TWI553895B - Efficient photovoltaic heterogeneous welding zone - Google Patents

Description

High efficiency photovoltaic isomerized ribbon

The invention belongs to the technical field of photovoltaic welding strip processing, and particularly relates to a high-efficiency photovoltaic isomerized welding strip.

With the rapid development of the world economy, energy consumption is increasing, and countries all over the world are demanding the application and popularization of new energy. The demand for clean renewable energy is particularly strong in countries around the world due to the effects of greenhouse gases caused by carbon dioxide emissions that contribute to global warming and natural disasters. Since the global crisis caused by the 2007 subprime crisis in the United States has spread and expanded, countries have adopted more active measures to encourage the use of renewable energy in order to stimulate economic growth. The US Obama administration has proposed to invest 150 billion U.S. dollars in clean energy in the next 10 years; the EU has set a goal to increase the proportion of renewable energy in energy use to 20% by 2020; Japan proposes to build more than 70% in 2030. The house is installed with solar panels (about 70 GW). In order to alleviate the insufficient domestic demand for photovoltaic products, on March 26, 2009, the Ministry of Finance of China announced that it will promote the implementation of the “Solar Roof Project” demonstration project. The Ministry of Finance, the Ministry of Housing and Urban-Rural Development jointly issued the "Implementation Opinions on Accelerating the Application of Solar Photovoltaic Buildings" clearly stated that the implementation of the "Solar Roof Project" will provide financial assistance for the demonstration project of photovoltaic building applications, encourage technological progress and technology. Innovate and encourage local governments to implement relevant financial support policies and strengthen policy support in the construction sector. At this stage, in large and medium-sized cities with developed economies and good industrial bases, we will actively promote the integration of photovoltaic roofs and photovoltaic curtain walls, and actively support the development of off-grid power generation in rural and remote areas, and implement regulations on power transmission to the countryside. It is the direction for the application of solar technology. Taking the integration of photovoltaic roofs and photovoltaic curtain walls as a breakthrough, it is possible to let people see the many benefits of applying solar energy in the short term, and it is also conducive to large-scale promotion in the future, and stimulate the enthusiasm of industrial capital to invest in solar energy. National new energy policies may be one of the next important policies that will affect our world development for the next 15 years. The 2009 Copenhagen Climate Conference reawakened and reinforces awareness of clean energy. With the application and popularization of new energy sources, the rapid growth of the photovoltaic industry has been further strengthened and valued.

Solder ribbons (including interconnecting strips and busbars) are important raw materials in the welding process of photovoltaic components. Solder ribbons are usually connected to each other by means of soldering or conductive adhesive bonding, and the current of the soldering strips will directly affect the quality of the soldering strips. The collection efficiency of the photovoltaic element current has a great influence on the power of the photovoltaic element. How to increase the conversion rate of the cell and reduce the fragmentation rate by isomerization of the solder ribbon has always been one of the research topics in the solder ribbon industry.

Chinese patent CN101789452A provides a tin-coated solder ribbon comprising a copper strip and a tin-coated layer on its surface, the tin-coated layer having a uniformly distributed pit-like body. This kind of solder band causes the sunlight to diffusely reflect in the pit, which improves the energy of receiving sunlight. However, the pit-like body only diffusely reflects, the proportion of sunlight reflected back to the cell sheet is small, and the conversion rate is limited; in addition, the pit is prepared during the tin-coating process, which generates an uneven solder layer, and There will be a phenomenon that the welding of the battery piece is not strong, and a virtual welding occurs.

Chinese patent CN102569470A provides a V-groove that is prepared perpendicular to the length of the strip on the surface of the strip to reduce the crack and chip rate of the cell. However, the V-shaped groove of the patented welding tape is perpendicular to the longitudinal direction and there is no significant spacing between the V-shaped grooves, so the welding tape is unstable when welded to the battery sheet, and the welding is not strong.

Chinese patent CN202004027U discloses a solder ribbon having a zigzag-shaped reflective structure formed by a plurality of grooves extending along the length of the strip in the front side of the strip, and the structure is used to allow sunlight incident on the strip. Effectively reflected on the battery to increase component power. However, the solder ribbon is unstable when soldered to the battery sheet, and the soldering is not strong, and the groove structure along the length of the solder strip has a large cross-sectional area loss in the case of the same thickness of the solder ribbon, thereby increasing the resistance. Not conducive to the improvement of power.

Chinese patents ZL201320071240.1, ZL201320071182.2, ZL201320110484.6, ZL201320463993.7, ZL201320466223.8, etc., proposed different forms of heterogeneity of the conductive base tape of the solder ribbon, to achieve partial multiplexing of the reflected light on the surface of the solder ribbon, and adjustment The soldering fastness between the solder ribbon and the battery sheet reduces the sinking electrical loss caused by the solder ribbon and reduces the yield stress of the solder ribbon to improve the weathering safety of the component and the fragmentation rate during the production process. Practice has confirmed that the above patent group still has a common shortcoming: when using the current automatic stringer welding on the market, unless the total area of the baseband plane on the heterogeneous wide surface is greatly increased, the proportion of the total area of the heterogeneous wide surface is There is a higher risk of a false weld between the heterogeneous wide surface contacting the back silver and the back silver. However, the consequence of greatly increasing the ratio of the total area of the baseband plane on the heterogeneous wide surface to the total area of the heterogeneous wide surface is the reason for the significant decrease in the reflectance of the reflected light on the surface of the positive silver strip, which is contrary to the main intention of product design. .

