WO2015154365A1

WO2015154365A1 - Effective interconnection band for photovoltaic module and manufacturing method thereof

Info

Publication number: WO2015154365A1
Application number: PCT/CN2014/085112
Authority: WO
Inventors: 钱海鹏
Original assignee: 凡登（江苏）新型材料有限公司
Priority date: 2014-04-08
Filing date: 2014-08-25
Publication date: 2015-10-15

Abstract

An effective interconnection band for a photovoltaic module and manufacturing method thereof; the effective interconnection band comprises a conductive baseband (1); the enveloping outline of the conductive baseband (1) is a flat wire material, and at least one of the two wide surfaces of the conductive baseband is a heterogeneous wide surface; the heterogeneous wide surface is provided with a plurality of recesses (2) thereon; coupling platforms (3) exist between neighboring recesses (2); and the coupling platforms (3) are rough planes having a surface profile arithmetic average deviation Ra in a range of 0.25 μm - 5 μm. Part of the reflected light of the interconnection band surface is reflected via the glass-air interface of the module back to the surface of a battery piece for multiplexing, increasing the power of the module, reasonably adjusting the yield property of the interconnection band, and improving the weather-resistant property of the module; in addition, a micropore accumulation mechanism for molten solder/ conductive adhesive glue is built on the contact surface of the interconnection band and the battery without affecting the above capabilities, improving the bonding of the interconnection band and the battery piece.

Description

Efficient interconnecting strip for photovoltaic modules and preparation method thereof

The invention belongs to the technical field of photovoltaic interconnect tape processing, and particularly relates to an efficient interconnecting strip for a photovoltaic module and a preparation method thereof.

Background technique

With the rapid development of the world economy, energy consumption is increasing, and countries all over the world are demanding the application and popularization of new energy sources. The demand for clean renewable energy is particularly strong in countries around the world due to the effects of greenhouse gases caused by carbon dioxide emissions that contribute to global warming and natural disasters. Since the global crisis caused by the 2007 subprime crisis in the United States has spread and expanded, countries have adopted more active measures to encourage the use of renewable energy to stimulate economic growth. The US Obama administration has proposed to invest 150 billion US dollars in clean energy in the next 10 years; the EU set a goal to increase the proportion of renewable energy in energy use to 20% by 2020; Japan proposes to make more than 70% of new homes in 2030 Installation of solar panels (about 70GW) _o To alleviate the lack of domestic demand for photovoltaic products, on March 26, 2009, the Ministry of Finance announced that it will promote the implementation of the "Solar Roof Plan" demonstration project. The Ministry of Finance, the Ministry of Housing and Urban-Rural Development jointly issued the "Implementation Opinions on Accelerating the Application of Solar Photovoltaic Buildings" clearly stated that the implementation of the "Solar Roof Plan" will provide financial subsidies for the photovoltaic building application demonstration project, encourage technological advancement and technology. Innovate, encourage local governments to introduce relevant financial support policies, and strengthen policy support in the construction sector. At this stage, in large and medium-sized cities with developed economies and good industrial bases, actively promote the integration of photovoltaic roofs, photovoltaic curtain walls and other photovoltaic buildings; actively support the development of off-grid power generation in rural and remote areas, and implement relevant regulations such as sending electricity to the countryside. It is also the direction for the application of solar technology. Taking the integration of photovoltaic roofs, photovoltaic curtain walls and other photovoltaic buildings as a breakthrough, it is possible to let people see the many benefits of applying solar energy in the short term, and it is also conducive to large-scale promotion in the future, stimulating the accumulation of industrial capital investment in solar energy. Polarity. National new energy policies may be one of the next important policies that will affect our world development for the next 15 years. The 2009 Copenhagen Climate Conference once again awakened and reinforces awareness of clean energy. With the application and popularization of new energy sources, the rapid growth of the photovoltaic industry has been further strengthened and valued.

Electrical connections to one or more solar cells have traditionally been relied upon by interconnects that can be spliced or bonded to so-called bus bars of the one or more solar cells. The entire current generated by the solar cell is conducted through the interconnection. The quality of the interconnected strip will directly affect the collection efficiency of the PV module's current, which has a great impact on the power of the PV module. How to increase the conversion rate of the cell sheet and reduce the fragmentation rate through the isomerization of the interconnected tape has been one of the research topics in the interconnect tape industry.

