WO2015152464A1 - Injection-molded product having antenna pattern formed thereon and manufacturing method therefor - Google Patents

Injection-molded product having antenna pattern formed thereon and manufacturing method therefor Download PDF

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Publication number
WO2015152464A1
WO2015152464A1 PCT/KR2014/005590 KR2014005590W WO2015152464A1 WO 2015152464 A1 WO2015152464 A1 WO 2015152464A1 KR 2014005590 W KR2014005590 W KR 2014005590W WO 2015152464 A1 WO2015152464 A1 WO 2015152464A1
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WO
WIPO (PCT)
Prior art keywords
antenna pattern
injection
region
injection molding
injection molded
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Application number
PCT/KR2014/005590
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French (fr)
Korean (ko)
Inventor
김덕현
양현석
임병준
Original Assignee
(주)파트론
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Publication of WO2015152464A1 publication Critical patent/WO2015152464A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas

Definitions

  • the present invention relates to an injection molded product having an antenna pattern and a method of manufacturing the same.
  • an antenna is necessary for transmitting and receiving signals.
  • the antenna which is formed by being exposed to the outside of the wireless communication terminal, is conventionally implemented in a pattern form and is generally located inside or on the surface of the wireless communication terminal.
  • the antenna pattern when the antenna pattern is located at the outermost part of the wireless communication terminal, the antenna pattern may be damaged by an external shock or stimulus, and may be exposed to the outside to reduce the overall aesthetics.
  • the manufacturing method of the antenna pattern structure and manufacturing method has been increasing.
  • the problem to be solved by the present invention is to provide an injection molded article and a method of manufacturing the antenna pattern is formed that can be economically produced while ensuring a sufficient separation distance from the ground plane to ensure the performance of the antenna.
  • Another problem to be solved by the present invention is to provide an injection molded article and a method of manufacturing the antenna pattern is formed that does not damage durability and aesthetics while ensuring sufficient space to form an antenna pattern.
  • Another object of the present invention is to provide an injection molded article and a method of manufacturing the antenna pattern is formed that can fully implement the waterproof and dustproof function even if the antenna pattern is connected to the inside through the through hole.
  • An injection molded product having an antenna pattern according to the present invention for solving the above problems includes a first injection molded product including a first area and a second area including the first area, an antenna pattern formed on a surface of the first area, and A second injection molding is formed in the second region and covers the antenna pattern.
  • the surface of the second region may be formed stepped to be lower than the surface around the second region.
  • the second injection molded product may be formed to a thickness as high as the height of the step.
  • the second injection molded part is formed in the first region is formed to a thickness of the difference between the height of the step and the thickness of the antenna pattern protruding from the surface of the first region
  • the portion formed in the second region other than the first region may be formed to have a thickness equal to the height of the step.
  • the surface of the second injection molding may be formed without a step with the surface around the second area.
  • the first injection molded product may include one side and a side surface extending from the outside of the one side, and the first region may include at least a portion of the side surface and a portion of one side adjacent thereto.
  • the first injection molding may include an inner surface and an outer surface opposite to the inner surface, and the antenna pattern may be formed on the outer surface.
  • one end may be connected to the antenna pattern, the other end may further include a connection pattern formed to extend to the inner surface of the first injection.
  • the first injection molding includes at least one through hole, and the connection pattern may be formed to extend from the outer surface to the inner surface of the first injection through the inner peripheral surface of the through hole. .
  • the through hole may be formed in the first region.
  • the first injection molding may include at least one through hole, and the second injection molding may cover the opening on the outer surface side of the through hole to seal the through hole.
  • the second injection molding may protrude to the inner surface of the first injection through the through hole.
  • the first injection molded product may constitute at least a part of a case of the mobile communication terminal.
  • the antenna pattern may be formed on an outer surface that is opposite to an inner surface that is in contact with the inner space of the mobile communication terminal of the first injection.
  • the antenna pattern may be formed on a portion including an outer side of the outer surface forming the side of the mobile communication terminal.
  • the antenna pattern may be a plating layer bonded to the surface of the first region.
  • the first region may be formed of a resin material including an additive that is not plated and then changes to a property capable of plating when the laser is irradiated.
  • the additive may be a metal oxide having a spinel or similar structure.
  • the antenna pattern may be formed of a flexible circuit board.
  • the antenna pattern may be formed by printing with a conductive ink.
  • the second injection molded product may be formed in the second region by an insert injection method.
  • the first injection molded product may include at least one groove in the second area so as to widen the contact area with the second injection molded product.
  • the second injection molding may be formed of a resin material that can be melted at a lower temperature than the resin forming the first injection molding.
  • the first to the second injection molding is formed of a resin material including glass fiber (glass fiber), the resin material forming the second injection molding is formed on the resin material forming the first injection
  • the mixing ratio of glass fibers may be low.
  • the antenna pattern has a heat resistance at the melting temperature of the resin material forming the second injection molding can be maintained in combination with the first injection molding.
  • a method of manufacturing an injection molded product having an antenna pattern may include preparing a first injection molded product including a first area and a second area including the first area, and an antenna in the first area. Forming a pattern and forming a second injection molded product to cover the antenna pattern in the second region.
  • the step of preparing the first injection molding, the step of injecting the first injection molding with a resin material containing an additive which is a property that is not plated and then changed to a plating possible property when the laser is irradiated And forming the antenna pattern may include irradiating a laser to the first region and forming a plating layer on the first region to which the laser is irradiated.
  • the preparing of the first injection molding includes forming at least one through hole in the first injection molding, connected to the antenna pattern, and through an inner circumferential surface of the through hole.
  • the method may further include forming a connection pattern extending from an outer surface of the first injection molding to an inner side of the outer surface.
  • the step of forming the second injection molding, the step of placing a portion including the second region of the first injection molding inside the mold and injecting a resin material in the mold to the resin Ash may be injected into the through hole and the second injection may be injected.
  • the step of injecting the second injection molding the resin material is injected so as to penetrate the through hole so that the second injection molding projected to the inner surface of the first injection through the through hole. Can be formed.
  • the forming of the second injection molding the surface of the second injection molding may be formed without a step with the surface around the second area.
  • the forming of the second injection molding may include positioning a part including the second region of the first injection molding inside a mold and injecting a resin material into the mold. 2 may include the step of injection molding.
  • the surface of the second region is formed to be stepped lower than the surface of the periphery of the second region, the step of injecting the second injection, the part of the inner surface of the mold is Positioned to abut against a surface around a second region, to form an interior space in which a boundary opposite the surface of the second region extends steplessly from the surface around the second region and injecting a resin material into the interior space; It may include a step.
  • the first injection molded product may include one side and a side surface extending from the outside of the one side, and the first region may include at least a portion of the side surface and a portion of one side adjacent thereto.
  • An injection molded antenna pattern according to an embodiment of the present invention can be economically manufactured while ensuring a sufficient distance from the ground plane to secure the performance of the antenna.
  • the injection molding formed with the antenna pattern according to an embodiment of the present invention may ensure that durability and aesthetics are not damaged while securing sufficient space to form the antenna pattern.
  • the injection molding formed with the antenna pattern according to an embodiment of the present invention can fully realize the waterproof and dustproof function even if the antenna pattern is connected through the through hole.
  • FIG. 1 is a cross-sectional view of a first injection of an injection molded antenna pattern according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of a first injection molding product and an antenna pattern in which an antenna pattern is formed according to an embodiment of the present invention.
  • FIG 3 is a cross-sectional view of an injection molded antenna pattern according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view illustrating an example of a process of forming a second injection molded product having an antenna pattern formed thereon according to an exemplary embodiment of the present invention.
  • FIG. 5 is an exploded perspective view of an injection molded product having an antenna pattern according to an embodiment of the present invention.
  • FIG. 6 is a perspective view of an injection molded antenna pattern according to an embodiment of the present invention.
  • FIG. 7 is a flowchart illustrating a method of manufacturing an injection molded product having an antenna pattern according to an embodiment of the present invention.
  • the antenna pattern is for transmitting or receiving a signal for wireless communication, and may be a component mounted in a wireless communication terminal.
  • the antenna pattern is formed in a pattern having a specific shape, and the frequency of a signal that can be transmitted and received can be changed according to the shape of the pattern.
  • a pattern of any shape is shown for convenience of description, but the present invention is not limited to the shape of the pattern shown.
  • the injection molded antenna pattern may be part of a case of the electronic device.
  • the case may be an inner case that is not exposed to the outside because there is an outer case or a separate outer case exposed to the outside.
  • the electronic device may be a wireless communication terminal capable of wireless communication.
  • the wireless communication terminal may be, for example, a mobile phone, a smartphone, a tablet computer, a cellular phone, a media player, a navigation device, a headphone device or a wearable wireless communication device. However, it is not limited thereto.
  • the injection molded product may be a rear case that forms the back of the smartphone.
  • the rear case may form the back of the smartphone.
  • the smartphone is provided with a separate battery case detachable when the battery is replaced, the rear case may form a rear surface exposed to the outside when the battery case is removed.
  • the rear case may include a rear side and a side extending from the rear side.
  • the side may form a side that is exposed to the outside, such as a smartphone.
  • the rear case may be combined with the front display device to form an internal space.
  • Various components such as a communication device and a control unit may be accommodated in the internal space.
  • 1 is a cross-sectional view of a first injection of an injection molded antenna pattern according to an embodiment of the present invention.
  • 2 is a cross-sectional view of a first injection molding product and an antenna pattern in which an antenna pattern is formed according to an embodiment of the present invention.
  • 3 is a cross-sectional view of an injection molded antenna pattern according to an embodiment of the present invention.
  • 4 is a cross-sectional view illustrating an example of a process of forming a second injection molded product having an antenna pattern formed thereon according to an exemplary embodiment of the present invention.
  • An injection molded product having the antenna pattern 200 of the present invention includes a first injection molded product 100, an antenna pattern 200, and a second injection molded product 300.
  • the first injection molded product 100 includes one side and a side surface which is bent and extended from the one side.
  • the bent portion between one side and the side may be sharply bent, or may be bent in a smooth curved surface.
  • one side and side may not be clearly distinguished, but as a whole, the main part of one side and side may form an angle of 45 ° or more, and preferably may form an angle of about 90 °. .
  • the first injection molding 100 may be divided into two surfaces that are opposite to each other.
  • the first injection molded product 100 may be divided into an outer surface that is opposite to an inner surface that contacts the inner space.
  • the inner surface and the outer surface may each include one surface and a side surface as described above.
  • the first injection molding 100 may include a first region 110 and a second region 120.
  • the second region 120 includes the first region 110.
  • An antenna pattern 200 to be described later is formed on the surface of the first region 110, and a second injection molding 300 to be described later is formed in the second region 120.
  • the first region 110 and the second region 120 include at least a portion of the side surface of the first injection molding 100 and one surface adjacent thereto.
  • the surface of the second region 120 may be formed to be stepped with the surface around the second region 120.
  • the surface of the second region 120 may be formed lower by a predetermined height h2 than the surrounding surface. Therefore, in the first injection molding 100, the thickness h1-h2 of the second region 120 may be formed thinner by the height h2 of the step than the thickness h1 of the periphery of the second region.
  • At least one through hole 130 may be formed in the first region 110.
  • the through hole 130 may penetrate the inner surface and the outer surface of the first injection molded product 100.
  • At least one groove 140 may be formed in the second region 120.
  • the groove 140 may be formed to be recessed in the surface of the second region 120.
  • the groove 140 may increase the surface area of the second region 120. Accordingly, the area of the contact surface between the second region 120 and the second injection-molded product 300 to be described later can be widened, and the bonding force can be improved.
  • the antenna pattern 200 is formed on the surface of the first region 110.
  • the antenna pattern 200 may be formed of a conductive thin film.
  • the antenna pattern 200 may be formed of a plating layer, a flexible circuit board, a printed layer of conductive ink, or a conductive deposition layer.
  • the plating layer may be coupled to the surface of the first region 110 of the first injection molded product 100.
  • the antenna pattern 200 may be formed through a selective plating process on the surface of the first injection molded product 100.
  • the selective plating process is a process in which a plating layer is selectively formed only on a surface corresponding to a specific region of the surface, and the plating layer is not formed on the remaining surface.
  • the plating layer may be selectively formed only on the first region 110.
  • a masking method, a double injection method, or an LDS (Laser Direct Structuring) method may be used as the selective plating process.
  • the masking method forms masking for blocking the etching on the remaining portions except for portions to be plated. Thereafter, the surface is exposed to the etching solution or the like to selectively etch only the portion to form the plating layer. When the etched surface meets the plating solution, metal ions are reduced and a plating layer is formed.
  • the portions to be formed on the plating layer and the remaining portions are injected into different resin materials, respectively. Thereafter, the surface is selectively etched by exposing the surface to an etching solution or the like that reacts only with the portion to form the plating layer. When the etched surface meets the plating solution, metal ions are reduced and a plating layer is formed.
  • a plated body is formed of a resin material containing an additive that was initially unplated and then changed to a plateable property when the laser was irradiated.
