WO2015158047A1 - 一种荧光条及使用荧光条的led封装模组 - Google Patents

一种荧光条及使用荧光条的led封装模组 Download PDF

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Publication number
WO2015158047A1
WO2015158047A1 PCT/CN2014/081962 CN2014081962W WO2015158047A1 WO 2015158047 A1 WO2015158047 A1 WO 2015158047A1 CN 2014081962 W CN2014081962 W CN 2014081962W WO 2015158047 A1 WO2015158047 A1 WO 2015158047A1
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Prior art keywords
light
layer
fluorescent strip
protective layer
phosphor
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PCT/CN2014/081962
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English (en)
French (fr)
Inventor
樊勇
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/647,116 priority Critical patent/US20170025585A1/en
Publication of WO2015158047A1 publication Critical patent/WO2015158047A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0025—Diffusing sheet or layer; Prismatic sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0026—Wavelength selective element, sheet or layer, e.g. filter or grating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/872—Periodic patterns for optical field-shaping, e.g. photonic bandgap structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

Definitions

  • the present invention relates to a liquid crystal display lighting assembly, and more particularly to a fluorescent strip and an LED package module using the fluorescent strip.
  • the current LEDs are basically packaged in the same package by using a blue chip and a phosphor, but when the blue chip emits light, the energy that is not converted into light energy is converted into heat, which causes the luminous efficiency of the blue chip itself to decrease.
  • the conversion efficiency will also decrease due to the increase in the temperature of the phosphor in the package, which eventually leads to a decrease in the luminous efficiency of the entire LED. Since the phosphor has a temperature quenching effect, as the temperature increases, the conversion efficiency of the phosphor decreases, and the luminescence spectrum shifts red; the effect is on quantum dots (QDs) phosphors having a narrow half-peak width (FWHM) of the luminescence spectrum. Especially obvious.
  • QDs quantum dots
  • QDs phosphors are coated on the diaphragm, such as the QDEF diaphragm developed by 3M.
  • the QDs phosphor is encapsulated in a glass tube.
  • the light emission direction of the fluorescence emitted by the QDs phosphor after receiving the blue light is indeterminate, the light pattern emitted from the glass tube is dispersed, and the light angle is dispersed, and the angle of the light is occupied by the angle.
  • the efficiency of light entering the light guide plate again decreases, resulting in lower coupling efficiency.
  • an object of the present invention is to provide a fluorescent strip which can gather light of a large viewing angle, improve coupling efficiency, eliminate total reflection in the illuminating body, and increase light extraction efficiency.
  • Another object of the present invention is to provide an LED package module using the fluorescent strip to increase the luminous efficiency of the LED and enhance the light collecting effect.
  • the invention provides a fluorescent strip covering the illuminant, wherein the fluorescent strip comprises a phosphor layer and at least two protective layers, and the phosphor layer is sandwiched between the two protective layers to prevent the phosphor from falling off. To protect and define the effect of the phosphor, the phosphor is evenly laid on the surface of the illuminant.
  • the protective layer includes an outer protective layer and an inner protective layer
  • the fluorescent strip further includes a concentrating layer, the concentrating layer covers the outer protective layer, and the light emitted by the illuminating body sequentially passes through the inner layer.
  • the protective layer, the phosphor layer, the outer protective layer and the concentrating layer, and the concentrating layer concentrates the light.