Chinese Patent No. CN101789452A discloses a tin-coated ribbon comprising a copper strip and a tin-coated layer on its surface, the surface of the tin-coated layer having a uniformly distributed pit-like body. This kind of slingband causes the sunlight to diffusely reflect in the pit, increasing the energy of receiving sunlight. However, the pit-like body only diffusely reflects, the proportion of sunlight reflected back to the cell sheet is small, and the conversion rate is limited; in addition, the pit is prepared during the tin-coating process, which produces an uneven layer of tantalum. And it will produce a phenomenon that the battery is not firmly connected, and there is a vain.

Chinese Patent No. CN 102569470 A discloses a V-groove prepared on the surface of an ankle tape perpendicular to the length of the ankle strap to reduce the crack and chip rate of the battery sheet. However, the patented V-groove is perpendicular to the length direction and has no significant spacing between the V-grooves. Therefore, the strap is unstable when it is spliced to the battery, and the splicing is not strong.

Chinese patent ZL 2013 2 0071240. 1, ZL2 0071182. 2 , ZL 2013 2 0110484. 6 , ZL 2013 2 0463993. 7, ZL2013 2 0466223. 8 etc., proposed different forms of heterogeneity through the conductive baseband of the ankle band , realize partial multiplexing of the reflected light on the surface of the belt, adjust the joint fastness between the belt and the battery sheet, reduce the electric current loss caused by the belt, and reduce the yield stress of the belt to improve the group. The weathering safety of the pieces and the fragmentation rate during the production process. Practice has confirmed that there is still a common deficiency in the above patent groups: that is, when using the automatic cross-talking machine currently on the market, unless the total area of the baseband plane on the heterogeneous wide surface is greatly increased, the proportion of the total area of the heterogeneous wide surface is increased. Otherwise, there is a higher risk of vainness between the heterogeneous wide surface of the back silver and the back silver. However, the consequence of greatly increasing the ratio of the total area of the baseband plane on the heterogeneous wide surface to the total area of the heterogeneous wide surface is that the ability to reflect the reflected light on the surface of the positive silver surface is greatly reduced, which is contrary to the main intention of product design. Summary of the invention

The technical problem to be solved by the present invention is: to reduce the splicing fastness between the heterogeneous interconnecting strip and the cell sheet while reasonably ensuring the surface anti-reflection multiplexing/stress reduction of the interconnecting strip through the surface heterogeneity of the interconnecting strip. The risk of imaginary increase is increased, and the present invention provides an efficient interconnecting strip for a photovoltaic module and a method of preparing the same. The technical solution adopted by the present invention to solve the technical problem thereof is: a high-efficiency interconnecting strip for a photovoltaic module, comprising a conductive base tape composed of a metal elemental or alloy material,

(a) the envelope of the conductive base tape is a flat wire, at least one of the two wide surfaces is a heterogeneous wide surface, and a plurality of depressions are distributed on the heterogeneous wide surface, and there are Coupling platform.

(b) The coupling platform is a rough plane whose surface contour arithmetic mean deviation Ra is between 0.25 μm and 5 μm.

The above technical solution realizes the multiplexing of the reflected light of the surface of the partial interconnecting strip by making a recess on the surface of the conductive base tape so that part of the surface reflected light can be re-reflected to the surface of the battery through the glass/air surface of the assembly. On the other hand, there is a coupling platform between adjacent recesses to ensure interconnection. The bond is fastened to the battery. The most important thing is to increase the surface roughness of the coupling platform by reasonably, so that the surface of the coupling platform produces a microporous condensing effect on the melted bismuth tin and/or the conductive glue used to bond the interconnecting strip/cell sheet, ie The bismuth tin or liquid conductive paste in the molten state accumulates in the dense micropores on the coupling platform due to capillary action, thereby greatly enhancing the wetting ability of the partial surface of the cell sheet in contact with the micropores, and thus macroscopic splicing/sticking The efficiency has been greatly improved. The above-mentioned enthalpy effect of the smear/conductive paste is particularly advantageous for the case of automatic splicing machine splicing: Since the automatic stringer is used for splicing, the heterogeneous surface of the interconnecting strip faces upwards, and after the bismuth is melted The tantalum tin on the coupling platform easily flows into the surrounding depressions, which on the one hand increases the surface isomerization and is partially filled, resulting in a reduction in the surface area of the reusable light reflected on the interconnected strip of the positive silver surface, and also easily leads to the battery. The surface of the interconnecting strip that is in contact with the back silver on the back of the sheet is too thin, resulting in insufficient wetting ability on the surface of the battery sheet, resulting in a sharp increase in the risk of false silver back. The invention solves the above problems substantially by increasing the surface roughness of the coupling platform and manufacturing the capillary aggregation of the material. Research tests have shown that the preferred surface roughness of the coupling platform should be selected for the different hydrodynamic properties of the coating/conductive paste and the application process of the user end. 5 μ ιη-3. 5 μ ιη 。耦 1 耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦耦 1 1 between.