  • the additive may be a metal oxide having a spinel or similar structure.
  • the additive may be copper chromite spinel (CuCr 2 O 4 ) and the like.
  • the antenna pattern 200 When the antenna pattern 200 is a plating layer, the antenna pattern 200 may protrude from the surface of the first region 110 by a predetermined thickness h3.
  • the antenna pattern 200 may be a conductive thin film formed on the flexible film.
  • the flexible film may be bent by an external force, and may be bonded to the surface of the first region 110 that is formed in a curved surface or is bent.
  • the conductive ink may be a material having a bonding force with the first region.
  • silver paste or the like may be used.
  • the antenna pattern 200 may be a combination or combination of two or more of the above-described plating layer, a flexible circuit board, a printing layer of a conductive ink or a conductive deposition layer.
  • the antenna pattern 200 may have a portion formed on one surface of the first injection molding 100 as a plating layer, another portion formed on the side thereof as a conductive deposition layer, and an overlap portion where the two portions are connected.
  • the antenna pattern 200 may extend from one surface of the first injection molding 100 to the side surface thereof.
  • the antenna pattern 200 is preferably formed on the outer surface when the first injection molded product 100 is a case.
  • the antenna pattern 200 may be a Planar Inverted F Anttena (PIFA).
  • PIFA Planar Inverted F Anttena
  • the ground plane of the antenna may be part of a circuit board that is typically housed inside a case. Therefore, it is desirable to be spaced apart from the inner space of the case as much as possible. To this end, it is advantageous that the area where the antenna pattern 200 can be formed is as wide as possible. Therefore, the antenna pattern 200 is advantageously formed to extend from one side of the first injection molding 100 to the side.
  • the antenna pattern 200 is advantageously formed on the outer surface than the inner surface of the first injection molding (100).
  • the injection molding formed with the antenna pattern 200 of the present invention may further include a connection pattern 210 connected to the antenna pattern 200.
  • the connection pattern 210 is transmitted to the communication unit of the wireless communication terminal transmitted and received by the antenna pattern 200.
  • one end of the connection pattern 210 may be connected to the antenna pattern 200 and the other end may form a terminal connected to the communication unit. Since the terminal of the communication unit is typically located in the inner space of the case, when the antenna pattern 200 is formed on the outer surface, the connection pattern 210 is formed to extend from the outer surface to the inner surface.
  • connection pattern 210 extends from the surface of the outer surface to the surface of the inner surface through the inner circumferential surface of the through hole 130. Specifically, one end of the connection pattern 210 is connected to a portion of the antenna pattern 200 formed on the outer surface, the other end forms a terminal on the inner surface.
  • connection pattern 210 may be formed of a plating layer, a flexible circuit board, a printed layer of conductive ink, or a conductive deposition layer.
  • connection pattern 210 may be connected to a part of the antenna pattern 200 and may not be clearly distinguished. In some cases, a portion including at least a portion of the antenna pattern 200 and the connection pattern 210 may be used to transmit and receive a signal.
  • the second injection molded product 300 is formed in the second region 120 and covers the antenna pattern 200.
  • the antenna pattern 200 may not be exposed to the outside by the second injection molding 300.
  • the antenna pattern 200 may be damaged by an external stimulus or shock.
  • the aesthetics may be dropped.
  • the antenna pattern 200 formed on the outer side surface of the first injection molded product 100 may be exposed to the outermost part of the electronic device such as a smartphone. This is a part that is not hidden even when a detachable outer case such as a separate battery case is assembled. Therefore, the antenna pattern 200 needs to be covered by a separate layer.
  • the surface of the second injection molded product 300 may be exposed to the outside. Therefore, it is preferable that the surface of the second injection molded material 300 and the surface of the first injection molded product 100 around the second region 120 are not easily distinguished.
  • the color and texture of the second injection molding 300 is preferably as close as possible to the surrounding surface.
  • the gap of the boundary portion between the second injection-molded product 300 and the surrounding surface be filled as narrowly or completely as possible.
  • the surface of the second injection-molded product 300 and the surface of the periphery may be smoothly formed without a step.
  • the second region 120 is formed stepped to be lower than other surrounding surfaces.
  • the second injection molded material 300 may be formed in the second area 120 to remove the step. That is, the surface of the second injection molded product 300 formed in the second region 120 may be formed without a step with the surface around the second region 120.
  • the second injection molded material 300 may be formed to have a thickness h2 corresponding to the height of the step. In such a case, the height of the surface around the second region 120 and the surface of the second injection molding 300 may be the same and there may be no step.
  • the first injection molded material 300 may be formed.
  • a step h3 corresponding to the degree of protrusion of the antenna pattern 200 may occur between the region 110 and its peripheral region. Therefore, the portion of the second injection molding 300 formed on the first region 110 and covering the antenna pattern 200 may have a height difference between the surface of the second region 120 and the surface of the peripheral region and the antenna pattern 200. It is preferable that the thickness is formed to be equal to the difference h2-h3 of the thickness protruding from the surface of the first region 110. Through this, the surface of the second injection molded product 300 may be smooth without a step as a whole, and may be smooth without a step with the surface around the second region 120.
  • the second injection molding 300 is formed so that the boundary between the second injection molding 300 and its surroundings is completely narrowed or completely filled, and the surface of the second injection molding 300 and the surrounding surface are smoothly formed without a step. May be formed by insert molding in the second region 120.
  • At least a part of the first injection molding 100 having the antenna pattern 200 formed in the first region 110 is located in the internal space 360 of the mold 350.
  • the at least part includes the second region 120.
  • a portion of the inner surface of the mold is positioned to abut the surface around the second region 120.
  • an inner space 360 may be formed between the surface of the second region 120, the stepped portion around the second region 120, and the inner surface of the mold.
  • the resin material is injected into the internal space 360 through the injection hole 353 of the mold to inject the second injection material 300.
  • the second injection molded product 300 may be closely coupled to the first injection molded product 100.
  • the boundary can be as narrow or completely filled as possible.
  • the surface of the second injection-molded product 300 may be formed smoothly without a step with the surface around it.
  • the insert injection process described above at least a part of the first injection molding 100 and the antenna pattern 200 are positioned inside the mold 350. Therefore, in the process of injecting the second injection molding 300, conditions such as temperature and pressure inside the mold may be maintained to such an extent that the first injection molding 100 and the antenna pattern 200 are not damaged.
  • the second injection material 300 may be a material capable of relatively low temperature injection compared to the first injection material (100).
  • a resin material having a smaller content of glass fibers may be used for the second injection molding material 300 than the first injection molding material 100.
  • the injection molding material optimized for low temperature injection may be used as the second injection molded product 300.
  • the second injection molding 300 may extend the side surface of the first injection molding 100.
  • a portion of the second injection molded material 300 extending from the end of the side of the first injection material 100 may be formed thicker than the other parts.
  • the thickness of the first injection molding 100, the antenna pattern 200, and the second injection molding 300 at the end of the side of the first injection molding 100 may be the same thickness.
  • the second injection molding 300 may block the through hole 130 formed in the first injection molding 100.
  • the resin material may be filled into the through hole 130 to block the through hole 130.
  • the second injection molded material 300 may be formed on the surface of the inner surface of the first injection molded material by injecting the resin material through the through hole 130. Accordingly, the second injection molding 300 may extend from the outer surface of the first injection molding 100 to the inner surface.
  • the second injection molding 300 may seal the through hole 130 to seal the internal space formed by the first injection molding 100. Therefore, the waterproof and dustproof functions of an electronic device such as a smartphone can be improved.
  • the second injection molding 300 may be filled in the groove 140 of the first injection molding 100. Accordingly, the area of the contact surface between the second region 120 and the second injection-molded product 300 to be described later can be widened, and the bonding force can be improved.
  • FIGS. 5 and 6 are exploded perspective and perspective views of an injection molded product having an antenna pattern having a pattern different from that of FIGS. 1 to 4.
  • the present invention is not limited by the shape of the antenna pattern.
  • FIG. 7 is a flowchart illustrating a method of manufacturing an injection molded product having an antenna pattern according to an embodiment of the present invention.
  • the method of manufacturing an injection molded product having an antenna pattern includes preparing a first injection molded product (S100), forming an antenna pattern (S200), and forming a second injection molded product (S300).
  • Preparing a first injection molding is preparing a first injection molding 100 including a first region 110 and a second region 120 including the first region 110.
  • Preparing the first injection molding (S100) may include the step of injecting the first injection molding 100 into a resin material including an additive which was a property of not being plated and then changed to a plating enabled property when a laser is irradiated. have.
  • preparing the first injection molding (S100) may include forming at least one through hole 130 in the first injection molding 100.
  • the through hole 130 may be formed in the process of injecting the first injection molded product 100.
  • the surface of the second region 120 of the first injection molding 100 in step S100 of preparing the first injection molding may be stepped to be lower than the surface of the periphery of the second region 120.
  • the first injection molded product 100 in preparing the first injection molded product (S100) may include one side and a side surface extending from an outer side of the one surface.
  • the first region 110 in which the antenna pattern 200 is formed may include at least a portion of a side surface of the first injection molded product 100 and a portion of one surface adjacent thereto.
  • the forming of the antenna pattern (S200) is a step of forming the antenna pattern 200 in the first region 110 of the first injection molded product 100.
  • Forming an antenna pattern may include irradiating a laser to the first region 110 and forming a plating layer on the first region 110 to which the laser is irradiated.
  • Forming the connection pattern 210 may be additionally performed.
  • the forming of the connection pattern 210 may be performed simultaneously with or in succession of forming the antenna pattern 200.
  • connection pattern 210 is connected to the antenna pattern 200, the connection pattern extending from the outer surface of the first injection molding 100 to the inner side of the outer surface of the first injection molding 100 through the inner circumferential surface of the through hole 130 Forming 210.
  • the second injection molding 300 is formed to cover the antenna pattern 200 in the second region 120.
  • the step of placing the part including the second region 120 of the first injection molded product 100 in the mold and the resin material is injected into the mold to allow the resin material to pass through the hole 130.
  • Injected into the inside and may include the step of injecting the second injection molding (300).
  • the step of injecting the second injection molding 300 the resin material is injected to penetrate the through hole 130 so that the second injection molding 300 through the through hole 130 to the inner surface of the first injection molding 100. It may be formed to protrude.
  • the surface of the second injection molding 300 may be formed without a step with the surface around the second region 120.
  • the step (S300) of forming the second injection molding may include positioning a portion including the second region 120 of the first injection molding 100 inside the mold and injecting a resin material into the mold to make the second injection molding ( 300) may be injected.
  • a part of the inner surface of the mold is positioned to abut the surface around the second region 120, so that a boundary facing the surface of the second region 120 is second.
  • the method may include forming an inner space extending from the surface around the region 120 without a step and injecting a resin material into the inner space.

Abstract

Disclosed is an injection-molded product having an antenna pattern formed thereon. The injection-molded product of the present invention having an antenna pattern formed thereon comprises: a first injection-molded product comprising a first region and a second region comprising the first region; an antenna pattern formed on the surface of the first region; and a second injection-molded product, formed in the second region, for covering the antenna pattern.

Description

안테나 패턴이 형성된 사출물 및 그 제조 방법Injection molded article with an antenna pattern and a method of manufacturing the same
본 발명은 안테나 패턴이 형성된 사출물 및 그 제조 방법에 관한 것이다. The present invention relates to an injection molded product having an antenna pattern and a method of manufacturing the same.
휴대용 전화기, 스마트폰, 태블릿 컴퓨터 등의 무선통신 단말기에서는 신호의 송수신을 위해 안테나가 반드시 필요하다. 무선통신 단말기가 소형화 및 박형화되는 추세에 따라 종래에 무선통신 단말기의 외부에 노출되어 형성되던 안테나는 패턴 형태로 구현되어 무선통신 단말기의 내부 또는 표면에 위치하는 것이 일반적이다.In wireless communication terminals such as portable telephones, smartphones, and tablet computers, an antenna is necessary for transmitting and receiving signals. In accordance with the trend of miniaturization and thinning of the wireless communication terminal, the antenna, which is formed by being exposed to the outside of the wireless communication terminal, is conventionally implemented in a pattern form and is generally located inside or on the surface of the wireless communication terminal.
안테나의 성능을 확보하기 위해서는 안테나 패턴과 접지면과의 이격 거리를 충분히 확보할 필요가 있다. 또한, 최적 형상의 패턴을 구현하기 위해서는 충분한 공간이 마련되어야 한다.In order to secure the performance of the antenna, it is necessary to secure a sufficient distance between the antenna pattern and the ground plane. In addition, sufficient space must be provided in order to realize an optimally shaped pattern.
그러나 안테나 패턴이 무선통신 단말기의 최외각에 위치하는 경우에는 안테나 패턴이 외부의 충격 또는 자극에 의해 손상될 수 있고, 외부에 노출되어 전체적인 미감을 떨어트릴 수 있다.However, when the antenna pattern is located at the outermost part of the wireless communication terminal, the antenna pattern may be damaged by an external shock or stimulus, and may be exposed to the outside to reduce the overall aesthetics.
