WO2015160092A3 - 메모리 소자 - Google Patents
메모리 소자 Download PDFInfo
- Publication number
- WO2015160092A3 WO2015160092A3 PCT/KR2015/002606 KR2015002606W WO2015160092A3 WO 2015160092 A3 WO2015160092 A3 WO 2015160092A3 KR 2015002606 W KR2015002606 W KR 2015002606W WO 2015160092 A3 WO2015160092 A3 WO 2015160092A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- memory element
- tunnel junction
- lower electrode
- magnetic tunnel
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Magnetic active materials
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
Abstract
본 발명은 기판 상에 하부 전극, 버퍼층, 시드층, 자기 터널 접합, 캐핑층, 합성 교환 반자성층 및 상부 전극이 적층 형성되고, 하부 전극 및 시드층은 다결정의 도전 물질로 형성되며, 400℃ 이상의 열처리 온도에서도 자기 터널 접합의 수직 자기 이방성이 유지되는 메모리 소자를 제시한다.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/094,265 US10586919B2 (en) | 2014-04-18 | 2015-03-18 | Memory device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140046563 | 2014-04-18 | ||
KR10-2014-0046563 | 2014-04-18 | ||
KR10-2014-0102139 | 2014-08-08 | ||
KR1020140102139A KR101537715B1 (ko) | 2014-04-18 | 2014-08-08 | 메모리 소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2015160092A2 WO2015160092A2 (ko) | 2015-10-22 |
WO2015160092A3 true WO2015160092A3 (ko) | 2017-05-18 |
Family
ID=54324673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2015/002606 WO2015160092A2 (ko) | 2014-04-18 | 2015-03-18 | 메모리 소자 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10586919B2 (ko) |
KR (1) | KR101537715B1 (ko) |
WO (1) | WO2015160092A2 (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107452869A (zh) * | 2016-05-31 | 2017-12-08 | 上海磁宇信息科技有限公司 | 一种垂直型磁电阻元件及其制造工艺 |
KR102511914B1 (ko) | 2016-08-04 | 2023-03-21 | 삼성전자주식회사 | 자기 기억 소자 및 이의 제조 방법 |
US10468592B1 (en) * | 2018-07-09 | 2019-11-05 | Applied Materials, Inc. | Magnetic tunnel junctions and methods of fabrication thereof |
US20220165950A1 (en) * | 2019-01-29 | 2022-05-26 | Industry-University Cooperation Foundation Hanyang University | Selector device comprising polycrystalline metal oxide layer and cross-point memory comprising same |
US11522126B2 (en) | 2019-10-14 | 2022-12-06 | Applied Materials, Inc. | Magnetic tunnel junctions with protection layers |
CN113346006B (zh) * | 2020-03-02 | 2023-03-21 | 上海磁宇信息科技有限公司 | 磁性隧道结结构及其磁性随机存储器 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008085208A (ja) * | 2006-09-28 | 2008-04-10 | Fujitsu Ltd | トンネル磁気抵抗素子、磁気ヘッドおよび磁気メモリ |
JP2010129115A (ja) * | 2008-11-26 | 2010-06-10 | Showa Denko Kk | 磁気記録媒体及びその製造方法並びに記憶装置 |
JP2012089858A (ja) * | 2011-11-28 | 2012-05-10 | Toshiba Corp | 磁気抵抗効果素子、磁気メモリ、磁気抵抗効果ヘッド、および磁気記録再生装置 |
KR20140011138A (ko) * | 2012-07-17 | 2014-01-28 | 삼성전자주식회사 | 자기 소자 및 그 제조 방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US22501A (en) * | 1859-01-04 | Cofeee-pot | ||
US92502A (en) * | 1869-07-13 | Improvement in door-locks | ||
US3000204A (en) * | 1957-08-23 | 1961-09-19 | Lisle W Menzimer | Door control mechanism |
US6911710B2 (en) * | 2000-03-09 | 2005-06-28 | Hewlett-Packard Development Company, L.P. | Multi-bit magnetic memory cells |
KR101040163B1 (ko) | 2008-12-15 | 2011-06-09 | 한양대학교 산학협력단 | 다치화 구조를 갖는 stt-mram 메모리 소자와 그 구동방법 |
TWI468715B (zh) * | 2012-10-22 | 2015-01-11 | Ind Tech Res Inst | 用於感測外部磁場之磁場感測器 |
KR101549625B1 (ko) * | 2014-04-18 | 2015-09-04 | 한양대학교 산학협력단 | 메모리 소자 |
-
2014
- 2014-08-08 KR KR1020140102139A patent/KR101537715B1/ko active IP Right Grant
-
2015