  • the concentrating layer is composed of a plurality of concentrating monomers closely arranged, and the concentrating layer has a zigzag shape.
  • the concentrating monomer has a triangular shape, a prismatic shape or a semi-cylindrical shape. Converging and collecting the light emitted by the illuminator by a sawtooth concentrating layer The concentrating effect.
  • the exit surface of the concentrating monomer has a prism shape, so that when the emitted light passes through the exit surface, a diffraction occurs, and the effect of concentrating the light is generated.
  • the apex angle of the concentrating monomer ranges from 30 to 120 degrees.
  • the apex angle of the condensing monomer is 90 degrees, and when the apex angle is 90 degrees, the light receiving effect is the best, and the light type is the most narrow.
  • the concentrating layer is made of polyacrylate (MS), polymethyl methacrylate (PMMA) or silica gel
  • the protective layer is made of polyacrylate, polymethyl methacrylate or silica gel.
  • the invention also provides an LED package module, comprising:
  • a fluorescent strip covering the LED chip comprising a phosphor layer, at least two protective layers and a concentrating layer, the protective layer comprising an outer protective layer and an inner protective layer, wherein the phosphor layer is sandwiched between the two protective layers
  • the phosphor is prevented from falling off, and the concentrating layer covers the outer protective layer, and the light emitted by the LED chip sequentially passes through the inner protective layer, the phosphor layer, the outer protective layer and the concentrating layer, and is concentrated by the concentrating layer.
  • the fluorescent strip of the invention has the following advantages:
  • the phosphor layer is protected by at least two protective layers to prevent it from oozing out, thereby protecting and encapsulating;
  • the fluorescent strip is attached to the LED chip of the LED package module, and the phosphor package is not required to be coated in the LED package module, thereby improving the overall structure of the LED package module, simplifying the process, simplifying the package, and improving Production efficiency;
  • the concentrating layer is in a zigzag shape, and the light emitted from the LED chip is refracted and concentrated by a plurality of concentrating monomers, so that the large-angle outgoing light is more gathered and reduced.
  • the large-angle light emission ratio achieves the purpose of light convergence, so that the light-emitting direction of the fluorescence is determined, and the light guide plate enters the light guide plate at a small angle, thereby improving the light-coupled efficiency of light entering the liquid crystal display.
  • 1 is a schematic structural view of a conventional fluorescent strip
  • FIG. 2 is a schematic structural view of a fluorescent strip of the present invention
  • FIG. 3 is a disassembled view of an LED package module according to the present invention.
  • FIG. 4 is a schematic view showing light emission of a condensing monomer of a fluorescent strip of the present invention
  • Figure 5 is a perspective view of a concentrating layer of a fluorescent strip of the present invention.
  • the present invention provides a fluorescent strip 100 covering the illuminant 200, wherein the fluorescent strip 100 comprises a phosphor layer 10 and at least two protective layers, the phosphor The layer 1 is sandwiched between the two protective layers to prevent the phosphor from falling off, thereby protecting and defining the effect of the phosphor, so that the phosphor is uniformly laid on the surface of the illuminant 200.
  • the protective layer comprises two layers, an inner protective layer 12 and an outer protective layer 14, and the inner protective layer 12, the outer protective layer 14 and the phosphor layer 10 have the same width, phosphor Layer 10 is sandwiched between inner protective layer 12 and outer protective layer 14.
  • the phosphor layer 10 is uniformly distributed with phosphors, and the phosphors may be yellow powder of yttrium aluminum garnet phosphor (YAG), nitride phosphor (Nitride), silicate phosphor (Silicate), or nitride.