At the same time, the inventors have found that the ability of retroreflective multiplexing is achieved even when the groove angle is set during the production of the ribbon to allow the reflected light to be reflected back through the glass/air surface of the component to the extent that the cell surface is totally reflected. not ideal.

The technical problem to be solved by the present invention is to solve the problem of heterogeneous solder ribbon and battery in the environment of automatic stringer, in order to reasonably ensure the use of the surface heterogeneity of the conductive strip of the interconnected strip to realize the reflective tape multiplexing/stress reduction. The welding fastness is reduced/the risk of the virtual welding is increased. The invention provides a cost-effective high-efficiency photovoltaic for simultaneously achieving partial reflective multiplexing of the surface of the soldering strip, reducing welding stress, ensuring welding strength, and converging electric leakage caused by balanced slotting. Heterogeneous solder ribbon.

The technical solution adopted by the present invention to solve the technical problem is: a high-efficiency photovoltaic isomerized soldering strip comprising a conductive base tape, the conductive base tape being a metal elemental or alloy material having two upper and lower wide surfaces, the conductive The baseband has at least one wide surface distributed with a V-shaped groove and a coupling platform. The depth h of the V-shaped groove is 0.055 mm<h<0.15 mm; the coupling platform is the largest inscribed circle having a diameter greater than 0.10 mm along the conductive baseband A platform with a maximum length in the length direction of less than 50 mm.

The above technical solution utilizes a V-shaped groove on the surface of the conductive base tape, and on the other hand, a part of the surface reflected light can be re-reflected to the surface of the battery via the glass/air surface of the component, thereby realizing the multiplexing of the reflected light on the surface of the partial solder ribbon. At the same time, the actual thickness of the solder ribbon is locally reduced by the distribution of the V-shaped grooves, thereby reducing the stress between the solder ribbon and the battery sheet after the soldering because the solder ribbon is much higher than the thermal expansion and contraction amplitude of the battery sheet. It is especially important that the solution also has a coupling platform reserved between the V-shaped grooves, thereby simultaneously solving the problem of the bonding fastness between the welding strip and the battery sheet. The inventors have found that when using the mainstream automatic stringer currently on the market, it is necessary to ensure that the solder has sufficient soldering fastness to the back silver surface of the battery during the soldering process, and the diameter of the largest inscribed circle of the coupling platform must be not less than 0.10 mm. . At the same time, generally, the maximum length of the coupling platform along the length of the conductive baseband should be less than 50mm. Otherwise, the V-groove density/band reflective multiplexing capability can be lost, and the V-groove can reduce the welding fragmentation rate. It will be greatly discounted: because the distance between the V-grooves is already greater than 30% of the width of the general polycrystalline cell, the stress of the solder ribbon/cell accumulated during the soldering process between adjacent V-grooves is difficult to be released.

The inventors have found that under the existing soldering process, the solder layer on the surface of the solder strip will naturally flow after soldering, so that some of the solder on the V-groove side wall and the coupling platform will flow into the V-shaped groove, if the V-shaped groove Too shallow a depth will cause most of the V-groove to be blocked by solder, losing the original intention of the reflective design. If the V-shaped groove is too deep, the thickness of the envelope of the solder ribbon is too large, and the risk of interrupting the line during the preparation process is high. Therefore, the depth h of the V-shaped groove is generally selected to be 0.055 mm < h < 0.15 mm.

The conductive base tape has at least one wide surface formed by the V-shaped groove and the coupling platform, that is, the same wide surface is composed only of the V-shaped groove and the coupling platform.

The V-shaped groove is a linear V-shaped groove in which the intersection of the two oblique sides of the groove is a straight line.

A coupling platform is left between adjacent V-shaped grooves.

In the package environment of the current wafer cell component, the depth h of the V-groove is preferably 0.06 mm ≤ h ≤ 0.12 mm.

Further, the diameter of the largest inscribed circle of the coupling platform is preferably greater than 0.20 mm, and the maximum length of the coupling platform along the length direction of the conductive baseband is less than 20 mm.

Further, the diameter of the largest inscribed circle of the coupling platform is preferably not less than 0.25 mm, and the maximum length of the coupling platform along the length direction of the conductive baseband is less than 5 mm. In the current mainstream automatic stringer environment on the market, and from the cost-effectiveness of industrially stable production of high solderability solder ribbon, in the case of ensuring that the solder ribbon can be welded or bonded and meet the strip peeling force of the strip, The ratio of the good coupling platform to the reflective V-groove.