The depth of the recess is greater than ΙΟ μιη, and the depth of the recess refers to the maximum depth of the same recess. On the one hand, in order to ensure the above-mentioned reflected light multiplexing efficiency as much as possible, it is desirable that the ratio of the recesses to the heterogeneous wide surface area is as large as possible. On the other hand, in order to ensure the bonding fastness of the interconnecting strip and the battery sheet, it is necessary to ensure retention and passage. The total area of the coupling platform combined with the surface of the cell by means of splicing or conductive adhesive bonding should not be too small. Depending on the surface characteristics of the tantalum/conductive paste and the cell connection surface, the sum of the areas of the coupling platforms on the same heterogeneous wide surface is generally selected to be 15%-85% of the total area of the heterogeneous wide surface in which the coupling is The area of the platform is a macroscopic shape contour area, and the area of the heterogeneous wide surface is an envelope macroscopic shape contour area. In order to ensure the above-described reflected light multiplexing efficiency as much as possible, the concave surface for reflecting the reusable light must maintain the highest possible finish, and the surface roughness of the coupling platform is larger than the concave surface roughness.

In order to increase the effective area of the interconnected strip for reflecting the reusable light as much as possible, any two points on the macroscopic shape contour of the recessed surface are taken, wherein the angle of the cut surface of the deeper point is smaller or equal to the shallower position The angle of the cut surface of the point, the cut surface being a plane tangential to the macroscopic contour of the recess at the point, the angle of the cut surface being the macroscopic contour of the coupled platform at the same heterogeneous wide surface as the recess An angle between the cut surface of the recess.

In order for the light reflected by the concave surface to be totally reflected at the glass/air interface of the assembly, the angle of the cut surface at any point on the macroscopic contour of the surface of the recess is between 20.9 ° - 45 °.

Practical tests have shown that under industrial processing conditions, the reflection of light on the concave surface is not specular or diffuse, but rather a typical non-Lambertian reflection characteristic, and the surface of the re-solidified tantalum and most bright metal coatings after splicing In this case, a feature that the forward reflection distribution is stronger than the backward reflection distribution is exhibited. Therefore, the angle of the cut surface at any point on the macroscopic shape contour of the surface of the selected recess is optimized to be between 30 ° and 45 °.

From the viewpoint of ensuring the consistency of processing of the conductive base tape and reducing the yield strength in the longitudinal direction: the depressions are grooves which are continuously or discontinuously distributed on the heterogeneous wide surface.

The grooves are regularly repeated along the length of the interconnecting strip on the heterogeneous wide surface.

The groove is a linear strip groove having an angle with the length direction of the interconnecting strip, and the angle is 5 ° -85 °.

The angle between the groove and the length of the strap is between 26 ° - 64 °.

The grooves are distributed in parallel on the same wide surface.

The grooves are distributed across the same wide surface.

The grooves are mirror images of each other with respect to a center line in the longitudinal direction of the interconnecting strip. The recess further includes one or more of a curved strip groove, a dot groove, a planar groove, and a bevel groove formed by a one-sided or double-sided pressing bevel along the length of the tab.

In order to enhance the surface light-reflecting ability of the interconnecting tape, all or part of the surface of the recess is covered with a light-reflecting layer.

All or part of the coupling platform is covered with a light reflecting layer.

The light reflecting layer is a metal reflective layer, and the main material is nickel, silver, aluminum, gold, molybdenum, copper, aluminum, or formed of one or more of nickel, silver, aluminum, gold, molybdenum, copper, aluminum. One or several of the alloys.

The light reflecting layer may also be a tin based layer.

The light reflecting layer may also be a transparent or reflective conductive film and/or a conductive paste.

One or more layers of metal and/or alloy may exist between the light reflecting layer and the conductive base tape for protecting the conductive base tape, adjusting the surface roughness of the conductive base tape, and/or enhancing the bonding fastness of the conductive base tape to the light reflecting layer. Transition layer.