  • the red luminescent powder (RG powder) in the phosphor (Nitride) and silicate phosphor (Silicate) can also be the red luminous powder (RG powder) in the quantum dots (QDs).
  • the quantum dots in the phosphor layer are The material of the phosphor is not limited to the above materials.
  • the fluorescent strip 100 further includes a light collecting layer 16 covering the outer protective layer 14, and the light emitted by the light emitting body 200 is sequentially transmitted through the inner protection.
  • the layer 12, the phosphor layer 10, the outer protective layer 14 and the concentrating layer 16 are concentrated by the concentrating layer 16.
  • the concentrating layer 16 is composed of a plurality of concentrating cells 160 closely arranged, and the concentrating layer 16 has a zigzag shape.
  • the concentrating monomer 160 has a triangular shape, a prismatic shape or a semi-cylindrical shape.
  • the light emitted by the illuminator 200 is collected by the sawtooth concentrating layer 16 to enhance the condensing effect. Referring to FIG. 2 and FIG.
  • the apex angle of the condensing monomer ranges from 30 to 120 degrees.
  • the light receiving effect is adopted.
  • the light type is the narrowest. Since the light path of the light emitted by the phosphor layer is relatively dispersed, and the light emitted by the large angle occupies a high specific gravity, the light concentrating unit 160 of the concentrating layer 16 refracts light by using the fluorescent strip structure of the present invention, so that the divergent light is scattered.
  • the plurality of concentrating monomers 160 are refracted to converge and gather, and in particular, the large-angle light is narrowed, and the large-angle light-emitting ratio is reduced, so that when the light enters the liquid crystal display, the light guide plate can enter the liquid crystal display at a small angle. Thereby, the light coupling efficiency of light entering the liquid crystal display is improved.
  • the exit surface of the concentrating unit 160 of the concentrating layer has a prism structure, and the light is incident on the condensing unit from the incident surface, and is refracted by the prism of the exit surface to be emitted.
  • the light gathers and gathers.
  • the concentrating layer is made of polyacrylate (MS), polymethyl methacrylate (PMMA) or silica gel
  • the protective layer is made of polyacrylate or polymethyl methacrylate.
  • the concentrating layer or the protective layer has a low refractive index and good light transmittance. The use of such materials can effectively improve the light-emitting efficiency of the light in the light-guiding strip.
  • the material can be formed by injection molding and embossing. structure.
  • materials such as silica gel have low water and oxygen permeability, which can improve the service life of the phosphor material.
  • the invention also provides an LED package module, comprising:
  • the fluorescent strip 100 covers the LED chip 22 and comprises a phosphor layer 10 and at least two protective layers.
  • the phosphor layer 10 is sandwiched between the two protective layers to prevent the phosphor from falling off.
  • the protective layer includes an inner protective layer 12 and an outer protective layer 14, and the phosphor layer 10 is sandwiched between the inner protective layer 12 and the outer protective layer 14.
  • the fluorescent strip 100 further includes a light concentrating layer 16 covering the outer protective layer 14, and the light emitted by the LED chip 22 passes through the inner protective layer 12, the phosphor layer 10, and the outer layer.
  • the protective layer 14 and the concentrating layer 16 are concentrated by the concentrating layer 16, and the light of a large viewing angle is gathered to improve the coupling efficiency, and the total reflection in the LED package module is destroyed by the concentrating layer 16, thereby effectively increasing Light extraction efficiency, improve the conversion efficiency of the phosphor.