또한, 최근의 통신 환경에서는 많은 대역의 주파수의 신호를 송수신하여야 하므로 하나의 무선통신 단말기에 탑재되는 안테나 패턴의 개수가 많아지고, 그 패턴의 형상도 복잡·정교해지고 있다. 또한, 최근의 무선통신 단말기에 다양한 기능이 부가됨에 따라 외부에 노출되는 전자 부품이 많아지고 있다. 이에 따라 안테나 패턴을 구현할 충분한 공간이 마련되기 어려운 실정이다.In addition, in recent communication environments, signals of many band frequencies have to be transmitted and received, so that the number of antenna patterns mounted in one wireless communication terminal increases, and the shape of the patterns is also complicated and sophisticated. In addition, as various functions are added to recent wireless communication terminals, electronic components exposed to the outside are increasing. Accordingly, it is difficult to provide enough space to implement the antenna pattern.
따라서 충분한 안테나 성능을 달성할 수 있으면서 높은 내구성과 미감을 만족시키고 그 제조 방법도 경제적인 안테나 패턴의 구조 및 제조 방법에 대한 요구가 증대되어 왔다.Therefore, while satisfying high durability and aesthetics while being able to achieve sufficient antenna performance, the manufacturing method of the antenna pattern structure and manufacturing method has been increasing.
본 발명이 해결하려는 과제는, 안테나의 성능을 확보하기 위해 접지면과 충분한 이격거리를 확보할 수 있으면서 경제적으로 제조될 수 있는 안테나 패턴이 형성된 사출물 및 그 제조 방법을 제공하는 것이다. The problem to be solved by the present invention is to provide an injection molded article and a method of manufacturing the antenna pattern is formed that can be economically produced while ensuring a sufficient separation distance from the ground plane to ensure the performance of the antenna.
본 발명이 해결하려는 다른 과제는, 안테나 패턴을 형성할 수 있는 충분한 공간을 확보하면서 내구성과 미감이 손상되지 않는 안테나 패턴이 형성된 사출물 및 그 제조 방법을 제공하는 것이다. Another problem to be solved by the present invention is to provide an injection molded article and a method of manufacturing the antenna pattern is formed that does not damage durability and aesthetics while ensuring sufficient space to form an antenna pattern.
본 발명이 해결하려는 또 다른 과제는, 관통홀을 통해 안테나 패턴이 내부로 연결되더라도 방수 및 방진 기능을 충분히 구현할 수 있는 안테나 패턴이 형성된 사출물 및 그 제조 방법을 제공하는 것이다.Another object of the present invention is to provide an injection molded article and a method of manufacturing the antenna pattern is formed that can fully implement the waterproof and dustproof function even if the antenna pattern is connected to the inside through the through hole.
상기 과제를 해결하기 위한 본 발명의 안테나 패턴이 형성된 사출물은, 제1 영역 및 상기 제1 영역을 포함하는 제2 영역을 포함하는 제1 사출물, 상기 제1 영역의 표면상에 형성되는 안테나 패턴 및 상기 제2 영역에 형성되고, 상기 안테나 패턴을 덮는 제2 사출물을 포함한다.An injection molded product having an antenna pattern according to the present invention for solving the above problems includes a first injection molded product including a first area and a second area including the first area, an antenna pattern formed on a surface of the first area, and A second injection molding is formed in the second region and covers the antenna pattern.
본 발명의 일 실시예에 있어서, 상기 제2 영역의 표면은 상기 제2 영역 주변의 표면보다 낮도록 단차지게 형성될 수 있다.In one embodiment of the present invention, the surface of the second region may be formed stepped to be lower than the surface around the second region.
본 발명의 일 실시예에 있어서, 상기 제2 사출물은 상기 단차의 높이만큼의 두께로 형성될 수 있다.In one embodiment of the present invention, the second injection molded product may be formed to a thickness as high as the height of the step.
본 발명의 일 실시예에 있어서, 상기 제2 사출물은 상기 제1 영역에 형성되는 부분은 상기 단차의 높이와 상기 안테나 패턴이 상기 제1 영역의 표면에서 돌출된 두께의 차만큼의 두께로 형성되고, 상기 제1 영역이 아닌 제2 영역에 형성된 부분은 상기 단차의 높이만큼의 두께로 형성될 수 있다.In one embodiment of the present invention, the second injection molded part is formed in the first region is formed to a thickness of the difference between the height of the step and the thickness of the antenna pattern protruding from the surface of the first region The portion formed in the second region other than the first region may be formed to have a thickness equal to the height of the step.
본 발명의 일 실시예에 있어서, 상기 제2 사출물의 표면은 상기 제2 영역 주변의 표면과 단차없이 형성될 수 있다.In one embodiment of the present invention, the surface of the second injection molding may be formed without a step with the surface around the second area.
본 발명의 일 실시예에 있어서, 상기 제1 사출물은 일면과 상기 일면의 외곽에서 연장되는 측면을 포함하고, 상기 제1 영역은 상기 측면의 적어도 일부 및 이와 인접한 일면의 일부를 포함할 수 있다.In one embodiment of the present invention, the first injection molded product may include one side and a side surface extending from the outside of the one side, and the first region may include at least a portion of the side surface and a portion of one side adjacent thereto.
본 발명의 일 실시예에 있어서, 상기 제1 사출물은 내부면과 상기 내부면의 반대면인 외부면을 포함하고, 상기 안테나 패턴은 상기 외부면 상에 형성될 수 있다.In one embodiment of the present invention, the first injection molding may include an inner surface and an outer surface opposite to the inner surface, and the antenna pattern may be formed on the outer surface.
본 발명의 일 실시예에 있어서, 일단은 상기 안테나 패턴과 연결되고, 타단은 상기 제1 사출물의 내부면까지 연장되어 형성되는 연결 패턴을 더 포함할 수 있다.In one embodiment of the present invention, one end may be connected to the antenna pattern, the other end may further include a connection pattern formed to extend to the inner surface of the first injection.
본 발명의 일 실시예에 있어서, 상기 제1 사출물은 적어도 하나의 관통홀을 포함하고, 상기 연결 패턴은 상기 관통홀의 내주면을 통해 상기 제1 사출물의 외부면에서 내부면까지 연장되어 형성될 수 있다.In one embodiment of the present invention, the first injection molding includes at least one through hole, and the connection pattern may be formed to extend from the outer surface to the inner surface of the first injection through the inner peripheral surface of the through hole. .
본 발명의 일 실시예에 있어서, 상기 관통홀은 상기 제1 영역에 형성될 수 있다.In one embodiment of the present invention, the through hole may be formed in the first region.
본 발명의 일 실시예에 있어서, 상기 제1 사출물은 적어도 하나의 관통홀을 포함하고, 상기 제2 사출물은 상기 관통홀의 외부면측 개구를 덮어 상기 관통홀을 밀폐할 수 있다.In one embodiment of the present invention, the first injection molding may include at least one through hole, and the second injection molding may cover the opening on the outer surface side of the through hole to seal the through hole.
본 발명의 일 실시예에 있어서, 상기 제2 사출물은 상기 관통홀을 통해 상기 제1 사출물의 내부면까지 돌출되어 형성될 수 있다.In one embodiment of the present invention, the second injection molding may protrude to the inner surface of the first injection through the through hole.
본 발명의 일 실시예에 있어서, 상기 제1 사출물은 이동통신 단말기의 케이스의 적어도 일부를 구성할 수 있다.In one embodiment of the present invention, the first injection molded product may constitute at least a part of a case of the mobile communication terminal.
본 발명의 일 실시예에 있어서, 상기 안테나 패턴은 상기 제1 사출물의 이동통신 단말기의 내부 공간과 맞닿는 내부면의 반대면인 외부면상에 형성될 수 있다.In one embodiment of the present invention, the antenna pattern may be formed on an outer surface that is opposite to an inner surface that is in contact with the inner space of the mobile communication terminal of the first injection.
본 발명의 일 실시예에 있어서, 상기 안테나 패턴은 상기 외부면 중 상기 이동통신 단말기의 측면을 이루는 외부 측면을 포함한 부분에 형성될 수 있다.In one embodiment of the present invention, the antenna pattern may be formed on a portion including an outer side of the outer surface forming the side of the mobile communication terminal.
본 발명의 일 실시예에 있어서, 상기 안테나 패턴은 상기 제1 영역의 표면과 결합된 도금층일 수 있다.In one embodiment of the present invention, the antenna pattern may be a plating layer bonded to the surface of the first region.
본 발명의 일 실시예에 있어서, 상기 제1 영역은 도금이 되지 않는 성질이었다가 레이저가 조사되면 도금이 가능한 성질로 변화하는 첨가물을 포함하는 수지재로 형성될 수 있다.In one embodiment of the present invention, the first region may be formed of a resin material including an additive that is not plated and then changes to a property capable of plating when the laser is irradiated.
본 발명의 일 실시예에 있어서, 상기 첨가물은 스피넬 또는 이와 유사한 구조를 가지는 금속 산화물일 수 있다.In one embodiment of the present invention, the additive may be a metal oxide having a spinel or similar structure.
본 발명의 일 실시예에 있어서, 상기 안테나 패턴은 연성 회로 기판으로 형성될 수 있다.In one embodiment of the present invention, the antenna pattern may be formed of a flexible circuit board.
본 발명의 일 실시예에 있어서, 상기 안테나 패턴은 도전성 잉크로 인쇄되어 형성될 수 있다.In one embodiment of the present invention, the antenna pattern may be formed by printing with a conductive ink.
본 발명의 일 실시예에 있어서, 상기 제2 사출물은 상기 제2 영역에 인서트 사출 방법으로 형성될 수 있다.In one embodiment of the present invention, the second injection molded product may be formed in the second region by an insert injection method.
본 발명의 일 실시예에 있어서, 상기 제1 사출물은 상기 제2 영역에 상기 제2 사출물과의 접촉하는 면적을 넓힐 수 있도록 적어도 하나의 홈을 포함할 수 있다.In one embodiment of the present invention, the first injection molded product may include at least one groove in the second area so as to widen the contact area with the second injection molded product.
본 발명의 일 실시예에 있어서, 상기 제2 사출물은 상기 제1 사출물을 형성하는 수지보다 낮은 온도에서 용융될 수 있는 수지재로 형성될 수 있다.In one embodiment of the present invention, the second injection molding may be formed of a resin material that can be melted at a lower temperature than the resin forming the first injection molding.
본 발명의 일 실시예에 있어서, 상기 제1 내지 제2 사출물은 유리 섬유(glass fiber)를 포함한 수지재로 형성되되, 상기 제2 사출물을 형성하는 수지재는 상기 제1 사출물을 형성하는 수지재에 비해 유리 섬유의 혼합 비율이 낮을 수 있다.In one embodiment of the present invention, the first to the second injection molding is formed of a resin material including glass fiber (glass fiber), the resin material forming the second injection molding is formed on the resin material forming the first injection The mixing ratio of glass fibers may be low.
본 발명의 일 실시예에 있어서, 상기 안테나 패턴은 상기 제2 사출물을 형성하는 수지재의 용융 온도에서 내열성을 가지고 상기 제1 사출물과의 결합이 유지될 수 있다.In one embodiment of the present invention, the antenna pattern has a heat resistance at the melting temperature of the resin material forming the second injection molding can be maintained in combination with the first injection molding.
상기 과제를 해결하기 위한 본 발명의 안테나 패턴이 형성된 사출물의 제조 방법은, 제1 영역 및 상기 제1 영역을 포함하는 제2 영역을 포함하는 제1 사출물을 준비하는 단계, 상기 제1 영역에 안테나 패턴을 형성하는 단계 및 상기 제2 영역에 상기 안테나 패턴을 덮도록 제2 사출물을 형성하는 단계를 포함한다.In order to solve the above problems, a method of manufacturing an injection molded product having an antenna pattern according to the present invention may include preparing a first injection molded product including a first area and a second area including the first area, and an antenna in the first area. Forming a pattern and forming a second injection molded product to cover the antenna pattern in the second region.
본 발명의 일 실시예에 있어서, 상기 제1 사출물을 준비하는 단계는, 도금이 되지 않는 성질이었다가 레이저가 조사되면 도금이 가능한 성질로 변하는 첨가물을 포함하는 수지재로 제1 사출물을 사출하는 단계를 포함하고, 상기 안테나 패턴을 형성하는 단계는, 상기 제1 영역에 레이저를 조사하는 단계 및 상기 레이저가 조사된 제1 영역에 도금층을 형성하는 단계를 포함할 수 있다.In one embodiment of the present invention, the step of preparing the first injection molding, the step of injecting the first injection molding with a resin material containing an additive which is a property that is not plated and then changed to a plating possible property when the laser is irradiated And forming the antenna pattern may include irradiating a laser to the first region and forming a plating layer on the first region to which the laser is irradiated.