Depending on the application method of the user, the arithmetic mean deviation of the surface profile of the reflective layer on the recess is

Between 0. 05 μ ιη- 5 μ ιη. In general, if the user uses the conventional splicing method (the reflective layer is generally tin-based sputum), it is limited by the anti-corrosion/anti-aging properties of the sputum, and the splicing environment for tin-based materials. In the use of bright additive restrictions, etc., the surface roughness of the above-mentioned reflective layer is often too large at the beginning of the production, but the surface of the reflective layer is caused by the subsequent splicing process, which leads to the surface self-leveling effect. The reflection ability of the incident light will be enhanced; if the user uses a conductive adhesive or the like, the bright plating can be selected, and the surface roughness of the reflective layer can be directly controlled to a small extent by using the process leveling ability. Enhance the ability to reflect light as much as possible.

A method of preparing an efficient interconnecting strip for a photovoltaic module, comprising the following steps:

(a) pressing a depression on a conductive base tape having a flat profile with a flat surface and a raised pressure roller; (b) using a rough-shaped circular pressure roller to perform a further surface shaping of the conductive base tape on which the depression has been formed to form a coupling platform;

(c) Heat treatment of the heterogeneous conductive base tape prepared in step (b) to adjust the mechanical properties of the heterogeneous conductive base tape.

Also included is a step (d): a layer of light reflecting layer is applied by electroplating or thermal coating on the heterogeneous conductive tape of the step (C).

The isomeric conductive tape prepared by the step (C), or the interconnecting tape which has been coated with the reflective layer prepared by the step (d), is immersed in a transparent or reflective conductive film material and/or a conductive colloidal material containing a liquid. After the tank is taken out, the surface is further dried and solidified.

(a) simultaneously forming a recess and a coupling platform on the same wide surface of the conductive base strip by sandblasting/blasting;

(b) Heat treatment of the heterogeneous conductive tape prepared in step (a) to adjust the mechanical properties of the heterogeneous conductive tape.

Also included is a step (c): a layer of light reflecting layer is applied by electroplating or thermal coating on the heterogeneous conductive tape of step (b).

The invention has the beneficial effects that the high-efficiency interconnecting strip for the photovoltaic module and the preparation method thereof, the surface of the interconnecting strip is reflected by the glass air interface of the component by the surface isomerization of the conductive strip The surface of the battery is multiplexed to enhance the power of the component. At the same time, the yield performance of the interconnecting strip can be reasonably adjusted to improve the weathering safety of the component. At the same time, the contact between the interconnecting strip and the battery can be achieved without affecting the above capabilities. The microporous aggregation mechanism of the molten tantalum/adhesive conductive glue is constructed on the surface, which improves the bonding fastness of the interconnecting strip and the battery sheet. DRAWINGS

The invention will now be further described with reference to the drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing the structure of an embodiment 1 of the high-efficiency interconnection tape of the present invention. Figure 2 is a schematic cross-sectional view of Figure 1.

Figure 3 is a partial enlarged view of A in Figure 2.

Figure 4 is a partially enlarged schematic view of the high efficiency interconnecting strip of the present invention with only the grooves having a reflective layer.

Fig. 5 is a structural schematic view showing the grooves of the high efficiency interconnecting strip of the present invention distributed in parallel on the same wide surface. Figure 6 is a schematic view showing the structure of the high-efficiency interconnecting strip of the present invention having intersecting linear grooves and beveled grooves. Figure 7 is a cross-sectional view taken along line A-A of Figure 6.

Figure 8 is a schematic view showing the structure of the high-efficiency interconnecting strip of the present invention having a beveled groove.

Figure 9 is a cross-sectional view of Figure 8.

Figure 10 is a schematic view showing the structure of the high-efficiency interconnecting strip of the present invention having a dot-like groove.

Figure 11 is a schematic view showing the structure of the high-efficiency interconnecting strip of the present invention having curved grooves.

Fig. 12 is a schematic view showing the angle between the two points M and N of the macroscopic shape contour of the groove surface of the high-efficiency interconnection tape of the present invention.

Figure 13 is a schematic view showing the angle of the cut surface of any two points M and N on the macroscopic contour of the groove surface of the high efficiency interconnecting strip of the present invention.

Figure 14 is a schematic view showing the angle between the two points M and N of the macroscopic shape contour of the groove surface of the high efficiency interconnecting tape of the present invention.