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  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)

Abstract

一种荧光条（100），覆盖于发光体（200）上，其中，荧光条包括荧光粉层（10）和至少两层保护层，荧光粉层夹在两保护层中间，避免荧光粉层脱落，保护层包括外保护层（14）和内保护层（12）。荧光条还包括聚光层（16），聚光层覆盖于外保护层上，由发光体发散出来的光，依次透过内保护层、荧光粉层、外保护层和聚光层，并由聚光层汇聚光线。通过聚光层将LED芯片中发射出来的光线折射汇聚，减小了大角度光出射比例，使得荧光的发光方向确定，以较小的角度进入导光板，提高了光线的耦光效率。

Description

一种荧光条及使用荧光条的 LED封装模组 技术领域
本发明涉及一种液晶显示器发光组件，尤其是指一种荧光条及使用荧光条的 LED封装模 组。
背景技术
目前的 LED基本都是采用蓝光芯片和荧光粉封装在同一个封装体中，但由于蓝光芯片发 光时， 未转换成光能的能量会转换成热量， 一方面会使得蓝光芯片本身的发光效率下降， 另 一方面由于封装体中荧光粉温度升高转换效率也会下降， 最终导致整个 LED 的发光效率下 降。 由于荧光粉具有温度淬灭效应， 随着温度升高， 荧光粉的转换效率会降低， 发光光谱会 红移； 该效应对于发光光谱半高峰宽 （FWHM) 较窄的量子点 （QDs) 荧光粉尤其明显。
目前在 QDs荧光粉的应用中， 规避温度淬灭问题主要有两种解决方法：
其一， QDs荧光粉涂布在膜片上， 如 3M公司开发的 QDEF膜片。
其二， 参照图 1所示， 把 QDs荧光粉封装在玻璃灯管中。
在方案二中， 由于 QDs 荧光粉接受蓝光后再次激发发出的荧光的发光方向不确定，所以 从玻璃管中发出的光型较为分散， 由于光型分散， 大角度的光占比角度， 该部分光再次进入 导光板的效率降低， 导致耦光效率较低。
发明内容
为了解决上述技术问题， 本发明的目的在于提供了一种可把大视角的光收拢， 提高耦光 效率， 并消除发光体内的全反射， 增加出光效率的一种荧光条。
本发明的另一目的在于提供一种使用所述荧光条的 LED封装模组， 以增加 LED的发光 效率、 提升聚光效果。
本发明提供了一种荧光条， 覆盖于发光体上， 其中， 所述荧光条包括荧光粉层和至少两 层保护层， 所述荧光粉层夹在两保护层中间， 避免荧光粉脱落， 起到保护并限定荧光粉的作 用， 使得荧光粉均匀地铺设于发光体的表面上。
优选地， 所述保护层包括外保护层和内保护层， 所述荧光条进一步包括聚光层， 所述聚 光层覆盖于外保护层上， 由发光体发散出来的光， 依次透过内保护层、 荧光粉层、 外保护层 和聚光层， 并由聚光层汇聚光线。
优选地， 所述聚光层由若干个聚光单体紧密排列组成， 所述聚光层呈锯齿状。 所述聚光 单体呈三角形、 棱柱形或半柱形。 通过锯齿状的聚光层将由发光体发出的光线汇聚收拢， 提 升聚光效果。
优选地， 所述聚光单体的出射表面呈棱镜状， 使得射出的光线经出射表面时， 会产生折 射， 产生光线汇聚的效果。
优选地， 所述聚光单体的顶角范围为 30-120度， 优选地， 所述聚光单体的顶角为 90度, 顶角为 90度时， 受光作用最好， 光型最窄。
优选地， 所述聚光层由聚丙烯酸酯 （MS )、 聚甲基丙烯酸甲酯 （PMMA) 或硅胶制成， 所述保护层由聚丙烯酸酯、 聚甲基丙烯酸甲酯或硅胶制成。
本发明还提供了一种 LED封装模组， 其包括：
导热基板；
复数个 LED芯片， 焊接于所述导热基板上；
荧光条， 覆盖于 LED芯片上， 其包括荧光粉层、 至少两层保护层和聚光层， 所述保护层 包括外保护层和内保护层， 所述荧光粉层夹在两保护层中间， 避免荧光粉脱落， 所述聚光层 覆盖于外保护层上， 由 LED芯片发散出来的光， 依次透过内保护层、 荧光粉层、 外保护层和 聚光层， 并由聚光层汇聚光线。
与现有技术相比， 在本发明荧光条具有以下优点：
1 ) 荧光粉层通过至少两层保护层覆盖而保护， 避免其渗出， 起到保护并封装的作用；
2) 制成荧光条贴附于 LED封装模组的 LED芯片上， 而无需在 LED封装模组内涂覆荧 光粉， 改进了 LED封装模组的整体结构， 简化了制程， 封装简易化， 提高了生产效 率；
