズ群２１は、プリズムを含むレンズ群であり、変倍中は固定とされる。
　第２レンズ群２２は、変倍に際して光軸上を移動してレンズ系全体としての焦点距離を変えるバリエータ－レンズ群である。例えば、広角端から望遠端への変倍の場合、第２レンズ群２２は、第１レンズ群２１側に移動する。
　第３レンズ群２３は、第２レンズ群２２の移動に連動して光軸上を移動し、変倍に伴う焦点ズレを補正するコンペンセーターレンズ群である。
　第４レンズ群２４は、手振れ補正用のレンズである。
　第５レンズ群２５は、撮像素子ユニット１０の受光面に近接する近接レンズである。 The first lens group 21 is a lens group including a prism, and is fixed during zooming.
The second lens group 22 is a variator lens group that moves on the optical axis at the time of zooming and changes the focal length of the entire lens system. For example, in the case of zooming from the wide angle end to the telephoto end, the second lens group 22 moves to the first lens group 21 side.
The third lens group 23 is a compensator lens group that moves on the optical axis in conjunction with the movement of the second lens group 22 and corrects a focus shift caused by zooming.
The fourth lens group 24 is a lens for camera shake correction.
The fifth lens group 25 is a proximity lens close to the light receiving surface of the image sensor unit 10.
　第２レンズ群２２には、２群レンズ用駆動部３２が接続される。第２レンズ群２２の駆動機構を図７に示す。図７に示すように、第２レンズ群２２は、レンズバレル３２４に保持される。レンズバレル３２４は、光軸に平行に配置されたガイド軸３２３に、摺動可能に保持される。また、レンズバレル３２４は、駆動用モーター３２１の駆動軸３２２に接続される。
　制御部（図示略）によって２群レンズ用駆動部３２（駆動用モーター３２１）の動作が制御されることにより、第２レンズ群２２を保持するレンズバレル３２４がガイド軸３２３に沿って所定距離だけ移動し、焦点距離が変更される。 A second lens group drive unit 32 is connected to the second lens group 22. A driving mechanism of the second lens group 22 is shown in FIG. As shown in FIG. 7, the second lens group 22 is held by the lens barrel 324. The lens barrel 324 is slidably held on a guide shaft 323 arranged in parallel to the optical axis. The lens barrel 324 is connected to the drive shaft 322 of the drive motor 321.
By controlling the operation of the second group lens drive unit 32 (drive motor 321) by a control unit (not shown), the lens barrel 324 holding the second lens group 22 is moved along the guide shaft 323 by a predetermined distance. Move and change focal length.
　第３レンズ群２３には、３群レンズ用駆動部３３が接続される。制御部（図示略）によって第３群レンズ用駆動部３３の動作が制御されることにより、第３レンズ群２３は光軸上を所定距離だけ移動する。第３レンズ群２３の駆動機構については、第２レンズ群２２の駆動機構と同様であるので、説明を省略する。 The third lens group 23 is connected with a third lens group driving unit 33. When the operation of the third lens group driving unit 33 is controlled by a control unit (not shown), the third lens group 23 moves on the optical axis by a predetermined distance. Since the driving mechanism of the third lens group 23 is the same as that of the second lens group 22, the description thereof is omitted.
　第４レンズ群２４には、ＯＩＳ（Optical Image Stabilization）用駆動部３４が接続される。ＯＩＳ用駆動部３４は、例えば第４レンズ群２４を保持するレンズバレル（図示略）及びマグネット部（図示略）を有する可動部と、コイル部（図示略）を有する固定部と、を備え、ボイスコイルモーター（ＶＣＭ）の駆動力を利用して、レンズバレルを揺動させる。制御部（図示略）によってＯＩＳ用駆動部３４の動作が制御されることにより、第４レンズ群２４が揺動し、手振れ補正が行われる。 The OIS (Optical Image Stabilization) drive unit 34 is connected to the fourth lens group 24. The OIS drive unit 34 includes, for example, a lens barrel (not shown) that holds the fourth lens group 24, a movable unit having a magnet unit (not shown), and a fixed unit having a coil unit (not shown). The lens barrel is swung using the driving force of the voice coil motor (VCM). When the operation of the OIS drive unit 34 is controlled by a control unit (not shown), the fourth lens group 24 swings, and camera shake correction is performed.