- 2015-03-18 US US16/094,265 patent/US10586919B2/en active Active
- 2015-03-18 WO PCT/KR2015/002606 patent/WO2015160092A2/ko active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008085208A (ja) * | 2006-09-28 | 2008-04-10 | Fujitsu Ltd | トンネル磁気抵抗素子、磁気ヘッドおよび磁気メモリ |
JP2010129115A (ja) * | 2008-11-26 | 2010-06-10 | Showa Denko Kk | 磁気記録媒体及びその製造方法並びに記憶装置 |
JP2012089858A (ja) * | 2011-11-28 | 2012-05-10 | Toshiba Corp | 磁気抵抗効果素子、磁気メモリ、磁気抵抗効果ヘッド、および磁気記録再生装置 |
KR20140011138A (ko) * | 2012-07-17 | 2014-01-28 | 삼성전자주식회사 | 자기 소자 및 그 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
KR101537715B1 (ko) | 2015-07-21 |
US10586919B2 (en) | 2020-03-10 |
US20190229259A1 (en) | 2019-07-25 |
WO2015160092A2 (ko) | 2015-10-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2015160093A3 (ko) | 메모리 소자 | |
WO2015160092A3 (ko) | 메모리 소자 | |
EP3586359A4 (en) | ASSEMBLIES OF SEMICONDUCTOR DEVICES EQUIPPED WITH ELECTROFUNCTIONAL HEAT TRANSFER STRUCTURES | |
EP3362852A4 (en) | MATRIX SUBSTRATE AND SEMICONDUCTOR DEVICE CONTAINING THE SUBSTRATE, AND METHOD FOR MANUFACTURING THE SUBSTRATE | |
EP3308402A4 (en) | ARRAY SUBSTRATE, DISPLAY DEVICE THEREFOR AND METHOD OF MANUFACTURING THEREOF | |
USD729250S1 (en) | Semiconductor memory device | |
EP3113217A4 (en) | Low-temperature polycrystalline silicon thin-film transistor, array substrate and manufacturing method therefor | |
EP3207574A4 (en) | Memory cells, semiconductor devices, and methods of fabrication | |
TW201614840A (en) | Semiconductor device and method for fabricating the same | |
EP3533836A4 (en) | HEAT-CONDUCTING SILICONE COMPOSITION, SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT | |
FR3029682B1 (fr) | Substrat semi-conducteur haute resistivite et son procede de fabrication | |
EP3380890A4 (en) | MATRIX SUBSTRATE, SEMICONDUCTOR DEVICE CONTAINING SAME, CONTROL METHOD THEREFOR, AND MANUFACTURING METHOD THEREOF | |
TW201714253A (en) | Method of making embedded memory device with silicon-on-insulator substrate | |
TW201613153A (en) | Resistive random access memory device and method for fabricating the same | |
JP2015079947A5 (ja) | 半導体装置 | |
EP3598497A4 (en) | SEMICONDUCTOR DEVICE, NETWORK SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | |
EP3242319A4 (en) | THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING SAME, AND MATRIX SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME | |
EP3491670A4 (en) | ARRAY SUBSTRATE, PRODUCTION METHOD THEREFOR, AND ELECTRONIC DEVICE | |
EP3437154A4 (en) | HEAT-DISSIPATING ENCAPSULATION MATERIAL BATTERY MODULE AND ASSOCIATED METHODS | |
TW201613094A (en) | Structure of fin feature and method of making same | |
EP3234998A4 (en) | Resistive memory cells including localized filamentary channels, devices including the same, and methods of making the same | |
EP3197251A4 (en) | Layered body, substrate for semiconductor element mounting, and method for manufacturing said body and substrate | |
EP3483936A4 (en) | SEMICONDUCTOR MEMORY ELEMENT, OTHER ELEMENTS, AND MANUFACTURING METHOD THEREOF | |
SG11201912503WA (en) | Device substrate with high thermal conductivity and method of manufacturing the same | |
WO2016195458A3 (ko) | 이중 스피로형 유기 화합물 및 이를 포함하는 유기 전자 소자 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 15779628 Country of ref document: EP Kind code of ref document: A2 |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 15779628 Country of ref document: EP Kind code of ref document: A2 |