3 ) 在荧光条的外侧增设聚光层， 聚光层呈锯齿状， 通过若干个聚光单体将 LED芯片中 发射出来的光线折射汇聚，使得大角度的出射光更为收拢，减小了大角度光出射比例， 实现光线汇聚的目的， 使得荧光的发光方向确定， 以较小的角度进入导光板， 提高了 光线进入液晶显示器的耦光效率。
附图说明
图 1为现有荧光条的结构示意图；
图 2为本发明一种荧光条的结构示意图；
图 3为本发明一种 LED封装模组的拆解图；
图 4为本发明一种荧光条的聚光单体的光线出射示意图；
图 5为本发明一种荧光条的聚光层的立体图。
具体实施方式
为了提升 LED封装模组的发光效率， 提高荧光粉的转换效率， 并使得荧光粉的发光方向 确定并聚拢， 参照图 2所示， 本发明提供了一种荧光条 100， 覆盖于发光体 200上， 其中， 所述荧光条 100包括荧光粉层 10和至少两层保护层， 所述荧光粉层 1夹在两保护层中间， 避 免荧光粉脱落， 起到保护并限定荧光粉的作用， 使得荧光粉均匀地铺设于发光体 200的表面 上。
在本发明的一个实施例中， 所述保护层包括两层， 为内保护层 12和外保护层 14， 所述 内保护层 12、 外保护层 14与荧光粉层 10的宽度相等， 荧光粉层 10夹在内保护层 12和外保 护层 14之间。 荧光层 10均匀分布着荧光粉， 所述荧光粉可为钇铝石榴石荧光粉（YAG)、 氮 化物荧光粉 （Nitride)、 硅酸盐荧光粉 （Silicate) 中的黄粉， 也可为氮化物荧光粉 （Nitride)、 硅酸盐荧光粉 （Silicate) 中的红色夜光粉 （RG粉）， 也可为量子点 （QDs) 中的红色夜光粉 (RG粉）， 荧光粉层中的量子点由硅胶包裹， 荧光粉的材料不限于上述材料。
在本发明的又一个实施例中， 所述荧光条 100进一步包括聚光层 16， 所述聚光层 16覆 盖于外保护层 14上， 由发光体 200发散出来的光， 依次透过内保护层 12、 荧光粉层 10、 外 保护层 14和聚光层 16， 并由聚光层 16汇聚光线。 所述聚光层 16由若干个聚光单体 160紧 密排列组成， 所述聚光层 16呈锯齿状。 所述聚光单体 160呈三角形、 棱柱形或半柱形。 通过 锯齿状的聚光层 16将由发光体 200发出的光线汇聚收拢， 提升聚光效果。参照图 2和图 3所 示， 所述聚光单体的顶角范围为 30-120度， 优选地， 所述聚光单体的顶角为 90度， 顶角为 90度时， 受光作用最好， 光型最窄。 由于荧光粉层发出的光的光路较为分散， 大角度出射的 光所占的比重较高， 采用本发明的荧光条结构通过聚光层 16的各个聚光单体 160折射光线， 使得发散的光线经复数个聚光单体 160折射而汇聚收拢， 特别地， 将大角度的光收窄， 减小 了大角度光射比例， 使得光线进入液晶显示器时， 能以较小的角度进入导光板， 从而提高了 光进入液晶显示器的耦光效率。
参照图 4和图 5所示， 所述聚光层的聚光单体 160的出射表面呈棱镜结构， 光线由入射 表面射入聚光单体中， 再由出射表面的棱镜折射而射出， 使得光线收拢汇聚。
优选地， 所述聚光层由聚丙烯酸酯 （MS )、 聚甲基丙烯酸甲酯 （PMMA) 或硅胶制成， 所述保护层由聚丙烯酸酯或聚甲基丙烯酸甲酯制成。 聚光层或保护层由于折射率较低， 透光 性好， 采用这类材料可以有效提高导光条中光的出光效率， 同时采用这类材料可以采取注塑 成型和压印工艺制作聚光微结构。 此外采用硅胶这类材料， 水、 氧透过率低， 可以提高荧光 粉材料的使用寿命。
本发明还提供了一种 LED封装模组， 其包括：
导热基板 20;
复数个 LED芯片 22， 焊接于所述导热基板 20上； 荧光条 100， 覆盖于 LED芯片 22上， 其包括荧光粉层 10和至少两层保护层， 所述荧光 粉层 10夹在两保护层中间， 避免荧光粉脱落。
所述保护层包括内保护层 12和外保护层 14，所述荧光粉层 10夹在内保护层 12和外保护 层 14之间。 所述荧光条 100还进一步包括聚光层 16， 所述聚光层 16覆盖于外保护层 14上， 由 LED芯片 22发散出来的光， 依次透过内保护层 12、 荧光粉层 10、 外保护层 14和聚光层 16， 并由聚光层 16汇聚光线， 将大视角的光收拢， 提高耦光效率， 并通过聚光层 16破坏了 LED封装模组内的全反射， 有效增加了出光效率， 提高荧光粉的转换效率。