The inclination angle of the linear V-shaped groove and the conductive base tape in the longitudinal direction is preferably 15° to 75°. When the angle between 75 ° and 90 °, the reflection of the V-shaped groove will re-reflect through the glass / air surface, most or all of it will fall back to the surface of the ribbon, and will not be reused by the cell, and the welding The effective conductive cross-sectional area of the strip is greatly reduced, resulting in an increase in the practical resistance of the solder ribbon, resulting in a higher package electrical loss. However, the V-groove direction at this time is beneficial to the release of the internal stress after the welding of the welding strip, so that the risk of welding debris caused by the thermal expansion and contraction of the welding strip can be better reduced; when the angle is between 0°-15° When the reflection of the V-shaped groove is re-reflected through the glass/air surface, most or all of it will fall back to the surface of the battery sheet, which is beneficial to the multiplexing of the light, and the effective cross-sectional area of the solder ribbon is reduced small/the package electric loss is small. However, at this time, it is not conducive to releasing the internal stress after welding of the welding strip, and there is a certain disadvantage in the risk of welding debris due to the fact that the welding strip is much higher than the thermal expansion and contraction coefficient of the battery sheet in the auxiliary reduction welding process.

The surface area ratio of the surface area of the coupling platform to the surface of the conductive base is 5% ≤ m ≤ 95%.

The surface area ratio of the surface area of the coupling platform to the surface of the conductive base is 25% ≤ m ≤ 75%.

The linear V-shaped grooves are distributed in parallel on the same wide surface.

The linear V-shaped grooves are distributed across the same wide surface.

The shape of the coupling platform is a parallelogram or a trapezoid.

After the solder ribbon is soldered, the solder layer on the surface will naturally flow, so that the angle of the actual light-emitting groove after the soldering is completed becomes larger. The above problems do not occur with non-welded methods (typically with conductive adhesive bonding batteries and interconnecting strips). Depending on the application method, the V-shaped angle of the V-shaped groove is generally selected to be between 75° and 138° to ensure the efficiency of the reflective surface of the preferred solder ribbon to be re-reflected through the glass/air surface to the surface of the battery.

The coupling platform is not lower than the highest point of the V-shaped groove.

The outer surface of the solder ribbon is coated or plated with a tin-based solder layer so that it can be soldered directly; and a protective layer can be prepared between the conductive base tape and the tin-based solder layer to prevent aging of the solder ribbon and reliable performance. The above-mentioned baseband fabrication scheme is also of great significance for the method of preparing a solder ribbon by using conventional hot-coated solder: when a conventional hot-coated solder is used to produce a solder ribbon, although the heterogeneity of the surface of the baseband is substantially filled, it is difficult to achieve soldering. Reflective multiplexing with surface, but with the V-groove base tape of this solution, the welding stress can still be reduced, and the effective conductive cross-sectional area is not excessively lost due to the existence of the V-shaped groove.

The outer surface of the ribbon can also be coated or plated with a conductive reflective layer, which is suitable for bonding between the ribbon and the cell without soldering (such as conductive adhesive bonding).

A transition layer is also prepared between the solder layer or the conductive light reflecting layer and the conductive base tape.

The invention discloses a high-efficiency photovoltaic isomerized soldering strip, which utilizes a V-shaped groove with a better depth on the surface of the conductive base tape, and a coupling platform which is preferably designed to simultaneously realize partial reflective multiplexing and reduce welding stress on the surface of the soldering strip. The guaranteed welding strength and the converging electric loss caused by the balanced slotting provide a cost-effective custom design. For the preparation of conventional hot-coated strips that ignore the ability of reflective multiplexing, it also has the guiding significance of optimization.

The depth h of the V-groove of the present invention is greater than 0.055 mm, firstly because under the existing welding strip welding process, the solder layer on the surface of the soldering strip will naturally flow after welding, so the V-shaped groove side wall and the part on the coupling platform The solder will flow into the V-groove. If the V-groove is too shallow, it will cause most of the V-groove to be blocked by the solder, losing the original intention of the reflective design. For example, the thickness of the solder layer is 10 mm, the coupling platform is a parallelogram, the diameter of the largest inscribed circle is 250 mm, and the angle of the V-shaped groove is 120 degrees. At this time, after the simulation is calculated, the residual V-grooves are filled with different depths. The depth is as follows:

As can be seen from the above table, when the V-groove depth is less than or equal to 0.05 mm, more than 50% of the depth is filled with the solder after soldering, which greatly loses the multiplexing ability of the strip reflective. At the same time, from the aspect of assisting the reduction of the welding stress, it is also desirable that the depth of the V-shaped groove is large, because the overall yield performance of the welding strip is basically determined by the yield performance of the thinnest portion of the ribbon caused by the V-shaped groove.

However, from other aspects, the V-shaped groove is too deep, which will bring about the problem that the thickness of the substrate after processing is too large, and the risk of the substrate being interrupted during processing is high. In practice, the depth h of the linear V-groove is generally selected to be less than 0.15 mm.

Embodiment 1: TU1 oxygen-free copper is selected as the conductive base tape 1, as shown in FIG. 1, having a groove set 2 along the length direction of the conductive base tape 1 on one wide surface thereof, and two groove sets 2 are respectively set in width On both sides of the surface, each groove set 2 is composed of a plurality of continuous V-shaped grooves 3, and the V-shaped groove 3 is a linear V-shaped groove whose intersection of the two oblique sides of the groove is straight, and may of course be a groove. The intersection of the two hypotenuses is a curved curved V-groove and other deformations.