Figure 15 is a schematic view showing the structure of the high-efficiency interconnection tape of the present invention.

In the figure 1, the conductive baseband, 2, the groove, 3, the coupling platform, 4, the reflective layer, _α , the angle of the cut surface, β, the angle between the groove and the length direction, L section ₍

detailed description

The invention will now be described in detail with reference to the drawings. The drawings are simplified schematic diagrams, and only the basic structure of the invention is illustrated in a schematic manner, and thus only the configurations related to the present invention are shown. Example 1

TU1 oxygen-free copper is selected as the conductive base tape 1, and the thickness is 0.222 mm. The envelope of the conductive base tape 1 is a flat wire, and a wide strip surface of a uniform cross-section is pressed on one of its two wide surfaces. 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 μ m, and the coupling platform 3 is a rough plane whose surface roughness is greater than the surface roughness of the groove 2, the depth of the groove 2 is greater than 10 m; the sum of the areas of the coupling platforms 3 on the same heterogeneous wide surface is 15%-85% of the total area of the heterogeneous wide surface, the area of the coupling platform 3 is a macroscopic shape contour area; the area of the heterogeneous wide surface is an envelope macroscopic shape contour area, wherein the heterogeneous wide surface The area is the rectangular area of the length aX width b of the interconnecting strip as shown in Fig. 1, that is, the envelope macroscopic contour area in which the recess exists is ignored.

Wherein, the linear strip-shaped circular groove 2 and the conductive base strip 1 have an angle β and a linear strip-shaped circular groove 2 having an angle β; In the example, the two linear strip-shaped circular grooves are mirror images of the center line of the longitudinal direction of the conductive base tape 1, and the two angles β are respectively 55° which are substantially 55° with the length of the interconnecting strip. The angle β of the direction.

The surface of the recess 2 and the coupling platform 3 are covered with a reflective layer 4.

As shown in FIG. 12, any two points Μ and Ν on the macroscopic shape contour of the surface of the groove 2 are taken, wherein the angle α of the tangent plane of the deeper point 小于 is smaller than or equal to the angle of the tangent point of the shallower point Μ ,, the cut The face L is a plane tangential to the macroscopic shape profile of the groove 2 at this point, the angle of the cut face α being the macroscopic shape profile of the coupled platform 3 at the same heterogeneous wide surface as the groove 2 The angle between the cut faces L of the grooves 2 is described. In this embodiment, it is a circular arc groove, and may also have a shape such as a V-shaped groove as shown in FIGS. The angle of the tangent angle α at any point on the surface of the macroscopic shape of the groove 2 is between 20.9 ° - 45 °, in order to cause the light reflected by the concave surface to be totally reflected on the glass/air interface of the assembly.

Practical tests have shown that under industrial processing conditions, the reflection of light on the concave surface is not specular or diffuse, but rather a typical non-langer reflection feature, and the surface of the re-solidified tantalum and most bright metal coatings after splicing In this case, a feature that the forward reflection distribution is stronger than the backward reflection distribution is exhibited. Therefore, the angle α of the tangent at any point on the macroscopic shape contour of the surface of the selected recess is optimized to be 30 ° -

Between 45 °. The grooves 2 may be continuously distributed or intermittently distributed. By discontinuous distribution is meant a plurality of spaced apart grooves on a length of interconnecting strip, and adjacent segments of the interconnecting strip have no grooves. In this embodiment, the grooves 2 are regularly repeated along the length of the interconnecting strip on the heterogeneous wide surface, and may of course be irregularly distributed. As shown in Fig. 5, the linear strip grooves may also be distributed in parallel on the same wide surface. As shown in Figure 6-11, the groove shape also includes a curved strip groove, a dot groove, a planar groove, and a bevel groove formed by a single-sided or double-side pressing bevel along the length of the tape. One or more of them. 5微米之间之间之间之间之间。 Between the 0. 05 μ ιη - 5 μ ιη between the arithmetic mean deviation of the surface profile of the reflective layer 4 on the groove 2. In general, if the user uses the conventional splicing method (when the reflective layer is generally tin-based sputum), the coupling platform 3 of the conductive base tape 1 should adopt a higher roughness to enhance the melting. The surface roughness of the above-mentioned reflective layer 4 is usually large, but the surface self-leveling effect is caused by the subsequent splicing process, and the reflective layer is incident after the splicing is completed. The light reflection ability will be enhanced; if the user uses conductive adhesive or the like, the bright plating can be selected, and the surface roughness of the reflective layer can be controlled to a small extent by using the process leveling ability, as much as possible. Enhance the ability to reflect light. One or more layers of metal and/or alloy may exist between the light reflecting layer and the conductive base tape for protecting the conductive base tape, adjusting the surface roughness of the conductive base tape, and/or enhancing the bonding fastness of the conductive base tape to the light reflecting layer. Transition layer. 5N,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The peeling tensile force between the heterogeneous wide surface of the interconnecting tape of the embodiment and the battery sheet is greater than 2N, which satisfies the requirements. The manufacturing method of the interconnecting strip of this embodiment includes the following steps:

(a) pressing the groove 2 on the conductive base tape 1 used to fabricate the interconnecting strip using a smooth and raised pressure roller;

(b) using a rough surface roller to perform a further surface shaping of the prepared conductive base tape 1 to form a coupling platform 3;

(c) heat treating the heterogeneous conductive base tape prepared by the step (b) to adjust the mechanical properties of the heterogeneous conductive base tape;

(d) A layer of reflective layer 4 is overlaid on the heterogeneous conductive tape of step (c) by electroplating, and the reflective layer 4 is a metallic reflective layer.

Alternatively, a tanning material may be used to electroplate or thermally coat the 10% tin-based dip material onto the heterogeneous conductive tape of the step (c) to form the reflective layer 4. It is also possible to immerse the heterogeneous conductive base tape prepared by the step (C), or the interconnecting tape which has been coated with the light-reflecting layer 4, which has been prepared by the step (d), into a liquid transparent or reflective conductive film material and/or conductive. The tank of the colloidal material is removed and the surface is dried and solidified.

If the light reflecting layer is prepared only in the groove 2, the waterproof protective film may be adhered to the coupling platform 3 of the heterogeneous conductive base tape obtained by the step (c) in the step (d), and then plated. Or a process such as hot coating or coating. After the plating is completed, the waterproof protective film can be removed. The embodiment of the present invention is substantially the same as the first embodiment, and the arithmetic mean deviation Ra of the surface profile of the coupling platform 3 is 0.25 μm. With the macroscopic splicing/adhesive efficiency measuring method of Example 1, the peeling tensile force between the heterogeneous wide surface of the interconnecting tape of the present embodiment and the battery sheet is greater than 1. 8 N, which satisfies the requirements.

Embodiment 3 This embodiment is basically the same as Embodiment 1. Unlike Embodiment 1, the arithmetic mean deviation Ra of the surface profile of the coupling platform 3 is 5 μm. With the macroscopic splicing/adhesive efficiency measuring method of Example 1, the peeling tensile force between the heterogeneous wide surface of the interconnecting tape of the present embodiment and the battery sheet is more than 2N, which satisfies the requirements.

Embodiment 4 This embodiment is basically the same as Embodiment 1. Unlike Embodiment 1, the arithmetic mean deviation Ra of the surface profile of the coupling platform 3 is 1. 5 μ m. With the macroscopic splicing/adhesive efficiency measuring method of Example 1, the peeling tensile force between the heterogeneous wide surface of the interconnecting tape of the present embodiment and the battery sheet is more than 2N, which satisfies the requirements.

Example 5 This embodiment is basically the same as the first embodiment. Unlike the first embodiment, the angle β is an angle β between the two directions which is substantially 5° with respect to the longitudinal direction of the interconnecting strip. With the macroscopic splicing/adhesive efficiency measuring method of Example 1, the peeling tensile force between the heterogeneous wide surface of the interconnecting tape of the present embodiment and the battery sheet is more than 2 Ν, which satisfies the requirements.

[Embodiment 6] This embodiment is basically the same as Embodiment 1, and is different from Embodiment 1 in that the included angle β is an angle β between the two directions which is substantially 85° with respect to the longitudinal direction of the interconnecting strip. With the macroscopic splicing/adhesive efficiency measuring method of Example 1, the peeling tensile force between the heterogeneous wide surface of the interconnecting tape of the present embodiment and the battery sheet is more than 2 Ν, which satisfies the requirements.