Claims

权 利 要 求 书
1、 一种荧光条， 覆盖于发光体上， 其中： 所述荧光条包括荧光粉层和至少两层保护层， 所述荧 光粉层夹在两保护层中间， 避免荧光粉脱落， 所述保护层包括外保护层和内保护层， 所述荧光 条进一步包括聚光层， 所述聚光层覆盖于外保护层上， 由发光体发散出来的光， 依次透过内保 护层、 荧光粉层、 外保护层和聚光层， 并由聚光层汇聚光线。
2、 根据权利要求 1所述的荧光条， 其中： 所述聚光层由若干个聚光单体紧密排列组成。
3、 根据权利要求 2所述的荧光条， 其中： 所述聚光单体呈三角形、 棱柱形或半柱形。
4、 根据权利要求 3所述的荧光条， 其中： 所述聚光单体的出射表面呈棱镜状。
5、 根据权利要求 4所述的荧光条， 其中： 所述聚光单体的顶角范围为 30-120度。
6、 根据权利要求 5所述的荧光条， 其中： 所述聚光单体的顶角为 90度。
7、 根据权利要求 2所述的荧光条， 其中： 所述聚光层呈锯齿状。
8、 根据权利要求 2所述的荧光条， 其中： 所述聚光层由聚丙烯酸酯、 聚甲基丙烯酸甲酯 或硅 胶制成， 所述保护层由聚丙烯酸酯或聚甲基丙烯酸甲酯制成。
9、 一种 LED封装模组， 其中包括：
导热基板；
复数个 LED芯片， 焊接于所述导热基板上；
荧光条， 覆盖于 LED芯片上， 其包括荧光粉层、 至少两层保护层和聚光层， 所述保护层包 括外保护层和内保护层， 所述荧光粉层夹在两保护层中间， 避免荧光粉脱落， 所述聚光层覆 盖于外保护层上， 由 LED芯片发散出来的光， 依次透过内保护层、 荧光粉层、 外保护层和 聚光层， 并由聚光层汇聚光线。
10、 一种荧光条， 覆盖于发光体上， 其中： 所述荧光条包括荧光粉层和至少两层保护层， 所 述荧光粉层夹在两保护层中间， 避免荧光粉脱落。
11、 根据权利要求 10所述的荧光条， 其中： 所述保护层包括外保护层和内保护层， 所述荧光条 进一步包括聚光层， 所述聚光层覆盖于外保护层上， 由发光体发散出来的光， 依次透过内保 护层、 荧光粉层、 外保护层和聚光层， 并由聚光层汇聚光线。
12、 根据权利要求 11所述的荧光条， 其中： 所述聚光层由若干个聚光单体紧密排列组成。
13、 根据权利要求 12所述的荧光条， 其中： 所述聚光单体呈三角形、 棱柱形或半柱形。
14、 根据权利要求 13所述的荧光条， 其中： 所述聚光单体的出射表面呈棱镜状。
15、 根据权利要求 14所述的荧光条， 其中： 所述聚光单体的顶角范围为 30-120度。
16、 根据权利要求 15所述的荧光条， 其中： 所述聚光单体的顶角为 90度。
17、 根据权利要求 12所述的荧光条， 其中： 所述聚光层呈锯齿状。 、 根据权利要求 12所述的荧光条， 其中： 所述聚光层由聚丙烯酸酯、 聚甲基丙烯酸甲酯或硅 胶制成， 所述保护层由聚丙烯酸酯或聚甲基丙烯酸甲酯制成。
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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105242344A (zh) * 2015-10-30 2016-01-13 青岛海信电器股份有限公司 一种显示装置
CN106229401A (zh) * 2016-08-24 2016-12-14 电子科技大学 荧光led封装阵列
DE102017108573A1 (de) * 2017-04-21 2018-10-25 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
CN107215764B (zh) * 2017-08-03 2018-10-09 南通江中光电有限公司 一种电梯梳齿踏板
CN113808478A (zh) * 2020-06-17 2021-12-17 北京小米移动软件有限公司 屏幕组件及其控制方法、控制装置和电子设备
CN113013300A (zh) * 2021-05-25 2021-06-22 北京芯海视界三维科技有限公司 发光器件及显示器件
CN116885078A (zh) * 2023-07-19 2023-10-13 陈量科技股份有限公司 光学元件、具有量子点的发光装置及其制造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003038215A (ja) * 2001-07-31 2003-02-12 Miwako Kaneko ファスナーの開閉補助用具
JP2008124504A (ja) * 2003-06-05 2008-05-29 Matsushita Electric Ind Co Ltd 半導体発光素子及びその製造方法
CN101883948A (zh) * 2007-12-07 2010-11-10 索尼公司 照明装置、显示装置和制造照明装置的方法
CN102016403A (zh) * 2008-04-25 2011-04-13 索尼公司 发光装置、显示装置和色彩转换片
CN102679194A (zh) * 2011-03-08 2012-09-19 建准电机工业股份有限公司 Led灯具
CN103219450A (zh) * 2012-01-19 2013-07-24 南亚光电股份有限公司 固态照明系统