본 발명의 일 실시예에 있어서, 상기 제1 사출물을 준비하는 단계는, 상기 제1 사출물에 적어도 하나의 관통홀을 형성하는 단계를 포함하고, 상기 안테나 패턴과 연결되고, 상기 관통홀의 내주면을 통해 상기 제1 사출물의 외부면에서 상기 외부면의 반대면인 내부까지 연장되는 연결 패턴을 형성하는 단계를 더 포함할 수 있다.In one embodiment of the present invention, the preparing of the first injection molding includes forming at least one through hole in the first injection molding, connected to the antenna pattern, and through an inner circumferential surface of the through hole. The method may further include forming a connection pattern extending from an outer surface of the first injection molding to an inner side of the outer surface.
본 발명의 일 실시예에 있어서, 상기 제2 사출물을 형성하는 단계는, 상기 제1 사출물 중 상기 제2 영역을 포함하는 부분을 금형 내부에 위치시키는 단계 및 상기 금형 내에 수지재를 주입하여 상기 수지재가 상기 관통홀 내부에 주입되며 상기 제2 사출물을 사출하는 단계를 포함할 수 있다.In one embodiment of the present invention, the step of forming the second injection molding, the step of placing a portion including the second region of the first injection molding inside the mold and injecting a resin material in the mold to the resin Ash may be injected into the through hole and the second injection may be injected.
본 발명의 일 실시예에 있어서, 상기 제2 사출물을 사출하는 단계는, 상기 수지재가 상기 관통홀을 관통하도록 주입되어 상기 제2 사출물이 상기 관통홀을 통해 상기 제1 사출물의 내부면까지 돌출되도록 형성할 수 있다.In one embodiment of the present invention, the step of injecting the second injection molding, the resin material is injected so as to penetrate the through hole so that the second injection molding projected to the inner surface of the first injection through the through hole. Can be formed.
본 발명의 일 실시예에 있어서, 상기 제2 사출물을 형성하는 단계는, 상기 제2 사출물의 표면을 상기 제2 영역 주변의 표면과 단차없이 형성할 수 있다.In one embodiment of the present invention, the forming of the second injection molding, the surface of the second injection molding may be formed without a step with the surface around the second area.
본 발명의 일 실시예에 있어서, 상기 제2 사출물을 형성하는 단계는, 상기 제1 사출물 중 상기 제2 영역을 포함하는 부분을 금형 내부에 위치시키는 단계 및 상기 금형 내에 수지재를 주입하여 상기 제2 사출물을 사출하는 단계를 포함 수 있다.In an embodiment of the present disclosure, the forming of the second injection molding may include positioning a part including the second region of the first injection molding inside a mold and injecting a resin material into the mold. 2 may include the step of injection molding.
본 발명의 일 실시예에 있어서, 상기 제2 영역의 표면은 상기 제2 영역의 주변의 표면보다 낮도록 단차지게 형성되고, 상기 제2 사출물을 사출하는 단계는, 상기 금형의 내면 중 일부가 상기 제2 영역 주변의 표면에 맞닿도록 위치하여, 제2 영역의 표면에 대향하는 경계가 상기 제2 영역 주변의 표면에서 단차 없이 연장되는 내부 공간을 형성하는 단계 및 상기 내부 공간에 수지재를 주입하는 단계를 포함할 수 있다.In one embodiment of the present invention, the surface of the second region is formed to be stepped lower than the surface of the periphery of the second region, the step of injecting the second injection, the part of the inner surface of the mold is Positioned to abut against a surface around a second region, to form an interior space in which a boundary opposite the surface of the second region extends steplessly from the surface around the second region and injecting a resin material into the interior space; It may include a step.
본 발명의 일 실시예에 있어서, 상기 제1 사출물은 일면과 상기 일면의 외곽에서 연장되는 측면을 포함하고, 상기 제1 영역은 상기 측면의 적어도 일부 및 이와 인접한 일면의 일부를 포함할 수 있다.In one embodiment of the present invention, the first injection molded product may include one side and a side surface extending from the outside of the one side, and the first region may include at least a portion of the side surface and a portion of one side adjacent thereto.
본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물은 안테나의 성능을 확보하기 위해 접지면과 충분한 이격거리를 확보할 수 있으면서 경제적으로 제조될 수 있다.An injection molded antenna pattern according to an embodiment of the present invention can be economically manufactured while ensuring a sufficient distance from the ground plane to secure the performance of the antenna.
또한, 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물은 안테나 패턴을 형성할 수 있는 충분한 공간을 확보하면서 내구성과 미감이 손상되지 않을 수 있다.In addition, the injection molding formed with the antenna pattern according to an embodiment of the present invention may ensure that durability and aesthetics are not damaged while securing sufficient space to form the antenna pattern.
또한, 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물은 관통홀을 통해 안테나 패턴이 내부로 연결되더라도 방수 및 방진 기능을 충분히 구현할 수 있다.In addition, the injection molding formed with the antenna pattern according to an embodiment of the present invention can fully realize the waterproof and dustproof function even if the antenna pattern is connected through the through hole.
또한, 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물의 제조 방법에 따르면, 상술한 효과를 가지는 안테나 패턴이 형성된 사출물을 경제적이고 간소한 방법으로 제조할 수 있다.In addition, according to the manufacturing method of the injection molded antenna pattern according to an embodiment of the present invention, it is possible to manufacture an injection molded antenna pattern having the above-described effect in an economical and simple method.
도 1은 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물의 제1 사출물의 단면도이다.1 is a cross-sectional view of a first injection of an injection molded antenna pattern according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물의 제1 사출물과 안테나 패턴의 단면도이다.2 is a cross-sectional view of a first injection molding product and an antenna pattern in which an antenna pattern is formed according to an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물의 단면도이다.3 is a cross-sectional view of an injection molded antenna pattern according to an embodiment of the present invention.
도 4는 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물의 제2 사출물을 형성하는 과정의 일 례를 설명하기 위한 단면도이다.4 is a cross-sectional view illustrating an example of a process of forming a second injection molded product having an antenna pattern formed thereon according to an exemplary embodiment of the present invention.
도 5는 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물의 분해 사시도이다.5 is an exploded perspective view of an injection molded product having an antenna pattern according to an embodiment of the present invention.
도 6는 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물의 사시도이다.6 is a perspective view of an injection molded antenna pattern according to an embodiment of the present invention.
도 7은 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물의 제조 방법을 설명하기 위한 순서도이다.7 is a flowchart illustrating a method of manufacturing an injection molded product having an antenna pattern according to an embodiment of the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 실시예들을 상세히 설명한다. 본 발명을 설명하는데 있어서, 해당 분야에 이미 공지된 기술 또는 구성에 대한 구체적인 설명을 부가하는 것이 본 발명의 요지를 불분명하게 할 수 있다고 판단되는 경우에는 상세한 설명에서 이를 일부 생략하도록 한다. 또한, 본 명세서에서 사용되는 용어들은 본 발명의 실시예들을 적절히 표현하기 위해 사용된 용어들로서, 이는 해당 분야의 관련된 사람 또는 관례 등에 따라 달라질 수 있다. 따라서, 본 용어들에 대한 정의는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다.Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention; In describing the present invention, if it is determined that adding specific descriptions of techniques or configurations already known in the art may make the gist of the present invention unclear, some of them will be omitted from the detailed description. In addition, terms used in the present specification are terms used to properly express the embodiments of the present invention, which may vary according to related persons or customs in the art. Therefore, the definitions of the terms should be made based on the contents throughout the specification.
본 발명의 안테나 패턴이 형성된 사출물에 관한 것이다. 본 발명에서 안테나 패턴은 무선 통신을 위한 신호를 송신하거나 수신하기 위한 것으로, 무선 통신 단말기에 장착되는 부품일 수 있다. 안테나 패턴은 특정한 형상의 패턴으로 형성되고, 상기 패턴의 형상에 따라 송수신할 수 있는 신호의 주파수 등이 변화될 수 있다. 첨부한 도면에는 설명의 편의성을 위해 임의의 형상의 패턴을 도시하였지만, 본 발명은 도시된 패턴의 형상에 제한되는 것은 아니다.It relates to an injection molded article formed with an antenna pattern of the present invention. In the present invention, the antenna pattern is for transmitting or receiving a signal for wireless communication, and may be a component mounted in a wireless communication terminal. The antenna pattern is formed in a pattern having a specific shape, and the frequency of a signal that can be transmitted and received can be changed according to the shape of the pattern. In the accompanying drawings, a pattern of any shape is shown for convenience of description, but the present invention is not limited to the shape of the pattern shown.
본 발명에서 안테나 패턴이 형성된 사출물은 전자 장치의 케이스의 일부일 수 있다. 구체적으로, 케이스는 외부로 노출되는 외부 케이스 또는 별도의 외부 케이스가 존재하여 외부로는 노출되지 않는 내부 케이스일 수 있다. 또한, 전자 장치는 무선 통신이 가능한 무선통신 단말기일 수 있다. 무선통신 단말기는, 예를 들어, 휴대 전화기, 스마트폰, 태블릿 컴퓨터, 셀룰러 전화기, 미디어 플레이어, 내비게이션 장치, 헤드폰 장치 또는 착용 가능한 무선 통신 장치 등이 될 수 있다. 그러나 이에 한정되는 것은 아니다.In the present invention, the injection molded antenna pattern may be part of a case of the electronic device. Specifically, the case may be an inner case that is not exposed to the outside because there is an outer case or a separate outer case exposed to the outside. Also, the electronic device may be a wireless communication terminal capable of wireless communication. The wireless communication terminal may be, for example, a mobile phone, a smartphone, a tablet computer, a cellular phone, a media player, a navigation device, a headphone device or a wearable wireless communication device. However, it is not limited thereto.
예를 들어, 전자 장치가 스마트폰 등의 이동통신 단말기인 경우, 사출물은 스마트폰 등의 후면을 이루는 후면 케이스(rear case)일 수 있다. 후면 케이스는 스마트폰 등의 후면을 이룰 수 있다. 또한, 스마트폰 등이 배터리 교체 시 분리 가능한 별도의 배터리 케이스를 구비하는 경우, 후면 케이스는 배터리 케이스를 분리한 경우 외부로 노출되는 후면을 이룰 수 있다.For example, when the electronic device is a mobile communication terminal such as a smartphone, the injection molded product may be a rear case that forms the back of the smartphone. The rear case may form the back of the smartphone. In addition, when the smartphone is provided with a separate battery case detachable when the battery is replaced, the rear case may form a rear surface exposed to the outside when the battery case is removed.
후면 케이스는 후면과 후면에서 연장되는 측면을 포함할 수 있다. 측면은 스마트폰 등의 외부로 노출되는 측면을 이룰 수 있다. 후면 케이스는 전면의 디스플레이 장치와 결합되어 내부 공간을 형성할 수 있다. 내부 공간에는 통신 장치 및 제어부 등 각종 부품이 수용될 수 있다.The rear case may include a rear side and a side extending from the rear side. The side may form a side that is exposed to the outside, such as a smartphone. The rear case may be combined with the front display device to form an internal space. Various components such as a communication device and a control unit may be accommodated in the internal space.
이하, 첨부한 도 1 내지 도 4를 참조하여, 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물에 대해 설명한다.Hereinafter, with reference to the accompanying Figures 1 to 4, it will be described with respect to the injection molded antenna pattern according to an embodiment of the present invention.
도 1은 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물의 제1 사출물의 단면도이다. 도 2는 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물의 제1 사출물과 안테나 패턴의 단면도이다. 도 3은 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물의 단면도이다. 도 4는 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물의 제2 사출물을 형성하는 과정의 일 례를 설명하기 위한 단면도이다.1 is a cross-sectional view of a first injection of an injection molded antenna pattern according to an embodiment of the present invention. 2 is a cross-sectional view of a first injection molding product and an antenna pattern in which an antenna pattern is formed according to an embodiment of the present invention. 3 is a cross-sectional view of an injection molded antenna pattern according to an embodiment of the present invention. 4 is a cross-sectional view illustrating an example of a process of forming a second injection molded product having an antenna pattern formed thereon according to an exemplary embodiment of the present invention.
본 발명의 안테나 패턴(200)이 형성된 사출물은 제1 사출물(100), 안테나 패턴(200) 및 제2 사출물(300)을 포함한다.An injection molded product having the antenna pattern 200 of the present invention includes a first injection molded product 100, an antenna pattern 200, and a second injection molded product 300.
도 1을 참조하면, 제1 사출물(100)은 일면과 상기 일면에서 절곡되며 연장되는 측면을 포함한다. 일면과 측면 사이의 절곡 부분은 예리하게 절곡되어 있을 수도 있고, 완곡하게 곡면을 이루며 절곡되어 있을 수도 있다. 완곡하게 절곡된 경우에는 일면과 측면이 명확하게 구분되지 않을 수 있으나, 전체적으로 일면과 측면의 주된 부분은 45° 이상의 각도를 형성할 수 있고, 바람직하게는 대략 90° 정도의 각도를 형성할 수 있다.Referring to FIG. 1, the first injection molded product 100 includes one side and a side surface which is bent and extended from the one side. The bent portion between one side and the side may be sharply bent, or may be bent in a smooth curved surface. When bent smoothly, one side and side may not be clearly distinguished, but as a whole, the main part of one side and side may form an angle of 45 ° or more, and preferably may form an angle of about 90 °. .