[Embodiment 7] This embodiment is basically the same as Embodiment 1, and is different from Embodiment 1 in that the included angle β is an angle β between the two directions which are substantially 26° with respect to the longitudinal direction of the interconnecting strip. With the macroscopic splicing/adhesive efficiency measuring method of Example 1, the peeling tensile force between the heterogeneous wide surface of the interconnecting tape of the present embodiment and the battery sheet is more than 2 Ν, which satisfies the requirements.

[Embodiment 8] This embodiment is basically the same as Embodiment 1, and differs from Embodiment 1 in that the included angle β is an angle β between the two directions which is substantially 64° with respect to the longitudinal direction of the interconnecting strip. With the macroscopic splicing/adhesive efficiency measuring method of Example 1, the peeling tensile force between the heterogeneous wide surface of the interconnecting tape of the present embodiment and the battery sheet is more than 2 Ν, which satisfies the requirements.

Example 9

The embodiment is substantially the same as the first embodiment. The difference from the embodiment 1 is that, as shown in FIG. 15, the TU1 oxygen-free copper is selected as the conductive base tape 1, and the thickness is 0. 20 mm, and sandblasting is performed on a wide surface thereof. System The dot-shaped groove 2 is a flat surface, and the total area of the coupling platform accounts for 30% of the area of the wide plane, and the area is a macroscopic shape contour area. The depth of the point groove 2 is greater than 10 μm, the arithmetic mean deviation Ra of the surface profile of the coupling platform 3 is lum, the point groove 2 and the coupling platform 3 are plated with a 4 um metallic bright nickel reflective layer 4, a metal reflective layer 5um。 The surface average arithmetic deviation of Ra is 0. 5um.

The user uses the adhesive tape to bond the tape to the cell sheet. The peeling tension between the heterogeneous wide surface of the interconnect tape and the cell sheet of the present embodiment is greater than 2N, which satisfies the requirements.

The manufacturing method of the interconnecting strip of this embodiment includes the following steps:

(a) simultaneously forming a groove 2 and a rate cascading platform 3 on a wide surface of the conductive base tape 1 by sandblasting/blasting;

(b) heat treating the heterogeneous conductive base tape prepared in step (a) to adjust the mechanical properties of the heterogeneous conductive tape;

(c) A layer of reflective layer 4 is applied by electroplating or thermal coating on the heterogeneous conductive tape of step (b), where the reflective layer 4 is a metallic reflective layer.

This embodiment utilizes the leveling ability of the bright nickel plating process, and the surface roughness of the electroplated reflective layer is lower than the original roughness of the conductive base tape.

In view of the above-described embodiments of the present invention, various changes and modifications may be made by those skilled in the art without departing from the scope of the invention. The technical scope of the present invention is not limited to the contents of the specification, and the technical scope thereof must be determined in accordance with the scope of the claims.

Claims

Claim

A highly efficient interconnecting strip for a photovoltaic module comprising a conductive base tape (1) composed of a metal elemental or alloy material, characterized by:

(a) the envelope of the conductive base tape (1) is a flat wire, at least one of the two wide surfaces is a heterogeneous wide surface, and a plurality of depressions are distributed on the heterogeneous wide surface, adjacent depressions There is a coupling platform (3);

(b) The coupling platform (3) is a rough plane with an arithmetic mean deviation of the surface profile ^ between 0.254 and 11-5 111.

2. The high efficiency interconnecting strip of claim 1 wherein the depression has a depth greater than 10 [mu]m.

3. The high efficiency interconnecting strip of claim 1 wherein: the sum of the area of the coupling platform (3) on the same heterogeneous wide surface is between 15% and 85% of the total area of the heterogeneous wide surface. The area of the coupling platform is a macroscopic shape contour area, and the area of the heterogeneous wide surface is an envelope macroscopic shape contour area.

4. The high efficiency interconnecting strip according to claim 1, wherein: the arithmetic mean deviation Ra of the surface profile of the coupling platform (3) is between 1.5 μm and 3.5 μm.

5. The high efficiency interconnecting strip of claim 1 wherein: the surface roughness of the coupling platform (3) is greater than the surface roughness of the recess.

The high-efficiency interconnecting strip according to any one of claims 1 to 5, wherein: any two points on the macroscopic shape contour of the concave surface are taken, wherein an angle of the tangent plane of the deeper point is less than or equal to The angle of the cut surface of the shallower point, the cut surface being a plane tangential to the macroscopic contour of the recess at the point, the angle of the cut surface being a coupling platform having the same heterogeneous wide surface as the recess ( 3) The angle between the macroscopic shape contour and the cut surface of the recess.