Between the two sets of grooves 2 is a rectangular coupling platform 4 extending along the length of the conductive base strip 1 , the height of the coupling platform 4 being equal to the highest point of the V-shaped groove 3 , coupled to the platform 4 The diameter of the largest inscribed circle is 0.1 mm; the V-shaped groove 3 has a V-shaped angle of 138°, and the V-shaped groove 3 is parallel to the longitudinal direction of the conductive base tape 1; the depth h of the V-shaped groove 3 is 0.12 mm; the coupling platform The area ratio of the surface area of 4 to the wide surface of the conductive base tape 1 is 5%.

The conductive retroreflective layer was uniformly prepared by electroplating onto the above-mentioned conductive base tape 1, and the thickness of the reflective layer was 5 mm to prepare a highly efficient photovoltaic isomerized solder ribbon.

The soldering tape is bonded to the battery sheet with a conductive adhesive, and the V-groove 3 of the soldering strip has a depth of 0.12 mm.

Using 60 pieces of 156mm*156mm polycrystalline silicon wafers (the same below), the power of a set of battery components using this photovoltaic ribbon is 6W higher than that of components prepared using ordinary solder ribbons, an increase of 2.4%.

The welding force of the welding strip is the tensile force required to pull the welding strip along the 45-degree direction of the battery sheet until the strip is peeled off from the battery sheet. Generally, the welding force requirement is greater than 3N, and the welding strip welding force of the embodiment is greater than 3N. fulfil requirements.

The fragmentation rate caused by the thermal expansion and contraction of the ribbon is less than two thousandths.

Embodiment 2: TU1 oxygen-free copper is selected as the conductive base tape 1, as shown in FIG. 2, having a groove set 2 on one wide surface thereof, and each groove set 2 is composed of a plurality of continuous V-shaped grooves 3, different concaves A parallelogram-shaped coupling platform 4 is left between the groove sets 2, the height of the coupling platform 4 is equal to the highest point of the V-shaped groove 3, and the diameter of the largest inscribed circle of the coupling platform 4 is 0.5 mm. The maximum length of the conductive base tape 1 in the longitudinal direction is 3.0 mm; the V-shaped groove 3 is present around the coupling platform 4; the V-shaped groove 3 has a V-shaped angle of 75°, and the V-shaped groove 3 and the length of the conductive base tape 1 are 30 The angle of the parallelogram has two sides parallel to the direction of the V-shaped groove 3; the depth h of the V-shaped groove 3 is 0.08 mm; and the surface area of the coupling platform 4 occupies 75% of the area of the wide surface of the conductive base tape 1.

A tin-lead solder was uniformly prepared by electroplating onto the above-mentioned conductive base tape 1 to prepare a highly efficient photovoltaic isomerized solder ribbon having a solder layer thickness of 10 mm.

After welding, the V-groove 3 of the strip has a depth of 0.048 mm.

Using 60 156*156 polycrystalline silicon wafers, the power of a set of battery components using this photovoltaic ribbon is 1 W higher than that of a component prepared using a conventional solder ribbon, an increase of 0.4%.

The welding force of the welding strip is the tensile force required to pull the welding strip along the 45-degree direction of the battery sheet until the strip is peeled off from the battery sheet. Generally, the welding force requirement is greater than 3N, and the welding strip welding force of the embodiment is greater than 3N. fulfil requirements.

The fragmentation rate caused by the thermal expansion and contraction of the ribbon is less than one thousandth.

Embodiment 3: TU1 oxygen-free copper is selected as the conductive base tape 1, as shown in FIG. 3, having a groove set 2 spaced apart along the length direction of the wide surface on one wide surface thereof, each groove set 2 being composed of a plurality of consecutive grooves The V-shaped groove 3 is composed of a parallelogram-shaped coupling platform 4 between the different groove sets 2, and the length of the coupling platform 4 in the width direction of the wide surface is equal to the width of the wide surface, and the width is 1.6 mm, the maximum The diameter of the inscribed circle is 0.5 mm, which is smaller than the width of the wide surface thereof, and the maximum length along the length of the conductive base tape 1 is 0.5 mm; the height of the coupling platform 4 is equal to the highest point of the V-shaped groove 3; the V-shaped groove The V-shaped angle of 3 is 120°, the V-shaped groove 3 is at an angle of 15 degrees with the longitudinal direction of the conductive base tape 1; the depth h of the V-shaped groove 3 is 0.10 mm; the surface area of the coupling platform 4 occupies a wide surface of the conductive base tape 1 The area ratio m is 95%.

The tin-lead solder was uniformly prepared by electroplating onto the above-mentioned conductive base tape 1, and a 2 mm transition layer between the solder layer and the conductive base tape 1 was prepared to prepare a highly efficient photovoltaic isomerized solder ribbon having a thickness of 8 mm.

After welding, the V-groove 3 of the strip has a depth of 0.069 mm.

Using 60 156*156 polycrystalline silicon wafers, the power of a set of battery components using this photovoltaic ribbon is 0.5 W higher than that of a component prepared using a conventional solder ribbon, an increase of 0.2%.

The welding force of the welding strip is the tensile force required to pull the welding strip along the 45-degree direction of the battery sheet until the strip is peeled off from the battery sheet. Generally, the welding force requirement is greater than 3N, and the welding strip welding force of the embodiment is greater than 5N. fulfil requirements.