제1 사출물(100)은 서로 반대면인 두 면으로 구분될 수 있다. 제1 사출물(100)이 전자 장치 등의 케이스인 경우, 내부 공간과 맞닿는 내부면과 반대면인 외부면으로 구분될 수 있다. 내부면와 외부면은 각각 상술한 것과 같이 일면과 측면을 포함할 수 있다.The first injection molding 100 may be divided into two surfaces that are opposite to each other. When the first injection molded product 100 is a case such as an electronic device, the first injection molded product 100 may be divided into an outer surface that is opposite to an inner surface that contacts the inner space. The inner surface and the outer surface may each include one surface and a side surface as described above.
제1 사출물(100)은 제1 영역(110) 및 제2 영역(120)을 포함할 수 있다. 제2 영역(120)은 제1 영역(110)을 포함한다. 제1 영역(110)의 표면상에는 후술할 안테나 패턴(200)이 형성되고, 제2 영역(120)에는 후술할 제2 사출물(300)이 형성된다.The first injection molding 100 may include a first region 110 and a second region 120. The second region 120 includes the first region 110. An antenna pattern 200 to be described later is formed on the surface of the first region 110, and a second injection molding 300 to be described later is formed in the second region 120.
제1 영역(110)과 제2 영역(120)은 제1 사출물(100)의 측면의 적어도 일부 및 이와 인접한 일면을 포함한다.The first region 110 and the second region 120 include at least a portion of the side surface of the first injection molding 100 and one surface adjacent thereto.
제2 영역(120)의 표면은 제2 영역(120) 주변의 표면과 단차지게 형성될 수 있다. 제2 영역(120)의 표면이 주변의 표면보다 소정의 높이(h2)만큼 낮게 형성될 수 있다. 따라서 제1 사출물(100)에 있어서, 제2 영역(120)의 두께(h1-h2)는 제2 영역 주변(h1)의 두께보다 상기 단차의 높이(h2)만큼 얇게 형성될 수 있다.The surface of the second region 120 may be formed to be stepped with the surface around the second region 120. The surface of the second region 120 may be formed lower by a predetermined height h2 than the surrounding surface. Therefore, in the first injection molding 100, the thickness h1-h2 of the second region 120 may be formed thinner by the height h2 of the step than the thickness h1 of the periphery of the second region.
제1 영역(110)에는 적어도 하나의 관통홀(130)이 형성될 수 있다. 관통홀(130)은 제1 사출물(100)의 내부면과 외부면을 관통할 수 있다.At least one through hole 130 may be formed in the first region 110. The through hole 130 may penetrate the inner surface and the outer surface of the first injection molded product 100.
제2 영역(120)에는 적어도 하나의 홈(140)이 형성될 수 있다. 홈(140)은 제2 영역(120)의 표면에서 함몰된 형태로 형성될 수 있다. 홈(140)에 의해 제2 영역(120)의 표면적을 넓힐 수 있다. 이에 따라 제2 영역(120)과 후술할 제2 사출물(300)의 접촉면의 면적을 넓힐 수 있고, 결합력을 향상시킬 수 있다.At least one groove 140 may be formed in the second region 120. The groove 140 may be formed to be recessed in the surface of the second region 120. The groove 140 may increase the surface area of the second region 120. Accordingly, the area of the contact surface between the second region 120 and the second injection-molded product 300 to be described later can be widened, and the bonding force can be improved.
도 2를 참조하면, 안테나 패턴(200)은 제1 영역(110)의 표면상에 형성된다. 안테나 패턴(200)은 도전성의 박막으로 형성될 수 있다. 안테나 패턴(200)은 구체적으로, 도금층, 연성 회로 기판, 도전성 잉크의 인쇄층 또는 전도성 증착층 등으로 형성될 수 있다.Referring to FIG. 2, the antenna pattern 200 is formed on the surface of the first region 110. The antenna pattern 200 may be formed of a conductive thin film. Specifically, the antenna pattern 200 may be formed of a plating layer, a flexible circuit board, a printed layer of conductive ink, or a conductive deposition layer.
예를 들어 안테나 패턴(200)이 도금층인 경우, 상기 도금층은 제1 사출물(100)의 제1 영역(110)의 표면과 결합되어 있을 수 있다. 안테나 패턴(200)은 제1 사출물(100)의 표면상에서 선택적 도금 과정을 통해 형성될 수 있다. 선택적 도금 과정이란 표면 중 특정 영역에 해당하는 표면에만 선택적으로 도금층이 형성되고, 나머지 표면에는 도금층이 형성되지 않도록 하는 공정이다. 본 발명에서는 제1 영역(110)에만 선택적으로 도금층을 형성하는 것이 될 수 있다. 선택적 도금 과정은 마스킹 방법, 이중사출 방법 또는 LDS(Laser Direct Structuring) 방법 등이 사용될 수 있다.For example, when the antenna pattern 200 is a plating layer, the plating layer may be coupled to the surface of the first region 110 of the first injection molded product 100. The antenna pattern 200 may be formed through a selective plating process on the surface of the first injection molded product 100. The selective plating process is a process in which a plating layer is selectively formed only on a surface corresponding to a specific region of the surface, and the plating layer is not formed on the remaining surface. In the present invention, the plating layer may be selectively formed only on the first region 110. As the selective plating process, a masking method, a double injection method, or an LDS (Laser Direct Structuring) method may be used.
마스킹 방법은 도금층을 형성하려는 부분만 제외하고 나머지 부분에 에칭을 차단하는 마스킹을 형성한다. 이후, 표면을 에칭 용액 등에 노출시켜 도금층을 형성하려는 부분만 선택적으로 에칭한다. 에칭된 표면이 도금 용액과 만나면 금속 이온이 환원되며 도금층이 형성된다.The masking method forms masking for blocking the etching on the remaining portions except for portions to be plated. Thereafter, the surface is exposed to the etching solution or the like to selectively etch only the portion to form the plating layer. When the etched surface meets the plating solution, metal ions are reduced and a plating layer is formed.
이중사출 방법은 도금층을 형성하려는 부분과 나머지 부분을 다른 수지재로 각각 사출한다. 이후, 표면을 도금층을 형성하려는 부분에만 반응하는 에칭 용액 등에 노출시켜 선택적으로 에칭한다. 에칭된 표면이 도금 용액과 만나면 금속 이온이 환원되며 도금층이 형성된다.In the double injection method, the portions to be formed on the plating layer and the remaining portions are injected into different resin materials, respectively. Thereafter, the surface is selectively etched by exposing the surface to an etching solution or the like that reacts only with the portion to form the plating layer. When the etched surface meets the plating solution, metal ions are reduced and a plating layer is formed.
LDS 방법은 처음에는 도금이 되지 않는 성질이었다가 레이저가 조사되면 도금이 가능한 성질로 변화하는 첨가물을 포함하는 수지재로 피도금체를 형성한다. 상기 첨가물은 스피넬 또는 이와 유사한 구조를 가지는 금속 산화물일 수 있다. 예를 들어, 첨가물은 copper chromite spinel(CuCr2O4) 등이 사용될 수 있다. 이후, 도금층을 형성하려는 부분에만 레이저를 조사한다. 이 후, 피도금체의 표면이 도금 용액에 노출되면 레이저가 조사된 부분에만 선택적으로 도금층이 형성된다.In the LDS method, a plated body is formed of a resin material containing an additive that was initially unplated and then changed to a plateable property when the laser was irradiated. The additive may be a metal oxide having a spinel or similar structure. For example, the additive may be copper chromite spinel (CuCr 2 O 4 ) and the like. Thereafter, the laser is irradiated only to the portion where the plating layer is to be formed. Thereafter, when the surface of the plated body is exposed to the plating solution, the plating layer is selectively formed only on the portion to which the laser is irradiated.
안테나 패턴(200)이 도금층인 경우, 안테나 패턴(200)은 제1 영역(110)의 표면에서 소정의 두께(h3)만큼 돌출되어 형성될 수 있다.When the antenna pattern 200 is a plating layer, the antenna pattern 200 may protrude from the surface of the first region 110 by a predetermined thickness h3.
안테나 패턴(200)이 연성 회로 기판인 경우, 안테나 패턴(200)은 연성의 필름 상에 형성된 도전성 박막일 수 있다. 연성의 필름은 외력에 의해 휘어질 수 있어, 곡면으로 형성되어 있거나 꺾어져 형성되어 있는 제1 영역(110)의 표면에 밀착하여 결합할 수 있다.When the antenna pattern 200 is a flexible circuit board, the antenna pattern 200 may be a conductive thin film formed on the flexible film. The flexible film may be bent by an external force, and may be bonded to the surface of the first region 110 that is formed in a curved surface or is bent.
안테나 패턴(200)이 도전성 잉크의 인쇄층인 경우, 도전성 잉크는 제1 영영과 결합력이 있는 재질일 수 있다. 예를 들면, 은 페이스트(Ag paste) 등이 사용될 수 있다.When the antenna pattern 200 is a printed layer of conductive ink, the conductive ink may be a material having a bonding force with the first region. For example, silver paste or the like may be used.
또한, 안테나 패턴(200)은 상술한 도금층, 연성 회로 기판, 도전성 잉크의 인쇄층 또는 전도성 증착층 등이 둘 이상 조합 또는 결합된 것일 수도 있다. 예를 들어, 안테나 패턴(200)은 제1 사출물(100)의 일면에 형성된 일부분은 도금층이고, 측면에 형성된 다른 일부분은 전도성 증착층이며, 상기 두 부분이 연결되는 오버랩 부분이 존재할 수 있다.In addition, the antenna pattern 200 may be a combination or combination of two or more of the above-described plating layer, a flexible circuit board, a printing layer of a conductive ink or a conductive deposition layer. For example, the antenna pattern 200 may have a portion formed on one surface of the first injection molding 100 as a plating layer, another portion formed on the side thereof as a conductive deposition layer, and an overlap portion where the two portions are connected.
안테나 패턴(200)은 제1 사출물(100)의 일면에서 측면까지 연장되어 형성될 수 있다. 또한, 안테나 패턴(200)은 제1 사출물(100)이 케이스인 경우, 외부면에 형성되는 것이 바람직하다. 통상적으로 안테나 패턴(200)은 평면 역F 안테나(PIFA, Planar Inverted F Anttena) 일 수 있다. 이런 경우, 안테나 패턴(200)은 접지면과의 이격 거리가 클수록 성능이 우수한 경향이 있다. 안테나의 접지면은 통상적으로 케이스 내부에 수용되는 회로 기판의 일부가 될 수 있다. 따라서 케이스의 내부 공간과 최대한 이격되는 것이 바람직하다. 이를 위해서, 안테나 패턴(200)이 형성될 수 있는 영역이 최대한 넓은 것이 유리하다. 따라서 안테나 패턴(200)은 제1 사출물(100)의 일면에서 측면까지 연장되어 형성되는 것이 유리하다. 또한, 안테나 패턴(200)은 제1 사출물(100)의 내부면보다 외부면에 형성되는 것이 유리하다.The antenna pattern 200 may extend from one surface of the first injection molding 100 to the side surface thereof. In addition, the antenna pattern 200 is preferably formed on the outer surface when the first injection molded product 100 is a case. Typically, the antenna pattern 200 may be a Planar Inverted F Anttena (PIFA). In this case, the antenna pattern 200 tends to have better performance as the distance from the ground plane increases. The ground plane of the antenna may be part of a circuit board that is typically housed inside a case. Therefore, it is desirable to be spaced apart from the inner space of the case as much as possible. To this end, it is advantageous that the area where the antenna pattern 200 can be formed is as wide as possible. Therefore, the antenna pattern 200 is advantageously formed to extend from one side of the first injection molding 100 to the side. In addition, the antenna pattern 200 is advantageously formed on the outer surface than the inner surface of the first injection molding (100).
본 발명의 안테나 패턴(200)이 형성된 사출물은 안테나 패턴(200)과 연결되는 연결 패턴(210)을 더 포함할 수 있다. 연결 패턴(210)은 안테나 패턴(200)이 송수신하는 무선통신 단말기의 통신부로 전달한다. 구체적으로, 연결 패턴(210)의 일단은 안테나 패턴(200)과 연결되고 타단은 통신부와 연결되는 단자를 형성할 수 있다. 통신부 측의 단자는 통상적으로 케이스의 내부 공간에 위치하기 때문에, 안테나 패턴(200)이 외부면에 형성되는 경우 연결 패턴(210)은 외부면에서 내부면까지 연장되어 형성된다.The injection molding formed with the antenna pattern 200 of the present invention may further include a connection pattern 210 connected to the antenna pattern 200. The connection pattern 210 is transmitted to the communication unit of the wireless communication terminal transmitted and received by the antenna pattern 200. Specifically, one end of the connection pattern 210 may be connected to the antenna pattern 200 and the other end may form a terminal connected to the communication unit. Since the terminal of the communication unit is typically located in the inner space of the case, when the antenna pattern 200 is formed on the outer surface, the connection pattern 210 is formed to extend from the outer surface to the inner surface.