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0168879B1 (ko) * 1992-12-25 1999-04-15 기따지마 요시또시 렌티큘러 렌즈, 면광원 및 액정 표시 장치
US7239080B2 (en) * 2004-03-11 2007-07-03 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd LED display with overlay
US7868340B2 (en) * 2008-05-30 2011-01-11 Bridgelux, Inc. Method and apparatus for generating white light from solid state light emitting devices
TWI364120B (en) * 2008-09-10 2012-05-11 E Pin Optical Industry Co Ltd Convex-fresnel led lens for angular distribution patterns and led assembly thereof
US20120219750A1 (en) * 2009-09-25 2012-08-30 Oceans King Lighting Science & Technology Co., Ltd Luminescent glass, producing method thereof and luminescent device
CN102128416A (zh) * 2010-01-20 2011-07-20 3M创新有限公司 导光板组件及其制造方法与包含该组件的液晶显示器
EP2400569B1 (en) * 2010-06-28 2018-10-24 LG Innotek Co., Ltd. Light-emitting diode package
TWI517452B (zh) * 2011-03-02 2016-01-11 建準電機工業股份有限公司 發光晶體之多晶封裝結構

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003038215A (ja) * 2001-07-31 2003-02-12 Miwako Kaneko ファスナーの開閉補助用具
JP2008124504A (ja) * 2003-06-05 2008-05-29 Matsushita Electric Ind Co Ltd 半導体発光素子及びその製造方法
CN101883948A (zh) * 2007-12-07 2010-11-10 索尼公司 照明装置、显示装置和制造照明装置的方法
CN102016403A (zh) * 2008-04-25 2011-04-13 索尼公司 发光装置、显示装置和色彩转换片
CN102679194A (zh) * 2011-03-08 2012-09-19 建准电机工业股份有限公司 Led灯具
CN103219450A (zh) * 2012-01-19 2013-07-24 南亚光电股份有限公司 固态照明系统

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