The fragmentation rate caused by the thermal expansion and contraction of the ribbon is less than one thousandth.

Embodiment 4: TU1 oxygen-free copper is selected as the conductive base tape 1, as shown in FIG. 4, having a groove set 2 on one wide surface thereof, and each groove set 2 is composed of a plurality of continuous V-shaped grooves 3, different concaves A parallelogram-shaped coupling platform 4 is left between the groove sets 2, the height of the coupling platform 4 is equal to the highest point of the V-shaped groove 3, and the diameter of the largest inscribed circle of the coupling platform 4 is 0.24 mm. There are V-shaped grooves 3 at the front and rear ends of the joint platform 4, and there are no V-shaped grooves 3 on the left and right sides, that is, the left and right sides of the coupling platform 4 extend to both side edges of the wide surface; the V-shaped groove 3 has a V-shaped angle of 110°. The V-shaped groove 3 is at an angle of 30 degrees with respect to the longitudinal direction of the conductive base strip 1, and the parallelogram has two sides parallel to the direction of the V-shaped groove 3; the depth h of the V-shaped groove 3 is 0.11 mm; the surface area of the coupling platform 4 occupies The area ratio m of the wide surface of the conductive base tape 1 is 55%.

A tin-lead solder was uniformly prepared by electroplating onto the above-mentioned conductive base tape 1 to prepare a highly efficient photovoltaic isomerized solder ribbon having a solder layer thickness of 10 mm.

After welding, the V-groove 3 of the strip has a depth of 0.084 mm.

Using 60 pieces of 156*156 polycrystalline silicon wafers, the power of a set of battery components using this photovoltaic ribbon is 2.2W higher than that of components prepared using conventional solder ribbons, an increase of 0.88%.

The welding force of the welding tape is a tensile force required to pull the welding tape along the 45-degree direction of the battery sheet until the welding strip is peeled off from the battery sheet. Generally, the welding force requirement is greater than 3N, and the welding force of the welding belt of the embodiment is greater than 4N. fulfil requirements.

The fragmentation rate caused by the thermal expansion and contraction of the ribbon is less than one thousandth.

Embodiment 5: TU1 oxygen-free copper is selected as the conductive base tape 1, as shown in FIG. 5, on one of its wide surfaces, there are two groove sets 2 along the length direction of the conductive base tape 1, and the two groove sets 2 are respectively set in width On both sides of the surface, each groove set 2 is composed of a plurality of continuous V-shaped grooves 3, between which a rectangular coupling platform 4 extending along the length of the conductive base tape 1 is left. The height of the coupling platform 4 is higher than the highest point of the V-shaped groove 3, the diameter of the largest inscribed circle of the coupling platform 4 is 0.6 mm; the V-shaped groove 3 has a V-shaped angle of 110°, and the V-shaped groove 3 is electrically conductive. The length direction of the base tape 1 is parallel; the depth h of the V-shaped groove 3 is 0.10 mm; and the surface area ratio of the surface area of the coupling platform 4 to the wide surface of the conductive base tape 1 is 25%.

The solder layer was uniformly prepared by electroplating onto the above-mentioned conductive base tape 1 to prepare a highly efficient photovoltaic isomerized solder ribbon, and the thickness of the solder layer 5 was 10 mm. As shown in FIG. 6 and FIG. 7 , it is a schematic cross-sectional view of the groove set 2 and the coupling platform 4 respectively.

After welding, the V-groove 3 of the strip has a depth of 0.070 mm.

Using 60 pieces of 156*156 polycrystalline silicon wafers, the power of a set of battery components using this photovoltaic ribbon is 4W higher than that of components prepared using conventional solder ribbons, an increase of 1.6%.

The welding force of the welding tape is a tensile force required to pull the welding tape along the 45-degree direction of the battery sheet until the welding strip is peeled off from the battery sheet. Generally, the welding force requirement is greater than 3N, and the welding force of the welding belt of the embodiment is greater than 4N. fulfil requirements.

The fragmentation rate caused by the thermal expansion and contraction of the ribbon is less than two thousandths.

Embodiment 6: TU1 oxygen-free copper is selected as the conductive base tape 1, as shown in FIG. 8, having a groove set 2 along the length direction of the conductive base tape 1 on one wide surface thereof, and the two groove sets 2 are respectively set in width On both sides of the surface, each groove set 2 is composed of a plurality of continuous V-shaped grooves 3, between which a rectangular coupling platform 4 extending along the length of the conductive base tape 1 is left. The height of the coupling platform 4 is equal to the highest point of the V-shaped groove 3, the diameter of the largest inscribed circle of the coupling platform 4 is 0.12 mm, and the maximum length along the length of the conductive base tape 1 is 18 mm; the V of the V-shaped groove 3 The angle of the shape is 110°, the V-shaped grooves 3 are all parallel to the longitudinal direction of the conductive base tape 1; the depth h of the V-shaped groove 3 is 0.1 mm; the surface area of the coupling platform 4 occupies the area of the wide surface of the conductive base tape 1 50%.

On the same wide surface, there is also a groove 8 having an open circular shape, and the bottom surface of the groove 8 has a circular arc shape.