연결 패턴(210)은 관통홀(130)의 내주면을 통해 외부면의 표면에서 내부면의 표면까지 연장된다. 구체적으로 연결 패턴(210)의 일단은 외부면상에 형성된 안테나 패턴(200)의 일부와 연결되고, 타단은 내부면상에서 단자를 형성한다.The connection pattern 210 extends from the surface of the outer surface to the surface of the inner surface through the inner circumferential surface of the through hole 130. Specifically, one end of the connection pattern 210 is connected to a portion of the antenna pattern 200 formed on the outer surface, the other end forms a terminal on the inner surface.
연결 패턴(210)은 안테나 패턴(200)과 마찬가지로 도금층, 연성 회로 기판, 도전성 잉크의 인쇄층 또는 전도성 증착층 등으로 형성될 수 있다.Like the antenna pattern 200, the connection pattern 210 may be formed of a plating layer, a flexible circuit board, a printed layer of conductive ink, or a conductive deposition layer.
연결 패턴(210)은 안테나 패턴(200)의 일 부분과 연결되어 명확히 구분되지 않을 수 있다. 또한, 경우에 따라 안테나 패턴(200)과 연결 패턴(210)의 적어도 일부를 포함한 부분이 신호를 송수신하는데 사용될 수 있다.The connection pattern 210 may be connected to a part of the antenna pattern 200 and may not be clearly distinguished. In some cases, a portion including at least a portion of the antenna pattern 200 and the connection pattern 210 may be used to transmit and receive a signal.
도 3을 참조하면, 제2 사출물(300)은 제2 영역(120)에 형성되고, 안테나 패턴(200)을 덮는다. 제2 사출물(300)에 의해 안테나 패턴(200)은 외부로 노출되지 않을 수 있다. 안테나 패턴(200)은 외부의 자극이나 충격 등에 의해 손상될 수 있다. 또한, 안테나 패턴(200)이 외부로 노출되는 경우에는 미감을 떨어트릴 수 있다. 특히, 제1 사출물(100)의 외부 측면에 형성되는 안테나 패턴(200)은 스마트폰 등의 전자 장치 측면을 이루며 최외곽으로 노출될 수 있다. 이는 별도의 베터리 케이스 등 탈착식 최외부 케이스가 조립되는 경우에도 가려지지 않고 노출되는 부분이다. 따라서 안테나 패턴(200)은 별도의 층(layer)에 의해 가려질 필요가 있다.Referring to FIG. 3, the second injection molded product 300 is formed in the second region 120 and covers the antenna pattern 200. The antenna pattern 200 may not be exposed to the outside by the second injection molding 300. The antenna pattern 200 may be damaged by an external stimulus or shock. In addition, when the antenna pattern 200 is exposed to the outside, the aesthetics may be dropped. In particular, the antenna pattern 200 formed on the outer side surface of the first injection molded product 100 may be exposed to the outermost part of the electronic device such as a smartphone. This is a part that is not hidden even when a detachable outer case such as a separate battery case is assembled. Therefore, the antenna pattern 200 needs to be covered by a separate layer.
제2 사출물(300)의 표면은 외부로 노출될 수 있다. 따라서 제2 사출물(300)의 표면과 제2 영역(120) 주변의 제1 사출물(100)의 표면은 쉽게 구분되지 않도록 형성되는 것이 바람직하다.The surface of the second injection molded product 300 may be exposed to the outside. Therefore, it is preferable that the surface of the second injection molded material 300 and the surface of the first injection molded product 100 around the second region 120 are not easily distinguished.
이를 위해 제2 사출물(300)의 색깔 및 질감 등은 주변의 표면과 최대한 유사한 것이 바람직하다.To this end, the color and texture of the second injection molding 300 is preferably as close as possible to the surrounding surface.
또한, 제2 사출물(300)과 주변의 표면과의 경계 부분의 간극을 최대한 좁거나 완전히 매꿔지는 것이 바람직하다.In addition, it is preferable that the gap of the boundary portion between the second injection-molded product 300 and the surrounding surface be filled as narrowly or completely as possible.
또한, 제2 사출물(300)의 표면과 주변의 표면은 서로 단차없이 매끄럽게 형성되는 것이 바람직하다. 상술한 것과 같이, 제2 영역(120)은 주변의 다른 표면보다 낮도록 단차지게 형성된다. 제2 사출물(300)은 제2 영역(120)에 형성되어 상기 단차를 제거할 수 있다. 즉, 제2 영역(120)에 형성된 제2 사출물(300)의 표면은 제2 영역(120) 주변의 표면과 단차없이 형성될 수 있다. 이를 위해, 제2 사출물(300)은 상기 단차의 높이만큼의 두께(h2)로 형성될 수 있다. 그러한 경우, 제2 영역(120) 주변의 표면과 제2 사출물(300) 표면의 높이가 동일해지고 단차가 없을 수 있다.In addition, the surface of the second injection-molded product 300 and the surface of the periphery may be smoothly formed without a step. As described above, the second region 120 is formed stepped to be lower than other surrounding surfaces. The second injection molded material 300 may be formed in the second area 120 to remove the step. That is, the surface of the second injection molded product 300 formed in the second region 120 may be formed without a step with the surface around the second region 120. To this end, the second injection molded material 300 may be formed to have a thickness h2 corresponding to the height of the step. In such a case, the height of the surface around the second region 120 and the surface of the second injection molding 300 may be the same and there may be no step.
안테나 패턴(200)이 제1 영역(110)의 표면에서 돌출되어 형성되고 제2 사출물(300)의 두께가 상기의 단차의 높이(h2)만큼이 경우, 제2 사출물(300)에 있어서 제1 영역(110)과 그 주변 영역 사이에서 안테나 패턴(200)의 돌출 정도에 해당하는 단차(h3)가 발생할 수 있다. 따라서 제2 사출물(300) 중 제1 영역(110) 상에 형성되어 안테나 패턴(200)을 덮는 부분은 제2 영역(120)의 표면과 주변 영역의 표면의 단차의 높이와 안테나 패턴(200)이 제1 영역(110)의 표면에서 돌출된 두께의 차(h2-h3)만큼의 두께로 형성되는 것이 바람직하다. 이를 통해, 제2 사출물(300)의 표면이 전체적으로 단차없이 매끄러울 수 있으며, 제2 영역(120) 주변의 표면과도 단차없이 매끄러울 수 있다.When the antenna pattern 200 is formed to protrude from the surface of the first region 110 and the thickness of the second injection molded product 300 is equal to the height h2 of the step, the first injection molded material 300 may be formed. A step h3 corresponding to the degree of protrusion of the antenna pattern 200 may occur between the region 110 and its peripheral region. Therefore, the portion of the second injection molding 300 formed on the first region 110 and covering the antenna pattern 200 may have a height difference between the surface of the second region 120 and the surface of the peripheral region and the antenna pattern 200. It is preferable that the thickness is formed to be equal to the difference h2-h3 of the thickness protruding from the surface of the first region 110. Through this, the surface of the second injection molded product 300 may be smooth without a step as a whole, and may be smooth without a step with the surface around the second region 120.
상술한 것과 같이, 제2 사출물(300)과 그 주변의 경계가 최대한 좁거나 완전히 매꿔지고, 제2 사출물(300)의 표면과 주변의 표면이 서로 단차없이 매끄럽게 형성되기 위해서 제2 사출물(300)은 제2 영역(120)에 인서트 사출(insert molding)에 의해 형성될 수 있다.As described above, the second injection molding 300 is formed so that the boundary between the second injection molding 300 and its surroundings is completely narrowed or completely filled, and the surface of the second injection molding 300 and the surrounding surface are smoothly formed without a step. May be formed by insert molding in the second region 120.
구체적으로 도 4를 참조하면, 제1 영역(110)에 안테나 패턴(200)이 형성된 제1 사출물(100)의 적어도 일부가 금형(350)의 내부 공간(360)에 위치한다. 상기 적어도 일부는 제2 영역(120)을 포함한다. 그 후, 금형의 내면 중 일부가 제2 영역(120) 주변의 표면에 맞닿도록 위치한다. 이에 의해서 제2 영역(120)의 표면, 제2 영역(120)과 주변의 단차부 및 금형의 내면에 의해 둘러사이는 내부 공간(360)이 형성될 수 있다. 금형의 주입구(353)를 통해 상기 내부 공간(360)에 수지재가 주입되어 제2 사출물(300)이 사출된다. 이에 의해 제2 사출물(300)은 제1 사출물(100)과 밀접하게 결합될 수 있다. 이에 따라 경계가 최대한 좁거나 완전히 매꿔질 수 있다. 또한, 이에 의해 제2 사출물(300)의 표면이 그 주변의 표면과 서로 단차 없이 매끄럽게 형성될 수 있다.In detail, referring to FIG. 4, at least a part of the first injection molding 100 having the antenna pattern 200 formed in the first region 110 is located in the internal space 360 of the mold 350. The at least part includes the second region 120. Thereafter, a portion of the inner surface of the mold is positioned to abut the surface around the second region 120. As a result, an inner space 360 may be formed between the surface of the second region 120, the stepped portion around the second region 120, and the inner surface of the mold. The resin material is injected into the internal space 360 through the injection hole 353 of the mold to inject the second injection material 300. As a result, the second injection molded product 300 may be closely coupled to the first injection molded product 100. As a result, the boundary can be as narrow or completely filled as possible. In addition, the surface of the second injection-molded product 300 may be formed smoothly without a step with the surface around it.
상술한 인서트 사출 과정에서 제1 사출물(100)의 적어도 일부와 안테나 패턴(200)이 금형(350) 내부에 위치한다. 따라서 제2 사출물(300)의 사출하는 과정에서 금형 내부의 온도 및 압력 등의 조건은 제1 사출물(100)과 안테나 패턴(200)이 손상되지 않는 정도로 유지되는 것이 바람직하다.In the insert injection process described above, at least a part of the first injection molding 100 and the antenna pattern 200 are positioned inside the mold 350. Therefore, in the process of injecting the second injection molding 300, conditions such as temperature and pressure inside the mold may be maintained to such an extent that the first injection molding 100 and the antenna pattern 200 are not damaged.
이를 위해, 제2 사출물(300)은 제1 사출물(100)에 비해 상대적을 저온 사출이 가능한 재질이 사용될 수 있다. 예를 들어, 제2 사출물(300)은 제1 사출물(100)에 비해 유리 섬유(glass fiber)의 함유량이 적은 수지재가 사용될 수 있다. 또한, 제2 사출물(300)은 저온 사출에 최적화된 사출 수지재가 사용될 수 있다.To this end, the second injection material 300 may be a material capable of relatively low temperature injection compared to the first injection material (100). For example, a resin material having a smaller content of glass fibers may be used for the second injection molding material 300 than the first injection molding material 100. In addition, the injection molding material optimized for low temperature injection may be used as the second injection molded product 300.
제2 사출물(300)은 제1 사출물(100)의 측면을 연장할 수 있다. 제1 사출물(100)의 측면의 끝단에서 연장되어 형성되는 제2 사출물(300)의 부분은 다른 부분보다 두껍게 형성될 수 있다. 구체적으로, 제1 사출물(100)의 측면의 끝단에서의 제1 사출물(100), 안테나 패턴(200) 및 제2 사출물(300)의 두께의 합과 동일한 두께로 형성될 수 있다.The second injection molding 300 may extend the side surface of the first injection molding 100. A portion of the second injection molded material 300 extending from the end of the side of the first injection material 100 may be formed thicker than the other parts. In detail, the thickness of the first injection molding 100, the antenna pattern 200, and the second injection molding 300 at the end of the side of the first injection molding 100 may be the same thickness.
제2 사출물(300)은 제1 사출물(100)에 형성된 관통홀(130)을 막을 수 있다. 구체적으로, 제2 사출물(300)을 사출하는 과정에서 수지재가 관통홀(130) 내부로 충진되어 관통홀(130)을 막을 수 있다. 또한, 제2 사출물(300)은 수지재가 관통홀(130)을 관통하도록 주입되어 제1 사출물(100)의 내부면의 표면상에도 형성될 수 있다. 이에 따라 제2 사출물(300)은 제1 사출물(100)의 외부면에서 내부면까지 연장되어 형성될 수 있다.The second injection molding 300 may block the through hole 130 formed in the first injection molding 100. In detail, in the process of injecting the second injection molding material 300, the resin material may be filled into the through hole 130 to block the through hole 130. In addition, the second injection molded material 300 may be formed on the surface of the inner surface of the first injection molded material by injecting the resin material through the through hole 130. Accordingly, the second injection molding 300 may extend from the outer surface of the first injection molding 100 to the inner surface.