　２群レンズ用駆動部３２、３群レンズ用駆動部３３、及びＯＩＳ用駆動部３４には、プリント配線基板４２が接続され、このプリント配線基板４２を介して給電及び駆動に関わる信号の入出力が行われる。 A printed wiring board 42 is connected to the second lens group driving unit 32, the third group lens driving unit 33, and the OIS driving unit 34, and signals related to power feeding and driving are input / output via the printed wiring board 42. Is done.
　撮像素子ユニット１０は、第５レンズ群２５（近接レンズ）に近接して配置される。撮像素子ユニット１０（ガラス部１３の受光面１３ａ又は赤外線カットフィルタ）と第５レンズ群２５の間隔は、０．１μｍ～２．８ｍｍであることが好ましい。この場合、ガラス部１３を設けない光学系に比較して、光軸上のＭＴＦ（Modulation Transfer Function）３０％時の空間周波数が２．５倍向上し、解像度が格段に向上することが確認されている。 The image sensor unit 10 is disposed in proximity to the fifth lens group 25 (proximity lens). The distance between the image sensor unit 10 (the light receiving surface 13a of the glass portion 13 or the infrared cut filter) and the fifth lens group 25 is preferably 0.1 μm to 2.8 mm. In this case, it is confirmed that the spatial frequency at 30% MTF (Modulation （Transfer Function) on the optical axis is improved by 2.5 times compared to the optical system without the glass portion 13, and the resolution is remarkably improved. ing.
　撮像素子ユニット１０の基板１２にはプリント配線基板４１が接続され、このプリント配線基板４１を介して撮像素子１１への給電及び撮像素子１１で撮像された映像信号の出力が行われる。 The printed wiring board 41 is connected to the substrate 12 of the image pickup device unit 10, and the power supply to the image pickup device 11 and the output of the video signal imaged by the image pickup device 11 are performed via the printed wiring board 41.
　撮像素子ユニット１０を備える撮像装置１によれば、高解像度化を図ることができる。また、撮像素子１１の撮像エリア１１ａに塵埃が付着しないので、一定の品質が保持される。 According to the imaging apparatus 1 including the imaging element unit 10, high resolution can be achieved. Moreover, since dust does not adhere to the imaging area 11a of the imaging element 11, a certain quality is maintained.
　以上、本発明者によってなされた発明を実施の形態に基づいて具体的に説明したが、本発明は上記実施の形態に限定されるものではなく、その要旨を逸脱しない範囲で変更可能である。
　例えば、実施の形態におけるガラス部１３に代えて、水や油等の液体を封止した箱体を適用することもできる。すなわち、本発明における素子被覆部は、空気よりも屈折率の大きい透明物質で構成されたものであればよい。 As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the above embodiment, and can be changed without departing from the gist thereof.
For example, it can replace with the glass part 13 in embodiment, and the box body which sealed liquids, such as water and oil, can also be applied. That is, the element covering portion in the present invention only needs to be made of a transparent material having a refractive index larger than that of air.
　また、実施の形態におけるフィラー入りの第２の樹脂接着剤１５ｂの配置箇所は、図４に示す形態に限定されない。例えば、図８Ａに示すように、撮像素子１１の撮像エリア１１ａの周縁に沿う複数の箇所（図８Ａでは８箇所）に第２の樹脂接着剤１５ｂを塗布するようにしてもよい。また例えば、図８Ｂに示すように、撮像素子１１の撮像エリア１１ａの周縁に沿って第２の樹脂接着剤１５ｂを帯状に塗布するようにしてもよい。すなわち、第２の樹脂接着剤１５ｂは、フィラー無しの第２の樹脂接着剤１５ａが撮像エリア１１ａ外に押し出される隙間を有するように塗布されればよい。 Moreover, the arrangement | positioning location of the 2nd resin adhesive 15b containing a filler in embodiment is not limited to the form shown in FIG. For example, as shown in FIG. 8A, the second resin adhesive 15b may be applied to a plurality of locations (eight locations in FIG. 8A) along the periphery of the imaging area 11a of the imaging device 11. Further, for example, as shown in FIG. 8B, the second resin adhesive 15b may be applied in a strip shape along the periphery of the imaging area 11a of the imaging device 11. That is, the second resin adhesive 15b may be applied so as to have a gap through which the second resin adhesive 15a without filler is pushed out of the imaging area 11a.
　今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなくて特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
　２０１４年４月２５日出願の特願２０１４－０９１９３３の日本出願に含まれる明細書、図面および要約書の開示内容は、すべて本願に援用される。 The disclosures of the specification, drawings and abstract included in the Japanese application of Japanese Patent Application No. 2014-091933 filed on April 25, 2014 are incorporated herein by reference.