The solder layer was uniformly prepared by electroplating onto the above-mentioned conductive base tape 1 to prepare a highly efficient photovoltaic isomerized solder ribbon having a solder layer thickness of 10 mm.

After welding, the V-groove 3 of the strip has a depth of 0.068 mm.

Using 60 156*156 polycrystalline silicon wafers, the power of a set of battery components using this photovoltaic ribbon is 1.4W higher than that of a component prepared using a conventional solder ribbon, an increase of 0.56%.

The welding force of the welding tape is a tensile force required to pull the welding tape along the 45-degree direction of the battery sheet until the welding strip is peeled off from the battery sheet. Generally, the welding force requirement is greater than 3N, and the welding force of the welding belt of the embodiment is greater than 4N. fulfil requirements.

The fragmentation rate caused by the thermal expansion and contraction of the ribbon is less than two thousandths.

Embodiment 7: TU1 oxygen-free copper is selected as the conductive base tape 1, as shown in FIG. 9, having two groove sets 2 on one wide surface thereof, and one groove set 2 is composed of a plurality of continuous V-shaped grooves 3, and A groove set 2 is composed of a V-shaped groove 3, and a parallelogram-shaped coupling platform 4 is left between the different groove sets 2, and the height of the coupling platform 4 is equal to the highest point of the V-shaped groove 3, and is coupled. The maximum inscribed circle of the joint platform 4 has a diameter of 0.26 mm, and the front and rear ends of the coupling platform 4 have a V-shaped groove 3, and the left and right sides have no V-shaped groove 3, that is, the left and right sides of the coupling platform 4 extend to a wide surface. Both sides; the V-shaped groove 3 has a V-shaped angle of 110°, the V-shaped groove 3 is at an angle of 30 degrees with the longitudinal direction of the conductive base belt 1, and the parallelogram has two sides parallel to the direction of the V-shaped groove 3; the V-shaped groove 3 The depth h is 0.10 mm; the surface area ratio of the surface area of the coupling platform 4 to the wide surface of the conductive base tape 1 is 55%.

A tin-lead solder was uniformly prepared by electroplating onto the above-mentioned conductive base tape 1 to prepare a highly efficient photovoltaic isomerized solder ribbon having a solder layer thickness of 10 mm.

After welding, the V-groove 3 of the strip has a depth of 0.07 mm.

Using 60 pieces of 156*156 polycrystalline silicon wafers, the power of a set of battery components using this photovoltaic ribbon is 2W higher than that of components prepared using conventional solder ribbons, an increase of 0.8%.

The welding force of the welding tape is a tensile force required to pull the welding tape along the 45-degree direction of the battery sheet until the welding strip is peeled off from the battery sheet. Generally, the welding force requirement is greater than 3N, and the welding force of the welding belt of the embodiment is greater than 4N. fulfil requirements.

The fragmentation rate caused by the thermal expansion and contraction of the ribbon is less than one thousandth.

Embodiment 8: TU1 oxygen-free copper is selected as the conductive base tape 1, as shown in FIG. 10, having a V-shaped groove 3 on one wide surface thereof, and a parallelogram-shaped coupling platform 4 is left between adjacent V-shaped grooves 3, The height of the coupling platform 4 is equal to the highest point of the V-shaped groove 3, and the diameter of the largest inscribed circle of the coupling platform 4 is 1.6 mm, which is consistent with the width of the base tape, and the maximum length along the length of the conductive base tape 1 is 45mm, the V-shaped groove 3 is present at the front and rear ends of the coupling platform 4, and there are no V-shaped grooves 3 on the left and right sides, that is, the left and right sides of the coupling platform 4 extend to both side edges of the wide surface; the V-shaped angle of the V-shaped groove 3 At 75°, the V-shaped groove 3 is at an angle of 30 degrees to the longitudinal direction of the conductive base tape 1, and the parallelogram has two sides parallel to the direction of the V-shaped groove 3; the depth h of the V-shaped groove 3 is 0.14 mm.

A tin-lead solder is uniformly prepared onto the above-mentioned conductive base tape 1 by a coating method to prepare a highly efficient photovoltaic isomerized solder ribbon.

Using 60 pieces of 156*156 polycrystalline silicon wafers, a set of battery components was prepared using this photovoltaic ribbon, and the fragmentation rate caused by thermal expansion and contraction of the ribbon was less than one thousandth.

The welding force of the welding strip is the tensile force required to pull the welding strip along the 45-degree direction of the battery sheet until the strip is peeled off from the battery sheet. Generally, the welding force requirement is greater than 3N, and the welding strip welding force of the embodiment is greater than 5N. fulfil requirements.

Embodiment 9: TU1 oxygen-free copper is selected as the conductive base tape 1, as shown in FIG. 11, having a V-shaped groove 3 on one wide surface thereof, and a parallelogram-shaped coupling platform 4 is left between adjacent V-shaped grooves 3, The height of the coupling platform 4 is equal to the highest point of the V-shaped groove 3, the diameter of the largest inscribed circle of the coupling platform 4 is 0.25 mm, and the front and rear ends of the coupling platform 4 have V-shaped grooves 3, There is no V-shaped groove 3 on both sides, that is, the left and right sides of the coupling platform 4 extend to both side edges of the wide surface; the V-shaped groove 3 has a V-shaped angle of 120°, and the V-shaped groove 3 and the length of the conductive base belt 1 are 40 degrees. The angle, the parallelogram has two sides parallel to the direction of the V-shaped groove 3; the depth h of the V-shaped groove 3 is 0.10 mm; the surface area ratio of the surface area of the coupling platform 4 to the wide surface of the conductive base tape 1 is 42%.