제2 사출물(300)이 관통홀(130)을 막으면서 제1 사출물(100)이 형성하는 내부 공간을 밀폐할 수 있다. 따라서 스마트폰 등의 전자 장치의 방수 및 방진 기능을 향상시킬 수 있다.The second injection molding 300 may seal the through hole 130 to seal the internal space formed by the first injection molding 100. Therefore, the waterproof and dustproof functions of an electronic device such as a smartphone can be improved.
제2 사출물(300)은 제1 사출물(100)의 홈(140)의 내부에 충진될 수 있다. 이에 따라 제2 영역(120)과 후술할 제2 사출물(300)의 접촉면의 면적을 넓힐 수 있고, 결합력을 향상시킬 수 있다.The second injection molding 300 may be filled in the groove 140 of the first injection molding 100. Accordingly, the area of the contact surface between the second region 120 and the second injection-molded product 300 to be described later can be widened, and the bonding force can be improved.
도 5 및 도 6은 도 1 내지 도 4와는 다른 형상의 패턴을 가지는 안테나 패턴이 형성된 사출물의 분해 사시도와 사시도이다. 상술한 것과 같이, 본 발명은 안테나 패턴의 형상에 의해 제한되는 것이 아니다.5 and 6 are exploded perspective and perspective views of an injection molded product having an antenna pattern having a pattern different from that of FIGS. 1 to 4. As mentioned above, the present invention is not limited by the shape of the antenna pattern.
이하, 도 7을 참조하여 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물의 제조 방법에 대해서 설명한다. 도 7은 본 발명의 일 실시예에 따른 안테나 패턴이 형성된 사출물의 제조 방법을 설명하기 위한 순서도이다.Hereinafter, a method of manufacturing an injection molded product having an antenna pattern according to an embodiment of the present invention will be described with reference to FIG. 7. 7 is a flowchart illustrating a method of manufacturing an injection molded product having an antenna pattern according to an embodiment of the present invention.
설명의 편의성을 위해서 도 7을 참조하여 안테나 패턴이 형성된 사출물의 제조 방법을 설명하는데 있어서, 도 1 내지 도 6를 참조하여 상술한 안테나 패턴(200)이 형성된 사출물의 설명과 중복되는 내용 중 일부는 생략하도록 한다.For convenience of description, in describing a method of manufacturing an injection molded product having an antenna pattern with reference to FIG. 7, some of the contents overlapping with the description of the injection molded product including the antenna pattern 200 described above with reference to FIGS. 1 to 6 will be described. Omit it.
도 7을 참조하면, 안테나 패턴이 형성된 사출물의 제조 방법은 제1 사출물을 준비하는 단계(S100), 안테나 패턴을 형성하는 단계(S200) 및 제2 사출물을 형성하는 단계(S300)를 포함한다.Referring to FIG. 7, the method of manufacturing an injection molded product having an antenna pattern includes preparing a first injection molded product (S100), forming an antenna pattern (S200), and forming a second injection molded product (S300).
상기의 단계들은 상기 나열된 순서로 수행되는 것이 바람직하다.The above steps are preferably performed in the order listed above.
제1 사출물을 준비하는 단계(S100)는 제1 영역(110) 및 제1 영역(110)을 포함하는 제2 영역(120)을 포함하는 제1 사출물(100)을 준비하는 단계이다.Preparing a first injection molding (S100) is preparing a first injection molding 100 including a first region 110 and a second region 120 including the first region 110.
제1 사출물을 준비하는 단계(S100)는, 도금이 되지 않는 성질이었다가 레이저가 조사되면 도금이 가능한 성질로 변하는 첨가물을 포함하는 수지재로 제1 사출물(100)을 사출하는 단계를 포함할 수 있다.Preparing the first injection molding (S100) may include the step of injecting the first injection molding 100 into a resin material including an additive which was a property of not being plated and then changed to a plating enabled property when a laser is irradiated. have.
또한, 제1 사출물을 준비하는 단계(S100)는, 제1 사출물(100)에 적어도 하나의 관통홀(130)을 형성하는 단계를 포함할 수 있다. 관통홀(130)은 제1 사출물(100)을 사출하는 과정에서 형성될 수 있다.In addition, preparing the first injection molding (S100) may include forming at least one through hole 130 in the first injection molding 100. The through hole 130 may be formed in the process of injecting the first injection molded product 100.
제1 사출물을 준비하는 단계(S100)에서의 제1 사출물(100)의 제2 영역(120)의 표면은 상기 제2 영역(120)의 주변의 표면보다 낮도록 단차지게 형성될 수 있다.The surface of the second region 120 of the first injection molding 100 in step S100 of preparing the first injection molding may be stepped to be lower than the surface of the periphery of the second region 120.
제1 사출물을 준비하는 단계(S100)에서의 제1 사출물(100)은 일면과 상기 일면의 외곽에서 연장되는 측면을 포함할 수 있다. 또한, 안테나 패턴(200)을 형성하는 단계에서 안테나 패턴(200)이 형성되는 제1 영역(110)은 제1 사출물(100)의 측면의 적어도 일부 및 이와 인접한 일면의 일부를 포함할 수 있다.The first injection molded product 100 in preparing the first injection molded product (S100) may include one side and a side surface extending from an outer side of the one surface. In addition, in the forming of the antenna pattern 200, the first region 110 in which the antenna pattern 200 is formed may include at least a portion of a side surface of the first injection molded product 100 and a portion of one surface adjacent thereto.
안테나 패턴을 형성하는 단계(S200)는, 제1 사출물(100)의 제1 영역(110)에 안테나 패턴(200)을 형성하는 단계이다.The forming of the antenna pattern (S200) is a step of forming the antenna pattern 200 in the first region 110 of the first injection molded product 100.
안테나 패턴을 형성하는 단계(S200)는, 제1 영역(110)에 레이저를 조사하는 단계 및 레이저가 조사된 제1 영역(110)에 도금층을 형성하는 단계를 포함할 수 있다.Forming an antenna pattern (S200) may include irradiating a laser to the first region 110 and forming a plating layer on the first region 110 to which the laser is irradiated.
연결 패턴(210)을 형성하는 단계가 추가적으로 수행될 수 있다. 연결 패턴(210)을 형성하는 단계는 안테나 패턴(200)을 형성하는 단계와 동시에 또는 연달아서 수행될 수 있다.Forming the connection pattern 210 may be additionally performed. The forming of the connection pattern 210 may be performed simultaneously with or in succession of forming the antenna pattern 200.
연결 패턴(210)을 형성하는 단계는 안테나 패턴(200)과 연결되고, 관통홀(130)의 내주면을 통해 제1 사출물(100)의 외부면에서 외부면의 반대면인 내부까지 연장되는 연결 패턴(210)을 형성하는 단계를 포함한다.Forming the connection pattern 210 is connected to the antenna pattern 200, the connection pattern extending from the outer surface of the first injection molding 100 to the inner side of the outer surface of the first injection molding 100 through the inner circumferential surface of the through hole 130 Forming 210.
제2 사출물을 형성하는 단계(S300)는 제2 영역(120)에 상기 안테나 패턴(200)을 덮도록 제2 사출물(300)을 형성하는 단계이다.In the forming of the second injection molding (S300), the second injection molding 300 is formed to cover the antenna pattern 200 in the second region 120.
제2 사출물을 형성하는 단계(S300)는, 제1 사출물(100) 중 제2 영역(120)을 포함하는 부분을 금형 내부에 위치시키는 단계 및 금형 내에 수지재를 주입하여 수지재가 관통홀(130) 내부에 주입되며 제2 사출물(300)을 사출하는 단계를 포함할 수 있다.In the forming of the second injection molded product (S300), the step of placing the part including the second region 120 of the first injection molded product 100 in the mold and the resin material is injected into the mold to allow the resin material to pass through the hole 130. Injected into the inside and may include the step of injecting the second injection molding (300).
또한, 제2 사출물(300)을 사출하는 단계는, 수지재가 관통홀(130)을 관통하도록 주입되어 제2 사출물(300)이 관통홀(130)을 통해 제1 사출물(100)의 내부면까지 돌출되도록 형성할 수 있다.In addition, the step of injecting the second injection molding 300, the resin material is injected to penetrate the through hole 130 so that the second injection molding 300 through the through hole 130 to the inner surface of the first injection molding 100. It may be formed to protrude.
또한, 제2 사출물을 형성하는 단계(S300)는, 제2 사출물(300)의 표면을 제2 영역(120) 주변의 표면과 단차없이 형성할 수 있다.In addition, in the step S300 of forming the second injection molding, the surface of the second injection molding 300 may be formed without a step with the surface around the second region 120.
또한, 제2 사출물을 형성하는 단계(S300)는, 제1 사출물(100) 중 제2 영역(120)을 포함하는 부분을 금형 내부에 위치시키는 단계 및 금형 내에 수지재를 주입하여 제2 사출물(300)을 사출하는 단계를 포함할 수 있다.In addition, the step (S300) of forming the second injection molding may include positioning a portion including the second region 120 of the first injection molding 100 inside the mold and injecting a resin material into the mold to make the second injection molding ( 300) may be injected.
또한, 제2 사출물(300)을 사출하는 단계는, 금형의 내면 중 일부가 제2 영역(120) 주변의 표면에 맞닿도록 위치하여, 제2 영역(120)의 표면에 대향하는 경계가 제2 영역(120) 주변의 표면에서 단차 없이 연장되는 내부 공간을 형성하는 단계 및 내부 공간에 수지재를 주입하는 단계를 포함할 수 있다.In addition, in the step of injecting the second injection molding 300, a part of the inner surface of the mold is positioned to abut the surface around the second region 120, so that a boundary facing the surface of the second region 120 is second. The method may include forming an inner space extending from the surface around the region 120 without a step and injecting a resin material into the inner space.
이상, 본 발명의 안테나 패턴이 형성된 사출물의 실시예들에 대해 설명하였다. 본 발명은 상술한 실시예 및 첨부한 도면에 한정되는 것은 아니며, 본 발명이 속하는 분야에서 통상의 지식을 가진 자의 관점에서 다양한 수정 및 변형이 가능할 것이다. 따라서 본 발명의 범위는 본 명세서의 특허청구범위뿐만 아니라 이 특허청구범위와 균등한 것들에 의해 정해져야 한다.In the above, embodiments of the injection molded article formed with the antenna pattern of the present invention have been described. The present invention is not limited to the above-described embodiment and the accompanying drawings, and various modifications and variations will be possible in view of those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be defined not only by the claims of the present specification but also by the equivalents of the claims.

Claims (34)

  1. 제1 영역 및 상기 제1 영역을 포함하는 제2 영역을 포함하는 제1 사출물;A first injection product including a first area and a second area including the first area;
    상기 제1 영역의 표면상에 형성되는 안테나 패턴; 및An antenna pattern formed on a surface of the first region; And
    상기 제2 영역에 형성되고, 상기 안테나 패턴을 덮는 제2 사출물을 포함하는 안테나 패턴이 형성된 사출물.An injection molded product having an antenna pattern formed in the second area and including a second injection molded product covering the antenna pattern.
  2. 제1 항에 있어서,According to claim 1,
    상기 제2 영역의 표면은 상기 제2 영역 주변의 표면보다 낮도록 단차지게 형성되는 안테나 패턴이 형성된 사출물.And an antenna pattern on which the surface of the second region is formed to be stepped so as to be lower than the surface around the second region.
  3. 제2 항에 있어서,The method of claim 2,
    상기 제2 사출물은 상기 단차의 높이만큼의 두께로 형성되는 안테나 패턴이 형성된 사출물.The second injection molded product having an antenna pattern formed to have a thickness equal to the height of the step.
  4. 제2 항에 있어서,The method of claim 2,
    상기 제2 사출물은 상기 제1 영역에 형성되는 부분은 상기 단차의 높이와 상기 안테나 패턴이 상기 제1 영역의 표면에서 돌출된 두께의 차만큼의 두께로 형성되고, 상기 제1 영역이 아닌 제2 영역에 형성된 부분은 상기 단차의 높이만큼의 두께로 형성되는 안테나 패턴이 형성된 사출물.The second injection molded part is formed in the first region to have a thickness equal to the difference between the height of the step and the thickness of the antenna pattern protruding from the surface of the first region, and the second region is not the first region. The part formed in the region is an injection molded article having an antenna pattern formed to have a thickness equal to the height of the step.
  5. 제2 항에 있어서,The method of claim 2,
    상기 제2 사출물의 표면은 상기 제2 영역 주변의 표면과 단차없이 형성되는 안테나 패턴이 형성된 사출물.And an antenna pattern formed on the surface of the second injection molding without a step difference with a surface around the second region.
  6. 제1 항에 있어서,According to claim 1,
    상기 제1 사출물은 일면과 상기 일면의 외곽에서 연장되는 측면을 포함하고,The first injection molded product includes one side and a side surface extending from the outside of the one side,
    상기 제1 영역은 상기 측면의 적어도 일부 및 이와 인접한 일면의 일부를 포함하는 안테나 패턴이 형성된 사출물.The first region is an injection molding formed with an antenna pattern including at least a portion of the side and a portion of one surface adjacent thereto.