　１　撮像装置
　１０　撮像素子ユニット
　１１　撮像素子
　１１ａ　撮像エリア
　１２　基板
　１３　ガラス部（素子被覆部）
　１４　オーバーモールド部
　１５　接着層
　１６　ボンディングワイヤー DESCRIPTION OF SYMBOLS 1 Imaging device 10 Imaging element unit 11 Imaging element 11a Imaging area 12 Board | substrate 13 Glass part (element coating | coated part)
14 Overmold part 15 Adhesive layer 16 Bonding wire

Claims (10)

  1. 　１以上のレンズ群を有するレンズ部に近接して配置される撮像素子ユニットであって、
    　前記レンズ部により結像される被写体像を撮像する撮像素子と、
    　前記撮像素子が実装される基板と、
    　空気よりも屈折率の大きい透明物質で構成され、前記撮像素子の撮像エリアを覆うように配置される素子被覆部と、
    　前記素子被覆部を囲繞するように前記基板の周縁部にモールド成形によって形成されるオーバーモールド部と、を備えることを特徴とする撮像素子ユニット。     An image sensor unit disposed in proximity to a lens unit having one or more lens groups,
    An image sensor for imaging a subject image formed by the lens unit;
    A substrate on which the image sensor is mounted;
    Composed of a transparent material having a refractive index greater than that of air, and an element covering portion disposed so as to cover the imaging area of the imaging element;
    An image pickup device unit comprising: an overmold portion formed by molding at a peripheral portion of the substrate so as to surround the element covering portion.
  2. 　前記素子被覆部は、ガラスで構成されることを特徴とする請求項１に記載の撮像素子ユニット。 The imaging element unit according to claim 1, wherein the element covering portion is made of glass.
  3. 　前記素子被覆部は、接着層を介して前記撮像素子上に接着されることを特徴とする請求項１に記載の撮像素子ユニット。 The image sensor unit according to claim 1, wherein the element covering portion is bonded onto the image sensor via an adhesive layer.
  4. 　前記接着層の厚さが２μｍ以上２５μｍ以下であることを特徴とする請求項３に記載の撮像素子ユニット。 The imaging element unit according to claim 3, wherein the adhesive layer has a thickness of 2 µm to 25 µm.
  5. 　前記接着層は、
    　フィラー無しの第１の樹脂接着剤からなり、前記撮像エリアを含む領域に配置される第１の接着部と、
    　フィラー入りの第２の樹脂接着剤からなり、前記撮像エリアを除く非撮像エリアにだけ配置される第２の接着部と、を有することを特徴とする請求項３に記載の撮像素子ユニット。     The adhesive layer is
    A first adhesive portion made of a first resin adhesive without a filler and disposed in a region including the imaging area;
    The imaging element unit according to claim 3, further comprising: a second adhesive portion which is made of a second resin adhesive containing a filler and is disposed only in a non-imaging area excluding the imaging area.
  6. 　前記素子被覆部と前記オーバーモールド部との界面が凹凸を有することを特徴とする請求項１に記載の撮像素子ユニット。 The imaging element unit according to claim 1, wherein an interface between the element covering portion and the overmold portion has irregularities.
  7. 　前記素子被覆部のうち前記オーバーモールド部で覆われていない露出面に赤外線カット層を有することを特徴とする請求項１に記載の撮像素子ユニット。 The imaging element unit according to claim 1, further comprising an infrared cut layer on an exposed surface of the element covering portion that is not covered with the overmold portion.
  8. 　請求項１に記載の撮像素子ユニットと、
    　前記撮像素子ユニットに近接する近接レンズを含む１以上のレンズ群を有するレンズ部と、を備えることを特徴とする撮像装置。     The image sensor unit according to claim 1;
    An imaging apparatus comprising: a lens unit including one or more lens groups including a proximity lens close to the imaging element unit.
  9. 　前記近接レンズと前記撮像素子ユニットとの間隔が、０．１μｍ～２．８ｍｍであることを特徴とする請求項８に記載の撮像装置。 The imaging apparatus according to claim 8, wherein a distance between the proximity lens and the imaging element unit is 0.1 μm to 2.8 mm.
  10. 　請求項８に記載の撮像装置を備えることを特徴とするカメラ付き携帯端末。 A camera-equipped mobile terminal comprising the imaging device according to claim 8.
PCT/JP2015/002185 2014-04-25 2015-04-22 Image-capturing element unit, image-capturing device, and camera-equipped mobile terminal WO2015162918A1 (en)

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