The tin-lead solder was uniformly prepared by electroplating onto the above-mentioned conductive base tape 1 to prepare a highly efficient photovoltaic isomerized solder ribbon having a solder layer thickness of 8 mm.

After welding, the V-groove 3 of the strip has a depth of 0.071 mm.

Using 60 pieces of 156*156 polycrystalline silicon wafers, the power of a set of battery components using this photovoltaic ribbon is 3W higher than that of components prepared using conventional solder ribbons, an increase of 1.2%.

The welding force of the welding tape is a tensile force required to pull the welding tape along the 45-degree direction of the battery sheet until the welding strip is peeled off from the battery sheet. Generally, the welding force requirement is greater than 3N, and the welding force of the welding belt of the embodiment is greater than 4N. fulfil requirements.

The fragmentation rate caused by the thermal expansion and contraction of the ribbon is less than one thousandth.

Embodiment 10: TU1 oxygen-free copper is selected as the conductive base tape 1, as shown in FIG. 12, having a groove set 2 on one wide surface thereof, and each groove set 2 is composed of a plurality of continuous V-shaped grooves 3, different concaves A trapezoidal coupling platform 4 is left between the groove sets 2, the height of the coupling platform 4 is equal to the highest point of the V-shaped groove 3, and the diameter of the largest inscribed circle of the coupling platform 4 is 0.5 mm, along the conductive The maximum length of the base belt 1 in the longitudinal direction is 2.0 mm; the V-shaped groove 3 is present around the coupling platform 4; the V-shaped groove 3 has a V-shaped angle of 75°, and the V-shaped groove 3 and the length direction of the conductive base belt 1 are two The inclination angles are all 75 degrees; the depth h of the V-shaped groove 3 is 0.08 mm; the surface area ratio of the surface area of the coupling platform 4 to the wide surface of the conductive base tape 1 is 55%.

A tin-lead solder was uniformly prepared by electroplating onto the above-mentioned conductive base tape 1 to prepare a highly efficient photovoltaic isomerized solder ribbon having a solder layer thickness of 10 mm.

After welding, the V-groove 3 of the strip has a depth of 0.049 mm.

Using 60 pieces of 156*156 polycrystalline silicon wafers, the power of a set of battery components using this photovoltaic ribbon is 1.5W higher than that of components prepared using conventional solder ribbons, an increase of 0.6%.

The welding force of the welding tape is a tensile force required to pull the welding tape along the 45-degree direction of the battery sheet until the welding strip is peeled off from the battery sheet. Generally, the welding force requirement is greater than 3N, and the welding force of the welding belt of the embodiment is greater than 4N. fulfil requirements.

The fragmentation rate caused by the thermal expansion and contraction of the ribbon is less than one thousandth.

Embodiment 11: TU1 oxygen-free copper is selected as the conductive base tape 1, as shown in FIG. 13, having a V-shaped groove 3 on one wide surface thereof, and a coupling platform 4 is left between the adjacent V-shaped grooves 3, the coupling The height of the joint platform 4 is equal to the highest point of the V-shaped groove 3, the diameter of the largest inscribed circle of the coupling platform 4 is 0.5 mm, and the maximum length along the length direction of the conductive base belt 1 is 2.0 mm; the circumference of the coupling platform 4 There are V-shaped grooves 3; the V-shaped groove 3 has a V-shaped angle of 100°, and the V-shaped groove 3 and the length of the conductive base belt 1 have two inclination angles, one is a 45-degree angle and the other is a 90-degree angle; The depth h of the groove 3 is 0.09 mm; the surface area ratio of the surface area of the coupling platform 4 to the wide surface of the conductive base tape 1 is 82%.

A tin-lead solder was uniformly prepared by electroplating onto the above-mentioned conductive base tape 1 to prepare a highly efficient photovoltaic isomerized solder ribbon having a solder layer thickness of 10 mm.

The V-groove depth of the welded strip after welding is 0.057 mm.

Using 60 156*156 polycrystalline silicon wafers, the power of a set of battery components using this photovoltaic ribbon is 0.5 W higher than that of a component prepared using a conventional solder ribbon, an increase of 0.2%.

The welding force of the welding strip is the tensile force required to pull the welding strip along the 45-degree direction of the battery sheet until the strip is peeled off from the battery sheet. Generally, the welding force requirement is greater than 3N, and the welding strip welding force of the embodiment is greater than 5N. fulfil requirements.

The fragmentation rate caused by the thermal expansion and contraction of the ribbon is less than one thousandth.