  7. 제1 항에 있어서,According to claim 1,
    상기 제1 사출물은 내부면과 상기 내부면의 반대면인 외부면을 포함하고,The first injection molded product includes an outer surface that is opposite to an inner surface and the inner surface,
    상기 안테나 패턴은 상기 외부면 상에 형성되는 안테나 패턴이 형성된 사출물.The antenna pattern is an injection molded article having an antenna pattern formed on the outer surface.
  8. 제7 항에 있어서,The method of claim 7, wherein
    일단은 상기 안테나 패턴과 연결되고, 타단은 상기 제1 사출물의 내부면까지 연장되어 형성되는 연결 패턴을 더 포함하는 안테나 패턴이 형성된 사출물.One end is connected to the antenna pattern, the other end is an injection molding formed an antenna pattern further comprises a connection pattern formed to extend to the inner surface of the first injection.
  9. 제8 항에 있어서,The method of claim 8,
    상기 제1 사출물은 적어도 하나의 관통홀을 포함하고,The first injection molded product includes at least one through hole,
    상기 연결 패턴은 상기 관통홀의 내주면을 통해 상기 제1 사출물의 외부면에서 내부면까지 연장되어 형성되는 안테나 패턴이 형성된 사출물.The connection pattern is an injection molding formed with an antenna pattern is formed to extend from the outer surface to the inner surface of the first injection through the inner peripheral surface of the through hole.
  10. 제9 항에 있어서,The method of claim 9,
    상기 관통홀은 상기 제1 영역에 형성되는 안테나 패턴이 형성된 사출물.The through hole is an injection molded product having an antenna pattern formed in the first region.
  11. 제7 항에 있어서,The method of claim 7, wherein
    상기 제1 사출물은 적어도 하나의 관통홀을 포함하고,The first injection molded product includes at least one through hole,
    상기 제2 사출물은 상기 관통홀의 외부면측 개구를 덮어 상기 관통홀을 밀폐하는 안테나 패턴이 형성된 사출물.And the second injection molded product having an antenna pattern covering the outer surface side opening of the through hole to seal the through hole.
  12. 제11 항에 있어서,The method of claim 11, wherein
    상기 제2 사출물은 상기 관통홀을 통해 상기 제1 사출물의 내부면까지 돌출되어 형성되는 안테나 패턴이 형성된 사출물.The second injection molding is formed with an antenna pattern is formed to protrude to the inner surface of the first injection through the through hole.
  13. 제1 항에 있어서,According to claim 1,
    상기 제1 사출물은 이동통신 단말기의 케이스의 적어도 일부를 구성하는 안테나 패턴이 형성된 사출물.The first injection molding is formed with an antenna pattern constituting at least a part of the case of the mobile communication terminal.
  14. 제13 항에 있어서,The method of claim 13,
    상기 안테나 패턴은 상기 제1 사출물의 이동통신 단말기의 내부 공간과 맞닿는 내부면의 반대면인 외부면상에 형성되는 안테나 패턴이 형성된 사출물.The antenna pattern is an injection molded product formed with an antenna pattern is formed on the outer surface that is opposite to the inner surface of the first communication of the mobile communication terminal with the inner surface of the injection.
  15. 제14 항에 있어서,The method of claim 14,
    상기 안테나 패턴은 상기 외부면 중 상기 이동통신 단말기의 측면을 이루는 외부 측면을 포함한 부분에 형성되는 안테나 패턴이 형성된 사출물.The antenna pattern is an injection molded article having an antenna pattern formed on a portion including an outer side of the outer surface forming the side of the mobile communication terminal.
  16. 제1 항에 있어서,According to claim 1,
    상기 안테나 패턴은 상기 제1 영역의 표면과 결합된 도금층인 안테나 패턴이 형성된 사출물.The antenna pattern is an injection molded article formed with an antenna pattern is a plating layer bonded to the surface of the first region.
  17. 제16 항에 있어서,The method of claim 16,
    상기 제1 영역은 도금이 되지 않는 성질이었다가 레이저가 조사되면 도금이 가능한 성질로 변화하는 첨가물을 포함하는 수지재로 형성되는 안테나 패턴이 형성된 사출물.The first region is an injection molded material having an antenna pattern formed of a resin material containing an additive which is a property that is not plated and changes to a property that can be plated when a laser is irradiated.
  18. 제17 항에 있어서,The method of claim 17,
    상기 첨가물은 스피넬 또는 이와 유사한 구조를 가지는 금속 산화물인 안테나 패턴이 형성된 사출물.The additive is an injection pattern formed antenna pattern is a metal oxide having a spinel or similar structure.
  19. 제1 항에 있어서,According to claim 1,
    상기 안테나 패턴은 연성 회로 기판으로 형성되는 안테나 패턴이 형성된 사출물.The antenna pattern is an injection molded article formed with an antenna pattern formed of a flexible circuit board.
  20. 제1 항에 있어서,According to claim 1,
    상기 안테나 패턴은 도전성 잉크로 인쇄되어 형성되는 안테나 패턴이 형성된 사출물.The antenna pattern is an injection molded article having an antenna pattern formed by printing with conductive ink.
  21. 제1 항에 있어서,According to claim 1,
    상기 제2 사출물은 상기 제2 영역에 인서트 사출 방법으로 형성되는 안테나 패턴이 형성된 사출물.The second injection molded product having an antenna pattern formed in the second region by an insert injection method.
  22. 제1 항에 있어서,According to claim 1,
    상기 제1 사출물은 상기 제2 영역에 상기 제2 사출물과의 접촉하는 면적을 넓힐 수 있도록 적어도 하나의 홈을 포함하는 안테나 패턴이 형성된 사출물.And the first injection molded product including an antenna pattern including at least one groove in the second area to widen the contact area with the second injection molded product.
  23. 제1 항에 있어서,According to claim 1,
    상기 제2 사출물은 상기 제1 사출물을 형성하는 수지보다 낮은 온도에서 용융될 수 있는 수지재로 형성되는 안테나 패턴이 형성된 사출물.And the second injection molding is formed of an antenna pattern formed of a resin material that can be melted at a lower temperature than the resin forming the first injection molding.
  24. 제1 항에 있어서,According to claim 1,
    상기 제1 내지 제2 사출물은 유리 섬유(glass fiber)를 포함한 수지재로 형성되되,The first to the second injection molding is formed of a resin material including glass fiber,
    상기 제2 사출물을 형성하는 수지재는 상기 제1 사출물을 형성하는 수지재에 비해 유리 섬유의 혼합 비율이 낮은 안테나 패턴이 형성된 사출물. The resin material forming the second injection molding is an injection molded article having an antenna pattern having a lower mixing ratio of glass fibers than the resin material forming the first injection molding.
  25. 제1 항에 있어서,According to claim 1,
    상기 안테나 패턴은 상기 제2 사출물을 형성하는 수지재의 용융 온도에서 내열성을 가지고 상기 제1 사출물과의 결합이 유지될 수 있는 안테나 패턴이 형성된 사출물.The antenna pattern is an injection molded article formed with an antenna pattern capable of maintaining the heat resistance at the melting temperature of the resin material forming the second injection molding and the bonding with the first injection molding.
  26. 제1 영역 및 상기 제1 영역을 포함하는 제2 영역을 포함하는 제1 사출물을 준비하는 단계;Preparing a first injection product including a first area and a second area including the first area;
    상기 제1 영역에 안테나 패턴을 형성하는 단계; 및Forming an antenna pattern in the first region; And
    상기 제2 영역에 상기 안테나 패턴을 덮도록 제2 사출물을 형성하는 단계를 포함하는 안테나 패턴이 형성된 사출물의 제조 방법.And forming a second injection molded product to cover the antenna pattern in the second area.
  27. 제26 항에 있어서,The method of claim 26,
    상기 제1 사출물을 준비하는 단계는, 도금이 되지 않는 성질이었다가 레이저가 조사되면 도금이 가능한 성질로 변하는 첨가물을 포함하는 수지재로 제1 사출물을 사출하는 단계를 포함하고,The preparing of the first injection molding product may include injecting the first injection molding product into a resin material including an additive that is not plated and is changed to a plating property when the laser is irradiated.
    상기 안테나 패턴을 형성하는 단계는, 상기 제1 영역에 레이저를 조사하는 단계 및 상기 레이저가 조사된 제1 영역에 도금층을 형성하는 단계를 포함하는 안테나 패턴이 형성된 사출물의 제조 방법.The forming of the antenna pattern may include irradiating a laser to the first region and forming a plating layer on the first region to which the laser is irradiated.
  28. 제26 항에 있어서,The method of claim 26,
    상기 제1 사출물을 준비하는 단계는, 상기 제1 사출물에 적어도 하나의 관통홀을 형성하는 단계를 포함하고,The preparing of the first injection molding may include forming at least one through hole in the first injection molding.
    상기 안테나 패턴과 연결되고, 상기 관통홀의 내주면을 통해 상기 제1 사출물의 외부면에서 상기 외부면의 반대면인 내부까지 연장되는 연결 패턴을 형성하는 단계를 더 포함하는 안테나 패턴이 형성된 사출물의 제조 방법.Forming a connection pattern connected to the antenna pattern, extending through the inner peripheral surface of the through-hole from the outer surface of the first injection molding to the inner side opposite to the outer surface, the method of manufacturing an injection molded antenna pattern .
  29. 제28 항에 있어서,The method of claim 28,
    상기 제2 사출물을 형성하는 단계는,Forming the second injection molding,
    상기 제1 사출물 중 상기 제2 영역을 포함하는 부분을 금형 내부에 위치시키는 단계; 및Positioning a portion of the first injection molding including the second region in a mold; And
    상기 금형 내에 수지재를 주입하여 상기 수지재가 상기 관통홀 내부에 주입되며 상기 제2 사출물을 사출하는 단계를 포함하는 안테나 패턴이 형성된 사출물의 제조 방법.And injecting a resin material into the mold to inject the resin material into the through hole and to inject the second injection molded product.
  30. 제29 항에 있어서,The method of claim 29,
    상기 제2 사출물을 사출하는 단계는, 상기 수지재가 상기 관통홀을 관통하도록 주입되어 상기 제2 사출물이 상기 관통홀을 통해 상기 제1 사출물의 내부면까지 돌출되도록 형성하는 안테나 패턴이 형성된 사출물의 제조 방법.Injecting the second injection molding, the resin material is injected so as to penetrate the through-holes to manufacture the injection-molded injection molded antenna pattern is formed so as to project the second injection through the through-hole to the inner surface of the first injection Way.
  31. 제26 항에 있어서,The method of claim 26,
    상기 제2 사출물을 형성하는 단계는,Forming the second injection molding,
    상기 제2 사출물의 표면을 상기 제2 영역 주변의 표면과 단차없이 형성하는 안테나 패턴이 형성된 사출물의 제조 방법.And an antenna pattern for forming the surface of the second injection molding without a step with the surface around the second region.
  32. 제26 항에 있어서,The method of claim 26,
    상기 제2 사출물을 형성하는 단계는,Forming the second injection molding,
    상기 제1 사출물 중 상기 제2 영역을 포함하는 부분을 금형 내부에 위치시키는 단계; 및Positioning a portion of the first injection molding including the second region in a mold; And
    상기 금형 내에 수지재를 주입하여 상기 제2 사출물을 사출하는 단계를 포함하는 안테나 패턴이 형성된 사출물의 제조 방법.And injecting a resin material into the mold to inject the second injection molded product.
  33. 제32 항에 있어서,33. The method of claim 32,
    상기 제2 영역의 표면은 상기 제2 영역의 주변의 표면보다 낮도록 단차지게 형성되고,The surface of the second region is formed stepped to be lower than the surface of the periphery of the second region,
    상기 제2 사출물을 사출하는 단계는,Injecting the second injection molding,
    상기 금형의 내면 중 일부가 상기 제2 영역 주변의 표면에 맞닿도록 위치하여, 제2 영역의 표면에 대향하는 경계가 상기 제2 영역 주변의 표면에서 단차 없이 연장되는 내부 공간을 형성하는 단계; 및A portion of the inner surface of the mold abuts against a surface around the second region, thereby forming an inner space in which a boundary opposite the surface of the second region extends without a step on the surface around the second region; And
    상기 내부 공간에 수지재를 주입하는 단계를 포함하는 안테나 패턴이 형성된 사출물의 제조 방법.Injecting a resin material in the inner space manufacturing method of the injection molded article formed with an antenna pattern.
  34. 제26 항에 있어서,The method of claim 26,
    상기 제1 사출물은 일면과 상기 일면의 외곽에서 연장되는 측면을 포함하고,The first injection molded product includes one side and a side surface extending from the outside of the one side,
    상기 제1 영역은 상기 측면의 적어도 일부 및 이와 인접한 일면의 일부를 포함하는 안테나 패턴이 형성된 사출물의 제조 방법.And the first region includes at least a portion of the side surface and a portion of one surface adjacent thereto.
PCT/KR2014/005590 2014-04-04 2014-06-24 Injection-molded product having antenna pattern formed thereon and manufacturing method therefor WO2015152464A1 (en)

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