7. The high efficiency interconnecting strip of claim 6 wherein the angle of the cut surface at any point on the surface macroscopic contour of the recess is between 20.9 and 45 degrees.

8. The high efficiency interconnection belt according to claim 7, wherein: the angle of the cut surface at any point on the surface macroscopic shape of the recess is between 30 ° and 45 °.

9. The high efficiency interconnecting strip of claim 6 wherein: said recess is a groove (2) that is continuously or discontinuously distributed over a heterogeneous wide surface.

10. The high efficiency interconnecting strip of claim 9, wherein: said groove (2) is regularly repeating along said length of said interconnecting strip on said heterogeneous wide surface.

11. The high-efficiency interconnecting strip according to claim 9, wherein: the groove (2) is a linear strip-shaped groove having an angle with a length direction of the interconnecting strip, and the angle is 5 ° - 85 °.

12. The high efficiency interconnection tape according to claim 11, wherein: the angle between the groove (2) and the length of the interconnection band is between 26[deg.] and 64[deg.].

13. The high efficiency interconnecting strip of claim 11 wherein: said grooves (2) are distributed parallel along the same wide surface.

14. The high efficiency interconnecting strip of claim 11 wherein: said grooves (2) are distributed across the same wide surface.

15. The high efficiency interconnecting strip of claim 14, wherein: the grooves (2) are mirror images of each other with respect to a centerline in the length direction of the interconnecting strip.

16. The high efficiency interconnecting strip of claim 6, wherein: the recess further comprises a curved strip groove, a point groove, a planar groove, and a one side or double along the length of the interconnecting strip One or more of the bevel grooves formed by the side pressing bevels.

17. The high efficiency interconnecting strip of claim 1 wherein: all or a portion of the surface of the recess is covered with a reflective layer (4).

18. The high efficiency interconnecting strip of claim 17, wherein: said coupling platform (3)

19. A high efficiency interconnect tape according to claim 17 or 18, wherein: said light reflecting layer (4) is a metallic light reflecting layer.

20. A high efficiency interconnect tape according to claim 17 or 18, wherein: said light reflecting layer (4) is a tin based layer.

The high-efficiency interconnection tape according to claim 17 or 18, wherein the light-reflecting layer (4) is a transparent or reflective conductive film and/or a conductive paste.

22. A high efficiency interconnect tape according to claim 17 or 18, characterized in that one or more metal and/or alloy transition layers are present between the light reflecting layer (4) and the conductive base tape (1).

23. The high efficiency interconnecting strip of claim 17, wherein: the reflective layer (4) has an arithmetic mean deviation of surface contours between 0.05 μm and 5 μm.

24. A method of making an efficient interconnect tape for a photovoltaic module according to any of claims 1-23, comprising the steps of:

(a) using a smooth surface with a raised pressure roller to suppress the depression on the conductive base tape (1) with a flat profile of the envelope;

(b) using a rough surface roller to perform a further surface shaping of the prepared conductive base tape (1) to form a coupling platform (3);

(c) Heat treatment of the heterogeneous conductive tape prepared in step (b) to adjust the mechanical properties of the heterogeneous conductive tape.

The preparation method according to claim 24, wherein the heterogeneous conductive base tape prepared by the step (c) is immersed in a tank containing a liquid transparent or reflective conductive film material and/or a conductive colloid material. After taking out, the surface is further dried and cured.

26. The method according to claim 24, further comprising: step (d): coating a reflective layer by electroplating or thermal coating on the heterogeneous conductive tape of the step (c) (4).

The preparation method according to claim 26, wherein the interconnecting tape which has been covered with the light reflecting layer (4) prepared by the step (d) is immersed in a transparent or reflective conductive film material containing liquid and/or Or the cavity of the conductive colloid material, after taking out, the surface is further dried and solidified.

28. A method of making an efficient interconnect tape for a photovoltaic module according to any of claims 1-23, comprising the steps of:

(a) simultaneously forming a depression and coupling platform (3) on the same wide surface of the conductive base tape (1) by sandblasting/blasting;

(b) Heat treatment of the heterogeneous conductive base tape prepared by the step (a) to adjust the mechanical properties of the heterogeneous conductive base tape.

The preparation method according to claim 28, further comprising the step (c): coating a reflective layer on the heterogeneous conductive base tape of the step (b) by electroplating or thermal coating ( 4).