1‧‧‧ Conductive baseband
2‧‧‧ Groove collection
3‧‧‧V-groove
4‧‧‧Coupling platform
5‧‧‧ solder layer
8‧‧‧ Groove

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the structure of a high performance photovoltaic isomerized ribbon of the present invention. 2 is a schematic view showing the structure of Embodiment 2 of the high-efficiency photovoltaic isomerized welding ribbon of the present invention. 3 is a schematic view showing the structure of Embodiment 3 of the high-efficiency photovoltaic isomerized solder ribbon of the present invention. 4 is a schematic structural view of Embodiment 4 of the high-efficiency photovoltaic isomerized ribbon of the present invention. Figure 5 is a schematic view showing the structure of Embodiment 5 of the high-efficiency photovoltaic isomerized ribbon of the present invention. Figure 6 is a cross-sectional view showing a groove set of Embodiment 5 of the present invention. Figure 7 is a cross-sectional view showing a coupling platform of Embodiment 5 of the present invention. Figure 8 is a schematic view showing the structure of Embodiment 6 of the high-efficiency photovoltaic isomerized ribbon of the present invention. Figure 9 is a schematic view showing the structure of Embodiment 7 of the high-efficiency photovoltaic isomerized ribbon of the present invention. Figure 10 is a schematic view showing the structure of Embodiment 8 of the high-efficiency photovoltaic isomerized ribbon of the present invention. Figure 11 is a schematic view showing the structure of Embodiment 9 of the high-efficiency photovoltaic isomerized ribbon of the present invention. Figure 12 is a schematic view showing the structure of Embodiment 10 of the high-efficiency photovoltaic isomerized ribbon of the present invention. Figure 13 is a schematic view showing the structure of the embodiment 11 of the high efficiency photovoltaic isomerized ribbon of the present invention.

3‧‧‧V-groove

4‧‧‧Coupling platform

Claims (19)

A high-efficiency photovoltaic isomerized soldering tape, comprising: a conductive base tape, the conductive base tape being a metal elemental or alloy material having two upper and lower wide surfaces, wherein the conductive base tape has at least one wide surface distributed a V-shaped groove and a coupling platform, wherein the depth h of the v-shaped groove is 0.055 mm<h<0.15 mm; the coupling platform is such that the diameter of the largest inscribed circle is not less than 0.10 mm along the length of the conductive base tape A platform with a maximum length of less than 50 mm. The high-efficiency photovoltaic isomerized solder ribbon of claim 1, wherein the conductive base tape has at least one wide surface composed of the V-shaped groove and the coupling platform. The high-efficiency photovoltaic isomerized soldering strip as described in claim 1, wherein the V-shaped groove is a linear V-shaped groove in which the intersection of the two oblique sides of the groove is a straight line. The high-efficiency photovoltaic isomerized soldering strip as described in claim 1, wherein the coupling platform is left between adjacent V-shaped grooves. The high-efficiency photovoltaic isomerized ribbon according to any one of claims 1 to 4, wherein the V-groove has a depth h of 0.06 mm h 0.12mm. The high-efficiency photovoltaic isomerized soldering strip according to any one of claims 1 to 4, wherein a diameter of a maximum inscribed circle of the coupling platform is greater than 0.20 mm, and the coupling platform is along the conductive The maximum length of the baseband in the longitudinal direction is less than 20 mm. The high-efficiency photovoltaic isomerized soldering strip of claim 6, wherein the maximum inscribed circle of the coupling platform has a diameter of not less than 0.25 mm, and the coupling platform is along the length of the conductive base tape. The maximum length is less than 5mm. The high-efficiency photovoltaic isomerized soldering tape according to claim 3, wherein the linear V-shaped groove and the conductive base tape have an inclination angle of 15° to 75° in the longitudinal direction. The high-efficiency photovoltaic isomerized soldering strip as described in claim 1, wherein the surface area of the coupling platform occupies 5% of the surface area of the conductive layer bandwidth. m 95%. The high-efficiency photovoltaic isomerized soldering strip as described in claim 9, wherein the surface area of the coupling platform occupies 25% of the area of the surface of the conductive base. m 75%. The high-efficiency photovoltaic isomerized ribbon as described in claim 3, wherein the linear V-shaped grooves are distributed in parallel on the same wide surface. The high efficiency photovoltaic isomerized ribbon of claim 3, wherein the linear V-shaped grooves are distributed across the same wide surface. The high-efficiency photovoltaic isomerized soldering strip as described in claim 1, wherein the coupling platform has a shape of a parallelogram or a trapezoid. The high-efficiency photovoltaic isomerized ribbon of any one of claims 1 to 3, wherein the V-shaped groove has a V-shaped angle between 75° and 138°. The high efficiency photovoltaic isomerized solder ribbon of any one of claims 1 to 4, wherein the coupling platform is not lower than a highest point of the V-shaped groove. The high-efficiency photovoltaic isomerized ribbon of claim 1, wherein the surface of the conductive tape is coated or plated with a solder layer. The high-efficiency photovoltaic isomerized ribbon of claim 16, wherein a transition layer is further formed between the solder layer and the conductive base tape. The high-efficiency photovoltaic isomerized ribbon of claim 1, wherein the surface of the conductive tape is coated or plated with a conductive reflective layer. The high-efficiency photovoltaic isomerized ribbon of claim 18, wherein a transition layer is further formed between the conductive reflective layer and the conductive base tape.